Manual bonding platform

Abstract

The invention discloses a manual bonding platform, and relates to the technical field of MEMS chip manufacturing. Comprising a Z-direction electric lifting table, a Y-direction electric linear displacement sliding table, an X-direction electric linear displacement sliding table, a voltage source, a displacement table driver, a chip holder, a grid baffle, a supporting rod, a heat insulation plate and a heat source. The Y-direction electric linear displacement sliding table is installed on the Z-direction electric lifting table, the X-direction electric linear displacement sliding table is installed on the Y-direction electric linear displacement sliding table, the heat insulation plate is placed on the X-direction electric linear displacement sliding table, the heat source is arranged on the heat insulation plate, and the lower chip is placed on the heat source. The supporting rod is fixedly installed on the table top, and the grid baffle and the chip clamping device are fixedly connected with the supporting rod. The moving sliding tables in the three directions are all electrically connected with the displacement table driver, and the heat source is electrically connected with the voltage source. According to the invention, the small-area bonding of the chip is realized, and a new solution thought is provided for the MEMS chip manufacturing field, especially the chip bonding direction.

Description

Technical Field

[0001] The invention belongs to the technical field of MEMS chip manufacturing, and more specifically, relates to a manual bonding platform. Background Art

[0002] Driven by Moore's Law, the integrated circuit industry continues to develop at a high speed, and the feature size of transistors continues to shrink. However, as the feature size of transistors approaches the physical limit, quantum effects and short channel effects become more and more significant, leakage current increases, and limits the further reduction of transistors. Therefore, exploring new channel materials and device structures has become the key to promoting the continued development of the IC industry. In this context, wafer-level packaging bonding technology has gradually entered the field of integrated circuit manufacturing, becoming an important technical approach to achieve three-dimensional stacking homogeneous / heterogeneous integration, improve device performance and functionality, and reduce system power consumption, size and manufacturing costs.

[0003] Bonding is a technology that directly combines two homogeneous or heterogeneous semiconductor materials with clean and atomically flat surfaces under certain conditions after surface cleaning and activation treatment, and bonds the wafers together through van der Waals forces, molecular forces, and even atomic forces. Conventional bonding includes direct bonding, anodic bonding, solder bonding, and thermocompression bonding. Direct bonding requires a temperature between room temperature and 1200°C, and the pressure requirement is relatively small. It is often used in SOI wafer manufacturing and heterogeneous structures. The anodic bonding temperature needs to be 150-500°C, and no mechanical pressure is required, but electrostatic pressure is required, which requires a voltage of 200-1500V. The solder bonding temperature needs to be 150-450°C, and only low load pressure is required. Thermocompression bonding requires higher temperatures and greater pressure. The materials bonded by thermocompression are highly airtight and compatible with CMOS.

[0004] Existing wafer bonding machines are developing in the direction of high precision, high stability, intelligence, automation, multi-function and integration. At the same time, they are gradually developing towards large wafer bonding. However, existing bonding machines are restricted by the bonding area. Once the bonding area is too small, existing bonding machines are difficult to bond. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide a manual bonding platform, which overcomes the difficulty of small-area bonding, realizes small-area chip bonding, and provides a new solution for the MEMS chip manufacturing field, especially the chip bonding direction.

[0006] In order to solve the above technical problems, the technical solution adopted by the present invention is: a manual bonding platform, including a Z-direction electric lifting platform, a Y-direction electric linear displacement slide, an X-direction electric linear displacement slide, a voltage source, a displacement platform driver, a chip clamp, a baffle plate, a support rod, a heat insulation plate and a heat source; the Z-direction electric lifting platform is placed on a desktop, the Y-direction electric linear displacement slide is installed on the Z-direction electric lifting platform, the X-direction electric linear displacement slide is installed on the Y-direction electric linear displacement slide, the heat insulation plate is placed on the X-direction electric linear displacement slide, the heat source is arranged on the heat insulation plate, and the lower chip is placed on the heat source; the support rod is fixedly installed on the desktop, the baffle plate is fixedly connected to the support rod, and the baffle plate is located above the chip clamp, the chip clamp clamps the upper chip, and the chip clamp is fixedly connected to the support rod;

[0007] The Z-direction electric lifting platform, the Y-direction electric linear displacement slide, and the X-direction electric linear displacement slide are all electrically connected to the displacement stage driver, and the heat source is electrically connected to the voltage source; the Z-direction electric lifting platform, the Y-direction electric linear displacement slide, and the X-direction electric linear displacement slide drive the lower chip to move in three directions.

[0008] Preferably, the bonding platform further comprises an observation light mirror, and the observation light mirror is installed above the baffle plate.

[0009] Preferably, the heat source is adhesively connected to the heat insulation board.

