Infrared radiation material and preparation method and application thereof

Abstract

The invention belongs to the technical field of infrared radiation materials, and particularly relates to an infrared radiation material and a preparation method and application thereof. The infrared radiation material comprises a base material layer, a metal layer, an ink layer and a polymer protection layer which are sequentially stacked, the ink layer comprises modified vanadium dioxide; the modified vanadium dioxide is obtained by modifying vanadium oxydichloride by adopting a metal compound. According to the invention, the multi-layer metal layer with high infrared reflection and low infrared radiance is used as the bottom layer, and the multi-layer metal layer shows strong reflection and low absorption effects in mid-infrared and far-infrared bands; infrared rays can penetrate through the ink layer and are reflected on the surface of the metal layer to be less absorbed, the modified vanadium dioxide is added into the ink layer, the phase change temperature can be greatly reduced through doping modification of a metal material in the vanadium dioxide, the phase change is reduced to the room temperature or below, and then the infrared radiance is obviously reduced. And all the layers act together to obtain the infrared radiation material with lower infrared radiance.

Description

Technical Field

[0001] The invention belongs to the technical field of infrared radiation materials, and in particular relates to an infrared radiation material and a preparation method and application thereof. Background Art

[0002] Infrared stealth technology reduces or changes the infrared radiation characteristics of the target, making it difficult for the opponent's infrared detection equipment to detect it or reducing its detection capability.

[0003] Low infrared radiation materials are mainly used for infrared thermal imager reconnaissance, aiming to reduce the brightness of the target in the infrared band. When infrared rays hit the smooth surface of any material, three phenomena will occur: part of the energy is absorbed, part of the energy is reflected, and part of the energy is transmitted. Due to the law of conservation of energy, α+β+γ=1; α is the material's absorptivity to infrared rays, β is the material's reflectivity to infrared rays, and γ is the material's transmittance to infrared rays. The infrared emissivity ε of a material at a given temperature is equal to the absorptivity α at the same temperature. Because ε+β+γ=1, to make ε low, β and γ must be high.

[0004] Generally speaking, metals have high infrared reflectivity and low infrared emissivity. Multilayer metal layers are widely used in infrared technology. For example, in frequently used reflective optical systems, multilayer metal layers can be used as high-reflection films to maximize the reflectivity of each component. Multilayer metal layers exhibit strong reflection and low absorption effects in the mid-infrared and far-infrared bands. A study has disclosed a multi-band enhanced metal reflective film, in which a chromium film layer, a transition bonding layer (pure copper or a mixture of copper and nickel), a metal layer and other metal layers are sequentially deposited on a substrate to achieve visible light laser infrared or laser infrared multi-band large-angle reflection, and high reflectivity, but its infrared emissivity is still high and cannot meet the demand for low infrared emissivity materials.

[0005] Therefore, it is of great significance to provide an infrared radiation material with lower infrared radiation rate. Summary of the invention

[0006] The present invention aims to solve one or more technical problems existing in the above-mentioned prior art, and at least provide a beneficial choice or create conditions. Specifically, the present invention provides an infrared radiation material, which has a lower infrared radiation rate.

[0007] The inventive concept of the present invention: the infrared radiation material of the present invention comprises a substrate layer, a metal layer, an ink layer and a polymer protective layer stacked in sequence; the composition of the ink layer comprises modified vanadium dioxide; the modified vanadium dioxide is obtained by modifying vanadium dichloride with a metal compound. The present invention uses a metal layer with high infrared reflection and low infrared emissivity as the bottom layer, and the metal layer exhibits a strong reflection and low absorption effect in the mid-infrared and far-infrared bands; the ink layer allows infrared rays to pass through and reflect on the surface of the metal layer with less absorption, and the ink layer is added with modified vanadium dioxide, and the doping modification of the metal in the vanadium dioxide can greatly reduce its phase change temperature, so that the phase change drops to room temperature or below, thereby significantly reducing the infrared emissivity, and the layers work together to obtain an infrared radiation material with a lower infrared emissivity.

[0008] Therefore, a first aspect of the present invention provides an infrared radiation material.

