Micro-led device preparation method, micro-led device and display device

Abstract

The present disclosure provides a micro-LED device preparation method, a micro-LED device and a display device. The method comprises: disposing a first partition layer on a transparent substrate, so that the first partition layer comprises a plurality of groups of first through holes, each group of first through holes comprising at least two first through holes; disposing a first reflective layer on the first partition layer, so that the first reflective layer comprises a plurality of groups of second through holes, and a second through hole in each group of second through holes corresponds to part of the first through holes in the corresponding group of first through holes; filling a third filter layer in the corresponding first through hole and the second through hole; disposing a second partition layer on the first reflective layer, so that the second partition layer comprises a plurality of groups of third through holes, and a second through hole in each group of second through holes corresponds to part of the third through holes in the corresponding group of third through holes; filling a photo-luminescent material layer and a first light-absorbing layer in each group of third through holes to obtain a first color conversion structure; and bonding the first color conversion structure with a light-emitting side of a micro-LED chip to obtain a micro-LED device.

Description

Technical Field

[0001] This disclosure relates to the technical field of semiconductor Micro LED, and more specifically, to a method for fabricating a micro LED device, a micro LED device, and a display device. Background Technology

[0002] Micro-LED is a comprehensive technology that integrates novel display technology with light-emitting diode (LED) technology. It boasts advantages such as small size, high brightness, high resolution, and low power consumption, and is considered one of the most promising next-generation display and light-emitting devices. Currently, full-color Micro-LED displays can be achieved in various ways, one of which is color conversion. However, full-color Micro-LED devices achieved through color conversion still suffer from unsatisfactory display effects. Summary of the Invention

[0003] The present disclosure provides a method for fabricating a micro LED device, a micro LED device, and a display device.

[0004] According to one aspect of the present disclosure, a method for fabricating a micro-LED device is provided, wherein the method includes: obtaining a transparent substrate and a micro-LED chip structure, wherein the micro-LED chip structure includes a micro-LED chip, the micro-LED chip including a micro-LED unit array composed of a plurality of micro-LED units; disposing a first partition layer on the transparent substrate, such that the first partition layer includes a first via array, the arrangement of the first via array corresponding to the arrangement of the micro-LED unit array, wherein the first via array includes multiple sets of first vias, each set of first vias including at least two first vias; disposing a first reflective layer on the first partition layer, such that the first reflective layer includes a second via array, wherein the second via array includes multiple sets of second vias corresponding to the multiple sets of first vias, the number of second vias in each set of second vias being less than the number of first vias in the corresponding set of first vias, and the second vias in each set of second vias corresponding to a portion of the first vias in the corresponding set of first vias, the first reflective layer being used to reflect light emitted by the micro-LED units; filling the corresponding first vias and second vias with a third filter layer, the third filter layer only allowing light emitted by the micro-LED units. Light emitted by the micro LED unit passes through; a second barrier layer is disposed on the first reflective layer and the third filter layer, such that the second barrier layer includes a third through-hole array, the third through-hole array corresponding to the first through-hole array, wherein the third through-hole array includes multiple sets of third through-holes corresponding to the multiple sets of first through-holes and multiple sets of second through-holes, the number of third through-holes in each set of third through-holes is the same as the number of first through-holes in each set of first through-holes, and the third through-holes in each set of third through-holes correspond to the first through-holes in the corresponding set of first through-holes, and the second through-holes in each set of second through-holes correspond to the first through-holes in the corresponding set of third through-holes. A portion of the third through-holes correspond to the second through-holes; a photoluminescent material layer is filled in the third through-holes in each group of third through-holes that do not correspond to the second through-holes, and a first light-absorbing layer is filled in the third through-holes in each group of third through-holes that correspond to the second through-holes, to obtain a first color conversion structure, wherein the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, and the first light-absorbing layer is used to partially absorb the light emitted by the micro LED unit; the side of the first color conversion structure opposite to the transparent substrate is bonded to the light-emitting side of the micro LED chip to obtain a micro LED device.

[0005] Furthermore, a first partition layer is disposed on the transparent substrate, such that the first partition layer includes a first through-hole array, the arrangement of the first through-hole array corresponding to the arrangement of the micro LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, each set of first through-holes including at least two first through-holes. This includes: disposing a first partition layer on the transparent substrate and opening a first through-hole array on the first partition layer, such that the arrangement of the first through-hole array corresponds to the arrangement of the micro LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, each set of first through-holes including three first through-holes, the three first through-holes including a first first through-hole, a second first through-hole, and a third first through-hole. A first reflective layer is disposed on a first partition layer, such that the first reflective layer includes a second through-hole array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, the number of second through-holes in each set of second through-holes is less than the number of first through-holes in the corresponding set of first through-holes, and the second through-holes in each set of second through-holes correspond to a portion of the first through-holes in the corresponding set of first through-holes. The first reflective layer is used to reflect the light emitted by the micro LED unit by: disposing a first reflective layer on the first partition layer and opening a second through-hole array on the first reflective layer, such that the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, each set of second through-holes including one second through-hole, the second through-hole being aligned with the third first through-hole, and the first reflective layer being used to reflect the third color light emitted by the micro LED unit. A third filter layer is filled in the corresponding first and second through holes. The third filter layer only allows light emitted by the micro LED unit to pass through. The aperture includes: a third filter layer is filled in the aligned third first and second through holes. The third filter layer only allows light of the third color emitted by the micro LED unit to pass through.A second barrier layer is disposed on the first reflective layer and the third filter layer, such that the second barrier layer includes a third via array, the third via array corresponding to the first via array, wherein the third via array includes multiple groups of third vias corresponding to the multiple groups of first vias and multiple groups of second vias, the number of third vias in each group of third vias is the same as the number of first vias in each group of first vias, and the third vias in each group of third vias correspond to the first vias in the corresponding group of first vias, and the second vias in each group of second vias correspond to a portion of the third vias in the corresponding group of third vias. The method includes: setting a second barrier layer on the first reflective layer and the third filter layer, and opening a third through-hole array on the second barrier layer, such that the third through-hole array is aligned with the first through-hole array, wherein the third through-hole array includes multiple sets of third through-holes corresponding to the multiple sets of first through-holes and the multiple sets of second through-holes, each set of third through-holes includes a first third through-hole aligned with a first first through-hole, a second third through-hole aligned with a second first through-hole, and a third third through-hole aligned with a third first through-hole, wherein the third third through-hole is aligned with the second through-hole aligned with the third first through-hole. The photoluminescent material layer includes a first-color photoluminescent material layer and a second-color photoluminescent material layer. A photoluminescent material layer is filled in the third through-holes in each group of third through-holes that do not correspond to the second through-hole, and a first light-absorbing layer is filled in the third through-holes in each group of third through-holes corresponding to the second through-hole, resulting in a first color conversion structure. The color of the light emitted by the micro-LED unit is different from the color corresponding to the photoluminescent material layer. The first light-absorbing layer is used to partially absorb the light emitted by the micro-LED unit by: filling the first-color photoluminescent material layer in the first third through-hole in each group of third through-holes, filling the second-color photoluminescent material layer in the second third through-hole in each group of third through-holes, and filling the third third through-hole in each group of third through-holes with the first light-absorbing layer. The first light-absorbing layer is used to partially absorb the third-color light emitted by the micro-LED unit. The light corresponding to the first color, the light corresponding to the second color, and the light corresponding to the third color are combined to obtain white light.

[0006] Furthermore, before the first reflective layer is disposed on the first partition layer, the method further includes a first filling step, the first filling step including at least one of the following steps: filling a first filling portion in the first first through hole in each group of first through holes, the first filling portion including a first light filter layer that allows only light of a first color to pass through, a second light-absorbing layer for partially absorbing light of a third color, or a transparent material; filling a second filling portion in the second first through hole in each group of first through holes, the second filling portion including a second light filter layer that allows only light of a second color to pass through, a second light-absorbing layer for partially absorbing light of a third color, or a transparent material.

[0007] Furthermore, the first filling step further includes: when either the first first through hole or the second first through hole in each group of first through holes is not filled, filling the unfilled first through hole in the first first through hole or the second first through hole with a transparent material.

[0008] Furthermore, each group of first through holes includes two first through holes. Before the first reflective layer is disposed on the first partition layer, the method further includes: filling one of the first through holes in each group of first through holes with a third filling portion, the third filling portion including a fourth filter layer that allows only the fourth color of light to pass through, a second light-absorbing layer for partially absorbing the third color of light, or a transparent material.

[0009] Furthermore, a first partition layer is disposed on the transparent substrate, such that the first partition layer includes a first through-hole array, the arrangement of the first through-hole array corresponding to the arrangement of the micro LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, each set of first through-holes including at least two first through-holes. This includes: disposing a first partition layer on the transparent substrate and opening a first through-hole array on the first partition layer, such that the arrangement of the first through-hole array corresponds to the arrangement of the micro LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, each set of first through-holes including two first through-holes. A first reflective layer is disposed on a first partition layer, such that the first reflective layer includes a second through-hole array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, the number of second through-holes in each set of second through-holes is less than the number of first through-holes in the corresponding set of first through-holes, and the second through-holes in each set of second through-holes correspond to a portion of the first through-holes in the corresponding set of first through-holes. The first reflective layer is used to reflect the light emitted by the micro LED unit by: disposing a first reflective layer on the first partition layer and opening a second through-hole array on the first reflective layer, such that the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, each set of second through-holes including one second through-hole, the second through-hole being aligned with the first through-hole without a third filling portion, and the first reflective layer being used to reflect the third color light emitted by the micro LED unit. Filling the corresponding first and second through holes with a third filter layer, the third filter layer allowing only light emitted by the micro LED unit to pass through includes: filling the aligned first and second through holes with a third filter layer, the third filter layer allowing only light of a third color emitted by the micro LED unit to pass through. A second barrier layer is disposed on the first reflective layer and the third filter layer, such that the second barrier layer includes a third via array, the third via array corresponding to the first via array, wherein the third via array includes multiple sets of third vias corresponding to the multiple sets of first vias and the multiple sets of second vias, the number of third vias in each set of third vias is the same as the number of first vias in each set of first vias, and the third vias in each set of third vias correspond to the first vias in the corresponding first via group, and the second vias in each set of second vias correspond to a portion of the third vias in the corresponding third via group. This includes: disposing a second barrier layer on the first reflective layer and the third filter layer and opening a third via array on the second barrier layer, such that the third via array corresponds to the first via array, wherein the third via array includes multiple sets of third vias corresponding to the multiple sets of first vias and the multiple sets of second vias, each set of third vias includes two third vias aligned with two first vias in the corresponding first via group, and the second vias in each set of second vias are aligned with one third via in the corresponding third via group.The photoluminescent material layer includes a fourth color photoluminescent material layer. A photoluminescent material layer is filled in the third through-holes in each group of third through-holes that do not correspond to the second through-hole, and a first light-absorbing layer is filled in the third through-holes in each group of third through-holes that correspond to the second through-hole, resulting in a first color conversion structure. The color of the light emitted by the micro-LED unit is different from the color corresponding to the photoluminescent material layer. The first light-absorbing layer is used to partially absorb the light emitted by the micro-LED unit by: filling the third through-holes in each group of third through-holes that are not aligned with the second through-hole, and filling the third through-holes in each group of third through-holes that are aligned with the second through-hole, with the first light-absorbing layer used to partially absorb the third color light emitted by the micro-LED unit. The fourth color light and the third color light are combined to obtain white light.

[0010] Furthermore, before depositing the second barrier layer on the first reflective layer and the third filter layer, the method further includes: depositing a third light-absorbing layer on the first reflective layer and the third filter layer, the third light-absorbing layer being used to partially absorb the light emitted by the micro-LED unit. Depositing the second barrier layer on the first reflective layer and the third filter layer includes: depositing the second barrier layer on the third light-absorbing layer.

