A novel water-based acrylic adhesive for circuit boards and preparation method thereof
By developing a new aqueous acrylic adhesive containing monomers, emulsifiers, curing agents and initiators, polymerizing in water with emulsion polymerization method and combining post-treatment, the problems of slow speed, high cost and solvent pollution of the new circuit board are solved, and environmentally friendly and strong adhesiveness are achieved.
Patent Information
- Application Number
- CN202411919194.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-25
- Publication Date
- 2025-04-08
AI Technical Summary
The use of multi-layer copper clad plates in traditional circuit boards is slow and costly. The use of oily glues such as epoxy resin glues has solvent contamination problems.
A new type of circuit board aqueous acrylic adhesive is developed, and its formulation includes monomers, emulsifiers, curing agents and initiators. The polymerization reaction is carried out in water by emulsion polymerization method, and the curing agent is introduced in combination with post-treatment to enhance the bonding strength.
It realizes environmentally friendly water-based adhesives, strong adhesion, and solves the problems of slow speed, high cost and solvent pollution of new circuit boards.
Smart Images
Figure CN119775924A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of water-based acrylic adhesive for circuit boards, in particular to a novel water-based acrylic adhesive for circuit boards and a preparation method thereof. Background Art
[0002] Traditional circuit boards generally use multi-layer copper clad boards, which are slow and costly. New circuit boards are made of adhesives, generally oil-based adhesives such as epoxy resin adhesives, but there is a problem of solvent pollution.
[0003] Therefore, in order to correct the above-mentioned defects, we proposed a novel water-based acrylic adhesive for circuit boards and a preparation method thereof. Summary of the invention
[0004] The technical problem solved by the present invention is to provide a novel water-based acrylic adhesive for circuit boards and a preparation method thereof.
[0005] To achieve the above objectives, the first objective of the present invention is to provide a novel water-based acrylic adhesive for circuit boards, the formula of which includes monomers, emulsifiers, curing agents, and initiators; The monomer is one of butyl acrylate, isooctyl acrylate, acrylic acid, methacrylic acid, methyl methacrylate, styrene, epoxy acrylate, isobornyl acrylate, cyclohexyl acrylate, acrylamide, hydroxyethyl acrylate, and hydroxypropyl acrylate; The emulsifier is one of alkyl polyoxyethylene ether, alkyl sulfonate, alkyl ether sulfate, and alkyl ether succinic platinum sulfonate; The initiator is persulfate; The curing agent is one of epoxyamine curing agent, aziridine curing agent and isocyanate curing agent.
[0006] The second object of the present invention is to provide a method for preparing the novel water-based acrylic adhesive for circuit boards as described above, comprising the following steps: S1. Pump the monomer material, emulsifier and process water required for pre-emulsification into the pre-emulsification kettle, start stirring for pre-emulsification, and obtain a pre-emulsion; S2, adding initiator and process water into the initiator kettle, stirring evenly to obtain an initiator solution; S3, adding the primer emulsifier and process water into the polymerization kettle, heating the polymerization kettle to raise the temperature and stirring to mix; S4, adding the primer pre-emulsion from the pre-emulsion kettle to the polymerization kettle, continuing heating, and then adding the primer initiator to perform a primer reaction. After the primer reaction is completed, the pre-emulsion in step S1 is added dropwise to perform a synthesis reaction for 4 to 6 hours. As the reaction proceeds, cooling water is added to the jacket of the polymerization kettle to control the reaction temperature; S5. After the polymerization reaction is completed, the temperature in the kettle is reduced to below 50°C after the heat preservation process and cooling, and the post-treatment agent is added for post-treatment adjustment. Furthermore, in step S3, the polymerization kettle is heated to 80-90°C.
[0007] Furthermore, in step S4, when the primer initiator is added, the temperature of the polymerization kettle rises to 78-86°C.
[0008] Furthermore, in step S4, when the pre-emulsion in step S1 is added dropwise for synthesis reaction, the temperature is controlled at 82-90°C.
[0009] Furthermore, in step S4, cooling water is added to the jacket of the polymerization reactor to control the reaction temperature to 82-90°C.
[0010] Compared with the prior art, the beneficial effects of the present invention are as follows: the water-based acrylic adhesive in the present invention meets environmental protection requirements and has strong adhesion, which solves the problem that traditional circuit boards generally use multi-layer copper-clad boards, which are slow and costly, and new circuit boards are made of adhesives, which generally use oily adhesives, such as epoxy resin adhesives, but have the problem of solvent pollution. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Figure 1 is the reaction equation in the present invention; Figure 2 The present invention is a process flow chart for preparing the same; Figure 3 It is a rendering of the present invention when implemented. DETAILED DESCRIPTION
[0012] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0013] The present invention provides a technical solution: See also Figure 1 , a new type of water-based acrylic adhesive for circuit boards, selects suitable monomers, as well as matching emulsifiers, initiators and curing agents to increase reactivity and enhance bonding strength.
