Camera module and electronic device

Abstract

A camera module and an electronic device are provided. The camera module comprises an imaging lens, an electronic photosensitive element and a magnet assembling mechanism. The electronic photosensitive element is used for receiving an optical image signal of the imaging lens. The magnet assembling mechanism is used for defining a state of an optical image signal of the imaging lens relative to the electronic photosensitive element. The magnet assembling mechanism comprises a magnet carrier, a magnet and a light-proof layer. The magnet is arranged on the magnet carrier. The light-proof layer is arranged on the outer surface of the magnet. Therefore, by arranging the magnet assembling mechanism, the quality of an optical image signal is ensured, and the opaque layer is arranged on the surface layer of the magnet, so that the probability of stray light is reduced.

Description

Technical Field

[0001] The present disclosure relates to a camera module, and more particularly to a camera module applied to a portable electronic device. Background Art

[0002] In recent years, portable electronic devices have developed rapidly, such as smart electronic devices and tablet computers, which have become part of modern people's lives, and camera modules installed on portable electronic devices have also developed rapidly. However, as technology becomes more and more advanced, users have higher and higher requirements for the imaging quality of camera modules. Therefore, developing a camera module that can improve imaging quality has become an important and urgent problem in the industry. Summary of the invention

[0003] The present disclosure provides a camera module and an electronic device, which ensure the quality of optical image signals by configuring a magnet assembly mechanism and provide an opaque layer on the surface of the magnet to reduce the probability of stray light.

[0004] According to an embodiment of the present disclosure, a camera module is provided, comprising an imaging lens, an electronic photosensitive element, and a magnet assembly mechanism. The electronic photosensitive element is used to receive an optical image signal of the imaging lens. The magnet assembly mechanism is used to define a state of the optical image signal of the imaging lens relative to the electronic photosensitive element. The magnet assembly mechanism comprises a magnet carrier, a magnet, and an opaque layer. The magnet is disposed on the magnet carrier. The opaque layer is disposed on an outer surface of the magnet.

[0005] According to the camera module of the embodiment described in the previous paragraph, a portion of the light-proof layer is disposed toward the electronic photosensitive element.

[0006] According to the camera module of the embodiment described in the previous paragraph, the magnet assembly mechanism further includes a coil, and the magnet and the coil are arranged correspondingly.

[0007] According to the camera module of the embodiment described in the previous paragraph, the magnet assembly mechanism further includes a magnetic field sensing element, and the magnet and the magnetic field sensing element are disposed correspondingly.

[0008] According to the camera module of the embodiment described in the previous paragraph, the magnet assembly mechanism is used to adjust a relative position between the imaging lens and the electronic photosensitive element.

[0009] According to the camera module of the embodiment described in the previous paragraph, the magnet assembly mechanism is used to provide a preload force to support the imaging lens.

[0010] According to the camera module of the embodiment described in the previous paragraph, the magnet assembly mechanism is used to adjust an aperture size of an aperture of the camera module.

[0011] According to the camera module of the embodiment described in the previous paragraph, the magnet assembly mechanism further includes a nano layer disposed on the opaque layer.

[0012] In the camera module according to the embodiment described in the previous paragraph, the nano-layer includes a plurality of nano-particles distributed in an irregular manner on a surface of the opaque layer.

[0013] In the camera module according to the embodiment described in the previous paragraph, the nano-layer includes a plurality of nano-protrusions distributed in an irregular manner on a surface of the opaque layer.

[0014] In the camera module according to the embodiment described in the previous paragraph, the nano-layer includes a plurality of nano-holes distributed in an irregular manner on a surface of the opaque layer.

[0015] According to the camera module of the embodiment described in the previous paragraph, the light-proof layer includes a plurality of micron particles, so that irregular protrusions are formed on a surface of the light-proof layer.

[0016] According to the camera module of the embodiment described in the previous paragraph, a surface of the opaque layer is measured according to ISO25178 standard, and the number of peaks per square millimeter of a microstructure layer is Ypd, which satisfies the following conditions: 19000 1 / mm 2 ≤Ypd≤210000 1 / mm 2 In addition, it can meet the following conditions: 250001 / mm 2 ≤Ypd≤120000 1 / mm 2 .

[0017] According to the camera module of the embodiment described in the previous paragraph, a surface of the opaque layer is measured according to the ISO25178 standard, and a load area ratio Ymr1 separating a core portion and a protruding peak portion in a load area ratio curve satisfies the following conditions: 7% ≤ Ymr1 ≤ 53%. In addition, the following conditions can be satisfied: 15% ≤ Ymr1 ≤ 45%.

[0018] According to the camera module of the embodiment described in the previous paragraph, a surface of the opaque layer is measured according to ISO25178 standard, and the average height of a protruding peak portion is Aph, which satisfies the following conditions: 0.5μm≤Aph≤42.5μm. In addition, it can satisfy the following conditions: 4.5μm≤Aph≤35.5μm.

[0019] According to the camera module of the embodiment described in the previous paragraph, a surface of the opaque layer is measured according to ISO25178 standard, and the number of protrusions of a microstructure layer that are greater than a core height and greater than 4 μm is Hpq, which satisfies the following conditions: 0≤Hpq≤430. In addition, it can satisfy the following conditions: 15≤Hpq≤300.

[0020] In the camera module according to the embodiment described in the previous paragraph, the light-proof layer completely covers the magnet.

