Force sensor and display device including the same

Abstract

A force sensor and a display device including the same are provided. The force sensor includes a first substrate and a second substrate. The second substrate faces the first substrate. The driving electrode is disposed on a first surface of the first substrate facing the second substrate. The sensing electrode is arranged on the first surface of the first substrate and is separated from the driving electrode. The force sensitive layer is disposed on a first surface of the second substrate facing the first substrate. The driving electrode includes a main driving protrusion protruding from a side surface of the driving electrode facing the sensing electrode.

Description

[0001] This application is a divisional application of the invention patent application "Force sensor and display device including the force sensor" with application date of November 8, 2019 and application number 201911086348.6. Technical Field

[0002] The present disclosure relates to a force sensor, and more particularly, to a force sensor and a display device including the force sensor. Background Art

[0003] Electronic devices such as smartphones, tablet PCs, digital cameras, laptops, navigation systems, and smart TVs generally include display devices for displaying images. The display device generally includes a display panel for generating and displaying images and various input devices such as a touch-sensitive panel.

[0004] A display device with touch sensitivity is generally referred to as a touch screen. Touch screens have been widely used in smart phones and tablet computers. Due to the convenience of touch operation, there is a trend to replace the keyboard as a conventional physical input device with an on-screen keypad displayed on the touch screen. Although conventional touch screens and other touch-sensitive devices may be able to sense the location of a touch event, force sensors have also been used to sense the pressure of a press applied thereto. Summary of the invention

[0005] A force sensor includes a first substrate and a second substrate. The second substrate faces the first substrate. A driving electrode is arranged on a first surface of the first substrate facing the second substrate. A sensing electrode is arranged on the first surface of the first substrate and is spaced apart from the driving electrode. A force sensitive layer is arranged on the first surface of the second substrate facing the first substrate. The driving electrode includes a main driving protrusion protruding from a side surface of the driving electrode facing the sensing electrode.

[0006] A force sensor includes a first substrate and a second substrate facing the first substrate. A plurality of force-sensitive units are arranged between the first substrate and the second substrate. Each of the plurality of force-sensitive units includes a drive electrode, a sensing electrode, and a force-sensitive layer at least partially overlapping the drive electrode and the sensing electrode. The drive electrode and / or the sensing electrode includes a protrusion protruding from one side surface of the drive electrode and / or the sensing electrode, and the one side surface faces the sensing electrode or the drive electrode.

[0007] A display device includes a display panel and a force sensor disposed below the display panel. The force sensor includes: a first substrate; a second substrate facing the first substrate; a driving electrode disposed on one surface of the first substrate facing the second substrate; a sensing electrode disposed on the one surface of the first substrate and spaced apart from the driving electrode; and a force-sensitive layer disposed on one surface of the second substrate facing the first substrate. The driving electrode includes a driving protrusion protruding from one side surface of the driving electrode facing the sensing electrode. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The above and other aspects and features of the present disclosure will become more apparent by describing in detail exemplary embodiments of the present disclosure with reference to the accompanying drawings, in which: Figure 1 is a perspective view showing a display device according to an exemplary embodiment of the inventive concept; Figure 2 is an exploded perspective view illustrating a display device according to an exemplary embodiment of the inventive concept; Figure 3 is shown attached to Figure 2 A bottom view of an example of a display panel of a cover window; Figure 4 It is shown Figure 2 A plan view of an example of a lower frame; Figure 5 It is shown Figure 2 A plan view of an example of a main circuit board; Figure 6 is along Figure 3 A cross-sectional view taken along line II'; Figure 7 is a cross-sectional view showing a display area of ​​a display panel; Figure 8 is a perspective view illustrating a force sensor according to an exemplary embodiment of the present inventive concept; Fig. 9 is a plan view showing a force sensor according to an exemplary embodiment of the present inventive concept; Fig.10 It is shown Fig. 9 An enlarged plan view of an example of area A; Fig.11 It is shown Fig.10 An enlarged plan view of an example of a region A-1; Fig.12 is along Fig.11 A cross-sectional view taken along line II-II'; Fig.13 is a graph showing resistance according to a force applied to a force-sensitive layer; Fig.14 is along Fig.10A cross-sectional view taken along line III-III'; Fig.15 is along Fig.10 A cross-sectional view taken along line IV-IV'; Fig.16 It is shown Fig.10 An enlarged plan view of an example of a region A-1; Fig.17 It is shown Fig. 9 An enlarged plan view of an example of area A; Fig.18 It is shown Fig. 9 An enlarged plan view of an example of area A; Fig.19 It is shown Fig. 9 An enlarged plan view of an example of region B; Fig. 20 It is shown Fig. 9 An enlarged plan view of an example of a region C; Fig.21 It is shown Fig. 9 An enlarged plan view of an example of region B; Fig. 22 It is shown Fig. 9 An enlarged plan view of an example of a region C; Fig.23 is an exploded perspective view illustrating a force sensor according to an exemplary embodiment of the present inventive concept; Fig.24 is a plan view showing a force sensor according to an exemplary embodiment of the present inventive concept; Fig.25 It is shown Fig.24 An enlarged plan view of an example of a region A'; Fig.26 and Fig. 27 is a perspective view illustrating an example of a display device using a first force sensor and a second force sensor as physical buttons according to an exemplary embodiment of the inventive concept; and Fig.28 and Fig.29 It is shown Fig.10 An enlarged plan view of an example of area A-1. DETAILED DESCRIPTION

[0009] The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the present invention are shown. However, the present invention may be implemented in different forms and should not be construed as being limited to the embodiments set forth herein. Instead, these embodiments are provided so that this disclosure will be thorough and complete, and these embodiments will fully convey the scope of the invention to those skilled in the art.

[0010] Throughout the specification and drawings, the same reference numerals may represent the same components. In the drawings, the thickness and shape of the various layers and regions may be exaggerated for clarity. However, it will be understood that the exact structures shown are considered to be exemplary embodiments of the present invention, and therefore the relative sizes, various angles, and structural arrangements shown in the drawings may be considered to be specific exemplary embodiments.

[0011] It will also be understood that when a layer is referred to as being “on” another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may also be present.

[0012] Hereinafter, exemplary embodiments of the inventive concept will be described with reference to the accompanying drawings.

[0013] Figure 1 is a perspective view illustrating a display device according to an exemplary embodiment of the inventive concept. Figure 2 is an exploded perspective view of a display device according to an exemplary embodiment of the inventive concept.

[0014] Reference Figure 1 and Figure 2 , a display device 10 according to an exemplary embodiment of the inventive concept includes a cover window 100, a touch sensing device 200, a touch circuit board 210, a touch driver 220, a display panel 300, a display circuit board 310, a display driver 320, a force sensing unit 330, a first force sensor 510, a second force sensor 520, a force sensing circuit board 550, a lower frame 600, a main circuit board 700 and a lower cover 900.

[0015] The terms "above", "top" and "upper surface" as used herein refer to the direction in which the cover window 100 is disposed relative to the display panel 300 (i.e., the Z-axis direction). The terms "below", "bottom" and "lower surface" as used herein refer to the direction in which the lower frame 600 is disposed relative to the display panel 300 (i.e., the direction opposite to the Z-axis direction). In addition, "left", "right", "upper" and "lower" refer to the direction when the display panel 300 is viewed from a plane. For example, "left" refers to the direction opposite to the X-axis direction, "right" refers to the X-axis direction, "upper" refers to the Y-axis direction, and "lower" refers to the direction opposite to the Y-axis direction.

[0016] The display device 10 may have a rectangular shape, which can be seen in a plan view. Figure 1 and Figure 2As shown in , the display device 10 may have a rectangular planar shape having a pair of short sides extending in a first direction (X-axis direction) and a pair of long sides extending in a second direction (Y-axis direction). The edge where the short side in the first direction (X-axis direction) meets the long side in the second direction (Y-axis direction) may be formed to be rounded to have a predetermined curvature, or may be optionally formed to have a right angle. The planar shape of the display device 10 is not limited to a rectangular shape, but may be formed in other polygonal shapes such as a circular shape or an elliptical shape.

[0017] The display device 10 may include a substantially flat / uncurved first region DR1 and a pair of second regions DR2 extending from the left and right sides of the first region DR1. The second region DR2 may be formed in a flat manner or in a curved manner. When the second region DR2 is formed in a flat manner, the angle between the first region DR1 and the second region DR2 may be an obtuse angle. When the second region DR2 is formed in a curved manner, the second region DR2 may have a constant curvature or a varying curvature.

[0018] Although in Figure 1 , the second region DR2 is shown to extend from each of the left and right sides of the first region DR1, but the present disclosure is not limited thereto. For example, the second region DR2 may extend only from either of the right and left sides of the first region DR1. Alternatively, the second region DR2 may extend not only from the left and right sides of the first region DR1, but also from at least one of the upper and lower sides. The following description will be made in conjunction with the case where the second region DR2 is provided at the left and right edges of the display device 10 as shown, but it will be understood that the case shown may be modified according to the above-mentioned changes.

[0019] The cover window 100 may be disposed at an upper portion of the display panel 300 and may cover an upper surface of the display panel 300. Therefore, the cover window 100 may play a role in protecting the upper surface of the display panel 300. The cover window 100 may be as shown in FIG. Figure 6 9 is attached to the touch sensing device 200 via a first adhesive member 910 as shown in FIG. The first adhesive member 910 may include an optically clear adhesive (OCA) or an optically clear resin (OCR).

[0020] The cover window 100 may include a transmissive (eg, transparent) portion DA100 corresponding to the display panel 300 and a light shielding (eg, opaque) portion NDA100 corresponding to a region other than the display panel 300. Element 390 ( Figure 3) may represent a dividing line between the transmissive portion DA100 and the light shielding portion NDA100. The cover window 100 may be disposed in the first region DR1 and the second region DR2. The transmissive portion DA100 may be disposed in a portion of the first region DR1 and a portion of the second region DR2. The light shielding portion NDA100 may be formed as a decorative layer having a pattern that may be displayed to a user when an image is not displayed. For example, a company icon such as "SAMSUNG" or various characters may be patterned in the light shielding portion NDA100. The light shielding portion NDA100 may include a hole HH for exposing a front camera, a front speaker, an infrared sensor, an iris recognition sensor, an ultrasonic sensor, an illuminance sensor, and the like, but the present disclosure is not limited thereto. For example, some or all of the front camera, the front speaker, the infrared sensor, the iris recognition sensor, the ultrasonic sensor, and the illuminance sensor may be incorporated into the display panel 300. In this case, some or all of the holes HH may be omitted. Alternatively, the transmissive portion DA100 may include one or more holes HH that may be shaped as a circle, a notch, or a cutout of some other shape, and in such a case, the light shielding portion NDA100 may be very narrow or may be omitted entirely.

[0021] The cover window 100 can be made of glass, sapphire and / or plastic. The cover window 100 can be rigid or flexible. As used herein, a flexible panel or bendable panel is a panel that can be bent and / or curved to a significant curvature without breaking.

[0022] The touch sensing device 200 may be disposed between the cover window 100 and the display panel 300. The touch sensing device 200 may be disposed in the first region DR1 and the second region DR2. Therefore, the user's touch may be detected not only in the first region DR1 but also in the second region DR2.

[0023] The touch sensing device 200 may be Figure 6 9 is attached to the lower surface of the cover window 100 through the first adhesive member 910 as shown in FIG. In order to prevent visibility reduction due to reflection of external light, a polarizing film may be added to the touch sensing device 200. In this case, the polarizing film may be attached to the lower surface of the cover window 100 through the first adhesive member 910.

[0024] The touch sensing device 200 is configured to sense the presence and position of a user's touch. The touch sensing device 200 may be implemented as a capacitance type such as a self-capacitance type or a mutual capacitance type. The touch sensing device 200 may include only a touch drive electrode when implemented as a self-capacitance type, and may include a touch drive electrode and a touch sensing electrode when implemented as a mutual capacitance type. Hereinafter, the case where the touch sensing device 200 is implemented as a mutual capacitance type will be mainly described.

[0025] The touch sensing device 200 may be formed as a panel or a film. In this case, the touch sensing device 200 may be formed as Figure 6 9 and 9A , the thin film encapsulation layer is attached to the display panel 300 by the second adhesive member 920 as shown in FIG. The second adhesive member 920 may include an optically clear adhesive (OCA) or an optically clear resin (OCR).

