Miniature LED device and display device
By designing the first partition layer and photoluminescent material layer in the micro LED device, the problem of poor display effect of the full-color Micro LED device is solved, and a more balanced light output and higher color purity are achieved.
Patent Information
- Application Number
- CN202411941783.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-26
- Publication Date
- 2025-04-11
AI Technical Summary
Full-color Micro LED devices achieved through color conversion method have problems with poor display effects, including color shift and poor color purity caused by light overflow.
A micro LED device is designed, which includes a micro LED chip, a first spacer layer, a photoluminescent material layer and a light absorbing layer. The first spacer layer is arranged on the light-out side of the micro LED chip, including a through-hole array, in which the photoluminescent material layer is filled with the through-hole, and the light absorbing layer is used to partially absorb the light of the third color, thereby reducing light overflow.
By reducing light overflow, the balance of light in the three colors is improved, the color purity of micro LEDs is improved, and the display effect of micro LED devices is improved.
Smart Images

Figure CN119816068A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the technical field of semiconductor Micro LEDs, and in particular, to a Micro LED device and a display apparatus. Background Art
[0002] Micro-LED is a comprehensive technology that integrates new display technology and light-emitting diode (LED) technology. It has the advantages of small size, high brightness, high resolution, and low power consumption. It is considered to be one of the most promising next-generation new display and light-emitting devices. Currently, Micro LED full-color display can be achieved in a variety of ways, one of which is the color conversion method. However, the full-color Micro LED device achieved by the color conversion method still has problems such as unsatisfactory display effects. Summary of the invention
[0003] The solution of the present disclosure provides a micro LED device and a display apparatus.
[0004] According to one aspect of an embodiment of the present disclosure, a micro LED device is provided, wherein the micro LED device comprises: a micro LED chip structure, wherein the micro LED chip structure comprises a micro LED chip, wherein the micro LED chip comprises a micro LED unit array composed of a plurality of micro LED units; a first barrier layer, wherein the first barrier layer is arranged on a light emitting side of the micro LED chip, wherein the first barrier layer comprises a first through hole array, wherein the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, wherein the first through hole array comprises a plurality of groups of first through holes, wherein each group of first through holes comprises three first through holes, wherein the three first through holes comprise a first first through hole, a second first through hole and a third first through hole; a photoluminescent material layer of a first color and a photoluminescent material layer of a second color, wherein the photoluminescent material layer of the first color is filled in a first first through hole in each group of first through holes, and the photoluminescent material layer of the second color is filled in a second first through hole in each group of first through holes; and a first light absorbing layer, wherein the first light absorbing layer is filled in a third first through hole in each group of first through holes, wherein the first light absorbing layer is used to partially absorb light of a third color emitted by the micro LED unit.
[0005] Further, the micro LED device also includes a second barrier layer, which is arranged on the first barrier layer and includes a second through hole array, the second through hole array is aligned with the first through hole array and is located above the first through hole array, wherein the second through hole array includes multiple groups of second through holes corresponding to the multiple groups of first through holes, each group of second through holes includes a first second through hole aligned with the first first through hole, a second second through hole aligned with the second first through hole, and a third second through hole aligned with the third first through hole.
[0006] Furthermore, the micro LED device also includes at least one of a first filling part, a second filling part and a third filling part, wherein: the first filling part is used to fill the first second through hole in each group of second through holes, and the first filling part includes a first filter layer that only allows light of the first color to pass through, and a second light absorbing layer or a transparent material for partially absorbing light of the third color; the second filling part is used to fill the second second through hole in each group of second through holes, and the second filling part includes a second filter layer that only allows light of the second color to pass through, and a second light absorbing layer or a transparent material for partially absorbing light of the third color; the third filling part is used to fill the third second through hole in each group of second through holes, and the third filling part includes a third filter layer that only allows light of the third color to pass through, and a second light absorbing layer or a transparent material for partially absorbing light of the third color.
[0007] Furthermore, the micro LED device further includes a third light absorption layer, which is disposed on the second barrier layer, wherein the third light absorption layer is used to partially absorb light of a third color emitted by the micro LED unit.
[0008] Furthermore, the micro LED device further includes a fourth light absorption layer, which is disposed between the first barrier layer and the second barrier layer, wherein the fourth light absorption layer is used to partially absorb light of a third color emitted by the micro LED unit.
[0009] Furthermore, the micro LED device further includes a first reflective layer, which is disposed on the second barrier layer, wherein the first reflective layer is used to partially reflect light of a third color emitted by the micro LED unit.
[0010] Furthermore, the micro LED device further includes a second reflective layer, which is disposed between the first barrier layer and the second barrier layer, wherein the second reflective layer is used to partially reflect light of a third color emitted by the micro LED unit.
[0011] Furthermore, the micro LED device further includes a fifth light absorption layer, which is disposed on the first barrier layer, wherein the fifth light absorption layer is used to partially absorb light of a third color emitted by the micro LED unit.
[0012] Furthermore, the micro LED device further includes a third reflective layer, which is disposed on the first barrier layer, wherein the third reflective layer is used to partially reflect light of a third color emitted by the micro LED unit.
[0013] Furthermore, the micro LED device further includes an insulating layer, and the insulating layer is arranged between the first barrier layer and the micro LED chip.
[0014] Furthermore, the micro LED device further includes a fourth reflective layer, which is disposed between the first barrier layer and the micro LED chip, wherein the fourth reflective layer is used to reflect light of the first color and light of the second color.
[0015] Furthermore, each micro LED unit in the micro LED unit array includes a first semiconductor layer on the light emitting side, and the insulating layer is arranged between the first barrier layer and the first semiconductor layer.
