Miniature LED device preparation method, miniature LED device and display device

Abstract

The invention provides a miniature LED device preparation method, a miniature LED device and a display device. The method comprises the following steps: obtaining a transparent substrate and a micro LED chip structure; a first partition layer is arranged on the transparent substrate, so that the first partition layer comprises a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, the first through hole array comprises a plurality of groups of first through holes, and each group of first through holes comprises at least two first through holes; each group of first through holes is filled with a photoluminescent material layer, and the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer; a first reflecting layer is arranged on the first partition layer and the photoluminescent material layer to obtain a first color conversion structure, and the first reflecting layer is used for reflecting light of the color corresponding to the photoluminescent material layer; and bonding one side, opposite to the transparent substrate, of the first color conversion structure with the light emitting side of the micro LED chip to obtain the micro LED device.

Description

Technical Field

[0001] The present disclosure relates to the technical field of semiconductor Micro LED, and in particular, to a method for preparing a Micro LED device, a Micro LED device and a display device. Background Art

[0002] Micro-LED is a comprehensive technology that integrates new display technology and light-emitting diode (LED) technology. It has the advantages of small size, high brightness, high resolution, and low power consumption. It is considered to be one of the most promising next-generation new display and light-emitting devices. Currently, Micro LED full-color display can be achieved in a variety of ways, one of which is the color conversion method. However, the full-color Micro LED device achieved by the color conversion method still has problems such as unsatisfactory display effects. Summary of the invention

[0003] The solution disclosed herein provides a method for preparing a micro LED device, a micro LED device, and a display device.

[0004] According to one aspect of an embodiment of the present disclosure, a method for preparing a micro LED device is provided, wherein the method comprises: obtaining a transparent substrate and a micro LED chip structure, wherein the micro LED chip structure comprises a micro LED chip, and the micro LED chip comprises a micro LED unit array composed of a plurality of micro LED units; arranging a first barrier layer on the transparent substrate, so that the first barrier layer comprises a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array comprises a plurality of groups of first through holes, and each group of first through holes comprises at least two first through holes; filling a photoluminescent material layer in each group of first through holes, the color of light emitted by the micro LED unit being different from the color corresponding to the photoluminescent material layer; arranging a first reflective layer on the first barrier layer and the photoluminescent material layer to obtain a first color conversion structure, wherein the first reflective layer is used to reflect light of the color corresponding to the photoluminescent material layer; bonding a side of the first color conversion structure opposite to the transparent substrate to a light emitting side of the micro LED chip to obtain a micro LED device.

[0005] Furthermore, before the first barrier layer is provided on the transparent substrate, the method further includes: providing a second barrier layer on the transparent substrate, so that the second barrier layer includes a second through hole array, the arrangement of the second through hole array corresponds to the arrangement of the micro LED unit array, wherein the second through hole array includes a plurality of groups of second through holes, each group of second through holes includes three second through holes, and the three second through holes include a first second through hole, a second second through hole and a third second through hole; a first filling step, when the first filling step is completed, a first intermediate structure is obtained, and the first filling step includes at least one of the following steps: the first second through hole in each group of second through holes is filled with a plurality of second through holes; A first filling portion is filled in the second through hole in each group of second through holes, wherein the first filling portion includes a first filter layer that only allows light of the first color to pass through, and a first light absorbing layer or a transparent material for partially absorbing light of the third color; a second filling portion is filled in the second second through hole in each group of second through holes, wherein the second filling portion includes a second filter layer that only allows light of the second color to pass through, and a first light absorbing layer or a transparent material for partially absorbing light of the third color; a third filling portion is filled in the third second through hole in each group of second through holes, wherein the third filling portion includes a third filter layer that only allows light of the third color to pass through, and a first light absorbing layer or a transparent material for partially absorbing light of the third color.

[0006] Furthermore, the first filling step further comprises: when there are unfilled second through holes in each group of second through holes, filling the unfilled second through holes with a transparent material.

[0007] Further, each group of first through holes includes three first through holes, and a first barrier layer is arranged on the transparent substrate so that the first barrier layer includes a first through hole array, and the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes multiple groups of first through holes, and each group of first through holes includes at least two first through holes, including: a first barrier layer is arranged on the first intermediate structure, and a first through hole array is opened on the first barrier layer, so that the first through hole array is aligned with the second through hole array, and the first through hole array exposes the first intermediate structure, wherein the first through hole array includes multiple groups of first through holes corresponding to the multiple groups of second through holes, and each group of first through holes includes a first first through hole aligned with the first second through hole, a second first through hole aligned with the second second through hole, and a third first through hole aligned with the third second through hole. The photoluminescent material layer includes a photoluminescent material layer of a first color and a photoluminescent material layer of a second color, and the photoluminescent material layer is filled in each group of first through holes, and the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, including: the first first through hole in each group of first through holes is filled with a photoluminescent material layer of a first color, and the second first through hole in each group of first through holes is filled with a photoluminescent material layer of a second color, wherein the micro LED unit emits light of a third color, and the light corresponding to the first color, the light corresponding to the second color, and the light of the third color are synthesized to obtain white light. The first reflective layer is used to reflect the light of the first color and the light of the second color.

[0008] Furthermore, before the first barrier layer is provided on the transparent substrate, the method further includes: providing a second barrier layer on the transparent substrate, so that the second barrier layer includes a second through hole array, the arrangement of the second through hole array corresponds to the arrangement of the micro LED unit array, wherein the second through hole array includes a plurality of groups of second through holes, each group of second through holes includes two second through holes; a second filling step, a second intermediate structure is obtained when the second filling step is completed, the second filling step includes at least one of the following steps: filling a fourth filling part in one second through hole in each group of second through holes, the fourth filling part including a fourth filter layer that only allows light of a fourth color to pass through, a first light absorbing layer or a transparent material for partially absorbing light of a third color; filling a fifth filling part in another second through hole in each group of second through holes, the fifth filling part including a third filter layer that only allows light of a third color to pass through, a first light absorbing layer or a transparent material for partially absorbing light of the third color.

[0009] Furthermore, the second filling step further comprises: when there are unfilled second through holes in each group of second through holes, filling the unfilled second through holes with a transparent material.

[0010] Further, a first barrier layer is arranged on the transparent substrate, so that the first barrier layer includes a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes multiple groups of first through holes, and each group of first through holes includes at least two first through holes, including: a first barrier layer is arranged on the second intermediate structure, and a first through hole array is opened on the first barrier layer, so that the first through hole array is aligned with the second through hole array, and the first through hole array exposes the second intermediate structure, wherein the first through hole array includes multiple groups of first through holes corresponding to the multiple groups of second through holes, and each group of first through holes includes two first through holes respectively aligned with two second through holes. The photoluminescent material layer includes a photoluminescent material layer of a fourth color, and the photoluminescent material layer is filled in each group of first through holes, and the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, including: in each group of first through holes, the photoluminescent material layer of the fourth color is filled in the first through hole aligned with the second through hole used to fill the fourth filling part, wherein the micro LED unit emits light of a third color, and the light corresponding to the fourth color and the light of the third color are synthesized to obtain white light. The first reflective layer is used to reflect the light of the fourth color.

[0011] Furthermore, before the first barrier layer is provided on the first intermediate structure, the method further comprises: providing a second light absorbing layer on the first intermediate structure, wherein the second light absorbing layer is used to partially absorb the light emitted by the micro LED unit. Providing the first barrier layer on the first intermediate structure comprises: providing the first barrier layer on the second light absorbing layer.

[0012] Furthermore, when filling the photoluminescent material layer in each group of first through holes, the method also includes: filling a sixth filling portion in a first through hole other than the first through hole filled with the photoluminescent material layer in each group of first through holes, the sixth filling portion comprising a third light absorbing layer, a photoluminescent material layer of a third color, or a transparent material, and the third light absorbing layer is used to partially absorb the light emitted by the micro LED unit.

[0013] Furthermore, after the first barrier layer and the photoluminescent material layer are provided with a first reflective layer, the method further comprises: providing an insulating layer on the first reflective layer. Bonding the side of the first color conversion structure opposite to the transparent substrate to the light-emitting side of the micro LED chip comprises: bonding the insulating layer of the first color conversion structure to the light-emitting side of the micro LED chip.

