Test equipment and test system comprising same

Abstract

A test device according to an embodiment includes: a first substrate in which a data conversion module is arranged, the data conversion module including a first connector for receiving data acquired from an external device, a field programmable gate array (FPGA) for converting the received data, and a second connector for outputting the converted data; a second substrate in which a test module is arranged, the test module including a third connector connected to the second connector of the first substrate and receiving the converted data, a test unit for performing a test operation using the data received through the third connector, a communication unit for transmitting test result information according to a test operation result of the test unit to the outside, and a control unit for controlling the test unit and the communication unit; and a housing for accommodating the first substrate and the second substrate.

Description

Technical Field

[0001] The embodiments relate to a test device, and more particularly to a test device including a frame grabber and a test device as a single module, a test system including the test device, and a test method thereof. Background Art

[0002] In recent years, testing systems for testing the quality of manufactured products have been provided.

[0003] The test system is equipped with a frame grabber, which is also called an image acquisition board or image acquisition board.

[0004] A frame grabber is a device that converts images from image media such as televisions, videos, and cameras into data that can be processed by a computer.

[0005] Depending on the computer environment, the frame grabber is provided in various forms of boards. For example, the frame grabber can be provided in the form of ISA (Industry Standard Architecture), PCI (Peripheral Component Interconnect), PCIe (PCI Express), CPCI (Compact PCI) for industrial use, VME (Versa Module Europa), etc.

[0006] The frame grabber receives the test image acquired by the camera and converts the image into data in a format that can be processed by a computer.

[0007] At the same time, the computer is usually connected to the plurality of frame grabbers. Then, the computer receives the data converted from each of the plurality of frame grabbers. In addition, the computer performs a quality test on the test image obtained by each camera using the received data.

[0008] Nowadays, the camera technology has been developing recently, so the pixels of the image sensor mounted on the camera have been increasing. Therefore, the performance of the CPU and GPU mounted on the frame grabber has become more and more advanced.

[0009] Therefore, the amount of data acquired from each frame grabber is increasing, and accordingly, the amount of data that the computer must process is also increasing.

[0010] Therefore, the performance of the CPU mounted on the computer must be further improved, or the number of CPU cores must be increased, which leads to a problem of increasing the cost required to configure the computer.

[0011] In addition, as the number of semiconductor chips mounted on a computer increases, or as the data capacity processed by the semiconductor chips increases, the heat generated by the semiconductor chips also increases. In addition, depending on the amount of heat generated, there is a problem that the heat dissipation structure mounted on the computer becomes complicated and the volume of the heat dissipation structure increases. In addition, even if a heat dissipation structure is mounted, it may not be possible to dissipate all the heat generated by the computer, thereby causing a problem of reduced performance of the computer. Therefore, in order to solve the problem of heat generation, the computer is spacing a plurality of semiconductor chips as far as possible, and therefore, there is a problem of further increasing the volume of the computer.

[0012] Additionally, the computer must process all the data provided by multiple frame grabbers, which can increase the amount of data that needs to be processed at a given point in time, creating a bottleneck. Additionally, this bottleneck can cause the overall performance of the computer to degrade.

[0013] Therefore, there is a need for a testing device that can more efficiently process a test image acquired by a camera and improve the accuracy of a test result based on the processed data. Summary of the invention

[0014] Technical issues

[0015] The embodiment provides a test device, a test system, and a test method capable of distributing processing data to a plurality of test devices.

[0016] In addition, the present embodiment also provides a testing device, a testing system and a testing method thereof that can minimize heat generation.

[0017] In addition, the present embodiment provides a test device, a test system, and a test method thereof that can minimize data loss of a test image.

[0018] In addition, the present embodiment provides a testing device, a testing system and a testing method thereof that can improve testing accuracy.

[0019] Furthermore, the present embodiment provides a compact test device with improved circuit integration and a test system including the test device.

[0020] The technical problems solved by the proposed embodiments are not limited to the above-mentioned technical problems, and other unmentioned technical problems may be clearly understood by technicians in the field to which the proposed embodiments are described below.

[0021] Technical Solution

[0022] According to one embodiment, a testing device includes: a first substrate, which includes a data conversion module, which has a first connector for receiving data acquired from an external device, an FPGA (Field Programmable Gate Array) for converting the received data, and a second connector for outputting the converted data; a second substrate, which has a testing module, which includes a third connector connected to the second connector of the first substrate and receiving the converted data, a testing unit for performing a testing operation using the data received through the third connector, a communication unit for transmitting test result information according to the test operation result of the testing unit to the outside, and a control unit for controlling the testing unit and the communication unit; and a housing for accommodating the first substrate and the second substrate.

