Display substrate, preparation method thereof and display device

Abstract

The present disclosure provides a display substrate, a preparation method thereof and a display device, and belongs to the technical field of display. The display substrate can solve the problems of crosstalk and complex preparation process of the existing display substrate. The display substrate comprises a substrate, a first electrode layer comprising a first electrode of each light emitting device, a pixel definition layer having a plurality of pixel openings, a light emitting functional layer comprising a light emitting functional part of each light emitting device, and a plurality of partition structures configured to disconnect at least part of the sub-functional layers in the light emitting functional layer at positions corresponding to the edges of the pixel openings. The partition structure comprises a first sub-structure and a second sub-structure, which are made of a first conductive material and a second conductive material, respectively. The second conductive material comprises a material obtained by a displacement reaction between the first conductive material and a first solution, and the solute in the first solution comprises a compound of the ions of the second conductive material. The display substrate has a simple preparation process and good anti-crosstalk effect.

Description

Technical Field

[0001] This disclosure belongs to the field of display technology, specifically relating to a display substrate and its preparation method, and a display device. Background Technology

[0002] Active-Matrix Organic Light Emitting Diode (AMOLED) is a novel display technology with advantages such as self-emission, wide color gamut, high contrast, and the ability to achieve flexible displays. As a result, the application scenarios for AMOLED display technology are expanding rapidly. For example, more and more mobile display device manufacturers are inclined to apply AMOLED display technology to various display devices, especially foldable mobile phones or laptops, to improve the performance and competitiveness of their products. It is foreseeable that AMOLED display devices will become one of the most important display products in the coming years.

[0003] Meanwhile, AMOLED display technology still has some areas that need improvement. For example, although AMOLED-based displays have the advantages of high color saturation and wide color gamut, this may also lead to overly vivid colors or crosstalk between pixels of different colors, affecting color accuracy. Another example is that while AMOLED displays can save power by not emitting light when displaying black, they require more energy than traditional LCD displays when displaying white, resulting in AMOLED products requiring higher power consumption.

[0004] Therefore, in order to overcome the limitations of AMOLED display technology in practical applications, it is necessary to improve the existing AMOLED. Summary of the Invention

[0005] This invention aims to at least solve one of the technical problems existing in the prior art. In one aspect, it provides a display substrate comprising: a substrate; a first electrode layer disposed on the substrate, the first electrode layer including first electrodes of each light-emitting device; a pixel defining layer disposed on a side of the first electrode layer opposite to the substrate, the pixel defining layer having a plurality of pixel openings penetrating along its thickness direction; and a light-emitting functional layer disposed on the side of the pixel defining layer opposite to the substrate, the light-emitting functional layer including light-emitting functional portions of each light-emitting device; one pixel opening and the first electrode and the light-emitting functional portion of one light-emitting device are disposed on the substrate. The orthographic projections on the substrate at least partially overlap; a plurality of partition structures are disposed on the side of the first electrode layer away from the substrate, and the partition structures are configured such that at least a portion of the sub-functional layers in the light-emitting functional layer are disconnected at the position corresponding to the edge of the pixel opening; wherein, the partition structure includes a first sub-structure and a second sub-structure enclosing the first sub-structure; the materials of the first sub-structure and the second sub-structure are a first conductive material and a second conductive material, respectively; the second conductive material includes a material obtained by a displacement reaction between the first conductive material and a first solution, and the solute in the first solution includes a compound containing ions of the second conductive material.

[0006] In some examples, the first conductive material includes aluminum, the second conductive material includes silver, and the solute in the first solution includes silver nitrate.

[0007] In some examples, the display substrate further includes a second electrode layer disposed on the side of the light-emitting functional layer opposite to the substrate; the second electrode layer includes a second electrode of each of the light-emitting devices and a first connection portion connecting adjacent second electrodes; the partition structure includes a notch, and the orthographic projections of one of the notches and one of the first connection portions on the substrate at least partially overlap.

[0008] In some examples, the display substrate further includes a driving circuit layer disposed on the side of the first electrode layer near the substrate, the driving circuit layer including a plurality of pixel driving circuits; the first electrode includes a first main body portion and a second connecting portion connected to the first main body portion, one second connecting portion electrically connected to one pixel driving circuit; the partition structure and the orthographic projection of the second connecting portion on the substrate do not overlap.

[0009] In some examples, the partition structure and the corresponding pixel opening have an orthographic projection on the substrate.

[0010] In some examples, the pixel defining layer also has a plurality of auxiliary openings extending through its thickness direction, one of the auxiliary openings being disposed around one of the pixel openings; the partition structure corresponding to the pixel opening overlaps with the orthographic projection of the auxiliary opening disposed around the pixel opening onto the substrate.

[0011] In some examples, for the partition structure and the corresponding pixel opening, the longitudinal section of the partition structure has a first side and a second side disposed opposite to each other along the thickness direction of the substrate, and a third side and a fourth side connecting the first side and the second side, wherein the third side is closer to the first center line than the fourth side; at least some points on the third side are at unequal distances from the first center line, and the points closer to the substrate are at longer distances from the first center line; the first center line is a straight line that passes through the center of the orthographic projection of the pixel opening onto the substrate and extends along the thickness direction of the substrate.

[0012] In some examples, the light-emitting functional layer includes a hole injection layer; the partition structure is disposed on the side of the hole injection layer near the substrate, and the partition structure is configured such that the hole injection layer is disconnected at the position corresponding to the edge of the pixel opening.

[0013] In some examples, the light-emitting functional layer includes a first light-emitting material layer, a second light-emitting material layer, and a charge-generating layer located between the first light-emitting material layer and the second light-emitting material layer; the partition structure is disposed on the side of the charge-generating layer near the substrate, and the partition structure is configured such that the charge-generating layer is disconnected at the position corresponding to the edge of the pixel opening.

[0014] In a second aspect, the present invention provides a method for fabricating a display substrate, wherein the display substrate is as described in any example of the first aspect above, wherein the fabrication method includes: providing a substrate; forming a first electrode layer on the substrate; forming an initial first substructure on a side of the first electrode layer opposite to the substrate; the material of the initial first substructure being a first conductive material; patterning the first electrode layer using a first solution to form first electrodes for each light-emitting device; simultaneously, using the first solution to undergo a displacement reaction with the initial first substructure to form a partition structure; the partition structure includes a first substructure and a second substructure enclosing the first substructure, wherein the materials of the first substructure and the second substructure are the first conductive material and the second conductive material, respectively; The second conductive material comprises a material obtained by a displacement reaction between the first conductive material and the first solution, wherein the solute in the first solution comprises a compound containing ions of the second conductive material; a pixel defining layer is formed on the side of the first electrode layer facing away from the substrate, and a plurality of pixel openings are formed extending along the thickness direction of the pixel defining layer; a light-emitting functional layer is formed on the side of the pixel defining layer facing away from the substrate; the light-emitting functional layer comprises a light-emitting functional part of each of the light-emitting devices, wherein a pixel opening at least partially overlaps with the orthographic projection of the first electrode and the light-emitting functional part of a light-emitting device on the substrate; and at least a portion of the sub-functional layers in the light-emitting functional layer are disconnected at the position corresponding to the edge of the pixel opening.

[0015] In some examples, an initial first substructure is formed on the side of the first electrode layer facing away from the substrate, including: forming a first conductive material layer on the side of the first electrode layer facing away from the substrate; patterning the first conductive material layer to form the initial first substructure; the initial first substructure is disposed around a pixel opening; for the initial first substructure and the corresponding pixel opening, the longitudinal section of the initial first substructure has a first bottom edge and a second bottom edge disposed opposite to each other along the thickness of the substrate, and a third side edge and a fourth side edge connecting the first bottom edge and the second bottom edge; the third side edge is closer to the first center line than the fourth side edge; at least some points on the third side edge are at unequal distances from the first center, and the points closer to the substrate are shorter from the first center line; the first center line is a straight line that passes through the center of the orthographic projection of the pixel opening onto the substrate and extends along the thickness direction of the substrate.

[0016] In some examples, while forming a plurality of pixel openings that extend through the thickness direction of the pixel defining layer, the method further includes: forming a plurality of auxiliary openings that extend through the thickness direction of the pixel defining layer; one of the auxiliary openings being disposed around one of the pixel openings; and the partition structure disposed corresponding to the pixel openings overlapping the orthographic projection of the auxiliary openings disposed around the pixel openings onto the substrate.

