Laser drilling method based on automobile millimeter wave radar circuit board

Abstract

The invention relates to the technical field of circuit board processing, in particular to a laser drilling method based on an automobile millimeter wave radar circuit board, which is characterized in that a cover cylinder used for absorbing harmful gas can move up and down, in the drilling process, the cover cylinder moves downwards to be attached to a circuit board body, the harmful gas is prevented from being diffused into a lower case, and after drilling is completed, the cover cylinder is attached to the circuit board body; the cover cylinder moves upwards to be far away from the circuit board body, and then harmful gas suction operation is carried out, so that the problems of laser beam refraction and scattering caused by harmful gas suction in real time in the drilling process are effectively avoided; a laser drilling device based on an automobile millimeter wave radar circuit board comprises a laser transmitter, an electric push rod, a cover cylinder, a pipeline and a driving assembly. The upper case is connected with a driving assembly; the driving assembly is connected with a laser transmitter; a plurality of electric push rods are fixedly connected to the laser transmitter; the telescopic ends of all the electric push rods are jointly and fixedly connected with a cover cylinder, and the cover cylinder is slidably connected with the laser transmitter.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing, and more specifically, to a laser drilling method based on a circuit board of an automobile millimeter wave radar. Background Art

[0002] When drilling holes in a circuit board, the circuit board needs to be fixed in a laser drilling machine first, and then the laser drilling machine is used to drill holes in the circuit board. During the drilling process, harmful gases are generated when the laser burns through the circuit board. In the prior art, an exhaust fan is provided on the laser drilling machine to remove the harmful gases. However, since the hole diameter of the drilled hole is usually less than one millimeter, that is, the amount of the laser burning through the circuit board is relatively small, the amount of harmful gases generated is small, and a small amount of harmful gases is distributed in the large space inside the laser drilling machine, resulting in the exhaust fan needing to consume a lot of power to completely remove the harmful gases, wasting energy and being inefficient. If a cover is set outside the laser transmitter and an exhaust fan is connected to the cover, the harmful gas generated by drilling will first be dispersed into the small space inside the cover. At this time, the exhaust fan only needs to use a small power to remove the harmful gas, thereby improving efficiency. During this process, in order to prevent the harmful gas from flowing from the small space inside the cover into the large space inside the laser drilling machine, the exhaust fan should be turned on in real time. This will result in the airflow carrying harmful gases and particulate impurities through the laser path under the laser transmitter during the drilling process, causing the laser beam to refract and scatter, thereby interfering with the drilling operation. Summary of the invention

[0003] In order to overcome the disadvantage that when a cover is used to extract harmful gases in the prior art, the airflow will carry harmful gases and particulate impurities through the laser path below the laser transmitter, thereby causing refraction and scattering of the laser beam, thereby interfering with the drilling operation, the present invention provides a laser drilling method based on an automotive millimeter wave radar circuit board.

[0004] The technical scheme is as follows: a laser drilling method based on an automotive millimeter-wave radar circuit board, the laser drilling method based on an automotive millimeter-wave radar circuit board is based on a laser drilling device, the laser drilling device includes a lower chassis, an upper chassis and a receiving plate; the lower chassis is fixedly connected to the upper chassis; the lower chassis is fixedly connected to the receiving plate; it also includes a laser emitter, an electric push rod, a cover tube, a pipeline and a driving assembly; the upper chassis is connected to the driving assembly; the driving assembly is connected to the laser emitter; the driving assembly is used to drive the laser emitter to move forward, backward, left and right; a plurality of electric push rods are fixedly connected to the laser emitter; the telescopic ends of all the electric push rods are commonly fixedly connected to the cover tube, and the cover tube is slidably connected to the laser emitter; the cover tube is connected to a plurality of pipelines; The laser drilling method based on the automotive millimeter wave radar circuit board comprises the following steps: Step 1: Establish a model. Based on the drill bit's physical parameters such as diameter, blade angle, chip removal angle, vibration frequency, amplitude, etc., apply wave theory and vibration principles to quantify the propagation law of ultrasonic longitudinal waves in the drill bit and establish a theoretical model of high-frequency substrate drilling force. Step 2: Simulation, using LS-Dyna and other software to build a three-dimensional dynamic model, combined with finite element simulation technology, to accurately simulate the drilling process; Step 3: Optimization, using a combination of theoretical models and simulation models to optimize the drilling method and improve drilling efficiency and accuracy; Step 4: Lower the cover tube to cover the circuit board body, so that a closed processing cavity is formed between the laser emitter, the cover tube and the circuit board body, and use the laser drilling device to drill the circuit board body. After the drilling is completed, the harmful gas in the cover tube is extracted through the pipeline; Step 5: Testing: testing the hole diameter and hole wall roughness of the small holes in the circuit board body.

