Heat dissipation device, energy supply system and electric device

Abstract

This application relates to the field of heat exchange technology, specifically to a heat dissipation device, a power supply system, and an electrical device. The heat dissipation device includes an evaporation assembly, a liquid storage assembly, and a cooling assembly. The evaporation assembly includes an evaporator and a liquid wick. The inner cavity of the liquid wick contains a liquid heat dissipation medium, which undergoes a phase change within the wick to transform into a gaseous heat dissipation medium. The liquid storage assembly is connected to the inner cavity of the liquid wick and stores and transports the liquid heat dissipation medium to the wick. The cooling assembly is connected to the evaporator and the liquid storage assembly via delivery pipes and cools the gaseous heat dissipation medium to form a liquid heat dissipation medium. In this embodiment, by connecting the evaporator and the cooling assembly via delivery pipes, condensate generated during heat exchange can be avoided from affecting heat sources such as batteries. Furthermore, by using a phase-changeable heat dissipation medium in conjunction with the evaporation assembly, efficient heat dissipation can be achieved.

Description

Technical Field

[0001] This application relates to the field of heat exchange technology, and in particular to a heat dissipation device, a power supply system, and an electrical device. Background Technology

[0002] The temperature of a battery directly affects its capacity and lifespan. Excessive temperature can also cause thermal runaway, which can lead to battery fire or explosion.

[0003] Current technologies typically employ air cooling or liquid cooling to dissipate heat from batteries. Traditional air cooling is limited by the low thermal conductivity of air, resulting in limited heat dissipation performance. Furthermore, the increasingly common direct-blowing air conditioning system inevitably introduces dew point issues, which can corrode batteries and increase the risk of short circuits. Liquid cooling offers improved heat dissipation compared to air cooling, but it requires additional humidity control to prevent condensation that could lead to battery corrosion and short circuits. Moreover, its reliance on a water pump reduces system reliability and makes it unsuitable for higher charge / discharge rates.

[0004] Therefore, it is necessary to address the aforementioned issues in order to change the current situation. Summary of the Invention

[0005] This application provides a heat dissipation device, a power supply system, and an electrical device to solve the problems of poor heat dissipation and low safety performance of batteries in the prior art.

[0006] The first aspect of this application provides a heat dissipation device, comprising:

[0007] An evaporation assembly includes an evaporator and a liquid wick, wherein the liquid wick is disposed within the evaporator; the inner cavity of the liquid wick is used to contain a liquid heat dissipation medium, and the liquid heat dissipation medium undergoes a phase change within the liquid wick to be converted into a gaseous heat dissipation medium;

[0008] A liquid storage assembly, connected to the inner cavity of the liquid-absorbing core, is used to store the liquid heat dissipation medium and transport it to the liquid-absorbing core; and

[0009] A cooling component is connected to the evaporator and the liquid storage component via delivery pipes. The cooling component is used to cool the gaseous heat dissipation medium to form the liquid heat dissipation medium.

[0010] In one possible implementation, the pore size of the absorbent core near the outer layer is smaller than the pore size of the absorbent core near the inner cavity; and / or the thermal conductivity of the absorbent core near the outer layer is greater than the thermal conductivity of the absorbent core near the inner cavity.

[0011] In one possible implementation, the liquid absorbent core includes a first liquid absorbent core and a second liquid absorbent core, the first liquid absorbent core being located outside the second liquid absorbent core, and the inner cavity of the second liquid absorbent core being used to contain the liquid heat dissipation medium.

[0012] Wherein, the pore size of the first absorbent core is smaller than that of the second absorbent core; and / or the thermal conductivity of the first absorbent core is greater than that of the second absorbent core.

[0013] In one possible implementation, the evaporation assembly further includes a heat-conducting element disposed between the liquid-absorbing core and the inner wall of the evaporator to form a heat-conducting channel, the heat-conducting channel being connected to the cooling assembly and used to transport the gaseous heat dissipation medium.

[0014] In one possible implementation, the inner cavity of the liquid-absorbing core extends along a first direction, and the heat-conducting channel extends along a second direction, with the first direction and the second direction forming an angle.

[0015] In one possible implementation, the number of heat-conducting channels is multiple, and the multiple heat-conducting channels are arranged in parallel or staggered.

[0016] In one possible implementation, the number of heat-conducting elements is multiple.

[0017] In one possible implementation, the heat-conducting element is integrally formed with the evaporator; and / or the heat-conducting element is integrally formed with the liquid-absorbing core.

[0018] In one possible implementation, the evaporation assembly further includes a first sensor connected to the evaporator and used to acquire a temperature signal inside the evaporator.

[0019] In one possible implementation, the liquid storage assembly includes a liquid storage element and a temperature control element. The liquid storage element is connected to a liquid conduit between the inner cavity of the liquid-absorbing core and the cooling assembly, and the liquid storage element is used to store the liquid heat dissipation medium. The temperature control element is connected to the liquid storage element and is used to regulate the temperature of the liquid heat dissipation medium.

[0020] In one possible implementation, the liquid storage assembly further includes a pressure relief valve located on the liquid conduit between the liquid storage component and the cooling assembly.

[0021] In one possible implementation, the liquid storage assembly further includes a second sensor connected to the liquid storage element, the second sensor being used to acquire temperature and / or pressure signals within the liquid storage element.

[0022] In one possible implementation, the cooling assembly includes a heat sink connected to both the evaporator and the liquid storage assembly, and the heat sink is used to cool the gaseous heat dissipation medium output from the evaporator to condense it into the liquid heat dissipation medium.

[0023] In one possible implementation, the cooling assembly further includes a subcooler disposed in a liquid conduit between the evaporator and the liquid storage assembly, and the subcooler is used to cool the liquid heat dissipation medium in the liquid conduit.

[0024] A second aspect of this application provides an energy supply system, comprising:

[0025] Batteries; and

[0026] As described in any of the above-mentioned heat dissipation devices, the evaporator of the heat dissipation device is in contact with the battery, the cooling component is spaced apart from the battery, and the heat dissipation device is used to cool the battery.