[0009] Specifically, the infrared radiation material comprises a substrate layer, a metal layer, an ink layer and a polymer protective layer stacked in sequence;

[0010] The ink layer comprises modified vanadium dioxide;

[0011] The modified vanadium dioxide is obtained by modifying vanadium oxychloride with a metal compound.

[0012] Preferably, the substrate layer is composed of at least one of polyethylene terephthalate, polypropylene, polyethylene and polyvinyl chloride.

[0013] Preferably, the polypropylene is biaxially oriented polypropylene.

[0014] Preferably, the polyethylene is high-density polyethylene.

[0015] Preferably, the metal in the metal layer includes at least one of aluminum, titanium, vanadium, chromium, manganese, iron, tin, cobalt, nickel, copper, zinc, germanium, terbium, ruthenium, rhodium, palladium, silver, antimony, iridium, gold and platinum.

[0016] Preferably, the number of the metal layers is greater than one.

[0017] Preferably, the metal in the metal compound includes at least one of tungsten, magnesium, chromium, aluminum, gold, molybdenum and titanium.

[0018] Preferably, in the ink layer, the weight percentage of the modified vanadium dioxide is 0.9-6.5%; further preferably, in the ink layer, the weight percentage of the modified vanadium dioxide is 1-6%.

[0019] Preferably, the preparation method of the modified vanadium dioxide is:

[0020] Mixing vanadium dichloride, sodium citrate and a metal compound, then adding sodium carbonate and a coupling agent, reacting and calcining to obtain the modified vanadium dioxide;

[0021] Preferably, the molar ratio of the vanadium oxychloride to the metal compound is 1:(0.01-0.055); further preferably, the molar ratio of the vanadium oxychloride to the metal compound is 1:(0.01-0.05).

[0022] Preferably, the coupling agent comprises a silane coupling agent.

[0023] Preferably, the weight ratio of the coupling agent to vanadium oxychloride is 0.016-0.025:1; further preferably, the weight ratio of the coupling agent to vanadium oxychloride is 0.018-0.022:1; further preferably, the weight ratio of the coupling agent to vanadium oxychloride is 0.02:1.

[0024] Preferably, the calcination temperature is 500-700°C; the calcination time is 1-3h; further preferably, the calcination temperature is 550-650°C; the calcination time is 1.5-2.5h; further preferably, the calcination temperature is 600°C; the calcination time is 2h.

[0025] Preferably, after the reaction, the solid is taken out for calcination.

[0026] Preferably, the solid is washed and dried before being calcined.

[0027] Preferably, the concentration of the vanadium oxychloride is 0.08-0.12 mol / L; further preferably, the concentration of the vanadium oxychloride is 0.09-0.11 mol / L; further preferably, the concentration of the vanadium oxychloride is 0.1 mol / L.

[0028] Preferably, the concentration of sodium citrate is 0.08-0.12 mol / L; further preferably, the concentration of sodium citrate is 0.09-0.11 mol / L; further preferably, the concentration of sodium citrate is 0.1 mol / L.

[0029] Preferably, the concentration of sodium carbonate is 0.8-1.2 mol / L; further preferably, the concentration of sodium carbonate is 0.9-1.1 mol / L; further preferably, the concentration of sodium carbonate is 1 mol / L.

[0030] Preferably, the ink layer also includes dyes, binders, solvents and additives.

[0031] Preferably, in terms of weight percentage, the composition of the ink layer includes 0.9-6.5% of modified vanadium dioxide, 16.5-27% of dye, 15-22% of connecting material, 39-65.1% of solvent, and 2.5-5.5% of additive.

[0032] Further preferably, the composition of the ink layer includes, by weight percentage, 1-6% of modified vanadium dioxide, 18-24% of dye, 16-20% of connecting material, 45-62% of solvent, and 3-5% of additive.

[0033] Preferably, the dye comprises cyan dye, magenta dye, and yellow dye.

[0034] Preferably, in the ink layer, the weight proportion of the cyan dye, magenta dye and yellow dye is 5.5-9%; further preferably, in the ink layer, the weight proportion of the cyan dye, magenta dye and yellow dye is 6-8%.

