Capacitively loaded low frequency microbridge
By employing capacitor loading technology and structural optimization, a capacitor-loaded low-frequency miniature bridge was designed, which solves the problem of excessively large low-frequency bridge size, realizes miniaturization and performance optimization of the bridge, and is suitable for modern communication equipment in the low-frequency range.
Patent Information
- Application Number
- CN202411801693.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-09
- Publication Date
- 2025-11-25
- Estimated Expiration
- 2044-12-09
AI Technical Summary
Existing low-frequency bridges are bulky due to their series-connected multi-layer stacked structure, which cannot meet the miniaturization requirements of modern electronic communication equipment.
By employing capacitor loading technology and structural optimization, and through the stacking of multilayer dielectric substrates, wire and via design, combined with embedded capacitors and double helix structure, the wire layout is optimized and the connection methods between capacitors and wires are increased to form a capacitor-loaded low-frequency micro bridge.
This technology enables miniaturization of the bridge, reduces insertion loss and coupling, and ensures a phase of around 90°, thus meeting the miniaturization requirements of modern communication equipment.
Smart Images
Figure CN119812712B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of low-frequency micro-bridge, in particular to a capacitor-loaded low-frequency micro-bridge. BACKGROUND
[0002] Nowadays, in the era of highly prosperous electronic communication equipment, the development of various equipment has entered the stage of miniaturization and micro-miniaturization, and at the same time, the corresponding miniaturization requirement is also put forward for various related devices. As one of the commonly used passive devices, the bridge also needs to comply with the development requirement. Generally, the low-frequency bridge adopts a series type multi-layer stacked structure, which occupies a large area, has a large thickness, and has a large overall volume, and cannot meet the development requirement of miniaturization. SUMMARY
[0003] In order to solve the problem of large volume of low-frequency bridge, the purpose of the present application is to provide a capacitor-loaded low-frequency micro-bridge, which is optimized and modified by capacitor loading technology and structure, so as to meet the development requirement of device miniaturization.
[0004] In order to achieve the above-mentioned purpose, the following technical scheme is adopted in the present application:
[0005] A capacitor-loaded low-frequency micro-bridge, which comprises a bridge structure main body stacked by multiple layers of dielectric substrates, a wire part, a via and a loading capacitor arranged inside the bridge structure main body, and an external port arranged on the outer layer of the bridge structure main body; the top layer of the bridge structure main body is a ground layer; the wire part comprises twenty layers of wires; wherein the first layer and the second layer of the bridge structure main body are each provided with one wire, and each layer of the other structure main body is provided with two wires; the twenty layers of wires and the via are connected to form a main body coupling wire; the via is used to connect the wires of different levels; the loading capacitor is connected with the corresponding wire through the via; the external port comprises an input end one, a ground end two, an isolation end three, an output end four, a ground end five and an output end six. The number of wire layers is different from the number of dielectric substrate layers, and they are not one-to-one corresponding. The number of layers of dielectric substrate with wires is 20, and the total number of dielectric substrates is 25. The first layer and the second layer of the wire are not one wire, and there are only two wires in total from the functional point of view. The wires on the 1st, 3rd, 5th, 7th, 9th, 11th, 13th, 15th, 17th and 19th layers of the wire are connected, which is one wire; the wires on the 2nd, 4th, 6th, 8th, 10th, 12th, 14th, 16th, 18th and 20th layers of the wire are connected, which is one wire.
[0006] The top layer of the bridge structure body is a ground layer, which is connected with the second and fifth grounding terminals; the wires on the bridge structure body are connected in a manner of one layer separating one layer to connect to the twentieth layer; the middle part of the ground layer is provided with a wire, which connects two wires on the third layer of the bridge structure body through a through hole; one wire on the second layer of the bridge structure body connects two wires on the fourth layer of the bridge structure body through a through hole; the third layer to the twentieth layer of the bridge structure body are connected by two wires of each layer in a manner of one layer separating one layer; the two wires on the third layer of the bridge structure body are connected with the two wires on the fifth layer of the bridge structure body through a through hole; the two wires on the fourth layer of the bridge structure body are connected with the two wires on the sixth layer of the bridge structure body through a through hole; the bridge structure body extends downward with the third and fourth layers as templates; one end of the two wires on the nineteenth layer of the bridge structure body is connected with the third isolation terminal and the sixth output terminal, and the other end is connected with the two wires on the seventeenth layer through a through hole; one end of the two wires on the twentieth layer of the bridge structure body is connected with the first input terminal and the fourth output terminal, and the other end is connected with the two wires on the eighteenth layer through a through hole.
