Micro-led device preparation method, micro-led device and display device

Abstract

The present disclosure provides a micro-LED device preparation method, a micro-LED device and a display device. The method comprises: disposing a reflective layer on a transparent substrate, so that the arrangement of a first via array included in the reflective layer corresponds to the arrangement of a micro-LED unit array and includes multiple groups of first vias; disposing a first barrier layer on the reflective layer, so that a second via array included in the first barrier layer includes multiple groups of second vias corresponding to the multiple groups of first vias, and a first via in each group of first vias corresponds to part of second vias in the corresponding group of second vias; filling a photo-luminescent material layer in the second vias without corresponding first vias, and filling a first light-absorbing layer in the corresponding first vias and second vias to obtain a first color conversion structure, the first light-absorbing layer being used for partially absorbing light emitted by the micro-LED unit; and bonding the side, opposite to the transparent substrate, of the first color conversion structure with the light-emitting side of a micro-LED chip to obtain a micro-LED device.

Description

Technical Field

[0001] This disclosure relates to the technical field of semiconductor Micro LED, and more specifically, to a method for fabricating a micro LED device, a micro LED device, and a display device. Background Technology

[0002] Micro-LED is a comprehensive technology that integrates novel display technology with light-emitting diode (LED) technology. It boasts advantages such as small size, high brightness, high resolution, and low power consumption, and is considered one of the most promising next-generation display and light-emitting devices. Currently, full-color Micro-LED displays can be achieved in various ways, one of which is color conversion. However, full-color Micro-LED devices achieved through color conversion still suffer from unsatisfactory display effects. Summary of the Invention

[0003] The present disclosure provides a method for fabricating a micro LED device, a micro LED device, and a display device.

[0004] According to one aspect of the present disclosure, a method for fabricating a micro-LED device is provided, wherein the method includes: obtaining a transparent substrate and a micro-LED chip structure, wherein the micro-LED chip structure includes a micro-LED chip, the micro-LED chip including a micro-LED unit array composed of a plurality of micro-LED units; disposing a reflective layer on the transparent substrate, such that the reflective layer includes a first through-hole array, the arrangement of the first through-hole array corresponding to the arrangement of the micro-LED unit array, wherein the first through-hole array includes a plurality of first through-holes, the reflective layer being used to reflect light emitted by the micro-LED units; disposing a first barrier layer on the reflective layer, such that the first barrier layer includes a second through-hole array, the arrangement of the second through-hole array corresponding to the arrangement of the micro-LED unit array, wherein the second through-hole array includes a plurality of first through-holes; and the reflective layer being used to reflect light emitted by the micro-LED units. Multiple sets of second through holes corresponding to the multiple sets of first through holes, each set of second through holes including at least two second through holes, the number of first through holes in each set of first through holes being less than the number of second through holes in each set of second through holes, and the first through holes in each set of first through holes corresponding to a portion of the second through holes in the corresponding set of second through holes; a photoluminescent material layer is filled in the second through holes in each set of second through holes without a corresponding first through hole, and a first light-absorbing layer is filled in the corresponding first and second through holes to obtain a first color conversion structure, wherein the first light-absorbing layer is used to partially absorb the light emitted by the micro LED unit, and the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer; the side of the first color conversion structure opposite to the transparent substrate is bonded to the light-emitting side of the micro LED chip to obtain a micro LED device.

[0005] Further, each group of first through holes includes one first through hole, and each group of second through holes includes three second through holes. A photoluminescent material layer is filled in the second through holes in each group that do not have a corresponding first through hole, and a first light-absorbing layer is filled in the corresponding first and second through holes. The first light-absorbing layer is used to partially absorb the light emitted by the micro-LED unit, and the color of the light emitted by the micro-LED unit is different from the color corresponding to the photoluminescent material layer. This includes filling two second through holes in each group of second through holes that do not have a corresponding first through hole with a first-color photoluminescent material layer and a second-color photoluminescent material layer, respectively, and filling the corresponding first and second through holes with a first light-absorbing layer. The first light-absorbing layer is used to partially absorb a third-color light emitted by the micro-LED unit. The light corresponding to the first color, the light corresponding to the second color, and the light corresponding to the third color are combined to obtain white light.

[0006] Further, before setting the reflective layer on the transparent substrate, the method further includes: setting a second partition layer on the transparent substrate, such that the second partition layer includes a third through-hole array, the arrangement of the third through-hole array corresponding to the arrangement of the micro LED unit array, wherein the third through-hole array includes multiple sets of third through-holes, each set of third through-holes including a first third through-hole, a second third through-hole, and a third third through-hole; a first filling step, wherein a first intermediate structure is obtained upon completion of the first filling step, the first filling step including at least one of the following steps: filling a first filling portion in the first third through-hole of each set of third through-holes, the first filling portion including a portion that only allows a first color. A first light-filtering layer allows light to pass through, or a second light-absorbing layer partially absorbs light of a third color; a second filling portion is filled in the second third through-hole of each group of third through-holes, the second filling portion comprising a second light-filtering layer that allows only light of the second color to pass through, or a second light-absorbing layer that partially absorbs light of the third color; a third filling portion is filled in the third third through-hole of each group of third through-holes, the third filling portion comprising a third light-filtering layer that allows only light of the third color to pass through, or a second light-absorbing layer that partially absorbs light of the third color, wherein the second light-absorbing layer included in the first filling portion, the second filling portion, and the third filling portion is made of the same material as the first light-absorbing layer.

[0007] Furthermore, the first filling step also includes: when there are unfilled third through holes in each group of third through holes, filling the unfilled third through holes with transparent material.

[0008] Furthermore, a reflective layer is disposed on the transparent substrate, such that the reflective layer includes a first via array, the arrangement of the first via array corresponding to the arrangement of the micro-LED unit array. The first via array includes multiple sets of first vias: a reflective layer is disposed on the first intermediate structure, and a first via array is formed on the reflective layer, such that the first via array includes multiple sets of first vias, each set of first vias including a first via aligned with the third via, the first vias exposing the first intermediate structure; a first partition layer is disposed on the reflective layer, such that the first partition layer includes a second via array, the arrangement of the second via array corresponding to... In the arrangement of the micro LED unit array, the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes. Each set of second through-holes includes at least two second through-holes. The number of first through-holes in each set of first through-holes is less than the number of second through-holes in each set of second through-holes. The correspondence between the first through-holes in each set of first through-holes and a portion of the second through-holes in the corresponding set of second through-holes includes: setting a first partition layer on the reflective layer, and opening a second through-hole array on the first partition layer, such that the second through-hole array is aligned with and above the third through-hole array, and the second through-hole array exposes the reflective layer. The second via array includes multiple sets of second vias corresponding to the multiple sets of third vias. Each set of second vias includes a first second via aligned with the first third via, a second second via aligned with the second third via, and a third second via aligned with the third third via. The third second via is aligned with the first via. In each set of second vias, the two second vias without a corresponding first via are respectively filled with a photoluminescent material layer of a first color and a photoluminescent material layer of a second color. Furthermore, the corresponding first and second vias are filled with a first light-absorbing layer, wherein the first light-absorbing layer is used to partially absorb the light emitted by the micro-LED unit. The third color of light, corresponding to the first color of light, the second color of light, and the third color of light combined to obtain white light, includes: filling the first second through hole in each group of second through holes with a first color of photoluminescent material layer, filling the second second through hole in each group of second through holes with a second color of photoluminescent material layer, and filling the aligned first through hole and third second through hole with a first light-absorbing layer, wherein the first light-absorbing layer is used to partially absorb the third color of light emitted by the micro LED unit, and the white light is obtained by combining the first color of light, the second color of light, and the third color of light.

[0009] Further, each group of first through holes includes one first through hole, and each group of second through holes includes two second through holes. A photoluminescent material layer is filled in the second through hole in each group of second through holes that does not correspond to the first through hole, and a first light-absorbing layer is filled in the corresponding first and second through holes. The first light-absorbing layer is used to partially absorb the light emitted by the micro-LED unit, and the color of the light emitted by the micro-LED unit is different from the color corresponding to the photoluminescent material layer. This includes filling a fourth color photoluminescent material layer in the second through hole in each group of second through holes that does not correspond to the first through hole, and filling the corresponding first and second through holes with a first light-absorbing layer. The first light-absorbing layer is used to partially absorb a third color of light emitted by the micro-LED unit, and the fourth color light and the third color light are combined to obtain white light.

[0010] Further, before setting the reflective layer on the transparent substrate, the method further includes: setting a second partition layer on the transparent substrate, such that the second partition layer includes a third through-hole array, the arrangement of the third through-hole array corresponding to the arrangement of the micro LED unit array, wherein the third through-hole array includes multiple sets of third through-holes, each set of third through-holes including two third through-holes; a second filling step, wherein a second intermediate structure is obtained upon completion of the second filling step, the second filling step including at least one of the following steps: filling a fourth filling portion in one of the third through-holes in each set of third through-holes, the fourth filling portion including a fourth light filter layer that allows only fourth color light to pass through or a second light-absorbing layer for partially absorbing third color light; filling a fifth filling portion in another third through-hole in each set of third through-holes, the fifth filling portion including a third light filter layer that allows only third color light to pass through or a second light-absorbing layer for partially absorbing third color light, wherein the second light-absorbing layer included in the fourth filling portion and the fifth filling portion is made of the same material as the first light-absorbing layer.

[0011] Furthermore, the second filling step also includes: when there are unfilled third through holes in each group of third through holes, filling the unfilled third through holes with transparent material.

[0012] Furthermore, a reflective layer is disposed on a transparent substrate, such that the reflective layer includes a first via array, the arrangement of which corresponds to the arrangement of the micro-LED unit array. The first via array includes multiple sets of first vias: a reflective layer is disposed on the second intermediate structure, and a first via array is formed on the reflective layer, such that the first via array includes multiple sets of first vias, each set including a first via aligned with a third via, the first vias exposing the second intermediate structure; a first partition layer is disposed on the reflective layer, such that the first partition layer includes a second via array, the arrangement of which corresponds to the arrangement of the micro-LED unit array, wherein the second via array includes vias corresponding to the multiple sets of first vias. Multiple sets of second through holes, each set of second through holes including at least two second through holes, the number of first through holes in each set of first through holes being less than the number of second through holes in each set of second through holes, and the first through holes in each set of first through holes corresponding to a portion of the second through holes in the corresponding set of second through holes, comprising: setting a first partition layer on the reflective layer, and opening a second through hole array on the first partition layer, such that the second through hole array is aligned with the third through hole array and located above the third through hole array, and the second through hole array exposes the reflective layer, wherein the second through hole array includes multiple sets of second through holes corresponding to the multiple sets of third through holes, each set of second through holes including two second through holes respectively aligned with two third through holes, and one of the second through holes in each set of second through holes being aligned with a first through hole.