[0016] Furthermore, the micro LED device further comprises a transparent cover plate, wherein the transparent cover plate is disposed on the first barrier layer, and the transparent cover plate and the micro LED chip are located on both sides of the first barrier layer.
[0017] Further, the light corresponding to the first color, the light corresponding to the second color and the light of the third color are synthesized to obtain white light, the first color is red, the second color is green and the third color is blue.
[0018] Furthermore, the micro LED chip structure also includes a driver chip, and the side of the micro LED chip opposite to the light emitting side is arranged on the driver chip, or the micro LED chip structure also includes a driver chip and a flexible circuit board, and the side of the micro LED chip opposite to the light emitting side is arranged on the driver chip to form a micro LED module, and the micro LED module is arranged on the flexible circuit board through the driver chip.
[0019] Further, the material of the first barrier layer includes a visible light shielding material, the material of the first color photoluminescent material layer and the material of the second color photoluminescent material layer include at least one of II-VI group quantum dots, III-V group quantum dots, perovskite quantum dots and carbon quantum dots, and the material of the first light absorption layer includes an organic dye, nano absorption particles or inorganic oxide for absorbing light of a third color.
[0020] According to another aspect of the embodiments of the present disclosure, a display device is provided, comprising the micro LED device.
[0021] Applying the technical solution of the present disclosure, the first barrier layer is arranged on the light-emitting side of the micro LED chip and includes a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array, each group of first through holes in the multiple groups of first through holes included in the first through hole array includes three first through holes, a first color photoluminescent material layer, a second color photoluminescent material layer and a first light absorption layer are respectively filled in the three first through holes, and the first light absorption layer is used to partially absorb the third color of light emitted by the micro LED unit, thereby forming a micro LED device. In the micro LED device, the light of the third color emitted by the micro LED unit of the micro LED chip excites the material in the photoluminescent material layer of the first color to emit the light of the first color, and the light of the third color emitted by the micro LED unit of the micro LED chip excites the material in the photoluminescent material layer of the second color to emit the light of the second color. Since the first light absorption layer can partially absorb the light of the third color emitted by the micro LED unit, the light overflow of the third color caused by the third color light emitted by the micro LED unit directly from the micro LED device is reduced, thereby reducing the color deviation and poor color purity caused by the light overflow, thereby improving the balance of the three colors of light emitted from the micro LED device, improving the color purity of the micro LED, and further improving the display effect of the micro LED device. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] By reading the detailed description below with reference to the accompanying drawings, the above and other purposes, features and advantages of the exemplary embodiments of the present disclosure will become readily understood. In the accompanying drawings, several embodiments of the present disclosure are shown in an exemplary and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:
[0023] Figures 1 to 9 Schematic diagrams respectively show the structures of a micro LED device according to an embodiment of the present disclosure. DETAILED DESCRIPTION
[0024] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present disclosure will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.
[0025] It should be noted that the following detailed descriptions are illustrative and are intended to provide further explanation of the present application. Unless otherwise specified, all technical and scientific terms used herein have the same meanings as those commonly understood by those skilled in the art to which the present application belongs.
[0026] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" may include both "above" and "below". The device may also be positioned in other different ways, rotated 90 degrees or in other orientations, and the spatially relative descriptions used herein are interpreted accordingly.
[0027] Now, exemplary embodiments according to the present disclosure will be described in more detail with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in a variety of different forms and should not be construed as being limited to the embodiments described herein. It should be understood that these embodiments are provided to make the disclosure of the present application thorough and complete, and to fully convey the concepts of these exemplary embodiments to those of ordinary skill in the art. In the accompanying drawings, for clarity, the thickness of the layers and regions is enlarged, and the same reference numerals are used to represent the same devices, and thus their descriptions will be omitted.
[0028] The present disclosure provides some embodiments of micro LED devices. Figures 1 to 9 , Figures 1 to 9 Schematic diagrams respectively show the structures of a micro LED device according to an embodiment of the present disclosure.
[0029] Reference Figure 1 , Figure 1 FIG. 1 is a schematic diagram showing the structure of a micro LED device 1 according to an embodiment of the present disclosure. Figure 1As shown, the micro LED device 1 includes: a micro LED chip structure, the micro LED chip structure includes a micro LED chip 11, the micro LED chip 11 includes a micro LED unit array 111 composed of a plurality of micro LED units 1111; a first barrier layer 101, the first barrier layer 101 is arranged on the light emitting side of the micro LED chip 11, the first barrier layer 101 includes a first through hole array, the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array 111, wherein the first through hole array includes a plurality of groups of first through holes, each group of first through holes includes three first through holes, and the three first through holes include the first first through hole 1011 1. A second first through hole 10112 and a third first through hole 10113; a first color photoluminescent material layer 1011 and a second color photoluminescent material layer 1012, wherein the first color photoluminescent material layer 1011 is filled in the first first through hole 10111 in each group of first through holes, and the second color photoluminescent material layer 1012 is filled in the second first through hole 10112 in each group of first through holes; a first light absorbing layer 1013, wherein the first light absorbing layer 1013 is filled in the third first through hole 10113 in each group of first through holes, wherein the first light absorbing layer 1013 is used to partially absorb the light of the third color emitted by the micro LED unit.
[0030] It is worth noting that, for the sake of clarity, a marking line with an arrow is used to point to the position of the first through hole so as to distinguish it from the filling in the first through hole. And for the sake of clarity and simplicity, Figure 1 Only a group of first through holes included in the first through hole array is shown, and the group of first through holes includes a first first through hole 10111, a second first through hole 10112 and a third first through hole 10113. Figure 1 The number of groups of first through holes and the number of first through holes in each group of first through holes shown in the figure are only for illustration and are not limited here, as long as the corresponding relationship between the first through holes and the micro LED unit array is met.
