Surface polishing method for hardware tableware

Abstract

The present invention belongs to the technical field of hardware tableware processing, and specifically relates to a surface polishing method for hardware tableware, comprising the following steps: S1: preparing a low-concentration chemical polishing liquid and mixing it with suspended abrasive to obtain a mixed polishing liquid; S2: immersing the hardware tableware in the mixed polishing liquid; S3: using an ultrasonic transmitter to perform ultrasonic oscillation on the mixed polishing liquid; S4: arranging an ultrasonic receiver in a solution pool to receive ultrasonic waves reflected in part of the pool, comparing ultrasonic reflection maps of the hardware tableware positions, and obtaining coordinates of defective areas of the polishing degree of the hardware tableware; S5: calling a fluid polishing device to impact the polishing defective areas of the hardware tableware with high-pressure fluid mixed with the same suspended abrasive, thereby reducing the consumption of chemical agents by mixing multiple process methods, and specifically reinforcing the polishing effect by identifying the approximate coordinates of the defective areas through ultrasonic waves, thereby shortening the overall time, improving the polishing efficiency, and enhancing the polishing effect and quality of the hardware tableware.

Description

Technical Field

[0001] The invention belongs to the technical field of hardware tableware processing, and particularly relates to a surface polishing method for hardware tableware. Background Art

[0002] Cutlery, including knives, forks, and spoons, is typically made of stainless steel, silver, or other alloys. Polishing is an essential step in the manufacturing process to enhance its aesthetics and durability.

[0003] Traditional polishing methods for hardware tableware mainly include mechanical polishing, chemical polishing and electrochemical polishing. Although the above three traditional polishing methods can meet the needs of hardware tableware manufacturing to a certain extent, their respective problems limit their further application and development.

[0004] First of all, mechanical polishing usually requires repeated grinding by hand or automated equipment. Manual grinding takes a long time for complex geometric shapes or high-requirement surface finish. In addition, the disadvantage of automated polishing equipment is that the high-speed grinding method is limited by the calibration accuracy of the equipment for tableware of different sizes. Any slight deviation will damage the product details, resulting in a low yield rate in mass production.

[0005] Secondly, chemical polishing or electroplating polishing of hardware tableware also leads to high costs due to the long time and high cost of completing the complete polishing process.

[0006] In summary, there is an urgent need for a method for polishing hardware tableware with controllable cost, high precision and good quality. Summary of the Invention

[0007] In order to solve the above problems existing in the prior art, the present invention provides a surface polishing method for hardware tableware, which solves the problem that the burrs or oxides on the surface of the hardware tableware to be polished are of different sizes and need to be specifically processed.

[0008] The purpose of the present invention can be achieved by the following technical solution: A surface polishing method for hardware tableware, comprising the following steps:

[0009] S1: preparing a mixed polishing liquid, preparing a low-concentration chemical polishing liquid and mixing it with a suspended abrasive to obtain a mixed polishing liquid;

[0010] S2: Soaking, soaking the hardware tableware in the mixed polishing liquid, and corroding and polishing through the low concentration of chemical polishing liquid components;

[0011] S3: Oscillation polishing, using an ultrasonic transmitter to ultrasonically oscillate the mixed polishing liquid;

[0012] S4: Identify defective areas on the tableware surface, set an ultrasonic receiver in the solution pool, receive part of the ultrasonic waves reflected in the pool, compare the ultrasonic reflection map of the hardware tableware position, and obtain the coordinates of the defective area of ​​the hardware tableware polishing degree;

[0013] S5: For fine polishing of defective areas on the surface of tableware, a fluid polishing device is used to impact the polishing defective areas of the hardware tableware with high-pressure fluid mixed with the same suspended abrasive to accelerate the completion of polishing.

[0014] Preferably, in S4, when the number of polishing defect areas of the hardware tableware obtained is less than three, the hardware tableware is raised to a liquid level out of the mixed polishing liquid, and then the fluid polishing step of step S5 is connected.

