A fully automatic mirror polishing device for a silicon ring

By designing a fully automatic mirror polishing device, a single motor is used to control the rotation of the polishing mechanism, and ensuring the stability and surface cleaning of the silicon ring through lifting and cleaning mechanisms, the motor complexity and debris cleaning problems during the silicon ring polishing process in the prior art are solved, and an efficient and automatic polishing process is achieved.

CN119772754BActive Publication Date: 2025-06-27ZHEJIANG YUANXIN SEMICON MATERIAL CO LTD
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Patent Information

Application Number
CN202510085182.5
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-01-20
Publication Date
2025-06-27
Estimated Expiration
2045-01-20

AI Technical Summary

Technical Problem

In the prior art, the polishing process of the silicon ring requires two motors to control the rotation of the fine grinding head and the coarse grinding head respectively, and it is necessary to repeatedly push through an electric push rod to increase the polishing range, and it is impossible to clean the debris generated by the polishing of the silicon ring surface in time.

Method used

A fully automatic mirror polishing device is designed, using a single motor to control the rotation of the polishing mechanism, ensuring the stability of the silicon ring through the lifting mechanism and the placement mechanism, and using the cleaning mechanism to drive the wipe strip and wipe cotton to clean the surface debris.

Benefits of technology

The fine grinding head and coarse grinding head are realized to only control the rotation of a single motor, reducing the mechanical complexity and cost during the grinding process. At the same time, it can clean up debris generated by the polishing of the silicon ring surface in a timely manner, improving the grinding efficiency and effect.

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Abstract

The present invention discloses a full-automatic mirror polishing device for a silicon ring, belonging to the field of silicon ring polishing. It includes a polishing mechanism, a bottom plate is arranged below the polishing mechanism, and a vertical plate is fixedly connected to the right side of the upper surface of the bottom plate; a lifting mechanism is arranged on the left side of the vertical plate; a placing mechanism is arranged on the left side of the upper surface of the bottom plate; a cleaning mechanism is arranged on the left side of the bottom plate; the polishing mechanism includes a mounting plate, the mounting plate is fixedly installed on the lifting mechanism, the lower surface of the mounting plate is rotatably connected to a cylinder through a rotating shaft, the bottom end of the cylinder is fixedly connected to a mounting frame, and two through-type sliding grooves I are opened on the upper surface of the mounting frame; Start the vacuum pump, adsorb the silicon ring through the suction disc to ensure that the silicon ring will not move easily during grinding. By starting the second motor, under the meshing of the third gear and the fourth gear, control the suction disc to rotate, so that the silicon ring rotates while being ground, and the grinding is more comprehensive.
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Description

Technical Field

[0001] The present invention relates to the field of silicon ring polishing, and particularly to a full-automatic mirror polishing device for silicon rings. Background Art

[0002] Silicon rings are used to carry wafers during the wafer processing. The thicknesses of silicon rings used in different processes are different. Therefore, in the production and preparation of silicon rings, a polishing mechanism is required to grind the back surface of the silicon ring to reduce its thickness. When grinding, it is necessary to first perform rough grinding to accelerate the grinding speed, and then perform fine grinding to reach the required thickness.

[0003] Patent: CN221792005U discloses a grinding and thinning device for single-crystal silicon rings, which includes a frame. A moving frame is installed on the frame through a lateral moving mechanism. A lifting frame is installed on the moving frame through a vertical moving mechanism. A rotating frame is rotatably installed on the lifting frame. The rotating frame is driven to rotate by a first rotation driving mechanism. Two first rotating motors are vertically installed on the rotating frame. The two first rotating motors are symmetrically arranged along the rotation center of the rotating frame. The output shaft of the first rotating motor is fixedly provided with a mounting plate downward. A fine grinding head and a rough grinding head are respectively installed on the two mounting plates. A rotating table rotatably installed on the frame is provided below the rotating frame. The rotating table is driven to rotate by a second rotation mechanism. A plurality of adsorption holes are provided on the rotating table. The adsorption holes are connected to a vacuum generator. An infrared rangefinder corresponding to the rotating table is installed on the rotating frame. Thus, the functions of rough grinding and fine grinding are simultaneously available on the same device, which can reduce the equipment investment cost.