[0014] Furthermore, after bonding the side of the first color conversion structure opposite to the transparent substrate to the light emitting side of the micro LED chip, the method includes: removing the transparent substrate of the first color conversion structure to obtain a second color conversion structure from the first color conversion structure.

[0015] According to another aspect of the present disclosure, a micro LED device is also provided.

[0016] The micro LED device comprises a second color conversion structure and a micro LED chip structure, wherein the micro LED chip structure comprises a micro LED chip, wherein the micro LED chip comprises a micro LED unit array composed of a plurality of micro LED units, wherein the second color conversion structure comprises: a first barrier layer, wherein the first barrier layer comprises a first through hole array, wherein the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array comprises a plurality of groups of first through holes, wherein each group of first through holes comprises at least two first through holes; a photoluminescent material layer, wherein the photoluminescent material layer is filled in each group of first through holes, wherein the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer; and a first reflective layer, wherein the first reflective layer is arranged below the first barrier layer and the photoluminescent material layer, wherein the first reflective layer is used to reflect light of the color corresponding to the photoluminescent material layer. The first reflective layer of the second color conversion structure is arranged on the light-emitting side of the micro LED chip.

[0017] Further, the second color conversion structure also includes a second barrier layer, the second barrier layer includes a second through hole array, the arrangement of the second through hole array corresponds to the arrangement of the micro LED unit array, wherein the second through hole array includes multiple groups of second through holes, each group of second through holes includes three second through holes, and the three second through holes include a first second through hole, a second second through hole and a third second through hole. The second color conversion structure also includes at least one of a first filling part, a second filling part and a third filling part, wherein: the first filling part is used to fill the first second through hole in each group of second through holes, and the first filling part includes a first filter layer that only allows light of the first color to pass through, and a first light absorbing layer or a transparent material that partially absorbs light of the third color; the second filling part is used to fill the second second through hole in each group of second through holes, and the second filling part includes a second filter layer that only allows light of the second color to pass through, and a first light absorbing layer or a transparent material that partially absorbs light of the third color; the third filling part is used to fill the third second through hole in each group of second through holes, and the third filling part includes a third filter layer that only allows light of the third color to pass through, and a first light absorbing layer or a transparent material that partially absorbs light of the third color.

[0018] Further, when there is an unfilled second through hole in each group of second through holes, the second color conversion structure further includes a transparent material, and the transparent material is filled in the unfilled second through hole.

[0019] Further, each group of first through holes includes three first through holes, the first barrier layer is arranged under the second barrier layer, the first through hole array is aligned with the second through hole array, wherein the first through hole array includes multiple groups of first through holes corresponding to the multiple groups of second through holes, each group of first through holes includes a first first through hole aligned with the first second through hole, a second first through hole aligned with the second second through hole, and a third first through hole aligned with the third second through hole, the photoluminescent material layer includes a photoluminescent material layer of a first color and a photoluminescent material layer of a second color, the photoluminescent material layer of the first color is filled in the first first through hole in each group of first through holes, and the photoluminescent material layer of the second color is filled in the second first through hole in each group of first through holes, wherein the micro LED unit emits light of a third color, and the light corresponding to the first color, the light corresponding to the second color, and the light of the third color are synthesized to obtain white light, and the first reflective layer is used to reflect the light of the first color and the light of the second color.

[0020] Further, the first color is red, the second color is green and the third color is blue.

[0021] Further, the second color conversion structure further includes a second barrier layer, the second barrier layer includes a second through hole array, the arrangement of the second through hole array corresponds to the arrangement of the micro LED unit array, wherein the second through hole array includes a plurality of groups of second through holes, each group of second through holes includes two second through holes. The second color conversion structure further includes at least one of a fourth filling part and a fifth filling part, wherein: the fourth filling part is used to fill in one second through hole in each group of second through holes, the fourth filling part includes a fourth filter layer that only allows light of a fourth color to pass through, a first light absorbing layer or a transparent material that partially absorbs light of a third color; the fifth filling part is used to fill in another second through hole in each group of second through holes, the fifth filling part includes a third filter layer that only allows light of a third color to pass through, a first light absorbing layer or a transparent material that partially absorbs light of a third color.

[0022] Further, when there is an unfilled second through hole in each group of second through holes, the second color conversion structure further includes a transparent material, and the transparent material is filled in the unfilled second through hole.

[0023] Further, the first barrier layer is arranged below the second barrier layer, the first barrier layer comprises a first through hole array, the first through hole array is aligned with the second through hole array, wherein the first through hole array comprises a plurality of groups of first through holes corresponding to the plurality of groups of second through holes, each group of first through holes comprises two first through holes respectively aligned with two second through holes, the photoluminescent material layer comprises a photoluminescent material layer of a fourth color, the photoluminescent material layer of the fourth color is filled in the first through holes aligned with the second through holes used to fill the fourth filling part, wherein the micro LED unit emits light of a third color, and white light is obtained by synthesizing the light of the fourth color and the light of the third color, and the first reflective layer is used to reflect the light of the fourth color.

[0024] Further, the fourth color is yellow and the third color is blue.

[0025] Furthermore, the second color conversion structure also includes a second light absorbing layer, which is arranged below the second barrier layer and is used to partially absorb the light emitted by the micro LED unit, and the first barrier layer is arranged below the second light absorbing layer.

[0026] Furthermore, the second color conversion structure also includes a sixth filling portion, which includes a third light absorbing layer, a photoluminescent material layer of a third color or a transparent material, and the sixth filling portion is filled in the first through hole other than the first through hole filled with the photoluminescent material layer in each group of first through holes, and the third light absorbing layer is used to partially absorb the light emitted by the micro LED unit.

[0027] Furthermore, the second color conversion structure further includes an insulating layer, and the insulating layer is arranged below the first reflective layer. The insulating layer of the second color conversion structure is arranged on the light emitting side of the micro LED chip.

[0028] Furthermore, the micro LED chip structure also includes a driver chip, and the side of the micro LED chip opposite to the light emitting side is arranged on the driver chip, or the micro LED chip structure also includes a driver chip and a flexible circuit board, and the side of the micro LED chip opposite to the light emitting side is arranged on the driver chip to form a micro LED module, and the micro LED module is arranged on the flexible circuit board through the driver chip.

[0029] Further, the first reflective layer includes a distributed Bragg reflector for reflecting light of a color corresponding to the photoluminescent material layer, the material of the first barrier layer and the material of the second barrier layer include a visible light shielding material, the material of the photoluminescent material layer of the first color and the material of the photoluminescent material layer of the second color include at least one of II-VI group quantum dots, III-V group quantum dots, perovskite quantum dots and carbon quantum dots, the material of the first light absorption layer includes an organic dye, nano absorption particles or inorganic oxide for absorbing blue light, and the material of the first filter layer, the second filter layer and the third filter layer include organic dyes, nano absorption particles or inorganic oxides.

[0030] According to another aspect of the embodiments of the present disclosure, a display device is provided, comprising a micro LED device prepared by the above method.

[0031] By applying the technical solution disclosed in the present invention, a transparent substrate and a micro LED chip are obtained, a first barrier layer is arranged on the transparent substrate, each group of first through holes included in the first barrier layer includes at least two first through holes, and then a photoluminescent material layer is filled in each group of first through holes, and then a first reflective layer is arranged on the first barrier layer and the photoluminescent material layer to form a first color conversion structure, and the first color conversion structure is bonded to the light-emitting side of the micro LED chip to form a micro LED device.

