Miniature LED device preparation method, miniature LED device and display device

Abstract

The invention provides a miniature LED device preparation method, a miniature LED device and a display device. The method comprises the following steps: obtaining a transparent substrate and a micro LED chip structure; a first light absorption layer is arranged on the transparent substrate, and the first light absorption layer is used for partially absorbing light emitted by the micro LED units; a first partition layer is arranged on the first light absorption layer, so that the first partition layer comprises a plurality of groups of first through holes, and each group of first through holes comprises at least two first through holes; a second partition layer is arranged on the first partition layer, so that the second partition layer comprises a plurality of groups of second through holes corresponding to the plurality of groups of first through holes; each group of second through holes is filled with a photoluminescent material layer to obtain a first color conversion structure, and the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer; and bonding one side, opposite to the transparent substrate, of the first color conversion structure with the light emitting side of the micro LED chip to obtain the micro LED device.

Description

Technical Field

[0001] The present disclosure relates to the technical field of semiconductor Micro LED, and in particular, to a method for preparing a Micro LED device, a Micro LED device and a display device. Background Art

[0002] Micro-LED is a comprehensive technology that integrates new display technology and light-emitting diode (LED) technology. It has the advantages of small size, high brightness, high resolution, and low power consumption. It is considered to be one of the most promising next-generation new display and light-emitting devices. Currently, Micro LED full-color display can be achieved in a variety of ways, one of which is the color conversion method. However, the full-color Micro LED device achieved by the color conversion method still has problems such as unsatisfactory display effects. Summary of the invention

[0003] The solution disclosed herein provides a method for preparing a micro LED device, a micro LED device, and a display device.

[0004] According to one aspect of an embodiment of the present disclosure, a method for preparing a micro LED device is provided, wherein the method comprises: obtaining a transparent substrate and a micro LED chip structure, wherein the micro LED chip structure comprises a micro LED chip, and the micro LED chip comprises a micro LED unit array composed of a plurality of micro LED units; arranging a first light absorbing layer on the transparent substrate, wherein the first light absorbing layer is used to partially absorb light emitted by the micro LED unit; arranging a first barrier layer on the first light absorbing layer, so that the first barrier layer comprises a first through hole array, and the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array comprises a plurality of groups of first through holes, and each group of first through holes has a plurality of first through holes. A through hole includes at least two first through holes; a second barrier layer is arranged on the first barrier layer, so that the second barrier layer includes a second through hole array, the second through hole array corresponds to the first through hole array, wherein the second through hole array includes multiple groups of second through holes corresponding to the multiple groups of first through holes, and the second through holes in each group of second through holes correspond to the first through holes in the corresponding first through hole group; a photoluminescent material layer is filled in each group of second through holes to obtain a first color conversion structure, wherein the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer; a side of the first color conversion structure opposite to the transparent substrate is bonded to the light emitting side of the micro LED chip to obtain a micro LED device.

[0005] Further, the first light absorbing layer is used to partially absorb the light of the third color emitted by the micro LED unit. Each group of first through holes includes three first through holes, a first barrier layer is arranged on the first light absorbing layer, so that the first barrier layer includes a first through hole array, and the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes multiple groups of first through holes, and each group of first through holes includes at least two first through holes, including: a first barrier layer is arranged on the first light absorbing layer and a first through hole array is opened on the first barrier layer, so that the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes multiple groups of first through holes, and each group of first through holes includes a first first through hole, a second first through hole and a third first through hole. A second barrier layer is arranged on the first barrier layer, so that the second barrier layer includes a second through hole array, the second through hole array corresponds to the first through hole array, wherein the second through hole array includes a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, and the second through holes in each group of second through holes correspond to the first through holes in the corresponding first through hole group, comprising: a second barrier layer is arranged on the first barrier layer and a second through hole array is opened on the second barrier layer, so that the second through hole array is aligned with the first through hole array, wherein the second through hole array includes a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, each group of second through holes includes three second through holes, and the three second through holes include a first second through hole aligned with the first first through hole, a second second through hole aligned with the second first through hole, and a third second through hole aligned with the third first through hole. The photoluminescent material layer includes a photoluminescent material layer of a first color and a photoluminescent material layer of a second color. The photoluminescent material layer is filled in each group of second through holes to obtain a first color conversion structure, wherein the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, including: filling the first second through hole in each group of second through holes with a photoluminescent material layer of the first color, and filling the second second through hole in each group of second through holes with a photoluminescent material layer of the second color, and the light corresponding to the first color, the light corresponding to the second color and the light of the third color are synthesized to obtain white light.

[0006] Further, before the second barrier layer is provided on the first barrier layer, the method further includes: a first filling step, the first filling step including at least one of the following steps: filling a first filling portion in a first first through hole in each group of first through holes, the first filling portion including a first filter layer that only allows light of the first color to pass through, a second light absorbing layer or a transparent material that is used to partially absorb light of a third color; filling a second filling portion in a second first through hole in each group of first through holes, the second filling portion including a second filter layer that only allows light of the second color to pass through, a second light absorbing layer or a transparent material that is used to partially absorb light of the third color; filling a third filling portion in a third first through hole in each group of first through holes, the third filling portion including a third filter layer that only allows light of the third color to pass through, a second light absorbing layer or a transparent material that is used to partially absorb light of the third color.

[0007] Further, each group of first through holes includes two first through holes, and before the second barrier layer is arranged on the first barrier layer, the method further includes: a second filling step, the second filling step includes at least one of the following steps: filling a fourth filling part in one first through hole in each group of first through holes, the fourth filling part includes a fourth filter layer that only allows light of a fourth color to pass through, a second light absorbing layer or a transparent material for partially absorbing light of a third color; filling a fifth filling part in another first through hole in each group of first through holes, the fifth filling part includes a third filter layer that only allows light of a third color to pass through, a second light absorbing layer or a transparent material for partially absorbing light of the third color.

[0008] Further, the first light absorbing layer is used to partially absorb the light of the third color emitted by the micro LED unit. A first barrier layer is arranged on the first light absorbing layer, so that the first barrier layer includes a first through hole array, and the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes a plurality of groups of first through holes, and each group of first through holes includes at least two first through holes, including: a first barrier layer is arranged on the first light absorbing layer and a first through hole array is opened on the first barrier layer, so that the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes a plurality of groups of first through holes, and each group of first through holes includes two first through holes. A second barrier layer is arranged on the first barrier layer, so that the second barrier layer includes a second through hole array, the second through hole array corresponds to the first through hole array, wherein the second through hole array includes a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, and the second through holes in each group of second through holes correspond to the first through holes in the corresponding first through hole group, comprising: a second barrier layer is arranged on the first barrier layer and a second through hole array is opened on the second barrier layer, so that the second through hole array is aligned with the first through hole array, wherein the second through hole array includes a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, and each group of second through holes includes two second through holes that are respectively aligned with two first through holes in the corresponding first through hole group. The photoluminescent material layer includes a photoluminescent material layer of a fourth color, and the photoluminescent material layer is filled in each group of second through holes to obtain a first color conversion structure, wherein the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, comprising: filling the photoluminescent material layer of the fourth color in the second through holes in each group of second through holes that are aligned with the first through holes used to fill the fourth filling part, and synthesizing the light corresponding to the fourth color and the light of the third color to obtain white light.

[0009] Furthermore, before the second barrier layer is disposed on the first barrier layer, the method further comprises: disposing a first reflective layer on the first barrier layer, the first reflective layer being used to partially reflect the light emitted by the micro LED unit. Disposing the second barrier layer on the first barrier layer comprises: disposing the second barrier layer on the first reflective layer.

[0010] Furthermore, when filling the photoluminescent material layer in each group of second through holes, the method also includes: filling a sixth filling portion in the second through holes other than the second through holes filled with the photoluminescent material layer in each group of second through holes, the sixth filling portion comprising a third light absorbing layer, a photoluminescent material layer of a third color, or a transparent material, and the third light absorbing layer is used to partially absorb the light emitted by the micro LED unit.

[0011] Furthermore, after each group of second through holes is filled with a photoluminescent material layer, the method further includes: arranging a second reflective layer on the second barrier layer and the photoluminescent material layer, wherein the second reflective layer is used to reflect light of a color corresponding to the photoluminescent material layer.

