An alignment system and method for a semiconductor manufacturing apparatus, and a semiconductor manufacturing apparatus

Abstract

The present invention provides an alignment system and method for a semiconductor manufacturing equipment, and a semiconductor manufacturing equipment. The alignment system includes a mounting table, a first central axis, a first driving mechanism, and an alignment module; the mounting table is located on the XY plane; the first central axis extends along the Z direction and is connected to the mounting table; the first driving mechanism is connected to the first central axis and is used to drive the central axis to rotate; the alignment module includes a lens assembly, and the lens assembly includes a second driving mechanism and a lens unit. The second driving mechanism is arranged on the mounting table and is connected to the lens unit, and the second driving mechanism can drive the lens unit to move along the X direction and / or the Y direction; the X direction, the Y direction, and the Z direction are perpendicular to each other pairwise. When performing an alignment operation on a substrate carried on a workpiece table of a semiconductor manufacturing equipment by using the alignment system, the alignment efficiency is relatively high, effectively improving the production capacity of the semiconductor manufacturing equipment.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor equipment, and particularly relates to an alignment system and method for a semiconductor production equipment, and a semiconductor production equipment. Background Art

[0002] The substrate alignment subsystem is one of the key subsystems of a substrate exposure equipment. It mainly provides the pixel coordinate positions of the substrate marks and reference marks in the imaging field of view for the realization of the precise exposure function, and through the object-image conversion relationship, converts the coordinates of the substrate marks and reference marks into the whole machine coordinate system, so that the upper components can solve the position information of each alignment mark on the substrate in the whole machine coordinate system according to the substrate alignment model, and then establish the relative position relationship among the mask coordinate, the stage coordinate, and the substrate coordinate, to meet a certain overlay accuracy requirement.

[0003] The substrate alignment operation in the prior art is completed by the movement of the stage carrying the substrate. Specifically, in the exposure equipment, there is an alignment lens that remains relatively stationary with respect to the outer shell of the whole machine. When performing the alignment operation on the substrate, the stage is used to carry the substrate, and the substrate marks on the substrate are made to correspond one by one with the reference marks on the stage. Then, by controlling the movement of the stage, each substrate mark on the substrate is sequentially placed below the alignment lens, so as to obtain the pixel coordinate positions of each substrate mark in the imaging field of view. After that, through a series of optoelectronic signal conversions, the physical coordinates of each alignment mark under the whole machine are obtained.

[0004] However, the size of the materials produced by the substrate exposure equipment is large, such as 404mm×515mm, 510mm×515mm, 600mm×600mm, etc. During actual operation, the substrate is divided into multiple exposure areas, and multiple alignment marks are set on each exposure area, and the distances between the multiple alignment marks are far. This results in that when the stage moves so that each alignment mark sequentially reaches below the alignment lens to complete the alignment operation of each alignment mark on the substrate, the movement distance of the stage is long, the movement time is long, and the alignment efficiency is low. Summary of the Invention

[0005] The purpose of the present invention is to provide an alignment system and method for a semiconductor production equipment, and a semiconductor production equipment, aiming to improve the alignment operation efficiency of the substrate, and further improve the production rate of the semiconductor production equipment.

[0006] To achieve the above purpose, the present invention provides an alignment system for a semiconductor production equipment, including:

[0007] A mounting table, located on the XY plane;

[0008] A first central axis, extending along the Z direction and connected to the mounting table;

[0009] A first driving mechanism, connected to the first central axis and configured to drive the first central axis to rotate; and,

[0010] An alignment module, the alignment module includes a lens assembly, the lens assembly includes a second driving mechanism and a lens unit, the second driving mechanism is disposed on the mounting table and connected to the lens unit, and the second driving mechanism is configured to be able to drive the lens unit to move along the X direction and / or the Y direction;

[0011] The X direction, the Y direction, and the Z direction are perpendicular to each other in pairs;

[0012] The alignment system of the semiconductor manufacturing equipment is configured to perform an alignment operation on the alignment mark on the substrate by rotating the first central axis and moving the lens unit along the X direction and / or the Y direction.

[0013] Optionally, the mounting table is rectangular, and one of the adjacent two sides of the mounting table extends along the X direction and the other extends along the Y direction; the first central axis is connected to a vertex angle of the mounting table, or the first central axis is connected to the midpoint of a side of the mounting table.

[0014] Optionally, the mounting table includes a first table body, a second table body, a second central axis, and a third driving mechanism; both the first table body and the second table body are located in the XY plane, the second central axis extends along the Z direction, and the axis of the second central axis passes through the center of the second table body; one end of the second central axis is rotatably connected to the first table body and the other end is connected to the second table body; the third driving mechanism is connected to the second central axis and is configured to drive the second central axis to rotate relative to the first table body;

[0015] The first table body is connected to the first central axis, and the alignment module is disposed on a side of the second table body away from the first table body.

[0016] Optionally, the first table body is rectangular, and one of the adjacent two sides of the first table body extends along the X direction and the other extends along the Y direction, and the center of the first table body is located on the axis of the second central axis; the first central axis is connected to a vertex angle of the first table body;

[0017] The second table body is rectangular, and one of the adjacent two sides of the second table body extends along the X direction and the other extends along the Y direction.

[0018] Optionally, the alignment system includes one of the alignment modules; alternatively, the alignment system includes two of the alignment modules, and the two alignment modules are arranged on the mounting table along the X direction or the Y direction.

[0019] Optionally, the alignment module includes one or more of the lens assemblies.

[0020] Optionally, when the second driving mechanism is capable of driving the lens unit to move along the X direction or the Y direction, the second driving mechanism includes a first driving part, a first guide rail, and a first slider. The first guide rail is connected to the mounting table and extends along the moving direction of the lens unit. The first slider is movably arranged on the first guide rail and is connected to the first driving part; the lens unit is connected to the first slider.

[0021] Optionally, the first guide rail is a mechanical guide rail, and the alignment system further includes a first brake, which is configured to brake the slider; alternatively, the first guide rail is an air-floating guide rail; or the first guide rail is a magnetic levitation guide rail.

[0022] Optionally, when the second driving mechanism is capable of driving the lens unit to move along the X direction and the Y direction, the second driving mechanism includes a first driving part, a first guide rail, a first slider, a second driving part, a second guide rail, and a second slider; the first guide rail is arranged on the mounting table and extends along one of the X direction and the Y direction. The first slider is movably arranged on the first guide rail and is connected to the first driving part; the second guide rail is arranged on the first slider and extends along the other of the X direction and the Y direction. The second slider is arranged on the second guide rail and is connected to the second driving part; the lens unit is connected to the second slider.

[0023] Optionally, the first guide rail is one of a mechanical guide rail, an air-floating guide rail, and a magnetic levitation guide rail; the second guide rail is one of a mechanical guide rail, an air-floating guide rail, and a magnetic levitation guide rail;

[0024] When the first guide rail is a mechanical guide rail, the alignment system further includes a first brake, which is configured to brake the first slider; when the second guide rail is a mechanical guide rail, the alignment system further includes a second brake, which is configured to brake the second slider.

[0025] Optionally, the second driving mechanism is further configured to be capable of driving the lens unit to move along the Z direction.

[0026] To achieve the above object, the present invention further provides a semiconductor manufacturing apparatus, including an alignment system of the semiconductor manufacturing apparatus as described in any one of the preceding items.

