Miniature LED device preparation method, miniature LED device and display device

Abstract

The invention provides a miniature LED device preparation method, a miniature LED device and a display device. The method comprises the following steps: obtaining a first transparent substrate, a micro LED chip and a light absorption structure comprising a first light absorption layer, wherein the first light absorption layer is used for partially absorbing light emitted by a micro LED unit; a first partition layer is arranged on the first transparent substrate, the arrangement of a first through hole array included in the first partition layer corresponds to the arrangement of a micro LED unit array of the micro LED chip, the first through hole array comprises a plurality of groups of first through holes, and each group of first through holes comprises at least two first through holes; filling each group of first through holes with a photoluminescent material layer to obtain a color conversion structure; and arranging the first light absorption layer of the light absorption structure on the first transparent substrate, and bonding one side, opposite to the first transparent substrate, of the color conversion structure with the light emitting side of the micro LED chip to obtain the micro LED device.

Description

Technical Field

[0001] The present disclosure relates to the technical field of semiconductor Micro LED, and in particular, to a method for preparing a Micro LED device, a Micro LED device and a display device. Background Art

[0002] Micro-LED is a comprehensive technology that integrates new display technology and light-emitting diode (LED) technology. It has the advantages of small size, high brightness, high resolution, and low power consumption. It is considered to be one of the most promising next-generation new display and light-emitting devices. Currently, Micro LED full-color display can be achieved in a variety of ways, one of which is the color conversion method. However, the full-color Micro LED device achieved by the color conversion method still has problems such as unsatisfactory display effects. Summary of the invention

[0003] The solution disclosed herein provides a method for preparing a micro LED device, a micro LED device, and a display device.

[0004] According to one aspect of an embodiment of the present disclosure, a method for preparing a micro LED device is provided, wherein the method comprises: obtaining a first transparent substrate, a micro LED chip structure and a light absorption structure, wherein the micro LED chip structure comprises a micro LED chip, the micro LED chip comprises a micro LED unit array composed of a plurality of micro LED units, the light absorption structure comprises a first light absorption layer, and the first light absorption layer is used to partially absorb the light emitted by the micro LED unit; a first barrier layer is arranged on the first transparent substrate, so that the first barrier layer comprises a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array comprises a plurality of groups of first through holes, each group of first through holes comprises at least two first through holes; a photoluminescent material layer is filled in each group of first through holes to obtain a color conversion structure, wherein the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer; the first light absorption layer of the light absorption structure is arranged on the first transparent substrate, and a side of the color conversion structure opposite to the first transparent substrate is bonded to a light emitting side of the micro LED chip to obtain a micro LED device.

[0005] Further, disposing the first light absorption layer of the light absorption structure on the first transparent substrate includes: disposing the first light absorption layer of the light absorption structure on the first transparent substrate of the color conversion structure.

[0006] Furthermore, the first light absorption layer of the light absorption structure is arranged on the first transparent substrate, and the side of the color conversion structure opposite to the first transparent substrate is bonded to the light emitting side of the micro LED chip, including: the first light absorption layer of the light absorption structure is arranged on the first transparent substrate of the color conversion structure; the side of the color conversion structure opposite to the first transparent substrate is bonded to the light emitting side of the micro LED chip.

[0007] Furthermore, the first light absorption layer of the light absorption structure is arranged on the first transparent substrate, and the side of the color conversion structure opposite to the first transparent substrate is bonded to the light emitting side of the micro LED chip, including: bonding the side of the color conversion structure opposite to the first transparent substrate to the light emitting side of the micro LED chip; and arranging the first light absorption layer of the light absorption structure on the first transparent substrate of the color conversion structure.

[0008] Furthermore, the light absorption structure further includes a second transparent substrate, and the first light absorption layer is arranged on the second transparent substrate.

[0009] Furthermore, before the first barrier layer is provided on the first transparent substrate, the method further comprises: providing a second barrier layer on the first transparent substrate, so that the second barrier layer comprises a second through hole array, the arrangement of the second through hole array corresponds to the arrangement of the micro LED unit array, wherein the second through hole array comprises a plurality of groups of second through holes, each group of second through holes comprises three second through holes, and the three second through holes comprise a first second through hole, a second second through hole and a third second through hole; a first filling step, wherein a first intermediate structure is obtained when the first filling step is completed, and the first filling step comprises at least one of the following steps: the first second through hole in each group of second through holes is filled with a plurality of second through holes, each group of second through holes comprises three second through holes, and the three second through holes comprise a first second through hole, a second second through hole and a third second through hole; A first filling portion is filled in the through hole, wherein the first filling portion includes a first filter layer that only allows light of the first color to pass through, and a second light absorbing layer or a transparent material for partially absorbing light of the third color; a second filling portion is filled in the second second through hole in each group of second through holes, wherein the second filling portion includes a second filter layer that only allows light of the second color to pass through, and a second light absorbing layer or a transparent material for partially absorbing light of the third color; a third filling portion is filled in the third second through hole in each group of second through holes, wherein the third filling portion includes a third filter layer that only allows light of the third color to pass through, and a second light absorbing layer or a transparent material for partially absorbing light of the third color.

[0010] Furthermore, the first filling step further comprises: when there are unfilled second through holes in each group of second through holes, filling the unfilled second through holes with a transparent material.

[0011] Further, each group of first through holes includes three first through holes, and a first barrier layer is arranged on the first transparent substrate so that the first barrier layer includes a first through hole array, and the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes multiple groups of first through holes, and each group of first through holes includes at least two first through holes, including: a first barrier layer is arranged on the first intermediate structure, and a first through hole array is opened on the first barrier layer so that the first through hole array is aligned with the second through hole array, and the first through hole array exposes the first intermediate structure, wherein the first through hole array includes multiple groups of first through holes corresponding to the multiple groups of second through holes, and each group of first through holes includes a first first through hole aligned with the first second through hole, a second first through hole aligned with the second second through hole, and a third first through hole aligned with the third second through hole. The photoluminescent material layer includes a photoluminescent material layer of a first color and a photoluminescent material layer of a second color. The photoluminescent material layer is filled in each group of first through holes to obtain a color conversion structure, wherein the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, including: filling the first first through hole in each group of first through holes with a photoluminescent material layer of the first color, and filling the second first through hole in each group of first through holes with a photoluminescent material layer of the second color, wherein the micro LED unit emits light of a third color, and the light corresponding to the first color, the light corresponding to the second color, and the light of the third color are synthesized to obtain white light.

[0012] Further, before the first barrier layer is provided on the first transparent substrate, the method further includes: providing a second barrier layer on the first transparent substrate, so that the second barrier layer includes a second through hole array, the arrangement of the second through hole array corresponds to the arrangement of the micro LED unit array, wherein the second through hole array includes a plurality of groups of second through holes, each group of second through holes includes two second through holes; a second filling step, a second intermediate structure is obtained when the second filling step is completed, and the second filling step includes at least one of the following steps: filling a fourth filling part in a second through hole in each group of second through holes, the fourth filling part including a fourth filter layer that only allows light of a fourth color to pass through, a second light absorbing layer or a transparent material for partially absorbing light of a third color; filling a fifth filling part in another second through hole in each group of second through holes, the fifth filling part including a third filter layer that only allows light of a third color to pass through, a second light absorbing layer or a transparent material for partially absorbing light of the third color.

[0013] Furthermore, the second filling step further comprises: when there are unfilled second through holes in each group of second through holes, filling the unfilled second through holes with a transparent material.

[0014] Further, a first barrier layer is arranged on the first transparent substrate, so that the first barrier layer includes a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes multiple groups of first through holes, and each group of first through holes includes at least two first through holes, including: a first barrier layer is arranged on the second intermediate structure, and a first through hole array is opened on the first barrier layer, so that the first through hole array is aligned with the second through hole array, and the first through hole array exposes the second intermediate structure, wherein the first through hole array includes multiple groups of first through holes corresponding to the multiple groups of second through holes, and each group of first through holes includes two first through holes respectively aligned with two second through holes. The photoluminescent material layer includes a photoluminescent material layer of a fourth color, and the photoluminescent material layer is filled in each group of first through holes to obtain a color conversion structure, wherein the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer. The method includes: in each group of first through holes, a photoluminescent material layer of the fourth color is filled in a first through hole above a second through hole used to fill a fourth filling portion, wherein the micro LED unit emits light of a third color, and white light is obtained by synthesizing the light corresponding to the fourth color and the light of the third color.

[0015] Furthermore, when filling the photoluminescent material layer in each group of first through holes, the method also includes: filling a sixth filling part in the first through holes other than the first through holes filled with the photoluminescent material layer in each group of first through holes, the sixth filling part comprising a third light absorbing layer or a transparent material, and the third light absorbing layer is used to partially absorb the light emitted by the micro LED unit.

[0016] Furthermore, after the sixth filling part is filled in the first through holes other than the first through holes filled with the photoluminescent material layer in each group of first through holes, the method further includes: providing a first reflective layer on the first barrier layer, the photoluminescent material layer and the sixth filling part, wherein the first reflective layer is used to reflect light of a color corresponding to the photoluminescent material layer.

