Broadband 1GHz-8GHz 8*8 full-switching matrix board card
By using GaAs power segment chip, SBMA vertical interconnection technology and onboard MCU control unit in the 8×8 full-factor board, the problems of large size and complex control of the switching components in the prior art are solved, and the effects of miniaturization, high integration and direct computer control are achieved.
Patent Information
- Application Number
- CN202510196189.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-21
- Publication Date
- 2025-04-08
AI Technical Summary
In the prior art, the 8×8 switching component is large in size, which is not conducive to cascade expansion, and the switch control is SPI center, and an external main control board is required for interface conversion before it can be controlled through the computer serial port.
A broadband 1GHz to 8GHz 8×8 full-factory board is designed, using GaAs power split chip and SBMA vertical interconnection technology, combined with the on-board MCU control unit, to achieve efficient signal switching and direct computer control.
It realizes the miniaturization and high integration of boards, supports cascade expansion of multiple boards, simplifies control processes, improves the ease of use and control efficiency of the system.
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Figure CN119788627A_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the field of satellite communication technology, and in particular, to the field of satellite ground station radio frequency signal exchange technology. Background Art
[0002] RF signal exchange is mainly used in satellite ground station systems. Through RF signal exchange, multiple terminal devices can share one antenna, and any terminal can freely choose any antenna. RF signal exchange technology uses matrix equipment to realize point-to-multipoint or multi-point-to-point full exchange of signal input and output.
[0003] like Figure 1 The technical solution of the prior art 1 is shown as follows: At present, the industry implements 8×8 switching components by combining power division modules and switch modules. Due to the wide frequency, the power division circuit adopts 8-order microstrip power division. The size of the entire switching module is 247×116×135mm, and the switch adopts SPI control. Disadvantages of the prior art 1: In this way, the switching component size is large, which is not conducive to cascade expansion, and the switch control is SPI center, which requires an external main control board for interface conversion before it can be controlled through the computer serial port. Summary of the invention
[0004] The present invention aims to solve the above problems of the prior art. A broadband 1GHz~8GHz 8×8 full switch matrix card is proposed. The technical solution of the present invention is as follows:
[0005] A broadband 1GHz-8GHz 8×8 full-switch matrix board, comprising: a power division unit group, a switch unit group and an MCU control unit, wherein two power division unit groups are above the switch unit group, the signal input end of the switch board is connected to the signal input end of the power division unit group through a radio frequency cable, the signal output of the power division unit group is connected to the signal input end of the switch unit group through a BMA connector, and the output end of the switch unit group is connected to the output signal output end of the switch board through the radio frequency cable; wherein the power division unit group is used to evenly distribute the input radio frequency signal power to multiple output ports, and the power division unit group adopts a GaAs power division chip to achieve broadband 1GHz-8GHz power distribution; the switch unit group is used to select an input signal for output according to a control signal, and the switch unit group is controlled by an SPI signal; the MCU control unit is used to convert an external serial port control signal into an SPI signal, thereby controlling the signal path selection of the switch unit group;
[0006] The MCU control unit converts the external serial port control signal into an SPI signal, and the SPI signal is converted into a TTL level signal through a shift controller to control the selection of the switch.
[0007] Furthermore, the power division unit group and the switch unit group are vertically interconnected in an SBMA manner.
[0008] Furthermore, the size of the board is 242×170×26 mm, which is convenient for cascading expansion of multiple boards.
[0009] Furthermore, the MCU control unit includes a shift controller for converting the serial port control signal into an SPI signal, and then controlling the selection of the switch unit group through a TTL level signal.
[0010] Furthermore, the signal input end of the board is connected to the input end of the power division unit group through a radio frequency cable, and the output of the power division unit group is connected to the input end of the switch unit group through a BMA connector.
[0011] Furthermore, the board can realize the full switching matrix function of 8 inputs and 8 outputs, the signal of any input port can be selectively directed to any output port, and supports direct control of the computer serial port. The advantages and beneficial effects of the present invention are as follows:
[0012] 1. Chip design of power division circuit: Traditional power division circuits are implemented using complex microstrip lines or hybrid microwave circuits, while the present invention uses GaAs (gallium arsenide) power division chips. This chip design not only reduces the size of the circuit and improves the integration of the circuit, but also ensures stable RF performance in the wide band range of 1GHz to 8GHz. Since GaAs has good performance in the high-frequency field, its application in power division circuits is innovative because it can effectively solve the loss and instability problems of traditional power division circuits in the high-frequency band.
