Network signal transformer module and network communication equipment

Abstract

The invention discloses a network signal transformer module and network communication equipment, the network signal transformer module comprises a transformer unit, a packaging pin and a substrate, the transformer unit is provided with a coil and a patch pin which are automatically wound and packaged, and the transformer unit is mounted on the substrate through the patch pin; the packaging pins are used for electrically connecting the interior of the network signal transformer module with an external circuit; the substrate is used for supporting the transformer unit and the packaging pins, and electrical connection between the transformer unit and the packaging pins is achieved through wires on the substrate. According to the novel transformer unit, the high-density wiring substrate and the packaging pins adopting the full-automatic winding packaging technology and the surface mounting technology, the whole module production process can be completely and automatically completed by a machine, the production speed is greatly increased, uncertainty caused by manual operation is reduced, and the production efficiency is improved. Therefore, the production efficiency is integrally improved, and the labor cost is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of network signal transformers, and in particular to a network signal transformer module and network communication equipment. Background Art

[0002] With the rapid development of information technology, network communication equipment has higher and higher requirements for signal transmission quality. In network equipment, the performance of the signal transformer, as one of the key components, directly affects the stability of the entire system and the quality of data transmission. At present, the common network signal transformers on the market are mainly made by manually winding the coil on a closed magnetic ring, and then fixing the lead to the pin (PIN) on the base plastic shell, and reinforcing it with soldering. Although this manufacturing method can meet basic needs, it has obvious limitations for multi-winding, high-density network signal transformer modules.

[0003] First, due to reliance on manual operation, production efficiency is low and cost is high. Second, the manual winding method makes it difficult to ensure parameter consistency and accuracy for each product, which limits the improvement of product performance to a certain extent. In addition, the traditional circular magnetic winding method is irregular and has limited volume density, which is particularly difficult when faced with the need to physically stack windings to achieve high-density module design.

[0004] Therefore, the high-density multi-channel network signal transformer modules that currently rely on manual production have problems such as high cost, low production efficiency, and poor consistency. Summary of the invention

[0005] The embodiments of the present application provide a network signal transformer module and a network communication device, which improve the module production efficiency, reduce the production cost, and improve the performance consistency and stability by using an automated packaging method.

[0006] On the one hand, an embodiment of the present application provides a network signal transformer module, the network signal transformer module comprising:

[0007] A transformer unit, wherein the transformer unit has a coil and a patch pin of an automated winding package, and the transformer unit is mounted on a substrate through the patch pin;

[0008] Package pins are used for electrical connection between the internal and external circuits of the network signal transformer module;

[0009] The substrate is used to support the transformer unit and the package pins, and realize the electrical connection between the transformer unit and the package pins through wiring on the substrate.

[0010] On the other hand, an embodiment of the present application provides a network communication device, which includes the network signal transformer module as described in any of the above embodiments.

[0011] The embodiment of the present application provides a network signal transformer module and network communication equipment, the network signal transformer module includes a transformer unit, a package pin and a substrate, wherein the transformer unit has a coil and a patch pin of an automated winding package, and the transformer unit is mounted on the substrate through the patch pin; the package pin is used to electrically connect the internal and external circuits of the network signal transformer module; the substrate is used to support the patch inductor unit and the package pin, and realize the electrical connection between the patch inductor unit and the package pin through the wiring on the substrate. The embodiment of the present application adopts fully automated production of transformer units and patch package pin materials, and the manufacturing process of each transformer unit strictly follows the preset standards, ensuring highly consistent electrical characteristics between the components and enhancing the consistency and accuracy of product parameters. The entire module production process can be completed completely automatically by the machine, greatly improving the production speed and reducing the uncertainty caused by manual operation, thereby improving the overall production efficiency and reducing labor costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0013] Figure 1 This is a schematic diagram of the structure of the network signal transformer module provided in an embodiment of the present application. DETAILED DESCRIPTION

[0014] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0015] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0016] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0017] The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the various specific processes and material examples provided by the present application, but those of ordinary skill in the art can appreciate the application of other processes and / or the use of other materials.