[0011] Furthermore, after filling the third through hole in each group of third through holes without a corresponding second through hole with a photoluminescent material layer and filling the third through hole in each group of third through holes corresponding to the second through hole with a first light-absorbing layer, the method further includes: disposing a second reflective layer on the second barrier layer, the photoluminescent material layer and the first light-absorbing layer, wherein the second reflective layer is used to reflect light of the color corresponding to the photoluminescent material layer.

[0012] Further, after filling the third through-holes in each group of third through-holes without corresponding second through-holes with a photoluminescent material layer and filling the third through-holes in each group of third through-holes corresponding to the second through-holes with a first light-absorbing layer, the method further includes: providing an insulating layer on the second barrier layer, the photoluminescent material layer, and the first light-absorbing layer. Bonding the side of the first color conversion structure opposite to the transparent substrate to the light-emitting side of the microLED chip includes: bonding the insulating layer of the first color conversion structure to the light-emitting side of the microLED chip.

[0013] Furthermore, after bonding the side of the first color conversion structure opposite to the transparent substrate to the light-emitting side of the microLED chip, the method includes: removing the transparent substrate of the first color conversion structure to obtain a second color conversion structure from the first color conversion structure.

[0014] According to another aspect of this disclosure, a micro LED device is also provided.

[0015] The micro-LED device includes a second color conversion structure and a micro-LED chip structure. The micro-LED chip structure includes a micro-LED chip, which includes a micro-LED unit array composed of multiple micro-LED units. The second color conversion structure includes: a first barrier layer, which includes a first through-hole array, the arrangement of which corresponds to the arrangement of the micro-LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, each set including at least two first through-holes; a first reflective layer, which is disposed below the first barrier layer and includes a second through-hole array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, the number of second through-holes in each set being less than the number of first through-holes in the corresponding first through-hole set, and the second through-holes in each set corresponding to a portion of the first through-holes in the corresponding first through-hole set; the first reflective layer is used to reflect the light emitted by the micro-LED units; and a third filter layer, which fills the corresponding first and second through-holes. In the process, the third filter layer only allows light emitted by the micro-LED unit to pass through; the second barrier layer is disposed below the first reflective layer and the third filter layer and includes a third through-hole array, the third through-hole array corresponding to the first through-hole array, wherein the third through-hole array includes multiple sets of third through-holes corresponding to the multiple sets of first through-holes and multiple sets of second through-holes, the number of third through-holes in each set of third through-holes is the same as the number of first through-holes in each set of first through-holes, and the third through-holes in each set of third through-holes correspond to the first through-holes in the corresponding first through-hole group. A through-hole corresponds to a second through-hole in each group of second through-holes, and a portion of the third through-holes in the corresponding third through-hole group corresponds to a third through-hole in the corresponding third through-hole group; a photoluminescent material layer and a first light-absorbing layer, wherein the photoluminescent material layer fills the third through-holes in each group of third through-holes that do not have a corresponding second through-hole, and the first light-absorbing layer fills the third through-holes in each group of third through-holes that correspond to the second through-holes, wherein the color of the light emitted by the micro-LED unit is different from the color corresponding to the photoluminescent material layer, and the first light-absorbing layer is used to partially absorb the light emitted by the micro-LED unit. The second barrier layer, the photoluminescent material layer and the first light-absorbing layer of the second color conversion structure are disposed on the light-emitting side of the micro-LED chip.

[0016] Furthermore, each group of first through-holes includes three first through-holes: a first first through-hole, a second first through-hole, and a third first through-hole. Each group of second through-holes includes one second through-hole aligned with the third first through-hole. The first reflective layer reflects the third color light emitted by the micro-LED unit. The third filter layer fills the aligned third first through-hole and second through-hole, allowing only the third color light emitted by the micro-LED unit to pass through. Each group of third through-holes includes a first third through-hole aligned with the first first through-hole, a second third through-hole aligned with the second first through-hole, and a third third through-hole aligned with the third first through-hole. The third through-hole is aligned with the second through-hole aligned with the third first through-hole. The photoluminescent material layer includes a first-color photoluminescent material layer and a second-color photoluminescent material layer. The first-color photoluminescent material layer fills the first third through-hole in each group of third through-holes, the second-color photoluminescent material layer fills the second third through-hole in each group of third through-holes, and the first light-absorbing layer fills the third third through-hole in each group of third through-holes. The first light-absorbing layer is used to partially absorb the third-color light emitted by the micro LED unit. The light corresponding to the first color, the light corresponding to the second color, and the third-color light are combined to obtain white light.

[0017] Furthermore, the second color conversion structure further includes at least one of a first filling portion and a second filling portion, wherein: the first filling portion is used to fill the first first through hole in each group of first through holes, and the first filling portion includes a first light filter layer that allows only light of the first color to pass through, a second light-absorbing layer for partially absorbing light of the third color, or a transparent material; the second filling portion is used to fill the second first through hole in each group of first through holes, and the second filling portion includes a second light filter layer that allows only light of the second color to pass through, a second light-absorbing layer for partially absorbing light of the third color, or a transparent material.

[0018] Furthermore, when either the first or second first through hole in each group of first through holes is not filled, the second color conversion structure also includes a transparent material that fills the unfilled first through hole in the first or second first through hole.

[0019] Furthermore, the first color is red, the second color is green, and the third color is blue.

[0020] Furthermore, each group of first through holes includes two first through holes, and the second color conversion structure also includes a third filling part, which fills one of the first through holes in each group of first through holes. The third filling part includes a fourth filter layer that only allows light of the fourth color to pass through, a second light-absorbing layer for partially absorbing light of the third color, or a transparent material.

[0021] Furthermore, each group of first through holes includes two first through holes, each group of second through holes includes one second through hole, the second through hole is aligned with the first through hole that is not filled with the third filling portion, the first reflective layer is used to reflect the third color light emitted by the micro LED unit, the third filter layer is filled in the aligned first and second through holes, the third filter layer only allows the light emitted by the micro LED unit to pass through, each group of third through holes includes two third through holes aligned with the two first through holes in the corresponding first through hole group, the second through hole in each group of second through holes is aligned with one third through hole in the corresponding third through hole group, the photoluminescent material layer includes a fourth color photoluminescent material layer, the fourth color photoluminescent material layer is filled in the third through hole in each group of third through holes that is not aligned with the second through hole, and the first light-absorbing layer is filled in the third through hole in each group of third through holes that is aligned with the second through hole, the first light-absorbing layer is used to partially absorb the third color light emitted by the micro LED unit, corresponding to the fourth color light and the third color light being combined to obtain white light.

[0022] Furthermore, the fourth color is yellow and the third color is blue.

[0023] Furthermore, the second color conversion structure also includes a third light-absorbing layer, which is disposed below the first reflective layer and the third filter layer. The third light-absorbing layer is used to partially absorb the light emitted by the micro LED unit, and the second barrier layer is disposed below the third light-absorbing layer.

[0024] Furthermore, the second color conversion structure also includes a second reflective layer, which is disposed below the second barrier layer, the photoluminescent material layer and the first light-absorbing layer. The second reflective layer is used to reflect light of the color corresponding to the photoluminescent material layer.

[0025] Furthermore, the second color conversion structure also includes an isolation layer, which is disposed below the second barrier layer, the photoluminescent material layer and the first light-absorbing layer, and is disposed on the light-emitting side of the micro LED chip.

[0026] Furthermore, the micro LED chip structure also includes a driver chip, with the side of the micro LED chip opposite to the light-emitting side disposed on the driver chip. Alternatively, the micro LED chip structure also includes a driver chip and a flexible circuit board, with the side of the micro LED chip opposite to the light-emitting side disposed on the driver chip to form a micro LED module, and the micro LED module disposed on the flexible circuit board via the driver chip.

[0027] Furthermore, the materials of the first barrier layer and the second barrier layer include visible light shielding materials; the materials of the first color photoluminescent material layer and the second color photoluminescent material layer include at least one of group II-VI quantum dots, group III-V quantum dots, perovskite quantum dots, and carbon quantum dots; the materials of the first light-absorbing layer and the second light-absorbing layer include organic dyes, nano-absorbing particles, or inorganic oxides for absorbing blue light; the materials of the first filter layer, the second filter layer, and the third filter layer include organic dyes, nano-absorbing particles, or inorganic oxides; and the first reflective layer includes a distributed Bragg reflector film for reflecting light emitted by the micro LED unit.

[0028] According to another aspect of the present disclosure, a display device is also provided. The display device includes a miniature LED device prepared by the above-described method.

[0029] By applying the technical solution of this disclosure, a transparent substrate and a micro LED chip are obtained. A first barrier layer is disposed on the transparent substrate, and a first reflective layer is disposed on the first barrier layer. Each group of first through-holes included in the first barrier layer includes at least two first through-holes. The number of second through-holes in each group of second through-holes included in the first reflective layer is less than the number of first through-holes in each group of first through-holes. The second through-holes correspond to a portion of the first through-holes. Then, a third filter layer is filled into the corresponding first and second through-holes. Finally, a second barrier layer is disposed on the first reflective layer and the third filter layer. Each group of third through-holes included in the second barrier layer... The number of third through holes in each through hole is the same as the number of first through holes in each group of first through holes, and the third through holes in each group of third through holes correspond to the first through holes in the corresponding group of first through holes. The second through holes in each group of second through holes correspond to some of the third through holes in the corresponding group of third through holes. Then, a photoluminescent material layer is filled in the third through holes in each group of third through holes that do not correspond to the second through holes, and a first light-absorbing layer is filled in the third through holes in each group of third through holes that correspond to the second through holes, thereby forming a first color conversion structure. The first color conversion structure is bonded to the light-emitting side of the micro LED chip to form a micro LED device.

[0030] On one hand, in this micro-LED device, the light emitted by the micro-LED unit of the micro-LED chip excites the material in the photoluminescent material layer to emit light of a different color than the light emitted by the micro-LED unit. Since there are corresponding first, second, and third through-holes, the first light-absorbing layer filled in the third through-hole corresponding to the first and second through-holes can partially absorb the light emitted by the micro-LED unit. The third light-filtering layer filled in the first and second through-holes corresponding to the third through-hole allows only the light emitted by the micro-LED unit to pass through, i.e., reflects light other than the light emitted by the micro-LED unit. Therefore, by setting the first light-absorbing layer in the third through-hole, the direct light emitted by the micro-LED unit from the micro-LED device can be reduced. The light overflow caused by the light is reduced, thus reducing color deviation and poor color purity caused by light overflow. This improves the uniformity of different colors of light emitted from the micro-LED device and enhances the color purity of the micro-LED. Furthermore, by setting a third filter layer in the first and second through holes, the third filter layer can be made thicker, which can effectively block light other than the light emitted by the micro-LED unit from passing through. As described above, after the light emitted by the micro-LED unit is reduced by passing through the first light-absorbing layer, other light different from the light emitted by the micro-LED unit can be prevented from mixing and being output from the micro-LED device together with the light emitted by the micro-LED unit, thereby improving the color purity of the micro-LED and thus improving the display effect of the micro-LED device.

[0031] On the other hand, since the first reflective layer covers the photoluminescent material layer, if a portion of the light emitted by the micro-LED unit does not participate in exciting the photoluminescent material layer and leaks through the photoluminescent material layer, the first reflective layer can reflect the leaked portion of light back to the photoluminescent material layer and re-participate in exciting the photoluminescent material layer. This increases the amount of light participating in exciting the photoluminescent material layer, thereby increasing the amount of light emitted in the color corresponding to the photoluminescent material layer, thus improving the brightness of the micro-LED. Furthermore, it reduces the mixing output of the leaked portion of light with the different colors of light emitted by exciting the photoluminescent material layer, thereby improving the color purity of the micro-LED and thus improving the display effect of the micro-LED device. Attached Figure Description

[0032] The above and other objects, features, and advantages of exemplary embodiments of the present disclosure will become readily apparent upon reading the following detailed description with reference to the accompanying drawings. In the drawings, several embodiments of the present disclosure are illustrated by way of example and not limitation, and like or corresponding reference numerals denote like or corresponding parts, wherein:

[0033] Figure 1 This is a flowchart illustrating a method for fabricating a micro LED device according to an embodiment of the present disclosure;

[0034] Figures 2 to 14 This is a schematic diagram illustrating the fabrication process of a micro LED device fabrication method according to an embodiment of the present disclosure. Detailed Implementation

[0035] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present disclosure will now be described in detail with reference to the accompanying drawings and embodiments.

