Miniature LED device preparation method, miniature LED device and display device

Abstract

The invention provides a miniature LED device preparation method, a miniature LED device and a display device. The method comprises the following steps: obtaining a transparent substrate and a micro LED chip structure, wherein the structure comprises a micro LED chip; a first partition layer is arranged on the transparent substrate, so that the first partition layer comprises a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array of the micro LED chip, the first through hole array comprises a plurality of groups of first through holes, and each group of first through holes comprises at least two first through holes; each group of first through holes is filled with a photoluminescent material layer and a first light absorption layer to obtain a first color conversion structure, the first light absorption layer is used for partially absorbing light emitted by the micro LED unit, and the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer; and bonding one side, opposite to the transparent substrate, of the first color conversion structure with the light emitting side of the micro LED chip to obtain the micro LED device.

Description

Technical Field

[0001] The present disclosure relates to the technical field of semiconductor Micro LED, and in particular, to a method for preparing a Micro LED device, a Micro LED device and a display device. Background Art

[0002] Micro-LED is a comprehensive technology that integrates new display technology and light-emitting diode (LED) technology. It has the advantages of small size, high brightness, high resolution, and low power consumption. It is considered to be one of the most promising next-generation new display and light-emitting devices. Currently, Micro LED full-color display can be achieved in a variety of ways, one of which is the color conversion method. However, the full-color Micro LED device achieved by the color conversion method still has problems such as unsatisfactory display effects. Summary of the invention

[0003] The solution disclosed herein provides a method for preparing a micro LED device, a micro LED device, and a display device.

[0004] According to one aspect of an embodiment of the present disclosure, a method for preparing a micro LED device is provided, wherein the method comprises: obtaining a transparent substrate and a micro LED chip structure, wherein the micro LED chip structure comprises a micro LED chip, and the micro LED chip comprises a micro LED unit array composed of a plurality of micro LED units; arranging a first barrier layer on the transparent substrate, so that the first barrier layer comprises a first through hole array, and the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array comprises a plurality of groups of first through holes, and each group of first through holes comprises at least two first through holes; filling a photoluminescent material layer and a first light absorption layer in each group of first through holes respectively to obtain a first color conversion structure, wherein the first light absorption layer is used to partially absorb the light emitted by the micro LED unit, and the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer; bonding a side of the first color conversion structure opposite to the transparent substrate to a light emitting side of the micro LED chip to obtain a micro LED device.

[0005] Further, each group of first through holes includes three first through holes, and a photoluminescent material layer and a first light absorption layer are respectively filled in each group of first through holes to obtain a first color conversion structure, wherein the first light absorption layer is used to partially absorb the light emitted by the micro LED unit, and the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer. The method includes: filling a photoluminescent material layer of a first color and a photoluminescent material layer of a second color in two first through holes in each group of first through holes, and filling the first light absorption layer in another first through hole in each group of first through holes, wherein the first light absorption layer is used to partially absorb the light of a third color emitted by the micro LED unit, and the light corresponding to the first color, the light corresponding to the second color, and the light of the third color are synthesized to obtain white light.

[0006] Furthermore, before the first barrier layer is provided on the transparent substrate, the method further includes: providing a second barrier layer on the transparent substrate, so that the second barrier layer includes a second through hole array, the arrangement of the second through hole array corresponds to the arrangement of the micro LED unit array, wherein the second through hole array includes a plurality of groups of second through holes, each group of second through holes includes a first second through hole, a second second through hole and a third second through hole; a first filling step, when the first filling step is completed, a first intermediate structure is obtained, and the first filling step includes at least one of the following steps: filling a first filling portion in a first second through hole in each group of second through holes, The first filling part includes a first filter layer that only allows light of the first color to pass through, and a second light absorbing layer or a transparent material for partially absorbing light of the third color; the second filling part is filled in the second second through hole in each group of second through holes, and the second filling part includes a second filter layer that only allows light of the second color to pass through, and a second light absorbing layer or a transparent material for partially absorbing light of the third color; the third filling part is filled in the third second through hole in each group of second through holes, and the third filling part includes a third filter layer that only allows light of the third color to pass through, and a second light absorbing layer or a transparent material for partially absorbing light of the third color. The second light absorbing layer included in the first filling part, the second filling part, and the third filling part is made of the same material as the first light absorbing layer.

[0007] Furthermore, the first filling step further comprises: when there are unfilled second through holes in each group of second through holes, filling the unfilled second through holes with a transparent material.

[0008] Further, a first barrier layer is arranged on the transparent substrate, so that the first barrier layer includes a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes multiple groups of first through holes, and each group of first through holes includes at least two first through holes, including: a first barrier layer is arranged on the first intermediate structure, and a first through hole array is opened on the first barrier layer, so that the first through hole array is aligned with the second through hole array and is located above the second through hole array, and the first through hole array exposes the first intermediate structure, wherein the first through hole array includes multiple groups of first through holes corresponding to the multiple groups of second through holes, and each group of first through holes includes a first first through hole aligned with the first second through hole, a second first through hole aligned with the second second through hole, and a third first through hole aligned with the third second through hole. Filling a photoluminescent material layer of a first color and a photoluminescent material layer of a second color in two first through holes in each group of first through holes respectively, and filling the first light absorption layer in another first through hole in each group of first through holes, wherein the first light absorption layer is used to partially absorb the light of a third color emitted by the micro LED unit, and the light corresponding to the first color, the light corresponding to the second color and the light of the third color are synthesized to obtain white light, including: filling a photoluminescent material layer of a first color in the first first through hole in each group of first through holes, filling a photoluminescent material layer of a second color in the second first through hole in each group of first through holes, and filling the first light absorption layer in the third first through hole in each group of first through holes, wherein the first light absorption layer is used to partially absorb the light of the third color emitted by the micro LED unit, and the light corresponding to the first color, the light corresponding to the second color and the light of the third color are synthesized to obtain white light.

[0009] Further, each group of first through holes includes two first through holes, and a photoluminescent material layer and a first light absorption layer are respectively filled in each group of first through holes to obtain a first color conversion structure, wherein the first light absorption layer is used to partially absorb the light emitted by the micro LED unit, and the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer. The method includes: filling a photoluminescent material layer of a fourth color in one first through hole in each group of first through holes, and filling the first light absorption layer in another first through hole in each group of first through holes, wherein the first light absorption layer is used to partially absorb the light of a third color emitted by the micro LED unit, and white light is obtained by synthesizing the light of the fourth color and the light of the third color.

[0010] Further, before the first barrier layer is provided on the transparent substrate, the method further includes: providing a second barrier layer on the transparent substrate, so that the second barrier layer includes a second through hole array, the arrangement of the second through hole array corresponds to the arrangement of the micro LED unit array, wherein the second through hole array includes a plurality of groups of second through holes, each group of second through holes includes two second through holes; a second filling step, when the second filling step is completed, a second intermediate structure is obtained, and the second filling step includes at least one of the following steps: filling a fourth filling part in one second through hole in each group of second through holes, the fourth filling part includes a fourth filter layer that only allows light of a fourth color to pass through, a second light absorbing layer or a transparent material for partially absorbing light of a third color; filling a fifth filling part in another second through hole in each group of second through holes, the fifth filling part includes a third filter layer that only allows light of a third color to pass through, a second light absorbing layer or a transparent material for partially absorbing light of a third color. The second light absorbing layer included in the fourth filling part and the fifth filling part is made of the same material as the first light absorbing layer.

[0011] Furthermore, the second filling step further comprises: when there are unfilled second through holes in each group of second through holes, filling the unfilled second through holes with a transparent material.

[0012] Further, a first barrier layer is arranged on the transparent substrate, so that the first barrier layer includes a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes multiple groups of first through holes, and each group of first through holes includes at least two first through holes, including: a first barrier layer is arranged on the second intermediate structure, and a first through hole array is opened on the first barrier layer, so that the first through hole array is aligned with the second through hole array and is located above the second through hole array, and the first through hole array exposes the second intermediate structure, wherein the first through hole array includes multiple groups of first through holes corresponding to the multiple groups of second through holes, and each group of first through holes includes two first through holes respectively aligned with two second through holes. Filling a photoluminescent material layer of a fourth color in one first through hole in each group of first through holes, and filling the first light absorbing layer in another first through hole in each group of first through holes, wherein the first light absorbing layer is used to partially absorb the light of the third color emitted by the micro LED unit, and white light is obtained by synthesizing the light of the fourth color and the light of the third color. The method comprises: in each group of first through holes, filling a photoluminescent material layer of the fourth color in a first through hole above a second through hole for filling a fourth filling portion, and filling the first light absorbing layer in a first through hole above a second through hole for filling a fifth filling portion, wherein the first light absorbing layer is used to partially absorb the light of the third color emitted by the micro LED unit, and white light is obtained by synthesizing the light of the fourth color and the light of the third color.

[0013] Furthermore, after filling the photoluminescent material layer and the first light absorbing layer in each group of first through holes, the method further comprises: providing an insulating layer on the first barrier layer, the photoluminescent material layer and the first light absorbing layer. Bonding the side of the first color conversion structure opposite to the transparent substrate to the light emitting side of the micro LED chip comprises: bonding the insulating layer of the first color conversion structure to the light emitting side of the micro LED chip.

