Circuit gap filling device and method for inner core board of printed circuit board

Abstract

The invention discloses a circuit gap filling device and method for an inner core board of a printed circuit board, and relates to the technical field of printed circuit board processing. An inner-layer core plate to be filled with resin is arranged in the tray; the filling mechanism comprises a resin box, a scraping plate, a guide frame and a supporting frame, one end of the supporting frame is connected to a rotating shaft, the rotating shaft is rotationally arranged between the two first supports, the overturning mechanism is used for driving the rotating shaft, and a template is installed at the bottom of the supporting frame; the pattern on the template corresponds to a line gap of the inner-layer core plate, the guide frame is arranged at the top of the supporting frame, the resin box is connected with the scraping plate and linearly slides along a guide groove of the guide frame, and the bottom of the scraping plate is tightly attached to the template; the linear travel mechanism is used for reciprocating the resin box and the scraper blade. According to the invention, the resin can be filled into the circuit gap of the inner core plate, and the height difference between the copper surface in the inner core plate and the substrate is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of printed circuit board processing, and in particular to a device and method for filling gaps between lines on an inner core board of a printed circuit board. Background Art

[0002] The main features of thick copper plates are: large current carrying capacity, reduced thermal strain and good heat dissipation performance. They are mainly used in communication equipment, aerospace, planar transformers and power modules. The structure of thick copper plates includes a substrate and a copper layer covering the surface. As the current passing through increases, the thickness of the copper layer on the substrate surface increases.

[0003] At present, the copper thickness of high-current thick copper boards is generally greater than or equal to 6oz, so there is a large height difference between the copper surface and the substrate. During the lamination process, the resin in the adhesive sheet fills into the line gap and cannot completely fill this height difference, resulting in an uneven surface of the circuit board after lamination. This unevenness affects the processing of subsequent processes of the circuit board and will lead to a decrease in product reliability. Summary of the invention

[0004] In order to solve the deficiencies of the prior art, the present invention provides a device and method for filling the gap between inner core board circuits of a printed circuit board, which can fill the gap between inner core board circuits with resin and reduce the height difference between the copper surface and the substrate.

[0005] In order to achieve the purpose of the present invention, the following scheme is proposed: A device for filling the gap between inner core plates of a printed circuit board comprises an operating table, a plurality of trays, a filling mechanism, a linear travel mechanism and a turning mechanism.

[0006] The top of the operating table has preset positions for matching pallets; The tray contains the inner core board to be filled with resin; The filling mechanism includes a resin box, a scraper, a guide frame and a support frame. One end of the support frame is connected to a rotating shaft, and the rotating shaft is rotatably arranged between two first brackets. The flip mechanism is used to drive the rotating shaft. A template is installed at the bottom of the support frame. When the support frame covers the operating table, the template is in close contact with the inner core board, and the pattern on the template corresponds to the line gap of the inner core board. The guide frame is arranged on the top of the support frame. The resin box and the scraper are connected and are arranged to slide linearly along the guide groove of the guide frame. The bottom of the scraper is in close contact with the template. The linear travel mechanism is arranged on the second bracket, connected to the resin box, and used for reciprocating the resin box and the scraper.

[0007] A method for filling the gap between inner core boards of printed circuit boards, using the device for filling the gap between inner core boards of printed circuit boards, comprises the following steps: S1. Place the tray with the inner core board on the preset position on the top of the operating table; S2, the motor drives the screw rod to move the slider away from the rotating shaft. During this process, the rack drives the gear, which causes the support frame to flip down. When the rack just leaves the gear, the straight rod just falls into the groove, and the template is in close contact with the inner core plate; S3, the resin box releases a certain amount of resin onto the template, the motor continues to drive the screw rod to make the resin box and the scraper move back and forth, and the scraper fills the resin into the line gap of the inner core plate; S4, the motor drives the rotating shaft in reverse, so that the support frame flips up, the straight rod is separated from the groove, and the tray is moved out.

