Display panel and display device

Abstract

The present disclosure provides a display panel and a display device, wherein the display panel includes a substrate and a display function layer and a conductive structure layer located on the substrate. The display function layer is located on the substrate and includes a plurality of light-emitting units, wherein the light-emitting units include a first electrode, a light-emitting function layer, and a second electrode stacked in sequence on the substrate, the conductive structure layer is located on the substrate and connected to the second electrode, and the gap between the light-emitting units is within the orthographic projection of the conductive structure layer on the substrate. In the display panel, the conductive structure layer is connected to the second electrode, which can reduce the voltage drop when driving the second electrode, so that the voltage distribution on the second electrode is relatively uniform, thereby improving the display effect of the display panel.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular, to a display panel and a display device. Background Art

[0002] Organic Light-Emitting Diode (OLED) is an organic thin film electroluminescent unit. It has attracted great attention and is widely used in electronic display products due to its advantages such as simple preparation process, low cost, low power consumption, high brightness, wide viewing angle, high contrast and flexible display.

[0003] However, current electronic display products are limited by their own structural design and still have problems such as increased driving power consumption and uneven light output. Summary of the invention

[0004] In a first aspect, the present disclosure provides a display panel, which includes a substrate, a display function layer and a conductive structure layer located on the substrate. The display function layer is located on the substrate and includes a plurality of light-emitting units, the light-emitting units include a first electrode, a light-emitting function layer and a second electrode stacked in sequence on the substrate, the conductive structure layer is located on the substrate and connected to the second electrode, and the orthographic projection of the conductive structure layer on the substrate and the gaps between the light-emitting units are within the orthographic projection on the substrate.

[0005] In the above solution, the conductive structure layer is connected to the second electrode, which can reduce the voltage drop when driving the second electrode, so that the voltage distribution on the second electrode is relatively uniform, thereby improving the display effect of the display panel.

[0006] In a specific embodiment of the first aspect of the present disclosure, the square resistance of the conductive structure layer is smaller than the square resistance of the second electrode. The conductive structure layer is located at the gap between the light-emitting units, so it is not limited by the material and can select a material with high conductivity.

[0007] In a specific embodiment of the first aspect of the present disclosure, the thickness of the conductive structure layer is greater than the thickness of the second electrode. Unlike the second electrode which needs to have a relatively small thickness in consideration of light transmittance, the conductive structure layer is located in the gap between the light-emitting units, so it can be designed to have a larger thickness to have a smaller resistivity, thereby further reducing the voltage drop when driving the second electrode.

[0008] In a specific embodiment of the first aspect of the present disclosure, the display panel further includes a pixel defining layer located on the substrate, the pixel defining layer includes a plurality of pixel openings, and the pixel openings limit the light-emitting units.

[0009] In a specific implementation of the first aspect of the present disclosure, the display panel further includes a plurality of support posts spaced apart from each other, the conductive structure layer includes a plurality of conductive units spaced apart from each other, and the conductive units are located between the support posts and the substrate.

[0010] In the above solution, the conductive unit is covered by the support column, so as not to affect the arrangement of other structures in the display panel (such as position, size, etc., such as the gap size between the light-emitting units).

[0011] Optionally, the conductive units correspond to the support pillars one by one.

[0012] Optionally, the number of the conductive units is less than the number of the supporting columns, and the conductive units are located between the pixel defining layer and part of the supporting columns.

[0013] In a specific implementation of the first aspect of the present disclosure, the conductive structure layer is located on a side of the pixel defining layer away from the substrate, and the second electrode is connected to a side wall of the conductive unit.

[0014] Optionally, the orthographic projection of the conductive unit on the substrate is within the orthographic projection of the corresponding support column on the substrate. In this way, the support column can isolate part of the film layer in the light-emitting functional layer (for example, the film layer with light-emitting functionality) to alleviate the current crosstalk problem between adjacent light-emitting units.

[0015] Optionally, the orthographic projection of one end of the conductive unit facing away from the support pillar on the substrate is located within the orthographic projection of one end of the conductive unit facing the support pillar on the substrate. In this way, the conductive unit has relatively inclined side walls, so that the second electrode is deposited on the side walls of the conductive unit, thereby reducing the impedance at the connection between the second electrode and the conductive unit.

[0016] Optionally, a cross-sectional shape of the conductive unit along a direction perpendicular to the surface where the substrate is located is a regular trapezoid.

[0017] In a specific embodiment of the first aspect of the present disclosure, the conductive structure layer is located on a side of the pixel defining layer away from the substrate, a portion of the surface of the conductive unit away from the substrate is covered by a support column, and the second electrode is connected to a side wall of the conductive unit and a portion of the surface of the conductive unit away from the substrate that is not covered by the support column. Relative to the side wall of the conductive unit, the surface of the conductive unit away from the substrate is conducive to the deposition of the second electrode, thereby increasing the bonding area between the conductive unit and the second electrode, so as to further reduce the impedance at the connection between the second electrode and the conductive unit.

[0018] Optionally, the orthographic projection of one end of the support column facing the substrate on the substrate is located within the orthographic projection of one end of the support column facing away from the support column on the substrate. In this way, the support column can isolate part of the film layer in the light-emitting functional layer (for example, the film layer with light-emitting functionality) to alleviate the current crosstalk problem between adjacent light-emitting units.

[0019] Optionally, a cross-sectional shape of the support column in a direction perpendicular to the surface where the substrate is located is an inverted trapezoid.

[0020] In a specific embodiment of the first aspect of the present disclosure, the pixel defining layer defines a plurality of through holes corresponding to the conductive units, the conductive units are located in the corresponding through holes, and the second electrode is connected to the side wall of the conductive unit. In this way, the height increase of the support column caused by the provision of the conductive structure layer can be avoided.

[0021] Optionally, the orthographic projection of the conductive unit on the substrate is within the orthographic projection of the corresponding support column on the substrate. In this way, the support column can isolate part of the film layer in the light-emitting functional layer (for example, the film layer with light-emitting functionality) to alleviate the current crosstalk problem between adjacent light-emitting units.

[0022] Optionally, the orthographic projection of one end of the conductive unit facing away from the support pillar on the substrate is located within the orthographic projection of one end of the conductive unit facing the support pillar on the substrate. In this way, the conductive unit has relatively inclined side walls, so that the second electrode is deposited on the side walls of the conductive unit, thereby reducing the impedance at the connection between the second electrode and the conductive unit.