[0017] In some examples, forming a light-emitting functional layer on the side of the pixel defining layer away from the substrate includes: sequentially forming a first light-emitting material layer, a charge-generating layer, and a second light-emitting material layer on the side of the pixel defining layer away from the substrate; the partition structure is formed on the side of the charge-generating layer near the substrate and is configured such that the charge-generating layer is disconnected at the position corresponding to the edge of the pixel opening.

[0018] In some examples, the method further includes: forming a second electrode layer on the side of the light-emitting functional layer opposite to the substrate; the second electrode layer includes a second electrode of each of the light-emitting devices and a first connection portion connecting adjacent second electrodes; the partition structure includes a notch, one of the notches at least partially overlapping the orthographic projection of one of the first connection portions on the substrate.

[0019] Thirdly, this disclosure also provides a display device comprising the display substrate described in any of the examples of the first aspect above. Attached Figure Description

[0020] Figure 1 This is a planar schematic diagram of an AMOLED display substrate in related technologies.

[0021] Figure 2 for Figure 1 The diagram shows a cross-sectional view of the display substrate.

[0022] Figure 3 for Figure 1 The diagram shows a cross-sectional view of a sub-pixel in the display substrate.

[0023] Figure 4 This is a schematic diagram of the structure of a light-emitting functional layer.

[0024] Figure 5 This is a schematic diagram of another type of light-emitting functional layer.

[0025] Figure 6 This is a graph showing the change of color coordinates with grayscale when an AMOLED display device displays blue and green images in related technologies.

[0026] Figure 7This is a spectral diagram of an AMOLED display device displaying blue and green images in related technologies.

[0027] Figure 8 This is a planar schematic diagram of the display substrate provided in this disclosure.

[0028] Figure 9 for Figure 8 The diagram shows a cross-sectional view of the display substrate along AB.

[0029] Figure 10 This is an experimental test diagram showing the displacement reaction between aluminum and silver ion solution.

[0030] Figure 11A A cross-sectional electron microscope image of the display substrate provided in this disclosure.

[0031] Figure 11B The spectral variation diagram provided in this disclosure is shown when the display substrate displays low grayscale.

[0032] Figure 12 For preparation Figure 9 The diagram shows the fabrication process of the display substrate.

[0033] Figure 13 This is a flowchart of step S3.

[0034] Figure 14 This is a plan view of another display substrate provided in this disclosure.

[0035] Figure 15 for Figure 14 The diagram shows a cross-sectional view of the display substrate along CD.

[0036] Figure 16 For preparation Figure 15 The diagram shows the fabrication process of the display substrate.

[0037] Figure 17 This is a schematic diagram of the shape of the longitudinal section of the partition structure.

[0038] The attached figures are labeled as follows:

[0039] 1. Substrate; 2. Driving circuit layer; 3. Planarization layer; 4. Pixel boundary layer; 5. Light-emitting device layer; 401. Pixel aperture; 4021. First electrode layer; 402. First electrode; 421. Light-emitting functional layer; 403. Light-emitting functional part; 4041. Second electrode layer; 404. Second electrode; 4211. Light-emitting material layer; 4211a. First light-emitting material layer; 4211b. Second light-emitting material layer; 421a. Hole injection layer; 421b. Hole transport layer; 421c. Electron transport layer; 421d. Electron injection layer; 421e. Charge generation layer; 101. Polyimide layer; 102. Buffer layer; 103. First gate insulating layer; 104. Second gate insulating layer; 105. Interlayer dielectric layer; 201. Active layer; 202. Gate; 203. Drain; 204. Source; 301, First electrode plate; 302, Second electrode plate; 42, Light-emitting device; 41, Sub-pixel; 41a, Red sub-pixel; 41b, Blue sub-pixel; 41c, Green sub-pixel; 400, Pixel unit; 8, Encapsulation layer; 108, First inorganic encapsulation layer; 109, Organic encapsulation layer; 110, Second inorganic encapsulation layer; 6, Partition structure; 61, First partition structure; 62, Second partition structure; 61a, First partition portion; 61b, Second partition portion; 62a, Third partition portion; 62b, Fourth partition portion; 63, Notch; 4021a, First main body portion; 4022, Second connecting portion; 4042, First connecting portion; 601, First substructure; 602, Second substructure; 406, Auxiliary opening; 6011, Initial first substructure; 6012, First conductive material layer; 7, Spacer. Detailed Implementation

[0040] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0041] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0042] As used herein, “parallel” and “perpendicular” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable range of deviation for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable range of deviation for approximate perpendicularity may also be, for example, within 5°.

[0043] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0044] In this article, "electrical connection" includes the situation where constituent elements are connected together by a component that has a certain electrical function. There are no particular restrictions on the "component that has a certain electrical function" as long as it enables the transmission and reception of electrical signals between the connected constituent elements. Examples of "components that have a certain electrical function" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other components with various functions.

[0045] This document describes exemplary embodiments with reference to sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and regions is enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Therefore, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. Thus, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0046] In this disclosure, unless otherwise stated, the term "same-layer arrangement" means that two layers, components, elements, or portions can be formed by the same patterning process, and that the two layers, components, elements, or portions are generally formed of the same material.

[0047] In this disclosure, unless otherwise stated, the term "patterning process" generally includes steps such as photoresist coating, exposure, development, etching, and photoresist stripping. The term "one-step patterning process" refers to a process that uses a photomask to form patterned layers, components, or parts.

[0048] Figure 1 This is a planar schematic diagram of an AMOLED display substrate in related technologies; Figure 2 yes Figure 1 The diagram shows a schematic representation of the film structure along the thickness direction of the display substrate. Figure 1 and Figure 2 As shown, the display substrate includes a plurality of pixel units 400 arranged in an array, and each pixel unit 400 includes a plurality of sub-pixels 41. For example, pixel unit 400 may include red sub-pixels, green sub-pixels, and blue sub-pixels. Structurally speaking, Figure 1 and Figure 2 The display substrate shown includes a substrate 1, a driving circuit layer 2 formed on the substrate 1, and a pixel defining layer 4 and a light-emitting device layer 5 disposed on the side of the driving circuit layer 2 facing away from the substrate 1. The pixel defining layer 4 has a plurality of pixel openings 401 extending through its thickness direction; the light-emitting device layer 5 includes a plurality of light-emitting devices 42 corresponding to the pixel openings 401, with each pixel opening 401 defining an effective light-emitting area for one light-emitting device 42; the driving circuit layer 2 includes pixel driving circuits electrically connected to each light-emitting device 42 in a one-to-one correspondence. Typically, a sub-pixel 41 may include a light-emitting device 42 and a pixel driving circuit electrically connected to that light-emitting device 42.

[0049] Figure 3 yes Figure 2 The diagram shown illustrates the film structure of a sub-pixel 41 along its thickness direction in the display substrate. Figure 3As shown, the pixel driving circuit in sub-pixel 41 typically includes a thin-film transistor and a capacitor structure. The pixel driving circuit can adopt circuit structures such as 3T1C, 4T1C, 5T1C, 5T2C, 6T1C, 7T1C, or 8T1C. The light-emitting device 42 in sub-pixel 41 may include a first electrode 402, a light-emitting functional part 403, and a second electrode 404. The first electrode 402 can be electrically connected to the pixel driving circuit through a metal via. The first electrode 402 can be an anode, which can be made of materials such as ITO (indium tin oxide), indium zinc oxide (IZO), or zinc oxide (ZnO). The light-emitting functional part 403 is partially located within the pixel opening 401 and formed on the first electrode 402. The light-emitting functional part 403 may include small molecule organic materials or polymer molecule organic materials, and can be a fluorescent light-emitting material or a phosphorescent light-emitting material. The material can emit red, green, blue, or white light, etc.; and, depending on the actual needs, in different examples, the light-emitting functional part 403 can further include functional layers such as an electron injection layer (EIL), an electron transport layer (ETL), a hole injection layer (HIL), and a hole transport layer (HTL); the second electrode 404 covers the light-emitting functional part 403, and the polarity of the second electrode 404 is opposite to that of the first electrode 402; this second electrode 404 can be a cathode, and this cathode can be made of metal materials such as lithium (Li), aluminum (Al), magnesium (Mg), and silver (Ag).

