Polygonal spin end coating method and equipment for chip component

Abstract

The invention provides a polygonal spin end coating method and equipment for a chip component, and the equipment comprises the following components: an X-axis transverse moving module which is installed at the top of a complete machine frame of the equipment and is connected with a whole Z-axis lifting mechanism below through an aluminum block and a sliding rail, so as to drive a Z-axis lifting platform deck to move left and right in the X-axis direction; meanwhile, the Y-axis slurry spreading silver disc is matched to perform Y-axis front and back movement, so that three-axis spiral end coating operation is realized; the X-axis transverse moving module comprises an X-axis transverse moving motor, the X-axis transverse moving motor is installed on the side of the X-axis transverse moving module and fixed through screws, and the X-axis transverse moving motor rotates to drive the X-axis transverse moving module to act so as to control the Z-axis lifting platform deck to move left and right in the X-axis direction and control the X-axis operation range and speed, so that the speed and position of the spiral coating end are controlled; and the Z-axis lifting platform deck is hoisted below the complete machine frame and above the Y-axis slurry spreading silver disc through a sliding rail, moves left and right through the sliding rail, and performs lifting action above the slurry spreading silver disc. The device can be used for smearing in any shape, and the top of a chip component product has no salient point and is flat.

Description

Technical Field

[0001] The invention relates to the technical field of end coating equipment, and in particular to a method and equipment for polygonal rotary end coating of a chip element. Background Art

[0002] Traditional coating equipment is a linear lifting mechanism, such as Figure 1 As shown, that is, Z axis + Y axis movement. First, the arranged chip components are extracted by clamping or adsorption, and then the chip components are immersed in the electronic paste for a certain period of time. After the immersion is completed, they are placed on the silver plate for scraping the electronic paste for air immersion treatment, and the electronic paste protruding from the top of the chip component end is taken away to complete the coating end, as shown in FIG. Figure 2 shown.

[0003] In the past, chip components were dipped into the electronic paste, lifted up, and then lowered onto a silver plate that scraped the electronic paste to remove excess electronic paste from the top of the product. The traditional process is vertical lifting and coating. During the air immersion, the silver plate can take away part of the paste on the top of the chip component, but there will still be a lot of electronic paste left, resulting in larger bumps on the top of the product, such as Figure 8 As shown. This will affect the welding effect of the product, and the product will have quality problems such as dents, pinholes, cracks, etc. after burning. Summary of the invention

[0004] The objectives of the present invention are achieved through the following technical solutions.

[0005] In the original mechanism, the present invention adds an X-axis on the basis of the original Z-axis + Y-axis, so that the equipment can complete various spin coating functions, including S-type spin coating, circular, polygonal, spiral type while rising and falling, etc. The polygonal spin coating end of the chip component solves the quality problems of the previous product top pointed, concave, convex and so on.

[0006] Specifically, the present invention provides a chip-type component polygonal rotary coating device, comprising the following components: The X-axis lateral movement module is installed on the top of the whole frame of the equipment, and is connected to the entire Z-axis lifting mechanism below through an aluminum block and a slide rail, thereby driving the Z-axis lifting platform to move left and right in the X-axis direction, and at the same time cooperates with the Y-axis slurry silver plate to move forward and backward in the Y-axis, thereby realizing the three-axis spiral coating operation; The X-axis lateral movement module includes an X-axis lateral movement motor, which is installed on the side of the X-axis lateral movement module and fixed by screws. The X-axis lateral movement motor rotates to drive the X-axis lateral movement module to move, so as to control the Z-axis lifting platform to move left and right along the X-axis, and control the operating range and speed of the X-axis, thereby controlling the speed and position of the spiral coating end; The Z-axis lifting platform is hoisted under the whole machine frame and above the Y-axis slurry spreading silver plate through a slide rail, and moves left and right through the slide rail to perform a lifting action above the slurry spreading silver plate.

[0007] Furthermore, the Z-axis lifting motor is installed on a fixed steel plate above the Z-axis lifting platform, and is connected to a belt using screws. The motor rotates the belt to drive the Z-axis lifting platform to perform lifting motion.

[0008] Furthermore, the chip component carrier is installed below the Z-axis lifting platform, and two chip component grippers are installed above the Z-axis platform. The chip component grippers are pushed by cylinders to open and close to take and place the chip component carrier.

[0009] Furthermore, the chip component gripper is installed above the Z-axis lifting platform, and a cylinder is fixed by screws, and the cylinder pushes the chip component gripper to move.

[0010] Furthermore, further comprising: The Y-axis slurry spreading silver plate is installed below the Z-axis lifting platform and above the whole machine panel of the equipment, and is connected to the whole machine panel through a slider.