[0026] Alternatively, the touch sensing device 200 may be integrally formed with the display panel 300. In this case, the touch driving electrodes and the touch sensing electrodes of the touch sensing device 200 may be formed on the thin film encapsulation layer of the display panel 300.

[0027] The touch circuit board 210 may be attached to one side of the touch sensing device 200. For example, one side of the touch circuit board 210 may be attached to a pad (or may be referred to as a "pad") provided on one side of the touch sensing device 200 using an anisotropic conductive film. A touch connection unit may be provided on the other side of the touch circuit board 210, and the touch connection unit may be connected to a touch connector 312a of the display circuit board 310, such as Figure 3 The touch circuit board 210 may be a flexible printed circuit board.

[0028] The touch driver 220 may apply a touch drive signal to the touch drive electrode of the touch sensing device 200, may receive a detection signal from the touch sensing electrode of the touch sensing device 200, and may calculate a user's touch position by analyzing the detection signal. The touch driver 220 may be formed as an integrated circuit and may be mounted on the touch circuit board 210.

[0029] The display panel 300 may be disposed under the touch sensing device 200. The display panel 300 may at least partially overlap the transmissive portion DA100 of the cover window 100. The display panel 300 may be disposed in the first region DR1 and the second region DR2. Therefore, an image of the display panel 300 may be seen not only in the first region DR1 but also in the second region DR2.

[0030] The display panel 300 may be a light-emitting display panel including a light-emitting element. For example, the display panel 300 may include an organic light-emitting display panel using an organic light-emitting diode, an ultra-small light-emitting diode display panel using a micro-LED, and / or a quantum dot light-emitting display panel including a quantum dot light-emitting diode. Hereinafter, the case where the display panel 300 is an organic light-emitting display panel will be mainly described.

[0031] like Figure 7As shown in the figure, the display area of ​​the display panel 300 represents the area where the light emitting element layer 304 displays an image, and the non-display area of ​​the display panel 300 represents the peripheral area of ​​the display area where no image is displayed. The display panel 300 may include a supporting substrate 301, a flexible substrate 302, a thin film transistor layer 303, a light emitting element layer 304, and a thin film encapsulation layer 305.

[0032] The flexible substrate 302 is disposed on the supporting substrate 301. Each of the supporting substrate 301 and the flexible substrate 302 may include a flexible polymer material. For example, each of the supporting substrate 301 and the flexible substrate 302 may include polyethersulfone (PES), polyacrylate (PA), polyarylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallylate, polyimide (PI), polycarbonate (PC), cellulose triacetate (CTA), cellulose acetate propionate (CAP), and / or combinations thereof.

[0033] The thin film transistor layer 303 is formed on the flexible substrate 302. The thin film transistor layer 303 includes a thin film transistor 335, a gate insulating film 336, an interlayer insulating film 337, a protective film 338, and a planarizing film 339.

[0034] A buffer film may be formed on the flexible substrate 302. The buffer film may be formed on the flexible substrate 302 and may protect the thin film transistor 335 and the light emitting element layer 304 from moisture that penetrates through the supporting substrate 301 and the flexible substrate 302. The buffer film may include a plurality of stacked inorganic films. The buffer film may be formed of a plurality of alternately stacked inorganic films. For example, the buffer film may be formed of a plurality of alternately stacked silicon oxide films (SiO x )、Silicon nitride film (SiN x ) and a multilayer film of one or more inorganic films of SiON. The buffer film may be omitted.

[0035] The thin film transistor 335 is formed on the buffer film. The thin film transistor 335 includes an active layer 331, a gate electrode 332, a source electrode 333 and a drain electrode 334. Figure 7 3 shows that the thin film transistor 335 is formed by a top gate method in which the gate electrode 332 is located above the active layer 331, but the present disclosure is not limited thereto. For example, the thin film transistor 335 is formed by a bottom gate method in which the gate electrode 332 is located below the active layer 331, or by a dual gate method in which the gate electrode 332 is formed above and below the active layer 331.

[0036] The active layer 331 is formed on the buffer film. The active layer 331 may be formed of a silicon-based semiconductor material or an oxide-based semiconductor material. A light shielding layer for shielding external light incident on the active layer 331 may be formed between the buffer film and the active layer 331.

[0037] The gate insulating film 336 may be formed on the active layer 331. The gate insulating film 336 may be formed of an inorganic film (eg, a silicon oxide film (SiO x )、Silicon nitride film (SiN x ) or a multilayer film thereof) is formed.

[0038] The gate electrode 332 and the gate line may be formed on the gate insulating film 336. The gate electrode 332 and the gate line may have a multi-layer or single-layer made of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and / or copper (Cu).

[0039] The interlayer insulating film 337 may be formed on the gate electrode 332 and the gate line. The interlayer insulating film 337 may include an inorganic film, for example, a silicon oxide film (SiO x )、Silicon nitride film (SiN x ) or multilayer films thereof.

[0040] The source electrode 333, the drain electrode 334, and the data line may be formed on the interlayer insulating film 337. Each of the source electrode 333 and the drain electrode 334 may be connected to the active layer 331 via a contact hole passing through the gate insulating film 336 and the interlayer insulating film 337. The source electrode 333, the drain electrode 334, and the data line may have a multi-layer or single-layer including molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and / or copper (Cu).

[0041] A protective film 338 that insulates the thin film transistor 335 may be formed on the source electrode 333, the drain electrode 334, and the data line. The protective film 338 may include, for example, a silicon oxide film (SiO x )、Silicon nitride film (SiN x ) or inorganic films of multilayers thereof.

[0042] A planarization film 339 may be formed on the protective film 338 to planarize a step caused by the thin film transistor 335. The planarization film 339 may be formed of an organic film made of acrylic resin, epoxy resin, phenol resin, polyamide resin, polyimide resin, or the like.

[0043] The light emitting element layer 304 is formed on the thin film transistor layer 303. The light emitting element layer 304 includes a light emitting element and a pixel defining layer 344.

[0044] The light emitting element and the pixel defining layer 344 are formed on the planarization film 339. The light emitting element may be an organic light emitting device. In this case, the light emitting element may include an anode electrode 341, a light emitting layer 342, and a cathode electrode 343.

[0045] The anode electrode 341 may be formed on the planarization film 339. The anode electrode 341 may be connected to the drain electrode 334 of the thin film transistor 335 via a contact hole passing through the protection film 338 and the planarization film 339.

[0046] The pixel defining layer 344 may cover the edge of the anode electrode 341 on the planarization film 339 and may separate pixels from each other. For example, the pixel defining layer 344 is used as a pixel defining layer for defining pixels. Each pixel represents a region where the anode electrode 341, the light emitting layer 342, and the cathode electrode 343 are sequentially stacked so that holes from the anode electrode 341 and electrons from the cathode electrode 343 are combined with each other to emit light.

[0047] The light-emitting layer 342 is formed on the anode electrode 341 and the pixel defining layer 344. The light-emitting layer 342 may be an organic light-emitting layer. The light-emitting layer 342 may emit red light, green light, or blue light. The peak wavelength range of the red light may be about 620nm to 750nm, and the peak wavelength range of the green light may be about 495nm to 570nm. In addition, the peak wavelength range of the blue light may be about 450nm to 495nm. Optionally, the light-emitting layer 342 may be a white light-emitting layer that emits white light. In this case, the light-emitting layer 342 may be formed by stacking a red light-emitting layer, a green light-emitting layer, and a blue light-emitting layer, and may be a common layer formed throughout all pixels. In this case, the display panel 300 may also include separate color filters for displaying red, green, and blue.

[0048] The light emitting layer 342 may include a hole transport layer, a light emitting layer, and an electron transport layer. In addition, the light emitting layer 342 may be formed in a series structure of two or more stacks, in which case a charge generation layer may be formed between the stacks.

[0049] The cathode electrode 343 is formed on the light emitting layer 342. The cathode electrode 343 may cover the light emitting layer 342. The cathode electrode 343 may be a common layer commonly formed throughout all pixels.

[0050] When the light emitting element layer 304 is formed as a top emission type to emit light in an upward direction, the anode electrode 341 may be formed of a metal material having a high reflectivity (e.g., a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and indium tin oxide (ITO) (ITO / Al / ITO), an APC alloy, and a stacked structure of an APC alloy and ITO (ITO / APC / ITO)). The APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu). The cathode electrode 343 may be formed of a semi-transmissive conductive material such as magnesium (Mg), silver (Ag), or an alloy of Mg and Ag, or a transparent conductive material (TCO) capable of transmitting light such as ITO or indium zinc oxide (IZO). When the cathode electrode 343 is formed of a semi-transmissive conductive material, light extraction efficiency may be improved by a microcavity effect.

[0051] When the light emitting element layer 304 is formed as a bottom emission type to emit light in a downward direction, the anode electrode 341 may be formed of a transparent conductive material (TCO) such as ITO or IZO or a semi-transmissive conductive material such as magnesium (Mg), silver (Ag), or an alloy of Mg and Ag. The cathode electrode 343 may be formed of a metal material having a high reflectivity (e.g., a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of an APC alloy and ITO (ITO / APC / ITO)). As understood herein, the phrase "high reflectivity" may refer to a reflectivity of visible light within a range determined by the reflectivity of the above-mentioned composition. When the anode electrode 341 is formed of a semi-transmissive conductive material, light extraction efficiency may be improved by a microcavity effect.

[0052] The thin film encapsulation layer 305 is formed on the light emitting element layer 304. The thin film encapsulation layer 305 prevents oxygen or moisture from penetrating the light emitting layer 342 and the cathode electrode 343. To this end, the thin film encapsulation layer 305 may include at least one inorganic film. The inorganic film may be formed of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide and / or titanium oxide. In addition, the thin film encapsulation layer 305 may also include at least one organic film. The organic film may have a sufficient thickness to prevent particles from penetrating the thin film encapsulation layer 305 and being injected into the light emitting layer 342 and the cathode electrode 343. The organic film may include epoxy resin, acrylate and / or polyurethane acrylate. The window layer 306 may be formed on the thin film encapsulation layer 305.

[0053] The display circuit board 310 may be attached to one side of the display panel 300. For example, one side of the display circuit board 310 may be attached to a pad provided on one side of the display panel 300 using an anisotropic conductive film. The display circuit board 310 may be bent toward the lower surface of the display panel 300. The touch circuit board 210 may also be bent toward the lower surface of the display panel 300. Therefore, the touch connection portion provided at one end of the touch circuit board 210 may be connected to the touch connector 312a of the display circuit board 310. This will be referred to later. Figure 3 and Figure 4 A detailed description is given of the display circuit board 310 .

[0054] The display driver 320 outputs signals and voltages for driving the display panel 300 through the display circuit board 310. The display driver 320 may include an integrated circuit mounted on the display circuit board 310, but the present disclosure is not limited thereto. For example, the display driver 320 may be directly mounted on the substrate of the display panel 300. In this case, the display driver 320 may be attached to the upper surface or the lower surface of the substrate of the display panel 300.

[0055] like Figure 6 As shown in FIG. 1 , the lower panel member 400 may be disposed below the display panel 300. The lower panel member 400 may be attached to the lower surface of the display panel 300 by a third adhesive member 930. The third adhesive member 930 may include an optically clear adhesive (OCA) or an optically clear resin (OCR).

[0056] The lower panel member 400 may include a light absorbing member for absorbing light incident from the outside, a buffer member for absorbing external impact, a heat dissipating member for effectively dissipating heat from the display panel 300, and / or a light blocking layer for blocking light incident from the outside.

[0057] The light absorbing member may be disposed under the display panel 300. The light absorbing member prevents components disposed under the light absorbing member (e.g., the first force sensor 510, the second force sensor 520, the display circuit board 310, etc.) from being seen from the top of the display panel 300 by blocking transmission of light. The light absorbing member may include a light absorbing material such as a black pigment or dye.

[0058] The buffer member may be disposed below the light absorbing member. The buffer member absorbs external impacts to prevent the display panel 300 from being damaged. The buffer member may include a single layer or multiple layers. For example, the buffer member may be formed of a polymer resin such as polyurethane, polycarbonate, polypropylene, or polyethylene, or may include a rubber, urethane-based material, and / or a sponge obtained by foaming an acrylic material or another material having elastic properties similar to any of the above materials. The buffer member may be a buffer layer.

