Mainboard circuit and server

Abstract

The embodiment of the invention provides a mainboard circuit and a server. The mainboard circuit comprises a first board card and at least one second board card, wherein a plurality of first connecting pieces are arranged on the first board surface of the first board card; a plurality of first connecting pieces are arranged on the first board surface of the second board card, a plurality of second connecting pieces are arranged on the second board surface of the second board card, and the second connecting pieces are used for being electrically connected with the first connecting pieces on the adjacent board cards; and the first board card and the at least one second board card are connected in a laminated manner through a plurality of connecting pieces on the board surfaces. And the load increasing flexibility of the server is improved.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of computer technology, and in particular to a mainboard circuit and a server. Background Art

[0002] The server can process various services. As the demands on the server increase, the performance of the server needs to be improved.

[0003] In actual application, a larger power chip or additional power device can be used to provide a larger current to the processor of the server motherboard. In this way, the processor can improve its processing power and run stably under a larger load. In the above process, due to the limited space of the server motherboard, it is not possible to add too many power devices or use a larger power chip, and the load increase on the processor is limited. In addition, the use of a larger power chip or the addition of power devices increases the cost, resulting in low flexibility in increasing the server load. Summary of the invention

[0004] The embodiments of the present application provide a mainboard circuit and a server to solve the problem of low flexibility in increasing the load of the server.

[0005] In a first aspect, an embodiment of the present application provides a mainboard circuit, which is applied to a server, and the mainboard circuit includes: a first board and at least one second board; wherein:

[0006] A plurality of first connecting members are arranged on the first board surface of the first board card;

[0007] A plurality of first connectors are arranged on the first board surface of the second board card, and a plurality of second connectors are arranged on the second board surface of the second board card, wherein the plurality of second connectors are used to be electrically connected to the plurality of first connectors on the adjacent board card;

[0008] The first board and the at least one second board are connected in a stacked manner through a plurality of connectors on the board surface.

[0009] In the embodiment of the present application, the stacked connection can make full use of the space layout above the server motherboard, greatly increase the number of components that can be placed on the server motherboard, and flexibly increase the power supply capacity. Adding more power supply devices to provide a larger current for the processor, improve the processor load capacity, and save costs, and improve the flexibility of increasing the server load.

[0010] In a possible implementation manner, the second board surface of the first second board card is arranged opposite to the first board surface of the first board card;

[0011] The second board surface of the i-th second board card is arranged opposite to the first board surface of the i-1-th second board card, and i is 2, 3, ..., N in sequence, and N is the number of the at least one second board card.

[0012] In the embodiment of the present application, two adjacent boards are arranged opposite to each other, so that multiple boards can be arranged vertically to avoid occupying more mainboard space.

[0013] In a possible implementation manner, the plurality of first connectors include input connection holes, output connection holes, and signal connection holes; the plurality of second connectors include input connectors, output connectors, and signal connectors, wherein:

[0014] For any two adjacent boards, the input connection holes are connected to the input connectors;

[0015] The output connection hole is connected to the output connector;

[0016] The signal connection hole is connected to the signal connection head.

[0017] In the embodiment of the present application, adjacent boards are connected by direct plugging of connectors to connect current channels and signal paths, thereby avoiding redundant lines in the mainboard circuit, reducing the space occupied by the mainboard, and improving the safety of the mainboard circuit.

[0018] In a possible implementation manner, a processor and a controller are further disposed on the first board surface of the first board card, and at least one power stage circuit is further disposed on the first board surface of the second board card, wherein:

[0019] The controller is used to output a corresponding control signal to at least one power stage circuit of each second board;

[0020] The processor is used to process at least one service according to the computing resources corresponding to the target load.

[0021] In the embodiment of the present application, the processor can determine the target load according to the first current corresponding to each power level circuit in each second board, and process the service under the target load. The target load can determine the number of each power level circuit in each second board, thereby improving the flexibility of the server to increase the load.