[0018] It should be noted that the order of description of the following embodiments is not intended to limit the priority order of the embodiments.

[0019] See also Figure 1 The embodiment of the present application provides a network signal transformer module 100 . The network signal transformer module 100 includes a transformer unit 10 , a package pin 20 and a substrate 30 .

[0020] The transformer unit 10 has an inductor coil and a patch pin of an automated winding package, and the transformer unit 10 is mounted on the substrate 30 through the patch pin.

[0021] For example, the transformer unit 10 contains a precision-wound inductor or transformer coil, which is wound by highly automated winding equipment to ensure the uniformity and accuracy of the coil. The winding direction and number of layers of the inductor or transformer coil are optimized to reduce electromagnetic interference (EMI) and radio frequency interference (RFI) and improve signal purity. After winding, the inductor or transformer coil is covered with a magnetic core, and patch pins are led out from the bottom. These patch pins are used to fix the transformer unit 10 and electrically connect it to the substrate 30.

[0022] For example, the patch pins are made of gold plating or other corrosion-resistant and conductive materials to ensure good electrical connection and long-term stability. The design of the patch pins facilitates direct mounting on the substrate 30 through surface mounting technology (SMT), simplifies the assembly process, and improves production efficiency.

[0023] like Figure 1 As shown, the network signal transformer module 100 has a high-density layout and routing design for multiple transformer units 10, which not only improves the integration and reliability of the transformer, but also makes the multi-channel signal transformer module with the same performance smaller in size and easy to design to be fully compatible with the performance structure of the traditional signal transformer module.

[0024] For example, different transformer units 10 may have different inductance values ​​and turns ratio characteristics, and a suitable combination of inductors or transformer units may be selected according to actual application requirements, so that the network signal transformer module 100 can meet different performance requirements. If a transformer unit 10 fails or needs to be replaced, it can be easily removed from the substrate 30 and replaced with a new inductor or transformer unit without disassembling and rebuilding the entire transformer module.

[0025] The package pins 20 are used for electrical connection between the inside and outside of the network signal transformer module.

[0026] For example, the package pins 20 are used to make electrical connections with the inside and outside of the network signal transformer module. The multi-channel high-density module package pins 20 are usually arranged in a regular array to facilitate connection with the network device circuit package and impedance control. The package connection substrate end generally uses a patch package to facilitate automatic module production. The pin end can be designed with a straight-in, bent-leg or surface-mount (SMD) type to adapt to the circuit board layout and assembly method of different network devices. Some pins can also be provided with a fool-proof design to avoid installation errors. At the same time, in order to facilitate assembly and testing, the package pins 20 are usually marked with clear logos or numbers.

[0027] For example, the package pins 20 serve as the input and output interfaces of the network signal transformer module 100, and their number, arrangement and spacing must strictly comply with industry standards or specific application requirements. The pins are tin-plated or made of other materials with good conductivity and strong oxidation resistance to ensure the reliability and durability of the electrical connection. For example, the package pins 20 are usually made of copper or copper alloy materials, and the surface is gold-plated or tin-plated to improve solderability and corrosion resistance. During the manufacturing process, the package pins 20 need to undergo precise stamping, bending, electroplating and other process steps.

[0028] The substrate 30 is used to support the transformer unit 10 and the package pins 20 , and to realize electrical connection between the transformer unit 10 and the package pins 20 through wiring on the substrate 30 .

[0029] For example, the substrate 30 is usually made of high-frequency, low-loss dielectric materials, such as ceramics, polytetrafluoroethylene (PTFE) or high-performance epoxy resin composite materials, which can effectively reduce the energy loss of the signal during transmission and maintain the integrity of the signal.

[0030] For example, the carefully designed wiring on the substrate 30 not only realizes the electrical connection between the transformer unit 10 and the package pin 20, but also further optimizes the signal transmission path through reasonable routing layout and impedance matching, reducing signal reflection and attenuation. In addition, the wiring design also needs to consider the heat dissipation requirements to ensure that the operating temperature of the transformer is within a safe range under high load conditions. The substrate 30 not only provides a stable support for the network signal transformer 100, but also provides the necessary physical protection and environmental protection for the entire network signal transformer module 100 through its structural design and surface treatment (such as flame retardant and moisture-proof coating), thereby enhancing the durability and reliability of the product.

