A detection device and detection method

Abstract

This invention relates to the field of printing equipment technology, and specifically discloses a detection device and method, including a conveying assembly for conveying a board to be tested to a detection position along a first direction; a first baffle disposed on one side of the conveying assembly; a first photoelectric sensor disposed on the side of the first baffle near the board to be tested, and positioned above the detection position; a second baffle disposed on the other side of the conveying assembly; a second photoelectric sensor disposed on the side of the second baffle near the board to be tested, and positioned above the detection position, the second photoelectric sensor and the first photoelectric sensor being arranged opposite to and spaced apart along a second direction; and a control assembly, which includes a first alarm system that issues an alarm when at least one of the first and second photoelectric sensors detects the board to be tested. Through this method, this invention can detect angular deflection during the transport of a PCB board.

Description

Technical Field

[0001] This invention relates to the field of printing equipment technology, and in particular to a testing device and testing method. Background Technology

[0002] In related technologies, the process of text printing (marking text, logos, serial numbers, trademarks, etc. on PCB boards) requires transporting the PCB board to the printing station for clamping before printing. To ensure that printing is performed at the preset position on the PCB board, the length and width of the transported PCB board must match the length and width of the clamping station.

[0003] In the process of realizing this invention, the inventors discovered that during the transportation of PCB boards, due to the influence of the board loading machine or human factors, the PCB boards are prone to angle changes during transportation, and the length and width of the PCB boards are prone to interchange. This can easily cause the PCB boards to be unable to be clamped when transported to the next process, resulting in board collision losses and affecting printing efficiency. Summary of the Invention

[0004] In view of the above problems, embodiments of the present invention provide a detection device and a detection method that overcome the above problems or at least partially solve the above problems.

[0005] According to one aspect of the present invention, a detection device is provided, comprising a conveying assembly for conveying a plate to be detected to a detection position along a first direction; a first baffle disposed on one side of the conveying assembly; a first photoelectric sensor disposed on the side of the first baffle near the plate to be detected, the first photoelectric sensor being located above the detection position in a vertical direction, the detection direction of the first photoelectric sensor facing the detection position; a second baffle disposed on the other side of the conveying assembly, the second baffle being disposed opposite to the first baffle along a second direction, the first baffle and the second baffle moving synchronously, and the first baffle and the second baffle being able to approach or move away from each other along the second direction; and a second photoelectric sensor disposed on the side of the conveying assembly. The second baffle is located near the side of the plate to be tested. The second photoelectric sensor is positioned above the detection position in the vertical direction. The second photoelectric sensor and the first photoelectric sensor are positioned opposite each other and spaced apart in the second direction. The distance between the first photoelectric sensor and the second photoelectric sensor in the second direction is greater than or equal to the width of the plate to be tested. The second direction is perpendicular to the first direction and the vertical direction. A control component is connected to the conveying component, the first photoelectric sensor, and the second photoelectric sensor. The control component is equipped with a first alarm system. When at least one of the first photoelectric sensor and the second photoelectric sensor detects the plate to be tested, the first alarm system issues an alarm.

[0006] In one alternative embodiment, the first baffle and the second baffle are connected by a transmission assembly, the first baffle and the second baffle move synchronously, and the first baffle and the second baffle can move closer to each other or away from each other along the second direction; the initial interval between the first baffle and the second baffle along the second direction is S, the displacement of the first photoelectric sensor to the plate to be tested along the second direction is d1, the displacement of the second photoelectric sensor to the plate to be tested along the second direction is d2, the distance of the first photoelectric sensor to the first baffle along the second direction and the distance of the second photoelectric sensor to the second baffle along the second direction are both d, and the detection width of the plate to be tested along the second direction is H, when d1=d2, H=S-(d1+d2)-2d.

[0007] In one alternative approach, when |d1-d2|<d, the plate to be tested is not in contact with the first baffle or the second baffle, and H=S-(d1+d2)-2d.

[0008] In one alternative approach, when d1-d2≥d and the plate to be tested contacts the second baffle, H=S-2×d1-d.

[0009] In one alternative approach, when d2-d1≥d and the plate to be tested contacts the first baffle, H=S-2×d2-d.

[0010] In one alternative embodiment, the control component includes a second alarm system; the actual width of the board to be detected is h, and when |Hh|≤δ, the second alarm system does not issue an alarm, and when |Hh|>δ, the second alarm system issues an alarm.