[0022] In a possible implementation manner, the controller is used to output corresponding control signals to each power stage circuit in the first second board through the signal connection hole of the first board;

[0023] The controller is used to output corresponding control signals to each power stage circuit in the i+1th second board through the signal connection hole of the i-th second board, where i is 2, 3, ..., N in sequence, and N is the number of the at least one second board.

[0024] In an embodiment of the present application, the controller can output a corresponding control signal to each power stage circuit 309 in each second board card according to the setting, so that each power stage circuit generates a current according to the control signal, thereby generating a first current corresponding to the target load, thereby improving the accuracy of increasing the load.

[0025] In a possible implementation, the target load is less than or equal to a preset load, and the preset load is a maximum load of the processor.

[0026] In the embodiment of the present application, the target load is not greater than the maximum load of the processor, which can avoid the situation where the increased load exceeds the maximum load of the processor and causes damage to the power stage circuit.

[0027] In a possible implementation manner, the power stage circuit of the first second board is used to output a first voltage to the first board according to a corresponding control signal, and output a first current corresponding to the first voltage;

[0028] The power stage circuit of the i-th second board is used to output a first voltage to the i-1-th second board according to a corresponding control signal, and output a first current corresponding to the first voltage, where i is 2, 3, ..., N in sequence, and N is the number of the at least one second board.

[0029] In an embodiment of the present application, the second board can output the first current according to the power stage circuit in the second board to provide more current to the processor, thereby improving the power supply load capacity of the server motherboard.

[0030] In a possible implementation manner, the target number of the at least one second board is a ratio of the first number of the at least one power stage circuit to a preset number;

[0031] The preset number is the number of the at least one power stage circuit in the second board.

[0032] In the embodiment of the present application, it is applicable to various load conditions of the server, including loads of different sizes and different types. And the number of power stage circuits in each second board can be flexibly changed. Therefore, the application range is wide and the scalability is high.

[0033] In a possible implementation manner, the first quantity is a ratio of the target current to the first current, and the target current is determined according to a target load of the processor.

[0034] In the embodiment of the present application, determining the first number according to the target load can avoid the situation where the power stage circuit in the second board wastes too much unnecessary load, resulting in unnecessary loss of mainboard circuit space.

[0035] In a second aspect, an embodiment of the present application provides a server, comprising the mainboard circuit described in any one of the first aspects.

[0036] The motherboard circuit and server provided in the embodiment of the present application, the motherboard circuit includes a first board and at least one second board. A plurality of first connectors are arranged on the first board of the first board. A plurality of first connectors are arranged on the first board of the second board, and a plurality of second connectors are arranged on the second board of the second board. The plurality of second connectors are used to electrically connect with the plurality of first connectors on the adjacent boards. The first board and at least one second board are connected in layers through a plurality of connectors on the board. In this way, at least one power supply device can be transferred to the vertical area within the limited motherboard space, and the current channel and the signal path can be connected by the connector, which not only expands the vertical area space, but also frees up more placement space for other components of the motherboard below. Adding more power supply devices provides a larger current for the processor, improves the processor load capacity, and can avoid using a larger specification power supply chip or increasing the power supply device to increase the cost, thereby improving the flexibility of the server to increase the load. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0038] Figure 1 A schematic diagram of an application scenario provided by an embodiment of the present application;

[0039] Figure 2 A schematic diagram of the structure of a mainboard circuit provided in an embodiment of the present application;

[0040] Figure 3 A schematic diagram of a mainboard circuit provided in an embodiment of the present application;

[0041] Figure 4 A schematic diagram of the structure of another mainboard circuit provided in an embodiment of the present application;

[0042] Figure 5 A schematic diagram of the structure of a server provided in an embodiment of the present application.

[0043] Main board circuit: 200;

[0044] First board: 201;

[0045] Second board: 202;

[0046] Input connection hole 301;

[0047] Output connection hole 302;

[0048] Signal connection hole 303;

[0049] Input connector 304;

[0050] Output connector 305;

[0051] Signal connector 306;

[0052] Processor 307;

[0053] Controller 308;

[0054] Power stage circuit 309 .