[0027] A third aspect of this application provides an electrical device, including an energy supply system as described in any of the preceding claims, or a heat dissipation device as described in any of the preceding claims, wherein the heat dissipation device is used to cool the heat source in the electrical device or the energy supply system.

[0028] Implementing the embodiments of this application has the following beneficial effects:

[0029] When using the heat dissipation device of this embodiment, the evaporator is first brought into contact with the heat source. Since the cooling component is connected to the evaporator through a delivery pipe, the cooling component and the heat source can be spaced apart. After the liquid heat dissipation medium in the liquid storage component is delivered to the inner cavity of the liquid absorbing core, the liquid absorbing core can absorb the liquid heat dissipation medium. The evaporator absorbs external heat and conducts it to the liquid absorbing core. As a result, the liquid heat dissipation medium in the liquid absorbing core can undergo a phase change and form a gaseous heat dissipation medium to realize the heat absorption function of the heat dissipation device. After the gaseous heat dissipation medium is output from the evaporator, it is cooled and condensed by the cooling component to reform the liquid heat dissipation medium. The liquid heat dissipation medium is then delivered back to the liquid storage component.

[0030] In the heat dissipation device of this embodiment, by setting up a delivery pipe to connect the evaporator and the cooling component, it is possible to avoid the condensate generated during the heat exchange process from affecting heat sources such as batteries. Furthermore, by using a phase-change heat dissipation medium in conjunction with the evaporation component, efficient heat dissipation can be achieved. In addition, compared to traditional heat dissipation solutions such as air cooling and liquid cooling, the heat dissipation device of this embodiment can achieve self-circulating heat dissipation without external power after forming a thermal cycle, thus improving reliability. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 A schematic diagram of the heat dissipation device in an embodiment of the present invention is shown;

[0033] Figure 2 A cross-sectional schematic diagram of the evaporation assembly in an embodiment of the present invention is shown;

[0034] Figure 3 It shows Figure 2 A sectional view along line AA.

[0035] Figure 4 It shows Figure 2 Sectional view along line BB;

[0036] Figure 5 A cross-sectional schematic diagram of an evaporation assembly according to another embodiment of the present invention is shown;

[0037] Figure label:

[0038] 10-Heat dissipation device;

[0039] 100 - Evaporation assembly; 110 - Evaporator; 111 - Steam chamber; 112 - Liquid pipe; 113 - Gas pipe; 121 - First liquid suction core; 122 - Second liquid suction core; 130 - Heat-conducting component; 131 - Heat-conducting channel; 140 - First sensor;

[0040] 200-Liquid storage assembly; 210-Liquid storage element; 220-Temperature control element; 230-Pressure relief valve; 240-Second sensor; 300-Cooling assembly; 310-Heat dissipation element; 320-Subcooler. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0042] With the development of electric vehicles and large-scale energy storage systems, the charging and discharging capabilities of power and energy storage batteries are increasing, especially with high-rate charging and discharging currents reaching hundreds of amperes, resulting in significant thermal effects during battery operation. Battery temperature directly affects its capacity and lifespan; excessively high temperatures can also trigger thermal runaway, leading to battery fires or explosions.

[0043] To address battery heat dissipation, current technologies typically employ air cooling and liquid cooling. Air cooling relies on airflow to remove heat, but due to air's relatively low thermal conductivity, this passive cooling method often proves insufficient for high-power batteries. Furthermore, while direct air conditioning cooling by introducing phase-change media into the battery pack can effectively improve heat dissipation, it inevitably introduces dew point issues. In high-humidity environments, moisture condenses inside the battery pack, increasing the risk of corrosion, further exacerbating short-circuit hazards, and placing high demands on the battery pack's sealing performance, ultimately impacting battery safety and reliability.

[0044] Liquid cooling offers improved heat dissipation performance compared to air cooling. In liquid cooling, the fluid primarily exchanges heat with the air conditioner under the drive of a pump, gaining cooling capacity before entering pipes arranged on the battery pack to remove heat. However, this method suffers from limited pipe coverage across the entire battery pack, resulting in a limited heat transfer area and heavy reliance on the performance of the liquid pump and other driving devices. Furthermore, introducing cooling into the battery pack leads to condensation, which can cause corrosion and short circuits. Therefore, strict dew point control necessitates the introduction of dehumidifiers and other related devices, reducing the overall reliability of the cooling system and increasing manufacturing costs.

[0045] For this purpose, please refer to Figures 1 to 5 As shown, this embodiment of the invention provides a heat dissipation device 10, which includes an evaporation assembly 100, a liquid storage assembly 200, and a cooling assembly 300. The evaporation assembly 100 includes an evaporator 110 and a liquid absorption core, with the liquid absorption core disposed within the evaporator 110. The inner cavity of the liquid absorption core is used to contain a liquid heat dissipation medium, and the liquid heat dissipation medium undergoes a phase change within the liquid absorption core to transform into a gaseous heat dissipation medium. The liquid storage assembly 200 is connected to the inner cavity of the liquid absorption core and is used to store the liquid heat dissipation medium and transport it to the liquid absorption core. The cooling assembly 300 is connected to the evaporator 110 and the liquid storage assembly 200 respectively through a transport pipe and is used to cool the gaseous heat dissipation medium to form a liquid heat dissipation medium.

[0046] When using the heat dissipation device 10 of this embodiment, the evaporator 110 is first brought into contact with the heat source. Since the cooling component 300 is connected to the evaporator 110 through a conveying pipe, the cooling component 300 and the heat source can be spaced apart. After the liquid heat dissipation medium in the liquid storage component 200 is conveyed to the inner cavity of the liquid suction core, the liquid suction core can absorb the liquid heat dissipation medium. The evaporator 110 absorbs external heat and conducts it to the liquid suction core. As a result, the liquid heat dissipation medium in the liquid suction core can undergo a phase change and form a gaseous heat dissipation medium to realize the heat absorption function of the heat dissipation device 10. After the gaseous heat dissipation medium is output from the evaporator 110, it is cooled and condensed by the cooling component 300 to reform the liquid heat dissipation medium. The liquid heat dissipation medium is then conveyed back to the liquid storage component 200, thereby forming a stable thermodynamic cycle.

