Composite polishing machining device and method for sealing surface

Abstract

The invention relates to a composite polishing device and method for a sealing surface, the device comprises an electrolyte tank, and electrolyte is contained in the electrolyte tank; the polishing platform is movably arranged in the electrolyte; the at least one material carrying disc is movably arranged in the electrolyte, and the material carrying disc and the polishing platform are oppositely arranged; a positive electrode and a negative electrode of the electrolytic machining power supply are electrically connected with the material loading disc and the polishing platform respectively; during machining, the to-be-machined sealing face of a workpiece loaded on the material loading disc makes contact with the polishing platform, the material loading disc and the polishing platform are driven respectively so that the workpiece and the polishing platform can rotate oppositely, and meanwhile the electrolytic machining power source is turned on so that a circuit can be switched on, and the sealing face of the workpiece can be polished and machined. The invention further discloses a composite polishing machining method for the sealing face. The purposes of high machining precision, good machining flexibility and stable and controllable machining process can be achieved.

Description

Technical Field

[0001] The invention relates to the technical field of precision machining, and in particular to a sealing surface composite polishing machining device and a method thereof. Background Art

[0002] With the rapid development of modern industry, the use environment of sealing surfaces is becoming more and more demanding, such as high temperature, low temperature, high pressure, high vacuum, large size, micro size, etc., as well as the sealing problems of various flammable, explosive, toxic, highly corrosive media and media containing suspended particles such as mud and sand, which put forward higher requirements on the sealing surface. Therefore, the processing quality of the sealing surface determines the service life and sealing performance of the seal, which directly affects the stability, reliability and service life of the sealing system.

[0003] Excellent processing technology is an effective means to ensure the processing accuracy and surface quality of the sealing surface. At present, the main processing methods for sealing surfaces include grinding, lapping, electrochemical polishing and other processes. Among them, grinding can basically meet the processing accuracy and surface quality of the sealing surface, but the grinding heat generated when processing difficult-to-cut and high-temperature resistant materials will be concentrated in the processing area, affecting the processing quality of the sealing surface. Grinding is the use of grinding tools and free abrasives to apply a certain pressure on the surface of the workpiece and remove the protrusions on the processing surface through relative movement, so as to improve the surface accuracy of the sealing surface and reduce the surface roughness of the sealing surface. However, for the processing of large or small sealing surfaces, there are problems such as low processing efficiency and poor surface quality stability. Electrochemical polishing is a process method that relies on the principle of electrochemical anodic dissolution to remove materials and achieve surface finishing of the workpiece. Electrochemical polishing has the characteristics of being independent of the mechanical properties of the workpiece material, free of burrs, good surface quality, no recast layer and microcracks, etc. It is suitable for precision machining of sealing surfaces. However, there are many uncontrollable factors in the electrochemical polishing process, which can easily cause uneven removal of surface material and introduce new errors that affect the machining accuracy of the sealing surface, making it difficult to obtain an ideal polishing effect. Summary of the invention

[0004] Therefore, the object of the present invention is to provide a sealing surface composite polishing processing device and method with high processing accuracy, good processing flexibility, and stable and controllable processing.

[0005] The present invention achieves the above-mentioned object through the following technical solutions.

[0006] In the first aspect, the present invention provides a sealing surface composite polishing processing device, comprising: an electrolyte tank containing electrolyte; a polishing platform, the polishing platform is movably arranged in the electrolyte tank; at least one loading tray, the loading tray is movably arranged in the electrolyte tank, and the loading tray is arranged opposite to the polishing platform; an electrolytic machining power supply, the positive and negative electrodes of the electrolytic machining power supply are electrically connected to the loading tray and the polishing platform respectively; during machining, the sealing surface to be machined of the workpiece loaded on the loading tray is contacted with the polishing platform, and the loading tray and the polishing platform are driven respectively to make the workpiece and the polishing platform rotate in opposite directions, and at the same time, the electrolytic machining power supply is turned on to conduct the circuit and polish the sealing surface of the workpiece.

