Copper deposition equipment for PCB (Printed Circuit Board)

Abstract

The invention belongs to the technical field of circuit board manufacturing, and particularly relates to PCB (printed circuit board) copper deposition equipment which comprises a bottom frame, a copper deposition tank is placed on the bottom frame, at least two copper deposition chambers are arranged on the copper deposition tank, at least two hydraulic cylinders are connected to the bottom frame, movable rods of the hydraulic cylinders are connected with lifting frames, and the number of the lifting frames is equal to that of the copper deposition chambers. A moving block moves along with a chain, a transverse block part pushes a placement frame to move leftwards, a vertical rod extrudes a push block to move upwards, a baffle blocks the placement frame, the push block crosses a hanging part, the placement frame falls and presses a transverse rod, the vertical rod and a connecting rod to descend, a hydraulic cylinder drives a lifting frame to descend, a PCB enters a copper deposition chamber for copper deposition, the lifting frame ascends again, and the push block pushes the placement frame to move leftwards continuously. The working state of the corresponding copper deposition chamber can be controlled only by controlling the height of the lifting frame, the process that the placing frame enters the copper deposition chamber, the process that the placing frame moves out of the copper deposition chamber and the process that the placing frame moves can be continuously carried out at the same time, the copper deposition process is automatic, and the working efficiency is high.

Description

Technical Field

[0001] The invention belongs to the technical field of circuit board manufacturing, and in particular relates to a PCB circuit board copper deposition device. Background Art

[0002] PCB circuit boards are important electronic components. PCB circuit boards make circuits miniaturized and intuitive, and play an important role in the mass production of fixed circuits and the optimization of electrical appliance layout. The manufacturing process of PCB circuit boards generally includes cutting, drilling, copper deposition, pattern transfer, pattern electroplating, etching, solder mask and surface treatment.

[0003] In the copper deposition process of PCB circuit boards, the placement rack with PCB circuit boards is first grabbed by the robot on the mobile rack, and then the mobile rack is driven to move horizontally to the top of the copper deposition chamber by the linear drive mechanism. The robot puts the placement rack into the copper deposition chamber for copper deposition, and then the robot continues to grab the next placement rack. However, the number of copper deposition chambers in a row is generally large, while the number of robots is small. When the copper deposition of PCB circuit boards on the placement rack is completed one after another, the robot needs to take out the placement rack. At this time, it is difficult to put the next batch of placement racks into the copper deposition chamber at the same time. There is a long waiting time in the whole process, and the work efficiency needs to be improved. Summary of the invention

[0004] In order to solve the problem of long waiting time in the copper deposition process of a PCB circuit board, the present invention provides a PCB circuit board copper deposition device with high working efficiency.

[0005] The technical implementation scheme of the present invention is: a PCB circuit board copper deposition equipment, including a base frame, a copper deposition pool is placed on the base frame, at least two copper deposition chambers are opened on the copper deposition pool, at least two hydraulic cylinders are connected to the base frame, and the movable rods of the hydraulic cylinders are connected to lifting frames, the number of lifting frames is equal to the number of copper deposition chambers, two connecting frames are connected to the base frame, chains are installed on the upper parts of the connecting frames, and multiple pairs of moving blocks are detachably connected to the two chains at intervals, a placement frame for placing PCB circuit boards is provided below the chain, the placement frame is hung on a pair of moving blocks, and the moving blocks are provided with push blocks that slide up and down, and two receiving parts are provided at the lower part of the lifting frame, and the receiving parts located on the left side of the lifting frame are rotatably connected with baffles. When the placement frame moves, the placement frame will contact the baffle, and the lifting frame is provided with a transmission mechanism for sliding the push block and rotating the baffle.

[0006] More preferably, two limit rods are connected to the base frame, the rear ends of the receiving parts are extended upward to form limit ends, the upper part of the placement frame is symmetrically provided with hanging parts front and back, the moving blocks are provided with cross plate parts, the hanging parts are hung on the cross plate parts, and the pushing blocks include two cross block parts; in the up and down directions, the total thickness of the hanging part and the cross plate part is less than the distance between the two cross block parts; when the pushing block slides upward on the moving block, the cross block part and the hanging part are staggered in the horizontal direction.

