Manufacturing method for preventing Vcut line offset when no solder resist windowing line or pattern exists in board
By drilling out the detection holes on the edge of the printed circuit board and replacing the welding resist window alignment line, the problem of Vcut line offset when there is no welding resist window opening line or graphics in the board is solved, and an efficient and low-cost production process is achieved.
Patent Information
- Application Number
- CN202411990542.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2025-04-11
AI Technical Summary
During the production process of printed circuit boards, when there is no soldering resistance in the board, the Vcut line is prone to offset, resulting in defects. The existing solutions increase the production process, improve costs and reduce efficiency.
By drilling the first detection hole and the second detection hole in the waste area on the edge of the plate, these holes are used instead of the solder-blocking window alignment line, and determining whether there is a deviation in the V-cutting position by identifying the inter-hole distance during V-cutting.
In the absence of Vcut solder-resistant window opening and graphical bit line, ensure that the Vcut line is unbiased, improve production efficiency and reduce production costs.
Smart Images
Figure CN119815696A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of printed circuit board manufacturing, and in particular to a manufacturing method for preventing a Vcut line from deviating when there is no solder resist window line or pattern in the board. Background Art
[0002] At present, when making Vcut lines on circuit boards, there are solder mask opening lines. The width of the opening line is usually 0.45mm. During Vcut processing, it acts on the center of the opening line. By identifying the degree of deviation of the Vcut line on the opening line, it is ensured that the Vcut is not offset.
[0003] The design and processing flow is as follows: cutting → outer layer drilling → outer layer copper plating → full board electroplating → outer layer graphics → solder mask → Vcut → molding → post-process
[0004] However, in the production process of some printed circuit boards, there is a Vcut process without solder mask ink or graphics inside the board, that is, the board surface does not need to be processed for outer layer circuit graphics and solder mask process. Since there is no solder mask ink window at the Vcut line, the Vcut alignment line cannot be effectively produced, and the Vcut process will be performed without alignment lines, resulting in the inability to identify whether there is a misalignment problem after Vcut, thus causing Vcut defects. In response to this situation, the current solution is to add solder mask or graphic production processes on the board surface, thereby increasing the use of solder mask windows to form Vcut alignment lines and avoid Vcut misalignment, but this method will increase the production process, increase production costs and reduce production efficiency. Summary of the invention
[0005] In view of the above-mentioned existing technical defects, the present invention provides a manufacturing method for preventing Vcut line deviation when there is no solder mask window line or pattern in the board. The method can ensure that there are no undesirable defects such as Vcut deviation when there is no Vcut solder mask window and pattern alignment line, and can also effectively improve production efficiency and reduce production costs.
[0006] In a first aspect, in order to solve the above technical problems, the present invention provides a method for preventing the Vcut line from being offset when there is no solder mask opening line or pattern in the board, comprising the following steps:
[0007] S1, in the drilling process, a first detection hole and a second detection hole are drilled on both sides of each V-secant line of the plate edge of the production plate, and the hole margin between the first detection hole and the second detection hole is greater than the width of the V-secant line;
[0008] S2. In the forming process, the first detection hole and the second detection hole are used as identification holes, and V-cuts are performed on both surfaces of the production plate along the center line between the first detection hole and the second detection hole to form a V-shaped groove, and the V-shaped grooves facing each other on the upper and lower surfaces are the V-groove connecting positions; wherein the extension direction of the V-shaped groove is perpendicular to the line connecting the hole centers between the first detection hole and the second detection hole.
[0009] Furthermore, in step S1, the apertures of the first detection hole and the second detection hole are both 2 mm.
[0010] Furthermore, in step S1, the hole margin between the first detection hole and the second detection hole is 0.5 mm.
[0011] Furthermore, in step S2, the width of the V-shaped groove is 0.3 mm.
[0012] Furthermore, the production board is provided with a plurality of arranged unit boards, and V-cuts are required between adjacent unit boards and between unit boards and board edges to form a criss-crossing mesh of V-cut lines on the production board, and a mesh of V-shaped grooves is formed after the V-cuts.
