Wearable electronic device including damping structure of circuit board

Abstract

A wearable electronic device is provided. The wearable electronic device may include: a bracket; at least part of the printed circuit board faces the first surface of the bracket; the sound sensor structure is arranged on the second surface of the bracket; the biological characteristic sensor structure is overlapped with the first surface of the support based on the direction perpendicular to the printed circuit board; and a damping structure interposed between the biometric sensor structure and the printed circuit board. The damping structure may elastically support the biometric sensor structure and the printed circuit board.

Description

Technical Field

[0001] An embodiment of the present disclosure relates to a wearable electronic device. Background Art

[0002] Wearable electronic devices (such as smart watches) have become popular. Such wearable electronic devices may include a printed circuit board. Various components (such as capacitors) may be mounted on the printed circuit board of the wearable electronic device. The capacitor may expand and / or contract by applying a voltage for operation. Vibration may occur due to the expansion and / or contraction of the capacitor. However, the above-mentioned related art is not recognized as prior art. Summary of the invention

[0003]

Technical solution

[0004] A wearable electronic device according to an embodiment may include: a housing including a cover. The wearable electronic device may include: a bracket, which is arranged in the housing and includes a first part. The wearable electronic device may include: a printed circuit board, which is arranged between the cover and the bracket and at least partially faces the first surface of the first part of the bracket. The wearable electronic device may include: a sound sensor structure, which is arranged on a second surface of the first part of the bracket that is different from the first surface. The wearable electronic device may include: a biometric sensor structure, which is installed in the cover to overlap with the first surface of the first part of the bracket relative to a direction perpendicular to the printed circuit board. The wearable electronic device may include: a damping structure, which is inserted between the biometric sensor structure and the printed circuit board and is configured to elastically support the biometric sensor structure and the printed circuit board.

[0005] A wearable electronic device according to an embodiment may include: a housing including a cover. The wearable electronic device may include: a bracket, which is arranged in the housing and includes a first part. The wearable electronic device may include: a printed circuit board, which is arranged between the cover and the bracket and at least partially faces a first surface of the first part of the bracket. The wearable electronic device may include: a sound sensor structure, which is arranged on a second surface of the first part of the bracket that is different from the first surface. The wearable electronic device may include a damping structure. The cover may include a protrusion extending toward the printed circuit board. The damping structure may be arranged between the printed circuit board and the protrusion. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Figure 1 is a perspective view of a wearable electronic device according to an embodiment.

[0007] Figure 2is a perspective view of a wearable electronic device according to an embodiment.

[0008] Figure 3 is an exploded perspective view of a wearable electronic device according to an embodiment.

[0009] Figure 4 is a cross-sectional view of a wearable electronic device according to an embodiment.

[0010] Figure 5 is a cross-sectional view of a wearable electronic device according to an embodiment.

[0011] Figure 6 is an exploded perspective view of a wearable electronic device according to an embodiment.

[0012] Figure 7 is a cross-sectional view of a wearable electronic device according to an embodiment.

[0013] Figure 8 is a graph depicting the sound signal received by the sound sensor.

[0014] Fig. 9 is a block diagram of an electronic device in a network environment according to an embodiment. DETAILED DESCRIPTION

[0015] Hereinafter, various embodiments of the present disclosure will be described with reference to the accompanying drawings. However, it should be understood that the embodiments of the present disclosure are not intended to limit the present disclosure to specific embodiment forms, but the present disclosure includes various modifications, equivalent forms and / or replacement forms of the embodiments of the present disclosure. In addition, when referring to the accompanying drawings, repeated descriptions of configurations with the same reference numerals may be omitted.

[0016] Figure 1 is a perspective view of a wearable electronic device according to an embodiment. Figure 2 1 is a perspective view of a wearable electronic device according to an embodiment. Hereinafter, a first direction D1 and a second direction D2 may be defined with reference to the wearable electronic device. The first direction D1 may be a direction facing the front cover 101 from the rear cover 107. The first direction may be a direction substantially perpendicular to the front cover 101. The second direction D2 may be a direction opposite to the first direction D1.

[0017] Reference Figure 1 and Figure 2 According to the wearable electronic device 100 of the embodiment (eg, Fig. 9 The electronic device 901 may include a housing 110 and fastening members 150 and 160.

[0018] The housing 110 may at least partially define the appearance of the wearable electronic device 100. For example, the housing 110 may include a first surface (or front surface) 110A, a second surface (or rear surface) 110B, and a side surface surrounding the space between the first surface 110A and the second surface 110B that defines the appearance of the electronic device 100. The housing 110 may be referred to as a structure that defines at least a portion of the first surface 110A, the second surface 110B, and the side surface 110C. The fastening members 150 and 160 may be connected to the housing 110 and may be configured to detachably fasten the wearable electronic device 100 to a part of the user's body (e.g., a wrist, etc.).

[0019] At least a portion of the first surface 110A facing the first direction D1 may be formed by a substantially transparent front cover 101. The front cover 101 may include, for example, a glass plate including various coatings, a polymer plate, or a combination thereof. The front cover 101 may be substantially plate-shaped, but the present disclosure is not limited thereto.

[0020] The second surface 110B facing the second direction D2 may be formed by the back cover 107. The back cover 107 may include a substantially transparent area and / or a substantially opaque area. The back cover 107 may be formed, for example, of coated or colored glass, ceramic, polymer, metal (aluminum, stainless steel (STS) or magnesium) or a combination of at least two of these materials.

[0021] The side surface 110C may be at least partially formed by a frame 106. The frame 106 may be coupled to the front cover 101 and the back cover 107. The frame 106 may include, for example, metal and / or polymer. The frame 106 may be referred to as a frame structure, a side frame structure, or a side member.

[0022] The fastening members 150 and 160 may be formed of various materials and shapes. For example, the fastening members 150 and 160 may be formed of woven products, leather, rubber, polyurethane, metal, ceramics, or a combination of at least two of these materials.

[0023] The wearable electronic device 100 according to the embodiment may include a display 120 , audio modules 105 and 108 , a first sensor module 111 , a second sensor module 112 , key input devices 102 , 103 , and 104 , and a connector hole 109 .

[0024] The display 120 may be exposed through a considerable portion of the front cover 101. For example, the display 120 may be visually viewed through a transparent area of ​​the front cover 101. The shape of the display 120 may be a shape corresponding to the shape of the front cover 101, and may be, for example, various shapes such as a circular shape, an elliptical shape, or a polygonal shape. The wearable electronic device 100 may include a touch detection circuit coupled to the display 120 and / or disposed adjacent to the display 120, a pressure sensor that can measure touch strength (pressure), and / or a fingerprint sensor.

[0025] The audio modules 105 and 108 may include a microphone hole 105 and a speaker hole 108. A microphone for acquiring external sound may be disposed inside the microphone hole 105. The microphone hole 105 may include multiple microphones to detect the direction of the sound, but the present disclosure is not limited thereto. The speaker hole 108 may be used as an external speaker or a voice communication receiver. In an embodiment, the speaker hole 108 and the microphone hole 105 may be implemented by one or more holes, but a speaker (e.g., a piezoelectric speaker) without the speaker hole 108 may be used. In an embodiment, the speaker hole 108 and / or the microphone hole 105 may have a grille shape with multiple openings, but the present disclosure is not limited thereto.

[0026] The first sensor module 111 and the second sensor module 112 may generate an electrical signal or data value corresponding to an internal operating state or an external environmental state of the wearable electronic device 100. The first sensor module 111 and the second sensor module 112 may be arranged on the rear surface of the back cover 107. The first sensor module 111 may include, for example, a heart rate monitor (HRM) sensor, but the present disclosure is not limited thereto. The second sensor module 112 may include, for example, a temperature sensor, but the present disclosure is not limited thereto. The wearable electronic device 100 may include a sensor module not shown, for example, at least one of a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, a humidity sensor, or an illumination sensor.

[0027] The key input devices 102, 103, and 104 may include: a wheel key 102, which is disposed on a first surface 110A of the housing 110 and can rotate in at least one direction; and / or side key buttons 103 and 104, which are disposed on a side surface 110C of the housing 110. The wheel key may have a shape corresponding to the shape of the front cover 101. In an embodiment, the wearable electronic device 100 may not include some or all of the above-mentioned key input devices 102, 103, and 104, or may further include other key input devices not shown. At least some of the key input devices 102, 103, and 104 may be implemented in other forms (e.g., soft keys on the display 120).

