A semiconductor heating plate surface deformation detection device and method

Abstract

The present invention relates to the technical field of surface deformation detection, and discloses a semiconductor heating plate surface deformation detection device and method. Driven by a moving drive mechanism, a carrying platform drives the semiconductor heating plate to be detected to move below a detection groove. During the movement of the carrying platform, a shielding mechanism can shield the moving drive mechanism, and under the combined shielding effect of a fixed frame, a mounting platform and a shielding baffle, it can ensure the isolation of the moving drive mechanism from the external environment, effectively preventing external dust and other impurities from entering the moving space of the moving drive mechanism, and effectively ensuring the accuracy of the moving drive mechanism driving the carrying platform to move. During the movement of the semiconductor heating plate, each probe detection mechanism and microscopic detection mechanism traverse the plane to be detected of the semiconductor heating plate, jointly performing deformation detection on the plane to be detected of the semiconductor heating plate to ensure the accuracy of the deformation detection.

Description

Technical Field

[0001] The present invention relates to the technical field of surface deformation detection, and particularly to a device and method for detecting the surface deformation of a semiconductor heating plate. Background Art

[0002] In semiconductor manufacturing, a heating plate is a commonly used device for providing a high-temperature environment to promote chemical reactions or physical processes. Specifically, the heating plate not only provides stable and precise temperature control to ensure the smooth progress of the etching process, but also promotes uniform heat transfer, improves the accuracy and efficiency of etching, and effectively prevents material defects caused by temperature fluctuations. In addition, the heating plate also undertakes the mechanical support function to ensure that the semiconductor material remains stable throughout the processing process, thereby improving the overall process reliability and product quality.

[0003] However, the surface of the heating plate may deform during use. The minute deformation on the surface of the heating plate may trigger a series of chain reactions, seriously affecting the quality of semiconductor products and production efficiency. Among them, the slight deformation on the surface of the heating plate will cause changes in the heat conduction path, thereby leading to uneven temperature distribution. This temperature difference may generate different degrees of thermal stress in different regions of the wafer, ultimately reflecting on the quality of the finished product.

[0004] The unevenness of the heating plate surface will be directly transmitted to the wafer. Especially during the high-temperature treatment stage, the increase in wafer warping not only increases the difficulty of subsequent processes, but may also cause the wafer to break in some cases. Wafer warping will also interfere with the alignment accuracy of the lithography machine and reduce the yield. The long-term accumulated surface deformation of the heating plate will affect the overall performance of the heating plate. As the amount of deformation increases, the heating plate may not be able to maintain the required temperature accuracy, resulting in a decrease in the thermal management efficiency of the entire system, an increase in energy consumption, and an increase in operating costs. In some special processes, such as plasma-enhanced chemical vapor deposition (PECVD), the unevenness of the heating plate surface may lead to the formation of local hot spots, and these hot spots may trigger unexpected chemical reactions and even pose safety hazards.

[0005] Therefore, before the semiconductor heating plate is put into use, it is necessary to detect the surface deformation of the semiconductor heating plate to avoid the influence of the heating plate on the semiconductor product production process. Summary of the Invention

[0006] In view of the deficiencies of the prior art, the present invention provides a device and method for detecting the surface deformation of a semiconductor heating plate.

[0007] To solve the above technical problems, the present invention provides the following technical solutions:

[0008] A semiconductor heating plate surface deformation detection device, comprising a bearing support and a fixed frame. The fixed frame is fixed at the top of the bearing support. An installation platform is provided at the top of the fixed frame. A bearing platform is provided inside the fixed frame and below the installation platform. A detection groove is formed on one side of the surface of the installation platform. A shielding baffle is provided at the top of the fixed frame and on the side of the installation platform close to the detection groove. A moving driving mechanism is provided at the bottom of the bearing platform. The moving driving mechanism can drive the bearing platform to move inside the space enclosed by the fixed frame, the installation platform and the shielding baffle. A shielding mechanism is further provided outside the bearing platform. During the movement of the bearing platform, the shielding mechanism can shield the moving driving mechanism. A plurality of probe detection mechanisms are provided on the upper surface of the installation platform and outside the detection groove. A microscopic detection mechanism is provided on the upper surface of the installation platform and on the side far from the detection groove. The bearing platform can carry a semiconductor heating plate inside. Driven by the moving driving mechanism, the bearing platform carries the semiconductor heating plate to move. Each of the probe detection mechanisms and the microscopic detection mechanism traverse the plane to be detected of the semiconductor heating plate, and jointly perform deformation detection on the plane to be detected of the semiconductor heating plate.

[0009] Preferably, the bearing platform includes a bearing housing. An end bearing groove, a base bearing circular groove and an external support collar are provided at the top of the bearing housing. The external support collar is provided outside the base bearing circular groove, and the external support collar can rotate on the top of the bearing housing. The end and the base of the semiconductor heating plate are respectively placed inside the end bearing groove and the base bearing circular groove.

