Light-emitting module based on CSP-LED lamp beads, preparation method of light-emitting module, backlight module and display device

Abstract

The invention discloses a light-emitting module based on CSP-LED lamp beads, a preparation method of the light-emitting module, a backlight module and a display device, and relates to the field of semiconductor photoelectric devices. The preparation method comprises the following steps: arranging CSP-LED lamp beads on a substrate; lens glue is formed, and first preliminary curing is carried out to form a first preliminary curing body which can deform under the action of acting force; an acting force is applied to the upper surface of the first preliminary solidified body, so that the top of the first preliminary solidified body flows towards the periphery to deform, and a second preliminary solidified body is formed; performing second primary curing to shape the second primary cured body to form a third primary cured body; wherein the section of the third preliminary curing body is of a curved surface structure, the curved surface structure comprises a sunken section which is sunken downwards and arching sections which are arranged on the two sides of the sunken section and arching upwards, and the orthographic projection of the sunken section in the thickness direction of the CSP-LED lamp bead at least partially coincides with the CSP-LED lamp bead; and curing the third primary cured body. According to the invention, the light-emitting angle of the light-emitting module can be increased.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor optoelectronic devices, and in particular to a light-emitting module based on CSP-LED lamp beads and a preparation method thereof, a backlight module, and a display device. Background Art

[0002] Conventional LED lamp beads are generally composed of brackets, LED chips, wires, and fluorescent glue. They have good directionality, with strong light in the center and low light intensity around them. The light-emitting angle can usually reach about 120°.

[0003] The backlight module based on the conventional LED lamp beads generally includes a PCB board 1a, an LED lamp bead 2a, a lens 3a and a diffusion sheet 4a (see Figure 1 ). Among them, the lens 3a is processed by injection molding with the help of a mold, and the usual material is acrylic (polymethyl methacrylate) or PC (polycarbonate). The main function of the lens group is to scatter the light and improve the uniformity of light mixing. This lens 3a is generally mechanically connected to the PCB board 1a.

[0004] For the above-mentioned backlight module, since the light-emitting angle of the LED lamp beads is small, the light directly in front of the LED lamp beads is strong, and the light intensity at the edge is weak, resulting in alternating light and dark, that is, uneven light mixing. For this reason, it is generally adopted to reduce the spacing between the LED lamp beads so that the light-emitting edges of the two LED lamp beads overlap to achieve the same light intensity as directly above the LED; after the spacing between the LED lamp beads is reduced, more LED lamp beads are required; when the light-emitting angle of the LED lamp beads is small, without reducing the spacing between the LED lamp beads, in order to obtain a uniform light mixing effect, it is necessary to increase the distance between the LED lamp beads and the diffuser so that the light emitted from the edge of the LED lamp beads overlaps at a farther distance, and the backlight module will be thicker at this time. These methods are not conducive to the development of display devices in the direction of thinness. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide a method for preparing a light-emitting module based on CSP-LED lamp beads, wherein the prepared lamp beads have a large light-emitting angle.

[0006] Another technical problem to be solved by the present invention is to provide a light-emitting module based on CSP-LED lamp beads.

[0007] Another technical problem to be solved by the present invention is to provide a backlight module.

[0008] Another technical problem to be solved by the present invention is to provide a display device.

[0009] In order to solve the above problems, the present invention discloses a method for preparing a light-emitting module based on CSP-LED lamp beads, which comprises:

[0010] Arrange the CSP-LED lamp beads on the substrate;

[0011] Forming a lens glue on the top of the CSP-LED lamp bead, and performing a first preliminary curing to form a first preliminary cured body, thereby obtaining a first intermediate body; wherein the cross section of the first preliminary cured body is dome-shaped, and it can be deformed under the action of a force;

[0012] Applying a force to the upper surface of the first preliminary solidified body to make the top of the first preliminary solidified body flow and deform toward its surroundings to form a second preliminary solidified body, thereby obtaining a second intermediate body;

[0013] The second preliminary solidified body is subjected to a second preliminary solidification to shape the second preliminary solidified body to form a third preliminary solidified body, thereby obtaining a third intermediate;

[0014] The third preliminary solidified body is solidified to form a lens body on the surface of the CSP-LED lamp bead; wherein the cross-section of the lens body is a curved surface structure, and the curved surface structure includes a downwardly concave section and an arched section arranged on both sides of the concave section and arched upward, and the orthographic projection of the concave section in the thickness direction of the CSP-LED lamp bead at least partially overlaps with the CSP-LED lamp bead.