[0007] As a further improvement of the above technical solution, the third isolation terminal and the sixth output terminal in the seventh layer of the bridge structure body each extend a wire from the port along the body coupling wire on the outer side thereof as a port extension wire of the seventh layer. The first input terminal and the fourth output terminal in the eighth layer of the bridge structure body each extend a wire from the port along the body coupling wire on the outer side thereof as a port extension wire of the eighth layer. The third isolation terminal and the sixth output terminal in the ninth layer of the bridge structure body each extend a wire from the port along the body coupling wire on the outer side thereof as a port extension wire of the ninth layer. The first input terminal and the fourth output terminal in the tenth layer of the bridge structure body each extend a wire from the port along the body coupling wire on the outer side thereof as a port extension wire of the tenth layer. The third isolation terminal and the sixth output terminal in the eleventh layer of the bridge structure body each extend a wire from the port along the body coupling wire on the outer side thereof as a port extension wire of the eleventh layer. The first input terminal and the fourth output terminal in the twelfth layer of the bridge structure body each extend a wire from the port along the body coupling wire on the outer side thereof as a port extension wire of the twelfth layer. The third isolation terminal and the sixth output terminal in the thirteenth layer of the bridge structure body each extend a wire from the port along the body coupling wire on the outer side thereof as a port extension wire of the thirteenth layer. The first input terminal and the fourth output terminal in the fourteenth layer of the bridge structure body each extend a wire from the port along the body coupling wire on the outer side thereof as a port extension wire of the fourteenth layer. The port extension wires are coupled with each other.
[0008] As a further improvement of the above technical solution, the input port one and the output port four form a coupling line, the isolation port three and the output port six form a coupling line, and the two coupling lines have equal amplitude and 90 degree phase difference.
[0009] As a further improvement of the above technical solution, two loading capacitors are arranged on the bridge structure body; each loading capacitor is an embedded capacitor and adopts VIC structure; the two ends of the capacitor are connected through a via and a ground terminal, and the via is connected with a wire; the two coupling lines of the bridge structure body are connected with a ground capacitor.
[0010] As a further improvement of the above technical solution, the main body coupling wire is divided into left and right parts downward from the third layer of the bridge structure body, the two parts are arranged in a spiral manner, a via is arranged at the two ends of each layer of wire to connect different layers of wires, and the coupling wire forms a double spiral structure from the third layer to the twentieth layer.
[0011] As a further improvement of the above technical solution, the loading capacitor includes A1 part, A2 part, A3 part, A4 part, A5 part, A6 part, A7 part, A8 part, A9 part, A10 part, A11 part, A12 part, A13 part, B1 part, B2 part, B3 part, B4 part, B5 part, B6 part, B7 part, B8 part, B9 part, B10 part and B11 part.
[0012] The A1 part is connected with the second ground terminal, the A2 part is connected with the via C1, the A3 part is connected with the second ground terminal, the A4 part is connected with the via C1, the A5 part is connected with the second ground terminal, the A6 part is connected with the via C1, the A7 part is connected with the second ground terminal, the A8 part is connected with the via C1, the A9 part is connected with the second ground terminal, the A10 part is connected with the via C1, the A11 part is connected with the via C1, the A12 part is connected with the second ground terminal, and the A13 part is connected with the via C1; the A1 part, the A2 part, the A3 part, the A4 part, the A5 part, the A6 part, the A7 part, the A8 part, the A9 part, the A10 part, the A11 part, the A12 part and the A13 part are connected in parallel, and are connected with the second layer of the bridge structure body through the via C1 and connected between the wire and the ground as a ground capacitor.
[0013] The B1 part of the loading capacitor is connected with the via C2, the B2 part is connected with the ground terminal five, the B3 part is connected with the via C2, the B4 part is connected with the ground terminal five, the B5 part is connected with the via C2, the B6 part is connected with the ground terminal five, the B7 part is connected with the via C2, the B8 part is connected with the ground terminal five, the B9 part is connected with the via C2, the B10 part is connected with the ground terminal five, the B11 part is connected with the via C2, the B1 part, the B2 part, the B3 part, the B4 part, the B5 part, the B6 part, the B7 part, the B8 part, the B9 part, the B10 part and the B11 part are connected with each other in parallel, and are connected with the first layer of the bridge structure main body through the via C2, and are connected between the conductor and the ground as a grounding capacitor. Only the via C1 and the via C2 are used as the capacitor part to connect the capacitors through multiple layers and connect the capacitors with the conductors.
