Miniature LED device preparation method, miniature LED device and display device

Abstract

The invention provides a miniature LED device preparation method, a miniature LED device and a display device. The method comprises the steps that a miniature LED chip structure is obtained, the miniature LED chip structure comprises a miniature LED chip, and the miniature LED chip comprises a miniature LED unit array composed of a plurality of miniature LED units; a first reflecting layer is arranged on the light emitting side of the micro LED chip; a first partition layer is arranged on the first reflecting layer, so that the first partition layer comprises a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, the first through hole array comprises a plurality of groups of first through holes, and each group of first through holes comprises at least two first through holes; each group of first through holes are filled with a photoluminescent material layer, the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, and the first reflecting layer is used for reflecting the light of the color corresponding to the photoluminescent material layer to obtain the micro LED device.

Description

Technical Field

[0001] The present disclosure relates to the technical field of semiconductor Micro LED, and in particular, to a method for preparing a Micro LED device, a Micro LED device and a display device. Background Art

[0002] Micro-LED is a comprehensive technology that integrates new display technology and light-emitting diode (LED) technology. It has the advantages of small size, high brightness, high resolution, and low power consumption. It is considered to be one of the most promising next-generation new display and light-emitting devices. Currently, Micro LED full-color display can be achieved in a variety of ways, one of which is the color conversion method. However, the full-color Micro LED device achieved by the color conversion method still has problems such as unsatisfactory display effects. Summary of the invention

[0003] The solution disclosed herein provides a method for preparing a micro LED device, a micro LED device, and a display device.

[0004] According to one aspect of an embodiment of the present disclosure, a method for preparing a micro LED device is provided, wherein the method comprises: obtaining a micro LED chip structure, wherein the micro LED chip structure comprises a micro LED chip, and the micro LED chip comprises a micro LED unit array composed of a plurality of micro LED units; providing a first reflective layer on a light emitting side of the micro LED chip; providing a first barrier layer on the first reflective layer, so that the first barrier layer comprises a first through hole array, and the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array comprises a plurality of groups of first through holes, and each group of first through holes comprises at least two first through holes; filling a photoluminescent material layer in each group of first through holes, wherein the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, and the first reflective layer is used to reflect light of the color corresponding to the photoluminescent material layer, so as to obtain a micro LED device.

[0005] Further, a first barrier layer is arranged on the first reflective layer, so that the first barrier layer includes a first through hole array, and the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes multiple groups of first through holes, and each group of first through holes includes at least two first through holes. The first through holes include: a first barrier layer is arranged on the first reflective layer, and a first through hole array is opened on the first barrier layer, so that the first through hole array exposes the first reflective layer, wherein the first through hole array includes multiple groups of first through holes, each group of first through holes includes three first through holes, and the three first through holes include a first first through hole, a second first through hole and a third first through hole. The photoluminescent material layer includes a photoluminescent material layer of a first color and a photoluminescent material layer of a second color, and the photoluminescent material layer is filled in each group of first through holes, wherein the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, and the first reflective layer is used to reflect the light of the color corresponding to the photoluminescent material layer, including: filling the first first through hole in each group of first through holes with the photoluminescent material layer of the first color, and filling the second first through hole in each group of first through holes with the photoluminescent material layer of the second color, wherein the micro LED unit emits light of a third color, and the light corresponding to the first color, the light corresponding to the second color, and the light of the third color are synthesized to obtain white light, and the first reflective layer is used to reflect the light of the first color and the light of the second color.

[0006] Further, after each group of first through holes is filled with the photoluminescent material layer, the method further comprises: arranging a second barrier layer on the first barrier layer and the photoluminescent material layer, and opening a second through hole array on the second barrier layer, so that the second through hole array is aligned with the first through hole array, and the second through hole array exposes the photoluminescent material layer, wherein the second through hole array comprises a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, and each group of second through holes comprises a first second through hole aligned with the first first through hole, a second second through hole aligned with the second first through hole, and a third second through hole aligned with the third first through hole; a first filling step, wherein the first filling step comprises the following steps: At least one of the steps: filling a first filling portion in a first second through hole in each group of second through holes, the first filling portion comprising a first filter layer that only allows light of the first color to pass through, a first light absorbing layer or a transparent material for partially absorbing light of a third color; filling a second filling portion in a second second through hole in each group of second through holes, the second filling portion comprising a second filter layer that only allows light of the second color to pass through, a first light absorbing layer or a transparent material for partially absorbing light of the third color; filling a third filling portion in a third second through hole in each group of second through holes, the third filling portion comprising a third filter layer that only allows light of the third color to pass through, a first light absorbing layer or a transparent material for partially absorbing light of the third color.

[0007] Furthermore, the first filling step further comprises: when there are unfilled second through holes in each group of second through holes, filling the unfilled second through holes with a transparent material.

[0008] Further, a first barrier layer is arranged on the first reflective layer, so that the first barrier layer includes a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes multiple groups of first through holes, and each group of first through holes includes at least two first through holes. The first through holes include: a first barrier layer is arranged on the first reflective layer, and a first through hole array is opened on the first barrier layer, so that the first through hole array exposes the first reflective layer, wherein the first through hole array includes multiple groups of first through holes, and each group of first through holes includes two first through holes. The photoluminescent material layer includes a photoluminescent material layer of a fourth color, and the photoluminescent material layer is filled in each group of first through holes, wherein the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, and the first reflective layer is used to reflect the light of the color corresponding to the photoluminescent material layer, including: filling a photoluminescent material layer of a fourth color in a first through hole in each group of first through holes, wherein the micro LED unit emits light of a third color, and white light is obtained by synthesizing the light of the fourth color and the light of the third color, and the first reflective layer is used to reflect the light of the fourth color.

[0009] Further, after each group of first through holes is filled with the photoluminescent material layer, the method further includes: arranging a second barrier layer on the first barrier layer and the photoluminescent material layer, and opening a second through hole array on the second barrier layer, so that the second through hole array is aligned with the first through hole array, and the second through hole array exposes the photoluminescent material layer, wherein the second through hole array includes a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, and each group of second through holes includes two second through holes respectively aligned with two first through holes; a second filling step, the second filling step including at least one of the following steps: filling a fourth filling part in a second through hole in each group of second through holes aligned with a first through hole filled with the photoluminescent material layer of a fourth color, the fourth filling part including a fourth filter layer that only allows light of the fourth color to pass through, a first light absorbing layer for partially absorbing light of the third color, or a transparent material; filling a fifth filling part in another second through hole in each group of second through holes, the fifth filling part including a third filter layer that only allows light of the third color to pass through, a first light absorbing layer for partially absorbing light of the third color, or a transparent material.

[0010] Furthermore, the second filling step further comprises: when there are unfilled second through holes in each group of second through holes, filling the unfilled second through holes with a transparent material.

[0011] Furthermore, when filling the photoluminescent material layer in each group of first through holes, the method also includes: filling a sixth filling portion in a first through hole other than the first through hole filled with the photoluminescent material layer in each group of first through holes, the sixth filling portion comprising a second light absorbing layer, a photoluminescent material layer of a third color, or a transparent material, and the second light absorbing layer is used to partially absorb the light emitted by the micro LED unit.

[0012] Furthermore, after filling the photoluminescent material layer in each group of first through holes, the method further includes: arranging a third light absorbing layer on the first barrier layer and the photoluminescent material layer, wherein the third light absorbing layer is used to partially absorb the light emitted by the micro LED unit.