[0059] The heat dissipation member may be disposed under the buffer member. The heat dissipation member may include: a first heat dissipation layer including graphite and carbon nanotubes; and a second heat dissipation layer formed of a metal thin film (such as copper, nickel, ferrite, and silver) that can shield electromagnetic waves and has high thermal conductivity.

[0060] The first force sensor 510 and the second force sensor 520 may be disposed in the second region DR2. For example, the first force sensor 510 may be disposed below the display panel 300 at the right edge of the display panel 300. The second force sensor 520 may be disposed below the display panel 300 at the left edge of the display panel 300. Figure 1 and Figure 2 As shown in , the left edge and the right edge of the display panel 300 are opposite to each other.

[0061] The first force sensor 510 and the second force sensor 520 may be attached to the lower surface of the lower panel member 400. The first force sensor 510 and the second force sensor 520 may be connected to the display circuit board 310 through the force sensing circuit board 550. Figure 3 FIG. 5 shows that the first force sensor 510 and the second force sensor 520 are connected to one force sensing circuit board 550 , but the present disclosure is not limited thereto. The first force sensor 510 and the second force sensor 520 may be connected to the display circuit board 310 through different force sensing circuit boards 550 .

[0062] like Figure 3 As shown in FIG. 3 , a force sensing unit 330 for sensing force by driving a first force sensor 510 and a second force sensor 520 may be mounted on a display circuit board 310. In this case, the force sensing unit 330 may be formed as an integrated circuit. The force sensing unit 330 may be integrated with the display driver 320 to form one integrated circuit.

[0063] Alternatively, the force sensing circuit board 550 may be connected to the touch circuit board 210 instead of the display circuit board 310. In this case, the force sensing unit 330 may be mounted on the touch circuit board 210. The force sensing unit 330 may be integrated with the touch driver 220 to form one integrated circuit.

[0064] The lower frame 600 may be disposed under the lower panel member 400. The lower frame 600 may include synthetic resin, metal, or both.

[0065] The waterproof member 610 may be disposed along the edge of the lower frame 600. The waterproof member 610 may be disposed on the outer side of the first force sensor 510 and the outer side of the second force sensor 520. The waterproof member 610 may be adhered to the lower surface of the lower panel member 400 and the upper surface of the lower frame 600.

[0066] like Figure 1 and Figure 2 As shown in FIG. 1 , since the waterproof member 610 is provided on the outer sides of the first force sensor 510 and the second force sensor 520, moisture and dust can be prevented from penetrating between the display panel 300 and the lower frame 600. For example, a waterproof and dustproof display device 10 can be provided.

[0067] The lower frame 600 may include a first camera hole CMH1 for inserting the camera device 720, a battery hole BH for dissipating heat generated from the battery, and a cable hole CAH through which the second connection cable 314 connected to the display circuit board 310 passes. For example, the cable hole CAH may be provided near the right edge of the lower frame 600. In this case, the cable hole CAH may be covered by the first force sensor 510 provided under the lower panel member 400 at the right edge of the display panel 300. Therefore, as Figure 2 As shown in , the first force sensor 510 may include a first recess NTH1 (hereinafter, may also be referred to as “first recess NTH1 ”) which is concavely formed in a notch shape on one side to expose the cable hole CAH.

[0068] In addition, the lower frame 600 is disposed below the lower panel member 400, the first force sensor 510, and the second force sensor 520. When force is applied to the first force sensor 510 and the second force sensor 520, the lower frame 600 may support the first force sensor 510 and the second force sensor 520. Therefore, the first force sensor 510 and the second force sensor 520 may sense the applied force.

[0069] The main circuit board 700 may be disposed under the lower frame 600. The main circuit board 700 may be a printed circuit board or a flexible printed circuit board.

[0070] The main circuit board 700 may include a main processor 710, a camera device 720, and a main connector 730. The main processor 710 and the main connector 730 may be disposed on the lower surface of the main circuit board 700 facing the lower cover 900. In addition, the camera device 720 may be disposed on both the upper and lower surfaces of the main circuit board 700.

[0071] The main processor 710 may be configured to control all functions of the display device 10. For example, the main processor 710 may output image data to the display driver 320 of the display circuit board 310 so that the display panel 300 displays an image. In addition, the main processor 710 may receive touch data from the touch driver 220 and thereby determine the position of the user's touch, and then may execute an application indicated by an icon displayed at the relevant touch position. In addition, the main processor 710 may receive force sensing data from the touch driver 220 or the force sensing unit 330, and then may execute an application indicated by an icon displayed at the user's force position according to the force sensing data. In addition, the main processor 710 may control the vibration generator 901 to vibrate according to the force sensing data, thereby realizing tactile feedback, which may include directional vibrations that the user may feel. The main processor 710 may be an application processor, a central processing unit, or a system chip including an integrated circuit.

[0072] The camera device 720 processes an image frame such as a still image or a moving image obtained by an image sensor in a camera mode and outputs the processed image frame to the main processor 710 .

[0073] The second connection cable 314 having passed through the cable hole CAH of the lower frame 600 may be connected to the main connector 730 provided on the lower surface of the main circuit board 700 through the gap between the lower frame 600 and the main circuit board 700. Therefore, the main circuit board 700 may be electrically connected to the display circuit board 310 and the touch circuit board 210.

[0074] In addition, the main circuit board 700 may further include a mobile communication module capable of sending and receiving radio signals using a base station, an external terminal and / or a server in a mobile communication network. According to the sending and receiving of text / multimedia information, the wireless signal may include a voice signal, a video call signal or various types of data. In addition, the main circuit board 700 may further include an audio output device such as a speaker capable of outputting sound.

[0075] The lower cover 900 may be disposed under the lower frame 600 and the main circuit board 700. The lower cover 900 may be fastened and fixed to the lower frame 600. The lower cover 900 may form an appearance of a lower surface of the display device 10. The lower cover 900 may include plastic and / or metal.

[0076] The second camera hole CMH2 may be formed in the lower cover 900 so that the camera device 720 is inserted into the second camera hole CMH2 to protrude outward. The position of the camera device 720 and the positions of the first camera hole CMH1 and the second camera hole CMH2 corresponding to the camera device 720 are not limited to Figure 1 , Figure 2 , Figure 4 and Figure 5The arrangement shown in .

[0077] In addition, the vibration generator 901 may be disposed on the upper surface of the lower cover 900, and the vibration generator 901 may be connected to the lower surface of the main circuit board 700. Therefore, the vibration generator 901 may generate vibration in response to the vibration signal of the main processor 710. The vibration generator 901 may be an eccentric rotating mass (ERM) actuator, a linear resonant actuator (LRA), and / or a piezoelectric actuator.

[0078] Figure 3 is shown attached to Figure 2 A bottom view of an example of a cover window display panel. Figure 4 It is shown Figure 2 An example plan view of the lower frame. Figure 5 It is shown Figure 2 A plan view of an example of a main circuit board.

[0079] In the following, reference will be made to Figures 3 to 5 The connection between the display circuit board 310 and the force sensing circuit board 550 and the connection between the second connection cable 314 and the main connector 730 of the main circuit board 700 will be described in detail. Figure 3 is a bottom view, and Figure 4 and Figure 5 is a plan view. Therefore, it should be noted that Figure 4 and Figure 5 Compared with the Figure 4 and Figure 5 The left and right sides of the display device 10 are Figure 3 For ease of explanation, the display circuit board 310 is inverted. Figure 4 As shown by the dotted line in FIG. Figure 5 Indicated by broken lines.

[0080] Reference Figures 3 to 5 The display circuit board 310 may include a first circuit board 311 , a second circuit board 312 , and a first connection cable 313 .

[0081] The first circuit board 311 is attached to one side of the upper surface or lower surface of the substrate of the display panel 300 and may be bent toward the lower surface of the substrate of the display panel 300. The first circuit board 311 may be Figure 4 As shown in FIG. 8 , the lower frame 600 is fixed to a fixing hole FH formed in the lower frame 600 by a fixing member.

[0082] The first circuit board 311 may include a display driver 320 , a force sensing unit 330 , a first connector 311 a , and a second connector 311 b . The display driver 320 , the force sensing unit 330 , the first connector 311 a , and the second connector 311 b may be disposed on one surface of the first circuit board 311 .

[0083] The first connector 311a may be connected to one end of a first connection cable 313 connected to the second circuit board 312. Thus, the display driver 320 and the force sensing unit 330 mounted on the first circuit board 311 may be electrically connected to the second circuit board 312 through the first connection cable 313.

[0084] The second connector 311b may be connected to one end of the force sensing circuit board 550 connected to the first force sensor 510 and the second force sensor 520. Therefore, the first force sensor 510 and the second force sensor 520 may be electrically connected to the force sensing unit 330.

[0085] The second circuit board 312 may include a touch connector 312a, a first connection connector 312b, and a second connection connector 312c. The first connection connector 312b and the second connection connector 312c may be disposed on one surface of the second circuit board 312, and the touch connector 312a may be disposed on another surface of the second circuit board 312.

[0086] The touch connector 312a may be connected to a touch connection portion provided at one end of the touch circuit board 210. Therefore, the touch driver 220 may be electrically connected to the second circuit board 312.

[0087] The first connection connector 312b may be connected to the other end of the first connection cable 313 connected to the first circuit board 311. Therefore, the display driver 320 and the force sensing unit 330 mounted on the first circuit board 311 may be electrically connected to the second circuit board 312 through the first connection cable 313.

[0088] The second connection connector 312c may be connected to one end of the second connection cable 314 connected to the main connector 730 of the main circuit board 700. Therefore, the second circuit board 312 may be electrically connected to the main connector 730 of the main circuit board 700 through the second connection cable 314.

[0089] A connector connection portion 315 may be formed at the other end of the second connection cable 314. Figure 3 and Figure 4As shown in FIG. 1 , the connector connection portion 315 of the second connection cable 314 may extend to the lower portion of the lower frame 600 through the cable hole CAH of the lower frame 600. Since a first recess NTH1 having a notch shape is formed on the inner side of the first force sensor 510 in an area corresponding to the cable hole CAH of the lower frame 600, the cable hole CAH of the lower frame 600 may be exposed without being covered by the first force sensor 510.

[0090] In addition, due to Figure 5 As shown in FIG. 1 , there is a gap between the lower frame 600 and the main circuit board 700, so the connector connection portion 315 of the second connection cable 314 that has passed through the cable hole CAH can pass through the gap between the lower frame 600 and the main circuit board 700 and extend to the lower portion of the main circuit board 700. Finally, the connector connection portion 315 of the second connection cable 314 can be connected to the main connector 730 provided on the lower surface of the main circuit board 700.

[0091] like Figures 3 to 5 As shown in FIG. 1 , the first recess NTH1 having a notch shape is formed on one side of the first force sensor 510 so as not to cover the cable hole CAH of the lower frame 600. Therefore, the second connection cable 314 connected to the display circuit board 310 may extend to the lower portion of the lower frame 600 through the cable hole CAH to be connected to the main connector 730 of the main circuit board 700. Therefore, the display circuit board 310 and the main circuit board 700 may be stably connected.

[0092] Figure 6 is along Figure 3 A cross-sectional view taken along line II'.

[0093] Reference Figure 6 , the cover window 100 , the touch sensing device 200 , the display panel 300 , the lower panel member 400 , and the lower frame 600 may be formed in a flat shape in the first region DR1 , and may be formed in a curved shape in the second region DR2 .

[0094] The first force sensor 510 may be disposed in the second region DR2 corresponding to the curved portion of the display device 10. The first bump 530 may be disposed at the upper portion of the first force sensor 510. Each of the first bumps 530 may be attached to the lower surface of the lower panel member 400 through the fourth adhesive member 940, and to the upper surface of the first force sensor 510 through the sixth adhesive member 960. In addition, the first force sensor 510 may be attached to the upper surface of the lower frame 600 through the fifth adhesive member 950. Each of the fourth adhesive member 940, the fifth adhesive member 950, and the sixth adhesive member 960 may be a force sensitive adhesive (PSA). Any one or more of the fourth adhesive member 940 and the fifth adhesive member 950 may be omitted.