[0008] The beneficial effect of the present invention is that the inner core board circuit gap filling device provided by the present invention can fill the resin into the circuit gap of the inner core board, and then the inner core board is baked and cured by a baking device. This method can reduce the height difference between the copper surface and the substrate in the inner core board, thereby solving the problem of the uneven surface of the circuit board obtained after pressing. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 A method flow chart is shown; Figure 2 A left side view of one of the inner core board circuit gap filling devices in an open state is shown; Figure 3 A diagram of the structure of the tray is shown; Figure 4 A top view of the support frame is shown; Figure 5 Shows a screen structure diagram; Figure 6 The front view of the scraper, L-shaped plate and resin box is shown; Figure 7 A left view of another inner core board circuit gap filling device in an open state is shown; Figure 8 It shows a structural diagram of another inner core board circuit gap filling device in an open state; Fig. 9 Shows another inner core board circuit gap filling device closed state left view; Fig.10 It shows a structural diagram of another inner core board circuit gap filling device in a closed state; Fig.11 A top view of an inner core board circuit gap filling device having a first conveying platform and a second conveying platform is shown; Fig.12 The structure diagram of the operating platform, the first conveying platform and the second conveying platform is shown; Fig.13 A schematic diagram of an inner core panel is shown; Fig.14A schematic diagram of the inner core panel after resin filling is shown; Fig.15 A schematic diagram of the inner core board, bonding sheet and copper foil after lamination is shown; Description of the drawings: operating table -1, through slot -11, tray -2, notch -21, filling mechanism -3, resin box -31, scraper -32, cylinder -321, L-shaped plate -322, straight rod -323, guide frame -33, guide slot -331, support frame -34, through hole -341, template -35, mounting column -351, locking screw -352, rotating shaft -36, linear travel mechanism -4, motor -41, screw -42, guide rod -43, slider -44, groove -441, flipping mechanism -5, gear -51, rack -52, first conveyor platform -6, second conveyor platform -7. DETAILED DESCRIPTION

[0010] Example 1 like Figure 2 , Figure 3 As shown, this embodiment provides a device for filling the gap between lines of the inner core board of a printed circuit board, which is used to fill the gap between lines of the inner core board with resin. The device includes an operating table 1, a plurality of trays 2, a filling mechanism 3, a linear travel mechanism 4 and a flipping mechanism 5.

[0011] Specifically, a slot is provided at a preset position on the top of the operating table 1, and the slot is used to match the tray 2, and the tray 2 is used to accommodate the inner core board, such as Figure 3 As shown, the four side walls of the tray 2 are all provided with notches 21, and the notches 21 penetrate the tray 2 from top to bottom. The notches 21 are used to facilitate the placement or removal of the inner core board.

[0012] Specifically, Figure 2 , Figure 4 As shown, the filling mechanism 3 includes a resin box 31, a scraper 32, a guide frame 33, a support frame 34 and a template 35. One end of the support frame 34 is connected to a rotating shaft 36, and the rotating shaft 36 is rotatably arranged between two first brackets. The template 35 is installed at the bottom of the support frame 34. A pattern is provided on the template 35. The direction of the pattern is made according to the line gap of the inner core board. When the template 35 is in close contact with the inner core board, the pattern on the template 35 corresponds to the line gap of the inner core board. The guide frame 33 is mounted on the top of the support frame 34. The resin box 31 and the scraper 32 are connected together and are linearly slidably arranged along the guide groove 331 of the guide frame 33. A plurality of discharge pipes are provided at the bottom of the resin box 31 for releasing epoxy resin onto the template 35. The bottom of the scraper 32 is in close contact with the template 35. The scraper 32 is used to squeeze the resin into the line gap of the inner core board during movement.

[0013] Specifically, the linear stroke mechanism 4 is arranged on the second bracket, the second bracket is arranged on the guide frame 33, the linear stroke mechanism 4 is connected to the resin box 31, and is used to reciprocate the resin box 31 and the scraper 32. There are many ways to implement the linear stroke mechanism 4 in the prior art, such as using a telescopic rod driven by a pneumatic cylinder or an oil cylinder.