[0007] More preferably, the transmission mechanism includes a vertical rod, the lifting frame is provided with a vertical rod that slides up and down, a return spring is connected between the vertical rod and the lifting frame, the lower end of the vertical rod is connected to a cross rod, the cross rod is connected to a connecting rod, the left end of the connecting rod is provided with a bending portion, and the bending portion contacts the left side of the baffle.

[0008] More preferably, the top end of the vertical rod extends from the top of the lifting frame, and the push block is provided with an inclined surface 1, and when the push block moves with the chain, the inclined surface 1 will contact the top end of the vertical rod.

[0009] More preferably, the PCB circuit board copper deposition equipment also includes a conveying mechanism, the conveying mechanism includes a fixed block, two fixed blocks are connected to the side of the two connecting frames away from each other, the tops of the fixed blocks are connected to guide rods, and sliding frames that are reset by compression springs are slidably connected up and down between the two front guide rods and between the two rear guide rods, the left and right parts of the sliding frames are connected to mounting plates, belt conveyors are installed between the two mounting plates on the left and between the two mounting plates on the right, and the left parts of the two sliding frames that are close to each other are connected to convex rods, and when the push block moves with the chain, the inclined surface of the push block will contact the convex rod.

[0010] More preferably, a second inclined surface is provided at the lower part of one side of the mounting plate close to the copper sinking pool, and both left and right sides of the copper sinking pool are in contact with the mounting plate.

[0011] More preferably, the PCB circuit board copper plating equipment also includes a limiting mechanism, the limiting mechanism includes a limiting plate 1, two limiting plates 1 that slide back and forth are provided at the lower part of the placement rack, straight rods are connected to the left and right ends of the limiting plate 1, and limiting plates 2 that slide up and down are provided between the two straight rods on the front side and between the two straight rods on the rear side. A row of evenly distributed partitions are provided on the side where the two limiting plates 1 are close to each other and on the side where the two limiting plates 2 are close to each other, a connecting column is connected to the right end of the limiting plate 2 on the rear side, a telescopic rod is connected between the connecting column and the limiting plate 2 on the front side, a fixed column is connected to the top of the connecting column, a slide plate that slides up and down is provided on the fixed column, and an adjusting component for adjusting the distance between the two limiting plates 1 and adjusting the relative position of the slide plate and the fixed column is provided on the placement rack.

[0012] More preferably, the adjustment assembly includes a bidirectional screw, the lower part of the placement frame is rotatably connected to the bidirectional screw, the two limit plates are both threadedly connected to the bidirectional screw, the top of the connecting column is rotatably connected to a threaded rod, and the threaded rod is threadedly connected to the slide plate.

[0013] Compared with the prior art, the present invention has the following advantages: 1. The moving block moves with the chain, the horizontal block part pushes the placement rack to move left, the vertical rod squeezes the push block to move upward, the baffle blocks the placement rack, the push block passes over the hanging part, the placement rack falls and presses the horizontal rod, the vertical rod and the connecting rod descend, the hydraulic cylinder drives the lifting rack to descend, the PCB circuit board enters the copper deposition chamber for copper deposition, the lifting rack rises again, and the push block pushes the placement rack to continue to move left. The working state of the corresponding copper deposition chamber can be controlled by controlling the height of the lifting rack. The process of the placement rack entering the copper deposition chamber, the process of the placement rack moving out of the copper deposition chamber and the movement process of the placement rack can be carried out simultaneously and continuously, the copper deposition process is automated, and the work efficiency is high.

[0014] 2. The belt conveyor on the right transports the placement rack with the PCB circuit boards to be copper-plated to the left. The placement rack can be pushed by the push block, and there is no need to manually hang the placement rack on the moving block. When the moving block and the push block drive the placement rack with the PCB circuit boards that have completed copper plating to move left, the convex rod squeezes the push block to slide upward, and the push block passes over the placement rack. The belt conveyor on the left unloads the placement rack, and the placement rack transportation is automated to improve work efficiency.

[0015] 3. The hydraulic cylinder drives the lifting frame to rise, and the lifting frame pushes the sliding frame to raise the mounting plate and the belt conveyor, and the copper sinking pool is removed for cleaning. When the copper sinking pool is put back on the base frame, the hydraulic cylinder drives the lifting frame to descend, and the compression spring descends the sliding frame, the mounting plate and the belt conveyor. The mounting plate centers the copper sinking pool in the left and right directions through the inclined plane 2, and the limit rod centers the copper sinking pool in the front and rear directions, thereby positioning the copper sinking pool.