[0028] The connector hole 109 may accommodate a connector (e.g., a USB connector) for transmitting power and / or data to an external electronic device and / or receiving power and / or data from an external electronic device, or may accommodate a connector (e.g., a headphone connector) for transmitting audio signals to an external electronic device and / or receiving audio signals from an external electronic device. However, the wearable electronic device 100 may not include the connector hole 109. However, the function using the connector hole 109 (e.g., transmission and reception of electrical signals using wired communication) may be at least partially performed by a wireless communication module (e.g., a wireless communication module) of the wearable electronic device 100. Fig. 9 The wireless communication module 992) is executed.

[0029] The fastening members 150 and 160 can be connected to each other by using the locking members 151 and 161 to be detached and / or fastened in at least a partial area of ​​the housing 110. The fastening member may include one or more of a fixing member 152, a fixing member coupling hole 153, a belt guide member 154, and a belt fixing ring 155.

[0030] The fixing member 152 may be configured to fix the housing 110 and the fastening members 150 and 160 to a portion of the user's body (e.g., a wrist, etc.). The fixing member coupling hole 153 may fix the housing 110 and the fastening members 150 and 160 to a portion of the user's body corresponding to the fixing member 152. The belt guide member 154 may be configured to limit the range of movement of the fixing member 152 when the fixing member 152 is coupled to the fixing member coupling hole 153 to allow the fastening members 150 and 160 to be attached to a portion of the user's body. The belt fixing ring 155 may limit the range of movement of the fastening members 150 and 160 in a state where the fixing member 152 and the fixing member coupling hole 153 are coupled to each other. However, the configuration for fastening the wearable electronic device 100 to the user's body (such as the fixing member 152 and the fixing member coupling hole 153 of the fastening members 150 and 160) is not limited to the above examples, and various mechanisms may be applied.

[0031] Figure 3 is an exploded perspective view of a wearable electronic device according to an embodiment. Figure 3 According to the wearable electronic device 300 of the embodiment (eg, Figure 1 The wearable electronic device 100 may include a front cover 101, a back cover 390, a frame 306, a display 120, a bracket 360, a battery 389, a support plate 388, a sound sensor structure 350 (or a sound sensor module), a printed circuit board 380, a biometric sensor structure 320 (or a biometric sensor module) and a damping structure 310.

[0032] The front cover 101 may be disposed at an upper portion (eg, first direction D1) of the frame 306. The front cover 101 may be coupled to the frame 306. The rear cover 390 may be disposed at a lower portion (eg, second direction D2) of the frame 306. The rear cover 390 may be coupled to the frame 306.

[0033] Back cover 390 (eg, Figure 2 The back cover 107 of the embodiment of the present invention may include a first cover 391 and a second cover 392. The first cover 391 may be coupled to the frame 306. For example, the first cover 391 may be coupled to the frame 306 below (e.g., in the second direction D2) of the frame 306. The second cover 392 may be coupled to the first cover 391. For example, the second cover 392 may be coupled to the first cover 391 below (e.g., in the second direction D2) of the first cover 391. The second cover 392 may at least partially close a hollow portion formed in the first cover 391.

[0034] The first cover 391 and the second cover 392 may be formed of different materials. For example, the first cover 391 may include resin, and the second cover 392 may include glass, but the present disclosure is not limited to the above examples. Alternatively, the first cover 391 and the second cover 392 may be formed of substantially the same material. In this case, optionally, the first cover 391 and the second cover 392 may be formed integrally.

[0035] Frame 306 (eg, Figure 1 The front cover 101 and the back cover 390 may be provided between the front cover 101 and the back cover 390. The front cover 101, the back cover 390, and the frame 306 may at least partially define the appearance of the wearable electronic device 300. For example, the front cover 101, the back cover 390, and the frame 306 may define at least a portion of the front surface 110A, the back surface 110B, and the side surface 110C of the wearable electronic device 300. In this regard, the front cover 101, the back cover 390, and at least a portion of the frame 306 may be referred to as a housing (e.g., Figure 1 housing 110).

[0036] The frame 306 may define an internal space "S" of the wearable electronic device 300 together with the front cover 101 and the back cover 390. For example, the frame 306 may include side walls that define a hollow portion in the interior of the frame 306. The front cover 101 and the back cover 390 may be coupled to upper and lower portions of the side walls of the frame 306, respectively, to at least partially close the hollow portion in the interior of the frame 306. By coupling the front cover 101, the back cover 390, and the frame 306 to each other, the internal space "S" of the wearable electronic device 300 may be defined.

[0037] In the internal space “S”, the display 120 , the support plate 388 , the bracket 360 , the battery 389 , the printed circuit board 380 , the sound sensor structure 350 , the biometric sensor structure 320 , and the damping structure 310 may be disposed.

[0038] The display 120 may be disposed between the front cover 101 and the bracket 360 (or the support plate 388). The display 120 may be at least partially housed inside the frame 306. The display 120 may be at least partially supported by the support plate 388 and the bracket 360. The display 120 may be attached to the rear surface (e.g., the surface facing the second direction D2) of the front cover 101. For example, the display 120 may be attached to the front cover 101 by a substantially transparent adhesive member (e.g., an optically clear adhesive (OCA) or an optically clear resin (OCR)).

[0039] The bracket 360 may be disposed inside the frame 306. The bracket 360 may be surrounded by the frame 306. The display 120 may be disposed on a first side (e.g., a first direction D1) of the bracket 360. The printed circuit board 380 may be disposed on a second side (e.g., a second direction D2) of the bracket 360. The bracket 361 may support the display 120 and the printed circuit board 380. The bracket 360 may be referred to as a supporting member. The bracket 360 may be formed, for example, of a metal material and / or a non-metal material (e.g., a polymer such as plastic).

[0040] The battery 389 may be at least partially accommodated in a space formed in the bracket 360. The battery 389 may be disposed between the support plate 388 and the printed circuit board 380. The battery 389 may store power to be supplied to at least one component of the wearable electronic device 300. The battery 389 may include, for example, a rechargeable storage battery.

[0041] The support plate 388 may be disposed on the bracket 360. The support plate 388 may cover the battery 389 accommodated in the bracket 360. The support plate 388 may support the battery 389 and the display 120. The support plate 388 may be formed of metal and may provide electrical shielding between the battery 389 and the display 120. The support plate 388 may include, for example, stainless steel, but the present disclosure is not limited thereto.

[0042] The sound sensor structure 350 may be installed in the bracket 360. For example, the sound sensor structure 350 may be disposed on a side surface of the bracket 360. The side surface of the bracket 360 may include an area facing the frame 306 of the bracket 360 (e.g., Figure 5 The sound sensor structure 350 may be located between the bracket 360 and the frame 306. The sound sensor structure 350 may face the microphone hole 305 formed in the frame 306 (eg, Figure 1The sound sensor structure 350 can obtain sound signals through the microphone hole 305.

[0043] The printed circuit board 380 may be disposed between the bracket 360 and the back cover 390. The processor (eg, Fig. 9 processor 920), memory (e.g., Fig. 9 930) and / or an interface (e.g., Fig. 9 The interface 977) may be mounted on the printed circuit board 380. The processor may include, for example, one or more of a central processing unit, a graphics processing unit (GPU), an application processor, a sensor processor, or a communication processor. The memory may include, for example, a volatile memory or a non-volatile memory. The interface may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may include, for example, a USB connector, an SD card / MMC connector, or a connector such as an audio connector (e.g., Fig. 9 The wearable electronic device 300 may be electrically or physically connected to an external electronic device.

[0044] Biometric sensor structure 320 (e.g., Figure 1 The second sensor module 112 of the back cover 390 may be mounted on the back cover 390. For example, the biometric sensor structure 320 may be mounted in the first cover 391 of the back cover 390. The biometric sensor structure 320 may be disposed on a rear surface (e.g., a surface facing the first direction D1) of the first cover 391. The biometric sensor structure 320 mounted in the back cover 390 may acquire biometric information of a user who is in contact with or adjacent to the back cover 390.

[0045] The damping structure 310 may be disposed between the printed circuit board 380 and the biometric sensor structure 320. The damping structure 310 may include a first member 311 and a second member 312. The first member 311 may be disposed on the biometric sensor structure 320 (e.g., in the first direction D1). The second member 312 may be disposed on the first member 311 (e.g., in the first direction D1). The second member 312 may be disposed between the first member 311 and the printed circuit board 380. The first member 311 may have a ring shape with a hollow portion, but the present disclosure is not limited thereto. For example, the first member 311 may have a plate shape without a hollow portion.