[0004] In the above technology, the fine grinding head and the rough grinding head need to be controlled by two motors respectively to rotate for grinding. And when grinding, it is necessary to repeatedly push through an electric push rod to increase the grinding range. Also, in the above technology, the debris generated by the surface polishing of the silicon ring cannot be cleaned in time, which needs to be improved. For this reason, we propose a full-automatic mirror polishing device for silicon rings. Summary of the Invention

[0005] Object of the Invention: The object of the present invention is to provide that the fine grinding head and the rough grinding head only need to be controlled by a single motor to rotate for grinding, and when grinding, it is not necessary to repeatedly push through an electric push rod to increase the grinding range. Another object of the present invention is to provide that the debris generated by the surface polishing of the silicon ring can be cleaned in time.

[0006] Technical Solution: A full-automatic mirror polishing device for silicon rings includes a polishing mechanism. A bottom plate is arranged below the polishing mechanism. A vertical plate is fixedly connected to the right side of the upper surface of the bottom plate.

[0007] A lifting mechanism is arranged on the left side of the vertical plate.

[0008] A placing mechanism is arranged on the left side of the upper surface of the bottom plate.

[0009] A cleaning mechanism is provided on the left side of the bottom plate;

[0010] The polishing mechanism includes a mounting plate, the mounting plate is fixedly mounted on the lifting mechanism, the lower surface of the mounting plate is rotatably connected with a cylinder via a rotating shaft, the bottom end of the cylinder is fixedly connected with a mounting frame, the upper surface of the mounting frame is provided with two through-type slide grooves 1, the opposite sides of the two slide grooves 1 are integrally formed with contraction grooves, the inside of the contraction groove is slidably connected with a sliding plate, the opposite sides of the two sliding plates are located on the inner sides of the two slide grooves 1 and are fixedly connected with shaft sleeves, the inner side of the shaft sleeve is rotatably connected with a shaft column via a rotating shaft, the bottom ends of the two shaft columns are respectively fixedly connected with a fine grinding head and a coarse grinding head, and the top end of the shaft column is fixedly connected with a gear 1;

[0011] A second slide groove is provided on the upper surface of the mounting plate, two slide rods are fixedly connected inside the second slide groove, an L-shaped bracket is slidably connected to the outer side walls of the two slide rods, a motor 1 is fixedly connected to the inner side of the L-shaped bracket, and a gear 2 is fixedly connected to the bottom end of the output shaft of the motor 1;

[0012] An electric push rod 1 is fixedly connected to the upper surface of the mounting plate, the bottom end of the output end of the electric push rod 1 penetrates below the mounting plate and is fixedly connected to a toggle column, a spiral groove is formed on the outer wall of the cylinder, and the rear end of the toggle column extends to the inside of the spiral groove and is slidably connected to the spiral groove;

[0013] A spring is fixedly connected between the slide slot 1 and the slide plate;

[0014] A cam is fixedly connected to the outer side wall of the output shaft of the motor 1, a connecting ring groove is provided on the upper surface of the cam, a connecting column is slidably connected inside the connecting ring groove, and an L-shaped support rod is fixedly connected between the top end of the connecting column and the upper surface of the mounting plate;

[0015] The placement mechanism includes an adsorption disk, a vacuum pump is fixedly connected to the lower surface of the adsorption disk, a shaft is fixedly connected to the lower surface of the placement mechanism, the lower surface of the shaft is rotatably connected to the upper surface of the bottom plate via a rotating shaft, a gear three is fixedly connected to the outer side wall of the shaft, a motor two is fixedly connected to the upper surface of the bottom plate located on the left side of the shaft, a gear four is fixedly connected to the top end of the output shaft of the motor two, and the gear four is meshingly connected to the gear three;

[0016] The cleaning mechanism includes a fixed head, the upper surface of the fixed head is rotatably connected to a spiral tube via a rotating shaft, the outer wall of the spiral tube is fixedly connected to a gear five, the gear five is meshingly connected to the gear four, the internal thread of the spiral tube is connected to a screw rod, the outer wall of the screw rod is fixedly connected to a wiping strip, and the lower surface of the wiping strip is detachably mounted with wiping cotton.