[0016] 4. The lower part of the PCB circuit board in the placement rack is separated by a partition. When the lifting rack, the placement rack and the PCB circuit board are lowered to the copper sinking chamber, the slide plate contacts the right side plate of the copper sinking pool, the lifting rack and the placement rack continue to descend, and the second limit plate rises relative to the PCB circuit board to separate the upper part of the PCB circuit board to avoid contact between two adjacent PCB circuit boards and ensure the copper sinking effect.

[0017] 5. By rotating the bidirectional screw, the two limit plates 1 are brought closer to each other, driving the limit plate 2 to move synchronously. The distance between the two limit plates 1 and the distance between the two limit plates 2 can adapt to the width of the PCB circuit board. By rotating the threaded rod, the slide plate is raised and lowered on the fixed column, and the relative position of the slide plate and the limit plate 2 is adjusted. The limit plate 2 can limit the upper part of the PCB circuit board of different heights, and has strong adaptability. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0019] Figure 2 For the present invention Figure 1 Schematic diagram of some structures in .

[0020] Figure 3 It is a schematic structural diagram of the base frame, hydraulic cylinder, lifting frame and vertical rod of the present invention.

[0021] Figure 4 For the present invention Figure 2 Front view of the .

[0022] Figure 5 It is a schematic structural diagram of the moving block, the placement frame, the hanging part and the pushing block of the present invention.

[0023] Figure 6 It is an exploded view of the moving block, the hanging part and the pushing block of the present invention.

[0024] Figure 7 The figure is a schematic diagram of the connection relationship among the lifting frame, the vertical rod, the horizontal rod, the connecting rod and the baffle of the present invention.

[0025] Figure 8 For the present invention Figure 7 The structural schematic diagram from another perspective shows the matching relationship between the bending portion and the baffle.

[0026] Fig. 9 The figure is a schematic diagram of the connection relationship among the fixed block, the guide rod, the sliding frame, the mounting plate and the belt conveyor of the present invention.

[0027] Fig.10 For the present invention Fig. 9 Enlarged view of point A in .

[0028] Fig.11 It is a schematic structural diagram of a placement rack, a straight rod, a second limiting plate, a bidirectional screw rod, a connecting column, a telescopic rod, a fixed column, a slide plate and a threaded rod according to the present invention.

[0029] Fig.12 For the present invention Fig.11 Schematic diagram of the structure after the middle shelf is hidden, with the fixed columns cut away.

[0030] The markings of the components in the attached drawings are as follows: 1-base frame, 2-copper sink, 21-limiting rod, 3-hydraulic cylinder, 4-lifting frame, 41-supporting part, 5-connecting frame, 6-chain, 7-moving block, 71-cross plate part, 8-placing frame, 81-hanging part, 9-push block, 90-cross block part, 91-inclined surface 1, 10-baffle, 111-vertical rod, 112-cross rod, 113-connecting rod, 114- Bending part, 121-fixed block, 122-guide rod, 123-sliding frame, 124-mounting plate, 125-belt conveyor, 126-convex rod, 127-inclined surface 2, 131-limiting plate 1, 132-straight rod, 133-limiting plate 2, 134-partition plate, 135-bidirectional screw, 136-connecting column, 137-telescopic rod, 138-fixed column, 139-slide plate, 14-threaded rod. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] Embodiment 1: A PCB circuit board copper deposition equipment, reference Figure 1-Figure 8 , including a base frame 1, a copper sinking pool 2, a limit rod 21, a hydraulic cylinder 3, a lifting frame 4, a connecting frame 5, a chain 6, a moving block 7, a placement frame 8, a push block 9, a baffle 10 and a transmission mechanism. A copper sinking pool 2 is placed on the top of the base frame 1, and two copper sinking chambers are opened on the copper sinking pool 2. Two limit rods 21 are fixedly connected to the top of the base frame 1, two hydraulic cylinders 3 are bolted to the front of the base frame 1, and the movable rods of the hydraulic cylinders 3 are fixedly connected to the lifting frame 4. The top of the base frame 1 is symmetrically welded with a connecting frame 5, and the upper part of the connecting frame 5 is installed with a chain 6. The driving method of the chain 6 is the existing technology, specifically, the sprocket is driven by a motor to rotate, and the sprocket drives the chain 6 to rotate Rotation; a plurality of pairs of moving blocks 7 are detachably connected to the two chains 6 at even intervals, a placement rack 8 for placing PCB circuit boards is provided below the chains 6, the placement rack 8 is hung on a pair of moving blocks 7, and a push block 9 that slides up and down is provided on the moving blocks 7, and two rod-shaped receiving parts 41 are symmetrically provided at the lower part of the lifting frame 4, and the rear ends of the receiving parts 41 extend upward to form limit ends, and the receiving parts 41 on the left side of the lifting frame 4 are rotatably connected with a baffle 10, and when the placement rack 8 moves to the left, the left side of the placement rack 8 will contact the right side of the baffle 10, and the lifting frame 4 is provided with a transmission mechanism for sliding the push block 9 and rotating the baffle 10; Figure 5 and Figure 6 As shown, a hanging portion 81 is symmetrically provided on the upper part of the placement rack 8, a cross plate portion 71 is provided on the moving block 7, the hanging portion 81 is hung on the cross plate portion 71, and the push block 9 includes two parallel cross block portions 90; in the up and down directions, the total thickness of the hanging portion 81 and the cross plate portion 71 is less than the distance between the two cross block portions 90; when the push block 9 slides upward on the moving block 7, the cross block portion 90 and the hanging portion 81 are staggered in the horizontal direction, so that the cross block portion 90 can pass over the hanging portion 81.