[0017] After filling the sixth filling part in the first through holes other than the first through holes filled with the photoluminescent material layer in each group of first through holes, the method further includes: providing an insulating layer on the first barrier layer, the photoluminescent material layer and the sixth filling part. Bonding the side of the color conversion structure opposite to the first transparent substrate to the light emitting side of the micro LED chip includes: bonding the insulating layer of the color conversion structure to the light emitting side of the micro LED chip.

[0018] According to another aspect of the present disclosure, a micro LED device is also provided.

[0019] The micro LED device comprises a color conversion structure, a micro LED chip structure and a light absorption structure, wherein the micro LED chip structure comprises a micro LED chip, wherein the micro LED chip comprises a micro LED unit array composed of a plurality of micro LED units, wherein the light absorption structure comprises a first light absorption layer, wherein the first light absorption layer is used to partially absorb the light emitted by the micro LED unit, wherein the color conversion structure comprises: a first transparent substrate; a first barrier layer, wherein the first barrier layer is arranged under the first transparent substrate, wherein the first barrier layer comprises a first through hole array, wherein the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array comprises a plurality of groups of first through holes, wherein each group of first through holes comprises at least two first through holes; and a photoluminescent material layer, wherein the photoluminescent material layer is filled in each group of first through holes, wherein the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer. The first light absorption layer of the light absorption structure is arranged on the first transparent substrate of the color conversion structure, and the side of the color conversion structure opposite to the first transparent substrate is arranged on the light emitting side of the micro LED chip.

[0020] Furthermore, the light absorption structure further includes a second transparent substrate, and the first light absorption layer is arranged on the second transparent substrate.

[0021] Further, the color conversion structure also includes a second barrier layer, which is arranged under the first transparent substrate and includes a second through hole array, the arrangement of the second through hole array corresponds to the arrangement of the micro LED unit array, wherein the second through hole array includes multiple groups of second through holes, each group of second through holes includes three second through holes, and the three second through holes include a first second through hole, a second second through hole and a third second through hole. The color conversion structure further includes at least one of a first filling portion, a second filling portion and a third filling portion, wherein: the first filling portion is used to fill the first second through hole in each group of second through holes, the first filling portion includes a first filter layer that only allows light of the first color to pass through, a second light absorbing layer or a transparent material that partially absorbs light of the third color; the second filling portion is used to fill the second second through hole in each group of second through holes, the second filling portion includes a second filter layer that only allows light of the second color to pass through, a second light absorbing layer or a transparent material that partially absorbs light of the third color; the third filling portion is used to fill the third second through hole in each group of second through holes, the third filling portion includes a third filter layer that only allows light of the third color to pass through, a second light absorbing layer or a transparent material that partially absorbs light of the third color.

[0022] Further, when there are unfilled second through holes in each group of second through holes, the color conversion structure further includes a transparent material, and the transparent material is filled in the unfilled second through holes.

[0023] Further, each group of first through holes includes three first through holes, the first barrier layer is arranged under the second barrier layer, the first through hole array is aligned with the second through hole array, wherein the first through hole array includes multiple groups of first through holes corresponding to the multiple groups of second through holes, each group of first through holes includes a first first through hole aligned with the first second through hole, a second first through hole aligned with the second second through hole, and a third first through hole aligned with the third second through hole, the photoluminescent material layer includes a photoluminescent material layer of a first color and a photoluminescent material layer of a second color, the photoluminescent material layer of the first color is filled in the first first through hole in each group of first through holes, and the photoluminescent material layer of the second color is filled in the second first through hole in each group of first through holes, wherein the micro LED unit emits light of a third color, and the light corresponding to the first color, the light corresponding to the second color, and the light of the third color are synthesized to obtain white light.

[0024] Further, the first color is red, the second color is green and the third color is blue.

[0025] Further, the color conversion structure further comprises a second barrier layer, the second barrier layer is arranged under the first transparent substrate and comprises a second through hole array, the second barrier layer comprises a second through hole array, the arrangement of the second through hole array corresponds to the arrangement of the micro LED unit array, wherein the second through hole array comprises a plurality of groups of second through holes, each group of second through holes comprises two second through holes. The color conversion structure further comprises at least one of a fourth filling part and a fifth filling part, wherein: the fourth filling part is filled in one second through hole in each group of second through holes, the fourth filling part comprises a fourth filter layer that only allows light of a fourth color to pass through, a second light absorbing layer or a transparent material for partially absorbing light of a third color; the fifth filling part is filled in another second through hole in each group of second through holes, the fifth filling part comprises a third filter layer that only allows light of a third color to pass through, a second light absorbing layer or a transparent material for partially absorbing light of a third color.

[0026] Further, when there are unfilled second through holes in each group of second through holes, the color conversion structure further includes a transparent material, and the transparent material is filled in the unfilled second through holes.

[0027] Further, the first barrier layer is arranged below the second barrier layer, the first barrier layer includes a first through hole array, the first through hole array is aligned with the second through hole array, wherein the first through hole array includes multiple groups of first through holes corresponding to the multiple groups of second through holes, each group of first through holes includes two first through holes respectively aligned with two second through holes, the photoluminescent material layer includes a photoluminescent material layer of a fourth color, the photoluminescent material layer of the fourth color is filled in the first through hole below the second through hole for filling the fourth filling part, wherein the micro LED unit emits light of a third color, and the light corresponding to the fourth color and the light of the third color are synthesized to obtain white light.

[0028] Further, the fourth color is yellow and the third color is blue.

[0029] Furthermore, the color conversion structure also includes a sixth filling portion, which fills the first through hole other than the first through hole filled with the photoluminescent material layer in each group of first through holes, and the sixth filling portion includes a third light absorbing layer or a transparent material, and the third light absorbing layer is used to partially absorb the light emitted by the micro LED unit.

[0030] Furthermore, the color conversion structure further includes a first reflective layer, which is disposed below the first barrier layer, the photoluminescent material layer and the sixth filling portion, and is used to reflect light of a color corresponding to the photoluminescent material layer.

[0031] Furthermore, the color conversion structure further includes an insulating layer, which is disposed below the first barrier layer, the photoluminescent material layer and the sixth filling portion, and the insulating layer of the color conversion structure is disposed on the light emitting side of the micro LED chip.

[0032] Furthermore, the micro LED chip structure also includes a driver chip, and the side of the micro LED chip opposite to the light emitting side is arranged on the driver chip, or the micro LED chip structure also includes a driver chip and a flexible circuit board, and the side of the micro LED chip opposite to the light emitting side is arranged on the driver chip to form a micro LED module, and the micro LED module is arranged on the flexible circuit board through the driver chip.

[0033] Further, the material of the first barrier layer and the material of the second barrier layer include visible light shielding materials, the material of the first color photoluminescent material layer and the material of the second color photoluminescent material layer include at least one of II-VI group quantum dots, III-V group quantum dots, perovskite quantum dots and carbon quantum dots, the material of the first light absorption layer and the material of the second light absorption layer include organic dyes, nano absorption particles or inorganic oxides for absorbing blue light, and the material of the first filter layer, the material of the second filter layer and the material of the third filter layer include organic dyes, nano absorption particles or inorganic oxides.

[0034] According to another aspect of the embodiments of the present disclosure, a display device is provided, comprising a micro LED device prepared by the above method.

[0035] By applying the technical solution disclosed in the present invention, a transparent substrate, a micro LED chip and a light absorption structure are obtained, a first barrier layer is arranged on the transparent substrate, each group of first through holes included in the first barrier layer includes at least two first through holes, a photoluminescent material layer is filled in each group of first through holes to form a color conversion structure, the first light absorption layer of the light absorption structure is arranged on the first transparent substrate, and the side of the color conversion structure opposite to the first transparent substrate is bonded to the light emitting side of the micro LED chip to obtain a micro LED device.

[0036] On the one hand, in the micro LED device, the light emitted by the micro LED unit of the micro LED chip excites the material in the photoluminescent material layer to emit light of a color different from that of the light emitted by the micro LED unit. Since the first light absorbing layer can partially absorb the light emitted by the micro LED unit, the light emitted by the micro LED unit that does not correspond to the photoluminescent material layer does not pass through the photoluminescent material layer and is directly emitted from the micro LED device. The light overflow is reduced, thereby reducing the color deviation and poor color purity caused by the light overflow, thereby improving the balance of light of different colors emitted from the micro LED device, improving the color purity of the micro LED, and thereby improving the display effect of the micro LED device.

[0037] On the other hand, since the first light absorption layer covers the photoluminescent material layer, when a portion of the light emitted by the micro LED unit corresponding to the photoluminescent material layer does not participate in the excitation of the photoluminescent material layer and leaks out through the photoluminescent material layer, the first light absorption layer can absorb the leaked part of the light, thereby reducing the mixed output of the leaked part of the light and the different color lights emitted by the exciting photoluminescent material layer, thereby improving the color purity of the micro LED, thereby improving the display effect of the micro LED device. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] By reading the detailed description below with reference to the accompanying drawings, the above and other purposes, features and advantages of the exemplary embodiments of the present disclosure will become readily understood. In the accompanying drawings, several embodiments of the present disclosure are shown in an exemplary and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0039] Figure 1 is a flow chart showing a method for preparing a micro LED device according to one embodiment of the present disclosure;

[0040] Figures 2 to 12 is a schematic diagram showing a preparation process flow of a method for preparing a micro LED device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0041] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present disclosure will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0042] It should be noted that the following detailed descriptions are illustrative and are intended to provide further explanation of the present application. Unless otherwise specified, all technical and scientific terms used herein have the same meanings as those commonly understood by those skilled in the art to which the present application belongs.