[0013] Furthermore, each micro-LED unit in the micro-LED unit array includes a first semiconductor layer on the light-emitting side, and bonding the side of the first color conversion structure opposite to the transparent substrate to the light-emitting side of the micro-LED chip includes: bonding the side of the first color conversion structure opposite to the transparent substrate to the first semiconductor layer.

[0014] Furthermore, after filling the second through-holes without corresponding first through-holes in each group of second through-holes with a photoluminescent material layer, and filling the corresponding first through-holes and second through-holes with a first light-absorbing layer, the method further includes: providing an insulating layer on the first barrier layer, the photoluminescent material layer and the first light-absorbing layer, and bonding the side of the first color conversion structure opposite to the transparent substrate to the first semiconductor layer includes: bonding the insulating layer of the first color conversion structure to the first semiconductor layer.

[0015] Furthermore, after bonding the side of the first color conversion structure opposite to the transparent substrate to the light-emitting side of the microLED chip, the method includes: removing the transparent substrate of the first color conversion structure to obtain a second color conversion structure from the first color conversion structure.

[0016] Furthermore, before setting the second barrier layer on the transparent substrate, the method further includes: setting a third light-absorbing layer on the transparent substrate, wherein the third light-absorbing layer is used to partially absorb the third color light emitted by the micro LED unit, and the third light-absorbing layer is made of the same material as the first light-absorbing layer; setting the second barrier layer on the transparent substrate includes: setting the second barrier layer on the third light-absorbing layer.

[0017] Furthermore, before setting the reflective layer on the first intermediate structure, the method further includes: setting a fourth light-absorbing layer on the first intermediate structure, wherein the fourth light-absorbing layer is used to partially absorb the third color light emitted by the micro LED unit, and the fourth light-absorbing layer is made of the same material as the first light-absorbing layer; setting the reflective layer on the first intermediate structure includes: setting a reflective layer on the fourth light-absorbing layer.

[0018] According to another aspect of this disclosure, a micro LED device is also provided.

[0019] The micro-LED device includes a second color conversion structure and a micro-LED chip structure. The micro-LED chip structure includes a micro-LED chip, which comprises a micro-LED unit array composed of multiple micro-LED units. The second color conversion structure includes: a first partition layer comprising a second via array, the arrangement of which corresponds to the arrangement of the micro-LED unit array, wherein the second via array comprises multiple sets of second vias, each set comprising at least two second vias; and a reflective layer disposed on the first partition layer, the reflective layer comprising a first via array, wherein the first via array comprises multiple sets of first vias corresponding to the multiple sets of second vias, each set comprising a first via. The number of the first through holes is less than the number of the second through holes in each group of second through holes, and the first through holes in each group of first through holes correspond to a portion of the second through holes in the corresponding group of second through holes. The reflective layer is used to reflect the light emitted by the micro LED unit. The photoluminescent material layer and the first light-absorbing layer are used to partially absorb the light emitted by the micro LED unit. The photoluminescent material layer is filled in the second through holes in each group of second through holes without a corresponding first through hole. The first light-absorbing layer is filled in the corresponding first through hole and second through hole. The first light-absorbing layer is used to partially absorb the light emitted by the micro LED unit. The color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer. The first barrier layer, the photoluminescent material layer and the first light-absorbing layer of the second color conversion structure are disposed on the light-emitting side of the micro LED chip.

[0020] Furthermore, each group of first through holes includes one first through hole, and each group of second through holes includes a first second through hole, a second second through hole, and a third second through hole. The third second through hole is aligned with the first through hole. The photoluminescent material layer includes a first color photoluminescent material layer and a second color photoluminescent material layer. The first color photoluminescent material layer fills the first second through hole in each group of second through holes, and the second color photoluminescent material layer fills the second second through hole in each group of second through holes. The first light-absorbing layer fills the aligned third second through hole and the first through hole. The first light-absorbing layer is used to partially absorb the third color light emitted by the micro LED unit. The light corresponding to the first color, the light corresponding to the second color, and the third color are combined to obtain white light.

[0021] Furthermore, the second color conversion structure further includes a second barrier layer disposed on the reflective layer and including a third through-hole array. The third through-hole array is aligned with and located above the second through-hole array. The third through-hole array includes multiple sets of third through-holes corresponding to the plurality of sets of second through-holes. Each set of third through-holes includes a first third through-hole aligned with the first second through-hole, a second third through-hole aligned with the second second through-hole, and a third third through-hole aligned with the third second through-hole. The second color conversion structure further includes at least one of a first filling portion, a second filling portion, and a third filling portion, wherein the first filling portion fills the first third through-hole in each set of third through-holes. The first filling portion includes a first filter layer that allows only light of a first color to pass through or a second light-absorbing layer that partially absorbs light of a third color; the second filling portion fills the second third through-hole in each group of third through-holes, and the second filling portion includes a second filter layer that allows only light of a second color to pass through or a second light-absorbing layer that partially absorbs light of a third color; the third filling portion fills the third third through-hole in each group of third through-holes, and the third filling portion includes a third filter layer that allows only light of a third color to pass through or a second light-absorbing layer that partially absorbs light of a third color, wherein the second light-absorbing layer included in the first filling portion, the second filling portion, and the third filling portion is made of the same material as the first light-absorbing layer.

[0022] Furthermore, when there are unfilled third through holes in each group of third through holes, the second color conversion structure also includes a transparent material that fills the unfilled third through holes.

[0023] Furthermore, the first color is red, the second color is green, and the third color is blue.

[0024] Furthermore, each group of first through holes includes one first through hole, each group of second through holes includes two second through holes, one of the second through holes in each group is aligned with the first through hole, the photoluminescent material layer includes a fourth color photoluminescent material layer, the fourth color photoluminescent material layer fills the second through holes not aligned with the first through hole, and the first light-absorbing layer fills the aligned second through holes and the first through hole, wherein the first light-absorbing layer is used to partially absorb the third color light emitted by the micro LED unit, and the fourth color light and the third color light are combined to obtain white light.

[0025] Furthermore, the second color conversion structure further includes a second barrier layer disposed on the reflective layer and including a third through-hole array. The third through-hole array is aligned with and located above the second through-hole array. The third through-hole array includes multiple sets of third through-holes corresponding to the multiple sets of second through-holes, each set of third through-holes including two third through-holes. The second color conversion structure further includes at least one of a fourth filling portion and a fifth filling portion. The fourth filling portion fills the third through-hole above the second through-hole filled with a photoluminescent material layer of the fourth color. The fourth filling portion includes a fourth filter layer that allows only the fourth color of light to pass through or a second light-absorbing layer for partially absorbing the third color of light. The fifth filling portion fills the third through-hole above the first through-hole filled with a first light-absorbing layer. The fifth filling portion includes a third filter layer that allows only the third color of light to pass through or a second light-absorbing layer for partially absorbing the third color of light. The second light-absorbing layer included in the fourth and fifth filling portions is made of the same material as the first light-absorbing layer.

[0026] Furthermore, when there are unfilled third through holes in each group of third through holes, the color conversion structure also includes a transparent material that fills the unfilled third through holes.

[0027] Furthermore, the fourth color is yellow and the third color is blue.

[0028] Furthermore, each micro-LED unit in the micro-LED unit array includes a first semiconductor layer on the light-emitting side, and the first barrier layer, photoluminescent material layer and first light-absorbing layer of the second color conversion structure are disposed on the first semiconductor layer.

[0029] Furthermore, the second color conversion structure also includes an isolation layer, which is disposed on the first barrier layer, the photoluminescent material layer and the first light-absorbing layer, and the isolation layer is disposed on the first semiconductor layer.

[0030] Furthermore, the second color conversion structure also includes a third light-absorbing layer disposed on the second barrier layer, wherein the third light-absorbing layer is used to partially absorb the light emitted by the micro LED unit, and the third light-absorbing layer is made of the same material as the first light-absorbing layer.

[0031] Furthermore, the second color conversion structure also includes a fourth light-absorbing layer disposed on the reflective layer, and the second barrier layer disposed on the fourth light-absorbing layer, wherein the fourth light-absorbing layer is used to partially absorb the light emitted by the micro LED unit, and the fourth light-absorbing layer is made of the same material as the first light-absorbing layer.

[0032] Furthermore, the micro LED chip structure also includes a driver chip, with the side of the micro LED chip opposite to the light-emitting side disposed on the driver chip. Alternatively, the micro LED chip structure also includes a driver chip and a flexible circuit board, with the side of the micro LED chip opposite to the light-emitting side disposed on the driver chip to form a micro LED module, and the micro LED module disposed on the flexible circuit board via the driver chip.

[0033] Furthermore, the materials of the first barrier layer and the second barrier layer include visible light shielding materials; the materials of the first color photoluminescent material layer and the second color photoluminescent material layer include at least one of group II-VI quantum dots, group III-V quantum dots, perovskite quantum dots, and carbon quantum dots; the materials of the first light-absorbing layer and the second light-absorbing layer include organic dyes, nano-absorbing particles, or inorganic oxides for absorbing blue light; the materials of the first light-filtering layer, the second light-filtering layer, and the third light-filtering layer include organic dyes, nano-absorbing particles, or inorganic oxides; and the reflective layer includes a distributed Bragg reflector film.

[0034] According to another aspect of the present disclosure, a display device is also provided. The display device includes a miniature LED device prepared by the above-described method.

[0035] By applying the technical solution of this disclosure, a transparent substrate and a micro LED chip are obtained. A reflective layer is disposed on the transparent substrate, and a first partition layer is disposed on the reflective layer. Each group of second vias included in the first partition layer includes at least two second vias. The number of first vias in each group of first vias included in the reflective layer is less than the number of second vias in each group of second vias. The second vias correspond to some of the first vias. A photoluminescent material layer is filled in the second vias in each group of second vias that do not correspond to the first vias, and a first light-absorbing layer is filled in the corresponding first and second vias to form a first color conversion structure. The first color conversion structure is then bonded to the light-emitting side of the micro LED chip to form a micro LED device.

[0036] On the one hand, in this micro-LED device, the light emitted by the micro-LED unit of the micro-LED chip excites the material in the photoluminescent material layer to emit light of a different color than the light emitted by the micro-LED unit. Since the first light-absorbing layer can partially absorb the light emitted by the micro-LED unit, the light overflow caused by the light emitted directly from the micro-LED device is reduced. Therefore, the color deviation and poor color purity caused by light overflow are reduced, thereby improving the uniformity of different colors of light emitted from the micro-LED device, improving the color purity of the micro-LED, and thus improving the display effect of the micro-LED device.