[0013] Furthermore, the production board is a multi-layer board in which an inner core board and an outer copper foil are pressed together by a prepreg.
[0014] In a second aspect, the present invention also provides another method for preventing the Vcut line from shifting when there is no solder mask opening line or pattern in the board, comprising the following steps:
[0015] S1. A number of arranged unit boards are provided on the production board. V-cuts are required between adjacent unit boards and between unit boards and board edges to form V-cuts in a crisscross pattern on the production board; one end of the uppermost transverse V-cut is used as the first starting point of the transverse V-cut, and one end of the lowermost transverse V-cut is used as the first ending point of the transverse V-cut; one end of the leftmost longitudinal V-cut is used as the second starting point of the longitudinal V-cut, and one end of the rightmost longitudinal V-cut is used as the second ending point of the longitudinal V-cut;
[0016] S2, in the drilling process, a first detection hole and a second detection hole are respectively drilled on both sides of the first cutting point and the first cutting point corresponding to the transverse V-secant line of the plate edge of the production plate, and the hole margin between the first detection hole and the second detection hole is greater than the width of the transverse V-secant line; a third detection hole and a fourth detection hole are respectively drilled on both sides of the second cutting point and the second cutting point corresponding to the longitudinal V-secant line of the plate edge of the production plate, and the hole margin between the third detection hole and the fourth detection hole is greater than the width of the longitudinal V-secant line;
[0017] S3. In the forming process, the first detection hole and the second detection hole are used as identification holes, and the two surfaces of the production board are transversely V-cut along the transverse V-cut line to form a transverse first V-shaped groove, and the first V-groove connecting position is between the first V-grooves opposite to each other on the upper and lower surfaces, wherein the uppermost first V-groove passes through the middle position between the first detection hole and the second detection hole at the first starting point, and the lowermost first V-groove passes through the middle position between the first detection hole and the second detection hole at the first closing point; the third detection hole and the fourth detection hole are used as identification holes, and the two surfaces of the production board are longitudinally V-cut along the longitudinal V-cut line to form a longitudinal second V-groove, and the second V-groove connecting position is between the second V-grooves opposite to each other on the upper and lower surfaces, wherein the leftmost second V-groove passes through the middle position between the third detection hole and the fourth detection hole at the second starting point, and the rightmost second V-groove passes through the middle position between the third detection hole and the fourth detection hole at the second closing point.
[0018] Furthermore, in step S1, the apertures of the first detection hole, the second detection hole, the third detection hole and the fourth detection hole are all 2 mm.
[0019] Furthermore, in step S1, the hole margin distance between the first detection hole and the second detection hole is 0.5 mm, and the hole margin distance between the third detection hole and the fourth detection hole is 0.5 mm.
[0020] Furthermore, in step S2, the width of the first V-shaped groove is 0.3 mm; the width of the second V-shaped groove is 0.3 mm.
[0021] Compared with the prior art, the present invention has the following beneficial effects:
[0022] The present invention drills a first detection hole and a second detection hole on both sides of a V-cut line in a waste area at the edge of a board, and uses the first detection holes and the second detection holes on both sides to replace the existing solder mask window alignment lines. By identifying the distance between the Vcut line of the tool during V-cutting and the first detection holes and the second detection holes on both sides, it is judged and confirmed whether the V-cut has a problem of deviation. Under the premise of satisfying the V-cut deviation identification of no solder mask window line or pattern in the board, the method of the present invention does not need to add additional solder mask and pattern processes, thereby improving production efficiency and reducing production costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] Figure 1 This is a schematic diagram of the test hole drilled on the production board in Example 1;
[0024] Figure 2 This is a schematic diagram of a V-shaped groove formed by V-cutting on a production board in Example 1;
[0025] Figure 3 This is a schematic diagram of a test hole drilled on a production board in Example 2;
[0026] Figure 4 This is a schematic diagram of a V-shaped groove formed by V-cutting on a production board in Example 2; DETAILED DESCRIPTION
[0027] In order to more fully understand the technical content of the present invention, the technical solution of the present invention will be further introduced and illustrated in conjunction with specific embodiments below.