[0031] According to the technical solution of this embodiment, the first barrier layer 101 is arranged on the light-emitting side of the micro LED chip 11 and includes a first through hole array. The arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array 111. Each group of first through holes in the multiple groups of first through holes included in the first through hole array includes three first through holes. The photoluminescent material 1011 of the first color, the photoluminescent material layer 1012 of the second color and the first light absorption layer 1013 are respectively filled in the three first through holes. The first light absorption layer 1013 is used to partially absorb the light of the third color emitted by the micro LED unit 1111, thereby forming a micro LED device 1. In the micro LED device 1, the light of the third color emitted by the micro LED unit 1111 of the micro LED chip 11 excites the material in the photoluminescent material layer 1011 of the first color to emit the light of the first color, and the light of the third color emitted by the micro LED unit 111 of the micro LED chip 11 excites the material in the photoluminescent material layer 1012 of the second color to emit the light of the second color. Since the first light absorption layer 1013 can partially absorb the light of the third color emitted by the micro LED unit 1111, the light overflow of the third color caused by the light of the third color emitted by the micro LED unit 1111 directly emitted from the micro LED device 1 is reduced, thereby reducing the color deviation and poor color purity caused by the light overflow, thereby improving the balance of the three colors of light emitted from the micro LED device, enhancing the color purity of the micro LED, and further improving the display effect of the micro LED device.
[0032] According to an embodiment of the present disclosure, the first barrier layer 101 can play the role of a grid, and the interior of the grid can be filled with corresponding materials. The material of the first barrier layer 101 can include a visible light shielding material, and the visible light shielding material can include, for example, a matte material such as a black photoresist, a reflective material such as a metal layer. The material of the first color photoluminescent material layer 1011 and the material of the second color photoluminescent material layer 1012 include at least one of II-VI group quantum dots, III-V group quantum dots, perovskite quantum dots, and carbon quantum dots. The material of the first light absorbing layer 1013 includes an organic dye, nano-absorbing particles, or an inorganic oxide for partially absorbing a third color of light such as blue light, such as zinc oxide nanoparticle photoresist.
[0033] According to the embodiments of the present disclosure, Figure 1As shown, the micro LED device 1 also includes an insulating layer 12, and the insulating layer 12 is arranged between the first barrier layer 101 and the micro LED chip 11. In addition, the micro LED chip can be any micro LED chip suitable for preparing a micro LED device. For example, the structure of the micro LED chip can include a face-up structure, a flip-chip structure or a vertical structure, etc., which is not limited here. Each micro LED unit in the micro LED unit array can include an exposed first semiconductor layer on its light-emitting side. Depending on the type of micro LED device, in some embodiments, the first semiconductor layer may include an N-GaN layer; in other embodiments, the first semiconductor layer may include a P-GaN layer. As Figure 1 As shown, each micro LED unit 1111 in the micro LED unit array 111 may include a first semiconductor layer 11111 on the light emitting side, so the insulating layer 12 may be disposed between the first barrier layer 101 and the first semiconductor layer 11111. Therefore, the insulating layer 12 may isolate, for example, the first semiconductor layer 11111 of the micro LED chip 11 from the photoluminescent material layer 1011 of the first color, the photoluminescent material layer 1012 of the second color, and the first light absorbing layer 1013, thereby protecting the photoluminescent material layer 1011 of the first color, the photoluminescent material layer 1012 of the second color, and the first light absorbing layer 1013. The material of the insulating layer 12 may include any applicable polymer organic material and inorganic oxide material such as silicon dioxide.
[0034] According to an embodiment of the present disclosure, the micro LED device 1 may further include a transparent cover plate, which is disposed on the first barrier layer 101, and the transparent cover plate and the micro LED chip 11 are located on both sides of the first barrier layer 101. The transparent cover plate protects the first color photoluminescent material layer 1011, the second color photoluminescent material layer 1012 and the first light absorption layer 1013 on the other side of the first barrier layer 101 opposite to the micro LED chip 11. The transparent cover plate may include any suitable cover plate such as a glass cover plate, a polyimide cover plate or a sapphire cover plate.
[0035] According to an embodiment of the present disclosure, the light of the first color refers to the light of the wavelength range corresponding to the first color, the light of the second color refers to the light of the wavelength range corresponding to the second color, and the light of the third color refers to the light of the wavelength range corresponding to the third color. The light corresponding to the first color, the light corresponding to the second color, and the light of the third color can be synthesized to obtain white light, and the first color, the second color, and the third color can be three primary colors, for example, the first color is red, the second color is green, and the third color is blue.
[0036] According to an embodiment of the present disclosure, the micro LED chip structure also includes a driving chip, and the side of the micro LED chip 11 opposite to the light emitting side is arranged on the driving chip, or the micro LED chip structure also includes a driving chip and a flexible circuit board, and the side of the micro LED chip 11 opposite to the light emitting side is arranged on the driving chip to form a micro LED module, and the micro LED module is arranged on the flexible circuit board through the driving chip.
[0037] Reference Figure 2 , Figure 2 FIG. 4 is a schematic structural diagram showing a micro LED device 2 according to another embodiment of the present disclosure. Figure 2 The micro LED device 2 shown is Figure 1 The difference of the micro LED device 1 shown is that the micro LED device 2 also includes a second barrier layer 201, the second barrier layer 201 is arranged on the first barrier layer 101 and includes a second through hole array, the second through hole array is aligned with the first through hole array and is located above the first through hole array, wherein the second through hole array includes multiple groups of second through holes corresponding to the multiple groups of first through holes, each group of second through holes includes a first second through hole 20111 aligned with the first first through hole 10111, a second second through hole 20112 aligned with the second first through hole 10112 and a third second through hole 20113 aligned with the third first through hole 10113.
