A lightweight and efficient heat dissipation phased array antenna device

Abstract

This application relates to a lightweight, high-efficiency heat dissipation phased array antenna device, comprising: a circuit board, the circuit board including an upper surface and a lower surface, the upper surface being provided with an array of radio frequency modules, the lower surface being provided with a power supply module and a control module, the power supply module being electrically connected to the control module and the radio frequency modules; an electromagnetic signal shielding mesh disposed on the circuit board and covering the radio frequency modules, the electromagnetic signal shielding mesh forming a first heat dissipation channel in the spacing extension direction of adjacent radio frequency modules; and a radiating element layer disposed on the electromagnetic signal shielding mesh, the radiating element layer including antenna radiating elements corresponding one-to-one with the positions of the radio frequency modules, the antenna radiating elements being electrically connected to the radio frequency modules.

Description

Technical Field

[0001] This application relates to the field of antenna technology, and in particular to a lightweight, high-efficiency heat dissipation phased array antenna device. Background Technology

[0002] Phased array antennas are the core component of phased array systems, especially two-dimensional active phased array antennas, whose integration level determines the performance and overall level of the phased array system. Active phased array antennas can be broadly classified into two types based on their circuit assembly methods: brick-type and tile-type. Brick-type active phased array antennas can be considered first-generation products, characterized by their large weight, bulky size, and difficult assembly. Tile-type active phased array antennas, on the other hand, are second-generation products. They utilize a horizontal integration and vertical assembly method, distributing the MMICs (Micro-Micro-Instruments) in a plane parallel to the antenna aperture plane, and forming a phased array through the stacking of buses. Compared to brick-type finite element phased array antennas, their weight and volume are significantly reduced. The cost of tile-type TR components is 76% lower than that of brick-type TR components, while their volume and weight are 86% and 67% of those of brick-type TR components, respectively. Current tile-type active phased array architectures include antenna arrays, T / R components, and beamforming networks. During signal reception and transmission, electronic interference occurs between the radio frequency channels of each antenna, affecting signal stability.

[0003] To address this technical problem, related technologies often employ a shielding layer around the RF module to achieve shielding. However, these technologies require the use of both the shielding layer and the isolation barrier, both of which are solid structures. While this achieves shielding of the RF module, it creates a sealed cavity around the module, making it difficult for the heat from the RF module to dissipate. Furthermore, using a solid shielding layer can easily increase the weight of the RF antenna. Summary of the Invention

[0004] This application provides a lightweight and efficient heat dissipation phased array antenna device, which can solve the technical problem that existing lightweight and efficient heat dissipation phased array antenna devices require additional supplementary lighting components, resulting in increased product thickness.

[0005] A lightweight and efficient heat-dissipating phased array antenna device includes:

[0006] A circuit board, comprising an upper surface and a lower surface, wherein an array of radio frequency modules is disposed on the upper surface, and a power module and a control module are disposed on the lower surface, wherein the power module is electrically connected to the control module and the radio frequency modules;

[0007] An electromagnetic signal shielding mesh is disposed on the circuit board and covers the radio frequency module. The electromagnetic signal shielding mesh forms a first heat dissipation channel in the direction of its extension between adjacent radio frequency modules.

[0008] A radiating element layer is disposed on the electromagnetic signal shielding mesh. The radiating element layer includes antenna radiating elements that correspond one-to-one with the positions of the radio frequency module. The antenna radiating elements are electrically connected to the radio frequency module.

[0009] In one embodiment, the lightweight and efficient heat dissipation phased array antenna device further includes a lower hollow bracket, which is disposed on the upper surface of the circuit board. The lower hollow bracket includes a first plate with a plurality of first windows and a plurality of inner heat dissipation corner pillars located around each first window. The first window corresponds one-to-one with the radio frequency module, and the radio frequency module extends out from the first window. The electromagnetic signal shielding mesh is disposed on the surface of the lower hollow bracket.

[0010] In one embodiment, the lightweight and efficient heat dissipation phased array antenna device further includes an upper hollow bracket, which is disposed on the lower hollow bracket. The upper hollow bracket includes a second plate with a second window and a plurality of outer support columns surrounding each second window. The positions of the second windows correspond one-to-one with the positions of the first windows. The outer support columns and the inner heat dissipation corner columns together limit the electromagnetic signal shielding mesh, and the upper hollow bracket exposes the electromagnetic signal shielding mesh.