[0005] Preferably, the cover tube is made of low light-transmittance material.

[0006] Preferably, a sealing ring is provided between the upper end of the cover tube and the laser emitter.

[0007] Preferably, the driving assembly includes an electric slide rail 1, an electric slider 1, an electric slide rail 2 and an electric slider 2; a plurality of electric slide rails 1 are fixedly connected to the upper chassis; an electric slider 1 is slidably connected to each electric slide rail 1; all electric sliders 1 are commonly fixedly connected to an electric slide rail 2; an electric slider 2 is slidably connected to the electric slide rail 2, and the electric slider 2 is fixedly connected to the laser emitter.

[0008] Preferably, a rubber ring is also included; a rubber ring is arranged at the lower end of the cover tube.

[0009] Preferably, a circular ring is also included; the circular ring is fixedly connected to the lower end of the cover tube.

[0010] Preferably, a frame is also included; the receiving plate is connected to the frame.

[0011] Preferably, the receiving plate is detachably connected to the frame.

[0012] Preferably, heat dissipation holes are provided on the lower chassis.

[0013] Preferably, a transparent door is provided on the upper chassis.

[0014] Compared with the prior art, the present invention has the following advantages: 1. The hood used to absorb harmful gases is set to be movable up and down. During the drilling process, the hood moves downward to fit the circuit board body to prevent harmful gases from diffusing into the lower chassis. After the drilling is completed, the hood moves upward away from the circuit board body. At this time, the harmful gas suction operation is performed, thereby effectively avoiding the problem of laser beam refraction and scattering caused by real-time suction of harmful gases during the drilling process; Second, the cavity between the laser emitter, the cover tube and the circuit board body is sealed by a rubber ring. Before the cover tube moves upward, the cavity is first pumped to a negative pressure state through a pipeline. At the moment when the electric push rod drives the cover tube to move upward, the air inside the lower chassis can immediately overflow into the inner side of the cover tube from the gap between the cover tube and the circuit board body, which can effectively prevent the harmful gas on the inner edge of the cover tube from escaping to the inner side of the lower chassis, which is beneficial to improve the harmful gas absorption rate. At the same time, by setting a circular ring at the lower end of the cover tube, at the moment when the cover tube moves upward, even if a small amount of harmful gas inside the cover tube escapes outward, it will first escape into the gap between the circular ring and the circuit board body, and then be brought back to the inner side of the cover tube by the air, effectively preventing the harmful gas from flowing into the inner side of the lower chassis; 3. By setting a frame on the outside of the circuit board body, when the drilling position is located at the edge of the circuit board body, a closed cavity is formed between the laser emitter, the cover tube, the circuit board body and the frame, thereby avoiding the problem that the opening formed at the edge of the cover tube and the circuit board body causes harmful gases generated by the drilling to flow into the inner side of the lower chassis from the opening. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic structural diagram of the laser drilling device of the present invention is shown; Figure 2 A schematic diagram of the structure of the inner side of the upper chassis of the present invention is shown; Figure 3 The present invention is shown Figure 2 The enlarged view of point A in the middle; Figure 4 The structural schematic diagram of the cover tube of the present invention is shown; Figure 5 The schematic diagram of the structure of the rubber ring and the circular ring of the present invention is shown; Figure 6 The schematic diagram of the structure of the frame of the present invention is shown.