[0010] Preferably, a plurality of base positioning units are provided at the top of the external support collar and outside the base bearing circular groove. A support sandbag is provided at the bottom end inside the base bearing circular groove. The base of the semiconductor heating plate can slide on the surface of the support sandbag. Each of the base positioning units can cooperate to drive the axis of the base of the semiconductor heating plate to be collinear with the axis of the base bearing circular groove. Each of the base positioning units can cooperate to press the plane to be detected of semiconductor heating plates with different thicknesses onto the same measurement plane, and when each of the base positioning units presses the semiconductor heating plate together, the support sandbag can deform to fit the bottom shape of the semiconductor heating plate.

[0011] Preferably, a rotation driving cylinder is provided at the bottom end of the outer support collar. The movable end of the rotation driving cylinder is connected to the outer support collar through a driving link. The driving link is rotatably connected to both the outer support collar and the rotation driving cylinder. The telescopic movement of the movable end of the rotation driving cylinder can drive the outer support collar through the driving link to drive each of the substrate positioning units to rotate together around the axis of the substrate bearing circular groove.

[0012] Preferably, each of the substrate positioning units includes a positioning driving cylinder and a pressing clamping plate. A propulsion support plate is provided at the bottom end of the pressing clamping plate. The movable end of the positioning driving cylinder is fixed to the pressing clamping plate. The positioning driving cylinder can drive the pressing clamping plate and the propulsion support plate to move together in the direction of the axis of the substrate bearing circular groove. A number of sliding balls are embedded inside the side surfaces of the pressing clamping plate and the propulsion support plate close to the semiconductor heating plate. Each of the sliding balls can rotate independently.

[0013] Preferably, each of the positioning driving cylinders extends synchronously to drive each of the propulsion support plates to move synchronously in the direction of the axis of the substrate bearing circular groove, jointly driving the semiconductor heating plate to slide on the surface of the support sandbag, and driving the axis of the substrate of the semiconductor heating plate to be collinear with the axis of the substrate bearing circular groove. During the detection process of the probe detection mechanism and the microscopic detection mechanism, the rotation driving cylinder drives each of the pressing clamping plates and each of the propulsion support plates to rotate around the axis of the semiconductor heating plate, exposing the plane to be detected of the partially shielded semiconductor heating plate.

[0014] Preferably, the moving driving mechanism includes a lateral driving motor, a lateral limiting track, a moving mounting plate, a longitudinal driving motor, and a longitudinal limiting track. The lateral driving motor and the lateral limiting track are fixed to the inner bottom end of the fixed frame. The bottom end of the moving mounting plate fits with the lateral limiting track. The driving end of the lateral driving motor is coaxially fixed to a lateral driving rod. The lateral driving rod is threadedly connected to the moving mounting plate. The longitudinal driving motor and the longitudinal limiting track are fixed to the top end of the moving mounting plate. The bottom end of the carrying housing fits with the longitudinal limiting track. The driving end of the longitudinal driving motor is coaxially fixed to a longitudinal driving rod. The longitudinal driving rod is threadedly connected to the carrying housing.

[0015] Preferably, the shielding baffle includes a fixed baffle and a sliding baffle. Sliding tracks are provided on both sides of the fixed baffle. The sliding baffle fits with the sliding tracks, and the sliding baffle can slide under the limitation of the sliding tracks. The shielding mechanism includes two transverse shielding curtains and two longitudinal shielding curtains. One end of the transverse shielding curtain is provided with a transverse connecting plate, and the other end of the transverse shielding curtain away from the transverse connecting plate is wound inside a transverse winding box. One end of the longitudinal shielding curtain is provided with a longitudinal connecting plate, and the other end of the longitudinal shielding curtain away from the longitudinal connecting plate is wound inside a longitudinal winding box.

[0016] Preferably, the two transverse connecting plates are respectively fixed on both sides of the moving mounting plate. When the moving mounting plate moves, the transverse winding box on one side unwinds the corresponding transverse shielding curtain, and the transverse winding box on the other side winds the corresponding transverse shielding curtain. The two longitudinal connecting plates are respectively fixed on both sides of the bearing housing. When the bearing housing moves, the longitudinal winding box on one side unwinds the corresponding longitudinal shielding curtain, and the longitudinal winding box on the other side winds the corresponding longitudinal shielding curtain.

[0017] A method for detecting the surface deformation of a semiconductor heating plate uses the above-mentioned device for detecting the surface deformation of a semiconductor heating plate, and includes the following steps:

[0018] Open the shielding baffle, place the semiconductor heating plate to be detected with the plane to be detected facing up inside the bearing platform, and close the shielding baffle.

[0019] The moving drive mechanism drives the bearing platform to drive the semiconductor heating plate to be detected to move below the detection slot.

[0020] During the movement of the semiconductor heating plate, each probe detection mechanism and microscopic detection mechanism traverse the plane to be detected of the semiconductor heating plate, and jointly perform deformation detection on the plane to be detected of the semiconductor heating plate.