[0007] In some embodiments, a magnetic field generating component is also included, and the magnetic field generating component includes an N-pole magnet, an S-pole magnet and a magnetic field excitation source. The N-pole magnet and the S-pole magnet are respectively arranged on two sides outside the electrolyte tank, and the positive pole and the negative pole of the magnetic field excitation source are respectively electrically connected to the N-pole magnet and the S-pole magnet; during processing, the magnetic field excitation source is turned on to generate a magnetic field in the electrolyte tank.

[0008] In some embodiments, the magnetic field generating assembly further includes a magnetic field regulator; during processing, the magnetic field regulator is used to adjust the direction and magnitude of the magnetic field.

[0009] In some embodiments, magnetic abrasive particles are provided in the electrolyte.

[0010] In some embodiments, at least one workpiece is loaded in the loading tray.

[0011] In some embodiments, a groove is provided on the carrier tray, at least one of the workpieces is disposed in the groove, the workpiece has a concave cavity, and paraffin is disposed in the groove and the concave cavity.

[0012] In some embodiments, the polishing platform includes a rotating platform and a polishing pad fixed on the rotating platform, and the polishing pad and the rotating platform are provided with communicating spiral grooves.

[0013] In some embodiments, an electrolyte circulation pipeline is further included, one end of which is connected to the bottom of the electrolyte tank, the other end of which is provided with a nozzle, and the electrolyte circulation pipeline is provided with a liquid pump, a flow meter and a pressure gauge.

[0014] In a second aspect, the present invention provides a sealing surface composite polishing method, comprising the following steps: S1, loading the workpiece into the loading tray, and filling the groove of the loading tray and the cavity of the workpiece with paraffin and smoothing them; S2, placing the workpiece with the sealing surface to be processed facing downward on the polishing pad, and starting the liquid pump to allow the electrolyte to flow steadily into the electrolyte tank; S3, connecting the positive electrode and the negative electrode of the electrolytic machining power supply to the loading plate and the rotating platform respectively; S4, turning on the magnetic field excitation source to generate a magnetic field in the electrolyte, and adjusting the direction of the magnetic field through the magnetic field regulator so that the direction of the magnetic field is perpendicular to the flow direction of the electrolyte; S5, driving the material carrier and the rotating platform respectively to make the workpiece and the polishing pad rotate in opposite directions, and at the same time driving the material carrier close to the rotating platform to make the workpiece contact with the polishing pad without separation; S6, turning on the electrolytic machining power supply to conduct the circuit, and polishing the sealing surface of the workpiece through the combined action of the polishing pad, electrolyte, and magnetic field.

[0015] In some embodiments, in step S6, the magnitude of the magnetic field can be adjusted by a magnetic field regulator; after step S6, the following steps are also included: after the polishing process is completed, the electrolytic machining power supply, the magnetic field excitation source, the liquid pump, and the driving of the loading plate and the rotating platform are turned off, and the loading plate and the rotating platform are reset at the same time, and the paraffin on the loading plate and the workpiece is removed by low-temperature heating to remove the workpiece and clean it.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows: by arranging a polishing platform and a loading plate that can rotate in opposite directions in the electrolyte tank, and connecting the loading plate and the polishing platform to the positive and negative electrodes of the electrolytic machining power supply respectively, the electrochemical mechanical composite polishing processing of the sealing surface of the workpiece loaded on the loading plate can be realized, and the sealing surface can be guaranteed to be smooth, sharp-edged, and free of burrs, thereby ensuring the processing quality and dimensional accuracy of the sealing surface; at the same time, by arranging a magnetic field generating device outside the electrolyte tank, a magnetic field can be generated in the electrolyte, and under the action of the magnetic field, the electrochemical polishing processing and the grinding processing of scraping off the passivation film on the workpiece processing surface can be alternately and continuously processed, so as to achieve the effect of finishing the processed surface and further improving the processing quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which: Figure 1 It is a structural schematic diagram of a sealing surface composite polishing processing device of the present invention; Figure 2 It is a partial schematic diagram of a sealing surface composite polishing processing device of the present invention; Figure 3 It is a partially enlarged schematic diagram of a sealing surface composite polishing processing device of the present invention; Figure 4 It is a schematic diagram of a material loading tray in a sealing surface composite polishing processing device of the present invention loading multiple workpieces; Figure 5 It is a schematic diagram of a sealing surface composite polishing processing device of the present invention in which a workpiece cavity is filled with paraffin wax; Figure 6 It is a schematic diagram of a sealing surface composite polishing processing device of the present invention being used for multiple material loading trays at the same time; Figure 7 It is a schematic diagram of an annular belt-shaped workpiece in a sealing surface composite polishing processing device of the present invention; Figure 8 It is a schematic diagram of a spiral workpiece in a sealing surface composite polishing processing device of the present invention; Fig. 9 It is a schematic diagram of a gradually expanding workpiece in a sealing surface composite polishing processing device of the present invention; Fig.10 It is a schematic diagram of a cross-array-shaped workpiece in a sealing surface composite polishing processing device of the present invention; Fig.11 The present invention is a flow chart of a sealing surface composite polishing processing method. DETAILED DESCRIPTION