[0014] As a further improvement of the above technical solution, the medium substrate adopts a ceramic substrate, and the bridge structure main body adopts an LTCC low-temperature co-firing technology to realize the integration of the multi-layer medium substrate.
[0015] Compared with the prior art, the advantages of the present application are:
[0016] (1) The capacitor-loaded low-frequency micro-bridge has the characteristics of small size, light weight, low cost and suitability for mass production. The traditional LTCC bridge is mainly composed of two conductors, and the bridge index is set by the two conductors. The present application additionally adds a capacitor part to connect two capacitors with two conductors, which can not only adjust the bridge index through the conductors, but also adjust the bridge index through the capacitors. In the present application, the internal conductor distribution is divided into two spiral structures from the first two layers, and the two structures are connected by conductors to form an arch bridge structure. The signal enters from the input port one, spirals upward along the conductor, reaches the second layer through the conductor connection, enters another main body coupling conductor, and is finally output through the output port four. The traditional bridge structure has only two inseparable conductors, and the length, width and distribution of the conductors are adjusted to change the bridge index. The present application additionally uses multiple conductors based on the traditional structure, which forms an external extension with the original two conductors according to the coupling principle of microstrip line, more effectively utilizes the limited space area, reduces the working frequency, and ensures that the phase is around 90°.
[0017] (2) The loading capacitor technology adopted by the application mainly solves the problem of large size of the low-frequency bridge. According to the principle and formula of the microstrip line, it can be concluded that the length of the microstrip line will continuously increase as the working frequency of the bridge decreases. The continuously increasing length of the line directly causes the problem of the increase of the size of the bridge. Meanwhile, the increase of the coupling degree, the increase of the isolation, the increase of the insertion loss and a series of problems are accompanied. The loading capacitor technology can reduce the size by nearly half, reduce the coupling degree and reduce the effect of isolation. The change of the distribution of the wire structure reduces the large coupling degree caused by the distribution of the wire, and reduces other clutter interference. The external extension of the wire further improves the wire on the basis of the distribution of the wire structure, increases the length of the wire without changing the length of the original wire, fully utilizes the limited space, reduces the working frequency and ensures that the phase is around 90 degrees.
[0018] (3) The capacitor-loaded low-frequency micro-bridge is mainly suitable for the working range of low frequency, and realizes the miniaturization of the size in the low-frequency range. In the traditional bridge design, two wires are coupled to meet the design requirements. The application proposes a method of loading capacitor to realize the miniaturization of the size of the bridge, reduce the insertion loss, optimize the isolation, and further optimize the internal structure to improve the size of the low-frequency bridge. The external extension of the wire reduces the working frequency and ensures that the phase is stable around 90 degrees. BRIEF DESCRIPTION OF DRAWINGS
[0019] Figure 1 is a structure diagram of the capacitor-loaded low-frequency micro-bridge in the application;
[0020] Figure 2 is an external surface port diagram of the capacitor-loaded low-frequency micro-bridge in the application;
[0021] Figure 3 is a structure diagram of the ground layer in the application;
[0022] Figure 4 is a structure diagram of the main body coupling wire part in the application Figure 1 ;
[0023] Figure 5 is a structure diagram of the coupling wire part in the application Figure 2 ;
[0024] Figure 6 is a structure diagram of the coupling wire part in the application Figure 3 ;
[0025] Figure 7 is a structure diagram of the coupling wire part in the application Figure 4 ;
[0026] Figure 8is the structural schematic diagram of the port extension wire in the application;
[0027] Figure 9 is the structural schematic diagram of the capacitor in the application;
[0028] Figure 10 is the S parameter simulation result diagram of the capacitor loaded low-frequency micro-bridge in the application;
[0029] Figure 11 is the phase simulation result diagram of the capacitor loaded low-frequency micro-bridge in the application.
[0030] Figure 12 is the actual experiment result diagram of the capacitor loaded low-frequency micro-bridge in the application.