[0011] According to another aspect of the present invention, a detection method using the detection device described above is provided, comprising the following steps: S1: the initial interval between the first baffle and the second baffle along the second direction is S; S2: the conveying assembly conveys the board to be detected to the detection position; S3: a first photoelectric sensor located on the first baffle and a second photoelectric sensor located on the second baffle detect the board to be detected at the detection position; S4: confirming whether the first photoelectric sensor and / or the second photoelectric sensor detect the board to be detected; if yes, the control assembly issues an alarm; if no, the control assembly does not issue an alarm.

[0012] In an optional embodiment, the detection method further includes the following step: S5: When the first photoelectric sensor and / or the second photoelectric sensor fail to detect the board to be detected, and the control component does not issue an alarm, the first baffle and the second baffle move synchronously. The first baffle drives the first photoelectric sensor to move towards the board to be detected, and the displacement of the first photoelectric sensor along the second direction to the board to be detected is d1. The second baffle drives the second photoelectric sensor to move towards the board to be detected, and the displacement of the second photoelectric sensor along the second direction to the board to be detected is d2. The distance of the first photoelectric sensor along the second direction to the first baffle and the distance of the second photoelectric sensor along the second direction to the second baffle are both d.

[0013] In an optional embodiment, the detection method includes the following steps: S6: If d1=d2, the first photoelectric sensor and the second photoelectric sensor simultaneously detect the plate to be detected, then H=S-(d1+d2)-2d; if |d1-d2|<d, then H=S-(d1+d2)-2d; if d1-d2≥d, the plate to be detected contacts the second baffle first, and then contacts the first baffle, then H=S-2×d1-d; if d2-d1≥d, the plate to be detected contacts the first baffle first, and then contacts the second baffle, then H=S-2×d2-d.

[0014] In one optional embodiment, the detection method includes the following steps: S7: The detection width of the board to be detected along the second direction is H, and the actual width of the board to be detected is h. If |Hh|≤δ, the control component does not issue an alarm; if |Hh|>δ, the control component issues an alarm.

[0015] The beneficial effects of the embodiments of the present invention are as follows: Unlike the prior art, the embodiments of the present invention are provided with a conveying component, a first baffle, a second baffle, a first photoelectric sensor, a second photoelectric sensor, and a control component. The conveying assembly is used to convey the plate to be tested to the testing position along a first direction. A first baffle is disposed on one side of the conveying assembly, and a second baffle is disposed on the other side of the conveying assembly. The second baffle and the first baffle are disposed opposite to each other along a second direction. The first baffle and the second baffle move synchronously and can move closer to each other or further away from each other along the second direction. A first photoelectric sensor is disposed on the side of the first baffle near the plate to be tested, and the first photoelectric sensor is located above the testing position in the vertical direction, with its detection direction facing the testing position. A second photoelectric sensor is disposed on the side of the second baffle near the plate to be tested, and the second photoelectric sensor is located above the testing position in the vertical direction. The second photoelectric sensor and the first photoelectric sensor are disposed opposite to each other and spaced apart along the second direction. The distance between the first photoelectric sensor and the second photoelectric sensor along the second direction is greater than the width of the plate to be tested. A control assembly is connected to the first photoelectric sensor and the second photoelectric sensor. The control assembly is equipped with a first alarm system. When at least one of the first photoelectric sensor and the second photoelectric sensor detects the plate to be tested... During board testing, the first alarm system issues an alarm. This setup allows the first and second photoelectric sensors, located on opposite sides of the PCB board along the second direction, to detect the board at the detection position as the conveying assembly transports the PCB board along the first direction to the detection position. Since the distance between the first and second photoelectric sensors along the second direction is greater than or equal to the width of the PCB board, and less than the length of the PCB board, under normal circumstances, the PCB board will not be detected by the first and second photoelectric sensors along the second direction when it is at the detection position. However, if the PCB board changes angle, or in severe cases, the length and width of the PCB board are interchanged, at least one of the first and second photoelectric sensors will detect the PCB board, and the first alarm system in the control assembly will issue an alarm. The user can then adjust the PCB board's angle or remove the PCB board for re-transport based on the alarm prompt, thereby reducing the risk of board collisions during transport and improving printing efficiency. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in specific embodiments of the present invention or the prior art, the accompanying drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.

[0017] Figure 1 This is a partial structural diagram of the detection device according to an embodiment of the present invention;

[0018] Figure 2 This is a schematic diagram of a partial structure—a conveying state—of the detection device according to an embodiment of the present invention;

[0019] Figure 3 This is a schematic diagram of another conveying state of part of the structure of the detection device in an embodiment of the present invention.