[0038] According to an embodiment of the present disclosure, the material of the second barrier layer 201 may include a visible light shielding material, which may include, for example, a matte material such as black photoresist or a reflective material such as a metal layer.
[0039] It is worth noting that, for the sake of clarity, a marking line with an arrow is used to point to the position of the second through hole so as to distinguish it from the filling in the second through hole. And for the sake of clarity and simplicity, Figure 2 Only a group of second through holes included in the second through hole array is shown, and the group of second through holes includes a first second through hole 20111, a second second through hole 20112 and a third second through hole 20113. Figure 2 The number of groups of second through holes and the number of second through holes in each group of second through holes shown in the figure are only for illustration and are not limited here, as long as the corresponding relationship between the first through holes and the second through holes described above is met.
[0040] According to an embodiment of the present disclosure, the micro LED device 2 also includes at least one of a first filling part, a second filling part and a third filling part, wherein: the first filling part is used to fill the first second through hole in each group of second through holes, and the first filling part includes a first filter layer that only allows light of the first color to pass through, and a second light absorbing layer or a transparent material for partially absorbing light of the third color; the second filling part is used to fill the second second through hole in each group of second through holes, and the second filling part includes a second filter layer that only allows light of the second color to pass through, and a second light absorbing layer or a transparent material for partially absorbing light of the third color; the third filling part is used to fill the third second through hole in each group of second through holes, and the third filling part includes a third filter layer that only allows light of the third color to pass through, and a second light absorbing layer or a transparent material for partially absorbing light of the third color.
[0041] According to an embodiment of the present disclosure, the material of the second light absorbing layer includes an organic dye, nano-absorbing particles or an inorganic oxide for absorbing a third color of light such as blue light, and the material of the second light absorbing layer can be the same as the material of the first light absorbing layer, for example, it can be a zinc oxide nano-particle photoresist. The material of the first filter layer, the material of the second filter layer and the material of the third filter layer include organic dyes, nano-absorbing particles or inorganic oxides. The transparent material can be any suitable material such as a transparent resin.
[0042] like Figure 2 As shown, the first filling portion is filled in the first second through hole 20111 in each group of second through holes, and the first filling portion includes a first filter layer 2011 that only allows light of the first color to pass through; the second filling portion is filled in the second second through hole 20112 in each group of second through holes, and the second filling portion includes a second filter layer 2012 that only allows light of the second color to pass through; the third filling portion is filled in the third second through hole 20113 in each group of second through holes, and the third filling portion includes a second light absorption layer 2013 for partially absorbing light of the third color.
[0043] According to the technical solution of this embodiment, since the second light absorption layer 2013 is aligned with the first light absorption layer 1013, the second light absorption layer 2013 can further enhance the absorption of the third color light (e.g., blue light) emitted by the micro LED unit 1111, thereby further reducing the light overflow (e.g., blue light overflow) caused by the third color light (e.g., blue light) emitted by the micro LED unit directly emitted from the micro LED device, thereby further improving the display effect of the micro LED device. In addition, when the second light absorbing layer is filled in the first second through hole 20111 and / or in the second second through hole 20112, and when a portion of the light of the third color, such as blue light, emitted by the micro LED unit corresponding to the photoluminescent material layer 1011 of the first color and the photoluminescent material layer 1012 of the second color does not participate in the excitation of the photoluminescent material layer and leaks out through the photoluminescent material layer, the second light absorbing layer filled in the first second through hole 20111 and / or in the second second through hole 20112 can absorb the leaked portion of the blue light, thereby reducing the mixing output of the leaked portion of the third color light (such as blue light) with the first color light, such as red light, and the second color light, such as green light, emitted by the excitation of the photoluminescent material layer, thereby improving the color purity of the micro LED, thereby improving the display effect of the micro LED device.
[0044] In such Figure 1 In the case where the micro LED device 1 shown includes a transparent cover plate, according to an embodiment of the present disclosure, the transparent cover plate may be disposed on the second barrier layer 201 .
[0045] Reference Figure 3 , Figure 3 is a schematic structural diagram showing a micro LED device 3 according to another embodiment of the present disclosure. Figure 3 The micro LED device 3 shown is Figure 2 The difference of the micro LED device 2 shown is that the micro LED device 3 further includes a third light absorbing layer 301 , and the third light absorbing layer 301 is arranged on the second barrier layer 201 , wherein the third light absorbing layer 301 is used to partially absorb the third color light emitted by the micro LED unit 1111 . Figure 3 It is shown that when there is a filling portion in the second through hole, the third light absorbing layer 301 is arranged on the second barrier layer 201 . It should be understood that when there is no filling portion in the second through hole, the third light absorbing layer 301 can also be arranged on the second barrier layer 201 .
[0046] According to an embodiment of the present disclosure, the material of the third light absorption layer 301 includes an organic dye, nano-absorption particles or an inorganic oxide for absorbing a third color of light, such as blue light, and the material of the third light absorption layer 301 can be the same as the material of the first light absorption layer 1013 and the material of the second light absorption layer 2013, for example, it can be zinc oxide nanoparticle photoresist.