[0014] Specifically, the flipping mechanism 5 is connected to the rotating shaft 36 and is used to drive the rotating shaft 36. There are many ways to implement the flipping mechanism 5 in the prior art, such as using a power motor to drive it.

[0015] Instructions for use: place the tray 2 with the inner core board at a preset position on the top of the operating table 1; the flipping mechanism 5 drives the rotating shaft 36 to flip the support frame 34 down and cover the operating table 1 until the template 35 is in close contact with the inner core board, and the pattern on the template 35 corresponds to the line gap of the inner core board; the resin box 31 releases a certain amount of resin onto the template 35, and the linear travel mechanism 4 reciprocates the resin box 31 and the scraper 32, and the scraper 32 fills the resin into the line gap of the inner core board; the flipping mechanism 5 drives the rotating shaft 36 in the reverse direction to flip the support frame 34 up and remove the tray 2.

[0016] The above solution only introduces the method of filling resin on one side of the inner core board. If the other side of the inner core board is filled with resin, there are two options: First, the template 35 is detachably mounted on the support frame 34, and after the first side of the inner core board is filled with resin and cured by baking, the other side of the inner core board is placed upward in the tray 2, and then the corresponding template 35 is mounted on the support frame 34, and the other side of the inner core board is filled with resin using the same set of inner core board line gap filling devices.

[0017] The second method is to prepare another set of inner core board circuit gap filling device. After the first side of the inner core board is filled with resin and baked and cured, the other side of the inner core board is placed face up in tray 2, and then another set of inner core board circuit gap filling device is used to fill the other side of the inner core board with resin.

[0018] In order to facilitate the disassembly and assembly of the template 35, the present embodiment adopts the following measures: Figure 2 , Figure 4 , Figure 5 As shown, the support frame 34 is provided with six through holes 341 running through it from top to bottom, and the template 35 is provided with six mounting posts 351 on the top. The mounting posts 351 are provided with threaded holes on the top. The mounting posts 351 match the corresponding through holes 341 and are fixed by locking screws 352.

[0019] Example 2 like Figure 7As shown, this embodiment provides another device for filling the gap between the inner core board of a printed circuit board. The device provided in this embodiment 2 is basically the same as that in embodiment 1, except that the linear travel mechanism 4 and the flip mechanism 5 are improved, as follows: like Figure 6 , Figure 7 As shown, a cylinder 321 is provided on each side of the scraper 32, the guide frame 33 is set as a rectangular frame, and the two opposite inner walls of the guide frame 33 are provided with guide grooves 331. The cylinder 321 slides in the corresponding guide groove 331, and an L-shaped plate 322 is provided on the top of the scraper 32. The bottom surface of the L-shaped plate 322 is close to the top surface of the guide frame 33. The resin box 31 is arranged in the L-shaped plate 322, and the outer wall of the L-shaped plate 322 is provided with a straight rod 323.

[0020] like Figure 4 , Figure 7 , Figure 8 As shown, the linear travel mechanism 4 is arranged on the second bracket, and the second bracket is arranged on the outside of the operating table 1. The linear travel mechanism 4 includes a motor 41, a screw rod 42, a guide rod 43 and a slider 44. The screw rod 42 is rotatably arranged on the second bracket, and the guide rod 43 is fixedly arranged on the second bracket. The slider 44 is threadedly connected with the screw rod 42 and slidingly cooperates with the guide rod 43. The motor 41 is used to drive the screw rod 42. A groove 441 is provided on the top of the slider 44, and the groove 441 is used to accommodate the straight rod 323. The flip mechanism 5 includes a gear 51 and a rack 52 that are meshed with each other. The gear 51 is coaxially connected with the rotating shaft 36, and the rack 52 is fixedly arranged at the bottom of the slider 44.

