Power conversion device

Abstract

Provided is a power conversion device in which a capacitor is easy to replace and in which connection failure does not readily occur between the capacitor and another electronic component. A power conversion device (100) is provided with: a printed circuit board (1U14) having a first surface (14a); at least one capacitor (1U13) mounted on a first surface (14a) of the printed circuit board (1U14); and an input-side semiconductor module (1U11) and an output-side semiconductor module (1U12) which are disposed so as to sandwich the at least one capacitor (1U13) in a first direction (DR1) along the first surface (14a), and which are electrically connected to each other via the at least one capacitor (1U13). The printed circuit board (1U14) is detachably supported by each of the input-side semiconductor module (1U11) and the output-side semiconductor module (1U12).

Description

Technical Field

[0001] The present disclosure relates to a power conversion device. Background Art

[0002] Conventionally, there is a power conversion device in which a capacitor electrically connected between a semiconductor element on the input side and a semiconductor element on the output side is mounted on a substrate different from the substrate on which the semiconductor elements on the input side and the output side are mounted, and the substrate on which the capacitor is mounted can be attached and detached relative to the substrate on which the semiconductor elements are mounted. In such a power conversion device, by attaching and detaching the substrate on which the capacitor is mounted relative to the substrate on which the semiconductor elements are mounted, the capacitor can be easily replaced compared to a power conversion device in which the capacitor and the semiconductor elements are mounted on the same substrate.

[0003] In the power supply system described in Japanese Patent No. 6190183 (Patent Document 1), a substrate on which a plurality of capacitors are mounted is detachably connected to a power supply substrate on which a power supply is mounted via a connector.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent No. 6190183 Summary of the invention

[0007] Problems to be solved by the invention

[0008] In the power supply system described in Patent Document 1, the capacitor substrate is supported on the power supply substrate in a cantilever state via a connector. The capacitor substrate has a portion connected to the power supply substrate via the connector and a portion protruding outward from the portion, and the capacitor is mounted on the latter portion. Therefore, stress is applied to the connection portion between the connector and the capacitor substrate, which may cause poor connection between the capacitor and electronic components such as a power supply mounted on the power supply substrate.

[0009] The main object of the present disclosure is to provide a power conversion device in which a capacitor can be easily replaced and poor connection between the capacitor and other electronic components is less likely to occur.

[0010] Means for solving problems

[0011] The power conversion device disclosed in the present invention comprises: a printed circuit board having a first surface; at least one capacitor mounted on the first surface of the printed circuit board; and an input-side semiconductor module and an output-side semiconductor module, which are arranged to sandwich the at least one capacitor in a first direction along the first surface and are electrically connected to each other via the at least one capacitor. The printed circuit board is supported by the input-side semiconductor module and the output-side semiconductor module in a detachable manner.

[0012] Effects of the Invention

[0013] According to the present disclosure, it is possible to provide a power conversion device in which a capacitor can be easily replaced and poor connection between the capacitor and other electronic components is less likely to occur. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a circuit diagram of the power conversion device according to the first embodiment.

[0015] Figure 2 This is a perspective view of the power conversion device according to the first embodiment.

[0016] Figure 3 It is a side view of the power conversion device according to the first embodiment.

[0017] Figure 4 This is a perspective view showing a capacitor and a printed circuit board of the power conversion device according to the first embodiment.

[0018] Figure 5 This is a circuit diagram of a modified example of the power conversion device according to the first embodiment.

[0019] Figure 6 This is a side view of another modified example of the power conversion device according to the first embodiment.

[0020] Figure 7 This is a cross-sectional view showing a first conductor pattern of a printed circuit board of a power conversion device according to a second embodiment.

[0021] Figure 8 This is a cross-sectional view showing a second conductor pattern of a printed circuit board of the power conversion device according to the second embodiment.

[0022] Fig. 9 It is a side view of the power conversion device according to the third embodiment.

[0023] Fig.10 It is a side view of the power conversion device according to the fourth embodiment.

[0024] Fig.11 It is a side view of the power conversion device according to the fifth embodiment.

[0025] Fig.12 It is a perspective view showing a capacitor and a printed circuit board of a power conversion device according to a fifth embodiment. DETAILED DESCRIPTION

[0026] Hereinafter, the embodiment will be described based on the drawings. In addition, in the following, the same reference numerals are attached to the same or corresponding parts, and the repeated description will not be repeated.

[0027] Implementation method 1.

[0028] <Structure of Power Conversion Device>

[0029] like Figure 1 As shown, the power conversion device 100 according to the first embodiment is configured as a three-phase power conversion device.

[0030] like Figure 1 As shown, the power conversion device 100 includes a first phase unit group 1U, a second phase unit group 1V and a third phase unit group 1W. The first phase unit group 1U, the second phase unit group 1V and the third phase unit group 1W are respectively configured to input and output the U phase, the V phase and the W phase. The first phase unit group 1U, the second phase unit group 1V and the third phase unit group 1W each include a plurality of power conversion circuit units. The plurality of power conversion circuit units each include a plurality of electronic components constituting a power conversion circuit. Preferably, the first phase unit group 1U, the second phase unit group 1V and the third phase unit group 1W have the same structure as each other. Here, the first phase unit group 1U is described as a representative of the first phase unit group 1U, the second phase unit group 1V and the third phase unit group 1W.

[0031] like Figure 1 As shown, the first phase unit group 1U includes a first phase first power conversion circuit unit 1U1, a first phase second power conversion circuit unit 1U2, and a first phase third power conversion circuit unit 1U3. Figure 1 , the components of the first-phase first power conversion circuit unit 1U1 are surrounded by dotted lines. The components of the first-phase second power conversion circuit unit 1U2 are surrounded by single-dotted lines. The components of the first-phase third power conversion circuit unit 1U3 are surrounded by double-dotted lines. The first-phase first power conversion circuit unit 1U1, the first-phase second power conversion circuit unit 1U2, and the first-phase third power conversion circuit unit 1U3 are each configured as a 1-phase 1-parallel power conversion circuit unit. The first-phase first power conversion circuit unit 1U1, the first-phase second power conversion circuit unit 1U2, and the first-phase third power conversion circuit unit 1U3 are connected in parallel with each other.

[0032] In addition, in each of the first phase unit group 1U, the second phase unit group 1V, and the third phase unit group 1W, the number of power conversion circuit units connected in parallel can be arbitrarily selected according to the specifications of the power conversion device 100. The number of power conversion circuit units connected in parallel for each phase may also be 2. For example, the first phase unit group 1U may also be composed of a first-phase first power conversion circuit unit 1U1 and a first-phase second power conversion circuit unit 1U2 connected in parallel to each other.

[0033] Preferably, the first-phase first power conversion circuit unit 1U1, the first-phase second power conversion circuit unit 1U2, and the first-phase third power conversion circuit unit 1U3 each have the same structure. Preferably, the power conversion circuit units of the first-phase unit group 1U, the second-phase unit group 1V, and the third-phase unit group 1W each have the same structure. Here, as a representative of the power conversion circuit units of the first-phase unit group 1U, the second-phase unit group 1V, and the third-phase unit group 1W, the first-phase first power conversion circuit unit 1U1 is described.