[0014] Furthermore, after bonding the side of the first color conversion structure opposite to the transparent substrate to the light emitting side of the micro LED chip, the method includes: removing the transparent substrate of the first color conversion structure to obtain a second color conversion structure from the first color conversion structure.

[0015] Furthermore, before setting the first barrier layer on the transparent substrate, the method also includes: setting a third light absorbing layer on the transparent substrate, wherein the third light absorbing layer is used to partially absorb the light emitted by the micro LED unit, and the third light absorbing layer is made of the same material as the first light absorbing layer, and setting the first barrier layer on the transparent substrate includes: setting the first barrier layer on the third light absorbing layer.

[0016] Furthermore, before setting the second barrier layer on the transparent substrate, the method also includes: setting a fourth light absorbing layer on the transparent substrate, wherein the fourth light absorbing layer is used to partially absorb the third color light emitted by the micro LED unit, and the fourth light absorbing layer is made of the same material as the first light absorbing layer, and setting the second barrier layer on the transparent substrate includes: setting the second barrier layer on the fourth light absorbing layer.

[0017] Furthermore, before setting the first barrier layer on the first intermediate structure, the method also includes: setting a fifth light absorbing layer on the first intermediate structure, wherein the fifth light absorbing layer is used to partially absorb the third color of light emitted by the micro LED unit, and the fifth light absorbing layer is made of the same material as the first light absorbing layer, and setting the first barrier layer on the first intermediate structure includes: setting the first barrier layer on the fifth light absorbing layer.

[0018] According to another aspect of the present disclosure, a micro LED device is also provided. The micro LED device includes a second color conversion structure and a micro LED chip structure, the micro LED chip structure includes a micro LED chip, the micro LED chip includes a micro LED unit array composed of a plurality of micro LED units, wherein the second color conversion structure includes: a first barrier layer, the first barrier layer includes a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes a plurality of groups of first through holes, each group of first through holes includes at least two first through holes; a photoluminescent material layer and a first light absorbing layer, the photoluminescent material layer and the first light absorbing layer are respectively filled in each group of first through holes, wherein the first light absorbing layer is used to partially absorb the light emitted by the micro LED unit, and the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, and the first barrier layer, the photoluminescent material layer and the first light absorbing layer of the second color conversion structure are arranged on the light emitting side of the micro LED chip.

[0019] Further, each group of first through holes includes a first first through hole, a second first through hole and a third first through hole, the photoluminescent material layer includes a photoluminescent material layer of a first color and a photoluminescent material layer of a second color, the photoluminescent material layer of the first color is filled in the first first through hole in each group of first through holes, the photoluminescent material layer of the second color is filled in the second first through hole in each group of first through holes, and the first light absorption layer is filled in the third first through hole in each group of first through holes, wherein the first light absorption layer is used to partially absorb the light of the third color emitted by the micro LED unit, and the light corresponding to the first color, the light corresponding to the second color and the light of the third color are synthesized to obtain white light.

[0020] Further, the second color conversion structure further includes a second barrier layer, the second barrier layer is arranged on the first barrier layer and includes a second through hole array, the second through hole array is aligned with the first through hole array and is located above the first through hole array, wherein the second through hole array includes a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, each group of second through holes includes a first second through hole aligned with the first first through hole, a second second through hole aligned with the second first through hole, and a third second through hole aligned with the third first through hole, and the color conversion structure further includes at least one of a first filling portion, a second filling portion and a third filling portion, wherein: the first filling portion is filled in the first second through hole in each group of second through holes, and the first filling portion is filled in the first second through hole in each group of second through holes. The invention comprises a first filter layer that only allows light of a first color to pass through, and a second light absorbing layer or a transparent material that is used to partially absorb light of a third color; the second filling part is filled in the second second through hole in each group of second through holes, and the second filling part comprises a second filter layer that only allows light of the second color to pass through, and a second light absorbing layer or a transparent material that is used to partially absorb light of the third color; the third filling part is filled in the third second through hole in each group of second through holes, and the third filling part comprises a third filter layer that only allows light of the third color to pass through, and a second light absorbing layer or a transparent material that is used to partially absorb light of the third color, and the second light absorbing layer included in the first filling part, the second filling part and the third filling part is made of the same material as the first light absorbing layer.

[0021] Further, when there is an unfilled second through hole in each group of second through holes, the second color conversion structure further includes a transparent material, and the transparent material is filled in the unfilled second through hole.

[0022] Further, the first color is red, the second color is green and the third color is blue.

[0023] Furthermore, each group of first through holes includes two first through holes, the photoluminescent material layer includes a photoluminescent material layer of a fourth color, the photoluminescent material layer of the fourth color is filled in one first through hole, and the first light absorption layer is filled in another first through hole, wherein the first light absorption layer is used to partially absorb the light of a third color emitted by the micro LED unit, and white light is obtained by synthesizing the light of the fourth color and the light of the third color.

[0024] Further, the second color conversion structure further includes a second barrier layer, which is disposed on the first barrier layer and includes a second through hole array, the second through hole array is aligned with the first through hole array and is located above the first through hole array, wherein the second through hole array includes a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, and each group of second through holes includes two second through holes, and the color conversion structure further includes at least one of a fourth filling portion and a fifth filling portion, wherein: the fourth filling portion is filled in the second through hole above the first through hole filled with the photoluminescent material layer of the fourth color, the fourth filling portion includes a fourth filter layer that only allows light of the fourth color to pass through, a second light absorption layer or a transparent material for partially absorbing light of the third color; the fifth filling portion is filled in the second through hole above the first through hole filled with the first light absorption layer, the fifth filling portion includes a third filter layer that only allows light of the third color to pass through, a second light absorption layer or a transparent material for partially absorbing light of the third color, and the second light absorption layer included in the fourth filling portion and the fifth filling portion is made of the same material as the first light absorption layer.

[0025] Further, when there are unfilled second through holes in each group of second through holes, the color conversion structure further includes a transparent material, and the transparent material is filled in the unfilled second through holes.

[0026] Further, the fourth color is yellow and the third color is blue.

[0027] Furthermore, the second color conversion structure also includes an insulating layer, which is arranged on the light-emitting side of the micro LED chip, and the first barrier layer, the photoluminescent material layer and the first light absorption layer of the second color conversion structure are arranged on the insulating layer.

[0028] Furthermore, the second color conversion structure also includes a third light absorption layer, which is arranged on the first barrier layer, the photoluminescent material layer and the first light absorption layer, wherein the third light absorption layer is used to partially absorb the light emitted by the micro LED unit, and the third light absorption layer is made of the same material as the first light absorption layer.

[0029] Furthermore, the second color conversion structure also includes a fourth light absorption layer, which is arranged on the second barrier layer, wherein the fourth light absorption layer is used to partially absorb the third color light emitted by the micro LED unit, and the fourth light absorption layer is made of the same material as the first light absorption layer.

[0030] Furthermore, the second color conversion structure also includes a fifth light absorption layer, which is arranged on the first barrier layer and the second barrier layer is arranged on the fifth light absorption layer, wherein the fifth light absorption layer is used to partially absorb the third color light emitted by the micro LED unit, and the fifth light absorption layer is made of the same material as the first light absorption layer.

[0031] Furthermore, the micro LED chip structure also includes a driver chip, and the side of the micro LED chip opposite to the light emitting side is arranged on the driver chip, or the micro LED chip structure also includes a driver chip and a flexible circuit board, and the side of the micro LED chip opposite to the light emitting side is arranged on the driver chip to form a micro LED module, and the micro LED module is arranged on the flexible circuit board through the driver chip.

[0032] Further, the material of the first barrier layer and the material of the second barrier layer include visible light shielding materials, the material of the first color photoluminescent material layer and the material of the second color photoluminescent material layer include at least one of II-VI group quantum dots, III-V group quantum dots, perovskite quantum dots and carbon quantum dots, the material of the first light absorption layer and the material of the second light absorption layer include organic dyes, nano absorption particles or inorganic oxides for absorbing blue light, and the material of the first filter layer, the material of the second filter layer and the material of the third filter layer include organic dyes, nano absorption particles or inorganic oxides.

[0033] According to another aspect of the embodiments of the present disclosure, a display device is provided, comprising a micro LED device prepared by the above method.

[0034] By applying the technical solution disclosed in the present invention, a transparent substrate and a micro LED chip are obtained, a first barrier layer is arranged on the transparent substrate, and each group of first through holes included in the first barrier layer is filled with a photoluminescent material layer and a first light absorbing layer, respectively, to form a color conversion structure, and the color conversion structure is bonded to the light-emitting side of the micro LED chip to form a micro LED device. In the micro LED device, light emitted by the micro LED unit of the micro LED chip excites the material in the photoluminescent material layer to emit light of a color different from that of the light emitted by the micro LED unit. Since the first light absorbing layer can partially absorb the light emitted by the micro LED unit, light overflow caused by the light emitted by the micro LED unit directly emitted from the micro LED device is reduced, thereby reducing color deviation and poor color purity caused by light overflow, thereby improving the balance of light of different colors emitted from the micro LED device, improving the color purity of the micro LED, and further improving the display effect of the micro LED device. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] By reading the detailed description below with reference to the accompanying drawings, the above and other purposes, features and advantages of the exemplary embodiments of the present disclosure will become readily understood. In the accompanying drawings, several embodiments of the present disclosure are shown in an exemplary and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0036] Figure 1 is a flow chart showing a method for preparing a micro LED device according to one embodiment of the present disclosure;

[0037] Figures 2 to 15 is a schematic diagram showing a preparation process flow of a method for preparing a micro LED device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0038] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present disclosure will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0039] It should be noted that the following detailed descriptions are illustrative and are intended to provide further explanation of the present application. Unless otherwise specified, all technical and scientific terms used herein have the same meanings as those commonly understood by those skilled in the art to which the present application belongs.

