Manufacturing method of PCB based on crimping hole and resin plug hole structure
By setting up a stacked hole structure on the PCB board, the accuracy problem and thermal expansion effect of coaxial setting of crimped holes and resin plug holes in high-layer PCB boards are solved, and higher connection reliability and overall reliability are achieved.
Patent Information
- Application Number
- CN202411989160.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2025-04-11
AI Technical Summary
In the design of high-layer PCB boards, the coaxial setting of crimp holes and resin plug holes requires high accuracy, and the filling process of resin plug holes may lead to inconsistent pore sizes or resin spillover, affecting the accuracy of crimp holes; at the same time, when the bottom resin plug holes are heated, it is easy to cause cracks in the connected copper layer, affecting reliability.
Using a stacked hole structure, resin plug holes and crimp holes are made on both sides of the PCB board through two drilling processes, and the inner wall and bottom surface environment is improved through plasma cleaning processes, and the adhesion and adhesion performance of the metal plating are improved.
The connection reliability between crimp holes and resin plug holes is improved, hole connection failure caused by thermal expansion effect is avoided, the mechanical strength and electrical insulation of the PCB board are enhanced, and the overall reliability is improved.
Smart Images
Figure CN119815695A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of printed circuit board manufacturing, and more specifically, to a manufacturing method of a PCB board based on a crimping hole and a resin plug hole structure. Background Art
[0002] With the rapid development and widespread application of integrated circuits, the types and applications of electronic devices have developed rapidly, and electronic products have become more intelligent and miniaturized. To match this, the categories of printed circuit boards (PCBs) have also been constantly updated. In modern electronic devices, with the continuous expansion and integration of functions, multi-layer PCBs, especially high-layer PCBs, have become the mainstream of complex circuit board design, and the design demand for high-density interconnected PCBs is growing. However, in high-layer PCBs, with the increase in PCB design functions, designers usually need to adopt more complex structures and technologies to achieve stable electrical connections and effective space utilization between different layers. In the design of high-layer PCBs, in order to achieve the reliability of electrical connections, improve signal quality, and enhance the mechanical strength of the board, it is often necessary to set both crimping holes and resin plug holes on high-layer PCBs.
[0003] Crimp holes are holes that are mechanically connected to component pins and are commonly used in connectors, sockets and other components. They are designed to achieve electrical connections between components and PCB boards by crimping without the need for soldering. The advantage of setting crimp holes on PCB boards is that they can provide higher mechanical strength than soldering, and are particularly suitable for applications that require greater physical pressure or vibration. Resin plug holes are usually filled with non-conductive materials such as resin to fill the holes that have been processed on the PCB board, thereby enhancing the mechanical strength and pressure resistance of the PCB board, improving durability, while protecting the metallized holes it encloses, preventing accidental connection or damage to the conductive paths on the PCB board, reducing the probability of electrical short circuits or signal crosstalk on the PCB board, and improving the reliability of the PCB board. Therefore, the reasonable combination of crimp holes and resin plug holes on high-rise PCB boards can increase the different functional designs in different areas on the PCB, while also achieving higher signal integrity and stronger mechanical strength.
[0004] However, since the crimping holes are mainly used for mechanical connection, they are usually larger holes made by mechanical drilling, which require higher mechanical precision and strength, and usually do not require electrical conduction. The resin plug holes are used for electrical insulation to prevent unnecessary electrical connection. They usually also need to be drilled at the corresponding locations by mechanical drilling, and then made through additional hole filling and other hole processing processes. Considering the functional area design and process requirements, the mainstream PCB design method often separates the two on the board surface, placing the crimping holes in areas where surface mounting is required and does not affect signal transmission, and placing the resin plug holes in areas where there may be short circuit risks, so as to optimize the wiring density that can be set on the PCB board in different areas and avoid electrical interference on the PCB.