[0013] Furthermore, after each group of first through holes is filled with a photoluminescent material layer, the method further comprises: arranging a transparent cover plate on the first barrier layer and the photoluminescent material layer.

[0014] Furthermore, before the first reflective layer is provided on the light-emitting side of the micro LED chip, the method further comprises: providing an insulating layer on the light-emitting side of the micro LED chip. Providing the first reflective layer on the light-emitting side of the micro LED chip comprises: providing the first reflective layer on the insulating layer.

[0015] According to another aspect of the present disclosure, a micro LED device is also provided. The micro LED device comprises: a micro LED chip structure, the micro LED chip structure comprises a micro LED chip, the micro LED chip comprises a micro LED unit array composed of a plurality of micro LED units; a first reflective layer, the first reflective layer is arranged on the light-emitting side of the micro LED chip; a first barrier layer, the first barrier layer is arranged on the first reflective layer, the first barrier layer comprises a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array comprises a plurality of groups of first through holes, each group of first through holes comprises at least two first through holes; a photoluminescent material layer, the photoluminescent material layer is filled in each group of first through holes, wherein the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, and the first reflective layer is used to reflect the light of the color corresponding to the photoluminescent material layer.

[0016] Further, the first through hole array exposes the first reflective layer, wherein each group of first through holes in the first through hole array includes three first through holes, the three first through holes include a first first through hole, a second first through hole and a third first through hole, the photoluminescent material layer includes a photoluminescent material layer of a first color and a photoluminescent material layer of a second color, the photoluminescent material layer of the first color is filled in the first first through hole in each group of first through holes, and the photoluminescent material layer of the second color is filled in the second first through hole in each group of first through holes, the micro LED unit emits light of a third color, and the light corresponding to the first color, the light corresponding to the second color and the light of the third color are synthesized to obtain white light, and the first reflective layer is used to reflect the light of the first color and the light of the second color.

[0017] Further, the micro LED device also includes a second barrier layer, which is arranged on the first barrier layer and the photoluminescent material layer, and the second barrier layer includes a second through hole array, the second through hole array is aligned with the first through hole array, the second through hole array exposes the photoluminescent material layer, the second through hole array includes a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, each group of second through holes includes a first second through hole aligned with the first first through hole, a second second through hole aligned with the second first through hole, and a third second through hole aligned with the third first through hole. The micro LED device also includes at least one of a first filling part, a second filling part and a third filling part, wherein: the first filling part is used to fill the first second through hole in each group of second through holes, and the first filling part includes a first filter layer that only allows light of the first color to pass through, and a first light absorbing layer or a transparent material for partially absorbing light of the third color; the second filling part is used to fill the second second through hole in each group of second through holes, and the second filling part includes a second filter layer that only allows light of the second color to pass through, and a first light absorbing layer or a transparent material for partially absorbing light of the third color; the third filling part is used to fill the third second through hole in each group of second through holes, and the third filling part includes a third filter layer that only allows light of the third color to pass through, and a first light absorbing layer or a transparent material for partially absorbing light of the third color.

[0018] Further, when there is an unfilled second through hole in each group of second through holes, the micro LED device further includes a transparent material, and the transparent material is filled in the unfilled second through hole.

[0019] Further, the first color is red, the second color is green and the third color is blue.

[0020] Further, the first through hole array exposes the first reflective layer, wherein the first through hole array includes multiple groups of first through holes, each group of first through holes includes two first through holes, the photoluminescent material layer includes a photoluminescent material layer of a fourth color, the photoluminescent material layer of the fourth color is filled in one first through hole in each group of first through holes, the micro LED unit emits light of a third color, and white light is obtained by synthesizing the light of the fourth color and the light of the third color, and the first reflective layer is used to reflect the light of the fourth color.

[0021] Further, the micro LED device further comprises a second barrier layer, the second barrier layer is disposed on the first barrier layer and the photoluminescent material layer, and the second barrier layer comprises a second through hole array, the second through hole array is aligned with the first through hole array, and the second through hole array exposes the photoluminescent material layer, wherein the second through hole array comprises a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, and each group of second through holes comprises two second through holes respectively aligned with two first through holes. The micro LED device further comprises at least one of a fourth filling part and a fifth filling part, wherein: the fourth filling part is used to fill the second through hole in each group of second through holes aligned with the first through hole filled with the photoluminescent material layer of the fourth color, the fourth filling part comprises a fourth filter layer that only allows the light of the fourth color to pass through, a first light absorbing layer or a transparent material that partially absorbs the light of the third color; the fifth filling part is used to fill another second through hole in each group of second through holes, the fifth filling part comprises a third filter layer that only allows the light of the third color to pass through, a first light absorbing layer or a transparent material that partially absorbs the light of the third color.

[0022] Further, when there is an unfilled second through hole in each group of second through holes, the micro LED device further includes a transparent material, and the transparent material is filled in the unfilled second through hole.

[0023] Further, the fourth color is yellow and the third color is blue.

[0024] Furthermore, the micro LED device also includes a sixth filling portion, which fills the first through hole other than the first through hole filled with the photoluminescent material layer in each group of first through holes, and the sixth filling portion includes a second light absorbing layer, a photoluminescent material layer of a third color or a transparent material, and the second light absorbing layer is used to partially absorb the light emitted by the micro LED unit.

[0025] Furthermore, the micro LED device further comprises a third light absorbing layer, wherein the third light absorbing layer is disposed on the first barrier layer and the photoluminescent material layer, and the third light absorbing layer is used for partially absorbing the light emitted by the micro LED unit.

[0026] Furthermore, the micro LED device further includes a transparent cover plate, and the transparent cover plate is disposed on the first barrier layer and the photoluminescent material layer.

[0027] Furthermore, the micro LED device also includes an insulating layer, which is arranged on the light-emitting side of the micro LED chip, and the first reflective layer is arranged on the insulating layer.

[0028] Furthermore, the micro LED chip structure also includes a driver chip, and the side of the micro LED chip opposite to the light emitting side is arranged on the driver chip, or the micro LED chip structure also includes a driver chip and a flexible circuit board, and the side of the micro LED chip opposite to the light emitting side is arranged on the driver chip to form a micro LED module, and the micro LED module is arranged on the flexible circuit board through the driver chip.

[0029] Further, the first reflective layer includes a distributed Bragg reflector for reflecting light of a color corresponding to the photoluminescent material layer, the material of the first barrier layer and the material of the second barrier layer include a visible light shielding material, the material of the photoluminescent material layer of the first color and the material of the photoluminescent material layer of the second color include at least one of II-VI group quantum dots, III-V group quantum dots, perovskite quantum dots and carbon quantum dots, the material of the first light absorption layer includes an organic dye, nano absorption particles or inorganic oxide for absorbing blue light, and the material of the first filter layer, the second filter layer and the third filter layer include organic dyes, nano absorption particles or inorganic oxides.

[0030] According to another aspect of the embodiments of the present disclosure, a display device is provided, comprising the above-mentioned micro LED device.

[0031] By applying the technical solution of the present disclosure, a micro LED chip is obtained, a first reflective layer is arranged on the micro LED chip, and a first barrier layer is arranged on the first reflective layer, each group of first through holes included in the first barrier layer includes at least two first through holes, and then a photoluminescent material layer is filled in each group of first through holes to form a micro LED device.