[0012] Furthermore, after the sixth filling part is filled in the second through holes other than the second through holes filled with the photoluminescent material layer in each group of second through holes, the method further comprises: providing an insulating layer on the second barrier layer, the photoluminescent material layer and the sixth filling part. Bonding the side of the first color conversion structure opposite to the transparent substrate to the light emitting side of the micro LED chip comprises: bonding the insulating layer of the first color conversion structure to the light emitting side of the micro LED chip.

[0013] Furthermore, after bonding the side of the first color conversion structure opposite to the transparent substrate to the light emitting side of the micro LED chip, the method includes: removing the transparent substrate of the first color conversion structure to obtain a second color conversion structure from the first color conversion structure.

[0014] According to another aspect of the present disclosure, a micro LED device is also provided.

[0015] The micro LED device comprises a second color conversion structure and a micro LED chip structure, wherein the micro LED chip structure comprises a micro LED chip, and the micro LED chip comprises a micro LED unit array composed of a plurality of micro LED units, wherein the second color conversion structure comprises: a first light absorption layer, wherein the first light absorption layer is used to partially absorb light emitted by the micro LED unit; a first barrier layer, wherein the first barrier layer is arranged under the first light absorption layer and comprises a first through hole array, wherein the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array The array includes a plurality of groups of first through holes, each group of first through holes includes at least two first through holes; a second barrier layer, the second barrier layer is arranged below the first barrier layer and includes a second through hole array, the second through hole array corresponds to the first through hole array, wherein the second through hole array includes a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, and the second through holes in each group of second through holes correspond to the first through holes in the corresponding first through hole group; a photoluminescent material layer, the photoluminescent material layer is filled in each group of second through holes, wherein the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer. The second barrier layer and the photoluminescent material layer of the second color conversion structure are arranged on the light emitting side of the micro LED chip.

[0016] Further, the first light-absorbing layer is used to partially absorb the light of the third color emitted by the micro LED unit, each group of first through holes includes three first through holes, the three first through holes include a first first through hole, a second first through hole and a third first through hole, each group of second through holes includes three second through holes, the three second through holes include a first second through hole aligned with the first first through hole, a second second through hole aligned with the second first through hole, and a third second through hole aligned with the third first through hole, the photoluminescent material layer includes a photoluminescent material layer of a first color and a photoluminescent material layer of a second color, the photoluminescent material layer of the first color is filled in the first second through hole in each group of second through holes, and the photoluminescent material layer of the second color is filled in the second second through hole in each group of second through holes, and the light corresponding to the first color, the light corresponding to the second color and the light of the third color are synthesized to obtain white light.

[0017] Further, the second color conversion structure also includes at least one of a first filling part, a second filling part and a third filling part, wherein: the first filling part is used to fill the first first through hole in each group of first through holes, and the first filling part includes a first filter layer that only allows light of the first color to pass through, and a second light absorbing layer or a transparent material that is used to partially absorb light of a third color; the second filling part is used to fill the second first through hole in each group of first through holes, and the second filling part includes a second filter layer that only allows light of the second color to pass through, and a second light absorbing layer or a transparent material that is used to partially absorb light of the third color; the third filling part is used to fill the third first through hole in each group of first through holes, and the third filling part includes a third filter layer that only allows light of the third color to pass through, and a second light absorbing layer or a transparent material that is used to partially absorb light of the third color.

[0018] Further, the first color is red, the second color is green and the third color is blue.

[0019] Further, each group of first through holes includes two first through holes, and the second color conversion structure also includes at least one of a fourth filling part and a fifth filling part, wherein: the fourth filling part is used to fill in one first through hole in each group of first through holes, and the fourth filling part includes a fourth filter layer that only allows light of a fourth color to pass through, and a second light absorbing layer or a transparent material that is used to partially absorb light of a third color; the fifth filling part is used to fill in another first through hole in each group of first through holes, and the fifth filling part includes a third filter layer that only allows light of a third color to pass through, and a second light absorbing layer or a transparent material that is used to partially absorb light of the third color.

[0020] Furthermore, the first light-absorbing layer is used to partially absorb the light of the third color emitted by the micro LED unit, each group of second through holes includes two second through holes respectively aligned with the two first through holes in the corresponding first through hole group, the photoluminescent material layer includes a photoluminescent material layer of a fourth color, and the photoluminescent material layer of the fourth color is filled in the second through holes in each group of second through holes that are aligned with the first through holes used to fill the fourth filling part, and the light corresponding to the fourth color and the light of the third color are synthesized to obtain white light.

[0021] Further, the fourth color is yellow and the third color is blue.

[0022] Furthermore, the second color conversion structure further includes a first reflective layer, which is disposed below the first barrier layer and is used to partially reflect light emitted by the micro LED unit, and the second barrier layer is disposed below the first reflective layer.

[0023] Furthermore, the second color conversion structure also includes a sixth filling portion, which includes a third light absorbing layer, a photoluminescent material layer of a third color and a transparent material. The sixth filling portion is filled in the second through holes other than the second through holes filled with the photoluminescent material layer in each group of second through holes, and the third light absorbing layer is used to partially absorb the light emitted by the micro LED unit.

[0024] Furthermore, the second color conversion structure further includes a second reflective layer, which is disposed below the second barrier layer and the photoluminescent material layer, and is used to reflect light of a color corresponding to the photoluminescent material layer.

[0025] Furthermore, the second color conversion structure further includes an insulating layer, which is disposed below the second barrier layer, the photoluminescent material layer and the sixth filling portion, and the insulating layer of the second color conversion structure is disposed on the light emitting side of the micro LED chip.

[0026] Furthermore, the micro LED chip structure also includes a driver chip, and the side of the micro LED chip opposite to the light emitting side is arranged on the driver chip, or the micro LED chip structure also includes a driver chip and a flexible circuit board, and the side of the micro LED chip opposite to the light emitting side is arranged on the driver chip to form a micro LED module, and the micro LED module is arranged on the flexible circuit board through the driver chip.

[0027] Further, the material of the first barrier layer and the material of the second barrier layer include visible light shielding materials, the material of the first color photoluminescent material layer and the material of the second color photoluminescent material layer include at least one of II-VI group quantum dots, III-V group quantum dots, perovskite quantum dots and carbon quantum dots, the material of the first light absorption layer and the material of the second light absorption layer include organic dyes, nano absorption particles or inorganic oxides for absorbing blue light, and the material of the first filter layer, the second filter layer and the third filter layer include organic dyes, nano absorption particles or inorganic oxides.

[0028] According to another aspect of the embodiments of the present disclosure, a display device is provided, comprising a micro LED device prepared by the above method.

[0029] By applying the technical solution disclosed in the present invention, a transparent substrate and a micro LED chip are obtained, a first light absorption layer is arranged on the transparent substrate, and the first light absorption layer is used to partially absorb the light emitted by the micro LED unit. Then a first barrier layer is arranged on the first absorption layer, and each group of first through holes included in the first barrier layer includes at least two first through holes. Then a second barrier layer is arranged on the first barrier layer, and the second through holes in each group of second through holes included in the second barrier layer correspond to the first through holes in the corresponding first through hole group. Then a photoluminescent material layer is filled in each group of second through holes to form a first color conversion structure, and the first color conversion structure is bonded to the light-emitting side of the micro LED chip to form a micro LED device.

[0030] On the one hand, in the micro LED device, the light emitted by the micro LED unit of the micro LED chip excites the material in the photoluminescent material layer to emit light of a color different from that of the light emitted by the micro LED unit. Since the first light absorbing layer can partially absorb the light emitted by the micro LED unit, the light emitted by the micro LED unit that does not correspond to the photoluminescent material layer does not pass through the photoluminescent material layer and is directly emitted from the micro LED device. The light overflow is reduced, thereby reducing the color deviation and poor color purity caused by the light overflow, thereby improving the balance of light of different colors emitted from the micro LED device, improving the color purity of the micro LED, and thereby improving the display effect of the micro LED device.

[0031] On the other hand, since the first light absorption layer covers the photoluminescent material layer, when a part of the light emitted by the micro LED unit does not participate in the excitation of the photoluminescent material layer and leaks out through the photoluminescent material layer, the first light absorption layer can absorb the leaked part of the light, thereby reducing the mixed output of the leaked part of the light and the different color lights emitted by the exciting photoluminescent material layer, thereby improving the color purity of the micro LED, thereby improving the display effect of the micro LED device. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] By reading the detailed description below with reference to the accompanying drawings, the above and other purposes, features and advantages of the exemplary embodiments of the present disclosure will become readily understood. In the accompanying drawings, several embodiments of the present disclosure are shown in an exemplary and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0033] Figure 1 is a flow chart showing a method for preparing a micro LED device according to one embodiment of the present disclosure;

[0034] Figures 2 to 13 is a schematic diagram showing a preparation process flow of a method for preparing a micro LED device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0035] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present disclosure will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0036] It should be noted that the following detailed descriptions are illustrative and are intended to provide further explanation of the present application. Unless otherwise specified, all technical and scientific terms used herein have the same meanings as those commonly understood by those skilled in the art to which the present application belongs.