[0047] In the heat dissipation device 10 of this embodiment, by providing a delivery pipe connecting the evaporator 110 and the cooling component 300, the generation of condensate during the heat exchange process can be prevented from affecting heat sources such as batteries. Furthermore, by employing a phase-change heat dissipation medium in conjunction with the evaporator component 100, efficient heat dissipation can be achieved. In addition, compared to traditional heat dissipation solutions such as air cooling and liquid cooling, the heat dissipation device 10 of this embodiment can achieve self-circulating heat dissipation without external power after forming a thermal cycle, thus improving reliability.

[0048] By separating the evaporator 110 and the cooling component 300 and connecting them respectively via liquid pipe 112 and gas pipe 113, the heat dissipation device 10 can transfer heat away from heat sources such as battery packs instead of releasing cooling energy at them. When the heat dissipation device 10 is connected to multiple heat sources, the cooling components 300 in multiple heat dissipation devices 10 can be concentrated to dissipate heat only, thereby improving the heat dissipation effect and reducing the overall application cost of the equipment. At the same time, since the cooling component 300 is far away from the heat source, there is no need to worry about dew point issues with the heat dissipation device 10 in this embodiment. The heat dissipation device 10 also does not rely on additional pumps or dehumidifiers, and its reliability is not affected by external devices. It can actively control the temperature of heat sources such as battery packs to maintain a constant temperature. The gas-liquid dual-channel design in the evaporator 110 can effectively improve temperature uniformity and has higher reliability, heat transfer capacity, and thermal buffering capacity.

[0049] Furthermore, in situations where thermal runaway occurs at the heat source, the heat dissipation device 10 of this embodiment, due to its use of a phase change medium for heat exchange, has a higher latent heat capacity compared to traditional air-cooling and liquid-cooling solutions. Therefore, this heat dissipation device 10 can effectively buffer short-term, massive heat release, thereby reducing the risk of thermal runaway from the heat source.

[0050] Specifically, see Figure 1As shown, the operating principle of the heat dissipation device 10 in this embodiment is as follows: According to the temperature conditions required by heat sources such as battery packs, the liquid storage component 200 is heated or cooled to set corresponding temperature and pressure values. At this time, the heat dissipation medium in the liquid storage component 200 is in a saturated state of gas and liquid two phases. After the evaporator 110 shell, which is in contact with or attached to the heat source, absorbs the heat from the heat source, it transfers the heat to the heat conduction component 130. When the heat reaches the phase change temperature of the liquid evaporation of the liquid core, the liquid heat dissipation medium in the inner cavity of the liquid core can form a gaseous heat dissipation medium at the interface between the liquid core and the heat conduction channel 131. At this time, a meniscus is formed at the interface between the gaseous heat dissipation medium and the liquid heat dissipation medium. Under the suction effect of the meniscus, the heat dissipation medium can be transported from the liquid heat dissipation medium to the gaseous heat dissipation medium, and the liquid heat dissipation medium in the inner cavity of the liquid core is drawn into the liquid core to ensure the continuous supply of heat dissipation medium. As the heat supplied by the evaporator 110 to the wick increases, the liquid heat dissipation medium in the inner cavity of the wick begins to evaporate, causing the gaseous heat dissipation medium to form saturated vapor. This saturated vapor gradually becomes superheated vapor during heat exchange with the heat-conducting element 130. This process increases the thermal energy of the heat dissipation medium. The superheated vapor in the heat-conducting channel 131 flows to the cooling assembly 300 through the gas pipe 113. At the cooling assembly 300, the vapor-type gaseous heat dissipation medium is cooled and undergoes a phase change, condensing into a liquid heat dissipation medium and achieving a certain degree of subcooling to accommodate the circulation of the heat dissipation medium. The condensed liquid heat dissipation medium then re-enters the storage assembly 200. Within the storage assembly 200, due to the temperature difference between the inside and outside, the storage assembly 200 can absorb some of the heat leakage from the evaporator 110, maintaining the heat dissipation medium in a saturated two-phase state. With this configuration, the heat dissipation device 10 can automatically form a thermal cycle and achieve heat exchange during the circulation of the heat dissipation medium.

[0051] It should be noted that in the heat dissipation device 10 of this embodiment, the meniscus (or capillary meniscus) is formed within the capillary structure at the liquid-gas interface, typically appearing in the wick or capillary channels of the evaporator 110. In the evaporator 110, after the liquid heat dissipation medium absorbs heat from the heat source, it begins to evaporate and transform into vapor. The formation of vapor causes a meniscus to form on the liquid surface. In the structural design of the wick, it typically has tiny capillary channels or pores inside. These capillary channels provide a path for the liquid to flow. When the liquid evaporates and forms vapor, the capillary action in the capillary structure causes the liquid to move upward, forming a meniscus while transforming into vapor. In addition, in the meniscus, the surface tension of the liquid causes the liquid surface to form a concave shape towards the vapor. That is, if viewed from the side, the meniscus is a concave curve, with the liquid at the center (bottom) and the gas at the outside (top). Due to the surface tension between the liquid and the gas, a stable meniscus is formed at the interface between the vapor (gas phase) and the liquid (liquid phase). This shape is spontaneously formed by the liquid to minimize surface energy. In the evaporation assembly 100, the formation of the meniscus is crucial for capillary action, which effectively drives the reflux and circulation of the liquid, ensuring that heat is efficiently transferred from the evaporation assembly 100 to the cooling assembly 300, thus achieving efficient heat dissipation of the system.