[0036] It should be noted that the following detailed descriptions are illustrative and intended to provide further explanation of this application. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0037] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways, rotated 90 degrees, or in other orientations, and the spatial relative descriptions used herein will be interpreted accordingly.

[0038] Exemplary embodiments according to this disclosure will now be described in more detail with reference to the accompanying drawings. However, these exemplary embodiments may be implemented in many different forms and should not be construed as being limited to the embodiments set forth herein. It should be understood that these embodiments are provided so that this disclosure is thorough and complete, and that the concept of these exemplary embodiments is fully conveyed to those skilled in the art. In the drawings, for clarity, the thickness of layers and regions has been enlarged, and the same reference numerals are used to denote the same devices, and therefore their description will be omitted.

[0039] This disclosure provides a method for fabricating a micro LED device. (Refer to...) Figures 1 to 14 , Figure 1 This is a flowchart illustrating a method for fabricating a micro LED device according to an embodiment of the present disclosure; Figures 2 to 14 This is a schematic diagram illustrating the fabrication process of a micro LED device fabrication method according to an embodiment of the present disclosure.

[0040] like Figure 1 As shown, the method for fabricating this micro LED device includes the following steps S101-S107.

[0041] Step S101: Obtain a transparent substrate and a micro LED chip structure, wherein the micro LED chip structure includes a micro LED chip, and the micro LED chip includes a micro LED unit array composed of multiple micro LED units.

[0042] Step S102: A first partition layer is formed on a transparent substrate, such that the first partition layer includes a first through-hole array, the arrangement of the first through-hole array corresponds to the arrangement of the micro LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, and each set of first through-holes includes at least two first through-holes.

[0043] Step S103: A first reflective layer is disposed on the first partition layer, such that the first reflective layer includes a second through-hole array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, the number of second through-holes in each set of second through-holes is less than the number of first through-holes in the corresponding set of first through-holes, and the second through-holes in each set of second through-holes correspond to a portion of the first through-holes in the corresponding set of first through-holes, and the first reflective layer is used to reflect the light emitted by the micro LED unit.

[0044] Step S104: Fill the corresponding first and second through holes with a third filter layer, which only allows light emitted by the micro LED unit to pass through.

[0045] Step S105: A second barrier layer is formed on the first reflective layer and the third filter layer, such that the second barrier layer includes a third through-hole array, the third through-hole array corresponding to the first through-hole array, wherein the third through-hole array includes multiple sets of third through-holes corresponding to the multiple sets of first through-holes and the multiple sets of second through-holes, the number of third through-holes in each set of third through-holes is the same as the number of first through-holes in each set of first through-holes, and the third through-holes in each set of third through-holes correspond to the first through-holes in the corresponding first through-hole set, and the second through-holes in each set of second through-holes correspond to a portion of the third through-holes in the corresponding third through-hole set.

[0046] Step S106: Fill the third through hole in each group of third through holes without a corresponding second through hole with a photoluminescent material layer and fill the third through hole in each group of third through holes corresponding to the second through hole with a first light-absorbing layer to obtain a first color conversion structure, wherein the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, and the first light-absorbing layer is used to partially absorb the light emitted by the micro LED unit.

[0047] Step S107: Bond the side of the first color conversion structure opposite to the transparent substrate to the light-emitting side of the micro LED chip to obtain a micro LED device.

[0048] According to this technical solution, a transparent substrate and a micro LED chip can be obtained. A first barrier layer is formed on the transparent substrate, and a first reflective layer is formed on the first barrier layer. Each group of first through-holes in the first barrier layer includes at least two first through-holes. The number of second through-holes in each group of second through-holes in the first reflective layer is less than the number of first through-holes in each group of first through-holes. The second through-holes correspond to a portion of the first through-holes. Then, a third filter layer is filled into the corresponding first and second through-holes. Finally, a second barrier layer is formed on the first reflective layer and the third filter layer. Each group of third through-holes in the second barrier layer... The number of third through holes in the hole is the same as the number of first through holes in each group of first through holes, and the third through holes in each group of third through holes correspond to the first through holes in the corresponding group of first through holes. The second through holes in each group of second through holes correspond to some of the third through holes in the corresponding group of third through holes. Then, a photoluminescent material layer is filled in the third through holes in each group of third through holes that do not have a corresponding second through hole, and a first light-absorbing layer is filled in the third through holes in each group of third through holes that correspond to the second through holes, thereby forming a first color conversion structure. The first color conversion structure is bonded to the light-emitting side of the micro LED chip to form a micro LED device.

[0049] On one hand, in this micro-LED device, the light emitted by the micro-LED unit of the micro-LED chip excites the material in the photoluminescent material layer to emit light of a different color than the light emitted by the micro-LED unit. Since there are corresponding first, second, and third through-holes, the first light-absorbing layer filled in the third through-hole corresponding to the first and second through-holes can partially absorb the light emitted by the micro-LED unit. The third light-filtering layer filled in the first and second through-holes corresponding to the third through-hole can only allow light emitted by the micro-LED unit to pass through, i.e., reflect light other than the light emitted by the micro-LED unit. Therefore, by setting the first light-absorbing layer in the third through-hole, the direct emission of light emitted by the micro-LED unit from the micro-LED device can be reduced. The light overflow caused by this process is reduced, thus minimizing color shift and poor color purity. This improves the uniformity of different colors of light emitted from the micro-LED device, enhances the color purity of the micro-LED, and, by setting a third filter layer in the first and second through holes, allows for a thicker third filter layer. This effectively blocks light other than that emitted by the micro-LED unit from passing through. As described above, the light emitted by the micro-LED unit is reduced after passing through the first light-absorbing layer, preventing other light different from that emitted by the micro-LED unit from mixing and being output from the micro-LED device. This further enhances the color purity of the micro-LED and improves the display effect of the micro-LED device.

[0050] On the other hand, since the first reflective layer covers the photoluminescent material layer, if a portion of the light emitted by the micro-LED unit does not participate in exciting the photoluminescent material layer and leaks through the photoluminescent material layer, the first reflective layer can reflect the leaked portion of light back to the photoluminescent material layer and re-participate in exciting the photoluminescent material layer. This increases the amount of light participating in exciting the photoluminescent material layer, thereby increasing the amount of light emitted in the color corresponding to the photoluminescent material layer, thus improving the brightness of the micro-LED. Furthermore, it reduces the mixing output of the leaked portion of light with the different colors of light emitted by exciting the photoluminescent material layer, thereby improving the color purity of the micro-LED and thus improving the display effect of the micro-LED device.

[0051] In step S101, a transparent substrate and a micro LED chip structure can be obtained, wherein the micro LED chip structure includes a micro LED chip, and the micro LED chip includes a micro LED unit array composed of multiple micro LED units.

[0052] According to embodiments of this disclosure, a transparent substrate and a micro-LED chip structure can be obtained first. The transparent substrate may include any suitable substrate such as a glass substrate, a polyimide substrate, or a sapphire substrate. The micro-LED chip structure includes a micro-LED chip, which comprises an array of micro-LED units for emitting light. The micro-LED chip can be any micro-LED chip suitable for fabricating a micro-LED device; for example, the structure of the micro-LED chip may include a right-mounted structure, a flip-chip structure, or a vertical structure, etc., without limitation. Each micro-LED unit in the micro-LED unit array may include an exposed first semiconductor layer on its light-emitting side. Depending on the type of micro-LED device, in some embodiments, the first semiconductor layer may include an N-GaN layer; in other embodiments, the first semiconductor layer may include a P-GaN layer. It is worth noting that the micro-LED chip structure can also be obtained in any step prior to the subsequent step of using the micro-LED chip structure.

[0053] Reference Figures 2-14 ,in Figure 2 A side view of a transparent substrate 101 according to an embodiment of the present disclosure is shown. Figure 2 As shown, the transparent substrate 101 may be, for example, a glass substrate.

[0054] Reference Figures 2-14 ,in Figure 3 A side view of a microLED chip structure according to an embodiment of the present disclosure is shown. Figure 3 As shown, the micro-LED chip structure includes a micro-LED chip 20, which comprises a micro-LED unit array 201 composed of micro-LED units 2011. Each micro-LED unit 2011 in the micro-LED unit array 201 includes, for example, a first semiconductor layer 20111 of N-GaN layer on the light-emitting side. Figure 3 As shown, the first semiconductor layer 20111 is shared by each micro-LED unit 2011 in the micro-LED unit array 201, that is, the first semiconductor layer 20111 is integrated into the micro-LED chip 20.

[0055] In step S102, a first partition layer can be formed on the transparent substrate, such that the first partition layer includes a first through-hole array, the arrangement of the first through-hole array corresponds to the arrangement of the micro LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, and each set of first through-holes includes at least two first through-holes.

[0056] According to embodiments of this disclosure, after obtaining a transparent substrate, a first barrier layer can be formed on the transparent substrate. The material of the first barrier layer may include a visible light shielding material, such as a matting material like black photoresist or a reflective material like a metal layer.

[0057] According to one embodiment of the first partition layer of this disclosure, a first partition layer is disposed on a transparent substrate, such that the first partition layer includes a first through-hole array, the arrangement of the first through-hole array corresponding to the arrangement of the micro LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, each set of first through-holes including at least two first through-holes. The first partition layer is disposed on a transparent substrate and a first through-hole array is formed on the first partition layer, such that the arrangement of the first through-hole array corresponds to the arrangement of the micro LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, each set of first through-holes including three first through-holes, the three first through-holes including a first first through-hole, a second first through-hole, and a third first through-hole.

[0058] According to another embodiment of the first partition layer of this disclosure, a first partition layer is disposed on a transparent substrate, such that the first partition layer includes a first through-hole array, the arrangement of the first through-hole array corresponding to the arrangement of the micro LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, each set of first through-holes including at least two first through-holes. The process includes: disposing of a first partition layer on a transparent substrate and forming a first through-hole array on the first partition layer, such that the arrangement of the first through-hole array corresponds to the arrangement of the micro LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, each set of first through-holes including two first through-holes.

[0059] Reference Figures 2-14 ,in Figure 4 A side view schematic diagram of a first partition layer 102 disposed on a transparent substrate 101 is shown. Figure 4 As shown, the first barrier layer 102 can be, for example, a black photoresist layer. Therefore, a black photoresist layer can be applied to a transparent substrate 101, such as a glass substrate, using spin coating. Then, for example, a first via array 1020 can be formed on the black photoresist layer using photolithography, such that the arrangement of the first via array 1020 corresponds to the arrangement of the subsequent micro-LED unit array 201 and exposes the transparent substrate 101. The first via array 1020 includes multiple sets of first vias, each set including a first first via 1021, a second first via 1022, and a third first via 1023. For clarity and brevity, Figure 4Only one set of first through holes is shown in the first through hole array 1020, which includes a first first through hole 1021, a second first through hole 1022, and a third first through hole 1023. Figure 4 The number of groups of first vias and the number of first vias in each group shown are merely illustrative and are not intended to be limiting. A first barrier layer 102, such as a black photoresist layer, can make the screen appear black when the display device is powered off or turned off.

