Exhaust gas treatment system in semiconductor manufacturing processes

Abstract

The application provides a semiconductor manufacturing process waste gas treatment system, which comprises a reaction chamber and further comprises: a spray water washing mechanism, which surrounds the outer circumferential surface of the reaction chamber, is provided with a spiral spray channel and a cooling cavity inside, the spray channel is used for the flow of semiconductor waste gas, and the bottom end of the spray channel is communicated with the bottom end of the reaction chamber; the cooling cavity is located between the spray channel and the outer wall of the reaction chamber; a water collecting pool, which is arranged at the bottom of the spray channel and is connected with a high-pressure water pump; a heater, which is arranged in the reaction chamber and is connected with a driving mechanism, and an outlet pipe, which is arranged below the heater and is communicated with the bottom end of the reaction chamber, wherein one side of the outlet pipe is provided with a side opening, and one side of the side opening is provided with a flushing assembly connected with the high-pressure water pump. The spray water washing mechanism surrounds the reaction chamber, can provide spray water washing for the waste gas, can also be used as a heat insulation structure of the reaction chamber, and can make the overall structure compact and reduce the floor area.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing, and in particular to a waste gas treatment system in the semiconductor manufacturing process. Background Technology

[0002] Waste gas treatment is a crucial step in semiconductor manufacturing, aiming to reduce or eliminate harmful gases generated during the process to protect the environment and employee health.

[0003] For example, the waste gases generated during silicon carbide production mainly include SiCl4, SiHCl3, HCl, H2, N2, and small amounts of metal chlorides. These waste gases not only contain toxic and harmful substances but can also seriously impact the atmospheric environment. In practical applications, it is necessary to select appropriate treatment methods based on factors such as the type, concentration, and quantity of waste gases, and to carefully control the treatment effect to ensure that waste gas emissions comply with relevant national and local standards.

[0004] The existing patent document "CN215654636U A Waste Gas Treatment Device for Semiconductor Device Manufacturing" includes a reaction chamber, a washing chamber, a clean water tank, a cooling tower, and a water pump. A heat exchange mechanism is set between the reaction chamber and the washing chamber. The heat exchange mechanism includes a cylinder and a heat-conducting rod. The two ends of the cylinder are connected to the bottom outlet of the reaction chamber and the top inlet of the washing chamber, respectively, and are equipped with valves. The cylinder has a cavity inside its circumferential wall, and the upper and lower parts of the outer wall of the cylinder are respectively provided with a first outlet and a first inlet. The first outlet is connected to the air inlet of the reaction chamber. The two ends of the heat-conducting rod are located in the cavity of the circumferential wall of the cylinder and the cavity of the cylinder, respectively. Although the above-mentioned prior art can treat waste gas, the structure for waste gas spraying is set separately from the waste gas reaction chamber, resulting in a large overall footprint and the need for an additional cooling and heat insulation structure for the waste gas reaction chamber. Furthermore, the heating structure in the waste gas reaction chamber is in long-term contact with the waste gas, and the byproducts produced after the waste gas combustion are easily attached to it, which can affect subsequent normal use if accumulated over a long period of time. Summary of the Invention

[0005] This invention provides a waste gas treatment system for semiconductor manufacturing processes to address the technical problems of the lack of integrated design between the spray structure and the cooling and heat insulation structure of the waste gas reaction chamber, as well as the susceptibility of the heat-generating structure in the waste gas reaction chamber to the effects of combustion byproducts.

[0006] The present invention solves the above-mentioned technical problems through the following technical solutions:

[0007] This invention provides a waste gas treatment system for semiconductor manufacturing processes, including a reaction chamber; further comprising: a spray washing mechanism surrounding the outer periphery of the reaction chamber, wherein the spray washing mechanism is provided with a spiral spray channel and a cooling chamber, the spray channel being used for the flow of semiconductor waste gas, and the bottom end of the spray channel communicating with the bottom end of the reaction chamber; the cooling chamber being located between the spray channel and the outer wall of the reaction chamber; a water receiving tank located at the bottom of the spray channel, and connected to a high-pressure water pump that can pump water from the tank into the cooling chamber; a heater located within the reaction chamber, the heater being connected to a drive mechanism that can drive the heater to move vertically and rotate, an outlet pipe communicating with the bottom end of the reaction chamber being located below the heater, and the outlet pipe being provided with an automatically releaseable sealing sleeve, a side opening being provided on one side of the outlet pipe, and a rinsing assembly connected to the high-pressure water pump being provided on one side of the side opening; and a filter mechanism connected to an exhaust pipe communicating with the top end of the reaction chamber.

[0008] In this technical solution, the reaction chamber is surrounded by a spray water washing mechanism, which not only provides spray water washing for the exhaust gas, but also serves as a heat insulation structure for the reaction chamber, while making the overall structure compact and reducing the floor space. Furthermore, the design of the high-pressure water pump flushing component and the heater being driven by the drive mechanism can provide cleaning for the surface of the heater.

