Optimization design method, system and storage medium for protective film substrate

Abstract

The present invention relates to an optimization design method, system and storage medium for a protective film substrate. The method comprises: obtaining tear force data of test samples of a protective film substrate and a backing paper, and verifying the material parameters of the test samples of the protective film substrate and the backing paper; establishing a peeling model for the peeling process of the protective film substrate and the backing paper during actual production according to the verified material parameters and actual working conditions; analyzing the peeling process of the protective film substrate and the backing paper during actual production according to the obtained peeling model, and obtaining the stress distribution and tearing state of the protective film substrate and the backing paper during the peeling process; optimizing the graphic layout structure of the protective film substrate according to the obtained stress distribution and tearing state of the protective film substrate and the backing paper during actual production. The present invention can solve the problem that the unreasonable graphic layout structure of the protective film substrate may cause tearing during the peeling process of the protective film substrate and the backing paper, leading to production abnormalities.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board production, and in particular to an optimization design method, system and storage medium for a protective film substrate. Background Art

[0002] With the advancement of miniaturization, integration, and diversification of electronic devices, the diversification of flexible circuit board design and manufacturing has gradually increased, which has also brought greater challenges to the corresponding production processes. Protective films (including protective film substrates and backing paper) are widely used in the manufacture of flexible circuit boards. During the use of protective films, it is generally necessary to cut the corresponding graphics on the protective film in advance. During use, the backing paper needs to be peeled off before entering the next step to bond the protective film substrate to the flexible board.

[0003] In the production of protective film, the protective film substrate is bonded to the backing paper during feeding, and the backing paper plays a protective role for the protective film substrate. After milling the graphics, the protective film substrate needs to be peeled off from the backing paper before proceeding to the next step. The unreasonable setting of the graphic layout structure or process parameters may cause tearing during the peeling process of the protective film substrate and the backing paper, resulting in production abnormalities and greatly affecting production. This problem often requires multiple redesigns and multiple adjustments to the process parameters to solve it. There is no relevant and clear preliminary troubleshooting method. Even in the design stage, it is often designed based on the experience of designers. Summary of the invention

[0004] The present invention provides an optimization design method, system and storage medium for a protective film substrate, which can solve the problem that the irrational graphic layout structure or process parameter setting of the protective film substrate in the traditional technology may cause tearing during the peeling process of the protective film substrate and the backing paper, resulting in production abnormalities.

[0005] In order to solve the above technical problems, the present invention provides an optimization design method for a protective film substrate, comprising:

[0006] Obtain tear force data of test samples of protective film substrate and backing paper, and verify material parameters of test samples of protective film substrate and backing paper;

[0007] According to the verified material parameters and actual working conditions, a peeling model of the protective film substrate and the backing paper during the actual production is established;

[0008] The peeling process of the protective film substrate and the backing paper during actual production is analyzed according to the obtained peeling model, and the stress distribution and tearing state of the protective film substrate and the backing paper during the peeling process are obtained;

[0009] The graphic layout structure of the protective film substrate is optimized according to the stress distribution and tearing state of the protective film substrate and the backing paper during actual production.

[0010] Optionally, the obtaining tear force data of the test samples of the protective film substrate and the liner paper and verifying the material parameters of the test samples of the protective film substrate and the liner paper include:

[0011] Controlling the tensile testing machine to perform tensile tearing tests on the prepared test samples of the protective film substrate and the liner paper, respectively, to obtain tearing force data of the test samples during the tearing process;

[0012] A tearing model of the test sample is established to simulate and test the tearing process of the test sample. According to the test results, the test material parameters of the protective film substrate and the backing paper are corrected to obtain accurate material parameters.

[0013] Optionally, the test sample is set as a rectangular sample, and a cutting line extending along the length direction of the test sample is provided in the middle of the test sample, and the cutting line satisfies the following relationship:

[0014] a / b=0.7-1.3, and h1 / (h1+h2)=0.3-0.7;

[0015] Wherein, a is the width of the portion of the test sample on one side of the cutting line, b is the width of the portion of the test sample on the other side of the cutting line, h1 is the length of the cutting line, and h1+h2 is the length of the test sample.

[0016] Optionally, the controlling the tensile testing machine to perform a tensile tearing test on the prepared test samples of the protective film substrate and the liner paper to obtain tearing force data of the test samples during the tearing process includes:

[0017] Controlling the tensile testing machine to perform tensile tearing tests on the protective film substrate and the backing paper of the cut test sample at a preset pre-tensioning force, a preset tensile speed, and a preset moving distance;

[0018] The tensile tearing data of the protective film substrate and the backing paper are obtained according to the tensile tearing test of the test sample, and the average tearing force corresponding to the protective film substrate and the backing paper is extracted from the tensile tearing data to obtain the tearing force data of the test sample during the tearing process.