[0040] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" may include both "above" and "below". The device may also be positioned in other different ways, rotated 90 degrees or in other orientations, and the spatially relative descriptions used herein are interpreted accordingly.

[0041] Now, exemplary embodiments according to the present disclosure will be described in more detail with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in a variety of different forms and should not be construed as being limited to the embodiments described herein. It should be understood that these embodiments are provided to make the disclosure of the present application thorough and complete, and to fully convey the concepts of these exemplary embodiments to those of ordinary skill in the art. In the accompanying drawings, for clarity, the thickness of the layers and regions is enlarged, and the same reference numerals are used to represent the same devices, and thus their descriptions will be omitted.

[0042] The present invention provides a method for preparing a micro LED device. Figures 1 to 15 , Figure 1 is a flow chart showing a method for preparing a micro LED device according to one embodiment of the present disclosure; Figures 2 to 15 is a schematic diagram showing a preparation process flow of a method for preparing a micro LED device according to an embodiment of the present disclosure.

[0043] like Figure 1 As shown, the method for preparing a micro LED device includes the following steps S101-S104.

[0044] Step S101: Obtain a transparent substrate and a micro LED chip structure, wherein the micro LED chip structure comprises a micro LED chip, and the micro LED chip comprises a micro LED unit array composed of a plurality of micro LED units.

[0045] Step S102: Disposing a first barrier layer on the transparent substrate, so that the first barrier layer includes a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes multiple groups of first through holes, and each group of first through holes includes at least two first through holes.

[0046] Step S103: Filling a photoluminescent material layer and a first light absorbing layer in each group of first through holes respectively to obtain a first color conversion structure, wherein the first light absorbing layer is used to partially absorb the light emitted by the micro LED unit, and the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer.

[0047] Step S104: bonding the side of the first color conversion structure opposite to the transparent substrate to the light emitting side of the micro LED chip to obtain a micro LED device.

[0048] According to the technical solution, a color conversion structure can be formed by obtaining a transparent substrate and a micro LED chip, arranging a first barrier layer on the transparent substrate, and filling each group of first through holes included in the first barrier layer with a photoluminescent material layer and a first light absorbing layer, respectively. The color conversion structure is bonded to the light-emitting side of the micro LED chip to form a micro LED device. In the micro LED device, the light emitted by the micro LED unit of the micro LED chip excites the material in the photoluminescent material layer to emit light of a color different from that of the light emitted by the micro LED unit. Since the first light absorbing layer can partially absorb the light emitted by the micro LED unit, the light overflow caused by the light emitted by the micro LED unit directly from the micro LED device is reduced, thereby reducing the color deviation and poor color purity caused by the light overflow, thereby improving the balance of light of different colors emitted from the micro LED device, improving the color purity of the micro LED, and further improving the display effect of the micro LED device.

[0049] In step S101, a transparent substrate and a micro LED chip structure may be obtained, wherein the micro LED chip structure includes a micro LED chip, and the micro LED chip includes a micro LED unit array composed of a plurality of micro LED units.

[0050] According to an embodiment of the present disclosure, a transparent substrate and a micro LED chip structure may be first obtained. The transparent substrate may include any applicable substrate such as a glass substrate, a polyimide substrate or a sapphire substrate. The micro LED chip structure includes a micro LED chip, and the micro LED chip includes a micro LED unit array for emitting light. Among them, the micro LED chip may be any micro LED chip suitable for preparing a micro LED device. For example, the structure of the micro LED chip may include a face-up structure, a flip-chip structure or a vertical structure, etc., which are not limited here. Each micro LED unit in the micro LED unit array may include an exposed first semiconductor layer on its light-emitting side. Depending on the type of micro LED device, in some embodiments, the first semiconductor layer may include an N-GaN layer; in other embodiments, the first semiconductor layer may include a P-GaN layer. It is worth noting that the micro LED chip structure may also be obtained in any step before the subsequent step of using the micro LED chip structure.

[0051] Reference Figure 2-Figure 15 ,in Figure 2 FIG. 1 shows a side view of a transparent substrate 101 according to an embodiment of the present disclosure. Figure 2 As shown, the transparent substrate 101 may be, for example, a glass substrate.

[0052] Reference Figure 2-Figure 15 ,in Figure 3FIG. 4 shows a side view of a micro LED chip structure according to an embodiment of the present disclosure. Figure 3 As shown, the micro LED chip structure includes a micro LED chip 20, and the micro LED chip 20 includes a micro LED unit array 201 composed of micro LED units 2011. Each micro LED unit 2011 in the micro LED unit array 201 includes a first semiconductor layer 20111 such as an N-GaN layer on the light emitting side. Figure 3 As shown, the first semiconductor layer 20111 is common to each micro LED unit 2011 in the micro LED unit array 201 , that is, the first semiconductor layer 20111 is integrated in the micro LED chip 20 .

[0053] In step S102, a first barrier layer may be provided on the transparent substrate, so that the first barrier layer includes a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes a plurality of groups of first through holes, and each group of first through holes includes at least two first through holes.

[0054] According to an embodiment of the present disclosure, after obtaining a transparent substrate, a first barrier layer may be provided on the transparent substrate. The first barrier layer may function as a grid, and the interior of the grid may be filled with a corresponding material. In some embodiments, the first barrier layer may include a visible light shielding material, which may include, for example, a matte material such as black photoresist, or a reflective material such as a metal layer.

[0055] According to one embodiment of the present disclosure, before the first barrier layer is provided on the transparent substrate, the method further includes: providing a second barrier layer on the transparent substrate, so that the second barrier layer includes a second through hole array, the arrangement of the second through hole array corresponds to the arrangement of the micro LED unit array, wherein the second through hole array includes a plurality of groups of second through holes, each group of second through holes includes a first second through hole, a second second through hole and a third second through hole; a first filling step, when the first filling step is completed, a first intermediate structure is obtained, the first filling step includes at least one of the following steps: filling a first filling portion in the first second through hole in each group of second through holes, the first filling portion including a portion that allows only light of the first color to pass through a first filter layer for partially absorbing the light of the third color, a second light absorbing layer or a transparent material for partially absorbing the light of the third color; a second filling portion is filled in the second second through hole in each group of second through holes, the second filling portion includes a second filter layer for only allowing the light of the second color to pass through, a second light absorbing layer or a transparent material for partially absorbing the light of the third color; a third filling portion is filled in the third second through hole in each group of second through holes, the third filling portion includes a third filter layer for only allowing the light of the third color to pass through, a second light absorbing layer or a transparent material for partially absorbing the light of the third color, and the second light absorbing layer included in the first filling portion, the second filling portion and the third filling portion is made of the same material as the first light absorbing layer.

[0056] Furthermore, the first filling step further comprises: when there are unfilled second through holes in each group of second through holes, filling the unfilled second through holes with a transparent material.

[0057] Specifically, a first barrier layer is provided on the transparent substrate, so that the first barrier layer includes a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes multiple groups of first through holes, and each group of first through holes includes at least two first through holes. It can include: a first barrier layer is provided on the first intermediate structure, and a first through hole array is opened on the first barrier layer, so that the first through hole array is aligned with the second through hole array and is located above the second through hole array, and the first through hole array exposes the first intermediate structure, wherein the first through hole array includes multiple groups of first through holes corresponding to the multiple groups of second through holes, and each group of first through holes includes a first first through hole aligned with the first second through hole, a second first through hole aligned with the second second through hole, and a third first through hole aligned with the third second through hole.

[0058] In this embodiment, the light of the first color refers to the light of the wavelength range corresponding to the first color, the light of the second color refers to the light of the wavelength range corresponding to the second color, and the light of the third color refers to the light of the wavelength range corresponding to the third color. The first color, the second color and the third color may be three primary colors, for example, the first color is red, the second color is green and the third color is blue. The material of the second barrier layer includes a visible light shielding material, which may include, for example, a matting material such as black photoresist, a reflective material such as a metal layer, the material of the photoluminescent material layer includes at least one of II-VI group quantum dots, III-V group quantum dots, perovskite quantum dots and carbon quantum dots, the material of the first light absorption layer and the material of the second light absorption layer include organic dyes, nano absorption particles or inorganic oxides for absorbing blue light, and the material of the first filter layer, the material of the second filter layer and the material of the third filter layer include organic dyes, nano absorption particles or inorganic oxides.

