Display module with isolation beacon structure

Abstract

The invention provides a display module with an isolation beacon structure, which comprises a display device and a frame structure arranged on the display device, and is characterized in that the display device comprises a display area, a non-display area arranged on one side of the display area and a binding area arranged in the non-display area; a PCB structure and a plurality of conductive circuits which are arranged around the PCB structure and used for being electrically connected with the PCB structure are arranged in the binding area, the frame structure is arranged around the PCB structure, and a plurality of concave part spaces which are used for the conductive circuits to pass through are formed in the bottom of the frame structure in an inward concave mode. The concave part space is arranged at the top of the dense part of the conductive circuits, a positioning unit for positioning is arranged on one side, far away from the conductive circuits, of the concave part space, and the positioning unit is made of a thermochromic material or coated with the thermochromic material.

Description

Technical Field

[0001] The present invention relates to the technical field of display modules, and in particular to a display module containing an isolation beacon structure. Background Art

[0002] The display module has a display area and a non-display area. The non-display area is provided with a circuit for controlling and driving the display function. The circuit includes a chip and / or a circuit board bound to a specific binding area, and a conductive line set in the binding area by printing or other means.

[0003] The chips and / or circuit boards set in the binding area are easily affected by external impact or extrusion during subsequent manufacturing or use, resulting in damage or reduced service life. During the binding process, how the automatic equipment used can accurately bind the chip or circuit board to the specified position is also a problem that needs to be solved.

[0004] The existing display modules solve the problem of automatic equipment positioning by setting positioning marks in some blank areas on the binding area where no functional components are set. However, for highly integrated display devices, the blank areas where no functional components are set are themselves very few / very small, which makes it difficult to design positioning marks, and the marking structure set by the prior art is bound to affect the surrounding functional components, such as the normal function realization of the conductive circuit mentioned above, resulting in problems such as reduced conductivity, expected external resistance caused by insufficient precision, and other functional degradation problems. In addition, if the prior art design is applied to the above situation, it is bound to result in a smaller marking area, thereby increasing the difficulty of recognition by automatic equipment, resulting in an increased probability of non-recognition or misrecognition, affecting production. Summary of the invention

[0005] Based on this, an object of the present invention is to provide a display module including an isolated beacon structure, which can effectively solve the above-mentioned deficiencies in the prior art.

[0006] A display module containing an isolation beacon structure comprises a display device and a frame structure arranged on the display device, wherein the display device comprises a display area, a non-display area arranged on one side of the display area, and a binding area arranged in the non-display area, wherein a PCB structure and a plurality of conductive lines arranged around the PCB structure for electrically connecting the PCB structure are arranged in the binding area, wherein the frame structure is arranged around the PCB structure, wherein a plurality of recessed spaces for the conductive lines to pass through are arranged inwardly at the bottom of the frame structure, wherein the recessed spaces are arranged at the top of the densely concentrated conductive lines, wherein a positioning unit for positioning is arranged on the side of the recessed space away from the conductive lines, wherein the positioning unit itself is made of a thermochromic material or coated with a thermochromic material.

[0007] Furthermore, the line cluster width of the conductive line is 2 mm.

[0008] Furthermore, the recessed space is square, and the width of the recessed space projected in the vertical direction is 2.5 mm-3.5 mm.

[0009] Furthermore, the positioning unit is a planar thin layer structure, and the positioning unit is arranged at the center of the concave space on a side away from the conductive circuit by printing or attaching.

[0010] Furthermore, the recessed space is in an arc shape, and the diameter of the recessed space projected in the vertical direction is 2.2 mm-3 mm.

[0011] Furthermore, the positioning unit is an arc-shaped thin layer structure, and the positioning unit is arranged at the center of the side of the recess space away from the conductive circuit by printing or attaching.

[0012] Furthermore, the recessed space is in an inverted trapezoidal shape, and the diameter of the recessed space projected in the vertical direction is 2.5 mm-3.5 mm.

[0013] Furthermore, the positioning unit is a planar thin layer structure, and the positioning unit is arranged at the center of the concave space on a side away from the conductive circuit by printing or attaching.

[0014] Furthermore, the positioning unit is an inverted trapezoid that fits the recessed space, the diameter of the recessed space projected in the vertical direction is 2.5mm-3.5mm, and the positioning unit is arranged in the recessed space by printing or attaching.

[0015] Furthermore, the frame structure is made of transparent plastic material such as PVC.