[0047] According to the technical solution of this embodiment, the third light absorption layer 301 covers the first light absorption layer 1013, so the third light absorption layer 301 can partially absorb the third color of light, such as blue light, emitted by the micro LED unit 1111 corresponding to the first light absorption layer 1013, thereby further reducing the blue light overflow caused by the blue light emitted by the micro LED unit directly emitted from the micro LED device, thereby further improving the display effect of the micro LED device. And because the third light absorbing layer 301 covers the photoluminescent material layer 1011 of the first color and the photoluminescent material layer 1012 of the second color, when a portion of, for example, blue light emitted by the micro LED units corresponding to the two photoluminescent material layers does not participate in exciting the photoluminescent material layers and leaks out through the photoluminescent material layers, the third light absorbing layer 301 can absorb the leaked portion of blue light, thereby reducing the mixing output of the leaked portion of blue light with the first color light, for example, red light, and the second color light, for example, green light, emitted by exciting the photoluminescent material layers, thereby improving the color purity of the micro LED, thereby improving the display effect of the micro LED device.
[0048] In such Figure 2 In the case where the micro LED device 2 shown includes a transparent cover plate, according to an embodiment of the present disclosure, the transparent cover plate can be disposed on the third light absorbing layer 301 .
[0049] Reference Figure 4 , Figure 4 is a schematic structural diagram showing a micro LED device 4 according to another embodiment of the present disclosure. Figure 4 The micro LED device 4 shown is Figure 2 The difference between the micro LED device 2 shown is that the micro LED device 4 also includes a fourth light absorption layer 401, and the fourth light absorption layer 401 is arranged between the first barrier layer 101 and the second barrier layer 201, wherein the fourth light absorption layer 401 is used to partially absorb the third color light emitted by the micro LED unit. Figure 4 It is shown that when there is a filling portion in the second through hole, the fourth light absorbing layer 401 is arranged on the second barrier layer 201. It should be understood that when there is no filling portion in the second through hole, the fourth light absorbing layer 401 can also be arranged on the second barrier layer 201.
[0050] According to an embodiment of the present disclosure, the material of the fourth light absorption layer 401 includes an organic dye, nano-absorption particles or an inorganic oxide for absorbing a third color of light such as blue light, and the material of the fourth light absorption layer 401 can be the same as the material of the first light absorption layer 1013, the material of the second light absorption layer 2013 and the material of the third light absorption layer 301, for example, it can be zinc oxide nanoparticle photoresist.
[0051] According to the technical solution of this embodiment, the fourth light absorption layer 401 covers the first light absorption layer 1013, so the fourth light absorption layer 401 can partially absorb the third color of light, such as blue light, emitted by the micro LED unit 1111 corresponding to the first light absorption layer 1013, thereby further reducing the blue light overflow caused by the blue light emitted by the micro LED unit directly emitted from the micro LED device, thereby further improving the display effect of the micro LED device. And because the fourth light absorbing layer 401 covers the photoluminescent material layer 1011 of the first color and the photoluminescent material layer 1012 of the second color, when a part of the light of the third color, such as blue light, emitted by the micro LED unit corresponding to the two photoluminescent material layers does not participate in the excitation of the photoluminescent material layer and passes through the photoluminescent material layer and leaks out, the fourth light absorbing layer 401 can absorb the leaked part of the blue light, thereby reducing the mixed output of the leaked part of the blue light and the first color light, such as red light, and the second color light, such as green light, emitted by the exciting photoluminescent material layer, thereby improving the color purity of the micro LED, thereby improving the display effect of the micro LED device.
[0052] Reference Figure 5 , Figure 5 is a schematic structural diagram showing a micro LED device 5 according to another embodiment of the present disclosure. Figure 5 The micro LED device 5 shown is Figure 2 The difference of the micro LED device 2 shown is that the micro LED device 5 further includes a first reflective layer 501 , which is disposed on the second barrier layer 201 , wherein the first reflective layer 501 is used to partially reflect the light of the third color emitted by the micro LED unit 1111 . Figure 5 It is shown that when there is a filling portion in the second through hole, the first reflective layer 501 is arranged on the second barrier layer 201. It should be understood that when there is no filling portion in the second through hole, the first reflective layer 501 can also be arranged on the second barrier layer 201.
[0053] According to an embodiment of the present disclosure, the material of the first reflective layer 501 includes a distributed Bragg reflector film for partially reflecting the light of the third color emitted by the micro LED unit 1111. The first reflective layer 501 can be, for example, a distributed Bragg reflector film formed by alternating stacking of silicon dioxide layers and titanium dioxide layers.
[0054] According to the technical solution of this embodiment, since the first reflective layer 501 covers the photoluminescent material layer 1011 of the first color and the photoluminescent material layer 1012 of the second color, when a portion of the light of the third color, such as blue light, emitted by the micro LED unit 1111 does not participate in exciting the photoluminescent material layer and passes through the photoluminescent material layer and leaks out, the first reflective layer 501 can reflect the portion of the blue light leaking from the photoluminescent material layer 1011 of the first color, such as red, back to the red photoluminescent material layer to re-participate in exciting the red photoluminescent material layer, and the first reflective layer 501 can reflect the portion of the blue light leaking from the photoluminescent material layer 1011 of the first color, such as red, back to the red photoluminescent material layer, and the blue light can re-participate in exciting the red photoluminescent material layer. A reflective layer 501 can reflect part of the blue light leaked from the photoluminescent material layer 1012 of the second color, such as green, back to the green photoluminescent material layer to re-excite the green photoluminescent material layer, thereby increasing the light participating in the excitation of the photoluminescent material layer, thereby increasing the light output of the color corresponding to the photoluminescent material layer, thereby improving the brightness of the micro-LED, and can reduce the mixed output of the leaked part of the light and the different color lights emitted by the exciting photoluminescent material layer, thereby improving the color purity of the micro-LED, thereby improving the display effect of the micro-LED device.
[0055] In such Figure 2 In the case where the micro LED device 2 shown includes a transparent cover plate, according to an embodiment of the present disclosure, the transparent cover plate can be disposed on the first reflective layer 501 .