[0037] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" may include both "above" and "below". The device may also be positioned in other different ways, rotated 90 degrees or in other orientations, and the spatially relative descriptions used herein are interpreted accordingly.

[0038] Now, exemplary embodiments according to the present disclosure will be described in more detail with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in a variety of different forms and should not be construed as being limited to the embodiments described herein. It should be understood that these embodiments are provided to make the disclosure of the present application thorough and complete, and to fully convey the concepts of these exemplary embodiments to those of ordinary skill in the art. In the accompanying drawings, for clarity, the thickness of the layers and regions is enlarged, and the same reference numerals are used to represent the same devices, and thus their descriptions will be omitted.

[0039] The present invention provides a method for preparing a micro LED device. Figures 1 to 13 , Figure 1 is a flow chart showing a method for preparing a micro LED device according to one embodiment of the present disclosure; Figures 2 to 13 is a schematic diagram showing a preparation process flow of a method for preparing a micro LED device according to an embodiment of the present disclosure.

[0040] like Figure 1 As shown, the method for preparing a micro LED device includes the following steps S101-S106.

[0041] Step S101: Obtain a transparent substrate and a micro LED chip structure, wherein the micro LED chip structure comprises a micro LED chip, and the micro LED chip comprises a micro LED unit array composed of a plurality of micro LED units.

[0042] Step S102: a first light absorbing layer is disposed on the transparent substrate, wherein the first light absorbing layer is used to partially absorb the light emitted by the micro LED unit.

[0043] Step S103: a first barrier layer is disposed on the first light absorbing layer, so that the first barrier layer includes a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes a plurality of groups of first through holes, and each group of first through holes includes at least two first through holes.

[0044] Step S104: a second barrier layer is disposed on the first barrier layer, so that the second barrier layer includes a second through hole array, the second through hole array corresponds to the first through hole array, wherein the second through hole array includes a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, and the second through holes in each group of second through holes correspond to the first through holes in the corresponding first through hole group.

[0045] Step S105: Filling a photoluminescent material layer in each group of second through holes to obtain a first color conversion structure, wherein the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer.

[0046] Step S106: Bonding the side of the first color conversion structure opposite to the transparent substrate to the light emitting side of the micro LED chip to obtain a micro LED device.

[0047] According to the technical solution, a transparent substrate and a micro LED chip can be obtained, a first light absorbing layer is arranged on the transparent substrate, and the first light absorbing layer is used to partially absorb the light emitted by the micro LED unit, and then a first barrier layer is arranged on the first absorbing layer, each group of first through holes included in the first barrier layer includes at least two first through holes, and then a second barrier layer is arranged on the first barrier layer, and the second through holes in each group of second through holes included in the second barrier layer correspond to the first through holes in the corresponding first through hole group, and then a photoluminescent material layer is filled in each group of second through holes to form a first color conversion structure, and the first color conversion structure is bonded to the light emitting side of the micro LED chip to form a micro LED device.

[0048] On the one hand, in the micro LED device, the light emitted by the micro LED unit of the micro LED chip excites the material in the photoluminescent material layer to emit light of a color different from that of the light emitted by the micro LED unit. Since the first light absorbing layer can partially absorb the light emitted by the micro LED unit, the light emitted by the micro LED unit that does not correspond to the photoluminescent material layer does not pass through the photoluminescent material layer and is directly emitted from the micro LED device. The light overflow is reduced, thereby reducing the color deviation and poor color purity caused by the light overflow, thereby improving the balance of light of different colors emitted from the micro LED device, improving the color purity of the micro LED, and thereby improving the display effect of the micro LED device.

[0049] On the other hand, since the first light absorption layer covers the photoluminescent material layer, when a part of the light emitted by the micro LED unit does not participate in the excitation of the photoluminescent material layer and leaks out through the photoluminescent material layer, the first light absorption layer can absorb the leaked part of the light, thereby reducing the mixed output of the leaked part of the light and the different color lights emitted by the exciting photoluminescent material layer, thereby improving the color purity of the micro LED, thereby improving the display effect of the micro LED device.

[0050] In step S101, a transparent substrate and a micro LED chip structure may be obtained, wherein the micro LED chip structure includes a micro LED chip, and the micro LED chip includes a micro LED unit array composed of a plurality of micro LED units.

[0051] According to an embodiment of the present disclosure, a transparent substrate and a micro LED chip structure may be first obtained. The transparent substrate may include any applicable substrate such as a glass substrate, a polyimide substrate or a sapphire substrate. The micro LED chip structure includes a micro LED chip, and the micro LED chip includes a micro LED unit array for emitting light. Among them, the micro LED chip may be any micro LED chip suitable for preparing a micro LED device. For example, the structure of the micro LED chip may include a face-up structure, a flip-chip structure or a vertical structure, etc., which are not limited here. Each micro LED unit in the micro LED unit array may include an exposed first semiconductor layer on its light-emitting side. Depending on the type of micro LED device, in some embodiments, the first semiconductor layer may include an N-GaN layer; in other embodiments, the first semiconductor layer may include a P-GaN layer. It is worth noting that the micro LED chip structure may also be obtained in any step before the subsequent step of using the micro LED chip structure.

[0052] Reference Figure 2-Figure 13 ,in Figure 2 FIG. 1 shows a side view of a transparent substrate 101 according to an embodiment of the present disclosure. Figure 2 As shown, the transparent substrate 101 may be, for example, a glass substrate.

[0053] Reference Figure 2-Figure 13 ,in Figure 3 FIG. 4 shows a side view of a micro LED chip structure according to an embodiment of the present disclosure. Figure 3 As shown, the micro LED chip structure includes a micro LED chip 20, and the micro LED chip 20 includes a micro LED unit array 201 composed of micro LED units 2011. Each micro LED unit 2011 in the micro LED unit array 201 includes a first semiconductor layer 20111 such as an N-GaN layer on the light emitting side. Figure 3 As shown, the first semiconductor layer 20111 is common to each micro LED unit 2011 in the micro LED unit array 201 , that is, the first semiconductor layer 20111 is integrated in the micro LED chip 20 .

[0054] In step S102 , a first light absorption layer may be disposed on the transparent substrate, wherein the first light absorption layer is used to partially absorb the light emitted by the micro LED unit.

[0055] According to an embodiment of the present disclosure, after obtaining a transparent substrate, a first light absorbing layer may be provided on the transparent substrate. The first light absorbing layer is used to partially absorb the light emitted by the micro LED unit so that a portion of the light emitted by the micro LED unit is absorbed after passing through the first light absorbing layer. The material of the first light absorbing layer includes an organic dye, nano absorption particles or an inorganic oxide for absorbing blue light, for example, it may be a zinc oxide nanoparticle photoresist. The first light absorbing layer may be used to partially absorb a third color of light, for example, blue light, emitted by the micro LED unit.

[0056] Reference Figure 2-Figure 13 ,in Figure 4 FIG. 1 shows a side view schematic diagram of a first light absorbing layer 102 disposed on a transparent substrate 101. Figure 4 As shown, a first light absorbing layer 102 is disposed on a transparent substrate 101. The first light absorbing layer 102 is used to partially absorb, for example, blue light emitted by the micro LED unit.

[0057] In step S103, a first barrier layer may be provided on the first light absorbing layer, so that the first barrier layer includes a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes a plurality of groups of first through holes, and each group of first through holes includes at least two first through holes.

[0058] According to an embodiment of the present disclosure, after setting the first light absorbing layer, a first barrier layer can be set on the first light absorbing layer, and the material of the first barrier layer may include a visible light shielding material, which may include, for example, a matte material such as black photoresist, and a reflective material such as a metal layer.

[0059] According to an embodiment of the first barrier layer disclosed in the present invention, each group of first through holes includes three first through holes, and the first barrier layer is arranged on the first light absorbing layer, so that the first barrier layer includes a first through hole array, and the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes multiple groups of first through holes, and each group of first through holes includes at least two first through holes, including: a first barrier layer is arranged on the first light absorbing layer and a first through hole array is opened on the first barrier layer, so that the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes multiple groups of first through holes, and each group of first through holes includes a first first through hole, a second first through hole and a third first through hole.