[0027] To achieve the above object, the present invention further provides an alignment method. The alignment method is performed based on the alignment system of the aforementioned semiconductor manufacturing apparatus. The alignment module is disposed on the lower surface of the mounting table; the alignment method is used to perform an alignment operation on the alignment marks of a substrate carried on a workpiece table; the substrate includes a plurality of exposure regions arranged in sequence around a reference axis, and a plurality of the alignment marks are provided on the exposure regions; the number of the exposure regions on the substrate is greater than the number of the alignment modules of the alignment system; the alignment method includes:

[0028] Controlling the workpiece table to move to a position where the substrate is partially located below the mounting table, aligning the reference axis with the axis of the first central axis, and making each alignment module located above one of the exposure regions; and,

[0029] Using the alignment module to perform an alignment operation on the alignment marks of each of the exposure regions;

[0030] Wherein, at least when performing an alignment operation on the alignment marks of the exposure region first located below the alignment module, controlling the second driving mechanism of the lens assembly to drive the lens unit to move along the X direction and / or the Y direction; and,

[0031] At least by controlling the first driving mechanism to drive the first central axis to rotate by a preset angle, so that each alignment module switches from above the exposure region that has completed the alignment operation to above the exposure region that has not yet performed the alignment operation.

[0032] Optionally, the substrate includes m exposure regions, and the m exposure regions are evenly distributed in the direction around the reference axis;

[0033] The alignment system includes one alignment module; the preset angle is 360° / m, and m is a positive integer greater than 1.

[0034] Optionally, the substrate includes four exposure regions;

[0035] The mounting table is divided into two mounting areas by a dividing line; the alignment system includes two alignment modules, and the two alignment modules are respectively disposed on the two mounting areas; the first central axis is disposed at an intersection of the edge of the mounting table and the dividing line; the preset angle is 180°.

[0036] Optionally, the number of the exposure areas is four, and when one of two adjacent exposure areas rotates 90° around the reference axis and rotates 90° around its own axis, it can be aligned with the other one;

[0037] The mounting table includes a first table body, a second table body, a second central axis, and a third driving mechanism; both the first table body and the second table body are located on the XY plane, the second central axis extends along the Z direction, and the axis of the second central axis passes through the center of the second table body; one end of the second central axis is rotatably connected to the first table body, and the other end is fixedly connected to the second table body; the third driving mechanism is connected to the second central axis and is configured to drive the second central axis to rotate relative to the first table body around its own axis; the first table body is connected to the first central axis, the number of the alignment modules is one, and the alignment module is arranged on the second table body;

[0038] The step of driving the mounting table to rotate a preset angle around the first central axis by at least the first driving mechanism so that the alignment module switches from above one exposure area to above another exposure area includes:

[0039] Controlling the first driving mechanism to drive the first table body to rotate 90° around the first central axis; and,

[0040] Controlling the third driving mechanism to drive the second central axis to rotate 90° relative to the first table body.

[0041] Compared with the prior art, an alignment system and method of a semiconductor production device and a semiconductor production device of the present invention have the following advantages:

[0042] The alignment system of the aforementioned semiconductor manufacturing equipment includes a mounting table, a first central axis, a first driving mechanism, and at least one alignment module; the mounting table is located on the XY plane; the first central axis extends along the Z direction and is connected to the mounting table; the first driving mechanism is connected to the first central axis and is used to drive the central axis to rotate; the alignment module includes a lens assembly, and the lens assembly includes a second driving mechanism and a lens unit. The second driving mechanism is arranged on the mounting table and is connected to the lens unit. The second driving mechanism is configured to be able to drive the lens unit to move along the X direction and / or the Y direction; the X direction, the Y direction, and the Z direction are perpendicular to each other pairwise. The alignment system can be used to perform an alignment method on a substrate carried on a workpiece table of a semiconductor manufacturing equipment to complete the alignment of alignment marks on the substrate; the substrate includes a plurality of exposure areas arranged in sequence around a reference axis, and a plurality of the alignment marks are provided on the exposure areas; the number of the exposure areas on the substrate is more than the number of the alignment modules of the alignment system; during actual operation, the alignment module is located on the lower surface of the mounting table, and the alignment method includes: controlling the workpiece table to move to a position where a part of the substrate is located below the mounting table, and aligning the reference axis with the first central axis, and making each alignment module located above an exposure area; and, using the alignment module to perform an alignment operation on the alignment marks of each exposure area; wherein, at least when performing the alignment operation on the alignment marks of the exposure area that is first located below the alignment module, control the second driving mechanism of the lens assembly to drive the lens unit to move; and, at least drive the first central axis to rotate a preset angle through the first driving mechanism, so that each alignment module switches from being located above the exposure area where the alignment operation has been completed to being located above the exposure area where the alignment operation has not been performed. By rotating to change the position of the alignment module and switch it to above the exposure area to be aligned, the amount of movement and the movement time of the moving mechanism in the alignment operation can be shortened, thereby improving the efficiency of the alignment operation on the substrate, and further improving the working efficiency of the semiconductor manufacturing equipment including this alignment system and increasing the production capacity. Description of the Drawings

[0043] The drawings are used to better understand the present invention and do not constitute an improper limitation on the present invention.

[0044] Figure 1 It is a schematic diagram of an application scenario of the alignment system of the semiconductor manufacturing equipment provided by the first embodiment of the present invention.

[0045] Figure 2 It is a flowchart of an alignment method performed by the alignment system of the semiconductor manufacturing equipment provided by the first embodiment of the present invention.

[0046] Figure 3 It is a schematic diagram of an application scenario of an alignment system of a semiconductor manufacturing apparatus according to a second embodiment of the present invention.

[0047] Figure 4 It is a flowchart of an alignment method performed by the alignment system of the semiconductor manufacturing apparatus according to a second embodiment of the present invention on the shown substrate.

[0048] Figure 5 It is a schematic structural diagram of an alignment system of a semiconductor manufacturing apparatus according to a third embodiment of the present invention.

[0049] Figure 6 It is a schematic diagram of an application scenario of an alignment system of a semiconductor manufacturing apparatus according to a fourth embodiment of the present invention.

[0050] Figure 7 It is a schematic structural diagram of an alignment system of a semiconductor manufacturing apparatus according to a fifth embodiment of the present invention.

[0051] Figure 8 It is a schematic structural diagram of a first substrate.

[0052] Figure 9 It is a schematic structural diagram of a second substrate.

[0053] Figure 10 It is a schematic structural diagram of a third substrate.

[0054] Figure 11 It is a schematic structural diagram of a fourth substrate.

[0055] Figure 12 It is a schematic structural diagram of a fifth substrate.

[0056] Figure 13 It is an alternative schematic structural diagram of a lens assembly of an alignment system of a semiconductor manufacturing apparatus according to some embodiments of the present invention.

[0057] Figure 14 It is another alternative schematic structural diagram of a lens assembly of an alignment system of a semiconductor manufacturing apparatus according to some embodiments of the present invention.

[0058] Figure 15 It is a position fluctuation curve of a lens unit of an alignment system of a semiconductor manufacturing apparatus according to an example of the present invention in the X direction when the workpiece table moves.

[0059] Figure 16 It is a position fluctuation curve of a lens unit of an alignment system according to an example of the present invention in the Y direction when the tool table moves.

[0060] Figure 17 This is a table of position fluctuations of the lens unit of the alignment system of a semiconductor production device provided by the present invention according to an example when the tool table moves.