[0019] Optionally, the tearing model of the test sample is established to simulate and test the tearing process of the test sample, and the test material parameters of the protective film substrate and the backing paper are corrected according to the test results to obtain accurate material parameters, including:

[0020] A tearing model is established according to a test sample subjected to a tensile tearing test by a tensile testing machine, and boundary conditions of the tearing model are set according to conditions of the tensile tearing test on the test sample;

[0021] According to the known test material parameters of the protective film substrate and the backing paper, the tearing model is solved by using an implicit solver to obtain the tearing animation of the tearing model and the support reaction forces on the cross sections on both sides of the tearing line;

[0022] Determine whether the tearing animation process of the tearing model is the same as the tensile tearing test process of the test sample, and whether the support reaction force and tearing force data are equal;

[0023] When the tearing animation process of the tearing model is different from the tensile tearing test process of the test sample, or / and the support reaction force and the tearing force data are not equal, the test material parameters of the protective film substrate and the backing paper are corrected to obtain accurate material parameters.

[0024] Optionally, the step of establishing a peeling model during the peeling process of the protective film substrate and the backing paper during actual production based on the verified material parameters and actual working conditions includes:

[0025] According to the design structure of the protective film substrate and the backing paper during actual peeling production, a peeling model during the peeling process of the protective film substrate and the backing paper is established;

[0026] According to the verified accurate material parameters and actual working conditions, the boundary conditions of the peeling model are set;

[0027] The peeling model includes a workbench provided with a steel plate, a backing paper attached to the surface of the workbench, and a protective film substrate attached to the backing paper.

[0028] Optionally, the workbench has a downwardly turned arc-shaped initial end portion, and the downward turning angle of the initial end portion is 135-180 degrees; the backing paper has a peeling start end that is attached to the arc-shaped initial end portion of the workbench.

[0029] Optionally, the verified accurate material parameters and actual working conditions obtained include:

[0030] According to the verified accurate material parameters and actual working conditions, the boundary conditions of the peeling model are set as follows:

[0031] A tensile boundary condition is applied to the edge of the peeling start end of the liner, and the magnitude and angle of the tensile force are the same as those in the actual working condition;

[0032] By using the relativity of motion, the motion of the protective film substrate and the backing paper is converted into the motion of the workbench, and the moving direction of the workbench is the same as the direction of the component force of the tension on the backing paper on the x-axis, and the moving speed of the workbench is equal to the speed of the feeding;

[0033] Set the initial position and end position of the protective film substrate and the end position of the backing paper as fixed boundaries;

[0034] The cohesive force model is used to simulate the bonding of the adhesive layer between the protective film substrate and the backing paper;

[0035] Set the contact relationship between the backing paper and the workbench to a friction relationship with a friction coefficient of 0.1 to 0.3;

[0036] The verified and accurate material parameters of the protective film substrate and the backing paper are used as the material parameters of the protective film substrate and the backing paper in the peeling model.

[0037] Optionally, the peeling process of the protective film substrate and the backing paper under actual working conditions is analyzed according to the obtained peeling model to obtain the stress distribution and tearing state of the protective film substrate and the backing paper during the peeling process, including:

[0038] According to the obtained peeling model, the peeling process of the protective film substrate and the backing paper under actual working conditions is analyzed and solved by using the display dynamics model, and the stress cloud diagram during the peeling process of the protective film substrate and the backing paper is obtained;

[0039] Based on the obtained stress cloud diagram, the stress distribution and tearing state of the protective film substrate and the backing paper during the tearing process were evaluated.

[0040] Optionally, the graphic layout structure of the protective film substrate is optimized according to the stress distribution and tearing state of the protective film substrate and the backing paper obtained during actual production, including:

[0041] According to the stress distribution and tearing state of the protective film substrate and the backing paper obtained during actual production, the area where the stress distribution is concentrated and the area where the tearing occurs are obtained;

[0042] According to the areas where stress distribution is concentrated and where tearing occurs, the graphic layout structure of the corresponding areas on the protective film substrate is optimized;

[0043] Among them, the graphic layout structure includes graphic shape, graphic size, number of graphics, graphic arrangement, distance between adjacent graphics, graphic angle, graphic proportion, and graphic thickness.

[0044] In addition, the present invention also provides an optimization design system for a protective film substrate, comprising:

[0045] A material parameter verification module is used to obtain tear force data of test samples of the protective film substrate and the backing paper, and verify the material parameters of the test samples of the protective film substrate and the backing paper;

[0046] A peeling model building module is used to build a peeling model in the actual production process of peeling the protective film substrate and the backing paper according to the verified material parameters and actual working conditions;

[0047] The peeling process risk module is used to analyze the peeling process of the protective film substrate and the backing paper during actual production according to the obtained peeling model, and obtain the stress distribution and tearing state of the protective film substrate and the backing paper during the peeling process;

[0048] The structure optimization module is used to optimize the graphic layout structure of the protective film substrate according to the stress distribution and tearing state of the protective film substrate and the backing paper during actual production.