[0021] According to an embodiment of the present disclosure, an electronic device is provided, comprising the camera module of the aforementioned embodiment. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1A FIG. 1 is an exploded view of a camera module according to a first embodiment of the present disclosure;

[0023] Figure 1B Draw according to Figure 1A Schematic diagram of the first magnet carrier and the light-proof layer in the camera module;

[0024] Figure 1C Draw according to Figure 1A Schematic diagram of the first magnetic carrier, the first magnet and the light-impermeable layer in the first example of the first embodiment;

[0025] Figure 1D Draw according to Figure 1C An enlarged schematic diagram of a portion 1D in the first example of the first embodiment;

[0026] Figure 1E Draw according to Figure 1A Schematic diagram of the first magnetic carrier, the first magnet and the light-impermeable layer in the second example of the first embodiment;

[0027] Figure 1F Draw according to Figure 1E An enlarged schematic diagram of a portion 1F in the second example of the first embodiment;

[0028] Figure 1G Draw according to Figure 1A An enlarged schematic diagram of the opaque layer, micron particles and nano-protrusions on the first magnet in the third example of the first embodiment;

[0029] Figure 1H Draw according to Figure 1A An enlarged schematic diagram of the opaque layer, micron particles and nano-holes on the first magnet in the fourth example of the first embodiment;

[0030] Figure 2A A schematic diagram showing a camera module according to a second embodiment of the present disclosure;

[0031] Figure 2B Draw according to Figure 2A A three-dimensional schematic diagram of a magnetic carrier, a magnet and a light-impermeable layer in the first embodiment of the second embodiment;

[0032] Figure 2C Draw according to Figure 2BSchematic diagram of the magnet, the light-proof layer and the adhesive material in the first embodiment of the second embodiment;

[0033] Figure 2D Draw according to Figure 2A A three-dimensional schematic diagram of a magnetic carrier and a light-impermeable layer in a second example of the second embodiment;

[0034] Figure 2E Draw according to Figure 2D Schematic diagram of a magnet, a light-proof layer and an adhesive material in a second embodiment of the second embodiment;

[0035] Figure 3A FIG. 4 is an exploded view of a camera module according to a third embodiment of the present disclosure;

[0036] Figure 3B Draw according to Figure 3A Schematic diagram of the magnet carrier, magnet and opaque layer in the camera module;

[0037] Figure 4A A schematic diagram of an electronic device according to a fourth embodiment of the present disclosure is shown;

[0038] Figure 4B Draw according to Figure 4A Another schematic diagram of the electronic device in the fourth embodiment;

[0039] Figure 4C Draw according to Figure 4A Schematic diagram of an image captured by an electronic device in a fourth embodiment;

[0040] Figure 4D Draw according to Figure 4A Schematic diagram of another image captured by the electronic device in the fourth embodiment;

[0041] Figure 4E Draw according to Figure 4A Schematic diagram of another image captured by the electronic device in the fourth embodiment;

[0042] Figure 5 A schematic diagram of an electronic device according to a fifth embodiment of the present disclosure is shown;

[0043] Fig. 6A A schematic diagram showing a vehicle tool according to a sixth embodiment of the present disclosure;

[0044] Figure 6B Draw according to Fig. 6A Another schematic diagram of the vehicle tool in the sixth embodiment; and

[0045] Figure 6C Draw according to Fig. 6A Another schematic diagram of the vehicle tool in the sixth embodiment.

[0046]

Explanation of symbols

[0047] 10,20: Electronic devices

[0048] 10a: User Interface

[0049] 11: High-pixel camera module

[0050] 12,21,22:Ultra-wide-angle camera module

[0051] 23,24: Wide-angle camera module

[0052] 13,14,25,26,27,28: Telephoto camera module

[0053] 15: Imaging signal processing element

[0054] 16,20a: Flash module

[0055] 29:TOF module

[0056] 30: Vehicle Tools

[0057] 100,200,300,31: Camera module

[0058] 110,210,310: Imaging lenses

[0059] 120,220,320: electronic photosensitive element

[0060] 131: first magnet carrier

[0061] 132: The First Magnet

[0062] 1321,2321: Adhesive material

[0063] 133,233,333: opaque layer

[0064] 1331: Micron particles

[0065] 134,234,3341,3342: Coil

[0066] 135,335: Magnetic field sensing element

[0067] 1361:Nanoparticles

[0068] 1362:Nano protrusions

[0069] 1363:Nanopores

[0070] 137: Opaque coating

[0071] 141: Second magnet carrier

[0072] 142: Second Magnet

[0073] 150,250,350: base

[0074] 151,152,351,352,353: Supporting elements

[0075] 231,331:Magnet carrier

[0076] 232,332: magnet

[0077] 2341: Coil positioning element

[0078] 261:Adjustable aperture

[0079] 262,3201:Fixed element

[0080] 3343:Equipped with components

[0081] 360: Filter element

[0082] θ: viewing angle

[0083] I1, I2, I3, I4: External space information DETAILED DESCRIPTION

[0084] One aspect of the present disclosure provides a camera module, comprising an imaging lens, an electronic photosensitive element and a magnet assembly mechanism. The electronic photosensitive element is used to receive an optical image signal of the imaging lens. The magnet assembly mechanism is used to define a state of the optical image signal of the imaging lens relative to the electronic photosensitive element. The magnet assembly mechanism comprises a magnet carrier, a magnet and an opaque layer. The magnet is disposed on the magnet carrier. The opaque layer is disposed on an outer surface of the magnet. Accordingly, the present disclosure provides a camera module with an assembled magnet, and the surface of the magnet is provided with an opaque layer, which can provide a matte magnet element to avoid the metallic luster on the surface of the magnet, thereby reducing the probability of stray light. Furthermore, the magnet assembly mechanism may change the state of the optical image signal of the imaging lens due to the displacement between the mechanisms, so that part of the light in the camera module is prone to produce unexpected light simulation. The present design can reduce the probability of this situation to ensure the quality of the optical image signal.