[0059] According to another embodiment of the present disclosure, before the first barrier layer is provided on the transparent substrate, the method further includes: providing a second barrier layer on the transparent substrate, so that the second barrier layer includes a second through hole array, the arrangement of the second through hole array corresponds to the arrangement of the micro LED unit array, wherein the second through hole array includes a plurality of groups of second through holes, each group of second through holes includes two second through holes; a second filling step, when the second filling step is completed, a second intermediate structure is obtained, and the second filling step includes at least one of the following steps: filling a fourth filling part in a second through hole in each group of second through holes, the fourth filling part including a fourth filter layer that only allows light of a fourth color to pass through, a second light absorbing layer or a transparent material for partially absorbing light of a third color; filling a fifth filling part in another second through hole in each group of second through holes, the fifth filling part including a third filter layer that only allows light of a third color to pass through, a second light absorbing layer or a transparent material for partially absorbing light of the third color, and the second light absorbing layer included in the fourth filling part and the fifth filling part is the same material as the first light absorbing layer.

[0060] The second filling step further includes: when there are unfilled second through holes in each group of second through holes, filling the unfilled second through holes with a transparent material.

[0061] Specifically, a first barrier layer is arranged on the transparent substrate, so that the first barrier layer includes a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes multiple groups of first through holes, and each group of first through holes includes at least two first through holes, including: a first barrier layer is arranged on the second intermediate structure, and a first through hole array is opened on the first barrier layer, so that the first through hole array is aligned with the second through hole array and is located above the second through hole array, and the first through hole array exposes the second intermediate structure, wherein the first through hole array includes multiple groups of first through holes corresponding to the multiple groups of second through holes, and each group of first through holes includes two first through holes respectively aligned with two second through holes.

[0062] In this embodiment, the light of the fourth color refers to the light of the wavelength range corresponding to the fourth color, the fourth color is yellow light and the third color is blue. The material of the second barrier layer includes a visible light shielding material, the material of the photoluminescent material layer includes at least one of II-VI group quantum dots, III-V group quantum dots, perovskite quantum dots and carbon quantum dots, the material of the first light absorption layer and the material of the second light absorption layer include organic dyes, nano absorption particles or inorganic oxides for absorbing blue light, for example, zinc oxide nanoparticle photoresist, and the material of the fourth filter layer includes organic dyes, nano absorption particles or inorganic oxides.

[0063] Reference Figure 2-Figure 15 ,in Figure 4 FIG. 1 shows a side view schematic diagram of a second barrier layer 102 disposed on a transparent substrate 101. Figure 4 As shown, the second barrier layer 102 may be, for example, a black photoresist layer, so a black photoresist layer may be coated on a transparent substrate 101 such as a sapphire substrate by spin coating, and then, for example, a second through hole array 1020 may be opened on the black photoresist layer by photolithography, so that the arrangement of the second through hole array 1020 corresponds to the arrangement of the micro LED unit array 201 to be used later and the transparent substrate 101 is exposed, wherein the second through hole array 1020 includes a plurality of groups of second through holes, each group of second through holes includes a first second through hole 1021, a second second through hole 1022 and a third second through hole 1023. For clarity and simplicity, Figure 4 Only a group of second through holes included in the second through hole array 1020 is shown, and the group of second through holes includes a first second through hole 1021, a second second through hole 1022 and a third second through hole 1023. Figure 4The number of groups of second through holes and the number of second through holes in each group of second through holes shown in the figure are only for illustration and are not limited here. The second barrier layer 102 such as a black photoresist layer can make the screen appear black when the display device is powered off or turned off.

[0064] Reference Figure 2-Figure 15 ,in Figure 5 A side view schematic diagram of the filling portion filled in each group of second through holes is shown. Figure 4 ,like Figure 5 As shown, a first filling portion is filled in the first second through hole 1021 in each group of second through holes, and the first filling portion may include a first filter layer 1031 that only allows light of a first color, such as red, to pass through; a second filling portion is filled in the second second through hole 1022 in each group of second through holes, and the second filling portion may include a second filter layer 1032 that only allows light of a second color, such as green, to pass through; a third filling portion is filled in the third second through hole 1023 in each group of second through holes, and the third filling portion may include a second light absorption layer 1033 for partially absorbing light of a third color, such as blue, to obtain the following: Figure 5 The first intermediate structure 30 is shown. It should be noted that in other embodiments, when there are unfilled second through holes in each group of second through holes, a transparent material may be filled in the unfilled second through holes to support the portion above the corresponding second through hole in the subsequent preparation process, and the transparent material may be any suitable material such as a transparent resin.

[0065] Reference Figure 2-Figure 15 ,in Figure 6 FIG. 1 shows a side view of a first barrier layer 104 disposed on the first intermediate structure 30. Figure 6 As shown, a first barrier layer 104 is disposed on the first intermediate structure 30, and a first through hole array 1040 is opened on the first barrier layer 104, so that the first through hole array 1040 is aligned with the second through hole array 1020 and is located above the second through hole array 1020, and the first through hole array 1040 exposes the first intermediate structure 30, specifically, exposes the first filter layer 1031, the second filter layer 1032, and the second light absorption layer 1033. The first through hole array 1040 includes a plurality of groups of first through holes corresponding to the plurality of groups of second through holes, and each group of first through holes includes a first first through hole 1041 aligned with the first second through hole 1021, a second first through hole 1042 aligned with the second second through hole 1022, and a third first through hole 1043 aligned with the third second through hole 1023.

[0066] In step S103, a photoluminescent material layer and a first light absorbing layer may be filled in each group of first through holes to obtain a first color conversion structure, wherein the first light absorbing layer is used to partially absorb the light emitted by the micro LED unit, and the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer.

[0067] According to an embodiment of the present disclosure, after obtaining the above-mentioned first through hole array, a photoluminescent material layer and a first light absorbing layer can be filled for the first through hole array. The first light absorbing layer partially absorbs the light emitted by the micro LED unit, so that a part of the light emitted by the micro LED unit is absorbed after passing through the first light absorbing layer, and the remaining light is emitted from the micro LED device. The color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, so that the light emitted from the micro LED light-emitting unit realizes the full-color display of the micro LED device after passing through the photoluminescent material layer.

[0068] According to an embodiment of the present disclosure, each group of first through holes includes three first through holes, and a photoluminescent material layer and a first light absorption layer are respectively filled in each group of first through holes to obtain a first color conversion structure, wherein the first light absorption layer is used to partially absorb the light emitted by the micro LED unit, and the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer. The method includes: filling a photoluminescent material layer of a first color and a photoluminescent material layer of a second color in two first through holes in each group of first through holes, and filling the first light absorption layer in another first through hole in each group of first through holes, wherein the first light absorption layer is used to partially absorb the light of a third color emitted by the micro LED unit, and the light corresponding to the first color, the light corresponding to the second color, and the light of the third color are synthesized to obtain white light.

[0069] Further, a photoluminescent material layer of a first color and a photoluminescent material layer of a second color are respectively filled in two first through holes in each group of first through holes, and the first light absorption layer is filled in another first through hole in each group of first through holes, wherein the first light absorption layer is used to partially absorb the light of a third color emitted by the micro LED unit, and the light corresponding to the first color, the light corresponding to the second color and the light of the third color are synthesized to obtain white light, including: filling a photoluminescent material layer of a first color in the first first through hole in each group of first through holes, filling a photoluminescent material layer of a second color in the second first through hole in each group of first through holes, and filling the first light absorption layer in the third first through hole in each group of first through holes, wherein the first light absorption layer is used to partially absorb the light of the third color emitted by the micro LED unit, and the light corresponding to the first color, the light corresponding to the second color and the light of the third color are synthesized to obtain white light.

[0070] In this embodiment, the first color, the second color and the third color may be three primary colors, for example, the first color is red, the second color is green and the third color is blue. The material of the photoluminescent material layer of the first color and the material of the photoluminescent material layer of the second color include at least one of II-VI group quantum dots, III-V group quantum dots, perovskite quantum dots and carbon quantum dots, and the material of the first light absorption layer includes organic dyes, nano absorption particles or inorganic oxides for absorbing blue light.

[0071] According to another embodiment of the present disclosure, each group of first through holes includes two first through holes, and a photoluminescent material layer and a first light absorption layer are respectively filled in each group of first through holes to obtain a first color conversion structure, wherein the first light absorption layer is used to partially absorb the light emitted by the micro LED unit, and the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer. The method includes: filling a photoluminescent material layer of a fourth color in one first through hole in each group of first through holes, and filling the first light absorption layer in another first through hole in each group of first through holes, wherein the first light absorption layer is used to partially absorb the light of a third color emitted by the micro LED unit, and white light is obtained by synthesizing the light of the fourth color and the light of the third color.

[0072] Further, a photoluminescent material layer of a fourth color is filled in one first through hole in each group of first through holes, and the first light absorbing layer is filled in another first through hole in each group of first through holes, wherein the first light absorbing layer is used to partially absorb the light of the third color emitted by the micro LED unit, and the white light is obtained by synthesizing the light of the fourth color and the light of the third color. The method comprises: in each group of first through holes, a photoluminescent material layer of the fourth color is filled in a first through hole above a second through hole for filling a fourth filling portion, and the first light absorbing layer is filled in a first through hole above a second through hole for filling a fifth filling portion, wherein the first light absorbing layer is used to partially absorb the light of the third color emitted by the micro LED unit, and the white light is obtained by synthesizing the light of the fourth color and the light of the third color.