[0023] In addition, the first connector includes MIPI (Mobile Industry Processor Interface), and the second connector and the third connector include PCIe (Peripheral Component Interconnect Express).

[0024] Furthermore, the second substrate is disposed on the first substrate, the second substrate includes a port of the third connector, the port is disposed in an open area corresponding to the second connector, and the port is connected to the second connector.

[0025] Furthermore, the communication unit of the second substrate transmits the test result information to the test device set as a master.

[0026] Furthermore, the communication unit of the second substrate receives test result information from the test device set as a slave, and transmits the test result information obtained from the test unit and the test result information received from the test device set as a slave to the server.

[0027] Furthermore, the transmitted test result information includes identification information assigned to each test device and test judgment information according to the test result performed on each test device.

[0028] Meanwhile, a test system according to one embodiment includes: a data acquisition device including a plurality of image sensors; and a first test device and a second test device respectively connected to the plurality of image sensors of the data acquisition device; wherein the first test device includes: a first data conversion unit adapted to convert data received from one of the plurality of image sensors; a first test unit adapted to perform a test operation using the data converted by the first data conversion unit; a first communication unit adapted to transmit first test result information according to a test operation result of the first test unit to the second test device; and a first control unit adapted to control the first data conversion unit, the first test unit and the first communication unit; wherein the second test device includes: a second data conversion unit adapted to convert data received from another one of the plurality of image sensors; a second test unit adapted to perform a test operation using the data converted by the second data conversion unit; a second communication unit adapted to receive the first test result information from the first communication unit and transmit the first test result information and the second test result information according to the test operation result of the second test unit to a server; and a second control unit adapted to control the second data conversion unit, the second test unit and the second communication unit.

[0029] Furthermore, the first data conversion unit and the second data conversion unit are frame grabbers including a field programmable gate array (FPGA).

[0030] Furthermore, the calculation performance of the second control unit is higher than the calculation performance of the first control unit.

[0031] Furthermore, the first test result information and the second test result information transmitted to the server include identification information of each of the first test device and the second test device and test judgment information obtained from each of the first test device and the second test device.

[0032] Beneficial Effects

[0033] The test system of the embodiment includes a plurality of image sensors and a plurality of test devices respectively connected to the image sensors. Each of the plurality of test devices includes a data conversion module and a test module, wherein the data conversion module is adapted to convert data transmitted from the image sensor, and the test module is adapted to analyze the data converted by the data conversion module and perform quality testing.

[0034] That is, the test system of the embodiment integrates the FPGA board that performs the data conversion operation and the test board that performs the test into one module. Therefore, the embodiment can perform a separate test operation on the data acquired from a specific image sensor in each test device. In this way, it is possible to solve the reliability problem that occurs when the host computer of the comparative example performs a test on the data acquired from all image sensors.

[0035] In addition, in the case where the data conversion module and the test module are respectively arranged on independent substrates, the present embodiment uses a connector to connect the data conversion module and the test module. In this way, the embodiment can perform a test on the data obtained from each frame grabber while using the traditional frame grabber as it is. In addition, the embodiment can be used by connecting the test module of the present invention to the data conversion module corresponding to the FPGA (designed to correspond to each industrial group). In this way, a test device that can be used in all groups regardless of the industrial group can be provided.

[0036] At the same time, the embodiment can distribute the components concentrated in the traditional main computer to each test device. In this way, the embodiment can solve the problem that all the components in the comparative example are concentrated in the main computer. For example, the embodiment can distribute the components concentrated in the main computer to the test modules of each test device. Therefore, the embodiment can simplify the heat dissipation structure of each test device. In addition, the embodiment can improve the heat dissipation characteristics of the test device, thereby improving the performance of the test device. In addition, the embodiment can be designed to only consider the minimum separation distance that will not cause performance problems due to the heat generation of each component assembled in the test device. Therefore, the embodiment can improve the circuit integration or component density of the test device, and even design a test device of compact size. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 is a block diagram showing a schematic configuration of a test system according to a comparative example.

[0038] Figure 2 It is a top perspective view of a testing device according to an embodiment.

[0039] Figure 3 It is a bottom perspective view of a testing device according to an embodiment.

[0040] Figure 4 yes Figure 2 and Figure 3 Exploded perspective view of the test equipment shown.