[0015] As an improvement of the above technical solution, the lens glue is silica gel, and its viscosity is 5000-15000 mPa·s and its thixotropic coefficient is 1.5-3.5.

[0016] As an improvement of the above technical solution, in the step of forming a lens glue on the top of the CSP-LED lamp bead and performing a first preliminary curing to form a first preliminary cured body to obtain a first intermediate, the lens glue is subjected to a first preliminary curing by baking, the temperature of the first preliminary curing is 60 to 100° C., and the time of the first preliminary curing is 30 to 60 seconds; and / or

[0017] In the step of subjecting the second preliminary solidified body to a second preliminary solidification to shape the second preliminary solidified body to form a third preliminary solidified body and obtain a third intermediate body, the second preliminary solidification is performed by baking or hot air, the temperature of the second preliminary solidification is 60 to 100° C., and the time of the second preliminary solidification is 200 to 600 seconds.

[0018] As an improvement of the above technical solution, in the step of curing the third preliminary solidified body, the third preliminary solidified body is cured by baking, the baking temperature is 150° C. to 160° C., and the baking time is 2 to 4 hours.

[0019] As an improvement of the above technical solution, in the step of applying a force to the upper surface of the first preliminary solidified body so that the top of the first preliminary solidified body flows and deforms toward its surroundings to form a second preliminary solidified body and obtain a second intermediate body, a blowing device is used to blow air on the first preliminary solidified body above the CSP-LED lamp bead so that the top of the first preliminary solidified body flows and deforms toward its surroundings; the blowing device includes a blowing pipe, and a guide edge is provided at the outlet of the blowing pipe so that the gas of a preset volume ratio flows toward the surroundings of the blowing pipe;

[0020] The temperature of the gas blown by the blowing device is 20-35°C, and the flow rate is 5-15m 3 / h;

[0021] When blowing starts, the distance between the outlet of the blowing pipe and the top surface of the CSP-LED lamp bead is 0.1 to 0.2 m; during blowing, the blowing pipe moves toward the direction approaching the CSP-LED lamp bead at a moving rate of 0.01 to 0.05 m / min; after blowing ends, the distance between the outlet of the blowing pipe and the top surface of the CSP-LED lamp bead is 0.08 to 0.19 m.

[0022] As an improvement of the above technical solution, in the step of subjecting the second preliminary solidified body to a second preliminary solidification to shape the second preliminary solidified body and forming a third preliminary solidified body to obtain a third intermediate body, a blowing device is used to blow air on the second preliminary solidified body to shape the second preliminary solidified body;

[0023] The temperature of the gas blown by the blowing device is 60-100°C, and the flow rate is 3-5m 3 / h;

[0024] When blowing starts, the distance between the outlet of the blowing pipe and the top surface of the CSP-LED lamp bead is 0.08 to 0.19 m; during blowing, the blowing pipe moves toward the direction approaching the CSP-LED lamp bead at a moving rate of 0.005 to 0.01 m / min; after blowing ends, the distance between the outlet of the blowing pipe and the top surface of the CSP-LED lamp bead is 0.03 to 0.1 m.

[0025] As an improvement of the above technical solution, the blowing device includes a main air pipe, a heating module, a cooling module and a blowing pipe;

[0026] The heating module and the cooling module are arranged on the outside of the main air pipe to heat or cool the gas in the main air pipe; a plurality of the air blowing pipes are connected to the main air pipe and are arranged one by one corresponding to the CSP-LED lamp beads.

[0027] Correspondingly, the present invention further discloses a light-emitting module based on CSP-LED lamp beads, which is prepared by the above-mentioned preparation method of the light-emitting module based on CSP-LED lamp beads.

[0028] Correspondingly, the present invention also discloses a backlight module, which includes the above-mentioned CSP-LED lamp bead-based light-emitting module and a diffusion sheet.

[0029] Correspondingly, the present invention also discloses a display device, which includes the above-mentioned backlight module.