[0005] Therefore, when necessary, the board design of the crimping hole and the resin plug hole coaxially arranged on the PCB can be adopted, thereby significantly saving the board space of the PCB board, allowing multiple connection holes and electrical paths to be set simultaneously on the limited board area of the PCB board. At the same time, the resin plug hole provides the overall structural support strength for the PCB board and the crimping hole, and improves the tensile strength and vibration resistance of the PCB board. However, at the same time, when the crimping hole and the resin plug hole are coaxially arranged on the PCB board, the accuracy of the layout and drilling process on the PCB board is required to be higher in order to ensure the reliability of its coaxial connection; and during the manufacturing process, since the crimping hole and the resin plug hole are at the same position, the filling process of the resin plug hole may cause inconsistency in the hole diameter or resin overflow, thereby affecting the accuracy of the crimping hole; after the manufacturing is completed, when the bottom resin plug hole is heated, it will also easily cause cracks in the copper layer connecting the resin plug hole and the crimping hole due to the thermal expansion effect, affecting the reliability of the crimping hole and the PCB board as a whole. Summary of the invention
[0006] The present invention aims to overcome at least one defect of the above-mentioned prior art and provides a method for manufacturing a PCB board based on a crimping hole and a resin plug hole structure. Specifically, a stacked hole structure of a new type of crimping hole and a resin plug hole combination arranged on the PCB is provided, thereby realizing two different functional requirements at corresponding positions on both sides of the PCB board surface, increasing the wiring area on the PCB and saving costs, and by improving the hole manufacturing process, improving the connection reliability between the crimping hole and the resin plug hole, avoiding the hole connection failure due to thermal expansion effect.
[0007] The technical solution adopted by the present invention is first to provide a method for manufacturing a PCB board based on a crimping hole and a resin plugging hole structure, wherein the PCB board is provided with a plurality of stacked hole structures, wherein the stacked hole structure comprises a crimping hole and a resin plugging hole arranged in a stacked manner, and the manufacturing method comprises the following steps: S1, resin plugging hole production, a plurality of first blind holes are produced on one side of the pressed PCB board by a one-time drilling process, and the first blind holes are metallized and filled with resin and cured to form a plurality of resin plugging holes; S2. Making a crimping hole, after alignment on the other side of the pressed PCB board, making a plurality of second blind holes through a secondary drilling process, wherein at least one of the resin plug holes is exposed in the second blind holes; after shaping the second blind holes, the second blind holes are metallized to form crimping holes; In the step S2, a plasma cleaning process is used to shape the inside of the second blind hole.
[0008] In the present technical solution, a stacked hole structure is provided on a PCB board, and the stacked hole structure includes crimping holes and resin plug holes which are stacked up and down. At the same time, the stacked hole structure runs through the entire board surface, saving horizontal board space on the PCB board and increasing the possibility of utilizing the PCB board surface. At the same time, the support of the resin plug holes provides the crimping holes with good mechanical strength and good electrical insulation, and also improves the stability of the interconnection between the PCB board layers. Furthermore, by adopting a reasonably adapted manufacturing process, the connection reliability between the crimping hole and the resin plug hole is improved; specifically, the resin plug hole and the crimping hole are respectively made on both sides of the PCB board by a two-drilling process, and the resin plug hole is formed by preferentially making it on one side of the PCB board, so that when making the crimping hole, the position of the resin plug hole can be exposed and accurately positioned by means of exposure alignment and the like, and then a second drilling is started at the position to form a second blind hole, thereby ensuring the alignment accuracy between the crimping hole and the resin plug hole, and improving the connection reliability between the crimping hole and the resin plug hole; further, after the second blind hole is formed and the resin plug hole is exposed, the exposed inner layer substrate and the resin plug hole structure in the second blind hole are shaped by a plasma cleaning process, thereby improving the surface environment of the inner wall and the bottom of the second blind hole, improving the adhesion of the metal coating in the second blind hole when the second blind hole is metallized by an electroplating process, constructing a metal coating with higher bonding strength and better bonding performance in the second blind hole, improving its ability to resist thermal expansion effects when exposed to heat, improving the reliability of the crimping hole setting, and thus improving the overall reliability of the PCB board.