[0020] Figure 4 This is a schematic flowchart of the detection method according to an embodiment of the present invention;

[0021] Figure 5 This is a schematic flowchart of an embodiment of the detection method of the present invention;

[0022] Figure 6 This is a flowchart illustrating another embodiment of the detection method of the present invention;

[0023] Figure 7 This is a flowchart illustrating another embodiment of the detection method of the present invention. Detailed Implementation

[0024] To facilitate understanding of the present invention, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as being "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as being "connected to" another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this specification are for illustrative purposes only.

[0025] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the invention. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.

[0026] Furthermore, the technical features involved in the different embodiments of this application described below can be combined with each other as long as they do not conflict with each other.

[0027] It should be noted that the board to be tested in this application includes, but is not limited to, PCB boards, thin boards, metal boards, composite material boards, etc. This application takes the application to PCB boards as an example for explanation.

[0028] To better explain the structure of the detection device 1000, the structure of the detection device 1000 will be described in conjunction with the X, Y, and Z axes. The X, Y, and Z axes are perpendicular to each other, with the first direction along the X-axis, the second direction along the Y-axis, and the vertical direction along the Z-axis.

[0029] Please see Figure 1 The detection device 1000 includes a frame, a conveying assembly 10, a first baffle 20, a second baffle 30, a first photoelectric sensor 40, a second photoelectric sensor 50, and a control assembly. The conveying assembly 10 is mounted on a frame and is used to convey the PCB board to be tested to the testing position along the first direction X. A first baffle 20 is mounted on one side of the conveying assembly 10, and a second baffle 30 is mounted on the other side of the conveying assembly 10. The second baffle 30 and the first baffle 20 are arranged opposite each other along the second direction Y. A first photoelectric sensor 40 is mounted on the side of the first baffle 20 near the PCB board to be tested. The first photoelectric sensor 40 is located above the testing position along the vertical direction Z, and the detection direction of the first photoelectric sensor 40 faces the testing position. A second photoelectric sensor 50 is mounted on the side of the second baffle 30 near the PCB board to be tested. The second photoelectric sensor 50 is located above the testing position along the vertical direction Z. The second photoelectric sensor 50 and the first photoelectric sensor 40 are arranged opposite each other and spaced apart along the second direction Y. A control assembly is connected to the first photoelectric sensor 40 and the second photoelectric sensor 50 and can be used to control the first photoelectric sensor 40 and the second photoelectric sensor 50. The following provides a detailed description of the frame, conveyor assembly 10, first baffle 20, second baffle 30, first photoelectric sensor 40, second photoelectric sensor 50, and control assembly. It is understood that the connection methods between the control assembly and the first photoelectric sensor 40 and the second photoelectric sensor 50 include, but are not limited to, electrical connection, wireless communication connection, and wired communication connection.

[0030] It should be noted that the first baffle 20, the second baffle 30, the first photoelectric sensor 40, and the second photoelectric sensor 50 are controlled by the same control system, while the conveying component 10 can be controlled by a separate control system. This arrangement can reduce the mutual interference between the conveying component 10 and the first baffle 20, the second baffle 30, the first photoelectric sensor 40, and the second photoelectric sensor 50.

[0031] Regarding the aforementioned conveying assembly 10 and frame (not shown in the figure), as Figure 1 As shown, the conveying assembly 10 is mounted on the frame and is used to convey the PCB board to be inspected to the inspection position along the first direction X. The conveying assembly 10 includes a belt (not shown), a first pulley (not shown), a second pulley (not shown), and a drive motor (not shown). The first and second pulleys are rotatably connected to the frame. The belt is fitted onto the first and second pulleys. The output end of the drive motor is connected to the first pulley. The rotation of the drive motor drives the rotation of the first and second pulleys, thereby rotating the belt. The PCB board to be inspected, located on the belt, moves along the first direction X. The user can control the displacement of the PCB board along the first direction X according to the number of rotations of the drive motor. It is understood that the inspection position can be located at a certain position on the belt or at a certain inspection platform outside the belt. In this application, the inspection position is located at a certain position on the belt, which the user can select according to actual needs. This application does not impose specific limitations.

[0032] In some embodiments, the conveying assembly 10 consists of two conveyor belts that can be opened and closed. The two conveyor belts can be close to each other or far apart. During normal transport of the PCB board to be tested, the two conveyor belts are in a closed state. After the PCB board to be tested reaches the preset position, the two conveyor belts can be opened to place the PCB board to be tested in the preset position.