[0041] Figure 5 yes Figure 4 A view of a modified example of the cover and heat dissipation unit shown in FIG.

[0042] Figure 6 is an exploded perspective view showing a testing device according to another embodiment.

[0043] Figure 7 is a diagram showing a schematic configuration of a test system according to an embodiment.

[0044] Figure 8 It is shown Figure 7Schematic diagram of the detailed configuration of each test device.

[0045] Fig. 9 It is shown Figure 8 Schematic diagram of the detailed configuration of the data conversion module.

[0046] Fig.10 It is shown Figure 8 Schematic diagram of the detailed configuration of the test module in .

[0047] Fig.11 is a flowchart for describing step by step an operation method of a test device set as a slave device.

[0048] Fig.12 is a flowchart for describing step by step an operation method of a test device set as a master device. DETAILED DESCRIPTION

[0049] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0050] However, the spirit and scope of the present disclosure are not limited to some of the described embodiments, but may be implemented in various other forms, and one or more elements of the embodiments may be selectively combined and rearranged within the spirit and scope of the present disclosure.

[0051] In addition, unless otherwise clearly defined and described, the terms (including technical and scientific terms) used in the embodiments of the present disclosure should be interpreted as having the same meaning as those commonly understood by ordinary technicians in the field to which the present disclosure belongs. In addition, the terms defined in common dictionaries should be interpreted as having the same meaning as their meanings in the context of the relevant technology. The terms used in the embodiments of the present disclosure are only used to describe the embodiments and are not intended to limit the present disclosure.

[0052] In the present specification, unless specifically stated in a phrase, a singular form may also include a plural form, and a description of "at least one (or more) of A (and), B, and C" may include at least one of all combinations that can be combined with A, B, and C. In addition, when describing elements of the embodiments of the present disclosure, terms such as first, second, A, B, (a), and (b) may be used.

[0053] These terms are only used to distinguish elements from each other, and these terms are not limited to the nature, order or sequence of the elements. In addition, when an element is described as being "connected", "coupled" or "contacted" to another element, it includes not only the case where an element is directly connected, coupled or contacted to other elements, but also the case where an element is connected, coupled or contacted to other elements through another element between the element and the other elements.

[0054] Furthermore, when described as being formed or disposed “on (above)” or “under (below)” each element, “on (above)” or “under (below)” may include not only a case where two elements are directly connected to each other, but also a case where one or more other elements are formed or disposed between the two elements. Furthermore, when expressed as “on (above)” or “under (below)”, it includes not only an upward direction based on one element, but also a downward direction based on one element.

[0055] Comparative Example

[0056] Figure 1 is a block diagram showing a schematic configuration of a test system according to a comparative example.

[0057] refer to Figure 1 The test system of the comparative example includes a sensor unit (10), a frame grabber unit (20), a host computer (30) and a server (40).

[0058] The sensor unit (10) includes a plurality of image sensors. Specifically, the sensor unit (10) includes first to N-th image sensors (11, 12, 13). The sensor unit (10) refers to an image acquisition unit, which acquires a test image for testing a manufactured product. At this time, the test system performs tests on a plurality of test items at the same time. At this time, each of the first to N-th image sensors (11, 12, 13) of the sensor unit (10) acquires a test image, which captures a product corresponding to a corresponding test item.

[0059] The frame grabber unit (20) includes a frame grabber connected to the sensor unit (10). Specifically, the frame grabber unit (20) includes first to N-th frame grabbers (21, 22, 23). Each of the first to N-th frame grabbers (21, 22, 23) of the frame grabber unit (20) is connected one-to-one to each of the first to N-th image sensors (11, 12, 13) of the sensor unit (10).

[0060] Furthermore, the first to N-th frame grabbers (21, 22, 23) of the frame grabber unit (20) receive the test images obtained by the first to N-th image sensors (11, 12, 13) and convert the received test images. Specifically, the first to N-th frame grabbers (21, 22, 23) convert the test images obtained by the first to N-th image sensors (11, 12, 13) into data that can be processed by the host computer (30).

[0061] Furthermore, the first to Nth frame grabbers (21, 22, 23) of the frame grabber unit (20) transmit the converted data to the host computer (30). For example, the frame grabber unit (20) transmits the converted data to the host computer (30) using a signal transmission line such as an optical cable.

[0062] At this time, the frame grabber unit (20) must transfer all converted data from each frame grabber to the host computer (30), so there is a problem that the data transmission method between the frame grabber unit (20) and the host computer (30) is limited.

