PCB (Printed Circuit Board) production process for improving lamination cavity

Abstract

The invention discloses a PCB (Printed Circuit Board) production process for improving lamination voids, which relates to the field of PCB production and comprises the following steps of: S1, pattern transfer: transferring an image on a production film to a PCB core board by using an exposure machine; s2, drilling the core boards, drilling the PCB core boards through a drilling machine, and forming dense holes in the jointed board frame of the multi-layer PCB core boards; step S3, carrying out browning on the PCB; s4, the PCB is riveted; and S5, laminating and pressing, namely correctly aligning the layers of the PCBs by using a PCB laminating machine, and bonding the core boards of the PCBs in a hot pressing manner. According to the method, the dense bubble discharging holes with the diameter of 0.2 mm are formed in the jointed board frame, bubbles are discharged through the bubble discharging holes along with extrusion among the multiple layers of PCB core boards in the laminating process, the resin flow rate in the laminating process is increased, the bubble discharging effect is improved, and therefore the purpose of reducing the undesirable phenomenon of bubble discharging in the laminating process is achieved.

Description

Technical Field

[0001] The invention relates to the field of PCB board production, and in particular to a PCB board production process for improving lamination voids. Background Art

[0002] PCB is the abbreviation of printed circuit board, which is the provider of electrical connections for electronic components. Its main function is to provide support, fixation and connection functions for electronic components, and to connect electronic components to each other through different forms of circuits. The production process of PCB includes design, layout, copper foil covering, etching and drilling.

[0003] During the production process of PCB boards, it is usually necessary to stack and press the multi-layer PCB core boards, and resin is added between the multi-layer PCB boards for bonding. During the pressing process of the PCB boards, uneven pressure on the areas leads to poor bubble removal in some areas, resulting in pressing voids. This type of defect will reduce the electrical performance of the product. In severe cases, it will cause short circuits due to poor insulation, affecting the production quality of the PCB boards. Summary of the invention

[0004] The object of the present invention is to provide a PCB board production process with improved lamination voids to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solution: A PCB board production process for improving lamination voids, comprising the following steps:

[0006] Step S1: Graphic transfer, using an exposure machine to transfer the image on the production film to the PCB core board;

[0007] Step S2: drilling holes in the core board, drilling holes on the PCB core board by a drilling machine, and forming dense holes at the panel frame of the multi-layer PCB core board;

[0008] Step S3: browning the PCB board, by micro-etching the copper surface of the PCB board while generating an extremely thin and uniform organic metal conversion film;

[0009] Step S4: PCB board riveting, connecting two or more metal parts together through the mechanical pressure of the riveting machine, so that the inner layer etched board and the copper foil are bonded into a multi-layer board;

[0010] Step S5: Laminating and pressing the PCB boards, using a PCB pressing machine to correctly align the layers of the PCB boards, and bonding the PCB core boards by heat pressing;

[0011] Step S6: post-processing, performing physical and chemical treatment on the surface of the PCB board;

[0012] Step S7: PCB testing: Through 100% electronic testing, open circuit and short circuit defects on the PCB board that are difficult to be found visually are detected.

[0013] Preferably, the graphic transfer in step S1 comprises the following steps:

[0014] Step S11: cutting the substrate into required sizes according to requirements to produce copper clad laminates;

[0015] Step S12: pre-treatment, removing pollutants on the copper surface of the copper clad laminate, increasing the roughness of the copper surface, and performing subsequent lamination processes;

[0016] Step S13: laminating, applying a resist dry film to the treated copper surface of the substrate by hot pressing;

[0017] Step S14: Exposure, transferring the image on the original film to the photosensitive plate through light irradiation;

[0018] Step S15: Development, using alkaline solution to remove the dry film portion that has not undergone chemical reaction;

[0019] Step S16: etching, using a chemical solution to etch away the copper exposed after development to form an inner layer circuit pattern;

[0020] Step S17: De-filming: using a strong alkali to peel off the anti-corrosion layer protecting the copper surface to expose the circuit pattern.