[0009] Furthermore, in order to further improve the connection stability between the crimping hole and the resin plug hole, and improve the bonding performance between the metal plating in the crimping hole and the exposed part in the resin plug hole, by setting it so that in the step S2, the secondary drilling process adopts controlled depth drilling, and the controlled depth drilling adopts a drill bit with an angle greater than 150°; thereby, a relatively flat bottom surface is constructed in the second blind hole, ensuring a reliable connection between the crimping hole and the resin plug hole; the bottom of the drilled second blind hole exposes the resin in the resin plug hole, so that when the plasma cleaning process is adopted, the shaping range includes the inner layer substrate and resin part exposed in the second blind hole, and the activation ability of the plasma cleaning process for the substrate and the resin is fully utilized, thereby improving the bonding strength between the electroplated plating layer formed in the subsequent second blind hole and the inner layer substrate and the resin, thereby improving the connection stability between the crimping hole and the resin plug hole, and improving the ability of the connection layer between the crimping hole and the resin plug hole to resist the thermal expansion effect when heated, thereby improving the overall reliability of the PCB board.
[0010] Preferably, after the plasma cleaning process in step S2, the substrate surface exposed at the bottom of the second blind hole and the resin surface of the resin plug hole form a bite mark with a depth of not less than 0.2 mil, thereby fully activating the substrate surface exposed at the bottom of the second blind hole and the resin surface of the resin plug hole, providing a sufficiently large contact area for the subsequent electroplating process, thereby further enhancing the bonding strength between the electroplated layer formed in the subsequent second blind hole and the inner substrate and the resin, thereby improving the connection stability and reliability between the crimping hole and the resin plug hole.
[0011] Furthermore, in step S1, the process of metallizing the first blind hole includes: S11. A horizontal copper deposition is performed once to uniformly plate a metal coating on the inner wall of the first blind hole; S12. A single board surface electroplating is performed to thicken the metal plating thickness on the inner wall of the first blind hole; by adding a horizontal copper plating process before the single board surface electroplating, the thickness uniformity of the metal plating layer in the first blind hole is improved, providing a good power foundation for the subsequent single board surface electroplating process, thereby optimizing the quality of the metal plating layer in the first blind hole as a whole.
[0012] Furthermore, in step S2, the process of metallizing the second blind hole includes: S21. A secondary horizontal copper deposition, wherein a metal coating is evenly plated inside the second blind hole; S22. Secondary board surface electroplating, thickening the thickness of the metal plating layer formed inside the second blind hole; by adding a secondary horizontal copper plating process before the secondary board surface electroplating, the thickness uniformity of the metal plating layer in the second blind hole is improved, providing a good power foundation for the subsequent primary board surface electroplating process, thereby optimizing the quality of the metal plating layer in the second blind hole as a whole. Furthermore, the thickness of the metal plating layer formed in the second blind hole is set to be not less than 1 mil, and by appropriately increasing the thickness of the metal layer in the crimping hole, and also increasing the thickness of the connecting metal layer between the crimping hole and the resin plug hole, the buffering effect of the metal layer in resisting the thermal expansion effect is fully utilized, and the connection stability between the crimping hole and the resin plug hole is further improved, and the ability of the connecting layer between the crimping hole and the resin plug hole to resist the thermal expansion effect when heated is improved, thereby improving the overall reliability of the PCB board.
[0013] The technical solution also provides a PCB board based on a crimping hole and a resin plug hole structure, which is manufactured using the manufacturing method provided in the technical solution; The PCB board is provided with a plurality of stacked hole structures, wherein the stacked hole structures include stacked crimping holes and at least two resin plug holes; and the resin plug holes are symmetrically arranged with the axis of the crimping hole as the center.