[0009] Preferably, an upper cover and a lower cover are fixedly installed at the top and bottom of the reaction chamber, respectively; the drive mechanism is installed on the upper cover, and the drive mechanism includes a screw, a carrier, a fixing nut, a prism, and a motor. A fixing nut is fixedly installed in the middle of the upper cover, the screw is threadedly connected to the fixing nut, and the bottom end of the screw is fixedly connected to the top end of the heater. A mating hole with a top opening is opened at the axis of the screw, and the mating hole is mated and connected to the prism. The top end of the prism is fixedly connected to the output shaft end of the motor. The carrier is fixedly installed on the top surface of the upper cover, and the motor is fixedly connected to the top of the carrier.

[0010] In this technical solution, the drive mechanism is used to drive the heater to move.

[0011] Preferably, the spray washing mechanism includes an outer cylinder, an inner cylinder, and a spray pipe; the outer cylinder, the inner cylinder, and the reaction chamber are coaxially arranged, the top ends of the outer cylinder and the inner cylinder are fixedly connected to the bottom surface of the upper cover, the bottom ends of the outer cylinder and the inner cylinder are fixedly connected to the top surface of the lower cover, the spray pipe is arranged between the outer cylinder and the inner cylinder, and the inner cylinder and the outer wall of the reaction chamber form a cooling cavity.

[0012] In this technical solution, the spray water washing mechanism provides spray water washing for the exhaust gas before it enters the reaction chamber.

[0013] Preferably, the spray pipe comprises spiral blades, a spiral tube, a baffle plate, and spray heads; the spiral blades are fixedly installed between the outer cylinder and the inner cylinder, forming an annular groove between the outer cylinder and the inner cylinder, which is divided into spray channels by the spiral blades; the spiral tube is fixedly laid along the length of the spiral blades, and several evenly distributed spray heads are installed along the length of the spiral tube; the top end of the spiral tube is closed, and the bottom end of the spiral tube is open; the open end of the spiral tube is connected to a high-pressure water inlet pipe fixed to the wall of the outer cylinder, and the high-pressure water inlet pipe extends outside the outer cylinder; a baffle plate is fixedly installed at the top of the spiral blades; an exhaust gas inlet pipe is connected to the top of the spray channel, and the exhaust gas inlet pipe is fixedly connected to the upper cover.

[0014] In this technical solution, the spiral design of the spray pipe forms a spiral spray channel, which extends the path of the exhaust gas spray washing and improves the spray washing effect.

[0015] Preferably, the lower cover includes a first sealing plate, a second sealing plate, connecting strips, and an outer ring; the first sealing plate is fixedly sealed to the bottom of the cooling chamber, the second sealing plate is fixedly sealed to the bottom of the reaction chamber, the first sealing plate and the outer ring are fixedly connected by several connecting strips, and a water trough is formed between every two adjacent connecting strips. The water trough is located between the spray channel and the water receiving pool. The top of the water receiving pool is fixedly connected to the bottom surface of the lower cover, and a filter screen is installed inside the water receiving pool.

[0016] In this technical solution, the water receiving tank is used to collect the water after the spray washing and to recycle it. The water is filtered through a filter screen to ensure the cleanliness of the recycled water.

[0017] Preferably, the bottom end of the spray channel is connected to a first gas supply pipe that is fixedly connected to the outer cylindrical wall, the first gas supply pipe is fixedly connected to a second gas supply pipe, the second gas supply pipe is fixedly connected to a second sealing plate, and the second gas supply pipe is connected to the bottom end of the reaction chamber.

[0018] In this technical solution, the design of the first gas supply pipe and the second gas supply pipe is used to transport the waste gas after spraying and washing in the spray channel to the reaction chamber.

[0019] Preferably, the inlet of the high-pressure water pump is connected to a first water pipe, which is connected to the bottom of the receiving pool. The outlet of the high-pressure water pump is connected to a tee pipe, and a first electrically controlled valve and a second electrically controlled valve are respectively installed at the two ends of the tee pipe. The first electrically controlled valve is connected to a second water pipe, which is connected to the bottom of the cooling chamber and a drain outlet is connected to the top of the cooling chamber. The drain outlet is fixedly connected to the upper cover. The second electrically controlled valve is connected to the flushing assembly.

[0020] In this technical solution, the rinsing assembly is connected to a high-pressure water pump, which provides the drive for the rinsing assembly.

[0021] Preferably, the flushing assembly includes a fixed cylinder, a movable tube, a blade block, a piston sleeve, and a second spring; one end of the fixed cylinder is fixedly connected to a second electrically controlled valve, one end of the movable tube is fixedly fitted with a piston sleeve, and the outer ring of the piston sleeve is connected to the inner wall of the fixed cylinder; the movable tube is connected to the end of the fixed cylinder away from the second electrically controlled valve, and the movable tube extends outside the fixed cylinder; a second spring is provided inside the movable tube, and the two ends of the second spring are fixedly connected to the movable tube and the fixed cylinder respectively; a water spray hole is provided at the end of the movable tube away from the piston sleeve; the blade block is fixedly connected to the movable tube below the water spray hole.

[0022] In this technical solution, the rinsing component is used for cleaning the surface of the heater.

