Molding and assembling method of airborne electronic pod

Abstract

The invention provides a molding and assembling method of an airborne electronic pod. The molding and assembling method comprises the following steps: 1, molding and assembling the airborne electronic pod; radome forming: adopting a skin honeycomb sandwich structure, and obtaining the radome through hot-pressing curing forming; shell forming: adopting a skin honeycomb sandwich structure, pre-embedding precast blocks in a local area, and performing hot-pressing curing forming to obtain a shell; and forming the electronic pod: positioning by using a tool through a molded surface and a hole site, and gluing and riveting the shell and the antenna housing to obtain the electronic pod. In addition, the invention further discloses the airborne light-weight electronic pod, and the airborne light-weight electronic pod is prepared by adopting the molding method. The airborne light-weight electronic pod is light in weight and good in consistency, and the manufacturing method of the airborne light-weight electronic pod is simple and convenient.

Description

Technical Field

[0001] The present invention belongs to the technical field of airborne electronic pod production, and specifically relates to a molding and assembly method of an airborne electronic pod, and more particularly to a molding and assembly method of an airborne lightweight electronic pod. Background Art

[0002] Electronic pods are an important part of weapons and equipment, and are important military supplies that play a role in electronic reconnaissance and interference in war. Electronic pods have the characteristics of a wide variety, light weight, wave transmission and load bearing. In recent years, the development of electronic and radar technology has made great progress, and more requirements have been put forward for electronic pods, such as light weight, serialization, and low cost.

[0003] Patent document CN116534266B discloses an airborne high-rigidity and lightweight electronic pod body and assembly method. Its technical solution is: an airborne high-rigidity and lightweight electronic pod body, including an upper beam, a lower beam, a side cover connected between the upper beam and the lower beam, a plurality of frames connected between the upper beam and the lower beam, and a lug assembly connected to the upper beam; the main bodies of the upper beam and the lower beam are thin-walled, and the thin walls are provided with a plurality of transversely arranged and longitudinally arranged reinforcing ribs, the upper beam is provided with a thickened reinforcement area, and the lug assembly is connected to the reinforcement area of ​​the upper beam; the main body of the frame is a thin plate, and flanges are provided around the thin plate. However, the focus of patent document CN116534266B does not involve materials.

[0004] In the prior art, electronic pods made of a variety of materials have emerged. Currently, the main molding methods for electronic pods are RTM, vacuum injection molding, and autoclave molding. However, the electronic pods obtained by RTM or vacuum injection molding are heavy and have poor consistency, while the cost of autoclave molding is high.

[0005] Based on this, it is desired to obtain a molding and assembly method of an airborne lightweight electronic pod, wherein the airborne lightweight electronic pod has light weight, good consistency, and low production cost. Summary of the invention

[0006] In view of the defects in the prior art, an object of the present invention is to provide a forming and assembling method of an airborne electronic pod.

[0007] A forming and assembling method of an airborne electronic pod provided by the present invention comprises:

[0008] Radome forming steps: using a skin honeycomb sandwich structure, and obtaining the radome through hot pressing and curing;

[0009] Shell forming steps: using a skin honeycomb sandwich structure, using prefabricated blocks to embed local areas, placing stiffener prefabricated parts in the layer structure of the box body, and obtaining a shell including stiffener prefabricated blocks through hot pressing and curing;

[0010] Electronic pod molding: Use tooling to locate the mold surface and holes, and glue and rivet the shell and antenna cover to obtain the electronic pod.

[0011] Preferably, the reinforcing rib preform is made by hot pressing high-strength glass fiber fabric prepreg.

[0012] Preferably, in the radome forming step, layering is performed;

[0013] When laying the layers, for the wave-transmitting area, the laying sequence is as follows: multi-layers of high-strength glass fiber fabric prepreg are used as the inner skin, followed by pre-pressing;

[0014] After pre-pressing, a bulk resin film is placed on the inner skin as an inner film;

[0015] Aramid paper honeycomb is placed on the inner film as a core material; and a bulk resin film is placed on the aramid paper honeycomb as an outer film;

[0016] Finally, multiple layers of high-strength glass fiber fabric prepreg are laid on the inner adhesive film as the outer skin.

[0017] Preferably, for the connection between the antenna cover and the shell, the ply laying sequence is: multiple layers of high-strength glass fiber fabric prepreg as an inner skin, multiple layers of high-strength glass fiber fabric prepreg, and multiple layers of high-strength glass fiber fabric prepreg as an outer skin.

[0018] Preferably, in the shell forming step, layering is performed;

[0019] When laying the layers, the laying order is: three layers of high-strength glass fiber fabric prepreg are used as the inner skin, followed by pre-pressing; after pre-pressing, the bulk resin film is placed on the inner skin as the inner film; aramid paper honeycomb is placed on the inner film as the core material; the bulk resin film is placed on the aramid paper honeycomb as the outer film; finally, multiple layers of high-strength glass fiber fabric prepreg are laid on the outer film as the outer skin.