[0015] Preferably, in S3, the ultrasonic transmitter is arranged in the solution pool and faces the location of the hardware tableware, and the ultrasonic receivers are respectively arranged on the side walls and bottom surface of the solution pool.

[0016] Preferably, in S4, the method for comparing the ultrasonic reflection patterns is:

[0017] Place the same type of hardware tableware that has been polished to the standard in the same solution environment, and use each ultrasonic receiver to obtain the ultrasonic reflection signal at this time. By obtaining multiple sets of standard data, the spectrum tolerance range is established, and the ultrasonic reflection spectrum and allowable tolerance at each angle of the corresponding hardware tableware when polished to the standard are obtained;

[0018] During the actual polishing process, the polishing defect areas of the hardware tableware can be obtained by comparing the ultrasonic reflection patterns obtained in real time.

[0019] Preferably, the same solution environment includes the same solution formula and solution volume of the mixed polishing solution.

[0020] Preferably, after S5, the method further includes S6: adding chemical polishing liquid, and the method for determining whether to add chemical polishing liquid is:

[0021] The same type of unpolished tableware is placed in a solution tank that needs to be added with chemical polishing liquid. The ultrasonic reflection signal at this time is obtained by each ultrasonic receiver. The spectrum tolerance range is established by obtaining multiple sets of standard data to obtain the standard ultrasonic reflection spectrum at each angle of the unpolished tableware when the polishing liquid is added.

[0022] In actual polishing processing, the ultrasonic reflection pattern obtained in real time is compared with the standard ultrasonic reflection pattern to determine whether chemical polishing liquid needs to be added.

[0023] Preferably, S6 also includes replacing the suspended abrasive.

[0024] Preferably, the device further comprises a controller, which is electrically connected to the ultrasonic transmitter and the ultrasonic receiver respectively, and controls the ultrasonic transmitter to perform ultrasonic oscillation and receives feedback signals from the ultrasonic receiver.

[0025] The beneficial effects of the present invention are:

[0026] In this method for polishing tableware, ultrasonic waves are used to oscillate the tableware, chemical polishing solution, and suspended abrasive in a solution tank. The cavitation effect induced by the ultrasound not only accelerates the chemical reaction rate of the chemical polishing solution but also significantly improves the grinding efficiency of the suspended abrasive. This method achieves the desired polishing effect in a relatively short period of time, reducing tableware polishing time, increasing polishing efficiency, and ultimately enhancing the polishing effect and quality of the tableware.

[0027] Moreover, through the cooperation of ultrasonic transmitter and ultrasonic receiver, the ultrasonic transmitter is not only used to vibrate and polish the hardware tableware, but also the feedback signal of the ultrasonic receiver is used to grasp the polishing degree of the surface of the hardware tableware, thereby intelligently controlling the polishing degree of the hardware tableware.

[0028] In addition, the combination of suspended abrasives and ultrasonic waves with chemical polishing liquid can reduce the consumption of chemical polishing liquid, and through ultrasonic waves, the approximate coordinates of the defect area can be identified to strengthen the polishing effect in a targeted manner, thereby shortening the overall time. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] To facilitate understanding by those skilled in the art, the present invention is further described below with reference to the accompanying drawings.

[0030] Figure 1 These are the method steps of the present invention. DETAILED DESCRIPTION

[0031] In order to further illustrate the technical means and effects adopted by the present invention to achieve the predetermined purpose of the invention, the specific implementation methods, structures, features and effects of the present invention are described in detail below in conjunction with the accompanying drawings and preferred embodiments.