[0011] Furthermore, further comprising: The Y-axis lateral movement motor is installed under the Y-axis slurry spreading silver plate and fixed by screws. The Y-axis lateral movement motor drives the Y-axis slurry spreading silver plate to move forward and backward.

[0012] According to another aspect, the present invention also provides a method for rotating the polygonal end of a chip component using the device, comprising: Inserting the chip component into the chip component carrier; Lay the electronic slurry at a preset height, the Z-axis lifting motor grabs the chip component carrier and lowers it, and immerses the chip component into the electronic slurry; When the chip component is coated for the second time and then dipped, during the rising process, the X-axis lateral movement module controls the Z-axis lifting platform to move left and right in the X-axis direction, and cooperates with the Y-axis slurry silver plate to move forward and backward in the Y-axis, thereby realizing the three-axis spiral coating operation.

[0013] Furthermore, during the three-axis spiral coating operation, the chip element performs polygonal displacement.

[0014] Furthermore, the polygonal displacement includes one or more of the following shapes: triangle, square, polygon, circle, spiral.

[0015] The invention has the advantages that when the chip component is coated and then subjected to secondary air immersion, the chip component is driven to perform polygonal displacement during the rising process, and the residual electronic paste on the top of the chip component is evenly and flatly applied. Any shapes such as triangle, square, polygon, circle, spiral, etc. can be applied, and the top of the chip component product has no convex points and is flat. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present invention. Moreover, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings: Figure 1 The schematic diagram of the coating end equipment structure in the prior art is shown.

[0017] Figure 2 The figure shows the working process of the coating end equipment in the prior art.

[0018] Figure 3 A front view of the structure of a polygonal spin coating device for chip-type components according to an embodiment of the present invention is shown.

[0019] Figure 4 A side view of a chip-type component polygonal spin-coating tip device structure according to an embodiment of the present invention is shown.

[0020] Figure 5 An exploded view of a chip-type component polygonal spin-coating tip device structure according to an embodiment of the present invention is shown.

[0021] Figure 6 A schematic diagram of the structure of a chip component carrier according to an embodiment of the present invention is shown.

[0022] Figure 7 A schematic diagram of a polygonal spin coating process for a chip element according to an embodiment of the present invention is shown.

[0023] Figure 8 A schematic diagram showing conventional vertical lifting resulting in page drawing.

[0024] Fig. 9 A schematic diagram showing the effect of adding a spiral trowel system according to an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0025] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0026] The present invention adds an X-axis to the original mechanism on the basis of the original Z-axis + Y-axis, and can complete various spin coating functions, including S-type spin coating, circular, polygonal, spiral type while rising and falling, etc. The polygonal spin coating end of the chip component solves the quality problems of previous products such as pointed heads, depressions, and protrusions on the top.

[0027] According to an embodiment of the present invention, a polygonal spin coating device for chip components is provided, such as Figure 3-5 As shown, it includes the following components: Z-axis lifting motor: Installed on the fixed steel plate above the Z-axis lifting platform, connected with the belt by screws, the motor rotates the belt to drive the Z-axis lifting platform to move up and down. This controls the Z-axis lifting platform to coat products at different heights, and also controls the coating at different speeds.

[0028] Chip component carrier: Installed below the Z-axis lifting platform, two chip component grippers are installed above the Z-axis platform, and the cylinder pushes the chip component grippers to open and close to take and place the chip component carrier. Its structure is as follows Figure 6 As shown, the fixed chip component is used, and the chip component is inserted into the carrier in the previous process. During the coating operation, the equipment grabs the entire carrier for coating.

[0029] Chip component gripper: Installed above the Z-axis lifting platform, the cylinder is fixed by screws, and the cylinder pushes the gripper to move. The chip component gripper is used to fix the chip component carrier. After the chip component carrier is fixed, the Z-axis lifting motor performs a lifting action to coat the chip component.

[0030] X-axis lateral movement module: installed on the top of the whole machine frame, connected to the entire Z-axis lifting mechanism below through an aluminum block and a slide rail, thereby driving the Z-axis lifting platform to move left and right in the X-axis direction, and at the same time cooperate with the Y-axis slurry silver plate to move forward and backward in the Y-axis, thereby realizing 3-axis spiral coating operation.

[0031] The X-axis lateral movement motor is installed on the side of the X-axis lateral movement module and fixed by screws. The motor rotates to drive the X-axis lateral movement module to move. The servo motor controls the left and right movement of the X-axis lateral movement module, thereby controlling the X-axis operating range and speed, and controlling the speed and position of the spiral coating end with higher precision.

[0032] Z-axis lifting platform: hoisted under the whole machine frame, above the Y-axis slurry silver plate, connected to the hoist through the slide rail, moved left and right through the slide rail, and performed lifting and lowering movements above the slurry silver plate. The Z-axis lifting platform fixes the chip component gripper and the chip component carrier to perform coating operations, and is connected to the Z-axis lifting motor, which controls its lifting and lowering movements.