[0085] Specifically, the magnet assembly mechanism can be a moving coil type drive mechanism or a moving magnet type drive mechanism, wherein the moving coil type drive mechanism has a fixed magnet carrier, and can also have a movable magnet carrier and a fixed magnet carrier at the same time; the moving magnet type drive mechanism has a movable magnet carrier, and can also have a movable magnet carrier and a fixed magnet carrier at the same time, but the content of the present disclosure is not limited to this.

[0086] The state defined by the aforementioned magnet assembly mechanism means that the magnet assembly mechanism can be used to realize the autofocus function of the camera module, the image stabilization function of the camera module, the aperture value adjustment function of the camera module, and the loop control function of the camera module; that is, the above functions all belong to specific implementation methods for defining the state of the optical image signal of the imaging lens relative to the electronic photosensitive element, but the present disclosure is not limited to this.

[0087] In addition, the magnet may be fixed to the magnetic carrier using an adhesive material, or may be directly adsorbed to the magnetic carrier, but the present disclosure is not limited thereto.

[0088] The light-proof layer may have a portion disposed toward the electronic photosensitive element. Since the magnet assembly mechanism is close to the electronic photosensitive element, it is easy to form high-intensity non-imaging light, and this technical feature can effectively prevent the non-imaging light from entering the electronic photosensitive element.

[0089] The magnet assembly mechanism may further include a coil, wherein the magnet and the coil are arranged correspondingly. The corresponding arrangement of the magnet and the coil can provide a driving force for the magnet assembly mechanism, thereby enabling the optical image signal to produce dynamic changes.

[0090] The magnet assembly mechanism may further include a magnetic field sensing element, wherein the magnet and the magnetic field sensing element are arranged correspondingly, thereby providing the magnet assembly mechanism with driving control sensitivity.

[0091] The magnet assembly mechanism is used to adjust the relative position between the imaging lens and the electronic photosensitive element. The above configuration can provide an autofocus or image stabilization function. When the imaging lens and the electronic photosensitive element can move in the vertical direction or in the horizontal direction, the autofocus function or the image stabilization function can be achieved.

[0092] The magnet assembly mechanism is used to provide a preload force to support the imaging lens; in detail, it can maintain the relative position between the imaging lens and the electronic photosensitive element in a balanced state, thereby providing assembly stability.

[0093] The magnet assembly mechanism is used to adjust the aperture size of an aperture of the camera module, thereby scaling the aperture size of the aperture, thereby realizing the function of adjusting the aperture value.

[0094] The magnet assembly mechanism may further include a nano layer disposed on the light-proof layer. Further disposing the nano layer on the light-proof layer helps to maintain a low reflectivity of the surface.

[0095] The nano-layer may include a plurality of nano-particles which are irregularly distributed on a surface of the light-opaque layer. The stacking of the nano-particles helps to form a gradient refractive index and helps to reduce the reflectivity.

[0096] The nano-layer may include a plurality of nano-protrusions that are irregularly distributed on a surface of the opaque layer, thereby providing a coating method with high mass production feasibility.

[0097] The nano-layer includes a plurality of nano-holes which are irregularly distributed on a surface of the light-impermeable layer, thereby the nano-holes help to form a gradient refractive index and help to reduce reflectivity.

[0098] The light-proof layer includes a plurality of micron-particles, so that irregular protrusions are formed on one surface of the light-proof layer. Thus, by designing a coating with better extinction ability, the surface of the magnet has a lower reflectivity. In detail, the micron-particles may include black carbon materials, acrylic materials, silica, aluminum oxide, and metal materials, which can be used to absorb incident light, and the micron-particles can form an irregular protrusion surface on the light-proof layer, which can effectively destroy high-intensity incident light, thereby reducing the probability of generating stray light. The light-proof layer may further include a light-proof coating, which can increase the adhesion of the light-proof layer and is used to attach a plurality of micron-particles to the magnet. The light-proof coating may be a black pigment, an organic solvent, or a resin, but is not limited thereto.

[0099] The surface of the opaque layer is measured according to ISO25178 standard, and the number of peaks per square millimeter in the microstructure layer is Ypd, which meets the following conditions: 19000 1 / mm 2 ≤Ypd≤2100001 / mm 2 In addition, it can meet the following conditions: 25000 1 / mm 2 ≤Ypd≤120000 1 / mm 2 .

[0100] A surface of the opaque layer is measured according to ISO25178 standard, and a load area ratio Ymr1 separating a core portion and a protruding peak portion in a load area ratio curve satisfies the following conditions: 7%≤Ymr1≤53%. In addition, the following conditions can be satisfied: 15%≤Ymr1≤45%.

[0101] A surface of the light-impermeable layer is measured according to ISO 25178 standard, and the average height of a protruding peak portion thereof is Aph, which satisfies the following conditions: 0.5 μm ≤ Aph ≤ 42.5 μm. In addition, it can satisfy the following conditions: 4.5 μm ≤ Aph ≤ 35.5 μm.

[0102] A surface of the opaque layer is measured according to ISO25178 standard, and the number of protrusions of a microstructure layer that are greater than a core height and greater than 4 μm is Hpq, which satisfies the following conditions: 0≤Hpq≤430. In addition, it can satisfy the following conditions: 15≤Hpq≤300.

[0103] The above parameter ranges define the light-proof layer of the present disclosure. When the ISO25178 standard is measured in different local areas, different measurement data can be measured. The light-proof layer provided by the present disclosure has at least one local area that can meet one of the aforementioned conditions, that is, the surface roughness parameters meet any of the above conditions, which can effectively destroy the reflection of visible light and is a coating surface suitable for camera modules.

