Micro-contact silver-plated ceramic chip conduction detection device and system

Abstract

The utility model relates to the technical field of ceramic chip detection, in particular to a micro-contact silver-plated ceramic chip conduction detection device, which comprises a base, a clamp and a probe fixing piece, a detection part for placing a silver-plated ceramic chip to be detected and a fixing part for fixing the clamp are formed on the base, the detection part is provided with a first probe and a second probe, and the first probe and the second probe are arranged on the base. A third probe and a fourth probe are arranged on one side of the probe fixing piece, the other side of the probe fixing piece is fixed to the clamping end of the clamp, and the clamping end of the clamp is located above the detection part; according to the device, the four probes in the device can be connected with a low-resistance measuring instrument by adopting a Kelvin four-wire method so as to detect the conduction performance of the silver-plated ceramic chip, so that the good conduction performance between the front surface and the back surface of the silver-plated ceramic chip can be detected, and the problems existing in the silver plating process can be reflected in time.

Description

TECHNICAL FIELD

[0001] The utility model relates to ceramic sheet detection technical field, in particular to a kind of micro contact silver-plated ceramic sheet conduction detection device and system. BACKGROUND

[0002] With the continuous progress of silver plating technology, its application range has far exceeded the traditional surface protection and decoration field, and focuses on its functional performance in electronic industry, military technology, aerospace and other key fields, such as wear resistance, excellent conductivity, high-efficiency light reflectivity and excellent corrosion resistance. In particular, when silver plating technology is applied to ceramic materials, this innovation not only greatly expands the application scope of ceramic materials, but also gives rise to a large number of in-depth researches on silver plating process and subsequent quality detection technology.

[0003] However, it is worth noting that although many researchers have made significant progress in optimizing silver plating process in recent years, the detection technology research of silver-plated ceramic sheet is relatively lagging behind. For example, the patent application with publication number CN208818732U in the prior art mainly focuses on the conduction performance test of piezoelectric ceramic, and does not propose an effective conduction detection method or device for the special needs of silver-plated ceramic sheet.

[0004] In addition, the current process standard has clear requirements for the thickness and hardness of single-layer silver plating and other key parameters. In the process of silver plating of ceramic sheet, especially when the silver plating contact area is small, the plating layer is prone to incomplete coverage, silver plating fracture and other quality problems. Due to the limitation of contact area, these subtle defects make the existing detection method face challenges in detecting the conduction between the two layers of silver-plated ceramic sheet with micro contact silver plating, and it is difficult to accurately capture the possible problems in silver plating process. UTILITY MODEL CONTENT

[0005] Therefore, it is necessary to provide a micro contact silver-plated ceramic sheet conduction detection device and system to solve the problem that the conduction performance of micro contact silver-plated ceramic sheet cannot be detected at present.

[0006] In the first aspect, the present application provides a micro contact silver-plated ceramic sheet conduction detection device. The device comprises a base, a clamp and a probe fixing piece, the base is formed with a detection part for placing the silver-plated ceramic sheet to be tested and a fixing part for fixing the clamp, the detection part is provided with a first probe and a second probe, one side of the probe fixing piece is provided with a third probe and a fourth probe, the other side of the probe fixing piece is fixed to the clamping end of the clamp, and the clamping end of the clamp is located above the detection part.

[0007] Further, the detection part is provided with a groove, and the groove is provided with a first probe mounting hole and a second probe mounting hole.

[0008] Further, the detection part is provided with a step for placing the silver-plated ceramic wafer to be detected.

[0009] Further, the detection part is provided with an opening in the horizontal direction and in the vertical direction.

[0010] Further, the first probe, the second probe, the third probe and the fourth probe are telescopic probes.

[0011] Further, the clamp is a double-end vertical quick clamp.

[0012] Further, the probe fixing member is a PCB fixing plate.

[0013] Further, the fixing part comprises a plurality of fixing holes for fixing the clamp.

[0014] Further, the material of the base is polytetrafluoroethylene.

[0015] In a second aspect, the application provides a micro-contact silver-plated ceramic wafer conduction detection system. The system comprises the micro-contact silver-plated ceramic wafer conduction detection device of the first aspect and a low resistance measuring instrument, and the four probes in the micro-contact silver-plated ceramic wafer conduction detection device are connected to the low resistance measuring instrument.