[0050] Just with Figure 3 In terms of the corresponding display substrate as a whole, its light-emitting device layer 5 includes a first electrode layer 4021, a light-emitting functional layer 421, and a second electrode layer 4041. The first electrode layer 4021 includes the first electrode 402 of each light-emitting device 42, the light-emitting functional layer 421 includes the light-emitting functional part 403 of each light-emitting device 42, and the second electrode layer 4041 includes the second electrode 404 of each light-emitting device 42. Typically, the first electrodes 402 of each light-emitting device 42 are independent of each other, and the second electrodes 404 of each light-emitting device 42 are connected across their entire surface; that is, the second electrode layer 4041 is a full-surface structure disposed on the display substrate and serves as the common electrode for multiple light-emitting devices 42.

[0051] Figure 4 This is a schematic diagram of a specific structure of the light-emitting functional layer 421. For example... Figure 4 As shown, the light-emitting functional layer 421 includes multiple sub-functional layers. Besides the light-emitting material layer 4211, the light-emitting functional layer 421 also includes an electron injection layer (EIL) 421d, an electron transport layer (ETL) 421c, a hole injection layer (HIL) 421a, and a hole transport layer (HTL) 421b. For the light-emitting functional layer 421, the material of the light-emitting material layer 4211 and the materials of each sub-functional layer are crucial in determining the light-emitting effect of each light-emitting functional part 403.

[0052] To improve the luminous efficacy of display devices, most OLED devices currently employ hole injection layers 421a that are typically composed of hole transport materials doped with deep-level P-dopants (e.g., Lowest Unoccupied Molecular Orbital). , The hole injection layer 421a is composed of materials such as F4-TCNQ, because there is a significant spontaneous charge transfer between the hole transport material and the P-dopant in the hole injection layer 421a, which ultimately endows the hole injection layer 421a with high conductivity, including high lateral hole carrier conductivity. It should be noted that in actual fabrication, in order to reduce the fabrication cost, CMM (Common Metal Mask) is generally used instead of FMM (Fine Metal Mask) in the process of forming the hole injection layer 421a by vapor deposition. The difference between the two is that CMM is often used to deposit common film layers, such as hole injection layer 421a and hole transport layer 421b, which is suitable for production scenarios with relatively low precision requirements; FMM is often used to deposit red, green and blue organic light-emitting material layers 4211 and form sub-pixels 41, which is suitable for production scenarios with extremely high precision requirements (such as high-resolution displays). In other words, the hole injection layer 421a of the red, green and blue sub-pixels 41 is shared, and the hole injection layer 421a is a whole-surface structure disposed in the display substrate.

[0053] To further improve the luminous efficiency and reduce power consumption of display devices, related technologies propose replacing the single-layer luminescent material in the luminescent functional layer 421 with two or more layers of luminescent material connected in series, and adding a charge generation layer (CGL) between the two luminescent material layers to achieve a dual-layer luminescent (Tandem EL) design. OLED devices formed by this design are called Tandem OLED devices.

[0054] Figure 5 This is a schematic diagram of the structure of the light-emitting functional layer 421, which includes two light-emitting material layers 4211. Figure 4 The difference between the light-emitting functional layer 421 shown is that... Figure 5The illustrated light-emitting functional layer 421 includes a first light-emitting material layer 4211a and a second light-emitting material layer 4211b. A charge generation layer (CGL) 421e is disposed between the two light-emitting material layers 4211. Each light-emitting material layer 4211 is equivalent to an independent light source. By connecting the two light-emitting material layers 4211 in series through the charge generation layer 421e, higher brightness, longer lifespan, and lower power consumption can be achieved. It should be noted that the charge generation layer 421e typically has a high lateral conductivity, and similar to the hole injection layer 421a, the charge generation layer CGL is shared by multiple sub-pixels 41, meaning that it is also formed as a whole surface during the fabrication process.

[0055] The following section discusses the technical problems existing in the related technology. As mentioned above, because the hole injection layer 421a and the charge generation layer 421e have high lateral conductivity, and because they are both formed on the entire surface of the display substrate, meaning that each light-emitting device 42 shares the same hole injection layer 421a and charge generation layer 421e, crosstalk between adjacent sub-pixels 41 can easily occur. For example, when the display device displays a blue or green image, some lateral hole carrier leakage current may flow into the red sub-pixel 41, causing the red sub-pixel to emit light, resulting in a pinkish appearance when displaying white. This crosstalk phenomenon is even more pronounced in low grayscale displays, causing the Gamma circuit to fail to adjust brightness or contrast in low grayscale, thus reducing the display effect of the display device.

[0056] The following section uses actual test results to intuitively describe the problems existing in the above-mentioned related technologies. Figure 6 This is a graph showing the change of color coordinates with grayscale when an AMOLED display device displays blue and green images in related technologies. Figure 7 This is a spectral diagram showing the blue and green colors displayed in AMOLED display devices within related technologies. From... Figure 6 As can be seen, the blue screen ( Figure 6 (a) and green screen (a) Figure 6 In (b) when the gray level is less than 64, the color coordinates tend to increase as the gray level decreases. From Figure 7 As can be seen, when displaying a blue image, there is crosstalk between green and red light in the emitted blue light (see curve L1), and when displaying a green image, there is crosstalk between red light in the emitted green light (see curve L2).

[0057] To address at least one of the aforementioned technical problems, this disclosure provides a display substrate. The display substrate provided in this disclosure will now be described in detail with reference to the accompanying drawings.

[0058] Figure 8This is a plan view of a display substrate provided in an embodiment of the present disclosure; Figure 9 for Figure 8 The diagram shows a cross-sectional view of the display substrate along the vertical plane containing AB. Figure 8 As shown, the display substrate provided in this disclosure includes a plurality of pixel units 400, and each pixel unit 400 includes a plurality of sub-pixels 41, so as to Figure 8 Taking the display substrate shown as an example, each pixel unit 400 includes a red sub-pixel 41a, a blue sub-pixel 41b, and a green sub-pixel 41c, and each sub-pixel 41 includes a light-emitting device 42. (Refer to...) Figure 9 The display substrate sequentially includes, along its thickness direction, a substrate 1, a first electrode layer 4021 disposed on the substrate 1, a pixel defining layer 4 disposed on the side of the first electrode layer 4021 facing away from the substrate 1, and a light-emitting functional layer 421 and a second electrode layer 4041 formed on the side of the pixel defining layer 4 facing away from the substrate 1. The first electrode layer 4021 includes a first electrode 402 of each light-emitting device 42; the pixel defining layer 4 has a plurality of pixel openings 401 extending along its thickness direction; the light-emitting functional layer 421 includes a light-emitting functional portion 403 of each light-emitting device 42, and a pixel opening 401 at least partially overlaps with the orthographic projection of the first electrode 402 and the light-emitting functional portion 403 of a light-emitting device 42 onto the substrate 1.

[0059] Continue to refer to Figure 8 and Figure 9 The display substrate provided in this disclosure also includes multiple partition structures 6. For example... Figure 9 As shown, the partition structure 6 is disposed on the side of the first electrode layer 4021 facing away from the substrate 1, and is configured such that at least a portion of the sub-functional layers in the light-emitting functional layer 421 are disconnected at the position corresponding to the edge of the pixel opening 401. Specifically, the partition structure 6 provided in this disclosure includes a first sub-structure 601 and a second sub-structure 602 that encloses the first sub-structure 601. The first sub-structure 601 and the second sub-structure 602 are respectively a first conductive material and a second conductive material, the second conductive material comprising a material obtained by a displacement reaction between the first conductive material and a first solution, and a compound in which the solute in the first solution includes ions of the second conductive material.

[0060] It should be noted that the phrase "disconnected at the position corresponding to the edge of pixel opening 401" in this article means that the sub-functional layer in the light-emitting functional layer 421 is a non-continuous or non-integrated structure at the position corresponding to the edge of pixel opening 401.

[0061] As an optional specific embodiment, the first conductive material can be aluminum (Al), the second conductive material can be silver (Ag), and the solute in the first solution includes silver nitrate. At this point, the material of the first substructure 601 of the partition structure 6 is aluminum, and the material of the second substructure 602 surrounding the outside of the first substructure 601 is silver; the partition structure 6 is formed by the following displacement reaction between the initial first substructure and the silver nitrate solution: The displacement reaction process can be roughly described as follows: metallic aluminum (the initial first substructure) is placed in a silver nitrate solution and undergoes a displacement reaction with the silver ions therein. The generated aluminum ions enter the solution, while the generated metallic silver adheres to the outside of the metallic aluminum. Ultimately, this causes partial corrosion of the edges of the initial first substructure to form the first substructure 601, while a layer of metallic silver is plated onto the outside of the first substructure 601. It should be noted that the first conductive material, the second conductive material, and the first solution provided in this embodiment are based on materials commonly used in existing preparation processes and do not constitute a limitation of this disclosure. In practical applications, they can be flexibly selected according to requirements. For example, the first conductive material can also be metals such as zinc, copper, iron, and magnesium, and the first solution can also be copper sulfate, copper nitrate, ferrous nitrate, bismuth nitrate, ammonium silver nitrate, etc. Correspondingly, the second conductive material can also be bismuth, copper, iron, etc.