[0032] See also Figure 1 This embodiment provides a surface polishing method for hardware tableware, comprising the following steps:

[0033] S1: Prepare a mixed polishing liquid, prepare a low-concentration chemical polishing liquid and mix it with a suspended abrasive to obtain a mixed polishing liquid. The preparation method and combination method of the low-concentration chemical polishing liquid are specific chemical polishing liquid formulas that are proportioned and produced according to specific polishing needs. Polishing needs include the specific type and material of the hardware tableware being processed and the required degree of polishing. However, during preparation, since polishing is not only performed using a chemical polishing liquid, when preparing the chemical polishing liquid, the concentration of the chemical polishing liquid required for polishing using only a chemical polishing liquid will be lower than that required for the same polishing. The specific proportioning method is based on the proportioning method of the chemical polishing liquid in the actual polishing. The shape and material of the suspended abrasive used need to be designed according to the specific type and material of the hardware tableware to be polished and the required degree of polishing, so as to meet the specific polishing needs;

[0034] S2: Soaking: Soak the tableware in the mixed polishing liquid and polish it with a low concentration of chemical polishing liquid. Before soaking, clean the surface of the tableware to prevent the residual matter on the tableware from interfering with the subsequent polishing of the tableware, and then dry it;

[0035] Place the cleaned and dried hardware tableware into the mixed chemical polishing liquid;

[0036] The tableware is corroded and polished according to the processing needs, and then the corroded and polished hardware tableware is dried.

[0037] S3: Oscillation polishing uses a high-power ultrasonic transmitter to ultrasonically oscillate the mixed polishing liquid. The high-frequency vibrations generated by the ultrasonic transmitter are transmitted through the liquid medium to the workpiece surface, utilizing the cavitation effect to remove surface defects from the tableware. During the specific polishing process, the ultrasonic transmitter time and power are limited according to the polishing requirements to prevent over-polishing or under-polishing. Specifically, the optimal ultrasonic transmission time and polishing power should be determined based on the specific material of the tableware, the initial surface condition, and the desired final finish. Different metals (such as stainless steel and silver) react differently to ultrasound, so the optimal ultrasonic transmission time and polishing power will also vary. Generally speaking, harder materials may require higher power and longer time to achieve the desired polishing effect; softer metals require more careful selection of power and time to prevent over-polishing and surface damage. Furthermore, if the tableware surface has a large number of burrs or high roughness, a higher initial power may be required to quickly remove these obvious defects. As the surface becomes smoother, the power can be appropriately reduced. Therefore, during the tableware polishing process, it is necessary to observe or make specific judgments based on the ultrasonic feedback data. For example, before actual polishing, perform multiple short polishing trials. After each polishing process, carefully examine the surface quality of the sample. If the desired effect is not achieved, repeat the process by slightly increasing the power or extending the polishing time until a proportional relationship is achieved. In subsequent polishing, make targeted adjustments based on the specific characteristics of the tableware.

[0038] When using an ultrasonic transmitter to polish the surface of tableware, with the help of ultrasonic oscillation, the suspended abrasive can be evenly distributed in the entire solution pool, ensuring that every corner of the tableware can be effectively treated. When chemical polishing is used to polish hardware tableware, the solution pool is an instrument for holding chemical polishing liquid and a certain amount of hardware tableware for chemical corrosion. The instrument referred to here also refers to the instrument for holding hardware tableware and mixed polishing liquid, and it does not interfere with ultrasonic oscillation.

[0039] S4: Identifying surface defects on tableware. To better understand the polishing results of the tableware, ultrasonic receivers are installed on the side walls and bottom of the solution pool. A matching ultrasonic transmitter is placed within the solution pool, facing the tableware. The ultrasonic receivers receive a portion of the ultrasonic waves reflected within the pool. By comparing the ultrasonic reflection patterns at the tableware locations, the coordinates of the polishing defects are determined.

[0040] Because ultrasound waves interact with the surface of tableware during propagation, varying degrees of reflection, scattering, and absorption occur depending on factors such as surface flatness and material properties. Ultrasonic receivers placed around and at the bottom of the solution pool collect the reflected signals. By analyzing changes in these signals (such as time delay and amplitude), information about the surface condition of the tableware, such as the presence of defects and surface roughness, can be inferred. By analyzing the data from these reflected waves, an "image" of the tableware surface can be constructed, known as an ultrasonic reflection map.