[0061] [Explanation of reference numerals:] 10 - mounting table, 11 - first body, 12 - second body, 13 - second central axis, 20 - first central axis, 31 - lens assembly, 311 - second driving mechanism, 3111 - first driving part, 3112 - first guide rail, 3113 - first slider, 3114 - second driving part, 3115 - second guide rail, 3116 - second slider, 3117 - first brake, 3118 - second brake, 312 - lens unit, 01 - substrate, 011 - exposure area, 0101 - alignment mark Detailed implementation manners

[0062] The following uses specific specific examples to illustrate the implementation manners of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation manners. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the drawings provided in this embodiment only illustrate the basic concept of the present invention in a schematic manner. Therefore, only the components related to the present invention are shown in the drawings, rather than being drawn according to the number, shape, and size of the components during actual implementation. The type, quantity, and ratio of each component during actual implementation can be arbitrarily changed, and the component layout type may also be more complex.

[0063] In addition, each of the following embodiments of the description has one or more technical features. However, this does not mean that those who use the present invention must implement all the technical features in any one embodiment at the same time, or can only separately implement some or all of the technical features in different embodiments. In other words, on the premise that implementation is possible, those skilled in the art can, according to the disclosure of the present invention and depending on design specifications or implementation requirements, selectively implement some or all of the technical features in any one embodiment, or selectively implement the combination of some or all of the technical features in multiple embodiments, thereby increasing the flexibility when implementing the present invention.

[0064] As used in this specification, the singular forms "a", "an", and "the" include plural referents, and the plural form "plural" includes more than two referents, unless the context clearly indicates otherwise. As used in this specification, the term "or" is generally used in the sense of including "and / or", unless the context clearly indicates otherwise, and the terms "mounted", "connected", and "coupled" should be understood broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium, and can be the communication inside two components or the interaction relationship between two components. The relational terms such as "first", "second", etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations, nor do they indicate or imply relative importance or implicitly specify the quantity of the indicated technical features. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0065] The object of the present invention is to provide an alignment system and method for a semiconductor manufacturing apparatus, and a semiconductor manufacturing apparatus, aiming to improve the working efficiency of the semiconductor manufacturing apparatus by improving the alignment efficiency of a substrate, and further improve the production capacity of the semiconductor manufacturing apparatus.

[0066] To make the objects, advantages, and features of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings. It should be noted that the drawings are in a very simplified form and use non-precise scales, only for the purpose of facilitating and clearly assisting in explaining the objects of the embodiments of the present invention. The same or similar reference numerals in the drawings represent the same or similar components.

[0067] Such as Figure 1 , Figure 3 , Figure 5 , Figure 6 and Figure 7As shown in the figure, the alignment system of the semiconductor manufacturing equipment provided by the embodiments of the present invention includes a mounting table 10, a first central axis 20, a first driving mechanism (not shown in the figure), and an alignment module (not labeled in the figure). The mounting table 10 is located on the XY plane. The first central axis 20 extends along the Z direction and is connected to the mounting table 10. The first driving mechanism is connected to the first central axis 20 and is configured to drive the first central axis 20 to rotate self, so as to drive the mounting table 10 to revolve around the first central axis 20. The alignment module is arranged on the mounting table 20, and the number of the alignment modules is at least one. Each alignment module includes at least one lens assembly 31. The lens assembly 31 includes a second driving mechanism 311 and a lens unit 312. The second driving mechanism 311 is arranged on the mounting table 10, connected to the lens unit 312, and configured to be able to drive the lens unit 312 to move along the X direction and / or the Y direction. The X direction, the Y direction, and the Z direction are perpendicular to each other in pairs.

[0068] In actual application, both the X direction and the Y direction are horizontal directions, the Z direction is a vertical direction, and the alignment module is arranged on the lower surface of the mounting table 10. For the convenience of description, the following description will be made in this orientation.

[0069] The alignment system is applied to a semiconductor manufacturing equipment and is used to perform an alignment method on the alignment marks 0101 on a substrate 01 that meets condition 1 and is carried by a workpiece table (not shown in the figure) of the semiconductor manufacturing equipment, so as to obtain the pixel coordinates of each alignment mark 0101 on the substrate 01 in the imaging field of view. It should be understood that a plurality of the reference marks are arranged on the workpiece table. When the substrate 01 is carried on the workpiece table, the plurality of alignment marks 0101 on the substrate 01 correspond to the reference marks on the tool table one by one.

[0070] Condition 1 is that the substrate 01 includes a plurality of exposure areas 011 arranged in sequence around a reference axis S0.

[0071] In the embodiments of the present invention, the exposure areas 011 of the substrate 01 may be the same or different, and preferably a plurality of alignment marks 0101 are arranged on the exposure area 011. It should be understood that the reference axis S0 is perpendicular to the substrate 01.

[0072] Figures 8 to 12 Schematic diagrams showing some substrates 01 that meet condition 1, in Figures 8 to 10 which, the reference axis S0 is shown as a point. Figure 8The substrate 01 shown is rectangular and includes four exposure areas 011. The four exposure areas 011 are identical and intersect at the reference axis S0. In Figure 8 , the exposure area 011 is square, and two adjacent exposure areas 011 in the direction around the reference axis S0 share a side. Four alignment marks 0101 are provided on the exposure area 011, and the four alignment marks 0101 are respectively arranged at the four vertices of a square. The square where the alignment marks 0101 are located is concentric and parallel to the exposure area 011. Figure 9 The substrate 01 shown and Figure 8 The difference between the substrate 01 shown and Figure 9 is that the exposure area 011 in Figure 10 is rectangular. Four alignment marks 0101 are provided on the exposure area 011, and the four alignment marks 0101 are respectively arranged at the four vertices of a rectangle. The rectangle where the alignment marks 0101 are located is concentric and parallel to the exposure area 011. Figure 11 The substrate 01 shown is circular and includes four exposure areas 011 in the shape of sectors that intersect at the reference axis S0. The four exposure areas 011 are identical, and two adjacent exposure areas 011 in the direction around the reference axis S0 share a side. Four alignment marks 0101 are provided on the exposure area 011, and the four alignment marks 0101 are respectively arranged at the four vertices of a square. Figure 12 The substrate 01 shown includes two identical exposure areas 011. The exposure areas 011 are rectangular, and the two exposure areas 011 share a side. The midpoint of the shared side of the two exposure areas 011 is on the reference axis S0. Four alignment marks 0101 are provided on the exposure area 011, and the four alignment marks 0101 are respectively arranged at the four vertices of a rectangle that is concentric and parallel to the exposure area 011. Figure 12 The substrate 01 shown includes three exposure areas 011. In Figure 12 the orientation shown, one of the three exposure areas 011 is arranged on the left, another is arranged in the upper right corner, and the other is arranged in the lower right corner, and the three exposure areas 011 intersect at the reference axis S0. It should be understood that the substrate 01 meeting the condition 1 is not limited to this, and more substrates 01 meeting the condition 1 are not shown.

[0073] When the alignment system performs the alignment method on the alignment mark 0101 of the substrate 01 that meets the condition 1 and is carried on the worktable, it is preferable that the number of alignment modules included in the alignment system is less than the number of exposure areas 011 included in the substrate 01. In this way, the alignment system rotates around the first central axis 20 and the lens unit 312 moves along the X direction and / or the Y direction to achieve the alignment operation on the alignment mark 0101 on the substrate.

[0074] Specifically, the alignment method includes: controlling the worktable to move to a position where the substrate 01 is partially located below the mounting table 10, aligning the reference axis S0 with the axis of the first central axis 20, and ensuring that each alignment module is located above one exposure area 011; and using the alignment module to perform an alignment operation on the alignment mark 0101 of each exposure area 011.

[0075] Among them, at least when performing the alignment operation on the alignment mark 0101 of the exposure area 011 that is first located below the alignment module, the second driving mechanism 311 of the lens assembly 31 is controlled to drive the lens unit 312 to move along the X direction and / or the Y direction. And at least by controlling the first driving mechanism to rotate the first central axis 20 by a preset angle so that each alignment module switches from above one exposure area 011 to above another exposure area 011.