[0016] The beneficial effects of the present invention are as follows: by providing a plurality of recessed spaces for the conductive lines to pass through in the bottom of the frame structure, the recessed spaces are provided at the top of the places where the conductive lines are densely concentrated, on the one hand, they are used to avoid the conductive lines to avoid affecting the functionality of the conductive lines, and on the other hand, they are used to provide heat dissipation space for the heat generated by the conductive lines when energized. The design position of the recessed space corresponds to the design position of the conductive lines, and does not affect the structural strength of the remaining parts; by providing a positioning unit for positioning on the side of the recessed space away from the conductive lines, positioning that can improve the binding accuracy is achieved on products with less available space, and the installation positions of the remaining components are not occupied or used, so that the overall integration is improved and it is suitable for a narrower new manufacturing process; by providing a positioning unit for positioning on the side of the recessed space away from the conductive lines, the positioning unit itself is made of a thermochromic material or coated with a thermochromic material, so that the heat generated by the energization of the conductive lines can be used to change its color, so that it is significantly different from other surrounding images in the image collected by the collection unit of the automatic binding device, which is particularly conducive to achieving precise positioning accuracy in a small size, and does not consume additional energy, which is conducive to cost saving and integrated design. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a top view of the display device in Embodiment 1 of the present invention;

[0018] Figure 2 is a top view of a display module having an isolated beacon structure in Embodiment 1 of the present invention;

[0019] Figure 3 is a cross-sectional view of a display module having an isolated beacon structure in Embodiment 1 of the present invention;

[0020] Figure 4 is a cross-sectional view of a display module having an isolated beacon structure in Embodiment 2 of the present invention;

[0021] Figure 5 is a cross-sectional view of a display module having an isolated beacon structure in Embodiment 3 of the present invention;

[0022] Figure 6 is a cross-sectional view of a display module having an isolated beacon structure in Embodiment 4 of the present invention;

[0023] Description of main component symbols:

[0024] Display device 10 Conductive circuit 15 Display Area 11 Framework 20 Non-display area 12 Recessed space 21 Binding Area 13 Positioning unit 22 PCB structure 14

[0025] The following specific implementation manner will further illustrate the present invention in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0026] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0027] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0029] Example 1

[0030] See also Figures 1 to 3 The display module containing the isolated beacon structure in the embodiment of the present invention comprises a display device 10 and a frame structure 20 arranged on the display device 10, wherein the display device 10 comprises a display area 11, a non-display area 12 arranged on one side of the display area 11, and a binding area 13 arranged in the non-display area 12, wherein a PCB structure 14 and a plurality of conductive lines 15 arranged around the PCB structure 14 for electrically connecting the PCB structure 14 are arranged in the binding area 13, wherein the frame structure 20 is arranged around the PCB structure 14, wherein a plurality of recessed spaces 21 for the conductive lines 15 to pass through are arranged inwardly at the bottom of the frame structure 20, wherein the recessed spaces 21 are arranged at the top of the densely packed areas of the conductive lines 15, wherein a positioning unit 22 for positioning is arranged on the side of the recessed space 21 away from the conductive lines 15, wherein the positioning unit 22 itself is made of a thermochromic material or coated with a thermochromic material.

[0031] Furthermore, the line cluster width of the conductive line 15 is 2 mm.

[0032] Furthermore, the recessed space 21 is square, and the width of the recessed space 21 projected in the vertical direction is 2.5 mm-3.5 mm.

[0033] Furthermore, the positioning unit 22 is a planar thin layer structure, and the positioning unit 22 is arranged at the center of the concave space 21 away from the conductive line 15 by printing or attaching.

[0034] Furthermore, the frame structure 20 is made of transparent plastic material such as PVC.

[0035] It can be understood that by setting the frame structure 20 to be made of transparent plastic material such as PVC, the non-display area at the bottom of the frame structure 20 can be observed through the frame structure 20 .

[0036] It should be noted that in this embodiment, four conductive circuits 15 are arranged around the PCB structure 14 for electrically connecting the PCB structure 14, and four recessed spaces 21 for the conductive circuits 15 to pass through are arranged inwardly at the bottom of the frame structure 20.

[0037] It can be understood that by setting four recessed spaces 21 for the conductive circuit 15 to pass through at the bottom of the frame structure 20, the recessed space 21 is set at the top of the densely packed conductive circuit 15, on the one hand, it is used to avoid the conductive circuit 15 to avoid affecting the functionality of the conductive circuit 15, and on the other hand, it is used to provide heat dissipation space for the heat generated by the conductive circuit 15 when powered on. The design position of the recessed space 21 corresponds to the design position of the conductive circuit 15, and does not affect the structural strength of the remaining parts; by setting the positioning unit 22 for positioning on the side of the recessed space 21 away from the conductive circuit 15, it is achieved on the product with less available space. The positioning method can improve the binding accuracy without occupying or using the installation positions of other components, so that the overall integration is improved and it is suitable for a narrower new manufacturing process; by arranging the positioning unit 22 for positioning on the side of the recessed space 21 away from the conductive circuit 15, the positioning unit 22 itself is made of thermochromic material or coated with thermochromic material, so that the heat generated by the power supply of the conductive circuit 15 can be used to change its color, so that it is significantly different from other surrounding images in the image captured by the acquisition unit of the automatic binding device, which is particularly conducive to achieving precise positioning accuracy in small sizes without consuming additional energy, and is conducive to cost saving and integrated design.