[0060] In step S103, a first reflective layer can be provided on the first partition layer, such that the first reflective layer includes a second through-hole array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, the number of second through-holes in each set of second through-holes is less than the number of first through-holes in the corresponding set of first through-holes, and the second through-holes in each set of second through-holes correspond to a portion of the first through-holes in the corresponding set of first through-holes, and the first reflective layer is used to reflect the light emitted by the micro LED unit.

[0061] According to embodiments of this disclosure, after the first barrier layer is provided, a first reflective layer can be provided on the first barrier layer. The first reflective layer may include a distributed Bragg reflective film, which may be, for example, a distributed Bragg reflective film formed by alternating stacks of silicon dioxide layers and titanium dioxide layers, and may also include any material layer for reflecting the light emitted by the micro LED unit.

[0062] Referring to an embodiment of the first barrier layer in step S102, according to an embodiment of the filling of the first through-holes in this disclosure, before the first reflective layer is disposed on the first barrier layer, the method further includes a first filling step, the first filling step including at least one of the following steps: filling a first filling portion in the first first through-hole in each group of first through-holes, the first filling portion including a first light-filtering layer that allows only light of a first color to pass through, a second light-absorbing layer for partially absorbing light of a third color, or a transparent material; filling a second filling portion in the second first through-hole in each group of first through-holes, the second filling portion including a second light-filtering layer that allows only light of a second color to pass through, a second light-absorbing layer for partially absorbing light of a third color, or a transparent material.

[0063] Furthermore, when either the first or second through hole in each group of first through holes is not filled, a transparent material is filled into the unfilled first through hole in the first or second through hole.

[0064] According to one embodiment of the first reflective layer of this disclosure, a first reflective layer is disposed on a first partition layer, such that the first reflective layer includes a second through-hole array, wherein the second through-hole array includes a plurality of second through-holes corresponding to the plurality of first through-holes, the number of second through-holes in each group of second through-holes is less than the number of first through-holes in the corresponding first through-hole group, and the second through-holes in each group of second through-holes correspond to a portion of the first through-holes in the corresponding first through-hole group. The first reflective layer is used to reflect the light emitted by the micro LED unit by: disposing the first reflective layer on the first partition layer and opening the second through-hole array on the first reflective layer, such that the second through-hole array includes a plurality of second through-holes corresponding to the plurality of first through-holes, each group of second through-holes including one second through-hole, the second through-hole being aligned with the third first through-hole, and the first reflective layer is used to reflect the third color light emitted by the micro LED unit.

[0065] In this embodiment, the first color of light refers to the light within the wavelength range corresponding to the first color, the second color of light refers to the light within the wavelength range corresponding to the second color, and the third color of light refers to the light within the wavelength range corresponding to the third color. The first, second, and third colors can be three primary colors; for example, the first color is red, the second color is green, and the third color is blue. The material of the second light-absorbing layer includes organic dyes, nano-absorbing particles, or inorganic oxides for absorbing blue light, such as zinc oxide nanoparticle photoresist. The materials of the first and second light-filtering layers include organic dyes, nano-absorbing particles, or inorganic oxides.

[0066] Referring to another embodiment of the first barrier layer in step S102, according to another embodiment of the filling of the first through holes in this disclosure, each group of first through holes includes two first through holes. Before the first reflective layer is disposed on the first barrier layer, the method further includes: filling one of the first through holes in each group of first through holes with a third filling portion, the third filling portion including a fourth filter layer that allows only the fourth color of light to pass through, a second light-absorbing layer for partially absorbing the third color of light, or a transparent material.

[0067] According to another embodiment of the first reflective layer of this disclosure, a first reflective layer is disposed on a first partition layer, such that the first reflective layer includes a second through-hole array, wherein the second through-hole array includes a plurality of second through-holes corresponding to the plurality of first through-holes, the number of second through-holes in each group of second through-holes is less than the number of first through-holes in the corresponding first through-hole group, and the second through-holes in each group of second through-holes correspond to a portion of the first through-holes in the corresponding first through-hole group. The first reflective layer is used to reflect the light emitted by the micro LED unit by: disposing a first reflective layer on a first partition layer and opening a second through-hole array on the first reflective layer, such that the second through-hole array includes a plurality of second through-holes corresponding to the plurality of first through-holes, each group of second through-holes including one second through-hole, the second through-hole being aligned with the first through-hole without a third filling portion, and the first reflective layer is used to reflect the third color light emitted by the micro LED unit.

[0068] In this embodiment, the fourth color of light refers to the light within the wavelength range corresponding to the fourth color. The fourth color is yellow light and the third color is blue. The material of the second light-absorbing layer includes organic dyes, nano-absorbing particles, or inorganic oxides for absorbing blue light, such as zinc oxide nanoparticle photoresist. The material of the fourth light-filtering layer includes organic dyes, nano-absorbing particles, or inorganic oxides.

[0069] Reference Figures 2-14 ,in Figure 5 A side view schematic diagram of the filling portion in each group of first through holes is shown. (Combined with...) Figure 4 ,like Figure 5 As shown, a first filling portion is filled in the first first through-hole 1021 of each group of first through-holes. This first filling portion may include a first filter layer 1031 that only allows light of a first color, such as red, to pass through. A second filling portion is filled in the second first through-hole 1022 of each group of first through-holes. This second filling portion may include a second filter layer 1032 that only allows light of a second color, such as green, to pass through, resulting in... Figure 5 The structure is shown. It is worth noting that in other embodiments, when either the first or second first through hole in each group of first through holes is not filled, a transparent material can be filled into the unfilled first through hole in the first or second first through hole to support the portion above the corresponding first through hole in subsequent manufacturing processes. The transparent material can be, for example, any suitable material such as transparent resin.

[0070] Reference Figures 2-14 ,in Figure 6 A side view schematic diagram of a first reflective layer disposed on a first partition layer is shown. Figure 6As shown, a first reflective layer 104, such as a distributed Bragg reflector, is disposed on the first partition layer 102, and a second through-hole array is formed on the first reflective layer 104, such that the second through-hole array includes multiple sets of second through-holes, each set of second through-holes including a second through-hole 1041 aligned with a third first through-hole 1023, the second through-hole 1041 exposing the third first through-hole 1023. The first reflective layer 104 is used to reflect, for example, blue light emitted by the micro LED unit. For clarity and brevity, Figure 6 Only one set of second through holes is shown in the second through hole array, which includes a second through hole 1041. Figure 6 The number of groups of second through holes and the number of second through holes in each group shown are merely illustrative and are not intended to be limiting.

[0071] In step S104, a third filter layer can be filled into the corresponding first and second through holes. The third filter layer only allows light emitted by the micro LED unit to pass through.

[0072] According to embodiments of this disclosure, after the first reflective layer is formed, a third filter layer can be filled into the first through-hole of the corresponding first barrier layer and the second through-hole of the first reflective layer. The material of the third filter layer includes organic dyes, nano-absorbing particles, or inorganic oxides.

[0073] Referring to an embodiment of the first barrier layer in step S102, an embodiment of filling the first through-hole in step S103, and an embodiment of the first reflective layer, according to an embodiment of filling the third filter layer of this disclosure, the third filter layer is filled in the corresponding first through-hole and second through-hole, and the third filter layer only allows light emitted by the micro LED unit to pass through. The third filter layer is filled in the aligned third first through-hole and second through-hole, and the third filter layer only allows light of the third color emitted by the micro LED unit to pass through.

[0074] Referring to another embodiment of the first barrier layer in step S102, another embodiment of filling the first through-hole in step S103, and another embodiment of the first reflective layer, according to another embodiment of filling the third filter layer of this disclosure, filling the corresponding first and second through-holes with the third filter layer, wherein the third filter layer only allows light emitted by the micro LED unit to pass through, includes: filling the aligned first and second through-holes with the third filter layer, wherein the third filter layer only allows light of a third color emitted by the micro LED unit to pass through.

[0075] Reference Figures 2-14 ,in Figure 7 A side view schematic diagram is shown, illustrating the third filter layer filled in the corresponding first and second through-holes. (Combined with...) Figure 6 ,like Figure 7 As shown, a third filter layer 105 is filled in the aligned third first through-hole 1023 and second through-hole 1041. This third filter layer 105 only allows light emitted by the micro LED unit to pass through.

[0076] In step S105, a second barrier layer can be provided on the first reflective layer and the third filter layer, such that the second barrier layer includes a third through-hole array, the third through-hole array corresponding to the first through-hole array, wherein the third through-hole array includes multiple sets of third through-holes corresponding to the multiple sets of first through-holes and the multiple sets of second through-holes, the number of third through-holes in each set of third through-holes is the same as the number of first through-holes in each set of first through-holes, and the third through-holes in each set of third through-holes correspond to the first through-holes in the corresponding first through-hole set, and the second through-holes in each set of second through-holes correspond to a portion of the third through-holes in the corresponding third through-hole set.

[0077] According to embodiments of this disclosure, after filling the third filter layer, a second barrier layer can be disposed on the first reflective layer and the third filter layer. The second barrier layer can function as a grid, and the interior of the grid can be filled with a corresponding material. In some embodiments, the second barrier layer may include a visible light shielding material, such as a matting material like black photoresist, or a reflective material like a metal layer.

[0078] Referring to an embodiment of the first barrier layer in step S102, an embodiment of filling the first via in step S103, an embodiment of the first reflective layer, and an embodiment of filling the third filter layer in step S104, according to an embodiment of the second barrier layer of this disclosure, a second barrier layer is disposed on the first reflective layer and the third filter layer, such that the second barrier layer includes a third via array, the third via array corresponding to the first via array, wherein the third via array includes multiple sets of third vias corresponding to the multiple sets of first vias and the multiple sets of second vias, the number of third vias in each set of third vias is the same as the number of first vias in each set of first vias, and the number of third vias in each set of third vias is... The via corresponds to the first via in the first via group, and the second via in each group of second vias corresponds to a portion of the third via in the third via group, including: setting a second partition layer on the first reflective layer and the third filter layer, and opening a third via array on the second partition layer, such that the third via array is aligned with the first via array, wherein the third via array includes multiple groups of third vias corresponding to the multiple groups of first vias and the multiple groups of second vias, each group of third vias including a first third via aligned with the first first via, a second third via aligned with the second first via, and a third third via aligned with the third first via, wherein the third third via is aligned with the second via aligned with the third first via.

[0079] Referring to another embodiment of the first barrier layer in step S102, another embodiment of filling the first via in step S103, another embodiment of the first reflective layer, and another embodiment of filling the third filter layer in step S104, according to another embodiment of the second barrier layer of this disclosure, a second barrier layer is disposed on the first reflective layer and the third filter layer, such that the second barrier layer includes a third via array, the third via array corresponding to the first via array, wherein the third via array includes multiple sets of third vias corresponding to the multiple sets of first vias and the multiple sets of second vias, the number of third vias in each set of third vias being equal to the number of first vias in each set of first vias. The method of having the same quantity and having the third through hole in each group of third through holes correspond to the first through hole in the corresponding first through hole group, and the second through hole in each group of second through holes corresponding to a portion of the third through holes in the corresponding third through hole group, includes: setting a second partition layer on the first reflective layer and the third filter layer, and opening a third through hole array on the second partition layer, such that the third through hole array corresponds to the first through hole array, wherein the third through hole array includes multiple groups of third through holes corresponding to the multiple groups of first through holes and the multiple groups of second through holes, each group of third through holes includes two third through holes respectively aligned with two first through holes in the corresponding first through hole group, and the second through hole in each group of second through holes is aligned with one third through hole in the corresponding third through hole group.

[0080] According to embodiments of this disclosure, before depositing the second barrier layer on the first reflective layer and the third filter layer, the method further includes: depositing a third light-absorbing layer on the first reflective layer and the third filter layer, the third light-absorbing layer being used to partially absorb the light emitted by the micro-LED unit. Depositing the second barrier layer on the first reflective layer and the third filter layer includes: depositing the second barrier layer on the third light-absorbing layer.