[0052] Specifically, the heat dissipation medium of the heat dissipation device 10 is selected based on the operating temperature of the heat source it is used in. The heat dissipation medium includes, but is not limited to, water, a mixture of ethylene glycol and water, methanol, and liquid ammonia. Due to its high heat capacity and high thermal conductivity, water is generally suitable for heat dissipation devices 10 operating at temperatures of 60°C and above. Ethylene glycol, with a temperature range of -30°C to 120°C, is widely used in automotive and industrial cooling systems in the prior art. Methanol is suitable for low-temperature heat dissipation systems, especially for ambient temperatures between -10°C and 80°C. Furthermore, the use of methanol effectively avoids corrosion problems caused by moisture. Liquid ammonia is typically used in low-temperature refrigeration systems, with an applicable temperature range of -30°C to 30°C. Of course, in some embodiments, other materials can be used as the heat dissipation medium, depending on the application environment of the heat dissipation device 10, and will not be elaborated here. The heat dissipation medium and the pipe wall material should be compatible, and the operating temperature range of the heat dissipation medium should be selected within a range with a large slope on the saturation pressure-to-saturation temperature curve to ensure good start-up performance of the heat dissipation device. In addition, the pressure variation of the heat dissipation medium must be within the limits of the material.

[0053] Further, see Figure 2 As shown, the aperture of the liquid-absorbing core near the heat-conducting channel 131 is smaller than the aperture of the inner cavity near the liquid-absorbing core; and / or the thermal conductivity of the side of the liquid-absorbing core near the heat-conducting channel 131 is greater than the thermal conductivity of the side of the liquid-absorbing core near the inner cavity.

[0054] In this embodiment, heat enters the evaporator 110 from its outer surface and is transferred to the wick via the heat-conducting element 130. The vapor-type gaseous heat dissipation medium generated after the phase change of the liquid heat dissipation medium in the inner cavity of the wick enters the heat-conducting channel 131 and is finally output to the cooling assembly 300 through the gas pipe 113. The overall structure of the wick has different effective pore sizes and / or thermal conductivity. The wick closer to the heat source has a smaller effective pore size and / or higher thermal conductivity to ensure sufficient capillary pressure and heating capacity; while the portion closer to the inner cavity of the wick has a larger effective pore size and / or lower thermal conductivity, thereby reducing liquid permeation resistance and minimizing reverse heat leakage. Furthermore, while the inner layer uses a larger pore size to reduce liquid resistance, the inner liquid layer effectively prevents gas from entering the inner cavity of the wick, while the outer wick ensures capillary performance.

[0055] It's important to note that the lower the thermal conductivity of a material, the stronger its ability to impede heat conduction. This means that heat conduction is slower when passing through such a material, reducing the likelihood of heat flowing backward and preventing heat loss and boiling of the liquid in the supply layer, which could lead to circulation cessation. Larger pore sizes and higher permeability effectively improve the fluidity of the liquid within the material, promoting uniform liquid distribution and rapid absorption and dissipation of external heat. This effectively reduces pressure drop loss during liquid flow and significantly improves the overall heat transfer limit of the heat dissipation device.

[0056] Specifically, in this embodiment, the meniscus is typically formed at the interface between the first wick 121 and the heat-conducting channel 131. For the first wick 121, which is close to the heat source, a small effective pore size and high thermal conductivity are required; copper can be chosen as the material. Copper has excellent thermal conductivity (approximately 398 W / m·K) and can achieve good capillary action even with a small pore size. Another optional material is aluminum alloy, such as 6061 or 7075, which has good thermal conductivity (approximately 150 W / m·K), is relatively lightweight, and has a lower cost, making it suitable for applications with moderate heat conduction requirements. Graphite, especially thermally conductive graphite, can also be used for the wick, as it can be customized to achieve small holes and specific pore structures to meet the needs of efficient heat dissipation.

[0057] For the second wick 122 located near the inner cavity of the wick, this part should be made of a material with a large effective pore size, high permeability, and low thermal conductivity. Aluminum oxides (such as bauxite and aluminum nitrides) are a good choice, as their larger effective pore size helps reduce the liquid's permeation resistance, making them suitable for the supply layer. Although aluminum oxides have relatively low thermal conductivity, specific components can be selected to adjust their thermal conductivity as needed. In addition, certain polymer-based composite materials are also suitable; these materials can be designed with appropriate pore sizes and provide excellent permeability, while their thermal conductivity can be enhanced by filling them with thermally conductive materials (such as thermally conductive silicates). Porous ceramic materials, such as alumina (Al2O3) or silicon nitride (Si3N4), have large porosity, which reduces the liquid's permeation resistance, while also possessing certain high-temperature resistance and mechanical strength, making them suitable for use as supply layer materials. The specific selection of the wick should be based on the heat dissipation medium, ensuring compatibility and good wettability.

[0058] In one embodiment, the inner cavity of the liquid-absorbing core extends along a first direction, and the heat-conducting channel 131 extends along a second direction, with the first direction and the second direction forming an angle.

[0059] See Figures 2 to 4 As shown, the first direction can be the X direction in the diagram, and the second direction can be the Y direction in the diagram. Also refer to... Figure 4 As shown, the Y direction indicates the direction perpendicular to the plane of the figure and outwards; specifically, the first direction and the second direction can be perpendicular to each other. The vertical arrangement of the heat conduction channel 131 and the inner cavity of the liquid wick can help improve the smoothness of the transport of liquid heat dissipation medium and gaseous heat dissipation medium, and at the same time effectively prevent the liquid wick from drying out locally, ensuring that the heat dissipation medium can be evenly distributed in the entire evaporator 110, and achieving a stable and efficient heat dissipation function.

[0060] Specifically, the vertically arranged heat-conducting channels 131 and the inner cavity of the liquid-absorbing core help to form good convection in different temperature ranges. This reduces local isolation of the liquid and avoids uneven liquid evaporation or reflux caused by temperature differences. At the same time, the dual-channel design can significantly shorten the flow distance between the liquid and gaseous heat dissipation media, thereby improving the temperature uniformity inside the evaporator 110 and ultimately improving heat dissipation efficiency.