[0035] Preferably, the cyan dye is an anthraquinone compound; the magenta dye is an azo compound; and the yellow dye is an azo compound.

[0036] Specifically, the present invention mixes cyan, magenta and yellow primary color dyes in appropriate proportions to prepare a dye, which can absorb visible light and has a low absorption rate for infrared rays. The dye is added to a compatible connecting material (transparent resin) to obtain an ink, which can absorb visible light and transmit infrared rays. When selecting dyes and connecting materials, materials containing no or less polar functional groups (such as cyano, carboxyl, etc.) are used to minimize the infrared absorption rate. The ink in the ink layer of the present invention is an ink that allows infrared rays to pass through and reflect on the surface of the metal layer and absorb less. At the same time, combined with the sheet metal material in the ink, the infrared radiation material has a lower infrared radiation rate.

[0037] Preferably, the connecting material includes at least one of polysiloxane resin, rubber resin, polyolefin resin and polyimide resin.

[0038] Preferably, the solvent includes an organic solvent; further preferably, the organic solvent includes at least one of ethanol, acetone and xylene.

[0039] Preferably, the additive comprises stearic acid.

[0040] Preferably, the polymer material in the polymer protective layer includes at least one of polycarbonate, polyethylene, polypropylene, trans-1,4-polyisoprene, polymethyl methacrylate, acrylonitrile-butadiene-styrene copolymer, and polyethylene terephthalate.

[0041] Preferably, the thickness of the substrate layer is 0.45-550 μm; more preferably, the thickness of the substrate layer is 0.5-500 μm.

[0042] Preferably, the thickness of the metal layer is 18 nm-22 μm; further preferably, the thickness of the metal layer is 20 nm-20 μm.

[0043] Specifically, the number of metal layers is greater than 1, and the thickness of the metal layer herein refers to the thickness of a single metal layer.

[0044] Preferably, the thickness of the ink layer is 1.5-2.2 μm or 4.5-5.0 μm; further preferably, the thickness of the ink layer is 1.6-2 μm or 4.7-4.8 μm.

[0045] The present invention uses interference method to reduce infrared radiation rate by controlling the thickness of the ink layer. The infrared light reflected from the inner and outer surfaces of the ink layer will reduce the reflected infrared light to the greatest extent through the interference method. The thickness d of the ink layer is:

[0046]

[0047] Wherein, k=0, 1, 2, 3, ..., λ is the wavelength of infrared light, and n is the refractive index of the ink layer material.

[0048] Preferably, the thickness of the polymer protective layer is 45 nm-5.5 μm; further preferably, the thickness of the polymer protective layer is 50 nm-5 μm.

[0049] The second aspect of the present invention provides a method for preparing the infrared radiation material described in the first aspect of the present invention.

[0050] Specifically, the method for preparing the infrared radiation material comprises the following steps:

[0051] A metal layer, an ink layer and a polymer protective layer are sequentially prepared on the substrate layer to obtain the infrared radiation material.

[0052] Preferably, the metal layer is prepared by any one of vacuum evaporation coating method, vacuum magnetron sputtering coating method, radio frequency magnetron sputtering coating method, electron beam evaporation coating method and electroplating.

[0053] Preferably, the ink layer is prepared by coating or screen printing.

[0054] Preferably, the metal layer is formed on the surface of the substrate layer by vacuum evaporation coating method, vacuum magnetron sputtering coating method, radio frequency magnetron sputtering coating method, electron beam evaporation coating method, electroplating or chemical plating.

[0055] Preferably, the ink layer is formed on the surface of the metal layer by screen printing or coating.

[0056] A third aspect of the present invention provides a stealth device.

[0057] Specifically, the stealth device includes the infrared radiation material described in the first aspect of the present invention.

