An external energy field-assisted chemimechanical planarization device

Abstract

This invention discloses an external energy field-assisted chemimechanical planarization device, relating to the field of polishing technology. It includes a lead screw frame with a servo lead screw device vertically mounted on it, forming a cross-connection with the frame. A polishing head device is mounted on the servo lead screw device, which can drive the polishing head device to move horizontally and vertically. A workpiece is mounted on the polishing head device. A polishing disc frame is located below the polishing head device, with a polishing disc device mounted on it. The polishing disc device is positioned below the polishing head device. The device also includes an electrochemical device, a peristaltic pump, an ultrasonic generator, and a control box. This invention provides functions such as ultrasonic vibration, current and voltage monitoring, polishing head and polishing disc rotation, automatic polishing head loading, polishing pressure and friction acquisition, polishing fluid supply, waste fluid collection, and automatic polishing head adjustment. It can also automatically set polishing process parameters, and the equipment operates automatically.

Description

Technical Field

[0001] This invention relates to the field of polishing technology, specifically to an external energy field-assisted chemimechanical planarization device. Background Technology

[0002] Both ultrasonic chemical mechanical polishing (CMP) and electrochemical mechanical polishing (EMP) techniques can significantly improve the material removal rate of wafers and enhance surface quality to varying degrees. Therefore, both ultrasonic and electrical factors can be introduced simultaneously to study ultrasonic electrochemical mechanical polishing (ECMP). To conduct research on ultrasonic EMP, a specialized external energy field-assisted chemical mechanical planarization device is required. Summary of the Invention

[0003] To address the aforementioned needs, this invention provides an external energy field-assisted chemimechanical planarization device to meet the research and experimental requirements for ultrasonic vibration, current and voltage, polishing head and polishing disc rotation, automatic polishing head loading, polishing pressure and friction acquisition, polishing fluid supply, waste liquid collection, and automatic polishing head adjustment. The device can also automatically set polishing process parameters and operate automatically.

[0004] The above-mentioned optimized structure of the present invention is achieved through the following technical solution: an external energy field-coordinated chemimechanical planarization device, comprising a screw frame, a servo screw device vertically mounted on the screw frame, the servo screw device and the screw frame forming a cross connection structure, a polishing head device mounted on the servo screw device, the servo screw device being able to drive the polishing head device to move in the horizontal and vertical directions, a workpiece to be processed mounted on the polishing head device, a polishing disc frame mounted below the polishing head device, a polishing disc device mounted on the polishing disc frame, the polishing disc device being located below the polishing head device;

[0005] It also includes an electrochemical device, a peristaltic pump, an ultrasonic generator, and a control box. The electrochemical device can apply an electric field to the workpiece to be processed, the peristaltic pump can deliver polishing liquid to the polishing disc device, the ultrasonic generator can drive the workpiece to be processed to vibrate, and the control box is electrically connected to the servo screw device, the polishing head device, the polishing disc device, and the ultrasonic generator.

[0006] In some embodiments, the servo screw device includes a screw frame, a vertical servo motor, a vertical screw assembly, a screw connecting plate, horizontal screw assembly support feet, a horizontal servo motor, and a horizontal screw assembly. The vertical screw assembly is arranged parallel to the screw frame. A vertical servo motor is located at the top of the vertical screw assembly. The screw connecting plate is located on the vertical screw assembly. The horizontal screw assembly is located on the screw connecting plate. The horizontal servo motor is located at one end of the horizontal screw assembly. The polishing head device is located on the side of the horizontal screw assembly away from the screw connecting plate. A plurality of horizontal screw assembly support feet are provided between the horizontal screw assembly and the screw connecting plate.

[0007] In some embodiments, the servo screw assembly further includes three vertical photoelectric sensors and three horizontal photoelectric sensors, with the three vertical photoelectric sensors disposed on one side of the vertical screw assembly and the three horizontal photoelectric sensors disposed on the top of the horizontal screw assembly.