[0033] For the first baffle 20 and the second baffle 30 mentioned above, as Figure 1 As shown, the first baffle 20 is disposed on one side of the conveying assembly 10, and the second baffle 30 is disposed on the other side of the conveying assembly 10. The second baffle 30 and the first baffle 20 are disposed opposite each other along the second direction Y. The first baffle 20 and the second baffle 30 can block the PCB board to be tested, which can reduce the possibility of the PCB board to be tested falling off the conveyor belt. It is understood that, for the convenience of testing, the spacing between the first baffle 20 and the second baffle 30 along the second direction Y can be set by the user according to actual needs, and is not specifically limited in this application.

[0034] In some embodiments, the first baffle 20 and the second baffle 30 are connected by a transmission assembly. The first baffle 20 and the second baffle 30 move synchronously, and the first baffle 20 and the second baffle 30 can move closer to each other or away from each other along the second direction Y. This arrangement is to allow for the subsequent calculation of the width of the PCB board to be detected. When the first baffle 20 moves along the second direction Y, it correspondingly drives the first photoelectric sensor 40 to move along the second direction Y. When the second baffle 30 moves along the second direction Y, it correspondingly drives the second photoelectric sensor 50 to move along the second direction Y. When the first baffle 20 and the second baffle 30 move closer to each other along the second direction Y, it correspondingly drives the first photoelectric sensor 40 to move closer to the PCB board to be detected along the second direction Y for detection, and also drives the second photoelectric sensor 50 to move closer to the PCB board to be detected along the second direction Y for detection.

[0035] In some embodiments, the transmission assembly includes a first slider, a second slider, a slide rail, a lead screw, and a motor. The slide rail is mounted on a frame, and both the first and second sliders are slidably mounted on the slide rail. A first baffle 20 is connected to the first slider, and a second baffle 30 is connected to the second slider. The lead screw is threadedly connected to both the first and second sliders. The thread direction between the first slider and the lead screw is opposite to the thread direction between the second slider and the lead screw. The output end of the motor is connected to the lead screw drive. By driving the lead screw to rotate, the first and second sliders can be moved closer to or further away from each other on the slide rail, thereby causing the first baffle 20 and the second baffle 30 to move closer to or further away from each other along the second direction Y. It is understood that, to achieve the principle of the first baffle 20 and the second baffle 30 moving closer to or further away from each other along the second direction Y, the structure of the transmission assembly is not limited to the above and can also be other structures, such as gear and rack combinations.

[0036] Regarding the aforementioned first photoelectric sensor 40, second photoelectric sensor 50, and control component (not shown), as follows: Figure 1 and Figure 2As shown, the first photoelectric sensor 40 is disposed on the side of the first baffle 20 near the PCB board to be tested. The first photoelectric sensor 40 is located above the detection position along the vertical direction Z, and the detection direction of the first photoelectric sensor 40 faces the detection position. The second photoelectric sensor 50 is disposed on the side of the second baffle 30 near the PCB board to be tested. The second photoelectric sensor 50 is located above the detection position along the vertical direction Z. The second photoelectric sensor 50 and the first photoelectric sensor 40 are opposite to and spaced apart along the second direction Y. Both the first photoelectric sensor 40 and the second photoelectric sensor 50 emit detection beams downward to the detection position. The control component receives the detection signals from the first photoelectric sensor 40 and / or the second photoelectric sensor 50. It can be understood that, for the convenience of detection, the spacing between the first photoelectric sensor 40 and the second photoelectric sensor 50 along the second direction Y can be set by the user according to the actual length and width of the PCB board, and is not specifically limited in this application. The actual length of the PCB board refers to the length dimension of the PCB board when its length direction is parallel to the first direction X, and the actual width of the PCB board refers to the width dimension of the PCB board when its width direction is parallel to the second direction Y.

[0037] It should be noted that, in order to detect whether the PCB board under test has changed angle, the distance between the first photoelectric sensor 40 and the second photoelectric sensor 50 along the second direction Y must be greater than or equal to the width of the PCB board under test. Under normal circumstances, when the PCB board under test is in the detection position, the two sides of the PCB board under test along the second direction Y will not be detected by the first photoelectric sensor 40 and the second photoelectric sensor 50. When the PCB board under test changes angle or its length and width are interchanged, it can be detected by the first photoelectric sensor 40 and the second photoelectric sensor 50. When at least one of the first photoelectric sensor 40 and the second photoelectric sensor 50 detects the PCB board under test, the first alarm system in the control component will issue an alarm. The user can adjust the turning angle of the PCB board under test or remove the PCB board under test and re-transport it according to the alarm prompt, thereby reducing the occurrence of collisions during the transport of the PCB board under test and improving printing efficiency.