[0034] like Figure 2 As shown, the first-phase first power conversion circuit unit 1U1 includes, for example, a first input-side semiconductor module 1U11 , a first output-side semiconductor module 1U12 , a plurality of first-phase first capacitors 1U13 , a printed circuit board 1U14 , and a cooler 1U15 .

[0035] The first input-side semiconductor module 1U11 and the first output-side semiconductor module 1U12 are electrically connected to each other via a plurality of first-phase first capacitors 1U13. The first input-side semiconductor module 1U11 and the first output-side semiconductor module 1U12 are arranged at intervals from each other in the first direction DR1. The first input-side semiconductor module 1U11 and the first output-side semiconductor module 1U12 are arranged to sandwich a plurality of first-phase first capacitors 1U13 in the first direction DR1.

[0036] In addition, the first-phase first power conversion circuit unit 1U1 only needs to include at least one first-phase first capacitor 1U13. In this case, the first input-side semiconductor module 1U11 and the first output-side semiconductor module 1U12 only need to be configured to sandwich at least one first-phase first capacitor 1U13 in the first direction DR1. In addition, when the first-phase first power conversion circuit unit 1U1 includes a plurality of first-phase first capacitors 1U13, the first input-side semiconductor module 1U11 and the first output-side semiconductor module 1U12 only need to be configured to sandwich at least one of the plurality of first-phase first capacitors 1U13 in the first direction DR1.

[0037] The first input-side semiconductor module 1U11 and the first output-side semiconductor module 1U12 are each supported by the cooler 1U15 in a manner that allows them to be loaded and unloaded, for example. The first input-side semiconductor module 1U11 and the first output-side semiconductor module 1U12 are each fixed to the cooler 1U15, for example, by screws. The cooler 1U15 includes a first cooling portion 15a connected to the first input-side semiconductor module 1U11 and a second cooling portion 15b connected to the first output-side semiconductor module 1U12. Preferably, the first cooling portion 15a and the second cooling portion 15b are each connected to the first input-side semiconductor module 1U11 or the first output-side semiconductor module 1U12, for example, via heat dissipation grease or a heat sink.

[0038] The first input side semiconductor module 1U11 and the first output side semiconductor module 1U12 are configured so that when one functions as a converter, the other functions as an inverter. The first input side semiconductor module 1U11 and the first output side semiconductor module 1U12 are configured, for example, by a 2-in-1 package in which two insulated gate bipolar transistors (IGBTs) are built into one package. The first input side semiconductor module 1U11 and the first output side semiconductor module 1U12 are not limited to 2-in-1 packages, and 1-in-1 packages may also be used. In this case, the packages are connected, for example, by bus bars. The first input side semiconductor module 1U11 and the first output side semiconductor module 1U12 may also be configured by metal oxide semiconductor field effect transistors (MOSFET: Metal Oxide Semiconductor Field Effect Transistor) or transistors. The first input side semiconductor module 1U11 and the first output side semiconductor module 1U12 can be prepared as a general-purpose semiconductor module.

[0039] like Figure 3 As shown, a plurality of first-phase first capacitors 1U13 are each arranged at intervals from the first input-side semiconductor module 1U11, the first output-side semiconductor module 1U12, and the cooler 1U15. Preferably, each first-phase first capacitor 1U13 does not contact other components. In this way, each first-phase first capacitor 1U13 is not easily affected by vibration and heat from other components. In addition, each first-phase first capacitor 1U13 may be connected to other adjacent components, such as the first-phase first capacitor 1U13, the printed circuit board 1U14, and the cooler 15, via a spacer having elasticity. In addition, the first-phase first capacitor 1U13 may also be connected to the cooler 1U15 via a spacer having high thermal conductivity. When the first-phase first capacitor 1U13 is connected to the cooler 1U15, the first-phase first capacitor 1U13 can be cooled by the cooler 1U15 by setting the temperature of the cooler 1U15 to be lower than the temperature of the first-phase first capacitor 1U13.

[0040] Each of the plurality of first-phase first capacitors 1U13 is configured to function as a smoothing capacitor. The first-phase first capacitor 1U13 is, for example, a film capacitor or an electrolytic capacitor. The type of the first-phase first capacitor 1U13 may be appropriately determined according to the application. A plurality of capacitors may be mounted on the printed circuit board 1U14 in a state of being connected in series or in parallel. The first-phase first capacitor 1U13 may be mounted on the printed circuit board 1U14, for example, by soldering. In addition, the first-phase first capacitor 1U13 may be mounted on the printed circuit board 1U14 by other mounting methods, such as rivet joining.

[0041] Each of the plurality of first-phase first capacitors 1U13 may be a lead-type capacitor. That is, each of the plurality of first-phase first capacitors 1U13 may include a plurality of leads, and each lead passing through each of the plurality of through holes formed in the printed substrate 1U14 may be fixed by solder. Alternatively, each of the plurality of first-phase first capacitors 1U13 may be a surface-mounted capacitor. That is, each of the plurality of first-phase first capacitors 1U13 may include a mounting surface facing the first surface 14a of the printed substrate 1U14, and the first surface 14a of the printed substrate 1U14 and the mounting surface of the first-phase first capacitor 1U13 arranged thereon may be fixed by solder.

[0042] like Figure 3 As shown, the printed circuit board 1U14 has a first surface 14a and a second surface 14b located on the opposite side to the first surface 14a. The first surface 14a faces the cooler 1U15. The first surface 14a is opposite to a portion of each of the first input side semiconductor module 1U11, the first output side semiconductor module 1U12 and the cooler 1U15. The first surface 14a and the second surface 14b are each along the first direction DR1. In this specification, the direction perpendicular to the first surface 14a is referred to as the second direction DR2, and the direction perpendicular to the first direction DR1 and the second direction DR2 is referred to as the third direction DR3. The first input side semiconductor module 1U11 and the first output side semiconductor module 1U12 are arranged on the first surface 14a side relative to the printed circuit board 1U14. A plurality of first phase first capacitors 1U13 are mounted on the first surface 14a of the printed circuit board 1U14. No electronic components such as capacitors are mounted on the second surface 14b of the printed circuit board 1U14.

[0043] The printed circuit board 1U14 is detachably supported by the first input-side semiconductor module 1U11 and the first output-side semiconductor module 1U12. That is, the printed circuit board 1U14 is supported by the first input-side semiconductor module 1U11 and the first output-side semiconductor module 1U12 at both ends.

[0044] like Figure 3As shown, the printed circuit board 1U14 includes a first portion 14c, a second portion 14d, and a third portion 14e. The first portion 14c is connected to the first input-side semiconductor module 1U11 in a manner that allows loading and unloading. The first portion 14c is opposite to the first input-side semiconductor module 1U11 in the second direction DR2. The first portion 14c is electrically connected to the first input-side semiconductor module 1U11. The second portion 14d is connected to the first output-side semiconductor module 1U12 in a manner that allows loading and unloading. The second portion 14d is opposite to the first output-side semiconductor module 1U12 in the second direction DR2 and is electrically connected to the first output-side semiconductor module 1U12. The third portion 14e is located between the first portion 14c and the second portion 14d in the first direction DR1. A portion of the surface of each of the first portion 14c, the second portion 14d, and the third portion 14e constitutes the first surface 14a. Another portion of the surface of each of the first portion 14c, the second portion 14d, and the third portion 14e constitutes the second surface 14b. The plurality of first-phase first capacitors 1U13 are mounted on the first surface 14a of the third portion 14e of the printed circuit board 1U14. The first portion 14c and the second portion 14d are each, for example, an end portion of the printed circuit board 1U14 in the first direction DR1.