[0058] Compared with the prior art, the technical solution provided by the present invention has the following beneficial effects:

[0059] (1) The infrared radiation material of the present invention comprises a substrate layer, a metal layer, an ink layer and a polymer protective layer stacked in sequence; the composition of the ink layer comprises modified vanadium dioxide; the modified vanadium dioxide is obtained by modifying vanadium dichloride with a metal compound. The present invention uses a multi-layer metal layer with high infrared reflectivity and low infrared emissivity as the bottom layer, and the multi-layer metal layer exhibits a strong reflection and low absorption effect in the mid-infrared and far-infrared bands; the ink layer allows infrared rays to pass through and reflect on the surface of the metal layer with less absorption, and the ink layer is added with modified vanadium dioxide, and the doping modification of the metal material in the vanadium dioxide can greatly reduce its phase change temperature, so that the phase change drops to room temperature or below, thereby significantly reducing the infrared emissivity. The layers work together to obtain an infrared radiation material with a lower infrared emissivity.

[0060] (2) The present invention uses an interference method to reduce the infrared radiation rate by controlling the thickness of the ink layer. The infrared light reflected from the inner and outer surfaces of the ink layer will minimize the reflected infrared light through the interference method.

[0061] (3) The present invention uses cyan, magenta and yellow primary color dyes that contain no or less polar functional groups (such as cyano, carboxyl, etc.) and mixes them in appropriate proportions to prepare ink, which can absorb visible light but not infrared light, and block visible light to reduce glare caused by visible light, thereby reducing infrared radiation. BRIEF DESCRIPTION OF THE DRAWINGS

[0062] Figure 1 This is a schematic structural diagram of the infrared radiation material prepared in Example 1 of the present invention. DETAILED DESCRIPTION

[0063] In order to make the technical scheme of the present invention more clearly understood by those skilled in the art, the following embodiments are listed for illustration. It should be pointed out that the following embodiments do not limit the protection scope of the present invention.

[0064] Unless otherwise specified, the raw materials, reagents or devices used in the following examples can be obtained from conventional commercial sources or by existing known methods.

[0065] Example 1

[0066] An infrared radiation material comprises a polyethylene terephthalate substrate layer, a metal layer, an ink layer with a thickness of 1.6 μm, and a polycarbonate protective layer with a thickness of 50 nm containing an ultraviolet absorber;

[0067] The raw material formula of the ink layer is as follows by weight percentage: 1% tungsten-modified vanadium dioxide, 6% cyan dye (anthraquinone compound 9,10-anthraquinone), 6% magenta dye (azo compound methyl red), 6% yellow dye (azo compound methyl orange), 16% polyethylene as a binder, 62% ethanol as a solvent, and 3% stearic acid as an additive;

[0068] The number of metal layers is 8, and 20 μm aluminum metal layers and 20 nm gold metal layers are alternately stacked.

[0069] A method for preparing an infrared radiation material comprises the following steps:

[0070] (1) Aluminum metal is formed on the surface of polyethylene terephthalate (PET) by vacuum evaporation coating to form an aluminum metal layer with a thickness of 20 μm;

[0071] (2) forming gold metal on the surface of the aluminum metal layer obtained in step (1) by vacuum evaporation coating to form a gold metal layer with a thickness of 20 nm;

[0072] (3) repeating the above steps (1) and (2) so that aluminum metal layers and gold metal layers are alternately stacked until the number of metal layers reaches 8, thereby obtaining a metal layer;

[0073] (4) mixing the raw materials of the ink layer to obtain ink; forming the ink on the surface of the metal layer obtained in step (3) by screen printing to form an ink layer with a thickness of 1.6 μm;

[0074] (5) An organic solution of polycarbonate containing an ultraviolet absorber is sprayed onto the surface of the ink layer to form a polycarbonate transparent film containing an ultraviolet absorber (1% by weight) and having a thickness of 50 nm as a polymer protective layer, thereby obtaining an infrared radiation material.

[0075] The preparation method of tungsten-modified vanadium dioxide comprises the following steps:

[0076] A 0.1 mol / L vanadium dichloride solution, a 0.1 mol / L sodium citrate, and tungsten trioxide in a 1:0.03 atomic ratio of vanadium dichloride to tungsten trioxide (the molar ratio of vanadium dichloride to tungsten trioxide is 1:0.03) are mixed to obtain a mixed solution; then, a 1.0 mol / L sodium carbonate having the same volume as the mixed solution is added dropwise; then, a 2 wt % KH-560 epoxy silane coupling agent is added dropwise to react, and the generated precipitate is washed with pure water, vacuum dried at 60° C. for 1 hour, and then calcined at 600° C. for 2 hours in a 10 mL / min nitrogen environment to obtain modified vanadium dioxide.