[0021] Open the shielding baffle, take out the semiconductor heating plate that has been detected from inside the bearing platform, and then place the next semiconductor heating plate to be detected inside the bearing platform.

[0022] Compared with the prior art, the present invention provides a device and method for detecting the surface deformation of a semiconductor heating plate, and has the following beneficial effects:

[0023] 1. In the surface deformation detection device of this semiconductor heating plate, driven by the moving drive mechanism, the bearing platform drives the semiconductor heating plate to be detected to move below the detection groove. During the movement of the bearing platform, the shielding mechanism can shield the moving drive mechanism, and under the combined shielding effect of the fixed frame, the installation platform and the shielding baffle, it can ensure the isolation of the moving drive mechanism from the external environment, effectively prevent external dust and other impurities from entering the moving space of the moving drive mechanism, and effectively ensure the accuracy of the moving drive mechanism driving the bearing platform to move. During the movement of the semiconductor heating plate, each probe detection mechanism and microscopic detection mechanism traverse the plane to be detected of the semiconductor heating plate, and jointly perform deformation detection on the plane to be detected of the semiconductor heating plate to ensure the accuracy of the deformation detection.

[0024] 2. In the surface deformation detection device of this semiconductor heating plate, during the process of each positioning drive cylinder synchronously driving each pressing clamp plate to move towards the axis direction of the base bearing circular groove, due to the inclined plane at the bottom of the pressing clamp plate, during the movement of the pressing clamp plate, a downward pressing force on the semiconductor heating plate is provided through the inclined plane, and the semiconductor heating plate is driven to press down on the support sandbag to generate deformation to fit the bottom shape of the semiconductor heating plate. Thus, when the semiconductor heating plate moves to the plane at the bottom of the pressing clamp plate, since the planes at the bottoms of each pressing clamp plate are coplanar, the support sandbag can generate deformation to press the plane to be detected of semiconductor heating plates with different thicknesses onto the same measurement plane. And during the process of each positioning drive cylinder synchronously driving each propulsion support plate to move towards the axis direction of the base bearing circular groove, it can push the semiconductor heating plate towards the center position of the base bearing circular groove, making the axis of the base of the semiconductor heating plate collinear with the axis of the base bearing circular groove, and enabling precise positioning of the semiconductor heating plate to ensure the effectiveness of the detection result.

[0025] 3. In the surface deformation detection device of this semiconductor heating plate, through the telescopic movement of the movable end of the rotation drive cylinder, it can drive the external support collar through the drive link to drive each base positioning unit to rotate around the axis of the base bearing circular groove, so as to rotate each pressing clamp plate and each propulsion support plate around the axis of the semiconductor heating plate, expose the plane to be detected of the partially shielded semiconductor heating plate, and through the function of the sliding balls embedded in the sides of the pressing clamp plate and the propulsion support plate close to the semiconductor heating plate, avoid damage to the semiconductor heating plate during the relative movement between the pressing clamp plate and the propulsion support plate and the surface to be detected of the semiconductor heating plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a three-dimensional structural schematic diagram of a surface deformation detection device for a semiconductor heating plate according to the present invention;

[0027] Figure 2Schematic diagram one of the installation structure of the fixing frame and the installation platform of a semiconductor heating plate surface deformation detection device according to the present invention;

[0028] Figure 3 Schematic diagram two of the installation structure of the fixing frame and the installation platform of a semiconductor heating plate surface deformation detection device according to the present invention;

[0029] Figure 4 Schematic diagram one of the three-dimensional structure of the bearing platform, the moving drive mechanism and the shielding mechanism of a semiconductor heating plate surface deformation detection device according to the present invention;

[0030] Figure 5 Schematic diagram two of the three-dimensional structure of the bearing platform, the moving drive mechanism and the shielding mechanism of a semiconductor heating plate surface deformation detection device according to the present invention;

[0031] Figure 6 Three-dimensional structure of the moving drive mechanism and the shielding mechanism of a semiconductor heating plate surface deformation detection device according to the present invention;

[0032] Figure 7 Schematic diagram of the assembly structure of the bearing platform of a semiconductor heating plate surface deformation detection device according to the present invention;

[0033] Figure 8 Schematic diagram one of the three-dimensional structure of the external support collar and each substrate positioning unit of a semiconductor heating plate surface deformation detection device according to the present invention;

[0034] Figure 9 Schematic diagram two of the three-dimensional structure of the external support collar and each substrate positioning unit of a semiconductor heating plate surface deformation detection device according to the present invention;

[0035] Figure 10 According to the present invention Figure 9 Enlarged view of part A.