[0049] In addition, the present invention also proposes a computer-readable storage medium, which stores computer execution instructions. When the computer execution instructions are executed by a processor, they are used to implement all or part of the method steps of the optimization design method for the protective film substrate as described above.

[0050] In addition, the present invention also proposes a computer program product, including computer instructions, characterized in that when the computer instructions are executed by a processor, they are used to implement all or part of the method steps of the above-mentioned method for optimizing the design of the protective film substrate.

[0051] The beneficial effects brought about by the technical solution provided by the present invention include:

[0052] By simulating and analyzing the tearing and separation process of the protective film substrate and the backing paper and modeling and analyzing the peeling process, production risks can be predicted, thereby improving design and production efficiency and saving production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0054] Figure 1 A schematic flow chart of the steps of the method for optimizing the design of the protective film substrate according to an embodiment of the present invention;

[0055] Figure 2 A schematic diagram of the structure of a test sample involved in the method for optimizing the design of a protective film substrate according to an embodiment of the present invention;

[0056] Figure 3 It is a structural schematic diagram of a peeling model involved in the optimization design method of the protective film substrate according to an embodiment of the present invention;

[0057] Figure 4It is a structural schematic diagram of the initial state of the peeling model involved in the optimization design method of the protective film substrate according to the embodiment of the present invention;

[0058] Figure 5 It is a structural schematic diagram of a peeling process of a peeling model involved in the optimization design method of a protective film substrate according to an embodiment of the present invention;

[0059] Figure 6 This is an example diagram of simulation results of the optimization design method of the protective film substrate according to an embodiment of the present invention;

[0060] Figure 7 It is a simplified block diagram showing the structure of the optimization design system for the protective film substrate according to an embodiment of the present invention. DETAILED DESCRIPTION

[0061] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0062] In the processing of flexible board, the protective film substrate needs to be bonded to the flexible board. The protective film substrate is also called PI substrate, which includes polyimide and glue. The backing paper is covered on the glue surface when the protective film substrate is manufactured to protect the glue surface. The backing paper needs to be peeled off before the protective film substrate is bonded to the flexible board. Therefore, the protective film substrate needs to be pre-processed to match the design of the flexible board. In order to make the protective film substrate match the flexible board, the graphic layout structure needs to be designed on the protective film substrate.

[0063] like Figure 1 As shown, the present invention provides a method for optimizing the design of a protective film substrate, which may specifically include the following steps:

[0064] S100, obtaining tear force data of test samples of the protective film substrate and the backing paper, and verifying material parameters of the test samples of the protective film substrate and the backing paper;

[0065] S200, establishing a peeling model during the peeling process of the protective film substrate and the backing paper during actual production according to the obtained verified material parameters and actual working conditions;

[0066] S300, analyzing the peeling process of the protective film substrate and the backing paper during actual production according to the obtained peeling model, and obtaining the stress distribution and tearing state of the protective film substrate and the backing paper during the peeling process;

[0067] S400, optimizing the graphic layout structure of the protective film substrate according to the stress distribution and tearing state of the protective film substrate and the backing paper during actual production.

[0068] By making test samples of the protective film substrate and backing paper, and testing and obtaining the tear force data of the test samples, it is convenient to verify and correct the material parameters of the protective film substrate and backing paper according to the obtained tear force data and the test process; then a peeling model corresponding to the actual production during the peeling process of the protective film substrate and the backing paper can be established, and the finite element analysis of the peeling model can be performed using the verified and corrected material parameters and the actual working conditions to obtain the stress distribution and tearing state of the protective film substrate and the backing paper during the peeling process. Based on this, the graphic layout structure of the protective film substrate is analyzed, and the graphic layout structure of the area with obvious stress concentration and the area where tearing occurs is optimized. In this way, by simulating and analyzing the tearing and separation process of the protective film substrate and the backing paper, and modeling and analyzing the peeling process, the production risk can be predicted, thereby improving the design and production efficiency and saving production costs.

[0069] Furthermore, in the above step S100, the tear force data of the test samples of the protective film substrate and the backing paper are obtained, and the material parameters of the test samples of the protective film substrate and the backing paper are verified, which may further include the following steps:

[0070] S110, controlling the tensile testing machine to perform tensile tearing tests on the prepared test samples of the protective film substrate and the backing paper, respectively, to obtain tearing force data of the test samples during the tearing process. Figure 2 As shown, the test sample is set as a rectangular sample, and a cutting line extending along the length direction of the test sample is set in the middle of the test sample, and the cutting line satisfies the following relationship:

[0071] a / b=0.7-1.3, and h1 / (h1+h2)=0.3-0.7;

[0072] Wherein, a is the width of the portion of the test sample on one side of the cutting line, b is the width of the portion of the test sample on the other side of the cutting line, h1 is the length of the cutting line, and h1+h2 is the length of the test sample.