[0028] Example 1
[0029] The present embodiment shows a method for manufacturing a circuit board, which includes a process for identifying the deviation of the V-cut during molding, and includes the following processing steps in sequence:
[0030] (1) Cutting: Cut the core board according to the panel size of 520mm×620mm. The thickness of the core board is 0.5mm, and the thickness of the copper layer on both surfaces of the core board is 0.5oz.
[0031] (2) Inner layer circuit production (negative film process): Inner layer pattern transfer, use a vertical coating machine to coat the photosensitive film, the film thickness of the photosensitive film is controlled to 8μm, and a fully automatic exposure machine is used to complete the exposure of the inner layer circuit with a 5-6 grid exposure ruler (21 grid exposure ruler). After development, the inner layer circuit pattern is formed; inner layer etching, the exposed and developed core board is etched to etch the inner layer circuit, and the inner layer line width is measured to be 3mil; inner layer AOI, and then check the inner layer circuit for defects such as open short circuits, circuit gaps, and circuit pinholes. Defective products are scrapped, and non-defective products are sent to the next process.
[0032] (3) Lamination: The browning speed is based on the bottom copper thickness. The core board, prepreg, and copper-free board are laminated in sequence as required. Then, according to the Tg of the board, appropriate lamination conditions are selected to laminate the laminated boards to form a production board, such as Figure 1 As shown, a number of unit plates 101 arranged in a square array are provided on the production plate 100, and the plate edge area 102 around the production plate is a waste area, which is removed by a gong plate later, and the width of the waste area is preferably 10-20mm.
[0033] In the above, V-cuts are required between adjacent unit boards 101 and between the outermost unit boards 101 and the board edges, that is, V-cut lines 1 (such as Figure 1 shown).
[0034] (4) Drilling: According to the existing drilling technology, drilling is performed on the production board according to the design requirements. When drilling, a first detection hole 2 and a second detection hole 3 are drilled on both sides of each V-secant line 1 on the edge of the production board (such as Figure 1 As shown), the hole margin distance between the first detection hole 2 and the second detection hole 3 is greater than the width of the V-secant line.
[0035] In one embodiment, the diameters of the first detection hole and the second detection hole are both 2 mm.
[0036] Preferably, the hole margin between the first detection hole and the second detection hole is 0.5 mm.
[0037] (5) Electrical test: Test the electrical conductivity of the finished board. The test method used for this board is: flying probe test.
[0038] (6) V-cut: Figure 2 As shown, an automatic V-Cut machine is used to perform V-cuts on both surfaces of the production board along the V-cut line, that is, the first detection holes 2 and the second detection holes 3 are used as identification holes, and V-cuts are performed on both surfaces of the production board along the center line between each group of first detection holes 2 and second detection holes 3 to form V-shaped grooves 10, and the V-grooves 10 facing each other on the upper and lower surfaces are V-groove connection positions; wherein the extension direction of the V-shaped groove 10 is perpendicular to the hole center line between the first detection holes 2 and the second detection holes 3.
[0039] In the above, the width of the V-groove is 0.3mm, that is, the distance between the V-groove after V-cut and the first detection hole 2 and the second detection hole 3 on both sides thereof is 0.1mm. Based on this distance, it is judged and identified whether there is a problem of V-cut deviation, thereby ensuring that when V-cut is performed without Vcut solder mask openings and graphic alignment lines, there are no defects such as Vcut deviation, and the appearance and size requirements are met.
[0040] (7) Molding: According to the existing technology and design requirements, the outer shape is shaped, the waste area on the edge of the board and the inspection holes drilled on the edge of the board are removed, and the outer shape tolerance is + / -0.05mm to produce the circuit board.
[0041] (8) FQC: Inspect the appearance of the circuit board according to the customer's acceptance standards and our inspection standards. If there are any defects, repair them in time to ensure that we provide customers with excellent quality control.
[0042] (9) FQA: Re-test the circuit board’s appearance, hole copper thickness, dielectric layer thickness, green oil thickness, inner layer copper thickness, etc. to see if they meet customer requirements.
[0043] (10) Packaging: According to the packaging method and packaging quantity required by the customer, the circuit boards are sealed and packed with desiccant and humidity card before shipment.
