Two-component pouring sealant for settlement-resistant photovoltaic module and preparation method of two-component pouring sealant
Through chemical modification and anti-settling agent coating technology, the problem of sedimentation of two-component potting powder is solved, and the dual effects of product stability and viscosity control are achieved.
Patent Information
- Application Number
- CN202411762862.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-03
- Publication Date
- 2025-04-11
- Estimated Expiration
- 2044-12-03
AI Technical Summary
The existing two-component potting glue is prone to settle under long-term standing conditions, resulting in unstable use. Anti-settlement methods such as the use of powder compound of different particle sizes may lead to excessive colloid viscosity and affect the operation of the glue machine.
Through chemical modification, the powder has both organic-inorganic properties. Anti-settling agents are used to physically coat the reinforcement filler to improve the compatibility between the filler and silicone oil and avoid settlement.
It effectively avoids powder settlement, ensures the consistent surface dryness of the potting glue, avoids rising viscosity, simplifies the preparation process, and improves product stability.
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Abstract
Description
Technical Field
[0001] The invention relates to the technical field of potting glue processing, and in particular to a two-component potting glue for a subsidence-resistant photovoltaic module and a preparation method thereof. Background Art
[0002] Silicone rubber is an organic polysiloxane polymer. Due to its chemical structure, it has both organic and inorganic properties. Two-component potting glue is widely used in photovoltaic module junction boxes because of its low viscosity, flowability, and fast curing properties. It can effectively protect electronic components and prevent external water molecules from invading and affecting them. Because silicone has a low polarity, inorganic powder will settle from the colloid to the bottom of the barrel under long-term static conditions, which will have an adverse effect on the use of potting glue.
[0003] The current method used on the market to resist sedimentation is mainly to use two powders with different particle sizes in combination. This may cause the colloid viscosity to be too high, which is not conducive to the operation of the glue machine and has certain limitations. Summary of the invention
[0004] The purpose of the present invention is to provide a two-component potting adhesive for a settling-resistant photovoltaic module and a preparation method thereof, which can solve the disadvantage of poor powder settling performance and improve product stability through chemical modification so that the powder has both organic and inorganic properties.
[0005] A two-component potting adhesive for a subsidence-resistant photovoltaic module, comprising a component A and a component B; the component A comprises, by weight, 100 parts of α,ω-dihydroxy polydimethylsiloxane, 20.5-105 parts of a modified reinforcing filler, and 0.5-5 parts of a deep-layer curing agent; Component B includes, by weight, 20-100 parts of silicone oil, 0.5-5 parts of coupling agent, 0.5-20 parts of crosslinking agent, and 0.1-10 parts of catalyst; The modified reinforcing filler is prepared by coating the reinforcing filler with an anti-settling agent.
[0006] The preparation process of the modified reinforcing filler is: the anti-settling agent and the reinforcing filler are blended and dried to obtain the modified reinforcing filler; the mass ratio of the anti-settling agent to the reinforcing filler is 0.5-5:20-100.
[0007] The viscosity of the α,ω-dihydroxy polydimethylsiloxane in the A component at 25° C. is 1500-10000 mpa·s, preferably 1500 mpa·s; The silicone oil in component B is one or a combination of methyl silicone oil, hydroxy silicone oil, vinyl silicone oil or amino silicone oil, preferably methyl silicone oil with a viscosity of 10-200 mpa·s at 25°C, more preferably methyl silicone oil with a viscosity of 50 mpa·s at 25°C.
[0008] The reinforcing filler is one or a combination of montmorillonite, nano-calcium carbonate, aluminum hydroxide, fumed silica, silicon micropowder or quartz powder; preferably, by mass percentage, the reinforcing filler contains 40-60% aluminum hydroxide, and the rest is one or a combination of fumed silica or magnesium hydroxide.