[0046] Figure 4 is a cross-sectional view of a wearable electronic device according to an embodiment. Figure 4 A cross-sectional view can be along Figure 3 A cross-sectional view taken along line AA'. Figure 5is a cross-sectional view of a wearable electronic device according to an embodiment. Figure 5 It can be shown Figure 4 A view of area A1.

[0047] Reference Figure 4 and Figure 5 , the wearable electronic device 300 according to the embodiment may include a connector 384 and a capacitor 382 arranged on a printed circuit board 380. The capacitor 382 may have a capacity of 1.0 μF, for example, but the present disclosure is not limited thereto. A capacitor having a capacity of 1.0 μF may be referred to as a high-capacity capacitor. The capacitor 382 may be disposed on a first surface 380A and / or a second surface 380B of the printed circuit board 380. The first surface 380A and the second surface 380B of the printed circuit board 380 may be opposite to each other. For example, the first surface 380A of the printed circuit board 380 may face the back cover 390 (or the second direction D2). The second surface 380B of the printed circuit board 380 may face the front cover 101 (or the first direction D1).

[0048] The wearable electronic device 300 according to the embodiment may include a sealing member 395 disposed between the frame 306 and the first cover 391 and a sealing member 396 disposed between the first cover 391 and the second cover 392. The sealing member 395 may prevent the introduction of foreign matter by sealing the gap between the frame 306 and the first cover 391. The sealing member 396 may prevent the introduction of foreign matter by sealing the gap between the first cover 391 and the second cover 392.

[0049] The first sensor module 111 may be disposed in the rear cover 390. For example, the first sensor module 111 may be at least partially located inside the hollow portion of the first cover 391. The first sensor module 111 may be disposed to face the second cover 392.

[0050] The first sensor module 111 may acquire biometric information through the second cover 392. For example, the first sensor module 111 may include a photoplethysmography (PPG) sensor. The first sensor module 111 may acquire information about the user's heart rate or blood oxygen saturation by using the PPG sensor. However, the present disclosure is not limited to the above examples.

[0051] The bracket 360 may include a first portion 361. The first portion 361 may be located between the display 120 and the printed circuit board 380 relative to the first direction D1. The first portion 361 may be located between the front cover 101 and the biometric sensor structure 320 relative to the first direction D1. The first portion 361 may at least partially overlap the biometric sensor structure 320 relative to the first direction D1. The first portion 361 may be located between the battery 389 and the frame 306 relative to a direction perpendicular to the first direction D1.

[0052] The first portion 361 of the bracket 360 may include a first surface 361A and a second surface 361B. The first surface 361A may at least partially face the printed circuit board 380. For example, the first surface 361A of the first portion 361 may face the second surface 380B of the printed circuit board 380. The first surface 361A may at least partially contact the second surface 380B of the printed circuit board 380, but the present disclosure is not limited thereto. The first surface 361A may at least partially overlap with the biometric sensor structure 320 relative to the first direction D1. The first recess 367 may be formed on the first surface 361A. The first recess 367 may be recessed on the first surface 361A of the first portion 361 in a direction (e.g., the first direction D1) that becomes farther away from the printed circuit board 380.

[0053] The wearable electronic device 300 according to the embodiment may include a connecting member 372, a support plate 373, a joint member 375, and a connector 384 located in the first recess 367. The connecting member 372 may electrically connect the battery 389 to the connector 384 provided on the second surface 380B of the printed circuit board 380. The connecting member 372 may include, for example, a flexible printed circuit board. The connecting member 372 may be provided on the support plate 373 to be supported. The support plate 373 may enhance the strength of the connecting member 372 and prevent its deformation. The support plate 373 may include, for example, a composite material including glass fiber (such as flame retardant 4 (FR4)) and epoxy resin, but the present disclosure is not limited thereto. The joint member 375 may attach the support plate 373 in which the connecting member 372 is provided to the first recess 367. The joint member 375 may include, for example, a double-sided tape. The connector 384 may include, for example, a C-clip connector, but the present disclosure is not limited thereto.

[0054] The second surface 361B of the first portion 361 may face the frame 306. The second surface 361B may not contact the printed circuit board 380. The second recess 368 may be formed on the second surface 361B. The second recess 368 may be recessed in a direction becoming away from the frame 306 on the second surface 361B. For example, the second recess 368 may be recessed toward the inner space "S" in a direction away from the side surface 110C of the frame 306. The second surface 361B may extend from the first surface 361A, but the present disclosure is not limited thereto.

[0055] The sound sensor structure 350 may be disposed on the second surface 361B of the first portion 361. The sound sensor structure 350 may be at least partially accommodated in a second recess 368 formed on the second surface 361B. The sound sensor structure 350 may include a substrate 352, a sound sensor 354, and an acoustic gasket 356.

[0056] The substrate 352 of the sound sensor structure 350 may be disposed on the second surface 361B to at least partially cover the second recess 368. For example, the substrate 352 may be attached to the second surface 361B by a bonding member 355 at least partially surrounding the periphery of the second recess 368. The substrate 352 may include a printed circuit board 380. The bonding member 355 may include a waterproof bonding tape, but the present disclosure is not limited thereto.

[0057] The sound sensor 354 may be disposed on the substrate 352. For example, the sound sensor 354 may be disposed on one surface of the substrate 352 facing the second recess 368. The sound sensor 354 may be at least partially located in the second recess 368. The sound sensor 354 may include, for example, a microphone (such as a micro-electromechanical system (MEMS) microphone) and a sensing circuit operably connected to the microphone.

[0058] The acoustic gasket 356 may be provided on the substrate 352. For example, the acoustic gasket 356 may be provided on a surface of the substrate 352 opposite to one surface on which the sound sensor 354 is provided. The acoustic gasket 356 may be provided between the substrate 352 and the frame.

[0059] The wearable electronic device 300 according to the embodiment may include an acoustic channel of a sound sensor structure 350. The acoustic channel may include a first acoustic channel 307, a second acoustic channel 308, and an acoustic port 309. The first acoustic channel 307 may be formed to pass through the frame 306. The first acoustic channel 307 may extend from the microphone hole 305 formed on the side surface 110C to the acoustic gasket 356. The second acoustic channel 308 formed in the acoustic gasket 356 may extend from the frame 306 to the substrate 352. The second acoustic channel 308 may communicate the first acoustic channel 307 of the frame 306 and the acoustic port 309 of the substrate 352. The acoustic port 309 may be formed in the substrate 352 to be connected to the sound sensor 354. The acoustic gasket 356 may include, for example, silicone rubber to seal the acoustic channel, but the present disclosure is not limited thereto. The acoustic gasket 356 may also include a mesh that prevents the acoustic gasket 356 itself from being deformed or a material constituting the acoustic gasket 356, a porous material, and / or a membrane that transmits the sound (air vibration) introduced into the first acoustic channel 307 to the second acoustic channel 308. The sound sensor 354 may acquire a sound signal that is delivered to the second acoustic channel 308 through the acoustic channel after passing through the first acoustic channel 307. However, unlike what is shown, the first acoustic channel 307 may be formed in the first cover 391 (e.g., Figure 7 In this case, the sound sensor structure 350 can be installed in the bracket 360 of the rear cover 391. In addition, the acoustic gasket 356 can be set between the substrate 352 and the first cover 391.

[0060] The first cover 391 of the rear cover 390 may include a first surface 391A and a second surface 391B. The first surface 391A may at least partially define the rear surface 110B. The second surface 391B opposite to the first surface 391A may face the printed circuit board 380. A through hole 399 may be formed in the first cover 391. The through hole 399 may extend from the first surface 391A to the second surface 391B. The through hole 399 may have different diameters, but the present disclosure is not limited thereto.

[0061] The biometric sensor structure 320 may be installed in the back cover 390. For example, the biometric sensor structure 320 may be disposed in the first cover 391. For example, the biometric sensor structure 320 may be at least partially accommodated in the through hole 399 of the first cover 391. The biometric sensor structure 320 may acquire biometric information through the opening 397 of the first cover 391. The biometric information acquired by the biometric sensor structure 320 may be different from the biometric information of the first sensor module 111. The biometric sensor structure 320 may include a biometric sensor 324, a lens 326, a sensor housing 328, a substrate 322, and a support plate 323.