[0077] The structural schematic diagram of the infrared radiation material prepared in Example 1 of the present invention is as follows Figure 1 shown.

[0078] Example 2

[0079] An infrared radiation material, comprising a biaxially oriented polypropylene substrate layer, a metal layer, an ink layer with a thickness of 4.8 μm, and a polyethylene protective layer with a thickness of 5 μm containing an ultraviolet absorber;

[0080] The raw material formula of the ink layer is as follows by weight percentage: 6% magnesium-modified vanadium dioxide, 8% cyan dye (anthraquinone compound 9,10-anthraquinone), 8% magenta dye (azo compound methyl red), 8% yellow dye (azo compound methyl orange), 20% polyethylene as a binder, 45% acetone as a solvent, and 5% stearic acid as an additive;

[0081] The number of metal layers is 4, and 50nm germanium metal layers and 10μm copper metal layers are alternately stacked.

[0082] A method for preparing an infrared radiation material comprises the following steps:

[0083] (1) forming germanium metal on the surface of the biaxially oriented polypropylene substrate layer by vacuum magnetron sputtering coating method to form a germanium metal layer with a thickness of 50 nm;

[0084] (2) forming copper metal on the surface of the germanium metal layer obtained in step (1) by vacuum magnetron sputtering coating method to form a copper metal layer with a thickness of 10 μm;

[0085] (3) repeating the above steps (1) and (2) so that aluminum metal layers and gold metal layers are alternately stacked until the number of metal layers reaches 4, thereby obtaining a metal layer;

[0086] (4) mixing the raw materials of the ink layer to obtain ink; and applying the ink on the surface of the metal layer obtained in step (3) to form an ink layer with a thickness of 4.8 μm;

[0087] (5) A polyethylene transparent film with a thickness of 5 μm and containing an ultraviolet absorber (1% by weight) is covered on the surface of the ink layer obtained in step (4) by hot pressing to form a polymer protective layer, thereby obtaining an infrared radiation material.

[0088] In Example 2, the preparation method of magnesium-modified vanadium dioxide is different from that in Example 1 only in that an equal amount of MgO is used to replace the tungsten trioxide in Example 1, and the rest is the same as in Example 1.

[0089] Example 3

[0090] An infrared radiation material, comprising a high-density polyethylene substrate layer, a metal layer (a 100 nm silver metal layer and a 5 μm nickel metal layer), an ink layer with a thickness of 4.7 μm, and a polymethyl methacrylate protective layer containing an ultraviolet absorber with a thickness of 1 μm;

[0091] Calculated by weight percentage, the raw material formula of the ink layer is: 3% aluminum-modified vanadium dioxide, 7% cyan dye (anthraquinone compound 9,10-anthraquinone), 7% magenta dye (azo compound methyl red), 7% yellow dye (azo compound methyl orange), 18% binder polyimide resin, 54% solvent xylene, and 4% additive stearic acid.

[0092] A method for preparing an infrared radiation material comprises the following steps:

[0093] (1) forming silver metal on the surface of the high-density polyethylene substrate layer by a vacuum magnetron sputtering coating method to form a silver metal layer with a thickness of 100 nm;

[0094] (2) forming a nickel metal layer on the surface of the silver metal layer obtained in step (1) by vacuum magnetron sputtering coating method to form a nickel metal layer with a thickness of 5 μm;

[0095] (3) mixing the raw materials of the ink layer to obtain ink; forming the infrared-transmitting ink containing aluminum-modified vanadium dioxide on the surface of the nickel metal layer obtained in step (2) by screen printing to form an ink layer with a thickness of 4.7 μm;

[0096] (4) Spraying an organic solution of polymethyl methacrylate containing an ultraviolet absorber onto the surface of the ink layer obtained in step (3) to form a transparent polymethyl methacrylate film containing an ultraviolet absorber (0.5% by weight) and having a thickness of 1 μm as a polymer protective layer to obtain an infrared radiation material.