[0037] On the other hand, since the reflective layer covers the photoluminescent material layer, if a portion of the light emitted by the micro-LED unit does not participate in exciting the photoluminescent material layer and leaks through the photoluminescent material layer, the reflective layer can reflect the leaked portion of light back to the photoluminescent material layer and allow it to re-participate in exciting the photoluminescent material layer. This increases the amount of light participating in exciting the photoluminescent material layer, thereby increasing the amount of light emitted in the color corresponding to the photoluminescent material layer, thus improving the brightness of the micro-LED. Furthermore, it reduces the mixing output of the leaked portion of light with the different colors of light emitted by exciting the photoluminescent material layer, thereby improving the color purity of the micro-LED and thus enhancing the display effect of the micro-LED device. Attached Figure Description

[0038] The above and other objects, features, and advantages of exemplary embodiments of the present disclosure will become readily apparent upon reading the following detailed description with reference to the accompanying drawings. In the drawings, several embodiments of the present disclosure are illustrated by way of example and not limitation, and like or corresponding reference numerals denote like or corresponding parts, wherein:

[0039] Figure 1 This is a flowchart illustrating a method for fabricating a micro LED device according to an embodiment of the present disclosure;

[0040] Figures 2 to 13This is a schematic diagram illustrating the fabrication process of a micro LED device fabrication method according to an embodiment of the present disclosure. Detailed Implementation

[0041] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present disclosure will now be described in detail with reference to the accompanying drawings and embodiments.

[0042] It should be noted that the following detailed descriptions are illustrative and intended to provide further explanation of this application. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0043] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways, rotated 90 degrees, or in other orientations, and the spatial relative descriptions used herein will be interpreted accordingly.

[0044] Exemplary embodiments according to this disclosure will now be described in more detail with reference to the accompanying drawings. However, these exemplary embodiments may be implemented in many different forms and should not be construed as being limited to the embodiments set forth herein. It should be understood that these embodiments are provided so that the disclosure of this application is thorough and complete, and that the concept of these exemplary embodiments is fully conveyed to those skilled in the art. In the drawings, for clarity, the thickness of layers and regions has been enlarged, and the same reference numerals are used to denote the same devices, and therefore their description will be omitted.

[0045] This disclosure provides a method for fabricating a micro LED device. (Refer to...) Figures 1 to 13 , Figure 1 This is a flowchart illustrating a method for fabricating a micro LED device according to an embodiment of the present disclosure; Figures 2 to 13 This is a schematic diagram illustrating the fabrication process of a micro LED device fabrication method according to an embodiment of the present disclosure.

[0046] like Figure 1As shown, the method for fabricating this micro LED device includes the following steps S101-S105.

[0047] Step S101: Obtain a transparent substrate and a micro LED chip structure, wherein the micro LED chip structure includes a micro LED chip, and the micro LED chip includes a micro LED unit array composed of multiple micro LED units.

[0048] Step S102: A reflective layer is formed on a transparent substrate, such that the reflective layer includes a first through-hole array, the arrangement of the first through-hole array corresponding to the arrangement of the micro LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, and the reflective layer is used to reflect the light emitted by the micro LED unit.

[0049] Step S103: A first barrier layer is provided on the reflective layer, such that the first barrier layer includes a second through-hole array, the arrangement of the second through-hole array corresponds to the arrangement of the micro LED unit array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, each set of second through-holes includes at least two second through-holes, the number of first through-holes in each set of first through-holes is less than the number of second through-holes in each set of second through-holes, and the first through-holes in each set of first through-holes correspond to a portion of the second through-holes in the corresponding set of second through-holes.

[0050] Step S104: Fill the second through hole in each group of second through holes without a corresponding first through hole with a photoluminescent material layer, and fill the corresponding first through hole and second through hole with a first light-absorbing layer to obtain a first color conversion structure, wherein the first light-absorbing layer is used to partially absorb the light emitted by the micro LED unit, and the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer.

[0051] Step S105: Bond the side of the first color conversion structure opposite to the transparent substrate to the light-emitting side of the micro LED chip to obtain a micro LED device.

[0052] According to this technical solution, a transparent substrate and a micro LED chip can be obtained. A reflective layer is disposed on the transparent substrate, and a first partition layer is disposed on the reflective layer. Each group of second through holes included in the first partition layer includes at least two second through holes. The number of first through holes in each group of first through holes included in the reflective layer is less than the number of second through holes in each group of second through holes. The second through holes correspond to some of the first through holes. A photoluminescent material layer is filled in the second through holes in each group of second through holes that do not correspond to the first through holes, and a first light-absorbing layer is filled in the corresponding first and second through holes to form a first color conversion structure. The first color conversion structure is then bonded to the light-emitting side of the micro LED chip to form a micro LED device.

[0053] On the one hand, in this micro-LED device, the light emitted by the micro-LED unit of the micro-LED chip excites the material in the photoluminescent material layer to emit light of a different color than the light emitted by the micro-LED unit. Since the first light-absorbing layer can partially absorb the light emitted by the micro-LED unit, the light overflow caused by the light emitted directly from the micro-LED device is reduced. Therefore, the color deviation and poor color purity caused by light overflow are reduced, thereby improving the uniformity of different colors of light emitted from the micro-LED device, improving the color purity of the micro-LED, and thus improving the display effect of the micro-LED device.

[0054] On the other hand, since the reflective layer covers the photoluminescent material layer, if a portion of the light emitted by the micro-LED unit does not participate in exciting the photoluminescent material layer and leaks through the photoluminescent material layer, the reflective layer can reflect the leaked portion of light back to the photoluminescent material layer and allow it to re-participate in exciting the photoluminescent material layer. This increases the amount of light participating in exciting the photoluminescent material layer, thereby increasing the amount of light emitted in the color corresponding to the photoluminescent material layer, thus improving the brightness of the micro-LED. Furthermore, it reduces the mixing output of the leaked portion of light with the different colors of light emitted by exciting the photoluminescent material layer, thereby improving the color purity of the micro-LED and thus enhancing the display effect of the micro-LED device.

[0055] In step S101, a transparent substrate and a micro LED chip structure can be obtained, wherein the micro LED chip structure includes a micro LED chip, and the micro LED chip includes a micro LED unit array composed of multiple micro LED units.

[0056] According to embodiments of this disclosure, a transparent substrate and a micro-LED chip structure can be obtained first. The transparent substrate may include any suitable substrate such as a glass substrate, a polyimide substrate, or a sapphire substrate. The micro-LED chip structure includes a micro-LED chip, which comprises an array of micro-LED units for emitting light. The micro-LED chip can be any micro-LED chip suitable for fabricating a micro-LED device; for example, the structure of the micro-LED chip may include a right-mounted structure, a flip-chip structure, or a vertical structure, etc., without limitation. Each micro-LED unit in the micro-LED unit array may include an exposed first semiconductor layer on its light-emitting side. Depending on the type of micro-LED device, in some embodiments, the first semiconductor layer may include an N-GaN layer; in other embodiments, the first semiconductor layer may include a P-GaN layer. It is worth noting that the micro-LED chip structure can also be obtained in any step prior to the subsequent step of using the micro-LED chip structure.

[0057] Reference Figures 2-13 ,in Figure 2 A side view of a transparent substrate 101 according to an embodiment of the present disclosure is shown. Figure 2 As shown, the transparent substrate 101 may be, for example, a glass substrate.

[0058] Reference Figures 2-13 ,in Figure 3 A side view of a microLED chip structure according to an embodiment of the present disclosure is shown. Figure 3 As shown, the micro-LED chip structure includes a micro-LED chip 20, which comprises a micro-LED unit array 201 composed of micro-LED units 2011. Each micro-LED unit 2011 in the micro-LED unit array 201 includes, for example, a first semiconductor layer 20111 of N-GaN layer on the light-emitting side. Figure 3 As shown, the first semiconductor layer 20111 is shared by each micro-LED unit 2011 in the micro-LED unit array 201, that is, the first semiconductor layer 20111 is integrated into the micro-LED chip 20.

[0059] In step S102, a reflective layer can be formed on the transparent substrate, such that the reflective layer includes a first through-hole array, the arrangement of the first through-hole array corresponding to the arrangement of the micro LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, and the reflective layer is used to reflect the light emitted by the micro LED unit.

[0060] According to embodiments of this disclosure, after obtaining a transparent substrate, a reflective layer can be formed on the transparent substrate. The reflective layer may include a distributed Bragg reflective film, which may be, for example, a distributed Bragg reflective film formed by alternating stacks of silicon dioxide and titanium dioxide layers, and may also include any material layer for reflecting the light emitted by the micro-LED unit. Additionally, each group of first through-holes may include one or two first through-holes.

[0061] According to one embodiment of this disclosure, before forming a reflective layer on a transparent substrate, the method further includes: forming a second partition layer on the transparent substrate, such that the second partition layer includes a third through-hole array, the arrangement of the third through-hole array corresponding to the arrangement of the micro-LED unit array, wherein the third through-hole array includes multiple sets of third through-holes, each set of third through-holes including a first third through-hole, a second third through-hole, and a third third through-hole; a first filling step, wherein a first intermediate structure is obtained upon completion of the first filling step, the first filling step including at least one of the following steps: filling a first filling portion in the first third through-hole of each set of third through-holes, the first filling portion including only allowing a first A first light-filtering layer allows light of a third color to pass through, or a second light-absorbing layer partially absorbs light of a third color; a second filling portion is filled in the second third through-hole of each group of third through-holes, the second filling portion comprising a second light-filtering layer that allows only light of the second color to pass through, or a second light-absorbing layer that partially absorbs light of the third color; a third filling portion is filled in the third third through-hole of each group of third through-holes, the third filling portion comprising a third light-filtering layer that allows only light of the third color to pass through, or a second light-absorbing layer that partially absorbs light of the third color, wherein the second light-absorbing layer included in the first filling portion, the second filling portion, and the third filling portion is made of the same material as the first light-absorbing layer.

[0062] Furthermore, the first filling step also includes: when there are unfilled third through holes in each group of third through holes, filling the unfilled third through holes with transparent material.

[0063] Specifically, a reflective layer is disposed on a transparent substrate, such that the reflective layer includes a first through-hole array, the arrangement of the first through-hole array corresponding to the arrangement of the micro LED unit array, wherein the first through-hole array includes multiple sets of first through-holes: a reflective layer is disposed on the first intermediate structure, and a first through-hole array is formed on the reflective layer, such that the first through-hole array includes multiple sets of first through-holes, each set of first through-holes including a first through-hole aligned with the third through-hole, and the first through-holes expose the first intermediate structure.