[0061] Furthermore, there are multiple heat conduction channels 131, which are arranged in parallel or staggered manner.

[0062] In this embodiment, a steam chamber 111 may also be provided inside the evaporator 110. The steam chamber 111 provides a concentrated convergence area for the heat-conducting channels 131, allowing one end of multiple heat-conducting channels 131 to be simultaneously connected to the steam chamber 111, and connected to the cooling component 300 through the steam chamber 111 and the gas pipe 113. This arrangement not only helps to improve the flow efficiency of the heat dissipation medium, but also ensures uniform pressure inside the multiple heat-conducting channels 131, promoting rapid heat exchange. Specifically, there may be two steam chambers 111, with each steam chamber 111 connected to opposite ends of the heat-conducting channels 131. In some embodiments, by employing parallel or staggered arrangements, the multiple heat-conducting channels 131 can effectively increase the contact area between the liquid heat dissipation medium and the gaseous heat dissipation medium, thereby improving the efficiency of phase change.

[0063] Specifically, see Figure 1 As shown, the two opposite ends of the inner cavity of the liquid-absorbing core can be connected to the liquid storage component 200 through at least two liquid pipes 112 to improve the uniformity and efficiency of the liquid heat dissipation medium entering the liquid-absorbing core; of course, the heat conduction channel 131 can also be connected to the cooling component 300 through at least two gas pipes 113 to improve the uniformity of the gaseous heat dissipation medium in the evaporator 110 and improve the transport efficiency of the gaseous heat dissipation medium.

[0064] Furthermore, the evaporation assembly 100 also includes a first sensor 140, which is connected to the evaporator 110 and used to acquire the temperature signal inside the evaporator 110.

[0065] Specifically, the first sensor 140 can be a temperature detection device such as a thermocouple, thermistor, or infrared sensor to ensure high-precision and real-time temperature monitoring. In this heat dissipation device 10, the temperature at the evaporator 110 is usually relatively high, so monitoring the temperature signal of the evaporator 110 is particularly important. The sensing position of the first sensor 140 in the evaporator 110 is preferentially set at the temperature of the meniscus, which is the liquid-vapor interface formed between the first liquid-absorbing core 121 and the heat-conducting channel 131. By detecting the temperature of the meniscus interface, precise control of the heat dissipation device 10 can be achieved.

[0066] In this embodiment, the heat dissipation device 10 further includes a control module, which is signal-connected to the first sensor 140, the liquid storage component 200, and the cooling component 300. The control module can acquire the temperature of the first sensor 140 and control the liquid storage component 200 and the cooling component 300 according to a preset program, thereby realizing the automatic feedback control function of the heat dissipation device 10 to improve its heat dissipation performance. Specifically, the control module can be, but is not limited to, various programmable logic controllers (PLCs), STM32 microcontrollers (32-bit microcontrollers with ARM Cortex-M cores), microcontrollers, field programmable gate arrays (FPGAs), ARM processors, etc.

[0067] Specifically, the liquid storage assembly 200 includes a liquid storage element 210 and a temperature control element 220. The liquid storage element 210 can be a closed container used to store liquid heat dissipation medium. The liquid storage element 210 is connected in the liquid pipe 112 between the inner cavity of the absorbing core and the cooling assembly 300. The liquid storage element 210 ensures the effective storage of the liquid heat dissipation medium within the system, avoiding temperature fluctuations caused by the flow of the working fluid, thereby improving the stability and reliability of the heat dissipation process. It also transports the heat dissipation medium to the inner cavity of the absorbing core through the pipeline. The liquid storage element 210 can be designed with an appropriate volume to accommodate sufficient liquid heat dissipation medium and meet the temperature regulation requirements of the system under high load. In this embodiment, the temperature control element 220, through its connection with the liquid storage element 210, can adjust the temperature of the liquid heat dissipation medium within the liquid storage element 210 in real time and regulate its temperature according to a preset temperature control strategy. The temperature control element 220 can be a semiconductor cooling chip, a heating wire, or other energy regulation element. In some embodiments, in order to ensure the stable establishment of thermal circulation in the heat dissipation device 10, heat insulation components can be installed on the liquid storage component 200 and the pipelines connecting the components to achieve heat insulation protection for the liquid storage component 200 and the pipelines connecting the components.

[0068] See Figure 1 As shown, in some embodiments, the cooling component 300 is first connected to the inner cavity of the liquid-absorbing core through the liquid pipe 112, at which time the liquid storage component 210 is connected to the liquid pipe 112 through a branch pipe. With this configuration, the liquid storage component 210 is arranged outside the loop of the liquid pipe 112 and connected through a branch, allowing for precise temperature control of the heat dissipation device 10 based on the amount of liquid filling. It also provides a larger buffer space and latent heat reserve, improving the adaptability of the heat dissipation device 10 to various operating conditions.

[0069] In another embodiment, the liquid storage element 210 can also be disposed in the loop of the liquid pipeline 112, that is, the liquid storage element 210 is connected to the inner cavity of the liquid suction core and the cooling component 300 through the liquid pipeline 112. With this arrangement, the temperature of the heat dissipation device 10 can be precisely controlled based on the amount of liquid filling the heat dissipation device 10, while providing a larger buffer space, improving the adaptability of the heat dissipation device 10 to various operating conditions, and allowing for faster adjustment to load changes and better system robustness.

[0070] Furthermore, the liquid storage assembly 200 also includes a pressure relief valve 230, which is located on the liquid pipeline 112 between the liquid storage component 210 and the cooling assembly 300, aiming to ensure the safety and stability of the entire circulation system. When the system faces abnormal conditions, such as thermal runaway of the heat source, the liquid heat dissipation medium in the evaporator 110 will vaporize violently, generating a large amount of steam, which will cause a rapid increase in the internal pressure of the system.