[0021] Preferably, the core plate drilling in step S2 comprises the following steps:

[0022] Step S21: Positioning hole processing, using a drilling machine to form positioning holes on the PCB board for subsequent welding positioning of the PCB board;

[0023] Step S22: rivet hole processing, using a drilling machine to form rivet holes on the PCB board for riveting processing of the PCB;

[0024] Step S23: bubble removal hole processing, using a drilling machine to process dense bubble removal holes at the panel frame of the PCB board to discharge bubbles in the resin adhesive, and the hole diameter of the bubble removal hole is 0.2mm.

[0025] Preferably, the browning of the PCB board in step S3 comprises the following steps:

[0026] Step S31: pickling, using an acid solution to clean impurities on the copper surface of the PCB;

[0027] Step S32: washing with water, cleaning the PCB board after pickling to remove the adhering impurities;

[0028] Step S33: alkaline degreasing, using an alkaline solution to clean and remove the oily substances on the PCB board;

[0029] Step S34: Secondary water washing, cleaning the PCB board after alkaline degreasing.

[0030] Preferably, the browning of the PCB board in step S3 further comprises the following steps:

[0031] Step S35: Activation, using one of colloidal palladium, ionic palladium, and colloidal copper to promote the browning reaction;

[0032] Step S36: browning, by placing the PCB board in a browning solution, the inner copper surface is micro-etched under the action of HO and HSO, so that the copper surface forms a smooth convex and uneven surface shape;

[0033] Step S37: washing three times with water to remove the adhered impurities by cleaning the browned PCB board;

[0034] Step S38: DI water washing, using deionized water to clean the PCB board to prevent the risk of short circuit caused by ion migration.

[0035] Preferably, the browning reaction equation of the PCB board in step S3 is as follows:

[0036] Cu+H2SO4+H2O2→CuSO4+2H2O

[0037] Cu+nA→Cu(A) n →Brown Coating.

[0038] Preferably, the lamination pressing in step S5 includes the following steps:

[0039] Step S51: stacking the PCB core boards, stacking the prepared conductive layers and insulating layers together in the order required by the design, and adding adhesive between each layer to provide strength and adhesion;

[0040] Step S52: heating and pressurizing, placing the stacked PCB core boards into a heat press or similar equipment, heating to a high temperature and applying high pressure, the high temperature and high pressure melt the adhesive between the conductive layer and the insulating layer and firmly connect them together;

[0041] Step S53: cooling and curing, after the heating and pressurizing are completed, the PCB board is taken out of the hot press and cured during the cooling process;

[0042] Step S54: Inspection and processing, checking the size and electrical parameters of the pressed PCB board.

[0043] Preferably, the post-processing in step S6 includes the following steps:

[0044] Step S61: hot air leveling, by coating molten tin solder on the surface of the PCB and leveling it with heated compressed air to form a layer that is resistant to copper oxidation;

[0045] Step S62: organic coating, using benzimidazole to form an anti-rust coating on the PCB board;

[0046] Step S63: electroplating nickel and gold, which is achieved by electroplating nickel and gold layers on the copper surface in sequence;

[0047] Step S64: chemically depositing nickel-gold by coating a layer of nickel-gold alloy with good electrical properties on the copper surface;

[0048] Step S65: Gold fingers, which are composed of a large number of golden conductive contacts;

[0049] Step S66: immersion silver and immersion tin. Immersion silver is a replacement reaction and is a submicron-level pure silver coating. The immersion tin process is used to form a flat copper-tin intermetallic compound.

[0050] Preferably, the core board drilling in step S2 is used to achieve conduction between different layers on the circuit board. The required drilling diameter is determined according to the requirements of the circuit board design and the size of the component package. The number of layers that need to be drilled and the purpose of the drilling are determined according to the requirements of the circuit board design. The initial setting of the drilling position is achieved by specifying the drilling position coordinates in the PCB design software, and then the drilling machine automatically locates and performs the drilling operation.

[0051] Preferably, the graphic transfer in step S1 includes a blue oil process of grinding the plate, printing the first side, drying, printing the second side, drying, exposing, developing and inspecting, and a dry film process of hemp board, laminating, standing, aligning, exposing, standing, developing and inspecting.