[0104] In addition, the light-proof layer can completely cover the magnet, thereby providing the manufacturability of blackening the magnet.

[0105] An aspect of the present disclosure provides an electronic device, comprising the camera module of the aforementioned aspect.

[0106] <First Embodiment>

[0107] Please refer to Figure 1A as well as Figure 1B ,in Figure 1A FIG. 1 is an exploded view of a camera module 100 according to a first embodiment of the present disclosure. Figure 1B Draw according to Figure 1A Schematic diagram of the first magnetic carrier 131 and the opaque layer 133 in the camera module 100. Figure 1A as well as Figure 1B It can be seen that the camera module 100 includes an imaging lens 110, an electronic photosensitive element 120 and a magnet assembly mechanism (not separately labeled), wherein the electronic photosensitive element 120 is used to receive the optical image signal of the imaging lens 110, and the magnet assembly mechanism is used to define a state of the optical image signal of the imaging lens 110 relative to the electronic photosensitive element 120; specifically, in the first embodiment, the magnet assembly mechanism is used to realize the autofocus function of the camera module 100 and the loop control function of the camera module 100.

[0108] In detail, the imaging lens 110 can accommodate at least one lens (not labeled separately), and the electronic photosensitive element 120 is disposed on the image side of the imaging lens 110; the camera module 100 can further include a base 150, and the electronic photosensitive element 120 can be positioned on the image side of the imaging lens 110 by being disposed on the base 150.

[0109] The magnet assembly mechanism comprises a magnet carrier, a magnet and an opaque layer, wherein Figure 1A In the first embodiment, the magnet carrier includes a first magnet carrier 131 and a second magnet carrier 141, and the magnet includes a first magnet 132 and a second magnet 142, wherein the number of the first magnet 132 and the second magnet 142 are both two, the first magnet 132 is disposed on the first magnet carrier 131, and the second magnet 142 is disposed on the second magnet carrier 141. Figure 1BIt can be seen that the number of the opaque layers 133 is four, which are respectively disposed on the outer surface of the first magnet 132 and the outer surface of the second magnet 142 , and are all disposed toward the direction of the electronic photosensitive element 120 .

[0110] The magnet assembly mechanism may further include two coils 134 and a magnetic field sensing element 135. The two coils 134 are respectively disposed on two opposite outer sides of the first magnet carrier 131 and are disposed opposite to the second magnet 142 on the second magnet carrier 141. The magnetic field sensing element 135 is disposed corresponding to the first magnet 132.

[0111] Specifically, Figure 1A In the first embodiment, the first magnet carrier 131 is a movable magnet carrier, the second magnet carrier 141 is a fixed magnet carrier, the first magnet 132 is a sensing magnet, and the second magnet 142 is a driving magnet, but the present disclosure is not limited to this configuration. In this way, the magnet assembly mechanism can be used to adjust the relative position between the imaging lens 110 and the electronic photosensitive element 120. In addition, the camera module 100 may further include supporting elements 151 and 152, which are respectively connected to the first magnet carrier 131, which is convenient for its movement and reset, and is used to provide a preload force to support the imaging lens 110.

[0112] Please refer to Figure 1C , which is shown in accordance with Figure 1A Schematic diagram of the first magnetic carrier 131, the first magnet 132 and the opaque layer 133 in the first example of the first embodiment. Figure 1C It can be seen that the first magnet 132 is installed on the first magnet carrier 131 through the adhesive material 1321, and the adhesive material 1321 can be arranged between the opaque layer 133 and the first magnet 132, but in other embodiments, the opaque layer can also be directly arranged on the first magnet, and the present disclosure is not limited to this.

[0113] Please refer to Figure 1D , which is shown in accordance with Figure 1C An enlarged schematic diagram of a portion 1D in the first example of the first embodiment. Figure 1DIt can be seen that the opaque layer 133 may include a plurality of micron particles 1331, so that irregular protrusions are formed on one surface of the opaque layer 133. Furthermore, the magnet assembly mechanism may further include a nano layer (not separately labeled), which is arranged on the opaque layer 133, wherein the nano layer includes a plurality of nano particles 1361, which are distributed in an irregular manner on one surface of the opaque layer 133. In addition, an opaque coating 137 may be arranged above the micron particles 1331, which helps to attach the micron particles 1331 to the first magnet 132, and by arranging the nano particles 1361 of the nano layer on the opaque coating 137, the nano layer is adhered to the opaque layer 133. In addition, the opaque layer 133 connected to the second magnet 142 may also have the same or similar structure and characteristics as the opaque layer 133 connected to the first magnet 132, which will not be repeated here.

[0114] Taking the first example of the first embodiment as an example, a surface of the opaque layer 133 is measured according to the ISO25178 standard, the number of peak vertices per square millimeter in a microstructure layer is Ypd, the load area rate of a core portion and a protruding peak portion in a load area rate curve is Ymr1, the average height of a protruding peak portion is Aph, and the number of protrusions in a microstructure layer that are greater than the height of a core portion and greater than 4μm is Hpq. The following Table 1 discloses the surface data of the opaque layer 133 of 63 sets of samples. It must be noted that the data disclosed in Table 1 can be applied to other embodiments and examples of the present disclosure.

[0115]

[0116]

[0117]

[0118]

[0119] Please refer to Figure 1E , which is shown in accordance with Figure 1A Schematic diagram of the first magnetic carrier 131, the first magnet 132 and the opaque layer 133 in the second example of the first embodiment. Figure 1E It can be seen that the first magnet 132 is mounted on the first magnet carrier 131 through the adhesive material 1321 , and the opaque layer 133 is directly disposed on the first magnet 132 .