[0023] Preferably, it further includes a connecting ring, which is connected to the sleeve; the connecting ring includes a ring seat, a sealing gasket, a slot, and a chamfer; the ring seat is fixed to the bottom surface of the lower cover, and the ring seat is coaxially arranged with the outlet pipe; a sealing gasket is fixedly installed inside the ring seat; the bottom inner edge of the ring seat is chamfered; and a slot is formed on the inner sidewall of the ring seat; the sleeve includes a sleeve, a guide sleeve, a first spring, a beveled insert, a connecting rod, a guide groove, and a sealing ring; the bottom end of the sleeve is closed, and the top end of the sleeve is open. The sleeve has an opening, and a sealing ring is fixedly installed on the inner wall of the closed end. The guide sleeve is fixedly installed on the outer wall of one side of the sleeve. The inclined insert block is connected to the guide sleeve, and a first spring is provided inside the guide sleeve. The two ends of the first spring are fixedly connected to the inclined insert block and the guide sleeve, respectively. The inclined end of the inclined insert block is embedded in the slot. The bottom of the guide sleeve has a guide groove, which is slidably connected to the connecting rod. The top end of the connecting rod is fixedly connected to the inclined insert block. The connecting rod is located on one side of the blade block.

[0024] In this technical solution, the connecting ring provides an installation position for the sleeve, and the sleeve has an automatic release positioning design, making it easy to remove from the outlet pipe.

[0025] Preferably, the filtration mechanism includes a housing, a connecting pipe, a filter, and a fan; the housing is fixedly connected to the outer wall of the outer cylinder, the fan is fixedly installed on one side of the housing, a filter is provided inside the housing, a connecting pipe is fixedly connected to the top of the housing and is fixedly connected to an exhaust pipe, and the bottom of the housing is connected to the air inlet of the fan.

[0026] In this technical solution, after the exhaust gas in the reaction chamber is treated, it is filtered again by a filtration mechanism to ensure the effectiveness of the exhaust gas treatment.

[0027] Based on common knowledge in the field, the above-mentioned preferred conditions can be combined arbitrarily to obtain various preferred embodiments of the present invention.

[0028] The positive and progressive effects of this invention are as follows:

[0029] The aforementioned waste gas treatment system for semiconductor manufacturing processes surrounds the outer periphery of the reaction chamber via a spray washing mechanism. This spray washing mechanism is used for spray washing of waste gas entering the reaction chamber and also serves as a heat insulation structure for the reaction chamber. The spray washing mechanism has spray channels and a cooling chamber. The water after spray washing can be used as a cold source in the cooling chamber, avoiding waste. Unlike existing technologies that only use the cooling chamber for heat insulation, the added spray channels further improve the heat insulation effect. The spray washing mechanism is concentrated on the outer periphery of the reaction chamber, making the overall structure compact and reducing the footprint. Furthermore, the high-pressure water pump, rinsing components, and drive mechanism provide cleaning for the heater after use, preventing the accumulation of byproducts that could affect its use. Even further, an outlet pipe is provided, which is used to exit the reaction chamber during heater cleaning. The outlet pipe is equipped with an automatically releaseable sealing sleeve. When not cleaning, the sleeve seals the outlet pipe; when cleaning is required, it automatically releases the sealing sleeve, facilitating manual opening of the outlet pipe. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the overall external structure of the present invention.

[0031] Figure 2 This is a schematic diagram of the outer cylinder, inner cylinder, and interior of the reaction chamber of the present invention.

[0032] Figure 3 For the present invention Figure 2 Enlarged structural diagram of section A in the middle.

[0033] Figure 4 This is a schematic diagram of the structure of the spray pipe of the present invention.

[0034] Figure 5 This is a schematic diagram of the structure of the lower cover and the top surface of the water receiving pool of the present invention.

[0035] Figure 6 This is a schematic diagram of the bottom structure of the lower cover of the present invention.

[0036] Figure 7 For the present invention Figure 6 Enlarged structural diagram of section B in the middle.

[0037] Figure 8 This is a schematic diagram of the high-pressure water pump and flushing assembly of the present invention.

[0038] Figure 9 This is a schematic diagram of the structure of the flushing assembly and the cover of the present invention.

[0039] Figure 10 This is a schematic diagram of the filtration mechanism of the present invention.

[0040] Explanation of reference numerals in the attached figures

[0041] 1. Outer cylinder;

[0042] 2. Support frame;

[0043] 3. Top cover;

[0044] 4. Lower cover; 401. First sealing plate; 402. Second sealing plate; 403. Connecting strip; 404. Outer ring;

[0045] 5. Drive mechanism; 501. Screw; 502. Carrier frame; 503. Fixing nut; 504. Prism; 505. Motor;

[0046] 6. Water receiving tank; 601. Filter screen;

[0047] 7. First gas pipeline;

[0048] 8. High-pressure water inlet pipe;

[0049] 9. Exhaust pipe;

[0050] 10. Drainage outlet;

[0051] 11. Exhaust gas inlet pipe;

[0052] 12. Filter mechanism; 1201. Housing; 1202. Connecting pipe; 1203. Filter; 1204. Fan;

[0053] 13. Inner cylinder;

[0054] 14. Reaction chamber;

[0055] 15. Spray pipe; 1501. Spiral blade; 1502. Spiral tube; 1503. Baffle plate; 1504. Spray head;

[0056] 16. Cooling chamber;

[0057] 17. Sprinkler channel;