[0011] In one embodiment, each of the inner heat dissipation corner pillars includes a guide groove extending along its length, and the plurality of guide grooves together limit the radio frequency module.

[0012] In one embodiment, the side of the antenna radiating element facing the upper hollow support is a convex arc surface, and the side of the antenna radiating element away from the upper hollow support is a concave arc surface. A radiating module is disposed in the concave arc surface of the antenna radiating element, and the radiating module is electrically connected to the radio frequency module.

[0013] In one embodiment, the electromagnetic signal shielding mesh is a flexible wire mesh, and the surface of the electromagnetic signal shielding mesh facing the radio frequency module is provided with multiple support portions for the flattened state of the electromagnetic signal shielding mesh.

[0014] In one embodiment, the electromagnetic signal shielding mesh is a rigid wire mesh, and the electromagnetic signal shielding mesh includes a plurality of covering parts corresponding one-to-one with the radio frequency modules. Each covering part covers one of the radio frequency modules, and each covering part is spaced apart from the radio frequency module to form the first heat dissipation channel.

[0015] In one embodiment, the electromagnetic signal shielding mesh includes an inner shielding mesh and an outer heat dissipation mesh disposed on the surface of the inner shielding mesh, wherein the mesh size of the inner shielding mesh is smaller than the mesh size of the outer heat dissipation mesh, and the mesh density of the inner shielding mesh is greater than the mesh density of the outer heat dissipation mesh.

[0016] In one embodiment, a heat dissipation enhancement structure is also included. The heat dissipation enhancement structure is square and includes multiple covers and folded edges surrounding the covers. The covers are fixed to the top surface of the RF module, and the folded edges on adjacent sides are disconnected. The folded edges are made of shape memory alloy material. The folded edges are in a curled state when the temperature is low and automatically unfold when the temperature generated by the RF module during operation is too high.

[0017] In one embodiment, the heat dissipation enhancement structure includes coolant sealed in both the folded edges and the cover plate, and a blocking strip is provided at the junction of the cover plate and each folded edge, the blocking strip allowing a certain amount of coolant to be stored in the cover plate.

[0018] This application provides a lightweight and efficient heat-dissipating phased array antenna device, which achieves the following technical effects:

[0019] 1. The solution provided in this application sets up an electromagnetic signal shielding mesh between the radio frequency module and the antenna radiating element. Since the electromagnetic signal shielding mesh is mesh-like, it can reduce the weight of the entire device while providing electromagnetic shielding. The electromagnetic signal shielding mesh forms a first heat dissipation channel in the interval extension direction of the adjacent radio frequency modules, which can also improve the heat dissipation effect of the entire device.

[0020] 2. The scheme provided in this application sets the radiating element layer as a concave arc surface, and focuses electromagnetic waves through the reflective surface, thereby enhancing the directivity of the beam. This design can make the antenna gain higher and the directivity stronger.

[0021] 3. The solution provided in this application also includes a heat dissipation enhancement structure. The heat dissipation enhancement structure is square and includes multiple cover plates and folded edges surrounding the cover plates. The cover plates are fixed to the top surface of the RF module to maintain the stability of the electromagnetic signal shielding mesh. The folded edges on adjacent sides are disconnected. The cover plates are disposed on the surface of the electromagnetic signal shielding mesh. The folded edges are made of shape memory alloy material. The folded edges are in a curled state when the temperature is low. The heat dissipation enhancement structure mainly utilizes the cover plates to enhance heat dissipation. When the temperature generated during the operation of the RF module is too high, it will automatically unfold to be located on the side of the electromagnetic signal shielding mesh to quickly conduct heat. The folded edges and cover plates dissipate heat together. When the folded edges unfold, they can increase the heat dissipation area, thereby optimizing the heat dissipation effect. This achieves a dynamic heat dissipation effect inside the device. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of a lightweight and efficient heat dissipation phased array antenna device provided in the first embodiment of this application;

[0023] Figure 2 yes Figure 1 A schematic diagram of the lightweight, high-efficiency heat dissipation phased array antenna device with a 180-degree flip.

[0024] Figure 3 This application Figure 1 A schematic diagram of the internal structure of a lightweight and efficient heat dissipation phased array antenna device is provided.