[0120] Please refer to Figure 1F , which is shown in accordance with Figure 1E An enlarged schematic diagram of the portion 1F in the second example of the first embodiment. Figure 1FIt can be seen that the opaque layer 133 may include a plurality of micron particles 1331, so that irregular protrusions are formed on one surface of the opaque layer 133. Furthermore, the magnet assembly mechanism may further include a nano layer (not separately labeled) disposed on the opaque layer 133, wherein the nano layer includes a plurality of nano particles 1361, which are distributed in an irregular manner on one surface of the opaque layer 133. In addition, an opaque coating 137 may be disposed above the micron particles 1331, which helps to attach the micron particles 1331 to the first magnet 132, and by arranging the nano particles 1361 of the nano layer on the opaque coating 137, the nano layer is adhered to the opaque layer 133.

[0121] Please refer to Figure 1G , which is shown in accordance with Figure 1A An enlarged schematic diagram of the opaque layer 133, the micron particles 1331 and the nano-protrusions 1362 on the first magnet 132 in the third example of the first embodiment. Figure 1G It can be seen that the opaque layer 133 may include a plurality of micron particles 1331, so that irregular protrusions are formed on one surface of the opaque layer 133. Furthermore, the magnet assembly mechanism may further include a nano layer (not separately labeled) disposed on the opaque layer 133, wherein the nano layer includes a plurality of nano protrusions 1362, which are distributed in an irregular manner on one surface of the opaque layer 133. In addition, an opaque coating 137 may be disposed above the micron particles 1331, which helps to attach the micron particles 1331 to the first magnet 132, and by disposing the nano protrusions 1362 of the nano layer on the opaque coating 137, the nano layer is adhered to the opaque layer 133.

[0122] Please refer to Figure 1H , which is shown in accordance with Figure 1A An enlarged schematic diagram of the opaque layer 133, the micron particles 1331 and the nano-holes 1363 on the first magnet 132 in the fourth example of the first embodiment. Figure 1H It can be seen that an adhesive material 1321 is disposed between the light-proof layer 133 and the first magnet 132, and the light-proof layer 133 may include a plurality of micron particles 1331, so that irregular protrusions are formed on one surface of the light-proof layer 133. Furthermore, the magnet assembly mechanism may further include a nano layer (not separately labeled) disposed on the light-proof layer 133, wherein the nano layer includes a plurality of nano holes 1363, which are distributed in an irregular manner on one surface of the light-proof layer 133. In addition, a light-proof coating 137 may be disposed above the micron particles 1331, which helps to attach the micron particles 1331 to the first magnet 132, and by disposing the nano holes 1363 of the nano layer on the light-proof coating 137, the nano layer is adhered to the light-proof layer 133.

[0123] <Second Embodiment>

[0124] Please refer to Figure 2A , which is a schematic diagram of a camera module 200 according to a second embodiment of the present disclosure. Figure 2A It can be seen that the camera module 200 includes an imaging lens 210, an electronic photosensitive element 220 and a magnet assembly mechanism (not separately labeled), wherein the electronic photosensitive element 220 is used to receive the optical image signal of the imaging lens 210, and the magnet assembly mechanism is used to define a state of the optical image signal of the imaging lens 210 relative to the electronic photosensitive element 220; specifically, in the second embodiment, the magnet assembly mechanism is used to realize the aperture value adjustment function of the camera module 200.

[0125] Specifically, the imaging lens 210 can accommodate at least one lens (not labeled), and the electronic photosensitive element 220 is disposed on the image side of the imaging lens 210 .

[0126] Figure 2A In the second embodiment, the magnet assembly mechanism includes a magnet carrier 231, a magnet 232 and an opaque layer 233, wherein the number of magnets 232 is two and they are arranged correspondingly on the sides of the magnet carrier 231, and the number of opaque layers 233 is also two and they are respectively arranged on the outer surfaces of the magnets 232.

[0127] The magnet assembly mechanism may further include two coils 234, which are arranged corresponding to the magnet 232; in detail, the coil 234 is arranged on the inner wall of the base 250 through the coil positioning element 2341, and the base 250 is covered outside the magnet carrier 231, so that the coil 234 is arranged corresponding to the magnet 232. In addition, the object side end surface of the base 250 is provided with an adjustable aperture 261 and a fixing element 262 for positioning the adjustable aperture 261 on the base 250. The magnet assembly mechanism disclosed by the second embodiment can use the magnet 232 as a driving magnet to drive the size of the adjustable aperture 261, thereby controlling the aperture value of the camera module 200.

[0128] Please refer to Figure 2B as well as Figure 2C ,in Figure 2B Draw according to Figure 2A A three-dimensional schematic diagram of a magnetic carrier 231, a magnet 232 and a light-proof layer 233 in the first embodiment of the second embodiment, Figure 2C Draw according to Figure 2B Schematic diagram of the magnet 232, the opaque layer 233 and the adhesive material 2321 in the first example of the second embodiment. Figure 2B as well as Figure 2C It can be seen that the magnet 232 is installed on the magnet carrier 231 through the adhesive material 2321, a part of the opaque layer 233 is set on the outer surface of the first magnet 132, and the other part of the opaque layer 233 is connected to the adhesive material 2321 and the magnet carrier 231 respectively.

[0129] Please refer to Figure 2D as well as Figure 2E ,in Figure 2D Draw according to Figure 2A A three-dimensional schematic diagram of a magnetic carrier 231 and a light-proof layer 233 in a second example of the second embodiment, Figure 2E Draw according to Figure 2D Schematic diagram of the magnet 232, the opaque layer 233 and the adhesive material 2321 in the second example of the second embodiment. Figure 2D as well as Figure 2E It can be seen that the opaque layer 233 completely covers the magnet 232 , and the magnet 232 covered with the opaque layer 233 is installed on the magnet carrier 231 through the adhesive material 2321 .