[0036] In the figure: 1, bearing support; 2, fixed frame; 21, shielding baffle; 211, fixed baffle; 212, sliding baffle; 213, sliding track; 3, installation platform; 31, detection groove; 4, bearing platform; 41, bearing housing; 42, end bearing groove; 43, matrix bearing circular groove; 44, external support collar; 441, rotation drive cylinder; 442, drive connecting rod; 45, matrix positioning unit; 451, positioning drive cylinder; 452, pressing splint; 453, propulsion support plate; 454, sliding ball; 46, supporting sandbag; 5, moving drive mechanism; 51, lateral drive motor; 52, lateral limiting track; 53, moving mounting plate; 54, longitudinal drive motor; 55, longitudinal limiting track; 56, lateral drive rod; 57, longitudinal drive rod; 6, shielding mechanism; 61, lateral shielding curtain; 62, longitudinal shielding curtain; 63, lateral connecting plate; 64, lateral winding box; 65, longitudinal connecting plate; 66, longitudinal winding box; 7, probe detection mechanism; 71, probe fixing plate; 72, probe extension plate; 73, detection probe; 8, microscopic detection mechanism. Detailed implementation manner

[0037] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0038] As introduced in the background art, there are deficiencies in the prior art. To solve the above technical problems, the present application proposes a semiconductor heating plate surface deformation detection device and method.

[0039] Embodiment 1

[0040] Please refer to Figures 1-10, A surface deformation detection device for a semiconductor heating plate, comprising a bearing support 1 and a fixed frame 2. The fixed frame 2 is fixed at the top of the bearing support 1. An installation platform 3 is provided at the top of the fixed frame 2. Inside the fixed frame 2 and below the installation platform 3, there is a bearing platform 4; on one side of the surface of the installation platform 3, a detection groove 31 is opened. At the top of the fixed frame 2 and on the side of the installation platform 3 close to the detection groove 31, there is a shielding baffle 21. At the bottom of the bearing platform 4, there is a moving driving mechanism 5, and the moving driving mechanism 5 can drive the bearing platform 4 to move inside the space enclosed by the fixed frame 2, the installation platform 3, and the shielding baffle 21; outside the bearing platform 4, there is also a shielding mechanism 6. During the movement of the bearing platform 4, the shielding mechanism 6 can shield the moving driving mechanism 5; on the upper surface of the installation platform 3 and outside the detection groove 31, there are several probe detection mechanisms 7. On the upper surface of the installation platform 3 and on the side far from the detection groove 31, there is a microscopic detection mechanism 8; the bearing platform 4 can carry a semiconductor heating plate inside. Driven by the moving driving mechanism 5, the bearing platform 4 drives the semiconductor heating plate to move, and each probe detection mechanism 7 and microscopic detection mechanism 8 traverse the plane to be detected of the semiconductor heating plate, jointly performing deformation detection on the plane to be detected of the semiconductor heating plate.

[0041] During use, first open the shielding baffle 21, place the semiconductor heating plate to be detected with the plane to be detected facing up inside the bearing platform 4, then close the shielding baffle 21. Driven by the moving driving mechanism 5, the bearing platform 4 drives the semiconductor heating plate to be detected to move below the detection groove 31. During the movement of the bearing platform 4, the shielding mechanism 6 can shield the moving driving mechanism 5, and with the combined shielding effect of the fixed frame 2, the installation platform 3, and the shielding baffle 21, it can ensure the isolation of the moving driving mechanism 5 from the external environment, effectively preventing external dust and other impurities from entering the moving space of the moving driving mechanism 5, effectively ensuring the accuracy of the moving driving mechanism 5 to drive the bearing platform 4 to move. Thus, during the movement of the semiconductor heating plate, each probe detection mechanism 7 and microscopic detection mechanism 8 traverse the plane to be detected of the semiconductor heating plate, jointly performing deformation detection on the plane to be detected of the semiconductor heating plate, ensuring the accuracy of the deformation detection. After the detection is completed, open the shielding baffle 21, take out the detected semiconductor heating plate from inside the bearing platform 4, and then put the next semiconductor heating plate to be detected inside the bearing platform 4, so as to continuously perform deformation detection on multiple semiconductor heating plates to be detected.

[0042] Among them, the microscopic detection mechanism 8 can use methods such as laser plane interferometry, reflection illuminance method, and image analysis method. Among them, the specific principle of the reflection illuminance method is as follows: A detection light source is used to provide uniformly intense light illumination in a direction to the plane to be detected, and a reflected light receiver can receive the light reflected from the plane to be detected. The reflected light receiver receives the reflected light intensities of the plane to be detected at multiple points, takes their average value, and then judges the deviation degree of the reflected light intensity at each point from the average reflected light intensity, so as to be able to determine the flatness of the plane to be detected according to the range of the deviation degree.

[0043] The detection principle of the probe detection mechanism 7 is a common probe detection scheme in the prior art. Specifically: Represented by a coordinate measuring machine, a probe is used to contact the sampling points of a plane to obtain a limited number of coordinate data; a probe is used to contact the sampling points of a plane to obtain a limited number of coordinate data. After preprocessing such as noise reduction and leveling, select the ISO12781 flatness evaluation tool, select the least squares method or the minimum zone method, and set the filtering parameters, then the flatness result can be obtained.