[0045] The first portion 14c is electrically connected to the first input side semiconductor module 1U11 via the first terminal 2a and the second terminal 2b. The first terminal 2a and the second terminal 2b are set to different potentials. One of the first terminal 2a and the second terminal 2b is a positive potential side terminal, and the other of the first terminal 2a and the second terminal 2b is a negative potential side terminal.

[0046] The first terminal 2a and the second terminal 2b are each fixed to at least one of the first portion 14c of the printed substrate 1U14 and the first input-side semiconductor module 1U11 in a manner that allows for attachment and detachment. For example, the first terminal 2a and the second terminal 2b are each fixed to the first portion 14c in a manner that allows for non-detachment, and are fixed to the first input-side semiconductor module 1U11 in a manner that allows for attachment and detachment. The printed substrate 14 is not directly fixed to the first semiconductor module 1U11, but is fixed to the first semiconductor module 1U11 via the first terminal 2a and the second terminal 2b. Thus, the insulation distance between the first terminal 2a and the second terminal 2b can be ensured, and the contact resistance value between the terminals of the first semiconductor module 1U11 can be reduced or stabilized. There is no particular limitation on the method of fixing the first terminal 2a and the second terminal 2b to the printed substrate 1U14 or the first input-side semiconductor module 1U11. For example, a through hole is formed in the first portion 14c through which the first terminal 2a and the second terminal 2b pass and are fixed by riveting or welding. The first input-side semiconductor module 1U11 includes a terminal portion that contacts and electrically connects the first terminal 2a and the second terminal 2b, and an internal thread portion that is threaded with a bolt. Figure 4 In the structure shown, the printed circuit board 1U14, the first terminal 2a, the second terminal 2b, and the first input-side semiconductor module 1U11 are fixed to each other by tightening the bolts after the respective hole portions of the first terminal 2a and the second terminal 2b are aligned with the positions of the internal thread portions of the first input-side semiconductor module 1U11. The printed circuit board 1U14 can be easily installed and replaced by disassembling the bolts. In addition, the disassembling of the bolts can be performed only on one surface in the second direction DR2 of the power conversion device 100 (for example, when the power conversion device 100 is applied to a control panel as described later, the surface facing the front side of the control panel), so maintenance operations are easy. In addition, the first terminal 2a and the second terminal 2b can also be fixed to the first portion 14c and the first input-side semiconductor module 1U11 in a manner that allows them to be attached and detached.

[0047] like Figure 4As shown, the first terminal 2a and the second terminal 2b are arranged at a distance from each other. The first terminal 2a and the second terminal 2b are arranged at a distance from each other, for example, in the first direction DR1. Preferably, in the first part 14c, a gap 14f is formed between the first terminal 2a and the second terminal 2b. The gap 14f is formed to cross an imaginary straight line connecting the first terminal 2a and the second terminal 2b at the shortest distance. By forming the gap 14f, the surface distance between the first terminal 2a and the second terminal 2b is longer than the shortest distance (the length of the imaginary straight line) between the first terminal 2a and the second terminal 2b. When viewed from the second direction DR2, the gap 14f has, for example, a long side direction and a short side direction. The long side direction of the gap 14f is, for example, perpendicular to the above-mentioned imaginary straight line.

[0048] The second part 14d is electrically connected to the first output side semiconductor module 1U12 via the third terminal 2c and the fourth terminal 2d. The third terminal 2c and the fourth terminal 2d may have the same structure as the first terminal 2a and the second terminal 2b. The third terminal 2c and the fourth terminal 2d are set to different potentials. One of the third terminal 2c and the fourth terminal 2d is a positive potential side terminal, and the other of the third terminal 2c and the fourth terminal 2d is a negative potential side terminal.

[0049] The third terminal 2c and the fourth terminal 2d are each detachably fixed to at least one of the second portion 14d of the printed circuit board 1U14 and the first output-side semiconductor module 1U12. For example, the third terminal 2c and the fourth terminal 2d are each non-detachably fixed to the second portion 14d and detachably fixed to the first output-side semiconductor module 1U12. There is no particular limitation on the method of fixing the third terminal 2c and the fourth terminal 2d to the printed circuit board 1U14 or the first output-side semiconductor module 1U12.

[0050] like Figure 4 As shown, the third terminal 2c and the fourth terminal 2d are arranged at intervals from each other. The third terminal 2c and the fourth terminal 2d are arranged at intervals from each other, for example, in the first direction DR1. Preferably, in the second part 14d, a gap 14f is formed between the third terminal 2c and the fourth terminal 2d. The gap 14f is formed to cross an imaginary straight line connecting the third terminal 2c and the fourth terminal 2d at the shortest distance. By forming the gap 14f, the surface distance between the third terminal 2c and the fourth terminal 2d is longer than the shortest distance (the length of the imaginary straight line) between the third terminal 2c and the fourth terminal 2d. When viewed from the second direction DR2, the gap 14f has, for example, a long side direction and a short side direction. The long side direction of the gap 14f is, for example, perpendicular to the above-mentioned imaginary straight line.

[0051] The material constituting the first terminal 2a, the second terminal 2b, the third terminal 2c and the fourth terminal 2d may be any conductive material, such as copper (Cu) or aluminum (Al). Figure 4 As shown, the outer shape of each terminal is, for example, a cylindrical shape, but is not limited thereto, and may also be a polygonal prism such as a quadrangular prism.

[0052] For example, only the first phase first capacitor 1U13 is mounted on the first surface 14a of the printed circuit board 1U14. In addition, other electronic components may be mounted on the first surface 14a in addition to the first phase first capacitor 1U13. For example, at least one of a resistor and a capacitor used in a snubber circuit for suppressing a surge voltage generated when the semiconductor module performs a switching operation may be mounted on the first surface 14a.

[0053] The printed circuit board 1U14 is, for example, a multilayer board including a plurality of conductor patterns stacked in the second direction DR2. The shape of each of the plurality of conductor patterns included in the printed circuit board 1U14 is not particularly limited.

[0054] As described above, the cooler 11, 15 includes the first cooling portion 15a and the second cooling portion 15b. Figure 3 The cooler 1U15 shown further includes a third cooling portion 15c that connects the first cooling portion 15a and the second cooling portion 15b in the first direction DR1. The third cooling portion 15c is arranged at intervals from the plurality of first-phase first capacitors 1U13 in the second direction DR2. Each of the plurality of first-phase first capacitors 1U13 may be connected to the third cooling portion 15c of the cooler 1U15 via a spacer having high thermal conductivity. The first cooling portion 15a, the second cooling portion 15b, and the third cooling portion 15c constitute the cooler 1U15, for example, as the same components.