[0018] In order to better understand the present invention, various aspects of the present invention will be described in more detail with reference to the accompanying drawings. It should be understood that these detailed descriptions are only descriptions of embodiments of the present invention, and do not limit the scope of the present invention in any way. It should be noted that in this specification, the expressions of first, second, third, etc. are only used to distinguish one feature from another feature, and do not represent any limitation on the feature.

[0019] It should also be understood that the terms “comprises,” “including,” “having,” “includes” and / or “comprising,” when used in this specification, indicate the presence of stated features, elements and / or components, but do not exclude the presence or addition of one or more other features, elements, components and / or combinations thereof.

[0020] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which the present invention belongs. It should also be understood that terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and will not be interpreted in an idealized or overly formal sense unless explicitly defined in this article.

[0021] With the rapid development of modern industry, the use environment of seals is becoming more and more demanding, and the requirements for the sealing surface of seals are also getting higher and higher. The processing quality of the sealing surface determines the service life and sealing performance of the seal, which directly affects the stability, reliability and service life of the sealing system. Existing sealing surface processing technologies such as grinding, lapping, and electrochemical polishing are difficult to simultaneously meet the requirements of high processing accuracy, good processing flexibility, and stable and controllable processing process, especially polishing processing such as Figure 7 The annular workpiece shown in Figure 8 The spiral workpiece shown, Fig. 9 The gradually expanding workpiece shown, such as Fig.10 When manufacturing seals of structural forms such as the cross-array workpiece shown, it is imperative to seek a new polishing device and polishing method that meets the requirements of high processing accuracy, good processing flexibility, and stable and controllable processing process.

[0022] See also Figures 1 to 6 The embodiment of the present invention provides a sealing surface composite polishing processing device, which includes an electrolyte circulation pipeline, a magnetic field generating component, an electrolyte tank 6, a polishing platform, at least one material loading tray 2 and an electrolytic processing power supply 7. Among them, the electrolyte circulation pipeline is arranged outside the electrolyte tank 6, which can stably provide electrolyte 11 to the electrolyte tank 6 and can be used for the circulation of electrolyte 11; the polishing platform is arranged opposite to at least one material loading tray 2 and both are arranged in the electrolyte tank 6 containing electrolyte 11, the polishing platform and the material loading tray 2 can be driven separately and rotated in opposite directions, and can be used for mechanical polishing of the sealing surface to be processed of the workpiece 1 loaded on the material loading tray 2; the electrolytic processing power supply 7 is arranged outside the electrolyte tank 6, and the positive and negative electrodes of the electrolytic processing power supply 7 are electrically connected to the material loading tray 2 and the polishing platform respectively, which can be used to generate an electrochemical reaction on the workpiece 1 and be used for electrochemical polishing of the workpiece 1; the magnetic field generating component is arranged outside the electrolyte tank 6, which can be used to generate a magnetic field in the electrolyte 11 and be used to assist the polishing of the workpiece 1.