[0058] 18. Heater;

[0059] 19. Second gas supply pipe;

[0060] 20. Outlet pipe; 2001. Side opening;

[0061] 21. Enclosure; 2101. Sleeve; 2102. Guide sleeve; 2103. First spring; 2104. Inclined insert; 2105. Connecting rod; 2106. Guide groove; 2107. Sealing ring;

[0062] 22. High-pressure water pump;

[0063] 23. First water pipe;

[0064] 24. Tee pipe;

[0065] 25. Second water pipe;

[0066] 26. Flushing assembly; 2601. Fixed cylinder; 2602. Movable tube; 2603. Blade block; 2604. Piston sleeve; 2605. Second spring;

[0067] 27. Connecting ring; 2701. Ring seat; 2702. Sealing gasket; 2703. Slot; 2704. Chamfer;

[0068] 28. First electrically controlled valve;

[0069] 29. Second electrically controlled valve. Detailed Implementation

[0070] The present invention will be further illustrated by way of embodiments below, but the present invention is not limited to the scope of the embodiments described herein.

[0071] like Figure 1-10 As shown, a waste gas treatment system for semiconductor manufacturing includes a reaction chamber 14; it also includes: a spray washing mechanism surrounding the outer periphery of the reaction chamber 14, and a spiral spray channel 17 and a cooling chamber 16 disposed within the spray washing mechanism. The spray channel 17 is used for the flow of semiconductor waste gas, and its bottom end is connected to the bottom end of the reaction chamber 14; the cooling chamber 16 is located between the spray channel 17 and the outer wall of the reaction chamber 14; and a water receiving tank 6 disposed at the bottom of the spray channel 17, and connected to a high-pressure water pump 2 that can pump water from the tank into the cooling chamber 16. 2; Heater 18, which is disposed in the reaction chamber 14 and connected to a drive mechanism 5, which can drive the heater 18 to move vertically and rotate. An outlet pipe 20 communicating with the bottom of the reaction chamber 14 is provided below the heater 18, and the outlet pipe 20 is provided with a cover 21 that can be automatically released from positioning. A side opening 2001 is provided on one side of the outlet pipe 20, and a flushing assembly 26 connected to a high-pressure water pump 22 is provided on one side of the side opening 2001; Filter mechanism 12, which is connected to an exhaust pipe 9 and communicates with the top of the reaction chamber 14.

[0072] like Figure 1-2As shown, as a specific technical solution, an upper cover 3 and a lower cover 4 are fixedly installed at the top and bottom of the reaction chamber 14, respectively; the drive mechanism 5 is installed on the upper cover 3, and the drive mechanism 5 includes a screw 501, a carrier 502, a fixing nut 503, a prism 504, and a motor 505. A fixing nut 503 is fixedly installed in the middle of the upper cover 3. The screw 501 is threadedly connected to the fixing nut 503, and the bottom end of the screw 501 is fixedly connected to the top end of the heater 18. A mating hole with a top opening is opened at the axis of the screw 501. The mating hole is mated with the prism 504. The top end of the prism 504 is fixedly connected to the output shaft end of the motor 505. The carrier 502 is fixedly installed on the top surface of the upper cover 3, and the motor 505 is fixedly connected to the top of the carrier 502.

[0073] When the heater 18 needs to be cleaned, the motor 505 drives the prism 504 to rotate. The prism 504 causes the screw 501 to be threaded around the fixing nut 503, driving the heater 18 to move downward and rotate at the same time. It passes through the outlet pipe 20 and is further rinsed through the rinsing assembly 26 on the side of the outlet pipe 20. Through the downward movement and rotation of the heater 18, cleaning is achieved at various positions along the length of the heater 18.

[0074] The prism 504 and the mating hole on the screw 501 cooperate with each other. When the screw 501 moves downward, the two slide vertically, so that they form a telescopic structure. Thus, the prism 504 will not affect the downward movement of the screw 501.

[0075] like Figure 2 , Figure 4As shown in Figure 5, as a specific technical solution, the spray washing mechanism includes an outer cylinder 1, an inner cylinder 13, and a spray pipe 15; the outer cylinder 1, the inner cylinder 13, and the reaction chamber 14 are coaxially arranged, the top end of the outer cylinder 1 and the top end of the inner cylinder 13 are fixedly connected to the bottom surface of the upper cover 3, the bottom end of the outer cylinder 1 and the bottom end of the inner cylinder 13 are fixedly connected to the top surface of the lower cover 4, the spray pipe 15 is arranged between the outer cylinder 1 and the inner cylinder 13, and the inner cylinder 13 and the outer wall of the reaction chamber 14 form a cooling cavity 16. The spray pipe 15 consists of a spiral blade 1501, a spiral tube 1502, a baffle 1503, and a spray head 1504. The spiral blade 1501 is fixedly installed between the outer cylinder 1 and the inner cylinder 13, forming an annular groove between them. The annular groove is divided into spray channels 17 by the spiral blade 1501. The spiral tube 1502 is fixedly laid along the length of the spiral blade 1501. The system is equipped with several evenly distributed spray heads 1504. The top end of the spiral tube 1502 is closed, while the bottom end of the spiral tube 1502 is open. The open end of the spiral tube 1502 is connected to a high-pressure water inlet pipe 8 fixed to the wall of the outer cylinder 1, and the high-pressure water inlet pipe 8 extends to the outside of the outer cylinder 1. A baffle plate 1503 is fixedly installed at the top end of the spiral blade 1501. The top end of the spray channel 17 is connected to an exhaust gas inlet pipe 11, and the exhaust gas inlet pipe 11 is fixedly connected to the upper cover 3. The lower cover 4 includes a first sealing plate 401, a second sealing plate 402, connecting strips 403, and an outer ring 404. The first sealing plate 401 is fixedly sealed to the bottom of the cooling chamber 16, and the second sealing plate 402 is fixedly sealed to the bottom of the reaction chamber 14. The first sealing plate 401 and the outer ring 404 are fixedly connected by several connecting strips 403. A water trough is formed between every two adjacent connecting strips 403. The water trough is located between the spray channel 17 and the water receiving pool 6. The top of the water receiving pool 6 is fixedly connected to the bottom surface of the lower cover 4, and a filter screen 601 is installed inside the water receiving pool 6.