[0031] For example, in order to increase the flexibility and density of wiring, the substrate 30 can be designed with a multi-layer high-density structure, where each layer contains different circuits and different types of via connections to achieve electrical connection in three-dimensional space.

[0032] For example, before assembly, the surface of the substrate 30 needs to be cleaned, deoxidized, tinned, and fluxed to ensure that the SMD inductor unit 10 and the package pins 20 can be firmly soldered to the substrate.

[0033] For example, the assembly process may include the following steps:

[0034] (1) The substrate 30 is placed on a workbench of an automatic chip mounter, and the parameters of the chip mounter are adjusted to adapt to the size and spacing of the chip inductor unit 10 and the package pins 20.

[0035] (2) Start the automatic placement machine, which will automatically pick up the transformer unit 10 and accurately place it on the predetermined position on the substrate 30; then, the placement machine will continue to pick up the package pins 20 and place them on the corresponding pads.

[0036] (3) After the patch operation is completed, the entire substrate 30 is sent to a reflow oven for soldering; during the soldering process, the solder paste will melt and form a strong electrical connection.

[0037] (4) After welding is completed, the substrate 30 is comprehensively inspected and tested to ensure the correctness and stability of all electrical connections, which may include steps such as visual inspection, electrical performance testing and functional verification.

[0038] In some embodiments, the transformer unit 10 is any one or more combinations of a horizontal SMD discrete transformer, a horizontal SMD common-mode inductor, a vertical SMD discrete transformer, and a vertical SMD common-mode inductor.

[0039] For example, the transformer unit 10 can be designed into a variety of different types to meet the needs of different application scenarios.

[0040] For example, horizontal SMD discrete transformers usually adopt a flat design, and their pins (or terminals) are located on the same side of the device, which is convenient for direct mounting on the surface of the circuit board. No additional space is required for vertical installation, which is very suitable for high-density integrated electronic applications. Its inductor coil is wound on the magnetic core and electrically connected to the substrate through the SMD pins. It is often used in circuits that require voltage conversion, isolation or signal transmission.

[0041] For example, horizontal chip common mode inductors are mainly used to suppress common mode noise on power lines or signal lines and improve the electromagnetic compatibility (EMC) of the circuit. It can balance the current difference between the two lines and effectively filter out high-frequency interference. Horizontal chip common mode inductors usually include two tightly coupled coils wound on the same ferrite core, but each has independent lead pins for easy series use in the circuit. The horizontal design makes it easy to adapt to compact layout space.

[0042] For example, vertical SMD discrete transformers can more effectively utilize the space above or below the circuit board by being installed vertically on the circuit board. They are particularly suitable for designs that have strict restrictions on the horizontal area of ​​the circuit board but relatively ample vertical space. The vertical structure helps improve heat dissipation conditions and reduce performance degradation caused by heat accumulation. At the same time, some designs also allow for more flexible pin configurations to accommodate different circuit connection requirements. Vertical SMD discrete transformers are placed vertically, and compared to horizontal transformers, they can take up less space in the vertical direction. Their inductor coils are also wound on the core, but the SMD pins extend from the bottom or side of the transformer to facilitate connection with the pads on the substrate.

[0043] For example, vertical chip common-mode inductors combine the space advantage of vertical transformers and the filtering function of common-mode inductors. They also have two or more tightly coupled windings to effectively suppress common-mode interference. They are similar to horizontal chip common-mode inductors, but are more suitable for use in scenarios where vertical space is limited, such as in some specially designed circuit boards or modules.