[0030] The implementation of the present invention has the following beneficial effects:

[0031] In the preparation method of the light-emitting module based on CSP-LED lamp beads in one embodiment of the present invention, a packaging glue is first formed on the CSP-LED lamp beads, and a force is applied after a primary curing to deform it, and then a secondary primary curing is performed to fix the shape, and finally the curing is performed. Based on this preparation method, a lens body can be formed on the surface of the CSP-LED lamp bead, and its cross-section is a curved surface structure, and the curved surface structure includes a concave section that is concave downward and an arched section that is arranged on both sides of the concave section and arched upward. The orthographic projection of the concave section in the thickness direction of the CSP-LED lamp bead at least partially overlaps with the CSP-LED lamp bead. The lens body of this shape can increase the light-emitting angle, specifically, the light-emitting angle can be increased to about 170°. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a structural schematic diagram of a backlight module in the prior art;

[0033] Figure 2 This is a flow chart of a method for preparing a light-emitting module based on CSP-LED lamp beads in one embodiment of the present invention;

[0034] Figure 3 is a schematic structural diagram of a first intermediate body and a heating plate in one embodiment of the present invention;

[0035] Figure 4 is a schematic diagram of the interaction between the first intermediate and the blowing device in step S3 in one embodiment of the present invention;

[0036] Figure 5 is a schematic diagram of the interaction between the second intermediate and the blowing device in step S4 in one embodiment of the present invention;

[0037] Figure 6 It is a structural schematic diagram of a light-emitting module based on CSP-LED lamp beads in one embodiment of the present invention;

[0038] Figure 7 is a schematic structural diagram of a backlight module in one embodiment of the present invention;

[0039] In the figure, 1a is a PCB board, 2a is an LED lamp bead, 3a is a lens, 4a is a diffuser, 100 is a substrate, 200 is a CSP-LED lamp bead, 300 is a lens body, 310 is a raised section, 320 is a recessed section, 400 is a diffuser, 500 is a first preliminary solidification body, 600 is a heating plate, 700 is an air blowing device, 710 is an air blowing pipe, 711 is a guide edge, 720 is a main air pipe, 730 is a heating module, 740 is a cooling module, and 800 is a third preliminary solidification body. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limiting the present application. In addition, it should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application.

[0041] In the description of the present application, it should be understood that the terms "length", "width", "up", "down", "left", "right", "horizontal", "top", "bottom", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0042] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0043] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0044] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0045] The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, and does not indicate the relationship between the various embodiments and / or settings discussed in itself. In addition, the various specific processes and examples of materials provided in the present application, but those of ordinary skill in the art can be aware of the application of other processes and / or the use scenarios of other materials.

[0046] As a first aspect of the present invention, see Figure 2 The present invention provides a packaging method for a flip-chip LED lamp bead, which comprises the following steps:

[0047] S1: Arrange CSP-LED lamp beads on the substrate;

[0048] Specifically, the CSP-LED lamp bead 200 refers to a chip-level packaged LED lamp bead, which is obtained by bonding a fluorescent film and / or protective material to the five sides of the LED chip. Its overall size is no more than 1.2 times the size of the LED chip, which is conducive to making the display device thin and light.

[0049] Preferably, in some embodiments, the CSP-LED lamp bead 200 is a single-sided light-emitting type CSP-LED lamp bead 200. Although its light-emitting angle is relatively small, its light color uniformity and color temperature uniformity are better, which is beneficial to improving the display effect.

[0050] Specifically, the substrate 100 may be an aluminum substrate, a steel substrate, or a PCB substrate, but is not limited thereto. Preferably, in some embodiments, the substrate is a PCB substrate.

[0051] Specifically, the CSP-LED lamp bead 200 is electrically connected to the substrate 100, and the electrical connection can be formed by welding, but is not limited thereto. Preferably, in some embodiments, solder paste is first applied to the substrate 100, and then the CSP-LED lamp bead 200 is reflow soldered, and the reflow soldering temperature is 230-280°C and the time is 30-60s.

[0052] S2: forming a lens glue on the top of the CSP-LED lamp bead, and performing a first preliminary curing to form a first preliminary cured body, thereby obtaining a first intermediate;

[0053] Specifically, the lens glue can be formed on the CSP-LED lamp bead 200 by screen printing, dispensing, etc., but is not limited thereto. Since the lens glue is generally made of organic material, which is different from the material of the substrate 100, the lens glue will form a dome or quasi-dome shape on the surface of the substrate 100 through the effect of surface tension.