[0009] The anti-settling agent is one or a combination of stearic acid, amino silicone oil emulsion, SBR emulsion, hexamethyldisilazane or polyamide wax; preferably, stearic acid and polyamide wax are compounded or SBR emulsion and hexamethyldisilazane are compounded, and more preferably, stearic acid and polyamide wax are compounded in a mass ratio of 4:1, or SBR emulsion and hexamethyldisilazane are compounded in a mass ratio of 3:1.
[0010] The deep curing agent is one or a combination of soda ash, gallstones, green vitriol or alum.
[0011] The coupling agent is one or more combinations of γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-glycidyloxypropyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, vinyltriethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane or vinyltrimethoxysilane, preferably a combination of at least two of γ-aminopropyltriethoxysilane, vinyltrimethoxysilane or γ-aminopropyltrimethoxysilane; The crosslinking agent is one or more combinations of ethyl orthosilicate, methyl orthosilicate, n-propyltrimethoxysilane, vinyltriacetoxysilane, polymethyltriethoxysilane or ethyltriacetoxysilane; The catalyst is one or more combinations of chelated tin, stannous octoate, stannous isooctanoate, dibutyltin dilaurate or dibutyltin diacetate.
[0012] A method for preparing a two-component potting adhesive for a subsidence-resistant photovoltaic module, comprising the following steps: Preparation of component A: the anti-settling agent and the reinforcing filler are mixed and dried to obtain a modified reinforcing filler; the modified reinforcing filler and the deep curing agent are sequentially added to α, ω-dihydroxy polydimethylsiloxane, mixed and stirred, and vacuumed and degassed to obtain component A; Preparation of component B: Silicone oil, coupling agent, cross-linking agent and catalyst are mixed and stirred, and vacuum degassing is performed to obtain component B.
[0013] The anti-settling agent and reinforcing filler are blended at a temperature of 80-90° C. for 30-45 min, with a stirring speed of 180 r / min-200 r / min; during the preparation of components A and B, the mixing and stirring time is 25-60 min, and the vacuum degree is -0.09 to -0.06 MPa.
[0014] The mass ratio of component A to component B is 4 to 6:1, preferably 6:1.
[0015] The present invention has the following beneficial effects: The two-component potting glue of the present invention adopts a special modification method, that is, the compatibility between the filler and the silicone oil is improved by physically coating the reinforcing filler with an anti-settling agent, and the sedimentation phenomenon caused by density and polarity differences is effectively avoided. This not only ensures the consistency of the surface dryness of the potting glue, but also effectively avoids the increase of the viscosity of the potting glue.
[0016] The invention simplifies the preparation process and is beneficial to workshop operation by optimizing the formula and process parameters during the preparation process of the potting glue. DETAILED DESCRIPTION
[0017] The embodiments of the present invention will be described in detail below with reference to examples, but those skilled in the art will appreciate that the following examples are only used to illustrate the present invention and should not be construed as limiting the scope of the present invention.
[0018] The viscosity of the α,ω-dihydroxypolydimethylsiloxane selected in the following examples and comparative examples at 25° C. is 1500 mpa·s, and the viscosity of the methyl silicone oil at 25° C. is 150 mpa·s.
[0019] Example 1 Preparation of modified aluminum hydroxide: 2 parts of stearic acid and 0.5 parts of polyamide wax are compounded, and then mixed with 10 parts of aluminum hydroxide, stirred at 80° C. for 45 minutes at a stirring speed of 180 r / min, and the stearic acid and polyamide wax are used to coat the aluminum hydroxide to obtain modified aluminum hydroxide; Preparation of modified magnesium hydroxide: 2 parts of stearic acid and 0.5 parts of polyamide wax are compounded, and then mixed with 10 parts of magnesium hydroxide, stirred at 80° C. for 45 minutes at a stirring speed of 180 r / min, and the stearic acid and polyamide wax are used to coat the magnesium hydroxide to obtain modified magnesium hydroxide; Preparation of component A: Add all the modified aluminum hydroxide and modified magnesium hydroxide prepared above to 100 parts of α, ω-dihydroxy polydimethylsiloxane, then add 1 part of green vitriol, stir at 40° C. for 45 minutes with a planetary machine, and vacuum degree -0.09 MPa to obtain component A; Preparation of component B: Add 100 parts of methyl silicone oil, 0.5 parts of γ-aminopropyltrimethoxysilane, 0.5 parts of vinyltrimethoxysilane, 0.5 parts of γ-aminopropyltriethoxysilane, 0.5 parts of ethyl orthosilicate and 0.5 parts of chelated tin into a planetary machine, stir for 30 minutes at 23°C, vacuum degree -0.09 MPa, and vacuum degas to obtain component B.