[0060] According to another embodiment of the first barrier layer disclosed in the present invention, a first barrier layer is disposed on the first light absorbing layer, so that the first barrier layer includes a first through hole array, and the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes multiple groups of first through holes, and each group of first through holes includes at least two first through holes, including: a first barrier layer is disposed on the first light absorbing layer and a first through hole array is opened on the first barrier layer, so that the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes multiple groups of first through holes, and each group of first through holes includes two first through holes.

[0061] Reference Figure 2-Figure 13 ,in Figure 5 FIG. 1 shows a side view of a first barrier layer 103 disposed on the first light absorbing layer 102. Figure 5 As shown, the first barrier layer 103 may be, for example, a black photoresist layer, so the black photoresist layer may be coated on the first light absorbing layer 102 by spin coating, and then, for example, a first through hole array 1030 may be opened on the black photoresist layer by photolithography, so that the arrangement of the first through hole array 1030 corresponds to the arrangement of the micro LED unit array 201 to be used later and exposes the first light absorbing layer 102, wherein the first through hole array 1030 includes a plurality of groups of first through holes, each group of first through holes includes a first first through hole 1031, a second first through hole 1032 and a third first through hole 1033. For clarity and simplicity, Figure 5 Only a group of first through holes included in the first through hole array 1030 is shown, and the group of first through holes includes a first first through hole 1031, a second first through hole 1032, and a third first through hole 1033. Figure 5 The number of groups of first through holes and the number of first through holes in each group of first through holes shown in the figure are only for illustration and are not limited here. The first barrier layer 103 such as a black photoresist layer can make the screen appear black when the display device is powered off or turned off.

[0062] In step S104, a second barrier layer may be disposed on the first barrier layer, so that the second barrier layer includes a second through hole array, the second through hole array corresponds to the first through hole array, wherein the second through hole array includes a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, and the second through holes in each group of second through holes correspond to the first through holes in the corresponding first through hole group.

[0063] According to an embodiment of the present disclosure, after preparing the first barrier layer, a second barrier layer may be provided on the first barrier layer. The second barrier layer may function as a grid, and the interior of the grid may be filled with a corresponding material. In some embodiments, the second barrier layer may include a visible light shielding material, which may include, for example, a matte material such as black photoresist, or a reflective material such as a metal layer.

[0064] Referring to an embodiment of the first barrier layer in step S103, according to an embodiment of the second barrier layer of the present disclosure, a second barrier layer is disposed on the first barrier layer so that the second barrier layer includes a second through hole array, the second through hole array corresponds to the first through hole array, wherein the second through hole array includes multiple groups of second through holes corresponding to the multiple groups of first through holes, and the second through holes in each group of second through holes correspond to the first through holes in the corresponding first through hole group, including: disposing a second barrier layer on the first barrier layer and opening a second through hole array on the second barrier layer so that the second through hole array is aligned with the first through hole array, wherein the second through hole array includes multiple groups of second through holes corresponding to the multiple groups of first through holes, each group of second through holes includes three second through holes, and the three second through holes include a first second through hole aligned with the first first through hole, a second second through hole aligned with the second first through hole, and a third second through hole aligned with the third first through hole.

[0065] Further, before the second barrier layer is provided on the first barrier layer, the method further includes: a first filling step, the first filling step including at least one of the following steps: filling a first filling portion in a first first through hole in each group of first through holes, the first filling portion including a first filter layer that only allows light of the first color to pass through, a second light absorbing layer or a transparent material that is used to partially absorb light of a third color; filling a second filling portion in a second first through hole in each group of first through holes, the second filling portion including a second filter layer that only allows light of the second color to pass through, a second light absorbing layer or a transparent material that is used to partially absorb light of the third color; filling a third filling portion in a third first through hole in each group of first through holes, the third filling portion including a third filter layer that only allows light of the third color to pass through, a second light absorbing layer or a transparent material that is used to partially absorb light of the third color.

[0066] In this embodiment, the light of the first color refers to the light of the wavelength range corresponding to the first color, the light of the second color refers to the light of the wavelength range corresponding to the second color, and the light of the third color refers to the light of the wavelength range corresponding to the third color. The first color may be red, the second color may be green, and the third color may be blue. The material of the second light absorption layer includes an organic dye, nano absorption particles, or an inorganic oxide for absorbing blue light. The material of the second light absorption layer may be the same as that of the first light absorption layer, for example, it may be a zinc oxide nanoparticle photoresist. The material of the first filter layer, the material of the second filter layer, and the material of the third filter layer include organic dyes, nano absorption particles, or inorganic oxides.

[0067] Referring to another embodiment of the first barrier layer in step S103, according to another embodiment of the second barrier layer of the present disclosure, a second barrier layer is disposed on the first barrier layer so that the second barrier layer includes a second through hole array, the second through hole array corresponds to the first through hole array, wherein the second through hole array includes multiple groups of second through holes corresponding to the multiple groups of first through holes, and the second through holes in each group of second through holes correspond to the first through holes in the corresponding first through hole group, including: disposing a second barrier layer on the first barrier layer and opening a second through hole array on the second barrier layer so that the second through hole array is aligned with the first through hole array, wherein the second through hole array includes multiple groups of second through holes corresponding to the multiple groups of first through holes, and each group of second through holes includes two second through holes that are respectively aligned with two first through holes in the corresponding first through hole group.

[0068] Further, each group of first through holes includes two first through holes, and before the second barrier layer is arranged on the first barrier layer, the method further includes: a second filling step, the second filling step includes at least one of the following steps: filling a fourth filling part in one first through hole in each group of first through holes, the fourth filling part includes a fourth filter layer that only allows light of a fourth color to pass through, a second light absorbing layer or a transparent material for partially absorbing light of a third color; filling a fifth filling part in another first through hole in each group of first through holes, the fifth filling part includes a third filter layer that only allows light of a third color to pass through, a second light absorbing layer or a transparent material for partially absorbing light of the third color.

[0069] In this embodiment, the light of the fourth color refers to the light of the wavelength range corresponding to the fourth color, and the light of the third color refers to the light of the wavelength range corresponding to the third color. The fourth color may be yellow and the third color may be blue. The material of the second light absorption layer includes an organic dye, nano absorption particles or inorganic oxide for partially absorbing the light of the third color such as blue light. The material of the second light absorption layer may be the same as the material of the first light absorption layer, for example, it may be zinc oxide nanoparticle photoresist. The material of the third filter layer and the material of the fourth filter layer include organic dyes, nano absorption particles or inorganic oxides.

[0070] According to an embodiment of the present disclosure, before the second barrier layer is disposed on the first barrier layer, the method further includes: disposing a first reflective layer on the first barrier layer, the first reflective layer being used to partially reflect the light emitted by the micro LED unit. Disposing the second barrier layer on the first barrier layer includes: disposing the second barrier layer on the first reflective layer. The first reflective layer may include a distributed Bragg reflector for partially reflecting the light emitted by the micro LED unit, and may also include any material layer for reflecting the light emitted by the micro LED unit. The first reflective layer may be, for example, a distributed Bragg reflector formed by alternating stacking of silicon dioxide layers and titanium dioxide layers.

[0071] Reference Figure 2-Figure 13 ,in Figure 6 A side view schematic diagram of the filling portion filled in each group of first through holes is shown. Figure 5 ,like Figure 6 As shown, a first filling portion is filled in the first through hole 1031 in each group of first through holes, and the first filling portion may include a first filter layer 1041 that only allows light of a first color, such as red, to pass through; a second filling portion is filled in the second through hole 1032 in each group of first through holes, and the second filling portion may include a second filter layer 1042 that only allows light of a second color, such as green, to pass through; a second light absorption layer 1043 is filled in the third through hole 1033 in each group of first through holes, and the second light absorption layer 1043 is used to partially absorb light of a third color, such as blue, to obtain the following: Figure 5 The first intermediate structure 30 is shown. It is worth noting that in other embodiments, when there are unfilled first through holes in each group of first through holes, a transparent material may be filled in the unfilled first through holes so as to support the portion above the corresponding first through hole in a subsequent preparation process requiring support, and the transparent material may be any applicable material such as a transparent resin.