[0025] Figure 4 yes Figure 1 An exploded view of a lightweight and efficient heat-dissipating phased array antenna device is provided.

[0026] Figure 5 yes Figure 4 Another exploded view of the provided lightweight and efficient heat dissipation phased array antenna device;

[0027] Figure 6 This application Figure 1 A cross-sectional schematic diagram of a lightweight and efficient heat dissipation phased array antenna device is provided.

[0028] Figure 7 yes Figure 6 A schematic diagram of the electromagnetic signal shielding mesh included in the provided lightweight and efficient heat dissipation phased array antenna device;

[0029] Figure 8 This is a schematic diagram of a lightweight and efficient heat dissipation phased array antenna device provided in the second embodiment of this application;

[0030] Figure 9 This is a schematic diagram of a lightweight and efficient heat dissipation phased array antenna device provided in the fourth embodiment of this application.

[0031] Explanation of reference numerals in the attached drawings: 100, Lightweight and efficient heat dissipation phased array antenna device; 1, Circuit board; 10, Radio frequency module; 12, Power supply module; 14, Control module; 2, Electromagnetic signal shielding mesh; 3, Radiating element layer; 30, Antenna radiating element; 310, First heat dissipation channel; 4, Lower hollow support; 402, First window; 42, Inner heat dissipation corner post; 5, Upper hollow support; 50, Second plate; 40, First plate; 52, Outer support post; 301, Radiating module; 502, Second window; 22, Cover section; 21, Inner shielding mesh; 23, Outer heat dissipation mesh; 6, Heat dissipation reinforcement structure; 60, Cover plate; 62, Folded edge; 410, Guide groove; 420, Second heat dissipation channel; 63, Connecting section; 201, Heat dissipation hole. Detailed Implementation

[0032] The following is in conjunction with the appendix Figure 1-9 The lightweight, high-efficiency heat dissipation phased array antenna device and display device provided in this application are described in further detail.

[0033] Example 1

[0034] Please see Figure 1-7This embodiment provides a lightweight and efficient heat dissipation phased array antenna device 100, including a circuit board 1, an electromagnetic signal shielding mesh 2, and a radiating array element layer 3.

[0035] Please see Figure 1 and Figure 2 The circuit board 1 includes an upper surface and a lower surface. An array of radio frequency modules 10 is disposed on the upper surface, and a power module 12 and a control module 14 are disposed on the lower surface. The power module 12 is electrically connected to the control module 14 and the radio frequency modules 10. The power module 12 provides the electrical energy required for the device to operate, and the control module 14 provides control signals for the normal operation of the device.

[0036] An electromagnetic signal shielding mesh 2 is disposed on the circuit board 1 and covers the radio frequency module 10. The electromagnetic signal shielding mesh 2 forms a first heat dissipation channel 310 in the direction of interval extension of adjacent radio frequency modules 10. The electromagnetic signal shielding mesh 2 adopts a mesh structure, and outside air can enter through the mesh structure of the electromagnetic signal shielding mesh 2, thereby facilitating the heat dissipation of the radio frequency module 10.

[0037] In this embodiment, the electromagnetic signal shielding mesh 2 includes a plurality of covering portions 22 corresponding one-to-one with the radio frequency modules 10. The covering portions 22 are connected to each other, and each covering portion 22 covers one of the radio frequency modules 10. Each covering portion 22 is spaced apart from the radio frequency module 10 to form the first heat dissipation channel 310. In other embodiments, the surface of the electromagnetic signal shielding mesh 2 facing the radio frequency module 10 is provided with a plurality of support portions (not shown). The support portions have a honeycomb structure and are used to support the electromagnetic signal shielding mesh 2 while assisting in heat dissipation.

[0038] In this embodiment, the electromagnetic signal shielding mesh 2 is a flexible wire mesh. The flexible shielding mesh can be a woven mesh structure made of metal wires, or it can be formed by stamping copper or aluminum foil. Copper has good conductivity and ductility, and can withstand a certain degree of bending and compression without easily breaking. Aluminum foil is lightweight and has good ductility; its cost is relatively low, and it is easy to form. When using copper or aluminum foil for stamping, several heat dissipation holes 201 can also be formed on the copper or aluminum foil. Multiple heat dissipation holes 201 facing each other in the RF module arrangement direction can form a second heat dissipation channel 420.