[0073] A rectangular sample of protective film substrate and backing paper with a size of 13mm*4mm can be prepared in advance by a sharp blade or other means. The edges of the rectangular sample should be as smooth and flat as possible, without sharp corners or obvious barbs.

[0074] When the tensile tear test is performed on the prepared test samples of the protective film substrate and the backing paper using a tensile testing machine, the two sides of the test sample, i.e., side A and side B, can be clamped by the tensile testing machine to perform the tensile tear test on the test sample under preset tensile conditions.

[0075] S120, establishing a tearing model of the test sample to perform simulation detection and verification on the tearing process of the test sample, and modifying the test material parameters of the protective film substrate and the backing paper according to the detection results to obtain accurate material parameters.

[0076] That is, a tearing model of the test sample is established to perform simulated tearing analysis, and the test material parameters of the protective film substrate and backing paper of the test sample are inspected to detect whether the test material parameters of the protective film substrate and backing paper are accurate. If inaccurate, the test material parameters are corrected to obtain accurate material parameters.

[0077] Furthermore, in the above step S110, controlling the tensile testing machine to perform a tensile tearing test on the prepared test samples of the protective film substrate and the liner paper to obtain tearing force data of the test samples during the tearing process may further include the following steps:

[0078] S112, controlling the tensile testing machine to perform tensile tearing tests on the protective film substrate and the backing paper of the cut test sample at a preset pre-tensioning force, a preset tensile speed, and a preset moving distance.

[0079] After clamping the two sides of the cutting line of the test sample by the tensile testing machine, the tensile tearing test can be performed on the test sample under preset tensile conditions. The preset tensile conditions include a preset pre-tensioning force, a preset tensile speed, and a preset moving distance. Moreover, in this embodiment, the preset pre-tensioning force can be 0.018 to 0.022 N, for example, the preset pre-tensioning force can be set to 0.02 N; in addition, the preset tensile speed can be 450 to 550 mm / min, for example, the preset tensile speed can be set to 500 mm / min; in addition, the preset moving distance can be set to 7 to 9 mm, for example, the preset moving distance can be set to 8 mm.

[0080] S114. Obtain tensile tear data of the protective film substrate and the backing paper according to the tensile tear test of the test sample, and extract the average tear force corresponding to the protective film substrate and the backing paper from the tensile tear data to obtain the tear force data of the test sample during the tearing process.

[0081] When conducting a tensile tear test on the test sample, the test sample can be gradually and completely torn apart from the cutting line to obtain the tensile tear data in this process, and based on this, the average tear force of the test samples of the protective film substrate and the backing paper can be obtained, which is the tear force data of the test sample during the tearing process.

[0082] Moreover, in the above step S120, a tearing model of the test sample is established to simulate and test the tearing process of the test sample, and the test material parameters of the protective film substrate and the backing paper are corrected according to the test results to obtain accurate material parameters, which may further include the following steps:

[0083] S122. Establish a tear model according to the test sample subjected to the tensile tear test by the tensile testing machine, and set the boundary conditions of the tear model according to the conditions of the tensile tear test on the test sample.

[0084] S124. According to the known test material parameters of the protective film substrate and the backing paper, an implicit solver is used to solve the tearing model to obtain the tearing animation of the tearing model and the support reaction forces on the cross sections on both sides of the cutting line.

[0085] S126, determining whether the tearing animation process of the tearing model is the same as the tensile tearing test process of the test sample, and whether the support reaction force and the tearing force data are equal.

[0086] S127. When the tearing animation process of the tearing model is different from the tensile tearing test process of the test sample, or / and the support reaction force and the tearing force data are not equal, the test material parameters of the protective film substrate and the backing paper are corrected to obtain accurate material parameters;

[0087] S128. When the tearing animation process of the tearing model is the same as the tensile tearing test process of the test sample, and the support reaction force and the tearing force data are equal, it is judged that the test material parameters of the protective film substrate and the backing paper are accurate material parameters.

[0088] According to the geometric structure of the test sample for tensile tearing test, the tearing model of the protective film substrate and the backing paper is constructed. The simulation requires the material density, Young's modulus, Poisson's ratio, and stress-strain curve of the plastic section of the protective film substrate and the backing paper. These test material parameters can be obtained from the manufacturer or tensile test. In addition, when the tearing model is simulated, the corresponding tearing animation process can be obtained, and the support reaction force on the cross section on both sides of the tear line of the tearing model can also be obtained.