[0054] Specifically, the lens glue may be epoxy resin or silicone commonly used in the art, but is not limited thereto. Preferably, in some embodiments of the present invention, the lens glue is silicone, which has stronger heat resistance and high transparency. More preferably, the lens glue is silicone, and its viscosity is 5000 to 15000 mPa·s and its thixotropic coefficient is 1.5 to 3.5. Based on this type of silicone, the molding of the lens body 300 of a specific shape can be completed subsequently by the blowing device 700.

[0055] It should be noted that after dispensing, although the lens glue will form a dome or a quasi-dome shape under the action of surface tension, it will still diffuse on the surface of the substrate 100 if it is not initially cured. To this end, the present invention performs a first initial curing on the lens glue so that the lens glue does not diffuse on the surface of the substrate 100, and is initially shaped, but not completely cured, and can be deformed under a smaller force, laying a good foundation for subsequent molding. Specifically, the first initial curing can be performed by light curing or heat curing, but is not limited to this. Preferably, in some embodiments, the lens glue is cured by baking to form a first preliminary cured body 500, and the temperature of the first preliminary curing is 60 to 100°C, and the time is 30 to 60s. After curing based on the baking process, the first preliminary cured body 500 has a certain fluidity and can be further deformed under the action of force.

[0056] Specifically, the substrate 100 after dispensing can be loaded as a whole into a baking device for first preliminary curing, but is not limited thereto. Preferably, in some embodiments, see Figure 3 , the first preliminary curing can be achieved by heating the substrate 100 through a heating plate 600 attached below the substrate 100 to simplify the operation.

[0057] S3: applying a force to the upper surface of the first preliminary solidified body to make the top of the first preliminary solidified body flow and deform toward its surroundings to form a second preliminary solidified body, thereby obtaining a second intermediate body;

[0058] Specifically, the first preliminary solidified body 500 may be pressed down by a mold of a specific shape to apply a force to deform the first preliminary solidified body 500, but the present invention is not limited thereto. Figure 4 , the blowing device 700 is used to blow air on the first preliminary solidified body 500 to exert a squeezing force thereon, thereby causing the top of the first preliminary solidified body 500 to flow and deform toward the surroundings. Specifically, by selecting a silicone with a specific viscosity and thixotropic coefficient, shaping can be achieved by blowing air, so that the first preliminary solidified body 500 is transformed into a second preliminary solidified body of a specific shape.

[0059] Specifically, in order to obtain a second preliminary solidified body of a specific shape by blowing, the temperature of the gas blown by the blowing device 700 is controlled to be 20-35° C. and the flow rate is 5-15 m / s. 3 / h; and when blowing starts, the distance between the outlet of the blowing pipe 710 and the top surface of the CSP-LED lamp bead 200 is 0.1~0.2m; during the blowing process, the blowing pipe 710 moves in the direction close to the CSP-LED lamp bead 200, and the moving speed is 0.01~0.05m / min; after the blowing is completed, the distance between the outlet of the blowing pipe 710 and the top surface of the CSP-LED lamp bead 200 is 0.08~0.19m.

[0060] Specifically, in order to facilitate the molding of the first preliminary solidified bodies 500 on the plurality of CSP-LED lamp beads 200, the air blowing device 700 may include a plurality of air blowing pipes 710 arranged one by one corresponding to the CSP-LED lamp beads 200, and the axis of each air blowing pipe 710 coincides with the center line of the CSP-LED lamp bead 200. Further, in order to optimize the molding effect, a guide edge 711 is provided at the outlet of the air blowing pipe 710 to allow the gas of a preset volume ratio to flow around the air blowing pipe 710.

[0061] More specifically, see Figure 4 , Figure 5 The blowing device 700 includes a main air pipe 720, a heating module 730, a cooling module 740 and an air blowing pipe 710; the heating module 730 and the cooling module 740 are arranged outside the main air pipe 720 to heat or cool the gas in the main air pipe 720; and a plurality of air blowing pipes 710 are connected to the main air pipe 720. By providing the heating module 730 and the cooling module 740, the temperature of the blowing air can be better controlled to improve the molding and curing effects.