[0039] Please see Figure 7 , Figure 7This paper demonstrates a feasible structural design for an electromagnetic signal shielding mesh 2. The electromagnetic signal shielding mesh 2 can also be a conductive polymer film (such as a polyester film coated with a conductive coating), which possesses good flexibility and conductivity, allowing it to form the desired chamber structure during extrusion; or conductive silicone, which has high flexibility and elasticity, can withstand repeated extrusion deformation, and is not easily broken; or a composite metal-coated fabric, where a layer of metal (such as copper or aluminum) is plated on the fabric surface, achieving good shielding effect and flexibility. The fabric itself has a certain structural strength and can withstand extrusion; or a conductive fiber fabric, woven from conductive fibers (such as carbon fiber or metal-doped fibers), which has good shielding effect and flexibility.

[0040] The radiating element layer 3 is disposed on the electromagnetic signal shielding mesh 2. The radiating element layer 3 includes antenna radiating elements 30 that correspond one-to-one with the positions of the radio frequency module 10. The antenna radiating elements 30 are electrically connected to the radio frequency module 10.

[0041] In some optional embodiments, the RF module 10 includes a signal receiving module and a signal transmitting module, both of which can generate and receive electromagnetic waves. The signal transmitting module includes a driver amplifier and a power amplifier, and also includes a control switch, a phase shifter, and a driver amplifier. When the RF module 10 is in the transmitting state, the excitation signal passes through the control switch, the phase shifter, and the driver amplifier, driving the high-power amplifier to amplify the small signal before outputting it to the antenna radiating element 30. Here, the control switch refers to a T / R switch. When the RF module 10 is in the receiving state, the signal received from the antenna is switched to a limiter, then passed through a low-noise amplifier, an attenuator, and a phase shifter, finally reaching the receiver through a transceiver switch, thereby amplifying the signal. The transceiver is used for both transmitting and receiving by a transceiver converter. The beam control module 14 controls the signal to perform beam execution and shape phase control according to a predetermined operating mode.

[0042] In one more specific embodiment, the lightweight and efficient heat dissipation phased array antenna device 100 further includes a lower hollow support 4, which is disposed on the upper surface of the circuit board 1. The lower hollow support 4 includes a first plate body 40 with a plurality of first windows 402 and a plurality of inner heat dissipation corner pillars 42 located around each first window 402. The first windows 402 correspond one-to-one with the radio frequency modules 10. The radio frequency modules 10 extend from the first windows 402 and their periphery contacts the inner heat dissipation corner pillars 42. The height of the inner heat dissipation corner pillars 42 is higher than the height of the radio frequency modules 10 extending from the first windows 402. The electromagnetic signal shielding mesh 2 is disposed on the surface of the lower hollow support 4.

[0043] Please see Figure 3 and Figure 4 In this embodiment, each inner heat dissipation corner post 42 includes a guide groove 410 opened along its length direction, and the multiple guide grooves 410 together limit the radio frequency module 10.

[0044] In other words, in this embodiment, the inner heat dissipation corner posts 42 not only limit the position of the RF modules 10, making each RF module 10 independent, but also increase the contact area for heat conduction by increasing the contact area between the RF modules 10 and the inner heat dissipation corner posts 42. This helps to distribute heat more evenly, thereby improving heat dissipation efficiency. Since the height of the inner heat dissipation corner posts 42 exceeds the height of the RF modules 10, the heat around the modules can be more evenly diffused to the surrounding environment through these inner heat dissipation corner posts 42, avoiding heat concentration in local areas of the modules. This ensures a uniform temperature around the modules, which helps to improve the stability of the system and the reliability of long-term operation. The lower hollow bracket 4 adopts a hollow structure, thereby reducing the overall weight of the device. The portion of the inner heat dissipation corner posts 42 that extends above the RF modules 10 is slidably equipped with a pressure plate (not shown in the figure). After the RF modules 10 are assembled, the pressure plate limits the upper surface of the RF modules 10, and also further dissipates heat when in contact with the RF modules 10.

[0045] The lower hollow bracket 4 is made of insulating material, such as rubber or plastic. By using the insulating plate to form a shielding cavity structure under the electromagnetic signal shielding mesh 2, direct contact between the flexible shielding mesh and the circuit board 1 is avoided, which could lead to short circuits at the exposed contacts on the circuit board 1.