[0073] In this embodiment, the fourth color is yellow light and the third color is blue. The material of the photoluminescent material layer of the fourth color may include at least one of group II-VI quantum dots, group III-V quantum dots, perovskite quantum dots and carbon quantum dots, and the material of the first light absorption layer may include organic dyes, nano absorption particles or inorganic oxides for absorbing blue light.

[0074] According to an embodiment of the present disclosure, after each group of first through holes is filled with a photoluminescent material layer and a first light absorbing layer, the method further comprises: providing an insulating layer on the first barrier layer, the photoluminescent material layer and the first light absorbing layer.

[0075] Reference Figure 2-Figure 15 ,in Figure 7 A schematic side view of a photoluminescent material layer filled in each group of first through holes is shown. Figure 6 ,like Figure 7 As shown, the first through hole 1041 in each group of first through holes is filled with a first color photoluminescent material layer 1051, such as red, and the second through hole 1042 in each group of first through holes is filled with a second color photoluminescent material layer 1052, such as green.

[0076] Reference Figure 2-Figure 15 ,in Figure 8 A side view schematic diagram of the first light absorbing layer filled in each group of first through holes is shown. Figure 6 and Figure 7 ,like Figure 8 As shown, the third first through hole 1043 in each group of first through holes is filled with a first light absorbing layer 1053 for absorbing, for example, blue light, to obtain Figure 8 The structure shown.

[0077] It is worth noting that the filling order of the photoluminescent material layer 1051 of the first color, the photoluminescent material layer 1052 of the second color, and the first light absorbing layer 1053 is only exemplary and is not limited here. The filling order of the photoluminescent material layer 1051 of the first color, the photoluminescent material layer 1052 of the second color, and the first light absorbing layer 1053 can be adjusted arbitrarily according to the actual preparation conditions such as specific processes and equipment. In addition, the light of the third color emitted by the micro LED unit excites the photoluminescent material layer 1051 of the first color to emit the light of the first color, and the light of the third color emitted by the micro LED unit excites the photoluminescent material layer 1052 of the second color to emit the light of the second color. The light of the third color emitted by the micro LED unit is partially absorbed after passing through the first light absorbing layer 1053, and the light passing through the first light absorbing layer 2033 is still the third color. The light of the first color, the light of the second color, and the light of the third color emitted through the photoluminescent material layer and the first light absorbing layer can be synthesized to obtain white light. Furthermore, the first color, the second color and the third color can be three primary colors, for example, the first color is red, the second color is green and the third color is blue. Therefore, by providing a first light absorption layer that partially absorbs the blue light emitted by the micro LED unit, the blue light overflow caused by the blue light emitted by the micro LED unit directly from the micro LED device can be reduced, thereby reducing the color deviation and poor color purity caused by the blue light overflow, thereby improving the balance of different colors of light emitted from the micro LED device, improving the color purity of the micro LED, and then improving the display effect of the micro LED device.

[0078] like Figure 8 As shown and described above, the second light absorption layer 1033 is filled in the third second through hole 1023, and the first light absorption layer 1053 is filled in the third first through hole 1043 aligned with the third second through hole 1023, so that the second light absorption layer 1033 can form a whole with the first light absorption layer 1053 to further enhance the absorption of the third color of light emitted by the micro LED unit 1011, thereby further reducing the light overflow caused by the light emitted by the micro LED unit directly emitted from the micro LED device, thereby further improving the display effect of the micro LED device.

[0079] It is worth noting that the first filter layer only allows light of the first color to pass through, and the first filter layer will reflect light of other colors, such as light of the third color, back to the photoluminescent material layer of the first color, so that the light of the third color re-participates in exciting the photoluminescent material layer of the first color. The second filter layer only allows light of the second color to pass through, and the second filter layer will reflect light of other colors, such as light of the third color, back to the photoluminescent material layer of the second color, so that the light of the third color re-participates in exciting the photoluminescent material layer of the second color. In the case where the third filter layer is filled in the third second through hole, the third filter layer only allows light of the third color to pass through, and the third filter layer will reflect light of other colors, such as light of the third color, back to the first light absorption layer, so that the first light absorption layer absorbs it. Therefore, the functions of the first filter layer, the second filter layer and the third filter layer are to reflect light other than the light of the corresponding color, which is different from the function of the first light absorption layer.

[0080] Reference Figure 2-Figure 15 ,in Fig. 9 FIG. 4 is a side view schematic diagram showing an insulating layer disposed on the first barrier layer, the photoluminescent material layer and the first light absorbing layer. Fig. 9 As shown, a plasma enhanced chemical vapor deposition (PECVD) method can be used to deposit an insulating layer 106 such as a silicon dioxide layer on the first barrier layer 104, the first color photoluminescent material layer 1051, the second color photoluminescent material layer 1052 and the first light absorption layer 1053 to obtain a Fig. 9 The first color conversion structure 10 shown. Of course, the insulating layer may also include any other applicable materials, such as any applicable polymer organic materials and inorganic oxides, and any applicable preparation process may be used to prepare the insulating layer for different materials. The insulating layer is used to protect other parts of the first color conversion structure, and can be used as a surface layer of the first color conversion structure to make the surface of the first color conversion structure smoother, thereby facilitating the subsequent bonding of the first color conversion structure with the micro LED chip.

[0081] In step S104, the side of the first color conversion structure opposite to the transparent substrate may be bonded to the light emitting side of the micro LED chip to obtain a micro LED device.

[0082] According to an embodiment of the present disclosure, after obtaining the first color conversion structure, the side of the first color conversion structure opposite to the transparent substrate can be bonded to the light emitting side of the micro LED chip to obtain a micro LED device.

[0083] Furthermore, bonding the side of the first color conversion structure opposite to the transparent substrate to the light emitting side of the micro LED chip includes: bonding an insulating layer of the first color conversion structure to the light emitting side of the micro LED chip.

[0084] Furthermore, each micro LED unit in the micro LED unit array includes a first semiconductor layer on the light emitting side, and bonding the insulating layer of the first color conversion structure to the light emitting side of the micro LED chip includes: bonding the insulating layer of the first color conversion structure to the first semiconductor layer.

[0085] According to an embodiment of the present disclosure, after bonding the side of the first color conversion structure opposite to the transparent substrate to the light-emitting side of the micro LED chip, the method includes: removing the transparent substrate of the first color conversion structure to obtain a second color conversion structure from the first color conversion structure.

[0086] According to an embodiment of the present disclosure, the micro LED chip structure also includes a driving chip, and the side of the micro LED chip opposite to the light emitting side is arranged on the driving chip, or the micro LED chip structure also includes a driving chip and a flexible circuit board, and the side of the micro LED chip opposite to the light emitting side is arranged on the driving chip to form a micro LED module, and the micro LED module is arranged on the flexible circuit board through the driving chip.

[0087] Reference Figure 2-Figure 15 ,in Fig.10 FIG. 4 shows a side view of bonding the first color conversion structure 10 to the micro LED chip 20 according to one embodiment of the present disclosure. Fig.10 As shown, the insulating layer 106 of the first color conversion structure 10 is bonded to the first semiconductor layer 20111 of the LED chip 20 of the micro LED chip structure to obtain Fig.10 The structure shown.

[0088] Reference Figure 2-Figure 15 ,in Fig.11 FIG. 4 shows a side view of a micro LED device 1 according to an embodiment of the present disclosure. Fig.11 As shown, remove Fig.10 The transparent substrate 101 of the first color conversion structure 10 in the structure shown in FIG. 1 is used to obtain the second color conversion structure 11 through the first color conversion structure 10, thereby obtaining the following Fig.11 The micro LED device 1 is shown.

[0089] According to one embodiment of the present disclosure, before the first barrier layer is set on the transparent substrate, the method further includes: setting a third light absorbing layer on the transparent substrate, wherein the third light absorbing layer is used to partially absorb the light emitted by the micro LED unit, and the third light absorbing layer is made of the same material as the first light absorbing layer, for example, it can be a zinc oxide nanoparticle photoresist. Setting the first barrier layer on the transparent substrate includes: setting the first barrier layer on the third light absorbing layer. In this embodiment, a micro LED device (not shown in the drawings) can be obtained in which there is no second barrier layer and the third light absorbing layer is set on the first barrier layer. On the one hand, the third light absorbing layer can further enhance the absorption of the third color of light emitted by the micro LED unit, thereby further reducing the light overflow caused by the third color of light emitted by the micro LED unit directly from the micro LED device, thereby further improving the display effect of the micro LED device. On the other hand, when the light of the third color emitted by the micro LED unit excites the photoluminescent material layer of the first color and the photoluminescent material layer of the second color, part of the light of the third color passes through the photoluminescent material layer of the first color and the photoluminescent material layer of the second color and leaks out. The third light-absorbing layer can absorb the leaked third color light, thereby preventing the part of the leaked third color light from being mixed with the first color light and the second color light obtained by the excitation and causing insufficient color purity, thereby further improving the display effect of the micro LED device.