[0063] In addition, as the resolution of the first to N-th image sensors (11, 12, 13) included in the sensor unit (10) increases, the amount of data transmitted becomes larger accordingly. Therefore, the comparative example has a limitation in transmitting the converted data from the frame grabber unit (20) to the host computer (30) in real time. In addition, in the comparative example, there are problems that the time required to transmit the data increases and the host computer (30) cannot process the converted data in real time.

[0064] Furthermore, in the comparative example, the frame grabber unit (20) modulates the converted data before transmitting it to the host computer (30). Furthermore, the host computer (30) further includes a demodulation unit (not shown) for demodulating the modulated data. Therefore, the host computer (30) receives the modulated data and demodulates the received modulated data.

[0065] In the comparative example, a separate modulation process and a separate demodulation process are required to transmit data. Therefore, in the comparative example, since the modulation and demodulation processes of data are required, there is a problem that the hardware circuit configuration of the test system becomes complicated.

[0066] Furthermore, in the comparative example, there is a problem that a data conversion error may occur during the modulation and demodulation process of data, resulting in data loss.

[0067] Meanwhile, the host computer (30) processes data transmitted from each of the first to N-th frame grabbers (21, 22, 23) of the frame grabber unit (20). For example, the host computer (30) analyzes the data transmitted from each frame grabber and performs a test on the analyzed data. Then, the host computer (30) transmits judgment result information according to the test result to the server (40).

[0068] At this time, the host computer (30) must process all the data transmitted from the first to N-th frame grabbers (21, 22, 23). Therefore, the host computer (30) needs high performance to process all the data. That is, in the comparative example, the performance of the CPU installed in the host computer (30) must be enhanced or the number of CPU cores must be increased, so there is a problem of increasing the cost required to configure the computer.

[0069] In addition, the test system of the comparative example may experience a bottleneck phenomenon, in which data is concentratedly transmitted to the host computer (30) at a specific time point. In addition, when the bottleneck phenomenon occurs, the performance of the host computer (30) may decrease, thereby causing a problem of decreased accuracy of the test judgment result. In addition, since a large amount of data needs to be processed, the test system of the comparative example may be overloaded, which may cause reliability problems such as heating.

[0070] Therefore, in order to solve problems such as heating, the host computer (30) of the comparative example has a problem of a complex heat dissipation structure. In addition, even if the host computer (30) of the comparative example applies a heat dissipation structure, it may be difficult to solve the heating problem, so the comparative example arranges the heating components in the substrate as dispersedly as possible. Therefore, the comparative example has a problem of further increasing the volume of the host computer.

[0071] This embodiment can solve the problem of the test system of the comparative example. Specifically, this embodiment provides a test system that can distribute the load of the host computer to multiple frame grabbers. In this way, this embodiment can improve the test accuracy while achieving fast testing.

[0072] The structure of each test device constituting the test system of this embodiment will be described below.

[0073] The test device described below may correspond to any one of the first to Nth frame grabbers.

[0074] Figure 2 is a top perspective view of a testing device according to an embodiment, Figure 3 is a bottom perspective view of a testing device according to an embodiment, Figure 4 yes Figure 2 and Figure 3 An exploded perspective view of the test equipment shown, Figure 5 yes Figure 4 A view of a modified example of the cover and heat dissipation unit shown in, Figure 6 is an exploded perspective view showing a testing device according to another embodiment.

[0075] Next, refer to Figures 2 to 6 The structure of the test device according to the present embodiment is described.

[0076] A testing device (100) according to one embodiment includes a housing (110), a cover (120), a first substrate (130), a second substrate (140), and a heat dissipation unit (150).

[0077] The housing (110) may include a receiving space. Preferably, the housing (110) may include a receiving space for receiving various components constituting the testing device (100).

[0078] The housing (110) can protect the components contained in the containing space. For example, the housing (110) can protect the components constituting the test device (100) from various environmental factors (such as moisture, wind, temperature, etc.) occurring in the use environment of the test device (100).

[0079] The housing (110) includes at least one through hole (111). For example, the housing (110) includes a through hole (111) formed on a lower surface of the housing (110), and the through hole exposes at least a portion of the components accommodated in the accommodation space.

[0080] The through hole (111) of the housing (110) can expose a portion of the first substrate (130) accommodated in the accommodation space. Preferably, the first substrate (130) includes a plurality of connectors. For example, the first substrate (130) includes a first connector (131).