[0044] Embodiment 2

[0045] Please refer to Figures 1-2 、 Figures 4-10 which is different from the above embodiment in that the bearing platform 4 includes a bearing housing 41. At the top of the bearing housing 41, there are an end bearing groove 42, a base bearing circular groove 43, and an external support collar 44. The external support collar 44 is arranged outside the base bearing circular groove 43, and the external support collar 44 can rotate on the top of the bearing housing 41. The end and the base of the semiconductor heating plate are respectively placed inside the end bearing groove 42 and the base bearing circular groove 43.

[0046] At the top of the external support collar 44 and outside the base bearing circular groove 43, there are several base positioning units 45. At the bottom end inside the base bearing circular groove 43, there is a support sandbag 46; the base of the semiconductor heating plate can slide on the surface of the support sandbag 46. Each base positioning unit 45 can cooperate to drive the axis of the base of the semiconductor heating plate to be collinear with the axis of the base bearing circular groove 43; each base positioning unit 45 can cooperate to press the plane to be detected of semiconductor heating plates with different thicknesses onto the same measurement plane, and when each base positioning unit 45 presses the semiconductor heating plate together, the support sandbag 46 can deform to fit the bottom shape of the semiconductor heating plate.

[0047] A rotation driving cylinder 441 is provided at the bottom end of the external support collar 44. The movable end of the rotation driving cylinder 441 is connected to the external support collar 44 through a driving connecting rod 442. The driving connecting rod 442 is rotatably connected to both the external support collar 44 and the rotation driving cylinder 441. The telescopic movement of the movable end of the rotation driving cylinder 441 can drive the external support collar 44 through the driving connecting rod 442 to drive each base positioning unit 45 to rotate together around the axis of the base bearing circular groove 43.

[0048] Each base positioning unit 45 includes a positioning driving cylinder 451 and a pressing clamping plate 452 (the bottom end of the pressing clamping plate 452 is an inclined surface and a flat surface, and the side close to the propulsion support plate 453 is a flat surface). A propulsion support plate 453 is provided at the bottom end of the pressing clamping plate 452. The movable end of the positioning driving cylinder 451 is fixed to the pressing clamping plate 452. The positioning driving cylinder 451 can drive the pressing clamping plate 452 and the propulsion support plate 453 to move together in the direction of the axis of the base bearing circular groove 43. A number of sliding balls 454 are embedded inside the side surfaces of the pressing clamping plate 452 and the propulsion support plate 453 close to the semiconductor heating plate. Each sliding ball 454 can rotate independently.

[0049] Each positioning driving cylinder 451 extends synchronously, driving each propulsion support plate 453 to move synchronously in the direction of the axis of the base bearing circular groove 43, jointly driving the semiconductor heating plate to slide on the surface of the support sandbag 46, and driving the axis of the base of the semiconductor heating plate to be collinear with the axis of the base bearing circular groove 43. During the detection process of the probe detection mechanism 7 and the microscopic detection mechanism 8, the rotation driving cylinder 441 drives each pressing clamping plate 452 and each propulsion support plate 453 to rotate around the axis of the semiconductor heating plate, exposing the plane to be detected of the partially shielded semiconductor heating plate.

[0050] During use, first place the ends and the substrates of the semiconductor heating plates to be detected inside the end bearing grooves 42 and the substrate bearing circular grooves 43 respectively. Through the arrangement of the supporting sandbags 46, the substrates of the semiconductor heating plates can slide on the surfaces of the supporting sandbags 46. During the process that each positioning driving cylinder 451 synchronously drives each pressing clamping plate 452 to move towards the axis direction of the substrate bearing circular groove 43, due to the slope effect at the bottom end of the pressing clamping plate 452, during the movement of the pressing clamping plate 452, a downward pressing force for the semiconductor heating plate is provided through the slope, and the semiconductor heating plate is driven to press down on the supporting sandbag 46 to generate deformation to fit the shape of the bottom end of the semiconductor heating plate. Thus, when the semiconductor heating plate moves to the plane at the bottom end of the pressing clamping plate 452, since the planes at the bottom ends of each pressing clamping plate 452 are coplanar, the supporting sandbag 46 can generate deformation to press the detection planes of semiconductor heating plates with different thicknesses on the same measurement plane. And during the process that the positioning driving cylinder 451 synchronously drives each pushing support plate 453 to move towards the axis direction of the substrate bearing circular groove 43, the semiconductor heating plate can be pushed to move towards the central position of the substrate bearing circular groove 43, so that the axis of the substrate of the semiconductor heating plate is collinear with the axis of the substrate bearing circular groove 43, and thus the semiconductor heating plate can be accurately positioned to ensure the effectiveness of the detection result;