[0031] wherein:
[0032] 1, the first layer of wire, 2, the second layer of wire, 3, the third layer of wire, 4, the fourth layer of wire, 5, the fifth layer of wire, 6, the sixth layer of wire, 7, the seventh layer of wire, 8, the eighth layer of wire, 9, the ninth layer of wire, 10, the tenth layer of wire, 11, the eleventh layer of wire, 12, the twelfth layer of wire, 13, the thirteenth layer of wire, 14, the fourteenth layer of wire, 15, the fifteenth layer of wire, 16, the sixteenth layer of wire, 17, the seventeenth layer of wire, 18, the eighteenth layer of wire, 19, the nineteenth layer of wire, 20, the twentieth layer of wire; 21, the ground capacitor, 22, the main body coupling wire, 23, the external extension wire; D1-D8, E1-E8 are the external extension wire; A1-A13, B1-B11 are the ground capacitor, C1, C2 are the capacitor communication via hole. DETAILED DESCRIPTION
[0033] The application will be further described below in conjunction with the drawings:
[0034] As Figure 1 shown in a kind of capacitor loaded low-frequency micro-bridge, the capacitor loaded low-frequency micro-bridge includes by multilayer dielectric substrate stack and multilayer wire, via hole, capacitor portion constitute bridge structure main part.This embodiment described capacitor loaded low-frequency micro-bridge's main body structure is mainly the stack structure of twenty-five dielectric substrates, uses LTCC low temperature co-firing technology.The dielectric substrate uses ceramic substrate.
[0035] The capacitor-loaded low-frequency miniature bridge described in this invention can be functionally structured as follows: a top ground layer, two mutually coupled conductors, through-holes connecting the conductors at different levels, capacitors connected to the conductors through the through-holes, and six external ports on the outermost layer. There are 20 conductor layers. Except for the first and second layers, which each have one conductor for connection, each of the other layers has two conductors. These conductors are connected to other layers through through-holes, forming two spiral-shaped coupled conductors. These two spirals are connected by the first and second layers to form two coupled conductors. Viewed separately from left to right, the two conductors in each layer appear as two spirals.
[0036] In this embodiment, the conductor comprises twenty layers. The topmost layer, the first layer, is a ground layer directly connected to two ground ports. A conductor in the middle of the same layer as the ground layer connects to two coupling conductors of the third layer via a via. The second layer has a conductor connecting to two coupling conductors of the fourth layer via a via. The two coupling conductors of the third layer connect to two coupling conductors of the fifth layer via vias. The two coupling conductors of the fourth layer connect to two coupling conductors of the sixth layer via vias. The conductors are connected in an alternating layer manner, thus connecting to the twentieth layer. Specifically, a conductor extends from the outer perimeter of the coupling conductors to the isolation port three and output port six of the seventh layer; a conductor extends from the outer perimeter of the coupling conductors to the input port one and output port four of the eighth layer; a conductor extends from the outer perimeter of the coupling conductors to the isolation port three and output port six of the ninth layer; a conductor extends from the outer perimeter of the coupling conductors to the input port one and output port four of the tenth layer, and so on up to the fourteenth layer. The coupling conductor of the nineteenth layer connects to the coupling conductor of the seventeenth layer via a via, and is also connected to the isolation port three and output port six via interconnecting conductors. The coupling wires on the 20th layer are connected to the coupling wires on the 18th layer through vias, and are also connected to input port one and output port four through interconnecting wires.
[0037] In the capacitor-loaded low-frequency miniature bridge described in this invention, the loading capacitor consists of two grounded capacitors. These capacitors are embedded and employ a VIC structure, which not only offers good Q-value and SRF but also has the advantage of a small footprint. The VIC structure is a multi-layer structure, connecting the two ends of the capacitor to the ground terminal via vias, which are also connected to wires. Since there are two coupling wires, each connected to a capacitor, there are a total of two capacitors.
[0038] like Figure 2 As shown, the capacitor-loaded low-frequency miniature bridge has six ports on its outer surface: input port 1, ground port 2, isolation port 3, output port 4, ground port 5, and output port 6. Input port 1 and output port 4 form a coupled line, and isolation port 3 and output port 6 form a coupled line. The output amplitudes of the two coupled lines are equal, and the phase difference is 90 degrees.