[0062] The display substrate provided in this disclosure, by providing a partition structure 6, disconnects at least a portion of the sub-functional layers in the light-emitting functional layer 421 at positions corresponding to the edge of the pixel opening 401, thereby reducing crosstalk between two adjacent sub-pixels 41 and improving the imaging effect of the display substrate. Furthermore, the partition structure 6 provided in this disclosure includes a first sub-structure 601 and a second sub-structure 602 surrounding the outside of the first sub-structure 601. This double-layer partition structure design increases the height of the partition structure 6, thereby ensuring the partitioning effect of the partition structure 6, that is, ensuring that the sub-functional layers in the light-emitting functional layer 421 are disconnected at the positions of the partition structure 6.

[0063] Figure 10 This shows the appearance and elemental analysis of aluminum after a displacement reaction with silver ions. Figure 10 As shown, when metallic aluminum is placed in a silver nitrate solution, the edges of the aluminum undergo a displacement reaction with silver ions in the etching solution, resulting in the corrosion of the aluminum edges while simultaneously adhering a layer of elemental silver. Figure 10 As can be seen, the color of the aluminum edge changed significantly, and silver was detected at the aluminum edge, proving that an aluminum-silver substitution reaction occurred at the aluminum edge.

[0064] Figure 11A for Figure 9 The image shown is a cross-sectional electron microscope (SEM) image of the display substrate. Figure 11AAs shown, the light-emitting functional layer 421 is disconnected at the location of the partition structure 6, which proves that in the display substrate provided by this disclosure, the partition structure 6 can effectively disconnect the light-emitting functional layer 421 at the position corresponding to the edge of the pixel opening 401, thereby preventing crosstalk between adjacent sub-pixels 41.

[0065] Figure 11B for Figure 9 The diagram shows the spectral changes when the display substrate displays low grayscale. Figure 11B In the diagram, curve LA represents the use of... Figure 9 The curves shown represent the low grayscale spectral changes when using partition structure 6, while curve LB represents the low grayscale spectral changes when partition structure 6 is not used. By comparison, it can be found that, relative to curve LB, when partition structure 6 is used... Figure 9 When the partition structure 6 is shown, the red spectral intensity of the display substrate is significantly reduced due to crosstalk. Therefore, the display substrate provided in this disclosure can ensure the low grayscale image quality of the AMOLED display.

[0066] Based on the same inventive concept, in a second aspect, this disclosure also provides a method for preparing a display substrate as described in the first aspect. Figure 12 This is a schematic flowchart illustrating the display substrate fabrication method provided in this disclosure. Figure 12 As shown, the preparation method includes:

[0067] Step S1: Provide a substrate 1.

[0068] For example, the substrate 1 can be made of one or more materials selected from glass, polyimide, polycarbonate, polyacrylate, polyetherimide, and polyethersulfone, but is not limited thereto. The substrate 1 can be a rigid substrate or a flexible substrate. When the substrate 1 is a flexible substrate, it can include a first flexible material layer, a first inorganic material layer, a semiconductor layer, a second flexible material layer, and a second inorganic material layer stacked sequentially; wherein, the materials of the first flexible material layer and the second flexible material layer can be polyimide (PI), polyethylene terephthalate (PET), or a surface-treated polymer soft film, etc.; the materials of the first inorganic material layer and the second inorganic material layer are silicon nitride (SiNx) or silicon oxide (SiOx), etc., to improve the substrate's resistance to water and oxygen. The first inorganic material layer and the second inorganic material layer can also be referred to as a barrier layer or a buffer layer.

[0069] Step S2: Form a first electrode layer 4021 on the substrate 1.

[0070] In some examples, the first electrode layer 4021 is the anode layer, and the first electrode 402 is the anode. In this case, the material of the first electrode layer 4021 can be a transparent conductive material with a high work function, such as indium tin oxide (ITO), which has high transparency and good conductivity. In other examples, the first electrode layer 4021 can also be a metallic material, such as any one or more of magnesium (Mg), silver (Ag), copper (Cu), titanium (Ti), and molybdenum (Mo), or an alloy of the above metals, such as aluminum-neodymium alloy (AlNd). In addition, the first electrode layer 4021 can be a single-layer structure, a multi-layer composite structure, or a stacked structure formed by metals and transparent conductive materials, such as reflective materials like ITO / Ag / ITO and Mo / AlNd / ITO.

[0071] Step S3: On the side of the first electrode layer 4021 away from the substrate 1, an initial first substructure 6011 is formed, and the material of the initial first substructure 6011 is a first conductive material.

[0072] Step S4: Using the first solution, pattern the first electrode layer 4021 to form the first electrode 402 of each light-emitting device 42; simultaneously, using the displacement reaction between the first solution and the first conductive material, form the first substructure 601 of the partition structure 6 and the second substructure 602 encapsulating the first substructure 601. The material of the second substructure 602 is the second conductive material, and the solute in the first solution includes a compound containing ions of the second conductive material.

[0073] In a specific embodiment, the first conductive material is aluminum, the second conductive material is silver, and the first solution includes silver nitrate. At this point, the material of the first substructure 601 of the partition structure 6 is aluminum, and the material of the second substructure 602 enclosing the first substructure 601 is silver; the partition structure 6 is formed by the following displacement reaction between the initial first substructure 6011 and the silver nitrate solution: The displacement reaction process can be roughly described as follows: metallic aluminum (initial first substructure 6011) is placed in a silver nitrate solution and undergoes a displacement reaction with the silver ions therein. The generated aluminum ions enter the solution, while the generated metallic silver adheres to the outside of the metallic aluminum. Ultimately, this causes part of the edge of the initial first substructure to be corroded, forming the first substructure 601. At the same time, a layer of metallic silver is plated on the outside of the first substructure 601, thus ultimately forming... Figure 9 The partition structure shown is 6.

[0074] Step S51: A pixel defining layer 4 is formed on the side of the first electrode layer 4021 that is away from the substrate 1.

[0075] For example, the material of the pixel defining layer 4 can be an organic material, such as polyimide, acrylic, or polyethylene terephthalate alcohol.

[0076] Step S52: Form a plurality of pixel openings 401 that extend through the thickness direction of the pixel defining layer 4. The orthographic projections of a first electrode 402 and a pixel opening 401 on the substrate 1 overlap.

[0077] Step S6: A light-emitting functional layer 421 is formed on the side of the pixel defining layer 4 facing away from the substrate 1. The light-emitting functional layer 421 includes a light-emitting functional part 403 of each light-emitting device 42. The orthogonal projection of a pixel opening 401 onto the substrate 1 of the first electrode 402 and the light-emitting functional part 403 of a light-emitting device 42 is at least partially overlapping. At least some sub-functional layers in the light-emitting functional layer 421 are disconnected at the position corresponding to the edge of the pixel opening 401.

[0078] The display substrate provided in this disclosure, by setting a partition structure 6, disconnects at least a portion of the sub-functional layers in the light-emitting functional layer 421 at the position corresponding to the edge of the pixel opening 401, thereby reducing crosstalk between two adjacent sub-pixels 41 and improving the imaging effect of the display substrate. Furthermore, the partition structure 6 provided in this disclosure includes a first sub-structure 601 and a second sub-structure 602 surrounding the outside of the first sub-structure 601. The double-layer partition structure design increases the height of the partition structure 6, thereby ensuring the partitioning effect of the partition structure 6, that is, ensuring that the sub-functional layers in the light-emitting functional layer 421 are disconnected at the position of the partition structure 6. In addition, the partition structure 6 provided in this disclosure does not require a separate fabrication process to form the second sub-structure 602 that adheres to the outside of the first sub-structure 601. As described in the above fabrication method, the second sub-structure 602 is formed simultaneously during the etching of the first electrode layer 4021 using a first solution to form the first electrode 402 of each light-emitting device 42. Therefore, the display substrate provided in this disclosure has a simple and efficient fabrication process and lower cost.