[0046] In one more specific embodiment, the lightweight and efficient heat dissipation phased array antenna device 100 further includes an upper hollow bracket 5, which is disposed on the electromagnetic signal shielding mesh 2. The upper hollow bracket 5 includes a second plate 50 with a second window 502 and a plurality of outer support columns 52 arranged around each second window 502. The positions of the second windows 502 correspond one-to-one with the positions of the first windows 402. The outer support columns 52 and the inner heat dissipation corner columns 42 together limit the electromagnetic signal shielding mesh 2, and the upper hollow bracket 5 exposes the side of the electromagnetic signal shielding mesh 2, allowing outside air to enter the interior of the electromagnetic signal shielding mesh 2 for heat dissipation.

[0047] Please see Figure 5-7 In a more specific embodiment, the side of the antenna radiating element 30 facing the upper hollow support 5 has a convex arc surface. This convex arc surface primarily works in conjunction with the second window 502, extending from the second window 502 to press against the electromagnetic signal shielding mesh 2. This allows the electromagnetic signal shielding mesh 2 to form a cavity covering the radio frequency module 10, thereby providing better shielding for the radio frequency module 10. The hollow structure of the upper hollow support 5 allows the convex arc surface on the radiating element layer 3 to be located within it, further reducing the volume and increasing compactness.

[0048] The side of the antenna radiating element 30 away from the upper hollow support 5 is a concave arc surface. A radiation module 301 is provided in the concave arc surface of the antenna radiating element 30, and the radiation module 301 is electrically connected to the radio frequency module 10.

[0049] The purpose of the concave arc surface design of the antenna radiating element 30 is to focus the beam. Similar to the design principle of a parabolic antenna, the concave arc surface can focus electromagnetic waves through a reflective surface, thereby enhancing the directivity of the beam. This design allows for higher antenna gain and stronger directivity. Improved Radiation Pattern: In some cases, the concave arc surface design can help improve the antenna's radiation pattern, reducing side lobes and back lobes, thus improving the gain and directivity of the main lobe. The concave arc surface design can control the beamwidth through the reflective surface, making the beam more concentrated, which is very useful for applications requiring high gain and narrow beams. Reduced Clutter Radiation: The concave arc surface design can help reduce clutter radiation around the antenna, improving antenna efficiency and reducing interference to other devices. Advantages of the Concave Arc Surface Design: Increased Gain: The concave arc surface design can make electromagnetic waves more concentrated, thereby increasing the antenna gain, which is especially important for long-distance communication. Improved Front-to-Back Ratio: The concave arc surface design can improve the antenna's front-to-back ratio, reducing back-side radiation and increasing the front gain of the antenna. Improved directivity: Antennas with stronger directivity can reduce interference to other devices and improve the overall performance of the communication system. Concave arc surface design can reduce unnecessary radiation, thereby reducing interference to other devices and improving the electromagnetic compatibility (EMC) of the system.

[0050] During installation, the lightweight and efficient heat-dissipating phased array antenna device 100 is assembled by sequentially arranging and pressing the circuit board 1, insulating plate, inner heat dissipation corner posts 42, outer support posts 52, hollow bracket, and radiating element layer 3. With the cooperation of the inner heat dissipation corner posts 42 and outer support posts 52, the flexible shielding mesh is compressed to form a cavity structure covering the radio frequency module 10, thereby achieving shielding between the radio frequency modules 10. The mesh structure of the flexible mesh facilitates electrical connection between the radiating module 301 and the radio frequency module 10 in the radiating element layer 3. The radiating module 301 and the radio frequency module 10 can be electrically connected through wires passing through the mesh of the flexible shielding mesh.