[0032] In the micro LED device, the light emitted by the micro LED unit of the micro LED chip excites the material in the photoluminescent material layer to emit light of a color different from that of the light emitted by the micro LED unit. The first reflective layer is used to reflect light of a color corresponding to the photoluminescent material layer. Since the first reflective layer covers the photoluminescent material layer and is located between the photoluminescent material layer and the micro LED chip, the light emitted from the micro LED unit can pass through the first reflective layer. When the light emitted by the micro LED unit excites the photoluminescent material layer to emit light, part of the excited light will be emitted toward the direction of the micro LED unit. The first reflective layer can reflect the part of the light toward the direction of the photoluminescent material layer, thereby increasing the light output of the light of the color corresponding to the photoluminescent material layer, thereby improving the brightness of the micro LED, and preventing part of the light emitted toward the micro LED unit from interfering with the light emitted by the micro LED unit, thereby improving the display effect of the micro LED device. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] By reading the detailed description below with reference to the accompanying drawings, the above and other purposes, features and advantages of the exemplary embodiments of the present disclosure will become readily understood. In the accompanying drawings, several embodiments of the present disclosure are shown in an exemplary and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0034] Figure 1 is a flow chart showing a method for preparing a micro LED device according to one embodiment of the present disclosure;

[0035] Figures 2 to 11 is a schematic diagram showing a preparation process flow of a method for preparing a micro LED device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0036] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present disclosure will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0037] It should be noted that the following detailed descriptions are illustrative and are intended to provide further explanation of the present application. Unless otherwise specified, all technical and scientific terms used herein have the same meanings as those commonly understood by those skilled in the art to which the present application belongs.

[0038] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" may include both "above" and "below". The device may also be positioned in other different ways, rotated 90 degrees or in other orientations, and the spatially relative descriptions used herein are interpreted accordingly.

[0039] Now, exemplary embodiments according to the present disclosure will be described in more detail with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in a variety of different forms and should not be construed as being limited to the embodiments described herein. It should be understood that these embodiments are provided to make the disclosure of the present application thorough and complete, and to fully convey the concepts of these exemplary embodiments to those of ordinary skill in the art. In the accompanying drawings, for clarity, the thickness of the layers and regions is enlarged, and the same reference numerals are used to represent the same devices, and thus their descriptions will be omitted.

[0040] The present invention provides a method for preparing a micro LED device. Figures 1 to 11 , Figure 1 is a flow chart showing a method for preparing a micro LED device according to one embodiment of the present disclosure; Figures 2 to 11 is a schematic diagram showing a preparation process flow of a method for preparing a micro LED device according to an embodiment of the present disclosure.

[0041] like Figure 1 As shown, the method for preparing a micro LED device includes the following steps S101-S104.

[0042] Step S101: Acquire a micro LED chip structure, wherein the micro LED chip structure comprises a micro LED chip, and the micro LED chip comprises a micro LED unit array composed of a plurality of micro LED units.

[0043] Step S102: Setting a first reflective layer on the light-emitting side of the micro LED chip.

[0044] Step S103: Disposing a first barrier layer on the first reflective layer, so that the first barrier layer includes a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes multiple groups of first through holes, and each group of first through holes includes at least two first through holes.

[0045] Step S104: Filling a photoluminescent material layer in each group of first through holes, wherein the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, and the first reflective layer is used to reflect the light of the color corresponding to the photoluminescent material layer, to obtain a micro LED device.

[0046] According to the technical solution, a micro LED device can be formed by obtaining a micro LED chip, setting a first reflective layer on the micro LED chip, and setting a first barrier layer on the first reflective layer, wherein each group of first through holes included in the first barrier layer includes at least two first through holes, and then filling each group of first through holes with a photoluminescent material layer.

[0047] In the micro LED device, the light emitted by the micro LED unit of the micro LED chip excites the material in the photoluminescent material layer to emit light of a color different from that of the light emitted by the micro LED unit. The first reflective layer is used to reflect light of a color corresponding to the photoluminescent material layer. Since the first reflective layer covers the photoluminescent material layer and is located between the photoluminescent material layer and the micro LED chip, the light emitted from the micro LED unit can pass through the first reflective layer. When the light emitted by the micro LED unit excites the photoluminescent material layer to emit light, part of the excited light will be emitted toward the direction of the micro LED unit. The first reflective layer can reflect the part of the light toward the direction of the photoluminescent material layer, thereby increasing the light output of the light of the color corresponding to the photoluminescent material layer, thereby improving the brightness of the micro LED, and preventing part of the light emitted toward the micro LED unit from interfering with the light emitted by the micro LED unit, thereby improving the display effect of the micro LED device.

[0048] In step S101, a micro LED chip structure may be acquired, wherein the micro LED chip structure includes a micro LED chip, and the micro LED chip includes a micro LED unit array composed of a plurality of micro LED units.

[0049] According to an embodiment of the present disclosure, a micro LED chip structure can be first obtained. The micro LED chip structure includes a micro LED chip, and the micro LED chip includes a micro LED unit array for emitting light. Among them, the micro LED chip can be any micro LED chip suitable for preparing a micro LED device. For example, the structure of the micro LED chip can include a face-up structure, a flip-chip structure or a vertical structure, etc., which is not limited here. Each micro LED unit in the micro LED unit array can include an exposed first semiconductor layer on its light-emitting side. Depending on the type of the micro LED device, in some embodiments, the first semiconductor layer may include an N-GaN layer; in other embodiments, the first semiconductor layer may include a P-GaN layer.

[0050] Reference Figure 2-Figure 11 ,in Figure 2 FIG. 4 shows a side view of a micro LED chip structure according to an embodiment of the present disclosure. Figure 2 As shown, the micro LED chip structure includes a micro LED chip 20, and the micro LED chip 20 includes a micro LED unit array 201 composed of micro LED units 2011. Each micro LED unit 2011 in the micro LED unit array 201 includes a first semiconductor layer 20111 such as an N-GaN layer on the light emitting side. Figure 2 As shown, the first semiconductor layer 20111 is common to each micro LED unit 2011 in the micro LED unit array 201 , that is, the first semiconductor layer 20111 is integrated in the micro LED chip 20 .

[0051] According to an embodiment of the present disclosure, the micro LED chip structure may further include a driving chip, and the side of the micro LED chip opposite to the light emitting side is arranged on the driving chip, or the micro LED chip structure also includes a driving chip and a flexible circuit board, and the side of the micro LED chip opposite to the light emitting side is arranged on the driving chip to form a micro LED module, and the micro LED module is arranged on the flexible circuit board through the driving chip.

[0052] In step S102 , a first reflective layer may be disposed on the light emitting side of the micro LED chip.

[0053] According to an embodiment of the present disclosure, after obtaining a micro LED chip, a first reflective layer may be provided on the micro LED chip. The first reflective layer includes a distributed Bragg reflector for reflecting light of a color corresponding to the photoluminescent material layer, and the distributed Bragg reflector may reflect light of at least one color, and the photoluminescent material layer will be described in a subsequent step. The first reflective layer may be, for example, a distributed Bragg reflector formed by alternately stacking silicon dioxide layers and titanium dioxide layers.

[0054] According to an embodiment of the present disclosure, before the first reflective layer is provided on the light-emitting side of the micro LED chip, the method further includes: providing an insulating layer on the light-emitting side of the micro LED chip. Providing the first reflective layer on the light-emitting side of the micro LED chip includes: providing the first reflective layer on the insulating layer.

[0055] As described in step S101, when each micro LED unit in the micro LED unit array includes a first semiconductor layer on the light emitting side, setting an insulating layer on the light emitting side of the micro LED chip includes: setting an insulating layer on the first semiconductor layer on the light emitting side of the micro LED chip.