[0076] The outer cylinder 1 is fixedly mounted with a support frame 2, which is used to support the height of the support frame 2.

[0077] The inlet of the high-pressure water pump 22 is connected to a first water pipe 23, which is connected to the bottom of the water receiving pool 6. The outlet of the high-pressure water pump 22 is connected to a three-way pipe 24. The two ports of the three-way pipe 24 are respectively equipped with a first electrically controlled valve 28 and a second electrically controlled valve 29. The first electrically controlled valve 28 is connected to a second water pipe 25, which is connected to the bottom of the cooling chamber 16. The top of the cooling chamber 16 is connected to a drain outlet 10, which is fixedly connected to the upper cover 3. The second electrically controlled valve 29 is connected to the flushing assembly 26.

[0078] The exhaust gas inlet pipe 11 is connected to the exhaust gas outlet pipe of the semiconductor manufacturing machine. An air pump can be installed at the connection point to transport the exhaust gas. During exhaust gas input, air also needs to be introduced into the exhaust gas inlet pipe 11. Figure 1 As shown, there are two exhaust gas inlet pipes 11, which can be used to introduce air and exhaust gas respectively. The exhaust gas enters the top of the spiral spray channel 17 through the exhaust gas inlet pipe 11 and flows downward in the spray channel 17. The high-pressure water inlet pipe 8 is connected to a high-pressure cold water source. The water enters the spray head 1504 evenly distributed in the spray channel 17 through the spiral pipe 1502 and is sprayed through the spray head 1504 to perform spray washing of the exhaust gas. Through the above spiral design, the spray washing path is greatly extended and the spray washing effect is improved.

[0079] After the spray water is sprayed out, it falls onto the spiral blade 1501, is guided along the spiral blade 1501, passes through the water tank, and enters the water receiving pool 6. After being filtered by the filter screen 601, the water is collected. The above design creates a continuous water layer on the spiral blade 1501. When the exhaust gas comes into contact with the surface of this water layer, it can adsorb dust and water-soluble components in the exhaust gas, thereby improving the effect of spray washing.

[0080] The water after spraying is recycled into the water receiving tank; it is then extracted by the high-pressure water pump 22. The water enters the high-pressure water pump 22 through the first water pipe 23. With the first solenoid valve 28 open and the second solenoid valve 29 closed, the water enters the cooling chamber 16 through the second water pipe 25. After passing through the cooling chamber 16, the water is discharged from the drain outlet 10. The discharged water flows back to the high-pressure cold water source connected to the high-pressure water inlet pipe 8 through the pipeline.

[0081] The above design enables the spray washing of semiconductor waste gas and the use of the water after spray washing as a cold source for the cooling chamber 16.

[0082] like Figure 2 As shown, the bottom end of the spray channel 17 is connected to a first gas supply pipe 7 which is fixedly connected to the wall of the outer cylinder 1. The first gas supply pipe 7 is fixedly connected to a second gas supply pipe 19. The second gas supply pipe 19 is fixedly connected to the second sealing plate 402 and is connected to the bottom end of the reaction chamber 14.

[0083] The exhaust gas after being washed by the spray channel 17 enters the reaction chamber 14 through the first gas supply pipe 7 and the second gas supply pipe 19, and is heated by the heater 18 in the reaction chamber 14 for combustion treatment.

[0084] like Figure 1 and Figure 10As shown, the filtration mechanism 12 includes a housing 1201, a connecting pipe 1202, a filter 1203, and a fan 1204; the housing 1201 is fixedly connected to the outer wall of the outer cylinder 1, the fan 1204 is fixedly installed on one side of the housing 1201, the filter 1203 is provided inside the housing 1201, the connecting pipe 1202 is fixedly connected to the top of the housing 1201, the connecting pipe 1202 is fixedly connected to the exhaust pipe 9, and the bottom of the housing 1201 is connected to the air inlet of the fan 1204.

[0085] After the exhaust gas is burned in the reaction chamber 14, it enters the housing 1201 through the exhaust pipe 9 and the connecting pipe 1202, then is filtered by the filter 1203, and finally discharged by the fan 1204.