[0055] The cooler 1U15 may have any structure as long as it can dissipate the heat generated in the first phase unit group 1U. The cooler 1U15 may be, for example, a radiator having a base and a plurality of fins. The plurality of fins may also be arranged on the air supply path of the cooling fan. The plurality of fins may also extend along the first direction DR1 and be arranged at intervals in the third direction DR3. The cooling fan supplies air in the first direction DR1. The cooler 1U15 may also have an intake side wind tunnel and an exhaust side wind tunnel for concentrating the air flow generated by the cooling fan around the plurality of fins. There is no particular limitation on the number and arrangement of the cooling fans. The cooling fan may be arranged on at least one of the intake side and the exhaust side relative to the cooler 1U15, and may be arranged on both sides, for example. Heat pipes may also be embedded in the cooler 1U15.

[0056] As described above, the first-phase second power conversion circuit unit 1U2 and the first-phase third power conversion circuit unit 1U3 each preferably have the same structure as the first-phase first power conversion circuit unit 1U1 .

[0057] The first-phase second power conversion circuit unit 1U2 includes Figure 1 The first phase second input side semiconductor module 1U21, the first phase second output side semiconductor module 1U22 and the first phase second capacitor 1U23 are shown, and the printed circuit board and the cooler are not shown. The first phase third power conversion circuit unit 1U3 includes Figure 1 The illustrated first-phase third input-side semiconductor module 1U31, the first-phase third output-side semiconductor module 1U32, and the first-phase third capacitor 1U33, and a printed circuit board and a cooler are not shown.

[0058] More preferably, the first-phase first power conversion circuit unit 1U1 , the first-phase second power conversion circuit unit 1U2 , and the first-phase third power conversion circuit unit 1U3 are each arranged adjacent to each other in the third direction DR3 in the order described above.

[0059] As described above, each of the second phase cell group 1V and the third phase cell group 1W preferably has the same structure as the first phase cell group 1U.

[0060] The second phase unit group 1V includes a second-phase first power conversion circuit unit, a second-phase second power conversion circuit unit and a second-phase third power conversion circuit unit. Preferably, the second-phase first power conversion circuit unit, the second-phase second power conversion circuit unit and the second-phase third power conversion circuit unit are configured to be adjacent in the third direction DR3 in the order described above. The third phase unit group 1W includes a third-phase first power conversion circuit unit, a third-phase second power conversion circuit unit and a third-phase third power conversion circuit unit. Preferably, the third-phase first power conversion circuit unit, the third-phase second power conversion circuit unit and the third-phase third power conversion circuit unit are configured to be adjacent in the third direction DR3 in the order described above. Preferably, the first phase unit group 1U, the second phase unit group 1V and the third phase unit group 1W are each configured to be adjacent in the third direction DR3 in the order described above.

[0061] The first phase first capacitor 1U13, the first phase second capacitor 1U23, and the first phase third capacitor 1U33 of the first phase unit group 1U are connected in parallel to each other. The capacitors (smoothing capacitors) included in the power conversion circuit units of the first phase unit group 1U, the second phase unit group 1V, and the third phase unit group 1W are connected in parallel to each other. Thus, each capacitor is maintained at the same potential.

[0062] In addition, the first phase first capacitor 1U13, the first phase second capacitor 1U23, and the first phase third capacitor 1U33 of the first phase unit group 1U may be mounted on the same printed circuit board 1U14. Furthermore, the capacitors (smoothing capacitors) included in the power conversion circuit units of the first phase unit group 1U, the second phase unit group 1V, and the third phase unit group 1W may be mounted on the same printed circuit board 1U14.

[0063] <Application examples of power conversion devices>

[0064] The power conversion device 100 of this embodiment can be applied to a control panel for an elevator. The control panel of an elevator is installed in a machine room or in a hoistway disposed above the hoistway where the car moves.

[0065] In the control panel of the elevator, the power conversion device 100 converts the power (e.g., three-phase AC power) supplied from the external AC power source PW (e.g., commercial power source, hereinafter referred to as power source) via the input inductor R1 into power (e.g., three-phase AC power) suitable for the hoisting machine M. The converted power is supplied to the hoisting machine M via the output inductor R2.

[0066] In this case, the three-phase AC power input to the power conversion device 100 from the power supply PW via the input inductor R1 is divided into the first phase unit group 1U, the second phase unit group 1V, and the third phase unit group 1W. The divided AC power is converted into DC power in each of the first phase unit group 1U, the second phase unit group 1V, and the third phase unit group 1W, and then smoothed. The smoothed DC power is converted into AC power in each of the first phase unit group 1U, the second phase unit group 1V, and the third phase unit group 1W, and then merged and output as three-phase AC power to the traction machine M via the output inductor R2.

[0067] The input-side semiconductor modules of the first phase unit group 1U, the second phase unit group 1V, and the third phase unit group 1W function as converters that convert AC power into DC power. The output-side semiconductor modules of the first phase unit group 1U, the second phase unit group 1V, and the third phase unit group 1W function as inverters that convert DC power into AC power. The capacitors of the first phase unit group 1U, the second phase unit group 1V, and the third phase unit group 1W function as smoothing capacitors.

[0068] The power conversion device 100 converts the regenerative electric power generated by the hoisting machine M into electric power suitable for charging the power supply PW. The converted electric power is supplied to the power supply PW.

[0069] In this case, the other part of the output-side semiconductor modules of the first phase unit group 1U, the second phase unit group 1V, and the third phase unit group 1W functions as a converter circuit that converts AC power into DC power. The part of the input-side semiconductor modules of the first phase unit group 1U, the second phase unit group 1V, and the third phase unit group 1W functions as an inverter circuit that converts DC power into AC power. The power conversion device 100 returns the regenerative power generated by the traction machine M to the power supply PW via the input inductor R1.

[0070] The power conversion device 100 can also be applied to applications other than elevator control panels. The power conversion device 100 can also be applied to, for example, a general-purpose inverter or an inverter for an air conditioner.

[0071] <Effects of Power Conversion Device>

[0072] In the power conversion device 100, the printed circuit board 1U14 on which the first-phase first capacitor 1U13 is mounted is supported by the first-phase first input-side semiconductor module 1U11 and the first-phase first output-side semiconductor module 1U12, respectively, which are arranged in the first direction DR1 so as to sandwich the first-phase first capacitor 1U13. Therefore, it is difficult for a connection failure to occur between the first-phase first capacitor 1U13 and the first-phase first input-side semiconductor module 1U11 and the first-phase first output-side semiconductor module 1U12. In the power conversion device 100, compared with a power conversion device in which a substrate on which a capacitor is mounted is supported in a cantilever state by a connector, it is difficult for a connection failure to occur between the first-phase first capacitor 1U13 and other electronic components. In particular, even if vibration is applied to the printed circuit board 1U14 during use or transportation of the power conversion device 100, it is difficult for a connection failure to occur between the first-phase first capacitor 1U13 and the first-phase first input-side semiconductor module 1U11 and the first-phase first output-side semiconductor module 1U12 in the power conversion device 100.