[0020] Example 2 The difference from Example 1 is that the modified reinforcing filler in component A is only modified magnesium hydroxide, and the added amount of modified magnesium hydroxide is twice that of Example 1.
[0021] Preparation of component A: Add modified magnesium hydroxide to 100 parts of α, ω-dihydroxy polydimethylsiloxane, then add 1 part of green vitriol, stir at 40° C. for 45 minutes with a planetary machine, and vacuum degree -0.09 MPa to obtain component A; Preparation of component B: Add 100 parts of methyl silicone oil, 0.5 parts of γ-aminopropyltrimethoxysilane, 0.5 parts of vinyltrimethoxysilane, 0.5 parts of γ-aminopropyltriethoxysilane, 0.5 parts of ethyl orthosilicate and 0.5 parts of chelated tin into a planetary machine, stir for 30 minutes at 23°C, vacuum degree -0.09 MPa, and vacuum degas to obtain component B.
[0022] Example 3 The difference from Example 1 is that the modified reinforcing filler in component A is only modified aluminum hydroxide, and the added amount of modified aluminum hydroxide is twice that of Example 1.
[0023] Preparation of component A: All modified aluminum hydroxide was added to 100 parts of α, ω-dihydroxy polydimethylsiloxane, and then 1 part of green vitriol was added, and the mixture was stirred at 40° C. for 45 minutes with a planetary mixer and a vacuum degree of -0.09 MPa to obtain component A; Preparation of component B: Add 100 parts of methyl silicone oil, 0.5 parts of γ-aminopropyltrimethoxysilane, 0.5 parts of vinyltrimethoxysilane, 0.5 parts of γ-aminopropyltriethoxysilane, 0.5 parts of ethyl orthosilicate and 0.5 parts of chelated tin into a planetary machine, stir for 30 minutes at 23°C, vacuum degree -0.09 MPa, and vacuum degas to obtain component B.
[0024] Example 4 The difference from Example 1 is that the anti-settling agent is SBR emulsion and hexamethyldisilazane, which are compounded in a mass ratio of 3:1.
[0025] Preparation of modified aluminum hydroxide: 1.5 parts of SBR emulsion and 0.5 parts of hexamethyldisilazane are compounded, and then mixed with 10 parts of aluminum hydroxide, stirred at 80° C. for 45 minutes at a stirring speed of 180 r / min, and SBR and hexamethyldisilazane are used to coat aluminum hydroxide to obtain modified aluminum hydroxide; Preparation of modified magnesium hydroxide: 1.5 parts of SBR emulsion and 0.5 parts of hexamethyldisilazane are compounded, and then mixed with 10 parts of magnesium hydroxide, stirred at 80° C. for 45 minutes at a stirring speed of 180 r / min, and SBR and hexamethyldisilazane are used to coat magnesium hydroxide to obtain modified magnesium hydroxide; Preparation of component A: Add all the modified aluminum hydroxide and modified magnesium hydroxide prepared above to 100 parts of α, ω-dihydroxy polydimethylsiloxane, then add 1 part of green vitriol, stir at 40° C. for 45 minutes with a planetary machine, and vacuum degree -0.09 MPa to obtain component A; Preparation of component B: Add 100 parts of methyl silicone oil, 0.5 parts of γ-aminopropyltrimethoxysilane, 0.5 parts of vinyltrimethoxysilane, 0.5 parts of γ-aminopropyltriethoxysilane, 0.5 parts of ethyl orthosilicate and 0.5 parts of chelated tin into a planetary machine, stir for 30 minutes at 23°C, vacuum degree -0.09 MPa, and vacuum degas to obtain component B.