[0008] In some embodiments, the servo screw device further includes a guide rail connecting plate, a guide rail, and a slider;

[0009] Two guide rail connecting plates are symmetrically arranged on the lead screw connecting plate. The guide rail is fixed to the guide rail connecting plate by a threaded connection. The slider slides with the guide rail. The polishing head device is connected between the two sliders.

[0010] In some embodiments, the polishing head device includes a sensor connection plate, a small pulley, a polishing head servo motor, a balancing element, an internal hex bolt, a spring, an ultrasonic transducer, a vibrator holder, a rotating shaft, a bearing seat, a bearing end cap, a three-dimensional pressure sensor, a belt, a large pulley, a conductive slip ring, and a conductive slip ring seat.

[0011] The sensor connecting plate is fixed to the horizontal lead screw assembly. The polishing head servo motor is fixed to the lower right of the sensor connecting plate. The small pulley is fixed to the output end of the polishing head servo motor. The conductive slip ring seat is fixed to the sensor connecting plate, and the conductive slip ring is located below the conductive slip ring seat. The three-dimensional pressure sensor is located to the lower left of the sensor connecting plate. The bearing end cap is fixed below the three-dimensional pressure sensor. The bearing seat is fixed below the bearing end cap. The rotating shaft passes through the bearing end cap, the bearing seat, and the sensor connecting plate. The large pulley is fixed... The belt is located at the top of the rotating shaft, within the grooves of the small and large pulleys. The balancing element is fixed below the rotating shaft, and the vibrator holder is located below the balancing element. Multiple hexagon socket head cap screws pass through the balancing element and are fixed above the vibrator holder. Springs are fitted onto the hexagon socket head cap screws, with both ends of the springs connected to the vibrator holder and below the balancing element, respectively. The ultrasonic transducer is fixed below the vibrator holder and electrically connected to the conductive slip ring. A clamping assembly is located below the ultrasonic transducer, and the clamping assembly clamps the workpiece to be processed.

[0012] In some embodiments, the clamping assembly includes a spring-loaded pin pressure plate, clamp number one, and clamp number two. Clamp number two is fixed to the lower part of the ultrasonic transducer by AB glue. Clamp number one is fixed to one side of clamp number two and located below the ultrasonic transducer. The spring-loaded pin is installed in the hole of clamp number two, and the spring-loaded pin pressure plate is fixed above clamp number two.

[0013] In some embodiments, a tapered roller bearing is coaxially disposed within the bearing housing, the tapered roller bearing is coaxially disposed with the rotating shaft, a bearing end cap is disposed on the bearing housing, and the bearing end cap passes through the rotating shaft.

[0014] In some embodiments, the rotating shaft is a hollow structure, and a wire hole is provided at the bottom of the rotating shaft. The conductive slip ring is connected to a wire, one end of which passes through the rotating shaft and out through the wire hole, and is connected to the ultrasonic transducer.

[0015] In some embodiments, the upper end of the oscillator holder is provided with a groove, a joint bearing is provided in the groove, a connecting shaft is coaxially provided in the joint bearing, and the connecting shaft is inserted into the rotating shaft.

[0016] In some embodiments, the polishing disc device includes a polishing disc, a guide frame, a polishing disc servo motor, a waste liquid tank, a hollow rotating platform, and a connecting plate. The hollow rotating platform and the polishing disc servo motor are mounted on the polishing disc frame. The connecting plate is fixed above the hollow rotating platform. The polishing disc is fixed above the connecting plate and connected to the polishing disc servo motor. The waste liquid tank is located above the polishing disc frame and below the polishing disc. The guide frame is located above the waste liquid tank, and the outlet of the guide frame is located above the polishing disc. The peristaltic pump is connected to the side of the guide frame away from the polishing disc.