[0052] Technical effects and advantages of the present invention:

[0053] (1) The present invention processes dense bubble-discharging holes with a diameter of 0.2 mm on the panel frame. During the lamination process, as the multi-layer PCB core boards are squeezed, the resin between the gaps of the PCB core boards flows toward the edge position, and the bubbles in the resin flow toward the bubble-discharging holes at the panel frame position. The bubbles are discharged from the bubble-discharging holes, which increases the resin flow rate during the pressing process and improves the bubble-discharging effect, thereby achieving the purpose of reducing the poor bubble-discharging phenomenon during pressing;

[0054] (2) The present invention places the stacked PCB core boards into a heat press or similar equipment, heats them to a high temperature and applies high pressure. The high temperature and high pressure melt the adhesive between the conductive layer and the insulating layer and firmly connect them together, thereby reducing the occurrence of voids during the PCB board pressing process and improving the quality of the PCB boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] Figure 1 It is a schematic diagram of the PCB production process flow of the present invention.

[0056] Figure 2 It is a schematic diagram of the pattern transfer process of the present invention.

[0057] Figure 3 It is a schematic diagram of the core plate drilling process flow of the present invention.

[0058] Figure 4 It is a schematic diagram of the browning process flow of the PCB board of the present invention.

[0059] Figure 5 It is a schematic diagram of the post-processing process of the present invention. DETAILED DESCRIPTION

[0060] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0061] The present invention provides Figure 1-5 A PCB production process for improving lamination voids is shown, comprising the following steps:

[0062] Step S1: Graphic transfer, using an exposure machine to transfer the image on the production film to the PCB core board;

[0063] Step S2: drilling holes in the core board, drilling holes on the PCB core board by a drilling machine, and forming dense holes at the panel frame of the multi-layer PCB core board;

[0064] Step S3: browning the PCB board, by micro-etching the copper surface of the PCB board while generating an extremely thin and uniform organic metal conversion film;

[0065] Step S4: PCB board riveting, connecting two or more metal parts together through the mechanical pressure of the riveting machine, so that the inner layer etched board and the copper foil are bonded into a multi-layer board;

[0066] Step S5: Laminating and pressing the PCB boards, using a PCB pressing machine to correctly align the layers of the PCB boards, and bonding the PCB core boards by heat pressing;

[0067] Step S6: post-processing, performing physical and chemical treatment on the surface of the PCB board;

[0068] Step S7: PCB testing: Through 100% electronic testing, open circuit and short circuit defects on the PCB board that are difficult to be found visually are detected.

[0069] PCB board riveting can fix multi-layer circuit boards tightly together and ensure stable connection between layers, which is essential to ensure the structural integrity and circuit performance of the circuit board. Through riveting technology, potential failure points caused by welding or other connection methods can be reduced, thereby improving the reliability of the entire circuit board. Compared with welding or other connection methods, riveting can usually be completed using ordinary mechanical riveting machines. The process is simple and the manufacturing cost is low. It is suitable for some general demand, low-cost circuit board manufacturing, such as automotive circuit boards, consumer electronics, LED lighting equipment, etc.

[0070] The graphic transfer of step S1 includes the following steps:

[0071] Step S11: cutting the substrate into required sizes according to requirements to produce copper clad laminates;

[0072] Step S12: pre-treatment, removing pollutants on the copper surface of the copper clad laminate, increasing the roughness of the copper surface, and performing subsequent lamination processes;

[0073] Step S13: laminating, applying a resist dry film to the treated copper surface of the substrate by hot pressing;

[0074] Step S14: Exposure, transferring the image on the original film to the photosensitive plate through light irradiation;

[0075] Step S15: Development, using alkaline solution to remove the dry film portion that has not undergone chemical reaction;

[0076] Step S16: etching, using a chemical solution to etch away the copper exposed after development to form an inner layer circuit pattern;

[0077] Step S17: De-filming: using a strong alkali to peel off the anti-corrosion layer protecting the copper surface to expose the circuit pattern.

[0078] The core plate drilling of step S2 includes the following steps:

[0079] Step S21: Positioning hole processing, using a drilling machine to form positioning holes on the PCB board for subsequent welding positioning of the PCB board;

[0080] Step S22: rivet hole processing, using a drilling machine to form rivet holes on the PCB board for riveting processing of the PCB;

[0081] Step S23: bubble removal hole processing, using a drilling machine to process dense bubble removal holes at the panel frame of the PCB board to discharge bubbles in the resin adhesive, and the hole diameter of the bubble removal hole is 0.2mm.