[0073] Furthermore, in the power conversion device 100, the printed circuit board 1U14 on which the first phase first capacitor 1U13 as a smoothing capacitor is mounted is detachably supported by the first phase first input side semiconductor module 1U11 and the first phase first output side semiconductor module 1U12. Therefore, in the power conversion device 100, the smoothing capacitor can be easily replaced compared to a power conversion device in which the smoothing capacitor and the semiconductor element are mounted on the same substrate.

[0074] For example, when the smoothing capacitor is an electrolytic capacitor, its life is about 10 to 15 years. When the use time of the power conversion device 100 is longer than the life of the smoothing capacitor, it is necessary to replace the smoothing capacitor. Even in such a case, according to the power conversion device 100, the smoothing capacitor can be replaced only by attaching and detaching the printed circuit board 1U14.

[0075] In addition, in the power conversion device 100, the first-phase first input-side semiconductor module 1U11 and the first-phase first output-side semiconductor module 1U12 are detachably supported by the cooler 1U15. Thus, even when it is necessary to change the power capacity of the power conversion device 100, the first-phase first input-side semiconductor module 1U11, the first-phase first output-side semiconductor module 1U12, and the printed circuit board 1U14 can be easily replaced.

[0076] In addition, in the power conversion device 100, the first-phase first input-side semiconductor module 1U11 and the first-phase first output-side semiconductor module 1U12 are each configured to sandwich the first-phase first capacitor 1U13 in the first direction DR1. From a different point of view, when viewed from the first direction DR1, at least a portion of the first-phase first capacitor 1U13 is configured to overlap with the first-phase first input-side semiconductor module 1U11 and the first-phase first output-side semiconductor module 1U12, respectively. Therefore, compared with the case where the first-phase first input-side semiconductor module 1U11 and the first-phase first output-side semiconductor module 1U12 are not each configured to sandwich the first-phase first capacitor 1U13 in the first direction DR1, the length (thickness) of the power conversion device 100 in the second direction DR2 becomes shorter (thinner).

[0077] In the power conversion device 100, the first cooling unit 15a and the second cooling unit 15b are arranged on the first phase first capacitor 1U13 side relative to the printed circuit board 1U14 in the second direction DR2, and the first phase first capacitor 1U13 is arranged at a distance from the first cooling unit 15a and the second cooling unit 15b. Therefore, even when the first cooling unit 15a and the second cooling unit 15b vibrate, the first phase first capacitor 1U13 is not easily affected.

[0078] In particular, when the first-phase first capacitor 1U13 is not in contact with other electronic components, the first-phase first capacitor 1U13 is not easily affected even when the electronic components vibrate, and heat input from the electronic components to the first-phase first capacitor 1U13 is suppressed.

[0079] In the power conversion device 100 , a plurality of first-phase first capacitors 1U13 are mounted on the printed circuit board 1U14 . The number of first-phase first capacitors 1U13 mounted on the printed circuit board 1U14 can be arbitrarily set according to the capacity required for the power conversion device 100 .

[0080] In the power conversion device 100, since a gap 14f is formed between the first terminal 2a and the second terminal 2b, which are set to different potentials, the creepage distance between the first terminal 2a and the second terminal 2b is longer than the shortest distance (the length of the imaginary straight line) between the first terminal 2a and the second terminal 2b. The creepage distance between the first terminal 2a and the second terminal 2b is set to be greater than the distance required for electrical insulation between the first terminal 2a and the second terminal 2b. Thus, the first terminal 2a and the second terminal 2b can be electrically insulated from each other, and the shortest distance between the first terminal 2a and the second terminal 2b can be shorter than the distance required for electrical insulation between the first terminal 2a and the second terminal 2b, so that the printed circuit board 1U14 can be miniaturized.

[0081] In addition, the power conversion device 100 may also be configured to replace Figure 1 The power conversion circuit shown is composed of Figure 5 The power conversion circuit shown.

[0082] Figure 5 The power conversion device 100 shown in the figure includes a first phase unit 10U, a second phase unit 10V, and a third phase unit 10W. The first phase unit 10U, the second phase unit 10V, and the third phase unit 10W each constitute one power conversion circuit unit of 1-phase 3-parallel connection. Figure 5 The power conversion device 100 shown in FIG. Figure 1 The power conversion device 100 shown is different in that the first phase unit 10U, the second phase unit 10V, and the third phase unit 10W each include only one smoothing capacitor. Figure 5 In the illustrated power conversion device 100 , a first phase unit 10U as one power conversion circuit unit includes a first phase input side semiconductor module 1U16 as an input side semiconductor module, a first phase output side semiconductor module 1U17 as an output side semiconductor module, and a first phase capacitor 1U18 .

[0083] In this case, the relative positional relationship and connection relationship of the first phase input side semiconductor module 1U16, the first phase output side semiconductor module 1U17 and the first phase capacitor 1U18 are the same as Figure 2 to Figure 4 The first-phase first input-side semiconductor module 1U11 , the first-phase first output-side semiconductor module 1U12 , and the first-phase first capacitor 1U13 shown may be the same in relative positional relationship and connection relationship.

[0084] like Figure 6 As shown, the cooler 1U15 of the power conversion device 100 may also be composed of two coolers, a first cooling unit 15a and a second cooling unit 15b. The first cooling unit 15a may also be composed of the first cooling unit 15a and the fourth cooling unit 15c1, and the fourth cooling unit 15c1 is arranged at intervals from the plurality of first-phase first capacitors 1U13 arranged near the first-phase first input-side semiconductor module 1U11 in the first direction DR1. The second cooling unit 15b may also be composed of the second cooling unit 15b and the fifth cooling unit 15c2, and the fifth cooling unit 15c2 is arranged at intervals from the plurality of first-phase first capacitors 1U13 arranged near the first-phase first output-side semiconductor module 1U12 in the first direction DR1. That is, the first cooling unit 15a and the second cooling unit 15b may also be separate components.

[0085] The heat capacity of each of the first cooling unit 15a and the second cooling unit 15b can be arbitrarily set according to the heat generation of each of the first-phase first input-side semiconductor module 1U11 and the first-phase first output-side semiconductor module 1U12. When the heat generation of the first-phase first input-side semiconductor module 1U11 is greater than the heat generation of the first-phase first output-side semiconductor module 1U12, as shown in FIG. Figure 6 As shown, the heat capacity of the first cooling portion 15a is preferably set to be larger than the heat capacity of the second cooling portion 15b.

[0086] Figure 6 The cooler 1U15 shown is Figure 3 Compared with the cooler 1U15 shown in the figure, the processability (carryability and installation) is improved. Figure 6 In the coolers 1U15 shown, the second cooling unit 15b having a relatively small heat capacity can be an inexpensive cooler.

[0087] Implementation method 2.