[0033] Y-axis slurry silver plate: installed below the Z-axis lifting platform and above the whole machine panel, connected by a slider, used for slurry laying, and can move back and forth. The silver plate carries electronic slurry on top and can move back and forth to lay electronic slurry at different heights. After laying the electronic slurry at a specified height, the Z-axis lifting motor grabs the chip component carrier and descends to immerse the chip component in the electronic slurry.

[0034] Y-axis traverse motor: Installed under the Y-axis slurry silver plate, fixed by screws, the Y-axis traverse motor drives the Y-axis slurry silver plate to move forward and backward. The Y-axis traverse motor controls the Y-axis running speed and position through the servo, thereby controlling the speed and position of the spiral coating end with higher precision.

[0035] Figure 7 A schematic diagram of a polygonal spin coating process for a chip element according to an embodiment of the present invention is shown. Figure 8 A schematic diagram showing conventional vertical lifting resulting in page drawing. Fig. 9 The schematic diagram of the effect of adding a spiral smoothing system according to an embodiment of the present invention is shown. When the chip component is coated and then subjected to secondary air immersion, the chip component is driven to perform polygonal displacement through the cooperation of the XYZ axis during the rising process, and the residual electronic paste on the top of the chip component is evenly and flatly applied. Any shapes such as triangles, squares, polygons, circles, spirals, etc. can be applied, and the top of the chip component product has no convex points and is flat. The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the present invention should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A polygonal rotary coating device for chip components, characterized in that: It includes the following components: The X-axis lateral movement module is installed on the top of the whole machine frame of the equipment, and is connected to the Z-axis lifting mechanism below through an aluminum block and a slide rail, thereby driving the Z-axis lifting platform to move left and right in the X-axis direction, and at the same time cooperates with the Y-axis slurry silver plate to move forward and backward in the Y-axis, thereby realizing the three-axis spiral coating operation; The X-axis lateral movement module includes an X-axis lateral movement motor, which is installed on the side of the X-axis lateral movement module and fixed by screws. The X-axis lateral movement motor rotates to drive the X-axis lateral movement module to move, so as to control the Z-axis lifting platform to move left and right along the X-axis, and control the operating range and speed of the X-axis, thereby controlling the speed and position of the spiral coating end; The Z-axis lifting platform is hoisted under the whole machine frame and above the Y-axis slurry spreading silver plate through a slide rail, and moves left and right through the slide rail to perform a lifting action above the slurry spreading silver plate.

2. The chip component polygonal rotary coating device according to claim 1, characterized in that: The Z-axis lifting motor is installed on a fixed steel plate above the Z-axis lifting platform and is connected to a belt using screws. The Z-axis lifting motor rotates the belt to drive the Z-axis lifting platform to perform lifting motion.

3. The chip component polygonal rotary coating device according to claim 1 or 2, characterized in that: Further including: The chip component carrier is installed under the Z-axis lifting platform.

4. The chip component polygonal rotary coating device according to claim 3, characterized in that: Further including: Two chip component grippers are installed above the Z-axis lifting platform and fixed with a cylinder by screws. The cylinder pushes the chip component grippers to open and close to take and place the chip component carrier.

5. The chip component polygonal rotary coating device according to any one of claims 1 to 4, characterized in that: Further including: The Y-axis slurry spreading silver plate is installed below the Z-axis lifting platform and above the whole machine panel of the equipment, and is connected to the whole machine panel through a slider.

6. The chip component polygonal rotary coating device according to claim 5, characterized in that: Further including: The Y-axis lateral movement motor is installed under the Y-axis slurry spreading silver plate and fixed by screws. The Y-axis lateral movement motor drives the Y-axis slurry spreading silver plate to move forward and backward.

7. A method for polygonal spin coating of chip components using the device according to any one of claims 1 to 6, characterized in that: include: Inserting the chip component into the chip component carrier; The electronic slurry of a preset height is laid on the Y-axis slurry laying silver plate, and the Z-axis lifting motor grabs the chip component carrier and lowers it, and immerses the chip component into the electronic slurry; When the chip component is coated for the second time and then dipped, during the rising process, the X-axis lateral movement module controls the Z-axis lifting platform to move left and right in the X-axis direction, and cooperates with the Y-axis slurry silver plate to move forward and backward in the Y-axis, thereby realizing the three-axis spiral coating operation.

8. The method for polygonal spin coating of chip components according to claim 7, characterized in that: During the three-axis spiral coating operation, the chip element undergoes polygonal displacement.

9. The method for polygonal spin coating of chip components according to claim 8, characterized in that: The polygonal displacement includes one or more of the following shapes: triangle, square, polygon, circle, spiral.

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