[0062] The biometric sensor 324 may be disposed on the substrate 322. For example, the biometric sensor 324 may be disposed on one surface of the substrate 322 facing the opening 397 of the first cover 391. The biometric sensor 324 may be at least partially located in the through hole 399 of the first cover 391. The biometric sensor 324 may be disposed in a sensor housing 328 disposed in the substrate 322. The biometric sensor 324 may be located between the substrate 322 and the lens 326.

[0063] The lens 326 may be coupled to the sensor housing 328. The lens 326 may be located between the biometric sensor 324 and the opening 397. The lens 326 may be configured to transmit light of a specific wavelength band. For example, the lens 326 may include a silicon lens or a glass lens that may transmit light of a long wave infrared (LWIR) band, but the present disclosure is not limited to the above examples.

[0064] The biometric sensor 324, the lens 326, and the opening 397 may be at least partially aligned. For example, the biometric sensor 324, the lens 326, and the opening 397 may be at least partially aligned with respect to one direction (eg, the second direction D2).

[0065] The biometric sensor may detect the biometric information of the user through the lens 326. For example, the biometric sensor 324 may include a temperature sensor (eg, an optical temperature sensor). The biometric sensor 324 may detect the body temperature of the user, for example, by using a temperature sensor. However, the present disclosure is not limited to the above examples.

[0066] The support plate 323 of the biometric sensor structure 320 may be disposed on the substrate 322. For example, the support plate 323 may be disposed on a surface opposite to one surface of the substrate 322 on which the biometric sensor 324 is disposed. The support plate 323 may be disposed between the substrate 322 and the damping structure 310. The support plate 323 may support the substrate 322. The support plate 323 may enhance the strength of the substrate 322 and prevent deformation thereof. The support plate 323 may include, for example, a metal such as stainless steel, but the present disclosure is not limited thereto.

[0067] In an embodiment, the sensor housing 328 may be disposed on the substrate 322. For example, the sensor housing 328 may be disposed on one surface of the substrate 322 on which the biometric sensor 324 is disposed. The sensor housing 328 may at least partially surround the biometric sensor 324 and the lens 326. The sensor housing 328 may protect the biometric sensor 324 and the lens 326 disposed therein. The sensor housing 328 may include metal, but the present disclosure is not limited thereto.

[0068] The sensor housing 328 may have a shape substantially similar to the through hole 399. The bonding member 325 may be inserted between the sensor housing 328 and the first cover 391. For example, the bonding member 325 may be disposed between the sensor housing 328 and the through hole 399. The bonding member 325 may at least partially fill the gap between the sensor housing 328 and the through hole 399. When the biometric sensor structure 320 is bonded to the first cover 391, the bonding member 325 may prevent foreign matter (e.g., moisture or dust) from being introduced between the sensor housing 328 and the through hole 399. The bonding member 325 may be formed, for example, by coating and curing a bonding liquid, but the present disclosure is not limited thereto.

[0069] The damping structure 310 may be interposed between the printed circuit board 380 and the biometric sensor structure 320. For example, the damping structure 310 may be disposed between the first surface 380A of the printed circuit board 380 and the support plate 323 of the biometric sensor structure 320.

[0070] The damping structure 310 may be located between the capacitor 382 and the sound sensor 354 with respect to a direction parallel to the first surface 380A or the second surface 380B of the printed circuit board 380 (a direction perpendicular to the first direction D1). The printed circuit board 380 may include a side portion closer to the sound sensor structure 350, and the damping structure 310 may contact the side portion of the printed circuit board 380. No capacitor may be provided on the first surface 380A and the second surface 380B of the printed circuit 380 between the damping structure 310 and the sound sensor 354, but the present disclosure is not limited thereto.

[0071] The damping structure 310 may elastically support the printed circuit board 380 and the biometric sensor structure 320. For example, the damping structure 310 may include a first member 311 and a second member 312 having a specific value of resilience. The first member 311 and the second member 312 may have different resilience indices. The resilience index (25% CFD (compression force deformation)) of the first member 311 may be, for example, 0.3 kgf / cm 2 Up to 3.0kgf / cm 2 However, the rebound index (25% CFD) of the first member 311 can be improved by using 0.3 kgf / cm 2 The second member 312 may have a greater rebound index than the first member 311. However, the rebound index (25% CFD) of the second member 312 may be 3 kgf / cm 2 or less. The first member 311 may include, for example, a sponge. The sponge may include, for example, urethane, silicon, or rubber, but the present disclosure is not limited thereto. The second member 312 may include, for example, polyethylene terephthalate (PET). The second member 312 may have a film form, but the present disclosure is not limited thereto.

[0072] Although not shown, the damping structure 310 may include at least two of the first bonding layer, the second bonding layer, and the third bonding layer. The first bonding layer may be disposed between the biometric sensor structure 320 and the first member 311. The first bonding layer may attach the first member 311 to the support plate 323 of the biometric sensor structure 320. The second bonding layer may be disposed between the first member 311 and the second member 312. The second bonding layer may bond the first member 311 to the second member 312. The third member 312 may be disposed between the second member 312 and the printed circuit board 380. The third bonding layer may attach the second member 312 to the first surface 380A of the printed circuit board 380. As an example, the damping structure 310 may include the first bonding layer and the third bonding layer, and may not include the second bonding layer. In this case, when the printed circuit board 380 to which the second member 312 is attached and the biometric sensor structure 320 to which the first member 311 is attached are assembled, the second member 312 may be stacked on the first member 311 without the need for a separate member.

[0073] The capacitor mounted on the printed circuit board 380 may vibrate when repeatedly expanded and contracted by an applied voltage. The vibration of the capacitor 382 may be transmitted to the printed circuit board 380. The vibration transmitted to the printed circuit board 380 is noise and may be heard by the user or transmitted to the sound sensor 354. In addition, a wearable electronic device having a relatively small volume and a narrow internal space may be more susceptible to vibration and noise because the printed circuit board 380 and the sound sensor 354 are disposed closer to each other.

[0074] The damping structure 310 may elastically support the printed circuit board 380 in a direction (e.g., the first direction D1) perpendicular to the printed circuit board 380. The damping structure 310 may suppress vibration caused by the capacitor 382 and transmitted to the printed circuit board 380, and may suppress and / or prevent the vibration caused by the capacitor 382 from being delivered to the sound sensor 354 as audible noise.

[0075] The damping structure 310 may provide different magnitudes of resilience (or damping force) to the printed circuit board 380 and the biometric sensor structure 320. For example, the resilience of the damping structure 310 in the first direction D1 and the second direction D2 may be different. For example, in the resilience provided by the damping structure 310 in the first direction D1, the resilience generated by the second member 312 contacting the printed circuit board 380 may be dominant, and in the resilience provided in the second direction D2, the resilience generated by the first member 311 contacting the biometric sensor structure 320 may be dominant. Because the resilience index of the second member 312 is greater than the resilience index (or hardness) of the first member 311, the resilience provided by the damping structure 310 in the first direction D1 may be higher than the resilience in the second direction. When the resilience in the second direction D2 is higher than the required resilience, the biometric sensor structure 320 may move in the first direction D1 or the second direction D2, which may seriously affect the performance of the biometric sensor 324. In addition, when the resilience in the second direction D2 is higher than the required resilience, the waterproof performance between the biometric sensor structure 320 and the first cover 391 provided by the joint member 325 may be deteriorated. When the resilience in the first direction D1 is lower than the required resilience, it may be difficult to suppress the vibration transmitted to the printed circuit board 380. The damping structure 310 can minimize the influence on the biometric sensor structure 320 while suppressing the vibration transmitted to the printed circuit board 380 by providing different magnitudes of resilience in the first direction D1 and the second direction D2.

[0076] The first cover 391 may include, for example, a protrusion 394. The protrusion 394 may protrude from the second surface 391B toward the printed circuit board 380. The protrusion 394 may at least partially overlap with the biometric sensor structure 320 relative to a direction perpendicular to the first direction D1. In addition, although not shown, a damping structure including the first member 311 and / or the second member 312 may be disposed between the protrusion 394 and the first surface 380A of the printed circuit board 380. In addition, although not shown, a damping structure including the first member 311 and / or the second member 312 may be disposed in an area where the first surface 361A of the bracket 360 and the second surface 380B of the printed circuit board 380 contact each other. The first member 311 and the second member 312 of the damping structure 310 may be interchangeable.