[0088] The power conversion device of the second embodiment has a substantially same structure as the power conversion device 100 of the first embodiment and has the same effect. Figure 7 and Figure 8 As shown, the difference from the power conversion device 100 of the first embodiment is that the printed circuit board 1U14 further includes a first conductor pattern 41 and a second conductor pattern 42 having different potentials, and the area of ​​the second conductor pattern 42 facing the first conductor pattern 41 in the second direction DR2 is 20% or more of the area of ​​the second conductor pattern 42. Here, the difference between the power conversion device of the second embodiment and the power conversion device 100 of the first embodiment is mainly described. In addition, Figure 7 In the middle, the dotted line indicates Figure 8 The outer edge of the second conductor pattern 42 is shown. Figure 8 In the middle, the dotted line indicates Figure 7 The outer edge portion of the first conductor pattern 41 is shown.

[0089] The first conductor pattern 41 and the second conductor pattern 42 are arranged at a distance from each other in the second direction DR2 . The first conductor pattern 41 and the second conductor pattern 42 are each covered with an insulating film 43 , and are electrically insulated from each other by the insulating film 43 .

[0090] The first conductor pattern 41 is electrically connected to the first terminal 2a via a through hole (not shown) or the like. That is, the first conductor pattern 41 is electrically connected to the first-phase first input-side semiconductor module 1U11 via the first terminal 2a or the like. Furthermore, the first conductor pattern 41 is electrically connected to one electrode of the first-phase first capacitor 1U13 via a through hole (not shown) or the like.

[0091] The second conductor pattern 42 is electrically connected to the second terminal 2b via a through hole, etc., not shown. That is, the second conductor pattern 42 is electrically connected to the first-phase first output-side semiconductor module 1U12 via the second terminal 2b, etc. Furthermore, the second conductor pattern 42 is electrically connected to the other electrode of the first-phase first capacitor 1U13 via a through hole, etc., not shown.

[0092] like Figure 7 As shown in FIG. 1 , the area of ​​the region of the first conductor pattern 41 that faces the second conductor pattern 42 in the second direction DR2 is greater than 20% of the area of ​​the first conductor pattern 41. Figure 8 As shown, the area of ​​the region of the second conductor pattern 42 that faces the first conductor pattern 41 in the second direction DR2 is equal to or greater than 20% of the area of ​​the second conductor pattern 42 .

[0093] In the power conversion device of the second embodiment, the capacitance formed by the first conductor pattern 41 and the second conductor pattern 42 is increased and the parasitic inductance component is reduced, compared with the case where the area of ​​the region of the second conductor pattern 42 that faces the first conductor pattern 41 in the second direction DR2 is less than 20% of the area of ​​the second conductor pattern 42. By reducing the parasitic inductance component, the surge voltage generated when the input-side semiconductor module and the output-side semiconductor module perform switching operations is reduced.

[0094] In the power conversion device of the second embodiment, the shapes of the first conductor pattern 41 and the second conductor pattern 42 are not limited to Figure 7 and Figure 8 The shapes shown can be set arbitrarily.

[0095] Implementation method 3.

[0096] The power conversion device 101 of the third embodiment has a substantially same structure as the power conversion device 100 of the first embodiment and has the same effect. Fig. 9 As shown, the difference from the power conversion device 100 is that the length L2 of the first phase first capacitor 1U13 in the second direction DR2 is longer than the length L1 of each of the first phase first input side semiconductor module 1U11 and the first phase first output side semiconductor module 1U12 in the second direction DR2, and a part of the first phase first capacitor 1U13 is arranged between the first cooling part 15a and the second cooling part 15b in the first direction DR1. The following mainly describes the differences between the power conversion device 101 and the power conversion device 100.

[0097] exist Fig. 9 In the power conversion device 101 shown, the area of ​​each of the two electrodes of one first-phase first capacitor 1U13 can be set larger than that of the power conversion device 100 of Embodiment 1, so the capacity of one first-phase first capacitor 1U13 can be set larger. As a result, in the power conversion device 101, when the capacity of the smoothing capacitor is set to be the same as that of the power conversion device 100, the number of first-phase first capacitors 1U13 required to achieve the capacity can be reduced compared to the power conversion device 100, so the area of ​​the third portion 14e of the printed circuit board 1U14 where the first-phase first capacitor 1U13 is mounted can be miniaturized.

[0098] like Fig. 9 As shown, in the power conversion device 101, the first cooling unit 15a and the second cooling unit 15b may be separate components. In other words, the cooler 1U15 may be composed of the first cooling unit 15a and the second cooling unit 15b separated from each other. In this way, even when the length L2 is about twice the length L1, the first phase first capacitor 1U13 can be arranged at a distance from the cooler 1U15 without contacting the cooler 1U15.

[0099] In the power conversion device 101, as long as the first-phase first capacitor 1U13 can be arranged at a distance from the cooler 1U15, the first cooling unit 15a and the second cooling unit 15b may constitute the cooler 1U15 as the same component. The thickness of the portion of the cooler 1U15 that faces the first-phase first capacitor 1U13 in the second direction DR2 may be thinner than the thickness of each of the first cooling unit 15a and the second cooling unit 15b in the second direction DR2.

[0100] Implementation method 4.

[0101] like Fig.10As shown, the power conversion device 102 of the fourth embodiment has a structure basically the same as the power conversion device 100 of the first embodiment, and has the same effect, but is different from the power conversion device 100 in that it further includes at least one capacitor 1U19 mounted on the second surface 14b of the printed circuit board 1U14. The differences between the power conversion device 102 and the power conversion device 100 will be mainly described below.

[0102] The power conversion device 102 includes, for example, a plurality of capacitors 1U19. Each of the plurality of capacitors 1U19 is mounted on the third portion 14e of the printed circuit board 1U14. Each of the plurality of capacitors 1U19 is connected in parallel with, for example, the first-phase first capacitor 1U13. The first-phase first output-side semiconductor module 1U12 is electrically connected to the first-phase first input-side semiconductor module 1U11 via the plurality of first-phase first capacitors 1U13 and the plurality of capacitors 1U19.

[0103] In the power conversion device 102, when the combined capacity of multiple first-phase first capacitors 1U13 and multiple capacitors 1U19 is made the same as the combined capacity of multiple first-phase first capacitors 1U13 of the power conversion device 100, the number of first-phase first capacitors 1U13 required to achieve the capacity can be reduced compared to the power conversion device 100, so the area of ​​the third part 14e on which the first-phase first capacitors 1U13 and capacitors 1U19 are mounted in the printed circuit board 1U14 can be miniaturized.

[0104] Preferably, the length L3 of each of the plurality of capacitors 1U19 in the second direction DR2 is shorter than the length L2 of each of the plurality of first-phase first capacitors 1U13 in the second direction DR2. Thus, the length (thickness) of the power conversion device 102 in the second direction DR2 becomes shorter (thinner) than when the length of each of the plurality of capacitors 1U19 in the second direction DR2 is longer than the length of each of the plurality of first-phase first capacitors 1U13 in the second direction DR2. Preferably, the length L3 of each of the plurality of capacitors 1U19 in the second direction DR2 is shorter than the length L1 of the first-phase first input-side semiconductor module 1U11 in the second direction DR2.

[0105] Each of the plurality of first-phase first capacitors 1U13 and the plurality of capacitors 1U19 may be a lead-type capacitor or a surface-mount capacitor.