[0023] Optionally, a cross-sectional shape of the conductive unit along a direction perpendicular to the surface where the substrate is located is a regular trapezoid.

[0024] In a specific embodiment of the first aspect of the present disclosure, the conductive unit is located between the pixel defining layer and the substrate, the pixel defining layer defines a plurality of through holes corresponding to the conductive units to expose at least a portion of the conductive unit, and the second electrode is connected to a portion of the conductive unit that is not covered by the support column and the pixel defining layer in a surface facing away from the substrate. In this way, the height increase of the support column caused by the provision of the conductive structure layer can be avoided.

[0025] Optionally, the orthographic projection of one end of the support column facing the substrate on the substrate is located within the orthographic projection of one end of the support column facing away from the support column on the substrate. In this way, the support column can isolate part of the film layer in the light-emitting functional layer (for example, the film layer with light-emitting functionality) to alleviate the current crosstalk problem between adjacent light-emitting units.

[0026] Optionally, a cross-sectional shape of the support column in a direction perpendicular to the surface where the substrate is located is an inverted trapezoid.

[0027] Optionally, the pixel defining layer covers the edge of the conductive unit. Thus, in the actual process, even if the process precision factor causes an offset error in the formation position of the through hole and the conductive unit, it can be ensured that the through hole completely falls on the conductive unit to ensure the contact area between the second electrode and the conductive unit.

[0028] Optionally, the conductive unit is in the same layer and material as the first electrode, and is spaced apart from the first electrode. In this way, the provision of the conductive structure layer does not increase the manufacturing process of the display panel, thereby effectively controlling the manufacturing cost of the display panel.

[0029] In a specific embodiment of the first aspect of the present disclosure, the conductive structure layer is located on a side of the pixel defining layer facing away from the substrate; or, the pixel defining layer defines a through hole, and the conductive structure layer is located in the corresponding through hole.

[0030] Optionally, the conductive structure layer is a grid-shaped electrode, the meshes of the grid-shaped electrode correspond to the light-emitting units respectively, and the orthographic projection of the light-emitting unit on the substrate is located within the orthographic projection of the corresponding meshes on the substrate. In this way, the area of ​​the conductive structure layer can be increased to further alleviate the voltage drop problem generated when driving the second electrode.

[0031] Optionally, the display panel includes a plurality of support pillars spaced apart from each other, and at least a portion of the orthographic projection of the conductive structure layer on the substrate is located outside the orthographic projection of the support pillars on the substrate. In this way, the arrangement of the conductive structure layer will not affect the arrangement of the support pillars; in addition, when the conductive structure layer has a relatively large thickness (for example, substantially equal to the thickness of the support pillars), the support pillars can also be used to assist in supporting the mask plate in the evaporation process.

[0032] Optionally, the orthographic projection of the conductive structure layer on the substrate is outside the orthographic projection of the support pillar on the substrate.

[0033] Optionally, the conductive structure layer includes a support portion and a crown portion, the support portion is located between the crown portion and the substrate, and the orthographic projection of the support portion on the substrate is located within the orthographic projection of the crown portion on the substrate, and the second electrode is connected to the side wall of the support portion. In this way, the crown portion isolates part of the film layer in the light-emitting functional layer (for example, the film layer with light-emitting functionality) to alleviate the current crosstalk problem between adjacent light-emitting units.

[0034] Optionally, the conductive structure layer further includes an auxiliary support portion, the support portion is located between the crown portion and the auxiliary support portion, the orthographic projection of the support portion on the substrate is located within the orthographic projection of the auxiliary support portion on the substrate, and the second electrode is connected to a portion of the surface of the auxiliary support portion that is away from the substrate and is not covered by the support portion. In this way, the auxiliary support portion can increase the contact area between the conductive structure layer and the second electrode, and the surface of the auxiliary support portion that is away from the substrate is more conducive to the deposition of the second electrode relative to the side wall of the support portion, so as to further reduce the impedance between the conductive structure layer and the second electrode.

[0035] Optionally, the orthographic projection of the auxiliary support portion on the substrate is located within the orthographic projection of the crown portion on the substrate. In this way, the partition effect of the crown portion on a part of the film layer in the light-emitting functional layer (eg, the light-emitting functional film layer) can be further ensured.

[0036] In a specific implementation of the first aspect of the present disclosure, the display panel may further include a common electrode line and a switching line, the common electrode line is electrically connected to the second electrode, one end of the switching line is connected to the common electrode line, and the other end is connected to the conductive structure layer.

[0037] In the above solution, by providing a switching line, voltage can be directly supplied to the conductive structure layer, so that the voltage input position can also be distributed in the internal area of ​​the second electrode, thereby further alleviating the voltage drop problem when driving the second electrode.

[0038] Optionally, the conductive structure layer is located on a side of the pixel defining layer away from the substrate, a via is provided in the pixel defining layer, and the transfer line is connected to the conductive structure layer through the via.

[0039] Optionally, the conductive structure layer is located between the pixel defining layer and the substrate, or a through hole is provided in the pixel defining layer, and the conductive structure layer is located in the through hole. The adapter is located within the substrate, the substrate includes a flat layer, the flat layer is located between the adapter and the conductive structure layer, a via hole is provided in the flat layer, and the adapter is connected to the conductive structure layer through the via hole.

[0040] A second aspect of the present disclosure provides a display device, which includes the display panel in the first aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 A schematic diagram of a planar structure of a display panel provided in one embodiment of the present disclosure.

[0042] Figure 2 for Figure 1 An enlarged view of the S1 region of the display panel is shown.

[0043] Figure 3 for Figure 2 The display panel is shown in a cross-sectional view along M1 - N1 in a design structure.

[0044] Figure 4 for Figure 2 The cross-sectional view of the display panel along M1 - N1 in another design structure is shown.

[0045] Figure 5 for Figure 2 The cross-sectional view of the display panel along M1 - N1 in another design structure is shown.

[0046] Figure 6 for Figure 2 The cross-sectional view of the display panel along M1 - N1 in another design structure is shown.

[0047] Figure 7 for Figure 2The cross-sectional view of the display panel along M1 - N1 in another design structure is shown.

[0048] Figure 8 An enlarged view of a partial area of ​​a display panel provided by an embodiment of the present disclosure.

[0049] Fig. 9 for Figure 8 The display panel is shown in a cross-sectional view along M2 - N2 in a design structure.