[0051] Example 2

[0052] Please see Figure 8The lightweight and efficient heat dissipation phased array antenna device 100 provided in Embodiment 2 is basically the same as that in Embodiment 1, except that it further includes a heat dissipation enhancement structure 6. The heat dissipation enhancement structure 6 is square and includes multiple cover plates 60 and folded edges 62 surrounding the cover plates 60. The folded edges 62 are connected to each other by connecting sections 63. The cover plates 60 are fixed to the top surface of the radio frequency module 10 to maintain the position stability of the electromagnetic signal shielding mesh 2. The multiple folded edges 62 connected to each cover plate 60 are disconnected. The cover plates 60 are disposed on the electromagnetic signal shielding mesh 2. On the surface, the folded edge 62 is made of shape memory alloy. When the temperature is low, the folded edge 62 is in a curled state. The folded edge 62 is curled inward and stored on the top four sides of the RF module 10. The heat dissipation enhancement structure 6 mainly uses the cover plate 60 to enhance heat dissipation. When the temperature generated by the RF module 10 is too high during operation, it will automatically unfold to be located on the side of the electromagnetic signal shielding mesh 2 to quickly conduct heat inside the device. The folded edge 62 and the cover plate 60 dissipate heat together. When the folded edge 62 unfolds, it can increase the heat dissipation area, thereby optimizing the heat dissipation effect. This achieves a dynamic heat dissipation effect inside the device.

[0053] Example 3

[0054] The lightweight and efficient heat dissipation phased array antenna device 100 provided in Embodiment 3 is basically the same as that in Embodiment 2, except that in this embodiment, the heat dissipation enhancement structure 6 is a cavity structure formed by shape memory alloy. The heat dissipation enhancement structure 6 includes folded edges 62 and cover plates 60, both of which are sealed with coolant. A blocking strip is provided at the junction of the cover plate 60 and each folded edge 62, allowing a certain amount of coolant to be stored in the cover plate 60. The folded edges 62 are in a curled state at low temperatures. The heat dissipation enhancement structure 6 mainly utilizes the cover plates 60 to enhance heat dissipation. When the temperature generated during the operation of the RF module 10 is too high, the coolant in the cavity of the cover plate 60 heats up rapidly, forming steam. The steam causes the folded edges 62 to unfold quickly. When the folded edges 62 unfold, the coolant in the cover plate 60 flows to the surrounding folded edges 62. The water vapor and the coolant in the folded edges 62 quickly merge, achieving rapid cooling of the RF module 10, thereby optimizing the heat dissipation effect.

[0055] Example 4

[0056] Please see Figure 9The lightweight and efficient heat dissipation phased array antenna device 100 provided in Embodiment 4 is basically the same as that in Embodiment 1. The difference is that in this embodiment, the electromagnetic signal shielding mesh 2 includes an inner shielding mesh 21 and an outer heat dissipation mesh 23 disposed on the surface of the inner shielding mesh 21. The mesh size of the inner shielding mesh 21 is smaller than that of the outer heat dissipation mesh 23, and the mesh density of the inner shielding mesh 21 is greater than that of the outer heat dissipation mesh 23. That is to say, in the same size, the number of meshes in the inner shielding mesh 21 is greater than the number of meshes in the outer heat dissipation mesh 23.

[0057] The inner shielding mesh 21 has smaller mesh sizes, enabling it to more effectively shield high-frequency electromagnetic signals and reduce the penetration of electromagnetic interference. The outer heat dissipation mesh 23 has larger mesh sizes, providing better airflow and thus enhancing heat dissipation. The larger mesh sizes increase air convection, promoting rapid heat dissipation and preventing heat buildup. The double-layer structure design of the inner shielding mesh 21 and the outer heat dissipation mesh 23 improves the overall mechanical stability and durability of the device.

[0058] Both the inner shielding mesh 21 and the outer heat dissipation mesh 23 can be formed by flexible wire weaving. Of course, it is understandable that both the inner shielding mesh 21 and the outer heat dissipation mesh 23 can be made of metal.

[0059] In this embodiment, the inner shielding mesh 21 is formed by weaving flexible conductive mesh, and the outer heat dissipation mesh 23 is formed by weaving copper wire.