[0076] It should be noted that the "alignment" mentioned in this article includes both the case of coincidence and the case of substantially coincidence. That is, "aligning the reference axis with the axis of the first central axis 20" includes the case where the reference axis coincides with the axis of the first central axis 20, and also includes the case where the reference axis is parallel to the axis of the first central axis 20 and the distance between the two is within a preset range and is substantially coincident.

[0077] At least by controlling the rotation of the first central axis 20 to change the position of the alignment module and switch it above the exposure area 011 to be aligned, the movement amount and movement time of the moving mechanism (including the lens unit 312) in the alignment operation can be shortened, thereby improving the efficiency of the alignment operation on the substrate 01, and further improving the working efficiency and production capacity of the semiconductor manufacturing equipment. The semiconductor manufacturing equipment can be exposure equipment or inspection equipment.

[0078] In some alternative embodiments, the substrate 01 includes m exposure areas 011, and the m exposure areas 011 are evenly distributed in the direction around the reference axis S0. Thus, when the alignment module switches positions for each of the exposure areas 011 of the same substrate 01, the preset angle of each rotation of the first central axis 20 is the same, which is 360° / m, where m is a positive integer greater than 1. Optionally, m is 2 or 4. For example, 8 to Figure 10 the central angle corresponding to each of the exposure areas 011 in the circle with the reference axis S0 as the axis is 90°, Figure 11 the central angle corresponding to each of the exposure areas 011 in the circle with the reference axis S0 as the axis is 180°. The preset angle of rotation of the first central axis 20 is 90° or 180°, which will be specifically described in combination with embodiments hereinafter.

[0079] In an alternative embodiment, the m exposure areas 011 are not evenly distributed in the direction around the reference axis S0. For example, Figure 12 in the substrate shown in, the central angles corresponding to the exposure areas 011 located in the upper right and lower right in the circle with the reference axis S0 as the axis are 90°, while the central angle corresponding to the exposure area 011 located on the left in the circle with the reference axis S0 as the axis is 180°. Thus, when the alignment module switches positions for different exposure areas 011 of the same substrate 01, the rotation angle of the first central axis 20 can be different, which is specifically determined according to the set position of the exposure area 011 located on the left. For example, in Figure 12 when the alignment mark 0101 on the exposure area 011 located on the left in is in the upper half, when the alignment module switches from above the exposure area 011 in the upper right corner to above the exposure area 011 on the left, the first central axis 20 can rotate 90°, and when the alignment module switches from the exposure area 011 on the left to above the exposure area 011 in the lower right corner, the first central axis 20 rotates 180°.

[0080] In the embodiments of the present invention, it is further preferred that the second driving mechanism 311 can drive the corresponding lens unit 312 to move along the Z direction. Thus, when using the alignment module to perform an alignment operation on the alignment mark 0101 on the substrate 01, the lens unit 312 can also be controlled to move in the Z direction according to the thickness of the substrate 01 or the state of the substrate 01, such as whether it is warped, so that the lens unit 312 can be focused on the substrate 01, improving the alignment accuracy.

[0081] When the second driving mechanism 311 can only drive the lens unit 312 to move along the X direction or the Y direction, the structure of the second driving mechanism 311 is as follows: Figure 13 As shown, it includes a first driving part 3111, a first guide rail 3112 and a first slider 3113. The first guide rail 3112 is arranged on the mounting platform 10 and extends along the moving direction of the lens unit 312, that is, if the second driving mechanism 311 can drive the lens unit 312 to move along the X direction, the first guide rail 3112 extends along the X direction; if the second driving mechanism 311 can drive the lens unit 312 to move along the Y direction, the first guide rail 3112 extends along the Y direction. The first slider 3113 includes a first connecting part and a first adapter part (not marked in the figure) connected to each other. The first connecting part is movably arranged on the first guide rail 3112 and is also connected to the first driving part 3111 so as to be able to move along the first guide rail 3112 under the drive of the first driving part 3111. The lens unit 312 is connected to the first adapter part.

[0082] When the second driving mechanism 311 is capable of driving the lens unit 312 to move along the X direction or the Y direction, and is also capable of driving the lens unit 312 to move along the Z direction, the second driving mechanism 311 includes the first driving part 3111, the first guide rail 3112, and the first slider 3113, and further includes a third driving part, a third guide rail, and a third slider (not shown in the figure). The arrangement of the first driving part 3111, the first guide rail 3112, and the first slider 3113 is referred to above and will not be repeated here. The third guide rail is arranged on the first slider 3113, specifically, on the transition part of the first slider 3113, and extends along the Z direction. The third slider includes a third connecting part and a third transition part connected to each other, and the third connecting part is movably arranged on the third guide rail and is also connected to the third driving part so as to be able to move along the third guide rail under the drive of the third driving part. The lens unit 312 is connected to the third transition part.

[0083] When the second driving mechanism 311 can drive the lens unit 312 to move in the X direction as well as in the Y direction, the structure of the second driving mechanism 311 is as follows: Figure 14As shown, it includes a first driving part 3111, a first guide rail 3112, a first slider 3113, a second driving part 3114, a second guide rail 3115, and a second slider 3116. The first guide rail 3112 is arranged on the mounting table 10 and extends along one of the X direction and the Y direction. The first slider 3113 includes a first connecting part and a first transition part (not marked in the figure) connected to each other, and the first connecting part is movably arranged on the first guide rail 3112 and connected to the first driving part 3111 so as to be able to move along the first guide rail 3112 under the drive of the first driving part 3111. The second guide rail 3115 is arranged on the first transition part of the first slider 3113 and extends along the other of the X direction and the Y direction. The second slider 3116 includes a second connecting portion and a second adapter portion (not marked in the figure) connected to each other, and the second connecting portion is movably arranged on the second guide rail 3115 and connected to the second driving portion 3114 so as to be able to move along the second guide rail 3115 under the drive of the second driving portion 3114. The lens unit 312 is connected to the second adapter portion. Optionally, the number of the first guide rails 3112 is two, and accordingly, the first slider 3113 includes two first connecting portions, each of which is movably arranged on one of the first guide rails 3112.

[0084] When the second driving mechanism 311 is capable of driving the lens unit 312 to move along the X direction and the Y direction, and can also drive the lens unit 312 to move along the Z direction, the second driving mechanism 311 includes the first driving part 3111, the first guide rail 3112, the first slider 3113, the second driving part 3114, the second guide rail 3115, and the second slider 3116, and further includes a third driving part, a third guide rail, and a third slider (not shown in the figure). The arrangement of the first driving part 3111, the first guide rail 3112, the first slider 3113, the second driving part 3114, the second guide rail 3115, and the second slider 3116 is referred to the above description, and will not be repeated here. The third guide rail is arranged on the second slider 3116 and extends along the Z direction. The third slider includes a third connecting portion and a third adapter portion connected to each other, wherein the third connecting portion is movably disposed on the second guide rail 3115 and is also connected to the third driving portion so as to be able to move along the third guide rail under the driving of the third driving portion. The lens unit 312 is connected to the third adapter portion.