[0064] In this embodiment, the first color of light refers to the light within the wavelength range corresponding to the first color, the second color of light refers to the light within the wavelength range corresponding to the second color, and the third color of light refers to the light within the wavelength range corresponding to the third color. The first, second, and third colors can be three primary colors; for example, the first color is red, the second color is green, and the third color is blue. The material of the second barrier layer includes a visible light shielding material, which may include, for example, an matting material such as black photoresist or a reflective material such as a metal layer. The material of the second light-absorbing layer includes organic dyes, nano-absorbing particles, or inorganic oxides for absorbing blue light, such as zinc oxide nanoparticle photoresist. The materials of the first, second, and third filter layers include organic dyes, nano-absorbing particles, or inorganic oxides.

[0065] Furthermore, before forming the second barrier layer on the transparent substrate, the method may further include: forming a third light-absorbing layer on the transparent substrate, wherein the third light-absorbing layer is used to partially absorb light of a third color emitted by the micro-LED unit, and the material of the third light-absorbing layer includes organic dyes, nano-absorbing particles, or inorganic oxides for absorbing blue light, such as zinc oxide nanoparticle photoresist. Therefore, forming the second barrier layer on the transparent substrate may include forming the second barrier layer on the third light-absorbing layer.

[0066] Furthermore, before setting the reflective layer on the first intermediate structure, the method further includes: setting a fourth light-absorbing layer on the first intermediate structure, wherein the fourth light-absorbing layer is used to partially absorb the third color light emitted by the micro-LED unit, and the material of the fourth light-absorbing layer includes organic dyes, nano-absorbing particles, or inorganic oxides for absorbing blue light, such as zinc oxide nanoparticle photoresist. Therefore, setting the reflective layer on the first intermediate structure can include: setting the reflective layer on the fourth light-absorbing layer.

[0067] According to another embodiment of this disclosure, before the reflective layer is disposed on the transparent substrate, the method further includes: disposing a second partition layer on the transparent substrate, such that the second partition layer includes a third through-hole array, the arrangement of the third through-hole array corresponding to the arrangement of the micro LED unit array, wherein the third through-hole array includes multiple sets of third through-holes, each set of third through-holes including two third through-holes; a second filling step, wherein a second intermediate structure is obtained upon completion of the second filling step, the second filling step including at least one of the following steps: filling a fourth filling portion in one of the third through-holes in each set of third through-holes, the fourth filling portion including a fourth light-filtering layer that allows only a fourth color of light to pass through or a second light-absorbing layer for partially absorbing a third color of light; filling a fifth filling portion in another third through-hole in each set of third through-holes, the fifth filling portion including a third light-filtering layer that allows only a third color of light to pass through or a second light-absorbing layer for partially absorbing a third color of light, wherein the second light-absorbing layer included in the fourth filling portion and the fifth filling portion is made of the same material as the first light-absorbing layer.

[0068] The second filling step further includes: when there are unfilled third through holes in each group of third through holes, filling the unfilled third through holes with transparent material.

[0069] Specifically, a reflective layer is disposed on a transparent substrate, such that the reflective layer includes a first through-hole array, the arrangement of the first through-hole array corresponding to the arrangement of the micro LED unit array, wherein the first through-hole array includes multiple sets of first through-holes: a reflective layer is disposed on the second intermediate structure, and a first through-hole array is formed on the reflective layer, such that the first through-hole array includes multiple sets of first through-holes, each set of first through-holes including a first through-hole aligned with a third through-hole, the first through-holes exposing the second intermediate structure.

[0070] In this embodiment, the fourth color of light refers to the light within the wavelength range corresponding to the fourth color, wherein the fourth color is yellow light and the third color is blue. The material of the second barrier layer includes a visible light shielding material, which may include, for example, an matting material such as black photoresist or a reflective material such as a metal layer. The material of the second light-absorbing layer includes organic dyes, nano-absorbing particles, or inorganic oxides for absorbing blue light, such as zinc oxide nanoparticle photoresist. The material of the fourth filter layer includes organic dyes, nano-absorbing particles, or inorganic oxides.

[0071] Reference Figures 2-13 ,in Figure 4 A side view schematic diagram of a second partition layer 102 disposed on a transparent substrate 101 is shown. Figure 4As shown, the second barrier layer 102 can be, for example, a black photoresist layer. Therefore, a black photoresist layer can be applied to a transparent substrate 101, such as a glass substrate, using spin coating. Then, for example, a second via array 1020 can be formed on the black photoresist layer by photolithography, such that the arrangement of the second via array 1020 corresponds to the arrangement of the micro-LED unit array 201 to be used subsequently, and exposes the transparent substrate 101. The second via array 1020 includes multiple sets of second vias, each set including a first second via 1021, a second second via 1022, and a third second via 1023. For clarity and brevity, Figure 4 Only one set of second through holes is shown in the second through hole array 1020, which includes a first second through hole 1021, a second second through hole 1022, and a third second through hole 1023. Figure 4 The number of groups of second vias and the number of second vias in each group shown are merely illustrative and are not intended to be limiting. A second barrier layer 102, such as a black photoresist layer, can make the screen appear black when the display device is powered off or turned off.

[0072] Reference Figures 2-13 ,in Figure 5 A side view schematic diagram of the filling portion in each group of second through holes is shown. (Combined with...) Figure 4 ,like Figure 5 As shown, a first filling portion is filled in the first second through-hole 1021 of each group of second through-holes. This first filling portion may include a first light-filtering layer 1031 that allows only light of a first color, such as red, to pass through. A second filling portion is filled in the second second through-hole 1022 of each group of second through-holes. This second filling portion may include a second light-filtering layer 1032 that allows only light of a second color, such as green, to pass through. A third filling portion is filled in the third second through-hole 1023 of each group of second through-holes. This third filling portion may include a second light-absorbing layer 1033 for partially absorbing light of a third color, such as blue, resulting in the following... Figure 5 The first intermediate structure 30 is shown. It is worth noting that in other embodiments, when there are unfilled second through holes in each group of second through holes, transparent material can be filled into the unfilled second through holes to support the portion above the corresponding second through holes in subsequent manufacturing processes. The transparent material can be, for example, any suitable material such as transparent resin.

[0073] Reference Figures 2-13 ,in Figure 6 A side view schematic diagram of a fourth light-absorbing layer 104 disposed on the first intermediate structure 30 is shown. Figure 6As shown, a fourth light-absorbing layer 104 is provided on the first intermediate structure 30. The fourth light-absorbing layer 104 is used to partially absorb light of a third color, such as blue, emitted by the micro LED unit, and the fourth light-absorbing layer 104 is made of the same material as the second light-absorbing layer 1033.

[0074] Reference Figures 2-13 ,in Figure 7 A side view schematic diagram of a reflective layer 105 disposed on a fourth light-absorbing layer 104 is shown. Figure 7 As shown, a reflective layer 105, such as a distributed Bragg reflector, is disposed on the fourth light-absorbing layer 104, and a first through-hole array is formed on the reflective layer 105, such that the first through-hole array includes multiple sets of first through-holes, each set of first through-holes including a first through-hole 1051 aligned with a third through-hole 1023, the first through-hole 1051 exposing the fourth light-absorbing layer 104. The reflective layer 105 is used to reflect, for example, blue light emitted by the micro-LED unit. For clarity and brevity, Figure 7 Only one set of first through holes is shown in the first through hole array, which includes a first through hole 1051. Figure 7 The number of groups of first through holes shown and the number of first through holes in each group are only illustrative and are not limited here.

[0075] In step S103, a first partition layer can be provided on the reflective layer, such that the first partition layer includes a second through-hole array, the arrangement of the second through-hole array corresponds to the arrangement of the micro LED unit array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, each set of second through-holes includes at least two second through-holes, the number of first through-holes in each set of first through-holes is less than the number of second through-holes in each set of second through-holes, and the first through-holes in each set of first through-holes correspond to a portion of the second through-holes in the corresponding set of second through-holes.

[0076] According to embodiments of this disclosure, after fabricating the reflective layer, a first barrier layer can be formed on the reflective layer. The first barrier layer can function as a grid, and the interior of the grid can be filled with a suitable material. In some embodiments, the first barrier layer may include a visible light shielding material, such as matting materials like black photoresist or reflective materials like a metal layer.

[0077] According to one embodiment of this disclosure, a first partition layer is disposed on the reflective layer, such that the first partition layer includes a second through-hole array, the arrangement of the second through-hole array corresponding to the arrangement of the micro LED unit array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, each set of second through-holes including at least two second through-holes, the number of first through-holes in each set of first through-holes being less than the number of second through-holes in each set of second through-holes, and the correspondence between the first through-holes in each set of first through-holes and a portion of the second through-holes in the corresponding set of second through-holes may include: disposing a first... A partition layer is provided, and a second through-hole array is formed on the first partition layer such that the second through-hole array is aligned with and above the third through-hole array, and the second through-hole array exposes the reflective layer. The second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of third through-holes. Each set of second through-holes includes a first second through-hole aligned with the first third through-hole, a second second through-hole aligned with the second third through-hole, and a third second through-hole aligned with the third third through-hole. The third second through-hole is aligned with the first through-hole.

[0078] According to another embodiment of this disclosure, a first partition layer is provided on the reflective layer, such that the first partition layer includes a second through-hole array, the arrangement of the second through-hole array corresponding to the arrangement of the micro LED unit array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, each set of second through-holes including at least two second through-holes, the number of first through-holes in each set of first through-holes being less than the number of second through-holes in each set of second through-holes, and the first through-holes in each set of first through-holes corresponding to a portion of the second through-holes in the corresponding set of second through-holes includes: providing a first partition layer on the reflective layer, and opening a second through-hole array on the first partition layer, such that the second through-hole array is aligned with and located above the third through-hole array, and the second through-hole array exposes the reflective layer, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of third through-holes, each set of second through-holes including two second through-holes respectively aligned with two third through-holes, and one of the second through-holes in each set of second through-holes being aligned with a first through-hole.

[0079] Reference Figures 2-13 ,in Figure 8 A side view schematic diagram of a first barrier layer 106 disposed on the reflective layer 105 is shown. Figure 8As shown, the first barrier layer 106 can be, for example, a black photoresist layer. Therefore, a black photoresist layer can be coated on the reflective layer 105 by spin coating. Then, for example, a second via array 1060 can be formed on the black photoresist layer by photolithography, such that the second via array 1060 is aligned with the third via array 1020, and the second via array 1060 exposes a portion of the reflective layer 105 and the first via 1051. The second via array 1060 includes multiple sets of second vias corresponding to multiple sets of third vias. Each set of second vias includes a first second via 1061 aligned with the first third via 1021, a second second via 1062 aligned with the second third via 1022, and a third second via 1063 aligned with the third third via 1023.