[0017] The above-described technical solutions in the embodiments of the present invention have at least the following technical effects or advantages:

[0018] This invention can provide ultrasonic vibration, current and voltage, polishing head and polishing disc rotation, automatic polishing head loading, polishing pressure and friction acquisition, polishing fluid supply, waste fluid collection, and automatic polishing head adjustment functions. It can also set polishing process parameters and operate automatically. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the architecture of the present invention;

[0021] Figure 2 This is a schematic diagram of the servo lead screw device of the present invention;

[0022] Figure 3 This is a schematic diagram of the polishing head device of the present invention;

[0023] Figure 4 This is a schematic diagram of the connection between the rotating shaft and the bearing housing of the present invention;

[0024] Figure 5 This is a schematic diagram of the structure of the clamping component of the present invention;

[0025] Figure 6 This is a partial cross-sectional view of the clamping assembly of the present invention;

[0026] Figure 7 This is a schematic diagram of the connection between the oscillator holder and the connecting shaft of the present invention;

[0027] Figure 8 This is a schematic diagram of the polishing disc device of the present invention;

[0028] Figure 9 This is a schematic diagram of the connection between the connecting disc and the polishing disc frame of the present invention.

[0029] In the diagram: 1. Servo screw assembly; 2. Polishing head assembly; 3. Polishing disc assembly; 4. Electrochemical device; 5. Ultrasonic generator; 6. Peristaltic pump; 7. Polishing disc frame; 8. Screw frame; 9. Control box; 101. Vertical servo motor; 102. Vertical photoelectric sensor; 103. Vertical screw assembly; 104. Screw connecting plate; 105. Guide rail connecting plate; 106. Guide rail; 107. Slider; 108. Horizontal screw assembly support foot; 109. Horizontal servo motor; 110. Horizontal screw assembly; 111. Horizontal photoelectric sensor; 201. Sensor connecting plate; 202. Small pulley; 203. Polishing head servo motor; 204. Balance. Components; 205, Socket head cap screw; 206, Spring; 207, Ultrasonic transducer; 208, Vibrator holder; 209, Rotating shaft; 210, Bearing housing; 211, Bearing end cap; 212, Three-dimensional pressure sensor; 213, Belt; 214, Large pulley; 215, Conductive slip ring; 216, Conductive slip ring seat; 217, Tapered roller bearing; 218, Spring ejector pin pressure plate; 219, Fixture No. 1; 220, Fixture No. 2; 221, Spring ejector pin; 222, Spherical plain bearing; 223, Connecting shaft; 31, Polishing disc; 32, Guide frame; 33, Polishing disc servo motor; 34, Waste liquid pool; 35, Hollow rotary platform; 36, Connecting disc. Detailed Implementation

[0030] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0031] In the description of this invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0032] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0033] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0034] refer to Figure 1-9 An external energy field-assisted electrochemical mechanical planarization device is disclosed. The device includes a polishing head assembly 2, a polishing disc assembly 3, a servo screw assembly 1, an electrochemical device 4, an ultrasonic generator 5, a peristaltic pump 6, and a control box 9. The servo screw assembly 1 is connected to a screw frame 8 in a cross-shaped, vertically and horizontally mounted configuration. The polishing head assembly 2 is mounted on the servo screw assembly 1 and is driven by the servo screw assembly 1 to move up, down, left, and right. The polishing disc assembly 3 is mounted on a polishing disc frame 7, located below the polishing head assembly 2. The peristaltic pump 6, the electrochemical device 4, and the ultrasonic generator 5 are all positioned to the right of the polishing disc assembly 3. The control box 9 is located behind the servo screw assembly 1. The electrochemical device 4 applies an electric field to the workpiece, the peristaltic pump 6 delivers polishing fluid to the polishing disc assembly 3, and the ultrasonic generator causes the workpiece to vibrate. The control box 9 is electrically connected to the servo screw assembly 1, the polishing head assembly 2, the polishing disc assembly 3, and the ultrasonic generator 5. The control box 9 provides power to the device and allows input of control parameters to achieve ultrasonic electrochemical mechanical polishing of the workpiece.