[0130] It must be noted that the light-proof layer 233 of the first embodiment and the second embodiment in the second embodiment may be the light-proof layer 133 of the first embodiment, the second embodiment or the third embodiment in the first embodiment having the same or similar surface structure as micron particles 1331 and a nanolayer, which will not be described in detail herein.

[0131] <Third Embodiment>

[0132] Please refer to Figure 3A as well as Figure 3B ,in Figure 3A FIG. 1 is an exploded view of a camera module 300 according to a third embodiment of the present disclosure. Figure 3B Draw according to Figure 3A Schematic diagram of the magnet carrier 331, magnet 332 and opaque layer 333 in the camera module 300. Figure 3A as well as Figure 3B It can be seen that the camera module 300 includes an imaging lens 310, an electronic photosensitive element 320 and a magnet assembly mechanism (not separately labeled), wherein the electronic photosensitive element 320 is used to receive the optical image signal of the imaging lens 310, and the magnet assembly mechanism is used to define a state of the optical image signal of the imaging lens 310 relative to the electronic photosensitive element 320; specifically, in the third embodiment, the magnet assembly mechanism is used to realize the image stabilization function of the camera module 300, the autofocus function of the camera module 300 and the loop control function of the camera module 300.

[0133] Specifically, the imaging lens 310 can accommodate at least one lens (not labeled), and the electronic photosensitive element 320 is disposed on the image side of the imaging lens 310 .

[0134] The magnet assembly mechanism includes a magnet carrier 331, a magnet 332 and an opaque layer 333. Figure 3A and Figure 3BIn the third embodiment, the number of magnets 332 and opaque layers 333 are four respectively. The magnets 332 are arranged at the four corners of the magnet carrier 331, and the opaque layers 333 are respectively arranged on the outer surface of each magnet 332 and each opaque layer 333 has a portion arranged in the direction of the electronic photosensitive element 320.

[0135] The magnet assembly mechanism may further include coils 3341, 3342 and a magnetic field sensing element 335. Specifically, the coil 3341 is disposed around the outside of the imaging lens 310 and is disposed corresponding to the four magnets 332 disposed on the magnet carrier 331. In addition, the number of coils 3342 is also four, which are disposed at the four corners of a mounting element 3343, the mounting element 3343 is configured on the image side of the magnet carrier 331, and the four coils 3342 also correspond to the four magnets 332. The number of magnetic field sensing elements 335 is two, which are disposed on the mounting element 3343 and adjacent to any two coils 3342, and are disposed corresponding to the two magnets 332. Furthermore, the camera module 300 further includes a filter element 360, which is disposed on the mounting element 3343 and corresponds to the electronic photosensitive element 320. In addition, the camera module 300 may further include supporting elements 351, 352, and 353, wherein the supporting element 351 is connected between the imaging lens 310 and the magnet carrier 331, the supporting element 352 is connected between the magnet carrier 331 and the mounting element 3343, the supporting element 353 is connected between the mounting element 3343 and the base 350, and the supporting element 353 receives and supports the electronic photosensitive element 320 and is connected to the base 350 through the fixing element 3201. Thus, the cooperation between the magnet assembly mechanism and the supporting elements 351, 352, and 353 can be used to adjust a relative position between the imaging lens 310 and the electronic photosensitive element 320, and to provide a preload force to support the imaging lens 310.

[0136] It must be noted that the opaque layer 333 of the third embodiment may be the opaque layer 133 of the first embodiment, the second embodiment or the third embodiment described above, which has the same or similar surface structure as the micron particles 1331 and the nanolayer, and will not be further described here.

[0137] <Fourth Embodiment>

[0138] Please refer to Figure 4A and Figure 4B ,in Figure 4A A schematic diagram of an electronic device 10 according to a fourth embodiment of the present disclosure is shown. Figure 4B Draw according to Figure 4A Another schematic diagram of the electronic device 10 in the fourth embodiment. Figure 4A and Figure 4BIt can be seen that the electronic device 10 is a smart phone, and the electronic device 10 includes multiple camera modules and a user interface 10a. Further, the camera modules are a high-pixel camera module 11, an ultra-wide-angle camera module 12, and two telephoto camera modules 13 and 14, and the user interface 10a is a touch screen, but it is not limited to this. Specifically, the camera module can be any one of the embodiments in the first embodiment to the third embodiment, but the present disclosure is not limited to this.

[0139] The user enters the shooting mode through the user interface 10a, wherein the user interface 10a is used to display the screen and can be used to manually adjust the shooting angle to switch different camera modules. At this time, the camera module collects imaging light on an electronic photosensitive element (not shown) of the camera module and outputs electronic signals related to the image to the image signal processing element (Image Signal Processor, ISP) 15.

[0140] Depend on Figure 4A It can be seen that, in response to the camera specifications of the electronic device 10, the electronic device 10 may further include an optical image stabilization component (not shown in the figure), and further, the electronic device 10 may further include at least one focus auxiliary module (not shown in the figure) and at least one sensor element (not shown in the figure). The focus auxiliary module may be a flash module 16 that compensates for color temperature, an infrared ranging element, a laser focus module, etc. The sensor element may have the function of sensing physical momentum and actuation energy, such as an accelerometer, a gyroscope, and a Hall Effect Element to sense the shaking and jitter imposed by the user's hand or the external environment, thereby facilitating the automatic focus function and the optical image stabilization component configured in the camera module of the electronic device 10 to obtain good imaging quality, and helping the electronic device 10 according to the present disclosure to have multiple modes of shooting functions, such as optimized self-timer, low-light HDR (High Dynamic Range), high-resolution 4K (4K Resolution) video recording, etc. In addition, the user can directly view the shooting picture of the camera through the user interface 10 a and manually operate the framing range on the user interface 10 a to achieve a what-you-see-is-what-you-get auto-focus function.