[0097] In Example 3, the preparation method of aluminum-modified vanadium dioxide is different from that in Example 1 only in that an equal amount of Al2O3 is used to replace the tungsten trioxide in Example 1, and the rest is the same as in Example 1.

[0098] Example 4

[0099] An infrared radiation material, comprising a polyvinyl chloride base material layer, a metal layer (a zinc metal layer of 13 μm, a chromium metal layer of 7 μm, a platinum metal layer of 70 nm), an ink layer with a thickness of 2 μm, and a polyethylene terephthalate protective layer with a thickness of 3 μm containing an ultraviolet absorber;

[0100] Calculated by weight percentage, the raw material formula of the ink layer is: 5% titanium-modified vanadium dioxide, 7% cyan dye (anthraquinone compound 9,10-anthraquinone), 7% magenta dye (azo compound methyl red), 7% yellow dye (azo compound methyl orange), 19% binder polyimide resin, 50% solvent xylene, and 5% additive stearic acid.

[0101] A method for preparing an infrared radiation material comprises the following steps:

[0102] (1) forming a zinc metal layer on the surface of a polyvinyl chloride (PVC) substrate layer by electroplating to form a zinc metal layer with a thickness of 13 μm;

[0103] (2) forming chromium metal on the surface of the zinc metal layer obtained in step (1) by electron beam evaporation coating method to form a chromium metal layer with a thickness of 7 μm;

[0104] (3) forming platinum metal on the surface of the chromium metal layer obtained in step (2) by electron beam evaporation coating to form a platinum metal layer with a thickness of 70 nm;

[0105] (4) mixing the raw materials of the ink layer to obtain ink; and forming the ink on the surface of the platinum metal layer obtained in step (3) by coating to form an ink layer with a thickness of 2 μm;

[0106] (5) A transparent polyethylene terephthalate film with a thickness of 3 μm and containing an ultraviolet absorber (0.5% by weight) is covered on the surface of the ink layer obtained in step (4) by hot pressing to form a polymer protective layer, thereby preparing an infrared radiation material.

[0107] In Example 4, the preparation method of titanium-modified vanadium dioxide is different from that of Example 1 only in that an equal amount of TiO2 is used to replace the tungsten trioxide in Example 1, and the rest is the same as Example 1.

[0108] Comparative Example 1

[0109] The only difference between Comparative Example 1 and Example 1 is that the composition of the ink layer of Comparative Example 1 does not contain tungsten-modified vanadium dioxide, that is, by weight percentage, the raw material formula of the ink layer of Comparative Example 1 is: 6% cyan dye, 6% magenta dye, 6% yellow dye, 16% binder, 63% solvent, and 3% additive, and the rest is the same as Example 1.

[0110] Comparative Example 2

[0111] The only difference between Comparative Example 2 and Example 4 is that the composition of the ink layer of Comparative Example 2 does not contain titanium-modified vanadium dioxide, that is, the raw material formula of the ink layer of Comparative Example 2 is, by weight percentage, 7% cyan dye, 7% magenta dye, 7% yellow dye, 19% binder, 55% solvent, and 5% additive, and the rest is the same as Example 4.

[0112] Performance Testing

[0113] The infrared radiation materials prepared in Examples 1-4 and Comparative Examples 1-2 were tested for infrared radiation rates, and the test results are shown in Table 1.

[0114] Table 1: Infrared emissivity test results of infrared radiation materials of Examples 1-4 and Comparative Examples 1-2

[0115] Test items Example 1 Example 2 Example 3 Example 4 Comparative Example 1 Comparative Example 2 Infrared emissivity 0.09 0.12 0.15 0.14 0.16 0.21

[0116] It can be seen from Table 1 that the infrared radiation material of the present invention has a lower infrared radiation rate.

