SMD anti-sulfuration plant lamp and preparation method thereof

Abstract

The invention relates to the technical field of LED (Light Emitting Diode) plant lamps, solves the problems of poor anti-vulcanization capability and non-uniform coating in the prior art, and provides an SMD (Surface Mount Device) anti-vulcanization plant lamp and a preparation method thereof. The plant lamp comprises a plurality of LED lamp beads, each LED lamp bead comprises a support and a light-emitting chip, and the light-emitting wavelengths of the light-emitting chips of different LED lamp beads are the same or different; the surface of the LED lamp bead is provided with a first coating through a vacuum coating, the first coating has a first preset thickness, the first coating is made of one or a combination of more of aluminum oxide, silicon oxide or silicon nitride, the support is provided with a functional area, the functional area is provided with a second coating through a vacuum coating, and the second coating has a second preset thickness. The second coating has a second preset thickness, and a third coating is further arranged on the surface of the first coating. By adopting a vacuum coating technology and a coating material, more reliable protection is provided for the SMD plant lamp, the stability of a product is improved, and the service life of the product is prolonged.

Description

Technical Field

[0001] The present invention relates to the technical field of LED plant lamps, and in particular to an SMD anti-sulfurization plant lamp and a preparation method thereof. Background Art

[0002] Plant lights are artificial light sources that are specially designed to simulate sunlight and provide the light needed for plant growth. Plant lights have important applications in agricultural production, especially in greenhouse cultivation, vertical agriculture, and indoor plant cultivation. Unlike ordinary lighting fixtures, plant lights must not only provide a certain light intensity, but also provide a specific spectrum range according to the growth needs of different plants. Common plant lights use LED technology, which has become the mainstream choice for modern plant lighting due to its high energy efficiency, long life, and adjustable spectrum.

[0003] The core component of LED plant lights is the LED lamp bead, which consists of a bracket and a light-emitting chip. The light-emitting chip is the light source part of the lamp bead. In order to improve the performance and service life of plant lamps, protection measures on the surface of LED lamp beads are crucial, especially in harsh environments such as humidity and warmth. The anti-sulfurization performance of LED lamp beads is a key factor affecting their reliability and stability. Sulfurization is a chemical reaction that usually occurs when the metal part of the LED lamp bead comes into contact with sulfides in the environment, resulting in the formation of a sulfide film on the metal surface, which affects the performance of the LED lamp bead, especially the light decay and light output stability. In the application of plant lamps, since the light source is often exposed to high temperature, high humidity and sulfiding gas environments, anti-sulfurization has become an important technical challenge in the design of LED plant lamps.

[0004] In order to improve the anti-sulfurization ability of LED lamp beads, the existing technology has adopted a variety of protective measures. For example, special packaging materials (such as AB glue, epoxy resin, etc.) are used to seal the LED lamp beads, or protective coatings such as polyurethane, silicone, etc. are applied to the surface of the LED lamp beads. However, most of these protective measures can only provide limited anti-sulfurization protection. Especially during long-term use, the coating or packaging material on the surface of the lamp beads is prone to aging or deterioration, resulting in a decrease in the anti-sulfurization effect. At present, most of the LED plant lights on the market are protected by simple packaging glue or coating, but the stability and protective effect of these protective coatings have certain limitations, especially in high humidity, high temperature and sulfur-rich environments. The existing coatings are often difficult to effectively prevent the occurrence of sulfurization reactions, resulting in accelerated light decay of LED lamp beads and shortened service life.

[0005] Although existing coatings (such as encapsulation glue, polyurethane coating, etc.) can provide certain anti-sulfurization protection, the protective effect is difficult to sustain in environments with high temperature, high humidity and high concentration of sulfide gases. The coating is prone to aging or corrosion, resulting in a decrease in anti-sulfurization ability. Summary of the invention

[0006] In view of this, an embodiment of the present invention provides an SMD anti-sulfurization plant lamp and a preparation method thereof, so as to solve the problem that the anti-sulfurization solution of the plant lamp in the prior art has limited protective effect.

[0007] In a first aspect, an embodiment of the present invention provides an SMD anti-sulfurization plant lamp, comprising: A plurality of LED lamp beads, wherein the LED lamp beads include a bracket and a light-emitting chip, the light-emitting chip is mounted on the bracket, and the light-emitting wavelengths of the light-emitting chips of different LED lamp beads are the same or different; The surface of the LED lamp bead is provided with a first coating by vacuum coating, the first coating has a first preset thickness, the material of the first coating is a combination of one or more of aluminum oxide, silicon oxide, or silicon nitride, a functional area is provided on the bracket, the functional area is provided with a second coating by vacuum coating, the second coating has a second preset thickness, a third coating is also provided on the surface of the first coating, the third coating has a third preset thickness, the first coating and the second coating are made of the same material, the first preset thickness is greater than the third preset thickness, and the second preset thickness is greater than the first preset thickness.

[0008] Preferably, the light emitting wavelength of the light emitting chip belongs to a preset wavelength range, and the preset wavelength range includes a combination of one or more of a first wavelength range of 360-410nm, a second wavelength range of 410-500nm, a third wavelength range of 500-600nm, a fourth wavelength range of 600-700nm and a fifth wavelength range of 700-1000nm.

[0009] Preferably, the material of the first coating layer and the second coating layer is silicon dioxide, and the material of the third coating layer is AF glue.

[0010] Preferably, the LED lamp bead includes fluorescent powder, and the fluorescent powder is fluoride.

[0011] Preferably, the first preset thickness is 100 nm, the second preset thickness is 300 nm, and the third preset thickness is 30 nm.

[0012] In a second aspect, an embodiment of the present invention further provides a method for preparing an SMD anti-sulfur plant lamp, which is used to prepare the SMD anti-sulfur plant lamp described in the first aspect, and the preparation method comprises: Cleaning the surface of the bracket and drying the cleaned bracket; Performing vacuum coating on the functional area of ​​the bracket to form a second coating having a second preset thickness; Fixing the light-emitting chip on the cleaned and dried bracket to obtain a plurality of LED lamp beads; Performing vacuum coating treatment on each of the LED lamp beads to form a first coating layer having a first preset thickness on the surface of the LED lamp beads; Perform vacuum coating on each of the LED lamp beads to form a third coating layer with a third preset thickness on the surface of the first coating layer. Each of the LED lamp beads is post-processed to obtain the SMD anti-sulfurization plant lamp.

[0013] In summary, the beneficial effects of the present invention are as follows: The SMD anti-sulfurization plant lamp and the preparation method thereof provided by the embodiment of the present invention effectively isolate the erosion of external sulfidation gas by forming a layer of aluminum oxide, silicon oxide or silicon nitride coating with strong chemical stability on the surface of the LED lamp bead, significantly improve the anti-sulfurization ability of the LED lamp bead, reduce the impact of the sulfidation reaction on the metal part of the lamp bead, and extend the service life of the lamp bead. The vacuum coating process can achieve uniform deposition of the coating, ensure the consistent protection effect of each area on the surface of the LED lamp bead, and avoid the weak link caused by uneven manual coating of the traditional coating. By improving the anti-sulfurization ability and environmental resistance of the LED lamp bead, the present invention can effectively reduce the light decay of the lamp bead in long-term use, maintain a high light output efficiency, and improve the lighting effect of the plant lamp. Because the coating of the present invention has excellent corrosion resistance and durability, it can effectively prevent the penetration of corrosive substances in the environment, reduce the premature failure of the LED lamp bead due to environmental deterioration, and thus significantly extend the service life of the plant lamp. In summary, the present invention solves the problems of poor anti-sulfurization ability and uneven coating in the prior art by adopting vacuum coating technology and high-quality coating materials, provides more reliable protection for SMD plant lamps, and improves the stability and service life of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the drawings required for use in the embodiment of the present invention will be briefly introduced below. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work, and these are all within the protection scope of the present invention.

[0015] Figure 1 It is a schematic diagram of the process of the preparation method of the SMD anti-sulfurization plant lamp according to an embodiment of the present invention. DETAILED DESCRIPTION

[0016] The features and exemplary embodiments of various aspects of the present invention will be described in detail below. In order to make the purpose, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and Examples. It should be understood that the specific embodiments described herein are only configured to explain the present invention and are not configured to limit the present invention. For those skilled in the art, the present invention can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present invention by illustrating examples of the present invention.

[0017] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0018] Example 1

[0019] An embodiment of the present invention provides an SMD anti-sulfurization plant lamp, comprising: A plurality of LED lamp beads, wherein the LED lamp beads include a bracket and a light-emitting chip, the light-emitting chip is mounted on the bracket, the light-emitting wavelength of the light-emitting chip belongs to a preset wavelength range, and the light-emitting wavelengths of the light-emitting chips of different LED lamp beads are the same or different; The surface of the LED lamp bead is provided with a first coating by vacuum coating, the first coating has a first preset thickness, and the material of the first coating is a combination of one or more of aluminum oxide, silicon oxide, or silicon nitride.

[0020] Specifically, the embodiment of the present invention provides an SMD anti-sulfurization plant lamp, the core innovation of which is to coat a first coating layer composed of one or more materials such as aluminum oxide (Al2O3), silicon oxide (SiO2), silicon nitride (Si3N4) on the surface of the LED lamp bead through a vacuum coating process. The main function of the coating is to improve the anti-sulfurization performance of the LED lamp bead, especially in harsh environments such as high temperature, high humidity, and sulfur-rich gas.