[0085] It can be understood that when the second driving mechanism 311 maintains its state, it is desired that the lens unit 312 remains relatively stationary with respect to the mounting table 10 and does not generate abnormal movement under the interference of other structures of the semiconductor manufacturing equipment. In view of this, as Figure 13 and Figure 14 shown, when the first guide rail 3112 is a mechanical guide rail, preferably the lens assembly 31 further includes a first brake 3117. The first brake 3117 is, for example, a clamp, and the first brake 3117 is configured to brake the first connection portion, and thus brake the first slider 3113. It should be understood that when the number of the first guide rails 3112 is two and the first slider 3112 includes two of the first connection portions, the number of the first brakes 3117 is also two, which are arranged corresponding to the two first connection portions. As Figure 14 shown, when the second guide rail 3115 is a mechanical guide rail, preferably the lens assembly 31 further includes a second brake 3118. The second brake 3118 is, for example, a clamp, and it is configured to brake the second slider 3115. Similarly, when the second driving mechanism 311 includes the third guide rail and the third guide rail is a mechanical guide rail, the alignment system further includes a third brake. The third brake is, for example, a clamp, and it is configured to brake the third slider.

[0086] Of course, in an alternative embodiment, all the guide rails can be air-floating guide rails or magnetic levitation guide rails. In this way, there is no need to provide brakes for braking the corresponding sliders. However, the solution of a mechanical guide rail cooperating with a clamp has better stability. Due to Figures 15 to 17It can be seen that when all the guide rails are set as mechanical guide rails and a clamp is used to brake the corresponding slider, during the acceleration and deceleration processes of the worktable, the maximum fluctuation value of the lens unit 312 in the positive X direction is 596 nm, the maximum fluctuation value in the negative X direction is 651 nm, and the average fluctuation value is 362 nm; in the positive Y direction, the maximum fluctuation value is 595 nm, the maximum fluctuation value in the negative Y direction is 508 nm, and the average fluctuation value is 387 nm; during the stable movement process of the worktable, the maximum fluctuation value of the lens unit 312 in the positive X direction is 23 nm, the maximum fluctuation value in the negative X direction is 11 nm, and the average fluctuation value is 22 nm; in the positive Y direction, the maximum fluctuation value is 27 nm, the maximum fluctuation value in the negative Y direction is 31 nm, and the average fluctuation value is 40 nm; during the exposure process, the maximum fluctuation value of the lens unit 312 in the positive X direction is 10 nm, the maximum fluctuation value in the negative X direction is 15 nm, and the average fluctuation value is 13 nm; in the positive Y direction, the maximum fluctuation value is 29 nm, the maximum fluctuation value in the negative Y direction is 20 nm, and the average fluctuation value is 31 nm. This indicates that the structure of the mechanical guide rail plus the clamp can effectively reduce the impact on the lens unit 22 caused by the movement of other moving parts such as the worktable, and improve the vertical stability of the lens unit 22.

[0087] Next, the alignment system and the alignment method performed based on the alignment system will be further introduced through several embodiments. It should be understood that only the optional structures of the alignment system and the optional processes of the corresponding alignment method are described by way of enumeration below, and it is impossible to list all possible structures of the alignment system and all possible processes of the alignment method. Therefore, the following should not constitute an improper limitation to the present invention.

[0088] Figure 1 The application scenario diagram of the alignment system provided by the first embodiment of the present invention is shown. As Figure 1 shown, in this embodiment, preferably, the mounting table 10 is a rectangular structure, and one of the adjacent two sides of the mounting table 10 extends along the X direction and the other extends along the Y direction. The first central axis 20 is preferably arranged at a vertex angle of the mounting table 10. Such an arrangement can improve the structural compactness of the alignment system and is beneficial to reducing the overall size of the semiconductor manufacturing equipment.

[0089] In this embodiment, the number of the alignment modules is one, and the alignment module includes one of the lens assemblies 31. Therefore, the second driving mechanism 311 of the lens assembly 31 can drive the lens unit 312 to move along the X direction and can also drive the lens unit 312 to move along the Y direction. Optionally, it can drive the lens unit 312 to move along the Z direction.

[0090] The alignment system provided in this embodiment can be applied to the substrate 01 that meets the condition 1-1, and the condition 1-1 is: on the basis of the condition 1, the substrate 01 includes at least three exposure areas 011, and at least three of the exposure areas 011 intersect at the reference axis S0. The substrate 01 that meets the condition 1-1 includes, but is not limited to Figures 8 to 10 , and Figure 12 the substrate 01 shown.

[0091] When performing an alignment operation on the substrate 01 that meets the condition 1-1 by using the alignment system provided in this embodiment, the process is as Figure 2 shown, including the following steps S11 to S14. Hereinafter, taking the example that there are n alignment marks 0101 provided on the exposure area 011, where n is a positive integer greater than 1.

[0092] Step S11 includes: controlling the workpiece table to move to a position where the substrate 01 is partially located below the mounting table 10, and aligning the reference axis S0 with the axis of the first central axis 20 (i.e., coinciding or substantially coinciding), and making one of the exposure areas 011 located below the alignment module.

[0093] Step S12 includes: controlling the second driving mechanism 311 of the lens assembly 31 to drive the lens unit 312 to move along the X direction and / or the Y direction, so that the lens unit 312 sequentially passes directly above the n alignment marks 0101 on the exposure area 011 that is currently below the lens module, to complete the alignment operation of each of the alignment marks 0101 on the current exposure area 011.

[0094] Step S13 includes: controlling the first driving mechanism to drive the first central axis 20 to rotate the preset angle in the clockwise or counterclockwise direction, so that the alignment module switches to above another exposure area 011.

[0095] If, when the step 13 is completed, the lens unit 312 is exactly above one of the alignment marks 0101 of the exposure area 011 currently located below the alignment module. Then step S14 includes: controlling the second driving mechanism 311 to drive the lens unit 312 to move in the X direction and / or the Y direction, so that the lens unit 312 sequentially passes above the remaining n - 1 alignment marks 0101 on the exposure area 011 currently located below the alignment module, to complete the alignment operation for each of the alignment marks 0101 of the current exposure area 011.

[0096] If, when the step S13 is completed, the lens unit 312 is obliquely above one of the alignment marks 0101 (referred to as the target alignment mark) of the exposure area 011 currently located below the alignment module, and the distance between the lens unit 312 and the target alignment mark on the horizontal plane is small, step S14 includes: first controlling the second driving mechanism 311 to drive the lens unit 312 to move in the X direction and / or the Y direction, so that the lens unit 312 moves to be directly above the target alignment mark, and then controlling the second driving mechanism 311 to drive the lens unit 312 to move in the X direction and / or the Y direction, so that the lens unit 312 sequentially passes above the remaining n - 1 alignment marks 0101 of the exposure area 011 currently located below the alignment module, to complete the alignment operation for each of the alignment marks 0101 of the current exposure area 011.

[0097] Among them, the step S13 and the step S14 are each executed three times.

[0098] It can be understood that in the step S12 and the step S14, the second driving mechanism 311 can also be controlled to drive the lens unit 312 to move in the Z direction according to actual needs, so that the lens unit 312 is focused on the substrate 01.

[0099] It is worth noting that if one of the two exposure areas 011 adjacent to each other in the direction around the reference axis S0 on the substrate 01 can coincide with the other when rotated by the preset angle around the reference axis S0, and the reference axis S0 coincides with the axis of the first central axis S20 when the step S11 is completed, then when the step 13 is completed, the lens unit 312 is exactly above one of the alignment marks 0101 of the exposure area 011 currently located below the alignment module.

[0100] If one of two adjacent exposure regions 011 on the substrate 01 in the direction around the reference axis S0 can coincide with the other when rotated by the preset angle around the reference axis S0, and when the step S11 is completed, the axis of the reference axis S0 is substantially coincident with the axis of the first central axis S20; or, if one of two adjacent exposure regions 011 on the substrate 01 in the direction around the reference axis S0 can be substantially coincident with the other when rotated by the preset angle around the reference axis S0, then when the step 13 is completed, the lens unit 312 is obliquely above one alignment mark 0101 (referred to as the target alignment mark) of the exposure region 011 currently located below the alignment module, and the distance between the lens unit 312 and the target alignment mark on the horizontal plane is small.