[0141] Further, the camera module, optical image stabilization component, sensor element and focus auxiliary module can be arranged on a flexible printed circuit board (Flexible Printed Circuitboard, FPC) (not shown), and electrically connected to the imaging signal processing element 15 and other related elements through a connector (not shown) to execute the shooting process. Current electronic devices such as smart phones have a trend of being thin and light. The camera module and related elements are arranged on a flexible printed circuit board, and the circuit is integrated to the main board of the electronic device by a connector. This can meet the requirements of the mechanism design and circuit layout of the limited space inside the electronic device and obtain a greater margin, and also make the automatic focus function of its camera module more flexibly controlled through the touch screen of the electronic device. In the fourth embodiment, the electronic device 10 can include a plurality of sensor elements and a plurality of focus auxiliary modules, and the sensor elements and the focus auxiliary modules are arranged on the flexible printed circuit board and at least one other flexible printed circuit board (not shown), and electrically connected to the imaging signal processing element 15 and other related elements through corresponding connectors to execute the shooting process. In other embodiments (not shown), the sensor element and the auxiliary optical element may also be disposed on a mainboard or other types of carrier boards of the electronic device according to the requirements of the mechanism design and circuit layout.

[0142] In addition, the electronic device 10 may further include but is not limited to a display unit (Display), a control unit (ControlUnit), a storage unit (StorageUnit), a random access memory (RAM), a read-only memory (ROM) or a combination thereof.

[0143] Figure 4C Draw according to Figure 4A Schematic diagram of an image captured by the electronic device 10 in the fourth embodiment. Figure 4C It can be seen that the ultra-wide-angle camera module 12 can capture images in a wider range and has the function of accommodating more scenery.

[0144] Figure 4D Draw according to Figure 4A A schematic diagram of another image captured by the electronic device 10 in the fourth embodiment. Figure 4D It can be seen that the high-pixel camera module 11 can capture images within a certain range and have high pixels, and has the function of high resolution and low deformation.

[0145] Figure 4E Draw according to Figure 4A A schematic diagram of another image captured by the electronic device 10 in the fourth embodiment. Figure 4E It can be seen that the telephoto camera modules 13 and 14 have a high-magnification function and can capture distant images and magnify them to a high magnification.

[0146] Depend on FIG. 4C to FIG. 4EIt can be seen that by using camera modules with different focal lengths to frame and combining with image processing technology, the zoom function can be implemented in the electronic device 10 .

[0147] <Fifth embodiment>

[0148] Please refer to Figure 5 , which is a schematic diagram of an electronic device 20 according to a fifth embodiment of the present disclosure. Figure 5 It can be seen that the electronic device 20 is a smart phone, and the electronic device 20 includes a plurality of camera modules. Specifically, the camera modules are ultra-wide-angle camera modules 21, 22, wide-angle camera modules 23, 24, telephoto camera modules 25, 26, 27, 28, and a TOF module (Time-Of-Flight: time-of-flight module) 29, and the TOF module 29 can also be other types of camera modules, and is not limited to this configuration. Specifically, the camera module can be the camera module described in any of the first to third embodiments, but the present disclosure is not limited thereto.

[0149] Furthermore, the telephoto camera modules 27 and 28 further have the function of deflecting the light path, but the present disclosure is not limited thereto.

[0150] In response to the camera specifications of the electronic device 20, the electronic device 20 may further include an optical image stabilization component (not shown in the figure), and further, the electronic device 20 may further include at least one focus auxiliary module (not shown in the figure) and at least one sensor element (not shown in the figure). The focus auxiliary module may be a flash module 20a that compensates for color temperature, an infrared ranging element, a laser focus module, etc. The sensor element may have the function of sensing physical momentum and actuation energy, such as an accelerometer, a gyroscope, and a Hall Effect Element to sense the shaking and jitter imposed by the user's hand or the external environment, thereby facilitating the automatic focus function and the optical image stabilization component configured in the camera module of the electronic device 20 to obtain good imaging quality, and helping the electronic device 20 according to the present disclosure to have multiple modes of shooting functions, such as optimized Selfie, low-light HDR (High Dynamic Range, high dynamic range imaging), high-resolution 4K (4K Resolution) video recording, etc.

[0151] In addition, the structures and configurations of the remaining elements of the fifth embodiment are the same as those of the fourth embodiment, and will not be further described herein.

[0152] <Sixth embodiment>

[0153] Please refer to FIG. 6A to FIG. 6C ,in Fig. 6A A schematic diagram of a vehicle tool 30 according to a sixth embodiment of the present disclosure is shown. Figure 6B Draw according to Fig. 6A Another schematic diagram of the vehicle tool 30 in the sixth embodiment, Figure 6C Draw according to Fig. 6A Another schematic diagram of the vehicle tool 30 in the sixth embodiment. FIG. 6A to FIG. 6C It can be seen that the vehicle tool 30 includes a plurality of camera modules 31. In the sixth embodiment, the number of the camera modules 31 is six, and the camera modules 31 can be any camera module described in the first to third embodiments, but are not limited thereto.