[0043] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" may include both "above" and "below". The device may also be positioned in other different ways, rotated 90 degrees or in other orientations, and the spatially relative descriptions used herein are interpreted accordingly.

[0044] Now, exemplary embodiments according to the present disclosure will be described in more detail with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in a variety of different forms and should not be construed as being limited to the embodiments described herein. It should be understood that these embodiments are provided to make the disclosure of the present application thorough and complete, and to fully convey the concepts of these exemplary embodiments to those of ordinary skill in the art. In the accompanying drawings, for clarity, the thickness of the layers and regions is enlarged, and the same reference numerals are used to represent the same devices, and thus their descriptions will be omitted.

[0045] The present invention provides a method for preparing a micro LED device. Figures 1 to 12 , Figure 1 is a flow chart showing a method for preparing a micro LED device according to one embodiment of the present disclosure; Figures 2 to 12 is a schematic diagram showing a preparation process flow of a method for preparing a micro LED device according to an embodiment of the present disclosure.

[0046] like Figure 1 As shown, the method for preparing a micro LED device includes the following steps S101-S104.

[0047] Step S101: Obtain a first transparent substrate, a micro LED chip structure and a light absorption structure, wherein the micro LED chip structure includes a micro LED chip, the micro LED chip includes a micro LED unit array composed of a plurality of micro LED units, and the light absorption structure includes a first light absorption layer, and the first light absorption layer is used to partially absorb the light emitted by the micro LED unit.

[0048] Step S102: Disposing a first barrier layer on the first transparent substrate, so that the first barrier layer includes a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes multiple groups of first through holes, and each group of first through holes includes at least two first through holes.

[0049] Step S103: Filling a photoluminescent material layer in each group of first through holes to obtain a color conversion structure, wherein the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer.

[0050] Step S104: disposing the first light absorption layer of the light absorption structure on the first transparent substrate, and bonding the side of the color conversion structure opposite to the first transparent substrate to the light emitting side of the micro LED chip to obtain a micro LED device.

[0051] According to the technical solution, a color conversion structure can be formed by obtaining a transparent substrate, a micro LED chip and a light absorption structure, arranging a first barrier layer on the transparent substrate, each group of first through holes included in the first barrier layer includes at least two first through holes, and filling a photoluminescent material layer in each group of first through holes, and arranging the first light absorption layer of the light absorption structure on the first transparent substrate, and bonding the side of the color conversion structure opposite to the first transparent substrate to the light emitting side of the micro LED chip to obtain a micro LED device.

[0052] On the one hand, in the micro LED device, the light emitted by the micro LED unit of the micro LED chip excites the material in the photoluminescent material layer to emit light of a color different from that of the light emitted by the micro LED unit. Since the first light absorbing layer can partially absorb the light emitted by the micro LED unit, the light emitted by the micro LED unit that does not correspond to the photoluminescent material layer does not pass through the photoluminescent material layer and is directly emitted from the micro LED device. The light overflow is reduced, thereby reducing the color deviation and poor color purity caused by the light overflow, thereby improving the balance of light of different colors emitted from the micro LED device, improving the color purity of the micro LED, and thereby improving the display effect of the micro LED device.

[0053] On the other hand, since the first light absorption layer covers the photoluminescent material layer, when a portion of the light emitted by the micro LED unit corresponding to the photoluminescent material layer does not participate in the excitation of the photoluminescent material layer and leaks out through the photoluminescent material layer, the first light absorption layer can absorb the leaked part of the light, thereby reducing the mixed output of the leaked part of the light and the different color lights emitted by the exciting photoluminescent material layer, thereby improving the color purity of the micro LED, thereby improving the display effect of the micro LED device.

[0054] In step S101, a first transparent substrate, a micro LED chip structure and a light absorption structure can be obtained, wherein the micro LED chip structure includes a micro LED chip, the micro LED chip includes a micro LED unit array composed of a plurality of micro LED units, and the light absorption structure includes a first light absorption layer, and the first light absorption layer is used to partially absorb the light emitted by the micro LED unit.

[0055] According to the embodiments of the present disclosure, a first transparent substrate, a micro LED chip structure and a light absorption structure can be first obtained. The first transparent substrate can include any applicable substrate such as a glass substrate, a polyimide substrate or a sapphire substrate. The micro LED chip structure includes a micro LED chip, and the micro LED chip includes a micro LED unit array for emitting light. Among them, the micro LED chip can be any micro LED chip suitable for preparing a micro LED device, for example, the structure of the micro LED chip can include a face-up structure, a flip-chip structure or a vertical structure, etc., which is not limited here. Each micro LED unit in the micro LED unit array can include an exposed first semiconductor layer on its light-emitting side. According to the type of micro LED device, in some embodiments, the first semiconductor layer can include an N-GaN layer; in other embodiments, the first semiconductor layer can include a P-GaN layer. The light absorption structure can include a first light absorption layer, which is used to partially absorb the light emitted by the micro LED unit, and the material of the first light absorption layer can include an organic dye, nano absorption particles or inorganic oxides for absorbing, for example, blue light, for example, zinc oxide nanoparticle photoresist. In addition, the light absorption structure may further include a second transparent substrate, the first light absorption layer is disposed on the second transparent substrate, and the second transparent substrate may include any applicable substrate such as a glass substrate, a polyimide substrate or a sapphire substrate. It is worth noting that the micro LED chip structure and the light absorption structure may also be obtained in any step before the subsequent step of using the micro LED chip structure and the light absorption structure.

[0056] Reference Figure 2-Figure 12 ,in Figure 2 FIG. 1 shows a side view of a first transparent substrate 101 according to an embodiment of the present disclosure. Figure 2 As shown, the first transparent substrate 101 may be, for example, a glass substrate.

[0057] Reference Figure 2-Figure 12 ,in Figure 3 FIG. 4 shows a side view of a micro LED chip structure according to an embodiment of the present disclosure. Figure 3 As shown, the micro LED chip structure includes a micro LED chip 20, and the micro LED chip 20 includes a micro LED unit array 201 composed of micro LED units 2011. Each micro LED unit 2011 in the micro LED unit array 201 includes a first semiconductor layer 20111 such as an N-GaN layer on the light emitting side. Figure 3 As shown, the first semiconductor layer 20111 is common to each micro LED unit 2011 in the micro LED unit array 201 , that is, the first semiconductor layer 20111 is integrated in the micro LED chip 20 .

[0058] Reference Figure 2-Figure 12 ,in Figure 4 FIG. 4 shows a side view of a light absorbing structure according to an embodiment of the present disclosure. Figure 4 As shown, the light absorption structure 102 includes a second transparent substrate 1021 and a first light absorption layer 1022 disposed on the second transparent substrate 1021 .

[0059] In step S102, a first barrier layer may be provided on the first transparent substrate, so that the first barrier layer includes a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes a plurality of groups of first through holes, and each group of first through holes includes at least two first through holes.

[0060] According to an embodiment of the present disclosure, after obtaining a first transparent substrate, a first barrier layer can be provided on the first transparent substrate, the first barrier layer can function as a grid, and the interior of the grid can be filled with a corresponding material. In some embodiments, the first barrier layer can include a visible light shielding material, which can include, for example, a matte material such as black photoresist, a reflective material such as a metal layer, etc.

[0061] According to an embodiment of the second barrier layer of the present disclosure, before the first barrier layer is arranged on the first transparent substrate, the method further includes: arranging the second barrier layer on the first transparent substrate, so that the second barrier layer includes a second through hole array, the arrangement of the second through hole array corresponds to the arrangement of the micro LED unit array, wherein the second through hole array includes a plurality of groups of second through holes, each group of second through holes includes three second through holes, and the three second through holes include a first second through hole, a second second through hole and a third second through hole; a first filling step, when the first filling step is completed, a first intermediate structure is obtained, and the first filling step includes at least one of the following steps: in each group of second through holes A first filling portion is filled in the first second through hole of each group of second through holes, wherein the first filling portion includes a first filter layer that only allows light of the first color to pass through, and a second light absorbing layer or a transparent material for partially absorbing light of the third color; a second filling portion is filled in the second second through hole in each group of second through holes, wherein the second filling portion includes a second filter layer that only allows light of the second color to pass through, and a second light absorbing layer or a transparent material for partially absorbing light of the third color; a third filling portion is filled in the third second through hole in each group of second through holes, wherein the third filling portion includes a third filter layer that only allows light of the third color to pass through, and a second light absorbing layer or a transparent material for partially absorbing light of the third color.

[0062] Furthermore, the first filling step further comprises: when there are unfilled second through holes in each group of second through holes, filling the unfilled second through holes with a transparent material.

[0063] Further, each group of first through holes includes three first through holes, and a first barrier layer is arranged on the first transparent substrate so that the first barrier layer includes a first through hole array, and the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes multiple groups of first through holes, and each group of first through holes includes at least two first through holes, including: a first barrier layer is arranged on the first intermediate structure, and a first through hole array is opened on the first barrier layer so that the first through hole array is aligned with the second through hole array, and the first through hole array exposes the first intermediate structure, wherein the first through hole array includes multiple groups of first through holes corresponding to the multiple groups of second through holes, and each group of first through holes includes a first first through hole aligned with the first second through hole, a second first through hole aligned with the second second through hole, and a third first through hole aligned with the third second through hole.