[0041] S5: For fine polishing of defective areas on the surface of tableware, a fluid polishing device is called to impact the polishing defective areas of the hardware tableware with a high-pressure fluid mixed with the same suspended abrasive to accelerate the completion of polishing. The fluid polishing device here is a device that fixes the hardware tableware and uses a specific fluid to flush specific positions of the hardware tableware. It includes at least one workpiece clamping fixture for the hardware tableware workpiece and a fluid flushing fixture. The tooling clamping fixture of the fluid polishing device performs at least one clamping and fixing on the hardware tableware. During the flushing process, the hardware tableware can be stably clamped to ensure the accuracy of the subsequent fluid flushing. The clamping structure of the fluid polishing device for the hardware tableware must be corrosion-resistant. The fluid polishing device includes a clamping structure for clamping the hardware tableware, and the clamping structure can cope with the impact of the high-pressure fluid to ensure the accuracy of the position of the subsequent high-pressure fluid impact.

[0042] The high-pressure fluid here is the aforementioned mixed polishing liquid, and since the suspended abrasive needs to be flushed through a fluid polishing device, the size of the suspended abrasive should conform to the size of the fluid flushing device so that the suspended abrasive is flushed out along with the chemical polishing liquid.

[0043] When using ultrasonic oscillatory polishing of tableware, due to the varying sizes of particles on the tableware surface, prolonged polishing is not recommended to avoid over-polishing. Furthermore, to improve the accuracy of ultrasonic testing of the tableware surface and reduce interference from the polishing fluid and suspended abrasive in the solution pool on the ultrasonic results, the tableware is raised to a level above the mixed polishing fluid. If the ultrasonic testing pattern indicates fewer than three areas of polishing defects on the tableware, the fluid polishing step S5 is then initiated to perform targeted polishing on the defective areas on the tableware surface.

[0044] Ultrasonic waves are used to oscillate and polish a mixture of hardware, polishing fluid, and suspended abrasive. The cavitation effect induced by ultrasound not only accelerates the chemical reaction rate of the chemical polishing fluid but also significantly increases the grinding efficiency of the suspended abrasive. This means that the ideal polishing effect can be achieved in a relatively short period of time, reducing polishing time and thus improving polishing efficiency.

[0045] Here, the ultrasonic transmitter and the ultrasonic receiver are coordinated to realize that the ultrasonic transmitter is not only used to vibrate and polish the hardware tableware, but also to grasp the polishing degree of the surface of the hardware tableware through the feedback signal of the ultrasonic receiver, thereby realizing the intelligent control of the polishing degree of the hardware tableware.

[0046] Moreover, since the suspended abrasive and ultrasonic waves are combined with chemical polishing liquid, the consumption of chemical polishing liquid can be reduced, and the rough coordinates of the defect area can be identified by ultrasonic waves to strengthen the polishing effect in a targeted manner, shortening the overall time.

[0047] In one embodiment, in step S4, the method for comparing the ultrasonic reflection patterns is:

[0048] Place the same amount and type of polished hardware cutlery that has met the standard in the same solution environment. Each ultrasonic receiver will capture the ultrasonic reflection signal at this time. By acquiring multiple sets of standard data, a spectrum tolerance range is established to obtain the ultrasonic reflection spectrum and allowable tolerance at each angle corresponding to the hardware cutlery when it is polished to the standard. The same solution environment here includes the same solution formula and volume. Since the standard part is placed first to allow the ultrasonic wave to establish the spectrum, and then the workpiece to be processed is placed for processing, the position of the workpiece to be processed and the position of the standard polished workpiece that has met the standard must be strictly controlled to ensure that the established spectrum tolerance range is applicable.