[0033] refer to Figure 2 , Figure 3 , Figure 7 and Figure 8The transmission mechanism includes a vertical rod 111, a cross rod 112 and a connecting rod 113. The lifting frame 4 is provided with a vertical rod 111 that slides up and down. A return spring is fixedly connected between the vertical rod 111 and the lifting frame 4. The top of the vertical rod 111 extends from the top of the lifting frame 4. The push block 9 is provided with an inclined surface 91. When the push block 9 moves with the chain 6, the inclined surface 91 of the push block 9 will contact the top of the vertical rod 111, so that the push block 9 slides upward on the moving block 7; the lower end of the vertical rod 111 is fixedly connected with a cross rod 112, and the cross rod 112 is fixedly connected with a connecting rod 113. The left end of the connecting rod 113 is provided with a bending portion 114, and the bending portion 114 contacts the left side of the baffle 10, thereby limiting the baffle 10.

[0034] Initially, there is copper deposition liquid in the copper deposition chamber. Figure 5 and Figure 6 The hanging portion 81 of the placement rack 8 is hung on the horizontal plate portion 71 of the moving block 7. Under the action of gravity, the push block 9 on the moving block 7 is in a descending state, and the upper horizontal block portion 90 on the push block 9 is aligned with the hanging portion 81; the baffle 10 is in an upright state, and the bending portion 114 limits the baffle 10 so that the baffle 10 does not rotate counterclockwise, and at this time the baffle 10 does not rotate clockwise relative to the receiving portion 41.

[0035] First, place the PCB circuit board to be copper-plated in the placement rack 8, and the chain 6 is driven by the cooperation of the motor and the sprocket to rotate clockwise, and the moving block 7 moves with the chain 6. The moving block 7 with the placement rack 8 is moved to the left, and the moving block 7 drives the push block 9 located thereon to move to the left. The upper horizontal block part 90 on the push block 9 pushes the hanging part 81 to move to the left together, thereby driving the placement rack 8 and the PCB circuit board to move horizontally to the left to just above the copper deposition chamber on the right.

[0036] When the inclined surface 91 of the push block 9 contacts the top end of the vertical rod 111 on the right, the vertical rod 111 squeezes the push block 9 to slide upward through the inclined surface 91, and the upper horizontal block portion 90 on the push block 9 is staggered with the hanging portion 81. When the left side of the placement rack 8 contacts the right side of the baffle 10 on the right, the placement rack 8 and the PCB circuit board stop moving, and the moving block 7 and the push block 9 continue to move to the left. Since the total thickness of the hanging portion 81 and the horizontal plate portion 71 is less than the distance between the two horizontal block portions 90, the push block 9 and the moving block 7 will pass over the hanging portion 81. When the moving block 7 is separated from the placement rack 8, the push block 9 will also be separated from the vertical rod 111, and the push block 9 will slide downward and reset by gravity, and the placement rack 8 will not Then hang it on the moving block 7, the placement rack 8 and the PCB circuit board fall onto the receiving portion 41 of the right lifting rack 4, the placement rack 8 will press the cross bar 112 to move downward, driving the vertical rod 111 and the connecting rod 113 to move downward relative to the lifting rack 4, the top of the vertical rod 111 no longer extends from the top of the lifting rack 4, the reset spring is stretched, so that the bent portion 114 of the connecting rod 113 no longer blocks the baffle 10, and the bent portion 114 no longer limits the baffle 10. At this time, the hydraulic cylinder 3 is controlled to drive the lifting rack 4 on the right to descend, driving the baffle 10, the vertical rod 111, the cross bar 112, the connecting rod 113, the placement rack 8 and the PCB circuit board to descend together, and the PCB circuit board enters the copper deposition chamber on the right for copper deposition.