[0086] like Figure 2 , Figure 3 , Figure 6 , Figure 7 , Figure 8As shown in Figure 9, as a specific technical solution, the flushing assembly 26 includes a fixed cylinder 2601, a movable tube 2602, a blade block 2603, a piston sleeve 2604, and a second spring 2605. One end of the fixed cylinder 2601 is fixedly connected to the second electrically controlled valve 29. One end of the movable tube 2602 is fixedly sleeved with the piston sleeve 2604, and the outer ring of the piston sleeve 2604 is connected to the inner wall of the fixed cylinder 2601. The movable tube 2602 is connected to the end of the fixed cylinder 2601 away from the second electrically controlled valve 29, and the movable tube 2602 extends outside the fixed cylinder 2601. The second spring 2605 is provided inside the movable tube 2602, and the two ends of the second spring 2605 are fixedly connected to the movable tube 2602 and the fixed cylinder 2601, respectively. A water spray hole is provided at the end of the movable tube 2602 away from the piston sleeve 2604. The blade block 2603 is fixedly connected to the movable tube 2602 below the water spray hole. It also includes a connecting ring 27, which is connected to the sleeve 21; the connecting ring 27 includes a ring seat 2701, a sealing gasket 2702, a slot 2703, and a chamfer 2704; the ring seat 2701 is fixed to the bottom surface of the lower cover 4, and the ring seat 2701 is coaxially arranged with the outlet pipe 20; the sealing gasket 2702 is fixedly installed inside the ring seat 2701; the bottom inner edge of the ring seat 2701 is provided with a chamfer 2704; the inner side wall of the ring seat 2701 is provided with a slot 2703; the sleeve 21 includes a sleeve 2101, a guide sleeve 2102, a first spring 2103, an inclined insert 2104, a connecting rod 2105, a guide groove 2106, and a sealing ring 2107; the bottom end of the sleeve 2101 is closed, and the sleeve 2102 is closed. The sleeve 2101 has an open top and a sealing ring 2107 is fixedly installed on the inner wall of the closed end. The guide sleeve 2102 is fixedly installed on one side of the outer wall of the sleeve 2101. The inclined insert 2104 is connected to the guide sleeve 2102, and a first spring 2103 is provided inside the guide sleeve 2102. The two ends of the first spring 2103 are fixedly connected to the inclined insert 2104 and the guide sleeve 2102, respectively. The inclined end of the inclined insert 2104 is embedded in the slot 2703. The bottom of the guide sleeve 2102 has a guide groove 2106, which is slidably connected to the connecting rod 2105. The top end of the connecting rod 2105 is fixedly connected to the inclined insert 2104. The connecting rod 2105 is located on one side of the blade block 2603. The movable tube 2602 is a non-circular tube to prevent rotation between the movable tube 2602 and the fixed cylinder 2601.

[0087] After the entire exhaust gas treatment system is used, the heater 18 is driven by the drive mechanism 5 to extend into the outlet pipe 20, aligning the bottom side of the heater 18 with the flushing assembly 26. The second electrically controlled valve 29 is opened, the first electrically controlled valve 28 is closed, and the high-pressure water pump 22 is started, allowing high-pressure water to flow into the flushing assembly 26. The water pressure causes the piston sleeve 2604 and the movable tube 2602 to move. The movable tube 2602 extends from the fixed cylinder 2601, simultaneously stretching the second spring 2605. The blade 2603 moves along with the movable tube 2602, and the blade 2603 compresses and pushes the connecting rod 210. 5. The connecting rod 2105 slides along the guide groove 2106, causing the inclined insert 2104 to retract into the guide sleeve 2102, while simultaneously compressing the first spring 2103; this automatically releases the positioning lock of the sleeve 2101. Then, the sleeve 2101 is manually rotated. Since both the sleeve 2101 and the outlet pipe 20 are circular tubes, the sleeve 2101 can rotate on the outlet pipe 20, ensuring that the guide sleeve 2102 and the inclined insert 2104 are not in the same vertical plane as the flushing assembly 26. Then, the sleeve 2101 is pulled down, which pulls the cover 21 off the outlet pipe 20, allowing the bottom end of the outlet pipe 20 and the side opening 2001 to be unobstructed and open. Through the above design, the cover 21 can be automatically released from its positioning without manual operation. Preferably, the surface of the connecting rod 2105 that contacts the blade block 2603 is a circular arc surface.

[0088] After the outlet pipe 20 is opened, the high-pressure water pump 22 pressurizes the water and continues to drive the movable pipe 2602 to move, so that the movable pipe 2602 enters the outlet pipe 20 through the side opening 2001. The blade of the blade block 2603 is in contact with the surface of the heater 18. After contact, there is a certain gap between the end of the movable pipe 2602 and the heater 18. Water from the high-pressure water pump 22 is sprayed out through the spray hole on the movable pipe 2602 to rinse the heater 18. When the heater 18 is driven to rotate and move downward, the circumferential residue of the heater 18 can be rinsed and removed.

