Electronic packaging device thermal resistance test system

Abstract

The invention relates to the technical field of electronic packaging devices, and particularly discloses an electronic packaging device thermal resistance test system, which comprises an optical platform, and a rapid movement adjusting mechanism, a movable pressing block, a mechanical universal support arm clamp, a microscope adjusting mechanism, a display, a limiting baffle block and an object placing table which are arranged above the optical platform, a direct current probe arm is arranged above the rapid movement adjusting mechanism, and the upper end of the microscope adjusting mechanism is connected with a CCD camera; the rapid movement adjusting mechanism can adjust the position of the direct current probe arm; the movable pressing block is used for fixing the to-be-tested electronic packaging device on the object placing table; the mechanical universal support arm clamp is used for clamping the to-be-tested electronic packaging device on the object placing table; the CCD camera can collect an image of the to-be-tested electronic packaging device, and the display can display the image of the to-be-tested electronic packaging device so as to assist the direct-current probe arm to feed a probe to the to-be-tested electronic packaging device. According to the invention, the test precision and accuracy can be ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic packaging devices, and more specifically, to a thermal resistance testing system for electronic packaging devices. Background Art

[0002] The heat dissipation performance of electronic packaging devices is an important part of the thermal reliability design of electronic products. In order to ensure that users can better manage heat at the end of use, it is necessary to accurately measure the thermal characteristics of electronic packaging devices. For typical electronic packaging devices, thermal performance is mainly evaluated by thermal resistance. Combined with GJB548B, JEDEC JESD51 series thermal test standards, etc., the thermal resistance of commonly used electronic packaging devices is usually defined as R_JX=(T_j-T_x) / P, where R_JX is the thermal resistance from the junction of the device to a specific environment (unit ℃ / W); T_j is the junction temperature of the device in steady state (unit ℃), T_x is the temperature of a specific reference point (unit ℃), and P is the chip power consumption (unit W). However, the traditional thermocouple thermal resistance test method requires the shell temperature of the packaged device to be measured. This test method is difficult to ensure the accuracy of the test and the repeatability of the test results.

[0003] However, for this electrical testing method, traditional manual soldering operations cannot meet the testing requirements for packaged devices with a small number of pins and small pin sizes. Summary of the invention

[0004] In order to solve the deficiencies in the prior art, the present invention provides a thermal resistance testing system for electronic packaging devices, which can ensure the precision and accuracy of the test.

[0005] As a first aspect of the present invention, a thermal resistance test system for an electronic packaging device is provided, the thermal resistance test system for an electronic packaging device comprising an optical platform, a rapid movement adjustment mechanism, a movable pressure block, a mechanical universal arm fixture, a microscope adjustment mechanism, a display, a limit stopper and a storage table are arranged above the optical platform, a DC probe arm is arranged above the rapid movement adjustment mechanism, a CCD camera is connected to the upper end of the microscope adjustment mechanism, the display is electrically connected to the CCD camera, the movable pressure block and the mechanical universal arm fixture are both located on one side of the storage table, and the limit stopper is located at the end of the rapid movement adjustment mechanism; The fast moving adjustment mechanism can adjust the position of the DC probe arm; The movable pressing block is used to fix the electronic packaged device to be tested on the storage table; The mechanical universal arm fixture is used to clamp the electronic packaged device to be tested on the storage platform; The CCD camera can collect the image of the electronic packaged device to be tested, and the display can display the image of the electronic packaged device to be tested, so as to assist the DC probe arm in inserting the needle into the electronic packaged device to be tested.

[0006] Furthermore, the optical platform is in the shape of a honeycomb panel, has a size of 1200mm*1200mm, and is magnetic.

[0007] Furthermore, the limit stopper is used to fix the rapid movement adjustment mechanism after the rapid movement adjustment mechanism slides to a specified position.

[0008] Furthermore, the DC probe arm can be adjusted to any angle.

[0009] Furthermore, the movable pressing block includes a first magnetic base, a handle and an insulating pressing block, the first magnetic base is adsorbed on the optical platform, the handle is installed on the first magnetic base, and the insulating pressing block is installed on the handle, and the insulating pressing block is controlled to fix the electronic package device to be tested on the storage table by adjusting the angle and position of the handle.