[0064] In this embodiment, the light of the first color refers to the light of the wavelength range corresponding to the first color, the light of the second color refers to the light of the wavelength range corresponding to the second color, and the light of the third color refers to the light of the wavelength range corresponding to the third color. The first color, the second color and the third color can be three primary colors, for example, the first color is red, the second color is green and the third color is blue. The material of the second barrier layer includes a visible light shielding material, which can include, for example, a matting material such as black photoresist, a reflective material such as a metal layer. The material of the second light absorbing layer includes an organic dye, nano absorption particles or an inorganic oxide for absorbing, for example, blue light, such as zinc oxide nanoparticle photoresist. The material of the first filter layer, the material of the second filter layer and the material of the third filter layer include an organic dye, nano absorption particles or an inorganic oxide.

[0065] According to another embodiment of the second barrier layer of the present disclosure, before the first barrier layer is arranged on the first transparent substrate, the method further includes: arranging the second barrier layer on the first transparent substrate, so that the second barrier layer includes a second through hole array, the arrangement of the second through hole array corresponds to the arrangement of the micro LED unit array, wherein the second through hole array includes a plurality of groups of second through holes, each group of second through holes includes two second through holes; a second filling step, when the second filling step is completed, a second intermediate structure is obtained, and the second filling step includes at least one of the following steps: filling a fourth filling part in one second through hole in each group of second through holes, the fourth filling part includes a fourth filter layer that only allows light of a fourth color to pass through, a second light absorbing layer or a transparent material for partially absorbing light of a third color; filling a fifth filling part in another second through hole in each group of second through holes, the fifth filling part includes a third filter layer that only allows light of a third color to pass through, a second light absorbing layer or a transparent material for partially absorbing light of the third color.

[0066] Furthermore, the second filling step further comprises: when there are unfilled second through holes in each group of second through holes, filling the unfilled second through holes with a transparent material.

[0067] Further, a first barrier layer is arranged on the first transparent substrate, so that the first barrier layer includes a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes multiple groups of first through holes, and each group of first through holes includes at least two first through holes, including: a first barrier layer is arranged on the second intermediate structure, and a first through hole array is opened on the first barrier layer, so that the first through hole array is aligned with the second through hole array, and the first through hole array exposes the second intermediate structure, wherein the first through hole array includes multiple groups of first through holes corresponding to the multiple groups of second through holes, and each group of first through holes includes two first through holes respectively aligned with two second through holes.

[0068] In this embodiment, the light of the fourth color refers to the light of the wavelength range corresponding to the fourth color, the fourth color is yellow light and the third color is blue. The material of the second barrier layer includes a visible light shielding material, which can include, for example, a black photoresist or other extinction material, a metal layer or other reflective material. The material of the second light absorption layer includes an organic dye, nano absorption particles or an inorganic oxide for absorbing, for example, blue light, such as zinc oxide nanoparticle photoresist. The material of the fourth filter layer includes an organic dye, nano absorption particles or an inorganic oxide.

[0069] Reference Figure 2-Figure 12 ,in Figure 5FIG. 1 shows a side view of a second barrier layer 103 disposed on the first transparent substrate 101. Figure 5 As shown, the second barrier layer 103 may be, for example, a black photoresist layer, so a black photoresist layer may be coated on a transparent substrate 101 such as a glass substrate by spin coating, and then, for example, a second through hole array 1030 may be opened on the black photoresist layer by photolithography, so that the arrangement of the second through hole array 1030 corresponds to the arrangement of the micro LED unit array 201 to be used later and exposes the first transparent substrate 101, wherein the second through hole array 1030 includes a plurality of groups of second through holes, each group of second through holes includes a first second through hole 1031, a second second through hole 1032 and a third second through hole 1033. For clarity and simplicity, Figure 5 Only a group of second through holes included in the second through hole array 1030 is shown, and the group of second through holes includes a first second through hole 1031, a second second through hole 1032, and a third second through hole 1033. Figure 5 The number of groups of second through holes and the number of second through holes in each group of second through holes shown in the figure are only for illustration and are not limited here. The second barrier layer 103 such as a black photoresist layer can make the screen appear black when the display device is powered off or turned off.

[0070] Reference Figure 2-Figure 12 ,in Figure 6 A side view schematic diagram of the filling portion filled in each group of second through holes is shown. Figure 5 ,like Figure 6 As shown, a first filling portion is filled in the first second through hole 1031 in each group of second through holes, and the first filling portion may include a first filter layer 1041 that only allows light of a first color, such as red, to pass through; a second filling portion is filled in the second second through hole 1032 in each group of second through holes, and the second filling portion may include a second filter layer 1042 that only allows light of a second color, such as green, to pass through; a second light absorbing layer 1043 is filled in the third second through hole 1033 in each group of second through holes, and the second light absorbing layer 1043 is used to partially absorb light of a third color, such as blue, to obtain the following: Figure 6 The first intermediate structure 30 is shown. It is worth noting that in other embodiments, when there are unfilled second through holes in each group of second through holes, a transparent material may be filled in the unfilled second through holes so as to support the portion above the corresponding first through hole in a subsequent preparation process requiring support, and the transparent material may be any applicable material such as a transparent resin.

[0071] Reference Figure 2-Figure 12 ,in Figure 7 FIG. 1 shows a side view of a first barrier layer 105 disposed on the first intermediate structure 30. Figure 7As shown, the first barrier layer 105 may be, for example, a black photoresist layer, so the black photoresist layer may be coated on the first intermediate structure 30 by spin coating, and then, for example, a first through hole array 1050 may be opened on the black photoresist layer by photolithography, so that the first through hole array 1050 is aligned with the second through hole array 1030, and the first through hole array 1050 exposes a portion of the first intermediate structure 30. The first through hole array 1050 includes a plurality of groups of first through holes corresponding to the plurality of groups of second through holes, each group of first through holes includes a first first through hole 1051 aligned with the first second through hole 1031, a second first through hole 1052 aligned with the second second through hole 1032, and a third first through hole 1053 aligned with the third second through hole 1033, so as to obtain the following: Figure 7 The structure shown.

[0072] In step S103 , a photoluminescent material layer may be filled in each group of first through holes to obtain a color conversion structure, wherein the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer.

[0073] According to an embodiment of the present disclosure, after obtaining the above-mentioned first through hole array, a photoluminescent material layer may be filled in the first through hole array.

[0074] Referring to an embodiment of the first barrier layer and the second barrier layer in step S102, according to an embodiment of the filled photoluminescent material layer of the present disclosure, the photoluminescent material layer includes a photoluminescent material layer of a first color and a photoluminescent material layer of a second color, and the photoluminescent material layer is filled in each group of first through holes to obtain a color conversion structure, wherein the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, including: filling the first color photoluminescent material layer in the first through hole in each group of first through holes, and filling the second color photoluminescent material layer in the second through hole in each group of first through holes, wherein the micro LED unit emits light of a third color, and the light corresponding to the first color, the light corresponding to the second color, and the light of the third color are synthesized to obtain white light.

[0075] In this embodiment, the first color, the second color and the third color may be three primary colors, for example, the first color is red, the second color is green and the third color is blue. The material of the photoluminescent material layer of the first color and the material of the photoluminescent material layer of the second color include at least one of II-VI group quantum dots, III-V group quantum dots, perovskite quantum dots and carbon quantum dots.

[0076] Referring to another embodiment of the first barrier layer and the second barrier layer in step S102, according to another embodiment of the filled photoluminescent material layer of the present disclosure, the photoluminescent material layer includes a photoluminescent material layer of a fourth color, and the photoluminescent material layer is filled in each group of first through holes to obtain a color conversion structure, wherein the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, including: in each group of first through holes, a photoluminescent material layer of the fourth color is filled in a first through hole above a second through hole for filling a fourth filling portion, wherein the micro LED unit emits light of a third color, and white light is obtained by synthesizing the light corresponding to the fourth color and the light of the third color.

[0077] In this embodiment, the fourth color is yellow light and the third color is blue. The material of the photoluminescent material layer of the fourth color may include at least one of II-VI group quantum dots, III-V group quantum dots, perovskite quantum dots and carbon quantum dots.

[0078] According to an embodiment of the present disclosure, when the photoluminescent material layer is filled in each group of first through holes, the method further includes: filling a sixth filling portion in a first through hole other than the first through hole filled with the photoluminescent material layer in each group of first through holes, the sixth filling portion including a third light absorbing layer or a transparent material, the third light absorbing layer being used to partially absorb the light emitted by the micro LED unit. The material of the third light absorbing layer includes an organic dye, nano absorption particles or an inorganic oxide for absorbing, for example, blue light, such as zinc oxide nanoparticle photoresist.

[0079] According to an embodiment of the present disclosure, after the sixth filling portion is filled in the first through holes other than the first through holes filled with the photoluminescent material layer in each group of first through holes, the method further includes: arranging a first reflective layer on the first barrier layer, the photoluminescent material layer and the sixth filling portion, the first reflective layer being used to reflect light of a color corresponding to the photoluminescent material layer. The first reflective layer may include a distributed Bragg reflector for reflecting light of a color corresponding to the photoluminescent material layer, and the first reflective layer may be, for example, a distributed Bragg reflector formed by alternately stacking silicon dioxide layers and titanium dioxide layers, and may also include any material layer for reflecting light of a color corresponding to the photoluminescent material layer.