[0095] The waterproof member 610 may be disposed on the outer side of the first force sensor 510. For example, the waterproof member 610 may be disposed on one side of the first force sensor 510, and one side surface of the first force sensor 510 may be disposed closer to one side edge of the display panel 300 than the other side surface of the first force sensor 510. For example, when the first force sensor 510 is Figure 6 When disposed at the right edge of the display panel 300 as shown in FIG. 8 , the waterproof member 610 may be disposed on the right side surface of the first force sensor 510 .

[0096] The waterproof member 610 may be attached to the lower surface of the lower panel member 400 and the upper surface of the lower frame 600. To this end, the waterproof member 610 may include a base film and a first adhesive film disposed on one surface of the base film and a second adhesive film disposed on the other surface of the base film. The base film may include polyethylene naphthalate (PEN), polyethylene terephthalate (PET) and a separate buffer layer or polyethylene foam (PE foam). Each of the first adhesive film and the second adhesive film may be a force sensitive adhesive (PSA). The first adhesive film may be adhered to the lower surface of the lower panel member 400, and the second adhesive film may be adhered to the upper surface of the lower frame 600.

[0097] Since the waterproof member 610 is pressed and attached to the lower surface of the lower panel member 400 and the upper surface of the lower frame 600, when the height of the waterproof member 610 is less than the sum of the height of the first force sensor 510 and the height of the first bump 530, the first force sensor 510 may be damaged by the force of attaching the waterproof member 610. Therefore, the height of the waterproof member 610 is preferably higher than the sum of the height of the first force sensor 510 and the height of the first bump 530. However, when the height of the waterproof member 610 is much higher than the sum of the height of the first force sensor 510 and the height of the first bump 530, the first force sensor 510 may not sense the force. Therefore, considering the fact that the first force sensor 510 is damaged by the force of attaching the waterproof member 610 after attaching the waterproof member 610 and whether the first force sensor 510 senses the force, it is preferable to predetermine the height of the waterproof member 610 through preliminary experiments.

[0098] In addition, in order for the first bump 530 to press the force-sensitive cells CE1 to CE8 of the first force sensor 510 according to the force of the user, preferably, the height of the first bump 530 is higher than that of the first force sensor 510 .

[0099] Furthermore, the width of the waterproof member 610 is preferably at least 1 mm to prevent moisture and dust from penetrating through the waterproof member 610 .

[0100] like Figure 6 As shown in , since the waterproof member 610 is provided on the outer side of the first force sensor 510 and attached to the lower surface of the lower panel member 400 and the upper surface of the lower frame 600, the waterproof member 610 can prevent moisture and dust from penetrating between the display panel 300 and the lower frame 600. Therefore, it is possible to provide a waterproof and dustproof display device 10.

[0101] Meanwhile, since the second force sensor 520 is disposed at the left edge of the display panel 300, the waterproof member 610 is disposed on the left side surface of the second force sensor 520. Therefore, since there is only a difference in the arrangement positions of the waterproof member 610 and the first force sensor 510, a detailed description of the arrangement positions of the waterproof member 610 and the second force sensor 520 will be omitted.

[0102] Figure 8 is a perspective view illustrating a force sensor according to an exemplary embodiment of the inventive concept. Fig. 9 is a plan view illustrating a force sensor according to an exemplary embodiment of the inventive concept.

[0103] Reference Figure 8 and Fig. 9The first force sensor 510 may include a first substrate SUB1, a second substrate SUB2, a driving line TL, sensing lines RL1 to RL8, first to eighth force sensitive units CE1 to CE8, a driving pad TPD, and sensing pads RPD1 to RPD8 (see Fig.10 ) and adhesive layer AL.

[0104] The first substrate SUB1 and the second substrate SUB2 may be arranged to face each other. Each of the first substrate SUB1 and the second substrate SUB2 may include polyethylene, polyimide, polycarbonate, polysulfone, polyacrylate, polystyrene, polyvinyl chloride, polyvinyl alcohol, polynorbornene and / or polyester. In one embodiment, the first substrate SUB1 and the second substrate SUB2 may be formed of a polyethylene terephthalate (PET) film or a polyimide film.

[0105] Each of the first substrate SUB1 and the second substrate SUB2 may have a rectangular planar shape having a pair of short sides in the first direction (X-axis direction) and a pair of long sides in the second direction (Y-axis direction). However, the planar shape of each of the first substrate SUB1 and the second substrate SUB2 is not limited thereto but may vary according to an application location.

[0106] Notch-shaped recesses NTH1 and NTH2 may be formed on one side of the first substrate SUB1 and the second substrate SUB2 so as not to cover the cable hole CAH of the lower frame 600. The recess NTH1 of the first substrate SUB1 and the recess NTH2 of the second substrate SUB2 may at least partially overlap each other.

[0107] A pad portion PAD to which the force sensing circuit board 550 is attached may be formed on the first substrate SUB1. The pad portion PAD may be exposed to the outside without being covered by the second substrate SUB2. The pad portion PAD may protrude from one side surface of the first substrate SUB1. Figure 8 and Fig. 9 2 shows that the pad portion PAD protrudes from one side surface of the first substrate SUB1 corresponding to the long side, but the present disclosure is not limited thereto, and the pad portion PAD may alternatively protrude from one side surface of the first substrate SUB1 corresponding to the short side.

[0108] The pad portion PAD may include a driving pad TPD connected to the driving line TL and sensing pads RPD1 to RPD8 connected to the sensing lines RL1 to RL8. The force sensing circuit board 550 may be attached to the driving pad TPD and the sensing pads RPD1 to RPD8.

[0109] The force sensitive units CE1 to CE8 are disposed between the first substrate SUB1 and the second substrate SUB2. Figure 8 and Fig. 9It is shown that the first force sensor 510 includes eight force sensitive units CE1 to CE8, but the number of the force sensitive units is not limited thereto.

[0110] Each of the force-sensitive units CE1 to CE8 can independently detect the force at the corresponding position. Figure 8 and Fig. 9 The force-sensitive units CE1 to CE8 are shown to be arranged in one column, but the present disclosure is not limited thereto. The force-sensitive units CE1 to CE8 may optionally be arranged in multiple columns. Figure 8 and Fig. 9 The plurality of electrodes may be arranged at predetermined intervals as shown in FIG. 1 , or may be arranged continuously (eg, in an adjacent manner).

[0111] The force-sensitive units CE1 to CE8 may have different areas depending on their intended use. Fig.26 As shown in FIG. 1 , the first force-sensitive unit CE1 to the seventh force-sensitive unit CE7 may be used as physical buttons, such as volume control buttons VB+ and VB- or a power button PB provided at one side edge of the display device 10. Alternatively, as Fig. 27 As shown in , the eighth force-sensitive cell CE8 may be used as a button SB for sensing the squeezing force of the user. In this case, the eighth force-sensitive cell CE8 may be formed to have an area larger than that of the first to seventh force-sensitive cells CE1 to CE7. The eighth force-sensitive cell CE8 may be formed to be longer than the first to seventh force-sensitive cells CE1 to CE7 in the length direction (Y-axis direction) of the first force sensor 510.

[0112] In addition, Figure 8 and Fig. 9 It is shown that the first force-sensitive unit CE1 to the seventh force-sensitive unit CE7 used as physical buttons are formed to have the same area, but the present disclosure is not limited to this. For example, the areas of the first force-sensitive unit CE1 to the seventh force-sensitive unit CE7 may be different from each other. Optionally, some of the first force-sensitive units CE1 to the seventh force-sensitive units CE7 may have the same area, and the remaining force-sensitive units may have the same area, but the areas of some of the first force-sensitive units CE1 to the seventh force-sensitive units CE7 may be different from the areas of the remaining force-sensitive units.

[0113] Each of the force-sensitive units CE1 to CE8 may include: a driving electrode TE and a sensing electrode RE, which are disposed on a surface of the first substrate SUB1 facing the second substrate SUB2; and a force-sensitive layer PSL, which is disposed on a surface of the second substrate SUB2 facing the first substrate SUB1. The driving electrodes TE and the sensing electrodes RE may be arranged alternately. Any one of the driving electrodes TE may be connected to a driving line TL, and any one of the sensing electrodes RE may be connected to a corresponding one of the sensing lines RL1 to RL8. The force-sensitive layer PSL may at least partially overlap the driving electrode TE and the sensing electrode RE.

[0114] The driving line TL, the sensing lines RL1 to RL8, the driving pad TPD, and the sensing pads RPD1 to RPD8 are disposed on one surface of the first substrate SUB1. The driving line TL may be connected to the force-sensitive units CE1 to CE8 in common, and the sensing lines RL1 to RL8 may be connected to the force-sensitive units CE1 to CE8 in one-to-one correspondence. The driving pad TPD may be connected to the driving line TL, and the sensing pads RPD1 to RPD8 may be connected to the sensing lines RL1 to RL8 in one-to-one correspondence. Figure 8 and Fig. 9 It is shown that the first force sensor 510 includes eight sensing lines RL1 to RL8 , but the number of sensing lines is not limited thereto.

[0115] like Fig.14 and Fig.15 As shown in FIG. 1 , an adhesive layer AL is disposed between the first substrate SUB1 and the second substrate SUB2 to adhere the first substrate SUB1 to the second substrate SUB2. The adhesive layer AL may be a force sensitive adhesive or a double-sided tape.

[0116] The adhesive layer AL may be disposed along the edges of the first substrate SUB1 and the second substrate SUB2. For example, the adhesive layer AL may be disposed to completely surround the edges of the first substrate SUB1 and the second substrate SUB2 except for not surrounding the pad portion PAD. In addition, the adhesive layer AL may be used as a spacer to maintain a constant interval between the first substrate SUB1 and the second substrate SUB2.

[0117] The adhesive layer AL may be disposed to overlap the driving line TL and the sensing lines RL1 to RL8. For example, the adhesive layer AL may be as follows. Fig.14 , or may be disposed on the sensing lines RL1 to RL8 as shown in FIG. Fig.15 In this case, the adhesive layer AL may serve as an insulating layer for insulating the driving line TL from the sensing lines RL1 to RL8 , thereby preventing the driving line TL and the sensing lines RL1 to RL8 from being exposed to the outside and oxidized.

[0118] A notch-shaped recess NTH1 may be formed on one side of the adhesive layer AL so as not to cover the reference Figures 3 to 5 The cable hole CAH of the lower frame 600 is described. The recess NTH1 of the adhesive layer AL may at least partially overlap the recess NTH1 of the first substrate SUB1 and the recess NTH2 of the second substrate SUB2.

[0119] In the process of combining the first substrate SUB1 and the second substrate SUB2, the adhesive layer AL may be attached to one surface of the first substrate SUB1 or one surface of the second substrate SUB2 and then attached to one surface of the other substrate. For example, the adhesive layer AL may be provided on each of one surface of the first substrate SUB1 and one surface of the second substrate SUB2, and in the process of combining the first substrate SUB1 and the second substrate SUB2, the adhesive layer AL of the first substrate SUB1 and the adhesive layer AL of the second substrate SUB2 may be attached to each other.

[0120] The first bump 530 may be disposed on the other surface of the second substrate SUB2. The other surface of the second substrate SUB2 may be a surface opposite to the one surface of the second substrate SUB2. The first bump 530 may at least partially overlap with the force-sensitive units CE1 to CE8. The first bump 530 is used to press the force-sensitive units CE1 to CE8 according to the force of the user.

[0121] To increase the force applied to the force sensing cells CE1 to CE8 by the first bumps 530, each first bump 530 may be formed to have an area smaller than that of each of the force sensing cells CE1 to CE8. Each first bump 530 may be formed to have an area smaller than that of the force sensing layer PSL of each of the force sensing cells CE1 to CE8.

[0122] The area of ​​the first bump 530 may be proportional to the area of ​​the force-sensitive units CE1 to CE8. For example, when the area of ​​the eighth force-sensitive unit CE8 is greater than the area of ​​each of the first force-sensitive unit CE1 to the seventh force-sensitive unit CE7 (eg, Figure 8 As shown in ), an area of ​​the first bump 530 overlapping the eighth force sensing unit CE8 may be greater than an area of ​​each of the first bumps 530 overlapping the first to seventh force sensing units CE1 to CE7.

[0123] At the same time, since the second force sensor 520 is Figure 8 and Fig. 9 The first force sensor 510 shown in FIG. 5 is different only in that the second force sensor 520 does not include the recesses NTH1 and NTH2 , so a detailed description of the second force sensor 520 will be omitted.