[0089] Moreover, when the test sample is subjected to a tensile tearing test in the above steps, the corresponding tensile tearing process and tearing force data can also be obtained. The tensile tearing process of the tensile tearing test can be compared and analyzed with the tearing animation process when simulating the tearing model to determine whether the two are similar. When the two are not similar, the test material parameters of the protective film substrate and the backing paper can be determined to be inaccurate material parameters; and the tearing force data of the tensile tearing test can be compared and analyzed with the support and reaction force when simulating the tearing model to determine whether the two are equal. When the difference between the two is large, the test material parameters of the protective film substrate and the backing paper can be determined to be inaccurate material parameters. In addition, the material parameters of the protective film substrate and the backing paper need to be corrected. Moreover, after the material parameters of the protective film substrate and the backing paper are corrected, the tearing model can continue to be simulated and analyzed using the corrected material parameters, and the tensile tearing process of the tensile tearing test can continue to be compared and analyzed with the tearing animation process when simulating the tearing model, and the tearing force data of the tensile tearing test can be compared and analyzed with the support and reaction force when simulating the tearing model.

[0090] Moreover, when the tensile tearing process of the tensile tearing test is basically similar to the tearing animation process when simulating the tearing model, and the tearing force data of the tensile tearing test is basically equal to the support and reaction force when simulating the tearing model, it can be determined that the test material parameters of the protective film substrate and the backing paper are accurate material parameters and do not need to be modified.

[0091] In addition, in the above step S200, according to the verified material parameters and actual working conditions, a peeling model in the actual production process of peeling the protective film substrate and the backing paper is established, which may further include the following steps:

[0092] S210, according to the design structure of the protective film substrate and the backing paper during the actual peeling production, establish a peeling model during the peeling process of the protective film substrate and the backing paper. Figure 3 to Figure 4 As shown, the peeling model includes a workbench set with a steel plate, a backing paper attached to the surface of the workbench (i.e., placed lightly, with only friction but no adhesion), and a protective film substrate attached to the backing paper; and the workbench has a downward-turned arc-shaped initial end, and the downward-turning angle of the initial end is 135 to 180 degrees; the backing paper has a peeling starting end that is attached to the arc-shaped initial end of the workbench.

[0093] S220: setting boundary conditions of the peeling model according to the verified accurate material parameters and actual working conditions.

[0094] That is, according to the design of the protective film substrate and the backing paper and the actual working conditions of the automatic stripping device to strip the protective film substrate and the backing paper, a shell unit model of the protective film substrate and the backing paper stripping process, i.e., a stripping model, is established. In addition, the arc size of the initial arc-shaped end of the workbench should be the same as the size of the workbench edge or roller corresponding to the stripping area of ​​the automatic stripping device, which can be determined according to the structure of the automatic stripping device, in order to make the initial stripping angle of the simulation model close to the actual process.

[0095] Furthermore, in step S220, according to the verified accurate material parameters and actual working conditions, the boundary conditions of the peeling model are set, which may further include the following steps:

[0096] According to the verified accurate material parameters and actual working conditions, the boundary conditions of the peeling model are set as follows:

[0097] Apply a tensile force boundary condition to the edge of the peeling start end of the backing paper, and the magnitude and angle of the tensile force are the same as those in the actual working condition. The backing paper is attached to the surface of the workbench, and the initial position of the backing paper is also turned down along the position where the workbench is turned down, and fits the curved surface of the workbench. Apply a tensile force boundary condition to the edge of the initial side of the backing paper (i.e. the peeling start end), and the magnitude and direction of the tensile force should be the same as those in the actual working condition of the automatic peeling equipment. The angle is generally set within the range of 105 to 180 degrees.

[0098] By utilizing the relativity of motion, the motion of the protective film substrate and the backing paper is converted into the motion of the workbench, and the moving direction of the workbench is the same as the direction of the component force of the tension on the backing paper on the x-axis, and the moving speed of the workbench is equal to the speed of the feeding. In the actual working process of the automatic stripping device, the workbench is fixed, and the backing paper continuously moves forward relative to the workbench under the action of the tension, and the protective film substrate and the backing paper move forward at the same speed and separate in the stripping area. In the embodiment, by utilizing the relativity of motion, the motion of the protective film substrate and the backing paper is converted into the motion of the workbench, which can simplify the model to a certain extent and improve the calculation speed and convergence. Moreover, the moving direction of the workbench is the same as the direction of the component force of the tension on the backing paper on the x-axis, and the moving speed is set with reference to the process conditions of the automatic stripping device, and is generally set to be equal to the speed of the feeding.