[0079] Figure 13 This refers to the specific steps in step S301 for forming the initial first substructure. Specifically, step S3, "forming the initial first substructure 6011 on the side of the first electrode layer 4021 facing away from the substrate 1," specifically includes:

[0080] Step S31: On the side of the first electrode layer 4021 facing away from the substrate 1, a first conductive material layer 6012 is formed.

[0081] Step S32: Pattern the first conductive material layer 6012 to form an initial first substructure 6011.

[0082] For the initial first substructure 6011 and the corresponding pixel opening 401, the longitudinal section of the initial first substructure 6011 has a first bottom edge D1 and a second bottom edge D2 disposed opposite to each other along the thickness of the substrate 1, and a third side edge D3 and a fourth side edge D4 connecting the first bottom edge D1 and the second bottom edge D2. The third side edge D3 is closer to the first center line L4 than the fourth side edge D4, and at least some points on the third side edge D3 are at unequal distances from the first center line L4, with points closer to the substrate 1 having shorter distances to the first center line L4. The first center line L4 is a straight line that passes through the center of the orthographic projection of the pixel opening 401 onto the substrate 1 and extends along the thickness direction of the substrate 1. Alternatively, simply put, the longitudinal section of the initial first substructure 6011 is trapezoidal. It should be noted that in this document, "the longitudinal section of the initial first substructure 6011" can refer to the cross-sectional shape of the initial first substructure 6011 in a plane perpendicular to the display substrate.

[0083] In some examples, the light-emitting functional layer 421 includes a hole injection layer 421a (see reference). Figure 4 and Figure 5 In the display substrate provided in this disclosure, the partition structure 6 is disposed on the side of the hole injection layer 421a close to the substrate 1, and the partition structure 6 is configured to at least cause the hole injection layer 421a to be disconnected at the position corresponding to the edge of the pixel opening 401.

[0084] Since the hole injection layer 421a has a high lateral hole carrier conductivity, and in actual fabrication, the hole injection layer 421a of each light-emitting device 42 is shared, and it is a whole-surface structure disposed in the display substrate, in the above example, the hole injection layer 421a is disconnected at the position of the partition structure 6 by using the partition structure 6, which can effectively reduce the crosstalk between two adjacent sub-pixels 41 caused by the high conductivity of the hole injection layer 421a.

[0085] In some examples, the light-emitting functional layer 421 includes a first light-emitting material layer 4211a, a second light-emitting material layer 4211b, and a charge-generating layer 421e located between the first light-emitting material layer 4211a and the second light-emitting material layer 4211b (see reference). Figure 5 In the display substrate provided in this disclosure, the partition structure 6 is disposed on the side of the charge generation layer 421e close to the substrate 1, and the partition structure 6 is configured to at least cause the charge generation layer 421e to be disconnected at the position corresponding to the edge of the pixel opening 401.

[0086] In the above example, by using two light-emitting material layers 4211 as the light-emitting functional part 403 of the light-emitting device 42, the luminous efficiency and display brightness of the display substrate can be effectively improved, the power consumption of the display substrate can be reduced, and the lifespan of the display substrate can be extended. However, on the other hand, the charge generation layer 421e usually has a high lateral conductivity, and the charge generation layer 421e of multiple light-emitting devices 42 is shared. It is formed as a whole surface during the fabrication process, which can easily lead to crosstalk between adjacent sub-pixels 41, affecting the display quality. In the above example, by using the partition structure 6 to disconnect the charge generation layer 421e at the position corresponding to the edge of the pixel opening 401, the crosstalk between two adjacent sub-pixels 41 caused by the highly conductive charge generation layer 421e can be reduced. In other words, the display substrate provided by the above example of this disclosure can improve the luminous efficiency and display brightness while reducing the crosstalk between adjacent sub-pixels 41 caused by the charge generation layer 421e.

[0087] In some other examples, the first light-emitting material layer 4211a, the charge-generating layer 421e, and the second light-emitting material layer 421b of the light-emitting functional layer 421 are all disconnected at the position corresponding to the edge of the pixel opening 401. Of course, the embodiments of this disclosure include, but are not limited to, the first light-emitting material layer 4211a and the charge-generating layer 421e may both be disconnected at the position corresponding to the edge of the pixel opening 401, while the second light-emitting material layer 4211b may not be disconnected at the position corresponding to the edge of the pixel opening 401.

[0088] For the display substrate provided in the above example, step S6 in the corresponding fabrication method specifically includes: sequentially depositing a hole injection layer 421a and a hole transport layer 421b using a CMM; sequentially depositing a first light-emitting material layer 4211a emitting different colors of light using an FMM, the first light-emitting material layer 4211a may include a red light-emitting layer, a green light-emitting layer and a blue light-emitting layer; sequentially depositing an electron transport layer 421c, an electron injection layer 421d, a charge generation layer 421e and a hole transport layer 421b using a CMM (the hole transport layer 421b here can be regarded as an auxiliary functional layer of the second light-emitting material layer 4211b); sequentially depositing a second light-emitting material layer 4211b emitting different colors of light using an FMM, the second light-emitting material layer 4211b may include a red light-emitting layer, a green light-emitting layer and a blue light-emitting layer; and sequentially depositing an electron transport layer 421c and an electron injection layer 421c using a CMM.

[0089] Continue to refer to Figure 8 and Figure 9In some examples, the display substrate provided in this disclosure further includes a second electrode layer 4041 disposed on the side of the light-emitting functional layer 421 facing away from the substrate 1. The second electrode layer 4041 includes second electrodes 404 of each light-emitting device 42 and first connection portions 4042 connecting adjacent second electrodes 404. Exemplarily, the second electrode layer 4041 can be a cathode. Specifically, the partition structure 6 is as follows... Figure 8 As shown, it also includes a notch 63, and the orthographic projections of a notch 63 and a first connection portion 4042 on the substrate 1 at least partially overlap. In some examples, the second electrode layer 4041 may also be broken at the position corresponding to the edge of the pixel opening 401.

[0090] In the above example, by providing a notch 63 in the partition structure 6, the adjacent second electrodes 404 are not disconnected at the notch 63, thus facilitating the transmission of cathode signals between the various light-emitting devices 42. It should be noted that the notch 63 in the partition structure 6 can be two or more. Preferably, the size of the notch 63 should not be too large; it only needs to ensure the smooth transmission of the cathode signal. It is understood that a smaller notch can significantly increase the resistance at the notch 63 location in the light-emitting functional layer 421, thereby effectively hindering the passage of current and effectively avoiding color crosstalk between adjacent sub-pixels 41.

[0091] Accordingly, when the display substrate is as described in the example above, its fabrication method is as follows: Figure 12 It also includes:

[0092] Step S7: A second electrode layer 4041 is formed on the side of the light-emitting functional layer 421 facing away from the substrate 1. The second electrode layer 4041 includes a second electrode 404 of each light-emitting device 42 and a first connection portion 4042 connecting adjacent second electrodes 404; a notch 63 of the partition structure 6 and the orthographic projection of a first connection portion 4042 on the substrate 1 at least partially overlap.

[0093] The above example can also be described as follows: the partition structure 6 corresponding to a pixel opening 401 may include multiple spaced sub-partitions, with a notch 63 formed between adjacent sub-partitions, and the orthographic projections of a notch 63 and a first connecting portion 4042 on the substrate 1 at least partially overlapping. Figure 8For example, the partition structure 6 includes a first partition structure 61 and a second partition structure 62. The first partition structure 61 is correspondingly disposed with the pixel opening 401 of the red sub-pixel 41a, and the second partition structure 62 is correspondingly disposed with the pixel opening 401 of the green sub-pixel 41c. Specifically, the first partition structure 61 may include a first partition portion 61a and a second partition portion 61b, and the second partition structure 62 may include a third partition portion 62a and a fourth partition portion 62b. A gap 63 is formed between the first partition portion 61a and the second partition portion 61b, and a gap 63 is formed between the third partition portion 62a and the fourth partition portion 62b. The orthographic projections of the first connection portion 4042 and the gap 63 of the two adjacent second electrodes 404 on the substrate 1 overlap.