[0032] In the micro LED device, the light emitted by the micro LED unit of the micro LED chip excites the material in the photoluminescent material layer to emit light of a color different from that of the light emitted by the micro LED unit. The first reflective layer is used to reflect light of a color corresponding to the photoluminescent material layer. Since the first reflective layer covers the photoluminescent material layer and is located between the photoluminescent material layer and the micro LED chip, the light emitted from the micro LED unit can pass through the first reflective layer. When the light emitted by the micro LED unit excites the photoluminescent material layer to emit light, part of the excited light will be emitted toward the direction of the micro LED unit. The first reflective layer can reflect the part of the light toward the direction of the photoluminescent material layer, thereby increasing the light output of the light of the color corresponding to the photoluminescent material layer, thereby improving the brightness of the micro LED, and preventing part of the light emitted toward the direction of the micro LED unit from interfering with the light emitted by the micro LED unit, thereby improving the display effect of the micro LED device. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] By reading the detailed description below with reference to the accompanying drawings, the above and other purposes, features and advantages of the exemplary embodiments of the present disclosure will become readily understood. In the accompanying drawings, several embodiments of the present disclosure are shown in an exemplary and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0034] Figure 1 is a flow chart showing a method for preparing a micro LED device according to one embodiment of the present disclosure;

[0035] Figures 2 to 13 is a schematic diagram showing a preparation process flow of a method for preparing a micro LED device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0036] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present disclosure will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0037] It should be noted that the following detailed descriptions are illustrative and are intended to provide further explanation of the present application. Unless otherwise specified, all technical and scientific terms used herein have the same meanings as those commonly understood by those skilled in the art to which the present application belongs.

[0038] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" may include both "above" and "below". The device may also be positioned in other different ways, rotated 90 degrees or in other orientations, and the spatially relative descriptions used herein are interpreted accordingly.

[0039] Now, exemplary embodiments according to the present disclosure will be described in more detail with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in a variety of different forms and should not be construed as being limited to the embodiments described herein. It should be understood that these embodiments are provided to make the disclosure of the present application thorough and complete, and to fully convey the concepts of these exemplary embodiments to those of ordinary skill in the art. In the accompanying drawings, for clarity, the thickness of the layers and regions is enlarged, and the same reference numerals are used to represent the same devices, and thus their descriptions will be omitted.

[0040] The present invention provides a method for preparing a micro LED device. Figures 1 to 13 , Figure 1is a flow chart showing a method for preparing a micro LED device according to one embodiment of the present disclosure; Figures 2 to 13 is a schematic diagram showing a preparation process flow of a method for preparing a micro LED device according to an embodiment of the present disclosure.

[0041] like Figure 1 As shown, the method for preparing a micro LED device includes the following steps S101-S105.

[0042] Step S101: Obtain a transparent substrate and a micro LED chip structure, wherein the micro LED chip structure comprises a micro LED chip, and the micro LED chip comprises a micro LED unit array composed of a plurality of micro LED units.

[0043] Step S102: Disposing a first barrier layer on the transparent substrate, so that the first barrier layer includes a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes multiple groups of first through holes, and each group of first through holes includes at least two first through holes.

[0044] Step S103: Filling a photoluminescent material layer in each group of first through holes, wherein the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer.

[0045] Step S104: a first reflective layer is disposed on the first barrier layer and the photoluminescent material layer to obtain a first color conversion structure, wherein the first reflective layer is used to reflect light of a color corresponding to the photoluminescent material layer.

[0046] Step S105: Bonding the side of the first color conversion structure opposite to the transparent substrate to the light emitting side of the micro LED chip to obtain a micro LED device.

[0047] According to the technical solution, a transparent substrate and a micro LED chip can be obtained, a first barrier layer is arranged on the transparent substrate, each group of first through holes included in the first barrier layer includes at least two first through holes, and then a photoluminescent material layer is filled in each group of first through holes, and then a first reflective layer is arranged on the first barrier layer and the photoluminescent material layer to form a first color conversion structure, and the first color conversion structure is bonded to the light-emitting side of the micro LED chip to form a micro LED device.

[0048] In the micro LED device, the light emitted by the micro LED unit of the micro LED chip excites the material in the photoluminescent material layer to emit light of a color different from that of the light emitted by the micro LED unit. The first reflective layer is used to reflect light of a color corresponding to the photoluminescent material layer. Since the first reflective layer covers the photoluminescent material layer and is located between the photoluminescent material layer and the micro LED chip, the light emitted from the micro LED unit can pass through the first reflective layer. When the light emitted by the micro LED unit excites the photoluminescent material layer to emit light, part of the excited light will be emitted toward the direction of the micro LED unit. The first reflective layer can reflect the part of the light toward the direction of the photoluminescent material layer, thereby increasing the light output of the light of the color corresponding to the photoluminescent material layer, thereby improving the brightness of the micro LED, and preventing part of the light emitted toward the direction of the micro LED unit from interfering with the light emitted by the micro LED unit, thereby improving the display effect of the micro LED device.

[0049] In step S101, a transparent substrate and a micro LED chip structure may be obtained, wherein the micro LED chip structure includes a micro LED chip, and the micro LED chip includes a micro LED unit array composed of a plurality of micro LED units.

[0050] According to an embodiment of the present disclosure, a transparent substrate and a micro LED chip structure may be first obtained. The transparent substrate may include any applicable substrate such as a glass substrate, a polyimide substrate or a sapphire substrate. The micro LED chip structure includes a micro LED chip, and the micro LED chip includes a micro LED unit array for emitting light. Among them, the micro LED chip may be any micro LED chip suitable for preparing a micro LED device. For example, the structure of the micro LED chip may include a face-up structure, a flip-chip structure or a vertical structure, etc., which are not limited here. Each micro LED unit in the micro LED unit array may include an exposed first semiconductor layer on its light-emitting side. Depending on the type of micro LED device, in some embodiments, the first semiconductor layer may include an N-GaN layer; in other embodiments, the first semiconductor layer may include a P-GaN layer. It is worth noting that the micro LED chip structure may also be obtained in any step before the subsequent step of using the micro LED chip structure.

[0051] Reference Figure 2-Figure 13 ,in Figure 2 FIG. 1 shows a side view of a transparent substrate 101 according to an embodiment of the present disclosure. Figure 2 As shown, the transparent substrate 101 may be, for example, a glass substrate.

[0052] Reference Figure 2-Figure 13 ,in Figure 3FIG. 4 shows a side view of a micro LED chip structure according to an embodiment of the present disclosure. Figure 3 As shown, the micro LED chip structure includes a micro LED chip 20, and the micro LED chip 20 includes a micro LED unit array 201 composed of micro LED units 2011. Each micro LED unit 2011 in the micro LED unit array 201 includes a first semiconductor layer 20111 such as an N-GaN layer on the light emitting side. Figure 3 As shown, the first semiconductor layer 20111 is common to each micro LED unit 2011 in the micro LED unit array 201 , that is, the first semiconductor layer 20111 is integrated in the micro LED chip 20 .

[0053] In step S102, a first barrier layer may be provided on the transparent substrate, so that the first barrier layer includes a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes a plurality of groups of first through holes, and each group of first through holes includes at least two first through holes.

[0054] According to an embodiment of the present disclosure, after obtaining a transparent substrate, a first barrier layer can be provided on the transparent substrate, the first barrier layer can function as a grid, and the inside of the grid can be filled with a corresponding material. In some embodiments, the first barrier layer can include a visible light shielding material, which can include, for example, a matte material such as black photoresist, a reflective material such as a metal layer, etc.

[0055] According to an embodiment of the second barrier layer of the present disclosure, before the first barrier layer is provided on the transparent substrate, the method further includes: providing the second barrier layer on the transparent substrate, so that the second barrier layer includes a second through hole array, the arrangement of the second through hole array corresponds to the arrangement of the micro LED unit array, wherein the second through hole array includes a plurality of groups of second through holes, each group of second through holes includes three second through holes, and the three second through holes include a first second through hole, a second second through hole and a third second through hole; a first filling step, when the first filling step is completed, a first intermediate structure is obtained, and the first filling step includes at least one of the following steps: in each group of second through holes, the first through hole array includes a plurality of second through holes, each group of second through holes includes three second through holes, and the three second through holes include a first second through hole, a second second through hole and a third second through hole; A first filling portion is filled in a second through hole, wherein the first filling portion includes a first filter layer that only allows light of the first color to pass through, and a first light absorbing layer or a transparent material for partially absorbing light of a third color; a second filling portion is filled in a second second through hole in each group of second through holes, wherein the second filling portion includes a second filter layer that only allows light of the second color to pass through, and a first light absorbing layer or a transparent material for partially absorbing light of the third color; a third filling portion is filled in a third second through hole in each group of second through holes, wherein the third filling portion includes a third filter layer that only allows light of the third color to pass through, and a first light absorbing layer or a transparent material for partially absorbing light of the third color.