[0016] The micro-contact silver-plated ceramic wafer conduction detection device and system described above, by providing the first probe and the second probe on the detection part of the base, and by fixing the third probe and the fourth probe on the clamping end of the clamp through the probe fixing member, when the silver-plated ceramic wafer to be detected is placed on the detection part, the first probe and the second probe can contact one side of the silver-plated ceramic wafer to be detected, then by moving the clamp, the third probe and the fourth probe can contact the other side of the silver-plated ceramic wafer to be detected, then by connecting the four probes to the low resistance measuring instrument using the Kelvin four-wire method, the conduction performance of the silver-plated ceramic wafer can be detected; the device can detect the conduction performance between the front and back surfaces of the silver-plated ceramic wafer, so as to reflect the problems existing in the silver-plating process in time. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 FIG. 1 is a structural schematic diagram of the micro-contact silver-plated ceramic wafer conduction detection device in one embodiment;

[0018] Figure 2 FIG. 2 is a base structure top view in one embodiment;

[0019] Figure 3 FIG. 3 is a side view of the micro-contact silver-plated ceramic wafer conduction detection device in actual measurement in one embodiment;

[0020] Figure 4A base size diagram in one embodiment;

[0021] Figure 5 A front view of a silver-plated ceramic wafer to be tested in one embodiment is placed on the left side of the groove in the micro-contact silver-plated ceramic wafer conduction detection device;

[0022] Figure 6 A front view of a silver-plated ceramic wafer to be tested in one embodiment is placed on the right side of the groove in the micro-contact silver-plated ceramic wafer conduction detection device;

[0023] Figure 7 A structure diagram of a micro-contact silver-plated ceramic wafer conduction detection system in one embodiment;

[0024] BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Base 1; clamp 2; probe fixing part 3; first probe 4; second probe 5; third probe 6; fourth probe 7; silver-plated ceramic wafer to be tested 8; detection part 11; fixing part 12; groove 111; first probe mounting hole 112; second probe mounting hole 113; step 114; opening 115; fixing hole 121. DETAILED DESCRIPTION

[0026] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application will be described in detail below with reference to the drawings. In the following description, many specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0027] Embodiment 1

[0028] Reference Figures 1 to 3 , Figure 1 A structure diagram of a micro-contact silver-plated ceramic wafer conduction detection device in one embodiment of the present application is shown, which includes a base, a clamp and a probe fixing part. The base forms a detection part for placing a silver-plated ceramic wafer to be tested and a fixing part for fixing the clamp. The detection part is provided with a first probe and a second probe. One side of the probe fixing part is provided with a third probe and a fourth probe. The other side of the probe fixing part is fixed to the clamping end of the clamp, and the clamping end of the clamp is located above the detection part.

[0029] Among them, the base is made of polytetrafluoroethylene material, which has good insulation, high temperature resistance, low temperature resistance and chemical corrosion resistance. Figure 2 A top view of the base is shown, as Figure 2 indicated, the base forms a detection part for placing a silver-plated ceramic wafer and a fixing part for fixing a clamp.

[0030] In particular, the first probe and the second probe can be telescopic probes, and a groove is designed in the detection part to match the telescopic probe, so that only a part of the telescopic probe is exposed. When the telescopic probe is contacted, a part of it will be retracted back, thereby ensuring good contact. Specifically, a first probe mounting hole and a second probe mounting hole are provided in the groove, which are used to install the first probe and the second probe respectively. Furthermore, the detection part is also provided with a step, and the design of the step serves to support and fix the silver-plated ceramic piece to be tested. In addition, the detection part is also provided with openings in the vertical direction and the horizontal direction for facilitating the picking up and moving of the silver-plated ceramic piece.

[0031] The clamp is a double-headed vertical quick clamp, which is fixed to the base through multiple fixing holes provided on the fixing part, and the clamping end of the clamp is located above the detection part.

[0032] Preferably, the probe holder is a PCB fixing plate. The third and fourth probes can be directly welded to the side of the PCB fixing plate facing the detection unit. The other side of the PCB fixing plate facing away from the detection unit can be fixed to the clamping end of the fixture using bolts or other fasteners to achieve the third and fourth probes being fixed to the clamping end of the fixture, ensuring stability and reliability during the detection process. Furthermore, the third and fourth probes can both be telescopic probes.

