Frame sealing equipment and sealing process for IGBT (Insulated Gate Bipolar Translator) pin

Abstract

The invention belongs to the technical field of electrical elements, and particularly relates to a semiconductor device packaging device, in particular to a frame sealing device for an IGBT pin and a sealing process, when the frame sealing device for the IGBT pin is assembled, a hot air source is used for providing hot air for each bearing box and blowing IGBT modules in the bearing boxes to float, and the IGBT modules in the bearing boxes are sealed by the hot air source. Therefore, the IGBT module is prevented from being scratched, meanwhile, the temperature in the containing groove is increased, and curing of the glue is delayed. Hot air is introduced into the bearing box to preserve heat of the containing groove, on one hand, solidification of glue is delayed, so that the bonding effect is improved, meanwhile, the IGBT module can be preheated in advance through the hot air, and it is avoided that the glue is directly solidified when making contact with the overcooled IGBT module; and on the other hand, the IGBT module is transferred in a suspension manner, so that the IGBT module can be prevented from being scratched when being transferred on the rotary table, and the qualified rate of the frame for the IGBT pin is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of electrical components, and specifically relates to semiconductor device packaging equipment, and in particular to a frame sealing device and a sealing process for IGBT pins. Background Art

[0002] When packaging the IGBT, glue needs to be applied to the pin surface, and then the cover body is passed through the pins to complete the bonding of the cover body and the IGBT module.

[0003] In the related art, during bonding, the IGBT module and the cover body are often not firmly bonded, and the IGBT module and the cover body fall off, thereby causing the IGBT module to be scrapped and causing the qualified rate of the IGBT module to decrease.

[0004] Therefore, how to improve the firmness of the bonding between the IGBT module and the cover is a technical problem that needs to be solved urgently.

[0005] It should be noted that the above information disclosed in this background technology section is only used to understand the background technology of the present application concept, and therefore, the above description is not considered to constitute information of the prior art. Summary of the invention

[0006] The embodiments of the present disclosure at least provide a frame sealing device and a sealing process for an IGBT pin.

[0007] In a first aspect, an embodiment of the present disclosure provides a frame sealing device for an IGBT pin, comprising: Assembly platform with multiple workstations; A rotating table, which is arranged on the assembly platform and is used to drive the IGBT module to circulate on multiple stations; A loading robot arm is arranged on the assembly platform and is used to grab the IGBT module and place it on the rotating table; A glue spreading component, which is arranged on the assembly platform and is used to spread glue on the top surface of the IGBT module; A capping robot arm is arranged on the assembly platform and is used to grab the cover body, align the pinholes of the cover body with the pins on the top surface of the IGBT module, and then cover the cover body on the IGBT module on the rotating table to complete the packaging; A control module, which is electrically connected to the rotating table, the feeding robot arm, the glue applying assembly and the capping robot arm, and is configured to control the rotating table, the feeding robot arm, the glue applying assembly and the capping robot arm to work; Wherein, the rotating platform comprises a hot air source and a plurality of supporting boxes arranged in a circumferential array; The supporting box is provided with a receiving slot; The bottom of the receiving tank is evenly distributed with a plurality of blowing holes; During assembly, the hot air source is used to provide hot air to each supporting box and blow the IGBT module in the supporting box to float, thereby preventing the IGBT module from being scratched.

[0008] In an optional implementation, the groove wall of the accommodating groove is spaced a preset distance from the IGBT module; When placing the IGBT module, the IGBT module in the receiving slot is preheated by hot air provided by the hot air source; When applying glue, the hot air provided by the hot air source is used to keep the receiving tank warm and delay the curing of the glue.

[0009] In an optional embodiment, a clamping assembly is further provided in the supporting box; The clamping assembly is arranged in the supporting box and is used to adjust the IGBT module in the receiving slot to be centered so as to facilitate positioning by the capping robot arm.

[0010] In an optional embodiment, the clamping assembly includes a plurality of pneumatic clamping plates; The groove wall of the receiving groove is provided with a plurality of mounting recesses; The plurality of pneumatic clamping plates are installed in corresponding mounting recesses through return springs; The mounting recess is in communication with the hot air source; After the loading robot arm places the IGBT module into the receiving slot, the corresponding supporting box is connected to the hot air source, and the pneumatic clamping plate clamps the floating IGBT module under the drive of the hot air.