[0020] Preferably, for the connection between the shell and the antenna cover, the ply laying sequence is: multiple layers of high-strength glass fiber fabric prepreg as an inner skin, multiple layers of high-strength glass fiber fabric prepreg, and multiple layers of high-strength glass fiber fabric prepreg as an outer skin.

[0021] Preferably, for the reinforcement part, the ply laying sequence is: multiple layers of high-strength glass fiber fabric prepreg as the inner skin, body film, high-strength glass fiber preform, body film, and multiple layers of high-strength glass fiber fabric prepreg as the outer skin.

[0022] Preferably, in the electronic pod forming step, assembly is performed;

[0023] During assembly, the assembly sequence is as follows: rivet the support plate nuts at the holes of the aluminum alloy docking frame; use tooling and pin screws to glue the aluminum alloy docking frame to both ends of the shell, and then rivet to strengthen; use tooling and pin screws to glue the aluminum alloy docking frame to the end of the antenna cover, and then rivet to strengthen; use tooling and pin screws to position the shell, and use hexagonal screws at both ends of the shell to install the antenna cover through the aluminum alloy docking frame.

[0024] Preferably, the antenna cover and the shell mold are both in the form of a male mold.

[0025] An airborne electronic pod provided by the present invention is manufactured by adopting the molding and assembling method of the airborne electronic pod.

[0026] Compared with the prior art, the present invention has the following beneficial effects:

[0027] 1. The present invention adopts prepreg molding, and the product weight deviation is controlled to ±1%;

[0028] 2. The present invention uses lightweight and high-strength aramid paper honeycomb as the filler, which is easier to lay in a contour and facilitates the lamination of the prepreg and the core material during the molding process;

[0029] 3. The present invention uses pre-set blocks of high-strength glass fiber as reinforcing ribs, which can ensure higher mechanical working conditions and is easy to shape;

[0030] 4. The present invention adopts prepreg, bulk film, honeycomb core material, bulk film, and prepreg co-curing molding, which can effectively ensure the structural property of the product, has good wave transmission and structural strength, simple molding process, low cost and good quality consistency;

[0031] 5. Compared with the existing technology of autoclave molding, the present invention has low cost; and compared with RTM or vacuum injection molding, it has light weight and good consistency. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Other features, objects and advantages of the present invention will become more apparent from the detailed description of non-limiting embodiments made with reference to the following drawings:

[0033] Figure 1 This is a schematic diagram of the structure of the airborne lightweight electronic pod described in Example 1;

[0034] Figure 2 This is a schematic structural diagram of the radome forming mold for the airborne lightweight electronic pod described in Example 1;

[0035] Figure 3 This is a schematic structural diagram of the shell forming mold of the airborne lightweight electronic pod described in Example 1;

[0036] Figure 4 It is a structural schematic diagram of the gluing assembly tooling of the airborne lightweight electronic pod described in Example 1;

[0037] The figure shows:

[0038] Radome 1;

[0039] Shell 2. DETAILED DESCRIPTION

[0040] The present invention is described in detail below in conjunction with specific embodiments. The following embodiments will help those skilled in the art to further understand the present invention, but are not intended to limit the present invention in any form. It should be noted that, for those of ordinary skill in the art, several changes and improvements can also be made without departing from the concept of the present invention. These all belong to the protection scope of the present invention.

[0041] The purpose of the present invention is to provide a molding and assembly method for an airborne lightweight electronic pod, which is molded by prepreg, uses lightweight and high-strength glass fiber as the skin and aramid paper honeycomb with excellent wave transmission as the core material, so that the weight deviation of the airborne lightweight electronic pod product finally prepared in this case is controlled to reach ±1%, and it has light weight, strong protection, and a wide electromagnetic frequency band applicability.

[0042] In this embodiment 1, the airborne lightweight electronic pod is formed by the following steps, which include:

[0043] Radome molding: The radome is obtained by using a skin honeycomb sandwich structure and hot pressing and curing molding;

[0044] Shell molding: adopt skin honeycomb sandwich structure, local areas are embedded with prefabricated blocks, and the prefabricated reinforcement parts are placed in the layer structure of the box body. The shell containing the prefabricated reinforcement blocks is obtained by hot pressing and curing; wherein, the prefabricated reinforcement parts are made by hot pressing of high-strength glass fiber fabric prepreg; in the present invention, the prefabricated reinforcement blocks obtained by hot pressing of high-strength glass fiber fabric prepreg have higher specific strength and wave transmission efficiency than the traditional 3240 epoxy board. Therefore, the parts of the airborne lightweight electronic pod of the present invention are lighter in weight and more functional, and are very suitable for the production of high-demand electronic pods, while other processes have no advantages in this regard.