[0077] Depending on the model of the product being produced, the distance between the biometric sensor structure 320 and the printed circuit board 380 may be different. For example, the distance between the biometric sensor structure 320 and the printed circuit board 380 may become greater than the distance shown (however, the absolute or relative size of the configuration shown is not limited to the example shown). In this case, in the damping structure 310, the thickness of the first member 311 and / or the second member 312 may be further increased to compensate for the increased distance between the printed circuit board 380 and the biometric sensor structure 320. Optionally, the damping structure 310 may further include a third member stacked on the first member 311 or the second member 312 to compensate for the increased distance between the printed circuit board 380 and the biometric sensor structure 320. The third member may be substantially the same as the first member 311 and the second member 312. On the contrary, the distance between the biometric sensor structure 320 and the printed circuit board 380 may become less than the distance shown. In this case, the thickness of the first member 311 and / or the second member 312 may be reduced to compensate for the reduced distance between the printed circuit board 380 and the biometric sensor structure 320. Alternatively or additionally, the damping structure 310 may not include the second member 312 to compensate for the reduced distance between the printed circuit board 380 and the biometric sensor structure 320 .

[0078] The wearable electronic devices 100 and 300 according to the embodiments may include: a housing 110 including a cover 390. The wearable electronic devices 100 and 300 may include: a bracket 360 disposed in the housing 110 and including a first portion 361. The wearable electronic devices 100 and 300 may include: a printed circuit board 380 disposed between the cover 390 and the bracket 360 and at least partially facing a first surface 361A of the first portion 361 of the bracket 360. The wearable electronic devices 100 and 300 may include: a sound sensor structure 350 disposed on a second surface 361B of the first portion 361 of the bracket 360 that is different from the first surface 361A. The wearable electronic devices 100 and 300 may include: a biometric sensor structure 320 installed in the cover 390 to overlap with the first surface 361A of the first portion 361 of the bracket 360 relative to a direction D1 perpendicular to the printed circuit board 380. The wearable electronic devices 100 and 300 may include a damping structure 310 inserted between the biometric sensor structure 320 and the printed circuit board 380 and elastically supporting the biometric sensor structure 320 and the printed circuit board 380. The damping structure 310 may reduce or eliminate noise caused by vibration of the printed circuit board 380 by suppressing vibration.

[0079] In an embodiment, the damping structure 310 may include a first member 311 having a certain value of resilience.

[0080] In an embodiment, the damping structure 310 may include a second member 312 stacked on a first member 311 , and the resilience of the first member may be different from the resilience of the second member.

[0081] In an embodiment, the first member 311 may be disposed between the biometric sensor structure 320 and the second member 312 , and the second member 312 may be disposed between the first member 311 and the printed circuit board 380 .

[0082] In an embodiment, the resilience of the first member 311 may be lower than the resilience of the second member 312 .

[0083] In an embodiment, the first member 311 may include a sponge.

[0084] In an embodiment, the second member 312 may include a polyethylene terephthalate (PET) film.

[0085] In an embodiment, the printed circuit board 380 may include a first surface 380A facing the cover 390 and a second surface 380B facing the first surface 380A. The biometric sensor structure 320 may include: a substrate 322 disposed above the first surface 380A of the printed circuit board 380; and a temperature sensor 324 disposed on the substrate 322 to face the cover 390. The first member 311 may be disposed between the substrate 322 and the second member 312. The second member 312 may be disposed between the first surface 380A of the printed circuit board 380 and the first member 311.

[0086] In an embodiment, the damping structure 310 may include at least two of a first bonding layer, a second bonding layer, and a third bonding layer. The first bonding layer may be disposed between the biometric sensor structure 320 and the first member 311. The second bonding layer may be disposed between the first member 311 and the second member 312. The third member 312 may be disposed between the second member 312 and the printed circuit board 380.

[0087] In an embodiment, the first member 311 may have a hollow portion.

[0088] The wearable electronic devices 100 and 300 according to the embodiments may include: a battery 389 at least partially accommodated in the interior of the bracket 360; and a connecting member 372 electrically connecting the battery 389 to the printed circuit board 380. The housing 110 may include a frame 306, and the cover 390 is coupled to the frame 306. The first portion 361 of the bracket 360 may be located between the battery 389 and the frame 306. The first recess 367 may be formed on the first surface 361A of the first portion 361 of the bracket 360, and the connecting member 372 is disposed in the first recess 367. The second recess 368 may be formed on the second surface 361B of the first portion 361 of the bracket 360, and the sound sensor structure 350 is at least partially accommodated in the second recess 368.

[0089] The wearable electronic devices 100 and 300 according to the embodiments may include a sensor module 111. The cover 390 may include: a first cover 391; and a second cover 392 coupled to the first cover 391 to close a hollow portion formed in the first cover 391. The biometric sensor structure 320 may be at least partially accommodated in a through hole 399 formed in the first cover 391. The sensor module 111 may be disposed on a rear surface of the second cover 392. The biometric sensor structure 320 may be configured to detect first biometric information including a body temperature of a user contacting the cover 390 through the through hole 399. The sensor module 111 may be configured to detect biometric information different from the first biometric information.

[0090] The wearable electronic devices 100 and 300 according to the embodiments may include a second damping structure and / or a third damping structure. The cover 390 may include a protrusion 394 extending toward the printed circuit board 380. The protrusion 394 may overlap the biometric sensor structure 320 at least partially with respect to a direction parallel to the printed circuit board 380. The second damping structure may be disposed between the protrusion 394 and the printed circuit board 380. The second damping structure may elastically support the printed circuit board 380. The third damping structure may be disposed between the printed circuit board 380 and the first surface 361A of the first portion 361 of the bracket 360. The third damping structure may elastically support the printed circuit board 380.

[0091] The wearable electronic devices 100 and 300 according to the embodiments may include a capacitor 382 provided in the printed circuit board 380. The damping structure 310 may be located between the sound sensor structure 350 and the capacitor 382 with respect to a direction parallel to the printed circuit board 380.

[0092] In an embodiment, the printed circuit board 380 may include a portion between the damping structure 310 and the sound sensor structure 350 with respect to a direction parallel to the printed circuit board 380. No capacitor may be provided in the portion of the printed circuit board 380.

[0093] Figure 6 is an exploded perspective view of a wearable electronic device according to an embodiment. Figure 6 According to the wearable electronic device 600 of the embodiment (eg, Figure 1 The wearable electronic device 100 may include a back cover 690 , a frame 606 , a bracket 660 , a sound sensor structure 650 , a biometric sensor structure 620 , and a damping structure 610 .

[0094] For the back cover 690, the frame 606, the bracket 660, the sound sensor structure 650, the biometric sensor structure 620 and the damping structure 610 of the wearable electronic device 600, the above-mentioned embodiments can be applied in substantially the same manner, similarly or in a corresponding manner. Figure 3 , Figure 4 and Figure 5 The description of the back cover 390, the frame 306, the bracket 360, the sound sensor structure 350, the biometric sensor structure 320, and the damping structure 310 of the wearable electronic device 300 is performed. For example, the damping structure 610 may include a first member 311, and may also include a second member 312. In the following, the repeated description thereof may be omitted.

[0095] The back cover 690 may include a first cover 691 and a second cover 692. The biometric sensor structure 620 may be installed in the back cover 690. For example, the biometric sensor structure 620 may be installed in the second cover 692 of the back cover 690, but the present disclosure is not limited thereto. For example, the biometric sensor structure 620 may be installed in the first cover 611. The biometric sensor structure 620 may not overlap with the damping structure 610 with respect to the second direction D2. The damping structure 610 may be disposed between the printed circuit board 380 and the back cover 690. Optionally, the wearable electronic device 600 according to the embodiment may not include the biometric sensor structure 620.

[0096] Figure 7 is a cross-sectional view of a wearable electronic device according to an embodiment. Figure 7 It can be along Figure 6 A cross-sectional view taken along line BB'.

[0097] Reference Figure 7, the bracket 660 may include a first portion 661. The first portion 661 may include a portion located between the display 120 and the printed circuit board 380 relative to the first direction D1. The first portion 661 may be located between the front cover 101 and the first cover 691 of the cover 690 relative to the first direction D1. The first portion 661 may at least partially overlap the damping structure 610 and the protrusion 694 relative to the first direction D1, and the damping structure 610 is disposed on the protrusion 694. The first portion 661 may be located between the battery 389 and the frame 606 relative to the first direction D1.