[0080] In step S104, a photoluminescent material layer can be filled in the second through hole in each group of second through holes that does not have a corresponding first through hole, and a first light-absorbing layer can be filled in the corresponding first through hole and second through hole to obtain a first color conversion structure, wherein the first light-absorbing layer is used to partially absorb the light emitted by the micro LED unit, and the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer.

[0081] According to embodiments of this disclosure, after obtaining the aforementioned second via array, a photoluminescent material layer and a first light-absorbing layer can be filled into the second via array. The first light-absorbing layer partially absorbs the light emitted by the micro-LED units, so that a portion of the light emitted by the micro-LED units is absorbed after passing through the first light-absorbing layer, and the remaining light is emitted from the micro-LED device. Furthermore, the color of the light emitted by the micro-LED units is different from the color corresponding to the photoluminescent material layer, enabling full-color display of the micro-LED device after the light emitted from the micro-LED units passes through the photoluminescent material layer.

[0082] According to one embodiment of this disclosure, each group of first through holes includes one first through hole, and each group of second through holes includes three second through holes. A photoluminescent material layer is filled in the second through holes in each group that do not correspond to a first through hole, and a first light-absorbing layer is filled in the corresponding first and second through holes. The first light-absorbing layer is used to partially absorb the light emitted by the micro-LED unit, and the color of the light emitted by the micro-LED unit is different from the color corresponding to the photoluminescent material layer. This includes filling two second through holes in each group of second through holes that do not correspond to a first through hole with a first-color photoluminescent material layer and a second-color photoluminescent material layer, respectively, and filling the corresponding first and second through holes with a first light-absorbing layer. The first light-absorbing layer is used to partially absorb a third-color light emitted by the micro-LED unit, and the light corresponding to the first color, the second color, and the third color are combined to obtain white light.

[0083] Further, in each group of second through holes, two second through holes without a corresponding first through hole are respectively filled with a first color photoluminescent material layer and a second color photoluminescent material layer, and in the corresponding first and second through holes, a first light-absorbing layer is filled, wherein the first light-absorbing layer is used to partially absorb the third color light emitted by the micro-LED unit, and the white light is synthesized corresponding to the first color light, the second color light, and the third color light. This includes: filling the first second through hole in each group of second through holes with a first color photoluminescent material layer, filling the second second through hole in each group of second through holes with a second color photoluminescent material layer, and filling the aligned first and third second through holes with a first light-absorbing layer, wherein the first light-absorbing layer is used to partially absorb the third color light emitted by the micro-LED unit, and the white light is synthesized corresponding to the first color light, the second color light, and the third color light.

[0084] In this embodiment, the first color, the second color, and the third color can be three primary colors, for example, the first color is red, the second color is green, and the third color is blue. The materials of the photoluminescent material layer of the first color and the photoluminescent material layer of the second color include at least one of group II-VI quantum dots, group III-V quantum dots, perovskite quantum dots, and carbon quantum dots. The material of the first light-absorbing layer includes organic dyes, nano-absorbing particles, or inorganic oxides for absorbing blue light, such as zinc oxide nanoparticle photoresist.

[0085] According to another embodiment of this disclosure, each group of first through holes includes one first through hole, and each group of second through holes includes two second through holes. A photoluminescent material layer is filled in the second through hole in each group of second through holes that does not correspond to the first through hole, and a first light-absorbing layer is filled in the corresponding first through hole and second through hole. The first light-absorbing layer is used to partially absorb the light emitted by the micro LED unit, and the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer. This includes filling a photoluminescent material layer of a fourth color in the second through hole in each group of second through holes that does not correspond to the first through hole, and filling a first light-absorbing layer in the corresponding first through hole and second through hole. The first light-absorbing layer is used to partially absorb the light of a third color emitted by the micro LED unit, and the light of the fourth color and the light of the third color are combined to obtain white light.

[0086] In this embodiment, the fourth color is yellow light and the third color is blue. The material of the photoluminescent material layer of the fourth color may include at least one of group II-VI quantum dots, group III-V quantum dots, perovskite quantum dots, and carbon quantum dots, and the material of the first light-absorbing layer may include organic dyes, nano-absorbing particles, or inorganic oxides for absorbing blue light, such as zinc oxide nanoparticle photoresist.

[0087] According to an embodiment of this disclosure, after filling a photoluminescent material layer in each group of second through holes without a corresponding first through hole, and filling a first light-absorbing layer in the corresponding first and second through holes, the method further includes: providing an insulating layer on the first barrier layer, the photoluminescent material layer, and the first light-absorbing layer.

[0088] Reference Figures 2-13 ,in Figure 9 A side view schematic diagram of the photoluminescent material layer filling each group of second through-holes is shown. (Combined with...) Figure 8 ,like Figure 9 As shown, the first second through hole 1061 in each group of second through holes is filled with a photoluminescent material layer 1071 of a first color, such as red, and the second second through hole 1062 in each group of second through holes is filled with a photoluminescent material layer 1072 of a second color, such as green.

[0089] Reference Figures 2-13 ,in Figure 10 A side view schematic diagram shows the first light-absorbing layer filled in the aligned first through-hole and third second through-hole. (Combined) Figure 8 and Figure 9 ,like Figure 10As shown, the aligned first through-hole 1051 and third second through-hole 1063 are filled with a first light-absorbing layer 1073 for absorbing, for example, blue light. It is worth noting that the filling order of the first-color photoluminescent material layer 1071, the second-color photoluminescent material layer 1072, and the first light-absorbing layer 1073 is merely exemplary and not limited herein. The filling order of the first-color photoluminescent material layer 1071, the second-color photoluminescent material layer 1072, and the first light-absorbing layer 1073 can be arbitrarily adjusted according to specific processes, equipment, and other actual preparation conditions.

[0090] Reference Figures 2-13 ,in Figure 11 A side view schematic diagram is shown, illustrating an insulating layer disposed on a first barrier layer, a photoluminescent material layer, and a first light-absorbing layer. (See diagram for reference.) Figure 11 As shown, a barrier layer 108, such as a silicon dioxide layer, can be deposited on the first barrier layer 106, the first photoluminescent material layer 1071, the second photoluminescent material layer 1072, and the first light-absorbing layer 1073 using plasma-enhanced chemical vapor deposition (PECVD) to obtain the following: Figure 11 The first color conversion structure 10 is shown. Of course, the insulating layer can also include any other suitable materials, such as any suitable polymeric organic materials and inorganic oxides, and any suitable preparation process can be used to prepare the insulating layer for different materials.

[0091] In step S105, the side of the first color conversion structure opposite to the transparent substrate can be bonded to the light-emitting side of the microLED chip to obtain a microLED device.

[0092] According to embodiments of this disclosure, after obtaining the first color conversion structure, the side of the first color conversion structure opposite to the transparent substrate can be bonded to the light-emitting side of the micro LED chip to obtain a micro LED device.

[0093] Furthermore, each micro-LED unit in the micro-LED unit array includes a first semiconductor layer on the light-emitting side, and bonding the side of the first color conversion structure opposite to the transparent substrate to the light-emitting side of the micro-LED chip includes: bonding the side of the first color conversion structure opposite to the transparent substrate to the first semiconductor layer.

[0094] According to an embodiment of this disclosure, bonding the side of the first color conversion structure opposite to the transparent substrate to the first semiconductor layer includes: bonding the insulating layer of the first color conversion structure to the first semiconductor layer.

[0095] According to an embodiment of this disclosure, after bonding the side of the first color conversion structure opposite to the transparent substrate to the light-emitting side of the microLED chip, the method includes: removing the transparent substrate of the first color conversion structure to obtain a second color conversion structure from the first color conversion structure.

[0096] According to embodiments of this disclosure, the micro LED chip structure further includes a driver chip, with one side of the micro LED chip opposite to the light-emitting side disposed on the driver chip. Alternatively, the micro LED chip structure further includes a driver chip and a flexible circuit board, with one side of the micro LED chip opposite to the light-emitting side disposed on the driver chip to form a micro LED module, and the micro LED module disposed on the flexible circuit board via the driver chip.

[0097] Reference Figures 2-13 ,in Figure 12 A side view showing the bonding of a first color conversion structure 10 to a microLED chip 20 according to an embodiment of the present disclosure is shown. Figure 12 As shown, the insulating layer 108 of the first color conversion structure 10 is bonded to the first semiconductor layer 20111 of the micro-LED chip 20, resulting in the following: Figure 12 The structure shown.

[0098] Reference Figures 2-13 ,in Figure 13 A side view of a micro LED device 1 according to an embodiment of the present disclosure is shown. Figure 13 As shown, remove Figure 12 The transparent substrate 101 of the first color conversion structure 10 in the structure shown obtains the second color conversion structure 11 through the first color conversion structure 10, resulting in the following... Figure 13 The micro LED device 1 shown.

[0099] Reference Figures 2 to 13It should be understood that the third color light emitted by the micro-LED unit 2011, such as blue light, excites the first color photoluminescent material layer 1071, such as red light, to emit red light. The third color light emitted by the micro-LED unit 2011, such as blue light, excites the second color photoluminescent material layer 1072, such as green light, to emit green light. The third color light emitted by the micro-LED unit, such as blue light, is partially absorbed after passing through the first light-absorbing layer 1073, but some blue light still passes through the first light-absorbing layer 1073. The first color light, such as red light, the second color light, such as green light, and the third color light, such as blue light, emitted after passing through the photoluminescent material layer and the first light-absorbing layer 1073 can be combined to obtain white light. Therefore, by setting a first light-absorbing layer that partially absorbs, for example, blue light emitted by the micro-LED unit, the blue light overflow caused by the direct emission of blue light from the micro-LED device can be reduced. This reduces color deviation and poor color purity caused by blue light overflow, thereby improving the uniformity of different colors of light emitted from the micro-LED device, enhancing the color purity of the micro-LED, and ultimately improving the display effect of the micro-LED device.