[0010] Furthermore, the mechanical universal arm clamp includes a second magnetic base and a magnetic clamp, the second magnetic base is adsorbed on the optical platform, the magnetic clamp is installed on the second magnetic base, the magnetic clamp is used to clamp the electronic packaged device to be tested on the storage table, and the clamped electronic packaged device to be tested is pitch-adjusted.

[0011] Furthermore, the microscope adjustment mechanism is used to adjust the photographing position of the CCD camera.

[0012] The electronic packaging device thermal resistance testing system provided by the present invention has the following advantages: it can realize the circuit connection of electronic packaging devices with different packaging forms and different packaging sizes, especially for electronic packaging devices with a small number of pins. The thermal resistance testing system is suitable for K factor testing, junction-to-environment thermal resistance testing and junction-to-case thermal resistance testing of various electronic packaging devices, avoiding multiple welding of device pins, and improving the thermal resistance testing efficiency while improving the testing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The accompanying drawings are used to provide further understanding of the present invention and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present invention, but do not constitute a limitation of the present invention.

[0014] Figure 1 It is a schematic diagram of the overall structure of the thermal resistance testing system for electronic packaging devices of the present invention.

[0015] Figure 2It is a top view of the electronic packaging device thermal resistance testing system of the present invention.

[0016] Figure 3 It is a side view of the electronic packaging device thermal resistance testing system of the present invention.

[0017] In the figure: 1-optical platform; 2-fast moving adjustment mechanism; 3-DC probe arm; 4-movable pressure block; 5-mechanical universal arm clamp; 6-microscope adjustment mechanism; 7-CCD camera; 8-display; 9-limit block; 10-storage table. DETAILED DESCRIPTION

[0018] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the specific implementation method, structure, characteristics and effects of a thermal resistance test system for electronic packaging devices proposed by the present invention are described in detail below in combination with the accompanying drawings and preferred embodiments. Obviously, the described embodiments are part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the protection scope of the present invention.

[0019] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so as to describe the embodiments of the present invention described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0020] In the interpretation of the present invention, it should be noted that the terms "installed", "connected" and "connected" should be understood in a broad sense unless otherwise specified. For example, the connection can be a fixed connection, or it can be connected through a special interface, or it can be indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0021] In this embodiment, a thermal resistance test system for electronic packaging devices is provided. Figure 1-3As shown, the electronic packaging device thermal resistance test system includes an optical platform 1, and a fast moving adjustment mechanism 2, a movable pressure block 4, a mechanical universal arm fixture 5, a microscope adjustment mechanism 6, a display 8, a limit stopper 9 and a storage table 10 are arranged above the optical platform 1, a DC probe arm 3 is arranged above the fast moving adjustment mechanism 2, a CCD camera 7 is connected to the upper end of the microscope adjustment mechanism 6, and the display 8 is electrically connected to the CCD camera 7, the movable pressure block 4 and the mechanical universal arm fixture 5 are both located on one side of the storage table 10, and the limit stopper 9 is located at the end of the fast moving adjustment mechanism 2; The fast moving adjustment mechanism 2 can adjust the position of the DC probe arm 3; The movable pressing block 4 is used to fix the electronic packaged device to be tested on the storage platform 10; The mechanical universal arm fixture 5 is used to clamp the electronic packaged device to be tested on the storage platform 10; The CCD camera 7 can collect the image of the electronic packaged device to be tested, and the display 8 can display the image of the electronic packaged device to be tested, so as to assist the DC probe arm 3 in inserting the needle into the electronic packaged device to be tested.

[0022] Specifically, the rapid moving adjustment mechanism 2 is a rectangular parallelepiped structure. The handle of the rapid moving adjustment mechanism 2 is adjusted clockwise to lock the rapid moving adjustment mechanism; the handle of the rapid moving adjustment mechanism 2 is adjusted counterclockwise to unlock the rapid moving adjustment mechanism; wherein, after unlocking, the rapid moving adjustment mechanism 2 can move rapidly forward and backward, and the rapid moving adjustment mechanism 2 is locked after sliding to the position of the electronic packaging device to be tested to avoid interference with other components.

[0023] Specifically, the storage table 10 is located at the center of the optical platform 1 .

[0024] Preferably, the optical platform 1 is in the shape of a honeycomb panel, has a size of 1200 mm*1200 mm, and is magnetic.

[0025] Preferably, the limit stopper 9 is used to fix the rapid movement adjustment mechanism 2 after the rapid movement adjustment mechanism 2 slides to a specified position, so as to prevent the electronic package device to be tested from moving as a whole during subsequent operations.