[0094] It should be noted that when the partition structure is 6, Figure 8 When the diagram includes a first partition structure 61 and a second partition structure 62, the first partition structure 61 and the second partition structure 62 can be configured to correspond to the pixel openings 401 of any two of the three sub-pixels 41a, 41c, and 41b, respectively; for example, the first partition structure 61 can be configured to correspond to the pixel openings 401 of the blue sub-pixel 41c, and the second partition structure 62 can be configured to correspond to the pixel openings 401 of the red or green sub-pixel.

[0095] Of course, the partition structure 6 may also include a first partition structure 61, a second partition structure 62, and a third partition structure. Figure 8 (Not shown in the image), wherein the first partition structure 61, the second partition structure 62, and the third partition structure are respectively configured to correspond to the pixel openings 401 of the red sub-pixel 41a, the blue sub-pixel 41b, and the green sub-pixel 41c. This effectively prevents crosstalk between the three different colored sub-pixels 41.

[0096] Alternatively, the partition structure 6 may consist only of a first partition structure 61, which can be configured to correspond to the pixel opening 401 of any one of the three sub-pixels: red sub-pixel 41a, blue sub-pixel 41b, and green sub-pixel 41c. For example, the first partition structure 61 can be configured to correspond to the pixel opening 401 of the red sub-pixel 41a. In this case, the most severely crosstalking red light is effectively isolated from sub-pixels of other colors, which can avoid crosstalk between the red sub-pixel and other color sub-pixels to a certain extent. This example has a smaller impact on pixel density, and the fabrication process is simpler compared to other examples.

[0097] In a preferred embodiment, the notch 63 of the partition structure 6 corresponding to the pixel opening 401 should be positioned such that the straight line containing the diagonal of the pixel opening 401 passes through the notch 63. Those skilled in the art should understand that when the pixel density of the display substrate is high and the sub-pixels 41 are arranged closely together, the distance between the edges of the effective light-emitting areas of adjacent sub-pixels 41 is small, while the space between the diagonals of the effective light-emitting areas of adjacent sub-pixels is large. By placing the notch at the diagonal of the pixel opening 401, the space between the diagonals of adjacent sub-pixels 41 can be fully utilized, thereby better enabling the cathode signal to be transmitted at this location.

[0098] The following section presents two examples of how to set the position of partition structure 6.

[0099] The first type is as follows Figure 8 and Figure 9 As shown, the orthographic projections of the partition structure 6 and the corresponding pixel opening 401 on the substrate 1 overlap.

[0100] When the position of partition structure 6 is set as follows Figure 9 As shown, the orthographic projection of part of the partition structure 6 and the pixel opening 401 on the substrate 1 overlaps, and the remaining part overlaps with the orthographic projection of the pixel defining layer 4 on the substrate 1. At this time, the arrangement between the partition structure 6 and the pixel opening 401 is compact and does not occupy too much space. Therefore, for display substrates with high pixel density, it will not affect the pixel density, thereby ensuring the resolution and luminous brightness of the display substrate.

[0101] The second method can be referenced. Figure 14 and Figure 15 , Figure 14 This is a plan view of another display substrate provided in an embodiment of the present disclosure; Figure 15 for Figure 14 The diagram shows a cross-sectional view of the display substrate along the vertical plane of CD. Figure 14 and Figure 15 As shown, in the display substrate provided in this disclosure, the pixel defining layer 4 also has a plurality of auxiliary openings 406 extending through it along its thickness direction, with one auxiliary opening 406 surrounding one pixel opening 401. The partition structure 6, which is provided corresponding to the pixel opening 401, overlaps with the orthographic projection of the auxiliary opening 406 surrounding the pixel opening 401 onto the substrate 1.

[0102] Since the partition structure 6 in the display substrate provided in this disclosure is made of conductive material, when the partition structure 6 is positioned as follows... Figure 14 and Figure 15When the projections of the partition structure 6 and the auxiliary opening 406 surrounding the pixel opening 401 onto the substrate overlap, there is no overlap between the partition structure 6 and the first electrode 402. In this case, the partition structure 6 made of conductive material can be prevented from affecting the anode signal conducted on the first electrode 402, such as avoiding increasing the conduction resistance of the first electrode 402 and thus affecting the transmission of the anode signal.

[0103] It should be noted that when the partition structure 6 is in the second position, a spacer 7 can also be formed between the partition structure 6 and the planarization layer 3. The spacer 7 is disposed in the same layer as the first electrode 402 and is formed simultaneously. This spacer 7 can increase the height of the partition structure 6, thereby ensuring that the light-emitting functional layer 421 is disconnected at the position corresponding to the edge of the pixel opening 401, and improving the reliability of the partition structure 6.

[0104] When the position of the partition structure 6 is the second type, the corresponding preparation method of the display substrate is as follows: Figure 16 As shown, it includes:

[0105] Step S11: Provide a substrate 1. The material and film structure of the substrate 1 can be referred to in step S1 above, and will not be repeated here.

[0106] Step S12: A first electrode layer 4021 is formed on the substrate 1, and the first electrode layer 4021 is patterned to form the first electrode 402 of each light-emitting device 42, and a plurality of spacers 7 corresponding to the positions of the partition structure 6 are formed. The material and patterning process of the first electrode layer 4021 can be referred to steps S2-S4 above, and will not be repeated here.

[0107] Step S13: A pixel defining layer 4 is formed on the side of the first electrode layer 4021 facing away from the substrate 1; and a plurality of pixel openings 401 and a plurality of auxiliary openings 406 are formed in the pixel defining layer 4 along its thickness direction. The orthographic projections of a pixel opening 401 and a first electrode 402 on the substrate 1 overlap; an auxiliary opening 406 is disposed around a pixel opening 401. For a pixel opening 401, the orthographic projections of the spacer 7 corresponding to the partition structure 6 and the auxiliary opening 6 surrounding the pixel opening 401 overlap on the substrate 1. The material selection for the pixel defining layer 4 can be referred to in steps S51 and S52 above, and will not be repeated here.

[0108] Step S14: An initial first substructure 6011 is formed on the side of the spacer 7 facing away from the substrate 1; the material of the initial first substructure 6011 is a first conductive material. Specifically, the specific steps for forming the initial first substructure 6011 can be referred to steps S31 and S32 above, and will not be repeated here.

[0109] Step S15: A displacement reaction is carried out between the first solution and the initial first substructure 6011 to form a first substructure 601 of the partition structure 6 and a second substructure 602 encapsulating the first substructure 601. The material of the second substructure 602 is a second conductive material, and the solute in the first solution includes a compound containing ions of the second conductive material.

[0110] In a specific embodiment, the first conductive material is aluminum, the second conductive material is silver, and the first solution includes silver nitrate. At this point, the material of the first substructure 601 of the partition structure 6 is aluminum, and the material of the second substructure 602 enclosing the first substructure 601 is silver; the partition structure 6 is formed by the following displacement reaction between the initial first substructure 6011 and the silver nitrate solution: The displacement reaction process can be roughly described as follows: metallic aluminum (initial first substructure 6011) is placed in a silver nitrate solution and undergoes a displacement reaction with the silver ions therein. The generated aluminum ions enter the solution, while the generated metallic silver adheres to the outside of the metallic aluminum. Ultimately, this causes part of the edge of the initial first substructure to be corroded, forming the first substructure 601. At the same time, a layer of metallic silver is plated on the outside of the first substructure 601, thus ultimately forming... Figure 16 The partition structure shown is 6.

[0111] Step S16: A light-emitting functional layer 421 is formed on the side of the pixel defining layer 4 facing away from the substrate 1. The light-emitting functional layer 421 includes a light-emitting functional part 403 of each light-emitting device 42. The orthographic projection of a pixel opening 401 and the first electrode 402 and the light-emitting functional part 403 of a light-emitting device 42 on the substrate 1 at least partially overlaps. At least some sub-functional layers in the light-emitting functional layer 421 are disconnected at the position corresponding to the edge of the pixel opening 401.

[0112] For example, the light-emitting functional layer 421 includes a first light-emitting material layer 4011a, a charge-generating layer 421e, and a second light-emitting material layer 4011b. Of course, the light-emitting functional layer 421 may also include a hole injection layer 421a, a hole transport layer 421b, an electron injection layer 421d, and a charge transport layer 421c for auxiliary light emission. The materials of the first light-emitting material layer 4011a and the second light-emitting material layer 4011b can be selected from pyrene derivatives, anthracene derivatives, fluorene derivatives, perylene derivatives, styrene-amine derivatives, metal complexes, etc.; the material of the hole injection layer 421a may include oxides or organic materials, such as hexacyanohexaazatriphenylene, 2,3,5,6-tetrafluoro-7,7,8,8-tetracyano-p-quinone dimethyl ether (F4TCNQ), 1,2,3-tris[(cyano)(4-cyano-2,3,5- The hole transport layer 421b may be made of aromatic amines with hole transport properties, or dimethylfluorene or carbazole materials, etc.; the charge generation layer 421e is configured to generate, transport, and inject charge carriers, and its material may be an N-type doped organic layer / inorganic metal oxide, or an N-type doped organic layer / organic layer, or an N-type doped organic layer / P-type doped organic layer, etc.