[0124] Fig.10 It is shown Fig. 9An enlarged plan view of an example of area A. Fig.11 It is shown Fig.10 An enlarged plan view of an example of area A-1. Fig.12 is along Fig.11 A cross-sectional view taken along line II-II'.

[0125] To simplify the description, Fig.10 Only the fourth force-sensitive unit CE4, the fifth force-sensitive unit CE5, the driving line TL, the first to eighth sensing lines RL1 to RL8 connected to the first to eighth force-sensitive units CE1 to CE8, the driving pad TPD, the sensing pads RPD1 to RPD8, and the adhesive layer AL are shown. In addition, Fig.10 A force sensing circuit board 550 is shown attached to drive pads TPD and sense pads RPD.

[0126] Reference Figures 10 to 12 Each of the force-sensitive units CE1 to CE8 may be connected to at least one driving line and at least one sensing line. For example, although the force-sensitive units CE1 to CE8 are connected to one driving line TL, they may be connected to the sensing lines RL1 to RL8 in a one-to-one correspondence. Fig.10 As shown in , the fourth force-sensitive unit CE4 can be connected to the driving line TL and the fourth sensing line RL4, and the fifth force-sensitive unit CE5 can be connected to the driving line TL and the fifth sensing line RL5. In addition, the driving line TL can be connected to the driving pad TPD, and the sensing lines RL1 to RL8 can be connected to the sensing pads RPD1 to RPD8 one by one.

[0127] The driving pad TPD and the sensing pads RPD1 to RPD8 may be provided on the pad portion PAD. The driving pad TPD may be connected to the driving lead TLR of the force sensing circuit board 550, and the sensing pads RPD1 to RPD8 may be connected to the sensing leads RLR1 to RLR8 of the force sensing circuit board 550 in a one-to-one correspondence. Since the force sensing circuit board 550 is connected to the display circuit board 310, the first force sensor 510 may be electrically connected to the force sensing unit 330 mounted on the display circuit board 310. Therefore, the force sensing unit 330 may apply a driving voltage to the driving line TL through the driving lead TLR of the force sensing circuit board 550 and the driving pad TPD of the first force sensor 510. In addition, by checking the current value or voltage value from the sensing lines RL1 to RL8 via the sensing leads RLR1 to RLR8 connected to the sensing pads RPD1 to RPD8 of the first force sensor 510, the force applied to the force sensitive units CE1 to CE8 can be detected.

[0128] like Fig.11As shown in FIG. 1 , each of the force-sensitive units CE1 to CE8 includes a driving connection electrode TCE, a sensing connection electrode RCE, a driving electrode TE, a sensing electrode RE, and a force-sensitive layer PSL (eg, Fig.12 ).

[0129] The driving connection electrodes TCE, the sensing connection electrodes RCE, the driving electrodes TE, and the sensing electrodes RE are disposed on one surface of the first substrate SUB1 facing the second substrate SUB2.

[0130] The driving connection electrode TCE is connected to the driving line TL and the driving electrode TE. For example, the driving connection electrode TCE is connected to the driving line TL at one end in the length direction (Y-axis direction). The driving electrode TE may be branched in the width direction (X-axis direction) of the driving connection electrode TCE.

[0131] The sensing connection electrode RCE is connected to one of the sensing lines RL1 to RL8 and the sensing electrode RE. For example, the sensing connection electrode RCE is connected to one of the sensing lines RL1 to RL8 at one end in the length direction (Y-axis direction). The sensing electrode RE may be branched in the width direction (X-axis direction) of the sensing connection electrode RCE.

[0132] The driving electrode TE and the sensing electrode RE are arranged adjacent to each other but are not connected to each other. The driving electrode TE and the sensing electrode RE may be arranged in parallel with each other. The driving electrode TE and the sensing electrode RE may be arranged alternately in the length direction (Y-axis direction) of the driving connection electrode TCE and the sensing connection electrode RCE. For example, the driving electrode TE, the sensing electrode RE, the driving electrode TE and the sensing electrode RE may be arranged sequentially and repeatedly in the length direction (Y-axis direction) of the driving connection electrode TCE and the sensing connection electrode RCE.

[0133] The driving lines TL, the sensing lines RL1 to RL8, the driving connection electrodes TCE, the sensing connection electrodes RCE, the driving electrodes TE, and the sensing electrodes RE may be formed on the same layer. The driving lines TL, the sensing lines RL1 to RL8, the driving connection electrodes TCE, the sensing connection electrodes RCE, the driving electrodes TE, and the sensing electrodes RE may be formed of the same material. For example, the driving lines TL, the sensing lines RL1 to RL8, the driving connection electrodes TCE, the sensing connection electrodes RCE, the driving electrodes TE, and the sensing electrodes RE may each include a conductive material such as silver (Ag), copper (Cu), and the like. The driving lines TL, the sensing lines RL1 to RL8, the driving connection electrodes TCE, the sensing connection electrodes RCE, the driving electrodes TE, and the sensing electrodes RE may be formed on the first substrate SUB1 by a screen printing method.

[0134] The force sensitive layer PSL is disposed on one surface of the second substrate SUB2 facing the first substrate SUB1. The force sensitive layer PSL may be arranged to at least partially overlap the driving electrode TE and the sensing electrode RE.

[0135] The force sensitive layer PSL may include a polymer resin having a force sensitive material. The force sensitive material may be metal microparticles (or metal nanoparticles) such as nickel, aluminum, titanium, tin, copper, etc. For example, the force sensitive layer PSL may be a quantum tunneling composite (QTC).

[0136] When the force in the height direction (Z-axis direction) of the first force sensor 510 is not applied to the second substrate SUB2, there is a gap between the force-sensitive layer PSL and the driving electrode TE and between the force-sensitive layer PSL and the sensing electrode RE. For example, when no force is applied to the second substrate SUB2, the force-sensitive layer PSL is spaced apart from the driving electrode TE and the sensing electrode RE.

[0137] When force is applied to the second substrate SUB2 along the height direction (Z-axis direction) of the first force sensor 510, the force-sensitive layer PSL may contact the driving electrode TE and the sensing electrode RE. In this case, at least one driving electrode TE and at least one sensing electrode RE may be physically connected through the force-sensitive layer PSL, and the force-sensitive layer PSL may function as a resistor.

[0138] Therefore, if Figures 10 to 12 As shown in , since the area where the force-sensitive layer PSL contacts the driving electrode TE and the sensing electrode RE varies according to the force applied to the force-sensitive units CE1 to CE8 of the first force sensor 510, the resistance values ​​of the sensing lines RL1 to RL8 electrically connected to the sensing electrodes RE may be changed. Fig.13 As shown in , as the force applied to the force sensitive units CE1 to CE8 of the first force sensor 510 is higher, the resistance value of the sensing lines RL1 to RL8 can be lower. The force sensing unit 330 detects the change in the current value or voltage value from the sensing lines RL1 to RL8 according to the change in the resistance value, thereby detecting the force pressed by the user's hand. Therefore, the first force sensor 510 can be used as an input device for sensing the user's input.

[0139] like Fig.11As shown in , each driving electrode TE may include a driving protrusion TP. Each driving protrusion TP may protrude from the driving electrode TE along a width direction (Y-axis direction) of the driving electrode TE that intersects with the length direction (X-axis direction) of the driving electrode TE. Each driving protrusion TP may protrude from the side surface of the driving electrode TE facing the sensing electrode RE. For example, since the driving electrode TE and the sensing electrode RE are alternately arranged in the length direction (Y-axis direction) of the driving connection electrode TCE and the sensing connection electrode RCE, the driving electrode TE is disposed between two adjacent side surfaces of two adjacent sensing electrodes RE. Therefore, the driving protrusion TP may protrude from two side surfaces of the driving electrode TE that are adjacent to the two sensing electrodes RE.

[0140] like Fig.11 As shown in , each sensing electrode RE may include a sensing protrusion RP. Each sensing protrusion RP may protrude from the sensing electrode RE along a width direction (Y-axis direction) of the sensing electrode RE that intersects with a length direction (X-axis direction) of the sensing electrode RE. Each sensing protrusion RP may protrude from a side surface of the sensing electrode RE that faces the driving electrode TE. For example, since the driving electrodes TE and the sensing electrodes RE are alternately arranged in the length direction (Y-axis direction) of the driving connection electrode TCE and the sensing connection electrode RCE, the sensing electrode RE is disposed between two adjacent side surfaces of two adjacent driving electrodes TE. Therefore, the sensing protrusion RP may protrude from two side surfaces of the sensing electrode RE that are adjacent to the two driving electrodes TE.

[0141] Although Fig.11 The driving protrusion TP and the sensing protrusion RP are shown to be rectangular in a plan view, but the planar shapes of the driving protrusion TP and the sensing protrusion RP are not limited thereto. For example, the driving protrusion TP and the sensing protrusion RP may be formed in a polygonal shape or a circular shape in a plan view. Fig.11 The driving protrusion TP and the sensing protrusion RP are shown to have the same shape, but the exemplary embodiments of the present disclosure are not limited thereto. For example, the driving protrusion TP may have different shapes, and the sensing protrusion RP may have different shapes. Alternatively, the driving protrusions TP are identical to each other, and the sensing protrusions RP are identical to each other, but the planar shape of each driving protrusion TP may be different from the planar shape of each sensing protrusion RP.

[0142] The driving protrusion TP may be disposed between the sensing protrusions RP in the length direction (X-axis direction) of the driving electrode TE and the sensing electrode RE. In addition, the driving protrusion TP and the sensing protrusion RP may be alternately arranged in the length direction (X-axis direction) of the driving electrode TE and the sensing electrode RE. For example, they may be repeatedly arranged in the order of the driving protrusion TP, the sensing protrusion RP, the driving protrusion TP, and the sensing protrusion RP in the length direction (X-axis direction) of the driving electrode TE and the sensing electrode RE.

[0143] The length that the driving electrode TE and the sensing electrode RE face each other can be increased due to the driving protrusion TP of each driving electrode TE and the sensing protrusion RP of each sensing electrode RE. Therefore, the edge capacitance and the lateral capacitance between the driving electrode TE and the sensing electrode RE can be increased. For example, the capacitance between the driving electrode TE and the sensing electrode RE can be increased.

[0144] The shape of the driving protrusion TP and the shape of the sensing protrusion RP are not limited to Fig.11 For example, one side of the driving electrode TE may have mirror symmetry with a side of the sensing electrode RE facing the side of the driving electrode TE.

[0145] In addition, refer to Fig.28 , the driving protrusion TP of the driving electrode TE may overlap the sensing protrusion RP of the sensing electrode RE in the length direction (X-axis direction) so that the length in which the driving electrode TE and the sensing electrode RE face each other increases.

[0146] After manufacturing the first force sensor 510, disconnection detection may be performed to check whether the sensing electrode RE, the driving line TL, the sensing lines RL1 to RL8, the driving connection electrode TCE, the sensing connection electrode RCE, the driving electrode TE, and / or the sensing electrode RE are disconnected. The disconnection detection may be performed by applying a predetermined voltage (e.g., 5V to 10V) to the driving line TL to charge the capacitance between the driving electrode TE and the sensing electrode RE, and then detecting the voltage charged in the capacitance through the sensing lines RL1 to RL8. When any one of the driving lines TL, the sensing lines RL1 to RL8, the driving connection electrode TCE, the sensing connection electrode RCE, the driving electrode TE, and / or the sensing electrode RE is disconnected, at least one of the voltages sensed through the sensing lines RL1 to RL8 may be less than a threshold value. However, if there is a small difference between the voltage charged in the electrostatic capacitance between the driving electrode TE and the sensing electrode RE and the threshold value, the detection result may be inaccurate.

[0147] like Fig.11 As shown in , the length that the driving electrode TE and the sensing electrode RE face each other can be increased due to the driving protrusion TP of each driving electrode TE and the sensing protrusion RP of each sensing electrode RE. Therefore, the capacitance between the driving electrode TE and the sensing electrode RE can be increased. Since the difference between the threshold voltage and the voltage charged in the capacitance between the driving electrode TE and the sensing electrode RE can be increased, accurate detection can be performed.