[0021] Directions: Figure 7 The inner core board line gap filling device is in the open state, at this time, the straight rod 323 is not located in the groove 441, when the inner core board line gap filling device needs to be closed, the motor 41 drives the screw rod 42 to move the slider 44 to the right, during this process, the rack 52 shifts the gear 51, thereby causing the support frame 34 to flip toward the operating table 1, when the rack 52 just disengages from the gear 51, the straight rod 323 just falls into the groove 441, and the support frame 34 covers the operating table 1, and the template 35 is in close contact with the inner core board, that is, Fig. 9 , Fig.10 Status shown.

[0022] It should be noted here that the size and shape of the groove 441 should be able to ensure that when the slider 44 moves to the right, it can receive the flipped straight rod 323.

[0023] The above scheme introduces a method for flipping down the support frame 34. After the support frame 34 is flipped down, the motor 41 continues to drive the screw rod 42 to prompt the slider 44 to continue to move to the right. Because the straight rod 323 is located in the groove 441, the rightward movement of the slider 44 will prompt the L-shaped plate 322, the resin box 31, the scraper 32 and the cylinder 321 to move along the guide groove 331 as a whole; when the cylinder 321 moves to the right end of the guide groove 331, the motor 41 drives the screw rod 42 in the reverse direction to prompt the slider 44 to move to the left, thereby realizing the reciprocating movement of the scraper 32; when the cylinder 321 moves to the left end of the guide groove 331, the motor 41 continues to drive the screw rod 42 in the reverse direction to prompt the support frame 34 to flip up, and the straight rod 323 disengages from the groove 441.

[0024] More specifically, Fig.11 , Fig.12 As shown, the present embodiment further includes a first conveying platform 6 and a second conveying platform 7. The operating table 1 is located between the linear travel mechanism 4 and the first conveying platform 6, and the first conveying platform 6 is docked with one side of the operating table 1. The first conveying platform 6 is used to convey the tray 2 to a preset position on the operating table 1, and the second conveying platform 7 is docked with one end of the operating table 1. The operating table 1 is provided with a through groove 11 which runs through its table top from top to bottom. The long axis direction of the through groove 11 is consistent with the conveying direction of the second conveying platform 7. When the tray 2 is located at the preset position on the operating table 1, the through groove 11 is connected with two notches 21 therein. A pushing mechanism is provided at the through groove 11, and the pushing mechanism includes a pushing plate, a pneumatic lifting rod and a pneumatic telescopic rod. The pushing plate is located in the through groove 11. Note that the top surface of the pushing plate cannot be higher than the through groove 11. The pushing mechanism is used to move the tray 2 on the operating table 1 to the second conveying platform 7, and the second conveying platform 7 is used to convey the tray 2 to the baking equipment.

[0025] One thing to explain here is that as mentioned above, each of the four side walls of the pallet 2 is provided with a notch 21. The function of the notch 21 is to facilitate the placement or removal of the inner core board. The second function of the notch 21 is to facilitate the pneumatic lifting rod of the pushing mechanism to move the push plate up into the notch 21, and then use the pneumatic telescopic rod to move the pallet 2 on the operating table 1 to the second conveyor platform 7.

[0026] Example 3 like Figure 1 As shown, this embodiment provides a method for filling the gap between inner core circuits of a printed circuit board, comprising the following steps: Pre-processing: The inner core board is cut, the inner layer circuit is processed, and the etching process is carried out in sequence. The copper layer thickness of the inner core board is 210μm-350μm. The schematic diagram is as follows Fig.13 shown.