[0099] Set the initial position and end position of the protective film substrate and the end position of the backing paper as fixed boundaries;

[0100] The cohesive force model is used to simulate the bonding of the adhesive layer between the protective film substrate and the backing paper. The cohesive force model is used to simulate the bonding of the adhesive layer between the protective film substrate and the backing paper. The parameters involved in the cohesive force model can be obtained from the supplier or by testing. Moreover, in the process of simulating and analyzing the peeling model, characterizing the interface properties between the protective film substrate and the backing paper by the cohesive force model is an effective way to explore its interlayer peeling mechanism. Moreover, the cohesive force model has many constitutive parameters, and the accuracy of the constitutive parameters is very important for whether the cohesive force model can correctly reflect the interface performance. Therefore, determining the accurate constitutive parameters of the cohesive force model that characterizes the interface performance between the protective film substrate and the backing paper is the key to exploring the tearing of the protective film substrate and the backing paper during the peeling process. Similarly, the constitutive parameters of the cohesive force model can also be calibrated and corrected by a tensile tearing test of the specimen similar to the above-mentioned test sample to determine the accurate constitutive parameters.

[0101] Set the contact relationship between the backing paper and the workbench to a friction relationship with a friction coefficient of 0.1 to 0.3;

[0102] The verified and accurate material parameters of the protective film substrate and the backing paper are used as the material parameters of the protective film substrate and the backing paper in the peeling model.

[0103] In addition, if Figure 5 and Figure 6 As shown, in the above step S300, the peeling process of the protective film substrate and the backing paper under actual working conditions is analyzed according to the obtained peeling model to obtain the stress distribution and tearing state of the protective film substrate and the backing paper during the peeling process, which may further include the following steps:

[0104] S310, according to the obtained peeling model, using a display dynamics model to analyze and solve the peeling process of the protective film substrate and the backing paper under actual working conditions, and a stress cloud diagram during the peeling process of the protective film substrate and the backing paper;

[0105] S320. According to the obtained stress cloud map, the stress distribution and tearing state of the protective film substrate and the backing paper during the tearing process are evaluated.

[0106] In addition, if Figure 6 As shown, in the above step S400, according to the stress distribution and tearing state of the protective film substrate and the backing paper during actual production, the graphic layout structure of the protective film substrate is optimized, which may further include the following steps:

[0107] S410, obtaining an area where stress distribution is concentrated and an area where tearing occurs according to the stress distribution and tearing state of the protective film substrate and the backing paper during actual production;

[0108] S420, optimizing the graphic layout structure of the corresponding area on the protective film substrate according to the area where the stress distribution is concentrated and the area where the tearing occurs;

[0109] Among them, the graphic layout structure includes graphic shape, graphic size, number of graphics, graphic arrangement, distance between adjacent graphics, graphic angle, graphic proportion, and graphic thickness.

[0110] Through simulation methods, different designs of protective film substrates and backing papers can be simulated, including the minimum distance between graphics, graphic angles, graphic proportions, material thickness, etc., so as to predict the results, discover risks in advance, and guide design modifications. In addition, the impact of different graphics can be studied to propose relevant design criteria for this type of design.

[0111] In addition, if Figure 7 As shown, the present invention also proposes an optimization design system 100 for a protective film substrate, which corresponds to the optimization design method for the protective film substrate described above. Specifically, the optimization design system 100 for a protective film substrate may include:

[0112] A material parameter verification module 110 is used to obtain tear force data of test samples of the protective film substrate and the backing paper, and verify material parameters of the test samples of the protective film substrate and the backing paper;

[0113] The peeling model establishment module 120 is used to establish a peeling model in the process of peeling the protective film substrate and the backing paper during actual production according to the verified material parameters and actual working conditions;

[0114] The peeling process risk module 130 is used to analyze the peeling process of the protective film substrate and the backing paper during actual production according to the obtained peeling model, and obtain the stress distribution and tearing state of the protective film substrate and the backing paper during the peeling process;

[0115] The structure optimization module 140 is used to optimize the graphic layout structure of the protective film substrate according to the stress distribution and tearing state of the protective film substrate and the backing paper during actual production.

[0116] The flexible plate film laminating system 100 described in this embodiment corresponds to the above-mentioned optimization design method of the protective film substrate. The functions of each module in the flexible plate film laminating system 100 in this embodiment are described in detail in the corresponding method embodiment and will not be repeated here.

[0117] In addition, in some embodiments, the present invention also proposes a computer-readable storage medium, which stores computer execution instructions. When the computer execution instructions are executed by a processor, they are used to implement all or part of the method steps of the optimization design method for the protective film substrate as described above.

[0118] In addition, in some embodiments, the present invention also provides a computer program product, including computer instructions, which, when executed by a processor, are used to implement all or part of the method steps of the method for optimizing the design of the protective film substrate as described above.

[0119] The present invention implements all or part of the process in the above method, and can also be completed by instructing related hardware through a computer program. The computer program can be stored in a computer-readable storage medium. When the computer program is executed by a processor, the steps of each method embodiment can be implemented. Among them, the computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium may include: any entity or device capable of carrying computer program code, recording medium, USB flash drive, mobile hard disk, disk, optical disk, computer memory, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), electric carrier signal, telecommunication signal and software distribution medium. It should be noted that the content contained in the computer-readable medium can be appropriately increased or decreased according to the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, according to legislation and patent practice, the computer-readable medium does not include electric carrier signals and telecommunication signals.