[0035] In some embodiments, the servo screw device 1 includes a screw frame 8, a vertical servo motor 101, a vertical screw assembly 103, a screw connecting plate 104, a horizontal screw assembly support foot 108, a horizontal servo motor 109, and a horizontal screw assembly 110. The vertical screw assembly 103 is arranged parallel to the screw frame 8. The vertical servo motor 101 is provided on the top of the vertical screw assembly 103. The screw connecting plate 104 is provided on the vertical screw assembly 103 and can be fixed by bolt assembly. The vertical screw assembly 103 may include a vertical screw, a vertical frame, and other structures. The vertical screw is connected to the vertical servo motor 101 and is connected to the screw connecting plate 104. The vertical screw is rotated by the rotation of the vertical servo motor 101, which drives the vertical servo motor 101 to rotate, thereby causing the screw connecting plate 104 to slide in the vertical direction. This is prior art and will not be described in detail here. A horizontal lead screw assembly 110 is provided on the lead screw connecting plate 104, which can be fixed by bolt assembly. A horizontal servo motor 109 is provided at one end of the horizontal lead screw assembly 110. A polishing head device 2 is provided on the side of the horizontal lead screw assembly 110 away from the lead screw connecting plate 104. Multiple horizontal lead screw assembly support feet 108 are provided between the horizontal lead screw assembly 110 and the lead screw connecting plate 104. There can be four horizontal lead screw assembly support feet 108, which can be symmetrically arranged to enhance the connection strength between the horizontal lead screw assembly 110 and the lead screw connecting plate 104 and ensure the stability of the horizontal lead screw assembly 110 when moving. The structure of the horizontal lead screw assembly 110 is similar to that of the vertical lead screw assembly 103, which is also the prior art and will not be described in detail here.

[0036] In some embodiments, the servo lead screw device 1 further includes three vertical photoelectric sensors 102 and three horizontal photoelectric sensors 111. The three vertical photoelectric sensors 102 are disposed on one side of the vertical lead screw assembly 103, and the three horizontal photoelectric sensors 111 are disposed on the top of the horizontal lead screw assembly 110. Through the vertical photoelectric sensors 102 and the horizontal photoelectric sensors 111, the moving speed and moving position of the lead screw connecting plate 104 and the polishing head device 2 can be controlled.

[0037] In some embodiments, the servo screw device 1 further includes a guide rail connecting plate 105, a guide rail 106, and a slider 107; two guide rail connecting plates 105 are symmetrically arranged on the screw connecting plate 104, the guide rail 106 is fixed to the guide rail connecting plate 105 by a threaded connection, the slider 107 slides with the guide rail 106, and a polishing head device 2 is connected between the two sliders 107. Through the sliding cooperation between the two sliders 107 and the guide rail 106, support can be provided when the polishing head device 2 moves, thereby improving the stability of the movement of the polishing head device 2.

[0038] In some embodiments, the polishing head device 2 includes a sensor connection plate 201, a small pulley 202, a polishing head servo motor 203, a balancing element 204, an internal hex bolt 205, a spring 206, an ultrasonic transducer 207, a vibrator holder 208, a rotating shaft 209, a bearing seat 210, a bearing end cap 211, a three-dimensional pressure sensor 212, a belt 213, a large pulley 214, a conductive slip ring 215, and a conductive slip ring seat 216.

[0039] The sensor connection plate 201 is fixed on the horizontal lead screw assembly 110, enabling the polishing head device 2 to move and adjust in the horizontal direction. The polishing head servo motor 203 is fixed to the lower right of the sensor connection plate 201. The small pulley 202 is fixed to the output end of the polishing head servo motor 203 by a key connection. The conductive slip ring seat 216 is fixed on the sensor connection plate 201. The conductive slip ring 215 is located below the conductive slip ring seat 216. The three-dimensional pressure sensor 212 is located to the lower left of the sensor connection plate 201. The bearing end cover 211 is fixed below the three-dimensional pressure sensor 212. The bearing seat 210 is fixed below the bearing end cover 211. The rotating shaft 209 passes through the bearing end cover 211, the bearing seat 210, and the sensor connection plate 201, providing a stable rotation axis. The large pulley 214 is fixed to the top of the rotating shaft 209. The belt 213 is located in the groove between the small pulley 202 and the large pulley 214, thereby realizing the power transmission from the polishing head servo motor 203 to the rotating shaft 209. By controlling the rotation speed of the polishing head servo motor 203, the rotation speed of the shaft 209 can be controlled to meet different polishing requirements.