[0044] Among them, no matter which type of transformer unit, an automated winding packaging process is adopted to ensure the consistency and reliability of the product. The magnetic core and coil materials are both made of high-performance materials to improve the inductance, quality factor (Q value) and temperature stability of the inductor unit. Through the patch design, these inductors or transformer units can be flexibly arranged, which is convenient for realizing high-density layout and miniaturization design. In practical applications, according to the specific needs and layout space of the circuit, the appropriate transformer unit type can be selected for installation and connection. This flexibility enables the network signal transformer module 100 of the embodiment of the present application to adapt to a wider range of application scenarios and more complex circuit designs.

[0045] In some embodiments, the transformer unit 10 is fixed on the substrate 30 by surface mounting technology.

[0046] Among them, through the surface mounting technology, the transformer unit 10 can be efficiently and accurately fixed on the substrate 30, laying a solid foundation for subsequent circuit assembly and testing. For example, the surface mounting technology can include the following steps:

[0047] (1) The patch feet are precisely aligned with the pads on the substrate 30. The bottom of the transformer unit 10 is designed with precise patch feet, and the shape, size and spacing of these patch feet match the pads on the substrate 30. The substrate 30 is pre-designed with a pad layout corresponding to the patch feet, and the position, size and spacing of the pads are precisely calculated to ensure that the transformer unit 10 can be accurately placed and form a good electrical connection. During the mounting process, the visual alignment system or mechanical alignment mechanism on the automated equipment ensures that the patch feet of the transformer unit 10 are precisely aligned with the pads on the substrate.

[0048] (2) Use an automated placement machine to place the transformer unit 10 at the predetermined position. For example, a high-precision automated placement machine, such as a rotary head placement machine or a parallel head placement machine, is used. The automated placement machine can accurately identify and pick up each transformer unit 10 through a built-in precision robotic arm and suction nozzle device, in conjunction with a visual positioning system, and then place it in the correct position on the substrate 30 according to the programmed path and position information. The automated placement machine can identify the type, size and placement position of the transformer unit 10 through preset program control to ensure that each unit is placed in the correct predetermined position. According to the size and shape of the transformer unit 10, select a suitable suction nozzle device to pick up and place the unit to avoid damage or offset during the placement process.

[0049] (3) Heating to a specific temperature through the reflow soldering process to melt the solder paste and form a firm electrical connection and mechanical fixation. Reflow soldering is a key step in SMT for achieving electrical connection and mechanical fixation. In this stage, the substrate 30 and the transformer unit 10 thereon pass through the reflow soldering furnace together. The temperature in the furnace gradually rises to above the melting point of the solder paste, causing the solder paste to melt and wet the patch feet and pads to form a metallurgical bond between the metals. The temperature curve of reflow soldering usually includes four stages: preheating, heat preservation, reflow and cooling. The temperature and time of each stage need to be precisely controlled to ensure that the solder paste is fully melted, bubbles are discharged, good metallurgical bonding is formed between the metals, and finally cooled and solidified to form a firm electrical connection and mechanical fixation. After completing the reflow soldering, it is usually necessary to inspect the welding quality, such as visual inspection, X-ray inspection or automatic optical inspection (AOI), to ensure that each SMD inductor unit 10 is correctly and firmly fixed on the substrate 30 and there are no welding defects.

[0050] In some embodiments, the package pins 20 include a pin header base or an array-type surface mount pin header.

[0051] For example, a pin header base is typically a component having a plurality of pins (or pins) arranged in parallel. These pins typically extend from one end or both sides of the base to form one or more rows. The pin header base is primarily used to establish electrical connections with a substrate 30 or other electronic components through pins. They are typically used in applications that require a higher pin density or that require frequent plugging and unplugging. The material of the pin header base is typically a metal with good electrical conductivity, such as copper alloy or tinned copper, to ensure good electrical connection and mechanical strength.

[0052] For example, an array-type patch pin header is a component that arranges multiple pins in a matrix form in a small, compact package. These pins are usually in the form of patches and can be directly mounted on the surface of a substrate. Array-type patch pin headers are mainly used in high-density integrated electronic devices, such as integrated circuit boards, module boards, etc. They provide higher pin density and smaller package size, which helps save space and reduce costs. Compared with the pin header base, the array-type patch pin header has a smaller volume and higher integration. They are usually connected to the substrate 30 through surface mount technology (SMT), which simplifies the assembly process and improves production efficiency.