[0120] Based on the same inventive concept, in some embodiments, the present invention also provides an electronic device, including a memory and a processor, wherein the memory stores a computer program running on the processor, and when the processor executes the computer program, all or part of the method steps in the above method are implemented.

[0121] The processor may be a central processing unit (CPU), other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor, etc. The processor is the control center of a computer device, and uses various interfaces and lines to connect various parts of the entire computer device.

[0122] The memory can be used to store computer programs and / or models. The processor realizes various functions of the computer device by running or executing the computer programs and / or models stored in the memory, and calling the data stored in the memory. The memory can mainly include a program storage area and a data storage area, wherein the program storage area can store an operating system and at least one application required for a function (such as a sound playback function, an image playback function, etc.); the data storage area can store data created according to the use of the mobile phone (such as audio data, video data, etc.). In addition, the memory can include a high-speed random access memory, and can also include a non-volatile memory, such as a hard disk, a memory, a plug-in hard disk, a smart memory card (SmartMedia Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), at least one disk storage device, a flash memory device, or other volatile solid-state storage devices.

[0123] It will be appreciated by those skilled in the art that embodiments of the present invention may be provided as methods, systems, servers or computer program products. Therefore, the present invention may take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Moreover, the present invention may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage and optical storage, etc.) containing computer-usable program codes.

[0124] The present invention is described with reference to flowcharts and / or block diagrams of methods, devices (systems), servers, and computer program products according to embodiments of the present invention. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as a combination of processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0125] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0126] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0127] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A method for optimizing the design of a protective film substrate, characterized in that: include: Obtain tear force data of test samples of protective film substrate and backing paper, and verify material parameters of test samples of protective film substrate and backing paper; According to the verified material parameters and actual working conditions, a peeling model of the protective film substrate and the backing paper during the actual production is established; The peeling process of the protective film substrate and the backing paper during actual production is analyzed according to the obtained peeling model, and the stress distribution and tearing state of the protective film substrate and the backing paper during the peeling process are obtained; According to the stress distribution and tearing state of the protective film substrate and the backing paper during actual production, the graphic layout structure of the protective film substrate is optimized.

2. The method for optimizing the design of a protective film substrate according to claim 1, characterized in that: The step of obtaining tear force data of the test samples of the protective film substrate and the backing paper and verifying the material parameters of the test samples of the protective film substrate and the backing paper includes: Controlling the tensile testing machine to perform tensile tearing tests on the prepared test samples of the protective film substrate and the liner paper, respectively, to obtain tearing force data of the test samples during the tearing process; A tearing model of the test sample is established to simulate and test the tearing process of the test sample. According to the test results, the test material parameters of the protective film substrate and the backing paper are corrected to obtain accurate material parameters.

3. The method for optimizing the design of a protective film substrate according to claim 2, characterized in that: The test sample is set as a rectangular sample, and a cutting line extending along the length direction of the test sample is set in the middle of the test sample, and the cutting line satisfies the following relationship: a / b=0.7-1.3, and h1 / (h1+h2)=0.3-0.7; Wherein, a is the width of the portion of the test sample on one side of the cutting line, b is the width of the portion of the test sample on the other side of the cutting line, h1 is the length of the cutting line, and h1+h2 is the length of the test sample.

4. The method for optimizing the design of a protective film substrate according to claim 2, characterized in that: The controlling tensile testing machine performs a tensile tearing test on the prepared test samples of the protective film substrate and the liner paper to obtain tearing force data of the test samples during the tearing process, including: Controlling the tensile testing machine to perform tensile tearing tests on the protective film substrate and the backing paper of the cut test sample at a preset pre-tensioning force, a preset tensile speed, and a preset moving distance; The tensile tearing data of the protective film substrate and the backing paper are obtained according to the tensile tearing test of the test sample, and the average tearing force corresponding to the protective film substrate and the backing paper is extracted from the tensile tearing data to obtain the tearing force data of the test sample during the tearing process.

5. The method for optimizing the design of a protective film substrate according to claim 2, characterized in that: The tearing model of the test sample is established to simulate and test the tearing process of the test sample, and the test material parameters of the protective film substrate and the backing paper are corrected according to the test results to obtain accurate material parameters, including: A tearing model is established according to a test sample subjected to a tensile tearing test by a tensile testing machine, and boundary conditions of the tearing model are set according to conditions of the tensile tearing test on the test sample; According to the known test material parameters of the protective film substrate and the backing paper, the tearing model is solved by using an implicit solver to obtain the tearing animation of the tearing model and the support reaction forces on the cross sections on both sides of the tearing line; Determine whether the tearing animation process of the tearing model is the same as the tensile tearing test process of the test sample, and whether the support reaction force and tearing force data are equal; When the tearing animation process of the tearing model is different from the tensile tearing test process of the test sample, or / and the support reaction force and the tearing force data are not equal, the test material parameters of the protective film substrate and the backing paper are corrected to obtain accurate material parameters.