[0011] In an optional embodiment, a diversion air channel is further provided in the side wall of the supporting box; The diverter air passage is in communication with the mounting recess in the receiving groove.

[0012] In an optional embodiment, insertion grooves are provided on both sides of the bottom of the receiving groove; The clamping claws of the feeding robot arm and the capping robot arm are inserted into the corresponding insertion slots when working.

[0013] In an optional implementation, the IGBT pin frame sealing device further includes: A visual inspection component, which is arranged on the assembly platform and is used to obtain image information of the IGBT module after the glue is applied; The control module is also configured to receive image information and determine the curing degree of the glue based on the image information; If the curing degree is higher than the preset value, the temperature of the hot air blown out by the hot air source is increased.

[0014] In an optional embodiment, a solenoid valve is provided at the connection between each of the supporting boxes and the air outlet pipe of the hot air source; The control module is also configured to control the solenoid valve to be turned on to float the IGBT module after the loading robot arm places the IGBT module into the supporting box; and to control the solenoid valve to be turned off after the capping robot arm takes out the cover body and the IGBT module box cover.

[0015] In a second aspect, the embodiment of the present disclosure further provides a sealing process applied to the frame sealing device for IGBT pins as described above, the process comprising: Control the loading robot arm to start loading, grab the IGBT module and place it in the support box on the rotating table; Control the hot air source to be connected to the support box, float the IGBT module in the support box, and preheat the IGBT module; Control the rotating table to rotate, rotate the IGBT module to the bottom of the glue spreading assembly, and control the glue spreading assembly to spread glue; Control the rotating table to rotate, rotate the IGBT module to the bottom of the capping mechanical arm, and control the capping mechanical arm to grab the cover body, align the pinhole of the cover body with the pin on the top surface of the IGBT module, and then cover the cover body on the IGBT module on the rotating table; After the capping robot arm is controlled to take out the packaged IGBT module, the hot air source is controlled to be disconnected from the corresponding supporting box.

[0016] In an optional embodiment, the IGBT pin frame sealing device further includes a visual inspection component; After gluing is completed and before the lid is applied; The process also includes: Control the rotating table to rotate, rotate the IGBT module to the bottom of the visual inspection component, and obtain the image information of the IGBT module after the glue is applied; Receive image information, and determine the curing degree of the glue based on the graphic information; If the curing degree is higher than the preset value, the temperature of the hot air blown out by the hot air source is increased.

[0017] The beneficial effect of the present invention is that the frame sealing device and sealing process for IGBT pins insulates the receiving groove by passing hot air into the supporting box. On the one hand, the curing of the glue is delayed, thereby improving the bonding effect. At the same time, the IGBT module can be preheated in advance by the hot air to avoid the glue from directly curing when it contacts the overcooled IGBT module. On the other hand, the IGBT module is transported in a suspended manner, which can avoid scratches on the IGBT module when transferring on the rotating table, thereby improving the qualified rate of the IGBT module.

[0018] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description and the drawings.

[0019] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, this article specifically cites preferred embodiments and provides detailed descriptions as follows in conjunction with the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 A schematic diagram of the structure of a frame sealing device for an IGBT pin provided in an embodiment of the present disclosure; Figure 2 A schematic diagram of the structure of a rotating platform provided in an embodiment of the present disclosure; Figure 3 A schematic diagram of the structure of a support box provided in an embodiment of the present disclosure; Figure 4 A cross-sectional view of a support box provided in an embodiment of the present disclosure; Figure 5 An electrical control schematic diagram of a frame sealing device for an IGBT pin provided in an embodiment of the present disclosure; Figure 6 A flow chart of a sealing process for an IGBT pin frame sealing device provided in an embodiment of the present disclosure.

[0022] In the figure: 100, assembly platform; 200, rotating table; 210, supporting box; 211, receiving slot; 2111, insertion slot; 212, blowing hole; 213, clamping assembly; 2131, pneumatic clamping plate; 2132, return spring; 2133, mounting recess; 2134, diverter air duct; 220, solenoid valve; 300, feeding robot arm; 400, glue spreading assembly; 500, capping robot arm; 600, visual inspection assembly; 700, IGBT module; 800, cover body. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] In this article, when it is mentioned that the first component is located on the second component, this may mean that the first component may be directly formed on the second component, or the third component may be interposed between the first component and the second component. In addition, in the drawings, in order to effectively describe the technical content, the thickness of the components may be exaggerated or reduced.