[0148] The adhesive layer AL may be Fig.10, the force-sensitive layer PSL of the second substrate SUB2 is arranged on the driving lines TL and the sensing lines RL1 to RL8 as shown in . For example, the adhesive layer AL may cover the driving lines TL and the sensing lines RL1 to RL8, thereby serving as an insulating layer for insulating the driving lines TL and the sensing lines RL1 to RL8. Therefore, it is possible to prevent the driving lines TL and the sensing lines RL1 to RL8 from being exposed to the outside and being oxidized. Even if the force-sensitive layer PSL of the second substrate SUB2 overlaps with the driving lines TL and the sensing lines RL1 to RL8 of the first substrate SUB1 due to a process error, it is possible to prevent the driving lines TL and the sensing lines RL1 to RL8 of the first substrate SUB1 from contacting the force-sensitive layer PSL of the second substrate SUB2 when a force is applied.

[0149] like Fig.10 As shown in , the adhesive layer AL may not be disposed on the driving lines TL and the sensing lines RL1 to RL8 arranged on the pad portion PAD. For example, there may be a first gap G1 between the adhesive layer AL and the force sensing circuit board 550, but the exemplary embodiments of the present disclosure are not limited thereto. For example, Fig.17 As shown in , the adhesive layer AL may be disposed on the driving line TL and the sensing lines RL1 to RL8 disposed on the pad portion PAD. Therefore, there may be no gap between the adhesive layer AL and the force sensing circuit board 550. In this case, the adhesive layer AL may be in contact with the force sensing circuit board 550. In addition, as shown in FIG. Fig.18 As shown in , the adhesive layer AL may be disposed on the driving line TL and the sensing lines RL1 to RL8 disposed on the pad portion PAD. However, in this case, a second gap G2 may exist between the adhesive layer AL and the force sensing circuit board 550. Since the second gap G2 is smaller than the first gap G1, the area of ​​the driving line TL and the sensing lines RL1 to RL8 exposed to the outside may be minimized.

[0150] In addition, the adhesive layer AL is as Fig.10 As shown in the figure, the force-sensitive units CE1 to CE8 and the driving pads TPD and sensing pads RPD1 to RPD8 of the pad part PAD are not overlapped. When the adhesive layer AL overlaps with the force-sensitive units CE1 to CE8, the driving electrodes TE and sensing electrodes RE of the first substrate SUB1 cannot contact the force-sensitive layer PSL of the second substrate SUB2, and it is difficult to sense the force even if a force is applied. In addition, when the adhesive layer AL overlaps with the driving pads TPD and sensing pads RPD1 to RPD8, the driving pads TPD and sensing pads RPD1 to RPD8 of the pad part PAD cannot be connected to the force sensing circuit board 550. Therefore, the force-sensitive units CE1 to CE8 cannot receive the driving voltage from the force sensing circuit board 550, and the force sensing circuit board 550 cannot detect the current value or voltage value from the force-sensitive units CE1 to CE8.

[0151] At the same time, since the second force sensor 520 is Figures 10 to 12The first force sensor 510 described is substantially the same, so a detailed description of the second force sensor 520 will be omitted.

[0152] Fig.16 It is shown Fig.10 An enlarged plan view of an example of area A-1.

[0153] Fig.16 The layout and Fig.11 The difference of the arrangement of is that each driving protrusion TP includes first to third driving protrusions TP1 to TP3 protruding therefrom, and each sensing protrusion RP has first to third sensing protrusions RP1 to RP3. Fig.16 In the Fig.11 The elements shown in the description are similar to the elements in the description.

[0154] Reference Fig.16 , each driving electrode TE may further include a first driving protrusion TP1, a second driving protrusion TP2, and a third driving protrusion TP3 protruding from each driving protrusion TP. The first driving protrusion TP1 may protrude from the first side surface S1 of each driving protrusion TP, the second driving protrusion TP2 may protrude from the second side surface S2 of each driving protrusion TP, and the third driving protrusion TP3 may protrude from the third side surface S3 of each driving protrusion TP. The second side surface S2 and the third side surface S3 of each driving protrusion TP may be arranged to face away from each other. For example, the first driving protrusion TP1 may protrude from each driving protrusion TP in the width direction (Y-axis direction) of the driving electrode TE. The second driving protrusion TP2 and the third driving protrusion TP3 may protrude from each driving protrusion TP in the length direction (X-axis direction) of the driving electrode TE.

[0155] The size of each of the first driving protrusion TP1, the second driving protrusion TP2, and the third driving protrusion TP3 may be smaller than the size of the driving protrusion TP. Fig.16 , the first driving protrusion TP1, the second driving protrusion TP2, and the third driving protrusion TP3 are shown to be rectangular in a plan view. However, the planar shapes of the first driving protrusion TP1, the second driving protrusion TP2, and the third driving protrusion TP3 are not limited thereto. For example, the first driving protrusion TP1, the second driving protrusion TP2, and the third driving protrusion TP3 may all be formed in a polygonal shape or a circular shape in a plan view. In addition, Fig.16, the first driving protrusion TP1, the second driving protrusion TP2, and the third driving protrusion TP3 are shown to have the same shape, but the exemplary embodiments of the present disclosure are not limited thereto. For example, the first driving protrusion TP1, the second driving protrusion TP2, and the third driving protrusion TP3 may have shapes different from each other. Alternatively, two of the first driving protrusion TP1, the second driving protrusion TP2, and the third driving protrusion TP3 may have the same shape, and the other may have another shape.

[0156] Each sensing electrode RE may further include a first sensing protrusion RP1, a second sensing protrusion RP2, and a third sensing protrusion RP3 protruding from each sensing protrusion RP. The first sensing protrusion RP1 may protrude from the first side surface S1 of each sensing protrusion RP, the second sensing protrusion RP2 may protrude from the second side surface S2 of each sensing protrusion RP, and the third sensing protrusion RP3 may protrude from the third side surface S3 of each sensing protrusion RP. The second side surface S2 and the third side surface S3 of each sensing protrusion RP may be arranged to face away from each other. For example, the first sensing protrusion RP1 may protrude from each sensing electrode RE in the width direction (Y-axis direction) of the sensing electrode RE. The second sensing protrusion RP2 and the third sensing protrusion RP3 may protrude from each sensing protrusion RP in the length direction (X-axis direction) of the sensing electrode RE.

[0157] The size of each of the first sensing protrusion RP1, the second sensing protrusion RP2, and the third sensing protrusion RP3 may be smaller than the size of the sensing protrusion RP. Fig.16 , the first sensing protrusion RP1, the second sensing protrusion RP2, and the third sensing protrusion RP3 are shown to be rectangular in a plan view. However, the planar shapes of the first sensing protrusion RP1, the second sensing protrusion RP2, and the third sensing protrusion RP3 are not limited thereto. For example, the first sensing protrusion RP1, the second sensing protrusion RP2, and the third sensing protrusion RP3 may all be formed in a polygonal shape or a circular shape in a plan view. In addition, Fig.16 , the first sensing protrusion RP1, the second sensing protrusion RP2, and the third sensing protrusion RP3 are shown to have the same shape, but exemplary embodiments of the present disclosure are not limited thereto. For example, the first sensing protrusion RP1, the second sensing protrusion RP2, and the third sensing protrusion RP3 may have different shapes. Alternatively, two of the first sensing protrusion RP1, the second sensing protrusion RP2, and the third sensing protrusion RP3 may have the same shape, and the other may have another shape.

[0158] Each of the driving protrusions TP of each driving electrode TE includes a first driving protrusion TP1, a second driving protrusion TP2, and a third driving protrusion TP3, and each of the sensing protrusions RP of each sensing electrode RE includes a first sensing protrusion RP1, a second sensing protrusion RP2, and a third sensing protrusion RP3, so that the length of the driving electrode TE and the sensing electrode RE facing each other can be increased. Therefore, the edge capacitance and the lateral capacitance between the driving electrode TE and the sensing electrode RE can be increased. For example, the capacitance between the driving electrode TE and the sensing electrode RE can be increased.

[0159] like Fig.16 As shown in , each of the driving protrusions TP of each driving electrode TE includes a first driving protrusion TP1, a second driving protrusion TP2, and a third driving protrusion TP3, and each of the sensing protrusions RP of each sensing electrode RE includes a first sensing protrusion RP1, a second sensing protrusion RP2, and a third sensing protrusion RP3. Therefore, the length of the driving electrode TE and the sensing electrode RE facing each other can be increased. Therefore, the capacitance between the driving electrode TE and the sensing electrode RE can be increased. Therefore, since the difference between the threshold voltage and the voltage charged in the capacitance between the driving electrode TE and the sensing electrode RE can be increased, accurate detection can be performed.

[0160] In addition, if Fig.29 As shown in , each of the driving protrusions TP of each driving electrode TE includes a first driving protrusion TP1 and a second driving protrusion TP2. The first driving protrusion TP1 may protrude from the driving electrode TE in the width direction (Y-axis direction) of the driving electrode TE. The first driving protrusion TP1 may extend in the width direction (Y-axis direction) of the driving electrode TE. The second driving protrusion TP2 may protrude from the first driving protrusion TP1 in the length direction (X-axis direction) of the driving electrode TE. The first driving protrusion TP1 may extend in the width direction (Y-axis direction) of the driving electrode TE. The second driving protrusion TP2 may extend in the length direction (X-axis direction) of the driving electrode TE.

[0161] Each of the sensing protrusions RP of each sensing electrode RE includes a first sensing protrusion RP1 and a second sensing protrusion RP2. The first sensing protrusion RP1 may protrude from the sensing electrode RE in the width direction (Y-axis direction) of the sensing electrode RE. The first sensing protrusion RP1 may extend in the width direction (Y-axis direction) of the sensing electrode RE. The second sensing protrusion RP2 may protrude from the first sensing protrusion RP1 in the length direction (X-axis direction) of the sensing electrode RE. The first sensing protrusion RP1 may extend in the width direction (Y-axis direction) of the sensing electrode RE. The second sensing protrusion RP2 may extend in the length direction (X-axis direction) of the sensing electrode RE.

[0162] The first driving protrusion TP1 of the driving electrode TE may overlap the first sensing protrusion RP1 of the sensing electrode RE in the length direction (X-axis direction) of the driving electrode TE, thereby increasing the length by which the driving electrode TE and the sensing electrode RE face each other. In addition, the second driving protrusion TP2 of the driving electrode TE may overlap the second sensing protrusion RP2 of the sensing electrode RE in the width direction (Y-axis direction) of the driving electrode TE, thereby increasing the length by which the driving electrode TE and the sensing electrode RE face each other.

[0163] Meanwhile, the shape of the driving protrusion TP and the shape of the sensing protrusion RP are not limited to Fig.16 and Fig.29 For example, one side of the driving electrode TE may have mirror symmetry with a side of the sensing electrode RE facing the side of the driving electrode TE.

[0164] Fig.19 It is shown Fig. 9 An enlarged plan view of an example of region B. Fig. 20 It is shown Fig. 9 An enlarged plan view of an example of area C.

[0165] Reference Fig.19 , among the first sensing line RL1 to the third sensing line RL3, the first sensing line RL1 can be set at the outermost position, and the third sensing line RL3 can be set at the innermost position. Since the third sensing line RL3 is connected to the third force-sensitive unit CE3 arranged closest to the pad part PAD, the wiring length is the shortest. On the contrary, since the first sensing line RL1 is connected to the first force-sensitive unit CE1 arranged farthest from the pad part PAD, the wiring length is the longest. For example, the wiring length of the first sensing line RL1, the wiring length of the second sensing line RL2, and the wiring length of the third sensing line RL3 may be different from each other. Therefore, the wiring resistance of the first sensing line RL1, the wiring resistance of the second sensing line RL2, and the wiring resistance of the third sensing line RL3 may be different from each other.

[0166] Therefore, in order to minimize the difference between the wiring resistance of the first sensing line RL1, the wiring resistance of the second sensing line RL2, and the wiring resistance of the third sensing line RL3, the wiring width of the sensing line can be designed to increase as the number of sensing lines decreases. For example, the first sensing line RL1, the second sensing line RL2, and the third sensing line RL3 are arranged on the outside of one side of the third force-sensitive unit CE3. However, since the third sensing line RL3 is connected to the third force-sensitive unit CE3, only the first sensing line RL1 and the second sensing line RL2 are arranged on the outside of one side of the second force-sensitive unit CE2. Therefore, the first sensing line RL1, the second sensing line RL2, and the third sensing line RL3 arranged on the outside of one side of the third force-sensitive unit CE3 have a first width W1, and the first sensing line RL1 and the second sensing line RL2 arranged on the outside of one side of the second force-sensitive unit CE2 may have a second width W2 larger than the first width W1.