[0081] Reference Figures 2-14 ,in Figure 8 A side view schematic diagram of a third light-absorbing layer disposed on the first reflective layer and the third filter layer is shown. Figure 8 As shown, a third light-absorbing layer 106 is disposed on the first reflective layer 104 and the third filter layer 105. This third light-absorbing layer 106 is used to partially absorb, for example, blue light emitted by the micro-LED unit. The material of the third light-absorbing layer 106 includes organic dyes, nano-absorbing particles, or inorganic oxides for absorbing blue light. The material of the third light-absorbing layer 106 can be the same as that of the second light-absorbing layer, for example, it can be zinc oxide nanoparticle photoresist.

[0082] Reference Figures 2-14 ,in Figure 9 A side view schematic diagram of a second barrier layer disposed on the third light-absorbing layer is shown. Figure 9 As shown, the second barrier layer 107 can be, for example, a black photoresist layer. Therefore, a black photoresist layer can be coated onto the third light-absorbing layer 106 using a spin-coating method. Then, for example, a third via array 1070 can be formed on the black photoresist layer by photolithography, such that the third via array 1070 is aligned with the first via array 1020, and the third via array 1070 exposes the third light-absorbing layer 106. The third via array 1070 includes multiple sets of third vias corresponding to multiple sets of first vias and multiple sets of second vias. Each set of third vias includes a first third via 1071 aligned with the first first via 1021, a second third via 1072 aligned with the second first via 1022, and a third third via 1073 aligned with the third first via 1023. The third third via 1073 is aligned with the second via 1041, resulting in the following... Figure 9 The structure shown. Figure 9 The number of groups of third through holes and the number of third through holes in each group shown are only illustrative. As long as the correspondence with the first and second through holes is followed as described above, there are no restrictions here.

[0083] In step S106, a photoluminescent material layer can be filled in the third through hole in each group of third through holes that does not have a corresponding second through hole, and a first light-absorbing layer can be filled in the third through hole in each group of third through holes that corresponds to the second through hole, to obtain a first color conversion structure, wherein the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, and the first light-absorbing layer is used to partially absorb the light emitted by the micro LED unit.

[0084] According to embodiments of this disclosure, after obtaining the aforementioned third via array, a photoluminescent material layer and a first light-absorbing layer can be filled into the third via array. The first light-absorbing layer partially absorbs the light emitted by the micro-LED units, so that a portion of the light emitted by the micro-LED units is absorbed after passing through the first light-absorbing layer, and the remaining light is emitted from the micro-LED device. Furthermore, the color of the light emitted by the micro-LED units is different from the color corresponding to the photoluminescent material layer, enabling full-color display of the micro-LED device after the light emitted from the micro-LED units passes through the photoluminescent material layer.

[0085] Referring to an embodiment of the first barrier layer in step S102, an embodiment of filling the first through-hole and an embodiment of the first reflective layer in step S103, an embodiment of filling the third filter layer in step S104, and an embodiment of the second barrier layer in step S105, according to an embodiment of the filled photoluminescent material layer and the second light-absorbing layer of this disclosure, the photoluminescent material layer includes a first-color photoluminescent material layer and a second-color photoluminescent material layer. A photoluminescent material layer is filled in the third through-holes in each group of third through-holes that do not correspond to a second through-hole, and a first light-absorbing layer is filled in the third through-holes in each group of third through-holes that correspond to the second through-hole, thereby obtaining a first color conversion. The structure wherein the color of the light emitted by the micro-LED unit is different from the color corresponding to the photoluminescent material layer, and the first light-absorbing layer for partially absorbing the light emitted by the micro-LED unit includes: filling the first third through hole in each group of third through holes with a first color of photoluminescent material layer, filling the second third through hole in each group of third through holes with a second color of photoluminescent material layer, and filling the third third through hole in each group of third through holes with a first light-absorbing layer, the first light-absorbing layer being used to partially absorb the third color of light emitted by the micro-LED unit, and the light corresponding to the first color, the light corresponding to the second color, and the light corresponding to the third color are combined to obtain white light.

[0086] In this embodiment, the first color of light refers to the light within the wavelength range corresponding to the first color, the second color of light refers to the light within the wavelength range corresponding to the second color, and the third color of light refers to the light within the wavelength range corresponding to the third color. The first, second, and third colors can be three primary colors, for example, the first color is red, the second color is green, and the third color is blue. The materials of the photoluminescent material layers of the first and second colors include at least one of group II-VI quantum dots, group III-V quantum dots, perovskite quantum dots, and carbon quantum dots. The material of the first light-absorbing layer includes organic dyes, nano-absorbing particles, or inorganic oxides for absorbing blue light, such as zinc oxide nanoparticle photoresist.

[0087] Referring to another embodiment of the first barrier layer in step S102, another embodiment of filling the first through-hole and another embodiment of the first reflective layer in step S103, another embodiment of filling the third filter layer in step S104, and another embodiment of the second barrier layer in step S105, according to another embodiment of the filled photoluminescent material layer and the second light-absorbing layer of this disclosure, the photoluminescent material layer includes a photoluminescent material layer of a fourth color, and the photoluminescent material layer is filled in the third through-holes in each group of third through-holes that do not have a corresponding second through-hole, and in the third through-holes in each group of third through-holes corresponding to the second through-holes. A first light-absorbing layer is filled to obtain a first color conversion structure, wherein the color of the light emitted by the micro-LED unit is different from the color corresponding to the photoluminescent material layer, and the first light-absorbing layer is used to partially absorb the light emitted by the micro-LED unit by: filling the third through hole in each group of third through holes that is not aligned with the second through hole with a fourth color of photoluminescent material layer, and filling the third through hole in each group of third through holes that is aligned with the second through hole with a first light-absorbing layer, the first light-absorbing layer being used to partially absorb the third color of light emitted by the micro-LED unit, and the fourth color of light and the third color of light are combined to obtain white light.

[0088] In this embodiment, the fourth color of light refers to light within the wavelength range corresponding to the fourth color, wherein the fourth color is yellow light and the third color is blue. The material of the photoluminescent material layer of the fourth color may include at least one of group II-VI quantum dots, group III-V quantum dots, perovskite quantum dots, and carbon quantum dots. The material of the first light-absorbing layer includes organic dyes, nano-absorbing particles, or inorganic oxides for absorbing blue light, such as zinc oxide nanoparticle photoresist.

[0089] According to embodiments of this disclosure, after filling the third through-holes without corresponding second through-holes in each group of third through-holes with a photoluminescent material layer and filling the third through-holes corresponding to the second through-holes in each group of third through-holes with a first light-absorbing layer, the method further includes: disposing a second reflective layer on the second barrier layer, the photoluminescent material layer, and the first light-absorbing layer, the second reflective layer being used to reflect light of the color corresponding to the photoluminescent material layer. The second reflective layer may, for example, be a distributed Bragg reflective film formed by alternating stacks of silicon dioxide layers and titanium dioxide layers. It is worth noting that although the second reflective layer and the first reflective layer are both distributed Bragg reflective films formed by alternating stacks of silicon dioxide layers and titanium dioxide layers, the number of silicon dioxide layers and titanium dioxide layers in the second reflective layer, as well as the thickness of each silicon dioxide layer and each titanium dioxide layer, are different from those in the first reflective layer.

[0090] According to an embodiment of this disclosure, after filling a photoluminescent material layer in the third through hole without a corresponding second through hole in each group of third through holes and filling a first light-absorbing layer in the third through hole corresponding to the second through hole in each group of third through holes, the method further includes: providing an insulating layer on the second barrier layer, the photoluminescent material layer and the first light-absorbing layer.

[0091] Reference Figures 2-14 ,in Figure 10 A side view schematic diagram is shown of the photoluminescent material layer filling each group of third through-holes. (Combined with...) Figure 9 ,like Figure 10 As shown, the first third through hole 1071 in each group of third through holes is filled with a photoluminescent material layer 1081 of a first color, such as red, and the second third through hole 1072 in each group of third through holes is filled with a photoluminescent material layer 1082 of a second color, such as green.

[0092] Reference Figures 2-14 ,in Figure 11 A side view schematic diagram of the first light-absorbing layer filled in each group of third through-holes is shown. (Combined with...) Figure 9 and Figure 10 ,like Figure 11 As shown, a first light-absorbing layer 1083 for partially absorbing, for example, blue light is filled into the third through-hole 1073. The material of the first light-absorbing layer 1083 can be the same as the material of the second light-absorbing layer and the third light-absorbing layer 106. It is worth noting that the filling order of the first-color photoluminescent material layer 1081, the second-color photoluminescent material layer 1082, and the first light-absorbing layer 1083 is merely exemplary and is not limited herein. The filling order of the first-color photoluminescent material layer 1081, the second-color photoluminescent material layer 1082, and the first light-absorbing layer 1083 can be arbitrarily adjusted according to the specific process, equipment, and other actual preparation conditions.

[0093] Reference Figures 2-14 ,in Figure 12 A side view schematic diagram is shown, illustrating an insulating layer disposed on a second barrier layer, a photoluminescent material layer, and a first light-absorbing layer. (See diagram for reference.) Figure 12 As shown, a barrier layer 109, such as a silicon dioxide layer, can be deposited on the second barrier layer 107, the first photoluminescent material layer 1081, the second photoluminescent material layer 1082, and the first light-absorbing layer 1083 using plasma-enhanced chemical vapor deposition (PECVD) to obtain the barrier layer 109. Figure 12 The first color conversion structure 10 is shown. Of course, the insulating layer can also include any other suitable materials, such as any suitable organic polymers and inorganic oxides, and any suitable fabrication process can be used to prepare the insulating layer for different materials. The insulating layer is used to protect the other parts of the first color conversion structure and can also serve as a surface layer of the first color conversion structure, making the surface of the first color conversion structure smoother, thereby facilitating the subsequent bonding of the first color conversion structure to the micro-LED chip.

[0094] In step S107, the side of the first color conversion structure opposite to the transparent substrate can be bonded to the light-emitting side of the micro LED chip to obtain a micro LED device.

[0095] According to embodiments of this disclosure, after obtaining the first color conversion structure, the side of the first color conversion structure opposite to the transparent substrate can be bonded to the light-emitting side of the micro LED chip to obtain a micro LED device.

[0096] Furthermore, bonding the side of the first color conversion structure opposite to the transparent substrate to the light-emitting side of the microLED chip includes: bonding the insulating layer of the first color conversion structure to the light-emitting side of the microLED chip.

[0097] Furthermore, each micro-LED unit in the micro-LED unit array includes a first semiconductor layer on the light-emitting side, and bonding the isolation layer of the first color conversion structure to the light-emitting side of the micro-LED chip includes: bonding the isolation layer of the first color conversion structure to the first semiconductor layer.

[0098] According to an embodiment of this disclosure, after bonding the side of the first color conversion structure opposite to the transparent substrate to the light-emitting side of the microLED chip, the method includes: removing the transparent substrate of the first color conversion structure to obtain a second color conversion structure from the first color conversion structure.

[0099] According to embodiments of this disclosure, the micro LED chip structure further includes a driver chip, with one side of the micro LED chip opposite to the light-emitting side disposed on the driver chip. Alternatively, the micro LED chip structure further includes a driver chip and a flexible circuit board, with one side of the micro LED chip opposite to the light-emitting side disposed on the driver chip to form a micro LED module, and the micro LED module disposed on the flexible circuit board via the driver chip.

[0100] Reference Figures 2-14 ,in Figure 13 A side view showing the bonding of a first color conversion structure to a microLED chip according to an embodiment of the present disclosure is shown. Figure 13 As shown, the insulating layer 109 of the first color conversion structure 10 is bonded to the first semiconductor layer 20111 of the micro-LED chip 20, resulting in the following... Figure 13 The structure shown.