[0014] Water-based acrylic adhesives are adhesives made by emulsion polymerization of suitable monomers with appropriate emulsifiers and initiators under certain conditions in water, and then after post-treatment, curing agents are introduced to enhance bonding strength. Suitable monomers include but are not limited to butyl acrylate, isooctyl acrylate, acrylic acid, methacrylic acid, methyl methacrylate, styrene, epoxy acrylate, isobornyl acrylate, cyclohexyl acrylate, acrylamide, hydroxyethyl acrylate, hydroxypropyl acrylate, etc., suitable emulsifiers include but are not limited to alkyl polyoxyethylene ethers, alkyl sulfonates, alkyl ether sulfates, alkyl ether succinic platinum sulfonates, etc., suitable initiators include but are not limited to persulfates, and suitable solid content includes but is not limited to epoxyamine curing agents, aziridine curing agents, and isocyanate curing agents.
[0015] The reaction equation is shown as Figure 1 shown.
[0016] The above-mentioned water-based acrylic adhesive synthesis process is a semi-continuous process, which includes material preparation, heating and dissolving, synthesis reaction, cooling, adjustment, testing, filtering, packaging and other processes. The production process takes about 8 hours. Figure 2 shown.
[0017] The specific process steps are as follows: A. Material preparation: Liquid raw materials are weighed and fed automatically, and solid raw materials are fed manually. It includes three parts: first, the monomer material, emulsifier and process water required for pre-emulsification are pumped into the pre-emulsification kettle, and stirring is started for pre-emulsification to obtain pre-emulsion; second, the initiator and process water are added to the initiator kettle, stirred evenly, and the initiator solution is obtained; third, the primer emulsifier and process water are added to the polymerization kettle, and stirred and mixed evenly.
[0018] B. Heating: Heat the polymerization kettle to 80-90°C and stir to mix.
[0019] C. Synthesis reaction: Add the pre-emulsion from the pre-emulsion kettle to the polymerization kettle, continue heating, and add the primer initiator when the temperature rises to 78-86°C to carry out the primer reaction. After the primer reaction is completed, start to drop the pre-emulsion to carry out the synthesis reaction. The temperature is controlled at 82-90°C, and the time is about 4-6 hours. As the reaction proceeds, cooling water will be added to the jacket of the reactor to control the reaction temperature at 82-90°C.
[0020] D. Cooling: After the polymerization reaction is completed, the temperature in the kettle is reduced to below 50°C after the heat preservation process and cooling, and the post-treatment agent is added for post-treatment adjustment.
[0021] E. Packaging and discharging: After adjustment and inspection, the materials are filtered, packaged and discharged.
[0022] Using this method, the circuit board bonding effect made of water-based acrylic adhesive is as follows Figure 3 shown.
[0023] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A new type of water-based acrylic adhesive for circuit boards, characterized in that: Its formula includes monomer, emulsifier, curing agent, initiator; The monomer is one of butyl acrylate, isooctyl acrylate, acrylic acid, methacrylic acid, methyl methacrylate, styrene, epoxy acrylate, isobornyl acrylate, cyclohexyl acrylate, acrylamide, hydroxyethyl acrylate, and hydroxypropyl acrylate; The emulsifier is one of alkyl polyoxyethylene ether, alkyl sulfonate, alkyl ether sulfate, and alkyl ether succinic platinum sulfonate; The initiator is persulfate; The curing agent is one of epoxyamine curing agent, aziridine curing agent and isocyanate curing agent.
2. A method for preparing the novel water-based acrylic adhesive for circuit boards as claimed in claim 1, characterized in that: The following steps are involved: S1. Pump the monomer material, emulsifier and process water required for pre-emulsification into the pre-emulsification kettle, start stirring for pre-emulsification, and obtain a pre-emulsion; S2, adding initiator and process water into the initiator kettle, stirring evenly to obtain an initiator solution; S3, adding the primer emulsifier and process water into the polymerization kettle, heating the polymerization kettle to raise the temperature and stirring to mix; S4, adding the primer pre-emulsion from the pre-emulsion kettle to the polymerization kettle, continuing heating, and then adding the primer initiator to perform a primer reaction. After the primer reaction is completed, the pre-emulsion in step S1 is added dropwise to perform a synthesis reaction for 4 to 6 hours. As the reaction proceeds, cooling water is added to the jacket of the polymerization kettle to control the reaction temperature; S5. After the polymerization reaction is completed, the temperature in the kettle is reduced to below 50°C after a heat preservation process and cooling, and a post-treatment agent is added for post-treatment adjustment.
3. The method for preparing the novel water-based acrylic adhesive for circuit boards according to claim 2, characterized in that: In step S3, the polymerization kettle is heated to 80-90°C.
4. The method for preparing the novel water-based acrylic adhesive for circuit boards according to claim 2, characterized in that: In step S4, when the primer initiator is added, the temperature of the polymerization kettle rises to 78-86°C.
5. The method for preparing the novel water-based acrylic adhesive for circuit boards according to claim 2, characterized in that: In the step S4, when the pre-emulsion in the step S1 is added dropwise to carry out the synthesis reaction, the temperature is controlled at 82-90°C.
6. The method for preparing the novel water-based acrylic adhesive for circuit boards according to claim 2, characterized in that: In step S4, cooling water is added into the jacket of the polymerization reactor to control the reaction temperature to 82-90°C.