[0039] As Figure 3 shown, in the first layer, the top ground layer and the coupling conductor are deployed, and the ground layer and the coupling conductor are combined into a layer, which not only improves the performance, but also improves the space utilization, wherein the top ground layer is connected with the two ground ports.
[0040] From Figures 4-7 the detailed disassembly process of the coupling conductor and the through hole can be seen, the coupling conductor is divided into two parts in the third layer, and the two parts are arranged in a spiral manner at both ends of the conductor in each layer or the through hole upwards or downwards, and the conductors in different layers are connected through the through hole to form the main coupling conductor in the third layer to the twentieth layer. Figure 7 In the twentieth layer, one end of the two conductors is connected with the input port one and the output port four, and the other end is connected with the two conductors in the eighteenth layer through the through hole. One end of the two conductors in the nineteenth layer is connected with the isolation port three and the output port six, and the other end is connected with the two conductors in the seventeenth layer through the through hole. The two conductors in the eighteenth layer are connected with the two conductors in the sixteenth layer through the through hole. The two conductors in the seventeenth layer are connected with the two conductors in the fifteenth layer through the through hole. The two coupling conductors in the third layer to the twentieth layer are connected with each other layer by layer. Figure 4 In the second layer, there is only one conductor, and the through holes at both ends of the conductor are connected with the two conductors in the fourth layer to connect the input port one and the output port four into a coupling line. In the first layer, there is only one conductor, and the through holes at both ends of the conductor are connected with the two conductors in the third layer to connect the isolation port three and the output port six into a coupling line.
[0041] Figure 8 D1-D8 and E1-E8 shown are port extension conductors. In the seventh layer of the conductor, the isolation port three and the output port six each extend a conductor from the port along the outer side of the main coupling conductor. In the eighth layer, the input port one and the output port four each extend a conductor from the port along the outer side of the main coupling conductor. In the ninth layer, the isolation port three and the output port six each extend a conductor from the port along the outer side of the main coupling conductor. In the tenth layer, the input port one and the output port four each extend a conductor from the port along the outer side of the main coupling conductor. In the eleventh layer, the isolation port three and the output port six each extend a conductor from the port along the outer side of the main coupling conductor. In the twelfth layer, the input port one and the output port four each extend a conductor from the port along the outer side of the main coupling conductor. In the thirteenth layer, the isolation port three and the output port six each extend a conductor from the port along the outer side of the main coupling conductor. In the fourteenth layer, the input port one and the output port four each extend a conductor from the port along the outer side of the main coupling conductor. These port extension conductors are coupled with each other and are affected by the main coupling conductor in the middle to be coupled, which plays a role in increasing the length of the conductor.
[0042] Figure 9 is the schematic diagram of the capacitor part in the capacitive loaded low frequency micro-bridge, as shown in Figure 9 A1 capacitor part is connected with the ground port, A2 capacitor part is connected with via C1, A3 capacitor part is connected with the ground port, A4 capacitor part is connected with via C1, A5 capacitor part is connected with the ground port, A6 capacitor part is connected with via C1, A7 capacitor part is connected with the ground port, A8 capacitor part is connected with via C1, A9 capacitor part is connected with the ground port, A10 capacitor part is connected with via C1, A11 capacitor part is connected with via C1, A12 capacitor part is connected with the ground port, A13 capacitor part is connected with via C1. These multiple capacitors are connected in parallel, which increases the total capacitance, and are connected with the second layer through via C1, connecting the wire and the ground as a ground capacitor. B1 capacitor part is connected with via C2, B2 capacitor part is connected with the ground port, B3 capacitor part is connected with via C2, B4 capacitor part is connected with the ground port, B5 capacitor part is connected with via C2, B6 capacitor part is connected with the ground port, B7 capacitor part is connected with via C2, B8 capacitor part is connected with the ground port, B9 capacitor part is connected with via C2, B10 capacitor part is connected with the ground port, B11 capacitor part is connected with via C2, which are connected in parallel and connected with the first layer through via C2, connecting the wire and the ground as a ground capacitor.