[0040] A balancing element 204 is fixed below the rotating shaft 209. A vibrator holder 208 is located below the balancing element 204. Multiple hexagon socket head cap screws 205 pass through the balancing element 204 and are fixed above the vibrator holder 208. Springs 206 are fitted onto the hexagon socket head cap screws 205. The two ends of the springs 206 are connected to the vibrator holder 208 and the lower part of the balancing element 204, respectively. The springs 206 allow the vibrator holder 208 to automatically adjust its posture during polishing, ensuring that the ultrasonic transducer 207 fits tightly and flatly against the polishing disc 31, thus achieving the automatic adjustment function of the polishing head device 2. The ultrasonic transducer 207 is fixed below the vibrator holder 208 and electrically connected to a conductive slip ring 215. A clamping assembly is located below the ultrasonic transducer 207, clamping the workpiece to be processed, allowing it to be polished under the action of the ultrasonic transducer 207.

[0041] The positive and negative terminals of the ultrasonic transducer 207 can be connected to the positive and negative terminals of the ultrasonic generator 5 through the conductive slip ring 215, thereby establishing a channel for power transmission, so that the ultrasonic generator 5 can provide the required power to the ultrasonic transducer 207, thereby driving it to generate ultrasonic vibration.

[0042] The ultrasonic energy field is generated by the ultrasonic transducer 207 driven by the ultrasonic generator 5. The ultrasonic generator 5 is an external device; by changing different types of ultrasonic transducers and correspondingly adjusting the power and frequency of the ultrasonic generator 5, the system can flexibly provide ultrasonic energy fields of different powers and frequencies. This adjustability allows the ultrasonic polishing process to be optimized according to the material of the workpiece and the polishing requirements.

[0043] It is worth noting that the ultrasonic generator, as an independent external device, is not directly controlled by the control box 9. Therefore, during the experiment, the ultrasonic generator needs to be operated separately to achieve the required ultrasonic vibration parameter settings.

[0044] The three-dimensional pressure sensor 212 can collect the force on the workpiece in the X, Y, and Z directions in real time. The Z direction is vertical, while X and Y are horizontal. The data is fed back to the control box 9. The force in the Z direction is measured as the loading pressure. The control box 9 controls the magnitude of the force by comparing the Z-direction force with the input required force value and controlling the rise and fall of the vertical lead screw assembly 103, thereby realizing the automatic loading of the workpiece. The forces measured in the X and Y directions are horizontal. The force measured in the Y direction, after removing the force affected by the pulley tension, is the resultant force of the force measured in the X direction, which is the friction force, thus realizing the acquisition of friction force. The friction coefficient can be calculated from the friction force and load values ​​to obtain the friction curve.

[0045] In some embodiments, the clamping assembly includes a spring-loaded pin plate 218, a first clamp 219, a second clamp 220, and a spring-loaded pin 221. The second clamp 220 is fixed below the ultrasonic transducer 207 with AB glue. The first clamp 219 is fixed to one side of the second clamp 220 and located below the ultrasonic transducer 207. The spring-loaded pin 221 is installed in the hole of the second clamp 220, and the spring-loaded pin plate 218 is fixed above the second clamp 220. After the workpiece is installed in the circular groove below the second clamp 220, the first clamp 219 presses the workpiece tightly into the second clamp 220 using three hexagonal socket head cap screws.

[0046] In some embodiments, tapered roller bearings 217 are coaxially arranged within the bearing housing 210. The two tapered roller bearings 217 can withstand a large radial load and a certain axial load, thus bearing both the large radial load required during polishing and the axial friction generated during polishing. A rotating shaft 209 is coaxially arranged within the tapered roller bearings 217, and a bearing end cap 211 is provided on the bearing housing 210, through which the rotating shaft 209 passes.