[0056] Reference Figure 6 , Figure 6 FIG. 4 is a schematic structural diagram showing a micro LED device 6 according to another embodiment of the present disclosure. Figure 6 The micro LED device 6 shown is Figure 2 The difference of the micro LED device 2 shown is that the micro LED device 6 also includes a second reflective layer 601, which is arranged between the first barrier layer 101 and the second barrier layer 201, wherein the second reflective layer 601 is used to partially reflect the third color light emitted by the micro LED unit. Figure 6 It is shown that when there is a filling portion in the second through hole, the second reflective layer 601 is arranged on the second barrier layer 201. It should be understood that when there is no filling portion in the second through hole, the second reflective layer 601 can also be arranged on the second barrier layer 201.
[0057] According to an embodiment of the present disclosure, the material of the second reflective layer 601 includes a distributed Bragg reflector film for partially reflecting the light of the third color emitted by the micro LED unit 1111, and the material of the second reflective layer 601 can be the same as the material of the first reflective layer 501. The second reflective layer 601 can be, for example, a distributed Bragg reflector film formed by alternating stacking of silicon dioxide layers and titanium dioxide layers.
[0058] According to the technical solution of this embodiment, since the second reflective layer 601 covers the photoluminescent material layer 1011 of the first color and the photoluminescent material layer 1012 of the second color, when a portion of the light of the third color, such as blue light, emitted by the micro LED unit 1111 does not participate in exciting the photoluminescent material layer and passes through the photoluminescent material layer and leaks out, the second reflective layer 601 can reflect the portion of the blue light leaking from the photoluminescent material layer 1011 of the first color, such as red, back to the red photoluminescent material layer to re-participate in exciting the red photoluminescent material layer, and the third color light .... The second reflective layer 601 can reflect part of the blue light leaked from the photoluminescent material layer 1012 of the second color, for example, green, back to the green photoluminescent material layer and re-participate in exciting the green photoluminescent material layer, thereby increasing the light participating in exciting the photoluminescent material layer, thereby increasing the light output of the color corresponding to the photoluminescent material layer, thereby improving the brightness of the micro-LED, and can reduce the mixed output of the leaked part of the light and the different color lights emitted by exciting the photoluminescent material layer, thereby improving the color purity of the micro-LED, thereby improving the display effect of the micro-LED device.
[0059] Reference Figure 7 , Figure 7 FIG. 4 is a schematic structural diagram showing a micro LED device 7 according to another embodiment of the present disclosure. Figure 7 The micro LED device 7 shown is Figure 1 The difference between the micro LED device 1 shown is that the micro LED device 7 further includes a fifth light absorption layer 701 , which is disposed on the first barrier layer 101 , wherein the fifth light absorption layer 701 is used to partially absorb the third color light emitted by the micro LED unit 1111 .
[0060] According to an embodiment of the present disclosure, the material of the fifth light absorption layer 701 includes an organic dye, nano-absorption particles or an inorganic oxide for absorbing a third color of light such as blue light, and the material of the fifth light absorption layer 701 can be the same as the material of the first light absorption layer 1013, the material of the second light absorption layer 2013, the material of the third light absorption layer 301 and the material of the fourth light absorption layer 401, for example, it can be zinc oxide nanoparticle photoresist.
[0061] According to the technical solution of this embodiment, the fifth light absorbing layer 701 covers the first light absorbing layer 1013, so the fifth light absorbing layer 701 can partially absorb the third color of light, such as blue light, emitted by the micro LED unit 1111 corresponding to the first light absorbing layer 1013, thereby further reducing the blue light overflow caused by the micro LED unit, such as blue light, directly emitted from the micro LED device, thereby further improving the display effect of the micro LED device. And because the fifth light absorbing layer 701 covers the photoluminescent material layer 1011 of the first color and the photoluminescent material layer 1012 of the second color, when a portion of, for example, blue light emitted by the micro LED units corresponding to the two photoluminescent material layers does not participate in exciting the photoluminescent material layers and leaks out through the photoluminescent material layers, the fifth light absorbing layer 701 can absorb the leaked portion of blue light, thereby reducing the mixing output of the leaked portion of blue light with the first color light, for example, red light, and the second color light, for example, green light, emitted by exciting the photoluminescent material layers, thereby improving the color purity of the micro LED, thereby improving the display effect of the micro LED device.
[0062] In such Figure 1 In the case where the micro LED device 1 shown includes a transparent cover plate, according to an embodiment of the present disclosure, the transparent cover plate can be disposed on the fifth light absorbing layer 701 .
[0063] Reference Figure 8 , Figure 8 FIG. 4 is a schematic structural diagram showing a micro LED device 8 according to another embodiment of the present disclosure. Figure 8 The micro LED device 8 shown is Figure 1 The difference of the micro LED device 1 shown is that the micro LED device 8 also includes a third reflective layer 801, and the third reflective layer 801 is arranged on the first barrier layer 101, wherein the third reflective layer 801 is used to partially reflect the third color light emitted by the micro LED unit 1111.
[0064] According to an embodiment of the present disclosure, the material of the third reflective layer 801 includes a distributed Bragg reflector film for partially reflecting the third color of light emitted by the micro LED unit 1111, and the material of the third reflective layer 801 can be the same as the material of the first reflective layer 501 and the material of the second reflective layer 601. The third reflective layer 801 can be, for example, a distributed Bragg reflector film formed by alternating stacking of silicon dioxide layers and titanium dioxide layers.