[0056] Reference Figure 2-Figure 11 ,in Figure 3 FIG. 4 shows a side view schematic diagram of an insulating layer disposed on the light-emitting side of a micro LED chip. Figure 3 As shown, a plasma enhanced chemical vapor deposition method (PECVD) can be used to deposit an insulating layer 101 such as a silicon dioxide layer on the first semiconductor layer 20111 of the micro LED chip 20 to obtain a Figure 3 Of course, the insulating layer may also include any other applicable materials, such as any applicable polymer organic materials and inorganic oxides, and any applicable preparation process may be used to prepare the insulating layer for different materials. The insulating layer may separate the subsequently arranged materials from the first semiconductor layer to play an insulating role. In addition, the insulating layer may also protect the micro LED chip, especially the first semiconductor layer, from damage during the subsequent preparation process. Furthermore, the insulating layer may be flat, so as to facilitate the subsequent preparation process thereon.

[0057] Reference Figure 2-Figure 11 ,in Figure 4 FIG. 4 shows a side view schematic diagram of a first reflective layer disposed on an insulating layer. Figure 4 As shown, a first reflective layer 102 may be disposed on the insulating layer 101 , and the first reflective layer 102 may include a Bragg reflective film for reflecting light of a color corresponding to the photoluminescent material layer.

[0058] In step S103, a first barrier layer may be provided on the first reflective layer, so that the first barrier layer includes a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes a plurality of groups of first through holes, and each group of first through holes includes at least two first through holes.

[0059] According to an embodiment of the present disclosure, after the first reflective layer is provided, a first barrier layer may be provided on the first reflective layer. The first barrier layer may function as a grid, and the interior of the grid may be filled with a corresponding material. In some embodiments, the first barrier layer may include a visible light shielding material, which may include, for example, a matte material such as black photoresist, or a reflective material such as a metal layer.

[0060] According to an embodiment of the first barrier layer of the present disclosure, a first barrier layer is disposed on the first reflective layer, so that the first barrier layer includes a first through hole array, and the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes multiple groups of first through holes, and each group of first through holes includes at least two first through holes, including: a first barrier layer is disposed on the first reflective layer, and a first through hole array is opened on the first barrier layer, so that the first through hole array exposes the first reflective layer, wherein the first through hole array includes multiple groups of first through holes, each group of first through holes includes three first through holes, and the three first through holes include a first first through hole, a second first through hole and a third first through hole.

[0061] According to another embodiment of the first barrier layer disclosed in the present invention, a first barrier layer is disposed on the first reflective layer, so that the first barrier layer includes a first through hole array, and the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes multiple groups of first through holes, and each group of first through holes includes at least two first through holes, including: a first barrier layer is disposed on the first reflective layer, and a first through hole array is opened on the first barrier layer, so that the first through hole array exposes the first reflective layer, wherein the first through hole array includes multiple groups of first through holes, and each group of first through holes includes two first through holes.

[0062] Reference Figure 2-Figure 11 ,in Figure 5 FIG. 4 shows a side view of a first barrier layer disposed on the first reflective layer. Figure 5As shown, the first barrier layer 103 may be, for example, a black photoresist layer, so a black photoresist layer may be coated on the first reflective layer 102, for example, a Bragg reflective film, by spin coating, and then, for example, a first through hole array 1030 may be opened on the black photoresist layer by photolithography, so that the arrangement of the first through hole array 1030 corresponds to the arrangement of the micro LED unit array 201 and exposes the first reflective layer 102, wherein the first through hole array 1030 includes a plurality of groups of first through holes, each group of first through holes includes a first first through hole 1031, a second first through hole 1032 and a third first through hole 1033. For clarity and simplicity, Figure 5 Only a group of first through holes included in the first through hole array 1030 is shown, and the group of first through holes includes a first first through hole 1031, a second first through hole 1032, and a third first through hole 1033. Figure 5 The number of groups of first through holes and the number of first through holes in each group of first through holes shown in the figure are merely illustrative and are not intended to be limiting herein.

[0063] In step S104, a photoluminescent material layer can be filled in each group of first through holes, wherein the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, and the first reflective layer is used to reflect light of the color corresponding to the photoluminescent material layer, thereby obtaining a micro LED device.

[0064] According to an embodiment of the present disclosure, after obtaining the above-mentioned first through hole array, a photoluminescent material layer can be filled for the first through hole array. The color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, so that the light emitted from the micro LED light-emitting unit can realize full-color display of the micro LED device after passing through the photoluminescent material layer.

[0065] Referring to an embodiment of the first barrier layer in step S103, according to an embodiment of the filled photoluminescent material layer of the present disclosure, the photoluminescent material layer includes a photoluminescent material layer of a first color and a photoluminescent material layer of a second color, and the photoluminescent material layer is filled in each group of first through holes, wherein the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, and the first reflective layer is used to reflect the light of the color corresponding to the photoluminescent material layer, including: filling the photoluminescent material layer of the first color in the first through hole in each group of first through holes, and filling the photoluminescent material layer of the second color in the second through hole in each group of first through holes, wherein the micro LED unit emits light of a third color, and the light corresponding to the first color, the light corresponding to the second color, and the light of the third color are synthesized to obtain white light, and the first reflective layer is used to reflect the light of the first color and the light of the second color.

[0066] After each group of first through holes is filled with a photoluminescent material layer, the method further comprises: arranging a second barrier layer on the first barrier layer and the photoluminescent material layer, and opening a second through hole array on the second barrier layer, so that the second through hole array is aligned with the first through hole array, and the second through hole array exposes the photoluminescent material layer, wherein the second through hole array comprises a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, and each group of second through holes comprises a first second through hole aligned with the first first through hole, a second second through hole aligned with the second first through hole, and a third second through hole aligned with the third first through hole; a first filling step, wherein the first filling step comprises the following steps: At least one: a first filling portion is filled in the first second through hole in each group of second through holes, the first filling portion includes a first filter layer that only allows light of the first color to pass through, and a first light absorbing layer or a transparent material for partially absorbing light of a third color; a second filling portion is filled in the second second through hole in each group of second through holes, the second filling portion includes a second filter layer that only allows light of the second color to pass through, and a first light absorbing layer or a transparent material for partially absorbing light of the third color; a third filling portion is filled in the third second through hole in each group of second through holes, the third filling portion includes a third filter layer that only allows light of the third color to pass through, and a first light absorbing layer or a transparent material for partially absorbing light of the third color.

[0067] Furthermore, the first filling step further comprises: when there are unfilled second through holes in each group of second through holes, filling the unfilled second through holes with a transparent material.

[0068] In this embodiment, the light of the first color refers to the light of the wavelength range corresponding to the first color, the light of the second color refers to the light of the wavelength range corresponding to the second color, and the light of the third color refers to the light of the wavelength range corresponding to the third color. The first color, the second color and the third color may be three primary colors, for example, the first color is red, the second color is green and the third color is blue. The material of the photoluminescent material layer of the first color and the material of the photoluminescent material layer of the second color include at least one of II-VI group quantum dots, III-V group quantum dots, perovskite quantum dots and carbon quantum dots, the material of the second barrier layer includes a visible light shielding material, which may include, for example, a matting material such as black photoresist, a reflective material such as a metal layer, the material of the first light absorbing layer includes an organic dye, nano absorption particles or an inorganic oxide for absorbing, for example, blue light, for example, may be a zinc oxide nanoparticle photoresist, the material of the first filter layer, the material of the second filter layer and the material of the third filter layer include an organic dye, nano absorption particles or an inorganic oxide.