[0098] The first portion 661 of the bracket 660 may include a first surface 661A and a second surface 661B. The first surface 661A of the first portion 661 may at least partially face the printed circuit board 380. For example, the first surface 661A may include a first region (e.g., a region facing the second direction D2) facing the second surface 380B of the printed circuit board 380 and a second region extending from the first region toward the first cover 691. The second region of the first surface 661A may face the printed circuit board 380 in a direction perpendicular to the first direction D1. The first surface 661A may at least partially contact the printed circuit board 380, but the present disclosure is not limited thereto. For example, the first surface 661A may at least partially contact the side surface of the printed circuit board 380 (e.g., the side surface between the first surface 380A and the second surface 380B), but the present disclosure is not limited thereto.

[0099] The first concave portion 667 may be formed on the first surface 661A. The first concave portion 667 may be recessed in a direction (eg, a first direction D1) that becomes farther away from the printed circuit board 380. For example, Figure 5 The connecting member 372 , the supporting plate 373 , the engaging member 375 , and the connector 384 may be disposed in the first recess 667 .

[0100] The second surface 661B of the first portion 661 may face the frame 606. The second surface 661B may not contact the printed circuit board 380. The second surface 661B may face the direction opposite to the printed circuit board 380. A second recess 668 may be formed on the second surface 661B. The second recess 668 may be recessed in a direction becoming away from the frame 606 on the second surface 661B. For example, the second recess 668 may be recessed toward the inner space "S" in a direction away from the side surface 110C of the frame 606. The second surface 661B may extend from the first surface 661A, but the present disclosure is not limited thereto.

[0101] The sound sensor structure 650 may be disposed on the second surface 661B of the first portion 661. The sound sensor structure 650 may be at least partially accommodated in a second recess 668 formed on the second surface 661B. The sound sensor structure 650 may be disposed between the first portion 661 of the bracket 660 and the first cover 691. The sound sensor structure 650 may be disposed on the second surface 661B of the bracket 660 to face the first acoustic channel 607 formed in the first cover 691. The first acoustic channel 607 may extend from the microphone hole 605 formed on the first surface 691A of the first cover 691 to the sound sensor structure 650. The first acoustic channel 607 may define an acoustic channel of the sound sensor structure 650. The sound sensor structure 650 may include Figure 5 The substrate 352 , the sound sensor 354 and the acoustic gasket 356 .

[0102] The first cover 691 of the rear cover 690 may include a first surface 691A and a second surface 691B. The first surface 691A may at least partially define the rear surface 110B. The second surface 691B opposite to the first surface 691A may face the printed circuit board 380 .

[0103] The first cover 691 of the rear cover 690 may include a protrusion 694 formed on the second surface 691B. The protrusion 694 may protrude from the second surface 691B toward the printed circuit board 380. Figure 7 It is shown that one protrusion 694 is provided, but the present disclosure is not limited thereto. The protrusion 694 may protrude from one or more regions of the second surface 691B. For example, one or more protrusions 694 may be provided. Corresponding to one or more protrusions 694, one or more damping structures 610 may also be provided. For example, one damping structure 610 may be provided in one protrusion 694. As another example, two damping structures 610 may be provided in two protrusions 694. As another example, two damping structures 610 may be provided in one protrusion 694.

[0104] The damping structure 610 may be disposed between the protrusion 694 and the first surface 380A of the printed circuit board 380. The damping structure 610 may contact the protrusion 694 and the first surface 380A of the printed circuit board 380. The damping structure 610 may be located between the capacitor 382 and the sound sensor 354 with respect to a direction parallel to the first surface 380A or the second surface 380B of the printed circuit board 380 (a direction perpendicular to the first direction D1). The printed circuit board 380 may include a side closer to the sound sensor structure 650, and the damping structure 610 may contact the side of the printed circuit board 380. No capacitor may be disposed on the first surface 380A and the second surface 380B of the printed circuit board 380 between the damping structure 610 and the sound sensor 354, but the present disclosure is not limited thereto.

[0105] The damping structure 610 may elastically support the printed circuit board 380 .

[0106] Although not shown, the damping structure 610 may be additionally or selectively disposed between the printed circuit board 380 and the bracket 660. For example, the damping structure 610 may be disposed between the printed circuit board 380 and the first portion 661 of the bracket 660. The damping structure 610 may elastically support the printed circuit board 380 and the bracket 660. For example, the damping structure 610 may be disposed in the first recess 667, and may elastically support the printed circuit board 380 and the first surface 661A of the bracket 660. As another example, the damping structure 610 may be disposed between the side surface of the printed circuit board 380 and the first surface 661A of the bracket 660 facing the side surface, and may elastically support the printed circuit board 380 and the bracket 660. However, the position where the damping structure 610 is disposed to elastically support the printed circuit board 380 and the bracket 660 is not limited to the above example, and various modifications may be made.

[0107] Although not shown, the damping structure 610 may include a first bonding layer and / or a second bonding layer. The first bonding layer may be provided on the protrusion 694 to attach the damping structure 610 to the protrusion 694. The second bonding layer may be provided on the first surface 380A of the printed circuit board 380, and the damping structure 610 may be attached to the printed circuit board 380. As an example, the damping structure 610 may include a first bonding layer, and may not include a second bonding layer. In this case, when the first cover 691 to which the damping structure 610 is attached and the printed circuit board 380 are assembled, the damping structure 610 may be pressed and attached by the printed circuit board 380.

[0108] The damping structure 610 may elastically support the printed circuit board 380 in a direction (e.g., the first direction D1) perpendicular to the printed circuit board 380. The damping structure 610 may suppress vibration caused by the capacitor 382 and transmitted to the printed circuit board 380, and may suppress and / or prevent the vibration caused by the capacitor 382 from being transmitted to the sound sensor 354 as audible noise.

[0109] Figure 8 is a graph depicting the sound signal received by the sound sensor. Figure 8 Curve (a) describes the acoustic signal of the electronic device which does not include a damping structure. Figure 8 The curve (b) of FIG. 1 describes the sound signal of the wearable electronic device including the damping structure (eg, the damping structure 310 or the damping structure 610) according to the embodiment. Figure 8 , the audible sound can be reduced in all frequency bands or in a specific frequency band with strong noise by the damping structure.

[0110] The wearable electronic devices 100 and 600 according to the embodiment may include: a housing 110 including a cover 690. The wearable electronic devices 100 and 600 may include: a bracket 660 disposed in the housing 110 and including a first portion 661. The wearable electronic devices 100 and 600 may include: a printed circuit board 380 disposed between the cover 690 and the bracket 660 and at least partially facing a first surface 661A of the first portion 661 of the bracket 660. The wearable electronic devices 100 and 600 may include: a sound sensor structure 650 disposed on a second surface 661B of the first portion 661 of the bracket 660 that is different from the first surface 661A. The wearable electronic devices 100 and 600 may include a damping structure 610. The cover 690 may include a protrusion 694 extending toward the printed circuit board 380. The damping structure 610 may be disposed between the printed circuit board 380 and the protrusion 694. The damping structure 610 may elastically support the printed circuit board 380. The damping structure 610 may reduce or eliminate noise caused by vibration of the printed circuit board 380 by damping the vibration.

[0111] In an embodiment, the damping structure 610 may include a first member 311 having a certain value of resilience.

[0112] In an embodiment, the damping structure 610 may include a second member 312 stacked on a first member 311. The resilience of the first member 311 may be different from the resilience of the second member 312.

[0113] In an embodiment, the first member 311 of the damping structure 610 may be disposed between the protrusion 694 and the second member 312. The second member 312 of the damping structure 610 may be disposed between the first member 311 and the printed circuit board 380.

[0114] In an embodiment, the resilience of the first member 311 may be lower than the resilience of the second member 312 .

[0115] In an embodiment, the first member 311 of the damping structure 610 may include a sponge.

[0116] In an embodiment, the second member 312 of the damping structure 610 may include a polyethylene terephthalate (PET) film.

[0117] In an embodiment, the wearable electronic devices 100 and 600 according to the embodiment may include the biometric sensor structure 320. The damping structure 610 may not overlap with the biometric sensor structure 320 with respect to a direction perpendicular to the printed circuit board 380.

[0118] In an embodiment, the damping structure 610 may include at least two of a first bonding layer, a second bonding layer, and a third bonding layer. The first bonding layer may be disposed between the protrusion 694 and the first member 311. The second bonding layer may be disposed between the first member 311 and the second member 312. The third bonding layer may be disposed between the second member 312 and the printed circuit board 380.