[0017] Furthermore, the lifting mechanism includes a fixing bar, the upper surface of which is fixedly connected to an electric push rod 2, the bottom end of the output end of the electric push rod 2 passes through the bottom of the fixing bar and is fixedly connected to a lifting bar, the left side of the lifting bar is fixedly connected to the right side of the mounting plate, and the right side of the fixing bar is fixedly connected to the left side of the vertical plate.

[0018] Furthermore, two vertical rods are fixedly connected to the lower surface of the fixing bar, and the bottom ends of the vertical rods penetrate the lifting bar and are slidably connected to the lifting bar.

[0019] Furthermore, a material guide seat is provided on the outer side wall of the adsorption disk, and a connecting seat is fixedly connected between the material guide seat and the bottom plate.

[0020] Beneficial effect: Start the vacuum pump, and use the adsorption plate to adsorb the silicon ring to ensure that the silicon ring will not move easily during grinding. By starting the motor 2, the adsorption plate is controlled to rotate under the meshing of gear 3 and gear 4, so that the silicon ring can be polished while rotating, and the grinding is more comprehensive;

[0021] When the motor 2 is started and controls the adsorption plate to rotate, the gear 4 will mesh with the gear 5 to drive the screw and the spiral tube to rotate together, thereby driving the wiping strip to rotate, and then the wiping cotton can wipe the surface of the silicon ring, so as to achieve the effect of grinding edge cleaning, and the screw can extend from the inside of the spiral tube to control the height of the wiping strip, so as to facilitate wiping silicon rings of different thicknesses;

[0022] Control the electric push rod 1 to extend or retract, and at this time, the mounting frame at the bottom of the cylinder will be rotated through the toggle column and the spiral groove, so as to control the gear 1 of the rough grinding head or the gear 1 at the bottom of the fine grinding head to mesh with the gear 2, so that the fine grinding head or the rough grinding head can be controlled to rotate and grind separately;

[0023] When the motor is started and the fine grinding head or the coarse grinding head is controlled to rotate and grind, the cam can repeatedly squeeze and push the motor 1 to move left and right repeatedly during the rotation process. At this time, under the push of the spring, the gear 2 and the gear 1 can always be in a meshing state. At the same time, the gear 1 meshing with the gear 2 is pushed to move left and right repeatedly, thereby driving the coarse grinding head or the fine grinding head to move left and right repeatedly, thereby increasing the grinding range. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0025] Figure 2 It is a structural schematic diagram of the polishing mechanism of the present invention;

[0026] Figure 3It is a schematic connection structure diagram of a cylinder, an electric push rod I, a mounting bracket, a fine grinding head and a rough grinding head of the present invention;

[0027] Figure 4 It is a schematic connection structure diagram of a motor I, a cam, a gear II, an L-shaped bracket and a sliding rod of the present invention;

[0028] Figure 5 It is a schematic side view connection structure diagram of a lifting mechanism and a vertical plate of the present invention;

[0029] Figure 6 It is a schematic connection structure diagram of a placing mechanism and a cleaning mechanism of the present invention.

[0030] In the figure: 1. Polishing mechanism; 2. Bottom plate; 3. Vertical plate; 4. Lifting mechanism; 5. Placing mechanism; 6. Cleaning mechanism; 7. Feeding seat; 8. Connecting seat; 101. Mounting plate; 102. Cylinder; 103. Mounting bracket; 104. First chute; 105. Shrinkage groove; 106. Sliding plate; 107. Bush; 108. Shaft column; 109. Fine grinding head; 110. Rough grinding head; 111. First gear; 112. Second chute; 113. Sliding rod; 114. L-shaped bracket; 115. Motor I; 116. Second gear; 117. Electric push rod I; 118. Poking column; 119. Spiral groove; 120. Spring; 121. Cam; 122. Connecting ring groove; 123. Connecting column; 124. L-shaped strut; 401. Fixed strip; 402. Electric push rod II; 403. Lifting strip; 404. Vertical rod; 501. Suction cup; 502. Vacuum pump; 503. Shaft rod; 504. Third gear; 505. Motor II; 506. Fourth gear; 601. Fixed head; 602. Screw tube; 603. Fifth gear; 604. Screw; 605. Wiping strip; 606. Wiping cotton. Detailed implementation mode

[0031] To make the technical solution of the present invention clearer, the following further describes the present invention in detail with reference to the accompanying drawings and specific embodiments. Embodiment