[0071] By installing a pressure relief valve 230 on the liquid pipeline 112, the valve will automatically open when the pressure reaches a preset threshold, releasing excess steam to effectively regulate the pressure. This process not only reduces the internal pressure of the heat dissipation device 10, effectively mitigating the risk of thermal runaway, but also prevents equipment damage or structural failure due to excessive pressure, thereby improving the overall safety of the heat dissipation device 10.

[0072] Specifically, the pressure relief valve 230 can adopt a spring-loaded or diaphragm-type structure, combining structural and material characteristics to ensure long-term stable operation. When opened, the valve should have the ability to quickly release steam to avoid delays in discharge time that could affect the safety of surrounding equipment. Under normal operating conditions, the pressure relief valve 230 will remain closed to prevent unnecessary loss of working fluid, while also reacting quickly in extreme situations to ensure the proper operation of the system.

[0073] Furthermore, the control system of the pressure relief valve 230 can be connected to the control module to provide real-time pressure monitoring and feedback. The pressure status within the liquid reservoir 210 is continuously monitored by sensors, providing timely alarms or response measures for different operating conditions. When an abnormal pressure is detected, the control module can activate other parts of the liquid reservoir assembly 200 (such as the temperature control device 220) to enhance the protection measures of the heat dissipation device 10.

[0074] Furthermore, the liquid storage assembly 200 also includes a second sensor 240, which is connected to the liquid storage component 210 and used to monitor the temperature and / or pressure signals within the liquid storage component 210 in real time. This embodiment, by effectively cooperating the second sensor 240 with the liquid storage component 210, can acquire relevant data on the heat dissipation medium in a timely manner, providing effective data support for the automatic control of the heat dissipation device 10.

[0075] Specifically, the second sensor 240 can be a thermocouple, thermistor, or other type of sensor to achieve efficient and accurate monitoring of the temperature inside the liquid storage container 210. Regarding pressure monitoring, the second sensor 240 can also be configured as a pressure sensor to collect pressure data within the liquid storage container 210.

[0076] Based on the temperature and pressure signals provided by the second sensor 240, the control module can execute precise adjustment measures. In the specific implementation process, the temperature control unit 220 can adopt a PID (proportional-integral-derivative) control algorithm, combined with a feedback mechanism, to adjust the temperature control strategy in real time, thereby ensuring that the working fluid temperature in the liquid storage unit 210 remains stable within the preset range.

[0077] Specifically, the control module compares the monitored temperature signal with the set temperature threshold. When the phase change temperature in the evaporator 110 is found to be higher than the set value, the temperature control unit 220 immediately cools the liquid storage unit 210, using the cooling component 300 to lower the temperature inside the liquid storage unit 210. Since the liquid storage unit 210 is in a saturated two-phase state, its internal pressure decreases accordingly, causing the liquid in the heat sink 310 to flow back into the liquid storage unit 210, increasing the heat dissipation area inside the heat sink 310, thereby enhancing heat transfer and reducing the overall system pressure, thus lowering the phase change temperature in the evaporator 110. Conversely, when the temperature is lower than the set value, the temperature control unit 220 uses heating measures, such as activating an electric heater. The pressure inside the liquid storage unit 210 rises, liquid enters the heat sink 310, blocking part of the heat dissipation area, and the system pressure rises, causing the phase change temperature in the evaporator 110 to rise accordingly. Through this method, precise control of the evaporator 110 temperature can be achieved, thereby controlling the temperature of the heat sink body.

[0078] Specifically, the cooling component 300 includes a heat sink 310, which is connected to the heat conduction channel 131 and the liquid storage component 200 respectively. The heat sink 310 is used to cool the gaseous heat dissipation medium output by the evaporator 110 to condense it into a liquid heat dissipation medium.

[0079] In this embodiment, by connecting the heat sink 310 to the gas pipe 113, the heat sink 310 can effectively exchange heat with the gaseous heat dissipation medium in the gas pipe 113, and can cause the vapor-type gaseous heat dissipation medium to condense rapidly into a liquid heat dissipation medium.

[0080] Specifically, the heat sink 310 can employ heat dissipation fins. The arrangement of the fins not only increases the heat dissipation area but also promotes airflow, thereby enhancing the heat dissipation effect under natural or forced convection conditions. The heat sink 310 can also be connected to an external air conditioner to achieve its cooling effect. The heat generated during this process is rapidly dissipated primarily through conduction and convection. The subcooling treatment scheme of the heat sink 310 ensures that the condensed liquid working fluid is in a good reflux state, preventing stagnation or vaporization. Good thermal coupling between the heat sink 310 and the evaporator 110 is crucial for ensuring smooth thermal circulation. The efficient cooling capacity of the heat sink 310 enables continuous circulation of the working fluid, providing a stable thermal management scheme for the entire system, thus ensuring the reliability and safety of the equipment under different operating environments. It should be noted that, to ensure the normal circulation of the heat dissipation device 10, in a preferred embodiment, the design load of the heat sink 310 is preferably such that all the steam generated by the evaporator 110 can be completely condensed under a preset working load, and a preset subcooling degree is achieved at the outlet of the heat sink 310.

[0081] In one embodiment, the cooling assembly 300 further includes a subcooler 320, which is disposed in the liquid pipe 112 between the evaporator 110 and the liquid storage assembly 200, and is used to cool the liquid heat dissipation medium in the liquid pipe 112.

[0082] In this embodiment, the condensed liquid heat dissipation medium, during its passage through the subcooler 320, actively or passively transfers its internal heat to the surrounding environment, thereby further subcooling the liquid heat dissipation medium. This effectively counteracts reverse heat leakage from the evaporator 110, preventing system shutdown caused by liquid boiling in the supply layer. The subsequently subcooled liquid heat dissipation medium then enters the inner cavity of the wick along the liquid pipe 112, where it is converted into a saturated liquid and supplied to the meniscus again through the wick, completing the circulation process.