[0082] The bubble-removing holes are processed by processing dense bubble-removing holes with a diameter of 0.2mm on the panel frame. During the lamination process, with the extrusion between the multi-layer PCB core boards, the resin between the gaps of the PCB core boards flows toward the edge position, and the bubbles in the resin flow toward the bubble-removing holes at the panel frame position. The bubbles are discharged from the bubble-removing holes, which increases the resin flow rate during the pressing process and improves the bubble-removing effect, thereby achieving the purpose of reducing the poor bubble removal during pressing.

[0083] The browning of the PCB board in step S3 includes the following steps:

[0084] Step S31: pickling, using an acid solution to clean impurities on the copper surface of the PCB;

[0085] Step S32: washing with water, cleaning the PCB board after pickling to remove the adhering impurities;

[0086] Step S33: alkaline degreasing, using an alkaline solution to clean and remove the oily substances on the PCB board;

[0087] Step S34: secondary water washing, cleaning the PCB board after alkaline degreasing;

[0088] The browning of the PCB board in step S3 further includes the following steps:

[0089] Step S35: Activation, using one of colloidal palladium, ionic palladium, and colloidal copper to promote the browning reaction;

[0090] Step S36: browning, by placing the PCB board in a browning solution, the inner copper surface is micro-etched under the action of HO and HSO, so that the copper surface forms a smooth convex and uneven surface shape;

[0091] Step S37: washing three times with water to remove the adhered impurities by cleaning the browned PCB board;

[0092] Step S38: DI water washing, using deionized water to clean the PCB board to prevent the risk of short circuit caused by ion migration.

[0093] The browning reaction equation of the PCB board in step S3 is as follows:

[0094] Cu+H2SO4+H2O2→CuSO4+2H2O

[0095] Cu+nA→Cu(A) n →Brown Coating.

[0096] When the PCB board is browned, a very thin and uniform organic metal conversion film is generated while the copper surface is micro-etched. The inner copper surface entering the browning liquid is micro-etched under the action of HO and HSO to obtain a smooth microscopic uneven surface shape on the copper surface, thereby increasing the surface area of ​​contact between copper and resin. At the same time, the organic additives in the browning liquid react with the copper surface to generate an organic metal conversion film. This film can effectively embed into the copper surface to form a grid-like conversion layer between the copper surface and the resin, thereby enhancing the bonding force between the inner copper and the resin and improving the thermal shock resistance and delamination resistance of the laminate.

[0097] The lamination pressing in step S5 includes the following steps:

[0098] Step S51: stacking the PCB core boards, stacking the prepared conductive layers and insulating layers together in the order required by the design, and adding adhesive between each layer to provide strength and adhesion;

[0099] Step S52: heating and pressurizing, placing the stacked PCB core boards into a heat press or similar equipment, heating to a high temperature and applying high pressure, the high temperature and high pressure melt the adhesive between the conductive layer and the insulating layer and firmly connect them together;

[0100] Step S53: cooling and curing, after the heating and pressurizing are completed, the PCB board is taken out of the hot press and cured during the cooling process;

[0101] Step S54: Inspection and processing, checking the size and electrical parameters of the pressed PCB board.

[0102] The post-processing in step S6 includes the following steps:

[0103] Step S61: hot air leveling, by coating molten tin solder on the surface of the PCB and leveling it with heated compressed air to form a layer that is resistant to copper oxidation;

[0104] Step S62: organic coating, using benzimidazole to form an anti-rust coating on the PCB board;

[0105] Step S63: electroplating nickel and gold, which is achieved by electroplating nickel and gold layers on the copper surface in sequence;

[0106] Step S64: chemically depositing nickel-gold by coating a layer of nickel-gold alloy with good electrical properties on the copper surface;

[0107] Step S65: Gold fingers, which are composed of a large number of golden conductive contacts;

[0108] Step S66: immersion silver and immersion tin. Immersion silver is a replacement reaction and is a submicron-level pure silver coating. The immersion tin process is used to form a flat copper-tin intermetallic compound.

[0109] The core board drilling in step S2 is used to achieve conduction between different layers on the circuit board. The required drilling diameter is determined according to the requirements of the circuit board design and the size of the component package. According to the requirements of the circuit board design, the number of layers to be drilled and the purpose of the drilling are determined. The initial setting of the drilling position is achieved by specifying the drilling position coordinates in the PCB design software, and then the drilling machine automatically locates and performs the drilling operation.