[0010] The beneficial effect of adopting the above technical solution is that: the present invention uses a chip clamp to clamp the upper chip, uses the Z-direction electric lifting platform, the Y-direction electric linear displacement slide, and the X-direction electric linear displacement slide to adjust the position of the lower chip so that it is aligned with the upper chip, and uses an observation microscope to observe the alignment of the upper and lower chips. When the upper and lower chips are aligned, the Z-direction electric lifting platform and the baffle plate are used to squeeze the upper and lower chips to complete chip bonding. The present invention solves the problem of difficulty in small-area chip bonding, realizes small-area chip bonding, and provides a new solution for the MEMS chip manufacturing field, especially the chip bonding direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a schematic diagram of the overall structure of the bonding platform;

[0012] Figure 2 Schematic diagram of the top view of the bonding platform;

[0013] Figure 3 It is a schematic diagram of the mobile platform in the three directions of X, Y and Z;

[0014] Figure 4 It is a schematic diagram of the connection between the heat source and the heat insulation board;

[0015] Figure 5 is a schematic diagram of the connection between the baffle plate and the chip holder;

[0016] Figure 6 Schematic diagram of the connection between the lower chip, heat source and heat insulation board;

[0017] Figure 7 Schematic diagram of the connection between the upper chip and the chip holder;

[0018] In the figure: 01, electric lifting platform in Z direction, 02, electric linear displacement slide in Y direction, 03, electric linear displacement slide in X direction, 04, voltage source, 05, displacement stage driver, 06, chip holder, 07, baffle plate, 08, observation light mirror, 09, support rod, 10, heat insulation board, 11, heat source, 12, lower chip, 13, upper chip. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limitations on the embodiments of the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0021] In the description of the embodiments of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0022] In the embodiments of the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0023] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiment of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0024] like Figure 1-7 As shown, the bonding platform includes a Z-direction electric lift 01, a Y-direction electric linear displacement slide 02, an X-direction electric linear displacement slide 03, a voltage source 04, a displacement stage driver 05, a chip holder 06, a baffle plate 07, an observation light mirror 08, a support rod 09, a heat insulation board 10 and a heat source 11. The Z-direction electric lift 01 is placed on the table. The Y-direction electric linear displacement slide 02 is installed on the Z-direction electric lift 01. The X-direction electric linear displacement slide 03 is installed on the Y-direction electric linear displacement slide 02. The heat insulation board 10 is placed on the X-direction electric linear displacement slide 03. The X-direction electric linear displacement slide 03 and the Y-direction electric linear displacement slide 02 are both micron-level electric linear displacement slides. The two micron-level electric linear displacement slides and the Z-direction electric lift 01 are each connected to the drive motor through a connecting line, and the three can also be adjusted manually. The translation stage driver 05 can modify various parameters of the two micron-level electric linear translation slides, the Z-direction electric lifting platform 01 and the driving motor, and control the movement of the two micron-level electric linear translation slides and the Z-direction electric lifting platform 01.

[0025] The heat source 11 is arranged on the heat insulation board 10. In an optional embodiment of the present invention, the heat insulation board 10 and the heat source 11 can be fixed with heat insulation tape or AB glue. The material needs to ensure that it will not fail under high temperature baking to prevent the heat insulation board 10 and the heat source 11 from being separated from the displacement stage during the heating process. This is not specifically limited in the embodiment of the present invention. As a specific example, the heat insulation tape is used as an example in the embodiment of the present invention.

[0026] The lower chip 12 is placed on the heat source 11. The Z-direction electric lifting platform 01, the Y-direction electric linear displacement slide 02, and the X-direction electric linear displacement slide 03 drive the lower chip 12 to move in three directions. The Z-direction electric lifting platform 01, the Y-direction electric linear displacement slide 02, and the X-direction electric linear displacement slide 03 are all electrically connected to the displacement stage driver 05.

[0027] The support rod 09 is fixedly mounted on the desktop, and the baffle plate 07 and the chip holder 06 are fixedly connected to the support frame 09. The baffle plate 07 and the chip holder 06 can be connected to the support frame 09 by welding. In an optional embodiment of the present invention, the above-mentioned fixed connection method can also be connected by a buckle and a card slot being connected to each other, or by a threaded connection. This embodiment of the present invention does not make specific restrictions. During the entire bonding process, the upper chip 12 is fixed by the chip holder 06 and keeps the position unchanged throughout the process. The baffle plate 07 mainly plays the role of blocking and applying pressure. The material of the baffle plate 07 can be selected from plastic, glass, metal, etc. These materials have high hardness and can remain intact under chip extrusion. There is no specific restriction in the embodiment of the present invention. As a specific example, a high-hardness and high-transparency acrylic plate is used as an example in the embodiment of the present invention. This material has good hardness and is transparent, and can be observed using an observation microscope 08 when pressure is applied.