[0053] In some embodiments, the package pins 20 and the substrate 30 are electrically connected by conductive adhesive or welding, and this assembly and connection can be fully automatically produced.

[0054] For example, conductive adhesive is an adhesive with conductive properties, which can form a conductive path after curing. By applying the conductive adhesive to the contact surface of the package pin 20 and the substrate 30 and curing them under appropriate conditions, an electrical connection between the two can be achieved. Conductive adhesive connection has the advantages of simple process, no need for high-temperature welding, and low thermal stress on components and substrates. It is particularly suitable for components that are sensitive to temperature or cannot withstand high-temperature welding.

[0055] For example, welding is to melt the solder (such as solder) and wet the contact surface of the package pin 20 and the substrate 30, so as to form a strong metallurgical bond after cooling. This connection method provides high conductivity, high mechanical strength and good reliability. The welding connection has the advantages of excellent conductivity, high mechanical strength and reliable connection. It is particularly suitable for electronic equipment that needs to withstand large mechanical stress and high temperature environment.

[0056] In some embodiments, the substrate 30 is a multi-layer high density interconnect printed circuit board.

[0057] For example, the substrate 30 is designed as a multi-layer high-density interconnect printed circuit board (HDI PCB). This design is intended to provide higher wiring density and smaller volume to meet the needs of modern electronic devices for miniaturization and high integration.

[0058] HDIPCB can contain multi-layer structures, each layer is connected by vias or interconnect lines, so as to achieve complex circuit layout. The increase in the number of layers can significantly improve the wiring density, but it will also increase the manufacturing cost and complexity. HDIPCB usually uses high-performance insulating materials and conductive materials, such as high Tg epoxy resin, polyimide and other insulating materials, and copper, copper alloy and other conductive materials to ensure the stability and reliability of the circuit board.

[0059] In some embodiments, the multi-layer high-density interconnected printed circuit board is provided with blind vias and buried vias to achieve interconnection between the multi-layer high-density interconnected printed circuit boards.

[0060] For example, blind vias are holes that extend from the surface of the circuit board to the inside but do not penetrate the entire thickness of the board. They are often used to connect the circuit pattern of the surface layer with the circuit pattern of the internal layer without affecting the circuit layout of other layers.

[0061] Buried vias: Buried vias are holes located inside the circuit board and completely surrounded by insulating material. They are used to connect circuit patterns between internal layers without penetrating to the surface of the circuit board.

[0062] The setting of blind and buried vias enables multi-layer HDI PCB to achieve more complex and flexible circuit interconnection structure. They not only improve the integration of circuit boards and signal transmission efficiency, but also reduce electromagnetic interference and signal loss.

[0063] In some embodiments, the substrate 30 is provided with positioning holes for fixing the transformer unit 10 and the package pins 20 .

[0064] The main function of the positioning holes is to serve as the positioning reference for the SMD inductor unit 10 and the package pins 20, ensuring that they can be accurately aligned and fixed in a predetermined position during the mounting process. This helps to improve the accuracy and reliability of assembly and reduce performance degradation or failures caused by misalignment or offset.

[0065] The position, size and shape of the positioning holes are usually designed according to the specific size and layout of the SMD inductor unit 10 and the package pins 20. During the manufacturing process, it is also necessary to ensure that the dimensional accuracy and surface quality of the positioning holes meet the requirements to ensure that the SMD components can be smoothly inserted and fixed therein.

[0066] In some embodiments, the network signal transformer module 100 further includes a top cover for covering the transformer unit 10 and the top of the substrate 30 .

[0067] For example, the top cover is usually made of insulating materials with certain mechanical strength, such as plastic, ceramic or metal materials (such as aluminum, stainless steel). The choice of these materials depends on the specific application scenarios of the network signal transformer, such as working environment, temperature requirements, electromagnetic shielding requirements, etc.