[0090] According to an embodiment of the present disclosure, before the second barrier layer is arranged on the transparent substrate, the method further includes: arranging a fourth light absorbing layer on the transparent substrate, wherein the fourth light absorbing layer is used to partially absorb the third color light emitted by the micro LED unit, and the fourth light absorbing layer is made of the same material as the first light absorbing layer, for example, it can be zinc oxide nanoparticle photoresist, and arranging the second barrier layer on the transparent substrate includes: arranging the second barrier layer on the fourth light absorbing layer. Figure 2-Figure 15 ,in Fig.12 FIG. 1 shows a side view schematic diagram of setting a fourth light absorbing layer 1054 on a transparent substrate. Figure 2 ,like Fig.12 As shown, a fourth light absorbing layer 1054 of the same material as the first light absorbing layer 1053 is disposed on the transparent substrate 101, and then the second barrier layer 102 as described above is disposed on the fourth light absorbing layer 1054 and the subsequent steps as described above are performed to obtain an embodiment of the present disclosure as shown in FIG. Fig.13The micro LED device 2 shown. On the one hand, the fourth light absorption layer 1054 can further enhance the absorption of the third color light (e.g., blue light) emitted by the micro LED unit 2011, thereby further reducing the light overflow (e.g., blue light overflow) caused by the third color light (e.g., blue light) emitted by the micro LED unit directly being emitted from the micro LED device, thereby further improving the display effect of the micro LED device. On the other hand, when the light of the third color (e.g., blue light) emitted by the micro LED unit excites the photoluminescent material layer 1051 of the first color (e.g., red) and the photoluminescent material layer 1052 of the second color (e.g., green), part of the light of the third color (e.g., blue light) will pass through the photoluminescent material layer 1051 of the first color (e.g., red) and the photoluminescent material layer 1052 of the second color (e.g., green) and leak out. After passing through the first filter layer 1031 and the second filter layer 1032, part of the light of the third color (e.g., blue light) may still leak out. The third light absorption layer 1054 can absorb the part of the leaked third color light (e.g., blue light), thereby preventing the part of the leaked third color light (e.g., blue light) from being mixed with the first color light (e.g., red light) and the second color light (e.g., green light) obtained by the excitation and causing insufficient color purity, thereby further improving the display effect of the micro LED device.

[0091] According to an embodiment of the present disclosure, before the first barrier layer is provided on the first intermediate structure, the method further includes: providing a fifth light absorbing layer on the first intermediate structure, wherein the fifth light absorbing layer is used to partially absorb the third color light emitted by the micro LED unit, and the fifth light absorbing layer is made of the same material as the first light absorbing layer, for example, it may be zinc oxide nanoparticle photoresist. Providing the first barrier layer on the first intermediate structure includes: providing the first barrier layer on the fifth light absorbing layer.

[0092] Reference Figure 2-Figure 15 ,in Fig.14 FIG. 1 shows a side view schematic diagram of a fifth light absorbing layer 1055 disposed on the first intermediate structure. Figure 5 ,like Fig.14 As shown, a fifth light absorbing layer 1055 of the same material as the first light absorbing layer 1053 is disposed on the first intermediate structure 30, and then the first barrier layer 104 as described above is disposed on the fifth light absorbing layer 1055 and the subsequent steps as described above are performed to obtain an embodiment of the present disclosure as shown. Fig.15The micro LED device 3 shown. On the one hand, the fifth light absorption layer 1055 can further enhance the absorption of the third color light (e.g., blue light) emitted by the micro LED unit 2011, thereby further reducing the light overflow (e.g., blue light overflow) caused by the third color light (e.g., blue light) emitted by the micro LED unit directly being emitted from the micro LED device, thereby further improving the display effect of the micro LED device. On the other hand, when the light of the third color (e.g., blue light) emitted by the micro LED unit excites the photoluminescent material layer 1051 of the first color (e.g., red) and the photoluminescent material layer 1052 of the second color (e.g., green), part of the light of the third color (e.g., blue light) will pass through the photoluminescent material layer 1051 of the first color (e.g., red) and the photoluminescent material layer 1052 of the second color (e.g., green) and leak out. The fourth light absorption layer 1054 can absorb the part of the leaked third color light (e.g., blue light), thereby preventing the part of the leaked third color light (e.g., blue light) from being mixed with the first color light (e.g., red light) and the second color light (e.g., green light) obtained by the excitation and causing insufficient color purity, thereby further improving the display effect of the micro LED device.

[0093] The present disclosure also provides a micro LED device.

[0094] like Figure 2-Figure 14 As shown, the micro LED devices 1, 2, and 3 include a second color conversion structure 11 and a micro LED chip structure, wherein the micro LED chip structure includes a micro LED chip 20, and the micro LED chip 20 includes a micro LED unit array 201 composed of a plurality of micro LED units 2011, wherein the second color conversion structure 11 includes: a first barrier layer 104, wherein the first barrier layer 104 includes a first through hole array 1040, wherein the arrangement of the first through hole array 1040 corresponds to the arrangement of the micro LED unit array 201, wherein the first through hole array 1040 includes a plurality of groups of first through holes, each group of first through holes includes at least two first through holes; a photoluminescent material layer and a first light absorbing layer 1053, the photoluminescent material layer and the first light absorbing layer 1053 are respectively filled in each group of first through holes, wherein the first light absorbing layer 1053 is used to partially absorb the light emitted by the micro LED unit 2011, and the color of the light emitted by the micro LED unit 2011 is different from the color corresponding to the photoluminescent material layer, and the first barrier layer 104, the photoluminescent material layer and the first light absorbing layer 1053 of the second color conversion structure 11 are arranged on the light emitting side of the micro LED chip 20.

[0095] According to an embodiment of the present disclosure, each group of first through holes includes a first first through hole 1041, a second first through hole 1042 and a third first through hole 1043, the photoluminescent material layer includes a photoluminescent material layer 1051 of a first color and a photoluminescent material layer 1052 of a second color, the photoluminescent material layer 1051 of the first color is filled in the first first through hole 1041 in each group of first through holes, the photoluminescent material layer 1052 of the second color is filled in the second first through hole 1042 in each group of first through holes, and the first light absorption layer 1053 is filled in the third first through hole 1043 in each group of first through holes, wherein the first light absorption layer 1053 is used to partially absorb the light of the third color emitted by the micro LED unit 2011, and the light corresponding to the first color, the light corresponding to the second color and the light of the third color are synthesized to obtain white light.

[0096] According to an embodiment of the present disclosure, the second color conversion structure 11 further includes a second barrier layer 102, which is disposed on the first barrier layer 104 and includes a second through hole array 1020, the second through hole array 1020 is aligned with the first through hole array 1040 and is located above the first through hole array 1040, wherein the second through hole array 1020 includes a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, each group of second through holes includes a first second through hole 1021 aligned with the first first through hole 1041, a second second through hole 1022 aligned with the second first through hole 1042, and a third second through hole 1023 aligned with the third first through hole 1043. The color conversion structure 11 further includes at least one of a first filling part, a second filling part and a third filling part, wherein: the first filling part is filled in the first second through hole 1021 in each group of second through holes, and the first filling part includes a first filter layer 1031 that allows only light of the first color to pass through, a second light absorption layer or a transparent material for partially absorbing light of the third color; the second filling part is filled in the second second through hole 1022 in each group of second through holes, and the second filling part includes a second filter layer 1032 that allows only light of the second color to pass through, a second light absorption layer or a transparent material for partially absorbing light of the third color; the third filling part is filled in the third second through hole 1023 in each group of second through holes, and the third filling part includes a third filter layer that allows only light of the third color to pass through, a second light absorption layer 1033 or a transparent material for partially absorbing light of the third color. The second light absorption layer included in the first filling part, the second filling part and the third filling part is the same material as the first light absorption layer.

[0097] According to an embodiment of the present disclosure, when there is an unfilled second through hole in each group of second through holes, the second color conversion structure 11 further includes a transparent material, and the transparent material is filled in the unfilled second through hole.

[0098] According to an embodiment of the present disclosure, the first color is red, the second color is green, and the third color is blue.

[0099] According to an embodiment of the present disclosure, each group of first through holes includes two first through holes, the photoluminescent material layer includes a photoluminescent material layer of a fourth color, the photoluminescent material layer of the fourth color is filled in one first through hole, and the first light absorption layer is filled in another first through hole, wherein the first light absorption layer is used to partially absorb the light of the third color emitted by the micro LED unit, and white light is obtained by synthesizing the light of the fourth color and the light of the third color.

[0100] According to an embodiment of the present disclosure, the second color conversion structure further comprises a second barrier layer, the second barrier layer is disposed on the first barrier layer and comprises a second through hole array, the second through hole array is aligned with the first through hole array and is located above the first through hole array, wherein the second through hole array comprises a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, and each group of second through holes comprises two second through holes. The color conversion structure further comprises at least one of a fourth filling part and a fifth filling part, wherein: the fourth filling part is filled in the second through hole above the first through hole filled with the photoluminescent material layer of the fourth color, the fourth filling part comprises a fourth filter layer that only allows light of the fourth color to pass through, a second light absorbing layer or a transparent material for partially absorbing light of the third color; the fifth filling part is filled in the second through hole above the first through hole filled with the first light absorbing layer, the fifth filling part comprises a third filter layer that only allows light of the third color to pass through, a second light absorbing layer or a transparent material for partially absorbing light of the third color, and the second light absorbing layer included in the fourth filling part and the fifth filling part is the same material as the first light absorbing layer.