[0081] In addition, the through hole (111) of the housing (110) may correspond to the first connector (131) of the first substrate (130). Preferably, the through hole (111) of the housing (110) may be formed to connect an external device to the first connector (131) of the first substrate (130). The external device may be a photographing device for acquiring a test image. For example, the external device may be a camera including an image sensor. In addition, in a case where the first substrate (130) is exposed through the through hole (111), the test device (100) may be connected to the external device through the first connector (131). In this way, the present embodiment may receive a test image acquired from an external device.

[0082] Meanwhile, the housing (110) may further include at least one heat dissipation hole (not shown). The heat dissipation hole may extend from the lower surface of the housing (110) along the minor axis direction. In addition, a plurality of heat dissipation holes may be formed on the lower surface of the housing (110), and the plurality of heat dissipation holes may be arranged spaced apart from each other in the longitudinal direction. The heat dissipation holes of the housing (110) may discharge heat generated by the components accommodated in the accommodation space to the outside.

[0083] A single module may be disposed in the accommodation space of the housing (110). For example, a plurality of substrates of a single module may be disposed in the accommodation space of the housing (110). A single module may include a data conversion module of a frame grabber corresponding to the FPGA and a test module for performing a test.

[0084] Furthermore, a single module includes a plurality of substrates.

[0085] One of the plurality of substrates may be a data conversion module corresponding to the frame grabber that performs data conversion, and another one of the plurality of substrates may be a test module that performs a test using data converted by the data conversion module.

[0086] For example, the first substrate (130) and the second substrate (140) are disposed in the accommodation space of the housing (110).

[0087] The first substrate (130) may be a data conversion module. The first substrate (130) may be a frame grabber. The first substrate (130) may be an FPGA (Field Programmable Gate Array) board. The first substrate (130) may be a power supply module for providing driving power to various components constituting the test device (100).

[0088] Specifically, the first substrate (130) of the first embodiment may refer to a module in which the FPGA module and the power module of the frame grabber are integrated.

[0089] The first substrate (130) may include a first connector (131). The first connector (131) of the first substrate (130) may be exposed to the outside of the housing (110) through a through hole (111) of the housing (110). In addition, the first substrate (130) may be connected to an external device through the first connector (131), and the first connector is exposed through the through hole (111) of the housing (110). In this way, the first substrate (130) may receive data obtained from the external device connected to the first connector (131). The received data may be a captured image of the product to be tested, but is not limited thereto.

[0090] The first substrate (130) is connected to an external device via a first connector (131). In addition, the first substrate (130) can be connected to a second substrate (140) via a second connector (132).

[0091] The second connector (132) may be an interface for connecting between the first substrate (130) and the second substrate (140). For example, the second connector (132) may be a PCI (Peripheral Controller Interface) port. Preferably, the second connector (132) may be a PCIe (PCI Express) port, but is not limited thereto. For example, the second connector (132) may be any one of a USB (Universal Serial Bus) port, an Ethernet port, a PC (Peripheral Controller Interface) port, a PCI Express port, a CPCI (Compact PCI) port, an RJ-45 port, and an RS-232 port.

[0092] However, in order to improve the signal transmission characteristics between the first substrate (130) and the second substrate (140), the present embodiment uses a PCIe (PCI Express) interface to connect the first substrate (130) and the second substrate (140).

[0093] The first substrate (130) includes a plurality of units mounted on the substrate, and the plurality of units include a first connector (131) and a second connector (132) corresponding to an interface.

[0094] In addition, the first substrate (130) may include: a power supply unit for receiving power and providing driving power to various components; a data conversion unit (e.g., FPGA) for converting data received through the first connector (131); and a storage unit for storing data required for the data conversion operation. Preferably, the first substrate (130) may correspond to the frame grabber in the comparative example. However, the first substrate (130) in this embodiment includes a second connector (132) that is connected to the second substrate (140) and transmits the converted data to the second substrate (140) through the second connector (132).

[0095] At the same time, the first substrate (130) may further include a connector for transmitting the converted data from the frame grabber of the FPGA constituting the first substrate (130) to a test device configured as an independent module (such as a host computer in the comparative example). For example, the first substrate (130) may further include an SFP port.

[0096] Therefore, when the test equipment is connected to the SFP port, the first substrate (130) can transmit the converted data to the SFP port.

[0097] Furthermore, when the second substrate (140) is connected to the second connector (132), the first substrate (130) may transmit the converted data to the second substrate (140).