[0154] Depend on Fig. 6A and Figure 6B It can be seen that the camera module 31 is a vehicle camera module, and the two camera modules 31 are respectively located below the left and right rearview mirrors, and are used to capture image information of a viewing angle θ. Specifically, the viewing angle θ can meet the following conditions: 40 degrees < θ < 90 degrees. In this way, image information within the left and right lanes can be captured.

[0155] Depend on Figure 6B It can be seen that the other two of the camera modules 31 can be set in the space inside the vehicle tool 30. Specifically, the two camera modules 31 are respectively set near the position of the rearview mirror inside the vehicle and near the rear window. Furthermore, the camera modules 31 can also be respectively set on the non-mirror surface of the left and right rearview mirrors of the vehicle tool 30, but it is not limited thereto.

[0156] Depend on Figure 6C It can be seen that two of the camera modules 31 can be set at the front and rear ends of the vehicle tool 30. The configuration of the camera modules 31 at the front and rear ends of the vehicle tool 30 and below the left and right rearview mirrors can help the driver obtain external space information outside the cockpit, such as external space information I1, I2, I3, and I4, but not limited to this. In this way, more viewing angles can be provided to reduce blind spots, thereby helping to improve driving safety. Furthermore, by setting the camera modules 31 around the vehicle tool 30, it is helpful to identify road condition information outside the vehicle tool 30, so as to help realize the function of automatic assisted driving.

[0157] Although the present invention has been disclosed as above by means of implementation modes and examples, they are not intended to limit the present invention. Any person with ordinary knowledge in the technical field may make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the definition of the attached claims.

Claims

1. A camera module, characterized in that: Include: An imaging lens; an electronic photosensitive element for receiving an optical image signal from the imaging lens; and A magnet assembly mechanism, used to define a state of the optical image signal of the imaging lens relative to the electronic photosensitive element, wherein the magnet assembly mechanism comprises: a magnetic carrier; a magnet, the magnet being disposed on the magnet carrier; and A light-proof layer is disposed on an outer surface of the magnet.

2. The camera module according to claim 1, wherein: A portion of the light-proof layer is disposed toward the electronic photosensitive element.

3. The camera module according to claim 1, wherein: The magnet assembly mechanism also includes: A coil, the magnet is arranged corresponding to the coil.

4. The camera module according to claim 1, wherein: The magnet assembly mechanism also includes: A magnetic field sensing element is provided. The magnet is arranged corresponding to the magnetic field sensing element.

5. The camera module according to claim 1, wherein: The magnet assembly mechanism is used to adjust a relative position between the imaging lens and the electronic photosensitive element.

6. The camera module according to claim 1, wherein: The magnet assembly mechanism is used to provide a preload force to support the imaging lens.

7. The camera module according to claim 1, wherein: The magnet assembly mechanism is used to adjust an aperture size of an aperture of the camera module.

8. The camera module according to claim 1, wherein: The magnet assembly mechanism also includes: A nano-layer is disposed on the light-impermeable layer.

9. The camera module according to claim 8, wherein: The nano layer includes a plurality of nano particles which are distributed irregularly on a surface of the light-impermeable layer.

10. The camera module according to claim 8, wherein: The nanometer layer comprises a plurality of nanometer protrusions which are distributed on a surface of the light-proof layer in an irregular manner.

11. The camera module according to claim 8, wherein: The nanometer layer includes a plurality of nanometer holes which are irregularly distributed on a surface of the light-proof layer.

12. The camera module according to claim 1, wherein: The light-proof layer comprises: The plurality of micron particles form irregular protrusions on a surface of the light-impermeable layer.

13. The camera module according to claim 2, wherein: The surface of the opaque layer is measured according to ISO25178 standard, and the number of peaks per square millimeter in a microstructure layer is Ypd, which meets the following conditions: 19000 1 / mm 2 ≤Ypd≤210000 1 / mm 2 。 14. The camera module according to claim 13, wherein: The surface of the opaque layer is measured according to ISO25178 standard, and the number of peaks per square millimeter of the microstructure layer is Ypd, which meets the following conditions: 25000 1 / mm 2 ≤Ypd≤120000 1 / mm 2 。 15. The camera module according to claim 2, wherein: The surface of the opaque layer is measured according to ISO25178 standard, and the load area ratio of a core portion and a protruding peak portion in a load area ratio curve is Ymr1, which satisfies the following conditions: 7%≤Ymr1≤53%.

16. The camera module according to claim 15, wherein: The surface of the opaque layer is measured according to ISO25178 standard, and the load area ratio separating the core portion and the protruding peak portion in the load area ratio curve is Ymr1, which satisfies the following conditions: 15%≤Ymr1≤45%.

17. The camera module according to claim 2, wherein: The surface of the opaque layer is measured according to ISO25178 standard, and the average height of a protruding peak portion thereof is Aph, which satisfies the following conditions: 0.5μm≤Aph≤42.5μm.

18. The camera module according to claim 17, wherein: The surface of the opaque layer is measured according to ISO25178 standard, and the average height of the protruding peak portion is Aph, which satisfies the following conditions: 4.5μm≤Aph≤35.5μm.

19. The camera module according to claim 2, wherein: The surface of the opaque layer is measured according to ISO25178 standard, and the number of protrusions in a microstructure layer that are greater than the core height and greater than 4 μm is Hpq, which meets the following conditions: 0≤Hpq≤430.

20. The camera module according to claim 19, wherein: The surface of the opaque layer is measured according to ISO25178 standard, and the number of protrusions of the microstructure layer that are greater than the core height and greater than 4 μm is Hpq, which satisfies the following conditions: 15≤Hpq≤300.

21. The camera module according to claim 1, wherein: The light-proof layer completely covers the magnet.

22. An electronic device, characterized in that: Include: The camera module as claimed in claim 1.

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