[0080] According to an embodiment of the present disclosure, after filling the sixth filling part in the first through holes other than the first through holes filled with the photoluminescent material layer in each group of first through holes, the method further includes: providing an insulating layer on the first barrier layer, the photoluminescent material layer and the sixth filling part.

[0081] Reference Figure 2-Figure 12 ,in Figure 8 A schematic side view of a photoluminescent material layer filled in each group of first through holes is shown. Figure 7 ,like Figure 8 As shown, the first through hole 1051 in each group of first through holes is filled with a first color photoluminescent material layer 1061, such as red, and the second through hole 1052 in each group of first through holes is filled with a second color photoluminescent material layer 1062, such as green.

[0082] Reference Figure 2-Figure 12 ,in Fig. 9 A side view schematic diagram of the sixth filling portion filled in the first through holes other than the first through holes filled with the photoluminescent material layer in each group of first through holes is shown. Figure 7 and Figure 8 ,like Fig. 9 As shown, the sixth filling part is, for example, the third light absorbing layer 1063, and the third light absorbing layer 1063 for absorbing, for example, blue light is filled in the third first through hole 1053 aligned with the third second through hole 1033. The material of the third light absorbing layer 1063 includes an organic dye, nano absorption particles or inorganic oxides for absorbing blue light, and the material of the third light absorbing layer 1063 can be the same as that of the first light absorbing layer 1022 and the second light absorbing layer 1043. It is worth noting that the above filling order of the first color photoluminescent material layer 1061, the second color photoluminescent material layer 1062 and the third light absorbing layer 1063 is only exemplary and is not limited here. The filling order of the first color photoluminescent material layer 1061, the second color photoluminescent material layer 1062 and the third light absorbing layer 1063 can be arbitrarily adjusted according to the actual preparation conditions such as specific processes and equipment. It should be understood that the sixth filling portion may also include a photoluminescent material layer of a third color, such as blue, so that the third color light, such as blue light, emitted by the micro LED unit excites the photoluminescent material layer of the third color to emit the third color light, such as blue light.

[0083] Reference Figure 2-Figure 12 ,in Fig.10 FIG. 4 is a side view schematic diagram showing an insulating layer disposed on the first barrier layer, the photoluminescent material layer and the sixth filling portion. Fig.10 As shown, a plasma enhanced chemical vapor deposition (PECVD) method can be used to deposit an insulating layer 107 such as a silicon dioxide layer on the first barrier layer 105, the first photoluminescent material layer 1061, the second photoluminescent material layer 1062 and the third light absorbing layer 1063 to obtain a Fig.10The first color conversion structure 10 shown. Of course, the insulating layer may also include any other applicable materials, such as any applicable polymer organic materials and inorganic oxides, and any applicable preparation process may be used to prepare the insulating layer for different materials. The insulating layer is used to protect other parts of the first color conversion structure, and can be used as a surface layer of the first color conversion structure to make the surface of the first color conversion structure smoother, thereby facilitating the subsequent bonding of the first color conversion structure with the micro LED chip.

[0084] In step S104, the first light absorption layer of the light absorption structure can be disposed on the first transparent substrate, and the side of the color conversion structure opposite to the first transparent substrate can be bonded to the light emitting side of the micro LED chip to obtain a micro LED device.

[0085] According to an embodiment of the present disclosure, disposing the first light absorbing layer of the light absorbing structure on the first transparent substrate may include: disposing the first light absorbing layer of the light absorbing structure on the first transparent substrate of the color conversion structure. In this embodiment, the light absorbing structure does not belong to the color conversion structure. In another embodiment, before disposing the first barrier layer on the first transparent substrate, the first light absorbing layer of the light absorbing structure may be disposed on the first transparent substrate, and then the preparation steps are sequentially performed as above, so that the light absorbing structure may also belong to the color conversion structure. For the case where the light absorbing structure does not belong to the color conversion structure, the following two embodiments may be provided.

[0086] According to an embodiment of the present disclosure, the first light absorption layer of the light absorption structure is disposed on the first transparent substrate, and the side of the color conversion structure opposite to the first transparent substrate is bonded to the light emitting side of the micro LED chip, including: disposing the first light absorption layer of the light absorption structure on the first transparent substrate of the color conversion structure; bonding the side of the color conversion structure opposite to the first transparent substrate to the light emitting side of the micro LED chip. In this embodiment, the first light absorption layer of the light absorption structure can be first disposed on the first transparent substrate of the color conversion structure, and then the side of the color conversion structure opposite to the first transparent substrate is bonded to the light emitting side of the micro LED chip.

[0087] According to another embodiment of the present disclosure, the first light absorption layer of the light absorption structure is disposed on the first transparent substrate, and the side of the color conversion structure opposite to the first transparent substrate is bonded to the light emitting side of the micro LED chip, including: bonding the side of the color conversion structure opposite to the first transparent substrate to the light emitting side of the micro LED chip; and disposing the first light absorption layer of the light absorption structure on the first transparent substrate of the color conversion structure. In this embodiment, the side of the color conversion structure opposite to the first transparent substrate can be bonded to the light emitting side of the micro LED chip first, and then the first light absorption layer of the light absorption structure can be disposed on the first transparent substrate of the color conversion structure.

[0088] In addition, according to an embodiment of the present disclosure, the micro LED chip structure also includes a driving chip, and the side of the micro LED chip opposite to the light emitting side is arranged on the driving chip, or the micro LED chip structure also includes a driving chip and a flexible circuit board, and the side of the micro LED chip opposite to the light emitting side is arranged on the driving chip to form a micro LED module, and the micro LED module is arranged on the flexible circuit board through the driving chip.

[0089] Reference Figure 2-Figure 12 ,in Fig.11 FIG. 4 shows a side view of the first light absorption layer 1022 of the light absorption structure 102 disposed on the first transparent substrate 101 of the color conversion structure 10 according to an embodiment of the present disclosure. Fig.11 As shown, the first light absorption layer 1022 of the light absorption structure 102 is disposed on the first transparent substrate 101 of the color conversion structure 10, such as a sapphire substrate. The light absorption structure may further include a second transparent substrate 1021, such as a sapphire substrate. The first light absorption layer 1022 is disposed on the second transparent substrate 1021, and the first transparent substrate 101 and the second transparent substrate 1021 are located on both sides of the first light absorption layer 1022. The material of the first light absorption layer 1022 includes an organic dye, nano absorption particles or inorganic oxides for absorbing, for example, blue light. The material of the first light absorption layer 1022 may be the same as the material of the second light absorption layer 1043 and the material of the third light absorption layer 1063.

[0090] Reference Figure 2-Figure 12 ,in Fig.12 FIG. 2 shows a side view of bonding a color conversion structure 10 to a micro LED chip 20 according to one embodiment of the present disclosure. Fig.12 As shown, the insulating layer 107 of the color conversion structure 10 is bonded to the first semiconductor layer 20111 of the LED chip 20 of the micro LED chip structure to obtain Fig.12 The micro LED device 1 is shown.

[0091] Reference Figures 2 to 12 It should be understood that the light of the third color, such as blue light, emitted by the micro LED unit 2011 excites the photoluminescent material layer 1061 of the first color, such as red, to emit red light, and the light of the third color, such as blue light, emitted by the micro LED unit 2011 excites the photoluminescent material layer 1062 of the second color, such as green, to emit green light. The light of the third color, such as blue light, emitted by the micro LED unit corresponding to the third first through hole 1053 passes through the third first through hole and the third second through hole, and is partially absorbed after the first light absorption layer 1022, and some of the blue light still passes through the first light absorption layer 1022. The light of the first color, such as red light, and the light of the second color, such as green light, emitted through the photoluminescent material layer and the first light absorption layer 1022, and the light of the third color, such as blue light, emitted through the first light absorption layer 1022 can be synthesized to obtain white light. Thus, by providing a first light absorption layer that partially absorbs, for example, blue light emitted by the micro LED unit, the blue light overflow caused by the blue light emitted by the micro LED unit corresponding to the third second through hole directly emitted from the micro LED device can be reduced, thereby reducing the color deviation and poor color purity caused by the blue light overflow, thereby improving the balance of light of different colors emitted from the micro LED device, improving the color purity of the micro LED, and further improving the display effect of the micro LED device. In addition, since the first light absorption layer 1022 covers the photoluminescent material layer 1061 of the first color, for example, red, and the photoluminescent material layer 1062 of the second color, for example, green, when a part of the blue light emitted by the micro LED unit corresponding to the photoluminescent material layer does not participate in the excitation of the photoluminescent material layer and passes through the photoluminescent material layer and leaks out, the first light absorption layer 1022 can absorb the leaked part of the blue light, thereby reducing the mixed output of the leaked part of the blue light and the red light and green light emitted by the exciting photoluminescent material layer, thereby improving the color purity of the micro LED, thereby improving the display effect of the micro LED device.