[0055] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0056] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0057] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0058] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, stored data, displayed data, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of relevant data must comply with relevant laws, regulations and standards, and provide corresponding operation entrances for users to choose to authorize or refuse.

[0059] For ease of understanding, below, combined Figure 1 , the application scenarios to which the embodiments of the present application are applicable are described.

[0060] Figure 1 This is a schematic diagram of an application scenario provided by the embodiment of this application. Figure 1 , including a server 101. A processor and a power module are provided in the server 101. The power module of the server 101 supplies power to the processor so that the processor can perform business processing. When the processing capacity of the processor of the server 101 is insufficient, the power supply load capacity of the server motherboard can be increased to provide more current to the processor of the server 101, thereby improving the processing capacity of the processor of the server 101.

[0061] In actual application, a larger power chip or additional power device can be used to provide a larger current to the processor of the server motherboard. In this way, the processor can improve its processing power and run stably under a larger load. In the above process, due to the limited space of the server motherboard, it is not possible to add too many power devices or use a larger power chip, and the load increase on the processor is limited. In addition, the use of a larger power chip or the addition of power devices increases the cost, resulting in low flexibility in increasing the server load.

[0062] In an embodiment of the present application, a mainboard circuit can be set in the server, and the mainboard circuit includes a first board and at least one second board. A plurality of first connectors are arranged on the first board of the first board. A plurality of first connectors are arranged on the first board of the second board, and a plurality of second connectors are arranged on the second board of the second board. The plurality of second connectors are used to electrically connect with the plurality of first connectors on the adjacent boards. The first board and at least one second board are connected in layers through a plurality of connectors on the board. In this way, at least one power supply device can be transferred to a vertical area within a limited mainboard space, and the current channel and the signal path can be connected by using connectors, which not only expands the vertical area space, but also frees up more placement space for other components of the mainboard below. Adding more power supply devices provides a larger current for the processor, improves the processor load capacity, and can avoid using a larger specification power supply chip or increasing the power supply device to increase the cost, thereby improving the flexibility of the server to increase the load.

[0063] The method shown in the present application is described below through specific embodiments. It should be noted that the following embodiments can exist independently or in combination with each other, and the same or similar contents will not be described repeatedly in different embodiments.

[0064] Figure 2This is a schematic diagram of the structure of a motherboard circuit provided in an embodiment of the present application. Figure 2 The mainboard circuit is applied to the server, and the mainboard circuit 200 includes: a first board 201 and at least one second board 202; wherein,

[0065] A plurality of first connecting members 300 are arranged on the first board surface of the first board card 201;

[0066] A plurality of first connectors are disposed on the first board surface of the second board card 202, and a plurality of second connectors are disposed on the second board surface of the second board card 202, wherein the plurality of second connectors are used to be electrically connected to the plurality of first connectors on the adjacent board cards;

[0067] The first board 201 and at least one second board 202 are connected in a stacked manner through a plurality of connectors on the board surface.

[0068] The second board surface of the first second board card 202 is arranged opposite to the first board surface of the first board card 201;

[0069] The second board surface of the i-th second board card 202 is arranged opposite to the first board surface of the i-1-th second board card 202, and i is 2, 3, ..., N in sequence, where N is the number of at least one second board card.

[0070] The first board 201 may be a mainboard in a server.

[0071] Two adjacent boards are arranged opposite to each other, so that multiple boards can be arranged vertically to avoid occupying more motherboard space.

[0072] The plurality of first connectors include an input connection hole 301, an output connection hole 302 and a signal connection hole 303; the plurality of second connectors include an input connector 304, an output connector 305 and a signal connector 306, wherein:

[0073] For any two adjacent boards, the input connection holes are connected to the input connectors;

[0074] The output connection hole is connected to the output connector;

[0075] The signal connection hole is connected to the signal connection head.

[0076] The above connection method is that the connector is inserted into the corresponding connection hole. In this way, the current channel and the signal path can be connected through the connector.

[0077] For example, the first connecting member and the second connecting member may both be connectors. The connecting head may be a male connector, and the connecting port may be a female connector.