[0047] In some embodiments, the rotating shaft 209 has a hollow structure and a wire hole at the bottom. A conductive slip ring 215 is connected to a wire. One end of the wire passes through the rotating shaft 209 and exits through the wire hole, and is connected to the ultrasonic transducer 207 to provide electrical power. The upper end of the vibrator holder 208 has a groove, and a joint bearing 222 is provided in the groove. A connecting shaft 223 is coaxially provided in the joint bearing 222, and the connecting shaft 223 is inserted into the rotating shaft 209.

[0048] In some embodiments, the polishing disc device 3 includes a polishing disc 31, a guide frame 32, a polishing disc servo motor 33, a waste liquid tank 34, a hollow rotating platform 35, and a connecting plate 36. The hollow rotating platform 35 and the polishing disc servo motor 33 are mounted on the polishing disc frame 7. The connecting plate 36 is fixed above the hollow rotating platform 35. The polishing disc 31 is fixed above the connecting plate 36 and connected to the polishing disc servo motor 33. The waste liquid tank 34 is located above the polishing disc frame 7 and below the polishing disc 31. The guide frame 32 is located above the waste liquid tank 34, and the outlet of the guide frame 32 is located above the polishing disc 31. A peristaltic pump 6 is connected to the side of the guide frame 32 away from the polishing disc 31, and the peristaltic pump 6 continuously supplies polishing liquid or deionized water.

[0049] Electrochemical device 4 can apply electric fields of different intensities to the workpiece to be processed. Specifically, the positive electrode of electrochemical device 4 is pressed against the tail of spring pin 221 by a cylindrical protrusion below the spring pin pressure plate 218 via a conductive slip ring 215, pressing the spring pin 221 tightly into the hole of clamp 220. The front end of spring pin 221 can retract when subjected to force, ensuring direct contact between the front end of spring pin 221 and the workpiece to be processed. When the workpiece is installed, the negative electrode and reference electrode of electrochemical device 4 are directly inserted into the waste liquid pool 34 from the outside. During the polishing process, polishing liquid will always be on the polishing disk 31, realizing the current flowing from the positive electrode through the workpiece to be processed and the polishing liquid to the negative electrode, thus applying the electric field. During the experiment, electrochemical device 4 can provide electric fields of different intensities by setting the applied voltage value, and can measure the changes in current and potential to obtain the electrochemical characteristics of the material. Electrochemical device 4 is external and cannot be directly controlled by control box 9; electrochemical device 4 needs to be operated separately during the experiment.

[0050] The specific working principle is as follows:

[0051] In practical use, parameters such as rotation speed, polishing fluid flow rate, polishing pressure, horizontal screw travel distance, and manual / automatic movement of the mechanism are input into control box 9. An automatic loading program can also be set, which can be configured with three stages of loading to gradually reach the required pressure, thus achieving automatic loading. Polishing will automatically stop after completion, realizing automatic operation of the polishing equipment. The workpiece to be processed is clamped at the bottom of the clamping assembly using clamps 219 and 220.

[0052] Under the control of the control box 9, the servo screw device 1 moves the workpiece to the set position and into contact with the polishing disc 31 through the combined action of the vertical screw assembly 103 and the horizontal screw assembly 110.

[0053] During this process, the polishing disc 31 rotates at a set speed under the action of the polishing disc servo motor 33. During the rotation of the polishing disc 31, the peristaltic pump 6 continuously sprays polishing liquid or deionized water onto the polishing disc 31. The workpiece to be processed comes into contact with the polishing disc 31 for polishing. The polishing liquid that flows out or is thrown out during the polishing process will be collected in the waste liquid pool 34 and finally flow into the waste liquid collection bucket through the pipe.