[0092] Furthermore, since the third first through hole 1053 is aligned with the third second through hole 1033 and the second light absorption layer 1043 is filled in the third second through hole 1033, the second light absorption layer 1043 can further enhance the absorption of, for example, blue light emitted by the micro LED unit 2011 corresponding to the third second through hole 1033, thereby further reducing the blue light overflow caused by the light emitted by the micro LED unit directly emitted from the micro LED device, thereby further improving the display effect of the micro LED device.

[0093] In addition, when the third light absorption layer 1063 is filled in the third first through hole 1053, the third light absorption layer 1063 can further enhance the absorption of, for example, blue light emitted by the micro LED unit 2011 corresponding to the third first through hole 1053, thereby further reducing the blue light overflow caused by the light emitted by the micro LED unit directly from the micro LED device, thereby further improving the display effect of the micro LED device.

[0094] Furthermore, regarding the first reflective layer, the first reflective layer is disposed on the first barrier layer, the photoluminescent material layer and the sixth filling portion, and the insulating layer can be disposed on the first reflective layer and between the first reflective layer and the micro LED chip, so the first reflective layer can cover, for example, the photoluminescent material layer of the first color, the photoluminescent material layer of the second color and the sixth filling portion, for example, the third light absorbing layer. Since the first reflective layer is used to reflect light of the color corresponding to the photoluminescent material layer, light such as blue emitted from the micro LED unit can pass through the first reflective layer, and when the blue light emitted by the micro LED unit excites the photoluminescent material layer of the first color such as red to emit red light, part of the excited red light will be emitted toward the direction of the micro LED unit, and the first reflective layer can reflect the part of the red light toward the direction of the photoluminescent material layer of the first color such as red, thereby increasing the light output of the light of the color corresponding to the photoluminescent material layer, thereby improving the brightness of the micro LED, and preventing the red light from being emitted toward the micro LED unit. The part of the red light emitted in the direction of the D unit interferes with the blue light emitted by the micro LED unit; similarly, when the blue light emitted by the micro LED unit excites the photoluminescent material layer of the second color, such as green, to emit green light, part of the excited green light will be emitted in the direction of the micro LED unit, and the first reflective layer can reflect the part of the green light in the direction of the photoluminescent material layer of the second color, such as green, so as to increase the light output of the light of the color corresponding to the photoluminescent material layer, thereby improving the brightness of the micro LED and preventing the part of the green light emitted in the direction of the micro LED unit from interfering with the blue light emitted by the micro LED unit. It is worth noting that when the first second through hole 1041 is filled with the first filter layer 1041 and the second second through hole 1032 is filled with the second filter layer 1042, the first filter layer 1041 only allows the light of the first color, such as red light, to pass through, and the first filter layer 1041 will reflect the light of the third color, such as blue light, in the direction of the photoluminescent material layer 1061 of the first color, such as red. The second filter layer 1032 allows only light of the second color, such as green light, to pass through, and the second filter layer 1032 reflects light of the third color, such as blue light, toward the direction of the photoluminescent material layer 1062 of the second color, such as green. Therefore, the first filter layer 1031 and the second filter layer 1032 function to reflect light other than the light of the corresponding color, which is different from the light absorption function of the first light absorption layer, the second light absorption layer and the third light absorption layer.

[0095] The present disclosure also provides a micro LED device.

[0096] like Figure 2-Figure 12As shown, the micro LED device 1 includes a color conversion structure 10, a micro LED chip structure and a light absorption structure 102, wherein the micro LED chip structure includes a micro LED chip 20, the micro LED chip 20 includes a micro LED unit array 201 composed of a plurality of micro LED units 2011, and the light absorption structure 102 includes a first light absorption layer 1022, wherein the first light absorption layer 1022 is used to partially absorb the light emitted by the micro LED unit 2011, wherein the color conversion structure 10 includes: a first transparent substrate 101; a first barrier layer 102; 05, the first barrier layer 105 is arranged under the first transparent substrate 101, the first barrier layer 105 includes a first through hole array 1050, the arrangement of the first through hole array 1050 corresponds to the arrangement of the micro LED unit array 201, wherein the first through hole array 1050 includes a plurality of groups of first through holes, each group of first through holes includes at least two first through holes; a photoluminescent material layer, the photoluminescent material layer is filled in each group of first through holes, wherein the color of the light emitted by the micro LED unit 2011 is different from the color corresponding to the photoluminescent material layer. The first light absorbing layer 1022 of the light absorbing structure 102 is arranged on the first transparent substrate 101 of the color conversion structure 10, and the side of the color conversion structure 10 opposite to the first transparent substrate 101 is arranged on the light emitting side of the micro LED chip 20.

[0097] According to an embodiment of the present disclosure, the light absorption structure 102 further includes a second transparent substrate 1021 , and the first light absorption layer 1022 is disposed on the second transparent substrate 1021 .

[0098] According to an embodiment of the present disclosure, the color conversion structure 10 further includes a second barrier layer 103, which is disposed below the first transparent substrate 101 and includes a second through hole array 1030, wherein the arrangement of the second through hole array 1030 corresponds to the arrangement of the micro LED unit array 201, wherein the second through hole array 1030 includes a plurality of groups of second through holes, each group of second through holes includes three second through holes, and the three second through holes include a first second through hole 1031, a second second through hole 1032, and a third second through hole 1033. The color conversion structure 10 further includes at least one of a first filling portion, a second filling portion and a third filling portion, wherein: the first filling portion is filled in the first second through hole 1031 in each group of second through holes, and the first filling portion includes a first filter layer 1041 that only allows light of the first color to pass through, and a second light absorbing layer or a transparent material for partially absorbing light of the third color; the second filling portion is filled in the second second through hole 1032 in each group of second through holes, and the second filling portion includes a second filter layer 1042 that only allows light of the second color to pass through, and a second light absorbing layer or a transparent material for partially absorbing light of the third color; the third filling portion is filled in the third second through hole 1033 in each group of second through holes, and the third filling portion includes a third filter layer that only allows light of the third color to pass through, and a second light absorbing layer 1043 or a transparent material for partially absorbing light of the third color.

[0099] According to an embodiment of the present disclosure, when there are unfilled second through holes in each group of second through holes, the color conversion structure 10 further includes a transparent material, and the transparent material is filled in the unfilled second through holes.

[0100] According to an embodiment of the present disclosure, each group of first through holes includes three first through holes, the first barrier layer 105 is disposed below the second barrier layer, the first through hole array 1050 is aligned with the second through hole array 1030, wherein the first through hole array 1050 includes a plurality of groups of first through holes corresponding to the plurality of groups of second through holes, and each group of first through holes includes a first first through hole 1051 aligned with the first second through hole 1031, a second first through hole 1052 aligned with the second second through hole 1032, and a third first through hole 1053 aligned with the third second through hole 1034. 53, the photoluminescent material layer includes a photoluminescent material layer 1061 of a first color and a photoluminescent material layer 1062 of a second color, the photoluminescent material layer 1061 of the first color is filled in the first first through hole 1051 in each group of first through holes, and the photoluminescent material layer 1062 of the second color is filled in the second first through hole 1052 in each group of first through holes, wherein the micro LED unit 2011 emits light of a third color, and the light corresponding to the first color, the light corresponding to the second color and the light of the third color are synthesized to obtain white light.

[0101] According to an embodiment of the present disclosure, the first color is red, the second color is green, and the third color is blue.

[0102] According to an embodiment of the present disclosure, the color conversion structure further includes a second barrier layer, the second barrier layer is disposed under the first transparent substrate and includes a second through hole array, the second barrier layer includes a second through hole array, the arrangement of the second through hole array corresponds to the arrangement of the micro LED unit array, wherein the second through hole array includes a plurality of groups of second through holes, each group of second through holes includes two second through holes. The color conversion structure further includes at least one of a fourth filling part and a fifth filling part, wherein: the fourth filling part is filled in one second through hole in each group of second through holes, the fourth filling part includes a fourth filter layer that only allows light of a fourth color to pass through, a second light absorbing layer or a transparent material for partially absorbing light of a third color; the fifth filling part is filled in another second through hole in each group of second through holes, the fifth filling part includes a third filter layer that only allows light of a third color to pass through, a second light absorbing layer or a transparent material for partially absorbing light of a third color.

[0103] According to an embodiment of the present disclosure, when there is an unfilled second through hole in each group of second through holes, the color conversion structure further includes a transparent material, and the transparent material is filled in the unfilled second through hole.

[0104] According to an embodiment of the present disclosure, the first barrier layer is disposed below the second barrier layer, the first barrier layer includes a first through hole array, the first through hole array is aligned with the second through hole array, wherein the first through hole array includes multiple groups of first through holes corresponding to the multiple groups of second through holes, each group of first through holes includes two first through holes respectively aligned with two second through holes, the photoluminescent material layer includes a photoluminescent material layer of a fourth color, the photoluminescent material layer of the fourth color is filled in the first through hole below the second through hole for filling the fourth filling portion, wherein the micro LED unit emits light of a third color, and white light is obtained by synthesizing the light corresponding to the fourth color and the light of the third color.

[0105] According to an embodiment of the present disclosure, the fourth color is yellow and the third color is blue.

[0106] According to an embodiment of the present disclosure, the color conversion structure also includes a sixth filling portion, which is filled in a first through hole other than the first through hole filled with a photoluminescent material layer in each group of first through holes, and the sixth filling portion includes a third light absorbing layer 1063 or a transparent material, and the third light absorbing layer 1063 is used to partially absorb the light emitted by the micro LED unit.