[0078] The adjacent boards are connected by direct plug-in connectors to connect the current channel and signal path, avoiding redundant lines in the mainboard circuit, reducing the space occupied by the mainboard, and improving the safety of the mainboard circuit.

[0079] For example, it is assumed that the first board included in the mainboard circuit is board A, and the two second boards are board B1 and board B2. The first board surface of board A is arranged opposite to the second board surface of board B1, and the first board surface of board B1 is arranged opposite to the second board surface of board B2. Among them, the input connection hole of board B1 is inserted into the input connector of board A, the output connection hole of board B1 is inserted into the output connector of board A, and the signal connection hole of board B1 is inserted into the signal connector of board A. In this way, board A is electrically connected to board B1. The input connection hole of board B2 is inserted into the input connector of board B1, the output connection hole of board B2 is inserted into the output connector of board B1, and the signal connection hole of board B2 is inserted into the signal connector of board B1. In this way, board B1 is electrically connected to board B2.

[0080] It should be noted that the setting position of each connector on the board surface can be determined according to the specific usage scenario and the first board card, and this application does not impose any restrictions.

[0081] Next, combine Figure 3 , the actual structure of the mainboard circuit 200 is illustrated by way of example. Figure 3 Schematic diagram of the mainboard circuit provided by the embodiment of this application. Figure 3 , including a main board circuit 200. The main board circuit 200 includes a first board card 201 and at least one second board card 202; wherein,

[0082] The first board card 201 and at least one second board card 202 are connected in a stacked manner through a plurality of connectors on the board surfaces; the second board surface of the first second board card 202 is arranged opposite to the first board surface of the first board card 201; the second board surface of the second second board card 202 is arranged opposite to the first board surface of the first second board card 202.

[0083] Since the connectors between adjacent boards are directly plugged, the first connector and the second connector on the first board 201 and the first second board 202 are not shown in the figure. Only the first connector on the first board surface of the second second board 202 (top board) is shown, and the first connector includes an input connection hole 301, an output connection hole 302 and a signal connection hole 303.

[0084] The motherboard circuit provided in the embodiment of the present application includes a first board and at least one second board. A plurality of first connectors are arranged on the first board surface of the first board. A plurality of first connectors are arranged on the first board surface of the second board, and a plurality of second connectors are arranged on the second board surface of the second board. The plurality of second connectors are used to electrically connect with the plurality of first connectors on the adjacent boards. The first board and at least one second board are connected in a stacked manner through a plurality of connectors on the board surface. In this way, at least one power supply device can be transferred to a vertical area within a limited motherboard space, and the current channel and the signal path can be connected by using connectors, which not only expands the vertical area space, but also frees up more placement space for other components of the motherboard below. Adding more power supply devices provides a larger current for the processor, improves the processor load capacity, and can avoid using a larger specification power supply chip or increasing the power supply device to increase the cost, thereby improving the flexibility of the server to increase the load.

[0085] Based on any of the above embodiments, Figure 4 , the detailed structure of the mainboard circuit 200 is described.

[0086] Figure 4 This is a schematic diagram of another mainboard circuit provided in the embodiment of the present application. Figure 4 The mainboard circuit 200 includes: a first board 201 and at least one second board 202, wherein:

[0087] A processor 307 and a controller 308 are further disposed on the first board surface of the first board card 201 , and at least one power stage circuit (Power Stage) 309 is further disposed on the first board surface of the second board card 202 .

[0088] The controller 308 is used to output a corresponding control signal to at least one power stage circuit 309 of each second board 202;

[0089] The processor 307 is used to process at least one service according to the computing resources corresponding to the target load.

[0090] The processor 307 can determine the target load according to the first current corresponding to each power level circuit in each second board, and process the service under the target load. The target load can determine the number of each power level circuit in each second board, thereby improving the flexibility of the server to increase the load.

[0091] The control signal may be a pulse width modulation (PWM) signal.