[0037] During the copper deposition process of the PCB circuit board in the copper deposition chamber on the right, the next placement rack 8 with the PCB circuit board is hung on the moving block 7. Similarly, the next placement rack 8 with the PCB circuit board can enter the copper deposition chamber on the left for copper deposition.

[0038] When the copper deposition of the PCB circuit board in one of the copper deposition chambers is completed, the hydraulic cylinder 3 is controlled to drive the corresponding lifting frame 4 to rise, driving the baffle 10, the vertical rod 111, the cross rod 112, the connecting rod 113, the placement frame 8 and the PCB circuit board after copper deposition to rise together, so that the placement frame 8 moves out of the copper deposition chamber, and the height of the lifting frame 4 rises higher than its initial height, so that the placement frame 8 is aligned with its initial height; the limit end can limit the placement frame 8 to prevent the placement frame 8 from moving back and forth on the lifting frame 4. When the pair of moving blocks 7 moving to the left moves to the hanging portion 81 of the placement frame 8, since the top end of the vertical rod 111 does not extend from the top of the lifting frame 4 at this time, the push block 9 will not contact the vertical rod 111, so that the push block 9 is in a descending state, and the upper side of the cross block 90 on the push block 9 can push the hanging portion 81 to move to the left together, so that the placement frame 8 and the PCB circuit board move to the left. At this time, the bending portion 114 does not limit the baffle 10, and the placement rack 8 will push the baffle 10 to rotate counterclockwise so that the placement rack 8 can pass over the baffle 10. When the placement rack 8 leaves the lifting rack 4, the placement rack 8 is separated from the cross bar 112, and the reset spring is restored, driving the vertical rod 111, the cross bar 112 and the connecting rod 113 to move upward and reset relative to the lifting rack 4. The bending portion 114 will push the baffle 10 to rotate clockwise and reset to the initial state, and then control the hydraulic cylinder 3 to drive the lifting rack 4 to descend to the initial height. Similarly, the lifting rack 4 can undertake the next placement rack 8. After the placement rack 8 with the PCB circuit board completed with copper plating moves to the left end of the chain 6, the placement rack 8 can be removed for unloading; if it is necessary to clean the copper sinking pool 2, the copper sinking pool 2 can be removed from the base frame 1. After the copper sinking pool 2 is put back on the base frame 1, the copper sinking pool 2 is limited by two limit rods 21.

[0039] In summary, with the cooperation of multiple pairs of moving blocks 7 and pushing blocks 9 on the chain 6, the working state of the corresponding copper deposition chamber can be controlled by controlling the height of the lifting frame 4 through the hydraulic cylinder 3: the lifting frame 4 at the initial height undertakes the placement frame 8, the lifting frame 4 in the descending state performs copper deposition, and the lifting frame 4 raised to a height higher than the initial height performs material discharge. The process of the placement frame 8 entering the copper deposition chamber, the process of the placement frame 8 moving out of the copper deposition chamber, and the movement process of the placement frame 8 can be carried out simultaneously and continuously, the waiting time of the entire process is short, the copper deposition process is automated, and the work efficiency is high.