[0021] The LED lamp beads include a bracket and a light-emitting chip. The light-emitting wavelength of the light-emitting chip is within a preset wavelength range, and different wavelengths can be selected according to the spectral requirements of different plants. This design allows the lighting effect of the plant lamp to be customized according to the lighting requirements of different plants. Different LED lamp beads can use the same or different light-emitting wavelengths to adapt to the photosynthetic needs of different plants.

[0022] The material of the first coating layer is composed of one or more of aluminum oxide, silicon oxide or silicon nitride, which have high chemical stability, hardness and good electrical insulation, and can provide strong protection in different environments.

[0023] Alumina has excellent corrosion resistance, especially in high temperature environments, and has stable chemical properties, so it can effectively prevent the surface of LED lamp beads from being corroded by sulfides.

[0024] Silicon oxide has high heat resistance and moisture resistance, as well as strong resistance to ultraviolet light and chemical corrosion, which can improve the durability of LED lamp beads in humid environments.

[0025] Silicon nitride is a very hard and highly heat-resistant material that can provide a stronger protective layer, especially in high temperature and high humidity environments, which can effectively prevent the performance of the lamp beads from deteriorating.

[0026] The thickness of the first coating is set to a first preset thickness according to specific protection requirements. This thickness can ensure that the coating can provide sufficient protection while not affecting the luminous effect of the LED lamp beads or increasing excessive thermal resistance.

[0027] In one embodiment of the present invention, the preset wavelength range includes a combination of one or more of a first wavelength range of 360-410 nm, a second wavelength range of 410-500 nm, a third wavelength range of 500-600 nm, a fourth wavelength range of 600-700 nm and a fifth wavelength range of 700-1000 nm.

[0028] Specifically, in an embodiment of the present invention, the preset wavelength range includes the following bands: 360-410nm, 410-500nm, 500-600nm, 600-700nm, and 700-1000nm. These wavelength ranges correspond to different effects of light on plant growth and photosynthesis, and the growth environment of plants can be optimized by precisely adjusting the spectrum of plant lamps.

[0029] The first wavelength range of 360-410nm is violet light. The violet light band has a certain effect on the photosynthesis and morphological construction of plants, but it is not as strong as blue light and red light. Violet light has a special effect on the photomorphological construction of plants and can affect the morphological development and growth direction of plants. Violet light helps plants grow and develop in short-day environments and regulates the morphological characteristics of plants, such as affecting the growth of plant stems. Violet light helps thicken plant leaves and helps enhance the photosynthetic capacity of plants. The violet light band has an stimulating effect on the synthesis of anthocyanin pigments and can affect the color and aesthetic characteristics of plants. Under the irradiation of violet light, some plants will activate special metabolic pathways and promote the synthesis of components in the plant body (such as plant hormones and secondary metabolites).

[0030] The second wavelength range of 410-500nm is blue light, which has a strong effect on plant growth and photosynthesis, and can regulate the growth morphology and photosynthesis of plants. Specifically, blue light can significantly promote plant photosynthesis, especially in the 430nm and 450nm bands, which play an important role in the chloroplasts of plants. In addition, blue light has the effect of inhibiting excessive growth of plants, especially the growth of plant nodes, which can help plants maintain a short and thick shape. The blue light band helps the differentiation and growth of plant roots, promotes the development of the root system, and supports the differentiation of multiple lateral branches and buds. The blue light band also helps the synthesis of anthocyanins and the synthesis of beneficial substances such as vitamin C, which is beneficial to the overall health of plants.

[0031] The third wavelength range of 500-600nm is green light. Green light has a certain promoting effect on plant photosynthesis and morphological construction, but its effect is smaller than that of blue light and red light. A small amount of green light can enhance photosynthesis, especially increase the photosynthetic efficiency of plants under higher light intensity. For some algae, green light can promote their growth, especially in the photosynthesis of aquatic plants. Too much green light may inhibit the excessive growth of plant stems, keeping the plants short and compact.

[0032] The fourth wavelength range of 600-700nm is red light, which is one of the most important wavelength ranges in plant photosynthesis and has a significant impact on plant growth and development. The specific effects of red light include: Accelerate photosynthesis: Red light plays a vital role in promoting plant photosynthesis, carbohydrate synthesis, etc. Red light is particularly helpful for plant sugar synthesis.

[0033] Promote plant growth and leaf enlargement: Red light is particularly beneficial to long-day plants, accelerating plant development and promoting leaf division and leaf enlargement.

[0034] Photoperiod regulation: Red light can also regulate the photoperiod of plants, affect the flowering and development of plants, extend the lighting time, and promote plant growth.

[0035] Influence on plant photomorphogenesis: Red light has a significant effect on plant photomorphogenesis, which helps to control the morphological characteristics of plants, such as promoting plant branching and stem growth.

[0036] The fifth wavelength range of 700-1000nm is far-infrared light. Far-infrared light plays an important role in the photomorphogenesis, growth regulation and flowering of plants. Far-infrared light can stimulate the extension of plant cells and promote the elongation of plant stems. It has a unique role in promoting plant flowering and seed germination, especially in regulating the flowering period of plants and the speed of seed germination.

[0037] The combination of far-red light and 660nm red light can accelerate photosynthesis and improve the photosynthetic efficiency of plants. The combination of far-red light and red light can adjust the light morphology of plants, such as plant height, branching pattern, etc. In addition, far-red light promotes the vertical growth of plants, especially in the elongation growth stage.

[0038] By using a spectrum covering these specific wavelength ranges in SMD anti-sulfur plant lamps, precise control of the plant growth process can be achieved. Different wavelengths of light can be customized to meet the needs of different plant growth stages, optimizing the plant's photosynthesis, photomorphogenesis, flowering and fruit development and other growth processes. Specifically, 360-410nm purple light promotes photomorphogenesis and anthocyanin synthesis, 410-500nm blue light strengthens photosynthesis and inhibits unnecessary stem elongation, 500-600nm green light helps increase photosynthesis and promote the growth of certain plants in small amounts, 600-700nm red light helps photosynthesis and plant height and leaf enlargement, and 700-1000nm far-red light stimulates plant growth processes such as extended growth, flowering and seed germination.

[0039] Preferably, the material of the first coating is silicon dioxide, a functional area is provided on the bracket, and the functional area is provided with a second coating by vacuum coating, wherein the material of the second coating is the same as that of the first coating, the second coating has a second preset thickness, and the first preset thickness is less than the second preset thickness.

[0040] Specifically, the material of the first coating is silicon dioxide, and the material of the second coating is the same as the first coating, that is, the second coating is also silicon dioxide. The preset thickness of the first coating is less than the preset thickness of the second coating. This means that in an embodiment of the present invention, the silicon dioxide coating will have two layers, each with a different thickness, in order to improve the performance of the coating and enhance its protective effect. The second coating is the main protective layer, providing a strong protective effect, especially to prevent sulfidation and corrosion. The first coating, as a supplementary layer, can enhance the uniformity of the coating while avoiding the problem of local stress concentration caused by thick coatings. By superimposing two layers of silicon dioxide coatings, multiple protections are provided, which helps to improve the ability of anti-sulfurization, moisture resistance and anti-aging.

[0041] The two-layer coating design makes the coating more uniform and stable, reducing the risk of possible coating peeling or damage. The presence of the second film can balance the hardness and flexibility of the film, making the coating resistant to external physical damage while avoiding cracks caused by over-hardening.

[0042] The optical properties of the silica coating, such as refractive index and transmittance, can affect the light output of the LED lamp beads. By adjusting the coating thickness, the scattering and transmission of light can be optimized, thereby improving the light efficiency of the plant lamp. The thin layer design of the second coating helps to improve light transmittance and reduce light reflection loss without affecting the protective effect of the first coating.

[0043] The silicon dioxide coating itself has strong chemical stability and high temperature resistance, and can be used for a long time in high humidity, high temperature and corrosive environments. By setting a second coating on the first coating, failure problems caused by coating shedding or aging can be effectively avoided.

[0044] In one embodiment, the LED lamp bead includes fluorescent powder, and the fluorescent powder is fluoride.

[0045] In this embodiment, the LED lamp bead includes a fluoride phosphor, which means that the luminescent material used in the LED lamp bead is a fluoride-type phosphor, such as KSF phosphor (potassium strontium fluoride phosphor) or other types of fluoride-based phosphors. Fluoride phosphors usually have high chemical stability, can maintain good physical and chemical properties under high temperature or corrosive environments, and are not easy to react with sulfides in the environment. Therefore, it has good sulfurization resistance for LED lamp beads in high-temperature sulfurization environments. Fluoride phosphors usually have low surface activity and can effectively prevent gases (especially sulfide gases) from reacting with the surface of the phosphor, thereby avoiding phosphor degradation and light output attenuation. The stability and low reactivity of fluoride phosphors make it less susceptible to the external environment (such as sulfide gases) during use, so it can significantly extend the service life of LED lamp beads and reduce the failure of lamp beads caused by sulfurization and other reasons.

[0046] Preferably, a third coating is further provided on the surface of the first coating, the material of the third coating is AF glue, the third coating has a third preset thickness, and the third preset thickness is less than the first preset thickness.

[0047] AF (amorphous fluorinated polymer) glue is usually used for surface coating. It has the function of preventing fingerprints, stains and water droplets from adhering, keeping the surface clean and improving the anti-fouling performance. Applying AF glue on the surface of LED lamp beads can reduce the accumulation of grease, dust and stains on the surface during use, keep the surface of the lamp beads clean, and reduce the light decay and light output efficiency decline caused by pollution. The thickness of the third coating is designed to be less than the first coating to ensure that the protective effect of AF glue does not affect the protective performance of the previous silica coating.