[0069] Referring to another embodiment of the first barrier layer in step S103, according to another embodiment of the filled photoluminescent material layer of the present disclosure, the photoluminescent material layer includes a photoluminescent material layer of a fourth color, and the photoluminescent material layer is filled in each group of first through holes, wherein the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, and the first reflective layer is used to reflect the light of the color corresponding to the photoluminescent material layer, including: filling a photoluminescent material layer of a fourth color in a first through hole in each group of first through holes, wherein the micro LED unit emits light of a third color, and white light is obtained by synthesizing the light corresponding to the fourth color and the light of the third color, and the first reflective layer is used to reflect the light of the fourth color.

[0070] Further, after each group of first through holes is filled with the photoluminescent material layer, the method further includes: arranging a second barrier layer on the first barrier layer and the photoluminescent material layer, and opening a second through hole array on the second barrier layer, so that the second through hole array is aligned with the first through hole array, and the second through hole array exposes the photoluminescent material layer, wherein the second through hole array includes a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, and each group of second through holes includes two second through holes respectively aligned with two first through holes; a second filling step, the second filling step including at least one of the following steps: filling a fourth filling part in a second through hole in each group of second through holes aligned with a first through hole filled with the photoluminescent material layer of a fourth color, the fourth filling part including a fourth filter layer that only allows light of the fourth color to pass through, a first light absorbing layer for partially absorbing light of the third color, or a transparent material; filling a fifth filling part in another second through hole in each group of second through holes, the fifth filling part including a third filter layer that only allows light of the third color to pass through, a first light absorbing layer for partially absorbing light of the third color, or a transparent material.

[0071] Furthermore, the second filling step further comprises: when there are unfilled second through holes in each group of second through holes, filling the unfilled second through holes with a transparent material.

[0072] In this embodiment, the light of the fourth color refers to the light of the wavelength range corresponding to the fourth color, the fourth color is yellow light and the third color is blue. The material of the photoluminescent material layer of the fourth color includes at least one of group II-VI quantum dots, group III-V quantum dots, perovskite quantum dots and carbon quantum dots, the material of the second barrier layer includes a visible light shielding material, which may include, for example, a matting material such as a black photoresist, a reflective material such as a metal layer, the material of the first light absorbing layer includes an organic dye, nano absorption particles or an inorganic oxide for absorbing, for example, blue light, and may be, for example, zinc oxide nanoparticle photoresist, and the material of the fourth filter layer includes an organic dye, nano absorption particles or an inorganic oxide.

[0073] According to an embodiment of the present disclosure, when a photoluminescent material layer is filled in each group of first through holes, the method further includes: filling a sixth filling portion in a first through hole other than the first through hole filled with the photoluminescent material layer in each group of first through holes, wherein the sixth filling portion includes a second light absorbing layer, a photoluminescent material layer of a third color, or a transparent material, and the second light absorbing layer is used to partially absorb the light emitted by the micro LED unit.

[0074] According to an embodiment of the present disclosure, after filling the photoluminescent material layer in each group of first through holes, the method further includes: arranging a third light absorbing layer on the first barrier layer and the photoluminescent material layer, the third light absorbing layer being used to partially absorb the light emitted by the micro LED unit. Thus, arranging the second barrier layer on the first barrier layer may include: arranging the second barrier layer on the third light absorbing layer.

[0075] According to an embodiment of the present disclosure, after filling the photoluminescent material layer in each group of first through holes, the method further comprises: arranging a transparent cover plate on the first barrier layer and the photoluminescent material layer. According to other embodiments of the present disclosure, the transparent cover plate can be arranged on the third light absorbing layer or on the second barrier layer.

[0076] Reference Figure 2-Figure 11 ,in Figure 6 A schematic side view of a photoluminescent material layer filled in each group of first through holes is shown. Figure 5 ,like Figure 6 As shown, the first through hole 1031 in each group of first through holes is filled with a first color photoluminescent material layer 1041, such as red, and the second through hole 1032 in each group of first through holes is filled with a second color photoluminescent material layer 1042, such as green.

[0077] Reference Figure 2-Figure 11 ,in Figure 7A side view schematic diagram of the sixth filling portion filled in the first through holes other than the first through holes filled with the photoluminescent material layer in each group of first through holes is shown. Figure 5 and Figure 6 ,like Figure 7 As shown, the sixth filling part is, for example, a second light absorbing layer 1043, and the second light absorbing layer 1043 for absorbing, for example, blue light is filled in the third first through hole 1033. The material of the second light absorbing layer 1043 includes an organic dye, nano absorption particles or inorganic oxide for absorbing blue light, for example, it can be a zinc oxide nanoparticle photoresist. It is worth noting that the above filling order of the photoluminescent material layer 1041 of the first color, the photoluminescent material layer 1042 of the second color and the second light absorbing layer 1043 is only exemplary and is not limited here. The filling order of the photoluminescent material layer 1041 of the first color, the photoluminescent material layer 1042 of the second color and the second light absorbing layer 1043 can be arbitrarily adjusted according to the actual preparation conditions such as specific processes and equipment. The sixth filling part can also include a photoluminescent material layer of a third color, such as blue, so that the light of the third color, such as blue light, emitted by the micro LED unit excites the photoluminescent material layer of the third color to emit light of the third color, such as blue light.

[0078] Reference Figure 2-Figure 11 ,in Figure 8 FIG. 4 shows a side view schematic diagram of a third light absorbing layer disposed on the first barrier layer and the photoluminescent material layer. Figure 8 As shown, a third light absorbing layer 105 is disposed on the first barrier layer 103, the photoluminescent material layer 1041 of the first color, the photoluminescent material layer 1042 of the second color, and the second light absorbing layer 1043. The third light absorbing layer 105 is used to partially absorb, for example, blue light emitted by the micro LED unit. The material of the third light absorbing layer 105 includes an organic dye, nano absorption particles, or an inorganic oxide for absorbing blue light, and the material of the third light absorbing layer 105 can be the same as that of the second light absorbing layer 1043, for example, zinc oxide nanoparticle photoresist.

[0079] Reference Figure 2-Figure 11 ,in Fig. 9 FIG. 4 shows a side view schematic diagram of a second barrier layer disposed on the third light absorbing layer. Fig. 9As shown, the second barrier layer 106 may be, for example, a black photoresist layer, so a black photoresist layer may be coated on the third light absorbing layer 105 by spin coating, and then, for example, a second through hole array 1060 may be opened on the black photoresist layer by photolithography, so that the second through hole array 1060 is aligned with the first through hole array 1030 and exposes the third light absorbing layer 105, wherein the second through hole array 1060 includes a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, and each group of second through holes includes a first second through hole 1061 aligned with the first first through hole 1031, a second second through hole 1062 aligned with the second first through hole 1032, and a third second through hole 1063 aligned with the third first through hole 1033. For clarity and simplicity, Fig. 9 Only a group of second through holes included in the second through hole array 1060 is shown, and the group of second through holes includes a first second through hole 1061, a second second through hole 1062 and a third second through hole 1063. Fig. 9 The number of groups of second through holes and the number of second through holes in each group of second through holes shown in the figure are only for illustration and are not limited herein. The second barrier layer 106 such as a black photoresist layer can make the screen appear black when the display device is powered off or turned off.