[0107] According to an embodiment of the present disclosure, the color conversion structure further includes a first reflective layer, which is disposed below the first barrier layer, the photoluminescent material layer and the sixth filling portion, and is used to reflect light of a color corresponding to the photoluminescent material layer.

[0108] According to an embodiment of the present disclosure, the color conversion structure 10 further includes an insulating layer 107, which is disposed under the first barrier layer 105, the photoluminescent material layer and the sixth filling portion. The insulating layer 107 of the color conversion structure 10 is disposed on the light emitting side of the micro LED chip 20.

[0109] According to an embodiment of the present disclosure, the micro LED chip structure also includes a driving chip, and the side of the micro LED chip 20 opposite to the light emitting side is arranged on the driving chip, or the micro LED chip structure also includes a driving chip and a flexible circuit board, and the side of the micro LED chip 20 opposite to the light emitting side is arranged on the driving chip to form a micro LED module, and the micro LED module is arranged on the flexible circuit board through the driving chip.

[0110] According to an embodiment of the present disclosure, the material of the first barrier layer 105 and the material of the second barrier layer 103 include visible light shielding materials, the material of the first color photoluminescent material layer 1061 and the material of the second color photoluminescent material layer 1062 include at least one of II-VI group quantum dots, III-V group quantum dots, perovskite quantum dots and carbon quantum dots, the material of the first light absorption layer 1022 and the material of the second light absorption layer 1043 include organic dyes, nano absorption particles or inorganic oxides for absorbing blue light, and the material of the first filter layer 1031, the material of the second filter layer 1032 and the material of the third filter layer include organic dyes, nano absorption particles or inorganic oxides.

[0111] It is worth noting that any relevant description about the micro LED device in the above-mentioned micro LED device preparation method (including but not limited to technical features and their functions, explanations, etc.) can be applied to the micro LED device disclosed in the present invention.

[0112] According to embodiments of the present disclosure, the pixel size in the micro LED device is typically less than 50 microns.

[0113] The present disclosure also provides a display device, which includes the above-mentioned type LED device. The display device can be applied to flexible electronic devices to realize technologies such as augmented reality (AR), virtual reality (VR), extended reality (XR), and mixed reality (MR). For example, the micro LED device can be the projection part of an electronic device, such as a projector, a head-up display (HUD), etc.; for another example, the micro LED device can also be the display part of an electronic device, such as a smart phone, a smart watch, a laptop, a tablet computer, a driving recorder, a navigator, a head-mounted device, and any other device with a display screen.

[0114] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0115] It should be understood that "one embodiment" or "an embodiment" mentioned throughout the specification means that specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. It should be understood that in various embodiments of the present application, the size of the serial number of each step / process mentioned above does not mean the order of execution, and the execution order of each step / process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiment of the present application. In addition, the serial numbers of the embodiments of the present application mentioned above are only for description and do not represent the advantages and disadvantages of the embodiments.

[0116] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein, for example. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0117] The above description is only a preferred embodiment of the present disclosure and is not intended to limit the present disclosure. For those skilled in the art, the present disclosure may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A method for preparing a micro LED device, wherein: The method comprises: Obtaining a first transparent substrate, a micro LED chip structure and a light absorption structure, wherein the micro LED chip structure comprises a micro LED chip, the micro LED chip comprises a micro LED unit array composed of a plurality of micro LED units, and the light absorption structure comprises a first light absorption layer, the first light absorption layer is used to partially absorb light emitted by the micro LED unit; Disposing a first barrier layer on the first transparent substrate, so that the first barrier layer includes a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes a plurality of groups of first through holes, and each group of first through holes includes at least two first through holes; Filling a photoluminescent material layer in each group of first through holes to obtain a color conversion structure, wherein the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer; The first light absorption layer of the light absorption structure is disposed on the first transparent substrate, and the side of the color conversion structure opposite to the first transparent substrate is bonded to the light emitting side of the micro LED chip to obtain a micro LED device.

2. The method for preparing a micro LED device according to claim 1, wherein: Disposing the first light absorption layer of the light absorption structure on the first transparent substrate comprises: The first light absorption layer of the light absorption structure is disposed on the first transparent substrate of the color conversion structure.

3. The method for preparing a micro LED device according to claim 2, wherein: The method of disposing the first light absorbing layer of the light absorbing structure on the first transparent substrate and bonding the side of the color conversion structure opposite to the first transparent substrate to the light emitting side of the micro LED chip comprises: Disposing a first light absorbing layer of the light absorbing structure on a first transparent substrate of the color conversion structure; The side of the color conversion structure opposite to the first transparent substrate is bonded to the light emitting side of the micro LED chip.

4. The method for preparing a micro LED device according to claim 2, wherein: The method of disposing the first light absorbing layer of the light absorbing structure on the first transparent substrate and bonding the side of the color conversion structure opposite to the first transparent substrate to the light emitting side of the micro LED chip comprises: Bonding a side of the color conversion structure opposite to the first transparent substrate to a light emitting side of the micro LED chip; The first light absorption layer of the light absorption structure is disposed on the first transparent substrate of the color conversion structure.

5. The method for preparing a micro LED device according to claim 1, wherein: The light absorption structure further includes a second transparent substrate, and the first light absorption layer is disposed on the second transparent substrate.

6. The method for preparing a micro LED device according to any one of claims 1 to 5, wherein: Before providing the first barrier layer on the first transparent substrate, the method further includes: Disposing a second barrier layer on the first transparent substrate, so that the second barrier layer includes a second through hole array, the arrangement of the second through hole array corresponds to the arrangement of the micro LED unit array, wherein the second through hole array includes a plurality of groups of second through holes, each group of second through holes includes three second through holes, and the three second through holes include a first second through hole, a second second through hole and a third second through hole; A first filling step, when the first filling step is completed, a first intermediate structure is obtained, and the first filling step includes at least one of the following steps: Filling a first filling portion in a first second through hole in each group of second through holes, wherein the first filling portion includes a first filter layer that allows only light of a first color to pass through, a second light absorption layer for partially absorbing light of a third color, or a transparent material; Filling a second filling portion in a second second through hole in each group of second through holes, wherein the second filling portion includes a second filter layer that allows only light of the second color to pass through, a second light absorption layer for partially absorbing light of the third color, or a transparent material; A third filling portion is filled in the third second through hole in each group of second through holes, wherein the third filling portion includes a third filter layer that allows only light of a third color to pass through, a second light absorption layer for partially absorbing light of the third color, or a transparent material.

7. The method for preparing a micro LED device according to claim 6, wherein: The first filling step further comprises: When there are unfilled second through holes in each group of second through holes, the unfilled second through holes are filled with a transparent material.

8. The method for preparing a micro LED device according to claim 6, wherein: Each group of first through holes includes three first through holes, a first barrier layer is arranged on the first transparent substrate, so that the first barrier layer includes a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes a plurality of groups of first through holes, each group of first through holes includes at least two first through holes including: A first barrier layer is disposed on the first intermediate structure, and a first through hole array is opened on the first barrier layer, so that the first through hole array is aligned with the second through hole array, and the first through hole array exposes the first intermediate structure, wherein the first through hole array includes a plurality of groups of first through holes corresponding to the plurality of groups of second through holes, each group of first through holes includes a first first through hole aligned with the first second through hole, a second first through hole aligned with the second second through hole, and a third first through hole aligned with the third second through hole, The photoluminescent material layer includes a photoluminescent material layer of a first color and a photoluminescent material layer of a second color, and the photoluminescent material layer is filled in each group of first through holes to obtain a color conversion structure, wherein the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, including: A first photoluminescent material layer of a first color is filled in the first through hole in each group of first through holes, and a second photoluminescent material layer of a second color is filled in the second through hole in each group of first through holes, wherein the micro LED unit emits light of a third color, and the light corresponding to the first color, the light corresponding to the second color, and the light of the third color are synthesized to obtain white light.

9. The method for preparing a micro LED device according to any one of claims 1 to 5, wherein: Before providing the first barrier layer on the first transparent substrate, the method further includes: Disposing a second barrier layer on the first transparent substrate, so that the second barrier layer includes a second through hole array, the arrangement of the second through hole array corresponds to the arrangement of the micro LED unit array, wherein the second through hole array includes a plurality of groups of second through holes, and each group of second through holes includes two second through holes; A second filling step, when the second filling step is completed, a second intermediate structure is obtained, and the second filling step includes at least one of the following steps: Filling a fourth filling portion in one second through hole in each group of second through holes, wherein the fourth filling portion includes a fourth filter layer that allows only light of a fourth color to pass through, a second light absorption layer for partially absorbing light of a third color, or a transparent material; A fifth filling portion is filled in another second through hole in each group of second through holes, wherein the fifth filling portion includes a third filter layer that allows only light of a third color to pass therethrough, a second light absorption layer for partially absorbing light of the third color, or a transparent material.

10. The method for preparing a micro LED device according to claim 9, wherein: The second filling step further comprises: When there are unfilled second through holes in each group of second through holes, the unfilled second through holes are filled with a transparent material.