[0025] The defects existing in the above solutions are the results obtained by the inventor after practice and careful research. Therefore, the discovery process of the above problems and the solutions proposed by the present invention in this article for the above problems should be the contributions made by the inventor to the present invention during the disclosure process.

[0026] After research, it was found that when the IGBT module in the related technology is packaged, due to external temperature reasons, the glue will solidify prematurely, which will cause the viscosity of the glue to decrease when the box cover is closed, and the cover body and the IGBT module cannot be firmly bonded, causing the IGBT module to fall off from the cover body. At the same time, when applying glue, the overflowing glue can easily cause the IGBT module to adhere to the rotating disk, resulting in the IGBT module sticking to the rotating table when the packaged frame is taken out later. When the IGBT is pulled down by external force, the risk of the IGBT module and the cover body falling off increases.

[0027] Based on the above research, an embodiment of the present disclosure provides a frame sealing device for IGBT pins, which uses a hot air source to blow the IGBT module to float, thereby increasing the temperature in the receiving groove, delaying the curing of the glue, and preheating the IGBT module in advance to avoid direct curing of the glue. At the same time, the IGBT module is directly separated from the rotating table to avoid bonding between the IGBT module and the rotating table, thereby solving the technical problem in the related art that the cover body is easy to fall off after bonding with the IGBT.

[0028] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0029] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0030] See also Figure 1 and Figure 5 , at least one embodiment provides a frame sealing device for an IGBT pin, including the following structure.

[0031] The assembly platform 100 is provided with a plurality of workstations.

[0032] The rotating table 200 is disposed on the assembly platform 100 and is used to drive the IGBT module 700 to circulate on multiple workstations.

[0033] The loading robot arm 300 is disposed on the assembly platform 100 and is used to grab the IGBT module 700 and place it on the rotating table 200 .

[0034] The glue spreading assembly 400 is disposed on the assembly platform 100 and is used to spread glue on the top surface of the IGBT module 700 .

[0035] The capping robot 500 is disposed on the assembly platform 100 and is used to grab the cover 800, align the pinholes of the cover 800 with the pins on the top surface of the IGBT module 700, and then cover the cover 800 on the IGBT module 700 on the rotating table 200 to complete the packaging.

[0036] The control module is electrically connected to the rotating platform 200, the feeding robot arm 300, the glue spreading assembly 400 and the capping robot arm 500, and is configured to control the rotating platform 200, the feeding robot arm 300, the glue spreading assembly 400 and the capping robot arm 500 to work. Figure 2 and Figure 3 , wherein the rotating table 200 includes a hot air source and a plurality of supporting boxes 210 arranged in a circumferential array; the supporting box 210 is provided with a receiving groove 211; a plurality of blowing holes 212 are evenly distributed at the bottom of the receiving groove 211; during assembly, the hot air source is used to provide hot air to each supporting box 210, and blow the IGBT module 700 in the supporting box 210 to float, thereby avoiding scratches on the IGBT module 700, and at the same time, increasing the temperature in the receiving groove 211 to delay the curing of the glue.

[0037] By introducing hot air into the support box 210 to insulate the receiving groove 211, on the one hand, the curing of the glue is delayed, thereby improving the bonding effect. At the same time, the IGBT module 700 can be preheated in advance by the hot air to prevent the glue from directly curing when it comes into contact with the overcooled IGBT module 700. On the other hand, the IGBT module 700 is transported in a suspended manner, which can prevent the IGBT module 700 from being scratched when transferring on the rotating table 200, thereby improving the qualified rate of the IGBT module 700.

[0038] It should be noted that the groove wall of the receiving groove 211 is spaced a preset distance from the IGBT module 700; when placing the IGBT module 700, the IGBT module 700 in the receiving groove 211 is preheated by the hot air provided by the hot air source; when applying the glue, the hot air provided by the hot air source is used to keep the receiving groove 211 warm to delay the curing of the glue. By setting the size of the receiving groove 211 to be larger than the size of the IGBT module 700, on the one hand, the assembly requirements of different sizes are met, and on the other hand, the IGBT module 700 is prevented from being scratched when it falls into the receiving groove.