[0113] Step S17: A second electrode layer 4041 is formed on the side of the light-emitting functional layer 421 facing away from the substrate 1. The second electrode layer 4041 includes a second electrode 404 of each light-emitting device 42 and a first connection portion 4042 connecting adjacent second electrodes 404.

[0114] Continue to refer to Figure 9 and Figure 15 The display substrate provided in this disclosure further includes a driving circuit layer 2 disposed on the side of the first electrode layer 4021 near the substrate 1. This driving circuit layer 2 includes a plurality of pixel driving circuits. The specific structure of the pixel driving circuits can be found in [reference needed]. Figure 3 It includes thin-film transistors and capacitor structures.

[0115] Specifically, the thin-film transistor can be a top-gate type, including an active layer 201, a first gate insulating layer 103, a gate 202, a second gate insulating layer 104, an interlayer dielectric layer 105, a source 204, and a drain 203. Specifically, the active layer 201 can be formed on the buffer layer 102, the first gate insulating layer 103 covers the buffer layer 102 and the active layer 201, the gate 202 is formed on the side of the first gate insulating layer 103 away from the active layer 201, the second gate insulating layer 104 covers the gate 202 and the first gate insulating layer 103, the interlayer dielectric layer 105 covers the second gate insulating layer 104, the source 204 and the drain 203 are formed on the side of the interlayer dielectric layer 105 away from the substrate 1 and are respectively located on opposite sides of the gate 202, and the source 204 and the drain 203 can contact the opposite sides of the active layer 201 through vias (e.g., metal vias).

[0116] The capacitor structure may include a first electrode 301 and a second electrode 302. The first electrode 301 is disposed on the same layer as the gate 202, and the second electrode 302 is located between the second gate insulating layer 104 and the interlayer dielectric layer 105, and is disposed opposite to the first electrode 301. The materials of the gate 202, the first electrode 301, and the second electrode 302 may include metallic or alloy materials, such as molybdenum, aluminum, and titanium. The source 204 and the drain 203 may include metallic or alloy materials, such as a single-layer or multi-layer structure formed of molybdenum, aluminum, and titanium. For example, the multi-layer structure is a multi-metal stack, such as a titanium, aluminum, and titanium three-layer stack (Ti / Al / Ti).

[0117] Correspondingly, the method for fabricating the display substrate also includes the step of forming a pixel driving circuit for each sub-pixel 41 in the driving circuit layer 2 described above.

[0118] In addition, when the thin-film transistor is a top-gate type, a planarization layer 3 can be fabricated before fabricating the light-emitting device 42 and the pixel defining layer 4. This planarization layer 3 can be a single-layer structure or a multi-layer structure. Generally, the planarization layer is usually made of organic materials, such as photoresist, acrylic polymers, silicon polymers, etc.

[0119] Accordingly, the method for preparing the display substrate also includes the steps of forming the planarization layer 3 and the connecting vias connecting the first electrode 402 of the light-emitting device 42 and the pixel driving circuit.

[0120] Reference Figure 8 and Figure 14In the display substrate provided in this disclosure, the first electrode 402 includes a first main body portion 4021a and a second connection portion 4022 connected to the first main body portion 4021a. Each second connection portion 4022 is electrically connected to a pixel driving circuit. Specifically, each second connection portion 4022 is electrically connected to the drain 203 of the thin-film transistor in the pixel driving circuit through a metal via on the planarization layer 3. In the display substrate provided in this disclosure, the orthographic projections of the partition structure 6 and the second connection portion 4022 on the substrate 1 do not overlap; or, the notch 63 of the partition structure 6 and the orthographic projection of the second connection portion 4022 on the substrate 1 overlap.

[0121] When the position of partition structure 6 is set as follows Figure 8 and Figure 9 As shown, the orthographic projections of the notch 63 of the partition structure 6 and the second connection portion 4022 on the substrate 1 overlap. That is, by placing the second connection portion 4022 at the position of the notch 63, the signal transmission between the pixel driving circuit and the second connection portion 4022 can be avoided by the partition structure 6 made of conductive material, thereby avoiding the transmission of the anode signal.

[0122] When the position of isolation structure 6 is set as follows Figure 14 and Figure 15 As shown, the orthographic projections of the notch 63 of the partition structure 6 and the second connecting portion 4022 on the substrate 1 overlap. That is, by placing the second connecting portion 4022 at the position of the notch 63, it is possible to avoid multiple etching of the second connecting portion 4022 during the process of forming the partition structure 6 using etching solution. This can prevent the second connecting portion 4022 from being corroded and broken during the process of forming the partition structure 6, thus avoiding the problem of affecting the transmission of the anode signal.

[0123] The cross-sectional shape of partition structure 6 will be described next.

[0124] Figure 17 This is a schematic diagram of the longitudinal section of the partition structure 6 in the display substrate provided in this disclosure. It should be noted that the longitudinal section of the partition structure 6 in this document refers to the shape of the partition structure 6 projected onto a plane perpendicular to the display substrate; for example, it refers to the shape of the partition structure 6 as projected onto a plane perpendicular to the display substrate. Figure 8 The vertical plane where line AB is shown, or Figure 14 The shape of the projection onto the vertical plane containing the CD line. (Example) Figure 17As shown, for the partition structure 6 and the corresponding pixel opening 401, the longitudinal section of the partition structure 6 has a first side S1 and a second side S2 arranged opposite to each other along the thickness direction of the substrate 1, and a third side S3 and a fourth side S4 connecting the first side S1 and the second side S2, wherein the third side S3 is closer to the first center line L4 than the fourth side S4. At least some points on the third side S3 are at unequal distances from the first center line L4, and the closer the point is to the substrate 1, the longer the distance to the first center line L4; wherein, the first center line L4 is a straight line that passes through the center of the orthographic projection of the pixel opening 401 on the substrate 1 and extends along the thickness direction of the substrate 1. For example Figure 13 As shown, the distances between the two points on the third side S3 and the first center line L4 are d1 and d2, respectively. The distance d2 between the point closer to the substrate 1 and the first center line L4 is greater than the distance d1 between the point farther from the substrate 1 and the first center line L4.

[0125] In other words, the partition structure 6 provided in this disclosure has a recess on the side wall closer to the first center line L4, or a protrusion 64 extending towards the first center line L4 on the side wall closer to the first center line L4, which is suspended. Generally speaking, Figure 17 The cross-sectional shape shown is also known as the Under Cut morphology. The partition structure 6 with such a morphology can better ensure that the sub-functional layers in the light-emitting functional layer 421 are disconnected at the protrusion 64, thereby improving the partition effect of the partition structure 6 and thus improving the anti-crosstalk effect of the display substrate.

[0126] In some examples, the display substrate provided in this disclosure further includes an encapsulation layer 8 formed on the side of the second electrode layer 4041 facing away from the substrate 1. This encapsulation layer 8 can be as follows: Figure 3 As shown, it includes a first inorganic encapsulation layer 108, an organic encapsulation layer 109, and a second inorganic encapsulation layer 110. For example, the first inorganic encapsulation layer 108 and the second inorganic encapsulation layer 110 can be made of inorganic materials such as silicon nitride and silicon oxide; the organic encapsulation layer 109 is used to achieve planarization to facilitate the fabrication of the second inorganic encapsulation layer 110, and this organic encapsulation film layer 118b can be made of materials such as acrylic polymers and silicon polymers.

[0127] Accordingly, the method for preparing the display substrate also includes the step of forming the encapsulation layer 8 described above. For example, a first inorganic encapsulation layer 108 is formed using a chemical vapor deposition (CVD) process or a physical vapor deposition (PVD) process; an organic encapsulation layer 109 is formed using an inkjet printing process or a spraying process; and a second inorganic encapsulation layer 110 is formed using a CVD process or a PVD process.