[0100] Furthermore, since the reflective layer 105 covers the photoluminescent material layer, when a portion of the light emitted by the micro-LED unit 2011 leaks out without participating in the excitation of the photoluminescent material layer, the reflective layer 105 can reflect a portion of the blue light leaking from the first color photoluminescent material layer 1071 (e.g., red) back to the red photoluminescent material layer to re-excite the red photoluminescent material layer. The reflective layer 105 can also reflect a portion of the blue light leaking from the second color photoluminescent material layer 1072 (e.g., green) back to the green photoluminescent material layer to re-excite the green photoluminescent material layer. This increases the amount of light participating in the excitation of the photoluminescent material layer, thereby increasing the light output of the color corresponding to the photoluminescent material layer, thus improving the brightness of the micro-LED. It also reduces the mixing output of the leaked light with the different colors emitted by the excitation of the photoluminescent material layer, thereby improving the color purity of the micro-LED and ultimately enhancing the display effect of the micro-LED device.

[0101] Furthermore, since the third through-hole 1023 is aligned with the third second through-hole 1063 and the first through-hole 1051, and the third through-hole 1023 is filled with the second light-absorbing layer 1033, the second light-absorbing layer 1033 can form an integral part with the first light-absorbing layer 1073 to further enhance the absorption of the third color light emitted by the micro LED unit 2011, such as blue light, thereby further reducing the blue light overflow caused by the light emitted by the micro LED unit directly from the micro LED device, thus further improving the display effect of the micro LED device.

[0102] Furthermore, regarding the third light-absorbing layer, on one hand, the third light-absorbing layer can further enhance the absorption of light of a third color, such as blue light, emitted by the micro-LED unit 2011, thereby further reducing the blue light overflow caused by the direct emission of light of a third color, such as blue light, from the micro-LED device, thus further improving the display effect of the micro-LED device. On the other hand, as described above, the reflective layer 105 is used to reflect light of a third color, such as blue light, leaking from the photoluminescent material layer. The third light-absorbing layer can absorb light of a third color, such as blue light, leaking from the reflective layer 105, thereby preventing the leaked light of a third color, such as blue light, from mixing with the first color light, such as red light, and the second color light, such as green light, obtained by excitation, resulting in insufficient color purity and low saturation, thus further improving the display effect of the micro-LED device.

[0103] Furthermore, regarding the fourth light-absorbing layer 104, on one hand, the fourth light-absorbing layer 104 can further enhance the absorption of light of a third color, such as blue light, emitted by the micro-LED unit 2011, thereby further reducing the blue light overflow caused by the direct emission of light of a third color, such as blue light, emitted by the micro-LED unit 2011 from the micro-LED device, thus further improving the display effect of the micro-LED device. On the other hand, as described above, the reflective layer 105 is used to reflect light of a third color, such as blue light, leaking from the photoluminescent material layer. The fourth light-absorbing layer 104 can absorb light of a third color, such as blue light, leaking from the reflective layer 105, thereby preventing insufficient color purity caused by the leakage of light of a third color, such as blue light, mixed with the first color light, such as red light, and the second color light, such as green light, obtained by excitation, thereby further improving the display effect of the micro-LED device.

[0104] It is worth noting that when the first third through-hole 1021 is filled with the first filter layer 1031, the second third through-hole 1022 is filled with the second filter layer 1032, and the third third through-hole is filled with the third filter layer, the first filter layer 1031 only allows light of a first color, such as red, to pass through, and reflects light of a third color, such as blue, towards the photoluminescent material layer 1071 of the first color, such as red. The second filter layer 1032 only allows light of a second color, such as green, to pass through, and reflects light of a third color, such as blue, towards the photoluminescent material layer 1072 of the second color, such as green. The third filter layer 1031 only allows light of a third color, such as blue, to pass through, and reflects light of other colors towards the first light-absorbing layer 1073. Therefore, the function of the first filter layer 1031, the second filter layer 1032 and the third filter layer is to reflect light other than the corresponding color light, which is different from the function of the first light-absorbing layer, the second light-absorbing layer, the third light-absorbing layer and the fourth light-absorbing layer to absorb light.

[0105] This disclosure also provides a miniature LED device.

[0106] like Figures 2-13As shown, the micro-LED device 1 includes a second color conversion structure 11 and a micro-LED chip structure. The micro-LED chip structure includes a micro-LED chip 20, which includes a micro-LED unit array 201 composed of multiple micro-LED units 2011. The second color conversion structure 11 includes: a first partition layer 106, which includes a second through-hole array 1060, the arrangement of which corresponds to the arrangement of the micro-LED unit array 201, wherein the second through-hole array 1060 includes multiple sets of second through-holes, each set including at least two second through-holes; and a reflective layer 105 disposed on the first partition layer 106, which includes a first through-hole array, wherein the first through-hole array includes multiple sets of first through-holes corresponding to the multiple sets of second through-holes, each set including at least two second through-holes. The number of first through holes in the hole is less than the number of second through holes in each group of second through holes, and the first through holes in each group of first through holes correspond to a portion of the second through holes in the corresponding group of second through holes. The reflective layer 105 is used to reflect the light emitted by the micro LED unit 2011. The photoluminescent material layer and the first light-absorbing layer 1073 are used to partially absorb the light emitted by the micro LED unit 2011, and the color of the light emitted by the micro LED unit 2011 is different from the color corresponding to the photoluminescent material layer. The first barrier layer 106, the photoluminescent material layer and the first light-absorbing layer 1073 of the second color conversion structure 11 are disposed on the light-emitting side of the micro LED chip 20.

[0107] According to embodiments of this disclosure, each group of first through holes includes a first through hole 1051, and each group of second through holes includes a first second through hole 1061, a second second through hole 1062, and a third second through hole 1063. The third second through hole 1063 is aligned with the first through hole 1051. The photoluminescent material layer includes a first-color photoluminescent material layer 1071 and a second-color photoluminescent material layer 1072. The first-color photoluminescent material layer 1071 fills the first second through hole 1061 in each group of second through holes, and the second-color photoluminescent material layer 1072 fills the second second through hole 1062 in each group of second through holes. The first light-absorbing layer 1073 fills the aligned third second through hole 1063 and the first through hole 1051. The first light-absorbing layer 1073 is used to partially absorb the third-color light emitted by the micro LED unit 2011. The light corresponding to the first color, the light corresponding to the second color, and the third color are combined to obtain white light.

[0108] According to an embodiment of this disclosure, the second color conversion structure 11 further includes a second barrier layer 102, which is disposed on the reflective layer 105 and includes a third through-hole array 1020. The third through-hole array 1020 is aligned with and located above the second through-hole array 1060. The third through-hole array 1020 includes multiple sets of third through-holes corresponding to the multiple sets of second through-holes. Each set of third through-holes includes a first third through-hole 1021 aligned with the first second through-hole 1061, a second third through-hole 1022 aligned with the second second through-hole 1062, and a third third through-hole 1023 aligned with the third second through-hole 1063. The second color conversion structure 11 further includes a first filler. The first filling part is filled in the first third through-hole of each group of third through-holes, and the first filling part includes a first light-filtering layer 1031 that allows only light of a first color to pass through or a second light-absorbing layer that partially absorbs light of a third color; the second filling part is filled in the second third through-hole of each group of third through-holes, and the second filling part includes a second light-filtering layer 1032 that allows only light of a second color to pass through or a second light-absorbing layer that partially absorbs light of a third color; the third filling part is filled in the third third through-hole of each group of third through-holes, and the third filling part includes a third light-filtering layer that allows only light of a third color to pass through or a second light-absorbing layer 1033 that partially absorbs light of a third color. The second light-absorbing layer included in the first filling part, the second filling part, and the third filling part is made of the same material as the first light-absorbing layer.

[0109] According to an embodiment of this disclosure, when there are unfilled third through holes in each group of third through holes, the second color conversion structure 11 further includes a transparent material that fills the unfilled third through holes.

[0110] According to embodiments of this disclosure, the first color is red, the second color is green, and the third color is blue.

[0111] According to embodiments of this disclosure, each group of first through holes includes one first through hole, each group of second through holes includes two second through holes, one of the second through holes in each group is aligned with the first through hole, the photoluminescent material layer includes a fourth color photoluminescent material layer, the fourth color photoluminescent material layer fills the second through holes not aligned with the first through hole, and the first light-absorbing layer fills the aligned second through holes and the first through hole, wherein the first light-absorbing layer is used to partially absorb the third color light emitted by the micro LED unit, and the fourth color light and the third color light are combined to obtain white light.

[0112] According to embodiments of this disclosure, the second color conversion structure further includes a second barrier layer disposed on the reflective layer and including a third through-hole array. The third through-hole array is aligned with and located above the second through-hole array. The third through-hole array includes multiple sets of third through-holes corresponding to the plurality of sets of second through-holes, each set of third through-holes including two third through-holes. The second color conversion structure further includes at least one of a fourth filling portion and a fifth filling portion. The fourth filling portion fills the third through-hole above the second through-hole filled with a photoluminescent material layer of a fourth color. The fourth filling portion includes a fourth filter layer that allows only the fourth color of light to pass through or a second light-absorbing layer for partially absorbing the third color of light. The fifth filling portion fills the third through-hole above the first through-hole filled with a first light-absorbing layer. The fifth filling portion includes a third filter layer that allows only the third color of light to pass through or a second light-absorbing layer for partially absorbing the third color of light. The second light-absorbing layer included in the fourth and fifth filling portions is made of the same material as the first light-absorbing layer.

[0113] According to an embodiment of this disclosure, when there are unfilled third through holes in each group of third through holes, the color conversion structure further includes a transparent material that fills the unfilled third through holes.

[0114] According to an embodiment of this disclosure, the fourth color is yellow and the third color is blue.

[0115] According to an embodiment of the present disclosure, each micro-LED unit 2011 in the micro-LED unit array 201 includes a first semiconductor layer 20111 on the light-emitting side, and the first barrier layer 106, the photoluminescent material layer and the first light-absorbing layer 1073 of the second color conversion structure 11 are disposed on the first semiconductor layer 20111.

[0116] According to an embodiment of this disclosure, the second color conversion structure 11 further includes an insulating layer 108, which is disposed on the first barrier layer 106, the photoluminescent material layer, and the first light-absorbing layer 1073, and on the first semiconductor layer 20111. The second color conversion structure 11 is disposed on the first semiconductor layer 20111 through the insulating layer 108.

[0117] According to an embodiment of this disclosure, the second color conversion structure further includes a third light-absorbing layer disposed on the second barrier layer, wherein the third light-absorbing layer is used to partially absorb the light emitted by the micro LED unit, and the third light-absorbing layer is made of the same material as the first light-absorbing layer.