[0043] The design principle of the capacitive loaded low frequency micro-bridge is:
[0044] The capacitive loaded low frequency micro-bridge, because the length of the coupling wire of the bridge is one quarter of the wavelength, that is wherein, is the length of the wire, c is the propagation speed of light in air, r is the relative dielectric constant of the dielectric substrate, f0 is the working center frequency of the bridge. It can be seen that the low frequency bridge has a longer length than other general bridges, and the longer length directly leads to the disadvantage of large volume. There are three ways to overcome this disadvantage, the first is to use a dielectric substrate with high relative dielectric constant as the material, the second is to optimize the internal wire structure, and the third is to load capacitors on the wire.
[0045] For the above problems, the application reduces the volume of the low-frequency bridge by using a method of loading a capacitor, one end of the capacitor is connected to the coupling wire through a via hole, and the other end of the capacitor is directly connected to the ground port. In order to further reduce the volume, the internal structure of the bridge is optimized. The layout of the wire is changed in structure, and the wire is divided into two parts for wiring, both of which are wired in a double helix upward manner, and finally one wire is used in the first layer and the second layer to connect the two parts of the two coupling wires, so that the two end ports to which the two coupling wires belong are communicated. In addition, a wire is led out along the periphery of the coupling wire at the input port and the output port of the seventh layer, a wire is led out along the periphery of the coupling wire at the isolation port and the output port of the eighth layer, a wire is led out along the periphery of the coupling wire at the input port and the output port of the ninth layer, and a wire is led out along the periphery of the coupling wire at the isolation port and the output port of the tenth layer. In this way, the wires are added alternately until the fourteenth layer is completed.
[0046] As shown in Figures 10-12 , after testing, the capacitor-loaded low-frequency micro-bridge has an insertion loss of less than 1 dB, a return loss of less than -23 dB, an isolation of less than -20 dB, and a phase of 90°±3° in the working range of the low-frequency state, and has superior low-frequency bridge performance.
[0047] The above-described embodiments are merely preferred embodiments of the application and do not limit the scope of the application. Without departing from the design spirit of the application, various modifications and improvements to the technical solutions of the application made by those skilled in the art shall fall within the protection scope of the claims of the application.
Claims
1. A capacitively loaded low frequency microbridge, characterized by, The capacitor-loaded low-frequency micro-bridge comprises a bridge structure body stacked by multiple layers of dielectric substrates, wire parts, through holes and loaded capacitors arranged inside the bridge structure body, and external ports arranged on the outer layer of the bridge structure body; the top layer of the bridge structure body is a ground layer; the wire parts comprise twenty layers of wires; wherein the first layer and the second layer of the bridge structure body are each provided with one wire, and each layer of the other structure body is provided with two wires; the twenty layers of wires and the through holes are connected to form a main body coupling wire; the through holes are used for connecting the wires of different levels; the loaded capacitors are connected with the corresponding wires through the through holes; the external ports comprise an input port one, a ground port two, an isolation port three, an output port four, a ground port five and an output port six; the top layer of the bridge structure body is a ground layer, and the ground layer is connected with the ground port two and the ground port five; the wires on the bridge structure body are connected in a manner of one layer separating one layer, and are connected to the twentieth layer; the middle part of the ground layer is provided with one wire, which connects the two wires on the third layer of the bridge structure body through the through hole; one wire on the second layer of the bridge structure body connects the two wires on the fourth layer of the bridge structure body through the through hole; the third layer to the twentieth layer of the bridge structure body are connected with each other in a manner of one layer separating one layer; the two wires on the third layer of the bridge structure body are connected with the two wires on the fifth layer of the bridge structure body through the through hole; the two wires on the fourth layer of the bridge structure body are connected with the two wires on the sixth layer of the bridge structure body through the through hole; the bridge structure body extends downward with the third layer and the fourth layer as templates; the two wires on the nineteenth layer of the bridge structure body are connected with the isolation port three and the output port six at one end, and are connected with the two wires on the seventeenth layer through the through hole at the other end; the two wires on the twentieth layer of the bridge structure body are connected with the input port one and the output port four at one end, and are connected with the two wires on the eighteenth layer through the through hole at the other end; the isolation port three and the output port six in the seventh layer of the bridge structure body each extend a wire from the port along the main body coupling wire on the outer side as the port extension wire of the seventh layer; the input port one and the output port four in the eighth layer of the bridge structure body each extend a wire from the port along the main body coupling wire on the outer side as the port extension wire of the eighth layer; the isolation port three and the output port six in the ninth layer of the bridge structure body each extend a wire from the port along the main body coupling wire on the outer side as the port extension wire of the ninth layer; the input port one and the output port four in the tenth layer of the bridge structure body each extend a wire from the port along the main body coupling wire on the outer side as the port extension wire of the tenth layer; the isolation port three and the output port six in the eleventh layer of the bridge structure body each extend a wire from the port along the main body coupling wire on the outer side as the port extension wire of the eleventh layer; The input port one and the output port four in the twelfth layer of the bridge structure body each extend a wire as a port extension wire of the twelfth layer from the port along the body coupling wire on the outer side of the twelfth layer; The isolation port three and the output port six in the thirteenth layer of the bridge structure body each extend a wire as a port extension wire of the thirteenth layer from the port along the body coupling wire on the outer side of the thirteenth layer; The input port one and the output port four in the fourteenth layer of the bridge structure body each extend a wire as a port extension wire of the fourteenth layer from the port along the body coupling wire on the outer side of the fourteenth layer; Each port extension wire is coupled to each other.