[0089] After the heater 18 has finished cleaning, the high-pressure water pump 22 is turned off, and the movable tube 2602 is reset by the elastic force of the second spring 2605; then the heater 18 is reset by the drive mechanism 5; next, the sleeve 21 is installed, aligning the top port of the sleeve 2101 with the outlet pipe 20, and positioning the guide sleeve 2102 and the inclined insert block 2104 on the left side of the sleeve 2101. The sleeve 2101 is pushed upward, and during the upward movement of the sleeve 2101, the chamfer 2704 is used to... The inclined surface of the inclined insert 2104 is pressed to insert it into the guide sleeve 2102. At the same time, the first spring 2103 is compressed until the top of the sleeve 2101 presses the sealing gasket 2702, and the bottom of the outlet pipe 20 presses the sealing ring 2107. Then the sleeve 2101 is rotated until the inclined insert 2104 is aligned with the slot 2703. The elastic force of the first spring 2103 causes the inclined insert 2104 to be inserted into the slot 2703, thus completing the installation.

[0090] This invention is not limited to the embodiments described above. Any changes in shape or structure shall fall within the protection scope of this invention. The protection scope of this invention is defined by the appended claims. Those skilled in the art may make various changes or modifications to these embodiments without departing from the principles and essence of this invention, but all such changes and modifications shall fall within the protection scope of this invention.

Claims

1. A system for treating exhaust gases in a semiconductor manufacturing process, comprising a reaction chamber (14); characterized in that, Also includes: A spray washing mechanism surrounds the outer periphery of the reaction chamber (14), and a spiral spray channel (17) and a cooling chamber (16) are provided inside the spray washing mechanism. The spray channel (17) is used for the flow of semiconductor waste gas, and the bottom end of the spray channel (17) is connected to the bottom end of the reaction chamber (14). The cooling chamber (16) is located between the spray channel (17) and the outer wall of the reaction chamber (14). Water receiving pool (6) is located at the bottom of the spray channel (17) and is connected to a high-pressure water pump (22) that can pump water in the pool into the cooling chamber (16). A heater (18) is installed in a reaction chamber (14). The heater (18) is connected to a drive mechanism (5). The drive mechanism (5) can drive the heater (18) to move vertically and rotate. An outlet pipe (20) is provided below the heater (18) and communicates with the bottom of the reaction chamber (14). The outlet pipe (20) is provided with a cover (21) that can be automatically released from positioning. A side opening (2001) is provided on one side of the outlet pipe (20). A flushing assembly (26) connected to a high-pressure water pump (22) is provided on one side of the side opening (2001). The filter mechanism (12) is connected to an exhaust pipe (9), and the exhaust pipe (9) is connected to the top of the reaction chamber (14); The top and bottom of the reaction chamber (14) are respectively fixedly installed with an upper cover (3) and a lower cover (4); the drive mechanism (5) is installed on the upper cover (3), the drive mechanism (5) includes a screw (501), a carrier (502), a fixing nut (503), a prism (504) and a motor (505), the middle part of the upper cover (3) is fixedly installed with a fixing nut (503), the screw (501) is threadedly connected to the fixing nut (503), and the bottom end of the screw (501) is fixedly connected to the top end of the heater (18), the screw (501) has a mating hole with an open top end at the axis of the screw (501), the mating hole is mated with the prism (504), and the top end of the prism (504) is connected to the motor (505). The output shaft end of 05 is fixedly connected, the carrier (502) is fixedly installed on the top surface of the upper cover (3), and the motor (505) is fixedly connected to the top of the carrier (502); the spray washing mechanism includes an outer cylinder (1), an inner cylinder (13) and a spray pipe (15); the outer cylinder (1), the inner cylinder (13) and the reaction chamber (14) are coaxially arranged, the top end of the outer cylinder (1) and the top end of the inner cylinder (13) are fixedly connected to the bottom surface of the upper cover (3), the bottom end of the outer cylinder (1) and the bottom end of the inner cylinder (13) are fixedly connected to the top surface of the lower cover (4), the spray pipe (15) is arranged between the outer cylinder (1) and the inner cylinder (13), and the inner cylinder (13) and the outer wall of the reaction chamber (14) form a cooling cavity (16).

2. The semiconductor manufacturing exhaust treatment system of claim 1, wherein: The spray pipe (15) is composed of a spiral blade (1501), a spiral tube (1502), a baffle (1503), and a spray head (1504). The spiral blade (1501) is fixedly installed between the outer cylinder (1) and the inner cylinder (13). The outer cylinder (1) and the inner cylinder (13) form an annular groove, which is divided into a spray channel (17) by the spiral blade (1501). The spiral tube (1502) is fixedly laid along the length of the spiral blade (1501), and the spiral tube (1502) extends along the length of the spiral blade (1501). The spiral tube (1502) is equipped with several evenly distributed spray heads (1504). The top end of the spiral tube (1502) is closed, and the bottom end of the spiral tube (1502) is open. The open end of the spiral tube (1502) is connected to a high-pressure water inlet pipe (8) fixed to the wall of the outer cylinder (1), and the high-pressure water inlet pipe (8) extends to the outside of the outer cylinder (1). The top end of the spiral blade (1501) is fixedly equipped with a partition plate (1503). The top end of the spray channel (17) is connected to an exhaust gas inlet pipe (11), and the exhaust gas inlet pipe (11) is fixedly connected to the upper cover (3).