[0026] Example 5 The difference from Example 1 is that gallstone is used as the deep curing agent.
[0027] Preparation of component A: Add all the modified aluminum hydroxide and modified magnesium hydroxide prepared in Example 1 to 100 parts of α, ω-dihydroxypolydimethylsiloxane, then add 1 part of gallstone, and stir at 40° C. for 45 minutes with a planetary mixer, and the vacuum degree is -0.09 MPa to obtain component A; Preparation of component B: Add 100 parts of methyl silicone oil, 0.5 parts of γ-aminopropyltrimethoxysilane, 0.5 parts of vinyltrimethoxysilane, 0.5 parts of γ-aminopropyltriethoxysilane, 0.5 parts of ethyl orthosilicate and 0.5 parts of chelated tin into a planetary machine, stir for 30 minutes at 23°C, vacuum degree -0.09 MPa, and vacuum degas to obtain component B.
[0028] Example 6 The difference from Example 1 is that the coupling agent is 1 part of γ-aminopropyltrimethoxysilane and 0.5 part of γ-aminopropyltriethoxysilane.
[0029] Preparation of component A: Add all the modified aluminum hydroxide and modified magnesium hydroxide prepared in Example 1 to 100 parts of α, ω-dihydroxypolydimethylsiloxane, and then add 1 part of green vitriol, and stir at 40° C. for 45 minutes with a planetary mill, and the vacuum degree is -0.09 MPa to obtain component A; Preparation of component B: Add 100 parts of methyl silicone oil, 0.5 parts of γ-aminopropyltrimethoxysilane, 0.5 parts of γ-aminopropyltriethoxysilane, 0.5 parts of ethyl orthosilicate and 0.5 parts of chelated tin into a planetary machine, stir for 30 minutes at 23°C, vacuum degree -0.09 MPa, and vacuum degas to obtain component B.
[0030] Comparative Example 1 Different from Example 1, aluminum hydroxide and aluminum hydroxide are not pre-modified, and the two, stearic acid and polyamide wax are directly added to 100 parts of α, ω-dihydroxypolydimethylsiloxane.
[0031] The components A and B of the above examples and comparative examples were mixed evenly at a mass ratio of 6:1, and tested according to GB / T29595-2013. The initial surface drying time, gel time, tensile strength, viscosity and hardness of the two-component potting glue were tested, and the results are shown in Table 1.
[0032] Table 1 Performance test results of potting glue obtained in Examples and Comparative Examples
[0033] It can be seen from the data in the above table that the two-component potting glue provided by the present invention has better anti-settling properties than the potting glue prepared by unmodified powder, and can also improve the viscosity of the system, promote the deep solidification of the colloid, and reduce the influence of water vapor factors in the environment on the colloid; according to Examples 1, 4 and Comparative Example 1, it can be seen that the compounding of stearic acid and polyamide wax, SBR emulsion and hexamethyldisilazane can significantly improve the mechanical strength of the colloid; according to the data of Examples 1, 2, and 3, the anti-settling effect is further improved by compounding modified aluminum hydroxide and modified magnesium hydroxide. In addition, the potting glue prepared by unmodified powder will also have a phenomenon of too long surface drying time, which affects the actual use of the potting glue.
Claims
1. A two-component potting adhesive for a subsidence-resistant photovoltaic module, comprising component A and component B, characterized in that: Component A includes, by weight, 100 parts of α, ω-dihydroxy polydimethylsiloxane, 20.5-105 parts of modified reinforcing filler, and 0.5-5 parts of deep curing agent; Component B includes, by weight, 20-100 parts of silicone oil, 0.5-5 parts of coupling agent, 0.5-20 parts of crosslinking agent, and 0.1-10 parts of catalyst; The modified reinforcing filler is prepared by coating the reinforcing filler with an anti-settling agent.