[0038] Example 2

[0039] See also Figure 4 The display module with the isolated beacon structure in Example 2 is different from the display module with the isolated beacon structure in Example 1 in that:

[0040] The recessed space is arc-shaped, and the diameter of the recessed space projected in the vertical direction is 2.2mm-3mm. The positioning unit is an arc-shaped thin layer structure, and the positioning unit is arranged in the center of the recessed space away from the conductive circuit by printing or attaching.

[0041] Example 3

[0042] See also Figure 5 The display module with the isolated beacon structure in Example 3 is different from the display module with the isolated beacon structure in Example 1 in that:

[0043] The recessed space is in an inverted trapezoidal shape, the diameter of the recessed space projected in the vertical direction is 2.5mm-3.5mm, the positioning unit is a planar thin layer structure, and the positioning unit is arranged in the center of the recessed space away from the conductive circuit by printing or attaching.

[0044] Example 4

[0045] See also Figure 6 The display module with the isolated beacon structure in Example 4 is different from the display module with the isolated beacon structure in Example 1 in that:

[0046] The positioning unit is an inverted trapezoid that fits the concave space. The diameter of the concave space projected in the vertical direction is 2.5 mm-3.5 mm. The positioning unit is arranged in the concave space by printing or attaching.

[0047] In summary, the display module containing the isolated beacon structure in the above-mentioned embodiment of the present invention has a plurality of recessed spaces for the conductive circuit to pass through, which are arranged inwardly at the bottom of the frame structure. The recessed spaces are arranged at the top of the densely-packed conductive circuits. On the one hand, they are used to avoid the conductive circuits from affecting their functionality. On the other hand, they are used to provide a heat dissipation space for the heat generated by the conductive circuits when they are powered on. The design position of the recessed space corresponds to the design position of the conductive circuits, and does not affect the structural strength of the remaining parts. By arranging a positioning unit for positioning on the side of the recessed space away from the conductive circuit, it is achieved that the product with less available space can be improved. The binding precision positioning does not occupy or use the installation positions of other components, so that the overall integration is improved and it is suitable for a narrower new manufacturing process; by arranging a positioning unit for positioning on the side of the recessed space away from the conductive circuit, the positioning unit itself is made of a thermochromic material or coated with a thermochromic material, so that the heat generated by the power supply of the conductive circuit can be used to change its color, so that it is significantly different from other surrounding images in the image captured by the acquisition unit of the automatic binding device, which is particularly conducive to achieving precise positioning accuracy in small sizes without consuming additional energy, and is conducive to cost saving and integrated design.

[0048] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0049] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the present invention. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A display module having an isolated beacon structure, characterized in that: The invention comprises a display device and a frame structure arranged on the display device, wherein the display device comprises a display area, a non-display area arranged on one side of the display area, and a binding area arranged in the non-display area, wherein a PCB structure and a plurality of conductive circuits arranged around the PCB structure for electrically connecting the PCB structure are arranged in the binding area, wherein the frame structure is arranged around the PCB structure, wherein a plurality of recessed spaces for the conductive circuits to pass through are arranged inwardly at the bottom of the frame structure, wherein the recessed spaces are arranged at the top of the densely concentrated conductive circuits, wherein a positioning unit for positioning is arranged on a side of the recessed space away from the conductive circuits, wherein the positioning unit itself is made of a thermochromic material or coated with a thermochromic material.

2. The display module with an isolated beacon structure according to claim 1, characterized in that: The line cluster width of the conductive line is 2 mm.

3. The display module with an isolated beacon structure according to claim 1, characterized in that: The recessed space is square, and the width of the recessed space projected in the vertical direction is 2.5 mm-3.5 mm.

4. The display module with an isolated beacon structure according to claim 3, characterized in that: The positioning unit is a planar thin layer structure, and is arranged at the center of the concave space on a side away from the conductive circuit by printing or attaching.

5. The display module with an isolated beacon structure according to claim 1, characterized in that: The concave space is in an arc shape, and the diameter of the concave space projected in the vertical direction is 2.2 mm-3 mm.

6. The display module with an isolated beacon structure according to claim 5, characterized in that: The positioning unit is an arc-shaped thin layer structure, and is arranged at the center of the concave space on a side away from the conductive circuit by printing or attaching.

7. The display module with an isolated beacon structure according to claim 1, characterized in that: The recessed space is in an inverted trapezoidal shape, and the diameter of the recessed space projected in the vertical direction is 2.5 mm-3.5 mm.

8. The display module with an isolated beacon structure according to claim 7, characterized in that: The positioning unit is a planar thin layer structure, and is arranged at the center of the concave space on a side away from the conductive circuit by printing or attaching.

9. The display module with an isolated beacon structure according to claim 1, characterized in that: The positioning unit is an inverted trapezoid that fits the concave space. The diameter of the concave space projected in the vertical direction is 2.5 mm-3.5 mm. The positioning unit is arranged in the concave space by printing or attaching.

10. The display module with an isolated beacon structure according to claim 1, characterized in that: The frame structure is made of transparent plastic materials such as PVC.

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