[0092] The processor 307 may be a central processing unit (CPU), a graphics processing unit (GPU), or the like.

[0093] The controller 308 of the first board 201 can also receive a monitoring signal through the signal connection hole 303 to determine whether the main board circuit 200 is in a normal state. For example, the monitoring signal can be a temperature signal, a humidity signal, a current signal, etc.

[0094] The target load is less than or equal to the preset load, and the preset load is the maximum load of the processor.

[0095] The target load is not greater than the maximum load of the processor, thereby preventing the increased load from exceeding the maximum load of the processor and causing damage to the power stage circuit.

[0096] The controller 308 is used to output corresponding control signals to each power stage circuit 309 in the first second board 202 through the signal connection hole of the first board 201;

[0097] The controller 308 is used to output corresponding control signals to each power stage circuit 309 in the (i+1)th second board 202 through the signal connection hole of the i-th second board 202, where i is 2, 3, ..., N in sequence, and N is the number of at least one second board.

[0098] The controller 308 can output corresponding control signals to each power stage circuit 309 in each second board according to the settings, so that each power stage circuit 309 generates current according to the control signal, thereby generating a first current corresponding to the target load, thereby improving the accuracy of increasing the load.

[0099] For example, it is assumed that the first board included in the mainboard circuit is board A, controller A, and two second boards. The two second boards are board B1 and board B2. The three power stage circuits respectively set on each second board can be specifically shown in Table 1:

[0100] Table 1

[0101]

[0102] As shown in Table 1, controller A outputs control signal 1 to power stage circuit 1 in board B1 through the signal connection hole of board A, outputs control signal 2 to power stage circuit 2 in board B1 through the signal connection hole of board A, and outputs control signal 3 to power stage circuit 3 in board B1 through the signal connection hole of board A. Controller A outputs control signal 1 to power stage circuit 1 in board B2 through the signal connection hole of board B1, outputs control signal 2 to power stage circuit 2 in board B2 through the signal connection hole of board B1, and outputs control signal 3 to power stage circuit 3 in board B2 through the signal connection hole of board B1.

[0103] The first board surface of each second board 202 is also provided with a board switching module. During the design and testing process of the main board circuit 200, the board 202 with the corresponding identification can be switched according to the identification of the required board and whether different resistors are installed.

[0104] The identifier can be a sort number, a letter, etc.

[0105] By changing the components, the same board can be used to cover the design requirements of different board positions, reducing the related design workload. For power modules with large back-end loads, the space occupied by components on the mainboard will be further reduced.

[0106] For example, it is assumed that the first board included in the mainboard circuit is board A, and the two second boards are board B1 and board B2. The resistor corresponding to board B1 is resistor B1, and the resistor corresponding to board B2 is resistor B2. During the design and test process, the user can control the resistor B1 to be loaded so that the mainboard circuit is switched to board B1. Alternatively, the user can control the resistor B2 to be loaded so that the mainboard circuit is switched to board B2.

[0107] The power stage circuit 309 of the first second board 202 is used to output a first voltage to the first board 201 according to a corresponding control signal, and output a first current corresponding to the first voltage;

[0108] The power stage circuit 309 of the i-th second board 202 is used to output a first voltage to the i-1-th second board 201 according to a corresponding control signal, and output a first current corresponding to the first voltage, where i is 2, 3, ..., N in sequence, and N is the number of at least one second board.

[0109] The second board 202 can output the first current according to the power stage circuit 309 in the second board 202 to provide more current to the processor 307, thereby improving the power supply load capacity of the server mainboard.

[0110] In each second board 202, the power stage circuits 309 are connected in parallel. Therefore, one more power stage circuit 309 can provide more current for the processor in the first board 201, thereby increasing the power supply load capacity of the server motherboard.

[0111] For example, according to the above example, controller A outputs control signal 1 to power stage circuit 1 in board B1 through the signal connection hole of board A. Power stage circuit 1 in board B1 outputs voltage A to board A according to control signal 1, and outputs current A corresponding to voltage A. Controller A outputs control signal 1 to power stage circuit 1 in board B2 through the signal connection hole of board B1. Power stage circuit 1 in board B2 outputs voltage A to board B1 according to control signal 1, and outputs current A corresponding to voltage A, thereby outputting current A to board A.