[0016] Explanation of the reference numerals: 1-lower chassis, 2-upper chassis, 3-supporting plate, 4-laser transmitter, 5-electric push rod, 6-cover tube, 7-pipeline, 8-circuit board body, 201-electric slide rail 1, 202-electric slider 1, 203-electric slide rail 2, 204-electric slider 2, 205-rubber ring, 206-ring, 207-frame. DETAILED DESCRIPTION

[0017] The following descriptions are merely preferred embodiments of the present invention and are not intended to limit the protection scope of the present invention.

[0018] Example 1 A laser drilling method based on an automotive millimeter wave radar circuit board, the laser drilling method based on an automotive millimeter wave radar circuit board is based on a laser drilling device, such as Figure 1-Figure 5 As shown, the laser drilling device includes a lower chassis 1, an upper chassis 2 and a receiving plate 3; the lower chassis 1 is bolted with the upper chassis 2, and both the lower chassis 1 and the upper chassis 2 are set to metal materials; the lower chassis 1 is bolted with the receiving plate 3; it also includes a laser emitter 4, an electric push rod 5, a cover tube 6, a pipe 7 and a drive assembly; the upper chassis 2 is connected to the drive assembly; the laser emitter 4 is connected to the drive assembly; two electric push rods 5 are bolted to the laser emitter 4; the telescopic ends of all the electric push rods 5 are fixedly connected to the cover tube 6, and the cover tube 6 is slidably connected to the laser emitter 4; two pipes 7 are connected and fixedly connected to the cover tube 6, and the pipes 7 can be set to metal materials or plastic materials; The laser drilling method based on the automotive millimeter wave radar circuit board comprises the following steps: Step 1: Establish a model. Based on the drill bit's physical parameters such as diameter, blade angle, chip removal angle, vibration frequency, amplitude, etc., apply wave theory and vibration principles to quantify the propagation law of ultrasonic longitudinal waves in the drill bit and establish a theoretical model of high-frequency substrate drilling force. Step 2: Simulation, combining finite element simulation technology, using LS-Dyna and other software to build a three-dimensional dynamic model to accurately simulate the drilling process; Step 3: Optimization, using a combination of theoretical models and simulation models to optimize the drilling method and improve drilling efficiency and accuracy; Step 4: lower the cover tube 6 to cover the circuit board body 4, so that a closed processing cavity is formed between the laser emitter 4, the cover tube 6 and the circuit board body 8, and use a laser drilling device to drill the circuit board body 8. After the drilling is completed, the harmful gas in the cover tube 6 is extracted through the pipeline 7; Step 5: Testing: testing the hole diameter and hole wall roughness of the small holes of the circuit board body 8.

[0019] The cover tube 6 is made of a low light-transmitting material to shield the laser, making it easier for humans to observe the drilling position.

[0020] A sealing ring is provided between the upper end of the cover tube 6 and the laser emitter 4 to improve the sealing performance.

[0021] The driving assembly includes an electric slide rail 1 201, an electric slider 1 202, an electric slide rail 2 203 and an electric slider 2 204; two electric slide rails 1 201 are bolted to the upper chassis 2; each electric slide rail 1 201 is slidably connected to an electric slider 1 202; all electric sliders 1 202 are fixedly connected to the electric slide rail 2 203; the electric slide rail 2 203 is slidably connected to the electric slider 2 204, and the electric slider 2 204 is fixedly connected to the laser emitter 4.