[0119] In an embodiment, the first member 311 of the damping structure 610 may have a hollow portion.

[0120] The wearable electronic devices 100 and 600 according to the embodiments may include: a battery 389 at least partially accommodated in the interior of the bracket 660; and a connecting member 372 electrically connecting the battery 389 to the printed circuit board 380. The housing 110 may include a frame 606 to which the cover 690 is coupled. The first portion 661 of the bracket 660 may be located between the battery 389 and the frame 606. A first recess 667 may be formed on a first surface 661A of the first portion 661 of the bracket 660, and the connecting member 372 is disposed in the first recess 667. A second recess 668 may be formed on a second surface 661B of the first portion 661 of the bracket 660, and the sound sensor structure 650 is at least partially accommodated in the second recess 668.

[0121] The wearable electronic devices 100 and 600 according to the embodiments may include a sensor module 111. The cover 690 may include: a first cover 691; and a second cover 692 coupled to the first cover 691 to close a hollow portion formed in the first cover 691. The biometric sensor structure 320 may be installed in the first cover 391. The sensor module 111 may be disposed on a rear surface of the second cover 692. The biometric sensor structure 320 may be configured to detect first biometric information including a body temperature of a user contacting the cover 390. The sensor module 111 may be configured to detect biometric information different from the first biometric information.

[0122] The wearable electronic devices 100 and 600 according to the embodiments may include a second damping structure (eg, damping structure 610). The damping structure may be disposed between the printed circuit board 380 and the first portion 661 of the bracket 660. The second damping structure may elastically support the printed circuit board 380.

[0123] In an embodiment, the second damping structure may be disposed in the first recess 667 of the bracket 660 .

[0124] The wearable electronic devices 100 and 600 according to the embodiments may include a capacitor 382 disposed in the printed circuit board 380. The damping structure 610 may be located between the sound sensor structure 650 and the capacitor 382 with respect to a direction parallel to the printed circuit board 380.

[0125] In an embodiment, the printed circuit board 380 may include a portion between the damping structure 610 and the sound sensor structure 650 with respect to a direction parallel to the printed circuit board 380. No capacitor may be provided in the portion of the printed circuit board 380.

[0126] Fig. 9 is a block diagram illustrating an electronic device 901 in a network environment 900 according to various embodiments. Fig. 9, the electronic device 901 in the network environment 900 may communicate with at least one of the electronic devices 902 via a first network 998 (e.g., a short-range wireless communication network), or communicate with the electronic device 904 or the server 908 via a second network 999 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 901 may communicate with the electronic device 904 via the server 908. According to an embodiment, the electronic device 901 may include a processor 920, a memory 930, an input module 950, a sound output module 955, a display module 960, an audio module 970, a sensor module 976, an interface 977, a connection terminal 978, a haptic module 979, a camera module 980, a power management module 988, a battery 989, a communication module 990, a user identification module (SIM) 996, or an antenna module 997. In some embodiments, at least one of the above components (e.g., the connection terminal 978) may be omitted from the electronic device 901, or one or more other components may be added to the electronic device 901. In some embodiments, some of the above-described components (eg, sensor module 176, camera module 180, or antenna module 197) may be implemented as a single component (eg, display module 160).

[0127] The processor 920 may run, for example, software (e.g., program 940) to control at least one other component (e.g., hardware component or software component) of the electronic device 901 connected to the processor 920, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 920 may store commands or data received from another component (e.g., sensor module 976 or communication module 990) in the volatile memory 932, process the commands or data stored in the volatile memory 932, and store the resultant data in the non-volatile memory 934. According to an embodiment, the processor 920 may include a main processor 921 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 923 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or combined with the main processor 921 in operation. For example, when the electronic device 901 includes a main processor 921 and an auxiliary processor 923, the auxiliary processor 923 may be adapted to consume less power than the main processor 921, or adapted to be dedicated to a specified function. The auxiliary processor 923 may be implemented as a separate part from the main processor 921, or as part of the main processor 921.

[0128] When the main processor 921 is in an inactive (e.g., sleep) state, the auxiliary processor 923 (rather than the main processor 921) may control at least some of the functions or states related to at least one component among the components of the electronic device 901 (e.g., display module 960, sensor module 976, or communication module 990), or when the main processor 921 is in an active state (e.g., running an application), the auxiliary processor 923 may control at least some of the functions or states related to at least one component among the components of the electronic device 901 (e.g., display module 960, sensor module 976, or communication module 990) together with the main processor 921. According to an embodiment, the auxiliary processor 923 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., a camera module 980 or a communication module 990) that is functionally related to the auxiliary processor 923. According to an embodiment, the auxiliary processor 923 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated by machine learning. For example, such learning may be performed by the electronic device 901 where the artificial intelligence is executed or via a separate server (e.g., server 908). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network or a combination of two or more thereof, but is not limited thereto. Additionally or alternatively, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0129] The memory 930 may store various data used by at least one component of the electronic device 901 (e.g., the processor 920 or the sensor module 976). The various data may include, for example, software (e.g., the program 940) and input data or output data for commands related thereto. The memory 930 may include a volatile memory 932 or a non-volatile memory 934.

[0130] The program 940 may be stored as software in the memory 930 , and may include, for example, an operating system (OS) 942 , middleware 944 , or an application 946 .

[0131] The input module 950 may receive commands or data to be used by other components (e.g., the processor 920) of the electronic device 901 from outside (e.g., a user) of the electronic device 901. The input module 950 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0132] The sound output module 955 can output a sound signal to the outside of the electronic device 901. The sound output module 955 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive an incoming call. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as part of the speaker.

[0133] The display module 960 may visually provide information to the outside of the electronic device 901 (e.g., a user). The display module 960 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 960 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0134] The audio module 970 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 970 may obtain sound via the input module 950, or output sound via the sound output module 955 or an earphone of an external electronic device (e.g., electronic device 902) directly (e.g., wired) connected to the electronic device 901 or wirelessly connected thereto.

[0135] The sensor module 976 may detect an operating state (e.g., power or temperature) of the electronic device 901 or an environmental state (e.g., a state of a user) outside the electronic device 901, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 976 may include, for example, a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0136] The interface 977 may support one or more specific protocols to be used to connect the electronic device 901 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 902). According to an embodiment, the interface 977 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0137] The connection end 978 may include a connector, wherein the electronic device 901 can be physically connected to an external electronic device (e.g., the electronic device 902) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0138] The haptic module 979 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 979 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0139] The camera module 980 may capture a still image or a moving image. According to an embodiment, the camera module 980 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0140] The power management module 988 may manage power supply to the electronic device 901. According to an embodiment, the power management module 988 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0141] The battery 989 may power at least one component of the electronic device 901. According to an embodiment, the battery 989 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0142] The communication module 990 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 901 and an external electronic device (e.g., electronic device 902, electronic device 904, or server 908), and perform communication via the established communication channel. The communication module 990 may include one or more communication processors capable of operating independently from the processor 920 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 990 may include a wireless communication module 992 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 994 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules may communicate via a first network 998 (e.g., a short-range communication network such as Bluetooth TM The electronic device 901 may communicate with the external electronic device 904 through a wireless communication network (e.g., a wireless Fidelity (Wi-Fi) Direct connection, or an Infrared Data Association (IrDA)) or a second network 999 (e.g., a long-distance communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 992 may identify or authenticate the electronic device 901 in a communication network (such as a first network 998 or a second network 999) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 996.

[0143] The wireless communication module 992 can support 5G networks after 4G networks and next-generation communication technologies (e.g., new radio (NR) access technology). NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable low-latency communication (URLLC). The wireless communication module 992 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 992 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 992 can support various requirements specified in the electronic device 901, an external electronic device (e.g., electronic device 904), or a network system (e.g., a second network 999). According to an embodiment, the wireless communication module 992 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip).

[0144] The antenna module 997 may transmit a signal or power to the outside of the electronic device 901 (e.g., an external electronic device) or receive a signal or power from the outside of the electronic device 901 (e.g., an external electronic device). According to an embodiment, the antenna module 997 may include an antenna including a radiating element, and the radiating element is formed of a conductive material or a conductive pattern formed on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 997 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 998 or the second network 999) may be selected from the plurality of antennas by, for example, the communication module 990. A signal or power may then be transmitted or received between the communication module 990 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as part of the antenna module 997.

[0145] According to various embodiments, the antenna module 997 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a specified high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the specified high frequency band.