[0045] Electronic pod molding: The radome and the shell are combined to obtain an airborne lightweight electronic pod, wherein the electronic pod is obtained by gluing and riveting the shell and the radome through the mold surface and hole positioning using tooling.

[0046] Compared with traditional autoclave molding and RTM, the present invention obtains an electronic pod with better performance. Moreover, compared with traditional autoclave process and RTM process, the molding method provided by the present invention is more convenient to operate and implement, does not require the use of autoclave equipment, and has a simple mold and low cost.

[0047] The forming of the radome specifically includes the following steps:

[0048] Step A1: Preparation of radome materials;

[0049] Step B1: Laying of the radome;

[0050] Step C1: curing, wherein the curing process is kept vacuumed throughout, and the vacuum degree is ≥95%; when the temperature is increased from room temperature to 85°C, the heating rate is 1-3°C / min, and then the temperature is kept at 85°C for 30 minutes; from 85°C to 135°C, the heating rate is 1-3°C / min, and the temperature is kept at 135°C for 3 hours;

[0051] Step D1: Demolding.

[0052] In the step A1, the radome raw materials include: high-strength glass fiber fabric prepreg, aramid paper honeycomb core and body resin film.

[0053] In the step B1, when laying the layers, for the wave-transparent area, the laying order is as follows: three layers of high-strength glass fiber fabric prepreg are used as the inner skin, followed by pre-pressing; after pre-pressing, a bulk resin film is placed on the inner skin as the inner film; an aramid paper honeycomb is placed on the inner film as the core material; a bulk resin film is placed on the aramid paper honeycomb as the outer film; and finally, two layers of high-strength glass fiber fabric prepreg are laid on the inner film as the outer skin.

[0054] For the connection between the antenna cover and the shell, the ply laying sequence is: three layers of high-strength glass fiber fabric prepreg as the inner skin, 24 layers of high-strength glass fiber fabric prepreg with a width of 20mm, and three layers of high-strength glass fiber fabric prepreg as the outer skin.

[0055] In the step D1, after the furnace temperature drops to 60° C., the product is taken out of the furnace and demoulded.

[0056] The molding of the shell specifically includes the following steps:

[0057] Step A2: preparing shell raw materials;

[0058] Step B2: Shell laying;

[0059] Step C2: curing, wherein the curing process is kept vacuumed throughout, and the vacuum degree is ≥95%; when the temperature is increased from room temperature to 85°C, the heating rate is 1-3°C / min, and then the temperature is kept at 85°C for 30 minutes; the temperature is increased from 85°C to 135°C, the heating rate is 1-3°C / min, and the temperature is kept at 135°C for 3 hours;

[0060] Step D2: Demolding.

[0061] In step A2, the shell material includes high-strength glass fiber fabric prepreg, aramid paper honeycomb core and body resin film.

[0062] In the step B2, when laying the layers, the laying order is as follows: the laying order is as follows: three layers of high-strength glass fiber fabric prepreg are used as the inner skin, followed by pre-pressing; after pre-pressing, a bulk resin film is placed on the inner skin as the inner film; an aramid paper honeycomb is placed on the inner film as the core material; a bulk resin film is placed on the aramid paper honeycomb as the outer film; and finally, two layers of high-strength glass fiber fabric prepreg are laid on the outer film as the outer skin.

[0063] For the connection between the shell and the antenna cover, the ply laying sequence is: three layers of high-strength glass fiber fabric prepreg as the inner skin, 24 layers of high-strength glass fiber fabric prepreg with a width of 20mm, and three layers of high-strength glass fiber fabric prepreg as the outer skin.

[0064] For the reinforcement part, the laying order is: three layers of high-strength glass fiber fabric prepreg as the inner skin, body film, 4.5mm thick high-strength glass fiber preform, body film, and three layers of high-strength glass fiber fabric prepreg as the outer skin.

[0065] The electronic pod forming process specifically includes the following steps:

[0066] Step A3: Preparation of electronic pod components;

[0067] Step B3: Gluing and assembling the electronic pod;

[0068] Step C3: Curing, using room temperature epoxy adhesive, curing and bonding at room temperature for 24 hours;

[0069] Step D4: demoulding.

[0070] In step A3, the electronic pod assembly includes 90° countersunk rivets, adhesive, antenna cover, shell, aluminum alloy docking frame, hexagonal screws, and support plate nuts.

[0071] In step B3, during assembly, the assembly sequence is as follows: riveting the support plate nuts at the holes of the aluminum alloy docking frame; gluing the aluminum alloy docking frame to the two ends of the shell using tooling and pin screws, and then riveting to strengthen; gluing the aluminum alloy docking frame to the end of the antenna cover using tooling and pin screws, and then riveting to strengthen; positioning the shell using tooling and pin screws, and installing the antenna cover through the aluminum alloy docking frame at both ends of the shell using hexagonal screws.