[0022] First, connect the external suction pipe to the pipeline 7. Before drilling, start the electric push rod 5. The electric push rod 5 drives the cover tube 6 to move downward so that the lower end of the cover tube 6 contacts the circuit board body 8. At this time, a closed cavity is formed between the laser emitter 4, the cover tube 6 and the circuit board body 8. The output end of the laser emitter 4 is located in the closed cavity. Then the laser emitter 4 emits a vertically downward laser beam to burn through the circuit board body 8 to complete the drilling operation. The harmful gases generated in the process of burning through the circuit board body 8 are dispersed in the closed cavity. Then the electric push rod 5 drives the cover tube 6 to move upward back to its original position to form a gap between the lower end of the cover tube 6 and the circuit board body 8. At the same time, the pipeline 7 is sucked through the external suction pipe, so that the air inside the lower chassis 1 flows into the inside of the cover tube 6 from the gap between the cover tube 6 and the circuit board body 8, and then flows into the external suction pipe from the pipeline 7, thereby dispersing the harmful gases dispersed in the cover tube. 6, the harmful gas in the external suction pipe stops suction, the electric slide rail 1 201, the electric slider 1 202, the electric slide rail 203 and the electric slider 204 are started, the electric slider 204 moves left and right on the electric slide rail 203, and the electric slider 1 202 moves back and forth on the electric slide rail 1 201, thereby driving the laser emitter 4 to move in the horizontal direction, so that the laser emitter 4 moves to the next punching position, and then repeats the above operation to perform the next drilling operation. When in use, the cover tube 6 for sucking out the harmful gas is set to be movable up and down. During the drilling process, the cover tube 6 moves downward to fit the circuit board body 8 to prevent the harmful gas from diffusing into the lower chassis 1. After the drilling is completed, the cover tube 6 moves upward away from the circuit board body 8. At this time, the harmful gas suction operation is performed again, thereby effectively avoiding the problem of laser beam refraction and scattering caused by real-time suction of harmful gases during the drilling process.

[0023] Example 2 On the basis of Example 1, Figure 4 and Figure 5 As shown, a rubber ring 205 is also included; a rubber ring 205 is provided at the lower end of the cover tube 6 to improve the sealing between the cover tube 6 and the circuit board body 8.

[0024] It also includes a circular ring 206; the circular ring 206 is welded to the lower end of the cover tube 6.

[0025] After the drilling is completed, the moment the cover cylinder 6 moves upward and away from the circuit board body 8, the harmful gas gathered at the inner edge of the cover cylinder 6 will escape to the inner side of the lower chassis 1, and the harmful gas escaped on the inner side of the lower chassis 1 is difficult to be absorbed. Therefore, a rubber ring 205 is arranged under the cover cylinder 6. When the cover cylinder 6 moves downward and approaches the circuit board body 8 to prepare for drilling, the gap between the cover cylinder 6 and the circuit board body 8 is blocked by the rubber ring 205. Before the cover cylinder 6 moves upward, the external suction pipe evacuates the pipe 7, so that part of the gas inside the cover cylinder 6 flows into the external suction pipe through the pipe 7, so that the inside of the cover cylinder 6 is in a negative pressure state, and then the cover cylinder 6 is driven to move upward by the electric push rod 5. At the moment when the cover cylinder 6 moves upward and away from the circuit board body 8, since the inside of the cover cylinder 6 is in a negative pressure state, The air inside the lower chassis 1 immediately overflows into the inner side of the cover tube 6 from the gap between the cover tube 6 and the circuit board body 8, which can effectively prevent the harmful gas at the inner edge of the cover tube 6 from escaping to the inner side of the lower chassis 1. The external suction pipe continuously evacuates the pipe 7, thereby completely removing the harmful gas inside the cover tube 6. When in use, the cavity between the laser emitter 4, the cover tube 6 and the circuit board body 8 is sealed by the rubber ring 205. Before the cover tube 6 moves upward, the cavity is first evacuated to a negative pressure state through the pipe 7. At the moment when the electric push rod 5 drives the cover tube 6 to move upward, the air inside the lower chassis 1 can immediately overflow into the inner side of the cover tube 6 from the gap between the cover tube 6 and the circuit board body 8, which can effectively prevent the harmful gas at the inner edge of the cover tube 6 from escaping to the inner side of the lower chassis 1, which is beneficial to improving the harmful gas removal rate.