[0050] Fig.10 for Figure 8 The display panel is shown in a cross-sectional view along M2 - N2 in another design structure.

[0051] Fig.11 for Figure 8 The display panel is shown in a cross-sectional view along M2 - N2 in another design structure.

[0052] Fig.12 for Figure 8 The display panel is shown in a cross-sectional view along M2 - N2 in another design structure.

[0053] Fig.13 A cross-sectional view of a partial area of ​​a display panel provided in an embodiment of the present disclosure.

[0054] Reference numerals:

[0055] 10-display panel; 11-display area; 12-frame area; 13-bonding area; 100-substrate; 110-flat layer; 200-light-emitting unit; 210-first electrode; 220-light-emitting functional layer; 230-second electrode; 300-conductive structure layer; 310-support part; 320-crown; 330-auxiliary support part; 400-pixel defining layer; 401-pixel opening; 402-through hole; 500-support column; 600-transfer wire; 700-common electrode line; 800-packaging structure; 810-first packaging layer; 820-second packaging layer; 830-third packaging layer. DETAILED DESCRIPTION

[0056] The following will be combined with the drawings in the embodiments of this specification to clearly and completely describe the technical solutions in the embodiments of this specification. Obviously, the described embodiments are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this specification.

[0057] In an OLED display panel, based on the requirement of light output, the thickness of the electrode on the light output side (such as the second electrode described below) is relatively thin so as to have a certain light transmittance, thereby achieving display. However, the limited thickness means that its resistivity is relatively high. When the electrode is driven, the voltage drop on the electrode will be relatively obvious, that is, the voltage (or level) of each area of ​​the electrode is quite different, which will not only lead to an increase in the driving voltage consumption, but also cause uneven distribution of the driving voltage of each OLED, thereby causing uneven brightness of the light output of the display panel.

[0058] At least one embodiment of the present disclosure provides a display panel and a display device to at least solve the above-mentioned problems. The display panel includes a substrate and a display function layer and a conductive structure layer located on the substrate. The display function layer is located on the substrate and includes a plurality of light-emitting units, the light-emitting units include a first electrode, a light-emitting function layer and a second electrode stacked in sequence on the substrate, the conductive structure layer is located on the substrate and connected to the second electrode, and the gaps between the light-emitting units are within the orthographic projection of the conductive structure layer on the substrate. In the above scheme, the conductive structure layer is connected to the second electrode, which can reduce the voltage drop when driving the second electrode, so that the voltage distribution on the second electrode is relatively uniform, thereby improving the display effect of the display panel.

[0059] The structure of the display panel and the display device in at least one embodiment of the present disclosure is described in detail below in conjunction with the accompanying drawings. In addition, in these drawings, a spatial rectangular coordinate system is established with the substrate as a reference to more intuitively present the positional relationship of the relevant structures in the display panel, and in the spatial rectangular coordinate system, the X-axis and the Y-axis are parallel to the surface where the substrate is located, and the Z-axis is perpendicular to the surface where the substrate is located.

[0060] like Figures 1 to 3 As shown, the plane area of ​​the display panel 10 can be divided into a display area 11 and a frame area 12 surrounding at least part of the display area 11. Sub-pixels (which can be called sub-pixels, etc.), such as R, G, and B sub-pixels, can be arranged in the display area 11. The physical structure of the sub-pixel can be a light-emitting unit, and the arrangement density of the sub-pixel in the display area 11 represents the pixel density PPI. It should be noted that in some embodiments of the present disclosure, part of the wiring in the frame area 12 (such as the common electrode line 700 mentioned below) can be arranged in the display area 11, so that the frame area 12 can be designed as a single-sided frame (after the side frame is bent, the display panel can be called a frameless panel).

[0061] The physical structure of the display panel 10 may include a substrate 100, and a display function layer and a conductive structure layer 300 located on the substrate 100. The display function layer is located on the substrate 100 and includes a plurality of light-emitting units 200, the light-emitting unit 200 includes a first electrode 210, a light-emitting function layer 220, and a second electrode 230 sequentially stacked on the substrate 100, the conductive structure layer 300 is located on the substrate 100 and connected to the second electrode 230, and the conductive structure layer 300 is arranged at the gap between the light-emitting units 200, that is, the orthographic projection of the conductive structure layer 300 on the substrate 100 is located within the orthographic projection of the gap between the light-emitting units 200 on the substrate 100.

[0062] The conductive structure layer 300 is arranged in the gap between the light-emitting units 200, and there is no requirement for light transmittance, so it can be designed to be of greater thickness and prepared using materials with high conductivity. In addition, voltage can also be passed to the second electrode 230 through the conductive structure layer 300. In this way, when the conductive structure layer 300 is connected to the second electrode 230, the conductive structure layer 300 can reduce the voltage drop when driving the second electrode 230, so that the voltage distribution on the second electrode 230 is relatively uniform, thereby improving the display effect of the display panel.

[0063] In at least one embodiment of the present disclosure, the square resistance of the conductive structure layer 300 is smaller than the square resistance of the second electrode 230. The conductive structure layer 300 is located at the gap between the light emitting units 200, so it is not limited by the material and can select a material with high conductivity.

[0064] "Sheet resistance" refers to the resistance characteristics of a film or thin layer of material, and is a parameter that describes the resistance of a film or thin layer of material. "Sheet resistance" is used to describe the resistance of a planar structure, such as a conductive film or metal film. The smaller the sheet resistance, the more conductive the film or thin layer of material. "Sheet resistance" is calculated as the ratio of the resistivity of a film or thin layer of material to the area of ​​the film or thin layer.

[0065] In at least one embodiment of the present disclosure, the thickness of the conductive structure layer 300 is greater than the thickness of the second electrode 230. Unlike the second electrode 230 which needs to have a relatively small thickness in consideration of light transmittance, the conductive structure layer 300 is located in the gap between the light-emitting units 200, so it can be designed to have a larger thickness to have a smaller resistivity, thereby further reducing the voltage drop when the second electrode 230 is driven.

[0066] It should be noted that the thickness of the conductive structure layer 300 being greater than the thickness of the second electrode 230 is a selective design, and in other embodiments, the thickness of the conductive structure layer 300 may be equal to or less than the thickness of the second electrode 230. For example, in a design scheme in which a voltage is applied to the second electrode 230 through the conductive structure layer 300, the conductive structure layer 300 is mainly used to introduce the voltage, and in this case, the thickness of the conductive structure layer 300 may be allowed to be reduced.