[0128] Thirdly, this disclosure also provides a display device comprising the display substrate provided in any of the above examples.

[0129] In summary, the display substrate provided by this disclosure, by setting the partition structure 6, ensures that at least some sub-functional layers in the light-emitting functional layer 421 are disconnected at the position corresponding to the edge of the pixel opening 401, thereby reducing crosstalk between two adjacent sub-pixels 41 and improving the imaging effect of the display substrate. Furthermore, the partition structure 6 provided by this disclosure includes a first sub-structure 601 and a second sub-structure 602 surrounding the outside of the first sub-structure 601. The double-layer partition structure design increases the height of the partition structure 6, thereby ensuring the partitioning effect of the partition structure 6, that is, ensuring that the sub-functional layers in the light-emitting functional layer 421 are disconnected at the position of the partition structure 6. In addition, the partition structure 6 provided in this disclosure does not require a separate fabrication process step to form the second substructure 602 that is attached to the outside of the first substructure 601. As described in the above fabrication method, the second substructure 602 is formed simultaneously during the process of etching the first electrode layer 4021 with the first solution to form the first electrode 402 of each light-emitting device 42. Therefore, the display substrate provided in this disclosure has a simple and efficient fabrication process and is also cheaper.

[0130] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A display substrate, comprising: Substrate; A first electrode layer is disposed on the substrate, and the first electrode layer includes the first electrode of each light-emitting device; A pixel defining layer is disposed on the side of the first electrode layer opposite to the substrate, and the pixel defining layer has a plurality of pixel openings extending through it along its thickness direction; A light-emitting functional layer is disposed on the side of the pixel defining layer opposite to the substrate, and the light-emitting functional layer includes the light-emitting functional part of each of the light-emitting devices; One of the pixel openings at least partially overlaps with the orthographic projections of both the first electrode and the light-emitting functional part of the light-emitting device onto the substrate. Multiple partition structures are disposed on the side of the first electrode layer facing away from the substrate, and the partition structures are configured such that at least a portion of the sub-functional layers in the light-emitting functional layer are disconnected at positions corresponding to the edge of the pixel opening; wherein, The partition structure includes a first substructure and a second substructure that encloses the first substructure; the materials of the first substructure and the second substructure are a first conductive material and a second conductive material, respectively; the second conductive material includes a material obtained by a displacement reaction between the first conductive material and a first solution, and the solute in the first solution includes a compound containing ions of the second conductive material.

2. The display substrate according to claim 1, wherein, The first conductive material includes aluminum, the second conductive material includes silver, and the solute in the first solution includes silver nitrate.

3. The display substrate according to claim 1, wherein, It also includes a second electrode layer disposed on the side of the light-emitting functional layer opposite to the substrate; The second electrode layer includes a second electrode for each of the light-emitting devices, and a first connection portion connecting adjacent second electrodes; The partition structure includes a notch, and the orthographic projections of the notch and the first connection portion on the substrate at least partially overlap.

4. The display substrate according to claim 1, wherein, It also includes a driving circuit layer disposed on the side of the first electrode layer near the substrate, the driving circuit layer including a plurality of pixel driving circuits; The first electrode includes a first main body portion and a second connecting portion connected to the first main body portion, wherein one second connecting portion is electrically connected to one pixel driving circuit; The partition structure does not overlap with the orthographic projection of the second connecting portion on the substrate.

5. The display substrate according to claim 1, wherein, The partition structure and the corresponding pixel opening have overlapping projections on the substrate.

6. The display substrate according to claim 1, wherein, The pixel defining layer also has a plurality of auxiliary openings extending through its thickness direction, with one of the auxiliary openings surrounding one of the pixel openings; The partition structure corresponding to the pixel opening overlaps with the orthographic projection of the auxiliary opening surrounding the pixel opening onto the substrate.

7. The display substrate according to claim 5 or 6, wherein, For the partition structure and the corresponding pixel opening, the longitudinal section of the partition structure has a first side and a second side disposed opposite to each other along the thickness direction of the substrate, and a third side and a fourth side connecting the first side and the second side, wherein the third side is closer to the first center line than the fourth side; At least some points on the third side are at unequal distances from the first midline, and the points closer to the substrate are at longer distances from the first midline. The first center line is a straight line that passes through the center of the orthographic projection of the pixel opening onto the substrate and extends along the thickness direction of the substrate.

8. The display substrate according to claim 1, wherein, The light-emitting functional layer includes a hole injection layer; The partition structure is disposed on the side of the hole injection layer near the substrate, and the partition structure is configured such that the hole injection layer is disconnected at the position corresponding to the edge of the pixel opening.

9. The display substrate according to claim 1, wherein, The light-emitting functional layer includes a first light-emitting material layer, a second light-emitting material layer, and a charge-generating layer located between the first light-emitting material layer and the second light-emitting material layer; The isolation structure is disposed on the side of the charge generation layer near the substrate, and the isolation structure is configured such that the charge generation layer is disconnected at the position corresponding to the edge of the pixel opening.

10. A method for preparing a display substrate, wherein the display substrate is as described in any one of claims 1-9, wherein, The preparation method includes: Provide substrates; A first electrode layer is formed on the substrate. An initial first substructure is formed on the side of the first electrode layer opposite to the substrate; the material of the initial first substructure is a first conductive material. The first electrode layer is patterned using a first solution to form the first electrode of each light-emitting device; simultaneously, the first solution undergoes a displacement reaction with the initial first substructure to form a partition structure. The partition structure includes a first substructure and a second substructure that encloses the first substructure. The materials of the first substructure and the second substructure are a first conductive material and a second conductive material, respectively. The second conductive material includes a material obtained by a displacement reaction between the first conductive material and the first solution, and the solute in the first solution includes a compound containing ions of the second conductive material. A pixel defining layer is formed on the side of the first electrode layer opposite to the substrate, and a plurality of pixel openings are formed that penetrate along the thickness direction of the pixel defining layer. A light-emitting functional layer is formed on the side of the pixel defining layer facing away from the substrate; the light-emitting functional layer includes the light-emitting functional part of each of the light-emitting devices, and the orthographic projection of a pixel opening and the first electrode and the light-emitting functional part of a light-emitting device on the substrate at least partially overlaps; and at least a portion of the sub-functional layers in the light-emitting functional layer are disconnected at the position corresponding to the edge of the pixel opening.

11. The preparation method according to claim 10, wherein, On the side of the first electrode layer opposite to the substrate, an initial first substructure is formed, comprising: A first conductive material layer is formed on the side of the first electrode layer that is away from the substrate. The first conductive material layer is patterned to form the initial first substructure; For the initial first substructure and the corresponding pixel opening, the longitudinal section of the initial first substructure has a first bottom edge and a second bottom edge disposed opposite to each other along the thickness of the substrate, and a third side edge and a fourth side edge connecting the first bottom edge and the second bottom edge; the third side edge is closer to the first center line than the fourth side edge; at least some points on the third side edge are at unequal distances from the first center line, and the closer the point is to the substrate, the shorter the distance to the first center line; the first center line is a straight line that passes through the center of the orthographic projection of the pixel opening on the substrate and extends along the thickness direction of the substrate.

12. The preparation method according to claim 10, wherein, In addition to forming a plurality of pixel openings that penetrate along the thickness direction of the pixel defining layer, the method further includes: Multiple auxiliary openings are formed that extend through the thickness direction of the pixel defining layer; one of the auxiliary openings is arranged around one of the pixel openings; the partition structure arranged corresponding to the pixel opening overlaps with the orthographic projection of the auxiliary opening arranged around the pixel opening on the substrate.

13. The preparation method according to claim 10, wherein, The step of forming a light-emitting functional layer on the side of the pixel defining layer opposite to the substrate includes: On the side of the pixel defining layer opposite to the substrate, a first light-emitting material layer, a charge-generating layer, and a second light-emitting material layer are formed sequentially. The partition structure is formed on the side of the charge generation layer near the substrate and is configured such that the charge generation layer is disconnected at the position corresponding to the edge of the pixel opening.

14. The preparation method according to claim 10, wherein, Also includes: A second electrode layer is formed on the side of the light-emitting functional layer that is opposite to the substrate. The second electrode layer includes a second electrode for each of the light-emitting devices, and a first connection portion connecting adjacent second electrodes; The partition structure includes a notch, one of which at least partially overlaps with the orthographic projection of one of the first connecting portions on the substrate.

15. A display device comprising the display substrate according to any one of claims 1-9.

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