[0056] Furthermore, the first filling step further comprises: when there are unfilled second through holes in each group of second through holes, filling the unfilled second through holes with a transparent material.

[0057] Further, each group of first through holes includes three first through holes, and a first barrier layer is arranged on the transparent substrate so that the first barrier layer includes a first through hole array, and the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes multiple groups of first through holes, and each group of first through holes includes at least two first through holes, including: a first barrier layer is arranged on the first intermediate structure, and a first through hole array is opened on the first barrier layer, so that the first through hole array is aligned with the second through hole array, and the first through hole array exposes the first intermediate structure, wherein the first through hole array includes multiple groups of first through holes corresponding to the multiple groups of second through holes, and each group of first through holes includes a first first through hole aligned with the first second through hole, a second first through hole aligned with the second second through hole, and a third first through hole aligned with the third second through hole.

[0058] Furthermore, before the first barrier layer is provided on the first intermediate structure, the method further comprises: providing a second light absorbing layer on the first intermediate structure, wherein the second light absorbing layer is used to partially absorb the light emitted by the micro LED unit. Providing the first barrier layer on the first intermediate structure comprises: providing the first barrier layer on the second light absorbing layer.

[0059] In this embodiment, the light of the first color refers to the light of the wavelength range corresponding to the first color, the light of the second color refers to the light of the wavelength range corresponding to the second color, and the light of the third color refers to the light of the wavelength range corresponding to the third color. The first color, the second color and the third color can be three primary colors, for example, the first color is red, the second color is green and the third color is blue. The material of the second barrier layer includes a visible light shielding material, which can include, for example, a matte material such as black photoresist, a reflective material such as a metal layer, the material of the first light absorbing layer and the material of the second light absorbing layer include organic dyes, nano absorption particles or inorganic oxides for absorbing, for example, blue light, for example, zinc oxide nanoparticle photoresist, the material of the first filter layer, the material of the second filter layer and the material of the third filter layer include organic dyes, nano absorption particles or inorganic oxides.

[0060] According to another embodiment of the second barrier layer of the present disclosure, before the first barrier layer is provided on the transparent substrate, the method further includes: providing a second barrier layer on the transparent substrate, so that the second barrier layer includes a second through hole array, the arrangement of the second through hole array corresponds to the arrangement of the micro LED unit array, wherein the second through hole array includes a plurality of groups of second through holes, each group of second through holes includes two second through holes; a second filling step, a second intermediate structure is obtained when the second filling step is completed, the second filling step includes at least one of the following steps: filling a fourth filling part in one second through hole in each group of second through holes, the fourth filling part including a fourth filter layer that only allows light of a fourth color to pass through, a first light absorbing layer or a transparent material for partially absorbing light of a third color; filling a fifth filling part in another second through hole in each group of second through holes, the fifth filling part including a third filter layer that only allows light of a third color to pass through, a first light absorbing layer or a transparent material for partially absorbing light of the third color.

[0061] Furthermore, the second filling step further comprises: when there are unfilled second through holes in each group of second through holes, filling the unfilled second through holes with a transparent material.

[0062] Further, a first barrier layer is arranged on the transparent substrate, so that the first barrier layer includes a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes multiple groups of first through holes, and each group of first through holes includes at least two first through holes, including: a first barrier layer is arranged on the second intermediate structure, and a first through hole array is opened on the first barrier layer, so that the first through hole array is aligned with the second through hole array, and the first through hole array exposes the second intermediate structure, wherein the first through hole array includes multiple groups of first through holes corresponding to the multiple groups of second through holes, and each group of first through holes includes two first through holes respectively aligned with two second through holes.

[0063] Furthermore, before the first barrier layer is provided on the second intermediate structure, the method further comprises: providing a second light absorbing layer on the second intermediate structure, wherein the second light absorbing layer is used to partially absorb the light emitted by the micro LED unit. Providing the first barrier layer on the second intermediate structure comprises: providing the first barrier layer on the second light absorbing layer.

[0064] In this embodiment, the light of the fourth color refers to the light of the wavelength range corresponding to the fourth color, the fourth color is yellow light and the third color is blue. The material of the second barrier layer includes a visible light shielding material, which may include, for example, a matte material such as a black photoresist, a reflective material such as a metal layer, the material of the first light absorbing layer and the material of the second light absorbing layer include an organic dye, nano absorption particles or an inorganic oxide for absorbing, for example, blue light, and may be, for example, zinc oxide nanoparticle photoresist, and the material of the fourth filter layer includes an organic dye, nano absorption particles or an inorganic oxide.

[0065] Reference Figure 2-Figure 13 ,in Figure 4 FIG. 1 shows a side view schematic diagram of a second barrier layer 102 disposed on a transparent substrate 101. Figure 4 As shown, the second barrier layer 102 may be, for example, a black photoresist layer, so a black photoresist layer may be coated on a transparent substrate 101 such as a glass substrate by spin coating, and then, for example, a second through hole array 1020 may be opened on the black photoresist layer by photolithography, so that the arrangement of the second through hole array 1020 corresponds to the arrangement of the micro LED unit array 201 to be used later and the transparent substrate 101 is exposed, wherein the second through hole array 1020 includes a plurality of groups of second through holes, each group of second through holes includes a first second through hole 1021, a second second through hole 1022 and a third second through hole 1023. For clarity and simplicity, Figure 4Only a group of second through holes included in the second through hole array 1020 is shown, and the group of second through holes includes a first second through hole 1021, a second second through hole 1022 and a third second through hole 1023. Figure 4 The number of groups of second through holes and the number of second through holes in each group of second through holes shown in the figure are only for illustration and are not limited here. The second barrier layer 102 such as a black photoresist layer can make the screen appear black when the display device is powered off or turned off.

[0066] Reference Figure 2-Figure 13 ,in Figure 5 A side view schematic diagram of the filling portion filled in each group of second through holes is shown. Figure 4 ,like Figure 5 As shown, a first filling portion is filled in the first second through hole 1021 in each group of second through holes, and the first filling portion may include a first filter layer 1031 that only allows light of a first color, such as red, to pass through; a second filling portion is filled in the second second through hole 1022 in each group of second through holes, and the second filling portion may include a second filter layer 1032 that only allows light of a second color, such as green, to pass through; a first light absorption layer 1033 is filled in the third second through hole 1023 in each group of second through holes, and the first light absorption layer 1033 is used to partially absorb light of a third color, such as blue, to obtain the following: Figure 5 The first intermediate structure 30 is shown. It is worth noting that in other embodiments, when there are unfilled second through holes in each group of second through holes, a transparent material may be filled in the unfilled second through holes so as to support the portion above the corresponding first through hole in a subsequent preparation process requiring support, and the transparent material may be any applicable material such as a transparent resin.

[0067] Reference Figure 2-Figure 13 ,in Figure 6 FIG. 4 shows a side view of a second light absorbing layer 104 disposed on the first intermediate structure 30. Figure 6 As shown, a second light absorption layer 104 is disposed on the first intermediate structure 30. The second light absorption layer 104 is used to partially absorb, for example, blue light emitted by the micro LED unit. The material of the second light absorption layer 105 can be the same as that of the first light absorption layer 1033.

[0068] Reference Figure 2-Figure 13 ,in Figure 7 FIG. 1 shows a side view of a first barrier layer 105 disposed on the second light absorbing layer 104. Figure 7As shown, the first barrier layer 105 may be, for example, a black photoresist layer, so the black photoresist layer may be coated on the second light absorbing layer 104 by spin coating, and then, for example, a first through hole array 1050 may be opened on the black photoresist layer by photolithography, so that the first through hole array 1050 is aligned with the second through hole array 1020, and the first through hole array 1050 exposes a portion of the second light absorbing layer 104. The first through hole array 1050 includes a plurality of groups of first through holes corresponding to the plurality of groups of second through holes, and each group of first through holes includes a first first through hole 1051 aligned with the first second through hole 1021, a second first through hole 1052 aligned with the second second through hole 1022, and a third first through hole 1053 aligned with the third second through hole 1023, so as to obtain the following: Figure 7 The structure shown.