[0014] In the technical scheme, a PCB board with a plurality of stacked hole structures is provided. In the stacked hole structure, at least two resin plug holes are arranged at the bottom of a crimping hole. By arranging that the bottom of the crimping hole is connected to multiple resin plug holes, the horizontal board space on the PCB board is saved, the possibility of utilizing the PCB board surface is increased, and the crimping hole is provided with good mechanical strength and good electrical insulation through the support of the resin plug hole, and the stability of the interconnection between the layers of the PCB board is improved as a whole; at the same time, since the crimping hole is connected to multiple resin plug holes, the connection layer at the bottom of the crimping hole is connected to the exposed area of the larger resin plug hole, thereby improving the bonding performance of the connection layer at the bottom of the crimping hole and the top of the resin plug hole, improving the connection stability and reliability between the crimping hole and the resin plug hole, and thus improving the reliability of the PCB board as a whole.
[0015] Preferably, in order to ensure the alignment accuracy between the crimping hole and the multiple resin plug holes connected thereto, so as to avoid the reliability of the crimping hole being affected by the hole being broken due to the offset, the distance between the edge of the resin plug hole and the edge of the crimping hole is set to be no less than 3 mil; at the same time, in order to ensure the independence of the multiple resin plug holes connected under the same crimping hole, ensure the electrical stability on the PCB board, and avoid signal crosstalk, the distance between the edges of the resin plug holes located at the bottom of the same crimping hole is set to be no less than 5 mil. Preferably, the aperture of the crimping hole is at least 3 times the aperture of the resin plug hole, thereby ensuring the possibility of the crimping hole being connected to more than two resin plug holes thereunder, avoiding the reliability of the crimping hole being affected by the hole being broken due to the offset when setting the resin plug hole, and providing a larger elastic range to ensure the process manufacturing capability.
[0016] Furthermore, the thickness of the metal layer filled in the crimping hole and the resin plug hole is not less than 1 mil; by adjusting the thickness of the metal plating on the inner wall of the resin plug hole to be thicker, a resin plug hole with higher strength and better buffering performance is constructed, thereby providing better strength support for the crimping hole, and also improving the metal layer's ability to fully exert its buffering effect against thermal expansion effects when exposed to heat; secondly, by setting the metal plating filled in the crimping hole to maintain a thicker thickness, the thickness of the metal layer connecting the crimping hole and the resin plug hole is also increased, and the metal layer's buffering effect against thermal expansion effects is fully exerted, further improving the connection stability between the crimping hole and the resin plug hole, and improving the ability of the connection layer between the crimping hole and the resin plug hole to resist thermal expansion effects when exposed to heat, thereby improving the overall reliability of the PCB board.
[0017] Compared with the prior art, the present invention has the following beneficial effects: 1. A PCB board with a plurality of stacked hole structures is provided. In the stacked hole structure, at least two resin plug holes are arranged at the bottom of a crimping hole. By arranging that the bottom of the crimping hole is connected to multiple resin plug holes, the horizontal board space on the PCB board is saved, the possibility of using the PCB board surface is increased, and the crimping hole is provided with good mechanical strength and good electrical insulation through the support of the resin plug hole, and the stability of the interconnection between the layers of the PCB board is improved as a whole; at the same time, because the crimping hole is connected to the multiple resin plug holes, the connection layer at the bottom of the crimping hole is connected to the exposed area of the larger resin plug hole, thereby improving the bonding performance of the connection layer at the bottom of the crimping hole and the top of the resin plug hole, improving the connection stability and reliability between the crimping hole and the resin plug hole, and thus improving the reliability of the PCB board as a whole.