[0027] The resin is filled into the line gap of the inner core board of the printed circuit board by the inner core board line gap filling device of Example 2, and the specific steps are as follows: An inner core board is placed in advance in the tray 2, and the first surface of all inner core boards is ensured to face upward, and the tray 2 is sequentially transported to a preset position on the operating table 1 by the first conveying platform 6; The motor 41 drives the screw rod 42 to move the slider 44 away from the rotating shaft 36. During this process, the rack 52 shifts the gear 51, thereby causing the support frame 34 to flip toward the operating table 1. When the rack 52 is just separated from the gear 51, the straight rod 323 just falls into the groove 441, and the support frame 34 covers the operating table 1, and the template 35 is in close contact with the inner core plate. Figure 7 Convert to Fig. 9 Status; The resin box 31 releases a fixed amount of epoxy resin onto the template 35, and the motor 41 continues to drive the screw rod 42 to cause the slider 44 to continue to move away from the rotating shaft 36, thereby causing the L-shaped plate 322, the resin box 31, the scraper 32 and the cylinder 321 to move along the guide groove 331 as a whole; when the cylinder 321 moves to the right end of the guide groove 331, the motor 41 drives the screw rod 42 in the reverse direction to cause the slider 44 to return, thereby realizing the reciprocating movement of the scraper 32 and filling the resin into the line gap of the inner core plate; When the device returns to Fig. 9 In the state shown, the motor 41 continues to drive the screw rod 42 in the reverse direction, causing the support frame 34 to flip up and the straight rod 323 to disengage from the groove 441; the tray 2 on the operating table 1 is moved to the second conveying platform 7 by the pushing mechanism, and the second conveying platform 7 conveys the tray 2 to the baking equipment.

[0028] Subsequent processing: transfer the tray 2 to the baking equipment for baking to solidify the resin. After the first side of the inner core board is filled with resin and baked and solidified, the other side of the inner core board is placed upward in the tray 2, and then the corresponding template 35 is installed on the support frame 34, and the other side of the inner core board is filled with resin using the same set of inner core board line gap filling device, and then baked and solidified, thereby completing the resin filling and solidification of both sides of the inner core board, as shown in the schematic diagram Fig.14 The copper foil, bonding sheet, inner core board, bonding sheet, inner core board, bonding sheet, and copper foil are stacked together in sequence and hot pressed, as shown in the schematic diagram. Fig.15 shown.

[0029] In summary, in this embodiment, the resin is first filled into the circuit gap of the inner core board, and then used for lamination after baking and curing. This method can reduce the height difference between the copper surface in the inner core board and the substrate, thereby solving the problem of uneven surface of the circuit board obtained after lamination.

[0030] The above embodiments are only used to illustrate the technical ideas and features of the present invention, and are not intended to be the only or limit the present invention. It should be understood by those skilled in the art that various changes or equivalent substitutions made to the present invention without departing from the scope of the present invention all fall within the scope of protection of the present invention.

Claims

1. A device for filling the gap between inner core circuits of a printed circuit board, characterized in that: It comprises an operating table (1), a plurality of trays (2), a filling mechanism (3), a linear travel mechanism (4) and a turning mechanism (5); The top of the operating table (1) is preset to match the tray (2); The tray (2) contains an inner core board to be filled with resin; The filling mechanism (3) comprises a resin box (31), a scraper (32), a guide frame (33) and a support frame (34); one end of the support frame (34) is connected to a rotating shaft (36); the rotating shaft (36) is rotatably arranged between two first brackets; the flip mechanism (5) is used to drive the rotating shaft (36); a template (35) is installed at the bottom of the support frame (34); when the support frame (34) covers the operating table (1), the template (35) is in close contact with the inner core board, and the pattern on the template (35) corresponds to the line gap of the inner core board; the guide frame (33) is mounted on the top of the support frame (34); the resin box (31) and the scraper (32) are connected and are arranged to slide linearly along the guide groove (331) of the guide frame (33); the bottom of the scraper (32) is in close contact with the template (35); The linear travel mechanism (4) is arranged on the second bracket and is connected to the resin box (31) and is used for reciprocating the resin box (31) and the scraper (32).

2. The device for filling gaps between inner core circuits of a printed circuit board according to claim 1, characterized in that: The copper layer thickness of the inner core board is 210μm-350μm.

3. The device for filling gaps between inner core circuits of a printed circuit board according to claim 1, characterized in that: The resin box (31) is filled with epoxy resin.