[0146] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0147] According to an embodiment, a command or data may be sent or received between the electronic device 901 and the external electronic device 904 via the server 908 connected to the second network 999. Each of the external electronic device 902 or the electronic device 904 may be a device of the same type as the electronic device 901, or a device of a different type from the electronic device 901. According to an embodiment, all or some operations to be executed in the electronic device 901 may be executed in one or more of the external electronic device 902, the external electronic device 904, or the external electronic device 908. For example, if the electronic device 901 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 901 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 901 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices receiving the request may execute at least part of the requested function or service, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 901. The electronic device 901 may provide the result as at least a partial reply to the request in the case of further processing the result or in the case of not further processing the result. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology or client-server computing technology, for example, may be used. The electronic device 901 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 904 may include an Internet of Things (IoT) device. The server 908 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 904 or the server 908 may be included in the second network 999. The electronic device 901 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars or health care) based on 5G communication technology or IoT-related technologies.

[0148] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those electronic devices described above.

[0149] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalents or alternative forms for the corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include all possible combinations of items listed together with the corresponding one of the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “combined with another element (e.g., the second element)”, “combined to another element (e.g., the second element)”, “connected with another element (e.g., the second element)”, or “connected to another element (e.g., the second element)” when the terms “operably” or “communicatively” are used or when the terms “operably” or “communicatively” are not used, it means that the element may be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0150] As used in conjunction with various embodiments of the present disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or portion of the single integrated component. For example, depending on the embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0151] Embodiments of the present disclosure may be implemented as software (e.g., program 940) including one or more instructions stored in a storage medium (e.g., internal memory 936 or external memory 938) that can be read by a machine (e.g., electronic device 901). For example, under the control of a processor, a processor (e.g., processor 920) of the machine (e.g., electronic device 901) may call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be run by an interpreter. A machine-readable storage medium may be provided in the form of a non-transitory storage medium. Among them, the term "non-transitory" only means that the storage medium is a tangible device and does not include a signal (e.g., an electromagnetic wave), but the term does not distinguish between data being semi-permanently stored in a storage medium and data being temporarily stored in a storage medium.

[0152] According to an embodiment, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be released in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be downloaded via an application store (e.g., Play Store TM ) The computer program product may be published (e.g., downloaded or uploaded) online, or the computer program product may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If published online, at least part of the computer program product may be temporarily generated, or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a memory of a manufacturer's server, an application store's server, or a forwarding server).

[0153] According to various embodiments, each component (e.g., module or program) of the above-mentioned components may include a single entity or multiple entities. Some of the multiple entities may be separately arranged in different components. According to various embodiments, one or more of the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding one of the multiple components before integration. According to various embodiments, the operations performed by a module, program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more of the operations may be run or omitted in a different order, or one or more other operations may be added.

Claims

1. A wearable electronic device (100, 300), comprising: A housing (110) including a cover (390); A bracket (360) is disposed in the housing (110) and includes a first portion (361); a printed circuit board (380) disposed between the cover (390) and the bracket (360) and at least partially facing the first surface (361A) of the first portion (361) of the bracket (360); A sound sensor structure (350) is disposed on a second surface (361B) of the first portion (361) of the bracket (360) that is different from the first surface (361A); a biometric sensor structure (320) mounted in the cover (390) to overlap the first surface (361A) of the first portion (361) of the bracket (360) relative to a direction (D1) perpendicular to the printed circuit board (380); as well as A damping structure (310) is inserted between the biometric sensor structure (320) and the printed circuit board (380) and is configured to elastically support the biometric sensor structure (320) and the printed circuit board (380).

2. The wearable electronic device according to claim 1, wherein: The damping structure (310) includes a first member (311) having a specific value of resilience.

3. The wearable electronic device according to claim 2, wherein: The damping structure (310) includes a second member (312) stacked on a first member (311), and The resilience of the first component is different from the resilience of the second component.

4. The wearable electronic device according to claim 3, wherein: The first member (311) is disposed between the biometric sensor structure (320) and the second member (312), and The second component (312) is arranged between the first component (311) and the printed circuit board (380).

5. The wearable electronic device according to claim 3 or 4, wherein: The resilience of the first member (311) is lower than the resilience of the second member (312).

6. The wearable electronic device according to any one of claims 3 to 5, wherein: The first member (311) includes a sponge, and Wherein, the second component (312) includes a polyethylene terephthalate film.

7. The wearable electronic device according to any one of claims 3 to 6, wherein: The printed circuit board (380) includes a first surface (380A) facing the cover (390) and a second surface (380B) opposite to the first surface (380A). Wherein, the biometric sensor structure (320) comprises: a substrate (322) disposed above the first surface (380A) of the printed circuit board (380); and a temperature sensor (324) disposed in the substrate (322) to face the cover (390), wherein the first member (311) is disposed between the substrate (322) and the second member (312); and The second component (312) is disposed between the first surface (380A) of the printed circuit board (380) and the first component (311).

8. The wearable electronic device according to any one of claims 3 to 7, wherein: The damping structure (310) comprises at least two of a first bonding layer, a second bonding layer and a third bonding layer, The first bonding layer is arranged between the biometric sensor structure (320) and the first component (311), wherein the second bonding layer is disposed between the first member (311) and the second member (312); and Wherein, the third bonding layer is arranged between the second component (312) and the printed circuit board (380).

9. The wearable electronic device according to any one of claims 2 to 8, wherein: The first member (311) has a hollow portion.

10. The wearable electronic device according to any one of claims 1 to 9, comprising: a battery (389) at least partially housed within the interior of the support (360); as well as a connecting member (372) for electrically connecting the battery (389) to the printed circuit board (380), wherein the housing (110) includes a frame (306), the cover (390) is coupled to the frame (306), The first portion (361) of the bracket (360) is located between the battery (389) and the frame (306). wherein a first recess (367) is formed on a first surface (361A) of a first portion (361) of the bracket (360), and the connecting member (372) is disposed in the first recess (367); and The second recess (368) is formed on the second surface (361B) of the first portion (361) of the bracket (360), and the sound sensor structure (350) is at least partially accommodated in the second recess (368).

11. The wearable electronic device according to any one of claims 1 to 10, comprising: A sensor module (111), The cover (390) includes a first cover (391) and a second cover (392), the second cover (392) being coupled to the first cover (391) to close a hollow portion formed in the first cover (391), wherein the biometric sensor structure (320) is at least partially received in a through hole (399) formed in the first cover (391), The sensor module (111) is disposed on the rear surface of the second cover (392). wherein the biometric sensor structure (320) is configured to detect first biometric information through the through hole (399), the first biometric information comprising a body temperature of a user contacting the cover (390); and The sensor module (111) is configured to detect biometric information different from the first biometric information.

12. The wearable electronic device according to any one of claims 1 to 11, comprising: The second damping structure and the third damping structure, wherein the cover (390) includes a protrusion (394) extending toward the printed circuit board (380), wherein the protrusion (394) at least partially overlaps the biometric sensor structure (320) relative to a direction parallel to the printed circuit board (380), wherein the second damping structure is disposed between the protruding portion (394) and the printed circuit board (380) to elastically support the printed circuit board (380), The third damping structure is arranged between the printed circuit board (380) and the first surface (361A) of the first part (361) to elastically support the printed circuit board (380).

13. The wearable electronic device according to any one of claims 1 to 12, comprising: A capacitor (382) is disposed in the printed circuit board (380), The damping structure (310) is located between the sound sensor structure (350) and the capacitor (382) relative to a direction parallel to the printed circuit board (380).

14. The wearable electronic device according to claim 13, wherein: The printed circuit board (380) includes a portion between the damping structure (310) and the sound sensor structure (350) with respect to a direction parallel to the printed circuit board (380), and Wherein, no capacitor is arranged in the portion of the printed circuit board (380).

15. A wearable electronic device (100, 600), comprising: A housing (110) including a cover (690); A bracket (660) is disposed in the housing (110) and includes a first portion (661); a printed circuit board (380) disposed between the cover (690) and the bracket (660) and at least partially facing the first surface (661A) of the first portion (661) of the bracket (660); a sound sensor structure (650) disposed on a second surface (661B) of the first portion (661) of the bracket (660) that is different from the first surface (661A); and A damping structure (610), wherein the cover (690) includes a protrusion (694) extending toward the printed circuit board (380); and The damping structure (610) is disposed between the printed circuit board (380) and the protrusion (694) to elastically support the printed circuit board (380).

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