[0018] 2. By adopting a reasonably adapted manufacturing process, the connection reliability between the crimping hole and the resin plug hole is improved; specifically, the resin plug hole and the crimping hole are respectively made on both sides of the PCB board by a two-drilling process, and the resin plug hole is formed on one side of the PCB board first, so that when making the crimping hole, the position of the resin plug hole can be exposed and accurately positioned by means of exposure and alignment, and then a second drilling is started at the position to form a second blind hole, thereby ensuring the alignment accuracy between the crimping hole and the resin plug hole, and improving the connection reliability between the crimping hole and the resin plug hole; further, after the second blind hole is formed and the resin plug hole is exposed, the exposed inner layer substrate and the resin plug hole structure in the second blind hole are shaped by a plasma cleaning process, thereby improving the surface environment of the inner wall and bottom of the second blind hole, improving the adhesion of the metal plating in the second blind hole when the second blind hole is metallized by an electroplating process, constructing a metal plating with higher bonding strength and better bonding performance in the second blind hole, improving its ability to resist thermal expansion effects when exposed to heat, improving the reliability of the crimping hole setting, and thus improving the overall reliability of the PCB board. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 The present invention is a flow chart of a method for manufacturing a PCB board based on a crimp hole and a resin plug hole structure.
[0021] Figure 2 The present invention provides a schematic structural diagram of a stacked hole structure including a crimping hole and a resin plug hole.
[0022] Figure 3 This is one of the structural schematic diagrams of a PCB board based on a crimp hole and a resin plug hole structure provided by the present invention.
[0023] Figure 4 This is the second structural schematic diagram of the PCB board based on the crimping hole and resin plug hole structure provided by the present invention.
[0024] Figure 5 It is a schematic structural diagram of a stacked hole structure including a crimping hole and three resin plug holes provided in Example 3 of the present invention. DETAILED DESCRIPTION
[0025] The drawings of the present invention are only for illustrative purposes and should not be construed as limiting the present invention. In order to better illustrate the following embodiments, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of the actual product; for those skilled in the art, some well-known structures and It is understandable that its description may be omitted.
[0026] Example 1 like Figure 1-Figure 2As shown, the present embodiment provides a method for manufacturing a PCB board based on a crimping hole and a resin plugging hole structure, wherein a plurality of stacked hole structures are provided on the PCB board, wherein the stacked hole structure comprises stacked crimping holes and resin plugging holes, and a stacked hole structure provided on the PCB board is provided, wherein the stacked hole structure comprises stacked crimping holes and resin plugging holes, which save horizontal board space on the PCB board and increase the possibility of utilizing the board surface of the PCB board, while providing the crimping holes with good mechanical strength and good electrical insulation through the support of the resin plugging holes, and also improving the stability of interconnection between layers of the PCB board.
[0027] Specifically, the preparation method comprises the following steps: S1, resin plugging hole production, a plurality of first blind holes are produced on one side of the pressed PCB board by a one-time drilling process, and the first blind holes are metallized and filled with resin and cured to form a plurality of resin plugging holes; S2. Making the crimping holes: After alignment on the other side of the pressed PCB board, a number of second blind holes are made through a secondary drilling process, and at least one resin plug hole is exposed in the second blind holes; after shaping the second blind holes, the second blind holes are metallized to form crimping holes; In step S2, a plasma cleaning process is used to shape the inside of the second blind hole.
[0028] By adopting a reasonably adapted manufacturing process, the connection reliability between the crimping hole and the resin plug hole is improved; specifically, the resin plug hole and the crimping hole are respectively made on both sides of the PCB board by a two-drilling process, and the resin plug hole is formed on one side of the PCB board first, so that when making the crimping hole, the position of the resin plug hole can be exposed and accurately positioned by means of exposure and alignment, and then a second drilling is started at the position to form a second blind hole, thereby ensuring the alignment accuracy between the crimping hole and the resin plug hole, and improving the connection reliability between the crimping hole and the resin plug hole; further, after the second blind hole is formed and the resin plug hole is exposed, the exposed inner layer substrate and the resin plug hole structure in the second blind hole are shaped by a plasma cleaning process, thereby improving the surface environment of the inner wall and the bottom of the second blind hole, improving the adhesion of the metal coating in the second blind hole when the second blind hole is metallized by an electroplating process, constructing a metal coating with higher bonding strength and better bonding performance in the second blind hole, improving its ability to resist thermal expansion effects when exposed to heat, improving the reliability of the crimping hole setting, and thus improving the overall reliability of the PCB board.