[0167] The second sensing line RL2 is connected to the second force-sensitive unit CE2, and therefore, only the first sensing line RL1 is disposed on the outer side of one side of the first force-sensitive unit CE1. Therefore, the first sensing line RL1 and the second sensing line RL2 disposed on the outer side of one side of the second force-sensitive unit CE2 have a second width W2, and the first sensing line RL1 disposed on the outer side of one side of the first force-sensitive unit CE1 may have a third width W3 greater than the second width W2.

[0168] In addition, since only one driving line TL is disposed on the outer side of the other side of the first to third force sensing cells CE1 to CE3 , the width of the driving line TL may be equal to or greater than the third width W3 .

[0169] Reference Fig. 20 , among the sixth sensing line RL6 to the eighth sensing line RL8, the eighth sensing line RL8 can be set at the outermost position, and the sixth sensing line RL6 can be set at the innermost position. Since the sixth sensing line RL6 is connected to the sixth force-sensitive unit CE6 that is closest to the pad PAD, the wiring length is the shortest. On the contrary, since the eighth sensing line RL8 is connected to the eighth force-sensitive unit CE8 that is arranged farthest from the pad PAD, the wiring length is the longest. For example, the wiring length of the sixth sensing line RL6, the wiring length of the seventh sensing line RL7, and the wiring length of the eighth sensing line RL8 may be different. Therefore, the wiring resistance of the sixth sensing line RL6, the wiring resistance of the seventh sensing line RL7, and the wiring resistance of the eighth sensing line RL8 may be different from each other. Therefore, in order to minimize the difference between the wiring resistance of the sixth sensing line RL6, the wiring resistance of the seventh sensing line RL7, and the wiring resistance of the eighth sensing line RL8, the wiring width of the sensing line can be designed to increase as the number of sensing lines decreases.

[0170] For example, the sixth sensing line RL6, the seventh sensing line RL7, and the eighth sensing line RL8 are arranged on the outer side of one side of the sixth force-sensitive unit CE6. However, since the sixth sensing line RL6 is connected to the sixth force-sensitive unit CE6, only the seventh sensing line RL7 and the eighth sensing line RL8 are arranged on the outer side of one side of the seventh force-sensitive unit CE7. Therefore, the sixth sensing line RL6, the seventh sensing line RL7, and the eighth sensing line RL8 arranged on the outer side of one side of the sixth force-sensitive unit CE6 have a fourth width W4, and the seventh sensing line RL7 and the eighth sensing line RL8 arranged on the outer side of one side of the seventh force-sensitive unit CE7 may have a fifth width W5 greater than the fourth width W4. The fourth width W4 may be substantially the same as the first width W1, and the fifth width W5 may be substantially the same as the second width W2.

[0171] At the same time, although Fig.19 and Fig. 20 It is shown that the same number of sensing lines are arranged in region B and region C, but the exemplary embodiments of the present disclosure are not limited thereto. For example, different numbers of sensing lines may be arranged in region B and region C. In this case, the fourth width W4 may be different from the first width W1, and the fifth width W5 may be different from the second width W2. For example, when the number of sensing lines arranged in region C is greater than the number of sensing lines arranged in region B, the fourth width W4 may be smaller than the first width W1, and the fifth width W5 may be smaller than the second width W2.

[0172] like Fig.19 and Fig. 20 As shown in , the wiring width of the sensing lines is designed to increase as the number of sensing lines decreases, thereby minimizing the difference between the wiring resistances of the sensing lines RL1 to RL8 .

[0173] Fig.21 It is shown Fig. 9 An enlarged plan view of an example of region B. Fig. 22 It is shown Fig. 9 An enlarged plan view of an example of area C.

[0174] Fig.21 and Fig. 22 The arrangement shown in Fig.19 and Fig. 20 The difference between the arrangement shown in FIG. 1 and FIG. 2 is that the wiring width is designed differently according to the wiring lengths of the first to third sensing lines RL1 to RL3, and the wiring width is designed differently according to the wiring lengths of the sixth to eighth sensing lines RL6 to RL8. Fig.21 and Fig. 22 In the Fig.19 and Fig. 20 The arrangement shown in the description of the arrangement is repeated.

[0175] Reference Fig.21 , the first sensing line RL1, the second sensing line RL2, and the third sensing line RL3 are arranged on the outside of one side of the third force-sensitive unit CE3. The wiring length of the third sensing line RL3 may be the shortest, the wiring length of the first sensing line RL1 may be the longest, the wiring length of the second sensing line RL2 may be shorter than the wiring length of the first sensing line RL1, and may also be longer than the wiring length of the third sensing line RL3.

[0176] Therefore, in order to minimize the difference between the wiring resistance of the first sensing line RL1, the wiring resistance of the second sensing line RL2, and the wiring resistance of the third sensing line RL3, the wiring width of the sensing line can be designed differently according to the wiring length of the sensing line. For example, the wiring width of the third sensing line RL3 disposed on the outer side of one side of the third force-sensitive unit CE3 may have a sixth width W6. The wiring width of the second sensing line RL2 disposed on the outer side of one side of the third force-sensitive unit CE3 may have a seventh width W7 greater than the sixth width W6. The wiring width of the first sensing line RL1 disposed on the outer side of one side of the third force-sensitive unit CE3 may have an eighth width W8 greater than the seventh width W7.

[0177] In addition, since the third sensing line RL3 is connected to the third force-sensitive unit CE3, only the first sensing line RL1 and the second sensing line RL2 are disposed on the outer side of one side of the second force-sensitive unit CE2. The wiring width of the second sensing line RL2 disposed on the outer side of one side of the second force-sensitive unit CE2 may have a ninth width W9 greater than the seventh width W7. The wiring width of the first sensing line RL1 disposed on the outer side of one side of the second force-sensitive unit CE2 may have a tenth width W10 greater than the eighth width W8.

[0178] In addition, since the second sensing line RL2 is connected to the second force-sensitive unit CE2, only the first sensing line RL1 is disposed on the outer side of one side of the first force-sensitive unit CE1. The wiring width of the first sensing line RL1 disposed on the outer side of one side of the first force-sensitive unit CE1 may have an eleventh width W11 greater than the tenth width W10.

[0179] In addition, since only one driving line TL is disposed on the outer side of the other side of the first to third force sensing cells CE1 to CE3 , the width of the driving line TL may be equal to or greater than the tenth width W10 .

[0180] Reference Fig. 22, the sixth sensing line RL6, the seventh sensing line RL7 and the eighth sensing line RL8 are arranged on the outer side of one side of the sixth force-sensitive unit CE6. The wiring length of the sixth sensing line RL6 may be the shortest, the wiring length of the eighth sensing line RL8 may be the longest, the wiring length of the seventh sensing line RL7 may be shorter than the wiring length of the eighth sensing line RL8, and may also be longer than the wiring length of the sixth sensing line RL6.

[0181] Therefore, in order to minimize the difference between the wiring resistance of the sixth sensing line RL6, the wiring resistance of the seventh sensing line RL7, and the wiring resistance of the eighth sensing line RL8, the wiring width of the sensing line can be designed differently according to the wiring length of the sensing line. For example, the wiring width of the sixth sensing line RL6 disposed on the outer side of one side of the sixth force-sensitive unit CE6 may have a twelfth width W12. The wiring width of the seventh sensing line RL7 disposed on the outer side of one side of the sixth force-sensitive unit CE6 may have a thirteenth width W13 greater than the twelfth width W12. The wiring width of the eighth sensing line RL8 disposed on the outer side of one side of the sixth force-sensitive unit CE6 may have a fourteenth width W14 greater than the thirteenth width W13. The twelfth width W12 may be substantially the same as the sixth width W6, the thirteenth width W13 may be substantially the same as the seventh width W7, and the fourteenth width W14 may be substantially the same as the eighth width W8.

[0182] At the same time, although Fig.21 and Fig. 22 It is shown that the same number of sensing lines are arranged in region B and region C, but the exemplary embodiments of the present disclosure are not limited thereto. For example, different numbers of sensing lines may be arranged in region B and region C. In this case, the twelfth width W12 may be different from the sixth width W6, the thirteenth width W13 may be different from the seventh width W7, and the fourteenth width W14 may be different from the eighth width W8. For example, when the number of sensing lines arranged in region C is greater than the number of sensing lines arranged in region B, the twelfth width W12 may be smaller than the sixth width W6, the thirteenth width W13 may be smaller than the seventh width W7, and the fourteenth width W14 may be smaller than the eighth width W8.

[0183] like Fig.21 and Fig. 22 As shown in , by differently designing the wiring widths according to the wiring lengths of the sensing lines RL1 to RL8 , the difference between the wiring resistances of the sensing lines RL1 to RL8 can be minimized.

[0184] Fig.23 is an exploded perspective view illustrating a force sensor according to an exemplary embodiment of the inventive concept. Fig.24 is a plan view illustrating a force sensor according to an exemplary embodiment of the inventive concept. Fig.25 It is shown Fig.24 An enlarged plan view of an example of area A'.

[0185] Figure 23 to Figure 25 The arrangement shown in Figures 8 to 10 The arrangement shown in FIG. 1 may be different in that the pad portion PAD protrudes from one side surface of the first substrate SUB1 corresponding to the short side. Figure 23 to Figure 25 In the Figures 8 to 10 The arrangement shown in the description of the arrangement is repeated.

[0186] Reference Figure 23 to Figure 25 , the pad portion PAD may protrude from one side surface of the first substrate SUB1 corresponding to the short side. For example, the pad portion PAD may protrude from the lower surface of the first substrate SUB1 disposed below the eighth force-sensitive unit CE8. In this case, the sensing lines RL1 to RL8 may be disposed on the outer side of one side of the force-sensitive units CE1 to CE8, and the driving line TL may be disposed on the outer side of the other side of the force-sensitive units CE1 to CE8.

[0187] Fig.26 and Fig. 27 An example of a display device using a first force sensor and a second force sensor as physical buttons according to an exemplary embodiment of the inventive concept is illustrated.

[0188] Fig.26 and Fig. 27 The first to eighth force sensing cells CE1 to CE8 of the first force sensor 510 and the second force sensor 520 disposed in the second region DR2 of the display device 10 are shown. Fig.26 It is shown that the user presses the fifth force sensitive unit CE5 of the left curved portion corresponding to the second region DR2 of the display device 10 with the index finger while holding the display device 10 with the hand. Fig. 27 It is shown that the user squeezes the eighth force-sensitive unit CE8 of the left curved part corresponding to the second area DR2 of the display device 10 with the middle finger, ring finger and little finger, and squeezes the eighth force-sensitive unit CE8 of the right curved part corresponding to the second area DR2 of the display device 10 with the palm, while holding the display device 10 with the hand.

[0189] Reference Fig.26 and Fig. 27 , the first force sensor 510 and the second force sensor 520 may replace the physical buttons of the display device 10. For example, when force is applied to the first force sensitive cells CE1 to CE8 of the first force sensor 510 formed on the right curved portion of the display device 10 and the first force sensitive cells CE1 to CE8 of the second force sensor 520 formed on the left curved portion of the display device 10, a predetermined application or operation may be performed.

[0190] For example, among the first force sensitive unit CE1 to the eighth force sensitive unit CE8 of the first force sensor 510 formed on the right curved portion of the display device 10, the first force sensitive unit CE1 and the second force sensitive unit CE2 can be used as a volume increase button VB+ pressed by the user to increase the sound of the display device 10, the third force sensitive unit CE3 and the fourth force sensitive unit CE4 can be used as a volume decrease button VB- pressed by the user to decrease the sound of the display device 10, and the fifth force sensitive unit CE5, the sixth force sensitive unit CE6 and the seventh force sensitive unit CE7 can be used as a power button PB pressed by the user to turn off the power.