[0101] According to an embodiment of the present disclosure, when there is an unfilled second through hole in each group of second through holes, the color conversion structure further includes a transparent material, and the transparent material is filled in the unfilled second through hole.

[0102] According to an embodiment of the present disclosure, the fourth color is yellow and the third color is blue.

[0103] According to an embodiment of the present disclosure, the second color conversion structure further includes an insulating layer 106 , which is disposed on the light-emitting side of the micro LED chip 20 , and the first barrier layer 104 , the photoluminescent material layer and the first light absorption layer 1053 of the second color conversion structure 11 are disposed on the insulating layer 106 .

[0104] According to an embodiment of the present disclosure, the second color conversion structure further includes a third light absorption layer, which is disposed on the first barrier layer 104, the photoluminescent material layer and the first light absorption layer 1053, wherein the third light absorption layer is used to partially absorb the light emitted by the micro LED unit, and the third light absorption layer is made of the same material as the first light absorption layer 1053.

[0105] According to an embodiment of the present disclosure, the second color conversion structure 11 further includes a fourth light absorbing layer 1054, which is disposed on the second barrier layer 102, wherein the fourth light absorbing layer 1054 is used to partially absorb the light of the third color emitted by the micro LED unit 2011, and the fourth light absorbing layer 1054 is made of the same material as the first light absorbing layer 1053.

[0106] According to an embodiment of the present disclosure, the second color conversion structure 11 further includes a fifth light absorption layer 1055, wherein the fifth light absorption layer 1055 is disposed on the first barrier layer 104 and the second barrier layer 102 is disposed on the fifth light absorption layer 1055, wherein the fifth light absorption layer 1055 is used to partially absorb the light of the third color emitted by the micro LED unit 2011, and the fifth light absorption layer 1055 is made of the same material as the first light absorption layer 1053.

[0107] According to an embodiment of the present disclosure, the micro LED chip structure also includes a driving chip, and the side of the micro LED chip opposite to the light emitting side is arranged on the driving chip, or the micro LED chip structure also includes a driving chip and a flexible circuit board, and the side of the micro LED chip opposite to the light emitting side is arranged on the driving chip to form a micro LED module, and the micro LED module is arranged on the flexible circuit board through the driving chip.

[0108] According to an embodiment of the present disclosure, the material of the first barrier layer 104 and the material of the second barrier layer 102 include visible light shielding materials, the material of the first color photoluminescent material layer 1051 and the material of the second color photoluminescent material layer 1052 include at least one of II-VI group quantum dots, III-V group quantum dots, perovskite quantum dots and carbon quantum dots, the material of the first light absorption layer 1053 and the material of the second light absorption layer 1033 include organic dyes, nano absorption particles or inorganic oxides for absorbing blue light, and the material of the first filter layer 1031, the material of the second filter layer 1032 and the material of the third filter layer include organic dyes, nano absorption particles or inorganic oxides.

[0109] It is worth noting that any relevant description about the micro LED device in the above-mentioned micro LED device preparation method (including but not limited to technical features and their functions, explanations, etc.) can be applied to the micro LED device disclosed in the present invention.

[0110] According to embodiments of the present disclosure, the pixel size in the micro LED device is typically less than 50 microns.

[0111] The present disclosure also provides a display device, which includes the above-mentioned type LED device. The display device can be applied to flexible electronic devices to realize technologies such as augmented reality (AR), virtual reality (VR), extended reality (XR), and mixed reality (MR). For example, the micro LED device can be the projection part of an electronic device, such as a projector, a head-up display (HUD), etc.; for another example, the micro LED device can also be the display part of an electronic device, such as a smart phone, a smart watch, a laptop, a tablet computer, a driving recorder, a navigator, a head-mounted device, and any other device with a display screen.

[0112] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0113] It should be understood that "one embodiment" or "an embodiment" mentioned throughout the specification means that specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. It should be understood that in various embodiments of the present application, the size of the serial number of each step / process mentioned above does not mean the order of execution, and the execution order of each step / process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiment of the present application. In addition, the serial numbers of the embodiments of the present application mentioned above are only for description and do not represent the advantages and disadvantages of the embodiments.

[0114] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein, for example. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0115] The above description is only a preferred embodiment of the present disclosure and is not intended to limit the present disclosure. For those skilled in the art, the present disclosure may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A method for preparing a micro LED device, wherein: The method comprises: Obtaining a transparent substrate and a micro LED chip structure, wherein the micro LED chip structure comprises a micro LED chip, and the micro LED chip comprises a micro LED unit array composed of a plurality of micro LED units; Disposing a first barrier layer on the transparent substrate, so that the first barrier layer includes a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes a plurality of groups of first through holes, and each group of first through holes includes at least two first through holes; Filling a photoluminescent material layer and a first light absorbing layer in each group of first through holes to obtain a first color conversion structure, wherein the first light absorbing layer is used to partially absorb the light emitted by the micro LED unit, and the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer; The side of the first color conversion structure opposite to the transparent substrate is bonded to the light emitting side of the micro LED chip to obtain a micro LED device.

2. The method for preparing a micro LED device according to claim 1, wherein: Each group of first through holes includes three first through holes, and a photoluminescent material layer and a first light absorption layer are respectively filled in each group of first through holes to obtain a first color conversion structure, wherein the first light absorption layer is used to partially absorb the light emitted by the micro LED unit, and the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, including: Two first through holes in each group of first through holes are filled with a first color photoluminescent material layer and a second color photoluminescent material layer, respectively, and the first light absorption layer is filled in another first through hole in each group of first through holes, wherein the first light absorption layer is used to partially absorb the third color light emitted by the micro LED unit, and the light corresponding to the first color, the light corresponding to the second color and the light corresponding to the third color are synthesized to obtain white light.

3. The method for preparing a micro LED device according to claim 2, wherein: Before providing the first barrier layer on the transparent substrate, the method further comprises: Disposing a second barrier layer on the transparent substrate, so that the second barrier layer includes a second through hole array, the arrangement of the second through hole array corresponds to the arrangement of the micro LED unit array, wherein the second through hole array includes a plurality of groups of second through holes, each group of second through holes includes a first second through hole, a second second through hole and a third second through hole; A first filling step, when the first filling step is completed, a first intermediate structure is obtained, and the first filling step includes at least one of the following steps: Filling a first filling portion in a first second through hole in each group of second through holes, wherein the first filling portion includes a first filter layer that allows only light of a first color to pass through, a second light absorption layer for partially absorbing light of a third color, or a transparent material; Filling a second filling portion in a second second through hole in each group of second through holes, wherein the second filling portion includes a second filter layer that allows only light of the second color to pass through, a second light absorption layer for partially absorbing light of the third color, or a transparent material; A third filling portion is filled in the third second through hole in each group of second through holes, the third filling portion includes a second light absorption layer for partially absorbing light of a third color, and the second light absorption layer included in the first filling portion, the second filling portion and the third filling portion is made of the same material as the first light absorption layer.

4. The method for preparing a micro LED device according to claim 3, wherein: The first filling step further comprises: When there are unfilled second through holes in each group of second through holes, the unfilled second through holes are filled with a transparent material.

5. The method for preparing a micro LED device according to claim 3, wherein: A first barrier layer is disposed on the transparent substrate, so that the first barrier layer includes a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes a plurality of groups of first through holes, each group of first through holes includes at least two first through holes including: A first barrier layer is disposed on the first intermediate structure, and a first through hole array is opened on the first barrier layer, so that the first through hole array is aligned with the second through hole array and is located above the second through hole array, and the first through hole array exposes the first intermediate structure, wherein the first through hole array includes a plurality of groups of first through holes corresponding to the plurality of groups of second through holes, each group of first through holes includes a first first through hole aligned with the first second through hole, a second first through hole aligned with the second second through hole, and a third first through hole aligned with the third second through hole, Filling a first color photoluminescent material layer and a second color photoluminescent material layer in two first through holes in each group of first through holes respectively, and filling the first light absorption layer in another first through hole in each group of first through holes, wherein the first light absorption layer is used to partially absorb the third color light emitted by the micro LED unit, and synthesizing the light corresponding to the first color, the light corresponding to the second color and the light corresponding to the third color to obtain white light comprises: A first first through hole in each group of first through holes is filled with a photoluminescent material layer of a first color, a second first through hole in each group of first through holes is filled with a photoluminescent material layer of a second color, and a third first through hole in each group of first through holes is filled with the first light absorption layer, wherein the first light absorption layer is used to partially absorb light of a third color emitted by the micro LED unit, and the light corresponding to the first color, the light corresponding to the second color, and the light of the third color are synthesized to obtain white light.

6. The method for preparing a micro LED device according to claim 1, wherein: Each group of first through holes includes two first through holes, and a photoluminescent material layer and a first light absorption layer are respectively filled in each group of first through holes to obtain a first color conversion structure, wherein the first light absorption layer is used to partially absorb the light emitted by the micro LED unit, and the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, including: A photoluminescent material layer of a fourth color is filled in one first through hole in each group of first through holes, and the first light absorption layer is filled in another first through hole in each group of first through holes, wherein the first light absorption layer is used to partially absorb the light of a third color emitted by the micro LED unit, and white light is obtained by synthesizing the light of the fourth color and the light of the third color.