[0117] The ink layer of Comparative Example 1 does not contain tungsten-modified vanadium dioxide, and the ink layer of Comparative Example 4 does not contain titanium-modified vanadium dioxide, so that the infrared radiation rate of the infrared radiation material prepared in Comparative Example 1 is significantly higher than that of Example 1, which is 1.8 times that of Example 1, and the infrared radiation rate of the infrared radiation material prepared in Comparative Example 2 is significantly higher than that of Example 4, which is 1.5 times that of Example 4. This indicates that adding modified vanadium dioxide to the ink layer plays an extremely important role in reducing the infrared radiation rate.

[0118] In summary, the present invention uses a multi-layer metal layer with high infrared reflection and low infrared emissivity as the bottom layer, and the multi-layer metal layer exhibits a strong reflection and low absorption effect in the mid-infrared and far-infrared bands; the ink layer allows infrared rays to pass through and reflect on the surface of the metal layer with less absorption, and the ink layer adds modified vanadium dioxide, and the doping modification of the metal material in the vanadium dioxide can greatly reduce its phase change temperature, so that the phase change drops to room temperature or below, thereby significantly reducing the infrared emissivity. The layers work together to obtain an infrared radiation material with a lower infrared emissivity.

[0119] The above embodiments are only used to illustrate the technical solution of the present invention rather than to limit the protection scope of the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced by equivalents without departing from the essence and scope of the technical solution of the present invention.

Claims

1. An infrared radiation material, characterized in that: It includes a substrate layer, a metal layer, an ink layer and a polymer protective layer stacked in sequence; The ink layer comprises modified vanadium dioxide; The modified vanadium dioxide is obtained by modifying vanadium oxychloride with a metal compound.

2. The infrared radiation material according to claim 1, characterized in that: The metal in the metal layer includes at least one of aluminum, titanium, vanadium, chromium, manganese, iron, tin, cobalt, nickel, copper, zinc, germanium, terbium, ruthenium, rhodium, palladium, silver, antimony, iridium, gold, and platinum; and / or the number of layers of the metal layer is greater than 1.

3. The infrared radiation material according to claim 1, characterized in that: The metal in the metal compound includes at least one of tungsten, magnesium, chromium, aluminum, gold, molybdenum and titanium.

4. The infrared radiation material according to claim 1, characterized in that: The preparation method of the modified vanadium dioxide is: Vanadium dichloride, sodium citrate and a metal compound are mixed, and then sodium carbonate and a coupling agent are added, reacted and calcined to obtain the modified vanadium dioxide.

5. The infrared radiation material according to claim 1, characterized in that: The ink layer also includes dyes, connecting materials, solvents and additives.

6. The infrared radiation material according to claim 5, characterized in that: Calculated by weight percentage, the ink layer comprises 0.9-6.5% of modified vanadium dioxide, 16.5-27% of dye, 15-22% of connecting material, 39-65.1% of solvent and 2.5-5.5% of additive.

7. The infrared radiation material according to any one of claims 1 to 6, characterized in that: The composition of the substrate layer includes at least one of polyethylene terephthalate, polypropylene, polyethylene, and polyvinyl chloride; and / or the composition of the polymer protective layer includes a polymer material and an ultraviolet absorber; the polymer material includes at least one of polycarbonate, polyethylene, polypropylene, trans-1,4-polyisoprene, polymethyl methacrylate, acrylonitrile-butadiene-styrene copolymer, and polyethylene terephthalate.

8. The method for preparing the infrared radiation material according to any one of claims 1 to 7, characterized in that: The following steps are involved: A metal layer, an ink layer and a polymer protective layer are sequentially prepared on the substrate layer to obtain the infrared radiation material.

9. The preparation method according to claim 8, characterized in that: The metal layer is formed on the surface of the substrate layer by vacuum evaporation coating, vacuum magnetron sputtering coating, radio frequency magnetron sputtering coating, electron beam evaporation coating, electroplating or chemical plating; and / or the ink layer is formed on the surface of the metal layer by screen printing or coating.

10. A stealth device, characterized in that: The infrared radiation material comprises the infrared radiation material according to any one of claims 1 to 7.

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