[0112] The target number of at least one second board 202 is a ratio of the first number of at least one power stage circuit 309 to a preset number; wherein the preset number is the number of at least one power stage circuit in the second board.

[0113] It is applicable to various load conditions of the server, including loads of different sizes and different types. And the preset number of power stage circuits 309 in each second board 202 can be flexibly changed. Therefore, it has a wide range of applications and high expansibility.

[0114] The preset number of power stage circuits 309 in each second board 202 is the same.

[0115] If the ratio of the first number to the preset number is not an integer, the target number may be rounded up to an integer. For example, if the ratio of the first number to the preset number is 2.5, the target number may be determined to be 3.

[0116] The first quantity is a ratio of a target current to the first current, and the target current is determined according to a target load of the processor 307 .

[0117] The target number and the first number may also be determined according to the support capability of the controller and the flow capacity of the connecting piece.

[0118] Determining the first number according to the target load can avoid the situation where the power stage circuit 309 in the second board 202 wastes too much unnecessary load, resulting in unnecessary loss of mainboard circuit space.

[0119] For example, assuming that the target current corresponding to the target load is 100A, and the first current corresponding to the power stage circuit is 50A. Then the first number of power stage circuits can be determined to be 100 / 50=2. If the preset number is 2, the target number can be determined to be 2 / 2=1. Therefore, for the processor of the target load, the mainboard circuit may include a first board and a second board. Among them, the number of power stage circuits in the second board is 2.

[0120] Optionally, if the preset number of power stage circuits 309 in each second board 202 is different, the first number of power stage circuits 309 required by the target load is determined according to the first current corresponding to each power stage circuit 309, thereby determining the target number of second boards 202.

[0121] For example, assuming that the preset number of power stage circuits in each second board card can be specifically as shown in Table 2:

[0122] Table 2

[0123]

[0124] If the target current corresponding to the target load is 150A, then according to Table 2, it can be determined that the first number of power stage circuits is 150 / 50=3. At this time, the mainboard circuit may have the following situations:

[0125] Case 1: The mainboard circuit includes a first board and a second board, wherein the second board may be board C2 shown in Table 2.

[0126] Case 2: The mainboard circuit includes a first board and two second boards, wherein the second board may be the board C1 shown in Table 2.

[0127] Case 3: The mainboard circuit includes a first board and two second boards, wherein the second boards are board C1 and board C3 shown in Table 2.

[0128] Case 4: The mainboard circuit includes a first board and three second boards, wherein the second board may be board C3 shown in Table 2.

[0129] Which of the above situations to use can be determined based on the configuration information of the server, the size of the motherboard space, the configuration information of the processor, etc.

[0130] The mainboard circuit provided in the embodiment of the present application is provided with a processor and a controller on the first board of the first board, and at least one power stage circuit is also provided on the first board of the second board, wherein the controller is used to output a corresponding control signal to at least one power stage circuit of each second board; the processor is used to process at least one service according to the computing resources corresponding to the target load, and the target load is determined according to the first current corresponding to each power stage circuit in each second board. The power stage circuit is used to output a first voltage to the first board according to the corresponding control signal, and output a first current corresponding to the first voltage. In this way, the number of boards to be stacked can be freely selected according to the different load sizes required by the processor, and the first number of power stage circuits on each layer of boards can be flexibly changed. The flexibility of increasing the load of the server is improved.

[0131] Based on any of the above embodiments, Figure 5 , the structure of the server is illustrated with an example.

[0132] Figure 5 This is a schematic diagram of the structure of the server provided in the embodiment of the present application. Figure 5 , including a server 500. The server 500 includes a mainboard circuit 200. The mainboard circuit 200 includes a plurality of boards. Among them, board 1 is a first board, and boards 2 to K are second boards. The mainboard circuit 200 is the mainboard circuit shown in any of the above embodiments.