[0067] For example, in at least one embodiment of the present disclosure, the first electrode 210 may be provided as an anode, and the second electrode 230 may be provided as a cathode.

[0068] For example, the light-emitting functional layer 220 may further include a first functional layer 221, a light-emitting layer 222, and a second functional layer 223 sequentially stacked on the first electrode 210, and the first functional layer 221, the light-emitting layer 222, and the second functional layer 223 are sequentially stacked on the first electrode 210. The first functional layer 221 may include a hole injection layer, a hole transport layer, or an electron blocking layer, etc. The second functional layer 223 may include an electron injection layer, an electron transport layer, or a hole blocking layer, etc.

[0069] In an embodiment of the present disclosure, the substrate 100 may include a substrate and a driving circuit layer located on the substrate, the driving circuit layer includes a plurality of pixel driving circuits located in the display area, and the display function layer is located on the driving circuit layer. For example, the pixel driving circuit may include a plurality of transistors TFT, capacitors, etc., for example, formed in various forms such as 2T1C (i.e., 2 transistors (TFT) and 1 capacitor (C)), 3T1C or 7T1C. The pixel driving circuit is electrically connected to the light-emitting unit 200 to control the switching state and light brightness of the light-emitting unit 200.

[0070] In the embodiments of the present disclosure, other structures are arranged in the gaps between the light-emitting units. The arrangement in the gaps between the light-emitting units is described below to simultaneously describe the arrangement relationship of the conductive structure layer between the other structures in the gaps.

[0071] In at least one embodiment of the present disclosure, Figures 1 to 3 As shown, the display panel further includes a pixel defining layer 400 located on the substrate 100, and the pixel defining layer 400 includes a plurality of pixel openings 401, and the pixel openings 401 limit the light-emitting unit 200. The pixel defining layer 400 is used to limit the various film layers in the light-emitting unit 200 and define the light-emitting area of ​​the light-emitting unit 200. For example, the edge area of ​​the first electrode 210 of the light-emitting unit 200 is covered by the pixel defining layer 400, and the portion of the first electrode 210 exposed by the pixel opening 401 corresponds to the light-emitting area of ​​the light-emitting unit 200.

[0072] In the embodiment of the present disclosure, the conductive structure layer 300 may be disposed on the pixel defining layer 400, or disposed below the pixel defining layer 400, or disposed in the same layer as the pixel defining layer 400. It should be noted that in the embodiment of the present disclosure, the upper and lower relationship of the layers is related to the macroscopic overlapping positions of the layers. For example, in the case where the pixel defining layer covers the edge of the first electrode, even if the pixel defining layer does not cover most of the first electrode, it is considered that the layer where the pixel defining layer is located is located above the layer where the first electrode is located.

[0073] In addition, in at least one embodiment of the present disclosure, a support column may be provided in the gap between the light-emitting units, and the support column is used to support structures such as a mask plate during the process of evaporating the film layer in the light-emitting unit, so as to prevent these structures from scratching the surface of the display panel (the display side surface presented in the evaporation process, not the surface of the final product) and causing a defective light-emitting unit. In the embodiment of the present disclosure, the conductive structure layer can be located where the support column is located, or located outside the position where the support column is located.

[0074] Next, the structure of the display panel is further described with respect to different arrangement relationships among the conductive structure layer, the pixel defining layer and the support pillars.

[0075] In some embodiments of the present disclosure, Figures 2 to 4 As shown, the display panel further includes a plurality of support posts 500 spaced apart from each other, and the conductive structure layer 300 includes a plurality of conductive units spaced apart from each other, that is, the conductive structure layer 300 can be regarded as a structure with a dot matrix distribution. The conductive unit is located between the support post 500 and the substrate 100, so that the conductive unit is covered by the support post 500, so as not to affect the arrangement of other structures in the display panel (such as position, size, etc., such as the gap size between the light-emitting units 200); in addition, the arrangement can enable the conductive unit to support the support post 500, thereby increasing the design height of the support post 500, or reducing the thickness requirement of the film layer used to form the support post 500, so as to simplify the difficulty of the preparation process and reduce the preparation cost.

[0076] In some embodiments of the present disclosure, the number of conductive units of the conductive structure layer 300 may be the same as that of the supporting columns 500, so that the conductive units correspond one-to-one to the supporting columns 500; or, in other embodiments of the present disclosure, the number of conductive units is less than the number of supporting columns 500, so that the conductive units are located between the pixel defining layer 400 and part of the supporting columns 500.

[0077] It should be noted that when the film layer in the light-emitting unit 200 is evaporated, Figure 3 and Figure 4As shown, the edge of the surface of the support column 500 that is away from the substrate 100 may also be partially evaporated with material. If the distance between the support column 500 and the mask plate during the evaporation process is ignored, the surface of the support column 500 that is away from the substrate 100 may not be covered by the evaporated material.

[0078] In at least one embodiment of the present disclosure, Figures 2 to 4 As shown, the conductive structure layer 300 is located on a side of the pixel defining layer 400 away from the substrate 100 , and the second electrode 230 is connected to the side wall of the conductive unit of the conductive structure layer 300 .

[0079] For example, the orthographic projection of the conductive unit on the substrate 100 may be located within the orthographic projection of the corresponding support column 500 on the substrate 100. In this way, the support column 500 may isolate part of the film layer (e.g., the film layer with light-emitting functionality) in the light-emitting functional layer 220 to alleviate the current crosstalk problem between adjacent light-emitting units 200.

[0080] In at least one embodiment of the present disclosure, Figures 2 to 4 As shown, the orthographic projection of one end of the conductive unit facing away from the support pillar 500 on the substrate 100 is located within the orthographic projection of one end of the conductive unit facing the support pillar 500 on the substrate 100. In this way, the conductive unit has relatively inclined sidewalls, so that the second electrode 230 is deposited on the sidewalls of the conductive unit, thereby reducing the impedance at the connection between the second electrode 230 and the conductive unit.

[0081] In at least one embodiment of the present disclosure, Figures 2 to 4 As shown, the cross-sectional shape of the conductive unit in the direction perpendicular to the surface where the substrate 100 is located is a regular trapezoid. It should be noted that the conductive unit can be a single film layer structure, or the conductive unit can be composed of multiple different film layers, and the corrosion resistance of these film layers decreases in sequence along the direction from the substrate to the support column, so that the side wall of the conductive unit is formed into a stepped structure, and the stepped structure appears as the side of a regular trapezoid in a macroscopic sense.