11. The method for preparing a micro LED device according to claim 9, wherein: A first barrier layer is disposed on the first transparent substrate, so that the first barrier layer includes a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes a plurality of groups of first through holes, each group of first through holes includes at least two first through holes including: A first barrier layer is disposed on the second intermediate structure, and a first through hole array is opened on the first barrier layer, so that the first through hole array is aligned with the second through hole array, and the first through hole array exposes the second intermediate structure, wherein the first through hole array includes a plurality of groups of first through holes corresponding to the plurality of groups of second through holes, and each group of first through holes includes two first through holes respectively aligned with two second through holes, The photoluminescent material layer includes a photoluminescent material layer of a fourth color, and the photoluminescent material layer is filled in each group of first through holes to obtain a color conversion structure, wherein the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, including: In each group of first through holes, a photoluminescent material layer of a fourth color is filled in the first through hole above the second through hole for filling the fourth filling part, wherein the micro LED unit emits light of a third color, and white light is obtained by synthesizing the light of the fourth color and the light of the third color.

12. The method for preparing a micro LED device according to any one of claims 1 to 5, wherein: When filling the photoluminescent material layer in each group of first through holes, the method further comprises: A sixth filling portion is filled in the first through holes other than the first through holes filled with the photoluminescent material layer in each group of first through holes. The sixth filling portion includes a third light absorbing layer or a transparent material. The third light absorbing layer is used to partially absorb the light emitted by the micro LED unit.

13. The method for preparing a micro LED device according to claim 12, wherein: After filling the sixth filling part in the first through holes other than the first through holes filled with the photoluminescent material layer in each group of first through holes, the method further includes: A first reflective layer is disposed on the first barrier layer, the photoluminescent material layer and the sixth filling portion, and the first reflective layer is used to reflect light of a color corresponding to the photoluminescent material layer.

14. The method for preparing a micro LED device according to claim 12, wherein: After filling the sixth filling part in the first through holes other than the first through holes filled with the photoluminescent material layer in each group of first through holes, the method further includes: providing an insulating layer on the first barrier layer, the photoluminescent material layer and the sixth filling part, Bonding the side of the color conversion structure opposite to the first transparent substrate to the light-emitting side of the micro LED chip includes: bonding the insulating layer of the color conversion structure to the light-emitting side of the micro LED chip.

15. A micro LED device, wherein: The micro LED device comprises a color conversion structure, a micro LED chip structure and a light absorption structure, wherein the micro LED chip structure comprises a micro LED chip, the micro LED chip comprises a micro LED unit array composed of a plurality of micro LED units, the light absorption structure comprises a first light absorption layer, and the first light absorption layer is used to partially absorb the light emitted by the micro LED unit, wherein the color conversion structure comprises: a first transparent substrate; A first barrier layer, the first barrier layer is disposed under the first transparent substrate, the first barrier layer comprises a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array comprises a plurality of groups of first through holes, each group of first through holes comprises at least two first through holes; a photoluminescent material layer, wherein the photoluminescent material layer is filled in each group of first through holes, wherein the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, The first light absorption layer of the light absorption structure is arranged on the first transparent substrate of the color conversion structure, and the side of the color conversion structure opposite to the first transparent substrate is arranged on the light emitting side of the micro LED chip.

16. The micro LED device according to claim 15, wherein: The light absorption structure further includes a second transparent substrate, and the first light absorption layer is disposed on the second transparent substrate.

17. The micro LED device according to claim 15 or 16, wherein: The color conversion structure further includes a second barrier layer, which is disposed below the first transparent substrate and includes a second through hole array, the arrangement of the second through hole array corresponds to the arrangement of the micro LED unit array, wherein the second through hole array includes a plurality of groups of second through holes, each group of second through holes includes three second through holes, and the three second through holes include a first second through hole, a second second through hole, and a third second through hole, The color conversion structure further comprises at least one of a first filling portion, a second filling portion and a third filling portion, wherein: The first filling part is used to fill the first second through hole in each group of second through holes, and the first filling part includes a first filter layer that only allows light of the first color to pass through, a second light absorption layer or a transparent material that is used to partially absorb light of a third color; The second filling part is used to fill the second second through hole in each group of second through holes, and the second filling part includes a second filter layer that only allows light of the second color to pass through, a second light absorption layer for partially absorbing light of the third color, or a transparent material; The third filling part is used to fill the third second through hole in each group of second through holes, and the third filling part includes a third filter layer that only allows light of a third color to pass through, a second light absorption layer or a transparent material for partially absorbing light of the third color.

18. The micro LED device according to claim 17, wherein: When there is an unfilled second through hole in each group of second through holes, the color conversion structure further includes a transparent material, and the transparent material is filled in the unfilled second through hole.

19. The micro LED device according to claim 17, wherein: Each group of first through holes includes three first through holes, the first barrier layer is arranged under the second barrier layer, the first through hole array is aligned with the second through hole array, wherein the first through hole array includes multiple groups of first through holes corresponding to the multiple groups of second through holes, each group of first through holes includes a first first through hole aligned with the first second through hole, a second first through hole aligned with the second second through hole, and a third first through hole aligned with the third second through hole, the photoluminescent material layer includes a photoluminescent material layer of a first color and a photoluminescent material layer of a second color, the photoluminescent material layer of the first color is filled in the first first through hole in each group of first through holes, and the photoluminescent material layer of the second color is filled in the second first through hole in each group of first through holes, wherein the micro LED unit emits light of a third color, and the light corresponding to the first color, the light corresponding to the second color, and the light of the third color are synthesized to obtain white light.

20. The micro LED device according to claim 17, wherein: The first color is red, the second color is green and the third color is blue.

21. The micro LED device according to claim 15 or 16, wherein: The color conversion structure further includes a second barrier layer, which is disposed below the first transparent substrate and includes a second through-hole array, wherein the second barrier layer includes a second through-hole array, and the arrangement of the second through-hole array corresponds to the arrangement of the micro LED unit array, wherein the second through-hole array includes a plurality of groups of second through-holes, and each group of second through-holes includes two second through-holes. The color conversion structure further includes at least one of a fourth filling portion and a fifth filling portion, wherein: The fourth filling part is used to fill one second through hole in each group of second through holes, and the fourth filling part includes a fourth filter layer that only allows light of a fourth color to pass through, a second light absorption layer that partially absorbs light of a third color, or a transparent material; The fifth filling part is used to fill another second through hole in each group of second through holes, and the fifth filling part includes a third filter layer that only allows light of a third color to pass through, a second light absorption layer that partially absorbs light of the third color, or a transparent material.

22. The micro LED device according to claim 21, wherein: When there is an unfilled second through hole in each group of second through holes, the color conversion structure further includes a transparent material, and the transparent material is filled in the unfilled second through hole.

23. The micro LED device according to claim 21, wherein: The first barrier layer is arranged below the second barrier layer, the first barrier layer comprises a first through hole array, the first through hole array is aligned with the second through hole array, wherein the first through hole array comprises a plurality of groups of first through holes corresponding to the plurality of groups of second through holes, each group of first through holes comprises two first through holes respectively aligned with two second through holes, the photoluminescent material layer comprises a photoluminescent material layer of a fourth color, the photoluminescent material layer of the fourth color is filled in the first through hole below the second through hole for filling the fourth filling portion, wherein the micro LED unit emits light of a third color, and white light is obtained by synthesizing the light corresponding to the fourth color and the light of the third color.

24. The micro LED device according to claim 21, wherein: The fourth color is yellow and the third color is blue.

25. The micro LED device according to claim 15 or 16, wherein: The color conversion structure also includes a sixth filling portion, which is filled in the first through holes other than the first through holes filled with the photoluminescent material layer in each group of first through holes, and the sixth filling portion includes a third light absorbing layer or a transparent material, and the third light absorbing layer is used to partially absorb the light emitted by the micro LED unit.

26. The micro LED device according to claim 25, wherein: The color conversion structure further includes a first reflective layer, which is disposed below the first barrier layer, the photoluminescent material layer and the sixth filling portion, and is used to reflect light of a color corresponding to the photoluminescent material layer.

27. The micro LED device according to claim 25, wherein: The color conversion structure further includes an insulating layer, which is disposed below the first barrier layer, the photoluminescent material layer and the sixth filling portion. The insulating layer of the color conversion structure is disposed on the light emitting side of the micro LED chip.

28. The micro LED device according to claim 15 or 16, wherein: The micro LED chip structure further includes a driving chip, and a side of the micro LED chip opposite to the light emitting side is arranged on the driving chip. Alternatively, the micro LED chip structure further includes a driving chip and a flexible circuit board, the side of the micro LED chip opposite to the light emitting side is arranged on the driving chip to form a micro LED module, and the micro LED module is arranged on the flexible circuit board through the driving chip.

29. The micro LED device according to claim 19, wherein: The material of the first barrier layer and the material of the second barrier layer include visible light shielding materials, the material of the first color photoluminescent material layer and the material of the second color photoluminescent material layer include at least one of II-VI group quantum dots, III-V group quantum dots, perovskite quantum dots and carbon quantum dots, the material of the first light absorption layer and the material of the second light absorption layer include organic dyes, nano absorption particles or inorganic oxides for absorbing blue light, and the material of the first filter layer, the material of the second filter layer and the material of the third filter layer include organic dyes, nano absorption particles or inorganic oxides.

30. A display device, wherein: The display device comprises the micro LED device according to any one of claims 15 to 29.

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