[0048] Preferably, the first preset thickness is 100 nm, the second preset thickness is 300 nm, and the third preset thickness is 30 nm.

[0049] Specifically, the thicker second coating (300nm) serves as the main protective layer, which provides strong physical and chemical protection. The first coating is relatively thin (100nm) and its function is to further enhance the uniformity of the coating while improving the protective effect. The thinner coating helps to maintain the protective performance without affecting the light output efficiency of the LED lamp beads. The coating can optimize the light transmittance and scattering effect while ensuring the surface uniformity and anti-sulfurization of the LED lamp beads. The AF glue layer plays the role of anti-fouling and anti-fingerprint. The AF glue layer is thin, which can avoid obvious effects on light transmittance and provide long-lasting anti-fouling ability.

[0050] In Example 1, the LED lamp beads were not subjected to anti-sulfurization treatment, that is, there was no first coating, second coating, and third coating. The experimental conditions were that the experimental temperature was 85℃ ±5℃, the sublimated sulfur concentration was 1.0g / 1000mL, and the experiment lasted for 69 hours (Ta=85℃ ±5℃, 69 hours). After the test, the LED lamp wire was obviously blackened, and there was no dead light phenomenon, but the bottom of the bracket was slightly blackened; In Comparative Example 2, only a 300nm second coating was set on the surface of the functional area of ​​the bracket, and the phosphor used in the LED lamp beads was conventional phosphor, which contained aluminate and nitride. The experiment was carried out under the same conditions as Comparative Example 1. After the experiment, the LED wire was obviously blackened and there was a dead light phenomenon (dead light 1PCS (1 dead chip of the double crystal)); In Example 3, only a 300nm second coating is set on the surface of the functional area of ​​the bracket, and the phosphor used in the LED lamp beads is a fluoride phosphor, such as KSF phosphor. The experiment is carried out under the same conditions. After the experiment, the LED lamp wire is obviously blackened, but there is no dead light phenomenon; In Example 4, a first coating of 100nm is set on the surface of the LED lamp bead, and a second coating of 300nm is set on the surface of the functional area of ​​the bracket. The phosphor used in the LED lamp bead is a conventional phosphor. Conventional phosphor refers to aluminate and nitride. The experiment was carried out under the same conditions. After the experiment, the LED lamp wire was obviously blackened, and there was no dead light phenomenon. In Example 5, a first coating of 100 nm is set on the surface of the LED lamp bead, and a second coating of 300 nm is set on the surface of the functional area of ​​the bracket. The phosphor used in the LED lamp bead is a fluoride phosphor, such as KSF phosphor. The experiment is carried out under the same conditions. After the experiment, the LED lamp wire is slightly blackened, and there is no dead light phenomenon. In a pair of example 6, a first coating of 100 nm is set on the surface of the LED lamp bead, a second coating of 300 nm is set on the surface of the bracket functional area, and a third coating of 30 nm is set on the surface of the first coating. The phosphor used in the LED lamp bead is a conventional phosphor, which contains aluminate and nitride. The experiment was carried out under the same conditions. After the experiment, the LED lamp wire was slightly blackened, and there was no dead light phenomenon. In a preferred embodiment, a first coating of 100 nm is provided on the surface of the LED lamp bead, a second coating of 300 nm is provided on the surface of the support functional area, and a third coating of 30 nm is provided on the surface of the first coating. The fluorescent powder used in the LED lamp bead is a conventional fluorescent powder, and the conventional powder refers to aluminate and nitride. The experiment is carried out under the same conditions. After the experiment, the LED lamp wire does not have a blackening phenomenon, and there is no dead light phenomenon. In Example 7, a 200nm second coating LED lamp bead is set on the surface of the bracket functional area. The fluorescent powder used is conventional fluorescent powder. Conventional powder refers to aluminate and nitride. The experiment is carried out under the same conditions. After the experiment, the LED lamp wire is slightly blackened, and there is no dead light phenomenon. In a pair of example 8, a 400nm second coating LED lamp bead is set on the surface of the bracket functional area. The phosphor used is a conventional phosphor. Conventional phosphor refers to aluminate and nitride. The experiment was carried out under the same conditions. After the experiment, the LED lamp wire was obviously blackened and there was a dead lamp phenomenon. There were 9 PCS of dead lamps (1 dead chip of the double crystal). This experiment systematically compared the performance of LED lamp beads under different anti-sulfurization treatment conditions, covering the effects of different coating settings and phosphor types. The experiment simulated a high-temperature sulfurization environment (85℃ ±5℃, sublimated sulfur 1.0g / 1000mL, for 69 hours) to evaluate the sulfurization resistance of LED lamp beads in this environment. The main observation indicators included the blackening of the wire and the dead light phenomenon. In the absence of any coating protection, the wire was obviously blackened, but there was no dead light phenomenon. There was a slight blackening at the bottom of the bracket, indicating that even without a coating, the LED lamp beads were still affected by sulfurization to a certain extent.

[0051] In a sulfurized environment, LED lamp beads using fluoride phosphors (such as KSF phosphors) show better anti-sulfurization ability than conventional phosphors (aluminate and nitride systems). Although the wire still turns black, the dead light phenomenon is significantly reduced. This shows that fluoride phosphors can effectively inhibit the sulfurization reaction in a high-temperature sulfurized environment and reduce the performance degradation caused by sulfurization.

[0052] The experimental results show that the coating plays a key role in protecting LED lamp beads from sulfurization. Specifically, the combination of a 100nm first coating and a 300nm second coating (such as Comparative Examples 4 and 5) can significantly slow down the impact of sulfurization on LED lamp beads, especially in the case of fluoride phosphors, showing better sulfurization resistance, significantly reducing the degree of blackening of the wire, and no dead light phenomenon. This combination coating can effectively block the penetration of sulfides and reduce the impact of sulfurization reactions on the internal components of LED lamp beads.

[0053] Further optimization was performed by adding a 30nm third coating (such as comparative example 6 and preferred embodiment). The experimental results show that this three-layer coating scheme provides the best anti-sulfurization effect. Under conventional phosphor conditions, the wire of the LED lamp bead is almost not blackened, and the dead lamp phenomenon is completely avoided. This combination scheme not only provides excellent protection performance, but also ensures the long life and stability of the LED lamp bead. It is of great significance for the long-term reliability and performance maintenance of LEDs.

[0054] The choice of coating thickness directly affects the vulcanization tolerance of LED lamp beads. From the experimental results in Comparative Examples 7 and 8, the 200nm coating can provide good protection, the wire is only slightly blackened, and there is no dead light phenomenon. However, the 400nm coating performed poorly, causing the wire to be obviously blackened and a more serious dead light phenomenon (9 dead lights). This result shows that too thick a coating may have an adverse effect on the thermal management and heat dissipation performance of LED lamp beads, and even aggravate the vulcanization reaction in some cases. Therefore, the coating thickness should be reasonably designed according to actual needs, balancing the protection effect and thermal management requirements.

[0055] Based on the experimental results of each group, the best anti-sulfurization design is: apply a 100nm first coating, a 300nm second coating on the surface of the LED lamp bead, and apply a 30nm third coating on the surface of the first coating, and use fluoride phosphors at the same time. This design can effectively reduce the negative impact of sulfurization on LED lamp beads and ensure that they can work stably for a long time in high temperature and sulfurized environments. For future optimization directions, further research can be considered on the optimization of coating materials and thickness, as well as the anti-sulfurization properties of other types of phosphors, so that they can be more widely used in various LED lighting products.

[0056] Example 2

[0057] For the SMD anti-sulfur plant lamp based on Example 1, please refer to Figure 1 The embodiment of the present invention provides a method for preparing an SMD anti-sulfur plant lamp, which is used to prepare the SMD anti-sulfur plant lamp described in the first aspect, and the preparation method includes: S1, cleaning the surface of the bracket and drying the cleaned bracket; Specifically, if there is oil, dust or other impurities on the surface of the bracket, these pollutants will affect the bonding effect of the LED light-emitting chip and the bracket in the subsequent steps, or affect the adhesion of the coating. Cleaning is to remove these impurities and provide an ideal surface to ensure the smooth progress of subsequent processes. Drying is to avoid residual moisture, which may cause the light-emitting chip to be loosely bonded or affect the uniform deposition of the coating on the surface of the bracket, thereby affecting the performance of the LED lamp beads.

[0058] Use solvents such as isopropyl alcohol and deionized water to wipe the surface of the bracket to remove oil, dust or other impurities. You can use ultrasonic cleaning equipment to put the bracket in the solvent for ultrasonic cleaning to further clean the surface of the bracket. After cleaning, use a drying device to dry the bracket to ensure that the surface of the bracket is completely clean and free of moisture. The cleaned bracket surface helps to improve the bonding strength between the LED chip and the bracket, and enhance the overall performance and stability of the LED lamp beads. S2, performing vacuum coating on the functional area of ​​the bracket to form a second coating having a second preset thickness; The bracket is an important component of LED lamp beads, usually made of metal or other materials, used to support the light-emitting chip. The "functional area" of the bracket usually refers to the part of the bracket that is specially designed to perform certain specific functions. These functional areas may include heat dissipation areas, connection areas, or other areas that require special treatment. A specific coating is formed on the surface of the bracket by vacuum coating the functional area of ​​the bracket, usually with a specific thickness (the second preset thickness) to meet the specific needs of the functional area. The thickness and material of the coating are precisely controlled to ensure that it has the required properties, such as improved corrosion resistance, enhanced adhesion, improved heat dissipation performance, etc.