[0032] As Figure 1 shown, a full-automatic mirror polishing device for silicon rings is provided, including a polishing mechanism 1. A bottom plate 2 is arranged below the polishing mechanism 1, and a vertical plate 3 is fixedly connected to the right upper surface of the bottom plate 2;

[0033] A feeding seat 7 is arranged on the outer side wall of the suction cup 501, and a connecting seat 8 is fixedly connected between the feeding seat 7 and the bottom plate 2;

[0034] The bottom plate 2 and the vertical plate 3 form the framework of the device, and the feeding seat 7 and the connecting seat 8 are used to guide the debris after grinding and cleaning.

[0035] As Figure 5As shown in the figure, a lifting mechanism 4 is arranged on the left side of the vertical plate 3;

[0036] The lifting mechanism 4 includes a fixed bar 401. The upper surface of the fixed bar 401 is fixedly connected with an electric push rod two 402. The bottom end of the output end of the electric push rod two 402 penetrates below the fixed bar 401 and is fixedly connected with a lifting bar 403. The left side of the lifting bar 403 is fixedly connected with the right side of the mounting plate 101. The right side of the fixed bar 401 is fixedly connected with the left side of the vertical plate 3;

[0037] Two vertical rods 404 are fixedly connected to the lower surface of the fixed bar 401. The bottom ends of the vertical rods 404 penetrate the lifting bar 403 and are slidably connected with the lifting bar 403;

[0038] By controlling the contraction of the electric push rod two 402, under the guidance of the vertical rods 404, the lifting bar 403 can be controlled to rise or fall, so that the polishing mechanism 1 can be controlled to rise or fall, and then the polishing mechanism 1 can be controlled to approach or move away from the silicon ring for grinding, which is convenient for the replacement of the silicon ring.

[0039] A placing mechanism 5 is arranged on the left side of the upper surface of the bottom plate 2;

[0040] The placing mechanism 5 includes a suction cup 501. The lower surface of the suction cup 501 is fixedly connected with a vacuum pump 502. The lower surface of the placing mechanism 5 is fixedly connected with a shaft rod 503. The lower surface of the shaft rod 503 is rotatably connected with the upper surface of the bottom plate 2 through a rotating shaft. A gear three 504 is fixedly connected to the outer side wall of the shaft rod 503. A motor two 505 is fixedly connected to the upper surface of the bottom plate 2 to the left of the shaft rod 503. The top end of the output shaft of the motor two 505 is fixedly connected with a gear four 506. The gear four 506 is meshed with the gear three 504;

[0041] Before grinding, place the silicon ring on the upper surface of the suction cup 501, start the vacuum pump 502, and adsorb the silicon ring through the suction cup 501 to ensure that the silicon ring will not move easily during grinding. By starting the motor two 505, under the meshing of the gear three 504 and the gear four 506, control the suction cup 501 to rotate, so that the silicon ring rotates while being ground, and the grinding is more comprehensive.

[0042] A cleaning mechanism 6 is arranged on the left side of the bottom plate 2;

[0043] The cleaning mechanism 6 includes a fixed head 601. The upper surface of the fixed head 601 is rotatably connected with a screw tube 602 through a rotating shaft. A gear five 603 is fixedly connected to the outer side wall of the screw tube 602. The gear five 603 is meshed with the gear four 506. A screw rod 604 is threadedly connected inside the screw tube 602. A wiping strip 605 is fixedly connected to the outer side wall of the screw rod 604. A wiping cotton 606 is detachably installed on the lower surface of the wiping strip 605;

[0044] When motor 2 505 is started and controls the adsorption plate 501 to rotate, gear 4 506 will engage with gear 5 603 to drive the screw 604 and the screw tube 602 to rotate together, thereby driving the wiping strip 605 to rotate, and then the wiping cotton 606 can wipe the surface of the silicon ring, so as to achieve the effect of cleaning the polished edge, and the screw 604 can extend from the inside of the screw tube 602 to control the height of the wiping strip 605, so as to facilitate the wiping of silicon rings of different thicknesses.