[0062] S4: performing a second preliminary curing on the second preliminary cured body to shape the second preliminary cured body to form a third preliminary cured body, thereby obtaining a third intermediate;

[0063] Specifically, the second preliminary curing can be performed by light curing or heat curing, but is not limited thereto. Preferably, in some embodiments, see Figure 5 The blowing device 700 is used to blow air on the second preliminary solidified body to shape the second preliminary solidified body; wherein the temperature of the gas blown by the blowing device 700 is 60-100°C, and the flow rate is 3-5m 3 / h; when blowing starts, the distance between the outlet of the blowing pipe 710 and the top surface of the CSP-LED lamp bead 200 is 0.08-0.19m; during blowing, the blowing pipe 710 moves toward the direction close to the CSP-LED lamp bead 200 at a moving rate of 0.005-0.01m / min; after blowing, the distance between the outlet of the blowing pipe 710 and the top surface of the CSP-LED lamp bead 200 is 0.03-0.1m. Based on the second preliminary curing, the second preliminary cured body can be fully shaped to form a third preliminary cured body 800.

[0064] Specifically, the cross section of the third preliminary solidified body 800 is a curved surface structure, which includes a downwardly concave section 320 and an upwardly arched section 310 provided on both sides of the concave section 320, and the orthographic projection of the concave section 320 in the thickness direction of the CSP-LED lamp bead 200 at least partially overlaps with the CSP-LED lamp bead 200. Based on the above shape, the light-emitting angle can be greatly improved. Preferably, in some embodiments, the lowest point of the concave section 320 is located on the extension line of the center line of the CSP-LED lamp bead 200. Based on this setting, the light-emitting angle can be further improved.

[0065] S5: curing the third preliminary cured body to form a lens on the surface of the CSP-LED lamp bead;

[0066] Specifically, the curing can be performed by light curing or heat curing, but is not limited thereto. Preferably, in some embodiments, the third preliminary cured body 800 is cured by baking, the baking temperature is 150° C. to 160° C., and the baking time is 2 to 4 hours.

[0067] Specifically, after the above-mentioned preparation method, the cross-section of the obtained lens body 300 presents a curved surface structure, and the curved surface structure includes a recessed section 320 recessed downward and an arched section 310 provided on both sides of the recessed section 320 and arched upward, and the orthographic projection of the recessed section 320 in the thickness direction of the CSP-LED lamp bead 200 at least partially overlaps with the CSP-LED lamp bead 200.

[0068] In summary, based on the preparation method of the light-emitting module based on the CSP-LED lamp bead 200 in this embodiment, a lens body 300 with a high periphery and a concave middle can be set on the surface of the CSP-LED lamp bead 200, thereby greatly improving the light-emitting angle. Specifically, the light-emitting angle can be increased to about 170°.

[0069] Accordingly, as a second aspect of the present invention, see Figure 6 The present invention discloses a light-emitting module, which is prepared by the above-mentioned preparation method of the light-emitting module based on CSP-LED lamp beads.

[0070] Accordingly, as the third aspect of the present invention, see Figure 7 The present invention discloses a backlight module, which includes a light-emitting module and a diffusion plate 400. Based on the light-emitting module in the embodiment of the present invention, the separately formed lens in the traditional backlight module can be eliminated, and the spacing between the CSP-LED lamp beads 200 can be increased, thereby reducing the usage of the CSP-LED lamp beads 200 and reducing the production cost. In addition, the light mixing distance can be shortened, and the distance between the diffusion plate 400 and the CSP-LED lamp beads 200 can be reduced, so that the thickness of the backlight module is smaller.

[0071] Correspondingly, as a fourth aspect of the present invention, the present invention further discloses a display device, which includes a display screen and the above-mentioned backlight module. The present application can effectively reduce the thickness of the display device and optimize its display effect.

[0072] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0073] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A method for preparing a light-emitting module based on CSP-LED lamp beads, characterized in that: include: Arrange the CSP-LED lamp beads on the substrate; Forming a lens glue on the top of the CSP-LED lamp bead, and performing a first preliminary curing to form a first preliminary cured body, thereby obtaining a first intermediate body; wherein the cross section of the first preliminary cured body is dome-shaped, and it can be deformed under the action of a force; Applying a force to the upper surface of the first preliminary solidified body to make the top of the first preliminary solidified body flow and deform toward its surroundings to form a second preliminary solidified body, thereby obtaining a second intermediate body; The second preliminary solidified body is subjected to a second preliminary solidification to shape the second preliminary solidified body to form a third preliminary solidified body, thereby obtaining a third intermediate; The third preliminary solidified body is solidified to form a lens body on the surface of the CSP-LED lamp bead; wherein the cross-section of the lens body is a curved surface structure, and the curved surface structure includes a downwardly concave section and an arched section arranged on both sides of the concave section and arched upward, and the orthographic projection of the concave section in the thickness direction of the CSP-LED lamp bead at least partially overlaps with the CSP-LED lamp bead.