2. The capacitive loaded low-frequency micro-bridge according to claim 1, wherein the input port one and the output port four form a coupling line, and the isolation port three and the output port six form another coupling line, and the two coupling lines have equal amplitude and a phase difference of 90 degrees.
3. The capacitive loaded low-frequency micro-bridge according to claim 1, wherein two loading capacitors are arranged on the bridge structure body, each loading capacitor is an embedded capacitor and adopts a VIC structure, and the two ends of the capacitor are connected through a via and a ground terminal, and the via is connected to a wire, and the two coupling lines of the bridge structure body are connected to a ground capacitor.
4. The capacitive loaded low-frequency micro-bridge according to claim 1, wherein the body coupling wire is divided into left and right parts from the third layer of the bridge structure body, and the two parts are arranged in a spiral manner, and a via is arranged at the two ends of each layer of wire to connect the wires of different layers, and the coupling wires form a double spiral structure from the third layer to the twentieth layer.
5. The capacitive loaded low-frequency micro-bridge according to claim 4, wherein the loading capacitor comprises an A1 part, an A2 part, an A3 part, an A4 part, an A5 part, an A6 part, an A7 part, an A8 part, an A9 part, an A10 part, an A11 part, an A12 part, an A13 part, a B1 part, a B2 part, a B3 part, a B4 part, a B5 part, a B6 part, a B7 part, a B8 part, a B9 part, a B10 part, and a B11 part. The A1 part is connected with the second ground terminal, the A2 part is connected with the through hole C1, the A3 part is connected with the second ground terminal, the A4 part is connected with the through hole C1, the A5 part is connected with the second ground terminal, the A6 part is connected with the through hole C1, the A7 part is connected with the second ground terminal, the A8 part is connected with the through hole C1, the A9 part is connected with the second ground terminal, the A10 part is connected with the through hole C1, the A11 part is connected with the through hole C1, the A12 part is connected with the second ground terminal, and the A13 part is connected with the through hole C1; the A1 part, the A2 part, the A3 part, the A4 part, the A5 part, the A6 part, the A7 part, the A8 part, the A9 part, the A10 part, the A11 part, the A12 part and the A13 part are connected in parallel, and are connected with the second layer of the bridge structure body through the through hole C1, and are connected between the wire and the ground as a ground capacitor. The B1 part of the loading capacitor is connected with the through hole C2, the B2 part is connected with the fifth ground terminal, the B3 part is connected with the through hole C2, the B4 part is connected with the fifth ground terminal, the B5 part is connected with the through hole C2, the B6 part is connected with the fifth ground terminal, the B7 part is connected with the through hole C2, the B8 part is connected with the fifth ground terminal, the B9 part is connected with the through hole C2, the B10 part is connected with the fifth ground terminal, and the B11 part is connected with the through hole C2; the B1 part, the B2 part, the B3 part, the B4 part, the B5 part, the B6 part, the B7 part, the B8 part, the B9 part, the B10 part and the B11 part are connected in parallel, and are connected with the first layer of the bridge structure body through the through hole C2, and are connected between the wire and the ground as a ground capacitor.
6. The capacitor-loaded low-frequency micro-bridge according to claim 1, characterized in that, The medium substrate adopts a ceramic substrate, and the bridge structure body adopts an LTCC low-temperature co-firing technology to realize integration of a multi-layer medium substrate.
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