[0023] The embodiment of the present invention arranges a polishing platform and a loading plate that can rotate in opposite directions in an electrolyte tank, and the loading plate and the polishing platform are respectively connected to the positive and negative electrodes of the electrolytic processing power supply, so as to realize electrochemical mechanical composite polishing processing of the sealing surface of the workpiece loaded on the loading plate, and can ensure that the sealing surface is smooth, sharp-edged, and free of burrs, thereby ensuring the processing quality and dimensional accuracy of the sealing surface; at the same time, by arranging a magnetic field generating device outside the electrolyte tank, a magnetic field can be generated in the electrolyte, and under the action of the magnetic field, the electrochemical polishing processing and the grinding processing of scraping off the passivation film on the processing surface of the workpiece can be alternately and continuously processed, so as to achieve the effect of finishing the processing surface and further improving the processing quality.

[0024] Specifically, the electrolyte circulation pipeline includes a circulation pipe, one end of which is connected to the bottom of the electrolyte tank 6, and the other end of the circulation pipe is fixedly installed with a nozzle 13, and the nozzle 13 is higher than the liquid level of the electrolyte 11 in the electrolyte tank 6; at the same time, a liquid pump 8, a flow meter 9 and a pressure gauge 10 are installed on the circulation pipe to facilitate the extraction of the electrolyte 11 in the electrolyte tank 6 and the spraying of the electrolyte 11 from the nozzle 13 into the electrolyte tank 6, so that the electrolyte 11 can have a certain flow velocity and a certain circulation renewal frequency in the electrolyte tank 6.

[0025] Preferably, an agitator 14 is installed at the bottom of the electrolyte tank 6 and near the inlet of the circulation pipe. The agitator 14 can not only be used to prevent the polishing product 17 from being deposited here and blocking the inlet of the circulation pipe, but also can be used to accelerate the flow and circulation renewal of the electrolyte 11.

[0026] Furthermore, the positive and negative electrodes of the electrolytic machining power supply 7 are electrically connected to the material carrier 2 and the polishing platform, respectively, and both the material carrier 2 and the polishing platform can be placed in the electrolyte 11 of the electrolyte tank 6. At the same time, a groove is provided on the material carrier 2, the depth of which is slightly less than the height of the workpiece 1, and a plurality of workpieces 1 with sealing surfaces to be machined of the same or different specifications are loaded in the groove, and the workpiece 1 has a concave cavity, and the groove of the material carrier 2 and the concave cavity of the workpiece 1 are filled with paraffin, and the paraffin is flattened; the polishing platform includes a polishing pad 3 and a rotating platform 4, the polishing pad 3 is arranged opposite to the workpiece 1 on the material carrier 2, and the polishing pad 3 is fixedly mounted on the rotating platform 4.

[0027] The embodiment of the present invention can support the sealing surface of the workpiece to a certain extent by filling the groove of the carrier plate and the concave cavity of the workpiece with paraffin and smoothing them, so that the entire sealing surface of the workpiece can be kept in contact with the polishing pad during the processing, effectively reducing the vibration caused by the uneven sealing surface of the workpiece, especially for some sealing surfaces of small sizes, so that the stability and controllability of the processing process can be improved; on the other hand, since there is a peak effect when processing the workpiece by electrochemical polishing, that is, the electric field intensity is large at the protrusion on the workpiece, and the electrochemical dissolution effect of the material here is strong, the filling of paraffin in the concave cavity of the workpiece can effectively reduce the electrochemical corrosion effect of the stray current on the sharp edge characteristics on the sealing surface, so that the sealing surface of the workpiece can maintain a smooth, sharp edge without burrs; in addition, during the polishing process, the magnetic abrasive particles in the electrolyte will generate a small amount of grinding heat when scraping off the passivation film on the workpiece processing surface, so that a small amount of paraffin melts and enters the polishing processing area, which can play a certain lubricating role on the polishing pad and the workpiece processing surface, that is, the embodiment of the present invention can not only improve the stability and controllability of the sealing surface polishing process, but also ensure that the sealing surface has a smooth, sharp edge without burrs.