[0059] S3, fixing the light-emitting chip on the cleaned and dried bracket to obtain a plurality of LED lamp beads, wherein the light-emitting wavelengths of the plurality of LED lamp beads belong to the preset wavelength range; Specifically, the light-emitting chip is fixed on the bracket to ensure the electrical connection and heat conduction of the light-emitting chip, while maintaining the physical stability between the chip and the bracket. The selection of a suitable wavelength range is to ensure that the spectrum of the plant lamp meets the needs of plant growth. Different wavelength ranges have different effects on different growth stages and characteristics of plants. Common fixing methods include using conductive glue, lead-free solder, etc. to fix the light-emitting chip to a predetermined position on the bracket. During the fixing process, ensure that the electrodes of the light-emitting chip are in good contact with the electrodes of the bracket. Select appropriate light-emitting chips according to the needs of plant growth. Different wavelength ranges (such as 360-410nm, 410-500nm, 500-600nm, 600-700nm and 700-1000nm) have different effects on plant photosynthesis, light morphology, anthocyanin synthesis, etc.

[0060] S4, performing vacuum coating treatment on each of the LED lamp beads to form a first coating layer having a first preset thickness on the surface of the LED lamp beads; Vacuum coating refers to the process of depositing coating materials on the surface of LED lamp beads to form a protective coating through physical vapor deposition (PVD) technology such as evaporation or sputtering in a vacuum environment. The main function of the coating is to protect LED lamp beads from environmental influences such as moisture, corrosive gases (such as hydrogen sulfide), etc., to prevent the LED lamp beads from sulfidation, light decay or damage. According to the requirements of the coating, select suitable target materials, and deposit these materials on the surface of LED lamp beads through high-frequency magnetron sputtering or evaporation technology. According to the required coating characteristics, adjust the equipment parameters such as deposition rate, power, air pressure, etc. to ensure that the coating is uniform and has sufficient adhesion. Vacuum coating can effectively improve the quality of the coating and enhance its anti-sulfurization, anti-moisture and anti-corrosion capabilities. The uniform coating improves the stability of LED lamp beads, allowing them to work stably in harsh environments and extend their service life.

[0061] S5, performing vacuum coating treatment on each of the LED lamp beads to form a third coating layer having a third preset thickness on the surface of the first coating layer This step is to further process the LED lamp beads that already have the first coating. Through vacuum coating technology, a third coating with a specific thickness (third preset thickness) is formed on the surface of the first coating. The thickness and material of this coating are carefully designed to meet the functional requirements of LED lamp beads, such as improving oxidation resistance, enhancing optical properties, and improving high temperature resistance. Precise control of the thickness of the third coating helps ensure the long-term stability and performance of LED lamp beads.

[0062] S6. Post-process each of the LED lamp beads to obtain the SMD anti-sulfurization plant lamp.

[0063] Post-processing refers to further processing of LED lamp beads after the basic assembly and coating of LED lamp beads, such as curing, inspection, testing, etc., to ensure that the LED lamp beads meet quality standards. If a coating material that requires thermal curing is used, it needs to be cured by heating or ultraviolet irradiation. Through light efficiency testing, stability testing, and environmental testing, ensure that the performance of LED lamp beads is stable under various conditions. Finally, the processed LED lamp beads are installed in the circuit board or lamp to complete the final assembly of the plant lamp. The post-processing steps ensure the quality, stability and performance of LED lamp beads, and avoid light decay or failure due to production defects. Through post-processing, the reliability of LED lamp beads can be improved, ensuring their performance in long-term use and enhancing the market competitiveness of products.

[0064] Preferably, the vacuum coating treatment is performed on each of the LED lamp beads to form a first coating layer having a first preset thickness on the surface of the LED lamp beads, including: S31. Obtaining a target material for vacuum coating according to the material of the first coating, wherein the material of the first coating is silicon dioxide, and the target material is solid silicon dioxide particles; Target material refers to the material used for evaporation or sputtering during the vacuum coating process, which usually has the same or similar chemical composition as the coating material to be plated. The target material will be excited under vacuum conditions and deposited on the surface of the LED lamp bead to form a coating. Solid pure silicon is a silicon material that is not doped with other elements. It is usually used as a target material for the deposition of silicon dioxide. According to the requirements of the coating material, select a suitable target material to ensure the coating quality and deposition effect. The silicon dioxide coating is usually formed by sputtering or evaporating a solid pure silicon target material, so solid pure silicon needs to be used as a target material.

[0065] S32, placing the LED lamp beads and the target material at designated positions in the reaction chamber of the vacuum coating machine respectively; Specifically, a vacuum coating machine is a device used to evaporate or sputter materials onto the surface of an object. It usually includes a reaction chamber, a target material, a heating device, and a gas delivery system. The reaction chamber is a sealed cavity in the vacuum coating machine that contains the LED lamp beads and target materials to be plated. Vacuum extraction and atmosphere control are performed in this chamber to provide a coating environment. Correctly placing the LED lamp beads and target materials in the reaction chamber can ensure the uniformity of the coating process and the quality of the coating. By reasonably arranging the positions of the LED lamp beads and the target materials, the coating can be uniformly deposited and unnecessary influences such as concentrated sputtering or uneven airflow can be avoided.

[0066] S33, acquiring vacuum coating parameters according to the target material corresponding to the first coating and the first preset thickness, wherein the vacuum coating parameters include: evaporation source temperature, target vacuum degree, and gas filling rate; Specifically, the core purpose of this step is to derive appropriate vacuum coating process parameters based on the properties of the target material, such as melting point, vapor pressure, etc., and the requirements of the first coating, such as film thickness and quality requirements. These parameters will directly affect the quality, uniformity, and physical and chemical properties of the film. Therefore, it is crucial to correctly set the evaporation source temperature, target vacuum, and gas filling rate. Based on the evaporation characteristics of silicon dioxide (such as its melting point and vapor pressure), a reasonable temperature range is selected. Generally, the temperature of the target material should be set above its melting point, but not too high to avoid affecting the quality of the film or excessive evaporation. The higher the vacuum degree, the better the evaporation efficiency of the evaporation source and the more stable the film quality. The vacuum degree is usually set within a reasonable range based on the vapor pressure of silicon dioxide. According to the specific needs of vacuum coating, an appropriate gas filling rate is selected. Inflation too fast or too slow will affect the quality of the film. Common gases such as argon are usually flow controlled under low pressure.

[0067] S34, evaporating the target material according to the vacuum coating parameters to form a first coating on the surface of the LED lamp bead; The purpose of this step is to use the vacuum coating parameters (evaporation source temperature, vacuum degree, gas filling rate) set in the previous step to evaporate the target material in a vacuum environment and deposit it on the surface of the LED lamp bead to form a coating of the required thickness. This process will directly affect the quality of the coating and the final performance of the LED lamp bead.

[0068] At the set evaporation source temperature, the target material is heated until it begins to evaporate. The evaporation source needs to be precisely controlled to prevent overheating or temperature fluctuations. The vacuum level is controlled to ensure that the evaporation effect of the evaporation source is as expected. If the vacuum is too high or too low, the evaporation rate will be affected, resulting in unstable film quality. The gas filling rate is controlled to ensure that the atmosphere conditions are suitable for the stable growth of the film during the silicon dioxide evaporation process. During the evaporation process, the film thickness and temperature are monitored to ensure that the film reaches the desired preset thickness.

[0069] S35. When the thickness of the coating reaches a first preset thickness, the vacuum coating process is stopped and the LED lamp bead is cooled.

[0070] During the coating process, the coating thickness is monitored in real time by a thickness sensor (such as reflection interferometry or optical sensor) to ensure that it gradually reaches the preset first thickness target. Ensure that the coating process stops when the coating reaches the preset thickness to avoid excessive deposition causing uneven film layers or affecting the performance of the LED lamp beads. Subsequently, the cooling process is performed to ensure that the film layer is stably attached to the surface of the LED lamp beads at room temperature. Through real-time thickness monitoring, the film thickness is ensured to accurately reach the preset target, avoiding excessive or insufficient coating. Through the cooling process, thermal stress can be avoided to cause the film layer to peel off or deform, ensuring that the coating is stably attached to the surface of the LED lamp beads at room temperature, and improving performance and stability in long-term use.

[0071] In one embodiment, the step S33 includes: S331, dividing the vacuum coating process into at least three coating stages according to the physicochemical properties of the target material and the first preset thickness, wherein thickness growth amounts and / or target deposition rates in different coating stages are different; In the vacuum coating process, the coating process is divided into multiple stages to achieve uniform and precise coating thickness control, especially when the coating requires high precision or different deposition rates or physical and chemical reaction characteristics may be encountered during the deposition of the material. Through staged control, the deposition process can be better adjusted to ensure that the coating quality, uniformity and adhesion and other properties meet the requirements.

[0072] Different materials may have different deposition rates, adsorption characteristics, and deposition behaviors during evaporation or deposition. For example, the deposition rate, reactivity, and gas adsorption of silicon dioxide (SiO2) and AF glue may be different, so different deposition parameters need to be used for different stages.

[0073] Thickness growth refers to the amount of change in coating thickness at each stage, which is usually achieved by controlling the deposition rate at each stage. For example, in the first stage, the thickness growth of the film layer may be small (such as 0-20nm) because we need to ensure the uniformity and adhesion of the coating. In the second stage, the deposition rate can be increased to quickly accumulate the film thickness, and finally in the third stage, the deposition rate can be slowed down to achieve precise final control.