[0044] Example 2
[0045] The present embodiment shows a method for manufacturing a circuit board, which includes a process for identifying the deviation of the V-cut during molding, and includes the following processing steps in sequence:
[0046] (1) Cutting: Cut the core board according to the panel size of 520mm×620mm. The thickness of the core board is 0.5mm, and the thickness of the copper layer on both surfaces of the core board is 0.5oz.
[0047] (2) Inner layer circuit production (negative film process): Inner layer pattern transfer, use a vertical coating machine to coat the photosensitive film, the film thickness of the photosensitive film is controlled to 8μm, and a fully automatic exposure machine is used to complete the exposure of the inner layer circuit with a 5-6 grid exposure ruler (21 grid exposure ruler). After development, the inner layer circuit pattern is formed; inner layer etching, the exposed and developed core board is etched to etch the inner layer circuit, and the inner layer line width is measured to be 3mil; inner layer AOI, and then check the inner layer circuit for defects such as open short circuits, circuit gaps, and circuit pinholes. Defective products are scrapped, and non-defective products are sent to the next process.
[0048] (3) Lamination: The browning speed is based on the bottom copper thickness. The core board, prepreg, and copper-free board are laminated in sequence as required. Then, according to the Tg of the board, appropriate lamination conditions are selected to laminate the laminated boards to form a production board, such as Figure 3 As shown, a number of unit boards 101 arranged in a square array are provided on the production board 100. The board edge area 102 around the production board 101 is a waste area, which is removed by a gong plate later. The width of the waste area is preferably 10-20 mm.
[0049] In the above, V-cuts are required between adjacent unit boards and between the outermost unit boards and the board edges, that is, V-cut lines 1 (such as Figure 3 As shown); wherein, one end of the uppermost transverse V-cut line is used as the first starting point of the transverse V-cut line, and one end of the lowermost transverse V-cut line is used as the first closing point of the transverse V-cut line, that is, the transverse V-cut lines are drilled out continuously at one time, and the distance between two adjacent transverse V-cut lines is determined according to the width size of the unit board and the board spacing between two adjacent rows of unit boards, that is, the distance between two adjacent transverse V-cut lines is a known fixed value, so that it is only necessary to ensure that the V-cut lines at the first starting point and the first closing point of the transverse V-cut line do not deviate, and the middle transverse V-cut line is moved according to the adjacent fixed values. and V-cut; one end of the leftmost longitudinal V-cut line is used as the second starting point of the longitudinal V-cut line, and one end of the rightmost longitudinal V-cut line is used as the second ending point of the longitudinal V-cut line, that is, the longitudinal V-cut line is drilled out continuously at one time, and the distance between two adjacent longitudinal V-cut lines is determined according to the length of the unit board and the board spacing between two adjacent columns of unit boards, that is, the distance between two adjacent longitudinal V-cut lines is a known fixed value, so it is only necessary to ensure that the V-cut lines at the starting point and the ending point of the longitudinal V-cut line do not offset, and the middle longitudinal V-cut line can be moved and V-cut according to the adjacent fixed values.
[0050] (4) Drilling: Based on the existing drilling technology, drilling is performed on the production board according to the design requirements; Figure 4 As shown, when drilling, a first detection hole 2 and a second detection hole 3 are respectively drilled on both sides of the first starting point and the first ending point of the horizontal V-secant line of the plate edge of the production board, and the hole margin between the first detection hole 2 and the second detection hole 3 is greater than the width of the horizontal V-secant line; a third detection hole 4 and a fourth detection hole 5 are respectively drilled on both sides of the second starting point and the second ending point of the longitudinal V-secant line of the plate edge of the production board, and the hole margin between the third detection hole 4 and the fourth detection hole 5 is greater than the width of the longitudinal V-secant line.
[0051] In one embodiment, the diameters of the first detection hole 2 , the second detection hole 3 , the third detection hole 4 and the fourth detection hole 5 are all 2 mm.
[0052] Preferably, the hole margin distance between the first detection hole and the second detection hole is 0.5 mm; the hole margin distance between the third detection hole 4 and the fourth detection hole 5 is 0.5 mm.