[0068] For example, the top cover is usually designed to be a flat structure with a certain thickness so that it can fit tightly on the substrate 30 and provide comprehensive protection for the internal transformer unit 10 and the top of the substrate 30. Its edges can be provided with flanges or buckles for easy installation and fixing. The top cover can prevent dust, moisture, corrosive substances, etc. in the external environment from entering the network signal transformer, thereby protecting the internal SMD inductor unit 10 and the top of the package substrate 30 from damage.

[0069] For example, for application scenarios that require electromagnetic shielding, the top cover can be made of conductive material or coated with a conductive layer to form a Faraday cage effect, effectively shielding external electromagnetic interference while preventing internal electromagnetic radiation leakage.

[0070] For example, in some high-power or high-frequency applications, the top cover may also be designed with heat dissipation holes or heat sinks to improve the heat dissipation performance of the network signal transformer and ensure its stability and reliability under long-term high-load operation.

[0071] For example, the top cover is usually fixed to the substrate 30 by mechanical fixing (such as screws, buckles) or adhesives (such as thermal conductive glue, double-sided tape). During installation, it is necessary to ensure the sealing between the top cover and the substrate 30 to prevent dust or moisture from entering. The position of the top cover is usually designed to cover the entire SMD inductor unit 10 and the top area of ​​the substrate 30 to ensure comprehensive protection. In some designs, the top cover can also cover part or all of the substrate edge to further enhance sealing and stability.

[0072] The top cover can be customized according to the specific requirements and application scenarios of the network signal transformer 100. For example, for applications requiring electromagnetic shielding, a top cover with specific conductive properties and shielding effectiveness can be designed; for applications requiring heat dissipation, a top cover with heat dissipation holes or heat sinks can be designed.

[0073] In some embodiments, the substrate 30 further includes a heat dissipation structure for improving the heat dissipation performance of the network signal transformer 100 and ensuring its stable operation under high power working conditions.

[0074] For example, the main purpose of the heat dissipation structure is to improve the heat dissipation performance of the network signal transformer module 100 under high power, such as PoE mode working conditions, to ensure that it will not be damaged or degraded due to overheating during long-term operation. By effectively dissipating the heat generated internally, the heat dissipation structure helps maintain a stable operating temperature of the internal components of the transformer, thereby improving its reliability and service life.

[0075] For example, the heat dissipation structure may include heat sinks, heat dissipation holes, heat dissipation channels, heat pipes, and other forms. Heat sinks are usually implemented by adding metal (such as copper, aluminum, etc.) heat sinks to the substrate 30, which can effectively transfer internal heat to the external environment. Heat dissipation holes and heat dissipation channels accelerate the dissipation of heat by increasing air flow. Heat pipes are an efficient heat conduction element that uses the phase change principle to transfer heat from a heat source to a heat dissipation area.

[0076] For example, in order to improve the heat dissipation performance, the design of the heat dissipation structure can comprehensively consider multiple factors such as the size, power, and working environment of the transformer. For example, in situations where the power is high or the working environment temperature is high, the number or area of ​​heat sinks can be increased, or more efficient heat dissipation technology can be used. In addition, the heat dissipation structure also needs to maintain an appropriate distance from other parts of the transformer (such as the inductor unit, package pins, etc.) to avoid adverse effects on their performance.

[0077] In some embodiments, a sealing structure is provided between the top cover and the substrate 30 to prevent external dust and moisture from invading, thereby improving the environmental adaptability and reliability of the network signal transformer 100 .

[0078] For example, the main function of the sealing structure is to prevent harmful substances such as external dust and moisture from invading the network signal transformer 100, thereby protecting its internal components from pollution and corrosion. By ensuring the cleanliness and dryness of the inside of the transformer, the sealing structure helps to improve the environmental adaptability and reliability of the transformer and extend its service life.

[0079] For example, the sealing structure may include a sealing ring, a sealing glue, a sealing gasket, etc. The sealing ring is usually an annular component made of an elastic material, which can form a tight seal between the top cover and the substrate 30. The sealing glue is an adhesive that can form a strong sealing layer after curing. The sealing gasket is a soft material that can fill the small gap between the top cover and the substrate 30, thereby improving the sealing effect.