[0045] like Figure 2 , Figure 3 and Figure 4 As shown, the polishing mechanism 1 includes a mounting plate 101, which is fixedly mounted on the lifting mechanism 4, the lower surface of the mounting plate 101 is rotatably connected to a cylinder 102 via a rotating shaft, the bottom end of the cylinder 102 is fixedly connected to a mounting frame 103, the upper surface of the mounting frame 103 is provided with two through-type slide grooves 104, the opposite sides of the two slide grooves 104 are integrally formed with contraction grooves 105, the inside of the contraction groove 105 is slidably connected to a sliding plate 106, the opposite sides of the two sliding plates 106 are located on the inner sides of the two slide grooves 104 and are fixedly connected to shaft sleeves 107, the inner side of the shaft sleeve 107 is rotatably connected to a shaft column 108 via a rotating shaft, the bottom ends of the two shaft columns 108 are respectively fixedly connected to a fine grinding head 109 and a coarse grinding head 110, and the top of the shaft column 108 is fixedly connected to a gear 111;

[0046] A second slide groove 112 is provided on the upper surface of the mounting plate 101, and two slide bars 113 are fixedly connected inside the second slide groove 112, and an L-shaped bracket 114 is slidably connected to the outer side walls of the two slide bars 113, and a motor 115 is fixedly connected to the inner side of the L-shaped bracket 114, and a gear 2 116 is fixedly connected to the bottom end of the output shaft of the motor 115;

[0047] The upper surface of the mounting plate 101 is fixedly connected with an electric push rod 117, the bottom end of the output end of the electric push rod 117 penetrates the bottom of the mounting plate 101, and is fixedly connected with a toggle column 118. The outer wall of the cylinder 102 is provided with a spiral groove 119, and the rear end of the toggle column 118 extends to the inside of the spiral groove 119 and is slidably connected with the spiral groove 119;

[0048] A spring 120 is fixedly connected between the slide slot 104 and the sliding plate 106;

[0049] The outer side wall of the output shaft of the motor 115 is fixedly connected with a cam 121, the upper surface of the cam 121 is provided with a connecting ring groove 122, the inner part of the connecting ring groove 122 is slidably connected with a connecting column 123, and an L-shaped support rod 124 is fixedly connected between the top of the connecting column 123 and the upper surface of the mounting plate 101;

[0050] During grinding, the motor 115 is started to control the gear 2 116 to rotate, and the electric push rod 117 can be controlled to extend or retract. At this time, the mounting frame 103 at the bottom of the cylinder 102 is driven to rotate by driving the column 118 and the spiral groove 119, so as to control the gear 1 111 of the rough grinding head 110 or the gear 1 111 at the bottom of the fine grinding head 109 to mesh with the gear 2 116, so that the fine grinding head 109 or the rough grinding head 110 can be controlled to rotate and grind separately;

[0051] When the motor 115 is started and controls the fine grinding head 109 or the rough grinding head 110 to rotate and grind, the cam 121 can repeatedly squeeze and push the motor 115 to move left and right repeatedly during the rotation process. At this time, under the push of the spring 120, the gear 2 116 and the gear 1 111 can always be in a meshing state. At the same time, the gear 111 meshing with the gear 2 116 is pushed to move left and right repeatedly, thereby driving the rough grinding head 110 or the fine grinding head 109 to move left and right repeatedly, thereby increasing the grinding range.