[0049] During the actual polishing process, the polishing defect areas of the hardware tableware can be obtained by comparing the ultrasonic reflection patterns obtained in real time.

[0050] In one embodiment, since the chemical polishing liquid will be consumed, it is necessary to appropriately add or replace the chemical polishing liquid as needed during the polishing process. The same applies to the suspended abrasive. Since the suspended abrasive will collide with the surface of the hardware tableware during the polishing process, the suspended abrasive needs to be replaced when the degree of wear of the suspended abrasive affects the polishing effect of the hardware tableware. By replacing or adding the suspended abrasive, the polishing effect of the hardware tableware is ensured.

[0051] The loss of chemical polishing fluid is generally a reduction in quantity, so the method to determine whether to add chemical polishing fluid is:

[0052] The same type and number of unpolished tableware are placed in a solution tank where chemical polishing liquid is to be added. The ultrasonic reflection signals at this time are acquired by each ultrasonic receiver. The spectrum tolerance range is established by acquiring multiple sets of standard data to obtain the standard ultrasonic reflection spectrum at each angle corresponding to the unpolished tableware when polishing liquid is to be added.

[0053] In actual polishing processing, the real-time ultrasonic reflection pattern is compared with the standard ultrasonic reflection pattern to determine whether chemical polishing liquid needs to be added. The operator can determine whether chemical polishing liquid needs to be added by observing the remaining amount of chemical polishing liquid.

[0054] In order to save the cost of ultrasonic transmitters, the ultrasonic transmitters used can be limited to one group, and the ultrasonic power emission time and mutual pre-conditioning of the ultrasonic transmitter for the hardware tableware and polishing function can be limited, so that a group of ultrasonic detectors can achieve the required functions. A controller is used, and the controller is electrically connected to the ultrasonic transmitter and the ultrasonic receiver respectively. The controller controls the emission of the ultrasonic transmitter and receives the feedback signal of the ultrasonic receiver respectively. The controller controls the working mode of the ultrasonic transmitter according to the set program, processes the signal fed back by the ultrasonic receiver, and performs signal analysis to obtain the ultrasonic reflection spectrum, so as to realize the aforementioned analysis of the defect distribution on the surface of the hardware tableware and whether the suspended abrasive needs to be added according to the ultrasonic reflection spectrum.

[0055] Moreover, the controller controls the ultrasonic transmitter to transmit the frequency band used for oscillation polishing and the frequency band used for detection function at specific times according to the set program, and different frequency bands are maintained for different times. The power and time of the specific frequency band used for oscillation polishing and the frequency band used for detection function are defined according to specific polishing needs and then set into a control program. The controller controls the ultrasonic transmitter and ultrasonic receiver according to the control program.

[0056] Naturally, the frequency band used for oscillation polishing and the frequency band used for detection function cannot interfere with each other. Therefore, when switching between frequency bands, it is necessary to control the switching time between adjacent frequency bands and the mutual non-interference of work. A working window switching is preset in the ultrasonic transmitter to achieve mutual non-interference between the work of each working window, and the ultrasonic receiver only receives frequency bands of specific frequencies, that is, only receives frequency bands used for detection function, thereby reducing the interference of the frequency bands used for oscillation polishing emitted by the ultrasonic transmitter on the ultrasonic receiver.

[0057] Moreover, because the time required to polish the tableware using this solution also depends on multiple factors, including but not limited to the material of the tableware, the initial surface condition, the desired final surface quality, and the specific ultrasonic parameters used (such as frequency, power, etc.), the polishing time is ultimately measured in minutes. Therefore, different functions are achieved by controlling the ultrasonic transmitter to intermittently transmit different frequency bands to ensure that there is no interference between the frequency bands. When the ultrasonic reflection spectrum data is subsequently analyzed, the data needs to be processed in batches to achieve batch processing of the feedback signal. Therefore, the signal processing between the ultrasonic transmitter and the signal receiver uses a control system to control the signal, thereby achieving control of the ultrasonic emission signal and subsequent data processing.