[0082] In other embodiments of the present disclosure, Figure 5 As shown, the conductive structure layer 300 is located on the side of the pixel defining layer 400 away from the substrate 100, a portion of the surface of the conductive unit away from the substrate 100 is covered by the support column 500, and the second electrode 230 is connected to the side wall of the conductive unit and the portion of the surface of the conductive unit away from the substrate 100 that is not covered by the support column 500. Figure 3 and Figure 4 The sidewall of the conductive unit shown and the surface of the conductive unit facing away from the substrate 100 are more conducive to the deposition of the second electrode 230, thereby increasing the bonding area between the conductive unit and the second electrode 230 to further reduce the impedance at the connection between the second electrode 230 and the conductive unit.

[0083] For example, Figure 5 As shown, the orthographic projection of one end of the support column 500 facing the substrate 100 on the substrate 100 is located within the orthographic projection of one end of the support column 500 facing away from the support column 500 on the substrate 100. In this way, the support column 500 can isolate part of the film layer (e.g., the film layer with light-emitting functionality) in the light-emitting functional layer 220 to alleviate the current crosstalk problem between adjacent light-emitting units 200.

[0084] For example, Figure 5 As shown, the cross-sectional shape of the support column 500 in the direction perpendicular to the surface where the substrate 100 is located is an inverted trapezoid. It should be noted that the support column 500 may be a single film layer structure, or the support column 500 may be composed of a plurality of different film layers, and the corrosion resistance of the film layers increases in sequence along the direction from the substrate to the support column, so that the side wall of the conductive unit is formed into a stepped structure, and the stepped structure appears as the side of a regular trapezoid in macroscopic terms.

[0085] In other embodiments of the present disclosure, Figure 6 As shown, the pixel defining layer 400 defines a plurality of through holes 402 corresponding to the conductive units, and the conductive units are located in the corresponding through holes 402, that is, the conductive structure layer 300 and the pixel defining layer 400 are in the same layer. Under this design, the second electrode 230 is connected to the side wall of the conductive unit. In this way, the height increase of the support column 500 caused by the provision of the conductive structure layer 300 can be avoided. In addition, in this solution, the conductive unit can have a larger design thickness to further alleviate the voltage drop problem generated when driving the second electrode 230.

[0086] For example, Figure 6 As shown, the orthographic projection of the conductive unit on the substrate 100 is located within the orthographic projection of the corresponding support column 500 on the substrate 100. In this way, the support column 500 can isolate part of the film layer (e.g., the film layer with light-emitting functionality) in the light-emitting functional layer 220 to alleviate the current crosstalk problem between adjacent light-emitting units 200.

[0087] For example, Figure 6 As shown, the orthographic projection of the end of the conductive unit facing away from the support pillar 500 on the substrate 100 is located within the orthographic projection of the end of the conductive unit facing the support pillar 500 on the substrate 100. In this way, the conductive unit has a relatively inclined side wall, so that the second electrode 230 is deposited on the side wall of the conductive unit, thereby reducing the impedance of the connection between the second electrode 230 and the conductive unit. For example, the cross-sectional shape of the conductive unit along the direction perpendicular to the surface of the substrate 100 is a positive trapezoid.

[0088] In other embodiments of the present disclosure, Figure 7As shown, the conductive units of the conductive structure layer 300 are located between the pixel defining layer 400 and the substrate 100, and the pixel defining layer 400 defines a plurality of through holes 402 corresponding to the conductive units to expose at least part of the conductive units, that is, the conductive units of the conductive structure layer 300 can be completely located in the through holes 402, or can be as shown in FIG. Figure 7 As shown, the second electrode 230 is located between the pixel defining layer 400 and the substrate 100. In this design, the second electrode 230 is connected to the portion of the surface of the conductive unit that is away from the substrate 100 and is not covered by the support column 500 and the pixel defining layer 400. In this way, the height increase of the support column 500 caused by the provision of the conductive structure layer 300 can be avoided.

[0089] For example, Figure 7 As shown, the orthographic projection of one end of the support column 500 facing the substrate 100 on the substrate 100 is located within the orthographic projection of one end of the support column 500 facing away from the support column 500 on the substrate 100. In this way, the support column 500 can isolate part of the film layer (e.g., the film layer with light-emitting functionality) in the light-emitting functional layer 220 to alleviate the current crosstalk problem between adjacent light-emitting units 200.

[0090] For example, Figure 7 As shown, the cross-sectional shape of the support column 500 along the direction perpendicular to the surface where the substrate 100 is located is an inverted trapezoid.

[0091] For example, Figure 7 As shown, the pixel defining layer 400 covers the edge of the conductive unit. In this way, in the actual process, even if the process precision factor causes the formation position of the through hole 402 and the conductive unit to have an offset error, it can be ensured that the through hole 402 falls completely on the conductive unit to ensure the contact area between the second electrode 230 and the conductive unit.

[0092] For example, Figure 7 As shown, the conductive unit can be in the same layer and material as the first electrode 210, and can be spaced apart from the first electrode 210. In this way, the provision of the conductive structure layer 300 does not increase the manufacturing process of the display panel, thereby effectively controlling the manufacturing cost of the display panel.

[0093] In the embodiments of the present disclosure, “same layer and same material” means that two structures are formed from the same film layer through a patterning process, or two structures are formed simultaneously by film formation using the same material in one process.

[0094] In other embodiments of the present disclosure, Figures 8 to 12As shown, the conductive structure layer 300 may be located outside the support column 500. For example, the conductive structure layer 300 is located on the side of the pixel defining layer 400 away from the substrate 100; or, the pixel defining layer 400 defines a through hole 402, and the conductive structure layer 300 is located in the corresponding through hole 402. The structure of the display panel under this design is described below through several specific embodiments.

[0095] In at least one embodiment of the present disclosure, Figure 8 and Fig. 9 As shown, the conductive structure layer 300 is a grid-shaped electrode, the meshes of the grid-shaped electrode correspond to the light-emitting units 200, and the orthographic projection of the light-emitting unit 200 on the substrate 100 is located within the orthographic projection of the corresponding meshes on the substrate 100. In this way, the area of ​​the conductive structure layer 300 can be increased, and compared with the conductive structure layer 300 designed as a dot matrix, the voltage drop problem generated when driving the second electrode 230 can be further alleviated.