[0072] Reference Figure 2-Figure 13 ,in Figure 7FIG. 4 shows a side view of a first reflective layer 105 disposed on the first intermediate structure 30. Figure 7 As shown, a first reflective layer 105, such as a distributed Bragg reflective film, is disposed on the first intermediate structure 30. The first reflective layer 105 is used to partially reflect, for example, blue light emitted by the micro LED unit.

[0073] Reference Figure 2-Figure 13 ,in Figure 8 FIG. 1 shows a side view of a second barrier layer 106 disposed on the first reflective layer 105. Figure 8 As shown, the second barrier layer 106 may be, for example, a black photoresist layer. Therefore, the black photoresist layer may be coated on the first reflective layer 105 by spin coating. Then, for example, a second through hole array 1060 may be opened on the black photoresist layer by photolithography, so that the second through hole array 1060 is aligned with the first through hole array 1030, and the second through hole array 1060 exposes a portion of the second light absorbing layer 105. The second through hole array 1060 includes a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, and each group of second through holes includes a first second through hole 1061 aligned with the first first through hole 1031, a second second through hole 1062 aligned with the second first through hole 1032, and a third second through hole 1063 aligned with the third first through hole 1033, so as to obtain the following: Figure 8 The structure shown.

[0074] In step S105 , a photoluminescent material layer may be filled in each group of second through holes to obtain a first color conversion structure, wherein the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer.

[0075] According to an embodiment of the present disclosure, after obtaining the second through hole array, a photoluminescent material layer may be filled into the second through hole array.

[0076] Referring to an embodiment of the first barrier layer in step S103 and an embodiment of the second barrier layer and the filling of the first through hole in step S104, according to an embodiment of the filled photoluminescent material layer of the present disclosure, the photoluminescent material layer includes a photoluminescent material layer of a first color and a photoluminescent material layer of a second color, and the photoluminescent material layer is filled in each group of second through holes to obtain a first color conversion structure, wherein the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, comprising: filling the first second through hole in each group of second through holes with the photoluminescent material layer of the first color, and filling the second second through hole in each group of second through holes with the photoluminescent material layer of the second color, and synthesizing the light corresponding to the first color, the light corresponding to the second color, and the light corresponding to the third color to obtain white light.

[0077] In this embodiment, the first color, the second color and the third color may be three primary colors, for example, the first color is red, the second color is green and the third color is blue. The material of the photoluminescent material layer of the first color and the material of the photoluminescent material layer of the second color include at least one of II-VI group quantum dots, III-V group quantum dots, perovskite quantum dots and carbon quantum dots.

[0078] Referring to another embodiment of the first barrier layer in step S103 and another embodiment of the second barrier layer and the filling of the first through hole in step S104, according to another embodiment of the filled photoluminescent material layer of the present disclosure, the photoluminescent material layer includes a photoluminescent material layer of a fourth color, and the photoluminescent material layer is filled in each group of second through holes to obtain a first color conversion structure, wherein the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, including: filling the photoluminescent material layer of the fourth color in the second through holes in each group of second through holes that are aligned with the first through holes for filling the fourth filling part, and synthesizing the light corresponding to the fourth color and the light of the third color to obtain white light.

[0079] In this embodiment, the fourth color is yellow light and the third color is blue. The material of the photoluminescent material layer of the fourth color may include at least one of II-VI group quantum dots, III-V group quantum dots, perovskite quantum dots and carbon quantum dots.

[0080] According to an embodiment of the present disclosure, when a photoluminescent material layer is filled in each group of second through holes, the method further includes: filling a sixth filling portion in a second through hole other than the second through hole filled with the photoluminescent material layer in each group of second through holes, the sixth filling portion including a third light absorbing layer, a photoluminescent material layer of a third color, or a transparent material, the third light absorbing layer being used to partially absorb the light emitted by the micro LED unit. The material of the third light absorbing layer includes an organic dye, nano absorption particles, or an inorganic oxide for absorbing blue light, and the material of the third light absorbing layer may be the same as the material of the first light absorbing layer and the material of the second light absorbing layer, for example, zinc oxide nanoparticle photoresist. In addition, the sixth filling portion may also include a photoluminescent material layer of a third color, for example, blue, and the material of the photoluminescent material layer of the third color includes at least one of group II-VI quantum dots, group III-V quantum dots, perovskite quantum dots, and carbon quantum dots.

[0081] According to an embodiment of the present disclosure, after the photoluminescent material layer is filled in each group of second through holes, the method further includes: arranging a second reflective layer on the second barrier layer and the photoluminescent material layer, the second reflective layer being used to reflect light of a color corresponding to the photoluminescent material layer. The second reflective layer may include a distributed Bragg reflective film for reflecting light of a color corresponding to the photoluminescent material layer, and of course may also include any material layer for reflecting light of a color corresponding to the photoluminescent material layer. The second reflective layer may be, for example, a distributed Bragg reflective film formed by alternately stacking silicon dioxide layers and titanium dioxide layers. It is worth noting that although the second reflective layer and the first reflective layer are both distributed Bragg reflective films formed by alternately stacking silicon dioxide layers and titanium dioxide layers, the number of silicon dioxide layers and titanium dioxide layers in the second reflective layer and the thickness of each silicon dioxide layer and each titanium dioxide layer are different from those of the first reflective layer.

[0082] According to an embodiment of the present disclosure, after filling the sixth filling part in the second through holes other than the second through holes filled with the photoluminescent material layer in each group of second through holes, the method further includes: providing an insulating layer on the second barrier layer, the photoluminescent material layer and the sixth filling part.

[0083] Reference Figure 2-Figure 13 ,in Fig. 9 A schematic side view of a photoluminescent material layer filled in each group of second through holes is shown. Figure 8 ,like Fig. 9 As shown, the first second through hole 1061 in each group of second through holes is filled with a first color photoluminescent material layer 1071, such as red, and the second second through hole 1062 in each group of second through holes is filled with a second color photoluminescent material layer 1072, such as green.

[0084] Reference Figure 2-Figure 13 ,in Fig.10 A side view schematic diagram of the sixth filling portion filled in the second through holes other than the second through holes filled with the photoluminescent material layer in each group of second through holes is shown. Figure 8 and Fig. 9 ,like Fig.10As shown, the sixth filling part is, for example, a third light absorbing layer 1073, and the third light absorbing layer 1073 for partially absorbing, for example, blue light is filled in the third second through hole 1063 aligned with the third first through hole 1033. The material of the third light absorbing layer 1073 includes an organic dye, nano absorption particles or inorganic oxide for absorbing blue light, and the material of the third light absorbing layer 1073 can be the same as that of the first light absorbing layer 1043 and the second light absorbing layer 105. It is worth noting that the above filling order of the first color photoluminescent material layer 1071, the second color photoluminescent material layer 1072 and the third light absorbing layer 1073 is only exemplary and is not limited here. The filling order of the first color photoluminescent material layer 1071, the second color photoluminescent material layer 1072 and the third light absorbing layer 1073 can be arbitrarily adjusted according to the actual preparation conditions such as specific processes and equipment. The sixth filling part may further include a photoluminescent material layer of a third color, such as blue, so that the light of a third color, such as blue light, emitted by the micro LED unit excites the photoluminescent material layer of the third color to emit light of a third color, such as blue light.

[0085] Reference Figure 2-Figure 13 ,in Fig.11 FIG. 4 is a side view schematic diagram showing an insulating layer disposed on the second barrier layer, the photoluminescent material layer and the sixth filling portion. Fig.11 As shown, a plasma enhanced chemical vapor deposition (PECVD) method can be used to deposit an insulating layer 108 such as a silicon dioxide layer on the second barrier layer 106, the first photoluminescent material layer 1071, the second photoluminescent material layer 1072 and the third light absorbing layer 1073 to obtain a Fig.11 The first color conversion structure 10 shown. Of course, the insulating layer may also include any other applicable materials, such as any applicable polymer organic materials and inorganic oxides, and any applicable preparation process may be used to prepare the insulating layer for different materials. The insulating layer is used to protect other parts of the first color conversion structure, and can be used as a surface layer of the first color conversion structure to make the surface of the first color conversion structure smoother, thereby facilitating the subsequent bonding of the first color conversion structure with the micro LED chip.

[0086] In step S106, the side of the first color conversion structure opposite to the transparent substrate may be bonded to the light emitting side of the micro LED chip to obtain a micro LED device.

[0087] According to an embodiment of the present disclosure, after obtaining the first color conversion structure, the side of the first color conversion structure opposite to the transparent substrate can be bonded to the light emitting side of the micro LED chip to obtain a micro LED device.