[0038] In some embodiments, such as Figure 1As shown, in order to calculate the width H of the PCB board to be tested, the initial distance between the first baffle 20 and the second baffle 30 along the second direction Y is S, the displacement of the first photoelectric sensor 40 along the second direction Y to the PCB board to be tested is d1, the displacement of the second photoelectric sensor 50 along the second direction Y to the PCB board to be tested is d2, the distance of the first photoelectric sensor 40 along the second direction Y to the first baffle 20, and the distance of the second photoelectric sensor 50 along the second direction Y to the second baffle 30 are both d. It should be noted that: the distance from the first photoelectric sensor 40 along the second direction Y to the PCB board to be tested refers to the displacement between the first photoelectric sensor 40 and the nearest detection point on the PCB board to be tested along the second direction Y; the distance from the second photoelectric sensor 50 along the second direction Y to the PCB board to be tested refers to the displacement between the second photoelectric sensor 50 and the nearest detection point on the PCB board to be tested along the second direction Y; the distance from the first photoelectric sensor 40 along the second direction Y to the first baffle 20 refers to the distance between the side of the first photoelectric sensor 40 closest to the first baffle 20 and the side of the first baffle 20 closest to the PCB board to be tested along the second direction Y; and the distance from the second photoelectric sensor 50 along the second direction Y to the second baffle 30 refers to the distance between the side of the second photoelectric sensor 50 closest to the second baffle 30 and the side of the second baffle 30 closest to the PCB board to be tested along the second direction Y.

[0039] It should be noted that: because the first baffle 20 and the second baffle 30 move synchronously, i.e., with the same speed and distance, the difference in distance between d1 and d2 is affected by the different positions of the PCB board to be tested on the conveying assembly 10. For example: Please refer to [link / reference needed]. Figure 2 and Figure 3 The PCB board to be tested is closer to the second baffle 30 than the first baffle 20, or the PCB board to be tested is closer to the first baffle 20 than the second baffle 30, etc.

[0040] In some embodiments, when d1=d2, H=S-(d1+d2)-2d. Since the first baffle 20 and the second baffle 30 move synchronously, when d1=d2, it means that the PCB board to be detected is located in the middle position between the first baffle 20 and the second baffle 30. At this time, the first photoelectric sensor 40 and the second photoelectric sensor 50 can detect it at the same time.

[0041] In some embodiments, when |d1-d2|<d, the board to be detected has not contacted the first baffle 20 or the second baffle 30, H=S-(d1+d2)-2d. Since the first baffle 20 and the second baffle 30 move synchronously, when |d1-d2|<d, it means that one of the first photoelectric sensor 40 and the second photoelectric sensor 50 detects the PCB board to be detected first, and the other detects the PCB board to be detected later. Since the distance between their trigger intervals is less than d, it means that the first photoelectric sensor 40 and the second photoelectric sensor 50 have completed the detection before the PCB board to be detected has contacted the first baffle 20 or the second baffle 30.

[0042] In some embodiments, when d1-d2≥d and the board to be tested contacts the second baffle 30, H=S-2×d1-d. Since the first baffle 20 and the second baffle 30 move synchronously, when d1-d2≥d, it indicates that the PCB board to be tested is closer to the second baffle 30 relative to the first baffle 20. That is, it means that the second baffle 30 is closer to the PCB board to be tested, and the first baffle 20 is farther away from the PCB board to be tested. Please refer to both. Figure 3 During the process of the first baffle 20 and the second baffle 30 moving closer to each other, the PCB board to be detected is first detected by the second photoelectric sensor 50. Since the triggering interval between the second photoelectric sensor 50 and the first photoelectric sensor 40 along the second direction Y is greater than d, the second baffle 30 contacts the PCB board to be detected and continues to move along the second direction Y until the first photoelectric sensor 40 on the first baffle 20 detects the PCB board to be detected. Thus, the detection width H of the PCB board to be detected is H = S - 2 × d1 - d.

[0043] In some embodiments, when d2-d1≥d and the board to be tested contacts the first baffle 20, H=S-2×d2-d. Since the first baffle 20 and the second baffle 30 move synchronously, when d2-d1≥d, it indicates that the PCB board to be tested is closer to the first baffle 20 relative to the second baffle 30. That is, it indicates that the second baffle 30 is farther from the PCB board to be tested, and the first baffle 20 is closer to the PCB board to be tested. Please refer to both. Figure 2 During the process of the first baffle 20 and the second baffle 30 moving closer to each other, the PCB board to be detected is first detected by the first photoelectric sensor 40. Since the triggering interval between the first photoelectric sensor 40 and the second photoelectric sensor 50 along the second direction Y is greater than d, the first baffle 20 contacts the PCB board to be detected and continues to move along the second direction Y until the second photoelectric sensor 50 on the second baffle 30 detects the PCB board to be detected. Thus, the detection width H of the PCB board to be detected is H = S - 2 × d² - d.