[0039] See also Figure 3 and Figure 4 , a clamping assembly 213 is also provided in the support box 210; the clamping assembly 213 is provided in the support box 210 and is used to adjust the IGBT module 700 in the receiving groove 211 to the center, so as to facilitate the positioning of the capping robot arm 500. The IGBT module 700 is clamped by the clamping assembly 213, and the position of the IGBT module 700 clamped by the clamping assembly 213 will not change when producing the same batch of IGBT modules 700, so that the subsequent packaging robot arm can be positioned, and the pinhole of the cover body 800 can be aligned with the pin of the IGBT module 700, thereby improving the assembly accuracy.

[0040] Specifically, the clamping assembly 213 includes a plurality of pneumatic clamping plates 2131; a plurality of mounting recesses 2133 are provided on the groove wall of the receiving groove 211; a plurality of the pneumatic clamping plates 2131 are installed in the corresponding mounting recesses 2133 through a reset spring 2132; the mounting recesses 2133 are connected to the hot air source; after the loading robot arm 300 places the IGBT module 700 into the receiving groove 211, the corresponding support box 210 is connected to the hot air source, and the pneumatic clamping plates 2131 clamp the floating IGBT module 700 under the drive of the hot air.

[0041] It should be noted that the air volume provided by the hot air source is always the same. Each time the clamping plate is started for clamping, each pneumatic clamping plate 2131 is driven by hot air and the movement process is the same as the previous time, thereby ensuring that the IGBT module 700 is fixed in the same position each time the pneumatic clamping plate 2131 clamps.

[0042] Please continue reading Figure 3 and Figure 4 The side wall of the support box 210 is also provided with a diverter air channel 2134, which is in communication with the mounting recess 2133 in the receiving groove 211. The diverter air channel 2134 disperses the hot air to ensure that each pneumatic clamping plate 2131 is subjected to uniform wind force.

[0043] It should be noted that in order to prevent the pneumatic clamping plate 2131 from damaging the IGBT module 700 when clamping, the surface of the clamping plate is a flexible layer.

[0044] Please continue reading Figure 4 The bottom of the receiving groove 211 is provided with insertion grooves 2111 on both sides; the clamping claws of the feeding robot arm 300 and the capping robot arm 500 are inserted into the corresponding insertion grooves 2111 when working. The insertion grooves 2111 are provided to facilitate the insertion of the feeding robot arm 300 and the capping robot arm 500.

[0045] See also Figure 1 and Figure 5 The IGBT pin frame sealing device further includes: a visual inspection component 600, which is arranged on the assembly platform 100 and is used to obtain image information of the IGBT module 700 after the glue is applied; the control module is also configured to receive image information and obtain and judge the curing degree of the glue based on the graphic information; if the curing degree is higher than the preset value, the temperature of the hot air blown out by the hot air source is increased. By setting the visual inspection component 600, the curing degree of the glue is detected to improve the quality of subsequent bonding.

[0046] Specifically, the preset value of the curing degree is obtained as follows: Use a high-resolution camera to capture continuous images of the glue from dispensing to complete curing to obtain sample data; De-noise the sample data and improve the image quality of the sample data through histogram equalization; Focus all sample data on the glue area, and crop the sample data with the focus point as the center to unify the image size and complete the preprocessing of the sample data; Perform feature extraction on the preprocessed sample data to obtain the color value of each image; The color values ​​are sorted according to the time sequence of sample data acquisition to complete the construction of the time series of curing degree represented by color values; According to the performance of the glue, the color value of one of the time points in the curing degree time series is selected as the preset value of the curing degree, and the time point is set manually.

[0047] In order to control the connection and disconnection of each support box 210 with the hot air source respectively, a solenoid valve 220 is provided at the connection between each support box 210 and the air outlet pipe of the hot air source; the control module is also configured to control the solenoid valve 220 to be turned on after the loading robot 300 places the IGBT module 700 into the support box 210, so that the IGBT module 700 floats; and control the solenoid valve 220 to be turned off after the capping robot 500 takes out the cover body 800 and the IGBT module 700 box cover.