6. The method for optimizing the design of a protective film substrate according to claim 2, characterized in that: The method of establishing a peeling model in the process of peeling the protective film substrate and the backing paper during actual production based on the verified material parameters and actual working conditions includes: According to the design structure of the protective film substrate and the backing paper during actual peeling production, a peeling model during the peeling process of the protective film substrate and the backing paper is established; According to the verified accurate material parameters and actual working conditions, the boundary conditions of the peeling model are set; The peeling model includes a workbench set with a steel plate, a backing paper attached to the surface of the workbench, and a protective film substrate attached to the backing paper.

7. The method for optimizing the design of a protective film substrate according to claim 6, characterized in that: The workbench has a downwardly turned arc-shaped initial end portion, and the downward turning angle of the initial end portion is 135-180 degrees; the backing paper has a peeling start end which is attached to the arc-shaped initial end portion of the workbench.

8. The method for optimizing the design of a protective film substrate according to claim 6, characterized in that: The verified accurate material parameters and actual working conditions obtained include: According to the verified accurate material parameters and actual working conditions, the boundary conditions of the peeling model are set as follows: A tensile boundary condition is applied to the edge of the peeling start end of the liner, and the magnitude and angle of the tensile force are the same as those in the actual working condition; By using the relativity of motion, the motion of the protective film substrate and the backing paper is converted into the motion of the workbench, and the moving direction of the workbench is the same as the direction of the component force of the tension on the backing paper on the x-axis, and the moving speed of the workbench is equal to the speed of the feeding; Set the initial position and end position of the protective film substrate and the end position of the backing paper as fixed boundaries; The cohesive force model is used to simulate the bonding of the adhesive layer between the protective film substrate and the backing paper; Set the contact relationship between the backing paper and the workbench to a friction relationship with a friction coefficient of 0.1 to 0.3; The verified accurate material parameters of the protective film substrate and the backing paper are used as the material parameters of the protective film substrate and the backing paper in the peeling model.

9. The method for optimizing the design of a protective film substrate according to claim 2, characterized in that: The step of analyzing the peeling process of the protective film substrate and the backing paper under actual working conditions according to the obtained peeling model to obtain the stress distribution and tearing state of the protective film substrate and the backing paper during the peeling process includes: According to the obtained peeling model, the peeling process of the protective film substrate and the backing paper under actual working conditions is analyzed and solved by using the display dynamics model, and the stress cloud diagram in the peeling process of the protective film substrate and the backing paper is obtained; Based on the obtained stress cloud diagram, the stress distribution and tearing state of the protective film substrate and the backing paper during the tearing process were evaluated.

10. The method for optimizing the design of a protective film substrate according to claim 2, characterized in that: The method of optimizing the graphic layout structure of the protective film substrate according to the stress distribution and tearing state of the protective film substrate and the backing paper during actual production comprises: According to the stress distribution and tearing state of the protective film substrate and the backing paper obtained during actual production, the area where the stress distribution is concentrated and the area where the tearing occurs are obtained; According to the areas where stress distribution is concentrated and where tearing occurs, the graphic layout structure of the corresponding areas on the protective film substrate is optimized; Among them, the graphic layout structure includes graphic shape, graphic size, number of graphics, graphic arrangement, distance between adjacent graphics, graphic angle, graphic proportion, and graphic thickness.

11. An optimization design system for a protective film substrate, characterized in that: include: A material parameter verification module is used to obtain tear force data of test samples of the protective film substrate and the backing paper, and verify the material parameters of the test samples of the protective film substrate and the backing paper; A peeling model building module is used to build a peeling model in the actual production process of peeling the protective film substrate and the backing paper according to the verified material parameters and actual working conditions; The peeling process risk module is used to analyze the peeling process of the protective film substrate and the backing paper during actual production according to the obtained peeling model, and obtain the stress distribution and tearing state of the protective film substrate and the backing paper during the peeling process; The structure optimization module is used to optimize the graphic layout structure of the protective film substrate according to the stress distribution and tearing state of the protective film substrate and the backing paper during actual production.

12. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer-executable instructions, which, when executed by a processor, are used to implement all or part of the method steps of the method for optimizing the design of a protective film substrate as described in claims 1-10.

13. A computer program product comprising computer instructions, characterized in that: When the computer instructions are executed by a processor, they are used to implement all or part of the method steps of the method for optimizing the design of a protective film substrate as described in claims 1 to 10.

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