[0133] The motherboard circuit provided in the embodiment of the present application includes a first board and at least one second board, and multiple second connectors are used to electrically connect to multiple first connectors on adjacent boards. The first board and at least one second board are connected in layers through multiple connectors on the board surface. In this way, at least one power supply device can be transferred to the vertical area within the limited motherboard space, and the current channel and signal path can be connected using connectors, which not only expands the vertical area space, but also frees up more placement space for other components of the motherboard below. Adding more power supply devices provides the processor with greater current and improves the processor load capacity, and can avoid using larger power supply chips or increasing power supply devices to increase costs, thereby improving the flexibility of the server to increase load.

[0134] Obviously, those skilled in the art can make various changes and modifications to the embodiments of the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the embodiments of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

[0135] In the present application, the term "include" and its variations may refer to non-restrictive inclusion; the term "or" and its variations may refer to "and / or". The terms "first", "second", etc. in the present application are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. In the present application, "plurality" refers to two or more. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B may mean: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the previously associated objects are in an "or" relationship.

Claims

1. A motherboard circuit, characterized in that: Applied to a server, the mainboard circuit includes: a first board and at least one second board; wherein, A plurality of first connecting members are arranged on the first board surface of the first board card; A plurality of first connectors are arranged on the first board surface of the second board card, and a plurality of second connectors are arranged on the second board surface of the second board card, wherein the plurality of second connectors are used to be electrically connected to the plurality of first connectors on the adjacent board card; The first board and the at least one second board are connected in a stacked manner through a plurality of connectors on the board surface.

2. The mainboard circuit according to claim 1, characterized in that: The second board surface of the first second board card is arranged opposite to the first board surface of the first board card; The second board surface of the i-th second board card is arranged opposite to the first board surface of the i-1-th second board card, and i is 2, 3, ..., N in sequence, and N is the number of the at least one second board card.

3. The mainboard circuit according to claim 1 or 2, characterized in that: The plurality of first connectors include input connection holes, output connection holes and signal connection holes; the plurality of second connectors include input connectors, output connectors and signal connectors, wherein: For any two adjacent boards, the input connection holes are connected to the input connectors; The output connection hole is connected to the output connector; The signal connection hole is connected to the signal connection head.

4. The mainboard circuit according to any one of claims 1 to 3, wherein a processor and a controller are further disposed on the first board surface of the first board card, and at least one power stage circuit is further disposed on the first board surface of the second board card, wherein: The controller is used to output a corresponding control signal to at least one power stage circuit of each second board; The processor is used to process at least one service according to the computing resources corresponding to the target load.

5. The mainboard circuit according to claim 4, characterized in that: The controller is used to output corresponding control signals to each power stage circuit in the first and second boards through the signal connection holes of the first board; The controller is used to output corresponding control signals to each power stage circuit in the i+1th second board through the signal connection hole of the i-th second board, where i is 2, 3, ..., N in sequence, and N is the number of the at least one second board.

6. The mainboard circuit according to claim 4, characterized in that: The target load is less than or equal to a preset load, and the preset load is a maximum load of the processor.

7. The mainboard circuit according to any one of claims 1 to 6, characterized in that: The power stage circuit of the first second board is used to output a first voltage to the first board according to a corresponding control signal, and output a first current corresponding to the first voltage; The power stage circuit of the i-th second board is used to output a first voltage to the i-1-th second board according to a corresponding control signal, and output a first current corresponding to the first voltage, where i is 2, 3, ..., N in sequence, and N is the number of the at least one second board.

8. The mainboard circuit according to any one of claims 1 to 7, characterized in that: The target number of the at least one second board is a ratio of the first number of the at least one power stage circuit to the preset number; The preset number is the number of the at least one power stage circuit in the second board.

9. The mainboard circuit according to claim 8, characterized in that: The first quantity is a ratio of the target current to the first current, and the target current is determined according to a target load of a processor.

10. A server, characterized in that: Comprising the mainboard circuit as described in any one of claims 1 to 9.

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