[0026] Preferably, the DC probe arm 3 can be adjusted at any angle, wherein three-axis fine adjustment is possible, and the fine adjustment stroke of the X, Y, and Z axes is 12 mm, to ensure the accuracy of the needle insertion. As the fast moving adjustment mechanism 2 reaches the specified position, the DC probe arm 3 is adjusted in pitch and fine-tuned in the three directions of XYZ to achieve electrical connection to the electronic packaging device to be tested.

[0027] Preferably, the movable pressing block 4 includes a first magnetic base, a handle and an insulating pressing block, the first magnetic base is adsorbed on the optical platform 1, the handle is installed on the first magnetic base, and the insulating pressing block is installed on the handle, and the insulating pressing block is controlled to fix the electronic packaging device to be tested on the storage table 10 by adjusting the angle and position of the handle.

[0028] Specifically, the movable pressure block 4 is used in conjunction with the DC probe arm 3. In order to prevent the electronic packaged device to be tested, especially the light electronic packaged device to be tested, from sliding when the DC probe arm 3 is adjusted, the movable pressure block 4 can limit the movement of the electronic packaged device to be tested.

[0029] It should be noted that, in order to improve the test efficiency, the needle lowering operation of the DC probe arm 3 does not require welding, so the electronic packaged device to be tested needs to be pressed on the storage table 10, and the electronic packaged device to be tested on the storage table 10 is moved and fixed by adjusting the movable pressing block 4.

[0030] Preferably, the mechanical universal arm clamp 5 includes a second magnetic base and a magnetic clamp, the second magnetic base is adsorbed on the optical platform 1, and the magnetic clamp is installed on the second magnetic base, and the magnetic clamp is used to clamp the electronic packaged device to be tested on the storage table 10, and the clamped electronic packaged device to be tested is pitch-adjusted.

[0031] Preferably, the microscope adjustment mechanism 6 is used to adjust the photographing position of the CCD camera 7 .

[0032] It should be noted that the microscope adjustment mechanism 6 , the CCD camera 7 and the display 8 constitute an imaging system, which is suitable for electronic packaging devices of smaller sizes and can be used in conjunction with each other when operating the DC probe arm 3 .

[0033] Specifically, by quickly moving the adjustment mechanism 2 to adjust the DC probe arm 3 and with the assistance of the imaging system, the DC probe arm 3 can accurately perform pin-down testing on the external pins of the electronic packaged device to be tested on the storage table 10, and multi-station testing is possible.

[0034] It should be noted that the present invention is applicable to the junction-to-case thermal resistance test of various packaged devices, and also supports the test of the K factor of various packaged devices.

[0035] During specific use, it is necessary to ensure that the DC probe arm 3 on the rapid moving adjustment mechanism 2 is moved to the storage table 10 where the electronic packaged device to be tested is placed, and use the movable pressure block 4 to fix the electronic packaged device to be tested on the storage table 10, and then cooperate with the imaging system composed of the microscope adjustment mechanism 6, CCD camera 7 and display 8 to accurately use the DC probe arm 3 to insert the needle into the electronic packaged device to be tested on the storage table 10 to ensure the precision and accuracy of the test.

[0036] The electronic packaging device thermal resistance testing system provided by the present invention has the following working principle: The DC probe arm 3 is accurately moved to the vicinity of the storage platform 10 by the fast moving adjustment mechanism 2 located on the optical platform 1, and the electronic packaged device to be tested on the storage platform 10 is fixed by the movable pressing block 4. For smaller packaged devices, an imaging system composed of a microscope adjustment mechanism 6, a CCD camera 7 and a display 8 is used. The DC probe arm 3 is accurately used to insert the needle into the electronic packaged device to be tested on the storage platform 10 through the imaging system. Since the electronic packaged device to be tested is directly in contact with the storage platform 10, the transient thermal characteristic curves of the electronic packaged device to be tested in dry and wet states can be measured respectively; then the electronic packaged device to be tested on the storage platform 10 is clamped and fixed by the mechanical universal arm clamp 5, and the DC probe arm 3 is used to insert the needle into the clamped electronic packaged device to be tested, and the temperature-voltage characteristic curve of the electronic packaged device to be tested can be measured; finally, the junction-to-shell thermal resistance of the electronic packaged device to be tested is calculated according to the transient thermal characteristic curves and the temperature-voltage characteristic curves in the dry and wet states.