[0101] The substrate 01 that meets the condition that "one of two adjacent exposure regions 011 on the substrate 01 in the direction around the reference axis S0 can coincide with the other when rotated by the preset angle around the reference axis S0" includes, but is not limited to Figure 8 and Figure 10 the substrate 01 shown.

[0102] When Figure 9 the difference between the long side and the short side of the rectangle where the alignment mark 0101 is located is small, the substrate 01 that meets the condition that "one of two adjacent exposure regions 011 on the substrate 01 in the direction around the reference axis S0 can be substantially coincident with the other when rotated by the preset angle around the reference axis S0" may include Figure 9 the substrate 01 shown. Of course, the substrate 01 that meets the condition that "one of two adjacent exposure regions 011 on the substrate 01 in the direction around the reference axis S0 can be substantially coincident with the other when rotated by the preset angle around the reference axis S0" is not limited to this.

[0103] In addition, it should be understood that when the alignment system of this embodiment is used to perform the alignment method on Figures 8 to 10 the substrate 01 shown, the preset angle is 90°, and in the step S11, it is preferably that the common edge of two adjacent exposure regions 011 in the direction around the reference axis S0 extends along the X direction or the Y direction.

[0104] Figure 3 The schematic diagram of the application scenario of the alignment system provided by the second embodiment of the present invention is shown. As Figure 3As shown, the alignment system of this embodiment is basically the same in structure as that of the first embodiment, except that the lens module includes a plurality of the lens components 31, and it is allowed that the second driving mechanism 311 of at least one of the lens components 31 can drive the corresponding lens unit 312 to move along the X direction or the Y direction.

[0105] The alignment system provided in this embodiment can also be applicable to perform an alignment operation on the alignment mark 0101 of the substrate 01 that meets the condition 1-1. Preferably, the number of the lens components 31 included in the alignment module of the alignment system of this embodiment is the same as the number of the alignment marks 0101 on the exposure area 011. In this way, one lens component 31 can perform an alignment operation on one alignment mark 0101 of the exposure area 011 currently located below the lens module, further improving the alignment efficiency.

[0106] Figure 4 Show the alignment system provided in this embodiment for Figures 8 to 10 , Figure 12 A flowchart of an alignment method performed on the shown substrate 01. As Figure 4 shown, the alignment method at least includes steps S21 to S23.

[0107] Step S21 includes: controlling the worktable to move to a position where the substrate 01 is partially located below the mounting table 10, aligning the reference axis S0 with the axis of the first central axis 20, and making one exposure area 011 located below the alignment module.

[0108] Step S22 includes: controlling the second driving mechanism 311 of each lens component 31 to drive the corresponding lens unit 312 to move along the X direction and / or the Y direction, so that each lens unit 312 reaches directly above one alignment mark 0101 of the exposure area 011 currently located below the alignment module, to complete the alignment operation on each alignment mark 0101 of the current exposure area 011.

[0109] Step S23 includes: controlling the first driving mechanism to drive the first central axis 20 to rotate the preset angle in the clockwise or counterclockwise direction, so that the alignment module switches to above another exposure area 011.

[0110] If, when the step S23 is completed, the lens unit 312 of each lens assembly 31 of the alignment module is exactly located directly above one alignment mark 0101 of the exposure area 011 currently located below the alignment module. Then, when the step S23 is completed, the alignment operation for another exposure area 011 is completed. This further improves the alignment efficiency of the alignment system.

[0111] If, when the step S23 is completed, the lens unit 312 of each lens assembly 31 of the alignment module is located obliquely above one alignment mark 0101 of the exposure area 011 currently located below the alignment module, and each alignment mark 0101 corresponds to the lens unit 312 located obliquely above it. In this case, the alignment method further includes a step S24 (not shown in the figure), and the step S24 includes controlling each second driving mechanism 311 to drive the lens unit 312 to move directly above the corresponding alignment mark 0101. It can be understood that after the step S23 is completed, the horizontal distance between each alignment mark 0101 and the lens unit 312 located obliquely above it is small. Therefore, in the step S24, the movement stroke and movement time of each lens unit 312 are both short, and the effect of improving the alignment efficiency can still be effectively achieved.

[0112] In the embodiment of the present invention, the step S23 is executed three times in total. In the case of executing the step S24, the execution times of the step S24 do not exceed three times.

[0113] It should be noted that if one of the two exposure areas 011 adjacent to each other in the direction around the reference axis S0 on the substrate 01 can coincide with the other when rotated by the preset angle around the reference axis S0, and when the step S11 is completed, the axis of the reference axis S0 coincides with the axis of the first central axis S20, then when the step S23 is completed, the lens unit 312 of each lens assembly 31 of the alignment module is exactly above a registration mark 0101 of the exposure area 011 currently located below the alignment module. If one of the two exposure areas 011 adjacent to each other in the direction around the reference axis S0 on the substrate 01 can coincide with the other when rotated by the preset angle around the reference axis S0, and when the step S11 is completed, the axis of the reference axis S0 is substantially coincident with the axis of the first central axis S20; or, if one of the two exposure areas 011 adjacent to each other in the direction around the reference axis S0 on the substrate 01 can be substantially coincident with the other when rotated by the preset angle around the reference axis S0, then when the step S23 is completed, the lens unit 312 of each lens assembly 31 of the alignment module is obliquely above a registration mark 0101 of the exposure area 011 currently located below the alignment module.

[0114] In addition, when the alignment system of this embodiment is used for Figures 8 to 10When the substrate 01 shown performs the alignment method, the preset angle is also 90°, and in the step S21, it is preferably that the common edge of two adjacent exposure regions 011 in the direction around the reference axis S0 extends in the X direction or the Y direction. In the step S22, it is preferably to use one lens assembly 31 as the target lens assembly, and first control the second driving mechanism 311 of the target lens assembly to drive the corresponding lens unit 312 to move in the X direction and / or the Y direction so that the lens unit 312 reaches directly above an alignment mark 0101, and complete the alignment operation of an alignment mark 0101. Then, taking the position where the lens unit 31 of the target lens assembly is located as the reference position, based on the known relative position relationship between the alignment mark directly below the lens unit 312 of the target lens assembly and other alignment marks 0101, obtain the corresponding target positions of other unaligned alignment marks 0101. After that, correspond each target position to each of the other lens assemblies 31 one by one, and then control the second driving mechanism 311 of each lens assembly 31 to drive the corresponding lens unit 312 to move to the corresponding target position. In this way, the movement stroke and movement duration of the other lens units 312 except the first lens unit 312 can be shortened, and the alignment efficiency can be further improved.

[0115] For the specific implementation process of the step S24, reference can be made to the step S22.

[0116] In addition, in the step S22 and the step S24, the movement of each lens unit 312 in the Z direction can also be controlled according to the actual situation.

[0117] Figure 5 It is a schematic structural diagram of the alignment system provided by the third embodiment of the present invention. The difference between this embodiment and the alignment system provided by the first embodiment or the second embodiment is that the first central axis 20 is not arranged at the vertex of the rectangular mounting table 10, but on one side of the rectangular mounting table 10, for example, at the midpoint of one side of the mounting table 10.

[0118] The alignment system provided by this embodiment is applicable to the substrate 01 that meets conditions 1-2. The conditions 1-2 include: on the basis of condition 1, the substrate 01 includes two exposure regions, and the two exposure regions 011 share a common edge, and the reference axis S0 passes through the midpoint of the common edge of the two exposure regions 011.