[0053] (5) Electrical test: Test the electrical conductivity of the finished board. The test method used for this board is: flying probe test.
[0054] (6) V-cutting: Using an automatic V-Cut machine to perform V-cutting on both surfaces of the production board along the V-cutting line; specifically, as shown in the figure, using the first detection hole 2 and the second detection hole 3 as identification holes, performing transverse V-cutting on both surfaces of the production board along the transverse V-cutting line to form a transverse first V-shaped groove 11, the first V-shaped grooves 11 on the upper and lower surfaces facing each other are the first V-groove connecting position, wherein the uppermost first V-shaped groove 11 passes through the middle position between the first detection hole 2 and the second detection hole 3 at the first starting point, and the lowermost first V-shaped groove 11 passes through the first closing point. The middle position between the first detection hole 2 and the second detection hole 3 at the second starting point; the third detection hole 4 and the fourth detection hole 5 are used as identification holes, and the two surfaces of the production board are longitudinally V-cut along the longitudinal V-cut line to form a longitudinal second V-groove 12, and the second V-groove 12 opposite to each other on the upper and lower surfaces is the second V-groove connecting position, wherein the leftmost second V-groove 12 passes through the middle position between the third detection hole 4 and the fourth detection hole 5 at the second starting point, and the rightmost second V-groove 12 passes through the middle position between the third detection hole 4 and the fourth detection hole 5 at the second ending point.
[0055] In the above, the groove width of the first V-shaped groove and the second V-shaped groove are both 0.3mm, that is, the distance between the first V-shaped groove 11 after V-cut and the first detection hole 2 and the second detection hole 3 on both sides thereof is 0.1mm, so as to judge and identify whether there is a problem of displacement in the horizontal V-cut according to the distance, and the distance between the second V-shaped groove 12 after V-cut and the third detection hole 4 and the second detection hole 5 on both sides thereof is 0.1mm, so as to judge and identify whether there is a problem of displacement in the longitudinal V-cut according to the distance, thereby ensuring that when V-cutting is performed without Vcut solder mask openings and graphic alignment lines, there are no defects such as Vcut displacement, and the appearance and size requirements are met.
[0056] (7) Molding: According to the existing technology and design requirements, the outer shape is shaped, the waste area on the edge of the board and the inspection holes drilled on the edge of the board are removed, and the outer shape tolerance is + / -0.05mm to produce the circuit board.
[0057] (8) FQC: Inspect the appearance of the circuit board according to the customer's acceptance standards and our inspection standards. If there are any defects, repair them in time to ensure that we provide customers with excellent quality control.
[0058] (9) FQA: Re-test the circuit board’s appearance, hole copper thickness, dielectric layer thickness, green oil thickness, inner layer copper thickness, etc. to see if they meet customer requirements.
[0059] (10) Packaging: According to the packaging method and packaging quantity required by the customer, the circuit boards are sealed and packed with desiccant and humidity card before shipment.
[0060] The technical solutions provided by the embodiments of the present invention are introduced in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the embodiments of the present invention. The description of the above embodiments is only applicable to help understand the principles of the embodiments of the present invention. At the same time, for those skilled in the art, according to the embodiments of the present invention, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as limiting the present invention.
Claims
1. A method for preventing the Vcut line from deviating when there is no solder mask opening line or pattern in the board, characterized in that: The following steps are involved: S1, in the drilling process, a first detection hole and a second detection hole are drilled on both sides of each V-secant line of the plate edge of the production plate, and the hole margin between the first detection hole and the second detection hole is greater than the width of the V-secant line; S2. In the forming process, the first detection hole and the second detection hole are used as identification holes, and V-cuts are performed on both surfaces of the production plate along the center line between the first detection hole and the second detection hole to form a V-shaped groove, and the V-shaped grooves facing each other on the upper and lower surfaces are the V-groove connecting positions; wherein the extension direction of the V-shaped groove is perpendicular to the line connecting the hole centers between the first detection hole and the second detection hole.