[0033] The positions of the third and fourth probes on the PCB mounting plate can be changed. If the silver coating position on one side of the silver-plated ceramic piece changes, continuity testing can be performed on the piece simply by changing the positions of the third and fourth probes on the PCB mounting plate. Furthermore, the probe mounting member can be made not only of the PCB mounting plate but also of the same Teflon material as the base or other insulating materials.

[0034] During the test, the wrench on the fixture can be moved. When the wrench is in the vertical position, such as Figure 3 As shown, the first and second probes can contact one side of the silver-plated ceramic sheet under test, while the third and fourth probes can contact the other side. After connecting the first, second, third, and fourth probes, the low resistance meter can measure the resistance of the silver plating between the upper and lower layers of the ceramic sheet. After the measurement is completed, the wrench is moved away from the probes to disconnect the third and fourth probes from the silver-plated ceramic sheet under test.

[0035] The micro-contact silver-plated ceramic sheet conduction detection device of the embodiment is provided with a first probe and a second probe on the detection part of the base, a third probe and a fourth probe are fixed on the clamping end of the clamp through a probe fixing piece, when the silver-plated ceramic sheet to be detected is placed on the detection part, the first probe and the second probe can contact one side of the silver-plated ceramic sheet to be detected, then the third probe and the fourth probe can contact the other side of the silver-plated ceramic sheet to be detected by moving the clamp, then the four probes are connected with a low resistance measuring instrument by using the Kelvin four-wire method, and the conduction performance of the silver-plated ceramic sheet can be detected; the device can detect the conduction performance between the front and back surfaces of the silver-plated ceramic sheet, so that problems existing in the silver-plating process can be reflected in time.

[0036] Embodiment 2

[0037] Figure 4 The size of the base in the embodiment of the utility model is shown in detail, as shown in Figure 4 The overall size of the base is 140mm in length and 100mm in width, and the opening on the base is 10mm in width. The first probe hole mounting hole and the second probe hole mounting hole are arranged close to each other, the centers of the two mounting holes are located on the center line of the horizontal opening of the base, and the distance between the two mounting holes and the edge of the base is 42.5mm. The vertical projection of the centers of the third probe and the fourth probe on the groove of the base is located on the center line along the length direction of the base, and is spaced apart from the centers of the first probe and the second probe by 17mm. At the same time, the vertical projection is 20.7mm away from the radius of the side of the step close to the inside of the groove, and is 23.7mm away from the radius of the side of the step away from the inside of the groove. The fixing part of the base includes four fixing holes, the four fixing holes are arranged in a rectangular array, the distance between the two fixing holes in the horizontal direction is 34mm, and the distance between the two fixing holes in the vertical direction is 24mm. The radius of the fixing hole is 4mm, and the diameter of the fixing hole is 8mm.

[0038] The base can measure the conduction of silver plating of the silver-plated ceramic sheet to be detected at two positions at the same time. Specifically, the silver-plated ceramic sheet to be detected can be moved horizontally in the detection part of the base to change the detection position. For example, when the silver-plated ceramic sheet to be detected is placed in the position as shown in Figure 5 , the resistance value of the silver plating between the upper and lower layers at the current position of the ceramic sheet to be detected can be measured; when the silver-plated ceramic sheet to be detected is placed in another position as shown in Figure 6 , the resistance value of the silver plating between the upper and lower layers at the other position of the ceramic sheet to be detected can also be measured. Thus, the conduction of silver plating at two positions of the silver-plated ceramic sheet to be detected is measured by translating the silver-plated ceramic sheet to be detected, and the reliability of the detection result is further improved. In addition, when the silver-plated ceramic sheet to be detected is of different shapes, the person skilled in the art can change the groove size and the position of the probe mounting hole according to the shape of the silver-plated ceramic sheet to be detected to ensure the detection effect.

[0039] Embodiment 3

[0040] Referring to Figure 7 , Figure 7 The utility model discloses a micro contact silver plated ceramic sheet conduction detection system's structure diagram, and the system includes micro contact silver plated ceramic sheet conduction detection device and low resistance measuring instrument.

[0041] Specifically, the low resistance measuring instrument adopts Kelvin four-wire connection method, and the resistance value between the front and back surfaces of the ceramic sheet is measured by connecting four probes in the micro contact silver plated ceramic sheet conduction detection device. Among them, Kelvin four-wire method is to measure resistance value through line contact, which can prevent the occurrence of poor contact. In actual operation, after the silver plated ceramic sheet to be measured is placed in the detection part on the base, the wrench on the clamp is pulled, when the contacts of the four probes simultaneously contact the silver plated ceramic sheet to be measured, the low resistance measuring instrument will obtain the resistance value between the silver plated positions. By comparing and analyzing the measured resistance value, whether the conduction performance of the silver plated layer is good can be accurately judged. Generally speaking, the higher the conduction rate of silver plating is, the smaller the resistance is, and the stronger the current conduction ability is.