[0101] Reference Figures 2-14 ,in Figure 14 A side view of a micro LED device 1 according to an embodiment of the present disclosure is shown. Figure 14 As shown, remove Figure 13 The transparent substrate 101 of the first color conversion structure 10 in the structure shown obtains the second color conversion structure 11 through the first color conversion structure 10, resulting in the following... Figure 14 The micro LED device 1 shown.

[0102] Reference Figures 2 to 14It should be understood that the third color light emitted by the micro-LED unit 2011, such as blue light, excites the first color photoluminescent material layer 1081, such as red light, to emit red light. The third color light emitted by the micro-LED unit 2011, such as blue light, excites the second color photoluminescent material layer 1082, such as green light, to emit green light. The third color light emitted by the micro-LED unit, such as blue light, is partially absorbed after passing through the first light-absorbing layer 1083, but some blue light still passes through the first light-absorbing layer 1083. The third filter layer 105 can only allow the blue light emitted by the micro-LED unit to pass through, that is, reflect light other than the blue light emitted by the micro-LED unit. The first color light, such as red light, the second color light, such as green light, and the third color light, such as blue light, emitted after passing through the photoluminescent material layer and the first light-absorbing layer 1083 can be combined to obtain white light. Therefore, by setting a first light-absorbing layer that partially absorbs, for example, blue light emitted by the micro-LED unit, the blue light overflow caused by the direct emission of blue light from the micro-LED device can be reduced. This reduces color shift and poor color purity caused by blue light overflow, thereby improving the uniformity of different colors of light emitted from the micro-LED device and enhancing the color purity of the micro-LED. Furthermore, by setting a third light-filtering layer in the corresponding first and second through holes that only allows, for example, blue light emitted by the micro-LED device to pass through, the third light-filtering layer can be made thicker, thus effectively preventing light other than that emitted by the micro-LED unit from passing through. As described above, after the light emitted by the micro-LED unit is reduced by passing through the first light-absorbing layer, other light different from that emitted by the micro-LED unit can be prevented from mixing and being output from the micro-LED device together with the light emitted by the micro-LED unit that has passed through the first light-absorbing layer, thereby enhancing the color purity of the micro-LED and improving the display effect of the micro-LED device.

[0103] Furthermore, since the first reflective layer 104 covers the photoluminescent material layer, when a portion of the light emitted by the micro-LED unit 2011 leaks out without participating in the excitation of the photoluminescent material layer, the first reflective layer 104 can reflect a portion of the blue light leaking from the first color photoluminescent material layer 1081 (e.g., red) back to the red photoluminescent material layer to re-excite the red photoluminescent material layer. The first reflective layer 104 can also reflect a portion of the blue light leaking from the second color photoluminescent material layer 1082 (e.g., green) back to the green photoluminescent material layer to re-excite the green photoluminescent material layer. This increases the amount of light participating in the excitation of the photoluminescent material layer, thereby increasing the light output of the color corresponding to the photoluminescent material layer, thus improving the brightness of the micro-LED. It also reduces the mixing output of the leaked light with the different colors emitted by the excitation of the photoluminescent material layer, thereby improving the color purity of the micro-LED and ultimately enhancing the display effect of the micro-LED device.

[0104] Regarding the second light-absorbing layer, since the first first through-hole 1021 is aligned with the first third through-hole 1071, and the second first through-hole 1022 is aligned with the second third through-hole 1072, when the second light-absorbing layer is filled in the first first through-hole 1021 and / or the second first through-hole 1022, and when a portion of the blue light emitted by the micro-LED unit corresponding to the first color photoluminescent material layer 1081 and the second color photoluminescent material layer 1082 does not participate in exciting the photoluminescent material layer and leaks through the photoluminescent material layer, the second light-absorbing layer can absorb the leaked portion of blue light. This reduces the mixing output of the leaked portion of blue light with the red and green light emitted by exciting the photoluminescent material layer, thereby improving the color purity of the micro-LED and thus improving the display effect of the micro-LED device.

[0105] Furthermore, regarding the third light-absorbing layer 106, it can partially absorb, for example, blue light emitted by the micro-LED unit 2011 corresponding to the third third through-hole 1073, thereby further reducing blue light overflow caused by the direct emission of blue light from the micro-LED device, thus further improving the display effect of the micro-LED device. Also, since the third light-absorbing layer 106 covers the photoluminescent material layer, when a portion of the blue light emitted by the micro-LED unit corresponding to the photoluminescent material layer leaks through the photoluminescent material layer without participating in the excitation of the photoluminescent material layer, the third light-absorbing layer 106 can absorb this leaked portion of blue light. This reduces the mixing and output of the leaked blue light with the red and green light emitted from the excitation of the photoluminescent material layer, thereby improving the color purity of the micro-LED and thus enhancing the display effect of the micro-LED device.

[0106] Furthermore, regarding the second reflective layer, this second reflective layer is disposed on the second barrier layer, the photoluminescent material layer, and the first light-absorbing layer. The barrier layer can be disposed on the second reflective layer and located between the second reflective layer and the microLED chip. Therefore, the second reflective layer can cover, for example, the first color photoluminescent material layer and the second color photoluminescent material layer. Since the second reflective layer is used to reflect light of the color corresponding to the photoluminescent material layer, light emitted from the microLED unit, for example, blue light, can pass through the second reflective layer. When the blue light emitted by the microLED unit excites, for example, the first color photoluminescent material layer (e.g., red) to emit red light, a portion of the emitted red light will be emitted towards the microLED unit. The second reflective layer can reflect this portion of red light towards the first color photoluminescent material layer (e.g., red), thereby increasing the light output of the color corresponding to the photoluminescent material layer, thus improving the brightness of the microLED and preventing light from escaping towards the microLED chip. The red light emitted in the direction of unit D interferes with the blue light emitted by the micro LED unit. Similarly, when the blue light emitted by the micro LED unit excites a second-color photoluminescent material layer (e.g., green) to emit green light, a portion of the emitted green light will be emitted towards the micro LED unit. The second reflective layer can reflect this portion of green light towards the second-color photoluminescent material layer, thereby increasing the amount of light emitted by the color corresponding to the photoluminescent material layer, thus improving the brightness of the micro LED, and preventing the portion of green light emitted towards the micro LED unit from interfering with the blue light emitted by the micro LED unit.

[0107] It is worth noting that when the first through-hole 1021 is filled with a first filter layer 1031 and the second through-hole 1022 is filled with a second filter layer 1032, the first filter layer 1031 only allows light of a first color, such as red, to pass through, and reflects light of a third color, such as blue, towards the photoluminescent material layer 1081 of the first color, such as red. The second filter layer 1032 only allows light of a second color, such as green, to pass through, and reflects light of a third color, such as blue, towards the photoluminescent material layer 1082 of the second color, such as green. Therefore, the function of the first filter layer 1031 and the second filter layer 1032 is to reflect light other than the corresponding colors, which is different from the light absorption function of the first light-absorbing layer, the second light-absorbing layer, and the third light-absorbing layer.

[0108] This disclosure also provides a miniature LED device.

[0109] like Figures 2-14As shown, the micro-LED device 1 includes a second color conversion structure 11 and a micro-LED chip structure. The micro-LED chip structure includes a micro-LED chip 20, which includes a micro-LED unit array 201 composed of multiple micro-LED units 2011. The second color conversion structure 11 includes a first barrier layer 102, which includes a first through-hole array 1020. The arrangement of the first through-hole array 1020 corresponds to the arrangement of the micro-LED unit array 201. The first through-hole array 1020 includes multiple sets of first through-holes, each set of first through-holes containing... The system includes at least two first through-holes; a first reflective layer 104 disposed below the first partition layer 102 and including a second through-hole array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, the number of second through-holes in each set of second through-holes is less than the number of first through-holes in the corresponding first through-hole set, and the second through-holes in each set of second through-holes correspond to a portion of the first through-holes in the corresponding first through-hole set, the first reflective layer 104 being used to reflect the light emitted by the micro LED unit 2011; and a third filter layer 105, the third filter layer 105 filling the corresponding first through-holes and the first through-holes. In the two through-holes, the third filter layer 105 only allows light emitted by the micro LED unit 2011 to pass through; the second barrier layer 107 is disposed below the first reflective layer 104 and the third filter layer 105 and includes a third through-hole array 1070, which corresponds to the first through-hole array 1020. The third through-hole array 1070 includes multiple sets of third through-holes corresponding to the multiple sets of first through-holes and the multiple sets of second through-holes. The number of third through-holes in each set of third through-holes is the same as the number of first through-holes in each set of first through-holes, and the number of third through-holes in each set of third through-holes corresponds to the number of first through-holes in the first through-holes. The first through-hole in the first through-hole group corresponds to the first through-hole, and the second through-hole in each group of second through-holes corresponds to a portion of the third through-hole in the corresponding third through-hole group; a photoluminescent material layer and a first light-absorbing layer 1083 are provided, wherein the photoluminescent material layer fills the third through-hole in each group of third through-holes that does not have a corresponding second through-hole, and the first light-absorbing layer 1083 fills the third through-hole in each group of third through-holes that corresponds to the second through-hole, wherein the color of the light emitted by the micro-LED unit 2011 is different from the color corresponding to the photoluminescent material layer, and the first light-absorbing layer 1083 is used to partially absorb the light emitted by the micro-LED unit 2011. The second barrier layer 107, the photoluminescent material layer, and the first light-absorbing layer 1083 of the second color conversion structure 11 are disposed on the light-emitting side of the micro-LED chip 20.

[0110] According to embodiments of this disclosure, each group of first through holes includes three first through holes, namely a first first through hole 1021, a second first through hole 1022, and a third first through hole 1023. Each group of second through holes includes one second through hole 1041, which is aligned with the third first through hole 1023. The first reflective layer 104 is used to reflect the third color light emitted by the micro LED unit 2011. The third filter layer 105 fills the aligned third first through hole 1023 and second through hole 1041, and the third filter layer 105 only allows the third color light emitted by the micro LED unit 2011 to pass through. Each group of third through holes includes a first third through hole 1071 aligned with the first first through hole 1021, a second third through hole 1072 aligned with the second first through hole 1022, and a third through hole 1072 aligned with the third first through hole 1023. The third through-hole 1073 is aligned with the second through-hole 1041 aligned with the third first through-hole 1023. The photoluminescent material layer includes a first-color photoluminescent material layer 1081 and a second-color photoluminescent material layer 1082. The first-color photoluminescent material layer 1081 fills the first third through-hole 1071 in each group of third through-holes, and the second-color photoluminescent material layer 1082 fills the second third through-hole 1072 in each group of third through-holes. The first light-absorbing layer 1083 fills the third third through-hole 1073 in each group of third through-holes. The first light-absorbing layer 1083 is used to partially absorb the third-color light emitted by the micro LED unit 2011. The light corresponding to the first color, the light corresponding to the second color, and the light corresponding to the third color are combined to obtain white light.

[0111] According to embodiments of this disclosure, the second color conversion structure 11 further includes at least one of a first filling portion and a second filling portion, wherein: the first filling portion is used to fill the first first through-hole 1021 in each group of first through-holes, and the first filling portion includes a first light filter layer 1031 that allows only light of the first color to pass through, a second light-absorbing layer or a transparent material for partially absorbing light of the third color; the second filling portion is used to fill the second first through-hole 1022 in each group of first through-holes, and the second filling portion includes a second light filter layer 1032 that allows only light of the second color to pass through, a second light-absorbing layer or a transparent material for partially absorbing light of the third color.

[0112] According to an embodiment of this disclosure, when either the first first through hole or the second first through hole in each group of first through holes is not filled, the second color conversion structure 11 further includes a transparent material that fills the unfilled first through hole in the first first through hole or the second first through hole.

[0113] According to embodiments of this disclosure, the first color is red, the second color is green, and the third color is blue.