[0069] In step S103 , a photoluminescent material layer may be filled in each group of first through holes, and the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer.

[0070] According to an embodiment of the present disclosure, after obtaining the above-mentioned first through hole array, a photoluminescent material layer may be filled into the first through hole array.

[0071] Referring to an embodiment of the first barrier layer and the second barrier layer in step S102, according to an embodiment of the filled photoluminescent material layer of the present disclosure, the photoluminescent material layer includes a photoluminescent material layer of a first color and a photoluminescent material layer of a second color, and the photoluminescent material layer is filled in each group of first through holes, and the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, including: filling the first color photoluminescent material layer in the first first through hole in each group of first through holes, and filling the second color photoluminescent material layer in the second first through hole in each group of first through holes, wherein the micro LED unit emits light of a third color, and the light corresponding to the first color, the light corresponding to the second color, and the light of the third color are synthesized to obtain white light.

[0072] In this embodiment, the first color, the second color and the third color may be three primary colors, for example, the first color is red, the second color is green and the third color is blue. The material of the photoluminescent material layer of the first color and the material of the photoluminescent material layer of the second color include at least one of II-VI group quantum dots, III-V group quantum dots, perovskite quantum dots and carbon quantum dots.

[0073] Referring to another embodiment of the first barrier layer and the second barrier layer in step S102, according to another embodiment of the filled photoluminescent material layer of the present disclosure, the photoluminescent material layer includes a photoluminescent material layer of a fourth color, and the photoluminescent material layer is filled in each group of first through holes, and the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, including: in each group of first through holes, the photoluminescent material layer of the fourth color is filled in the first through hole aligned with the second through hole for filling the fourth filling part, wherein the micro LED unit emits light of a third color, and white light is obtained by synthesizing the light corresponding to the fourth color and the light of the third color.

[0074] In this embodiment, the fourth color is yellow light and the third color is blue. The material of the photoluminescent material layer of the fourth color may include at least one of II-VI group quantum dots, III-V group quantum dots, perovskite quantum dots and carbon quantum dots.

[0075] According to an embodiment of the present disclosure, when a photoluminescent material layer is filled in each group of first through holes, the method further includes: filling a sixth filling portion in a first through hole other than the first through hole filled with the photoluminescent material layer in each group of first through holes, the sixth filling portion including a third light absorbing layer, a photoluminescent material layer of a third color, or a transparent material, the third light absorbing layer being used to partially absorb the light emitted by the micro LED unit. The material of the third light absorbing layer includes an organic dye, nano absorption particles, or an inorganic oxide for absorbing, for example, blue light, and the material of the third light absorbing layer may be the same as the material of the first light absorbing layer and the material of the second light absorbing layer, for example, zinc oxide nanoparticle photoresist. In addition, the sixth filling portion may also include a photoluminescent material layer of a third color, for example, blue, the material of the photoluminescent material layer of the third color including at least one of II-VI quantum dots, III-V quantum dots, perovskite quantum dots, and carbon quantum dots.

[0076] Reference Figure 2-Figure 13 ,in Figure 8 A schematic side view of a photoluminescent material layer filled in each group of first through holes is shown. Figure 7 ,like Figure 8 As shown, the first through hole 1051 in each group of first through holes is filled with a first color photoluminescent material layer 1061, such as red, and the second through hole 1052 in each group of first through holes is filled with a second color photoluminescent material layer 1062, such as green.

[0077] Reference Figure 2-Figure 13 ,in Fig. 9A side view schematic diagram of the sixth filling portion filled in the first through holes other than the first through holes filled with the photoluminescent material layer in each group of first through holes is shown. Figure 7 and Figure 8 ,like Fig. 9 As shown, the sixth filling part is, for example, a third light absorbing layer 1063, and the third light absorbing layer 1063 for absorbing, for example, blue light is filled in the third first through hole 1053 aligned with the third second through hole 1023. The material of the third light absorbing layer 1063 includes an organic dye, nano absorption particles or inorganic oxide for absorbing blue light, and the material of the third light absorbing layer 1063 can be the same as the material of the first light absorbing layer 1033 and the material of the second light absorbing layer 104. It is worth noting that the above filling order of the first color photoluminescent material layer 1061, the second color photoluminescent material layer 1062 and the third light absorbing layer 1063 is only exemplary and is not limited here. The filling order of the first color photoluminescent material layer 1061, the second color photoluminescent material layer 1062 and the third light absorbing layer 1063 can be arbitrarily adjusted according to the actual preparation conditions such as specific processes and equipment. The sixth filling part may further include a photoluminescent material layer of a third color, such as blue, so that the light of a third color, such as blue light, emitted by the micro LED unit excites the photoluminescent material layer of the third color to emit light of a third color, such as blue light.

[0078] In step S104, a first reflective layer may be disposed on the first barrier layer and the photoluminescent material layer to obtain a first color conversion structure, wherein the first reflective layer is used to reflect light of a color corresponding to the photoluminescent material layer.

[0079] According to an embodiment of the present disclosure, after the photoluminescent material layer is filled, a first reflective layer may be disposed on the first barrier layer and the photoluminescent material layer. The first reflective layer includes a distributed Bragg reflective film for reflecting light of a color corresponding to the photoluminescent material layer, the distributed Bragg reflective film may reflect light of at least one color, and the first reflective layer may be, for example, a distributed Bragg reflective film formed by alternately stacking silicon dioxide layers and titanium dioxide layers.

[0080] Referring to an embodiment of the first barrier layer and the second barrier layer in step S102 and an embodiment of the filling of the photoluminescent material layer in step S103, according to an embodiment of the first reflective layer of the present disclosure, the first reflective layer is used to reflect the light of the first color and the light of the second color.

[0081] Referring to another embodiment of the first barrier layer and the second barrier layer in step S102 and another embodiment of the filling of the photoluminescent material layer in step S103 , according to another embodiment of the filled photoluminescent material layer of the present disclosure, the first reflective layer is used to reflect light of a fourth color.

[0082] According to an embodiment of the present disclosure, after the first reflective layer is provided on the first barrier layer and the photoluminescent material layer, the method further comprises: providing an insulating layer on the first reflective layer.

[0083] Reference Figure 2-Figure 13 ,in Fig.10 FIG. 4 shows a side view schematic diagram of a first reflective layer disposed on the first barrier layer and the photoluminescent material layer. Fig.10 As shown, a first reflective layer 107 can be disposed on the first barrier layer 105, the first photoluminescent material layer 1061, the second photoluminescent material layer 1062 and the third light absorbing layer 1063. The first reflective layer 107 can reflect, for example, red light emitted by the photoluminescent material layer 1061 of a first color, for example, red, which is excited by, for example, blue light emitted by the micro LED unit, toward the photoluminescent material layer 1061, and the first reflective layer 107 can reflect, for example, green light emitted by the photoluminescent material layer 1062 of a second color, for example, green, which is excited by, for example, blue light emitted by the micro LED unit, toward the photoluminescent material layer 1062.

[0084] Reference Figure 2-Figure 13 ,in Fig.11 FIG. 4 shows a side view schematic diagram of an insulating layer disposed on the first reflective layer. Fig.11 As shown, a plasma enhanced chemical vapor deposition (PECVD) method can be used to deposit an insulating layer 108 such as a silicon dioxide layer on the first reflective layer 107 to obtain a Fig.11 The first color conversion structure 10 shown. Of course, the insulating layer may also include any other applicable materials, such as any applicable polymer organic materials and inorganic oxides, and any applicable preparation process may be used to prepare the insulating layer for different materials. The insulating layer is used to protect other parts of the first color conversion structure, and can be used as a surface layer of the first color conversion structure to make the surface of the first color conversion structure smoother, thereby facilitating the subsequent bonding of the first color conversion structure with the micro LED chip.

[0085] In step S105, the side of the first color conversion structure opposite to the transparent substrate may be bonded to the light emitting side of the micro LED chip to obtain a micro LED device.

[0086] According to an embodiment of the present disclosure, after obtaining the first color conversion structure, the side of the first color conversion structure opposite to the transparent substrate can be bonded to the light emitting side of the micro LED chip to obtain a micro LED device.