[0083] It is particularly important to note that a shortened penetration distance may lead to a potential increase in heat leakage risk. Therefore, this embodiment addresses the potential instability issues arising from the saturated liquid in the reservoir 210 by configuring a subcooler 320 in conjunction with the liquid pipe 112. Specifically, the subcooler 320 can utilize high-efficiency heat dissipation materials and technologies such as heat sink fins and semiconductor cooling chips to ensure sufficient subcooling of the liquid heat dissipation medium exiting the heat sink 310. This subcooling is to prevent the liquid heat dissipation medium in the inner cavity of the wick from generating bubbles due to reverse heat leakage, which could cause the wick to detach, thereby affecting the normal operation and cooling effect of the system.

[0084] In actual operation, once the system reaches the predetermined working state, the entire circulation system will maintain self-operation. The liquid will not flow backward in the system. The main heat loss will be the reverse conduction of heat from the evaporator. By setting up the subcooler 320, the normal operation of the heat dissipation device 10 can be ensured. Of course, when starting the heat dissipation device 10, the subcooler 320 can act as the starter of the heat dissipation device 10 to ensure the normal operation of the heat dissipation device 10. When the heat in the heat dissipation device 10 is balanced, the heat dissipation device 10 can operate on its own. At this time, the subcooler 320 can reduce its power only to offset the reverse heat leakage of the evaporator 110.

[0085] Specifically, the number of heat-conducting components 130 is at least one; see reference. Figure 2 As shown, the heat-conducting component 130 is integrally formed with the evaporator 110.

[0086] In this embodiment, by providing a heat-conducting element 130 on the inner wall of the evaporator 110, the inner wall of the evaporator 110 can be spaced apart from the liquid-absorbing core. A plurality of spaced heat-conducting channels 131 are formed between the inner wall of the evaporator 110 and the liquid-absorbing core by means of the heat-conducting element 130. The heat-conducting element 130 can also improve the strength of the evaporator 110. Specifically, the heat-conducting channels 131 can be formed by machining the heat-conducting elements 130 on the inner wall of the evaporator 110 by means of cutting, for example.

[0087] See Figure 5 As shown, in another embodiment, the heat-conducting element 130 is integrally formed with the liquid-absorbing core.

[0088] In this embodiment, a heat-conducting channel 131 can be formed on the first liquid-absorbing core 121, and a heat-conducting element 130 is formed through the heat-conducting channel 131 on the first liquid-absorbing core 121. This configuration can further increase the heat exchange surface area of ​​the liquid-absorbing core, improve the phase change rate, and significantly improve the start-up and working performance of the evaporation assembly 100.

[0089] In some embodiments, the liquid conduit 112 may be formed by a combination of a main liquid conduit and multiple branch liquid conduits. The main liquid conduit is connected to the liquid storage assembly 200, and the multiple branch liquid conduits are respectively connected to the evaporator 110. Furthermore, the multiple branch liquid conduits may be spaced apart along the extension direction of the wick (e.g., ...). Figure 3 (as shown in the Y direction), which can improve the uniformity of the liquid heat dissipation medium entering the wick, thereby improving the heat exchange performance of the heat dissipation device 10.

[0090] Of course, in some embodiments, the gas pipeline 113 can also be formed by a combination of a main gas pipeline and multiple gas pipeline branches. The main gas pipeline is connected to the cooling component 300, and the multiple gas pipeline branches are respectively connected to the steam chamber 111 or the heat conduction channel 131. Similar to the previous embodiment, this can also improve the uniformity and output efficiency of the gaseous heat dissipation medium output evaporator 110, thereby effectively improving the heat exchange performance of the heat dissipation device 10.

[0091] The heat dissipation device 10 of this embodiment, through the above-described configuration, has more efficient heat transfer performance compared to liquid cooling and direct air conditioning in the prior art. Based on the concept of heat transfer rather than cold transfer, it can effectively avoid dew point problems. Furthermore, since the heat dissipation device 10 adopts a passive heat transfer method, it eliminates the need for a pump structure, thus improving reliability. Additionally, because the heat dissipation device 10 possesses latent heat capacity, it can buffer short-term heat release, reducing the risk of thermal runaway. Based on the principle of phase change heat transfer, the temperature is stable and uniform. Compared to general heat pipe solutions, the heat dissipation device 10 of this embodiment has the advantages of gas-liquid separation pipes, low liquid flow loss, long transmission distance, and anti-gravity operation. Compared to general split-loop heat pipe solutions, the heat dissipation device 10 of this embodiment can use a flat-plate evaporator 110, which is suitable for large-area planar heat dissipation, especially for flat-plate batteries. Compared to general plate-type loop heat pipe solutions, the heat dissipation device 10 of this embodiment has a bidirectional heat transfer structure, enabling heat transfer between two layers of heat sources, making it suitable for heat transfer between multi-layer battery packs. Compared with the bidirectional heat transfer plate loop heat pipe solution, the heat dissipation device 10 in this embodiment has an independently temperature-controlled liquid storage component 200, which can actively control the operating temperature of the liquid pipe 112. Furthermore, by setting a liquid wick, the liquid penetration distance can be significantly reduced, and the heat transfer limit and transmission distance can be improved. At the same time, since the heat dissipation device 10 uses dual liquid pipes 112 and dual gas pipes 113 for output, the temperature of the plate evaporator 110 can be made more uniform.

[0092] The present invention also provides an energy supply system, which includes a battery and a heat dissipation device 10 as described in any of the above embodiments. The evaporator 110 of the heat dissipation device 10 is attached to the battery, the cooling component 300 is spaced apart from the battery, and the heat dissipation device 10 is used to cool the battery.

[0093] It is understood that in the power supply system of this embodiment, by setting up a heat dissipation device 10 in conjunction with the battery, and by providing a delivery pipe in the heat dissipation device 10 to connect the evaporator 110 and the cooling component 300, the condensate generated by the heat dissipation device 10 during the heat exchange process can be prevented from affecting the battery. At the same time, by using a phase-change heat dissipation medium in conjunction with the evaporation component 100, efficient heat dissipation can be achieved. Specifically, the battery can be a flat battery or a cylindrical battery, and is not limited to this specific type.