[0042] The micro contact silver plated ceramic sheet conduction detection system of the embodiment can avoid the occurrence of poor contact by using the low resistance measuring instrument to connect the four probes in the micro contact silver plated ceramic sheet conduction detection device to detect the conduction of the silver plated ceramic sheet, thereby improving the efficiency and reliability of detection.

[0043] The technical features of the above-described embodiments can be combined arbitrarily, and to make the description concise, all possible combinations of the technical features in the above-described embodiments are not described, however, as long as the combination of the technical features does not exist contradictory, it should be considered as the scope of the present application.

[0044] The above-described embodiments only express several implementation manners of the utility model, and the description is more specific and detailed, but it should not be understood as the limitation of the scope of the utility model patent. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the utility model, a number of modifications and improvements can be made, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent should be subject to the appended claims.

Claims

1. A micro contact silver plated ceramic sheet conduction detection device, characterized in that, The device comprises a base, a clamp and a probe fixing member, the base is formed with a detection part for placing a silver-plated ceramic piece to be tested and a fixing part for fixing the clamp, the detection part is provided with a first probe and a second probe, one side of the probe fixing member is provided with a third probe and a fourth probe, the other side of the probe fixing member is fixed to a clamping end of the clamp, and the clamping end of the clamp is located above the detection part.

2. The micro contact silver plated ceramic sheet conduction detection device according to claim 1, wherein, The detection part is provided with a groove, and the groove is provided with a first probe mounting hole and a second probe mounting hole.

3. The micro contact silver plated ceramic sheet conduction detection device according to claim 2, characterized in that, The detection part is provided with a step for supporting the silver-plated ceramic piece to be tested.

4. The micro contact silver plated ceramic sheet conduction detection device according to claim 3, characterized in that, The detection part is provided with an opening in the horizontal direction and in the vertical direction.

5. The micro contact silver plated ceramic sheet conduction detection device according to claim 1, wherein, The first probe, the second probe, the third probe and the fourth probe are all telescopic probes.

6. The micro contact silver plated ceramic sheet conduction detection device according to claim 1, wherein, The clamp is a double-end vertical type quick clamp.

7. The micro contact silver plated ceramic sheet conduction detection device according to claim 1, wherein, The probe fixing member is a PCB fixing plate.

8. The micro contact silver plated ceramic sheet conduction detection device according to claim 1, wherein, The fixing part comprises a plurality of fixing holes for fixing the clamp.

9. The micro contact silver plated ceramic sheet conduction detection device according to claim 1, wherein, The material of the base is polytetrafluoroethylene.

10. A micro contact silver plated ceramic sheet conduction detection system, characterized in that, The device comprises a micro-contact silver-plated ceramic piece conduction detection device and a low resistance measuring instrument, and four probes in the micro-contact silver-plated ceramic piece conduction detection device are connected to the low resistance measuring instrument. The device comprises a base, a clamp and a probe fixing member, the base is formed with a detection part for placing a silver-plated ceramic piece to be tested and a fixing part for fixing the clamp, the detection part is provided with a first probe and a second probe, one side of the probe fixing member is provided with a third probe and a fourth probe, the other side of the probe fixing member is fixed to a clamping end of the clamp, and the clamping end of the clamp is located above the detection part. The detection part is provided with a groove, and the groove is provided with a first probe mounting hole and a second probe mounting hole. The detection part is provided with a step for supporting the silver-plated ceramic piece to be tested. The detection part is provided with an opening in the horizontal direction and in the vertical direction. The first probe, the second probe, the third probe and the fourth probe are all telescopic probes. The clamp is a double-end vertical type quick clamp. The probe fixing member is a PCB fixing plate. The fixing part comprises a plurality of fixing holes for fixing the clamp. The material of the base is polytetrafluoroethylene. The device comprises a micro-contact silver-plated ceramic piece conduction detection device and a low resistance measuring instrument, and four probes in the micro-contact silver-plated ceramic piece conduction detection device are connected to the low resistance measuring instrument.

Images