[0013] 2. SBMA vertical interconnection technology: The present invention adopts SBMA (Small Blind Mate Aperture) vertical interconnection technology to closely connect the power division unit group and the switch unit group. This design method greatly reduces the size of the board, while reducing the signal transmission path, reducing signal loss, and improving switching efficiency. The application of SBMA technology is not common in RF switching matrices because it is necessary to solve complex problems such as signal integrity and electromagnetic compatibility, which makes it difficult to think of innovation points.
[0014] 3. Onboard MCU control unit: The present invention integrates an MCU control unit inside the board, which can directly convert the external serial port control signal into an SPI signal, thereby controlling the selection of the RF switch and eliminating the dependence on the external main control board. This integrated design not only simplifies the control architecture of the system, but also improves the real-time and flexibility of the control, allowing the computer to directly control the switching matrix without the need for additional control logic.
[0015] The corresponding beneficial effects include:
[0016] 1. Miniaturization and high integration: The use of GaAs power divider chip and SBMA vertical interconnection technology optimizes the board size to 242×170×26mm, greatly reducing the volume and facilitating the cascade expansion of multiple boards to form a larger-scale signal exchange network.
[0017] 2. Direct computer control: The onboard MCU control unit directly supports serial port control, which simplifies the control process and allows users to control the switching matrix more conveniently through a computer, improving the system's ease of use and control efficiency.
[0018] 3. Cascade expansion capability: The miniaturized design and direct control characteristics allow multiple boards to be easily cascaded to form a larger-scale full-switching matrix, meeting the satellite communication system's needs for large-scale, highly flexible RF signal exchange.
[0019] The reason why these innovations are not easy to think of is that they involve knowledge in multiple cross-fields such as RF technology, integrated circuit design, and signal processing, and require a deep understanding of the limitations of traditional RF switching matrices and innovative thinking in high frequency, broadband, and control logic. In addition, the selection of power splitter chips, the application of SBMA vertical interconnection technology, and the integration of MCU control units all require a balance and trade-off between technical feasibility, cost control, and system performance, which increases the difficulty of innovation. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 This is the principle block diagram of the traditional 8×8 power splitter switching component;
[0021] Figure 2 This is a schematic diagram of the composition of an 8×8 switch board in a preferred embodiment of the present invention;
[0022] Figure 3 This is a schematic diagram of the structure of an 8×8 switch board;
[0023] Figure 4 This is an exploded diagram of the 8×8 switch board structure. DETAILED DESCRIPTION
[0024] The following will describe the technical solutions in the embodiments of the present invention in detail in conjunction with the accompanying drawings in the embodiments of the present invention. The described embodiments are only part of the embodiments of the present invention.
[0025] The technical solution of the present invention to solve the above technical problems is:
[0026] like Figure 1-4As shown, the device includes a power division unit group, a switch unit group and an MCU control unit. The positions and connection relationships between the components are as follows: the two power division unit groups are above the switch unit group, the signal input end of the switch board is connected to the signal input end of the power division unit group through a radio frequency cable, the signal output of the power division unit group is connected to the signal input end of the switch unit group through a BMA connector, and the output end of the switch unit group is connected to the output signal output end of the switch board through a radio frequency cable.
[0027] The MCU control unit converts the external serial port control signal into an SPI signal, and the SPI signal is converted into a TTL level signal through a shift controller to control the selection of the switch.
[0028] The following describes two specific embodiments:
[0029] Example 1: Basic implementation
[0030] 1. Power splitter design: First, two GaAs (gallium arsenide) power splitter chips are designed and integrated. Each chip is responsible for evenly distributing the input RF signal in the 1GHz to 8GHz frequency band to four output ports. The GaAs chip was chosen based on its excellent RF performance and stability in a wide bandwidth.
[0031] 2. Switch unit group configuration: Next, configure the switch unit group consisting of 16 high-speed SPI-controlled RF switches. Each switch is responsible for connecting or disconnecting the path between the output of the power splitter group and the output port of the board. The switch is controlled by SPI signals to ensure fast switching of the signal path.
[0032] 3. MCU control unit integration: Design and integrate a micro control unit (MCU), whose function is to receive external serial control signals and convert them into SPI signals through the internal shift controller to control the selection of the switch unit group. The integration of MCU avoids dependence on the external main control board and simplifies the control process.