[0074] At different stages of coating, the target deposition rate will be different according to the deposition behavior of the material and the final requirements of the film. In the initial stage, a lower deposition rate can ensure the uniformity of the film and the interlayer adhesion; in the middle stage, the deposition rate is appropriately increased to ensure higher efficiency and greater film thickness; in the final stage, the deposition rate is reduced to avoid surface unevenness or holes caused by too fast accumulation.

[0075] For example, the first stage may be deposited at a low speed (such as 2-5nm / s) to ensure the smoothness of the film layer; the second stage can appropriately increase the deposition rate (such as 10-15nm / s) to accelerate the deposition; the third stage can reduce the deposition rate (such as 1-3nm / s) to ensure the final accuracy of the film layer.

[0076] S332, for each coating stage, obtaining a number of initial parameter combinations of the vacuum coating parameters that meet the corresponding target deposition rate; Specifically, each deposition stage requires a different deposition rate and film quality, and the target deposition rate directly determines the parameters that need to be adjusted during the vacuum coating process. While achieving the target deposition rate at each stage, it is necessary to select a suitable initial parameter combination to ensure that the target deposition rate can be achieved under given conditions. The initial parameter combination is the vacuum coating equipment setting before any adjustment is made, including the initial setting values ​​of parameters such as evaporation source temperature, gas filling rate, and vacuum degree. These initial settings provide starting conditions for the actual deposition process. For each deposition stage, the target deposition rate determines the range of the target vacuum degree and evaporation source temperature. By simulating and calculating each vacuum coating parameter or based on empirical rules, the initial parameter combination required to meet the target deposition rate can be determined.

[0077] S333, taking the coating stage with the largest thickness increase as the reference stage; Specifically, the reference stage refers to the stage with the largest thickness increase among all the coating stages. It is selected as a reference point to compare the adjustment differences of other stages. By selecting the stage with the largest thickness increase as the reference stage, the control accuracy can be guaranteed at the most important stage, thus affecting the coating quality in subsequent stages.

[0078] Among the multiple coating stages, the stage with the largest thickness increase is usually the growth stage, because this is when the main accumulation of the film layer occurs. By selecting this stage as the reference stage, it can be ensured that the parameter adjustments of other stages are carried out around the most critical and influential stage, making the overall coating process more coordinated.

[0079] Since the growth stage has a significant impact on the film thickness, its physical conditions (such as temperature, vacuum degree, gas flow rate, etc.) need to maintain a high degree of stability. Therefore, selecting it as the benchmark stage helps maintain the consistency of the entire process.

[0080] S334, screening the initial parameter combination of the reference stage according to the preset screening rules to obtain the target parameter combination; Specifically, the initial parameter combination is only a starting point and needs to be adjusted according to the specific requirements of different stages. The screening process can eliminate inappropriate parameter combinations to ensure the best deposition quality in the actual coating process. The preset screening rules are usually determined based on the physical properties of the material (such as melting point, evaporation temperature, etc.) and the requirements of the deposition rate. The screened target parameter combination will ensure that the most appropriate deposition speed and film quality are achieved in the benchmark stage. The initial parameters of the benchmark stage are analyzed according to the preset screening rules (such as the relationship between temperature, gas filling rate and vacuum degree) to select the most appropriate parameter combination. For example, if the evaporation source temperature is too high, resulting in a thick film layer or an uneven film layer, the temperature should be lowered. The screening rules may also include comparing the effects of different gas filling rates to find the optimal gas flow rate.

[0081] In one embodiment, when screening the initial parameter combination, a combination with a high degree of match between the deposition rate and the stage thickness growth is preferably selected. For example, a parameter combination is selected in which the deposition rate is within the target range and is consistent with the expected trend of thickness growth. The reason for this rule is that during the coating process, the deposition rate is directly related to the thickness growth. If the deposition rate is too fast, it may cause uneven material accumulation or enter the growth stage too early, affecting the quality of the film layer. If the deposition rate is too slow, the coating efficiency will be reduced, and even the thickness growth will fail to meet the expected requirements at some stages. Therefore, ensuring that the deposition rate matches the thickness growth will help achieve the expected coating effect and avoid problems such as insufficient deposition or uneven film layers.

[0082] In another embodiment, a parameter combination that remains stable within a predetermined vacuum range is preferably selected to ensure that the fluctuation of the vacuum degree change during the entire coating stage is controlled within a set tolerance range (eg, ±5%).

[0083] The influence of vacuum degree on the vacuum coating process is extremely important. Too high or too low vacuum degree will affect the evaporation and deposition efficiency of the coating material, resulting in uneven film quality. In order to ensure the stability of the coating process, it is necessary to ensure that the vacuum degree remains stable within an appropriate range. If the vacuum degree fluctuates too much, it may cause defects in the coating process, which in turn affects the quality of the final product. By selecting a parameter combination with stable vacuum degree, the negative impact of the external environment on the coating quality can be minimized.

[0084] In another embodiment, during screening, a parameter combination that can stabilize the gas filling rate is selected, and the influence of the gas composition in the atmosphere on the material deposition is considered, and those parameter combinations that can ensure a suitable atmosphere are preferentially selected. During the vacuum coating process, the stability of the gas filling rate and the atmosphere composition directly affects the uniformity of the deposition process and the chemical properties of the coating. If the gas filling rate is too high or too low, it may cause uneven film thickness or unstable chemical structure of the coating material. On the other hand, the atmosphere composition (such as oxygen, nitrogen or other gases) has an important influence on the microstructure and properties of the coating. For example, too much oxygen may cause oxidation, and nitrogen may affect the hardness and gloss of the film. Therefore, the screening rules should ensure that the gas filling rate and atmosphere composition are within an appropriate range to ensure the quality and consistency of the film.

[0085] The preset filtering rules can be adjusted according to actual conditions and no specific restrictions are made here.

[0086] S335, obtaining the difference between the initial parameter combination of the remaining coating stages and the target parameter combination of the reference stage; By comparing the difference in parameter combinations at each stage, we can understand the difference between each stage and the benchmark stage, so as to reduce the sudden change or uneven transition between stages, thereby ensuring the uniformity of the film layer and the stability of the film layer quality. The difference degree refers to the change in the coating parameters (such as deposition rate, evaporation source temperature, gas filling rate, etc.) between different stages. When calculating the difference, two factors are usually considered: (1) Numerical difference: For example, the deposition rate in the first stage is 2 nm / s, while that in the second stage is 10 nm / s. The numerical difference between the two is 8 nm / s.

[0087] (2) Differences in physical and chemical reactions: If the deposition rate at a certain stage increases too quickly, it may cause quality problems in the film layer (such as unevenness, cracks, etc.). The impact of this physical change should also be considered.

[0088] In one embodiment, different weights may be assigned to the degree of difference of each parameter according to the difficulty of adjustment at each stage, the size of the adjustment amount, and the impact on the film quality. For example: The difference in deposition rate has a greater impact on the uniformity of the film layer, so it is given a higher weight (such as 0.5). The temperature difference has a greater impact on the adhesion and optical properties of the film layer, but the difficulty of adjustment is relatively small, so it is given a medium weight (such as 0.3). The gas filling rate may mainly affect the reaction atmosphere of the film layer and have an indirect impact on the deposition effect, so it can be given a lower weight (such as 0.2).

[0089] Through the above weighted calculation, the difference between the initial parameter combination of the remaining coating stages and the target parameter combination of the reference stage can be obtained.

[0090] S336, determining target parameter combinations for the remaining coating stages according to the degree of difference; In one embodiment, the initial parameter combination with the smallest difference can be selected, which is equivalent to selecting the parameter combination with a small change and the smallest impact on the film layer, avoiding the adverse effect of excessive adjustment on the film quality. By selecting the parameter combination with the smallest difference, the instability caused by parameter adjustment can be effectively reduced, ensuring the consistency of the film quality at each stage.

[0091] In some cases, the combination with the smallest difference may not be the optimal process parameter, but it can be used as a conservative choice to ensure the stability of the overall process, especially when the process conditions do not allow drastic adjustments.

[0092] In one embodiment, the step S331 specifically includes: S3311, obtaining the physical and chemical properties of the target material corresponding to the first coating, wherein the physical and chemical properties include: vapor pressure, melting point, and surface energy; Specifically, the main reason for obtaining the three physical and chemical properties of vapor pressure, melting point and surface energy is that they have an important influence on the film growth, adhesion, film uniformity and quality during the vacuum coating process. Vapor pressure is the ability of a material to transform into a gaseous state at a specific temperature, indicating the tendency of a substance to transform from a solid or liquid state to a gaseous state. During the vacuum coating process, the target material needs to be heated to a certain temperature to evaporate. Materials with high vapor pressure evaporate more easily, while materials with low vapor pressure require higher temperatures to evaporate.

[0093] During the contact stage between the coating and the substrate, if the vapor pressure is too high, the material evaporates faster, which may lead to uneven deposition and affect the adhesion quality of the film. Materials with low vapor pressure are more suitable for forming a uniform initial film. Materials with high vapor pressure may accelerate the deposition process during the growth stage, but may also cause pores, bubbles or uneven films in the film. Therefore, the control of vapor pressure can help optimize the structure and quality of the film.