[0094] The present invention also provides an electrical device, which includes the power supply system in any of the above embodiments, or the heat dissipation device 10 in any of the above embodiments, wherein the heat dissipation device 10 is used to cool the heat source or power supply system in the electrical device.

[0095] In the electrical device of this embodiment, the cooling component 300 in the heat dissipation device 10 can be connected to the air conditioner of the electrical device to fully utilize the cooling performance of the air conditioner, thereby making the overall structure of the heat dissipation device 10 more compact. Simultaneously, by configuring the heat dissipation device 10 in conjunction with a heat source, the heat dissipation performance of the internal components of the electrical device can be effectively improved. Specifically, the electrical device can be a vehicle, in which case the cooling component 300 can be connected to the vehicle's air conditioner to utilize the cooling performance of the vehicle's air conditioner, thereby making the structure of the heat dissipation device 10 more compact.

[0096] In the description of the embodiments of this application, it should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0097] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application based on the specific circumstances.

[0098] In the embodiments of this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0099] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the embodiments of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0100] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A heat dissipation device (10), characterized in that, include: An evaporation assembly (100) includes an evaporator (110) and a liquid wick, wherein the liquid wick is disposed within the evaporator (110); the inner cavity of the liquid wick is used to contain a liquid heat dissipation medium, and the liquid heat dissipation medium undergoes a phase change within the liquid wick to be converted into a gaseous heat dissipation medium; A liquid storage assembly (200) is connected to the inner cavity of the liquid-absorbing core. The liquid storage assembly (200) is used to store the liquid heat dissipation medium and deliver it to the liquid-absorbing core; and A cooling component (300) is connected to the evaporator (110) and the liquid storage component (200) respectively via a delivery pipe. The cooling component (300) is used to cool the gaseous heat dissipation medium to form the liquid heat dissipation medium. The pore diameter near the outer layer of the absorbent core is smaller than the pore diameter near the inner cavity of the absorbent core; And / or the thermal conductivity of the absorbent core near the outer layer is greater than the thermal conductivity of the side near the inner cavity of the absorbent core.

2. The heat dissipation device (10) according to claim 1, characterized in that, The liquid-absorbing core includes a first liquid-absorbing core (121) and a second liquid-absorbing core (122). The first liquid-absorbing core (121) is located outside the second liquid-absorbing core (122), and the inner cavity of the second liquid-absorbing core (122) is used to contain the liquid heat dissipation medium. Wherein, the pore size of the first absorbent core (121) is smaller than that of the second absorbent core (122); and / or the thermal conductivity of the first absorbent core (121) is greater than that of the second absorbent core (122).

3. The heat dissipation device (10) according to claim 1, characterized in that, The evaporation assembly (100) further includes a heat-conducting element (130), which is disposed between the liquid-absorbing core and the inner wall of the evaporator (110) to form a heat-conducting channel (131). The heat-conducting channel (131) is connected to the cooling assembly (300) and is used to transport the gaseous heat dissipation medium.

4. The heat dissipation device (10) according to claim 3, characterized in that, The inner cavity of the liquid-absorbing core extends along a first direction, and the heat-conducting channel (131) extends along a second direction, with the first direction and the second direction forming an angle.

5. The heat dissipation device (10) according to claim 3, characterized in that, The number of heat-conducting channels (131) is multiple, and the multiple heat-conducting channels (131) are arranged in parallel or staggered.

6. The heat dissipation device (10) according to any one of claims 3-5, characterized in that, The number of the heat-conducting components (130) is multiple.

7. The heat dissipation device (10) according to any one of claims 3-5, characterized in that, The heat-conducting component (130) is integrally formed with the evaporator (110); and / or the heat-conducting component (130) is integrally formed with the liquid-absorbing core.

8. The heat dissipation device (10) according to claim 1, characterized in that, The evaporation assembly (100) further includes a first sensor (140), which is connected to the evaporator (110) and used to acquire the temperature signal inside the evaporator (110).

9. The heat dissipation device (10) according to claim 1, characterized in that, The liquid storage assembly (200) includes a liquid storage element (210) and a temperature control element (220). The liquid storage element (210) is connected to the liquid pipe (112) between the inner cavity of the liquid absorption core and the cooling assembly (300). The liquid storage element (210) is used to store the liquid heat dissipation medium. The temperature control element (220) is connected to the liquid storage element (210) and is used to regulate the temperature of the liquid heat dissipation medium.

10. The heat dissipation device (10) according to claim 9, characterized in that, The liquid storage assembly (200) also includes a pressure relief valve (230), which is located on the liquid pipeline (112) between the liquid storage component (210) and the cooling assembly (300).

11. The heat dissipation device (10) according to claim 9, characterized in that, The liquid storage assembly (200) further includes a second sensor (240), which is connected to the liquid storage component (210) and is used to acquire temperature and / or pressure signals within the liquid storage component (210).

12. The heat dissipation device (10) according to claim 1, characterized in that, The cooling component (300) includes a heat sink (310), which is connected to the evaporator (110) and the liquid storage component (200) respectively. The heat sink (310) is used to cool the gaseous heat dissipation medium output by the evaporator (110) to condense it into the liquid heat dissipation medium.

13. The heat dissipation device (10) according to claim 12, characterized in that, The cooling assembly (300) further includes a subcooler (320), which is disposed in a liquid pipe (112) between the evaporator (110) and the liquid storage assembly (200), and the subcooler (320) is used to cool the liquid heat dissipation medium in the liquid pipe (112).

14. An energy supply system, characterized in that, include: Battery; as well as The heat dissipation device (10) as described in any one of claims 1-13, wherein the evaporator (110) of the heat dissipation device (10) is in contact with the battery, the cooling component (300) is spaced apart from the battery, and the heat dissipation device (10) is used to cool the battery.

15. An electrical appliance, characterized in that, Includes the power supply system as described in claim 14, or the heat dissipation device (10) as described in any one of claims 1-13, wherein the heat dissipation device (10) is used to cool the heat source in the electrical device or the power supply system.

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