[0060] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A lightweight, high-efficiency heat dissipation phased array antenna device, characterized in that, include: Circuit board (1), the circuit board (1) includes an upper surface and a lower surface, the upper surface is provided with an array of radio frequency modules (10), the lower surface is provided with a power module (12) and a control module (14), the power module (12) is electrically connected to the control module (14) and the radio frequency module (10); An electromagnetic signal shielding mesh (2) is disposed on the circuit board (1) and covers the radio frequency module (10). The electromagnetic signal shielding mesh (2) forms a first heat dissipation channel (310) in the direction of interval extension between adjacent radio frequency modules (10); and A radiating element layer (3) is disposed on the electromagnetic signal shielding mesh (2). The radiating element layer (3) includes antenna radiating elements (30) that correspond one-to-one with the positions of the radio frequency module (10). The antenna radiating elements (30) are electrically connected to the radio frequency module (10). The lower hollow bracket (4) is disposed on the upper surface of the circuit board (1) and located below the electromagnetic signal shielding mesh (2). The lower hollow bracket (4) includes a first plate (40) with a plurality of first windows (402) and a plurality of inner heat dissipation corner pillars (42) surrounding each first window (402) and facing away from the surface of the circuit board (1). The first window (402) corresponds one-to-one with the radio frequency module (10), and the radio frequency module (10) extends out from the first window (402). as well as The upper hollow bracket (5) is disposed on the electromagnetic signal shielding mesh (2). The upper hollow bracket (5) includes a second plate (50) with a second opening (502) and a plurality of outer support columns (52) arranged around each second opening (502) and facing the surface of the circuit board (1). The position of the second opening (502) corresponds one-to-one with the position of the first opening (402). The outer support columns (52) and the inner heat dissipation corner columns (42) together limit the electromagnetic signal shielding mesh (2). The sides of the lower hollow bracket (4) and the upper hollow bracket (5) expose the electromagnetic signal shielding mesh (2).

2. The lightweight and efficient heat dissipation phased array antenna device according to claim 1, characterized in that: The radio frequency module (10) is in contact with the inner heat dissipation corner post (42) around its perimeter, and the height of the inner heat dissipation corner post (42) is higher than the height of the radio frequency module (10) extending from the first window (402). The portion of the inner heat dissipation corner post (42) that extends above the radio frequency module (10) is slidably provided with a pressure plate.

3. The lightweight and high-efficiency heat dissipation phased array antenna device according to claim 1, characterized in that: The side of the antenna radiating element (30) facing the upper hollow support (5) is a convex arc surface, and the side of the antenna radiating element (30) away from the upper hollow support (5) is a concave arc surface. A radiation module (301) is provided in the concave arc surface of the antenna radiating element (30), and the radiation module (301) is electrically connected to the radio frequency module (10).

4. The lightweight and efficient heat dissipation phased array antenna device according to claim 1, characterized in that: The electromagnetic signal shielding mesh (2) is a flexible wire mesh or a rigid wire mesh.

5. The lightweight and efficient heat dissipation phased array antenna device according to claim 4, characterized in that: The electromagnetic signal shielding mesh (2) has multiple support portions on its surface facing the radio frequency module (10); the support portions have a honeycomb structure; or The electromagnetic signal shielding mesh (2) includes a plurality of covering parts (22) corresponding one-to-one with the radio frequency module (10). Each covering part (22) covers one of the radio frequency modules (10), and each covering part (22) is spaced apart from the radio frequency module (10) to form the first heat dissipation channel (310).

6. A lightweight, high-efficiency heat dissipation phased array antenna device according to any one of claims 1-4, characterized in that: The electromagnetic signal shielding mesh (2) includes an inner shielding mesh (21) and an outer heat dissipation mesh (23) disposed on the surface of the inner shielding mesh (21). The mesh size of the inner shielding mesh (21) is smaller than that of the outer heat dissipation mesh (23), and the mesh density of the inner shielding mesh (21) is greater than that of the outer heat dissipation mesh (23).

7. The lightweight and efficient heat dissipation phased array antenna device according to claim 4, characterized in that: It also includes a heat dissipation enhancement structure (6), which is square and includes multiple covers (60) and folded edges (62) surrounding the covers (60). The covers (60) are fixed to the top surface of the radio frequency module (10), and the folded edges (62) on adjacent sides are disconnected. The folded edges (62) are made of shape memory alloy. The folded edges (62) are in a curled state when the ambient temperature of the radio frequency module is low, and automatically unfold when the temperature generated by the radio frequency module (10) is too high.

8. The lightweight and efficient heat dissipation phased array antenna device according to claim 7, characterized in that: The heat dissipation enhancement structure (6) includes folded edges (62) and cover plates (60) that are sealed with coolant. A blocking strip is provided at the junction of the cover plate (60) and each folded edge (62), and the blocking strip allows a certain amount of coolant to be stored in the cover plate (60).

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