[0088] Further, in a case where an insulating layer is provided on the second barrier layer, the photoluminescent material layer and the sixth filling part, bonding the side of the first color conversion structure opposite to the transparent substrate to the light emitting side of the micro LED chip includes: bonding the insulating layer of the first color conversion structure to the light emitting side of the micro LED chip.

[0089] Furthermore, each micro LED unit in the micro LED unit array includes a first semiconductor layer on the light emitting side, and bonding the insulating layer of the first color conversion structure to the light emitting side of the micro LED chip includes: bonding the insulating layer of the first color conversion structure to the first semiconductor layer.

[0090] According to an embodiment of the present disclosure, after bonding the side of the first color conversion structure opposite to the transparent substrate to the light-emitting side of the micro LED chip, the method includes: removing the transparent substrate of the first color conversion structure to obtain a second color conversion structure from the first color conversion structure.

[0091] According to an embodiment of the present disclosure, the micro LED chip structure also includes a driving chip, and the side of the micro LED chip opposite to the light emitting side is arranged on the driving chip, or the micro LED chip structure also includes a driving chip and a flexible circuit board, and the side of the micro LED chip opposite to the light emitting side is arranged on the driving chip to form a micro LED module, and the micro LED module is arranged on the flexible circuit board through the driving chip.

[0092] Reference Figure 2-Figure 13 ,in Fig.12 FIG. 4 shows a side view of bonding the first color conversion structure 10 to the micro LED chip 20 according to one embodiment of the present disclosure. Fig.12 As shown, the insulating layer 108 of the first color conversion structure 10 is bonded to the first semiconductor layer 20111 of the LED chip 20 of the micro LED chip structure to obtain Fig.12 The structure shown.

[0093] Reference Figure 2-Figure 13 ,in Fig.13 FIG. 4 shows a side view of a micro LED device 1 according to an embodiment of the present disclosure. Fig.13 As shown, remove Fig.12 The transparent substrate 101 of the first color conversion structure 10 in the structure shown in FIG. 1 is used to obtain the second color conversion structure 11 through the first color conversion structure 10. Fig.13 The micro LED device 1 is shown.

[0094] Reference Figures 2 to 13It should be understood that the light of the third color, such as blue light, emitted by the micro LED unit 2011 excites the photoluminescent material layer 1071 of the first color, such as red, to emit red light, and the light of the third color, such as blue light, emitted by the micro LED unit 2011 excites the photoluminescent material layer 1072 of the second color, such as green, to emit green light, and the light of the third color, such as blue light, emitted by the micro LED unit corresponding to the third second through hole 1063 is partially absorbed when passing through the first light absorption layer 102, and part of the blue light still passes through the first light absorption layer 102. The light of the first color, such as red light, the light of the second color, such as green light, and the light of the third color, such as blue light, emitted through the photoluminescent material layer and the first light absorption layer 102 can be synthesized to obtain white light. Thus, by providing a first light absorption layer that partially absorbs, for example, blue light emitted by the micro LED unit, the blue light overflow caused by the blue light emitted by the micro LED unit corresponding to the third second through hole directly emitted from the micro LED device can be reduced, thereby reducing the color deviation and poor color purity caused by the blue light overflow, thereby improving the balance of light of different colors emitted from the micro LED device, improving the color purity of the micro LED, and further improving the display effect of the micro LED device. In addition, since the first light absorption layer 102 covers the photoluminescent material layer 1071 of the first color, for example, red, and the photoluminescent material layer 1072 of the second color, for example, green, when a part of the blue light emitted by the micro LED unit corresponding to the photoluminescent material layer does not participate in the excitation of the photoluminescent material layer and passes through the photoluminescent material layer and leaks out, the first light absorption layer 102 can absorb the leaked part of the blue light, thereby reducing the mixed output of the leaked part of the blue light and the red light and green light emitted by the exciting photoluminescent material layer, thereby improving the color purity of the micro LED, thereby improving the display effect of the micro LED device.

[0095] Furthermore, since the third first through hole 1033 is aligned with the third second through hole 1063, when the second light absorption layer 1043 is filled in the third first through hole 1033, the second light absorption layer 1043 can partially absorb, for example, blue light emitted by the micro LED unit 2011 corresponding to the third first through hole 1033, thereby further reducing the blue light overflow caused by the blue light emitted by the micro LED unit directly emitted from the micro LED device, thereby further improving the display effect of the micro LED device.

[0096] In addition, regarding the first reflective layer 105, the first reflective layer 105 can partially reflect, for example, blue light emitted by the micro LED unit 2011 corresponding to the third first through hole 1033, thereby further reducing the blue light overflow caused by the blue light emitted by the micro LED unit directly emitted from the micro LED device, thereby further improving the display effect of the micro LED device. And because the first light absorption layer 105 covers the photoluminescent material layer, when a part of, for example, blue light emitted by the micro LED unit corresponding to the photoluminescent material layer does not participate in the excitation of the photoluminescent material layer and passes through the photoluminescent material layer and leaks out, the first reflective layer 105 can reflect the leaked part of the light back to the photoluminescent material layer and re-participate in the excitation of the photoluminescent material layer, thereby increasing the light participating in the excitation of the photoluminescent material layer, thereby increasing the light output of the light of the color corresponding to the photoluminescent material layer, thereby improving the brightness of the micro LED, and reducing the insufficient color purity and low saturation caused by the mixed output of the leaked part of the light and the light of different colors emitted by the exciting photoluminescent material layer, thereby improving the display effect of the micro LED device.

[0097] In addition, when the third light absorption layer 1073 is filled in the third third through hole 1063, the third light absorption layer 1073 can further enhance the absorption of, for example, blue light emitted by the micro LED unit 2011 corresponding to the third second through hole 1063, thereby further reducing the blue light overflow caused by the light emitted by the micro LED unit directly from the micro LED device, thereby further improving the display effect of the micro LED device.

[0098] Furthermore, regarding the second reflective layer, the second reflective layer is disposed on the second barrier layer, the photoluminescent material layer and the sixth filling portion, and the insulating layer can be disposed on the second reflective layer and between the second reflective layer and the micro LED chip, so the second reflective layer can cover, for example, the photoluminescent material layer of the first color, the photoluminescent material layer of the second color and the sixth filling portion of, for example, the third light absorbing layer. Since the second reflective layer is used to reflect light of the color corresponding to the photoluminescent material layer, light such as blue emitted from the micro LED unit can pass through the second reflective layer, and when the blue light emitted by the micro LED unit excites the photoluminescent material layer of the first color such as red to emit red light, part of the excited red light will be emitted toward the direction of the micro LED unit, and the second reflective layer can reflect the part of the red light toward the direction of the photoluminescent material layer of the first color such as red, thereby increasing the light output of the light of the color corresponding to the photoluminescent material layer, thereby improving the brightness of the micro LED, and preventing the red light from being emitted toward the micro LED unit. The part of the red light emitted in the direction of the D unit interferes with the blue light emitted by the micro LED unit; similarly, when the blue light emitted by the micro LED unit excites the photoluminescent material layer of the second color, such as green, to emit green light, part of the excited green light will be emitted in the direction of the micro LED unit, and the second reflective layer can reflect the part of the green light in the direction of the photoluminescent material layer of the second color, such as green, so as to increase the light output of the light of the color corresponding to the photoluminescent material layer, thereby improving the brightness of the micro LED and preventing the part of the green light emitted in the direction of the micro LED unit from interfering with the blue light emitted by the micro LED unit. It is worth noting that when the first through hole 1031 is filled with the first filter layer 1041 and the second through hole 1032 is filled with the second filter layer 1042, the first filter layer 1041 only allows the light of the first color, such as red light, to pass through, and the first filter layer 1041 will reflect the light of the third color, such as blue light, in the direction of the photoluminescent material layer 1071 of the first color, such as red. The second filter layer 1042 allows only light of the second color, such as green light, to pass through, and the second filter layer 1042 reflects light of the third color, such as blue light, toward the direction of the photoluminescent material layer 1072 of the second color, such as green. Therefore, the first filter layer 1041 and the second filter layer 1042 function to reflect light other than the light of the corresponding color, which is different from the light absorption function of the first light absorption layer, the second light absorption layer and the third light absorption layer.