[0094] Melting point is the temperature at which a material changes from solid to liquid. Materials with lower melting points are usually easier to evaporate at lower temperatures, so during the attachment stage, the film layer of low melting point materials is easy to deposit evenly and the film layer has strong adhesion. Materials with higher melting points require higher heating temperatures to achieve evaporation, which may cause poor adhesion of the film layer in the early stages or form uneven films. Materials with higher melting points may cause unstable deposition rates during evaporation and require more precise temperature control.

[0095] Surface energy refers to the energy per unit area of ​​a surface, and is usually related to the bonding strength of atoms on the surface of a material. The higher the surface energy, the higher the surface energy of the material, and the stronger the adhesion between the material and the substrate.

[0096] By consulting the material database or literature, the vapor pressure, melting point and surface energy data of the target material (such as silicon dioxide) can be obtained. These physical and chemical properties will be used in the subsequent steps to determine key parameters such as temperature control and vacuum setting during the coating process.

[0097] S3312, according to the physical and chemical properties, taking the first preset thickness as a scale, dividing the vacuum coating process into at least three coating stages, wherein the coating stages include an attachment stage, a growth stage, and a stabilization stage in sequence; Specifically, this step divides the vacuum coating process into at least three stages according to the physical and chemical properties of the target material, and the goal of each stage is to achieve different film growth characteristics. The process control strategy for each stage is different, and corresponding adjustments are set according to the material characteristics.

[0098] The focus of the adhesion stage is to ensure good adhesion between the coating and the substrate, so this stage usually controls a low deposition rate and a moderate evaporation source temperature. The thickness of the film layer grows rapidly in the growth stage, requiring a high deposition rate and precise control of the evaporation temperature. The deposition rate in the stable stage is low to ensure the uniformity of the coating and the stability of the final thickness.

[0099] S3313, determining the thickness growth amount in the attachment stage and the growth stage according to the vapor pressure and the melting point, wherein the thickness growth amount in the attachment stage is negatively correlated with the vapor pressure and positively correlated with the melting point, and the thickness growth amount in the growth stage is negatively correlated with both the melting point and the vapor pressure; Specifically, the thickness growth refers to the change in the film thickness in a certain stage during the vacuum coating process, that is, the thickness of the coating deposited in this stage. In the adhesion stage and the growth stage, the evaporation rate of the material directly affects the thickness growth rate of the coating. The higher the vapor pressure, the faster the evaporation rate, resulting in faster film thickening. Materials with lower melting points can evaporate more easily, so the thickness growth in the adhesion stage may be larger. Optimize the coating process based on these relationships.

[0100] Materials with higher vapor pressures mean that they can change from solid or liquid to gas at lower temperatures, and evaporate faster. This usually results in too fast initial film deposition, forming a rough coating, resulting in poor adhesion and poor film uniformity.

[0101] During the adhesion stage, excessive vapor pressure may cause excessive diffusion of material molecules or insufficient contact with the surface during the deposition process, affecting the adhesion between the film layer and the substrate. Therefore, materials with lower vapor pressure can provide more stable and uniform deposition conditions at this stage, which helps to form a better adhesion layer. Materials with higher melting points usually begin to evaporate at higher temperatures, which means that a longer heating time is required to achieve the appropriate evaporation state. In this process, the temperature stability of the material during evaporation is better, and the evaporation uniformity is higher, avoiding the uneven deposition caused by temperature fluctuations.

[0102] In addition, materials with higher melting points usually have stronger surface adhesion and are easier to form a strong adhesion layer on the substrate surface, which helps improve the quality of the initial coating. Therefore, a higher melting point helps to achieve more stable film deposition during the adhesion stage, and the thickness growth is more stable.

[0103] During the growth stage, materials with higher vapor pressure evaporate faster, which may cause the film to deposit too quickly, causing surface roughness, cracks and other defects in the film, affecting the quality of the film.

[0104] Too high a vapor pressure may result in a less than ideal aggregation of deposited materials during the evaporation process, and the particles may form larger particle clusters or irregular film layers on the surface. In order to ensure the uniformity and stability of the film layer, the vapor pressure needs to be controlled to adapt it to the deposition rate during the growth phase to ensure the smoothness and high quality of the film layer. Materials with higher melting points require higher temperatures to evaporate. During the growth phase, too high an evaporation temperature will cause the material to condense too quickly when deposited on the substrate surface, which may form a thicker non-uniform coating.

[0105] At this stage, materials with too high a temperature will cause instability during the film deposition process and affect the quality of the film. Therefore, it is necessary to control the relationship between the melting point and the temperature to ensure that the material is deposited at an appropriate rate and uniformly during the deposition process, avoiding excessive temperature fluctuations or too fast evaporation rates.

[0106] S3314, determining the thickness growth amount in the stable stage according to the melting point and the surface energy, which is positively correlated with both the melting point and the surface energy; In the stable stage, the thickness growth of the film tends to be stable. This stage mainly involves the optimization of the density, smoothness and final quality of the film. In this stage, most of the coating has been deposited, and the main purpose is to further optimize the quality of the coating, reduce defects, and make the film more stable and uniform. At this time, the growth rate of the film slows down, and the focus of deposition is to optimize the density, uniformity and physical properties of the film. The following explains in detail the influence of melting point and surface energy on the thickness growth in the stable stage, as well as their positive correlation.

[0107] During the deposition process, high melting point materials can better adapt to temperature changes due to their higher thermal stability, reduce deposition unevenness and changes in film structure. Therefore, when the thickness growth in the stable stage is large, high melting point materials can effectively control the deposition rate, promote the density and uniformity of the film, and reduce internal stress and surface defects.

[0108] The evaporation process of materials with higher melting points is gentler, reducing the impact of evaporation instability at high temperatures, which helps to form higher quality films in the stable stage. Therefore, in this stage, the thickness growth is positively correlated with the melting point.

[0109] Surface energy is a physical quantity that describes the interaction between the molecules on the surface of a material and the air interface. It affects the adhesion, wettability and surface smoothness of the material surface with other substances. Materials with higher surface energy have stronger hydrophilicity or lipophilicity, and can better interact chemically or physically with the surface of the substrate, thereby enhancing the adhesion and uniformity of the coating.

[0110] In the later stabilization stage, materials with higher surface energy can more easily form a uniform film on the substrate surface and reduce surface defects such as bubbles, cracks, etc. Due to the higher surface energy, the molecules of the material will be more evenly distributed on the substrate surface during the deposition process, thereby reducing irregular surface deposition.

[0111] Materials with higher surface energy are beneficial to the "self-balancing" effect of the film in the stable stage, that is, the film layer can be better spread on the surface of the substrate during the deposition process, thereby promoting the stable growth of the coating. As the thickness of the film increases, the surface energy of the material helps to reduce the stress accumulation during the deposition process, improve the structure of the film, and enable the film layer to continue to grow steadily at a slower growth rate. The combined effect of these two factors results in a larger thickness growth in the stable stage. Materials with high melting points and high surface energy can continue to optimize the quality of the film, reduce defects, and improve the density, uniformity, and stability of the film through a slower growth process in this stage. Therefore, the thickness growth in the stable stage is positively correlated with both the melting point and the surface energy.

[0112] S3315, fine-tuning the preset deposition speed of the corresponding coating stage according to the thickness growth amount to obtain a target deposition speed; Different coating stages correspond to different deposition requirements. The coating deposition method, film structure and quality requirements are different in each stage, so the deposition rate needs to be dynamically adjusted according to the thickness growth in each stage. In the adhesion stage, the deposition rate is usually slow to ensure that the coating is firmly attached to the substrate surface. In the growth stage, the deposition rate is fast to increase the film thickness, but the surface quality still needs to be controlled. In the stable stage, the deposition rate is usually low to optimize the quality of the film, reduce defects, and improve the uniformity of the film.

[0113] If the thickness growth of the film layer is small at a certain stage, it may be necessary to increase the deposition speed and increase the deposition rate to ensure that the film layer can grow smoothly according to the predetermined plan. If the thickness growth of the film layer is too large at a certain stage, it may be necessary to slow down the deposition speed to avoid excessive stress accumulation or quality problems in the film layer. By fine-tuning the deposition speed, the thickness growth process of the film layer can be more accurately controlled to ensure that the quality and performance of the film layer at each stage meet the expected requirements.

[0114] Preferably, the target material is evaporated according to the vacuum coating parameters to form a first coating on the surface of the LED lamp bead, comprising: S341, determining a function model according to the degree of difference between the evaporation source temperatures in each coating stage, wherein the function model includes a linear function, an exponential function, and a polynomial function; Specifically, the temperature of the evaporation source usually changes gradually during the coating process, and different stages may show different changing patterns. In order to reasonably control the coating process, it is necessary to mathematically model the temperature change. Selecting a suitable function model can more accurately predict the temperature change and optimize the temperature control. The degree of difference in temperature change determines which function model to choose. For example, if the temperature difference between each stage is small and the change is slow, a linear function can be selected; if the difference is large and the change is fast, an exponential function may be more appropriate; if the temperature change pattern is complex, a polynomial function can be selected.

[0115] The linear function is suitable for the case where the temperature changes relatively slowly and the amplitude of the change is small in each coating stage. It assumes that the temperature changes at a constant rate, that is, the temperature changes linearly with the increase of time or thickness.

[0116] The exponential function is suitable for situations where rapid changes are required, such as rapid heating in the initial stage, while the stable stage may need to maintain a high temperature or gradually reduce the temperature. The exponential model can accurately represent this rapid change process.

[0117] Polynomial functions are suitable for situations where the temperature changes are very complex or contain multiple change trends. If the temperature change during the coating process has a trend of acceleration, deceleration or twists and turns, a polynomial function can be used to accurately fit these complex temperature changes.