[0191] When a force is detected via the first force-sensitive unit CE1 and the second force-sensitive unit CE2 formed on the right curved portion of the display device 10, the main processor 710 may increase the sound level of the speaker of the display device 10. In addition, when a force is detected via the third force-sensitive unit CE3 and the fourth force-sensitive unit CE4 formed on the right curved portion of the display device 10, the main processor 710 may reduce the sound level of the speaker of the display device 10. In addition, when a force is detected via the fifth force-sensitive unit CE5, the sixth force-sensitive unit CE6, and the seventh force-sensitive unit CE7 formed on the right curved portion of the display device 10, the main processor 710 may turn off the screen of the display device 10 or output a screen for selecting power off of the display device 10.

[0192] In addition, among the first to eighth force-sensitive units CE1 to CE8 formed on the left curved portion of the display device 10, the first and second force-sensitive units CE1 and CE2 can be used as a call button CB pressed by a user to execute a call application, the third and fourth force-sensitive units CE3 and CE4 can be used as a camera button CMB pressed by a user to execute a camera application, and the fifth, sixth, and seventh force-sensitive units CE5, CE6, and CE7 can be used as an Internet button IB pressed by a user to execute an Internet application.

[0193] In this case, when a force is detected via the first force-sensitive unit CE1 and the second force-sensitive unit CE2 formed on the left curved portion of the display device 10, the main processor 710 may execute a call application. In addition, when a force is detected via the third force-sensitive unit CE3 and the fourth force-sensitive unit CE4 formed on the left curved portion of the display device 10, the main processor 710 may execute a camera application. In addition, when a force is detected via the fifth force-sensitive unit CE5, the sixth force-sensitive unit CE6, and the seventh force-sensitive unit CE7 formed on the left curved portion of the display device 10, the main processor 710 may execute an Internet application.

[0194] Fig.26The arrangement shown in is only an example, and the present disclosure is not limited thereto. For example, according to the force applied to the first force-sensitive cells CE1 to the seventh force-sensitive cells CE7 of the first force sensor 510 located on the right curved portion of the display device 10 and the first force-sensitive cells CE1 to the seventh force-sensitive cells CE7 of the second force sensor 520 located on the left curved portion of the display device 10, various functions including or in addition to the above functions may be performed. In addition, the main processor 710 may be programmed to perform different operations for each of the first force-sensitive cells CE1 to the seventh force-sensitive cells CE7 of the first force sensor 510 located on the right curved portion of the display device 10 and the first force-sensitive cells CE1 to the seventh force-sensitive cells CE7 of the second force sensor 520 located on the left curved portion of the display device 10.

[0195] In addition, the eighth force-sensitive unit CE8 formed on each of the left and right curved parts of the display device 10 may be used as a squeeze sensing button SB. The squeeze force applied to the eighth force-sensitive unit CE8 may be greater than the force applied to the first to seventh force-sensitive units CE1 to CE7. When the squeeze force is detected via the eighth force-sensitive unit CE8 formed on each of the left and right curved parts, the main processor 710 may execute a predetermined application or operation. For example, when the squeeze force is detected via the eighth force-sensitive unit CE8 formed on each of the left and right curved parts, the main processor 710 may turn on the display device 10 from the sleep mode.

[0196] like Fig.26 and Fig. 27 As shown in , by setting the first force sensor 510 and the second force sensor 520 in the second region DR2 corresponding to the curved portion of the display device 10, the first force sensor 510 and the second force sensor 520 can be used as physical buttons such as a sound control button, a power button, a call button, a camera button, an Internet button, and a squeeze sensing button.

[0197] In addition, when a force is applied to the first force sensor 510 and the second force sensor 520, the vibration generator 901 may be controlled to vibrate. In this case, the vibration of the vibration generator 901 when the force is applied to the first force sensor 510 may be different from the vibration of the vibration generator 901 when the force is applied to the second force sensor 520. In addition, the vibration of the vibration generator 901 may be different according to the positions of the first force sensitive unit CE1 to the eighth force sensitive unit CE8 of the first force sensor 510 and the first force sensitive unit CE1 to the eighth force sensitive unit CE8 of the second force sensor 520. The vibration of the vibration generator 901 may be adjusted by adjusting the vibration frequency, vibration displacement and / or vibration period of the vibration generator 901.

[0198] like Fig.26 and Fig. 27 As shown in , the vibration generator 901 is configured to vibrate when the first force sensitive cells CE1 to CE8 of the first force sensor 510 and the first force sensitive cells CE1 to CE8 of the second force sensor 520 detect force, thereby providing various tactile sensations (e.g., touch) to the user.

Claims

1. A sensor, comprising: first base; A plurality of sensing units are disposed on the first surface of the substrate; a plurality of driving electrodes and a plurality of sensing electrodes, respectively facing each other in each of the plurality of sensing units; as well as a plurality of sensing lines, respectively connecting the plurality of sensing electrodes to the plurality of sensing pads, Wherein, a maximum width of a first sensing line among the plurality of sensing lines is different from a maximum width of a second sensing line among the plurality of sensing lines.

2. The sensor according to claim 1, wherein: The first sensing line is connected to the plurality of sensing electrodes of a first sensing unit among the plurality of sensing units, and The second sensing line is connected to the plurality of sensing electrodes of a second sensing unit among the plurality of sensing units.

3. The sensor according to claim 2, wherein: The second sensing line is disposed closer to the first edge of the first substrate than the first sensing line, and a maximum width of the second sensing line is greater than a maximum width of the first sensing line.

4. The sensor according to claim 2, wherein: The second sensing line is longer than the first sensing line.

5. The sensor according to claim 2, wherein: The width of the second sensing line increases gradually.

6. The sensor according to claim 2, wherein: The second sensing line outside one side of the first sensing unit has the same width as the first sensing line outside one side of the first sensing unit.

7. The sensor according to claim 6, wherein: The second sensing line outside one side of the second sensing unit has a width wider than the first sensing line outside one side of the first sensing unit.

8. The sensor of claim 2, wherein the plurality of sensing lines further comprises: a third sensing line connected to the plurality of sensing electrodes of a third sensing unit among the plurality of sensing units; as well as A fourth sensing line connected to the plurality of sensing electrodes of a fourth sensing unit among the plurality of sensing units.

9. The sensor according to claim 8, wherein: The fourth sensing line is disposed closer to the second edge of the first substrate than the third sensing line, and a maximum width of the fourth sensing line is greater than a maximum width of the third sensing line.

10. The sensor according to claim 8, wherein: The fourth sensing line is longer than the third sensing line.

11. The sensor according to claim 8, wherein: The width of the fourth sensing line increases gradually.

12. The sensor according to claim 8, wherein: The fourth sensing line outside one side of the third sensing unit has the same width as the first sensing line outside one side of the first sensing unit.

13. The sensor of claim 12, wherein: The second sensing line outside one side of the second sensing unit has a width wider than the first sensing line outside one side of the first sensing unit.

14. The sensor according to claim 8, wherein: The number of sensing lines disposed in a first edge of the first substrate among the plurality of sensing lines is smaller than the number of sensing lines disposed in a second edge of the first substrate among the plurality of sensing lines.

15. The sensor of claim 14, wherein: The first sensing line and the second sensing line are disposed in the first edge of the first substrate, and The third sensing line and the fourth sensing line are disposed in the second edge of the first substrate.

16. The sensor of claim 15, wherein: A first width of the first sensing line is greater than a third width of the third sensing line.

17. The sensor of claim 15, wherein: A second width of the second sensing line outside one side of the second sensing unit is greater than a fourth width of the fourth sensing line outside one side of the fourth sensing unit.

18. The sensor of claim 1, further comprising: a main protrusion protruding from a side surface of a driving electrode among the plurality of driving electrodes or a sensing electrode among the plurality of sensing electrodes; a first protrusion protruding from a first side surface of the main protrusion; a second protrusion protruding from a second side surface of the main protrusion; as well as A third protrusion protrudes from a third side surface of the main protrusion facing the second side surface.

19. The sensor of claim 18, wherein: Each of the first protrusion, the second protrusion, and the third protrusion has a size smaller than that of the main protrusion.

20. The sensor of claim 1, further comprising: a second substrate, facing the first substrate; as well as An adhesive layer is configured to adhere the first substrate to the second substrate and at least partially overlaps at least one of the plurality of sensing lines.

21. The sensor of claim 20, wherein: The plurality of sensing pads are not covered by the second substrate and the adhesive layer.

22. A display device, comprising: Display panel; as well as A first sensor is disposed on a first side of the display panel. The first sensor includes a first sensing unit and a second sensing unit. The shape of the first sensing unit is different from the shape of the second sensing unit. The second sensing unit is arranged closer to the second side of the display panel than the first sensing unit, and Wherein, a first operation is performed when the first sensing unit detects a first sensing, and a second operation is performed when the second sensing unit detects a second sensing.

23. The display device according to claim 22, wherein: An area of ​​the first sensing unit is smaller than an area of ​​the second sensing unit.

24. The display device according to claim 22, wherein: The first sensor further includes a third sensing unit, and The shape of the third sensing unit is the same as the shape of the first sensing unit.

25. The display device according to claim 24, wherein: The third sensing unit is disposed between the first sensing unit and the second sensing unit.

26. The display device according to claim 24, wherein: When the third sensing unit detects the third sensing, a third operation is performed.

27. The display device according to claim 24, wherein: An area of ​​the third sensing unit is smaller than an area of ​​the second sensing unit.

28. The display device according to claim 24, wherein: An area of ​​the third sensing unit is the same as an area of ​​the first sensing unit.

29. The display device according to claim 22, wherein: The display panel includes a first area and a second area extending from a first side of the first area, Wherein, the first region is a planar region, and Wherein, the second region is a curved region.

30. The display device according to claim 29, wherein: The first sensor is disposed in the second area.

31. The display device according to claim 22, further comprising: A window is disposed on the first surface of the display panel, Wherein, the first sensor is disposed on a second surface of the display panel opposite to the first surface of the display panel.

32. The display device according to claim 31, further comprising: a frame disposed on the second surface of the display panel, wherein the first sensor is disposed between the display panel and the frame; and A bump is arranged between the first sensor and the display panel.

33. The display device according to claim 32, further comprising: a waterproof member, disposed between the frame and the display panel, Wherein, the waterproof component is closer to the edge of the display panel than the first sensor.

34. The display device according to claim 22, further comprising: A second sensor is disposed on a third side of the display panel, Wherein, the third side of the display panel is opposite to the first side of the display panel.

35. The display device according to claim 34, wherein: The second sensor includes a fourth sensing unit and a fifth sensing unit, The shape of the fourth sensing unit is different from the shape of the fifth sensing unit, and The fifth sensing unit is disposed closer to the second side of the display panel than the first sensing unit.

36. The display device according to claim 35, wherein: A fourth operation is performed when the fourth sensing unit detects the fourth sensing, and a fifth operation is performed when the fifth sensing unit detects the fifth sensing.

37. The display device according to claim 35, wherein: When the second sensing unit and the fifth sensing unit detect the sixth sensing at the same time, a sixth operation is performed.

38. The display device according to claim 35, wherein: The shape of the fifth sensing unit is the same as the shape of the second sensing unit.

39. The display device according to claim 35, wherein: An area of ​​the fifth sensing unit is the same as an area of ​​the second sensing unit.

40. The display device according to claim 35, wherein: The shape of the fifth sensing unit is different from the shape of the first sensing unit.

41. The display device according to claim 35, wherein: An area of ​​the fifth sensing unit is greater than an area of ​​the first sensing unit.

42. An electronic device comprising: A display device configured to display an image, The display device includes: a display panel; and a sensor disposed on a first side of the display panel, wherein the sensor includes: first base; A plurality of sensing units are arranged on the first surface of the first substrate; a plurality of driving electrodes and a plurality of sensing electrodes facing each other in each of the plurality of sensing units, respectively; and a plurality of sensing lines, respectively connecting the plurality of sensing electrodes to the plurality of sensing pads, Wherein, a maximum width of a first sensing line among the plurality of sensing lines is different from a maximum width of a second sensing line among the plurality of sensing lines.

43. An electronic device comprising: A display device configured to display an image, wherein the display device comprises: display panel; and A first sensor is disposed on a first side of the display panel. The first sensor includes a first sensing unit and a second sensing unit. The shape of the first sensing unit is different from the shape of the second sensing unit. The second sensing unit is arranged closer to the second side of the display panel than the first sensing unit, and Wherein, a first operation is performed when the first sensing unit detects a first sensing, and a second operation is performed when the second sensing unit detects a second sensing.

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