[0029] Furthermore, in order to further improve the connection stability between the crimping hole and the resin plug hole, and improve the bonding performance between the metal plating in the crimping hole and the exposed part in the resin plug hole, by setting it so that in step S2, the secondary drilling process adopts controlled depth drilling, and the controlled depth drilling adopts a drill bit with an angle greater than 150°; thereby, a relatively flat bottom surface is constructed in the second blind hole, ensuring a reliable connection between the crimping hole and the resin plug hole; and the bottom of the drilled second blind hole exposes the resin in the resin plug hole, so that when the plasma cleaning process is adopted, the shaping range includes the inner layer substrate and resin part exposed in the second blind hole, and the activation ability of the plasma cleaning process for the substrate and the resin is fully utilized, thereby improving the bonding strength between the electroplated plating layer formed in the subsequent second blind hole and the inner layer substrate and the resin, thereby improving the connection stability between the crimping hole and the resin plug hole, and improving the ability of the connection layer between the crimping hole and the resin plug hole to resist the thermal expansion effect when heated, thereby improving the overall reliability of the PCB board.
[0030] Preferably, after the plasma cleaning process in step S2, the substrate surface exposed at the bottom of the second blind hole and the resin surface of the resin plug hole form bite marks with a depth of not less than 0.2 mil, thereby fully activating the substrate surface exposed at the bottom of the second blind hole and the resin surface of the resin plug hole, providing a sufficiently large contact area for the subsequent electroplating process, thereby further enhancing the bonding strength between the electroplated layer formed in the subsequent second blind hole and the inner substrate and the resin, thereby improving the connection stability and reliability between the crimping hole and the resin plug hole.
[0031] Further, in step S1, the process of metallizing the first blind hole includes: S11. A horizontal copper deposition is performed once to uniformly plate a metal coating on the inner wall of the first blind hole; S12. A single board surface electroplating is performed to thicken the metal plating thickness on the inner wall of the first blind hole; by adding a horizontal copper plating process before the single board surface electroplating, the thickness uniformity of the metal plating layer in the first blind hole is improved, providing a good power foundation for the subsequent single board surface electroplating process, thereby optimizing the quality of the metal plating layer in the first blind hole as a whole.
[0032] Further, in step S2, the process of metallizing the second blind hole includes: S21. Secondary horizontal copper deposition, uniformly plating a metal coating inside the second blind hole; S22. Secondary board surface electroplating, thickening the thickness of the metal plating layer formed inside the second blind hole; by adding a secondary horizontal copper plating process before the secondary board surface electroplating, the thickness uniformity of the metal plating layer in the second blind hole is improved, providing a good power foundation for the subsequent primary board surface electroplating process, thereby optimizing the quality of the metal plating layer in the second blind hole as a whole. Furthermore, the thickness of the metal plating layer formed in the second blind hole is set to be not less than 1 mil, and by appropriately increasing the thickness of the metal layer in the crimping hole, and also increasing the thickness of the connecting metal layer between the crimping hole and the resin plug hole, the buffering effect of the metal layer in resisting the thermal expansion effect is fully utilized, and the connection stability between the crimping hole and the resin plug hole is further improved, and the ability of the connecting layer between the crimping hole and the resin plug hole to resist the thermal expansion effect when heated is improved, thereby improving the overall reliability of the PCB board.
[0033] Example 2 like Figure 3-Figure 4 As shown, this embodiment provides a PCB board based on a crimping hole and a resin plug hole structure, which is manufactured using the manufacturing method provided in Embodiment 1; A plurality of stacked hole structures are provided on the PCB board, and the stacked hole structures include stacked crimping holes and at least two resin plug holes. By connecting the bottom of the crimping hole to a plurality of resin plug holes, the horizontal board space on the PCB board is saved, the utilization possibility of the PCB board surface is increased, and the crimping hole is provided with good mechanical strength and good electrical insulation through the support of the resin plug hole, and the stability of the interconnection between the layers of the PCB board is improved as a whole. At the same time, since the crimping hole is connected to a plurality of resin plug holes, the connection layer at the bottom of the crimping hole is connected to the exposed area of the larger resin plug hole, thereby improving the bonding performance between the connection layer at the bottom of the crimping hole and the top of the resin plug hole, improving the connection stability and reliability between the crimping hole and the resin plug hole, and thus improving the reliability of the PCB board as a whole.