[0054] Meanwhile, the positive electrode of the electrochemical device 4 is connected to the tail of the spring pin below the spring pin pressure plate 218 through the conductive slip ring 215. The front part of the spring pin is in direct contact with the workpiece to be processed. The negative electrode and the reference electrode of the electrochemical device 4 are directly inserted into the waste liquid pool 34 from the outside. During the polishing process, there will always be polishing liquid on the polishing disk 31, so that the current flows from the positive electrode through the workpiece to be processed and the polishing liquid to the negative electrode, thereby applying an electric field.

[0055] During the polishing process, the force on the workpiece is transmitted to the three-dimensional pressure sensor 212, which collects the force on the workpiece in the X, Y, and Z directions and feeds the data back to the control box 9. The control box 9 controls the magnitude of the force by comparing the force in the Z direction with the input force value and controlling the rise and fall of the vertical lead screw assembly 103, thereby realizing the automatic loading of the workpiece.

[0056] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An external energy field-assisted chemimechanical planarization device, characterized in that: The assembly includes a lead screw frame (8), on which a servo lead screw device (1) is vertically mounted. The servo lead screw device (1) and the lead screw frame (8) are connected in a cross shape. A polishing head device (2) is mounted on the servo lead screw device (1). The servo lead screw device (1) can drive the polishing head device (2) to move in the horizontal and vertical directions. A workpiece to be processed is mounted on the polishing head device (2). A polishing disc frame (7) is located below the polishing head device (2). A polishing disc device (3) is mounted on the polishing disc frame (7). The polishing disc device (3) is located below the polishing head device (2). It also includes an electrochemical device (4), a peristaltic pump (6), an ultrasonic generator (5), and a control box (9). The electrochemical device (4) can apply an electric field to the workpiece to be processed. The peristaltic pump (6) can deliver polishing liquid to the polishing disc device (3). The ultrasonic generator (5) can drive the workpiece to be processed to vibrate. The control box (9) is electrically connected to the servo screw device (1), the polishing head device (2), the polishing disc device (3), and the ultrasonic generator (5). The polishing head device (2) includes a sensor connection plate (201), a small pulley (202), a polishing head servo motor (203), a balancing element (204), an internal hex bolt (205), a spring (206), an ultrasonic transducer (207), a vibrator holder (208), a rotating shaft (209), a bearing seat (210), a bearing end cap (211), a three-dimensional pressure sensor (212), a belt (213), a large pulley (214), a conductive slip ring (215), and a conductive slip ring seat (216). The sensor connection plate (201) is fixed on the horizontal lead screw assembly (110) of the servo lead screw device (1). The polishing head servo motor (203) is fixed to the lower right of the sensor connection plate (201). The small pulley (202) is fixed on the output end of the polishing head servo motor (203). The conductive slip ring seat (216) is fixed on the sensor connection plate (201). The conductive slip ring (215) is located below the conductive slip ring seat (216). The three-dimensional pressure sensor (212) is located to the lower left of the sensor connection plate (201). The bearing end cover (211) is fixed below the three-dimensional pressure sensor (212). The bearing seat (210) is fixed below the bearing end cover (211). The rotating shaft (209) passes through the bearing end cover (211), the bearing seat (210), and the sensor connection plate (201). The pulley (214) is fixed to the top of the rotating shaft (209), the belt (213) is located in the groove between the small pulley (202) and the large pulley (214), the balancing element (204) is fixed below the rotating shaft (209), the vibrator holder (208) is located below the balancing element (204), a plurality of hexagonal socket bolts (205) pass through the balancing element (204) and are fixed above the vibrator holder (208), the spring (206) is sleeved on the hexagonal socket bolts (205), the two ends of the spring (206) are respectively connected to the vibrator holder (208) and the bottom of the balancing element (204), the ultrasonic transducer (207) is fixed below the vibrator holder (208) and is electrically connected to the conductive slip ring (215), the ultrasonic transducer (207) is provided with a clamping assembly below it, and the clamping assembly clamps the workpiece to be processed; The clamping assembly includes a spring-loaded pin pressure plate (218), clamp number one (219), clamp number two (220), and spring-loaded pin (221). The clamp number two (220) is fixed below the ultrasonic transducer (207). The clamp number one (219) is fixed to one side of the clamp number two (220) and located below the ultrasonic transducer (207). The spring-loaded pin (221) is installed in the hole of the clamp number two (220). The spring-loaded pin pressure plate (218) is fixed above the clamp number two (220).