[0072] The present invention will be described in more detail below.

[0073] In the preferred example, the antenna cover and the shell mold in the present invention are both male molds, which ensure the inner cavity size of the electronic pod, and are conducive to reducing the impact of irregular inner cavity on the wave transmission of electronic equipment. In addition, compared with the electronic pod using the prior art, the present invention uses aramid paper honeycomb as the internal core material, so it is lighter and has better wave transmission.

[0074] The present invention also provides an airborne lightweight electronic pod, which is overall lightweight and high-strength, has good wave transmittance and good consistency, and is very suitable for use in an electronic pod.

[0075] In the description of the present application, it should be understood that the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0076] The above describes the specific embodiments of the present invention. It should be understood that the present invention is not limited to the above specific embodiments, and those skilled in the art can make various changes or modifications within the scope of the claims, which does not affect the essence of the present invention. In the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other arbitrarily.

Claims

1. A method for forming and assembling an airborne electronic pod, characterized in that: include: Radome forming steps: using a skin honeycomb sandwich structure, and obtaining the radome through hot pressing and curing; Shell forming steps: using a skin honeycomb sandwich structure, using prefabricated blocks to embed local areas, placing stiffener prefabricated parts in the layer structure of the box body, and obtaining a shell including stiffener prefabricated blocks through hot pressing and curing; Electronic pod molding: Use tooling to locate the mold surface and holes, and glue and rivet the shell and antenna cover to obtain the electronic pod.

2. The forming and assembling method of the airborne electronic pod according to claim 1, characterized in that: The reinforcing rib prefabricated part is made by hot pressing high-strength glass fiber fabric prepreg.

3. The forming and assembling method of the airborne electronic pod according to claim 2, characterized in that: In the radome forming step, layering is performed; When laying the layers, for the wave-transparent area, the laying sequence is as follows: multi-layers of high-strength glass fiber fabric prepreg are used as the inner skin, followed by pre-pressing; After pre-pressing, a bulk resin film is placed on the inner skin as an inner film; Aramid paper honeycomb is placed on the inner film as a core material; and a bulk resin film is placed on the aramid paper honeycomb as an outer film; Finally, multiple layers of high-strength glass fiber fabric prepreg are laid on the inner adhesive film as the outer skin.

4. The forming and assembling method of the airborne electronic pod according to claim 3, characterized in that: For the connection between the antenna cover and the shell, the ply laying sequence is: multiple layers of high-strength glass fiber fabric prepreg as an inner skin, multiple layers of high-strength glass fiber fabric prepreg, and multiple layers of high-strength glass fiber fabric prepreg as an outer skin.

5. The forming and assembling method of the airborne electronic pod according to claim 1, characterized in that: In the shell forming step, layering is performed; When laying the layers, the laying order is: three layers of high-strength glass fiber fabric prepreg are used as the inner skin, followed by pre-pressing; after pre-pressing, the bulk resin film is placed on the inner skin as the inner film; aramid paper honeycomb is placed on the inner film as the core material; the bulk resin film is placed on the aramid paper honeycomb as the outer film; finally, multiple layers of high-strength glass fiber fabric prepreg are laid on the outer film as the outer skin.

6. The forming and assembling method of the airborne electronic pod according to claim 5, characterized in that: For the connection between the shell and the antenna cover, the ply laying sequence is: multiple layers of high-strength glass fiber fabric prepreg as an inner skin, multiple layers of high-strength glass fiber fabric prepreg, and multiple layers of high-strength glass fiber fabric prepreg as an outer skin.

7. The forming and assembling method of the airborne electronic pod according to claim 6, characterized in that: For the reinforcement part, the ply laying sequence is: multiple layers of high-strength glass fiber fabric prepreg as the inner skin, body film, high-strength glass fiber preform, body film, and multiple layers of high-strength glass fiber fabric prepreg as the outer skin.

8. The forming and assembling method of the airborne electronic pod according to claim 1, characterized in that: In the electronic pod forming step, assembling is performed; When assembling, the assembly sequence is: Rivet the support plate nuts at the holes of the aluminum alloy docking frame; use the tooling and pin screws to glue the aluminum alloy docking frame to the two ends of the shell, and then rivet it to strengthen it; use the tooling and pin screws to glue the aluminum alloy docking frame to the end of the antenna cover, and then rivet it to strengthen it; use the tooling and pin screws to position the shell, and use hexagonal screws at both ends of the shell to install the antenna cover through the aluminum alloy docking frame.

9. The forming and assembling method of the airborne electronic pod according to claim 1, characterized in that: The antenna cover and shell molds are both male molds.

10. An airborne electronic pod, characterized in that: The airborne electronic pod is manufactured by the molding and assembly method according to any one of claims 1 to 9.

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