[0040] Example 2: Based on Example 1, refer to Figure 1 , Fig. 9 and Fig.10The PCB circuit board copper deposition equipment also includes a conveying mechanism, which includes a fixed block 121, a guide rod 122, a sliding frame 123, a mounting plate 124, a belt conveyor 125 and a protruding rod 126. Two symmetrical fixed blocks 121 are welded on the upper part of the side away from each other of the two connecting frames 5. The top of the fixed block 121 is welded and connected with a guide rod 122. The two guide rods 122 on the front side and the two guide rods 122 on the rear side are connected with a sliding frame 123 in an upward and downward sliding manner. The sliding frame 123 is fixedly connected to the guide rod 122. A compression spring is connected, and the left and right parts of the sliding frame 123 are fixedly connected to the mounting plates 124. The lower part of the mounting plate 124 close to the copper sinking pool 2 is provided with an inclined surface 127, and the left and right sides of the copper sinking pool 2 are in contact with the mounting plate 124; a belt conveyor 125 is installed between the two mounting plates 124 on the left and between the two mounting plates 124 on the right, and a convex rod 126 is connected to the left part of the side where the two sliding frames 123 are close to each other. When the push block 9 moves with the chain 6, the inclined surface 191 of the push block 9 will contact the convex rod 126.

[0041] The sliding frame 123 contacts with the fixed block 121, and the lowest position of the sliding frame 123, the mounting plate 124 and the belt conveyor 125 is limited by the fixed block 121; the placement rack 8 with the PCB circuit board to be copper-plated is conveyed to the left by the belt conveyor 125 on the right, so that the placement rack 8 stops at the left end of the belt conveyor 125 on the right, and the placement rack 8 is kept at a fixed height. When the moving block 7 and the pushing block 9 move with the chain 6, the placement rack 8 can be pushed by the pushing block 9, and the placement rack 8 does not need to be hung on the moving block 7 manually; when the moving block 7 and the pushing block 9 drive the placement rack 8 with the PCB circuit board after copper plating to move to the left, the inclined surface 91 of the pushing block 9 will contact the convex rod 126, and the pushing block 9 is squeezed by the convex rod 126 to slide upward, so that the pushing block 9 can pass over the placement rack 8, and then the belt conveyor 125 on the left is controlled to convey the placement rack 8 to the left for unloading. The conveying process of the placement rack 8 is automated, thereby improving work efficiency.

[0042] When it is necessary to clean the copper sinking pool 2, the hydraulic cylinder 3 is controlled to drive the lifting frame 4 to rise, the lifting frame 4 will contact the sliding frame 123, the lifting frame 4 will push the sliding frame 123 to rise, the compression spring is compressed, and the mounting plate 124 and the belt conveyor 125 are driven to rise, so that the position of the mounting plate 124 is higher than the copper sinking pool 2, and the copper sinking pool 2 can be removed; when the copper sinking pool 2 is put back on the base frame 1, the hydraulic cylinder 3 is controlled to drive the lifting frame 4 to descend, the lifting frame 4 is separated from the sliding frame 123, the compression spring is restored, and the sliding frame 123, the mounting plate 124 and the belt conveyor 125 are driven to descend and reset, and the mounting plates 124 on the left and right sides squeeze the copper sinking pool 2 through the inclined surface 127, so that the copper sinking pool 2 is centered in the left and right direction, and at the same time, the two limit rods 21 center the copper sinking pool 2 in the front and rear direction, thereby positioning the copper sinking pool 2.

[0043] Embodiment 3: Based on Embodiment 2, refer to Figure 1 , Fig.11 and Fig.12 The PCB circuit board copper deposition equipment also includes a limiting mechanism, which includes a limiting plate 131, a straight rod 132, a limiting plate 133, a partition 134, a connecting column 136, a telescopic rod 137, a fixed column 138, a slide plate 139 and an adjustment component. The lower part of the placement rack 8 is provided with two limiting plates 131 that slide forward and backward. The limiting plate 131 is fixedly connected to the left and right ends with straight rods 132. A limiting plate 133 that slides up and down is provided between the two straight rods 132 on the front side and between the two straight rods 132 on the rear side. A row of evenly distributed partitions 134 are arranged at intervals on the side where the two limiting plates 131 are close to each other and the side where the two limiting plates 133 are close to each other. The right side of the limiting plate 133 on the rear side The end is connected to a connecting column 136, and a telescopic rod 137 is connected between the front end of the connecting column 136 and the right end of the front limiting plate 133. A hollow fixed column 138 is fixedly connected to the top of the connecting column 136, and a slide plate 139 is provided on the fixed column 138 for sliding up and down. The placement frame 8 is provided with an adjusting component for adjusting the distance between the two limiting plates 131 and adjusting the relative position of the slide plate 139 and the fixed column 138; the adjusting component includes a bidirectional screw 135 and a threaded rod 14, and the left side of the lower part of the placement frame 8 is rotatably connected to the bidirectional screw 135, and the two limiting plates 131 are both threadedly connected to the bidirectional screw 135, and the top of the connecting column 136 is rotatably connected to the threaded rod 14, and the threaded rod 14 is threadedly connected to the slide plate 139.