[0080] For example, when installing the sealing structure, it is necessary to ensure that it fits tightly between the top cover and the base plate 30 and does not loosen or deform due to vibration or temperature changes. In addition, the integrity of the sealing structure needs to be checked regularly to ensure that it is always in good working condition. If the sealing structure is found to be damaged or aging, it should be replaced in time to avoid adverse effects on the performance of the transformer.

[0081] In some embodiments, the patch pins are designed to have a self-positioning structure, such as an L-shaped or J-shaped pin, to ensure accurate positioning during the mounting process and enhance the connection strength with the substrate 30 .

[0082] For example, one end of the L-shaped pin is fixed to the SMD inductor unit 10, and the other end is bent at a right angle to form an "L" shape. This design enables the pin to automatically align with the pad on the substrate 30 through its bent portion when inserted into the substrate 30, thereby achieving self-positioning. The self-positioning function of the L-shaped pin significantly reduces the need for manual alignment and improves the accuracy and consistency of mounting. The bent pin portion can provide greater mechanical support after welding, enhances the connection strength with the substrate, and helps to improve the overall reliability of the transformer.

[0083] For example, one end of the J-shaped pin is fixed to the SMD inductor unit 10, and the bent portion of the other end generally includes a downward bend and a subsequent upward bend, forming a shape similar to the letter "J". The complex bending design of the J-shaped pin can form a more secure self-locking structure after welding, further enhancing the connection stability between the SMD inductor unit 10 and the substrate 30. Since the bent portion of the J-shaped pin has a certain elasticity, it can better adapt to substrates 30 of different thicknesses, thereby improving the flexibility of the design.

[0084] In some embodiments, the inductor coil of the automated winding package is packaged using lead-free solder to meet environmental protection requirements.

[0085] For example, automated winding packaging technology can significantly improve the production efficiency and consistency of inductor coils. Through precise machine control, the winding parameters (such as the number of turns, wire diameter, etc.) of each inductor coil can be kept consistent, thereby improving the accuracy and stability of the inductance value. Lead solder is an environmentally friendly welding material that does not contain harmful substances such as lead and meets current environmental regulations. The use of lead-free solder for the packaging of inductor coils can not only reduce pollution to the environment, but also improve the welding quality and reliability of the inductor unit.

[0086] In some embodiments, the inductance value of the SMD inductor unit 10 can be adjusted according to application requirements to meet requirements of different frequencies and signal strengths.

[0087] For example, the inductance value determines the blocking effect of the chip inductor unit 10 on the AC signal. By adjusting the inductance value, the requirements of different frequencies and signal strengths can be met, thereby optimizing the performance of the circuit. The inductance value can be adjusted by changing parameters such as the number of turns, wire diameter, core material or shape of the inductor coil. For example, increasing the number of turns of the coil can increase the inductance value, while reducing the wire diameter can reduce the inductance value. In addition, special components such as adjustable inductors or digitally adjustable inductors can be used to achieve precise adjustment of the inductance value.

[0088] The adjustability of the inductance value enables the SMD inductor unit 10 to adapt to a wider range of application scenarios, improving the flexibility and versatility of the design. By accurately adjusting the inductance value, the performance parameters (such as impedance matching, filtering effect, etc.) of the network signal transformer 100 can be optimized to meet the needs of specific applications.

[0089] In some embodiments, the network signal transformer module 100 further includes a filter circuit for filtering out noise and interference in the signal to improve the quality of signal transmission.

[0090] For example, the filter circuit may include different types such as low-pass filter, high-pass filter, band-pass filter, and band-stop filter. According to actual application requirements, a suitable filter circuit can be selected to filter out noise and interference within a specific frequency range.

[0091] In some embodiments, the network signal transformer module 100 further includes a test interface for testing and calibrating the performance of the network signal transformer module 100 to ensure that it meets the design requirements.

[0092] For example, the types of test interfaces can include:

[0093] Signal input and output interfaces: used to connect test equipment to test the signal transmission performance of the network signal transformer 100. These interfaces are usually directly connected to the input and output terminals of the transformer.