[0044] In some embodiments, the control component further includes a second alarm system. The actual width of the board to be tested is h. The user can pre-input the value of the actual width h of the board to be tested into the control component. When |Hh|≤δ, the second alarm system does not issue an alarm; when |Hh|>δ, the second alarm system issues an alarm. Here, δ is the allowable error range for the width of the PCB board to be tested. The user can set the specific value of δ according to actual needs, and it is not specifically limited in this application.

[0045] In this embodiment of the invention, a conveying assembly 10, a first baffle 20, a second baffle 30, a first photoelectric sensor 40, a second photoelectric sensor 50, and a control assembly are provided. The conveying assembly 10 conveys the plate to be tested to a detection position along a first direction X. The first baffle 20 is disposed on one side of the conveying assembly 10, and the second baffle 30 is disposed on the other side of the conveying assembly 10. The second baffle 30 is opposite to the first baffle 20, and the first baffle 20 and the second baffle 30 move synchronously. The first baffle 20 and the second baffle 30 can move closer to each other or further apart along a second direction Y. The first photoelectric sensor 40 is disposed on the side of the first baffle 20 closest to the plate to be tested, and the first photoelectric sensor 40 is located at the detection position along the vertical direction Z. Above, the detection direction of the first photoelectric sensor 40 faces the detection position. The second photoelectric sensor 50 is disposed on the side of the second baffle 30 near the plate to be detected. The second photoelectric sensor 50 is located above the detection position in the vertical direction Z. The second photoelectric sensor 50 and the first photoelectric sensor 40 are positioned opposite each other and spaced apart in the second direction Y. The distance between the first photoelectric sensor 40 and the second photoelectric sensor 50 in the second direction Y is greater than the width of the plate to be detected. The control component is electrically connected to the first photoelectric sensor 40 and the second photoelectric sensor 50. The control component is equipped with a first alarm. The system is configured such that when at least one of the first photoelectric sensor 40 and the second photoelectric sensor 50 detects the PCB board to be inspected, the first alarm system issues an alarm. This configuration allows the first photoelectric sensor 40 and the second photoelectric sensor 50, located on opposite sides of the PCB board along the second direction Y, to detect the PCB board at the detection position when the conveying assembly 10 transports the PCB board to the detection position along the first direction X. Since the distance between the first photoelectric sensor 40 and the second photoelectric sensor 50 along the second direction Y is greater than or equal to the width of the PCB board, under normal circumstances, the two sides of the PCB board along the second direction Y will not be detected by the first photoelectric sensor 40 and the second photoelectric sensor 50 when the PCB board is at the detection position. However, if the PCB board changes angle, or in severe cases, the length and width of the PCB board are interchanged, at least one of the first photoelectric sensor 40 and the second photoelectric sensor 50 can detect the PCB board, and the first alarm system in the control assembly issues an alarm. The user can then adjust the PCB board's turning angle or remove the PCB board for re-transport based on the alarm prompt, thereby reducing the occurrence of PCB board collisions during transport and improving printing efficiency.

[0046] Please see Figure 4 The present invention also provides an embodiment of a detection method using the above-described detection device, the detection method comprising the following steps:

[0047] S1: The initial distance between the first baffle and the second baffle along the second direction is S;

[0048] S2: The conveyor assembly transports the board to be tested to the testing position;

[0049] S3: The first photoelectric sensor located on the first baffle and the second photoelectric sensor located on the second baffle detect the board to be detected at the detection position;

[0050] S4: Confirm whether the first photoelectric sensor and / or the second photoelectric sensor have detected the board to be tested. If yes, the control component issues an alarm; if no, the control component does not issue an alarm.

[0051] Since the first baffle and the second baffle are at a preset interval along the second direction, the first photoelectric sensor and the second photoelectric sensor are also at a preset interval along the second direction. Under normal circumstances, the two ends of the board to be tested along the second direction will not be detected by the first photoelectric sensor and the second photoelectric sensor. When the board to be tested changes angle or its length and width are interchanged, it can be detected by the first photoelectric sensor and the second photoelectric sensor. After at least one of the first photoelectric sensor and the second photoelectric sensor detects the board to be tested, the first alarm system in the control component issues an alarm. The user can adjust the turning angle of the board to be tested or remove the board to be tested and re-transport it according to the alarm prompt, thereby reducing the occurrence of board collisions during the transport of the board to be tested and thus improving printing efficiency.