[0080] Reference Figure 2-Figure 11 ,in Fig.10 A side view schematic diagram of the filling portion filled in each group of second through holes is shown. Fig. 9 ,like Fig.10 As shown, a first filling portion is filled in the first second through hole 1061 in each group of second through holes, and the first filling portion may include a first filter layer 1071 that only allows light of a first color, such as red, to pass through; a second filling portion is filled in the second second through hole 1062 in each group of second through holes, and the second filling portion may include a second filter layer 1072 that only allows light of a second color, such as green, to pass through; a first light absorption layer 1073 is filled in the third second through hole 1063 in each group of second through holes, and the first light absorption layer 1073 is used to partially absorb light of a third color, such as blue, to obtain the following: Fig.10 The structure shown. The material of the first light absorbing layer 1073 includes an organic dye, nano absorption particles or an inorganic oxide for absorbing blue light, and the material of the first light absorbing layer 1073 can be the same as the material of the second light absorbing layer 1043 and the material of the third light absorbing layer 105. It is worth noting that in other embodiments, when there are unfilled second through holes in each group of second through holes, a transparent material can be filled in the unfilled second through holes so as to support the portion above the corresponding first through hole in the subsequent preparation process that requires support, and the transparent material can be any applicable material such as a transparent resin.

[0081] Reference Figure 2-Figure 11 ,in Fig.11 FIG. 4 shows a schematic side view of a micro LED device according to an embodiment of the present disclosure. Fig.11 As shown, a transparent cover plate 108 is disposed on the second barrier layer 106 filled with the filling portion. The transparent cover plate 108 may include any suitable transparent cover plate such as a sapphire cover plate, a polyimide cover plate or a glass cover plate.

[0082] Reference Figures 2 to 11 It should be understood that the light of the third color, such as blue light, emitted by the micro LED unit 2011 excites the photoluminescent material layer 1041 of the first color, such as red, to emit red light, and the light of the third color, such as blue light, emitted by the micro LED unit 2011 excites the photoluminescent material layer 1042 of the second color, such as green, to emit green light. The first reflective layer 102 is used to reflect the light of the color corresponding to the photoluminescent material layer and allows the light emitted by the micro LED unit to pass through. Since the first reflective layer 102 covers the photoluminescent material layer 1041 of the first color and the photoluminescent material layer 1042 of the second color, and is located between the photoluminescent material layer 1041 of the first color and the photoluminescent material layer 1042 of the second color and the micro LED chip 20, the light of the third color, such as blue, emitted from the micro LED unit 2011 can pass through the first reflective layer 102. When the blue light emitted by the micro LED unit 2011 excites the photoluminescent material layer 1041 of the first color, such as red, to emit red light, part of the excited red light will be emitted toward the direction of the micro LED unit 2011. The first reflective layer 102 can reflect the part of the red light toward the photoluminescent material layer 1041 of the first color, such as red. The first reflective layer 102 can reflect the red light in the direction of the micro LED unit 2011, thereby increasing the light output of the light of the color corresponding to the photoluminescent material layer, thereby improving the brightness of the micro LED, and preventing part of the red light emitted in the direction of the micro LED unit 2011 from interfering with the blue light emitted by the micro LED unit 2011; similarly, when the blue light emitted by the micro LED unit 2011 excites the photoluminescent material layer 1042 of a second color, such as green, to emit green light, part of the excited green light will be emitted in the direction of the micro LED unit 2011, and the first reflective layer 102 can reflect the part of the green light in the direction of the photoluminescent material layer 1042 of the second color, such as green, thereby increasing the light output of the light of the color corresponding to the photoluminescent material layer, thereby improving the brightness of the micro LED, and preventing part of the green light emitted in the direction of the micro LED unit 2011 from interfering with the blue light emitted by the micro LED unit 2011.

[0083] Regarding the first light absorption layer 1073, since the third second through hole 1063 is aligned with the third first through hole 1033, when the first light absorption layer 1073 is filled in the third second through hole 1063, the first light absorption layer 1073 can partially absorb, for example, blue light emitted by the micro LED unit 2011 corresponding to the third second through hole 1063, thereby reducing the blue light overflow caused by the blue light emitted by the micro LED unit directly emitted from the micro LED device, thereby further improving the display effect of the micro LED device.

[0084] In addition, with respect to the second light absorption layer 1043, when the second light absorption layer 1043 is filled in the third first through hole 1033, the second light absorption layer 1043 can further enhance the absorption of, for example, blue light emitted by the micro LED unit 2011 corresponding to the third first through hole 1033, thereby further reducing the blue light overflow caused by the light emitted by the micro LED unit directly emitted from the micro LED device, thereby further improving the display effect of the micro LED device.

[0085] In addition, regarding the third light absorption layer 105, the third light absorption layer 105 can partially absorb, for example, blue light emitted by the micro LED unit 2011 corresponding to the third first through hole 1033, thereby further reducing the blue light overflow caused by the blue light emitted by the micro LED unit directly emitted from the micro LED device, thereby further improving the display effect of the micro LED device. And because the third light absorption layer 105 covers the photoluminescent material layer, when a part of, for example, blue light emitted by the micro LED unit corresponding to the photoluminescent material layer does not participate in the excitation of the photoluminescent material layer and leaks through the photoluminescent material layer, the third light absorption layer 105 can absorb the leaked part of the blue light, thereby reducing the mixed output of the leaked part of the blue light and the red light and green light emitted by the exciting photoluminescent material layer, thereby improving the color purity of the micro LED, thereby improving the display effect of the micro LED device.

[0086] It is worth noting that, when the first second through hole 1061 is filled with the first filter layer 1071 and the second second through hole 1062 is filled with the second filter layer 1072, the first filter layer 1071 only allows light of the first color, such as red light, to pass through, and the first filter layer 1071 will reflect light of the third color, such as blue light, toward the direction of the photoluminescent material layer 1041 of the first color, such as red light, and the second filter layer 1072 only allows light of the second color, such as green light, to pass through, and the second filter layer 1072 will reflect light of the third color, such as blue light, toward the direction of the photoluminescent material layer 1042 of the second color, such as green light. Therefore, the function of the first filter layer 1071 and the second filter layer 1072 is to reflect light other than the light of the corresponding color, which is different from the function of the first light absorption layer, the second light absorption layer and the third light absorption layer to absorb light.

[0087] The present disclosure also provides a micro LED device.

[0088] like Figure 2-Figure 11 As shown, the micro LED device 1 includes: a micro LED chip structure, the micro LED chip structure includes a micro LED chip 20, the micro LED chip 20 includes a micro LED unit array 201 composed of a plurality of micro LED units 2011; a first reflective layer 102, the first reflective layer 102 is arranged on the light emitting side of the micro LED chip 20; a first barrier layer 103, the first barrier layer 103 is arranged on the first reflective layer 102, the first barrier layer 103 includes a first through hole array 1030, the arrangement of the first through hole array 1030 corresponds to the arrangement of the micro LED unit array 201, wherein the first through hole array 1030 includes a plurality of groups of first through holes, each group of first through holes includes at least two first through holes; a photoluminescent material layer, the photoluminescent material layer is filled in each group of first through holes, wherein the color of light emitted by the micro LED unit 2011 is different from the color corresponding to the photoluminescent material layer, and the first reflective layer 102 is used to reflect the light of the color corresponding to the photoluminescent material layer.

[0089] According to an embodiment of the present disclosure, the first through hole array 1030 exposes the first reflective layer 102, wherein each group of first through holes in the first through hole array 1030 includes three first through holes, and the three first through holes include a first first through hole 1031, a second first through hole 1032, and a third first through hole 1033. The photoluminescent material layer includes a photoluminescent material layer 1041 of a first color and a photoluminescent material layer 1042 of a second color. The photoluminescent material layer 1041 of the first color is filled in the first first through hole 1031 in each group of first through holes, and the photoluminescent material layer 1042 of the second color is filled in the second first through hole 1032 in each group of first through holes. The micro LED unit 2011 emits light of a third color, and white light is obtained by synthesizing the light corresponding to the first color, the light corresponding to the second color, and the light of the third color. The first reflective layer 102 is used to reflect the light of the first color and the light of the second color.