2. The two-component potting adhesive for a subsidence-resistant photovoltaic module according to claim 1, characterized in that: The preparation process of the modified reinforcing filler is: the anti-settling agent and the reinforcing filler are blended and dried to obtain the modified reinforcing filler; the mass ratio of the anti-settling agent to the reinforcing filler is 0.5-5:20-100.
3. The two-component potting adhesive for a subsidence-resistant photovoltaic module according to claim 1, characterized in that: The viscosity of the α,ω-dihydroxy polydimethylsiloxane in the A component at 25° C. is 1500-10000 mpa·s, preferably 1500 mpa·s; The silicone oil in component B is one or a combination of methyl silicone oil, hydroxy silicone oil, vinyl silicone oil or amino silicone oil, preferably methyl silicone oil with a viscosity of 10-200 mpa·s at 25°C, more preferably methyl silicone oil with a viscosity of 50 mpa·s at 25°C.
4. The two-component potting adhesive for a subsidence-resistant photovoltaic module according to claim 2, characterized in that: The reinforcing filler is one or a combination of montmorillonite, nano-calcium carbonate, aluminum hydroxide, fumed silica, silicon micropowder or quartz powder; preferably, by mass percentage, the reinforcing filler contains 40-60% aluminum hydroxide, and the rest is one or a combination of fumed silica or magnesium hydroxide.
5. The two-component potting adhesive for a subsidence-resistant photovoltaic module according to claim 2, characterized in that: The anti-settling agent is one or a combination of stearic acid, amino silicone oil emulsion, SBR emulsion, hexamethyldisilazane or polyamide wax; preferably, stearic acid and polyamide wax are compounded or SBR emulsion and hexamethyldisilazane are compounded, and more preferably, stearic acid and polyamide wax are compounded in a mass ratio of 4:1, or SBR emulsion and hexamethyldisilazane are compounded in a mass ratio of 3:
1.
6. The two-component potting adhesive for a subsidence-resistant photovoltaic module according to claim 1, characterized in that: The deep curing agent is one or a combination of soda ash, gallstones, green vitriol or alum.
7. The two-component potting adhesive for a subsidence-resistant photovoltaic module according to claim 1, characterized in that: The coupling agent is one or more combinations of γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-glycidyloxypropyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, vinyltriethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane or vinyltrimethoxysilane, preferably a combination of at least two of γ-aminopropyltriethoxysilane, vinyltrimethoxysilane or γ-aminopropyltrimethoxysilane; The crosslinking agent is one or more combinations of ethyl orthosilicate, methyl orthosilicate, n-propyltrimethoxysilane, vinyltriacetoxysilane, polymethyltriethoxysilane or ethyltriacetoxysilane; The catalyst is one or more combinations of chelated tin, stannous octoate, stannous isooctanoate, dibutyltin dilaurate or dibutyltin diacetate.
8. A method for preparing a two-component potting adhesive for a subsidence-resistant photovoltaic module according to any one of claims 1 to 7, characterized in that: Here are the steps: Preparation of component A: the anti-settling agent and the reinforcing filler are mixed and dried to obtain a modified reinforcing filler; the modified reinforcing filler and the deep curing agent are sequentially added to α, ω-dihydroxy polydimethylsiloxane, mixed and stirred, and vacuumed and degassed to obtain component A; Preparation of component B: Silicone oil, coupling agent, cross-linking agent and catalyst are mixed and stirred, and vacuum degassing is performed to obtain component B.
9. The method for preparing a two-component potting adhesive for a subsidence-resistant photovoltaic module according to claim 8, characterized in that: The anti-settling agent and reinforcing filler are blended at a temperature of 80-90° C. for 30-45 min, with a stirring speed of 180 r / min-200 r / min. During the preparation of components A and B, the mixing and stirring time is 25-60 min, and the vacuum degree is -0.09 to -0.06 MPa.
10. The method for preparing a two-component potting adhesive for a subsidence-resistant photovoltaic module according to claim 8, characterized in that: The mass ratio of component A to component B is 4 to 6:1, preferably 6:1.
Citation Information
Patent Citations
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