[0034] Furthermore, in order to ensure the independence and reliability of the resin plug holes connected under the same crimping hole, the resin plug holes are arranged symmetrically with the axis of the crimping hole as the center. Preferably, in order to ensure the alignment accuracy of the crimping hole and the multiple resin plug holes connected thereunder, so as not to affect the reliability of the crimping hole due to the offset hole, the distance between the edge of the resin plug hole and the edge of the crimping hole is set to be not less than 3 mil; at the same time, in order to ensure the independence of the multiple resin plug holes connected under the same crimping hole, ensure the electrical stability on the PCB board, and avoid signal crosstalk, the distance between the edges of the resin plug holes located at the bottom of the same crimping hole is set to be not less than 5 mil. Preferably, the aperture of the crimping hole is at least 3 times the aperture of the resin plug hole, thereby ensuring the possibility of the crimping hole being connected to more than two resin plug holes under it, avoiding the impact of the reliability of the crimping hole due to the offset hole when setting the resin plug hole, and providing a larger elastic range to ensure the process manufacturing capability.
[0035] Furthermore, the thickness of the metal layer filled in the crimping hole and the resin plug hole is not less than 1 mil; by adjusting the thickness of the metal plating on the inner wall of the resin plug hole to be thicker, a resin plug hole with higher strength and better buffering performance is constructed, thereby providing better strength support for the crimping hole, and at the same time improving the metal layer's ability to fully exert its buffering effect against thermal expansion effects when exposed to heat; secondly, by setting the metal plating filled in the crimping hole to maintain a thicker thickness, the thickness of the metal layer connecting the crimping hole and the resin plug hole is also increased, and the metal layer's buffering effect against thermal expansion effects is fully exerted, further improving the connection stability between the crimping hole and the resin plug hole, and improving the ability of the connection layer between the crimping hole and the resin plug hole to resist thermal expansion effects when exposed to heat, thereby improving the overall reliability of the PCB board.
[0036] Example 3 like Figure 3-Figure 5 As shown, this embodiment also provides a PCB board based on a crimping hole and a resin plug hole structure, which is manufactured using the manufacturing method provided in Embodiment 1; A plurality of stacked hole structures are provided on the PCB board, and the stacked hole structures include stacked crimping holes and three resin plug holes. By connecting the bottom of the crimping hole to a plurality of resin plug holes, the horizontal board space on the PCB board is saved, the utilization possibility of the PCB board surface is increased, and the crimping hole is provided with good mechanical strength and good electrical insulation through the support of the resin plug hole, and the stability of the interconnection between the layers of the PCB board is improved as a whole. At the same time, since the crimping hole is connected to a plurality of resin plug holes, the connection layer at the bottom of the crimping hole is connected to the exposed area of the larger resin plug hole, thereby improving the bonding performance between the connection layer at the bottom of the crimping hole and the top of the resin plug hole, improving the connection stability and reliability between the crimping hole and the resin plug hole, and thus improving the reliability of the PCB board as a whole.
[0037] Furthermore, in order to ensure the independence and reliability of the resin plug holes connected under the same crimping hole, the three resin plug holes connected under the same crimping hole are arranged symmetrically with the axis of the crimping hole as the center. At the same time, in order to ensure the alignment accuracy of the crimping hole and the multiple resin plug holes connected thereto, so as not to affect the reliability of the crimping hole due to the hole being broken due to the offset, the distance between the edges of the resin plug holes and the edges of the crimping holes is set to be no less than 3.25mil; at the same time, in order to ensure the independence of the multiple resin plug holes connected under the same crimping hole, ensure the electrical stability on the PCB board, and avoid signal crosstalk, the distance between the edges of the resin plug holes located at the bottom of the same crimping hole is set to be no less than 6mil.