[0106] Preferably, each of the plurality of capacitors 1U19 is a surface-mounted capacitor. In this way, the mounting density of the plurality of capacitors 1U19 can be increased. In addition, in the case where each of the plurality of first-phase first capacitors 1U13 and the plurality of capacitors 1U19 is a lead-type capacitor, there is a high possibility that the lead of the capacitor mounted later on one surface is arranged near the body of the capacitor mounted earlier on the other surface. In this case, it is difficult to fix the lead of the capacitor mounted later on the other surface by solder. In contrast, if each of the plurality of capacitors 1U19 is a surface-mounted capacitor, the plurality of capacitors 1U19 are not arranged on the first surface 14a, so the above-mentioned problem is not likely to occur.

[0107] In addition, in order to avoid the above-mentioned problem, when the area of ​​each mounting region of the first-phase first capacitor 1U13 and the plurality of capacitors 1U19 is ensured to be sufficiently large, each of the plurality of first-phase first capacitors 1U13 and the plurality of capacitors 1U19 may be a lead-type capacitor.

[0108] Implementation method 5.

[0109] like Fig.11 and Fig.12 As shown, the power conversion device 103 of the fifth embodiment has a structure basically the same as the power conversion device 100 of the first embodiment, and has the same effect, but is different from the power conversion device 100 in that it further includes at least one supporting member 51a fixed to the central portion of the long side direction (first direction DR1) of the printed circuit board 1U14. The differences between the power conversion device 103 and the power conversion device 100 will be mainly described below.

[0110] The power conversion device 103 includes a plurality of support members 51a and 51b disposed between the printed circuit board 1U14 and the cooler 1U15. Each of the plurality of support members 51a and 51b is not a member for electrically connecting the printed circuit board 1U14 and the cooler 1U15, but a member for suppressing the relative position change of the printed circuit board 1U14 with respect to the cooler 1U15 in the second direction DR2. From a different point of view, each of the plurality of support members 51a and 51b is used to increase the fixing strength of the printed circuit board 1U14 with respect to the cooler 1U15.

[0111] The plurality of support members 51a and 51b extend in the second direction DR2. The length of each of the plurality of support members 51a and 51b in the second direction DR2 is longer than the length of each of the plurality of capacitors 1U13 in the second direction DR2. That is, the plurality of support members 51a and 51b can keep each capacitor 1U13 from contacting the cooler 1U15.

[0112] One end of each of the plurality of support members 51a and 51b in the second direction DR2 is fixed, for example, to the central portion of the long side direction (first direction DR1) of the printed circuit board 1U14. From a different point of view, one end of each of the plurality of support members 51a and 51b in the second direction DR2 is fixed to the central portion between the first terminal 2a and the third terminal 2c in the first direction DR1. One end of each of the plurality of support members 51a and 51b in the second direction DR2 is fixed, for example, to both ends in the short side direction (third direction DR3) of the printed circuit board 1U14. From a different point of view, each of the plurality of support members 51a and 51b is configured to sandwich the plurality of capacitors 1U13 in the first direction DR1 and the third direction DR3.

[0113] The other end of each of the plurality of support members 51a, 51b in the second direction DR2 is fixed to, for example, the cooler 1U15. Specifically, the other end of each of the plurality of support members 51a, 51b in the second direction DR2 is fixed to, for example, a portion of the cooler 1U15 that is spaced apart from each of the plurality of first-phase first capacitors 1U13 in the second direction DR2, i.e., the third cooling portion 15c.

[0114] The other end of each of the plurality of support members 51a and 51b in the second direction DR2 may be in contact with the cooler 1U15 and may not be fixed to the cooler 1U15. The other end of each of the plurality of support members 51a and 51b in the second direction DR2 may be in contact with the third cooling unit 15c.

[0115] In the power conversion device 103, the number of support members may be any number greater than 1. In the power conversion device 103, one support member may be disposed only in the center portion in the first direction DR1 and on one side with respect to the capacitor 1U13 in the third direction DR3.

[0116] In the power conversion device 103, the printed circuit board 1U14 is fixed to the cooler 1U15 by using at least one supporting member 51a, so that when vibration is applied to the power conversion device 103, the natural vibration frequency of the printed circuit board 1U14 is shifted to the high frequency side compared to the state before the supporting member 51a is arranged. As a result, in the power conversion device 103, the deformation amount of the printed circuit board 1U14 is reduced compared to the power conversion device 100 without at least one supporting member 51a, so the printed circuit board 1U14 is not easily damaged, and as a result, the life of the printed circuit board 1U14 can be expected to be extended. In addition, as Fig.11 As shown, in the power conversion device 103 including the plurality of support members 51a and 51b, deformation of the printed circuit board 1U14 can be further suppressed compared to the power conversion device 103 including only one support member 51a.

[0117] Furthermore, the power conversion device 103 may include three or more support members that are arranged at intervals from each other in at least one of the first direction DR1 and the third direction DR3 .

[0118] like Fig.12 As shown, the shape of the support member 51a is, for example, a cylindrical shape, but is not limited thereto. The shape of the support member 51a may be, for example, a polygonal prism such as a quadrangular prism or a hexagonal prism. In addition, the support member 51a may be provided as a terminal block that can be mounted on the printed circuit board 1U14.

[0119] The fixing method of the above-mentioned one end of the supporting member 51a in the second direction DR2 to the printed circuit board 1U14 may be any method, such as fastening by screws, riveting or welding. When the above-mentioned other end of the supporting member 51a in the second direction DR2 is fixed to the cooler 1U15, the fixing method may be any method, such as fastening by screws, riveting or welding.

[0120] The supporting member 51a may be composed of one member or a collection of multiple members. The material constituting the supporting member 51a may be any material as long as it can suppress the relative position change of the printed circuit board 1U14 with respect to the cooler 1U15 in the second direction DR2, for example, at least one selected from the group consisting of metal materials such as stainless steel, brass, and aluminum, and resin materials such as nylon and polyphenylene sulfide (PPS).

[0121] The power conversion device 103 may have the same structure as the power conversion device of Embodiment 2 or 4 except that it further includes at least one supporting member 51a fixed to the center portion of the printed circuit board 1U14 in the long side direction (first direction DR1). Figure 6 The fourth cooling portion 15c1 or the fifth cooling portion 15c2 shown may be in contact.

[0122] [Note 1]

[0123] A power conversion device comprising:

[0124] A printed substrate having a first surface;

[0125] at least one capacitor mounted on the first surface of the printed circuit board; and

[0126] an input-side semiconductor module and an output-side semiconductor module, which are arranged to sandwich the at least one capacitor in a first direction along the first surface and are electrically connected to each other via the at least one capacitor,

[0127] The printed circuit board is detachably supported by the input-side semiconductor module and the output-side semiconductor module.

[0128] [Note 2]

[0129] The power conversion device according to [Supplementary Note 1], wherein:

[0130] The power conversion device further comprises:

[0131] A first cooling unit connected to the input-side semiconductor module; and

[0132] a second cooling unit connected to the output-side semiconductor module,

[0133] The first cooling unit and the second cooling unit are arranged on the at least one capacitor side with respect to the printed circuit board in a second direction perpendicular to the first surface.