[0028] Furthermore, the magnetic field generating assembly includes an N-pole magnet, an S-pole magnet, a magnetic field excitation source 5 and a magnetic field regulator 10. The N-pole magnet and the S-pole magnet are fixedly mounted on both sides of the electrolyte tank 6, respectively, and the positive and negative poles of the magnetic field excitation source 5 are electrically connected to the N-pole magnet and the S-pole magnet, respectively, so as to generate a magnetic field in the electrolyte 11; at the same time, a magnetic field regulator 10 is installed on the line between the magnetic field excitation source 5 and the S-pole magnet, so as to adjust the direction and size of the magnetic field. Preferably, suspended magnetic abrasive particles 15 are arranged in the electrolyte 11, which is helpful for micro-leveling of the workpiece processing surface.

[0029] The embodiment of the present invention can utilize the magnetic field to assist the composite polishing process formed by electrochemical polishing and mechanical polishing by arranging a magnetic field generating component outside the electrolyte tank, that is, the electrochemical polishing process and the grinding process of scraping off the passivation film on the workpiece surface can be alternately and continuously processed under the action of the magnetic field to achieve the effect of finishing the surface. Specifically, the embodiment of the present invention can use the magnetic field regulator to adjust the direction of the magnetic field so that the direction of the magnetic field is perpendicular to the flow direction of the electrolyte, so that the electrolyte is accelerated to flow to the polishing processing area under the action of the Lorentz force to achieve the circulation and renewal of the electrolyte, and the ions in the electrolyte are more complex in their motion trajectory under the action of the Lorentz force, which is conducive to reducing the influence of concentration polarization, accelerating the electrochemical reaction process in the polishing processing area, and improving the material removal rate; at the same time, the magnetic abrasive particles suspended in the electrolyte are also accelerated to flow to the polishing processing area under the action of the magnetic field, so that more abrasive particles participate in the polishing process at the same time, shortening the processing time required to obtain the same surface roughness, and improving the processing efficiency. In this way, when a certain pressure is applied to the workpiece, the free magnetic abrasive particles roll, scrape, and squeeze on the processing surface. The passivation film generated on the micro-convex parts of the processed surface is quickly scraped off, so that new metal atoms are continuously exposed on the processed surface for anodic dissolution, so that the material on the micro-convex parts of the processed surface is quickly removed and the surface roughness is rapidly reduced, while the passivation film on the concave parts of the processed surface is not easily removed by the abrasive particles, and the electrochemical reaction is blocked and protected, thereby achieving a micro-leveling effect, thereby improving the processing quality of the sealing surface; in addition, the magnetic field regulator can be used to control the size of the magnetic field. When the magnetic field is small and the driving effect on the electrolyte and the magnetic abrasive particles is not strong, the size of the magnetic field can be dynamically controlled according to the actual processing requirements to achieve efficient composite polishing, that is, the embodiment of the present invention can not only ensure the advantages of high processing accuracy and high processing efficiency of electrochemical mechanical composite polishing, but also significantly improve the processing quality of the sealing surface.

[0030] More preferably, the polishing pad 3 and the rotating platform 4 are both provided with spiral grooves 18 extending from the center to the outside, and the spiral grooves 18 on the polishing pad 3 are connected to the spiral grooves 18 on the rotating platform 4. In the embodiment of the present invention, due to the provision of a magnetic field generating component, the electrolyte has a single flow direction and a limited renewal speed under the action of the magnetic field, resulting in the accumulation of abrasive particles in the polishing processing area, which is easy to cause scratches and burns on the processed surface. By providing the connected spiral grooves on the polishing pad and the rotating platform, when the workpiece sealing surface moves to the spiral grooves, not only can the processing products in the composite polishing process be removed faster, but also the abrasive particles accumulated in the polishing processing area can be returned to the electrolyte tank, thereby strengthening the renewal of the electrolyte in the polishing processing area, effectively ensuring the consistency and repeatability of the processing state, reducing the processing error, and significantly improving the consistency of the composite polishing process; at the same time, a small amount of electrolyte in the spiral groove also participates in the electrochemical reaction, so that the processed surface can be continuously leveled and polished, further reducing the surface roughness, that is, the embodiment of the present invention can not only ensure that the composite polishing process is stable and controllable, but also shorten the processing steps and improve the processing flexibility.