[0087] Further, in the case where an insulating layer is provided on the first reflective layer, bonding the side of the first color conversion structure opposite to the transparent substrate to the light emitting side of the micro LED chip includes: bonding the insulating layer of the first color conversion structure to the light emitting side of the micro LED chip.

[0088] Furthermore, each micro LED unit in the micro LED unit array includes a first semiconductor layer on the light emitting side, and bonding the insulating layer of the first color conversion structure to the light emitting side of the micro LED chip includes: bonding the insulating layer of the first color conversion structure to the first semiconductor layer.

[0089] According to an embodiment of the present disclosure, after bonding the side of the first color conversion structure opposite to the transparent substrate to the light-emitting side of the micro LED chip, the method includes: removing the transparent substrate of the first color conversion structure to obtain a second color conversion structure from the first color conversion structure.

[0090] According to an embodiment of the present disclosure, the micro LED chip structure also includes a driving chip, and the side of the micro LED chip opposite to the light emitting side is arranged on the driving chip, or the micro LED chip structure also includes a driving chip and a flexible circuit board, and the side of the micro LED chip opposite to the light emitting side is arranged on the driving chip to form a micro LED module, and the micro LED module is arranged on the flexible circuit board through the driving chip.

[0091] Reference Figure 2-Figure 13 ,in Fig.12 FIG. 4 shows a side view of bonding the first color conversion structure 10 to the micro LED chip 20 according to one embodiment of the present disclosure. Fig.12 As shown, the insulating layer 108 of the first color conversion structure 10 is bonded to the first semiconductor layer 20111 of the LED chip 20 of the micro LED chip structure to obtain Fig.12 The structure shown.

[0092] Reference Figure 2-Figure 13 ,in Fig.13 FIG. 4 shows a side view of a micro LED device 1 according to an embodiment of the present disclosure. Fig.13 As shown, remove Fig.12 The transparent substrate 101 of the first color conversion structure 10 in the structure shown in FIG. 1 is used to obtain the second color conversion structure 11 through the first color conversion structure 10. Fig.13The micro LED device 1 is shown.

[0093] Reference Figures 2 to 13 It should be understood that the light of the third color, such as blue light, emitted by the micro LED unit 2011 excites the photoluminescent material layer 1061 of the first color, such as red, to emit red light, and the light of the third color, such as blue light, emitted by the micro LED unit 2011 excites the photoluminescent material layer 1062 of the second color, such as green, to emit green light. The first reflective layer 107 is used to reflect the light of the color corresponding to the photoluminescent material layer and allows the light emitted by the micro LED unit to pass through. Since the first reflective layer 107 covers the photoluminescent material layer 1061 of the first color and the photoluminescent material layer 1062 of the second color, and is located between the photoluminescent material layer 1061 of the first color and the photoluminescent material layer 1062 of the second color and the micro LED chip 20, the light of the third color, such as blue, emitted from the micro LED unit 2011 can pass through the first reflective layer 107. When the blue light emitted by the micro LED unit excites the photoluminescent material layer of the first color, such as red, to emit red light, part of the excited red light will be emitted toward the direction of the micro LED unit. The first reflective layer can transmit the part of the red light toward the first color, such as red. The first reflective layer can reflect the red light in the direction of the photoluminescent material layer of the first color, thereby increasing the light output of the light of the color corresponding to the photoluminescent material layer, thereby improving the brightness of the micro LED and preventing part of the red light emitted in the direction of the micro LED unit from interfering with the blue light emitted by the micro LED unit; similarly, when the blue light emitted by the micro LED unit excites the photoluminescent material layer of the second color, such as green, to emit green light, part of the excited green light will be emitted in the direction of the micro LED unit, and the first reflective layer can reflect the part of the green light in the direction of the photoluminescent material layer of the second color, such as green, thereby increasing the light output of the light of the color corresponding to the photoluminescent material layer, thereby improving the brightness of the micro LED and preventing part of the green light emitted in the direction of the micro LED unit from interfering with the blue light emitted by the micro LED unit.

[0094] Regarding the first light absorption layer 1033, since the third second through hole 1023 is aligned with the third first through hole 1053, when the first light absorption layer 1033 is filled in the third second through hole 1023, the first light absorption layer 1033 can partially absorb, for example, blue light emitted by the micro LED unit 2011 corresponding to the third second through hole 1023, thereby reducing the blue light overflow caused by the blue light emitted by the micro LED unit directly emitted from the micro LED device, thereby further improving the display effect of the micro LED device.

[0095] In addition, regarding the second light absorption layer 104, the second light absorption layer 104 can partially absorb, for example, blue light emitted by the micro LED unit 2011 corresponding to the third second through hole 1023, thereby further reducing the blue light overflow caused by the blue light emitted by the micro LED unit directly emitted from the micro LED device, thereby further improving the display effect of the micro LED device. And because the second light absorption layer 104 covers the photoluminescent material layer, when a part of, for example, blue light emitted by the micro LED unit corresponding to the photoluminescent material layer does not participate in the excitation of the photoluminescent material layer and leaks through the photoluminescent material layer, the second light absorption layer 104 can absorb the leaked part of the blue light, thereby reducing the mixed output of the leaked part of the blue light and the red light and green light emitted by the exciting photoluminescent material layer, thereby improving the color purity of the micro LED, thereby improving the display effect of the micro LED device.

[0096] In addition, with regard to the third light absorption layer 1063, when the third light absorption layer 1063 is filled in the third first through hole 1053, the third light absorption layer 1063 can further enhance the absorption of, for example, blue light emitted by the micro LED unit 2011 corresponding to the third first through hole 1053, thereby further reducing the blue light overflow caused by the light emitted by the micro LED unit directly emitted from the micro LED device, thereby further improving the display effect of the micro LED device.

[0097] It is worth noting that, when the first second through hole 1021 is filled with the first filter layer 1031 and the second second through hole 1022 is filled with the second filter layer 1032, the first filter layer 1031 only allows light of the first color, such as red light, to pass through, and the first filter layer 1031 will reflect light of the third color, such as blue light, toward the direction of the photoluminescent material layer 1061 of the first color, such as red light. The second filter layer 1032 only allows light of the second color, such as green light, to pass through, and the second filter layer 1032 will reflect light of the third color, such as blue light, toward the direction of the photoluminescent material layer 1062 of the second color, such as green light. Therefore, the function of the first filter layer 1031 and the second filter layer 1032 is to reflect light other than the light of the corresponding color, which is different from the function of the first light absorption layer, the second light absorption layer and the third light absorption layer to absorb light.

[0098] It is worth noting that when the material of the first barrier layer is a transparent material, the number of first through holes in each group of first through holes may be different from the number of second through holes in the corresponding second through hole group. For example, when each group of second through holes includes a first second through hole, a second second through hole, and a third second through hole, the corresponding first through hole group may include a first first through hole aligned with the first second through hole and a second first through hole aligned with the second second through hole, and the first first through hole and the second first through hole may be filled with a photoluminescent material layer. Since the first barrier layer is a transparent material, the light emitted by the micro LED unit that does not correspond to the photoluminescent material layer may pass through the first barrier layer of transparent material and be emitted from the micro LED device.

[0099] The present disclosure also provides a micro LED device.

[0100] like Figure 2-Figure 13 As shown, the micro LED device 1 includes a second color conversion structure 11 and a micro LED chip structure, wherein the micro LED chip structure includes a micro LED chip 20, and the micro LED chip 20 includes a micro LED unit array 201 composed of a plurality of micro LED units 2011, wherein the second color conversion structure 11 includes: a first barrier layer 105, wherein the first barrier layer 105 includes a first through hole array 1050, and the arrangement of the first through hole array 1050 corresponds to the arrangement of the micro LED unit array 201, wherein the first through hole array 1050 includes a plurality of groups of first through holes, and each group of first through holes includes at least two first through holes; a photoluminescent material layer, wherein the photoluminescent material layer is filled in each group of first through holes, wherein the color of light emitted by the micro LED unit 2011 is different from the color corresponding to the photoluminescent material layer; and a first reflective layer 107, wherein the first reflective layer 107 is arranged below the first barrier layer 105 and the photoluminescent material layer, wherein the first reflective layer 107 is used to reflect light of the color corresponding to the photoluminescent material layer. The first reflective layer 107 of the second color conversion structure 11 is disposed on the light emitting side of the micro LED chip 20 .