7. The method for preparing a micro LED device according to claim 6, wherein: Before providing the first barrier layer on the transparent substrate, the method further comprises: Disposing a second barrier layer on the transparent substrate, so that the second barrier layer includes a second through hole array, the arrangement of the second through hole array corresponds to the arrangement of the micro LED unit array, wherein the second through hole array includes a plurality of groups of second through holes, and each group of second through holes includes two second through holes; A second filling step, when the second filling step is completed, a second intermediate structure is obtained, and the second filling step includes at least one of the following steps: Filling a fourth filling portion in one second through hole in each group of second through holes, wherein the fourth filling portion includes a fourth filter layer that allows only light of a fourth color to pass through, a second light absorption layer for partially absorbing light of a third color, or a transparent material; A fifth filling portion is filled in another second through hole in each group of second through holes, the fifth filling portion including a second light absorption layer for partially absorbing light of a third color, and the second light absorption layer included in the fourth filling portion and the fifth filling portion is made of the same material as the first light absorption layer.

8. The method for preparing a micro LED device according to claim 7, wherein: The second filling step further comprises: When there are unfilled second through holes in each group of second through holes, the unfilled second through holes are filled with a transparent material.

9. The method for preparing a micro LED device according to claim 7, wherein: A first barrier layer is disposed on the transparent substrate, so that the first barrier layer includes a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes a plurality of groups of first through holes, each group of first through holes includes at least two first through holes including: A first barrier layer is disposed on the second intermediate structure, and a first through hole array is opened on the first barrier layer, so that the first through hole array is aligned with the second through hole array and is located above the second through hole array, and the first through hole array exposes the second intermediate structure, wherein the first through hole array includes a plurality of groups of first through holes corresponding to the plurality of groups of second through holes, and each group of first through holes includes two first through holes respectively aligned with two second through holes, Filling a photoluminescent material layer of a fourth color in one first through hole in each group of first through holes, and filling the first light absorption layer in another first through hole in each group of first through holes, wherein the first light absorption layer is used to partially absorb the light of a third color emitted by the micro LED unit, and synthesizing the light of the fourth color and the light of the third color to obtain white light comprises: In each group of first through holes, a photoluminescent material layer of a fourth color is filled in a first through hole above a second through hole for filling a fourth filling portion, and the first light absorbing layer is filled in a first through hole above a second through hole for filling a fifth filling portion, wherein the first light absorbing layer is used to partially absorb light of a third color emitted by the micro LED unit, and white light is obtained by synthesizing the light of the fourth color and the light of the third color.

10. The method for preparing a micro LED device according to claim 1, wherein: After each group of first through holes is filled with a photoluminescent material layer and a first light absorbing layer, the method further comprises: providing an insulating layer on the first barrier layer, the photoluminescent material layer and the first light absorbing layer, Bonding the side of the first color conversion structure opposite to the transparent substrate to the light-emitting side of the micro LED chip includes: bonding the insulating layer of the first color conversion structure to the light-emitting side of the micro LED chip.

11. The method for preparing a micro LED device according to claim 1, wherein: After bonding the side of the first color conversion structure opposite to the transparent substrate to the light emitting side of the micro LED chip, the method includes: The transparent substrate of the first color conversion structure is removed, and a second color conversion structure is obtained from the first color conversion structure.

12. The method for preparing a micro LED device according to claim 1, wherein: Before the first barrier layer is provided on the transparent substrate, the method further comprises: providing a third light absorbing layer on the transparent substrate, wherein the third light absorbing layer is used to partially absorb the light emitted by the micro LED unit, and the third light absorbing layer is made of the same material as the first light absorbing layer. Providing a first barrier layer on the transparent substrate includes: providing the first barrier layer on the third light absorbing layer.

13. The method for preparing a micro LED device according to claim 3, wherein: Before the second barrier layer is provided on the transparent substrate, the method further comprises: providing a fourth light absorbing layer on the transparent substrate, wherein the fourth light absorbing layer is used to partially absorb the light of the third color emitted by the micro LED unit, and the fourth light absorbing layer is made of the same material as the first light absorbing layer. Providing a second barrier layer on the transparent substrate includes: providing the second barrier layer on the fourth light absorbing layer.

14. The method for preparing a micro LED device according to claim 5, wherein: Before arranging the first barrier layer on the first intermediate structure, the method further includes: arranging a fifth light absorbing layer on the first intermediate structure, wherein the fifth light absorbing layer is used to partially absorb the light of the third color emitted by the micro LED unit, and the fifth light absorbing layer is made of the same material as the first light absorbing layer. Providing a first barrier layer on the first intermediate structure includes: providing the first barrier layer on the fifth light absorbing layer.

15. A micro LED device, wherein: The micro LED device comprises a second color conversion structure and a micro LED chip structure, wherein the micro LED chip structure comprises a micro LED chip, and the micro LED chip comprises a micro LED unit array composed of a plurality of micro LED units, wherein the second color conversion structure comprises: A first barrier layer, the first barrier layer comprising a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array comprises a plurality of groups of first through holes, and each group of first through holes comprises at least two first through holes; a photoluminescent material layer and a first light absorbing layer, wherein the photoluminescent material layer and the first light absorbing layer are respectively filled in each group of first through holes, wherein the first light absorbing layer is used to partially absorb the light emitted by the micro LED unit, and the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, The first barrier layer, the photoluminescent material layer and the first light absorption layer of the second color conversion structure are arranged on the light emitting side of the micro LED chip.

16. The micro LED device according to claim 15, wherein: Each group of first through holes includes two first through holes, the photoluminescent material layer includes a photoluminescent material layer of a fourth color, the photoluminescent material layer of the fourth color is filled in one first through hole, and the first light absorption layer is filled in another first through hole, wherein the first light absorption layer is used to partially absorb the light of the third color emitted by the micro LED unit, and the light of the fourth color and the light of the third color are synthesized to obtain white light.

17. The micro LED device according to claim 16, wherein: The second color conversion structure further includes a second barrier layer, which is disposed on the first barrier layer and includes a second through hole array, the second through hole array is aligned with the first through hole array and is located above the first through hole array, wherein the second through hole array includes a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, each group of second through holes includes two second through holes, and the color conversion structure further includes at least one of a fourth filling portion and a fifth filling portion, wherein: The fourth filling part is filled in the second through hole above the first through hole filled with the photoluminescent material layer of the fourth color, and the fourth filling part includes a fourth filter layer that only allows the light of the fourth color to pass through, a second light absorption layer for partially absorbing the light of the third color, or a transparent material; The fifth filling part is filled in the second through hole above the first through hole filled with the first light absorbing layer, and the fifth filling part includes a second light absorbing layer for partially absorbing light of a third color. The second light absorption layer included in the fourth filling part and the fifth filling part is made of the same material as the first light absorption layer.

18. The micro LED device according to claim 17, wherein: When there is an unfilled second through hole in each group of second through holes, the color conversion structure further includes a transparent material, and the transparent material is filled in the unfilled second through hole.

19. The micro LED device according to claim 16, wherein: The fourth color is yellow and the third color is blue.

20. The micro LED device according to claim 15, wherein: The second color conversion structure further includes an insulating layer, which is arranged on the light-emitting side of the micro LED chip, and the first barrier layer, the photoluminescent material layer and the first light absorption layer of the second color conversion structure are arranged on the insulating layer.

21. The micro LED device according to claim 15, wherein: The second color conversion structure also includes a third light absorption layer, which is arranged on the first barrier layer, the photoluminescent material layer and the first light absorption layer, wherein the third light absorption layer is used to partially absorb the light emitted by the micro LED unit, and the third light absorption layer is made of the same material as the first light absorption layer.

22. The micro LED device according to claim 17, wherein: The second color conversion structure further includes a fourth light absorption layer, which is disposed on the second barrier layer, wherein the fourth light absorption layer is used to partially absorb the third color light emitted by the micro LED unit, and the fourth light absorption layer is made of the same material as the first light absorption layer.

23. The micro LED device according to claim 17, wherein: The second color conversion structure also includes a fifth light absorption layer, which is arranged on the first barrier layer and the second barrier layer is arranged on the fifth light absorption layer, wherein the fifth light absorption layer is used to partially absorb the third color light emitted by the micro LED unit, and the fifth light absorption layer is made of the same material as the first light absorption layer.

24. The micro LED device according to claim 15, wherein: The micro LED chip structure further includes a driving chip, and a side of the micro LED chip opposite to the light emitting side is arranged on the driving chip. Alternatively, the micro LED chip structure further includes a driving chip and a flexible circuit board, the side of the micro LED chip opposite to the light emitting side is arranged on the driving chip to form a micro LED module, and the micro LED module is arranged on the flexible circuit board through the driving chip.

25. The micro LED device according to claim 17, wherein: The material of the first barrier layer and the material of the second barrier layer include visible light shielding materials.

26. A display device, wherein: The display device comprises the micro LED device according to any one of claims 15 to 25.

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