[0031] More preferably, a plurality of loading trays 2 are provided on the polishing pad 3, which can be used to simultaneously process a plurality of workpieces of the same or different specifications, thereby significantly improving processing efficiency; at the same time, in response to the processing requirements of workpieces of different specifications and different workpiece sealing surfaces, the loading trays where the workpieces of different specifications are located can be controlled separately and different polishing processing speeds can be selected, thereby being able to meet the finishing processing requirements of the sealing surfaces of workpieces of various varieties and specifications, and significantly improving the processing capability and processing flexibility. That is, the embodiment of the present invention can not only significantly improve the processing efficiency of the workpiece sealing surface, but also can independently control the polishing processing speed of the loading tray to improve the processing capability and processing flexibility.

[0032] The present invention also provides a sealing surface composite polishing processing method, comprising the following steps: S1, loading the workpiece 1 into the loading tray 2, and filling the groove of the loading tray 2 and the cavity of the workpiece 1 with paraffin and smoothing them.

[0033] It should be noted here that a plurality of workpieces 1 of the same or different specifications can be loaded in the same loading tray 2, but the workpieces 1 of the same or different specifications have the same sealing surface processing quality requirements; of course, a plurality of loading trays 2 can be set up, and workpieces 1 of different specifications can be loaded in different loading trays 2, and different sealing surface processing quality requirements can be achieved by individually controlling the polishing processing speed of each loading tray 2.

[0034] S2, the workpiece 1 is placed with the sealing surface to be processed facing downward on the polishing pad 3, and the liquid pump 8 is started to allow the electrolyte 11 to flow steadily into the electrolyte tank 6. At this time, when the electrolyte 11 in the electrolyte tank 6 reaches a certain liquid level, the loading tray 2 and the workpiece 1 on the loading tray 2 can be placed in the electrolyte 11, and the polishing pad 3 on the rotating platform 4 can be placed in the electrolyte 11; at the same time, the electrolyte 11 has a certain flow speed and circulation renewal frequency between the workpiece 1 and the polishing pad 3.

[0035] S3, the positive electrode and the negative electrode of the electrolytic machining power source 7 are respectively connected to the material carrier plate 2 and the rotating platform 4. At this time, the workpiece 1 and the polishing pad 3 are respectively connected to the positive electrode and the negative electrode of the electrolytic machining power source 7.

[0036] S4, turn on the magnetic field excitation source 5 to generate a magnetic field in the electrolyte 11, and adjust the direction of the magnetic field through the magnetic field regulator 10 so that the direction of the magnetic field is perpendicular to the flow direction of the electrolyte 11. At this time, the electrolyte 11 is accelerated to flow to the polishing processing area between the workpiece 1 and the polishing pad 3 under the Lorentz force, which can realize the circulation and renewal of the electrolyte 11, and the ions in the electrolyte 11 are more complex under the action of the Lorentz force, which can effectively reduce the influence of concentration polarization, promote the electrochemical dissolution of the material in the polishing processing area, and improve the material removal rate.

[0037] S5, driving the material carrier 2 and the rotating platform 4 respectively to make the workpiece 1 and the polishing pad 3 rotate in opposite directions, and at the same time driving the material carrier 2 close to the rotating platform 4 to make the workpiece 1 and the polishing pad 3 contact with each other without separation.