[0090] According to an embodiment of the present disclosure, the micro LED device 1 further includes a second barrier layer 106, which is disposed on the first barrier layer 103 and the photoluminescent material layer, and includes a second through hole array 1060, the second through hole array 1060 is aligned with the first through hole array 1030, the second through hole array 1060 exposes the photoluminescent material layer, the second through hole array 1060 includes a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, each group of second through holes includes a first second through hole 1061 aligned with the first first through hole 1031, a second second through hole 1062 aligned with the second first through hole 1032, and a third second through hole 1063 aligned with the third first through hole 1033. The micro LED device 1 also includes at least one of a first filling part, a second filling part and a third filling part, wherein: the first filling part is used to fill the first second through hole 1061 in each group of second through holes, and the first filling part includes a first filter layer 1071 that only allows light of the first color to pass through, and a first light absorbing layer or a transparent material for partially absorbing light of the third color; the second filling part is used to fill the second second through hole 1062 in each group of second through holes, and the second filling part includes a second filter layer 1072 that only allows light of the second color to pass through, and a first light absorbing layer or a transparent material for partially absorbing light of the third color; the third filling part is used to fill the third second through hole 1063 in each group of second through holes, and the third filling part includes a third filter layer that only allows light of the third color to pass through, and a first light absorbing layer 1073 or a transparent material for partially absorbing light of the third color.

[0091] According to an embodiment of the present disclosure, when there is an unfilled second through hole in each group of second through holes, the micro LED device 1 further includes a transparent material, and the transparent material is filled in the unfilled second through hole.

[0092] According to an embodiment of the present disclosure, the first color is red, the second color is green, and the third color is blue.

[0093] According to an embodiment of the present disclosure, the first through hole array exposes the first reflective layer, wherein the first through hole array includes multiple groups of first through holes, each group of first through holes includes two first through holes, the photoluminescent material layer includes a photoluminescent material layer of a fourth color, the photoluminescent material layer of the fourth color is filled in one first through hole in each group of first through holes, the micro LED unit emits light of a third color, and white light is obtained by synthesizing the light of the fourth color and the light of the third color, and the first reflective layer is used to reflect the light of the fourth color.

[0094] According to an embodiment of the present disclosure, the micro LED device further comprises a second barrier layer, the second barrier layer is disposed on the first barrier layer and the photoluminescent material layer, and the second barrier layer comprises a second through hole array, the second through hole array is aligned with the first through hole array, and the second through hole array exposes the photoluminescent material layer, wherein the second through hole array comprises a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, and each group of second through holes comprises two second through holes respectively aligned with two first through holes. The micro LED device further comprises at least one of a fourth filling part and a fifth filling part, wherein: the fourth filling part is used to fill in the second through hole in each group of second through holes aligned with the first through hole filled with the photoluminescent material layer of the fourth color, the fourth filling part comprises a fourth filter layer that only allows the light of the fourth color to pass through, a first light absorbing layer or a transparent material that partially absorbs the light of the third color; the fifth filling part is used to fill in another second through hole in each group of second through holes, the fifth filling part comprises a third filter layer that only allows the light of the third color to pass through, a first light absorbing layer or a transparent material that partially absorbs the light of the third color.

[0095] According to an embodiment of the present disclosure, when there is an unfilled second through hole in each group of second through holes, the micro LED device further includes a transparent material, and the transparent material is filled in the unfilled second through hole.

[0096] According to an embodiment of the present disclosure, the fourth color is yellow and the third color is blue.

[0097] According to an embodiment of the present disclosure, the micro LED device 1 also includes a sixth filling portion, which is filled in a first through hole other than the first through hole filled with a photoluminescent material layer in each group of first through holes, and the sixth filling portion includes a second light absorbing layer 1043, a photoluminescent material layer of a third color or a transparent material, and the second light absorbing layer 1043 is used to partially absorb the light emitted by the micro LED unit 2011.

[0098] According to an embodiment of the present disclosure, the micro LED device 1 further includes a third light absorbing layer 105 , which is disposed on the first barrier layer 103 and the photoluminescent material layer, and is used to partially absorb the light emitted by the micro LED unit 2011 .

[0099] According to an embodiment of the present disclosure, the micro LED device 1 further includes a transparent cover plate 108 , and the transparent cover plate 108 is disposed on the first barrier layer 103 and the photoluminescent material layer.

[0100] According to an embodiment of the present disclosure, the micro LED device 1 further includes an insulating layer 101 , which is disposed on the light-emitting side of the micro LED chip 20 , and the first reflective layer 102 is disposed on the insulating layer 101 .

[0101] According to an embodiment of the present disclosure, the micro LED chip structure also includes a driving chip, and the side of the micro LED chip 20 opposite to the light emitting side is arranged on the driving chip, or the micro LED chip structure also includes a driving chip and a flexible circuit board, and the side of the micro LED chip 20 opposite to the light emitting side is arranged on the driving chip to form a micro LED module, and the micro LED module is arranged on the flexible circuit board through the driving chip.

[0102] According to an embodiment of the present disclosure, the first reflective layer 102 includes a distributed Bragg reflector for reflecting light of a color corresponding to the photoluminescent material layer, the material of the first barrier layer 103 and the material of the second barrier layer 106 include a visible light shielding material, the material of the photoluminescent material layer 1041 of the first color and the material of the photoluminescent material layer 1042 of the second color include at least one of II-VI group quantum dots, III-V group quantum dots, perovskite quantum dots and carbon quantum dots, the material of the first light absorption layer 1073 includes an organic dye, nano absorption particles or inorganic oxide for absorbing blue light, and the material of the first filter layer 1071, the second filter layer 1072 and the third filter layer include organic dyes, nano absorption particles or inorganic oxides.

[0103] It is worth noting that any relevant description about the micro LED device in the above-mentioned micro LED device preparation method (including but not limited to technical features and their functions, explanations, etc.) can be applied to the micro LED device disclosed in the present invention.

[0104] According to embodiments of the present disclosure, the pixel size in the micro LED device is typically less than 50 microns.

[0105] The present disclosure also provides a display device, which includes the above-mentioned type LED device. The display device can be applied to flexible electronic devices to realize technologies such as augmented reality (AR), virtual reality (VR), extended reality (XR), and mixed reality (MR). For example, the micro LED device can be the projection part of an electronic device, such as a projector, a head-up display (HUD), etc.; for another example, the micro LED device can also be the display part of an electronic device, such as a smart phone, a smart watch, a laptop, a tablet computer, a driving recorder, a navigator, a head-mounted device, and any other device with a display screen.

[0106] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0107] It should be understood that "one embodiment" or "an embodiment" mentioned throughout the specification means that specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. It should be understood that in various embodiments of the present application, the size of the serial number of each step / process mentioned above does not mean the order of execution, and the execution order of each step / process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiment of the present application. In addition, the serial numbers of the embodiments of the present application mentioned above are only for description and do not represent the advantages and disadvantages of the embodiments.