[0033] 4. Circuit layout and connection: In terms of circuit layout, the two power splitter groups are located above the switch group, and are vertically interconnected through BMA connectors to reduce the signal path length and board size. The signal input end of the board is connected to the power splitter group through an RF cable, and the output of the power splitter group is connected to the output end of the board through an RF cable to ensure efficient signal transmission.
[0034] 5. Structural design and size: The board adopts a compact structural design with an optimized size of 242×170×26mm, which is convenient for cascading multiple boards to form a larger-scale full-switch matrix.
[0035] 6. Testing and Verification: Finally, the board is tested for RF performance to verify its signal exchange capability in the wideband range of 1GHz to 8GHz, as well as the feasibility of direct control through a computer serial port.
[0036] Example 2: Cascade expansion implementation method
[0037] 1. Board cascade design: Based on the basic implementation method, the board cascade interface is designed so that multiple switching boards can be connected in series or in parallel to form a larger signal exchange network. Each board is connected to the adjacent board through a dedicated interface to achieve continuous signal exchange.
[0038] 2. Cascade expansion of control signals: Optimize the software of the MCU control unit so that it can process the control signals of the cascaded boards and realize unified control of multiple boards. Through the control instructions received through the serial port, the MCU can intelligently distribute them to each cascaded board to ensure accurate selection of the signal path.
[0039] 3. Enhanced RF performance: In the scenario of cascade expansion, the RF performance of the power division unit group and the switch unit group is enhanced to cope with the impact of the increase in the scale of the signal exchange network on signal attenuation and signal integrity. For example, the dynamic range of the power division chip is increased, and the switching time and isolation of the switch are optimized.
[0040] 4. Architecture design and testing: Design an architecture that supports cascading expansion, build and test the signal exchange network, and verify the signal exchange efficiency and control flexibility when multiple boards are cascaded.
[0041] The systems, devices, modules or units described in the above embodiments may be implemented by computer chips or entities, or by products with certain functions.
[0042] It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprises a ..." do not exclude the existence of other identical elements in the process, method, commodity or device including the elements.
[0043] The above embodiments should be understood to be only used to illustrate the present invention and not to limit the protection scope of the present invention. After reading the contents of the present invention, technicians can make various changes or modifications to the present invention, and these equivalent changes and modifications also fall within the scope defined by the claims of the present invention.
Claims
1. A broadband 1GHz~8GHz 8×8 full switch matrix card, characterized in that: include: A power division unit group, a switch unit group and an MCU control unit, wherein two power division unit groups are above the switch unit group, the signal input end of the switch board is connected to the signal input end of the power division unit group through a radio frequency cable, the signal output of the power division unit group is connected to the signal input end of the switch unit group through a BMA connector, and the output end of the switch unit group is connected to the output signal output end of the switch board through a radio frequency cable; wherein the power division unit group is used to evenly distribute the input radio frequency signal power to multiple output ports, and the power division unit group adopts a GaAs power division chip to achieve broadband 1GHz to 8GHz power distribution; the switch unit group is used to select the input signal for output according to the control signal, and the switch unit group is controlled by an SPI signal; the MCU control unit is used to convert the external serial port control signal into an SPI signal, thereby controlling the signal path selection of the switch unit group; The MCU control unit converts the external serial port control signal into an SPI signal, and the SPI signal is converted into a TTL level signal through a shift controller to control the selection of the switch.
2. A broadband 1GHz-8GHz 8×8 full switch matrix board according to claim 1, characterized in that: The power division unit group and the switch unit group are vertically interconnected by using an SBMA blind plug-in radio frequency connector.
3. The broadband radio frequency signal exchange matrix board according to claim 1, characterized in that: The size of the board is 242×170×26 mm, which is convenient for cascading expansion of multiple boards.
4. The broadband radio frequency signal exchange matrix board according to claim 1, characterized in that: The MCU control unit includes a shift controller for converting a serial port control signal into an SPI signal, and further controlling the selection of the switch unit group through a TTL level signal.
5. The broadband radio frequency signal exchange matrix board according to claim 1, characterized in that: The signal input end of the board is connected to the input end of the power division unit group through a radio frequency cable, and the output of the power division unit group is connected to the input end of the switch unit group through a BMA connector.
6. The broadband RF signal exchange matrix board according to any one of claims 1 to 5, characterized in that: The board can realize the full switching matrix function of 8 inputs and 8 outputs. The signal of any input port can be selectively directed to any output port, and supports direct control by computer serial port.
Citation Information
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