[0099] It is worth noting that when the material of the second barrier layer is a transparent material, the number of second through holes in each group of second through holes may be different from the number of first through holes in the corresponding first through hole group. For example, in the case where each group of first through holes includes a first first through hole, a second first through hole and a third first through hole, the corresponding second through hole group may include a first second through hole aligned with the first first through hole and a second second through hole aligned with the second first through hole, and the first second through hole and the second second through hole may be filled with a photoluminescent material layer. Since the second barrier layer is a transparent material, the light emitted by the micro LED unit that does not correspond to the photoluminescent material layer may pass through the second barrier layer of transparent material and be emitted from the micro LED device.

[0100] The present disclosure also provides a micro LED device.

[0101] like Figure 2-Figure 13 As shown, the micro LED device 1 includes a second color conversion structure 11 and a micro LED chip structure, wherein the micro LED chip structure includes a micro LED chip 20, and the micro LED chip 20 includes a micro LED unit array 201 composed of a plurality of micro LED units 2011, wherein the second color conversion structure 11 includes: a first light absorption layer 102, wherein the first light absorption layer 102 is used to partially absorb the light emitted by the micro LED unit 2011; a first barrier layer 103, wherein the first barrier layer 103 is disposed below the first light absorption layer 102 and includes a first through hole array 1030, wherein the arrangement of the first through hole array 1030 corresponds to the arrangement of the micro LED unit array 201, wherein the second color conversion structure 11 includes: a first light absorption layer 102, wherein the first light absorption layer 102 is used to partially absorb the light emitted by the micro LED unit 2011; and .... The first through hole array 1030 includes a plurality of groups of first through holes, each group of first through holes includes at least two first through holes; the second barrier layer 106 is arranged below the first barrier layer 103 and includes a second through hole array 1060, the second through hole array 1060 corresponds to the first through hole array 1030, wherein the second through hole array 1060 includes a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, and the second through holes in each group of second through holes correspond to the first through holes in the corresponding first through hole group; and a photoluminescent material layer is filled in each group of second through holes, wherein the color of light emitted by the micro LED unit 2011 is different from the color corresponding to the photoluminescent material layer. The second barrier layer 106 and the photoluminescent material layer of the second color conversion structure 11 are arranged on the light emitting side of the micro LED chip 20.

[0102] According to an embodiment of the present disclosure, the first light absorbing layer 102 is used to partially absorb the light of the third color emitted by the micro LED unit 2011, each group of first through holes includes three first through holes, the three first through holes include a first first through hole 1031, a second first through hole 1032 and a third first through hole 1033, each group of second through holes includes three second through holes, the three second through holes include a first second through hole 1061 aligned with the first first through hole 1031, a second second through hole 1062 aligned with the second first through hole 1032, and a third second through hole 1063 aligned with the third first through hole 1064. The through hole 1033 is aligned with the third second through hole 1063, the photoluminescent material layer includes a photoluminescent material layer 1071 of a first color and a photoluminescent material layer 1072 of a second color, the photoluminescent material layer 1071 of the first color is filled in the first second through hole 1061 in each group of second through holes, and the photoluminescent material layer 1072 of the second color is filled in the second second through hole 1062 in each group of second through holes, and the light corresponding to the first color, the light corresponding to the second color and the light corresponding to the third color are synthesized to obtain white light.

[0103] According to an embodiment of the present disclosure, the second color conversion structure 11 further includes at least one of a first filling portion, a second filling portion and a third filling portion, wherein: the first filling portion is used to fill the first first through hole 1031 in each group of first through holes, and the first filling portion includes a first filter layer 1041 that only allows light of the first color to pass through, and a second light absorption layer or a transparent material for partially absorbing light of the third color; the second filling portion is used to fill the second first through hole 1032 in each group of first through holes, and the second filling portion includes a second filter layer 1042 that only allows light of the second color to pass through, and a second light absorption layer or a transparent material for partially absorbing light of the third color; the third filling portion is used to fill the third first through hole 1033 in each group of first through holes, and the third filling portion includes a third filter layer that only allows light of the third color to pass through, and a second light absorption layer 1043 or a transparent material for partially absorbing light of the third color.

[0104] According to an embodiment of the present disclosure, the first color is red, the second color is green, and the third color is blue.

[0105] According to an embodiment of the present disclosure, each group of first through holes includes two first through holes, and the second color conversion structure also includes at least one of a fourth filling part and a fifth filling part, wherein: the fourth filling part is used to fill in a first through hole in each group of first through holes, and the fourth filling part includes a fourth filter layer that only allows light of a fourth color to pass through, and a second light absorbing layer or a transparent material that partially absorbs light of a third color; the fifth filling part is used to fill in another first through hole in each group of first through holes, and the fifth filling part includes a third filter layer that only allows light of a third color to pass through, and a second light absorbing layer or a transparent material that partially absorbs light of the third color.

[0106] According to an embodiment of the present disclosure, the first light-absorbing layer is used to partially absorb the light of the third color emitted by the micro LED unit, each group of second through holes includes two second through holes respectively aligned with the two first through holes in the corresponding first through hole group, the photoluminescent material layer includes a photoluminescent material layer of a fourth color, and the photoluminescent material layer of the fourth color is filled in the second through holes in each group of second through holes that are aligned with the first through holes used to fill the fourth filling part, and the light corresponding to the fourth color and the light of the third color are synthesized to obtain white light.

[0107] According to an embodiment of the present disclosure, the fourth color is yellow and the third color is blue.

[0108] According to an embodiment of the present disclosure, the second color conversion structure 11 further includes a first reflective layer 105 , which is disposed below the first barrier layer 103 . The first reflective layer 105 is used to partially reflect the light emitted by the micro LED unit 2011 , and the second barrier layer 106 is disposed below the first reflective layer 105 .

[0109] According to an embodiment of the present disclosure, the second color conversion structure 11 further includes a sixth filling portion, which includes a third light absorbing layer 1073, a photoluminescent material layer of a third color and a transparent material. The sixth filling portion is filled in the second through holes other than the second through holes filled with the photoluminescent material layer in each group of second through holes. The third light absorbing layer 1073 is used to partially absorb the light emitted by the micro LED unit 2011.

[0110] According to an embodiment of the present disclosure, the second color conversion structure 11 further includes a second reflective layer, which is disposed below the second barrier layer 106 and the photoluminescent material layer, and is used to reflect light of a color corresponding to the photoluminescent material layer.

[0111] According to an embodiment of the present disclosure, the second color conversion structure 11 further includes an insulating layer 108, which is disposed below the second barrier layer 106, the photoluminescent material layer and the sixth filling portion. The insulating layer 108 of the second color conversion structure 11 is disposed on the light emitting side of the micro LED chip 20.

[0112] According to an embodiment of the present disclosure, the micro LED chip structure also includes a driving chip, and the side of the micro LED chip 20 opposite to the light emitting side is arranged on the driving chip, or the micro LED chip structure also includes a driving chip and a flexible circuit board, and the side of the micro LED chip 20 opposite to the light emitting side is arranged on the driving chip to form a micro LED module, and the micro LED module is arranged on the flexible circuit board through the driving chip.

[0113] According to an embodiment of the present disclosure, the material of the first barrier layer 103 and the material of the second barrier layer 106 include visible light shielding materials, the material of the first color photoluminescent material layer 1071 and the material of the second color photoluminescent material layer 1072 include at least one of II-VI group quantum dots, III-V group quantum dots, perovskite quantum dots and carbon quantum dots, the material of the first light absorption layer 102 and the material of the second light absorption layer 1043 include organic dyes, nano absorption particles or inorganic oxides for absorbing blue light, and the material of the first filter layer 1041, the second filter layer 1042 and the third filter layer include organic dyes, nano absorption particles or inorganic oxides.

[0114] It is worth noting that any relevant description about the micro LED device in the above-mentioned micro LED device preparation method (including but not limited to technical features and their functions, explanations, etc.) can be applied to the micro LED device disclosed in the present invention.

[0115] According to embodiments of the present disclosure, the pixel size in the micro LED device is typically less than 50 microns.

[0116] The present disclosure also provides a display device, which includes the above-mentioned type LED device. The display device can be applied to flexible electronic devices to realize technologies such as augmented reality (AR), virtual reality (VR), extended reality (XR), and mixed reality (MR). For example, the micro LED device can be the projection part of an electronic device, such as a projector, a head-up display (HUD), etc.; for another example, the micro LED device can also be the display part of an electronic device, such as a smart phone, a smart watch, a laptop, a tablet computer, a driving recorder, a navigator, a head-mounted device, and any other device with a display screen.