[0094] Control interface: used to receive control signals of the test equipment, such as starting the test, stopping the test, etc. These interfaces can be connected to the control circuit of the network signal transformer 100 through a microcontroller or other control elements.

[0095] Power supply interface: used to provide power to the test equipment to ensure the normal operation of the equipment during the test. These interfaces are usually connected to the power input terminal of the network signal transformer 100.

[0096] The design of the test interface needs to consider factors such as the interface type, communication protocol, and electrical characteristics of the test equipment. By selecting the appropriate interface type and connection method, the efficiency and accuracy of the test process can be ensured.

[0097] For example, the network signal transformer 100 is suitable for high-speed data transmission equipment, such as routers, switches, modems, etc., to improve the stability and reliability of data transmission.

[0098] All of the above technical solutions can be arbitrarily combined to form optional embodiments of the present application, which will not be described in detail here.

[0099] The embodiment of the present application provides a network signal transformer module 100, which includes a transformer unit 10, a package pin 20 and a substrate 30, wherein the transformer unit 10 has an inductor coil and a patch pin of an automated winding package, and the transformer unit 10 is mounted on the substrate 30 through the patch pin; the package pin 20 is used to electrically connect the internal and external circuits of the network signal transformer module; the substrate 30 is used to support the transformer unit 10 and the package pin 20, and realize the electrical connection between the transformer unit 10 and the package pin 20 through the wiring on the substrate 30. The embodiment of the present application adopts a fully automated production transformer unit and a patch package pin material, and the manufacturing process of each transformer unit strictly follows the preset standards, ensuring highly consistent electrical characteristics between the components and enhancing the consistency and accuracy of product parameters. The entire module production process can be completely completed by the machine automatically, greatly improving the production speed, reducing the uncertainty caused by manual operation, thereby improving the overall production efficiency and reducing labor costs.

[0100] On the other hand, an embodiment of the present application provides a network communication device, the network communication device comprising a network signal transformer module as described in any of the above embodiments. The specific structure of the network signal transformer module refers to the above exemplary embodiments, or a combination of the above exemplary embodiments can be adopted without conflict.

[0101] The above description is only a specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application.

Claims

1. A network signal transformer module, characterized in that: The network signal transformer module comprises: A transformer unit, wherein the transformer unit has an inductor coil and a patch pin of an automated winding package, and the transformer unit is mounted on a substrate through the patch pin; Package pins, used to electrically connect to the internal and external circuits of the network signal transformer module; The substrate is used to support the transformer unit and the package pins, and realize the electrical connection between the transformer unit and the package pins through wiring on the substrate.

2. The network signal transformer module according to claim 1, characterized in that: The transformer unit is any one or more combinations of a horizontal patch discrete transformer, a horizontal patch common-mode inductor, a vertical patch discrete transformer and a vertical patch common-mode inductor.

3. The network signal transformer module according to claim 1, characterized in that: The chip inductor unit is fixed on the substrate by surface mounting technology.

4. The network signal transformer module according to claim 1, characterized in that: The package pins include a pin header base or an array type patch pin header.

5. The network signal transformer module according to claim 1, characterized in that: The substrate is a multi-layer high-density interconnection printed circuit board.

6. The network signal transformer module according to claim 5, characterized in that: The multi-layer high-density interconnected printed circuit board is provided with blind holes and buried holes to realize interconnection and device layout between the multi-layer high-density interconnected printed circuit boards.

7. The network signal transformer module according to claim 1, characterized in that: The network signal transformer module also includes a top cover for covering the transformer unit and the top of the substrate.

8. The network signal transformer module according to claim 1, characterized in that: The package pins are electrically connected to the substrate through conductive glue or welding.

9. The network signal transformer module according to any one of claims 1 to 8, characterized in that: The network signal transformer module also includes a top cover for covering the transformer unit and the top of the substrate.

10. A network communication device, characterized in that: The network communication device comprises a network signal transformer module as described in any one of claims 1-9.

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