[0096] For example, Fig. 9 As shown, the display panel includes a plurality of support pillars 500 spaced apart from each other, and at least a portion of the orthographic projection of the conductive structure layer 300 on the substrate 100 is located outside the orthographic projection of the support pillars 500 on the substrate 100. In this way, the arrangement of the conductive structure layer 300 will not affect the arrangement of the support pillars 500; in addition, when the conductive structure layer 300 has a relatively large thickness (for example, substantially equal to the thickness of the support pillars 500), the support pillars 500 can also be assisted to play a role in assisting the support of the mask plate in the evaporation process.

[0097] For example, Fig. 9 As shown, the orthographic projection of the conductive structure layer 300 on the substrate 100 is located outside the orthographic projection of the support column 500 on the substrate 100 , that is, the conductive structure layer 300 and the support column 500 are located in different areas.

[0098] In some embodiments of the present disclosure, when the conductive structure layer 300 and the support pillar 500 are located in different regions, Fig. 9 As shown, the conductive structure layer 300 may be disposed on a side of the pixel defining layer 400 facing away from the substrate 100 .

[0099] In some other embodiments of the present disclosure, when the conductive structure layer 300 and the support pillar 500 are located in different regions, such as Fig.10As shown, the pixel defining layer 400 may be provided with a through hole 402 corresponding to the conductive structure layer 300, and at least a portion of the conductive structure layer 300 is located in the through hole 402. It should be noted that when the conductive structure layer 300 is a grid-like electrode, the through hole is also a grid-like structure. The specific arrangement of the conductive structure layer 300 in this case can refer to the relevant description in the above embodiment, and will not be repeated here.

[0100] In some other embodiments of the present disclosure, when the conductive structure layer 300 and the support pillar 500 are located in different regions, such as Fig.11 As shown, the pixel defining layer 400 may be provided with a through hole 402 corresponding to the conductive structure layer 300, and the conductive structure layer is located between the pixel defining layer 400 and the substrate 100, and corresponds to the through hole 402. It should be noted that when the conductive structure layer 300 is a grid-like electrode, the through hole 402 is also a grid-like structure. The specific arrangement of the conductive structure layer 300 in this case can refer to the relevant description in the above-mentioned embodiment, and will not be repeated here.

[0101] In at least one embodiment of the present disclosure, Fig. 9 , Fig.10 and Fig.12 As shown, the conductive structure layer 300 includes a support portion 310 and a crown portion 320, the support portion 310 is located between the crown portion 320 and the substrate 100, and the orthographic projection of the support portion 310 on the substrate 100 is located within the orthographic projection of the crown portion 320 on the substrate 100, and the second electrode 230 is connected to the side wall of the support portion 310. In this way, the crown portion 320 isolates part of the film layer in the light-emitting functional layer 220 (for example, the light-emitting functional layer 220 or the first functional layer included therein) to alleviate the current crosstalk problem between adjacent light-emitting units 200.

[0102] For example, Fig.10 and Fig.12 As shown, the conductive structure layer 300 further includes an auxiliary support portion 330, the support portion 310 is located between the crown portion 320 and the auxiliary support portion 330, the orthographic projection of the support portion 310 on the substrate 100 is located within the orthographic projection of the auxiliary support portion 330 on the substrate 100, and the second electrode 230 is connected to the portion of the surface of the auxiliary support portion 330 that is away from the substrate 100 and is not covered by the support portion 310. In this way, the auxiliary support portion 330 can increase the contact area between the conductive structure layer 300 and the second electrode 230, and the surface of the auxiliary support portion 330 that is away from the substrate 100 is more conducive to the deposition of the second electrode 230 relative to the sidewall of the support portion 310, so as to further reduce the impedance between the conductive structure layer 300 and the second electrode 230.

[0103] It should be noted that, when the auxiliary support portion 330 is provided and the through hole 402 is provided in the pixel defining layer 400, Fig.12 As shown, the auxiliary support portion 330 may be located between the pixel defining layer 400 and the substrate, and the support portion 310 and the crown portion 320 may be located in the through hole 402. For example, the auxiliary support portion 330 may be in the same layer and the same material as the first electrode 210.

[0104] For example, Fig.10 and Fig.12 As shown, the orthographic projection of the auxiliary support portion 330 on the substrate 100 is within the orthographic projection of the crown portion 320 on the substrate 100. In this way, the isolation effect of the crown portion 320 on a part of the film layer (such as the film layer with light-emitting function) in the light-emitting function layer 220 can be further ensured.

[0105] In at least one embodiment of the present disclosure, it is possible to refer to Figure 1 and Figure 4 The display panel may further include a common electrode line 700 and a switching line 600, wherein the common electrode line 700 is electrically connected to the second electrode 230, and one end of the switching line 600 is connected to the common electrode line 700, and the other end is connected to the conductive structure layer 300. Thus, by providing the switching line 600, a voltage may be directly supplied to the conductive structure layer 300, so that the voltage input position may also be distributed in the inner region of the second electrode 230, thereby further alleviating the voltage drop problem when driving the second electrode 230.

[0106] It should be noted that the adapter line 600 can be set in the substrate 100. For example, the adapter line 600 can be prepared simultaneously during the process of preparing the pixel driving circuit; or, the adapter line 600 can also be set on the surface of the substrate 100. The specific design can be based on the actual process requirements and is not limited here.

[0107] In at least one embodiment of the present disclosure, it is possible to refer to Figure 4 , Figure 5 and Figure 7 In the case where the conductive structure layer 300 is located on the side of the pixel defining layer 400 away from the substrate 100 , a via hole may be provided in the pixel defining layer 400 , and the transfer line 600 is connected to the conductive structure layer 300 through the via hole.

[0108] In at least one embodiment of the present disclosure, it is possible to refer to Figure 7 The substrate 100 includes a flat layer 110 , which is located between the adapter line 600 and the conductive structure layer 300 . A via is provided in the flat layer 110 , and the adapter line 600 is connected to the conductive structure layer 300 through the via.