[0114] According to embodiments of this disclosure, each group of first through holes includes two first through holes, and the second color conversion structure further includes a third filling portion, which fills one of the first through holes in each group of first through holes. The third filling portion includes a fourth filter layer that allows only the fourth color of light to pass through, a second light-absorbing layer for partially absorbing the third color of light, or a transparent material.

[0115] According to embodiments of this disclosure, each group of first through holes includes two first through holes, each group of second through holes includes one second through hole, the second through hole is aligned with the first through hole that is not filled with a third filling portion, the first reflective layer is used to reflect the third color light emitted by the micro LED unit, the third filter layer is filled in the aligned first and second through holes, the third filter layer only allows the light emitted by the micro LED unit to pass through, each group of third through holes includes two third through holes aligned with the two first through holes in the corresponding first through hole group, the second through hole in each group of second through holes is aligned with one third through hole in the corresponding third through hole group, the photoluminescent material layer includes a fourth color photoluminescent material layer, the fourth color photoluminescent material layer is filled in the third through hole in each group of third through holes that is not aligned with the second through hole, and the first light-absorbing layer is filled in the third through hole in each group of third through holes that is aligned with the second through hole, the first light-absorbing layer is used to partially absorb the third color light emitted by the micro LED unit, and the fourth color light and the third color light are combined to obtain white light.

[0116] According to an embodiment of this disclosure, the fourth color is yellow and the third color is blue.

[0117] According to an embodiment of this disclosure, the second color conversion structure 11 further includes a third light-absorbing layer 106, which is disposed below the first reflective layer 104 and the third filter layer 105. The third light-absorbing layer 106 is used to partially absorb the light emitted by the micro LED unit 2011, and the second barrier layer 107 is disposed below the third light-absorbing layer 106.

[0118] According to an embodiment of this disclosure, the second color conversion structure 11 further includes a second reflective layer, which is disposed below the second barrier layer 107, the photoluminescent material layer and the first light-absorbing layer 1083. The second reflective layer is used to reflect light of the color corresponding to the photoluminescent material layer.

[0119] According to an embodiment of this disclosure, the second color conversion structure 11 further includes an isolation layer 109, which is disposed below the second barrier layer 107, the photoluminescent material layer and the first light-absorbing layer 1083, and is disposed on the light-emitting side of the micro LED chip 20.

[0120] According to embodiments of this disclosure, the micro LED chip structure 11 further includes a driver chip, and the side of the micro LED chip 20 opposite to the light-emitting side is disposed on the driver chip. Alternatively, the micro LED chip structure further includes a driver chip and a flexible circuit board, and the side of the micro LED chip 20 opposite to the light-emitting side is disposed on the driver chip to form a micro LED module. The micro LED module is disposed on the flexible circuit board through the driver chip.

[0121] According to embodiments of this disclosure, the materials of the first barrier layer 102 and the second barrier layer 107 include visible light shielding materials; the materials of the first color photoluminescent material layer 1081 and the second color photoluminescent material layer 1082 include at least one of group II-VI quantum dots, group III-V quantum dots, perovskite quantum dots, and carbon quantum dots; the materials of the first light-absorbing layer 1083 and the second light-absorbing layer include organic dyes, nano-absorbing particles, or inorganic oxides for absorbing blue light; the materials of the first light-filtering layer 1031, the second light-filtering layer 1032, and the third light-filtering layer 105 include organic dyes, nano-absorbing particles, or inorganic oxides; and the first reflective layer 104 includes a distributed Bragg reflector film for reflecting light emitted by the micro LED unit 2011.

[0122] It is worth noting that any relevant descriptions of the micro-LED device in the above-mentioned micro-LED device fabrication method (including but not limited to technical features and their functions, explanations, etc.) can be applied to the micro-LED device disclosed herein.

[0123] According to embodiments of this disclosure, the pixel size in a micro-LED device is typically less than 50 micrometers.

[0124] This disclosure also provides a display device including the aforementioned LED device. This display device can be applied to flexible electronic devices to realize technologies such as Augmented Reality (AR), Virtual Reality (VR), Extended Reality (XR), and Mixed Reality (MR). For example, the micro-LED device can be a projection part of an electronic device, such as a projector or head-up display (HUD); or, for example, the micro-LED device can be a display part of an electronic device, such as a smartphone, smartwatch, laptop, tablet, dashcam, navigator, head-mounted device, or any device with a display screen.

[0125] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0126] It should be understood that the phrase "one embodiment" or "an embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of this application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. It should be understood that in the various embodiments of this application, the sequence numbers of the above steps / processes do not imply a sequential order of execution; the execution order of each step / process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application. Moreover, the above embodiment numbers are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0127] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0128] The above description is merely a preferred embodiment of this disclosure and is not intended to limit this disclosure. Various modifications and variations can be made to this disclosure by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.

Claims

1. A method for fabricating a micro LED device, wherein, The method includes: A transparent substrate and a micro LED chip structure are obtained, wherein the micro LED chip structure includes a micro LED chip, and the micro LED chip includes a micro LED unit array composed of multiple micro LED units; A first partition layer is disposed on a transparent substrate, such that the first partition layer includes a first through-hole array, the arrangement of the first through-hole array corresponds to the arrangement of the micro LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, and each set of first through-holes includes at least two first through-holes. A first reflective layer is disposed on a first partition layer, such that the first reflective layer includes a second through-hole array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, the number of second through-holes in each set of second through-holes is less than the number of first through-holes in the corresponding set of first through-holes, and the second through-holes in each set of second through-holes correspond to a portion of the first through-holes in the corresponding set of first through-holes, and the first reflective layer is used to reflect the light emitted by the micro LED unit; A third filter layer is filled into the corresponding first and second through holes, and the third filter layer only allows light emitted by the micro LED unit to pass through; A second barrier layer is disposed on the first reflective layer and the third filter layer, such that the second barrier layer includes a third through-hole array, the third through-hole array corresponding to the first through-hole array, wherein the third through-hole array includes multiple sets of third through-holes corresponding to the multiple sets of first through-holes and the multiple sets of second through-holes, the number of third through-holes in each set of third through-holes is the same as the number of first through-holes in each set of first through-holes, and the third through-holes in each set of third through-holes correspond to the first through-holes in the corresponding first through-hole set, and the second through-holes in each set of second through-holes correspond to a portion of the third through-holes in the corresponding third through-hole set; A photoluminescent material layer is filled in the third through hole in each group of third through holes that does not have a corresponding second through hole, and a first light-absorbing layer is filled in the third through hole in each group of third through holes that corresponds to the second through hole, to obtain a first color conversion structure, wherein the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, and the first light-absorbing layer is used to partially absorb the light emitted by the micro LED unit. The side of the first color conversion structure opposite to the transparent substrate is bonded to the light-emitting side of the micro-LED chip to obtain a micro-LED device.

2. The method for fabricating a micro LED device according to claim 1, wherein, A first partition layer is disposed on a transparent substrate, such that the first partition layer includes a first through-hole array, the arrangement of the first through-hole array corresponding to the arrangement of the micro-LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, each set of first through-holes including at least two first through-holes. The process involves: disposing a first partition layer on the transparent substrate and forming a first through-hole array on the first partition layer, such that the arrangement of the first through-hole array corresponds to the arrangement of the micro-LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, each set of first through-holes including three first through-holes, the three first through-holes including a first first through-hole, a second first through-hole, and a third first through-hole. A first reflective layer is disposed on a first partition layer, such that the first reflective layer includes a second through-hole array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the plurality of sets of first through-holes, the number of second through-holes in each set of second through-holes is less than the number of first through-holes in the corresponding set of first through-holes, and the second through-holes in each set of second through-holes correspond to a portion of the first through-holes in the corresponding set of first through-holes. The first reflective layer is used to reflect light emitted by the micro-LED unit by: disposing the first reflective layer on the first partition layer and forming a second through-hole array on the first reflective layer, such that the second through-hole array includes multiple sets of second through-holes corresponding to the plurality of sets of first through-holes, each set of second through-holes including one second through-hole, the second through-hole being aligned with the third first through-hole, and the first reflective layer being used to reflect light of a third color emitted by the micro-LED unit. A third filter layer is filled into the corresponding first and second through holes. This third filter layer only allows light of a third color emitted by the micro-LED unit to pass through. A second barrier layer is disposed on the first reflective layer and the third filter layer, such that the second barrier layer includes a third via array, the third via array corresponding to the first via array, wherein the third via array includes multiple groups of third vias corresponding to the multiple groups of first vias and multiple groups of second vias, the number of third vias in each group of third vias is the same as the number of first vias in each group of first vias, and the third vias in each group of third vias correspond to the first vias in the corresponding group of first vias, and the second vias in each group of second vias correspond to a portion of the third vias in the corresponding group of third vias. The method includes: setting a second barrier layer on a first reflective layer and a third filter layer, and forming a third through-hole array on the second barrier layer, such that the third through-hole array is aligned with the first through-hole array, wherein the third through-hole array includes multiple sets of third through-holes corresponding to the multiple sets of first through-holes and the multiple sets of second through-holes, each set of third through-holes including a first third through-hole aligned with a first first through-hole, a second third through-hole aligned with a second first through-hole, and a third third through-hole aligned with a third first through-hole, wherein the third third through-hole is aligned with the second through-hole aligned with the third first through-hole. The photoluminescent material layer includes a first-color photoluminescent material layer and a second-color photoluminescent material layer. A photoluminescent material layer is filled in the third through-holes in each group of third through-holes that do not correspond to the second through-hole, and a first light-absorbing layer is filled in the third through-holes in each group of third through-holes corresponding to the second through-hole, resulting in a first color conversion structure. The color of the light emitted by the micro-LED unit is different from the color corresponding to the photoluminescent material layer. The first light-absorbing layer is used to partially absorb the light emitted by the micro-LED unit by: filling the first-color photoluminescent material layer in the first third through-hole in each group of third through-holes, filling the second-color photoluminescent material layer in the second third through-hole in each group of third through-holes, and filling the third third through-hole in each group of third through-holes with the first light-absorbing layer. The first light-absorbing layer is used to partially absorb the third-color light emitted by the micro-LED unit. The light corresponding to the first color, the light corresponding to the second color, and the light corresponding to the third color are combined to obtain white light.

3. The method for fabricating a micro LED device according to claim 2, wherein, Before the first reflective layer is applied to the first barrier layer, the method further includes a first filling step, which includes at least one of the following steps: A first filling portion is filled in the first first through hole in each group of first through holes. The first filling portion includes a first filter layer that allows only light of the first color to pass through, a second light-absorbing layer for partially absorbing light of the third color, or a transparent material. A second filling portion is filled in the second first through hole in each group of first through holes. The second filling portion includes a second filter layer that allows only the second color of light to pass through, a second light-absorbing layer for partially absorbing the third color of light, or a transparent material.

4. The method for fabricating a micro LED device according to claim 3, wherein, The first filling step further includes: When either the first or second through hole in each group of first through holes is not filled, fill the unfilled first through hole with transparent material.

5. The method for fabricating a micro LED device according to claim 1, wherein, Each group of first through holes includes two first through holes. Before the first reflective layer is disposed on the first partition layer, the method further includes: A third filling portion is filled in one of the first through holes in each group of first through holes. The third filling portion includes a fourth filter layer that allows only the fourth color of light to pass through, a second light-absorbing layer for partially absorbing the third color of light, or a transparent material.