[0044] The copper sinking pool 2 includes a right side plate located on the right side of each copper sinking chamber, and the PCB circuit board to be coppered is vertically placed in the placement rack 8, and the front and rear sides of the PCB circuit board are located between two adjacent columns of partitions 134, and the lower half of the PCB circuit board is separated one by one by the partition 134. When the lifting rack 4, the placement rack 8 and the PCB circuit board are lowered to the copper sinking chamber, the limit plate 131, the straight rod 132, the limit plate 2 133, the connecting column 136, the telescopic rod 137, the fixed column 138, the slide plate 139 and the threaded rod 14 will descend together with the placement rack 8, and the slide plate 139 will contact the right side plate of the copper sinking pool 2, and the slide plate 139 will stop descending, and the threaded rod 14, the fixed column 138, the telescopic rod 137, the connecting column 136 and the limit plate 2 133 will also stop descending, while the lifting rack 4, the placement rack 8, the PCB circuit board, the limit plate 131 and the straight rod 132 will continue to descend. The second positioning plate 133 rises relative to the PCB circuit board, and the second limiting plate 133 separates the upper part of the PCB circuit board, while the first limiting plate 131 continues to separate the lower part of the PCB circuit board, so that the PCB circuit boards in the copper plating liquid are in a one-to-one separated state, ensuring that there is enough space between two adjacent PCB circuit boards to avoid contact between the two adjacent PCB circuit boards and ensure the copper plating effect. When the lifting frame 4, the placement frame 8 and the PCB circuit board rise and leave the copper plating chamber for unloading, under the action of gravity or manually pushing the slide plate 139, the slide plate 139 is lowered and reset relative to the PCB circuit board, driving the fixed column 138, the telescopic rod 137, the connecting column 136 and the second limiting plate 133 to descend relative to the PCB circuit board, and the second limiting plate 133 moves to the position of the lower part of the PCB circuit board, so as to facilitate the removal of the PCB circuit board on the placement frame 8.

[0045] When copper deposition is required for PCB circuit boards of different specifications, the bidirectional screw rod 135 is manually rotated using a tool, and the two limit plates 131 are brought closer to each other in the front and rear directions through a threaded connection, driving the straight rod 132 and the limit plate 2 133 to move synchronously, and the telescopic rod 137 can be adaptively extended and retracted, and the distance between the two limit plates 131 and the distance between the two limit plates 133 can adapt to the width of the PCB circuit board; the threaded rod 14 is manually rotated, and the slide plate 139 is raised and lowered on the fixed column 138 through a threaded connection to adjust the relative position of the slide plate 139 and the limit plate 2 133 in the up and down directions, so that the rising height of the limit plate 2 133 during copper deposition can adapt to the height of the PCB circuit board, ensuring that the limit plate 2 133 can limit the upper half of PCB circuit boards of different heights, and has strong adaptability.

[0046] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A PCB copper deposition device, comprising a base frame (1), on which a copper deposition pool (2) is placed, wherein: The copper sinking pool (2) is provided with at least two copper sinking chambers. The base frame (1) is connected with at least two hydraulic cylinders (3). The movable rods of the hydraulic cylinders (3) are connected with lifting frames (4). The number of the lifting frames (4) is equal to the number of the copper sinking chambers. The base frame (1) is connected with two connecting frames (5). Chains (6) are installed on the upper parts of the connecting frames (5). Multiple pairs of moving blocks (7) are detachably connected to the two chains (6) at intervals. A spacer for placing a PCB circuit board is provided below the chains (6). A placing rack (8) is hung on a pair of moving blocks (7), each of the moving blocks (7) is provided with a push block (9) that slides up and down, and each of the lower parts of the lifting rack (4) is provided with two receiving parts (41), and each of the receiving parts (41) located on the left side of the lifting rack (4) is rotatably connected to a baffle (10). When the placing rack (8) moves, the placing rack (8) contacts the baffle (10), and the lifting rack (4) is provided with a transmission mechanism for causing the push block (9) to slide and the baffle (10) to rotate.