[0101] According to an embodiment of the present disclosure, the second color conversion structure 11 further includes a second barrier layer 102, the second barrier layer 102 includes a second through hole array 1020, the arrangement of the second through hole array 1020 corresponds to the arrangement of the micro LED unit array 201, wherein the second through hole array 1020 includes a plurality of groups of second through holes, each group of second through holes includes three second through holes, and the three second through holes include a first second through hole 1021, a second second through hole 1022 and a third second through hole 1023. The second color conversion structure 11 also includes at least one of a first filling part, a second filling part and a third filling part, wherein: the first filling part is used to fill the first second through hole 1021 in each group of second through holes, and the first filling part includes a first filter layer 1031 that only allows light of the first color to pass through, and a first light absorbing layer or a transparent material for partially absorbing light of the third color; the second filling part is used to fill the second second through hole 1022 in each group of second through holes, and the second filling part includes a second filter layer 1032 that only allows light of the second color to pass through, and a first light absorbing layer or a transparent material for partially absorbing light of the third color; the third filling part is used to fill the third second through hole 1023 in each group of second through holes, and the third filling part includes a third filter layer that only allows light of the third color to pass through, and a first light absorbing layer 1033 or a transparent material for partially absorbing light of the third color.

[0102] According to an embodiment of the present disclosure, when there is an unfilled second through hole in each group of second through holes, the second color conversion structure 11 further includes a transparent material, and the transparent material is filled in the unfilled second through hole.

[0103] According to an embodiment of the present disclosure, each group of first through holes includes three first through holes, the first barrier layer 105 is disposed below the second barrier layer 102, the first through hole array 1050 is aligned with the second through hole array 1020, wherein the first through hole array 1050 includes a plurality of groups of first through holes corresponding to the plurality of groups of second through holes, each group of first through holes includes a first first through hole 1051 aligned with the first second through hole 1021, a second first through hole 1052 aligned with the second second through hole 1022, and a third first through hole 1053 aligned with the third second through hole 1023, and the photoluminescent material layer The present invention comprises a photoluminescent material layer 1061 of a first color and a photoluminescent material layer 1062 of a second color, wherein the photoluminescent material layer 1061 of the first color is filled in the first first through hole 1051 in each group of first through holes, and the photoluminescent material layer 1062 of the second color is filled in the second first through hole 1052 in each group of first through holes, wherein the micro LED unit 2011 emits light of a third color, and the light corresponding to the first color, the light corresponding to the second color and the light of the third color are synthesized to obtain white light, and the first reflective layer is used to reflect the light of the first color and the light of the second color.

[0104] According to an embodiment of the present disclosure, the first color is red, the second color is green, and the third color is blue.

[0105] According to an embodiment of the present disclosure, the second color conversion structure further includes a second barrier layer, the second barrier layer includes a second through hole array, the arrangement of the second through hole array corresponds to the arrangement of the micro LED unit array, wherein the second through hole array includes multiple groups of second through holes, each group of second through holes includes two second through holes. The second color conversion structure further includes at least one of a fourth filling part and a fifth filling part, wherein: the fourth filling part is used to fill in one second through hole in each group of second through holes, the fourth filling part includes a fourth filter layer that only allows light of the fourth color to pass through, a first light absorbing layer or a transparent material that partially absorbs light of the third color; the fifth filling part is used to fill in another second through hole in each group of second through holes, the fifth filling part includes a third filter layer that only allows light of the third color to pass through, a first light absorbing layer or a transparent material that partially absorbs light of the third color.

[0106] According to an embodiment of the present disclosure, when there is an unfilled second through hole in each group of second through holes, the second color conversion structure further includes a transparent material, and the transparent material is filled in the unfilled second through hole.

[0107] According to an embodiment of the present disclosure, the first barrier layer is disposed below the second barrier layer, the first barrier layer comprises a first through hole array, the first through hole array is aligned with the second through hole array, wherein the first through hole array comprises a plurality of groups of first through holes corresponding to the plurality of groups of second through holes, each group of first through holes comprises two first through holes respectively aligned with two second through holes, the photoluminescent material layer comprises a photoluminescent material layer of a fourth color, the photoluminescent material layer of the fourth color is filled in the first through holes aligned with the second through holes for filling the fourth filling portion, wherein the micro LED unit emits light of a third color, the light corresponding to the fourth color and the light of the third color are synthesized to obtain white light, and the first reflective layer is used to reflect the light of the fourth color.

[0108] According to an embodiment of the present disclosure, the fourth color is yellow and the third color is blue.

[0109] According to an embodiment of the present disclosure, the second color conversion structure 11 further includes a second light absorbing layer 104, which is disposed below the second barrier layer 102, and is used to partially absorb the light emitted by the micro LED unit 2011. The first barrier layer 105 is disposed below the second light absorbing layer 104.

[0110] According to an embodiment of the present disclosure, the second color conversion structure 11 further includes a sixth filling portion, which includes a third light absorbing layer 1063, a photoluminescent material layer of a third color or a transparent material, and the sixth filling portion is filled in a first through hole other than the first through hole filled with the photoluminescent material layer in each group of first through holes, and the third light absorbing layer 1063 is used to partially absorb the light emitted by the micro LED unit 2011.

[0111] According to an embodiment of the present disclosure, the second color conversion structure 11 further includes an insulating layer 108 , which is disposed below the first reflective layer 107 . The insulating layer 108 of the second color conversion structure 11 is disposed on the light emitting side of the micro LED chip 20 .

[0112] According to an embodiment of the present disclosure, the micro LED chip structure also includes a driving chip, and the side of the micro LED chip 20 opposite to the light emitting side is arranged on the driving chip, or the micro LED chip structure also includes a driving chip and a flexible circuit board, and the side of the micro LED chip 20 opposite to the light emitting side is arranged on the driving chip to form a micro LED module, and the micro LED module is arranged on the flexible circuit board through the driving chip.

[0113] According to an embodiment of the present disclosure, the first reflective layer 107 includes a distributed Bragg reflector for reflecting light of a color corresponding to the photoluminescent material layer, the material of the first barrier layer 105 and the material of the second barrier layer 102 include visible light shielding materials, the material of the photoluminescent material layer 1061 of the first color and the material of the photoluminescent material layer 1062 of the second color include at least one of II-VI group quantum dots, III-V group quantum dots, perovskite quantum dots and carbon quantum dots, the material of the first light absorption layer 1033 includes an organic dye, nano absorption particles or inorganic oxide for absorbing blue light, and the material of the first filter layer 1031, the second filter layer 1032 and the third filter layer include organic dyes, nano absorption particles or inorganic oxides.

[0114] It is worth noting that any relevant description about the micro LED device in the above-mentioned micro LED device preparation method (including but not limited to technical features and their functions, explanations, etc.) can be applied to the micro LED device disclosed in the present invention.

[0115] According to embodiments of the present disclosure, the pixel size in the micro LED device is typically less than 50 microns.

[0116] The present disclosure also provides a display device, which includes the above-mentioned type LED device. The display device can be applied to flexible electronic devices to realize technologies such as augmented reality (AR), virtual reality (VR), extended reality (XR), and mixed reality (MR). For example, the micro LED device can be the projection part of an electronic device, such as a projector, a head-up display (HUD), etc.; for another example, the micro LED device can also be the display part of an electronic device, such as a smart phone, a smart watch, a laptop, a tablet computer, a driving recorder, a navigator, a head-mounted device, and any other device with a display screen.

[0117] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0118] It should be understood that "one embodiment" or "an embodiment" mentioned throughout the specification means that specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. It should be understood that in various embodiments of the present application, the size of the serial number of each step / process mentioned above does not mean the order of execution, and the execution order of each step / process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiment of the present application. In addition, the serial numbers of the embodiments of the present application mentioned above are only for description and do not represent the advantages and disadvantages of the embodiments.