[0038] It should be noted here that the rotational movement of the loading tray 2 and the rotating platform 4 is controlled separately, that is, the rotation directions of the loading tray 2 and the rotating platform 4 may be opposite and the rotation speeds may be inconsistent. For example, the rotating platform 4 rotates counterclockwise at the second rotation speed, the first loading tray and the workpiece loaded thereon rotate clockwise at the first rotation speed, and the second loading tray and the workpiece loaded thereon rotate clockwise at the third rotation speed.

[0039] S6, turn on the electrolytic machining power supply 7 to conduct the circuit, and polish the sealing surface of the workpiece 1 through the combined action of the polishing pad 3, the electrolyte 11, and the magnetic field. At this time, the workpiece 1 rotates with the carrier plate 2 so that the passivating electrolyte 11 flows into the polishing processing area and forms a closed loop, and a thin passivation film can be formed on the workpiece 1 processing surface under the action of electrolytic machining. At the same time, through the action of the magnetic field, the magnetic abrasive particles 15 suspended in the electrolyte 11 are accelerated to flow to the polishing processing area under the action of the magnetic field, so that more magnetic abrasive particles 15 participate in the polishing process at the same time, and when the workpiece 1 is applied with a certain pressure and abuts against the polishing pad 3, the free magnetic abrasive particles 15 will quickly scrape off the passivation film generated at the micro-convex part of the processing surface, so that the processing surface continuously exposes new metal atoms for anodic dissolution, and the passivation film at the concave part of the processing surface is not easily removed by the magnetic abrasive particles 15, and the electrochemical reaction is hindered, so that the effect of micro-leveling, high processing accuracy, high processing efficiency and high processing quality can be achieved.

[0040] It should be noted that during polishing, the magnetic field size can be dynamically adjusted by the magnetic field regulator 10 according to actual processing requirements to achieve efficient composite polishing processing.

[0041] S7, after the polishing process is completed, turn off the electrolytic machining power supply 7, the magnetic field excitation source 5, the liquid pump 8, and stop driving the loading tray 2 and the rotating platform 4. At the same time, reset the loading tray 2, and heat at low temperature to remove the paraffin on the loading tray 2 and the workpiece 1, so as to remove and clean the workpiece 1.

[0042] The embodiment of the present invention connects the workpiece and the polishing pad of the sealing surface to be processed to the positive and negative electrodes of the electrolytic processing power supply respectively, and the workpiece and the polishing pad rotate in opposite directions so that the passivating electrolyte flows into the polishing processing area to form a closed loop for electrochemical reaction, and forms a thin passivation film on the workpiece processing surface under the action of electrolytic processing. At the same time, by adjusting the direction of the magnetic field to be perpendicular to the flow direction of the electrolyte, the electrolyte is accelerated to flow into the polishing processing area by the Lorentz force so that the electrolyte is circulated and renewed, further accelerating the anodic dissolution process; at the same time, the electrolyte contains suspended magnetic abrasive particles, which enter the polishing processing area under the action of the magnetic field to scrape off the passivation film formed by the electrolysis of the processing surface, so that the processing surface continuously exposes new metal atoms to be continuously electrolyzed, thereby improving the microscopic leveling effect of the processing surface, and the polished sealing surface can maintain a smooth, sharp edge without burrs, significantly improving the processing quality of the sealing surface.

[0043] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0044] The above-described embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the attached claims.

Claims

1. A sealing surface composite polishing device, characterized in that: include: An electrolyte tank (6), wherein the electrolyte tank (6) contains an electrolyte (11); A polishing platform, the polishing platform being movably disposed in the electrolyte tank (6); At least one material loading tray (2), the material loading tray (2) being movably disposed in the electrolyte tank (6), and the material loading tray (2) being disposed opposite to the polishing platform; An electrolytic machining power source (7), wherein a positive electrode and a negative electrode of the electrolytic machining power source (7) are electrically connected to the material loading plate (2) and the polishing platform respectively; During machining, the sealing surface to be machined of the workpiece (1) loaded on the material carrier (2) is brought into contact with the polishing platform, and the material carrier (2) and the polishing platform are driven respectively to rotate the workpiece (1) and the polishing platform in opposite directions, and at the same time, the electrolytic machining power supply (7) is turned on to conduct the circuit and polish the sealing surface of the workpiece (1).