[0118] By reasonably selecting the function model, the law of temperature change can be accurately described, ensuring more precise temperature control during the vacuum coating process, thereby improving the quality of the film layer.

[0119] S342, performing curve fitting through the function model according to the evaporation source temperature in each coating stage to obtain a temperature control curve; By fitting the temperature data, a mathematical curve (such as a linear, exponential or polynomial function) describing the temperature variation can be obtained, which can accurately reflect the temperature variation in different coating stages. This temperature control curve can be used as a reference in the actual coating process, and the heating power, cooling rate and other control parameters of the evaporation source can be adjusted according to the curve. If a linear function is selected, a simple linear regression method is used to fit the temperature data; if an exponential function or a polynomial function is selected, a corresponding nonlinear fitting method is used, such as the least squares method or polynomial regression.

[0120] S343, based on the temperature control curve, curve fitting is performed according to the target vacuum degree and gas filling rate of each coating stage to obtain a gas rate control curve and a vacuum degree control curve respectively; The vacuum degree and gas filling rate are usually not constant, but gradually change with time or the progress of the deposition process. In order to accurately control the changes in these parameters and avoid affecting the film quality due to inaccurate control, it is necessary to fit the changes in these parameters with time or thickness to obtain the corresponding control curve.

[0121] The changes in vacuum and gas filling rate should be coordinated with the temperature changes. The control curve obtained by fitting can help achieve more precise control. Using the data fitting method of S342 mentioned above, control curves are generated for vacuum and gas filling rate respectively. These curves will describe how vacuum and gas flow change at different times or thicknesses to ensure the control accuracy during the coating process.

[0122] S344, performing vacuum coating treatment on the LED lamp beads according to the temperature control curve, the gas rate control curve and the vacuum control curve; Vacuum coating is used to deposit thin films on the surface of LED lamp beads. These films can have different functions, such as protective films, optical films or functional films. By precisely controlling the vacuum coating parameters, the performance of LED lamp beads can be improved, such as improving brightness, stability, life, etc. The temperature of the evaporation source is adjusted according to the temperature control curve to keep it stable at different stages; the flow rate of the gas is adjusted according to the gas rate control curve to ensure that the gas filling rate meets the coating requirements; the vacuum degree is adjusted in real time according to the vacuum degree control curve to ensure that the vacuum environment at each stage meets the requirements.

[0123] In the actual vacuum coating process, the current temperature, gas flow and vacuum are obtained through real-time monitoring sensors and compared with the preset curves. If deviations are found, the system will automatically adjust accordingly to ensure that the temperature, gas flow and vacuum are within the specified range. The four parameters of temperature, thickness, vacuum and gas flow directly affect the evaporation efficiency of the evaporation source, the adhesion and uniformity of the film layer, etc. Therefore, monitoring these parameters can effectively ensure that the process conditions at each stage are strictly controlled.

[0124] The monitoring data can provide feedback information for subsequent automatic regulation and adaptive adjustment, forming a closed-loop control system.

[0125] S346, in a coating stage, one or more of a temperature control curve, a gas rate control curve, and a vacuum control curve are controlled by using the real-time data and a preset adaptive control algorithm; The adaptive control algorithm is a control algorithm that automatically adjusts process parameters based on real-time data feedback. The algorithm model determines the difference between the current state and the target state and makes appropriate adjustments. During the coating process, the process curve (temperature control curve, gas rate control curve, vacuum control curve) can be dynamically adjusted through real-time monitoring of the parameter data obtained to ensure that the process parameters meet the target requirements at any time. The adaptive control algorithm adjusts the process curve by analyzing the deviation between the real-time data and the target data to achieve the purpose of optimizing the coating quality and stability. According to the difference between the real-time data and the target data, select the appropriate algorithm (such as PID control, fuzzy control, etc.) to dynamically adjust the control curves of temperature, gas flow and vacuum. Depending on the different stages of coating, one or more control curves may be adjusted.

[0126] S347, when a coating stage is finished, the real-time data of the stage is compared with the adjusted temperature control curve, gas rate control curve and vacuum control curve to obtain the stage deviation; Specifically, the deviation refers to the difference between the actual parameters (such as temperature, gas flow, etc.) and the target parameters (the values ​​calculated by the control curve). For example, if the actual temperature is higher or lower than the target temperature, the temperature deviation will have a positive or negative value. Similarly, the gas rate and vacuum degree will be calculated based on the difference between the target value and the actual value. After each stage, the temperature, gas flow, vacuum degree and other data in the actual coating process are analyzed and compared to calculate the deviation. Through these deviations, the process execution of each stage can be evaluated and provide a basis for subsequent adjustments. The stage deviation is the difference between the actual process parameters (such as temperature, gas flow, vacuum degree) and the target set value after a certain coating stage is completed. It is usually expressed by calculating the deviation between the actual value and the target value. The stage deviation reflects the difference in process execution at each stage and can be used as a feedback signal for subsequent optimization and adjustment.

[0127] S348, determining a corresponding deviation adjustment capacity according to the thickness growth amount and the target deposition rate of the remaining coating stages, wherein the deviation adjustment capacity is positively correlated with the thickness growth amount and negatively correlated with the target deposition rate; Deviation adjustment capacity refers to how much deviation adjustment can be accepted at a certain coating stage without affecting the stability and final result of the entire process. It is a parameter determined after considering the actual situation of each stage, which controls the possible adjustment range within the stage. If the thickness growth amount of a certain stage is large, it means that its adjustment space is larger and has more adjustment capabilities to deal with possible deviations to ensure that the thickness and quality of the film meet the requirements; when the target deposition rate is high, it means that the coating work at this stage is faster and more concentrated, so the adjustment space of each stage will be relatively small. High deposition rate means higher control accuracy requirements, and the deviation adjustment capacity cannot be too large, otherwise it will cause process instability, so the deviation adjustment capacity will be smaller. When the deposition rate is high, the adjustment space is limited, and too much adjustment will affect the coating quality, so the deviation adjustment capacity is small. When the deposition rate is low, the changes in each stage are not so rapid, and the allowable deviation adjustment range is larger. By reasonably setting the deviation adjustment capacity of each stage, excessive adjustment is avoided, ensuring that the process of each stage can be accurately executed.

[0128] S349, determining several adjustment schemes for each remaining coating stage according to the stage deviation amount and the deviation adjustment capacity; Specifically, after determining the deviation adjustment capacity, in order to eliminate or reduce the process differences between the coating stages, a specific adjustment plan is determined. This plan will tell the operating system how to allocate the adjustment amount to each stage. According to the deviation amount and adjustment capacity of different stages, multiple possible adjustment plans are designed. Each plan corresponds to a different adjustment strategy, which may involve changes in temperature, gas flow, and vacuum. Based on the existing process rules, adjustment capacity, and target deposition rate, multiple adjustment plans are calculated, and the system automatically selects the most appropriate plan. By comparing multiple adjustment plans, the most suitable plan can be selected for process adjustment to minimize the deviation between each stage and ensure the coating quality.

[0129] S3410, obtaining, by weighted operation, the curve deviation degree between the remaining coating stages after adjustment by the adjustment scheme; Specifically, after completing the adjustment of a certain stage, it is necessary to evaluate the process curves of the remaining stages (such as temperature curve, gas flow curve, vacuum curve) to ensure that the adjusted curves can minimize the deviations of subsequent stages. By calculating the degree of deviation between the stages through weighted operations, the adjustment effect can be quantified to help select the optimal adjustment plan. The weight can be based on the importance of the stage (for example, the initial stage has a greater impact on the quality of the film layer and can be given a higher weight) or the sensitivity of the process curve. Then, the comprehensive degree of deviation for each solution is obtained through the weighted average method.

[0130] S3411, adjusting one or more of the temperature control curve, the gas rate control curve, and the vacuum control curve of the remaining stage according to the adjustment scheme with the smallest curve deviation; After calculating the deviations of different adjustment schemes, select the scheme with the smallest deviation for actual operation to ensure that the process curves of the remaining stages are optimized, thereby reducing errors and achieving the expected film quality and performance. According to the optimal adjustment scheme, adjust the process curves of the remaining stages. Specifically, adjust one or more of the temperature control curve, gas rate control curve, and vacuum control curve to ensure that the process parameters of each stage are close to the target requirements. While executing the adjustment scheme, continuously monitor the actual data to ensure that the adjusted parameters are effectively implemented and adjust any deviations from the target in a timely manner.

[0131] S3412, after all coating stages are completed, the first coating is obtained.

[0132] This step marks the end of the coating process, with the goal of ensuring that a uniform coating that meets design requirements is formed through precise control of each stage. After this step is completed, the first coating will be formed on the surface of the LED lamp bead.

[0133] In summary, the SMD anti-sulfurization plant lamp and its preparation method provided by the embodiment of the present invention, by forming a layer of aluminum oxide, silicon oxide or silicon nitride coating with strong chemical stability on the surface of the LED lamp bead, effectively isolates the corrosion of external sulfide gas, significantly improves the anti-sulfurization ability of the LED lamp bead, reduces the impact of the sulfidation reaction on the metal part of the lamp bead, and extends the service life of the lamp bead. The vacuum coating process can achieve uniform deposition of the coating, ensure that the protective effect of each area on the surface of the LED lamp bead is consistent, and avoid the weak links of the traditional coating caused by uneven manual coating. By improving the anti-sulfurization ability and environmental resistance of the LED lamp bead, the present invention can effectively reduce the light decay of the lamp bead in long-term use, maintain a high light output efficiency, and improve the lighting effect of the plant lamp. Because the coating of the present invention has excellent corrosion resistance and durability, it can effectively prevent the penetration of corrosive substances in the environment, reduce the premature failure of the LED lamp bead due to environmental deterioration, and thus significantly extend the service life of the plant lamp. In summary, the present invention solves the problems of poor anti-sulfurization ability and uneven coating in the prior art by adopting vacuum coating technology and high-quality coating materials, provides more reliable protection for SMD plant lamps, and improves the stability and service life of the product.