[0051] And during the process that the positioning driving cylinder 451 drives the pressing clamping plate 452 and the pushing support plate 453 to move towards the axis direction of the substrate bearing circular groove 43 together, due to the independent rotation of a plurality of sliding balls 454 at the bottom end of the pressing clamping plate 452, the friction between the pressing clamping plate 452 and the detection surface of the semiconductor heating plate can be avoided to damage the detection surface of the semiconductor heating plate. At the same time, the influence of the friction on the accurate positioning of the semiconductor heating plate can also be reduced; and since the pressing clamping plate 452 shields part of the detection surface of the semiconductor heating plate, the telescopic movement of the movable end of the rotation driving cylinder 441 can drive the external support collar 44 through the driving connecting rod 442 to drive each substrate positioning unit 45 to rotate around the axis of the substrate bearing circular groove 43 together, so as to rotate each pressing clamping plate 452 and each pushing support plate 453 around the axis of the semiconductor heating plate, expose the detection planes of the partially shielded semiconductor heating plates, and through the action of the sliding balls 454 embedded in the sides of the pressing clamping plate 452 and the pushing support plate 453 close to the semiconductor heating plate, damage to the semiconductor heating plate can be avoided during the relative movement between the pressing clamping plate 452 and the pushing support plate 453 and the detection surface of the semiconductor heating plate.

[0052] Embodiment III

[0053] Please refer to Figures 1-6, different from the above embodiments, the moving drive mechanism 5 includes a lateral drive motor 51, a lateral limit track 52, a moving mounting plate 53, a longitudinal drive motor 54 and a longitudinal limit track 55; the lateral drive motor 51 and the lateral limit track 52 are fixed to the inner bottom end of the fixed frame 2, the bottom end of the moving mounting plate 53 fits with the lateral limit track 52, the drive end of the lateral drive motor 51 is coaxially fixed to a lateral drive rod 56, and the lateral drive rod 56 is threadedly connected to the moving mounting plate 53; the longitudinal drive motor 54 and the longitudinal limit track 55 are fixed to the top end of the moving mounting plate 53, the bottom end of the carrying housing 41 fits with the longitudinal limit track 55, the drive end of the longitudinal drive motor 54 is coaxially fixed to a longitudinal drive rod 57, and the longitudinal drive rod 57 is threadedly connected to the carrying housing 41.

[0054] The shielding baffle 21 includes a fixed baffle 211 and a sliding baffle 212. Sliding tracks 213 are provided on both sides of the fixed baffle 211, the sliding baffle 212 fits with the sliding tracks 213, and the sliding baffle 212 can slide under the limitation of the sliding tracks 213; the shielding mechanism 6 includes two lateral shielding curtains 61 and two longitudinal shielding curtains 62. A lateral connecting plate 63 is provided at one end of the lateral shielding curtain 61, and the end of the lateral shielding curtain 61 away from the lateral connecting plate 63 is wound inside a lateral winding box 64. A longitudinal connecting plate 65 is provided at one end of the longitudinal shielding curtain 62, and the end of the longitudinal shielding curtain 62 away from the longitudinal connecting plate 65 is wound inside a longitudinal winding box 66.

[0055] The two lateral connecting plates 63 are respectively fixed to both sides of the moving mounting plate 53. When the moving mounting plate 53 moves, the lateral winding box 64 on one side unwinds the corresponding lateral shielding curtain 61, and the lateral winding box 64 on the other side winds the corresponding lateral shielding curtain 61; the two longitudinal connecting plates 65 are respectively fixed to both sides of the carrying housing 41. When the carrying housing 41 moves, the longitudinal winding box 66 on one side unwinds the corresponding longitudinal shielding curtain 62, and the longitudinal winding box 66 on the other side winds the corresponding longitudinal shielding curtain 62.

[0056] Thus, during use, the driving end of the lateral driving motor 51 is coaxially fixed to the lateral driving rod 56, and the lateral driving rod 56 is threadedly connected to the moving mounting plate 53, so that the power output by the lateral driving motor 51 can drive the moving mounting plate 53 and the carrying housing 41 to move laterally. Similarly, the driving end of the longitudinal driving motor 54 is coaxially fixed to the longitudinal driving rod 57, and the longitudinal driving rod 57 is threadedly connected to the carrying housing 41, so that the power output by the longitudinal driving motor 54 can drive the carrying housing 41 to move longitudinally, thereby stably driving the movement of the carrying housing 41 and the semiconductor heating plate to be detected carried thereon. During the movement, when the moving mounting plate 53 moves, the lateral winding box 64 on one side unwinds the corresponding lateral shielding curtain 61, and the lateral winding box 64 on the other side winds the corresponding lateral shielding curtain 61; the two longitudinal connecting plates 65 are respectively fixed on both sides of the carrying housing 41. When the carrying housing 41 moves, the longitudinal winding box 66 on one side unwinds the corresponding longitudinal shielding curtain 62, and the longitudinal winding box 66 on the other side winds the corresponding longitudinal shielding curtain 62, so as to cooperate with the shielding effects of the fixed baffle 211, the sliding baffle 212, the fixed frame 2 and the mounting platform 3, and effectively prevent external dust and other impurities from entering the moving space of the moving driving mechanism 5, and effectively ensure the accuracy of the moving driving mechanism 5 to drive the carrying platform 4 to move.