2. A PCB copper deposition equipment according to claim 1, characterized in that: The base frame (1) is connected to two limit rods (21), the rear ends of the receiving parts (41) are extended upward to form limit ends, the upper part of the placement frame (8) is symmetrically provided with hanging parts (81) in the front and rear, the moving block (7) is provided with a transverse plate part (71), the hanging part (81) is hung on the transverse plate part (71), and the push block (9) includes two transverse block parts (90); in the up and down direction, the total thickness of the hanging part (81) and the transverse plate part (71) is less than the distance between the two transverse block parts (90); when the push block (9) slides upward on the moving block (7), the transverse block part (90) and the hanging part (81) are offset in the horizontal direction.

3. A PCB copper deposition equipment according to claim 2, characterized in that: The transmission mechanism comprises a vertical rod (111), the lifting frame (4) is provided with a vertical rod (111) that slides up and down, a return spring is connected between the vertical rod (111) and the lifting frame (4), the lower end of the vertical rod (111) is connected to a cross rod (112), the cross rod (112) is connected to a connecting rod (113), and the left end of the connecting rod (113) is provided with a bent portion (114), and the bent portion (114) is in contact with the left side of the baffle (10).

4. A PCB copper deposition equipment according to claim 3, characterized in that: The top end of the vertical rod (111) extends from the top of the lifting frame (4), and the push block (9) is provided with an inclined surface 1 (91). When the push block (9) moves along with the chain (6), the inclined surface 1 (91) will contact the top end of the vertical rod (111).

5. A PCB copper deposition equipment according to claim 4, characterized in that: The PCB copper deposition device further comprises a conveying mechanism, the conveying mechanism comprising a fixed block (121), two fixed blocks (121) are connected to the sides of the two connecting frames (5) that are away from each other, the tops of the fixed blocks (121) are connected to guide rods (122), a sliding frame (123) that is reset by a compression spring is slidably connected up and down between the two front guide rods (122) and between the two rear guide rods (122), the left and right parts of the sliding frame (123) are connected to mounting plates (124), a belt conveyor (125) is installed between the two mounting plates (124) on the left side and between the two mounting plates (124) on the right side, and a convex rod (126) is connected to the left parts of the sides of the two sliding frames (123) that are close to each other, and when the push block (9) moves with the chain (6), the inclined surface 1 (91) of the push block (9) will contact the convex rod (126).

6. A PCB copper deposition equipment according to claim 5, characterized in that: A second inclined surface (127) is provided at the lower portion of one side of the mounting plate (124) close to the copper sinking pool (2), and both left and right sides of the copper sinking pool (2) are in contact with the mounting plate (124).

7. A PCB copper deposition equipment according to claim 6, characterized in that: The PCB copper deposition device also includes a limiting mechanism, the limiting mechanism includes a limiting plate 1 (131), the lower part of the placement rack (8) is provided with two limiting plates 1 (131) that slide forward and backward, the left and right ends of the limiting plate 1 (131) are connected with straight rods (132), between the two straight rods (132) on the front side and between the two straight rods (132) on the rear side, a limiting plate 2 (133) that slides up and down is provided, and a row of limiting plates 1 (131) and 133 are provided at intervals on the side where the two limiting plates 1 (131) are close to each other and on the side where the two limiting plates 2 (133) are close to each other. The partitions (134) are evenly distributed, the right end of the rear limiting plate 2 (133) is connected to a connecting column (136), a telescopic rod (137) is connected between the connecting column (136) and the front limiting plate 2 (133), the top of the connecting column (136) is connected to a fixing column (138), the fixing column (138) is provided with a slide plate (139) that slides up and down, and the placement frame (8) is provided with an adjustment component for adjusting the distance between the two limiting plates 1 (131) and adjusting the relative position of the slide plate (139) and the fixing column (138).

8. A PCB copper deposition equipment according to claim 7, characterized in that: The adjustment assembly comprises a bidirectional screw (135), the lower part of the placement frame (8) is rotatably connected to the bidirectional screw (135), the two limit plates (131) are both threadedly connected to the bidirectional screw (135), the top of the connecting column (136) is rotatably connected to a threaded rod (14), and the threaded rod (14) is threadedly connected to the slide plate (139).

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