[0037] In this embodiment, by quickly moving the adjustment mechanism 2 and the DC probe arm 3, it is possible to realize the circuit connection of electronic packaging devices of different packaging forms and different packaging sizes, especially for electronic packaging devices with a small number of pins. The thermal resistance test system is suitable for K coefficient testing, junction-to-environment thermal resistance testing, and junction-to-shell thermal resistance testing of various electronic packaging devices, avoiding multiple welding of device pins, improving the test efficiency, and improving the thermal resistance test efficiency. The fast-moving adjustment mechanism 2 ensures that the electronic packaging device can be subjected to thermal resistance test operations on different storage tables, and the DC probe arm 3 ensures that the needle can be accurately aligned with the pins of the electronic packaging device to ensure the stability of the circuit connection.

[0038] In order to replace the welding operation with the clamping operation, the present invention has developed a thermal resistance test system for electronic packaging devices based on the advanced real-time static sampling method in the JEDEC test method (JESD51-1). The test platform can be placed on a heating table, a temperature control table, etc. For the packaged devices to be applied with direct current, it includes two DC needle adjustment arms, which can be fine-tuned in the XYZ directions, and can be observed and assisted by a microscopic imaging system to complete the needle test. In addition, the probe arm is equipped with a fast moving mechanism, which can be tested in multiple stations.

[0039] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technician familiar with this profession can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention without departing from the content of the technical solution of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A thermal resistance test system for electronic packaging devices, characterized in that: The electronic packaging device thermal resistance test system comprises an optical platform (1), wherein a rapid movement adjustment mechanism (2), a movable pressure block (4), a mechanical universal arm clamp (5), a microscope adjustment mechanism (6), a display (8), a limit stopper (9) and a storage platform (10) are arranged above the optical platform (1), a DC probe arm (3) is arranged above the rapid movement adjustment mechanism (2), a CCD camera (7) is connected to the upper end of the microscope adjustment mechanism (6), the display (8) is electrically connected to the CCD camera (7), the movable pressure block (4) and the mechanical universal arm clamp (5) are both located on one side of the storage platform (10), and the limit stopper (9) is located at the end of the rapid movement adjustment mechanism (2); The rapid movement adjustment mechanism (2) is capable of adjusting the position of the DC probe arm (3); The movable pressing block (4) is used to fix the electronic packaged device to be tested on the storage platform (10); The mechanical universal arm clamp (5) is used to clamp the electronic packaged device to be tested on the storage platform (10); The CCD camera (7) is capable of collecting images of the electronic packaged device to be tested, and the display (8) is capable of displaying the image of the electronic packaged device to be tested, so as to assist the DC probe arm (3) in inserting a needle into the electronic packaged device to be tested.

2. The electronic packaging device thermal resistance testing system according to claim 1, characterized in that: The optical platform (1) is in the shape of a honeycomb plate, has a size of 1200 mm*1200 mm, and is magnetic.

3. The electronic packaging device thermal resistance testing system according to claim 1, characterized in that: The limit stopper (9) is used to fix the rapid movement adjustment mechanism (2) after the rapid movement adjustment mechanism (2) slides to a specified position.

4. The electronic packaging device thermal resistance testing system according to claim 1, characterized in that: The DC probe arm (3) can be adjusted at any angle.

5. The electronic packaging device thermal resistance testing system according to claim 1, characterized in that: The movable pressing block (4) comprises a first magnetic base, a handle and an insulating pressing block, wherein the first magnetic base is adsorbed on the optical platform (1), the handle is mounted on the first magnetic base, and the insulating pressing block is mounted on the handle, and the insulating pressing block is controlled to fix the electronic package device to be tested on the storage platform (10) by adjusting the angle and position of the handle.

6. The electronic packaging device thermal resistance testing system according to claim 1, characterized in that: The mechanical universal arm clamp (5) comprises a second magnetic base and a magnetic clamp, wherein the second magnetic base is adsorbed on the optical platform (1), and the magnetic clamp is mounted on the second magnetic base, and the electronic packaged device to be tested on the storage platform (10) is clamped by the magnetic clamp, and the clamped electronic packaged device to be tested is adjusted in pitch.

7. The electronic packaging device thermal resistance testing system according to claim 1, characterized in that: The microscope adjustment mechanism (6) is used to adjust the photographing position of the CCD camera (7).

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