Accurate displacement laser bonding method, system, device, equipment and medium

By using the combination of adsorption fixtures, visual alignment control, height measurement laser and piezoelectric ceramic displacement sensor in the laser bonding system, the problem that multi-layer bonding in traditional glass welding cannot achieve accurate alignment and focal consistency is solved, and high-quality and high-stability laser bonding is achieved.

CN120192084APending Publication Date: 2025-06-24SHENZHEN INTE LASER TECH
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Patent Information

Application Number
CN202510196430.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-02-21
Publication Date
2025-06-24

AI Technical Summary

Technical Problem

In traditional glass welding, due to uneven surfaces between welding components and moving parts, multi-layer bonding cannot achieve accurate alignment and focal consistency.

Method used

The laser bonding method based on adsorption fixture and visual alignment control is adopted. By measuring the coordination of the laser and piezoelectric ceramic displacement sensor, the laser focus position is adjusted in real time to ensure the accurate alignment and focal consistency of the samples to be bonded.

Benefits of technology

It significantly improves the quality and stability of laser bonding, reduces errors caused by surface unevenness or material thickness changes, improves welding consistency and reliability, and enhances the system's adaptability and production efficiency.

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Abstract

The invention relates to the technical field of laser bonding, in particular to a precise-displacement laser bonding method, system, device, equipment and medium, and the method comprises the steps: fixing to-be-bonded samples based on an adsorption jig, the to-be-bonded samples including a first to-be-bonded sample and a second to-be-bonded sample; based on visual alignment, controlling the first to-be-bonded sample and the second to-be-bonded sample to carry out alignment lamination; controlling a height measurement laser emitter to emit height measurement laser to the alignment surface of the to-be-bonded sample; identifying reflected laser for height measurement, and calculating the fitting height of the to-be-bonded sample at the current reflection point position based on the reflected laser; and controlling a piezoelectric ceramic displacement sensor to move an optical element based on the lamination height, adjusting the position of a laser focus of bonding laser, and carrying out laser bonding on the to-be-bonded sample. According to the invention, the welding error caused by the uneven surface of the to-be-bonded sample or the material thickness change in the laser bonding process can be reduced.
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Citation Information

Cited By

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