[0038] The aperture of the crimping hole is 35 mil, and the thickness of the plated copper layer is not less than 1 mil. The aperture of the resin plug hole is 10 mil, and the thickness of the plated copper layer is not less than 1 mil, which improves the overall reliability of the PCB board.
[0039] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the technical solution of the present invention, and are not intended to limit the specific implementation methods of the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the claims of the present invention shall be included in the protection scope of the claims of the present invention.
Claims
1. A method for manufacturing a PCB board based on a crimping hole and a resin plug hole structure, characterized in that: The PCB board is provided with a plurality of stacked hole structures, wherein the stacked hole structures include stacked crimping holes and resin plug holes, and the manufacturing method thereof includes the following steps: S1, resin plugging hole production, a plurality of first blind holes are produced on one side of the pressed PCB board by a one-time drilling process, and the first blind holes are metallized and filled with resin and cured to form a plurality of resin plugging holes; S2. The crimping hole is made by aligning the other side of the pressed PCB board, and then making a plurality of second blind holes by a secondary drilling process, wherein the second blind hole exposes at least one of the resin plug holes; After shaping the second blind hole, metallizing the second blind hole to form a crimping hole; In the step S2, a plasma cleaning process is used to shape the inside of the second blind hole.
2. The method for manufacturing a PCB board based on a crimping hole and a resin plugging hole structure according to claim 1, characterized in that: In step S2, the secondary drilling process uses controlled depth drilling, and the controlled depth drilling uses a drill bit with an angle greater than 150 degrees; the bottom of the drilled second blind hole exposes the resin in the resin plug hole.
3. The method for manufacturing a PCB board based on a crimping hole and a resin plugging hole structure according to claim 2, characterized in that: After the plasma cleaning process in step S2, the substrate surface exposed at the bottom of the second blind hole and the resin surface of the resin plug hole form a bite mark with a depth of not less than 0.2 mil.
4. The method for manufacturing a PCB board based on a crimping hole and a resin plugging hole structure according to any one of claims 1 to 3, characterized in that: In step S1, the process of metallizing the first blind hole includes: S11. A horizontal copper deposition is performed once to uniformly plate a metal coating on the inner wall of the first blind hole; S12. Electroplating the board surface once to thicken the metal coating thickness on the inner wall of the first blind hole.
5. The method for manufacturing a PCB board based on a crimping hole and a resin plugging hole structure according to any one of claims 1 to 3, characterized in that: In step S2, the process of metallizing the second blind hole includes: S21. A secondary horizontal copper deposition, wherein a metal coating is evenly plated inside the second blind hole; S22. Perform secondary board surface electroplating to thicken the metal coating formed inside the second blind hole.
6. The method for manufacturing a PCB board based on a crimping hole and a resin plugging hole structure according to claim 5, characterized in that: The thickness of the metal plating layer formed in the second blind hole is not less than 1 mil.
7. A PCB board based on a crimp hole and a resin plug hole structure, characterized in that: Prepared by the preparation method according to any one of claims 1 to 6; The PCB board is provided with a plurality of stacked hole structures, wherein the stacked hole structures include stacked crimping holes and at least two resin plug holes; and the resin plug holes are symmetrically arranged with the axis of the crimping hole as the center.
8. The PCB board based on the crimping hole and resin plug hole structure according to claim 7, characterized in that: The distance between the edge of the resin plug hole and the edge of the crimping hole is not less than 3 mils, and the spacing between the edges of the resin plug holes located at the bottom of the same crimping hole is not less than 5 mils.
9. The PCB board based on the crimping hole and resin plug hole structure according to any one of claims 7-8, characterized in that: The diameter of the crimping hole is at least three times the diameter of the resin plug hole.
10. The PCB board based on the crimping hole and resin plug hole structure according to any one of claims 7 to 8, characterized in that: The thickness of the metal layer filled in the crimping hole and the resin plug hole is not less than 1 mil.