[0052] In some embodiments, please refer to the following: Figure 5 The detection method also includes the following steps:

[0053] S5: When the control component does not issue an alarm, the first baffle and the second baffle move synchronously. The first baffle drives the first photoelectric sensor to move toward the plate to be detected, and the second baffle drives the second photoelectric sensor to move toward the plate to be detected.

[0054] S6: The distance from the first photoelectric sensor to the plate to be tested along the second direction is measured as d1, the distance from the second photoelectric sensor to the plate to be tested along the second direction is d2, the distance from the first photoelectric sensor to the first baffle along the second direction, and the distance from the second photoelectric sensor to the second baffle along the second direction are both d.

[0055] When the first photoelectric sensor and / or the second photoelectric sensor fail to detect the board to be tested and the control component does not issue an alarm, the user can calculate the detection width H of the board to be tested along the second direction based on the relevant data of S, d1, d2 and d.

[0056] In some embodiments, please refer to the following: Figure 6 The detection method also includes the following steps:

[0057] S7: The detection width of the board to be tested along the second direction is H. If d1=d2, and the first photoelectric sensor and the second photoelectric sensor detect the board to be tested at the same time, then H=S-(d1+d2)-2d.

[0058] If |d1-d2|<d, the plate to be tested does not contact the first baffle or the second baffle, and H=S-(d1+d2)-2d;

[0059] If d1-d2≥d, the plate to be tested contacts the second baffle first, and then contacts the first baffle, H=S-2×d1-d;

[0060] If d2-d1≥d, the plate to be tested contacts the first baffle first, and then contacts the second baffle, H=S-2×d2-d.

[0061] Since the positions of the board to be tested on the conveying assembly are different, the distance difference between d1 and d2 is different. If |d1-d2|<d, the board to be tested has not contacted the first baffle or the second baffle. H=S-(d1+d2)-2d. Since the first baffle and the second baffle move synchronously, when |d1-d2|<d, it means that one of the first photoelectric sensor and the second photoelectric sensor detects the board to be tested first, and the other detects the board to be tested later. Since the trigger interval between the two is less than d, it means that the first photoelectric sensor and the second photoelectric sensor have completed the detection before the board to be tested has contacted the first baffle or the second baffle.

[0062] If d1-d2≥d, and the plate to be detected contacts the second baffle, H=S-2×d1-d. Since the first baffle and the second baffle move synchronously, when d1-d2≥d, it means that the plate to be detected is closer to the second baffle than the first baffle. That is, the second baffle is closer to the plate to be detected, and the first baffle is farther away from the plate to be detected. During the process of the first baffle and the second baffle moving closer to each other, the plate to be detected is detected by the second photoelectric sensor first. Since the triggering interval between the second photoelectric sensor and the first photoelectric sensor along the second direction is greater than d, the second baffle contacts the plate to be detected and continues to move along the second direction until the first photoelectric sensor on the first baffle detects the plate to be detected. Therefore, the detection width of the plate to be detected is H=S-2×d1-d.

[0063] If d2-d1≥d, and the plate to be detected contacts the first baffle, H=S-2×d2-d. Since the first baffle and the second baffle move synchronously, when d2-d1≥d, it means that the plate to be detected is closer to the first baffle than the second baffle. That is, the second baffle is farther away from the plate to be detected, and the first baffle is closer to the plate to be detected. During the process of the first baffle and the second baffle moving closer to each other, the plate to be detected is first detected by the first photoelectric sensor. And since the triggering interval between the first photoelectric sensor and the second photoelectric sensor along the second direction is greater than d, the first baffle contacts the plate to be detected and continues to move along the second direction until the second photoelectric sensor on the second baffle detects the plate to be detected. Therefore, the detection width of the plate to be detected is H=S-2×d2-d.

[0064] In some embodiments, please refer to the following: Figure 7 The detection method also includes the following steps:

[0065] S8: The detection width of the board to be tested along the second direction is H, and the actual width of the board to be tested is h. If |Hh|≤δ, the control component does not issue an alarm; if |Hh|>δ, the control component issues an alarm.