[0057] Embodiment Four

[0058] Please refer to Figures 1-3 , which is different from the above embodiment in that the probe detection mechanism 7 includes a probe fixing plate 71, a probe extension plate 72 and a detection probe 73. The probe fixing plate 71 is fixed to the mounting platform 3. One end of the probe extension plate 72 is fixed to the probe fixing plate 71, and the other end of the probe extension plate 72 extends into the detection slot 31. The detection probe 73 is arranged at one end of the probe extension plate 72 located inside the detection slot 31; the microscopic detection mechanism 8 includes a magnifying electron microscope and a display screen. During the process of the carrying platform 4 carrying the semiconductor heating plate and moving, each detection probe 73 and the magnifying electron microscope traverse the plane to be detected of the semiconductor heating plate, and jointly perform deformation detection on the plane to be detected of the semiconductor heating plate.

[0059] Thus, each detection probe 73 can perform probe detection. In this embodiment, the microscopic detection mechanism 8 uses image analysis method to analyze the flatness of the plane to be detected, and through the combined magnification of the magnifying electron microscope and the display screen, the deformation detection of the plane to be detected of the semiconductor heating plate can be performed through picture comparison algorithm, brightness detection algorithm, etc.

[0060] Embodiment Five

[0061] A method for detecting the surface deformation of a semiconductor heating plate, using a device for detecting the surface deformation of a semiconductor heating plate described in any one of Embodiments 1-4, includes the following steps:

[0062] Open the shielding baffle 21, place the semiconductor heating plate to be detected with the plane to be detected facing upward inside the bearing platform 4, and close the shielding baffle 21;

[0063] The moving drive mechanism 5 drives the bearing platform 4 to drive the semiconductor heating plate to be detected to move below the detection groove 31;

[0064] During the movement of the semiconductor heating plate, each probe detection mechanism 7 and the microscopic detection mechanism 8 traverse the plane to be detected of the semiconductor heating plate, and jointly perform deformation detection on the plane to be detected of the semiconductor heating plate;

[0065] Open the shielding baffle 21, take out the semiconductor heating plate that has been detected from inside the bearing platform 4, and then place the next semiconductor heating plate to be detected inside the bearing platform 4.

[0066] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor heating plate surface deformation detection device, comprising a bearing support and a fixed frame, the fixed frame being fixed to the top of the bearing support, characterized in that: An installation platform is provided at the top of the fixed frame, and a bearing platform is provided inside the fixed frame and below the installation platform; A detection groove is formed on one side of the surface of the installation platform. A shielding baffle is provided at the top of the fixed frame and on the side of the installation platform close to the detection groove. A moving driving mechanism is provided at the bottom of the bearing platform, and the moving driving mechanism can drive the bearing platform to move inside the space enclosed by the fixed frame, the installation platform, and the shielding baffle; A shielding mechanism is further provided outside the bearing platform. During the movement of the bearing platform, the shielding mechanism can shield the moving driving mechanism; A plurality of probe detection mechanisms are provided on the upper surface of the installation platform and outside the detection groove, and a microscopic detection mechanism is provided on the upper surface of the installation platform and on the side away from the detection groove; The inside of the bearing platform can carry a semiconductor heating plate. Driven by the moving driving mechanism, the bearing platform carries the semiconductor heating plate to move, and each of the probe detection mechanisms and the microscopic detection mechanism traverse the plane to be detected of the semiconductor heating plate to jointly perform deformation detection on the plane to be detected of the semiconductor heating plate; The bearing platform includes a bearing housing. An end bearing groove, a matrix bearing circular groove, and an external support collar are provided at the top of the bearing housing. A plurality of matrix positioning units are provided at the top of the external support collar and outside the matrix bearing circular groove. A support sandbag is provided at the bottom end inside the matrix bearing circular groove; The matrix of the semiconductor heating plate can slide on the surface of the support sandbag, and each of the matrix positioning units can cooperate to drive the axis of the matrix of the semiconductor heating plate to be collinear with the axis of the matrix bearing circular groove; Each of the matrix positioning units can cooperate to press the plane to be detected of semiconductor heating plates with different thicknesses onto the same measurement plane, and when each of the matrix positioning units jointly presses the semiconductor heating plate, the support sandbag can deform to fit the bottom shape of the semiconductor heating plate.

2. The surface deformation detection device for a semiconductor heating plate according to claim 1, wherein: The external support collar is provided outside the matrix bearing circular groove, and the external support collar can rotate on the top of the bearing housing. The end and the matrix of the semiconductor heating plate are respectively placed inside the end bearing groove and the matrix bearing circular groove.