[0134] It should be clear that the present invention is not limited to the specific configuration and processing described above and shown in the figures. For the sake of simplicity, a detailed description of the known method is omitted here. In the above embodiments, several specific steps are described and shown as examples. However, the method process of the present invention is not limited to the specific steps described and shown, and those skilled in the art can make various changes, modifications and additions, or change the order between the steps after understanding the spirit of the present invention.

[0135] The functional blocks shown in the structural block diagram described above can be implemented as hardware, software, firmware or a combination thereof. When implemented in hardware, it can be, for example, an electronic circuit, an application specific integrated circuit (ASIC), appropriate firmware, a plug-in, a function card, etc. When implemented in software, the elements of the present invention are programs or code segments used to perform the required tasks. The program or code segment can be stored in a machine-readable medium, or transmitted on a transmission medium or a communication link by a data signal carried in a carrier. "Machine-readable medium" may include any medium capable of storing or transmitting information. Examples of machine-readable media include electronic circuits, semiconductor memory devices, ROMs, flash memories, erasable ROMs (EROMs), floppy disks, CD-ROMs, optical disks, hard disks, optical fiber media, radio frequency (RF) links, etc. The code segment can be downloaded via a computer network such as the Internet, an intranet, etc.

[0136] It should also be noted that the exemplary embodiments mentioned in the present invention describe some methods or systems based on a series of steps or devices. However, the present invention is not limited to the order of the above steps, that is, the steps can be performed in the order mentioned in the embodiments, or in a different order from the embodiments, or several steps can be performed simultaneously.

[0137] The above is only a specific implementation of the present invention. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working process of the system, module and unit described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here. It should be understood that the protection scope of the present invention is not limited to this. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be covered within the protection scope of the present invention.

Claims

1. A SMD anti-sulfurization plant lamp, characterized in that: include: A plurality of LED lamp beads, wherein the LED lamp beads include a bracket and a light-emitting chip, the light-emitting chip is mounted on the bracket, and the light-emitting wavelengths of the light-emitting chips of different LED lamp beads are the same or different; The surface of the LED lamp bead is provided with a first coating by vacuum coating, the first coating has a first preset thickness, the material of the first coating is a combination of one or more of aluminum oxide, silicon oxide, or silicon nitride, a functional area is provided on the bracket, the functional area is provided with a second coating by vacuum coating, the second coating has a second preset thickness, a third coating is also provided on the surface of the first coating, the third coating has a third preset thickness, the first coating and the second coating are made of the same material, the first preset thickness is greater than the third preset thickness, and the second preset thickness is greater than the first preset thickness.

2. The SMD anti-sulfurization plant lamp according to claim 1, characterized in that: The light emitting wavelength of the light emitting chip belongs to a preset wavelength range, which includes a combination of one or more of a first wavelength range of 360-410nm, a second wavelength range of 410-500nm, a third wavelength range of 500-600nm, a fourth wavelength range of 600-700nm and a fifth wavelength range of 700-1000nm.

3. The SMD anti-sulfurization plant lamp according to claim 1, characterized in that: The materials of the first coating layer and the second coating layer are silicon dioxide, and the material of the third coating layer is AF glue.

4. The SMD anti-sulfurization plant lamp according to claim 3, characterized in that: The LED lamp bead includes fluorescent powder, and the fluorescent powder is fluoride.

5. The SMD anti-sulfurization plant lamp according to claim 1, characterized in that: The first preset thickness is 100 nm, the second preset thickness is 300 nm, and the third preset thickness is 30 nm.

6. A method for preparing an SMD anti-sulfurization plant lamp, characterized in that: Used to prepare the SMD anti-sulfurization plant lamp according to any one of claims 1 to 5, the preparation method comprising: Cleaning the surface of the bracket and drying the cleaned bracket; Performing vacuum coating on the functional area of ​​the bracket to form a second coating having a second preset thickness; Fixing the light-emitting chip on the cleaned and dried bracket to obtain a plurality of LED lamp beads; Performing vacuum coating treatment on each of the LED lamp beads to form a first coating layer having a first preset thickness on the surface of the LED lamp beads; Performing vacuum coating treatment on each of the LED lamp beads to form a third coating layer with a third preset thickness on the surface of the first coating layer; Each of the LED lamp beads is post-processed to obtain the SMD anti-sulfurization plant lamp.

7. The method for preparing the SMD anti-sulfurization plant lamp according to claim 6, characterized in that: The vacuum coating treatment is performed on each of the LED lamp beads to form a first coating layer having a first preset thickness on the surface of the LED lamp beads, comprising: According to the material of the first coating, obtaining a target material for vacuum coating, wherein the target material is solid silicon dioxide particles; Placing the LED lamp beads and the target material at designated positions in the reaction chamber of the vacuum coating machine respectively; According to the target material corresponding to the first coating and the first preset thickness, vacuum coating parameters are acquired, wherein the vacuum coating parameters include: evaporation source temperature, target vacuum degree and gas filling rate; According to the vacuum coating parameters, the target material is evaporated to form a first coating on the surface of the LED lamp bead; When the thickness of the coating reaches a first preset thickness, the vacuum coating process is stopped and the LED lamp bead is cooled.

8. The method for preparing the SMD anti-sulfurization plant lamp according to claim 7, characterized in that: The step of obtaining vacuum coating parameters according to the target material corresponding to the first coating and the first preset thickness includes: According to the physicochemical properties of the target material and the first preset thickness, the vacuum coating process is divided into at least three coating stages, wherein the thickness growth amount and / or the target deposition speed are different in different coating stages; For each coating stage, obtaining a number of initial parameter combinations of the vacuum coating parameters that meet the corresponding target deposition rate; The coating stage with the largest thickness increase is taken as the benchmark stage; According to the preset screening rules, the initial parameter combination of the benchmark phase is screened to obtain the target parameter combination; Obtaining the degree of difference between the initial parameter combinations of the remaining coating stages and the target parameter combination of the reference stage; Determining target parameter combinations for the remaining coating stages according to the degree of difference; The vacuum coating parameters are determined according to the target parameter combination of each coating stage.

9. The method for preparing the SMD anti-sulfurization plant lamp according to claim 8, characterized in that: The step of obtaining vacuum coating parameters according to the target material corresponding to the first coating and the first preset thickness includes: Acquiring physical and chemical properties of a target material corresponding to the first coating, wherein the physical and chemical properties include: vapor pressure, melting point, and surface energy; According to the physical and chemical properties, the vacuum coating process is divided into at least three coating stages based on the first preset thickness, wherein the coating stages include an attachment stage, a growth stage, and a stabilization stage in sequence; Determine the thickness growth amount in the attachment stage and the growth stage according to the vapor pressure and the melting point, wherein the thickness growth amount in the attachment stage is negatively correlated with the vapor pressure and positively correlated with the melting point, and the thickness growth amount in the growth stage is negatively correlated with both the melting point and the vapor pressure; According to the melting point and the surface energy, the thickness growth amount in the stable stage is determined, which is positively correlated with the melting point and the surface energy; According to the thickness growth amount, the preset deposition speed of the corresponding coating stage is fine-tuned to obtain the target deposition speed.

10. The method for preparing the SMD anti-sulfurization plant lamp according to claim 9, characterized in that: The step of evaporating the target material according to the vacuum coating parameters to form a first coating on the surface of the LED lamp bead comprises: Determining a function model according to the degree of difference between the evaporation source temperatures in each deposition stage, wherein the function model includes a linear function, an exponential function, and a polynomial function; According to the evaporation source temperature in each coating stage, curve fitting is performed through the function model to obtain a temperature control curve; Based on the temperature control curve, curve fitting is performed according to the target vacuum degree and gas filling rate of each coating stage to obtain a gas rate control curve and a vacuum degree control curve respectively; Performing vacuum coating treatment on the LED lamp beads according to the temperature control curve, the gas rate control curve and the vacuum degree control curve; Monitor the real-time data during the vacuum coating process, including temperature data, thickness data, vacuum degree data and gas flow data; In a coating stage, one or more of a temperature control curve, a gas rate control curve and a vacuum control curve are controlled by the real-time data and a preset adaptive control algorithm; When a coating stage is finished, the real-time data of the stage is compared with the adjusted temperature control curve, gas rate control curve and vacuum control curve to obtain the stage deviation; Determine a corresponding deviation adjustment capacity according to the thickness growth amount and the target deposition rate of the remaining deposition stage, wherein the deviation adjustment capacity is positively correlated with the thickness growth amount and negatively correlated with the target deposition rate; Determining a plurality of adjustment schemes for each remaining coating stage according to the stage deviation amount and the deviation adjustment capacity; Obtaining, by weighted calculation, the curve deviation degree between the remaining coating stages after adjustment by the adjustment scheme; Adjust one or more of the temperature control curve, the gas rate control curve, and the vacuum control curve of the remaining stage according to the adjustment scheme with the smallest curve deviation; After all coating stages are completed, the first coating is obtained.

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