2. The sealing surface composite polishing device according to claim 1, characterized in that: It also includes a magnetic field generating component, the magnetic field generating component includes an N-pole magnet, an S-pole magnet and a magnetic field excitation source (5), the N-pole magnet and the S-pole magnet are respectively arranged on two sides outside the electrolyte tank (6) in a relative manner, and the positive pole and the negative pole of the magnetic field excitation source (5) are respectively electrically connected to the N-pole magnet and the S-pole magnet; during processing, the magnetic field excitation source (5) is turned on to generate a magnetic field in the electrolyte tank (6).

3. The sealing surface composite polishing device according to claim 2, characterized in that: The magnetic field generating component further comprises a magnetic field regulator (10); during processing, the magnetic field regulator (10) is used to adjust the direction and magnitude of the magnetic field.

4. The sealing surface composite polishing device according to claim 2, characterized in that: Magnetic abrasive particles are provided in the electrolyte (11).

5. The sealing surface composite polishing device according to claim 1, characterized in that: At least one workpiece (1) is loaded in the loading tray (2).

6. The sealing surface composite polishing device according to claim 5, characterized in that: The material carrier tray (2) is provided with a groove, and at least one of the workpieces (1) is arranged in the groove. The workpiece (1) has a cavity, and paraffin is arranged in the groove and the cavity.

7. The sealing surface composite polishing processing device according to claim 1, characterized in that: The polishing platform comprises a rotating platform (4) and a polishing pad (3) fixed on the rotating platform (4); the polishing pad (3) and the rotating platform (4) are provided with communicating spiral through grooves (18).

8. The sealing surface composite polishing device according to any one of claims 1 to 7, characterized in that: It also includes an electrolyte circulation pipeline, one end of which is in communication with the bottom of the electrolyte tank (6), the other end of which is provided with a nozzle (13), and the electrolyte circulation pipeline is provided with a liquid pump (8), a flow meter (9) and a pressure gauge (10).

9. A processing method of the sealing surface composite polishing processing device according to any one of claims 1 to 8, characterized in that: The following steps are involved: S1, loading the workpiece (1) into the loading tray (2), and filling the groove of the loading tray (2) and the cavity of the workpiece (1) with paraffin and smoothing them; S2, placing the workpiece (1) with the sealing surface to be processed facing downward on top of the polishing pad (3), and starting the liquid pump (8) to allow the electrolyte (11) to flow steadily into the electrolyte tank (6); S3, connecting the positive electrode and the negative electrode of the electrolytic machining power source (7) to the loading plate (2) and the rotating platform (4) respectively; S4, turning on the magnetic field excitation source (5) to generate a magnetic field in the electrolyte (11), and adjusting the direction of the magnetic field through the magnetic field regulator (10) so that the direction of the magnetic field is perpendicular to the flow direction of the electrolyte (11); S5, driving the material carrier (2) and the rotating platform (4) respectively so that the workpiece (1) and the polishing pad (3) rotate in opposite directions, and at the same time driving the material carrier (2) close to the rotating platform (4) so ​​that the workpiece (1) and the polishing pad (3) are in contact with each other without being separated; S6, turning on the electrolytic machining power source (7) to conduct the circuit, and polishing the sealing surface of the workpiece (1) through the combined action of the polishing pad (3), the electrolyte (11), and the magnetic field.

10. The sealing surface composite polishing method according to claim 9, characterized in that: In step S6, the magnitude of the magnetic field can be adjusted by a magnetic field regulator (10); after step S6, the following steps are also included: After the polishing process is completed, the electrolytic processing power supply (7), the magnetic field excitation source (5), the liquid pump (8) are turned off, and the driving of the loading plate (2) and the rotating platform (4) is stopped. At the same time, the loading plate (2) is reset, and the paraffin on the loading plate (2) and the workpiece (1) is removed by low-temperature heating, so that the workpiece (1) can be removed and cleaned.

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