[0118] According to an embodiment of this disclosure, the second color conversion structure 11 further includes a fourth light-absorbing layer 104 disposed on the reflective layer 105, and the second barrier layer 102 disposed on the fourth light-absorbing layer 104, wherein the fourth light-absorbing layer 104 is used to partially absorb the light emitted by the micro LED unit 2011, and the fourth light-absorbing layer 104 is made of the same material as the first light-absorbing layer 1073.

[0119] According to embodiments of this disclosure, the micro LED chip structure 11 further includes a driver chip, and the side of the micro LED chip 20 opposite to the light-emitting side is disposed on the driver chip. Alternatively, the micro LED chip structure further includes a driver chip and a flexible circuit board, and the side of the micro LED chip 20 opposite to the light-emitting side is disposed on the driver chip to form a micro LED module. The micro LED module is disposed on the flexible circuit board through the driver chip.

[0120] According to embodiments of this disclosure, the materials of the first barrier layer 106 and the second barrier layer 102 include visible light shielding materials; the materials of the first color photoluminescent material layer 1071 and the second color photoluminescent material layer 1072 include at least one of group II-VI quantum dots, group III-V quantum dots, perovskite quantum dots, and carbon quantum dots; the materials of the first light-absorbing layer 1073 and the second light-absorbing layer 1033 include organic dyes, nano-absorbing particles, or inorganic oxides for absorbing blue light; the materials of the first light-filtering layer 1031, the second light-filtering layer 1032, and the third light-filtering layer include organic dyes, nano-absorbing particles, or inorganic oxides; and the reflective layer 105 includes a distributed Bragg reflector film.

[0121] It is worth noting that any relevant descriptions of the micro-LED device in the above-mentioned micro-LED device fabrication method (including but not limited to technical features and their functions, explanations, etc.) can be applied to the micro-LED device disclosed herein.

[0122] According to embodiments of this disclosure, the pixel size in a micro-LED device is typically less than 50 micrometers.

[0123] This disclosure also provides a display device including the aforementioned LED device. This display device can be applied to flexible electronic devices to realize technologies such as Augmented Reality (AR), Virtual Reality (VR), Extended Reality (XR), and Mixed Reality (MR). For example, the micro-LED device can be a projection part of an electronic device, such as a projector or head-up display (HUD); or, for example, the micro-LED device can be a display part of an electronic device, such as a smartphone, smartwatch, laptop, tablet, dashcam, navigator, head-mounted device, or any device with a display screen.

[0124] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0125] It should be understood that the phrase "one embodiment" or "an embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of this application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. It should be understood that in the various embodiments of this application, the sequence numbers of the above steps / processes do not imply a sequential order of execution; the execution order of each step / process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application. Moreover, the above embodiment numbers are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0126] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0127] The above description is merely a preferred embodiment of this disclosure and is not intended to limit this disclosure. Various modifications and variations can be made to this disclosure by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.

Claims

1. A method for fabricating a micro LED device, wherein, The method includes: A transparent substrate and a micro LED chip structure are obtained, wherein the micro LED chip structure includes a micro LED chip, and the micro LED chip includes a micro LED unit array composed of multiple micro LED units; A reflective layer is disposed on a transparent substrate, such that the reflective layer includes a first through-hole array, the arrangement of the first through-hole array corresponding to the arrangement of the micro LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, and the reflective layer is used to reflect the light emitted by the micro LED unit; A first partition layer is provided on the reflective layer, such that the first partition layer includes a second through-hole array, the arrangement of the second through-hole array corresponds to the arrangement of the micro LED unit array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, each set of second through-holes includes at least two second through-holes, the number of first through-holes in each set of first through-holes is less than the number of second through-holes in each set of second through-holes, and the first through-holes in each set of first through-holes correspond to a portion of the second through-holes in the corresponding set of second through-holes; A photoluminescent material layer is filled in the second through hole in each group of second through holes that does not correspond to the first through hole, and a first light-absorbing layer is filled in the corresponding first through hole and second through hole to obtain a first color conversion structure, wherein the first light-absorbing layer is used to partially absorb the light emitted by the micro LED unit, and the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer. The side of the first color conversion structure opposite to the transparent substrate is bonded to the light-emitting side of the micro-LED chip to obtain a micro-LED device.

2. The method for fabricating a micro LED device according to claim 1, wherein, Each group of first through-holes includes one first through-hole, and each group of second through-holes includes three second through-holes. A photoluminescent material layer is filled in the second through-holes in each group that do not have a corresponding first through-hole, and a first light-absorbing layer is filled in the corresponding first and second through-holes. The first light-absorbing layer is used to partially absorb the light emitted by the micro-LED unit, and the color of the light emitted by the micro-LED unit is different from the color corresponding to the photoluminescent material layer, including: In each group of second through holes, two second through holes without a corresponding first through hole are filled with a first color photoluminescent material layer and a second color photoluminescent material layer, respectively. In the corresponding first through hole and second through hole, a first light-absorbing layer is filled. The first light-absorbing layer is used to partially absorb the third color light emitted by the micro LED unit. The light corresponding to the first color, the light corresponding to the second color, and the third color light are combined to obtain white light.

3. The method for fabricating a micro LED device according to claim 2, wherein, Before depositing the reflective layer on the transparent substrate, the method further includes: A second partition layer is provided on a transparent substrate, such that the second partition layer includes a third through-hole array, the arrangement of the third through-hole array corresponds to the arrangement of the micro LED unit array, wherein the third through-hole array includes multiple sets of third through-holes, each set of third through-holes including a first third through-hole, a second third through-hole and a third third through-hole; A first filling step, upon completion of the first filling step, yields a first intermediate structure, wherein the first filling step includes at least one of the following steps: A first filling portion is filled in the first third through hole in each group of third through holes. The first filling portion includes a first filter layer that allows only light of the first color to pass through or a second light-absorbing layer for partially absorbing light of the third color. A second filling portion is filled in the second third through hole in each group of third through holes. The second filling portion includes a second filter layer that allows only the second color of light to pass through or a second light-absorbing layer for partially absorbing the third color of light. A third filler portion is filled in the third through-hole of each group of third through-holes. The third filler portion includes a third filter layer that allows only light of a third color to pass through. The second light-absorbing layer included in the first filling portion and the second filling portion is made of the same material as the first light-absorbing layer.

4. The method for fabricating a micro LED device according to claim 3, wherein, The first filling step further includes: When there are unfilled third through holes in each group, fill the unfilled third through holes with transparent material.

5. The method for fabricating a micro LED device according to claim 3, wherein, A reflective layer is disposed on a transparent substrate, such that the reflective layer includes a first through-hole array, the arrangement of the first through-hole array corresponding to the arrangement of the micro-LED unit array, wherein the first through-hole array includes multiple sets of first through-holes including: A reflective layer is disposed on the first intermediate structure, and a first through-hole array is formed on the reflective layer, such that the first through-hole array includes multiple sets of first through-holes, each set of first through-holes including a first through-hole aligned with the third through-hole, and the first through-holes expose the first intermediate structure. A first partition layer is disposed on the reflective layer, such that the first partition layer includes a second through-hole array, the arrangement of the second through-hole array corresponding to the arrangement of the micro LED unit array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, each set of second through-holes including at least two second through-holes, the number of first through-holes in each set of first through-holes being less than the number of second through-holes in each set of second through-holes, and the first through-holes in each set of first through-holes corresponding to a portion of the second through-holes in the corresponding set of second through-holes including: A first partition layer is disposed on the reflective layer, and a second through-hole array is formed on the first partition layer, such that the second through-hole array is aligned with and above the third through-hole array, and the second through-hole array exposes the reflective layer. The second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of third through-holes. Each set of second through-holes includes a first second through-hole aligned with the first third through-hole, a second second through-hole aligned with the second third through-hole, and a third second through-hole aligned with the third third through-hole. The third second through-hole is aligned with the first through-hole. A first color photoluminescent material layer and a second color photoluminescent material layer are respectively filled into the two second through-holes in each set that do not correspond to the first through-hole. A first light-absorbing layer is filled into the corresponding first and second through-holes. The first light-absorbing layer is used to partially absorb the third color light emitted by the micro-LED unit. The synthesis of white light corresponding to the first color light, the second color light, and the third color light includes: A first-color photoluminescent material layer is filled in the first second through hole in each group of second through holes, a second-color photoluminescent material layer is filled in the second second through hole in each group of second through holes, and a first light-absorbing layer is filled in the aligned first and third through holes, wherein the first light-absorbing layer is used to partially absorb the third-color light emitted by the micro LED unit, and the light corresponding to the first color, the light corresponding to the second color, and the third color are combined to obtain white light.

6. The method for fabricating a micro LED device according to claim 1, wherein, Each group of first through-holes includes one first through-hole, and each group of second through-holes includes two second through-holes. A photoluminescent material layer is filled in the second through-holes in each group that do not have a corresponding first through-hole, and a first light-absorbing layer is filled in the corresponding first and second through-holes. The first light-absorbing layer is used to partially absorb the light emitted by the micro-LED unit, and the color of the light emitted by the micro-LED unit is different from the color corresponding to the photoluminescent material layer, including: A fourth color photoluminescent material layer is filled in the second through hole in each group of second through holes without a corresponding first through hole, and a first light-absorbing layer is filled in the corresponding first through hole and second through hole, wherein the first light-absorbing layer is used to partially absorb the third color light emitted by the micro LED unit, and the fourth color light and the third color light are combined to obtain white light.

7. The method for fabricating a micro LED device according to claim 6, wherein, Before depositing the reflective layer on the transparent substrate, the method further includes: A second partition layer is provided on the transparent substrate, such that the second partition layer includes a third through-hole array, the arrangement of the third through-hole array corresponds to the arrangement of the micro LED unit array, wherein the third through-hole array includes multiple sets of third through-holes, and each set of third through-holes includes two third through-holes. A second filling step, upon completion of the second filling step, yields a second intermediate structure, wherein the second filling step includes at least one of the following steps: A fourth filling portion is filled in one of the third through holes in each group, the fourth filling portion comprising a fourth filter layer that allows only the fourth color of light to pass through; A fifth filler portion is filled in another third through hole in each group of third through holes. The fifth filler portion includes a third filter layer that allows only light of the third color to pass through.

8. The method for fabricating a micro LED device according to claim 7, wherein, The second filling step further includes: When there are unfilled third through holes in each group, fill the unfilled third through holes with transparent material.