[0026] After the inner side of the cover cylinder 6 is evacuated to negative pressure, the electric push rod 5 drives the cover cylinder 6 to move upward. At the moment when the cover cylinder 6 moves upward and away from the circuit board body 8, even if a small amount of harmful gas escapes outward from the inner side of the cover cylinder 6, the harmful gas will first escape into the gap between the ring 206 and the circuit board body 8. Since the inner side of the cover cylinder 6 is in a negative pressure state, the air inside the lower chassis 1 will also flow into the inner side of the cover cylinder 6 from the gap between the ring 206 and the circuit board body 8, and then drive the harmful gas in the gap between the ring 206 and the circuit board body 8 to flow into the inner side of the cover cylinder 6, effectively preventing the harmful gas from flowing into the inner side of the lower chassis 1. When in use, by setting the ring 206 at the lower end of the cover cylinder 6, at the moment when the cover cylinder 6 moves upward, even if a small amount of harmful gas escapes outward from the inner side of the cover cylinder 6, it will first escape into the gap between the ring 206 and the circuit board body 8, and then be brought back to the inner side of the cover cylinder 6 by the air, effectively preventing the harmful gas from flowing into the inner side of the lower chassis 1.

[0027] Example 3 On the basis of Example 2, Figure 2 and Figure 6 As shown, a frame 207 is also included; the receiving plate 3 is connected to the frame 207, and the edge of the circuit board body 8 is extended by the frame 207.

[0028] The receiving plate 3 is detachably connected to the frame 207 , and the frame 207 can be replaced according to the specifications of the circuit board body 8 .

[0029] The lower chassis 1 is provided with heat dissipation holes for heat dissipation.

[0030] A transparent door is provided on the upper chassis 2 to facilitate manual observation of the drilling operation.

[0031] When the drilling position is located at the edge of the circuit board body 8, after the cover tube 6 moves downward and contacts the circuit board body 8, an opening is formed at the edge of the cover tube 6 and the circuit board body 8, causing the harmful gas generated by the drilling to flow into the inner side of the lower chassis 1 from the opening. Therefore, when clamping the circuit board body 8, the circuit board body 8 is fixed on the inner side of the frame 207, the frame 207 is tightly fitted with the circuit board body 8, and the upper side of the frame 207 is flush with the upper side of the circuit board body 8. When the drilling position is located at the edge of the circuit board body 8, after the cover tube 6 moves downward and contacts the circuit board body 8, the laser A closed cavity is formed between the emitter 4, the cover tube 6, the circuit board body 8 and the frame 207, and the harmful gas generated by drilling is located in the closed cavity and will not flow into the inner side of the lower chassis 1. When in use, the frame 207 is arranged on the outer side of the circuit board body 8, so that when the drilling position is located at the edge of the circuit board body 8, a closed cavity is formed between the laser emitter 4, the cover tube 6, the circuit board body 8 and the frame 207, thereby avoiding the problem that the harmful gas generated by drilling flows into the inner side of the lower chassis 1 from the opening formed at the edge of the cover tube 6 and the circuit board body 8.

[0032] The above description is only an example of the present invention and is not intended to limit the present invention. Any equivalent substitutions made within the principles of the present invention should be included in the protection scope of the present invention. The contents not elaborated in detail in the present invention belong to the existing technologies known to those skilled in the art.