[0028] The observation light mirror 08 is installed above the baffle plate 07. Since the position of the upper chip 12 does not change during the entire bonding process, the observation light mirror 08 can be used to observe whether the upper and lower chips are aligned during the process of adjusting the position of the lower chip.

[0029] The heat source 11 is electrically connected to the voltage source 04, and the voltage source 04 provides the required voltage and power to the heat source 11 so that the heat source reaches the bonding temperature. The heat insulation plate 10 is placed between the heat source 11 and the X-direction electric linear displacement slide 03 to prevent the temperature from affecting the accuracy of the three moving platforms. The heating source 11 can choose different materials to achieve temperature loading from room temperature to 1000°C. As a specific example, a ceramic sheet is used as an example in the embodiment of the present invention, and the material can achieve a temperature change from room temperature to 500°C under voltage control.

[0030] The specific working mode of this platform is to use the Y-direction electric linear displacement slide 02 and the X-direction electric linear displacement slide 03 to adjust the position of the lower chip 12 placed on the heat source 11. Observe through the observation microscope 08 and adjust until the upper and lower chips are aligned. Adjust the chip clamp 06 to a certain height of the support rod 09, and adjust the Z-direction electric lift 01 to raise the lower chip 13 until the upper and lower chips are attached. At this time, observe under the observation microscope 08, and adjust the Y-direction electric linear displacement slide 02 and the X-direction electric linear displacement slide 03 again to align the upper and lower chips. Loosen the chip clamp 06 to make the upper and lower chips completely attached, push the clamp of the chip clamp 06 aside, and adjust the Z-direction electric lift 01 again to raise the chip height until the baffle plate 07. Use the voltage source 04 to provide the required voltage and power to the heat source 11, so that the heat source 11 reaches the bonding temperature for a certain period of time, and the heat insulation board 10 is placed between the heat source 11 and the X-direction electric linear displacement slide 03 to prevent the temperature from affecting the accuracy of the three moving platforms below. During the heating process of the heat source 11, the Z-direction electric lift 01 is continuously raised and adjusted, and the upper and lower chips are sandwiched between the baffle plate 07 and the heat source 11. The Z-direction electric lift 01 applies pressure to the upper and lower chips. After a certain period of time, the power is disconnected, and the Z-direction electric lift 01 is adjusted to lower the chip height. At this time, the chip is bonded.

[0031] It should be noted that for different bonding methods, the power required for heating is different, and the time for heating and applying pressure is also different. The requirements of different bonding methods can be met by changing the materials of the heating source 11 and the baffle plate 07. For anodic bonding, the heating source 11 and the baffle plate 07 can be replaced with conductive materials. When the upper and lower chips are completely attached and the height rises to the baffle plate 07, there is no need to continuously raise and adjust the Z-direction electric lifting platform 01. Instead, the heating source 11 and the baffle plate 07 are powered on to achieve anodic bonding.

[0032] The above are only preferred specific implementation modes of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solutions and inventive concepts of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A manual bonding platform, characterized in that: The invention comprises a Z-direction electric lifting platform (01), a Y-direction electric linear displacement slide (02), an X-direction electric linear displacement slide (03), a voltage source (04), a displacement platform driver (05), a chip holder (06), a baffle plate (07), a support rod (09), a heat insulation plate (10) and a heat source (11); the Z-direction electric lifting platform (01) is placed on a table, the Y-direction electric linear displacement slide (02) is installed on the Z-direction electric lifting platform (01), and the X-direction electric linear displacement slide (03) is installed on the Y-direction The heat insulating plate (10) is placed on the electric linear displacement slide (02) in the X direction, the heat source (11) is arranged on the heat insulating plate (10), and the lower chip (12) is placed on the heat source (11); the support rod (09) is fixedly installed on the desktop, the baffle plate (07) is fixedly connected to the support rod (09), and the baffle plate (07) is located above the chip holder (06), the chip holder (06) clamps the upper chip (13), and the chip holder (06) is fixedly connected to the support rod (09); The Z-direction electric lifting platform (01), the Y-direction electric linear displacement slide (02), and the X-direction electric linear displacement slide (03) are all electrically connected to the displacement platform driver (05), and the heat source (11) is electrically connected to the voltage source (04); the Z-direction electric lifting platform (01), the Y-direction electric linear displacement slide (02), and the X-direction electric linear displacement slide (03) drive the lower chip (12) to realize movement in three directions.

2. A manual bonding platform according to claim 1, characterized in that: The bonding platform also includes an observation light mirror (08), which is installed above the baffle plate (07).

3. A manual bonding platform according to claim 1, characterized in that: The heat source (11) is bonded to the heat insulation board (10).

Images