9. The method for fabricating a micro LED device according to claim 7, wherein, A reflective layer is disposed on a transparent substrate, such that the reflective layer includes a first through-hole array, the arrangement of the first through-hole array corresponding to the arrangement of the micro-LED unit array, wherein the first through-hole array includes multiple sets of first through-holes including: A reflective layer is disposed on the second intermediate structure, and a first through-hole array is formed on the reflective layer, such that the first through-hole array includes multiple sets of first through-holes, each set of first through-holes including a first through-hole aligned with a third through-hole, the first through-holes exposing the second intermediate structure. A first partition layer is disposed on the reflective layer, such that the first partition layer includes a second through-hole array, the arrangement of the second through-hole array corresponding to the arrangement of the micro LED unit array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, each set of second through-holes including at least two second through-holes, the number of first through-holes in each set of first through-holes being less than the number of second through-holes in each set of second through-holes, and the first through-holes in each set of first through-holes corresponding to a portion of the second through-holes in the corresponding set of second through-holes including: A first partition layer is provided on the reflective layer, and a second through-hole array is formed on the first partition layer, such that the second through-hole array is aligned with the third through-hole array and is located above the third through-hole array, and the second through-hole array exposes the reflective layer, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of third through-holes, each set of second through-holes includes two second through-holes respectively aligned with two third through-holes, and one of the second through-holes in each set of second through-holes is aligned with a first through-hole.

10. The method for fabricating a micro LED device according to claim 1, wherein, Each microLED unit in the microLED unit array includes a first semiconductor layer on the light-emitting side. Bonding the side of the first color conversion structure opposite to the transparent substrate to the light-emitting side of the microLED chip includes: bonding the side of the first color conversion structure opposite to the transparent substrate to the first semiconductor layer.

11. The method for fabricating a micro LED device according to claim 10, wherein, After filling the second through-holes in each group of second through-holes without corresponding first through-holes with a photoluminescent material layer, and filling the corresponding first and second through-holes with a first light-absorbing layer, the method further includes: providing an insulating layer on the first barrier layer, the photoluminescent material layer, and the first light-absorbing layer. Bonding the side of the first color conversion structure opposite to the transparent substrate to the first semiconductor layer includes: bonding the isolation layer of the first color conversion structure to the first semiconductor layer.

12. The method for fabricating a micro LED device according to claim 1, wherein, After bonding the side of the first color conversion structure opposite to the transparent substrate to the light-emitting side of the microLED chip, the method includes: Remove the transparent substrate of the first color conversion structure to obtain the second color conversion structure.

13. The method for fabricating a micro LED device according to claim 3, wherein, Before depositing the second barrier layer on the transparent substrate, the method further includes: depositing a third light-absorbing layer on the transparent substrate, wherein the third light-absorbing layer is used to partially absorb light of a third color emitted by the micro-LED unit, and the third light-absorbing layer is made of the same material as the first light-absorbing layer. Depositing a second barrier layer on a transparent substrate includes: depositing a second barrier layer on the third light-absorbing layer.

14. The method for fabricating a micro LED device according to claim 5, wherein, Before depositing the reflective layer on the first intermediate structure, the method further includes: depositing a fourth light-absorbing layer on the first intermediate structure, wherein the fourth light-absorbing layer is used to partially absorb the third color light emitted by the micro-LED unit, and the fourth light-absorbing layer is made of the same material as the first light-absorbing layer. The process of setting a reflective layer on the first intermediate structure includes setting a reflective layer on the fourth light-absorbing layer.

15. A miniature LED device, wherein, The micro-LED device includes a second color conversion structure and a micro-LED chip structure. The micro-LED chip structure includes a micro-LED chip, and the micro-LED chip includes a micro-LED unit array composed of multiple micro-LED units. The second color conversion structure includes: A first partition layer, the first partition layer includes a second through-hole array, the arrangement of the second through-hole array corresponds to the arrangement of the micro LED unit array, wherein the second through-hole array includes multiple sets of second through-holes, each set of second through-holes includes at least two second through-holes; A reflective layer is disposed on the first partition layer. The reflective layer includes a first through-hole array, wherein the first through-hole array includes multiple sets of first through-holes corresponding to the multiple sets of second through-holes. The number of first through-holes in each set of first through-holes is less than the number of second through-holes in each set of second through-holes, and the first through-holes in each set of first through-holes correspond to a portion of the second through-holes in the corresponding set of second through-holes. The reflective layer is used to reflect the light emitted by the micro LED unit. The system comprises a photoluminescent material layer and a first light-absorbing layer. The photoluminescent material layer fills the second through-holes in each group of second through-holes that do not have a corresponding first through-hole. The first light-absorbing layer fills the corresponding first and second through-holes. The first light-absorbing layer is used to partially absorb the light emitted by the micro-LED unit, and the color of the light emitted by the micro-LED unit is different from the color corresponding to the photoluminescent material layer. The first barrier layer, the photoluminescent material layer, and the first light-absorbing layer of the second color conversion structure are disposed on the light-emitting side of the micro LED chip.

16. The micro LED device according to claim 15, wherein, Each group of first through holes includes one first through hole, and each group of second through holes includes a first second through hole, a second second through hole, and a third second through hole. The third second through hole is aligned with the first through hole. The photoluminescent material layer includes a first color photoluminescent material layer and a second color photoluminescent material layer. The first color photoluminescent material layer fills the first second through hole in each group of second through holes, and the second color photoluminescent material layer fills the second second through hole in each group of second through holes. The first light-absorbing layer fills the aligned third second through hole and the first through hole. The first light-absorbing layer is used to partially absorb the third color light emitted by the micro LED unit. The light corresponding to the first color, the light corresponding to the second color, and the third color light are combined to obtain white light.

17. The micro LED device according to claim 16, wherein, The second color conversion structure further includes a second barrier layer disposed on the reflective layer and including a third through-hole array. The third through-hole array is aligned with and located above the second through-hole array. The third through-hole array includes multiple sets of third through-holes corresponding to the plurality of sets of second through-holes. Each set of third through-holes includes a first third through-hole aligned with the first second through-hole, a second third through-hole aligned with the second second through-hole, and a third third through-hole aligned with the third second through-hole. The second color conversion structure further includes at least one of a first filling portion, a second filling portion, and a third filling portion, wherein: The first filling portion fills the first third through hole in each group of third through holes. The first filling portion includes a first filter layer that allows only light of the first color to pass through or a second light-absorbing layer for partially absorbing light of the third color. The second filling portion fills the second third through hole in each group of third through holes. The second filling portion includes a second filter layer that allows only the second color of light to pass through or a second light-absorbing layer for partially absorbing the third color of light. The third filling portion fills the third third through hole in each group of third through holes. The third filling portion includes a third filter layer that allows only light of the third color to pass through. The second light-absorbing layer included in the first filling portion and the second filling portion is made of the same material as the first light-absorbing layer.

18. The micro LED device according to claim 17, wherein, When there are unfilled third through holes in each group of third through holes, the second color conversion structure also includes a transparent material that fills the unfilled third through holes.

19. The micro LED device according to claim 17, wherein, The first color is red, the second color is green, and the third color is blue.

20. The micro LED device according to claim 15, wherein, Each group of first through holes includes one first through hole, each group of second through holes includes two second through holes, one of the second through holes in each group is aligned with the first through hole, the photoluminescent material layer includes a fourth color photoluminescent material layer, the fourth color photoluminescent material layer fills the second through holes not aligned with the first through hole, and the first light-absorbing layer fills the aligned second through holes and the first through hole, wherein the first light-absorbing layer is used to partially absorb the third color light emitted by the micro LED unit, and the fourth color light and the third color light are combined to obtain white light.

21. The micro LED device according to claim 20, wherein, The second color conversion structure further includes a second barrier layer disposed on the reflective layer and including a third through-hole array. The third through-hole array is aligned with and located above the second through-hole array. The third through-hole array includes multiple sets of third through-holes corresponding to the plurality of sets of second through-holes, each set of third through-holes including two third through-holes. The second color conversion structure further includes at least one of a fourth filling portion and a fifth filling portion, wherein: The fourth filling portion is filled in the third through hole above the second through hole filled with the photoluminescent material layer of the fourth color, and the fourth filling portion includes a fourth filter layer that allows only the fourth color of light to pass through. The fifth filling portion fills the third through hole above the first through hole filled with the first light-absorbing layer, and the fifth filling portion includes a third filter layer that allows only light of the third color to pass through.

22. The micro LED device according to claim 21, wherein, When there are unfilled third through holes in each group of third through holes, the color conversion structure also includes a transparent material that fills the unfilled third through holes.

23. The micro LED device according to claim 21, wherein, The fourth color is yellow and the third color is blue.

24. The micro LED device according to claim 15, wherein, Each microLED unit in the microLED unit array includes a first semiconductor layer on the light-emitting side, and a first barrier layer, a photoluminescent material layer, and a first light-absorbing layer of the second color conversion structure are disposed on the first semiconductor layer.

25. The micro LED device according to claim 24, wherein, The second color conversion structure further includes an isolation layer disposed on the first barrier layer, the photoluminescent material layer and the first light-absorbing layer, and the isolation layer disposed on the first semiconductor layer.

26. The micro LED device according to claim 17, wherein, The second color conversion structure further includes a third light-absorbing layer disposed on the second barrier layer, wherein the third light-absorbing layer is used to partially absorb the light emitted by the micro LED unit, and the third light-absorbing layer is made of the same material as the first light-absorbing layer.

27. The micro LED device according to claim 17, wherein, The second color conversion structure further includes a fourth light-absorbing layer disposed on the reflective layer, and the second barrier layer disposed on the fourth light-absorbing layer, wherein the fourth light-absorbing layer is used to partially absorb the light emitted by the micro LED unit, and the fourth light-absorbing layer is made of the same material as the first light-absorbing layer.

28. The micro LED device according to claim 15, wherein, The micro LED chip structure also includes a driver chip, with one side of the micro LED chip opposite to the light-emitting side disposed on the driver chip. Alternatively, the micro LED chip structure may further include a driver chip and a flexible circuit board. The side of the micro LED chip opposite to the light-emitting side is disposed on the driver chip to form a micro LED module, and the micro LED module is disposed on the flexible circuit board through the driver chip.

29. The micro LED device according to claim 17, wherein, The materials of the first barrier layer and the second barrier layer include visible light shielding materials; the materials of the first color photoluminescent material layer and the second color photoluminescent material layer include at least one of group II-VI quantum dots, group III-V quantum dots, perovskite quantum dots, and carbon quantum dots; the materials of the first light-absorbing layer and the second light-absorbing layer include organic dyes, nano-absorbing particles, or inorganic oxides for absorbing blue light; the materials of the first filter layer, the second filter layer, and the third filter layer include organic dyes, nano-absorbing particles, or inorganic oxides; and the reflective layer includes a distributed Bragg reflector film.

30. A display device, wherein, The display device includes the micro LED device according to any one of claims 15 to 29.

Images