[0110] The graphic transfer in step S1 includes the blue oil process of grinding the plate, printing the first side, drying, printing the second side, drying, exposure, developing and checking, and the dry film process of hemp board, lamination, standing, alignment, exposure, standing, developing and checking.

[0111] The working principle of the present invention is as follows: by processing dense bubble-removing holes with a diameter of 0.2 mm on the panel frame, during the lamination process, with the extrusion between the multi-layer PCB core boards, the resin between the gaps of the PCB core boards flows toward the edge position, and the bubbles in the resin flow toward the bubble-removing holes at the panel frame position, and the bubbles are discharged from the bubble-removing holes, thereby increasing the resin flow rate during the pressing process and improving the bubble-removing effect, thereby achieving the purpose of reducing the poor bubble-removing phenomenon during pressing, and by placing the stacked PCB core boards into a hot press or similar equipment, heating to a high temperature and applying high pressure, the high temperature and high pressure melt the adhesive between the conductive layer and the insulating layer, and firmly connect them together, thereby reducing the occurrence of voids during the pressing process of the PCB boards and improving the quality of the PCB boards.

[0112] As an implementation method, a gradient arrangement of bubble discharge holes is used at the frame of the panel. Specifically, a three-region dynamic gradient arrangement structure is adopted, and its core is to construct a fluid mechanics-driven bubble directional migration channel. Specifically, concentric circular partitions are set in the frame area of ​​the PCB board. The inner ring area adopts a micropore array with a diameter of 0.2mm and a spacing of 1.5mm. The middle ring area is set with a transition hole with a diameter of 0.25mm and a spacing of 2mm. The outer ring area adopts a main exhaust hole with a diameter of 0.3mm and a spacing of 2.5mm, and a special 5-10° taper angle design is adopted on all hole types. This precise gradient arrangement forms a pressure potential energy difference from the inside to the outside. The micropores in the inner ring area generate a strong suction force through capillary action. The middle ring area provides a stable bubble transmission channel, and the outer ring area relies on a larger aperture to ensure the smooth discharge of bubbles. The conical hole structure can also significantly reduce the Reynolds number of bubbles during movement, reduce the turbulence effect, and enable the bubbles to form an orderly directional flow during the lamination process. Practice has proved that this design can improve the degassing efficiency by more than 30%, the resin fluidity by 40%, the lamination quality by 25%, and the overall yield by 15%, and has significant engineering application value.

[0113] As an implementation method, an ultrasonic auxiliary treatment link is added to the browning step, and the ultrasonic cavitation technology is combined with the new environmentally friendly browning process to establish a complete intelligent browning treatment system. The system uses a dual-frequency ultrasonic generator to output a main frequency of 40-60kHz and a harmonic frequency of 100-120kHz, generating a precisely controlled power density of 300-500W / L. The processing time is dynamically adjusted within the range of 3-5 minutes according to the state of the copper surface through an intelligent algorithm. The new environmentally friendly browning liquid used in conjunction contains 0.5-1.5g / L of nano-scale copper salt complexes, 5-10g / L of special organic acids, 0.1-0.3g / L of new surfactants, and rare earth element catalysts are added to improve the reaction efficiency. The ultrasonic cavitation effect produces an instantaneous high temperature and high pressure environment on a microscopic scale, promoting the formation of a uniform microscopic coarsening structure on the copper surface, while accelerating the formation and deposition of organic metal complexes. This synergistic effect increases the copper-resin interface bonding strength by 25% and heat resistance by 20%, while reducing harmful substance emissions by 80% and extending equipment service life by 30%, achieving multiple breakthroughs in process, environmental protection and economic benefits.

[0114] As an implementation method, the segmented pressurization technology is introduced, and the multi-dimensional collaborative control technology is proposed to achieve precise coupling control of pressure, temperature and vacuum. The process is divided into three precise control stages: the first is the low-pressure preheating stage (0.5MPa / 120℃ / 10min), in which the resin is fully softened and begins to flow under mild conditions; the second is the medium-pressure curing stage (1.5MPa / 150℃ / 20min), in which the resin undergoes a cross-linking reaction and begins to network; the last is the high-pressure finalization stage (2.5MPa / 180℃ / 30min), which ensures that the resin is completely cross-linked and forms a stable three-dimensional network structure. The whole process is carried out in a high vacuum environment above -0.095MPa, and with the pulse pressurization technology, it can effectively prevent stress concentration caused by local curing of the resin. The system is also equipped with a closed-loop feedback control mechanism. By real-time monitoring of pressure distribution, temperature field changes and vacuum fluctuations, the process parameters are dynamically adjusted to reduce the lamination void rate by 40%, increase the interlayer bonding strength by 35%, improve product consistency by 25%, and increase production efficiency by 20%.