[0066] Where δ is the allowable error range for the width of the board to be tested. If |Hh|≤δ, it means that the difference between the actual width of the board and the detected width is within the allowable error range, and the control component will not issue an alarm. If |Hh|>δ, it means that the difference between the actual width of the board and the detected width exceeds the allowable error range, and the control component will issue an alarm.

[0067] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A detection device, characterized in that, include: A conveying assembly for conveying the plate to be tested to the testing position along a first direction; A first baffle is disposed on one side of the conveying assembly; A first photoelectric sensor is disposed on the side of the first baffle close to the plate to be detected. The first photoelectric sensor is located above the detection position in the vertical direction, and the detection direction of the first photoelectric sensor is towards the detection position. The second baffle is disposed on the other side of the conveying assembly. The second baffle and the first baffle are disposed opposite to each other along the second direction. The first baffle and the second baffle move synchronously, and the first baffle and the second baffle can move closer to each other or away from each other along the second direction. The second photoelectric sensor is disposed on the side of the second baffle close to the plate to be tested. The second photoelectric sensor is located above the detection position in the vertical direction. The second photoelectric sensor and the first photoelectric sensor are opposite to each other and spaced apart in the second direction. The distance between the first photoelectric sensor and the second photoelectric sensor in the second direction is greater than or equal to the width of the plate to be tested. The second direction is perpendicular to the first direction and the vertical direction. A control component is connected to the first photoelectric sensor and the second photoelectric sensor. The control component is equipped with a first alarm system. When at least one of the first photoelectric sensor and the second photoelectric sensor detects the board to be detected, the first alarm system issues an alarm. The first baffle and the second baffle are connected by a transmission assembly. The first baffle and the second baffle move synchronously, and the first baffle and the second baffle can move closer to each other or away from each other along the second direction. The initial distance between the first baffle and the second baffle along the second direction is S. The displacement of the first photoelectric sensor to the plate to be tested along the second direction is d1. The displacement of the second photoelectric sensor to the plate to be tested along the second direction is d2. The distance of the first photoelectric sensor to the first baffle along the second direction and the distance of the second photoelectric sensor to the second baffle along the second direction are both d. The detection width of the plate to be tested along the second direction is H. When d1=d2, H=S-(d1+d2)-2d; When |d1-d2|<d, H=S-(d1+d2)-2d; When d1-d2≥d, and the plate to be tested contacts the second baffle, H=S-2×d1-d; When d2-d1≥d, and the plate to be tested contacts the first baffle, H=S-2×d2-d; The control component is also equipped with a second alarm system; The actual width of the board to be tested is h. When |Hh|≤δ, the second alarm system does not issue an alarm. When |Hh|>δ, the second alarm system issues an alarm.

2. A detection method using the detection device of claim 1, comprising the following steps: S1: The initial distance between the first baffle and the second baffle along the second direction is S; S2: The conveying assembly conveys the board to be tested to the testing position; S3: The first photoelectric sensor located on the first baffle and the second photoelectric sensor located on the second baffle detect the board to be detected at the detection position; S4: Confirm whether the first photoelectric sensor and / or the second photoelectric sensor have detected the board to be detected. If yes, the control component issues an alarm; if no, the control component does not issue an alarm.

3. The detection method according to claim 2, characterized in that, The detection method further includes the following steps: S5: When the control component does not issue an alarm, the first baffle and the second baffle move synchronously. The first baffle drives the first photoelectric sensor to move toward the plate to be detected, and the second baffle drives the second photoelectric sensor to move toward the plate to be detected. S6: The displacement of the first photoelectric sensor along the second direction to the plate to be tested is measured as d1, the displacement of the second photoelectric sensor along the second direction to the plate to be tested is d2, and the distance of the first photoelectric sensor along the second direction to the first baffle and the distance of the second photoelectric sensor along the second direction to the second baffle are both d.

4. The detection method according to claim 3, characterized in that, The detection method includes the following steps: S7: The detection width of the board to be tested along the second direction is H. If d1=d2, and the first photoelectric sensor and the second photoelectric sensor detect the board to be tested at the same time, then H=S-(d1+d2)-2d. If |d1-d2|<d, then H=S-(d1+d2)-2d; If d1-d2≥d, the plate to be tested contacts the second baffle first, and then contacts the first baffle, H=S-2×d1-d; If d2-d1≥d, the plate to be tested contacts the first baffle first, and then contacts the second baffle, H=S-2×d2-d.

5. The detection method according to claim 4, characterized in that, The detection method includes the following steps: S8: The actual width of the board to be tested is h. If |Hh|≤δ, the control component does not issue an alarm. If |Hh|>δ, the control component issues an alarm.

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