Claims

1. A laser drilling method based on an automotive millimeter wave radar circuit board, the laser drilling method based on an automotive millimeter wave radar circuit board is based on a laser drilling device, and is characterized in that: The laser drilling device comprises a lower chassis (1), an upper chassis (2) and a receiving plate (3); the lower chassis (1) is fixedly connected to the upper chassis (2); the lower chassis (1) is fixedly connected to the receiving plate (3); the device also comprises a laser emitter (4), an electric push rod (5), a cover tube (6), a pipe (7) and a drive assembly; the upper chassis (2) is connected to the drive assembly; the laser emitter (4) is connected to the drive assembly; the drive assembly is used to drive the laser emitter (4) to move forward, backward, leftward and rightward; the laser emitter (4) is fixedly connected to a plurality of electric push rods (5); the telescopic ends of all the electric push rods (5) are fixedly connected to the cover tube (6), and the cover tube (6) is slidably connected to the laser emitter (4); the cover tube (6) is connected to a plurality of pipes (7); The laser drilling method based on the automotive millimeter wave radar circuit board comprises the following steps: Step 1: Establish a model. Based on the drill bit's physical parameters such as diameter, blade angle, chip removal angle, vibration frequency, amplitude, etc., apply wave theory and vibration principles to quantify the propagation law of ultrasonic longitudinal waves in the drill bit and establish a theoretical model of high-frequency substrate drilling force. Step 2: Simulation, using LS-Dyna and other software to build a three-dimensional dynamic model, combined with finite element simulation technology, to accurately simulate the drilling process; Step 3: Optimization, using a combination of theoretical models and simulation models to optimize the drilling method and improve drilling efficiency and accuracy; Step 4: lowering the cover tube (6) to cover the circuit board body (4), so that a closed processing cavity is formed between the laser emitter (4), the cover tube (6) and the circuit board body (8), and drilling is performed on the circuit board body (8) using a laser drilling device. After the drilling is completed, the harmful gas in the cover tube (6) is extracted through the pipe (7); Step 5: Testing: testing the hole diameter and hole wall roughness of the small holes in the circuit board body (8).

2. A laser drilling method based on an automotive millimeter wave radar circuit board according to claim 1, characterized in that: The cover tube (6) is made of a low light-transmittance material.

3. The laser drilling method based on the automotive millimeter wave radar circuit board according to claim 1 is characterized in that: A sealing ring is provided between the upper end of the cover tube (6) and the laser emitter (4).

4. A laser drilling method based on an automotive millimeter wave radar circuit board according to claim 3, characterized in that: The driving assembly comprises an electric slide rail 1 (201), an electric slider 1 (202), an electric slide rail 2 (203) and an electric slider 2 (204); a plurality of electric slide rails 1 (201) are fixedly connected to the upper chassis (2); each electric slide rail 1 (201) is slidably connected to an electric slider 1 (202); all electric sliders 1 (202) are commonly fixedly connected to an electric slide rail 2 (203); an electric slider 2 (204) is slidably connected to the electric slide rail 2 (203), and the electric slider 2 (204) is fixedly connected to the laser emitter (4).

5. The laser drilling method based on the automotive millimeter wave radar circuit board according to claim 4 is characterized in that: It also includes a rubber ring (205); the lower end of the cover tube (6) is provided with the rubber ring (205).

6. The laser drilling method based on the automotive millimeter wave radar circuit board according to claim 5 is characterized in that: It also includes a circular ring (206); the circular ring (206) is fixedly connected to the lower end of the cover tube (6).

7. The laser drilling method based on the automotive millimeter wave radar circuit board according to claim 6 is characterized in that: It also includes a frame (207); the frame (207) is connected to the receiving plate (3).

8. The laser drilling method based on the automotive millimeter wave radar circuit board according to claim 7 is characterized in that: The receiving plate (3) is detachably connected to the frame (207).

9. The laser drilling method based on the automotive millimeter wave radar circuit board according to claim 8, characterized in that: The lower chassis (1) is provided with heat dissipation holes.

10. A laser drilling method based on an automotive millimeter wave radar circuit board according to any one of claims 1 to 9, characterized in that: The upper chassis (2) is provided with a transparent door.

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