3. The semiconductor manufacturing exhaust treatment system of claim 2, wherein: The lower cover (4) includes a first sealing plate (401), a second sealing plate (402), a connecting strip (403), and an outer ring (404); the first sealing plate (401) is fixedly sealed to the bottom of the cooling chamber (16), and the second sealing plate (402) is fixedly sealed to the bottom of the reaction chamber (14). The first sealing plate (401) and the outer ring (404) are fixedly connected by several connecting strips (403). A water trough is formed between every two adjacent connecting strips (403). The water trough is located between the spray channel (17) and the water receiving pool (6). The top of the water receiving pool (6) is fixedly connected to the bottom surface of the lower cover (4). A filter screen (601) is installed inside the water receiving pool (6).

4. The semiconductor manufacturing exhaust treatment system of claim 3, wherein: The bottom end of the spray channel (17) is connected to a first gas supply pipe (7) which is fixedly connected to the outer cylindrical wall. The first gas supply pipe (7) is fixedly connected to a second gas supply pipe (19). The second gas supply pipe (19) is fixedly connected to the second sealing plate (402) and is connected to the bottom end of the reaction chamber (14).

5. The semiconductor manufacturing exhaust treatment system of claim 1, wherein: The inlet of the high-pressure water pump (22) is connected to a first water pipe (23), which is connected to the bottom of the water receiving pool (6). The outlet of the high-pressure water pump (22) is connected to a three-way pipe (24). The two ports of the three-way pipe (24) are respectively equipped with a first electrically controlled valve (28) and a second electrically controlled valve (29). The first electrically controlled valve (28) is connected to a second water pipe (25), which is connected to the bottom of the cooling chamber (16). The top of the cooling chamber (16) is connected to a drain outlet (10), which is fixedly connected to the upper cover (3). The second electrically controlled valve (29) is connected to the flushing assembly (26).

6. The waste gas treatment system in semiconductor manufacturing process as described in claim 5, characterized in that: The flushing assembly (26) includes a fixed cylinder (2601), a movable tube (2602), a blade (2603), a piston sleeve (2604), and a second spring (2605). One end of the fixed cylinder (2601) is fixedly connected to the second electrically controlled valve (29), and one end of the movable tube (2602) is fixedly sleeved with the piston sleeve (2604), with the outer ring of the piston sleeve (2604) engaging with the inner wall of the fixed cylinder (2601). The movable tube (2602) and the fixed cylinder (2601) are located away from the second electrically controlled valve (29). Two electrically controlled valves (29) are connected at one end, and the movable tube (2602) extends to the outside of the fixed cylinder (2601). A second spring (2605) is provided inside the movable tube (2602). The two ends of the second spring (2605) are fixed to the movable tube (2602) and the fixed cylinder (2601) respectively. A water spray hole is provided at the end of the movable tube (2602) away from the piston sleeve (2604). The blade block (2603) is fixed to the area below the water spray hole on the movable tube (2602).

7. The semiconductor manufacturing exhaust treatment system of claim 6, wherein: It also includes a connecting ring (27), which is connected to the cover (21); the connecting ring (27) includes a ring seat (2701), a sealing gasket (2702), a slot (2703), and a chamfer (2704); the ring seat (2701) is fixed to the bottom surface of the lower cover (4), and the ring seat (2701) is coaxially arranged with the outlet pipe (20), and the sealing gasket (2702) is fixedly installed inside the ring seat (2701). The bottom inner edge of the ring seat (2701) is chamfered (2704), and the inner sidewall of the ring seat (2701) is provided with a slot (2703); the sleeve (21) includes a sleeve (2101), a guide sleeve (2102), a first spring (2103), a beveled insert (2104), a connecting rod (2105), a guide groove (2106), and a sealing ring (2107); the bottom end of the sleeve (2101) is closed. The sleeve (2101) has an open top, and a sealing ring (2107) is fixedly installed on the inner wall of the closed end of the sleeve (2101). The guide sleeve (2102) is fixedly installed on one side of the outer wall of the sleeve (2101). The inclined insert (2104) is connected to the guide sleeve (2102), and a first spring (2103) is provided inside the guide sleeve (2102). The two ends of the first spring (2103) are respectively connected to the inclined insert. (2104) and guide sleeve (2102) are fixedly connected, and one end of the inclined insert (2104) is embedded in the slot (2703). The bottom of the guide sleeve (2102) is provided with guide groove (2106). The guide groove (2106) is slidably connected to the connecting rod (2105), and the top end of the connecting rod (2105) is fixedly connected to the inclined insert (2104). The connecting rod (2105) is located on one side of the blade block (2603).

8. The semiconductor manufacturing exhaust treatment system of claim 1, wherein: The filtration mechanism (12) includes a housing (1201), a connecting pipe (1202), a filter (1203), and a fan (1204); the housing (1201) is fixedly connected to the outer wall of the outer cylinder (1), the fan (1204) is fixedly installed on one side of the housing (1201), the filter (1203) is provided inside the housing (1201), the connecting pipe (1202) is fixedly connected to the top of the housing (1201), the connecting pipe (1202) is fixedly connected to the exhaust pipe (9), and the bottom of the housing (1201) is connected to the air inlet of the fan (1204).

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