[0134] The at least one capacitor is disposed at a distance from the first cooling unit and the second cooling unit.

[0135] [Note 3]

[0136] The power conversion device according to [Supplementary Note 2], wherein:

[0137] The first cooling unit and the second cooling unit constitute a cooler as the same component.

[0138] The cooler has a portion disposed at a distance from the at least one capacitor in the second direction.

[0139] [Note 4]

[0140] The power conversion device according to [Supplementary Note 2], wherein:

[0141] The first cooling part and the second cooling part are components separate from each other.

[0142] [Note 5]

[0143] The power conversion device according to [Supplementary Note 2], wherein:

[0144] The length of the at least one capacitor in the second direction is longer than the length of each of the input-side semiconductor module and the output-side semiconductor module in the second direction.

[0145] A portion of the at least one capacitor is disposed between the first cooling portion and the second cooling portion in the first direction.

[0146] [Note 6]

[0147] The power conversion device according to [Supplementary Note 5], wherein:

[0148] The first cooling part and the second cooling part are components separate from each other.

[0149] [Note 7]

[0150] The power conversion device according to any one of [Supplementary Note 1] to [Supplementary Note 6], wherein:

[0151] The printed circuit board further includes a first terminal and a second terminal which are electrically connected to the input-side semiconductor module and have different potentials from each other.

[0152] A gap is formed on the printed circuit board between the first terminal and the second terminal.

[0153] [Note 8]

[0154] The power conversion device according to any one of [Supplement 1] to [Supplement 7], wherein:

[0155] The printed circuit board further includes a first conductor pattern and a second conductor pattern which are arranged at a distance from each other in a second direction perpendicular to the first surface and have different potentials from each other.

[0156] An area of ​​a region of the second conductor pattern that faces the first conductor pattern in the second direction is equal to or greater than 20% of an area of ​​the second conductor pattern.

[0157] [Note 9]

[0158] The power conversion device according to any one of [Supplementary Note 1] to [Supplementary Note 8], wherein:

[0159] the at least one capacitor is a plurality of capacitors,

[0160] When viewed from the first direction, each of the plurality of capacitors has a portion overlapping the input-side semiconductor module and the output-side semiconductor module.

[0161] [Note 10]

[0162] The power conversion device according to any one of [Supplementary Note 1] to [Supplementary Note 9], wherein:

[0163] The printed circuit board further has a second surface located on a side opposite to the first surface.

[0164] The power conversion device further includes at least one capacitor mounted on the second surface of the printed circuit board.

[0165] [Note 11]

[0166] The power conversion device according to any one of [Supplement 1] to [Supplement 10], wherein:

[0167] The printed circuit board has at least one supporting member located on the first surface.

[0168] The supporting member is in contact with the cooling portion.

[0169] The embodiments of the present disclosure are described above, but various modifications can be made to the above embodiments. In addition, the scope of the present disclosure is not limited to the above embodiments. The scope of the present disclosure is indicated by the claims, and it is intended to include all changes within the meaning and scope equivalent to the claims.

[0170] Description of symbols

[0171] 1U: first phase unit group; 1U1: first phase first power conversion circuit unit; 1U2: first phase second power conversion circuit unit; 1U3: first phase third power conversion circuit unit; 1U11: first phase first input side semiconductor module; 1U12: first phase first output side semiconductor module; 1U13: first phase first phase first capacitor; 1U14: printed circuit board; 1U15: cooler; 1U21: first phase second input side semiconductor module; 1U22: first phase second output side semiconductor module; 1U23: first phase second capacitor; 1U31: first phase third input side semiconductor module; 1U32: first phase third output side semiconductor module; 1U33: first phase third capacitor; 1U16: first phase input side semiconductor module; 1U17: first Phase output side semiconductor module; 1U18, 1U19: capacitor; 1V: second phase unit group; 1W: third phase unit group; 2a: first terminal; 2b: second terminal; 2c: third terminal; 2d: fourth terminal; 10U: first phase unit; 10V: second phase unit; 10W: third phase unit; 14a: first surface; 14b: second surface; 14c: first part; 14d: second part; 14e: third part; 14f: gap; 15a: first cooling part; 15b: second cooling part; 15c: third cooling part; 15c1: fourth cooling part; 15c2: fifth cooling part; 41: first conductor pattern; 42: second conductor pattern; 43: insulating film; 51a, 51b: supporting parts; 100, 101, 102: power conversion device.

Claims

1. A power conversion device comprising: A printed substrate having a first surface; at least one capacitor mounted on the first surface of the printed circuit board; and an input-side semiconductor module and an output-side semiconductor module, which are arranged to sandwich the at least one capacitor in a first direction along the first surface and are electrically connected to each other via the at least one capacitor, The printed circuit board is detachably supported by the input-side semiconductor module and the output-side semiconductor module.

2. The power conversion device according to claim 1, wherein: The power conversion device further comprises: A first cooling unit connected to the input-side semiconductor module; and a second cooling unit connected to the output-side semiconductor module, The first cooling unit and the second cooling unit are arranged on the at least one capacitor side with respect to the printed circuit board in a second direction perpendicular to the first surface. The at least one capacitor is disposed at a distance from the first cooling unit and the second cooling unit.

3. The power conversion device according to claim 2, wherein: The first cooling unit and the second cooling unit constitute a cooler as the same component. The cooler has a portion disposed at a distance from the at least one capacitor in the second direction.

4. The power conversion device according to claim 3, wherein: The printed circuit board has at least one supporting member located on the first surface. The support member is in contact with the portion of the cooler that is arranged at a distance from the at least one capacitor in the second direction.

5. The power conversion device according to claim 2, wherein: The first cooling part and the second cooling part are components separate from each other.

6. The power conversion device according to claim 2, wherein: The length of the at least one capacitor in the second direction is longer than the length of each of the input-side semiconductor module and the output-side semiconductor module in the second direction. A portion of the at least one capacitor is disposed between the first cooling portion and the second cooling portion in the first direction.

7. The power conversion device according to claim 6, wherein: The first cooling part and the second cooling part are components separate from each other.

8. The power conversion device according to any one of claims 1 to 7, wherein: The printed circuit board further includes a first terminal and a second terminal which are electrically connected to the input-side semiconductor module and have different potentials from each other. A gap is formed between the first terminal and the second terminal on the printed circuit board.

9. The power conversion device according to any one of claims 1 to 7, wherein: The printed circuit board further includes a first conductor pattern and a second conductor pattern which are arranged at a distance from each other in a second direction perpendicular to the first surface and have different potentials from each other. An area of ​​a region of the second conductor pattern that faces the first conductor pattern in the second direction is equal to or greater than 20% of an area of ​​the second conductor pattern.

10. The power conversion device according to any one of claims 1 to 7, wherein: the at least one capacitor is a plurality of capacitors, When viewed from the first direction, each of the plurality of capacitors has a portion overlapping the input-side semiconductor module and the output-side semiconductor module.

11. The power conversion device according to any one of claims 1 to 7, wherein: The printed circuit board further has a second surface located on a side opposite to the first surface. The power conversion device further includes at least one capacitor mounted on the second surface of the printed circuit board.

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