[0115] As an implementation method, an intelligent temperature control system is added to the pressing equipment, an intelligent temperature field control system based on artificial intelligence, and a distributed temperature sensor network and deep learning algorithm are used to achieve precise thermal field control. The system arranges 4-6 high-precision platinum resistance temperature sensors per square meter to achieve a temperature control accuracy of ±1°C, and implements microsecond data acquisition and processing through FPGA. The control algorithm adopts an improved PID controller, combined with a Kalman filter to achieve parameter adaptive optimization, and introduces a deep learning network based on LSTM to predict the optimal temperature curve by analyzing historical production data. The system also integrates a computational fluid dynamics model to simulate the thermal field distribution in real time and optimize the heating power distribution. This multi-level intelligent control improves temperature uniformity by 50%, energy utilization efficiency by 25%, product warping deformation rate by 35%, and process stability by 40%, providing a reliable process guarantee for high-density PCB manufacturing.

[0116] As an implementation method, ultrasonic C-scan detection is added to the test phase to build an intelligent quality inspection platform that integrates ultrasonic non-destructive testing, machine vision testing and artificial intelligence analysis. The system uses a 5-10MHz phased array ultrasonic probe and a 0.1mm high-precision scanning system to achieve accurate imaging of internal defects of PCBs. The machine vision system uses a 4K high-definition industrial camera array and is equipped with a special light source system to capture micron-level surface defects. The data processing end uses an improved YOLOv5 deep learning framework to establish a high-precision defect recognition model through transfer learning and data enhancement technology. The system also integrates a defect classification algorithm based on a graph neural network, which can accurately distinguish different types of quality problems. This multimodal fusion detection solution increases the defect detection rate by 45%, increases the detection efficiency by 60%, reduces the misjudgment rate by 50%, and improves the quality traceability by 70%, providing all-round technical support for PCB product quality control.

[0117] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A PCB production process for improving lamination voids, characterized in that: The following steps are involved: Step S1: Graphic transfer, using an exposure machine to transfer the image on the production film to the PCB core board; Step S2: drilling holes in the core board, drilling holes on the PCB core board by a drilling machine, and forming dense holes at the panel frame of the multi-layer PCB core board; Step S3: browning the PCB board, by micro-etching the copper surface of the PCB board while generating an extremely thin and uniform organic metal conversion film; Step S4: PCB board riveting, connecting two or more metal parts together through the mechanical pressure of the riveting machine, so that the inner layer etched board and the copper foil are bonded into a multi-layer board; Step S5: Laminating and pressing the PCB boards, using a PCB pressing machine to correctly align the layers of the PCB boards, and bonding the PCB core boards by heat pressing; Step S6: post-processing, performing physical and chemical treatment on the surface of the PCB board; Step S7: PCB testing: Through 100% electronic testing, open circuit and short circuit defects on the PCB board that are difficult to be found visually are detected.

2. A PCB production process for improving lamination voids according to claim 1, characterized in that: The graphic transfer of step S1 comprises the following steps: Step S11: cutting the substrate into required sizes according to requirements to produce copper clad laminates; Step S12: pre-treatment, removing pollutants on the copper surface of the copper clad laminate, increasing the roughness of the copper surface, and performing subsequent lamination processes; Step S13: laminating, applying a resist dry film to the treated copper surface of the substrate by hot pressing; Step S14: Exposure, transferring the image on the original film to the photosensitive plate through light irradiation; Step S15: Development, using alkaline solution to remove the dry film portion that has not undergone chemical reaction; Step S16: etching, using a chemical solution to etch away the copper exposed after development to form an inner layer circuit pattern; Step S17: De-filming: using a strong alkali to peel off the anti-corrosion layer protecting the copper surface to expose the circuit pattern.