4. The device for filling gaps between inner core circuits of a printed circuit board according to claim 1, characterized in that: The support frame (34) is provided with a plurality of through holes (341) penetrating the support frame (34) from top to bottom. The top of the template (35) is provided with a plurality of mounting posts (351). The tops of the mounting posts (351) are provided with threaded holes. The mounting posts (351) are matched in corresponding through holes (341) and are fixed by locking screws (352).

5. The device for filling gaps between inner core circuits of a printed circuit board according to claim 1, characterized in that: A cylinder (321) is provided on each side of the scraper (32); the guide frame (33) is configured as a rectangular frame; two opposite inner walls of the guide frame (33) are provided with guide grooves (331); the cylinders (321) are slidably fitted in the corresponding guide grooves (331); an L-shaped plate (322) is provided on the top of the scraper (32); the bottom surface of the L-shaped plate (322) is in close contact with the top surface of the guide frame (33); and the resin box (31) is arranged in the L-shaped plate (322).

6. The device for filling gaps between inner core circuits of a printed circuit board according to claim 5, characterized in that: A straight rod (323) is provided on the outer wall of the L-shaped plate (322). The linear travel mechanism (4) comprises a motor (41), a screw rod (42), a guide rod (43) and a slider (44). The second bracket is provided on the outer side of the operating table (1). The screw rod (42) is rotatably provided on the second bracket. The guide rod (43) is fixedly provided on the second bracket. The slider (44) is threadedly connected to the screw rod (42) and is slidably matched with the guide rod (43). The motor (41) is used to drive the screw rod (42). The slider (44) A groove (441) is provided at the top for accommodating the straight rod (323). The turning mechanism (5) comprises a gear (51) and a rack (52) that mesh with each other. The gear (51) is coaxially connected to the rotating shaft (36). The rack (52) is provided at the bottom of the slider (44). When the slider (44) moves in a direction away from the rotating shaft (36) and the rack (52) just disengages from the gear (51), the straight rod (323) just falls into the groove (441), and the template (35) is in close contact with the inner core plate.

7. The device for filling gaps between inner core circuits of a printed circuit board according to claim 1, characterized in that: It also includes a first conveying platform (6) and a second conveying platform (7), wherein the first conveying platform (6) is docked with one side of the operating platform (1) for conveying the tray (2) to a preset position on the operating platform (1), and the second conveying platform (7) is docked with one end of the operating platform (1), and the operating platform (1) is provided with a through groove (11) which runs through its table top from top to bottom, and the long axis direction of the through groove (11) is consistent with the conveying direction of the second conveying platform (7), and a pushing mechanism is provided at the through groove (11) for moving the tray (2) to the second conveying platform (7).

8. The device for filling gaps between inner core circuits of a printed circuit board according to claim 7, characterized in that: The four side walls of the tray (2) are each provided with a notch (21), the notch (21) passing through the tray (2) from top to bottom, and when the tray (2) is located at a preset position on the operating table (1), the through slot (11) is connected to two of the notches (21).

9. A method for filling the gap between inner core circuits of a printed circuit board, characterized in that: The device for filling the gap between the inner core board circuits of the printed circuit board according to claim 6 comprises the following steps: S1. placing a tray (2) loaded with an inner core board at a preset position on top of an operating table (1); S2, the motor (41) drives the screw rod (42) to move the slider (44) in a direction away from the rotating shaft (36). During this process, the rack (52) drives the gear (51), thereby causing the support frame (34) to flip down. When the rack (52) just leaves the gear (51), the straight rod (323) just falls into the groove (441), and the template (35) is in close contact with the inner core plate; S3, the resin box (31) releases a fixed amount of resin onto the template (35), the motor (41) continues to drive the screw (42), so that the resin box (31) and the scraper (32) move back and forth, and the scraper (32) fills the resin into the line gap of the inner core plate; S4, the motor (41) drives the driving shaft (36) in the reverse direction, so that the supporting frame (34) turns upward, and the straight rod (323) is separated from the groove (441), and the tray (2) is moved out.

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