[0065] According to the technical solution of this embodiment, since the third reflective layer 801 covers the photoluminescent material layer 1011 of the first color and the photoluminescent material layer 1012 of the second color, when a portion of the light of the third color, such as blue light, emitted by the micro LED unit 1111 does not participate in exciting the photoluminescent material layer and passes through the photoluminescent material layer and leaks out, the third reflective layer 801 can reflect the portion of the blue light leaking from the photoluminescent material layer 1011 of the first color, such as red, back to the red photoluminescent material layer to re-participate in exciting the red photoluminescent material layer, and the third reflective layer 801 can reflect the portion of the blue light leaking from the photoluminescent material layer 1011 of the first color, such as red, back to ... The three-reflection layer 801 can reflect part of the blue light leaked from the photoluminescent material layer 1012 of the second color, for example, green, back to the green photoluminescent material layer and re-participate in exciting the green photoluminescent material layer, thereby increasing the light participating in exciting the photoluminescent material layer, thereby increasing the light output of the color corresponding to the photoluminescent material layer, thereby improving the brightness of the micro-LED, and can reduce the mixed output of the leaked part of the light and the different color lights emitted by exciting the photoluminescent material layer, thereby improving the color purity of the micro-LED, thereby improving the display effect of the micro-LED device.
[0066] In such Figure 1 In the case where the micro LED device 1 shown includes a transparent cover plate, according to an embodiment of the present disclosure, the transparent cover plate can be disposed on the third reflective layer 801 .
[0067] Reference Fig. 9 , Fig. 9 is a schematic structural diagram showing a micro LED device 9 according to another embodiment of the present disclosure. Fig. 9 The micro LED device 9 shown is Figure 1 The difference of the micro LED device 1 shown is that the micro LED device 9 further includes a fourth reflective layer 901, which is arranged between the first barrier layer 101 and the micro LED chip 11, wherein the fourth reflective layer 901 is used to reflect the first color of light and the second color of light.
[0068] In such Figure 1In the case where the micro LED device 1 shown includes an insulating layer 12, according to an embodiment of the present disclosure, the fourth reflective layer 901 can be disposed between the first barrier layer 101 and the insulating layer 12. The material of the fourth reflective layer 901 includes a distributed Bragg reflective film for reflecting light of a first color and light of a second color. The fourth reflective layer 901 can be, for example, a distributed Bragg reflective film formed by alternating stacking of silicon dioxide layers and titanium dioxide layers. It is worth noting that although the fourth reflective layer 901 and the first reflective layer, the second reflective layer, and the third reflective layer are all distributed Bragg reflective films formed by alternating stacking of silicon dioxide layers and titanium dioxide layers, the number of silicon dioxide layers and titanium dioxide layers in the fourth reflective layer 901 and the thickness of each silicon dioxide layer and each titanium dioxide layer are different from those of the first reflective layer, the second reflective layer, and the third reflective layer.
[0069] It is worth noting that the fourth reflective layer 901 may also exist in the above-mentioned micro LED devices 2, 3, 4, 5, 6, 7, 8. In these micro LED devices, the positional relationship between the fourth reflective layer 901, the insulating layer 12 and the first barrier layer 101 may be the same as that described above. Fig. 9 The described position relationship is consistent.
[0070] According to the technical solution of this embodiment, the fourth reflective layer 901 is located between the first barrier layer 101 and the micro LED chip 11 and covers the first color photoluminescent material layer 1011 and the second color photoluminescent material layer 1012. Since the fourth reflective layer 901 is used to reflect the first color light corresponding to the first color photoluminescent material layer 1011 and the second color light corresponding to the second color photoluminescent material layer 1012, the third color light, such as blue, emitted from the micro LED unit 1111 can pass through the fourth reflective layer 901, and when the blue light, such as blue light, emitted by the micro LED unit excites the first color photoluminescent material layer, such as red, to emit red light, part of the excited red light will be emitted in the direction of the micro LED unit 1111, and the fourth reflective layer 901 can reflect the part of the red light in the direction of the first color photoluminescent material layer, such as red, so as to increase the color corresponding to the photoluminescent material layer. The amount of light emitted by the micro-LED is increased, thereby improving the brightness of the micro-LED and preventing part of the red light emitted toward the direction of the micro-LED unit from interfering with the blue light emitted by the micro-LED unit; similarly, when the blue light emitted by the micro-LED unit excites a photoluminescent material layer of a second color, such as green, to emit green light, part of the excited green light will be emitted toward the direction of the micro-LED unit 1111, and the fourth reflective layer 901 can reflect the part of the green light toward the direction of the photoluminescent material layer of the second color, such as green, thereby increasing the amount of light emitted by the photoluminescent material layer. The brightness of the micro-LED is improved and part of the green light emitted toward the direction of the micro-LED unit is prevented from interfering with the blue light emitted by the micro-LED unit.
[0071] According to an embodiment of the present disclosure, the pixel size in the above-mentioned micro LED device is generally less than 50 microns.
[0072] The present disclosure also provides a display device, which includes the above-mentioned type LED device. The display device can be applied to flexible electronic devices to realize technologies such as augmented reality (AR), virtual reality (VR), extended reality (XR), and mixed reality (MR). For example, the micro LED device can be the projection part of an electronic device, such as a projector, a head-up display (HUD), etc.; for another example, the micro LED device can also be the display part of an electronic device, such as a smart phone, a smart watch, a laptop, a tablet computer, a driving recorder, a navigator, a head-mounted device, and any other device with a display screen.
[0073] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.
[0074] It should be understood that "one embodiment" or "an embodiment" mentioned throughout the specification means that specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. It should be understood that in various embodiments of the present application, the size of the serial number of each step / process mentioned above does not mean the order of execution, and the execution order of each step / process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiment of the present application. In addition, the serial numbers of the embodiments of the present application mentioned above are only for description and do not represent the advantages and disadvantages of the embodiments.
[0075] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein, for example. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.