[0058] The above description is merely a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Although the present invention has been disclosed as above in terms of a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art can, without departing from the scope of the technical solution of the present invention, make some changes or modifications to equivalent embodiments using the technical contents disclosed above. However, any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A surface polishing method for hardware tableware, characterized in that: The following steps are involved: S1: preparing a mixed polishing liquid, preparing a low-concentration chemical polishing liquid and mixing it with a suspended abrasive to obtain a mixed polishing liquid; S2: Immersion polishing: soak the hardware tableware in the mixed polishing liquid and corrode and polish it with a low concentration of chemical polishing liquid; S3: Oscillation polishing, using an ultrasonic transmitter to ultrasonically oscillate the mixed polishing liquid; S4: Identify defective areas on the tableware surface, set an ultrasonic receiver in the solution pool, receive part of the ultrasonic waves reflected in the pool, compare the ultrasonic reflection map of the hardware tableware position, and obtain the coordinates of the defective area of ​​the hardware tableware polishing degree; S5: For fine polishing of defective areas on the tableware surface, a fluid polishing device is used to impact the polishing defective areas of the hardware tableware with high-pressure fluid mixed with the same suspended abrasive to accelerate the polishing process. In S4, the method for comparing the ultrasonic reflection patterns is: Place the same type of hardware tableware that has been polished to the standard in the same solution environment, and use each ultrasonic receiver to obtain the ultrasonic reflection signal at this time. By obtaining multiple sets of standard data, the spectrum tolerance range is established, and the ultrasonic reflection spectrum and allowable tolerance at each angle of the corresponding hardware tableware when polished to the standard are obtained; During the actual polishing process, the polishing defect areas of the hardware tableware can be obtained by comparing the ultrasonic reflection patterns obtained in real time; Also included is S6: adding chemical polishing liquid, and a method for determining whether or not to add chemical polishing liquid: The same type of unpolished tableware is placed in a solution tank that needs to be added with chemical polishing liquid. The ultrasonic reflection signal at this time is obtained by each ultrasonic receiver. The spectrum tolerance range is established by obtaining multiple sets of standard data to obtain the standard ultrasonic reflection spectrum at each angle of the unpolished tableware when the polishing liquid is added. In the actual polishing process, the ultrasonic reflection pattern obtained in real time is compared with the standard ultrasonic reflection pattern to determine whether chemical polishing liquid needs to be added; The device further includes a controller, which is electrically connected to the ultrasonic transmitter and the ultrasonic receiver, respectively. The controller controls the ultrasonic transmitter to perform ultrasonic oscillation and receives feedback signals from the ultrasonic receiver, processes the signals fed back by the ultrasonic receiver, performs signal analysis to obtain an ultrasonic reflection spectrum, and analyzes the defect distribution on the surface of the hardware tableware and whether suspended abrasive needs to be added based on the ultrasonic reflection spectrum. The controller controls the ultrasonic transmitter to transmit a frequency band for oscillation polishing and a frequency band for detection function at a specific time.

2. The surface polishing method of hardware tableware according to claim 1, characterized in that: In S4, when the number of polishing defect areas of the hardware tableware obtained is less than three, the hardware tableware is raised to a liquid level out of the mixed polishing liquid, and then the fluid polishing step of step S5 is connected.

3. The surface polishing method of hardware tableware according to claim 1, characterized in that: In S3, the ultrasonic transmitter is arranged in the solution pool and faces the location of the hardware tableware, and the ultrasonic receivers are respectively arranged on the side walls and bottom surface of the solution pool.

4. The surface polishing method of hardware tableware according to claim 1, characterized in that: The same solution environment includes the same solution formula and solution volume of the mixed polishing solution.

5. The surface polishing method of hardware tableware according to claim 1, characterized in that: The S6 also includes replacement of the suspended abrasive.

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