3. A semiconductor heating plate surface deformation detection device according to claim 2, characterized in that: A rotation driving cylinder is provided at the bottom end of the external support collar. The movable end of the rotation driving cylinder is connected to the external support collar through a driving connecting rod, and the driving connecting rod is rotatably connected to both the external support collar and the rotation driving cylinder; The telescopic movement of the movable end of the rotation driving cylinder can drive the external support collar through the driving connecting rod to drive each of the matrix positioning units to jointly rotate around the axis of the matrix bearing circular groove.

4. A semiconductor heating plate surface deformation detection device according to claim 3, characterized in that: Each of the matrix positioning units includes a positioning driving cylinder and a pressing clamping plate. A propulsion support plate is provided at the bottom end of the pressing clamping plate. The movable end of the positioning driving cylinder is fixed to the pressing clamping plate, and the positioning driving cylinder can drive the pressing clamping plate and the propulsion support plate to jointly move towards the axis direction of the matrix bearing circular groove; A number of sliding balls are embedded inside the side surfaces of the pressing clamping plate and the pushing support plate close to the semiconductor heating plate, and each of the sliding balls can rotate independently.

5. The surface deformation detection device for a semiconductor heating plate according to claim 4, characterized in that: Each of the positioning drive cylinders extends synchronously, driving each of the pushing support plates to move synchronously towards the axis direction of the matrix bearing circular groove, jointly driving the semiconductor heating plate to slide on the surface of the supporting sandbag, and driving the axis of the matrix of the semiconductor heating plate to be collinear with the axis of the matrix bearing circular groove; During the detection process of the probe detection mechanism and the microscopic detection mechanism, the rotation drive cylinder drives each of the pressing clamping plates and each of the pushing support plates to rotate around the axis of the semiconductor heating plate, exposing the plane to be detected of the partially shielded semiconductor heating plate.

6. A semiconductor heating plate surface deformation detection device according to claim 2, characterized in that: The moving drive mechanism includes a transverse drive motor, a transverse limit track, a moving mounting plate, a longitudinal drive motor, and a longitudinal limit track; The transverse drive motor and the transverse limit track are fixed to the inner bottom end of the fixed frame. The bottom end of the moving mounting plate fits with the transverse limit track. The drive end of the transverse drive motor is coaxially fixed to a transverse drive rod, and the transverse drive rod is threadedly connected to the moving mounting plate; The longitudinal drive motor and the longitudinal limit track are fixed to the top end of the moving mounting plate. The bottom end of the carrying housing fits with the longitudinal limit track. The drive end of the longitudinal drive motor is coaxially fixed to a longitudinal drive rod, and the longitudinal drive rod is threadedly connected to the carrying housing.

7. A semiconductor heating plate surface deformation detection device according to claim 6, characterized in that: The shielding baffle includes a fixed baffle and a sliding baffle. Sliding tracks are provided on both sides of the fixed baffle. The sliding baffle fits with the sliding tracks, and the sliding baffle can slide under the limitation of the sliding tracks; The shielding mechanism includes two transverse shielding curtains and two longitudinal shielding curtains. One end of the transverse shielding curtain is provided with a transverse connecting plate. The end of the transverse shielding curtain away from the transverse connecting plate is wound inside a transverse winding box. One end of the longitudinal shielding curtain is provided with a longitudinal connecting plate. The end of the longitudinal shielding curtain away from the longitudinal connecting plate is wound inside a longitudinal winding box.

8. A semiconductor heating plate surface deformation detection device according to claim 7, characterized in that: The two transverse connecting plates are respectively fixed on both sides of the moving mounting plate. When the moving mounting plate moves, the transverse winding box on one side unwinds the corresponding transverse shielding curtain, and the transverse winding box on the other side winds the corresponding transverse shielding curtain; The two longitudinal connecting plates are respectively fixed on both sides of the carrying housing. When the carrying housing moves, the longitudinal winding box on one side unwinds the corresponding longitudinal shielding curtain, and the longitudinal winding box on the other side winds the corresponding longitudinal shielding curtain.

9. A method for detecting the surface deformation of a semiconductor heating plate, characterized in that, Using a semiconductor heating plate surface deformation detection device according to any one of claims 1-8, includes the following steps: Open the shielding baffle, place the semiconductor heating plate to be detected with the plane to be detected facing upwards inside the carrying platform, and close the shielding baffle; The moving drive mechanism drives the carrying platform to drive the semiconductor heating plate to be detected to move below the detection slot; During the movement of the semiconductor heating plate, each probe detection mechanism and microscopic detection mechanism traverse the plane to be detected of the semiconductor heating plate, and jointly perform deformation detection on the plane to be detected of the semiconductor heating plate; Open the shielding baffle, take out the semiconductor heating plate that has completed the detection from inside the carrying platform, and then place the next semiconductor heating plate to be detected inside the carrying platform.

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