2. The external energy field-assisted chemimechanical planarization device according to claim 1, characterized in that: The servo screw device (1) includes a screw frame (8), a vertical servo motor (101), a vertical screw assembly (103), a screw connecting plate (104), horizontal screw assembly support feet (108), a horizontal servo motor (109), and a horizontal screw assembly (110). The vertical screw assembly (103) is arranged parallel to the screw frame (8). The vertical screw assembly (103) has a vertical servo motor (101) on its top. The vertical screw assembly (103) has the screw connecting plate (104) on its top. The horizontal screw assembly (110) has the horizontal screw assembly (110) on its top. One end of the horizontal screw assembly (110) has the horizontal servo motor (109). The polishing head device (2) is located on the side of the horizontal screw assembly (110) away from the screw connecting plate (104). Multiple horizontal screw assembly support feet (108) are provided between the horizontal screw assembly (110) and the screw connecting plate (104).

3. The external energy field-assisted chemimechanical planarization device according to claim 2, characterized in that: The servo screw device (1) also includes three vertical photoelectric sensors (102) and three horizontal photoelectric sensors (111). The three vertical photoelectric sensors (102) are located on one side of the vertical screw assembly (103), and the three horizontal photoelectric sensors (111) are located on the top of the horizontal screw assembly (110).

4. The external energy field-assisted chemimechanical planarization device according to claim 2, characterized in that: The servo screw device (1) also includes a guide rail connecting plate (105), a guide rail (106), and a slider (107). Two guide rail connecting plates (105) are symmetrically arranged on the lead screw connecting plate (104). The guide rail (106) is fixed on the guide rail connecting plate (105) by threaded connection. The slider (107) slides with the guide rail (106). The polishing head device (2) is connected between the two sliders (107).

5. The external energy field-assisted chemimechanical planarization device according to claim 1, characterized in that: A tapered roller bearing (217) is coaxially disposed inside the bearing housing (210), and a rotating shaft (209) is coaxially disposed on the tapered roller bearing (217). A bearing end cover (211) is disposed on the bearing housing (210), and the rotating shaft (209) is disposed through the bearing end cover (211).

6. The external energy field-assisted chemimechanical planarization device according to claim 1, characterized in that: The rotating shaft (209) has a hollow structure and a wire hole at the bottom. The conductive slip ring (215) is connected to a wire. One end of the wire passes through the rotating shaft (209) and then through the wire hole, and is connected to the ultrasonic transducer (207).

7. The external energy field-assisted chemimechanical planarization device according to claim 1, characterized in that: The upper end of the oscillator holder (208) is provided with a groove, and a joint bearing (222) is provided in the groove. A connecting shaft (223) is coaxially provided in the joint bearing (222), and the connecting shaft (223) is inserted into the rotating shaft (209).

8. The external energy field-assisted chemimechanical planarization device according to claim 1, characterized in that: The polishing disc device (3) includes a polishing disc (31), a guide frame (32), a polishing disc servo motor (33), a waste liquid tank (34), a hollow rotating platform (35), and a connecting plate (36). The hollow rotating platform (35) and the polishing disc servo motor (33) are mounted on the polishing disc frame (7). The connecting plate (36) is fixed above the hollow rotating platform (35). The polishing disc (31) is fixed above the connecting plate (36) and connected to the polishing disc servo motor (33). The waste liquid tank (34) is located above the polishing disc frame (7) and below the polishing disc (31). The guide frame (32) is located above the waste liquid tank (34), and the outlet of the guide frame (32) is located above the polishing disc (31). The peristaltic pump (6) is connected to the side of the guide frame (32) away from the polishing disc (31).

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