[0048] See also Figure 6 At least one embodiment further provides a sealing process for the frame sealing device for IGBT pins as described above, the process comprising: S110: Control the loading robot arm to start loading, grab the IGBT module 700 and place it in the support box on the rotating table; S120: controlling the hot air source to be connected to the supporting box, floating the IGBT module 700 in the supporting box, and preheating the IGBT module 700; S130: Control the rotating table to rotate, rotate the IGBT module 700 to the bottom of the glue spreading assembly, and control the glue spreading assembly to spread glue; S140: Control the rotating table to rotate, rotate the IGBT module 700 to the bottom of the capping robot arm, and control the capping robot arm to grab the cover 800, align the pinholes of the cover 800 with the pins on the top surface of the IGBT module 700, and then cover the cover 800 on the IGBT module 700 on the rotating table; S150: After controlling the capping robot arm to take out the packaged IGBT module 700, the hot air source is controlled to be disconnected from the corresponding supporting box.

[0049] It should be noted that the frame sealing device for IGBT pins also includes a visual inspection component 600; After gluing is completed and before the lid is applied; The process also includes: controlling the rotation of the rotating table 200 to rotate the IGBT module 700 to the bottom of the visual inspection component 600 to obtain image information of the IGBT module 700 after the glue is applied; receiving the image information, and judging the degree of curing of the glue based on the graphic information. If the degree of curing is higher than a preset value, the temperature of the hot air blown out by the hot air source is increased.

[0050] In summary, the present invention provides a frame sealing device and a sealing process for IGBT pins, wherein the frame sealing device for IGBT pins includes an assembly platform 100, which is provided with a plurality of workstations; a rotating table 200, which is arranged on the assembly platform 100 and is used to drive the IGBT module 700 to circulate on the plurality of workstations; a loading robot arm 300, which is arranged on the assembly platform 100 and is used to grab the IGBT module 700 and place it on the rotating table 200; a glue spreading component 400, which is arranged on the assembly platform 100 and is used to spread glue on the top surface of the IGBT module 700; a capping robot arm 500, which is arranged on the assembly platform 100 and is used to grab the cover body 800, align the pinholes of the cover body 800 with the pins on the top surface of the IGBT module 700, and then cover the cover body 800 on the The packaging is completed on the IGBT module 700 on the rotating table 200; the control module is electrically connected to the rotating table 200, the loading robot arm 300, the glue applying assembly 400 and the capping robot arm 500, and is configured to control the operation of the rotating table 200, the loading robot arm 300, the glue applying assembly 400 and the capping robot arm 500, the rotating table 200 includes a hot air source and a plurality of supporting boxes 210 arranged in a circumferential array; the supporting box 210 is provided with a receiving groove 211; the bottom of the receiving groove 211 is evenly distributed with a plurality of blowing holes 212; during assembly, the hot air source is used to provide hot air to each supporting box 210, and blow the IGBT module 700 in the supporting box 210 to float, thereby avoiding scratches on the IGBT module 700, and at the same time, increasing the temperature in the receiving groove 211 to delay the curing of the glue. By introducing hot air into the support box 210 to insulate the receiving groove 211, on the one hand, the curing of the glue is delayed, thereby improving the bonding effect. At the same time, the IGBT module 700 can be preheated in advance by the hot air to prevent the glue from directly curing when it comes into contact with the overcooled IGBT module 700. On the other hand, the IGBT module 700 is transported in a suspended manner, which can prevent the IGBT module 700 from being scratched when transferring on the rotating table 200, thereby improving the qualified rate of the IGBT module 700.

[0051] Based on the above ideal embodiments of the present invention, the relevant staff can make various changes and modifications without departing from the technical concept of the present invention through the above description. The technical scope of the present invention is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A frame sealing device for IGBT pins, characterized in that: include: An assembly platform (100) is provided with a plurality of workstations; A rotating table (200) is used to drive the IGBT module (700) to circulate on multiple workstations; A loading robot arm (300), used for grabbing the IGBT module (700) and placing it on the rotating table (200); A glue spreading component (400), which is arranged on the assembly platform (100) and is used to spread glue on the top surface of the IGBT module (700); The capping mechanical arm (500) covers the cover body (800) on the IGBT module (700) on the rotating platform (200) to complete the packaging; A control module configured to control the operation of the rotating table (200), the loading robot arm (300), the glue spreading assembly (400), and the capping robot arm (500); Wherein, the rotating platform (200) comprises a hot air source and a plurality of supporting boxes (210) arranged in a circumferential array; The supporting box (210) is provided with a receiving groove (211); The bottom of the containing groove (211) is evenly distributed with a plurality of blowing holes (212); During assembly, the hot air source is used to provide hot air to each support box (210) and blow the IGBT module (700) in the support box (210) until it floats.