[0076] The above description is only a preferred embodiment of the present disclosure and is not intended to limit the present disclosure. For those skilled in the art, the present disclosure may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.
Claims
1. A micro LED device, wherein: The micro LED device comprises: A micro LED chip structure, the micro LED chip structure comprising a micro LED chip, the micro LED chip comprising a micro LED unit array consisting of a plurality of micro LED units; a first barrier layer, the first barrier layer being arranged on the light emitting side of the micro LED chip, the first barrier layer comprising a first through hole array, the arrangement of the first through hole array corresponding to the arrangement of the micro LED unit array, wherein the first through hole array comprises a plurality of groups of first through holes, each group of first through holes comprises three first through holes, and the three first through holes comprise a first first through hole, a second first through hole and a third first through hole; A first color photoluminescent material layer and a second color photoluminescent material layer, wherein the first color photoluminescent material layer is filled in a first first through hole in each group of first through holes, and the second color photoluminescent material layer is filled in a second first through hole in each group of first through holes; A first light absorption layer is filled in the third first through hole in each group of first through holes, wherein the first light absorption layer is used to partially absorb the light of the third color emitted by the micro LED unit.
2. The micro LED device according to claim 1, wherein: The micro LED device also includes a second barrier layer, which is arranged on the first barrier layer and includes a second through hole array, the second through hole array is aligned with the first through hole array and is located above the first through hole array, wherein the second through hole array includes multiple groups of second through holes corresponding to the multiple groups of first through holes, each group of second through holes includes a first second through hole aligned with the first first through hole, a second second through hole aligned with the second first through hole, and a third second through hole aligned with the third first through hole.
3. The micro LED device according to claim 2, wherein: The micro LED device further comprises at least one of a first filling portion, a second filling portion and a third filling portion, wherein: The first filling part is used to fill the first second through hole in each group of second through holes, and the first filling part includes a first filter layer that only allows light of the first color to pass through, a second light absorption layer or a transparent material that is used to partially absorb light of a third color; The second filling part is used to fill the second second through hole in each group of second through holes, and the second filling part includes a second filter layer that only allows light of the second color to pass through, a second light absorption layer for partially absorbing light of the third color, or a transparent material; The third filling portion is used to fill the third second through hole in each group of second through holes, and the third filling portion includes a second light absorbing layer used to partially absorb light of a third color.
4. The micro LED device according to claim 2 or 3, wherein: The micro LED device further includes a third light absorbing layer, which is disposed on the second barrier layer, wherein the third light absorbing layer is used to partially absorb light of a third color emitted by the micro LED unit.
5. The micro LED device according to claim 2 or 3, wherein: The micro LED device further includes a fourth light absorbing layer, which is disposed between the first barrier layer and the second barrier layer, wherein the fourth light absorbing layer is used to partially absorb light of a third color emitted by the micro LED unit.
6. The micro LED device according to claim 2 or 3, wherein: The micro LED device further includes a first reflective layer, which is disposed on the second barrier layer, wherein the first reflective layer is used to partially reflect light of a third color emitted by the micro LED unit.
7. The micro LED device according to claim 2 or 3, wherein: The micro LED device further includes a second reflective layer, which is disposed between the first barrier layer and the second barrier layer, wherein the second reflective layer is used to partially reflect light of a third color emitted by the micro LED unit.
8. The micro LED device according to claim 1, wherein: The micro LED device further includes a fifth light absorption layer, which is disposed on the first barrier layer, wherein the fifth light absorption layer is used to partially absorb light of a third color emitted by the micro LED unit.
9. The micro LED device according to claim 1, wherein: The micro LED device further includes a third reflective layer, which is disposed on the first barrier layer, wherein the third reflective layer is used to partially reflect light of a third color emitted by the micro LED unit.
10. The micro LED device according to any one of claims 1 to 9, wherein: The micro LED device further includes an insulating layer, and the insulating layer is disposed between the first barrier layer and the micro LED chip.
11. The micro LED device according to any one of claims 1 to 9, wherein: The micro LED device further includes a fourth reflective layer, which is disposed between the first barrier layer and the micro LED chip, wherein the fourth reflective layer is used to reflect light of the first color and light of the second color.
12. The micro LED device according to claim 10, wherein: Each micro LED unit in the micro LED unit array includes a first semiconductor layer on the light emitting side, and the insulating layer is arranged between the first barrier layer and the first semiconductor layer.
13. The micro LED device according to claim 1, wherein: The micro LED device further includes a transparent cover plate, which is disposed on the first barrier layer, and the transparent cover plate and the micro LED chip are located on both sides of the first barrier layer.
14. The micro LED device according to any one of claims 1 to 13, wherein: The light corresponding to the first color, the light corresponding to the second color, and the light of the third color are synthesized to obtain white light, the first color is red, the second color is green, and the third color is blue.
15. The micro LED device according to any one of claims 1 to 14, wherein: The micro LED chip structure further includes a driving chip, and a side of the micro LED chip opposite to the light emitting side is arranged on the driving chip. Alternatively, the micro LED chip structure further includes a driving chip and a flexible circuit board, the side of the micro LED chip opposite to the light emitting side is arranged on the driving chip to form a micro LED module, and the micro LED module is arranged on the flexible circuit board through the driving chip.
16. The micro LED device according to claim 1, wherein: The material of the first barrier layer includes a visible light shielding material, the material of the first color photoluminescent material layer and the material of the second color photoluminescent material layer include at least one of II-VI group quantum dots, III-V group quantum dots, perovskite quantum dots and carbon quantum dots, and the material of the first light absorption layer includes an organic dye, nano absorption particles or inorganic oxide for absorbing light of a third color.
17. A display device, wherein: The display device comprises the micro LED device according to any one of claims 1 to 16.
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