[0052] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the present invention. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A fully automatic mirror polishing device for a silicon ring, comprising a polishing mechanism (1), characterized in that: A bottom plate (2) is provided below the polishing mechanism (1), and a vertical plate (3) is fixedly connected to the right side of the upper surface of the bottom plate (2); A lifting mechanism (4) is provided on the left side of the vertical plate (3); A placement mechanism (5) is provided on the left side of the upper surface of the bottom plate (2); A cleaning mechanism (6) is provided on the left side of the bottom plate (2); The polishing mechanism (1) comprises a mounting plate (101), wherein the mounting plate (101) is fixedly mounted on the lifting mechanism (4); the lower surface of the mounting plate (101) is rotatably connected to a cylinder (102) via a rotating shaft; the bottom end of the cylinder (102) is fixedly connected to a mounting frame (103); the upper surface of the mounting frame (103) is provided with two through-type slide grooves (104); the opposite sides of the two slide grooves (104) are integrally formed with contraction grooves (105); The shrinkage groove (105) is slidably connected to a sliding plate (106) inside, and the opposite sides of the two sliding plates (106) are fixedly connected to the inner sides of the two slide grooves (104) with shaft sleeves (107), and the inner side of the shaft sleeve (107) is rotatably connected to a shaft column (108) via a rotating shaft, and the bottom ends of the two shaft columns (108) are respectively fixedly connected to a fine grinding head (109) and a rough grinding head (110), and the top end of the shaft column (108) is fixedly connected to a gear (111); The upper surface of the mounting plate (101) is provided with a second slide groove (112), the interior of the second slide groove (112) is fixedly connected with two slide bars (113), the outer side walls of the two slide bars (113) are slidably connected with an L-shaped bracket (114), the inner side of the L-shaped bracket (114) is fixedly connected with a motor 1 (115), and the bottom end of the output shaft of the motor 1 (115) is fixedly connected with a gear 2 (116); An electric push rod 1 (117) is fixedly connected to the upper surface of the mounting plate (101); the bottom end of the output end of the electric push rod 1 (117) passes through the bottom of the mounting plate (101) and is fixedly connected to a toggle column (118); a spiral groove (119) is formed on the outer wall of the cylinder (102); a rear end of the toggle column (118) extends into the interior of the spiral groove (119) and is slidably connected to the spiral groove (119); A spring (120) is fixedly connected between the first slide groove (104) and the slide plate (106); A cam (121) is fixedly connected to the outer side wall of the output shaft of the motor 1 (115); a connecting ring groove (122) is provided on the upper surface of the cam (121); a connecting column (123) is slidably connected inside the connecting ring groove (122); an L-shaped support rod (124) is fixedly connected between the top end of the connecting column (123) and the upper surface of the mounting plate (101); The placement mechanism (5) comprises an adsorption plate (501), the lower surface of the adsorption plate (501) is fixedly connected to a vacuum pump (502), the lower surface of the placement mechanism (5) is fixedly connected to a shaft (503), the lower surface of the shaft (503) is rotatably connected to the upper surface of the bottom plate (2) via a rotating shaft, the outer side wall of the shaft (503) is fixedly connected to a gear three (504), the upper surface of the bottom plate (2) is located on the left side of the shaft (503) and is fixedly connected to a motor two (505), the top end of the output shaft of the motor two (505) is fixedly connected to a gear four (506), and the gear four (506) is meshingly connected to the gear three (504); The cleaning mechanism (6) comprises a fixed head (601), the upper surface of the fixed head (601) is rotatably connected to a screw tube (602) via a rotating shaft, the outer wall of the screw tube (602) is fixedly connected to a gear five (603), the gear five (603) is meshingly connected to the gear four (506), the inner thread of the screw tube (602) is connected to a screw rod (604), the outer wall of the screw rod (604) is fixedly connected to a wiping strip (605), and the lower surface of the wiping strip (605) is detachably mounted with a wiping cotton (606).

2. The fully automatic mirror polishing device for a silicon ring according to claim 1, characterized in that: The lifting mechanism (4) comprises a fixing bar (401), the upper surface of which is fixedly connected to a second electric push rod (402), the bottom end of the output end of the second electric push rod (402) passes through the bottom of the fixing bar (401) and is fixedly connected to a lifting bar (403), the left side of the lifting bar (403) is fixedly connected to the right side of the mounting plate (101), and the right side of the fixing bar (401) is fixedly connected to the left side of the vertical plate (3).

3. The fully automatic mirror polishing device for a silicon ring according to claim 2, characterized in that: Two vertical rods (404) are fixedly connected to the lower surface of the fixing bar (401), and the bottom ends of the vertical rods (404) penetrate the lifting bar (403) and are slidably connected to the lifting bar (403).

4. The fully automatic mirror polishing device for a silicon ring according to claim 1, characterized in that: A material guide seat (7) is provided on the outer side wall of the adsorption disk (501), and a connecting seat (8) is fixedly connected between the material guide seat (7) and the bottom plate (2).

Citation Information

Patent Citations

  • Polishing and thinning device for monocrystalline silicon ring

    CN221792005U

  • End face treatment device for air inlet valve manufacturing

    CN111843667A

  • Thermal printing sheet ceramic substrate pretreatment equipment and treatment method thereof

    CN117245550A