[0119] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein, for example. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0120] The above description is only a preferred embodiment of the present disclosure and is not intended to limit the present disclosure. For those skilled in the art, the present disclosure may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A method for preparing a micro LED device, wherein: The method comprises: Obtaining a transparent substrate and a micro LED chip structure, wherein the micro LED chip structure comprises a micro LED chip, and the micro LED chip comprises a micro LED unit array composed of a plurality of micro LED units; Disposing a first barrier layer on the transparent substrate, so that the first barrier layer includes a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes a plurality of groups of first through holes, and each group of first through holes includes at least two first through holes; Filling a photoluminescent material layer in each group of first through holes, wherein the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer; Arranging a first reflective layer on the first barrier layer and the photoluminescent material layer to obtain a first color conversion structure, wherein the first reflective layer is used to reflect light of a color corresponding to the photoluminescent material layer; The side of the first color conversion structure opposite to the transparent substrate is bonded to the light emitting side of the micro LED chip to obtain a micro LED device.

2. The method for preparing a micro LED device according to claim 1, wherein: Before providing the first barrier layer on the transparent substrate, the method further comprises: Disposing a second barrier layer on the transparent substrate, so that the second barrier layer includes a second through hole array, the arrangement of the second through hole array corresponds to the arrangement of the micro LED unit array, wherein the second through hole array includes a plurality of groups of second through holes, each group of second through holes includes three second through holes, and the three second through holes include a first second through hole, a second second through hole and a third second through hole; A first filling step, when the first filling step is completed, a first intermediate structure is obtained, and the first filling step includes at least one of the following steps: Filling a first filling portion in a first second through hole in each group of second through holes, wherein the first filling portion includes a first filter layer that allows only light of a first color to pass through, a first light absorption layer for partially absorbing light of a third color, or a transparent material; Filling a second filling portion in a second second through hole in each group of second through holes, wherein the second filling portion includes a second filter layer that allows only light of the second color to pass through, a first light absorption layer for partially absorbing light of the third color, or a transparent material; A third filling portion is filled in the third second through hole in each group of second through holes, wherein the third filling portion includes a third filter layer that allows only light of a third color to pass through, a first light absorption layer for partially absorbing light of the third color, or a transparent material.

3. The method for preparing a micro LED device according to claim 2, wherein: The first filling step further comprises: When there are unfilled second through holes in each group of second through holes, the unfilled second through holes are filled with a transparent material.

4. The method for preparing a micro LED device according to claim 2, wherein: Each group of first through holes includes three first through holes, and a first barrier layer is arranged on the transparent substrate, so that the first barrier layer includes a first through hole array, and the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes a plurality of groups of first through holes, and each group of first through holes includes at least two first through holes including: A first barrier layer is disposed on the first intermediate structure, and a first through hole array is opened on the first barrier layer, so that the first through hole array is aligned with the second through hole array, and the first through hole array exposes the first intermediate structure, wherein the first through hole array includes a plurality of groups of first through holes corresponding to the plurality of groups of second through holes, each group of first through holes includes a first first through hole aligned with the first second through hole, a second first through hole aligned with the second second through hole, and a third first through hole aligned with the third second through hole, The photoluminescent material layer includes a photoluminescent material layer of a first color and a photoluminescent material layer of a second color, the photoluminescent material layer is filled in each group of first through holes, and the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, including: A first photoluminescent material layer of a first color is filled in a first first through hole in each group of first through holes, and a second photoluminescent material layer of a second color is filled in a second first through hole in each group of first through holes, wherein the micro LED unit emits light of a third color, and the light corresponding to the first color, the light corresponding to the second color, and the light of the third color are synthesized to obtain white light, The first reflective layer is used for reflecting light of a first color and light of a second color.

5. The method for preparing a micro LED device according to claim 1, wherein: Before providing the first barrier layer on the transparent substrate, the method further comprises: Disposing a second barrier layer on the transparent substrate, so that the second barrier layer includes a second through hole array, the arrangement of the second through hole array corresponds to the arrangement of the micro LED unit array, wherein the second through hole array includes a plurality of groups of second through holes, and each group of second through holes includes two second through holes; A second filling step, when the second filling step is completed, a second intermediate structure is obtained, and the second filling step includes at least one of the following steps: Filling a fourth filling portion in one second through hole in each group of second through holes, wherein the fourth filling portion includes a fourth filter layer that allows only light of a fourth color to pass through, a first light absorption layer for partially absorbing light of a third color, or a transparent material; A fifth filling portion is filled in another second through hole in each group of second through holes, wherein the fifth filling portion includes a third filter layer that allows only light of a third color to pass therethrough, a first light absorption layer for partially absorbing light of the third color, or a transparent material.

6. The method for preparing a micro LED device according to claim 5, wherein: The second filling step further comprises: When there are unfilled second through holes in each group of second through holes, the unfilled second through holes are filled with a transparent material.

7. The method for preparing a micro LED device according to claim 5, wherein: A first barrier layer is disposed on the transparent substrate, so that the first barrier layer includes a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes a plurality of groups of first through holes, each group of first through holes includes at least two first through holes including: A first barrier layer is disposed on the second intermediate structure, and a first through hole array is opened on the first barrier layer, so that the first through hole array is aligned with the second through hole array, and the first through hole array exposes the second intermediate structure, wherein the first through hole array includes a plurality of groups of first through holes corresponding to the plurality of groups of second through holes, and each group of first through holes includes two first through holes respectively aligned with two second through holes, The photoluminescent material layer includes a photoluminescent material layer of a fourth color, the photoluminescent material layer is filled in each group of first through holes, and the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, including: In each group of first through holes, a photoluminescent material layer of a fourth color is filled in a first through hole aligned with a second through hole for filling a fourth filling portion, wherein the micro LED unit emits light of a third color, and white light is obtained by synthesizing the light of the fourth color and the light of the third color. The first reflective layer is used for reflecting light of a fourth color.

8. The method for preparing a micro LED device according to claim 4, wherein: Before the first barrier layer is provided on the first intermediate structure, the method further comprises: providing a second light absorbing layer on the first intermediate structure, wherein the second light absorbing layer is used to partially absorb the light emitted by the micro LED unit. Providing a first barrier layer on the first intermediate structure includes: providing the first barrier layer on the second light absorbing layer.

9. The method for preparing a micro LED device according to claim 1, wherein: When filling the photoluminescent material layer in each group of first through holes, the method further comprises: A sixth filling portion is filled in the first through holes other than the first through holes filled with the photoluminescent material layer in each group of first through holes, wherein the sixth filling portion includes a third light absorbing layer, a photoluminescent material layer of a third color, or a transparent material, and the third light absorbing layer is used to partially absorb the light emitted by the micro LED unit.

10. The method for preparing a micro LED device according to claim 1, wherein: After the first reflective layer is disposed on the first barrier layer and the photoluminescent material layer, the method further comprises: disposing an insulating layer on the first reflective layer, Bonding the side of the first color conversion structure opposite to the transparent substrate to the light-emitting side of the micro LED chip includes: bonding the insulating layer of the first color conversion structure to the light-emitting side of the micro LED chip.

11. The method for preparing a micro LED device according to claim 1, wherein: After bonding the side of the first color conversion structure opposite to the transparent substrate to the light emitting side of the micro LED chip, the method includes: The transparent substrate of the first color conversion structure is removed, and a second color conversion structure is obtained from the first color conversion structure.

12. A micro LED device, wherein: The micro LED device comprises a second color conversion structure and a micro LED chip structure, wherein the micro LED chip structure comprises a micro LED chip, and the micro LED chip comprises a micro LED unit array composed of a plurality of micro LED units, wherein the second color conversion structure comprises: A first barrier layer, the first barrier layer comprising a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array comprises a plurality of groups of first through holes, and each group of first through holes comprises at least two first through holes; a photoluminescent material layer, the photoluminescent material layer being filled in each group of first through holes, wherein the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer; a first reflective layer, the first reflective layer being arranged below the first barrier layer and the photoluminescent material layer, wherein the first reflective layer is used to reflect light of a color corresponding to the photoluminescent material layer; The first reflective layer of the second color conversion structure is arranged on the light emitting side of the micro LED chip.

13. A display device, wherein: The display device comprises the micro LED device according to claim 12.

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