[0108] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein, for example. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0109] The above description is only a preferred embodiment of the present disclosure and is not intended to limit the present disclosure. For those skilled in the art, the present disclosure may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A method for preparing a micro LED device, wherein: The method comprises: Acquire a micro LED chip structure, wherein the micro LED chip structure comprises a micro LED chip, and the micro LED chip comprises a micro LED unit array composed of a plurality of micro LED units; A first reflective layer is provided on the light emitting side of the micro LED chip; Disposing a first barrier layer on the first reflective layer, so that the first barrier layer includes a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes a plurality of groups of first through holes, and each group of first through holes includes at least two first through holes; A photoluminescent material layer is filled in each group of first through holes, wherein the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, and the first reflective layer is used to reflect the light of the color corresponding to the photoluminescent material layer, thereby obtaining a micro LED device.

2. The method for preparing a micro LED device according to claim 1, wherein: A first barrier layer is disposed on the first reflective layer, so that the first barrier layer includes a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes a plurality of groups of first through holes, each group of first through holes includes at least two first through holes including: A first barrier layer is disposed on the first reflective layer, and a first through hole array is opened on the first barrier layer, so that the first through hole array exposes the first reflective layer, wherein the first through hole array includes a plurality of groups of first through holes, each group of first through holes includes three first through holes, and the three first through holes include a first first through hole, a second first through hole and a third first through hole, The photoluminescent material layer includes a photoluminescent material layer of a first color and a photoluminescent material layer of a second color, and the photoluminescent material layer is filled in each group of first through holes, wherein the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, and the first reflective layer is used to reflect the light of the color corresponding to the photoluminescent material layer, and includes: A first photoluminescent material layer of a first color is filled in the first through hole in each group of first through holes, and a second photoluminescent material layer of a second color is filled in the second through hole in each group of first through holes, wherein the micro LED unit emits light of a third color, and the light corresponding to the first color, the light corresponding to the second color, and the light of the third color are synthesized to obtain white light, and the first reflective layer is used to reflect the light of the first color and the light of the second color.

3. The method for preparing a micro LED device according to claim 2, wherein: After filling the photoluminescent material layer in each group of first through holes, the method further comprises: A second barrier layer is disposed on the first barrier layer and the photoluminescent material layer, and a second through hole array is formed on the second barrier layer, so that the second through hole array is aligned with the first through hole array, and the second through hole array exposes the photoluminescent material layer, wherein the second through hole array includes a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, and each group of second through holes includes a first second through hole aligned with the first first through hole, a second second through hole aligned with the second first through hole, and a third second through hole aligned with the third first through hole; A first filling step, wherein the first filling step comprises at least one of the following steps: Filling a first filling portion in a first second through hole in each group of second through holes, wherein the first filling portion includes a first filter layer that allows only light of a first color to pass through, a first light absorption layer for partially absorbing light of a third color, or a transparent material; Filling a second filling portion in a second second through hole in each group of second through holes, wherein the second filling portion includes a second filter layer that allows only light of the second color to pass through, a first light absorption layer for partially absorbing light of the third color, or a transparent material; A third filling portion is filled in the third second through hole in each group of second through holes, wherein the third filling portion includes a third filter layer that allows only light of a third color to pass through, a first light absorption layer for partially absorbing light of the third color, or a transparent material.

4. The method for preparing a micro LED device according to claim 3, wherein: The first filling step further comprises: When there are unfilled second through holes in each group of second through holes, the unfilled second through holes are filled with a transparent material.

5. The method for preparing a micro LED device according to claim 1, wherein: A first barrier layer is disposed on the first reflective layer, so that the first barrier layer includes a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes a plurality of groups of first through holes, each group of first through holes includes at least two first through holes including: A first barrier layer is disposed on the first reflective layer, and a first through hole array is formed on the first barrier layer, so that the first through hole array exposes the first reflective layer, wherein the first through hole array includes a plurality of groups of first through holes, and each group of first through holes includes two first through holes; The photoluminescent material layer includes a photoluminescent material layer of a fourth color, and the photoluminescent material layer is filled in each group of first through holes, wherein the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, and the first reflective layer is used to reflect light of the color corresponding to the photoluminescent material layer, and includes: A photoluminescent material layer of a fourth color is filled in a first through hole in each group of first through holes, wherein the micro LED unit emits light of a third color, and white light is obtained by synthesizing the light of the fourth color and the light of the third color, and the first reflective layer is used to reflect the light of the fourth color.

6. The method for preparing a micro LED device according to claim 5, wherein: After filling the photoluminescent material layer in each group of first through holes, the method further comprises: A second barrier layer is disposed on the first barrier layer and the photoluminescent material layer, and a second through hole array is formed on the second barrier layer, so that the second through hole array is aligned with the first through hole array, and the second through hole array exposes the photoluminescent material layer, wherein the second through hole array includes a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, and each group of second through holes includes two second through holes respectively aligned with two first through holes; A second filling step, wherein the second filling step comprises at least one of the following steps: Filling a fourth filling portion in the second through holes in each group of second through holes aligned with the first through holes filled with the photoluminescent material layer of the fourth color, wherein the fourth filling portion includes a fourth filter layer that allows only light of the fourth color to pass through, a first light absorption layer for partially absorbing light of the third color, or a transparent material; A fifth filling portion is filled in another second through hole in each group of second through holes, wherein the fifth filling portion includes a third filter layer that allows only light of a third color to pass therethrough, a first light absorption layer for partially absorbing light of the third color, or a transparent material.

7. The method for preparing a micro LED device according to claim 6, wherein: The second filling step further comprises: When there are unfilled second through holes in each group of second through holes, the unfilled second through holes are filled with a transparent material.

8. The method for preparing a micro LED device according to claim 1, wherein: When filling the photoluminescent material layer in each group of first through holes, the method further comprises: A sixth filling portion is filled in the first through holes other than the first through holes filled with the photoluminescent material layer in each group of first through holes, wherein the sixth filling portion includes a second light absorbing layer, a photoluminescent material layer of a third color or a transparent material, and the second light absorbing layer is used to partially absorb the light emitted by the micro LED unit.

9. The method for preparing a micro LED device according to claim 1, wherein: After filling the photoluminescent material layer in each group of first through holes, the method further includes: disposing a third light absorbing layer on the first barrier layer and the photoluminescent material layer, wherein the third light absorbing layer is used to partially absorb the light emitted by the micro LED unit.

10. The method for preparing a micro LED device according to claim 1, wherein: After filling the photoluminescent material layer in each group of first through holes, the method further includes: arranging a transparent cover plate on the first barrier layer and the photoluminescent material layer.

11. The method for preparing a micro LED device according to claim 1, wherein: Before the first reflective layer is provided on the light-emitting side of the micro LED chip, the method further comprises: providing an insulating layer on the light-emitting side of the micro LED chip, Providing a first reflective layer on the light-emitting side of the micro LED chip includes: providing the first reflective layer on the insulating layer.

12. A micro LED device, wherein: The micro LED device comprises: A micro LED chip structure, the micro LED chip structure comprising a micro LED chip, the micro LED chip comprising a micro LED unit array consisting of a plurality of micro LED units; A first reflective layer, wherein the first reflective layer is arranged on the light emitting side of the micro LED chip; A first barrier layer, the first barrier layer is disposed on the first reflective layer, the first barrier layer comprises a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array comprises a plurality of groups of first through holes, each group of first through holes comprises at least two first through holes; A photoluminescent material layer is filled in each group of first through holes, wherein the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, and the first reflective layer is used to reflect light of the color corresponding to the photoluminescent material layer.

13. A display device, wherein: The display device comprises the micro LED device according to claim 12.

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