2. The method for preventing the Vcut line from shifting when there is no solder mask window line or pattern in the board according to claim 1, characterized in that: In step S1, the diameters of the first detection hole and the second detection hole are both 2 mm.
3. The method for preventing the Vcut line from shifting when there is no solder mask window line or pattern in the board according to claim 2, characterized in that: In step S1, the hole margin between the first detection hole and the second detection hole is 0.5 mm.
4. The method for preventing the Vcut line from shifting when there is no solder mask window line or pattern in the board according to claim 3, characterized in that: In step S2, the width of the V-shaped groove is 0.3 mm.
5. The method for preventing the Vcut line from deviating when there is no solder mask window line or pattern in the board according to any one of claims 1 to 4, characterized in that: The production board is provided with a plurality of arranged unit boards, and V-cuts are required between adjacent unit boards and between unit boards and board edges to form crisscrossing V-cut lines in a mesh on the production board, and a mesh of V-shaped grooves is formed after the V-cuts.
6. The method for preventing the Vcut line from shifting when there is no solder mask window line or pattern in the board according to claim 1, characterized in that: The production board is a multi-layer board in which an inner core board and an outer copper foil are pressed together by a semi-cured sheet.
7. A method for preventing the Vcut line from shifting when there is no solder mask window line or pattern in the board, characterized in that: The following steps are involved: S1. A number of arranged unit boards are provided on the production board. V-cuts are required between adjacent unit boards and between unit boards and board edges to form V-cuts in a crisscross pattern on the production board; one end of the uppermost transverse V-cut is used as the first starting point of the transverse V-cut, and one end of the lowermost transverse V-cut is used as the first ending point of the transverse V-cut; one end of the leftmost longitudinal V-cut is used as the second starting point of the longitudinal V-cut, and one end of the rightmost longitudinal V-cut is used as the second ending point of the longitudinal V-cut; S2, in the drilling process, a first detection hole and a second detection hole are respectively drilled on both sides of the first cutting point and the first cutting point corresponding to the transverse V-secant line of the plate edge of the production plate, and the hole margin between the first detection hole and the second detection hole is greater than the width of the transverse V-secant line; a third detection hole and a fourth detection hole are respectively drilled on both sides of the second cutting point and the second cutting point corresponding to the longitudinal V-secant line of the plate edge of the production plate, and the hole margin between the third detection hole and the fourth detection hole is greater than the width of the longitudinal V-secant line; S3. In the forming process, the first detection hole and the second detection hole are used as identification holes, and the two surfaces of the production board are transversely V-cut along the transverse V-cut line to form a transverse first V-shaped groove, and the first V-groove connecting position is between the first V-grooves opposite to each other on the upper and lower surfaces, wherein the uppermost first V-groove passes through the middle position between the first detection hole and the second detection hole at the first starting point, and the lowermost first V-groove passes through the middle position between the first detection hole and the second detection hole at the first closing point; the third detection hole and the fourth detection hole are used as identification holes, and the two surfaces of the production board are longitudinally V-cut along the longitudinal V-cut line to form a longitudinal second V-groove, and the second V-groove connecting position is between the second V-grooves opposite to each other on the upper and lower surfaces, wherein the leftmost second V-groove passes through the middle position between the third detection hole and the fourth detection hole at the second starting point, and the rightmost second V-groove passes through the middle position between the third detection hole and the fourth detection hole at the second closing point.
8. The method for preventing the Vcut line from shifting when there is no solder mask window line or pattern in the board according to claim 7, characterized in that: In step S1, the apertures of the first detection hole, the second detection hole, the third detection hole and the fourth detection hole are all 2 mm.
9. The method for preventing the Vcut line from shifting when there is no solder mask window line or pattern in the board according to claim 8, characterized in that: In step S1, the hole margin distance between the first detection hole and the second detection hole is 0.5 mm, and the hole margin distance between the third detection hole and the fourth detection hole is 0.5 mm.
10. The method for preventing the Vcut line from shifting when there is no solder mask window line or pattern in the board according to claim 9, characterized in that: In step S2, the width of the first V-shaped groove is 0.3 mm; the width of the second V-shaped groove is 0.3 mm.