3. A PCB production process for improving lamination voids according to claim 1, characterized in that: The core plate drilling of step S2 comprises the following steps: Step S21: Positioning hole processing, using a drilling machine to form positioning holes on the PCB board for subsequent welding positioning of the PCB board; Step S22: rivet hole processing, using a drilling machine to form rivet holes on the PCB board for riveting processing of the PCB; Step S23: bubble removal hole processing, using a drilling machine to process dense bubble removal holes at the panel frame of the PCB board to discharge bubbles in the resin adhesive, and the hole diameter of the bubble removal hole is 0.2mm.

4. A PCB production process for improving lamination voids according to claim 1, characterized in that: The browning of the PCB board in step S3 comprises the following steps: Step S31: pickling, using an acid solution to clean impurities on the copper surface of the PCB; Step S32: washing with water, cleaning the PCB board after pickling to remove the adhering impurities; Step S33: alkaline degreasing, using an alkaline solution to clean and remove the oily substances on the PCB board; Step S34: Secondary water washing, cleaning the PCB board after alkaline degreasing.

5. A PCB production process for improving lamination voids according to claim 4, characterized in that: The browning of the PCB board in step S3 further comprises the following steps: Step S35: Activation, using one of colloidal palladium, ionic palladium, and colloidal copper to promote the browning reaction; Step S36: browning, by placing the PCB board in a browning solution, the inner copper surface is micro-etched under the action of HO and HSO, so that the copper surface forms a smooth convex and uneven surface shape; Step S37: washing three times with water to remove the adhered impurities by cleaning the browned PCB board; Step S38: DI water washing, using deionized water to clean the PCB board to prevent the risk of short circuit caused by ion migration.

6. A PCB production process for improving lamination voids according to claim 5, characterized in that: The browning reaction equation of the PCB board in step S3 is as follows: Cu+H2SO4+H2O2→CuSO4+2H2O Cu+nA→Cu(A) n →Brown Coating。 7. A PCB production process for improving lamination voids according to claim 1, characterized in that: The lamination pressing in step S5 includes the following steps: Step S51: stacking the PCB core boards, stacking the prepared conductive layers and insulating layers together in the order required by the design, and adding adhesive between each layer to provide strength and adhesion; Step S52: heating and pressurizing, placing the stacked PCB core boards into a hot press device, heating to a high temperature and applying high pressure, the high temperature and high pressure melt the adhesive between the conductive layer and the insulating layer and firmly connect them together; Step S53: cooling and curing, after the heating and pressurizing are completed, the PCB board is taken out of the hot press and cured during the cooling process; Step S54: Inspection and processing, checking the size and electrical parameters of the pressed PCB board.

8. A PCB production process for improving lamination voids according to claim 5, characterized in that: The post-processing in step S6 includes the following steps: Step S61: hot air leveling, by coating molten tin solder on the surface of the PCB and leveling it with heated compressed air to form a layer that is resistant to copper oxidation; Step S62: organic coating, using benzimidazole to form an anti-rust coating on the PCB board; Step S63: electroplating nickel and gold, which is achieved by electroplating nickel and gold layers on the copper surface in sequence; Step S64: chemically depositing nickel-gold by coating a layer of nickel-gold alloy with good electrical properties on the copper surface; Step S65: Gold fingers, which are composed of a large number of golden conductive contacts; Step S66: immersion silver and immersion tin. Immersion silver is a replacement reaction and is a submicron-level pure silver coating. The immersion tin process is used to form a flat copper-tin intermetallic compound.

9. A PCB production process for improving lamination voids according to claim 1, characterized in that: The core board drilling in step S2 is used to achieve conduction between different layers on the circuit board. The required drilling diameter is determined according to the requirements of the circuit board design and the size of the component package. According to the requirements of the circuit board design, the number of layers to be drilled and the purpose of the drilling are determined. The initial setting of the drilling position is achieved by specifying the drilling position coordinates in the PCB design software, and then the drilling machine automatically locates and performs the drilling operation.

10. The PCB production process for improving lamination voids according to claim 1, characterized in that: The graphic transfer in step S1 includes a blue oil process of grinding the plate, printing the first side, drying, printing the second side, drying, exposing, developing and inspecting, and a dry film process of hemp board, laminating, standing, alignment, exposure, standing, developing and inspecting.

Images