[0119] Further preferably, the condition 1-2 further includes: one of the two exposure regions 011 of the substrate 01 can be aligned with the other when rotated 180° around the reference axis S0, that is, coincide (in this way, the two exposure regions 011 are arranged centrosymmetrically) or be substantially coincident. The substrate 01 meeting the condition 1-2 includes but is not limited to Figure 11 the substrate 01 shown.

[0120] When the alignment module in this embodiment only includes one lens assembly 31, when performing the alignment method on the substrate 01 meeting the condition 1-2 by using the alignment system provided in this embodiment, the flow of the alignment method can refer to Figure 2 , in which in the step S11, the side shared by the two exposure regions 011 is parallel to the side of the rectangular mounting table 10 where the first central axis 20 is provided, and in the step S13, the rotation angle of the first central axis 20 is 180°.

[0121] When the alignment module in this embodiment includes a plurality of lens assemblies 31, and preferably the number of the lens assemblies 31 included in the alignment module is equal to the number of the alignment marks 0101 on the exposure region 011, when performing the alignment method on Figure 7 the substrate 01 shown by using the alignment system provided in this embodiment, the flow of the alignment method can refer to Figure 5 , at least including steps S21 to S23, and may further include step S24, in which in the step S21, the side shared by the two exposure regions 011 is parallel to the side of the rectangular mounting table 10 where the first central axis 20 is provided, and in the step S23, the rotation angle of the first central axis 20 is 180°.

[0122] Figure 6 is a schematic diagram of an application scenario of the alignment system provided in the fourth embodiment of the present invention, Figure 6 in which the alignment system is shown by thick lines. As Figure 6 shown, one of the differences between this embodiment and the first embodiment or the second embodiment is that the alignment system includes two alignment modules, and the two alignment modules are arranged along the X direction or the Y direction. That is, the mounting table 10 is divided into a first mounting area and a second mounting area by a dividing line S1, and the first mounting area and the second mounting area are arranged along the X direction or the Y direction. One of the two alignment modules is arranged in the first mounting area and the other is arranged in the second mounting area.

[0123] Another difference between this embodiment and the first embodiment or the second embodiment is that the first central axis 20 is arranged at an intersection of the edge of the mounting table 10 and the dividing line S1.

[0124] The alignment system provided in this embodiment is applicable to the substrate 01 that meets conditions 1-3. The conditions 1-3 include: on the basis of condition 1, the substrate 01 includes four exposure areas 011, and the four exposure areas 011 intersect at the reference axis S0.

[0125] Further preferably, the conditions 1-3 further include: two of the four exposure areas 011 are arranged along a first straight line, and the other two are arranged along a second straight line. The second straight line, the first straight line, and the reference axis S0 intersect at a point, and when one of the two exposure areas 011 arranged along the first straight line rotates 180° around the reference axis S0, it can coincide or substantially coincide with the other one. When one of the two exposure areas 011 arranged along the second straight line rotates 180° around the reference axis S0, it can coincide or substantially coincide with the other one. The substrate 01 that meets the conditions 1-3 includes but is not limited to Figures 8 to 10 the substrate 01 shown.

[0126] When the alignment module in this embodiment only includes one lens assembly 31, when the alignment method is performed on the substrate 01 that meets the conditions 1-3 by using the alignment system provided in this embodiment, the process of the alignment method is similar to Figure 2 , including steps S11 to S14, where: in step S11, one of the two adjacent exposure areas 011 in the direction around the reference axis S0 is located below one alignment module, and the other is located below another alignment module; in step S12, the second driving mechanisms 311 of the lens assemblies 31 of the two alignment modules are respectively controlled to drive the corresponding lens units 312 to move, so as to perform alignment operations on the alignment marks 0101 of the two exposure areas 011 currently located below the two alignment modules at the same time; in step S13, the rotation angle of the first central axis 20 is 180°; in step S14, the second driving mechanisms 311 of the lens assemblies 31 of the two alignment modules are respectively controlled to drive the corresponding lens units 312 to move.

[0127] When the number of lens assemblies 31 included in the alignment module in this embodiment is the same as the number of alignment marks 0101 on the exposure area 011, when the alignment method is performed on the substrate 01 that meets the conditions 1-3 by using the alignment system provided in this embodiment, the process of the alignment method is similar to Figure 4, at least including step S21 to step S23, and may further include step S24, where: in step S21, one of two adjacent exposure areas 011 in the direction around the reference axis S0 is located below one of the alignment modules, and the other is located below the other alignment module; in step S22, the second driving mechanisms 311 of the respective lens assemblies 31 of the two alignment modules are respectively controlled to operate; in step S23, the rotation angle of the first central axis 20 is 180°; in step S24, the second driving mechanisms 311 of the respective lens assemblies 31 of the two alignment modules are respectively controlled to operate.

[0128] Figure 7 is a schematic structural diagram of the alignment system provided by the fifth embodiment of the present invention. As Figure 7 shown, the difference between this embodiment and the first embodiment or the second embodiment is that the mounting table 10 is a double-layer structure, including a first table body 11, a second table body 12, a second central axis 13, and a third driving mechanism (not shown in the figure). The first table body 11 and the second table body 12 are both located on the XY plane, and the second central axis 13 extends along the Z direction. One axial end of the second central axis 13 is rotatably connected to the first table body 11, and the other axial end is fixedly connected to the second table body 12, and the axis of the second central axis 13 passes through the center of the second table body 12. The third driving mechanism is connected to the second central axis and is configured to drive the second central axis 13 to rotate relative to the first table body 11, so as to drive the second table body 12 to rotate relative to the first table body 11. The first central axis 20 is connected to the first table body 11, and the alignment module is arranged on the side of the second table body 12 away from the first table body 11.

[0129] Preferably, the first table body 11 is a rectangular structure. One of the adjacent two sides of the first table body 11 extends along the X direction, and the other extends along the Y direction, and the center of the first table body 11 is located on the axis of the second central axis 13. The first central axis 20 is arranged at a vertex angle of the first table body 11. Preferably, the second table body 12 is also a rectangular structure, and one of the adjacent two sides of the second table body 12 extends along the X direction, and the other extends along the Y direction. In this way, the structural compactness of the alignment system can be improved.

[0130] The alignment system provided in this embodiment can be applied to the substrate 01 that meets conditions 1-4. The conditions 1-4 include: on the basis of condition 1, the substrate 01 includes four exposure areas 011, and one of two adjacent exposure areas 011 in the direction around the reference axis S0 can be aligned (i.e., coincide or substantially coincide) with the other after rotating 90° around the reference axis S0 and rotating 90° around its own axis. The substrate 01 that meets conditions 1-4 includes, but is not limited to Figure 9 the substrate 01 shown

[0131] When the alignment module includes only one lens assembly 31, the alignment method flow for the substrate 01 that meets conditions 1-4 using the alignment system provided in this embodiment is similar to Figure 2 , including steps S11 to S14, the difference being only that in step S13, not only the first driving mechanism is controlled to drive the first central axis 20 to rotate 90° around its own axis, but also the third driving mechanism is controlled to drive the second central axis 13 to rotate 90° around its own axis.

[0132] When the number of lens assemblies 31 included in the alignment module is equal to the number of alignment marks 0101 on the exposure area 011, the alignment method flow for the substrate 01 that meets conditions 1-4 using the alignment system provided in this embodiment is similar to Figure 4 , including steps S21 to S23, and may include step S24. The difference is only that in step S23, not only the first driving mechanism is controlled to drive the first central axis 20 to rotate 90° around its own axis, but also the third driving mechanism is controlled to drive the second central axis 13 to rotate 90° around its own axis.