[0109] In at least one embodiment of the present disclosure, Fig.13As shown, the display panel may further include a packaging structure 800 covering the display function layer (including the light-emitting unit 200), and the packaging structure 800 may include a first packaging layer 810, a second packaging layer 820 and a third packaging layer 830 sequentially stacked on the display function layer. The first packaging layer 810 and the third packaging layer 830 may be inorganic film layers to have high density to block the intrusion of water vapor, etc., and the second packaging layer 820 may be an organic film layer to have a large thickness so as to have a planarization function, so that the surface of the packaging structure 800 facing away from the substrate 100 is flat, thereby facilitating the preparation of other functional structures (such as a touch control structure, etc.).

[0110] For example, Fig.13 As shown, the encapsulation structure 800 covers the conductive structure layer 300 , that is, the light emitting unit 200 of the display function layer and the encapsulation structure 800 are located between the encapsulation structure 800 and the substrate 100 .

[0111] In the embodiments of the present disclosure, there is no limitation on the specific manufacturing process method of the display panel, and the method can be selected based on actual process requirements for the display panels of different structures shown in the above different embodiments.

[0112] For example, in one example, after forming a substrate 100 (which may be referred to as an array substrate), an array-distributed first electrode 210 (anode) may be formed on the substrate 100; then a pixel defining layer 400 may be formed, the pixel defining layer 400 may form a pixel opening 401 exposing the first electrode 210, and the pixel defining layer 400 may cover the edge region of the first electrode 210; a conductive structure layer 300 may be formed, and then a support column 500 may be formed on the conductive structure layer 300; then, a light-emitting functional layer 220 may be formed in the pixel opening 401, and a second electrode 230 (cathode) may be formed covering the pixel opening 401, the second electrode 230 may be connected to the conductive structure layer 300, and the first electrode 210, the light-emitting functional layer 220, and the second electrode 230 stacked at each pixel opening 401 may constitute a light-emitting unit 200; then, a packaging structure 800 may be formed covering the light-emitting unit 200, the conductive structure layer 300, and the support column 500. It should be noted that the display panel corresponding to the preparation process of this example may be as follows: Figures 3 to 6 As shown; In addition, in the preparation Figure 6 In the process of manufacturing the display panel shown, the through hole 402 can be formed simultaneously during the process of forming the pixel opening 401 , so as to be used for setting the conductive unit of the conductive structure layer 300 .

[0113] For example, in another example, after forming a substrate 100 (which may be referred to as an array substrate), an array-distributed first electrode 210 (anode) and a conductive structure layer 300 (including a plurality of conductive units) may be formed on the substrate 100; then a pixel defining layer 400 may be formed, the pixel defining layer 400 may form a pixel opening 401 exposing the first electrode 210 and a through hole 402 exposing the conductive unit of the conductive structure layer 300, and the pixel defining layer 400 may cover an edge region of the first electrode 210 and an edge region of the conductive unit; a support column 500 may be formed on the conductive structure layer 300; then, a light-emitting functional layer 220 may be formed in the pixel opening 401, and a second electrode 230 (cathode) may be formed covering the pixel opening 401, the second electrode 230 may be connected to the conductive structure layer 300, and the first electrode 210, the light-emitting functional layer 220 and the second electrode 230 stacked at each pixel opening 401 may constitute a light-emitting unit 200; then, a packaging structure 800 may be formed covering the light-emitting unit 200, the conductive structure layer 300 and the support column 500. It should be noted that the display panel corresponding to the preparation process of this example can be Figure 7 shown.

[0114] For example, in another example, after forming a substrate 100 (which may be referred to as an array substrate), an array-distributed first electrode 210 (anode) may be formed on the substrate 100; then a pixel defining layer 400 may be formed, the pixel defining layer 400 may form a pixel opening 401 exposing the first electrode 210, and the pixel defining layer 400 may cover an edge region of the first electrode 210; a conductive structure layer 300 may be formed, and a support column 500 may be formed on the pixel defining layer 400, and the order in which the conductive structure layer 300 and the support column 500 are formed is not limited; then, a light-emitting functional layer 220 may be formed in the pixel opening 401, and a second electrode 230 (cathode) may be formed covering the pixel opening 401, the second electrode 230 may be connected to the conductive structure layer 300, and the first electrode 210, the light-emitting functional layer 220, and the second electrode 230 stacked at each pixel opening 401 may constitute a light-emitting unit 200; then, a packaging structure 800 may be formed covering the light-emitting unit 200, the conductive structure layer 300, and the support column 500. It should be noted that the display panel corresponding to the preparation process of this example can be Fig. 9 and Fig.12 shown.

[0115] For example, in another example, after forming the substrate 100 (which may be referred to as an array substrate), the first electrode 210 (anode) distributed in an array and a portion of the conductive structure layer 300 (including a plurality of conductive units) (for example, the auxiliary support portion 330) may be formed on the substrate 100; then, when forming the pixel defining layer 400, the pixel defining layer 400 forms a pixel opening 401 exposing the first electrode 210 and a through hole 402 exposing the auxiliary support portion 330 of the conductive unit, and the pixel defining layer 400 covers the edge area of ​​the first electrode 210 and the edge area of ​​the auxiliary support portion 330; and the conductive structure layer 300 is formed. The other parts of the structural layer 300, such as the support portion 310, the crown portion 320, etc., are then formed on the pixel defining layer 400. The support column 500 is then formed; thereafter, a light-emitting functional layer 220 is formed in the pixel opening 401, and a second electrode 230 (cathode) covering the pixel opening 401 is formed, and the second electrode 230 is connected to the conductive structural layer 300. The first electrode 210, the light-emitting functional layer 220 and the second electrode 230 stacked at each pixel opening 401 constitute a light-emitting unit 200; then a packaging structure 800 covering the light-emitting unit 200, the conductive structural layer 300 and the support column 500 is formed. It should be noted that the display panel corresponding to the preparation process of this example can be as follows. Fig.10 and Fig.11 shown.

[0116] It should be noted that if the display panel finally formed by the demand is a hard screen design, the display panel can continue to be encapsulated with Frit (glass powder). In addition, in this design, more support columns 500 can be provided to improve the supporting effect.

[0117] At least one embodiment of the present disclosure provides a display device, which may be the display panel in the above embodiment. For example, the display device may include a touch structure, a cover plate, and other structures arranged on the light-emitting side of the display panel.

[0118] For example, the display device may be any product or component having a display function, such as a television, a digital camera, a mobile phone, a watch, a tablet computer, a notebook computer, a navigator, or the like.

[0119] The above description is only a preferred embodiment of this specification and is not intended to limit this specification. Any modifications, equivalent substitutions, etc. made within the spirit and principles of this specification should be included in the protection scope of this specification.