6. The method for fabricating a micro LED device according to claim 5, wherein, A first partition layer is disposed on a transparent substrate, such that the first partition layer includes a first through-hole array, the arrangement of the first through-hole array corresponding to the arrangement of the micro-LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, each set of first through-holes including at least two first through-holes. The process involves: disposing a first partition layer on the transparent substrate and forming a first through-hole array on the first partition layer, such that the arrangement of the first through-hole array corresponds to the arrangement of the micro-LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, each set of first through-holes including two first through-holes. A first reflective layer is disposed on a first partition layer, such that the first reflective layer includes a second through-hole array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, the number of second through-holes in each set of second through-holes is less than the number of first through-holes in the corresponding set of first through-holes, and the second through-holes in each set of second through-holes correspond to a portion of the first through-holes in the corresponding set of first through-holes. The first reflective layer is used to reflect the light emitted by the micro-LED unit by: disposing the first reflective layer on the first partition layer and forming a second through-hole array on the first reflective layer, such that the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, each set of second through-holes including one second through-hole, the second through-hole being aligned with the first through-hole without a third filling portion, and the first reflective layer being used to reflect the third color light emitted by the micro-LED unit. Filling the corresponding first and second through holes with a third filter layer, wherein the third filter layer only allows light emitted by the micro-LED unit to pass through, includes: filling the aligned first and second through holes with a third filter layer, wherein the third filter layer only allows light of a third color emitted by the micro-LED unit to pass through. A second barrier layer is disposed on a first reflective layer and a third filter layer, such that the second barrier layer includes a third via array, the third via array corresponding to the first via array. The third via array includes multiple groups of third vias corresponding to the multiple groups of first vias and the multiple groups of second vias. The number of third vias in each group of third vias is the same as the number of first vias in each group of first vias, and the third vias in each group of third vias correspond to the first vias in the corresponding first via group. Furthermore, the second vias in each group of second vias correspond to a portion of the third vias in the corresponding third via group. This includes: disposing a second barrier layer on the first reflective layer and the third filter layer, and forming a third via array on the second barrier layer, such that the third via array corresponds to the first via array. The third via array includes multiple groups of third vias corresponding to the multiple groups of first vias and the multiple groups of second vias. Each group of third vias includes two third vias aligned with two first vias in the corresponding first via group, and the second vias in each group of second vias are aligned with one third via in the corresponding third via group. The photoluminescent material layer includes a fourth color photoluminescent material layer. A photoluminescent material layer is filled in the third through-holes in each group of third through-holes that do not correspond to the second through-hole, and a first light-absorbing layer is filled in the third through-holes in each group of third through-holes that correspond to the second through-hole, resulting in a first color conversion structure. The color of the light emitted by the micro-LED unit is different from the color corresponding to the photoluminescent material layer. The first light-absorbing layer is used to partially absorb the light emitted by the micro-LED unit by: filling the third through-holes in each group of third through-holes that are not aligned with the second through-hole, and filling the third through-holes in each group of third through-holes that are aligned with the second through-hole, with the first light-absorbing layer used to partially absorb the third color light emitted by the micro-LED unit. The fourth color light and the third color light are combined to obtain white light.

7. The method for fabricating a micro LED device according to claim 1, wherein, Before depositing the second barrier layer on the first reflective layer and the third filter layer, the method further includes: depositing a third light-absorbing layer on the first reflective layer and the third filter layer, the third light-absorbing layer being used to partially absorb the light emitted by the micro-LED unit. The provision of a second barrier layer on the first reflective layer and the third filter layer includes: providing a second barrier layer on the third light-absorbing layer.

8. The method for fabricating a micro LED device according to claim 1, wherein, After filling the third through hole in each group of third through holes without a corresponding second through hole with a photoluminescent material layer and filling the third through hole in each group of third through holes corresponding to the second through hole with a first light-absorbing layer, the method further includes: disposing a second reflective layer on the second barrier layer, the photoluminescent material layer and the first light-absorbing layer, wherein the second reflective layer is used to reflect light of the color corresponding to the photoluminescent material layer.

9. The method for fabricating a micro LED device according to claim 1, wherein, After filling the third through-holes in each group of third through-holes without corresponding second through-holes with a photoluminescent material layer and filling the third through-holes in each group of third through-holes corresponding to the second through-holes with a first light-absorbing layer, the method further includes: providing an insulating layer on the second barrier layer, the photoluminescent material layer, and the first light-absorbing layer. Bonding the side of the first color conversion structure opposite to the transparent substrate to the light-emitting side of the microLED chip includes: bonding the insulating layer of the first color conversion structure to the light-emitting side of the microLED chip.

10. The method for fabricating a micro LED device according to claim 1, wherein, After bonding the side of the first color conversion structure opposite to the transparent substrate to the light-emitting side of the microLED chip, the method includes: Remove the transparent substrate of the first color conversion structure to obtain the second color conversion structure.

11. A miniature LED device, wherein, The micro-LED device includes a second color conversion structure and a micro-LED chip structure. The micro-LED chip structure includes a micro-LED chip, and the micro-LED chip includes a micro-LED unit array composed of multiple micro-LED units. The second color conversion structure includes: A first partition layer, the first partition layer includes a first through-hole array, the arrangement of the first through-hole array corresponds to the arrangement of the micro LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, each set of first through-holes includes at least two first through-holes; A first reflective layer is disposed below the first partition layer and includes a second through-hole array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, the number of second through-holes in each set of second through-holes is less than the number of first through-holes in the corresponding set of first through-holes, and the second through-holes in each set of second through-holes correspond to a portion of the first through-holes in the corresponding set of first through-holes. The first reflective layer is used to reflect the light emitted by the micro LED unit. A third filter layer is filled in the corresponding first and second through holes, and the third filter layer only allows light emitted by the micro LED unit to pass through; A second barrier layer is disposed below the first reflective layer and the third filter layer and includes a third through-hole array, which corresponds to the first through-hole array. The third through-hole array includes multiple sets of third through-holes corresponding to the multiple sets of first through-holes and the multiple sets of second through-holes. The number of third through-holes in each set of third through-holes is the same as the number of first through-holes in each set of first through-holes, and the third through-holes in each set of third through-holes correspond to the first through-holes in the corresponding first through-hole set. Furthermore, the second through-holes in each set of second through-holes correspond to a portion of the third through-holes in the corresponding third through-hole set. The microLED chip comprises a photoluminescent material layer and a first light-absorbing layer. The photoluminescent material layer is filled in the third through-holes in each group of third through-holes that do not correspond to the second through-holes. The first light-absorbing layer is filled in the third through-holes in each group of third through-holes that correspond to the second through-holes. The color of the light emitted by the microLED unit is different from the color corresponding to the photoluminescent material layer. The first light-absorbing layer is used to partially absorb the light emitted by the microLED unit. The second barrier layer of the second color conversion structure, the photoluminescent material layer, and the first light-absorbing layer are disposed on the light-emitting side of the microLED chip.

12. The micro LED device according to claim 11, wherein, Each group of first through-holes includes three first through-holes: a first first through-hole, a second first through-hole, and a third first through-hole. Each group of second through-holes includes one second through-hole aligned with the third first through-hole. The first reflective layer reflects the third color light emitted by the micro-LED unit. The third filter layer fills the aligned third first through-hole and second through-hole, allowing only the third color light emitted by the micro-LED unit to pass through. Each group of third through-holes includes a first third through-hole aligned with the first first through-hole, a second third through-hole aligned with the second first through-hole, and a third third through-hole aligned with the third first through-hole. The third through-hole is aligned with the second through-hole aligned with the third first through-hole. The photoluminescent material layer includes a first color photoluminescent material layer and a second color photoluminescent material layer. The first color photoluminescent material layer fills the first third through-hole in each group of third through-holes, the second color photoluminescent material layer fills the second third through-hole in each group of third through-holes, and the first light-absorbing layer fills the third third through-hole in each group of third through-holes. The first light-absorbing layer is used to partially absorb the third color light emitted by the micro LED unit. The light corresponding to the first color, the light corresponding to the second color, and the third color light are combined to obtain white light.

13. The micro LED device according to claim 12, wherein, The second color conversion structure further includes at least one of a first filling portion and a second filling portion, wherein: The first filling portion is used to fill the first first through hole in each group of first through holes. The first filling portion includes a first filter layer that allows only light of the first color to pass through, a second light-absorbing layer for partially absorbing light of the third color, or a transparent material. The second filling portion is used to fill the second first through hole in each group of first through holes. The second filling portion includes a second filter layer that only allows light of the second color to pass through, a second light-absorbing layer for partially absorbing light of the third color, or a transparent material.

14. The micro LED device according to claim 13, wherein, When either the first or second first through hole in each group of first through holes is not filled, the second color conversion structure further includes a transparent material that fills the unfilled first through hole in the first or second first through hole.

15. The micro LED device according to claim 13, wherein, The first color is red, the second color is green, and the third color is blue.

16. The micro LED device according to claim 11, wherein, Each group of first through holes includes two first through holes, and the second color conversion structure also includes a third filling part, which fills one of the first through holes in each group of first through holes. The third filling part includes a fourth filter layer that allows only the fourth color of light to pass through, a second light-absorbing layer for partially absorbing the third color of light, or a transparent material.

17. The micro LED device according to claim 16, wherein, Each group of first through holes includes two first through holes, and each group of second through holes includes one second through hole. The second through hole is aligned with the first through hole that is not filled with the third filling portion. The first reflective layer is used to reflect the third color light emitted by the micro LED unit. The third filter layer is filled in the aligned first and second through holes. The third filter layer only allows the light emitted by the micro LED unit to pass through. Each group of third through holes includes two third through holes that are aligned with the two first through holes in the corresponding first through hole group. The second through hole in each group of second through holes is aligned with one third through hole in the corresponding third through hole group. The photoluminescent material layer includes a fourth color photoluminescent material layer. The fourth color photoluminescent material layer is filled in the third through hole in each group of third through holes that is not aligned with the second through hole. The first light-absorbing layer is filled in the third through hole in each group of third through holes that is aligned with the second through hole. The first light-absorbing layer is used to partially absorb the third color light emitted by the micro LED unit. The fourth color light and the third color light are combined to obtain white light.

18. The micro LED device according to claim 17, wherein, The fourth color is yellow and the third color is blue.

19. The micro LED device according to claim 11, wherein, The second color conversion structure further includes a third light-absorbing layer, which is disposed below the first reflective layer and the third filter layer. The third light-absorbing layer is used to partially absorb the light emitted by the micro LED unit, and the second barrier layer is disposed below the third light-absorbing layer.

20. The micro LED device according to claim 11, wherein, The second color conversion structure further includes a second reflective layer, which is disposed below the second barrier layer, the photoluminescent material layer and the first light-absorbing layer. The second reflective layer is used to reflect light of the color corresponding to the photoluminescent material layer.

21. The micro LED device according to claim 11, wherein, The second color conversion structure further includes an isolation layer, which is disposed below the second barrier layer, the photoluminescent material layer and the first light-absorbing layer, and is disposed on the light-emitting side of the micro LED chip.

22. The micro LED device according to claim 11, wherein, The micro LED chip structure also includes a driver chip, with one side of the micro LED chip opposite to the light-emitting side disposed on the driver chip. Alternatively, the micro LED chip structure may further include a driver chip and a flexible circuit board. The side of the micro LED chip opposite to the light-emitting side is disposed on the driver chip to form a micro LED module, and the micro LED module is disposed on the flexible circuit board through the driver chip.

23. The micro LED device according to claim 13, wherein, The materials of the first barrier layer and the second barrier layer include visible light shielding materials; the materials of the first color photoluminescent material layer and the second color photoluminescent material layer include at least one of group II-VI quantum dots, group III-V quantum dots, perovskite quantum dots, and carbon quantum dots; the materials of the first light-absorbing layer and the second light-absorbing layer include organic dyes, nano-absorbing particles, or inorganic oxides for absorbing blue light; the materials of the first filter layer, the second filter layer, and the third filter layer include organic dyes, nano-absorbing particles, or inorganic oxides; and the first reflective layer includes a distributed Bragg reflector film for reflecting light emitted by the micro LED unit.

24. A display device, wherein, The display device includes the micro LED device according to any one of claims 11 to 23.

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