[0133] Although the present invention is disclosed as above, it is not limited thereto. Those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention also intends to include these modifications and variations.

Claims

1. An alignment system for a semiconductor manufacturing equipment, characterized in that, The alignment system includes: A mounting table located on the XY plane; A first central axis extending along the Z direction and connected to the mounting table; A first driving mechanism connected to the first central axis and configured to drive the first central axis to rotate; and An alignment module, the alignment module includes a lens assembly, the lens assembly includes a second driving mechanism and a lens unit, the second driving mechanism is disposed on the mounting table and connected to the lens unit, and the second driving mechanism is configured to be able to drive the lens unit to move along the X direction and / or the Y direction; The X direction, the Y direction, and the Z direction are perpendicular to each other in pairs; The alignment system of the semiconductor manufacturing equipment is configured to perform an alignment operation on the alignment marks on the substrate by rotating the first central axis and moving the lens unit along the X direction and / or the Y direction.

2. The alignment system of the semiconductor manufacturing equipment according to claim 1, wherein, The mounting table is rectangular, and one of the adjacent two sides of the mounting table extends along the X direction and the other extends along the Y direction; the first central axis is connected to a vertex angle of the mounting table, or the first central axis is connected to the midpoint of one side of the mounting table.

3. The alignment system of the semiconductor manufacturing equipment according to claim 1, characterized in that, The mounting table includes a first table body, a second table body, a second central axis, and a third driving mechanism; the first table body and the second table body are both located on the XY plane, the second central axis extends along the Z direction, and the axis of the second central axis passes through the center of the second table body; one end of the second central axis is rotatably connected to the first table body and the other end is connected to the second table body; the third driving mechanism is connected to the second central axis and is configured to drive the second central axis to rotate relative to the first table body; The first table body is connected to the first central axis, and the alignment module is disposed on the side of the second table body away from the first table body.

4. The alignment system of the semiconductor manufacturing equipment according to claim 3, characterized in that, The first table body is rectangular, and one of the adjacent two sides of the first table body extends along the X direction and the other extends along the Y direction, and the center of the first table body is located on the axis of the second central axis; the first central axis is connected to a vertex angle of the first table body; The second table body is rectangular, and one of the adjacent two sides of the second table body extends along the X direction and the other extends along the Y direction.

5. The alignment system of the semiconductor manufacturing equipment according to claim 1 or 2, characterized in that, The alignment system includes one such alignment module; or, the alignment system includes two such alignment modules, and the two alignment modules are arranged along the X direction or the Y direction on the mounting table.

6. The alignment system of the semiconductor manufacturing equipment according to claim 1, characterized in that, The alignment module includes one or more such lens assemblies.

7. The alignment system of the semiconductor manufacturing equipment according to claim 1, wherein, When the second driving mechanism can drive the lens unit to move along the X direction or the Y direction, the second driving mechanism includes a first driving part, a first guide rail, and a first slider, the first guide rail is connected to the mounting table and extends along the moving direction of the lens unit, the first slider is movably disposed on the first guide rail and connected to the first driving part; the lens unit is connected to the first slider.

8. The alignment system of the semiconductor manufacturing equipment according to claim 7, characterized in that, The first guide rail is a mechanical guide rail, and the alignment system further includes a first brake configured to brake the slider; alternatively, the first guide rail is an air-bearing guide rail; alternatively, the first guide rail is a magnetic levitation guide rail.

9. The alignment system of the semiconductor manufacturing equipment according to claim 1, wherein When the second driving mechanism is capable of driving the lens unit to move in the X direction and the Y direction, the second driving mechanism includes a first driving part, a first guide rail, a first slider, a second driving part, a second guide rail, and a second slider; the first guide rail is disposed on the mounting table and extends along one of the X direction and the Y direction, the first slider is movably disposed on the first guide rail and connected to the first driving part; the second guide rail is disposed on the first slider and extends along the other of the X direction and the Y direction, the second slider is disposed on the second guide rail and connected to the second driving part; the lens unit is connected to the second slider.

10. The alignment system of the semiconductor manufacturing equipment according to claim 9, characterized in that, The first guide rail is one of a mechanical guide rail, an air-bearing guide rail, and a magnetic levitation guide rail; the second guide rail is one of a mechanical guide rail, an air-bearing guide rail, and a magnetic levitation guide rail; When the first guide rail is a mechanical guide rail, the alignment system further includes a first brake configured to brake the first slider; when the second guide rail is a mechanical guide rail, the alignment system further includes a second brake configured to brake the second slider.

11. The alignment system of the semiconductor manufacturing equipment according to claim 1, characterized in that, The second driving mechanism is further configured to be capable of driving the lens unit to move in the Z direction.

12. A semiconductor manufacturing apparatus, characterized in that, An alignment system of a semiconductor manufacturing apparatus according to any one of claims 1-11.

13. An alignment method, which is executed by the alignment system of the semiconductor manufacturing equipment according to claim 1, wherein the alignment module is disposed on the lower surface of the mounting table; the alignment method is used to perform an alignment operation on the alignment marks of the substrate carried on the workpiece table; the substrate includes a plurality of exposure regions arranged in sequence around a reference axis, and a plurality of the alignment marks are provided on the exposure regions; The number of the exposure regions on the substrate is greater than the number of the alignment modules of the alignment system; characterized in that The alignment method includes: Controlling the workpiece table to move to a position where the substrate is partially located below the mounting table, aligning the reference axis with the axis of the first central axis, and positioning each alignment module above one of the exposure regions; and Performing an alignment operation on the alignment marks of each of the exposure regions by using the alignment module; Wherein, at least when performing the alignment operation on the alignment mark of the exposure region first located below the alignment module, controlling the second driving mechanism of the lens assembly to drive the lens unit to move in the X direction and / or the Y direction; And At least by controlling the first driving mechanism to drive the first central axis to rotate a preset angle, so that each alignment module is switched from above the exposure region where the alignment operation has been completed to above the exposure region where the alignment operation has not been performed.

14. The alignment method according to claim 13, wherein The substrate includes m exposure regions, and the m exposure regions are evenly distributed in a direction around the reference axis; The alignment system includes one alignment module; the preset angle is 360° / m, and m is a positive integer greater than 1.

15. The alignment method according to claim 13, wherein The substrate includes four exposure regions; The mounting table is divided into two mounting areas by a dividing line; the alignment system includes two of the alignment modules, which are respectively arranged on the two mounting areas; the first central axis is arranged at an intersection of the edge of the mounting table and the dividing line; the preset angle is 180°.

16. The alignment method according to claim 13, wherein The number of the exposure areas is four, and one of two adjacent exposure areas can be aligned with the other when rotating 90° around the reference axis and rotating 90° around its own axis; The mounting table includes a first table body, a second table body, a second central axis and a third driving mechanism; both the first table body and the second table body are located in the XY plane, the second central axis extends along the Z direction, and the axis of the second central axis passes through the center of the second table body; one end of the second central axis is rotatably connected to the first table body, and the other end is fixedly connected to the second table body; the third driving mechanism is connected to the second central axis and is configured to drive the second central axis to rotate relative to the first table body; the first table body is connected to the first central axis, the number of the alignment modules is one, and it is arranged on the second table body; The step of at least driving the mounting table to rotate a preset angle around the first central axis by the first driving mechanism so that the alignment module switches from above one exposure area to above another exposure area includes: Controlling the first driving mechanism to drive the first table body to rotate 90° around the first central axis; And, Controlling the third driving mechanism to drive the second central axis to rotate 90° relative to the first table body.

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