2. The method for preparing a light-emitting module based on CSP-LED lamp beads according to claim 1, characterized in that: The lens glue is silica gel, the viscosity of which is 5000-15000 mPa·s and the thixotropic coefficient is 1.5-3.

5.

3. The method for preparing a light-emitting module based on CSP-LED lamp beads according to claim 2, characterized in that: In the step of forming a lens glue on the top of the CSP-LED lamp bead and performing a first preliminary curing to form a first preliminary cured body to obtain a first intermediate, the lens glue is subjected to a first preliminary curing by baking, the first preliminary curing temperature is 60 to 100° C., and the first preliminary curing time is 30 to 60 seconds; and / or In the step of subjecting the second preliminary solidified body to a second preliminary solidification to shape the second preliminary solidified body to form a third preliminary solidified body and obtain a third intermediate body, the second preliminary solidification is performed by baking or hot air, the temperature of the second preliminary solidification is 60 to 100° C., and the time of the second preliminary solidification is 200 to 600 seconds.

4. The method for preparing a light-emitting module based on CSP-LED lamp beads according to claim 2, characterized in that: In the step of curing the third preliminary cured body, the third preliminary cured body is cured by baking, the baking temperature is 150° C. to 160° C., and the baking time is 2 to 4 hours.

5. The method for preparing a light-emitting module based on CSP-LED lamp beads according to claim 1 or 3, characterized in that: In the step of applying a force to the upper surface of the first preliminary solidified body so that the top of the first preliminary solidified body flows and deforms toward the surroundings thereof to form a second preliminary solidified body and obtain a second intermediate body, a blowing device is used to blow air on the first preliminary solidified body above the CSP-LED lamp bead so that the top of the first preliminary solidified body flows and deforms toward the surroundings thereof; the blowing device includes a blowing pipe, and a guide edge is provided at the outlet of the blowing pipe so that the gas of a preset volume ratio flows toward the surroundings of the blowing pipe; The temperature of the gas blown by the blowing device is 20-35°C, and the flow rate is 5-15m 3 / h; When blowing starts, the distance between the outlet of the blowing pipe and the top surface of the CSP-LED lamp bead is 0.1 to 0.2 m; during blowing, the blowing pipe moves toward the direction approaching the CSP-LED lamp bead at a moving rate of 0.01 to 0.05 m / min; after blowing ends, the distance between the outlet of the blowing pipe and the top surface of the CSP-LED lamp bead is 0.08 to 0.19 m.

6. The method for preparing a light-emitting module based on CSP-LED lamp beads according to claim 5, characterized in that: In the step of subjecting the second preliminary solidified body to a second preliminary solidification to shape the second preliminary solidified body and forming a third preliminary solidified body to obtain a third intermediate body, a blowing device is used to blow air on the second preliminary solidified body to shape the second preliminary solidified body; The temperature of the gas blown by the blowing device is 60-100°C, and the flow rate is 3-5m 3 / h; When blowing starts, the distance between the outlet of the blowing pipe and the top surface of the CSP-LED lamp bead is 0.08 to 0.19 m; during blowing, the blowing pipe moves toward the direction approaching the CSP-LED lamp bead at a moving rate of 0.005 to 0.01 m / min; after blowing ends, the distance between the outlet of the blowing pipe and the top surface of the CSP-LED lamp bead is 0.03 to 0.1 m.

7. The method for preparing a light-emitting module based on CSP-LED lamp beads according to claim 5, characterized in that: The air blowing device comprises a main air pipe, a heating module, a cooling module and an air blowing pipe; The heating module and the cooling module are arranged on the outside of the main air pipe to heat or cool the gas in the main air pipe; a plurality of the air blowing pipes are connected to the main air pipe and are arranged one by one corresponding to the CSP-LED lamp beads.

8. A light-emitting module based on CSP-LED lamp beads, characterized in that: The light-emitting module is prepared by the preparation method of the light-emitting module based on CSP-LED lamp beads as described in any one of claims 1 to 7.

9. A backlight module, characterized in that: It comprises a light-emitting module and a diffuser based on CSP-LED lamp beads as described in claim 8.

10. A display device, characterized in that: Comprising the backlight module as claimed in claim 9.

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