[0117] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0118] It should be understood that "one embodiment" or "an embodiment" mentioned throughout the specification means that specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. It should be understood that in various embodiments of the present application, the size of the serial number of each step / process mentioned above does not mean the order of execution, and the execution order of each step / process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiment of the present application. In addition, the serial numbers of the embodiments of the present application mentioned above are only for description and do not represent the advantages and disadvantages of the embodiments.

[0119] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein, for example. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0120] The above description is only a preferred embodiment of the present disclosure and is not intended to limit the present disclosure. For those skilled in the art, the present disclosure may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A method for preparing a micro LED device, wherein: The method comprises: Obtaining a transparent substrate and a micro LED chip structure, wherein the micro LED chip structure comprises a micro LED chip, and the micro LED chip comprises a micro LED unit array composed of a plurality of micro LED units; Disposing a first light absorbing layer on the transparent substrate, wherein the first light absorbing layer is used to partially absorb the light emitted by the micro LED unit; Disposing a first barrier layer on the first light absorbing layer, so that the first barrier layer includes a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes a plurality of groups of first through holes, and each group of first through holes includes at least two first through holes; Disposing a second barrier layer on the first barrier layer, so that the second barrier layer includes a second through hole array, the second through hole array corresponds to the first through hole array, wherein the second through hole array includes a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, and the second through hole in each group of second through holes corresponds to the first through hole in the corresponding first through hole group; Filling a photoluminescent material layer in each group of second through holes to obtain a first color conversion structure, wherein the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer; The side of the first color conversion structure opposite to the transparent substrate is bonded to the light emitting side of the micro LED chip to obtain a micro LED device.

2. The method for preparing a micro LED device according to claim 1, wherein: The first light absorbing layer is used to partially absorb the light of the third color emitted by the micro LED unit, each group of first through holes includes three first through holes, a first barrier layer is arranged on the first light absorbing layer, so that the first barrier layer includes a first through hole array, and the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes a plurality of groups of first through holes, and each group of first through holes includes at least two first through holes, comprising: a first barrier layer is arranged on the first light absorbing layer and a first through hole array is opened on the first barrier layer, so that the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes a plurality of groups of first through holes, each group of first through holes includes a first first through hole, a second first through hole and a third first through hole, The second barrier layer is arranged on the first barrier layer, so that the second barrier layer includes a second through hole array, the second through hole array corresponds to the first through hole array, wherein the second through hole array includes a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, and the second through holes in each group of second through holes correspond to the first through holes in the corresponding first through hole group, comprising: the second barrier layer is arranged on the first barrier layer and a second through hole array is opened on the second barrier layer, so that the second through hole array is aligned with the first through hole array, wherein the second through hole array includes a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, each group of second through holes includes three second through holes, and the three second through holes include a first second through hole aligned with the first first through hole, a second second through hole aligned with the second first through hole, and a third second through hole aligned with the third first through hole, The photoluminescent material layer includes a photoluminescent material layer of a first color and a photoluminescent material layer of a second color. The photoluminescent material layer is filled in each group of second through holes to obtain a first color conversion structure, wherein the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, including: filling the first second through hole in each group of second through holes with a photoluminescent material layer of the first color, and filling the second second through hole in each group of second through holes with a photoluminescent material layer of the second color, and the light corresponding to the first color, the light corresponding to the second color and the light of the third color are synthesized to obtain white light.

3. The method for preparing a micro LED device according to claim 2, wherein: Before arranging the second barrier layer on the first barrier layer, the method further comprises: A first filling step, wherein the first filling step comprises at least one of the following steps: Filling a first filling portion in a first first through hole in each group of first through holes, wherein the first filling portion includes a first filter layer that allows only light of a first color to pass through, a second light absorption layer for partially absorbing light of a third color, or a transparent material; Filling a second filling portion in a second first through hole in each group of first through holes, wherein the second filling portion includes a second filter layer that allows only light of a second color to pass through, a second light absorbing layer for partially absorbing light of a third color, or a transparent material; A third filling portion is filled in the third first through hole in each group of first through holes, wherein the third filling portion includes a third filter layer that allows only light of a third color to pass through, a second light absorption layer for partially absorbing light of the third color, or a transparent material.

4. The method for preparing a micro LED device according to claim 1, wherein: Each group of first through holes includes two first through holes. Before the second barrier layer is disposed on the first barrier layer, the method further includes: A second filling step, wherein the second filling step comprises at least one of the following steps: Filling a fourth filling portion in one first through hole in each group of first through holes, wherein the fourth filling portion includes a fourth filter layer that allows only light of a fourth color to pass through, a second light absorption layer for partially absorbing light of a third color, or a transparent material; A fifth filling portion is filled in another first through hole in each group of first through holes, wherein the fifth filling portion includes a third filter layer that allows only light of a third color to pass through, a second light absorption layer for partially absorbing light of the third color, or a transparent material.

5. The method for preparing a micro LED device according to claim 4, wherein: The first light absorbing layer is used to partially absorb the light of the third color emitted by the micro LED unit, a first barrier layer is arranged on the first light absorbing layer, so that the first barrier layer includes a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes a plurality of groups of first through holes, each group of first through holes includes at least two first through holes, comprising: a first barrier layer is arranged on the first light absorbing layer and a first through hole array is opened on the first barrier layer, so that the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array includes a plurality of groups of first through holes, each group of first through holes includes two first through holes, The second barrier layer is arranged on the first barrier layer, so that the second barrier layer includes a second through hole array, the second through hole array corresponds to the first through hole array, wherein the second through hole array includes a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, and the second through holes in each group of second through holes correspond to the first through holes in the corresponding first through hole group, comprising: the second barrier layer is arranged on the first barrier layer and a second through hole array is opened on the second barrier layer, so that the second through hole array is aligned with the first through hole array, wherein the second through hole array includes a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, and each group of second through holes includes two second through holes respectively aligned with two first through holes in the corresponding first through hole group, The photoluminescent material layer includes a photoluminescent material layer of a fourth color, and the photoluminescent material layer is filled in each group of second through holes to obtain a first color conversion structure, wherein the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, comprising: filling the photoluminescent material layer of the fourth color in the second through holes in each group of second through holes that are aligned with the first through holes used to fill the fourth filling part, and synthesizing the light corresponding to the fourth color and the light of the third color to obtain white light.

6. The method for preparing a micro LED device according to claim 1, wherein: When filling the photoluminescent material layer in each group of second through holes, the method further comprises: A sixth filling portion is filled in the second through holes other than the second through holes filled with the photoluminescent material layer in each group of second through holes, wherein the sixth filling portion includes the photoluminescent material layer of a third color.

7. The method for preparing a micro LED device according to claim 6, wherein: After filling the sixth filling part in the second through holes other than the second through holes filled with the photoluminescent material layer in each group of second through holes, the method further includes: providing an insulating layer on the second barrier layer, the photoluminescent material layer and the sixth filling part, Bonding the side of the first color conversion structure opposite to the transparent substrate to the light-emitting side of the micro LED chip includes: bonding the insulating layer of the first color conversion structure to the light-emitting side of the micro LED chip.

8. The method for preparing a micro LED device according to claim 1, wherein: After bonding the side of the first color conversion structure opposite to the transparent substrate to the light emitting side of the micro LED chip, the method includes: The transparent substrate of the first color conversion structure is removed, and a second color conversion structure is obtained from the first color conversion structure.

9. A micro LED device, wherein: The micro LED device comprises a second color conversion structure and a micro LED chip structure, wherein the micro LED chip structure comprises a micro LED chip, and the micro LED chip comprises a micro LED unit array composed of a plurality of micro LED units, wherein the second color conversion structure comprises: A first light absorbing layer, the first light absorbing layer is used to partially absorb the light emitted by the micro LED unit; A first barrier layer, the first barrier layer is disposed below the first light absorbing layer and comprises a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array comprises a plurality of groups of first through holes, each group of first through holes comprises at least two first through holes; A second barrier layer, the second barrier layer is disposed below the first barrier layer and comprises a second through hole array, the second through hole array corresponds to the first through hole array, wherein the second through hole array comprises a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, and the second through hole in each group of second through holes corresponds to the first through hole in the corresponding first through hole group; a photoluminescent material layer, wherein the photoluminescent material layer is filled in each group of second through holes, wherein the color of light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, The second barrier layer and the photoluminescent material layer of the second color conversion structure are arranged on the light emitting side of the micro LED chip.

10. A display device, wherein: The display device comprises the micro LED device according to claim 9.

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