2. The IGBT pin frame sealing device according to claim 1, characterized in that: A groove wall of the accommodating groove (211) and the IGBT module (700) are spaced apart by a preset distance; When placing the IGBT module (700), the IGBT module (700) in the receiving groove (211) is preheated by hot air provided by a hot air source; When applying glue, the hot air provided by the hot air source is used to keep the containing groove (211) warm, thereby delaying the curing of the glue.

3. The IGBT pin frame sealing device according to claim 2, characterized in that: A clamping assembly (213) is also provided in the supporting box (210); The clamping assembly (213) is arranged in the supporting box (210) and is used to adjust the IGBT module (700) in the containing groove (211) to be centered, so as to facilitate positioning of the capping robot arm (500).

4. The IGBT pin frame sealing device according to claim 3, characterized in that: The clamping assembly (213) comprises a plurality of pneumatic clamping plates (2131); The groove wall of the containing groove (211) is provided with a plurality of mounting recesses (2133); The plurality of pneumatic clamping plates (2131) are installed in corresponding installation recesses (2133) via return springs (2132); The mounting recess (2133) is in communication with the hot air source; After the loading robot arm (300) places the IGBT module (700) into the containing groove (211), the corresponding supporting box (210) is connected to the hot air source, and the pneumatic clamping plate (2131) clamps the floating IGBT module (700) under the drive of the hot air.

5. The IGBT pin frame sealing device according to claim 4, characterized in that: A diversion air channel (2134) is also provided in the side wall of the support box (210); The diverter air channel (2134) is in communication with the mounting recess (2133) in the accommodating groove (211).

6. The IGBT pin frame sealing device according to claim 1, characterized in that: Insertion grooves (2111) are provided on both sides of the bottom of the accommodating groove (211); When working, the clamping claws of the loading robot arm (300) and the capping robot arm (500) are inserted into the corresponding insertion slots (2111).

7. The IGBT pin frame sealing device according to claim 1, characterized in that: The IGBT pin frame sealing device also includes: A visual inspection component (600), which is arranged on the assembly platform (100) and is used to obtain image information of the IGBT module (700) after the glue is applied; The control module is also configured to receive image information and determine the curing degree of the glue based on the image information; If the curing degree is higher than the preset value, the temperature of the hot air blown out by the hot air source is increased.

8. The IGBT pin frame sealing device according to claim 1, characterized in that: A solenoid valve (220) is provided at the connection between each of the supporting boxes (210) and the air outlet pipe of the hot air source; The control module is further configured to control the solenoid valve (220) to be turned on to float the IGBT module (700) after the loading robot arm (300) places the IGBT module (700) into the supporting box (210); and to control the solenoid valve (220) to be turned off after the capping robot arm (500) takes out the cover body (800) and the box cover of the IGBT module (700).

9. A sealing process applied to the IGBT pin frame sealing device as claimed in claim 1, characterized in that: The sealing process comprises: Controlling the loading robot arm (300) to start loading, grabbing the IGBT module (700) and placing it in a supporting box (210) on the rotating table (200); Controlling the hot air source to be connected to the support box (210), floating the IGBT module (700) in the support box (210), and preheating the IGBT module (700); Controlling the rotating table (200) to rotate, rotating the IGBT module (700) to below the glue spreading assembly (400), and controlling the glue spreading assembly (400) to spread glue; Controlling the rotating platform (200) to rotate, rotating the IGBT module (700) to the bottom of the capping mechanical arm (500), and controlling the capping mechanical arm (500) to grab the cover body (800), aligning the pinholes of the cover body (800) with the pins on the top surface of the IGBT module (700), and then covering the cover body (800) on the IGBT module (700) on the rotating platform (200); After the capping robot arm (500) is controlled to take out the packaged IGBT module (700), the hot air source is controlled to be disconnected from the corresponding supporting box (210).

10. The sealing process of the frame sealing device for IGBT pins according to claim 9, characterized in that: The frame sealing device for IGBT pins also includes a visual inspection component (600); After the glue is applied and before the lid is covered, the process also includes: Controlling the rotating table (200) to rotate, rotating the IGBT module (700) to below the visual inspection component (600), and obtaining image information of the IGBT module (700) after the glue is applied; Receive image information, and determine the curing degree of the glue based on the graphic information; If the curing degree is higher than the preset value, the temperature of the hot air blown out by the hot air source is increased.

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