Claims

1. A display panel, characterized in that: include: substrate; A display function layer is located on the substrate and includes a plurality of light-emitting units, wherein the light-emitting units include a first electrode, a light-emitting function layer, and a second electrode sequentially stacked on the substrate; A conductive structure layer, located on the substrate and connected to the second electrode; The orthographic projection of the conductive structure layer on the substrate is within the orthographic projection of the gap between the light-emitting units on the substrate.

2. The display panel according to claim 1, characterized in that: The sheet resistance of the conductive structure layer is smaller than the sheet resistance of the second electrode; Preferably, the thickness of the conductive structure layer is greater than the thickness of the second electrode; Preferably, the display panel further comprises a pixel defining layer located on the substrate, the pixel defining layer comprises a plurality of pixel openings, and the pixel openings limit the light emitting units.

3. The display panel according to claim 2, characterized in that: It also includes a plurality of support pillars spaced apart from each other, wherein the conductive structure layer includes a plurality of conductive units spaced apart from each other, and The conductive unit is located between the support column and the substrate; Preferably, the conductive units correspond to the support pillars one by one; or Preferably, the number of the conductive units is less than the number of the supporting columns, and the conductive units are located between the pixel defining layer and a portion of the supporting columns.

4. The display panel according to claim 3, characterized in that: The conductive structure layer is located on a side of the pixel definition layer away from the substrate, and The second electrode is connected to a side wall of the conductive unit; Preferably, the orthographic projection of the conductive unit on the substrate is located within the orthographic projection of the corresponding support column on the substrate; Further preferably, the orthographic projection of one end of the conductive unit facing away from the support column on the substrate is located within the orthographic projection of one end of the conductive unit facing the support column on the substrate; Still further preferably, the cross-sectional shape of the conductive unit along a direction perpendicular to the surface where the substrate is located is a regular trapezoid.

5. The display panel according to claim 3, characterized in that: The conductive structure layer is located on a side of the pixel defining layer away from the substrate, a portion of a surface of the conductive unit away from the substrate is covered by the support column, and The second electrode is connected to the side wall of the conductive unit and a portion of the surface of the conductive unit facing away from the substrate and not covered by the supporting pillar; Preferably, the orthographic projection of one end of the support column facing the substrate on the substrate is located within the orthographic projection of one end of the support column facing away from the support column on the substrate; Further preferably, the cross-sectional shape of the support column along a direction perpendicular to the surface where the substrate is located is an inverted trapezoid.

6. The display panel according to claim 3, characterized in that: The pixel defining layer defines a plurality of through holes corresponding to the conductive units respectively, and the conductive units are located in the corresponding through holes, and The second electrode is connected to a side wall of the conductive unit; Preferably, the orthographic projection of the conductive unit on the substrate is located within the orthographic projection of the corresponding support column on the substrate; Further preferably, the orthographic projection of one end of the conductive unit facing away from the support column on the substrate is located within the orthographic projection of one end of the conductive unit facing the support column on the substrate; Still further preferably, the cross-sectional shape of the conductive unit along a direction perpendicular to the surface where the substrate is located is a regular trapezoid.

7. The display panel according to claim 3, characterized in that: The conductive unit is located between the pixel defining layer and the substrate, and The pixel defining layer defines a plurality of through holes respectively corresponding to the conductive units to expose at least a portion of the conductive units, and the second electrode is connected to a portion of the conductive unit that is not covered by the support column and the pixel defining layer and faces away from the substrate; Preferably, the orthographic projection of one end of the support column facing the substrate on the substrate is located within the orthographic projection of one end of the support column facing away from the support column on the substrate; Further preferably, the cross-sectional shape of the support column in a direction perpendicular to the surface where the substrate is located is an inverted trapezoid; Preferably, the pixel defining layer covers the edge of the conductive unit; Preferably, the conductive unit is in the same layer and made of the same material as the first electrode, and is spaced apart from the first electrode.

8. The display panel according to claim 2, characterized in that: The conductive structure layer is located on a side of the pixel definition layer away from the substrate; or The pixel defining layer defines a through hole, and the conductive structure layer is located in the corresponding through hole; Preferably, the conductive structure layer is a grid-shaped electrode, the meshes of the grid-shaped electrode correspond to the light-emitting units respectively, and the orthographic projection of the light-emitting unit on the substrate is located within the orthographic projection of the corresponding mesh on the substrate; Preferably, the display panel comprises a plurality of support pillars spaced apart from each other, and at least a portion of an orthographic projection of the conductive structure layer on the substrate is located outside the orthographic projection of the support pillars on the substrate; Further preferably, the orthographic projection of the conductive structure layer on the substrate is outside the orthographic projection of the support pillar on the substrate; Preferably, the conductive structure layer comprises a support portion and a crown portion, the support portion is located between the crown portion and the substrate, and the orthographic projection of the support portion on the substrate is located within the orthographic projection of the crown portion on the substrate, and the second electrode is connected to the side wall of the conductive structure layer; Further preferably, the conductive structure layer further comprises an auxiliary support portion, the support portion is located between the crown portion and the auxiliary support portion, the orthographic projection of the support portion on the substrate is located within the orthographic projection of the auxiliary support portion on the substrate, and the second electrode is connected to a portion of a surface of the auxiliary support portion that is away from the substrate and is not covered by the support portion; Still further preferably, the orthographic projection of the auxiliary supporting portion on the base plate is located within the orthographic projection of the crown portion on the base plate.

9. The display panel according to claim 2, characterized in that: It also includes a common electrode line and a switching line, wherein the common electrode line is electrically connected to the second electrode, one end of the switching line is connected to the common electrode line, and the other end is connected to the conductive structure layer; Preferably, the conductive structure layer is located on a side of the pixel defining layer away from the substrate, a via hole is provided in the pixel defining layer, and the adapter is connected to the conductive structure layer through the via hole; or Preferably, the conductive structure layer is located between the pixel defining layer and the substrate, or a through hole is provided in the pixel defining layer, and the conductive structure layer is located in the through hole, wherein the adapter is located within the substrate, the substrate includes a flat layer, the flat layer is located between the adapter and the conductive structure layer, a via hole is provided in the flat layer, and the adapter is connected to the conductive structure layer through the via hole.

10. A display device, characterized in that: A display panel comprising any one of claims 1 to 9.

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