[0098] The testing device (100) includes a second substrate (140) coupled to the first substrate (130). The second substrate (140) may include a third connector (not shown) coupled to the second connector (132) of the first substrate (130).

[0099] At this time, the second substrate (140) may include an open area (141) corresponding to the second connector (132) of the first substrate (130). In addition, the second substrate (140) may be provided with a port corresponding to the open area (141). In addition, the second substrate (140) may be connected to the second connector (132) of the first substrate (130) at the open area (141).

[0100] The second substrate (140) may be connected to the first substrate (130) so as to receive data transmitted from the first substrate (130). For example, the second substrate (140) may receive data converted by a data conversion unit of the first substrate (130).

[0101] The second substrate (140) can analyze the data acquired from the external device using the received data. For example, the second substrate (140) can use the image acquired by the external device (such as a camera) to determine whether the product used for the test object has defects.

[0102] To this end, the second substrate (140) may include a plurality of units. For example, the second substrate (140) may include: a test unit that performs a test operation using data; a storage unit that stores data required to perform the test operation; a communication unit that transmits result information corresponding to the test operation to the outside; and a control unit that controls the operations of the test unit and the communication unit.

[0103] The heat dissipation unit (150) is disposed on the second substrate (140). The heat dissipation unit (150) may be a heat sink. The heat dissipation unit (150) may be in contact with at least one of the first substrate (130) and the second substrate (140). The heat dissipation unit (150) may radiate heat generated by the unit disposed on the first substrate (130) and the unit disposed on the second substrate (140) to the outside. To this end, the heat dissipation unit (150) may include a material having high thermal conductivity.

[0104] The heat dissipation unit (150) may include heat dissipation pins (151). The heat dissipation pins (151) of the heat dissipation unit (150) may absorb heat generated by the first substrate (130) and the second substrate (140), and conduct the absorbed heat to the direction in which the cover (120) is arranged.

[0105] That is, the heat dissipation unit (150) can disperse the heat concentrated on the first substrate (130) and the second substrate (140) by using the heat dissipation pins (151). At the same time, the present embodiment can improve the heat dissipation characteristics by arranging a heat dissipation pad or a heat dissipation agent between the heat dissipation unit (150) and the first substrate (130) and / or the second substrate (140).

[0106] The cover (120) may be disposed on the heat dissipation unit (150). The cover (120) may protect various components of the test device (100) together with the housing (110).

[0107] For example, the housing (110) may be referred to as a first cover that covers the sides and bottom of the test device (100), and the cover (120) may be referred to as a second cover that covers the top of the test device (100).

[0108] The cover (120) has a plurality of heat dissipation holes. For example, the heat dissipation holes (121) may be formed to correspond to the heat dissipation pins (151) of the heat dissipation unit (150). The heat dissipation holes (121) of the cover (120) may radiate heat transmitted through the heat dissipation pins (151) to the outside.

[0109] At the same time, Figures 2 to 4 In the embodiment, the cover (120) and the heat dissipation unit (150) of the test device (100) are configured as independent components, but this is not limited thereto. Figure 5 As shown, the connector (131) and the heat dissipation unit (150) may be provided as a single heat dissipation cover (160) formed integrally with each other.

[0110] Specifically, the heat dissipation cover (160) includes a side plate (161). The side plate (161) of the heat dissipation cover (160) can be arranged to surround the upper edge area of ​​the second substrate (140). For example, the side plate (161) of the heat dissipation cover (160) can cover the upper edge area of ​​the second substrate (140).

[0111] The side plate (161) may include at least one open area (161a). For example, the side plate (161) may include an open area (161a) that opens at least a portion of the upper edge area of ​​the second substrate (140). Preferably, the side plate (161) may be formed to correspond to a unit that needs to be exposed to the outside among the units provided on the second substrate (140). For example, the unit that needs to be exposed to the outside may be provided in an edge area of ​​the upper surface of the second substrate (140). In addition, the open area (161a) may be formed to correspond to an edge area of ​​the side plate (161) where the unit is provided.

[0112] The heat dissipation cover (160) may include an upper plate (162). The upper plate (162) may extend from the side plate (161). The upper plate (162) of the heat dissipation cover (160) may cover an upper region of the second substrate (140).

[0113] The heat dissipation cover (160) may include heat dissipation pins (163) protruding upward from the upper plate (162).

[0114] For example, the heat dissipation cover (160) may include a plurality of heat dissipation pins (163) extending on the upper plate (162) in a first horizontal direction and spaced apart in a second horizontal direction perpendicular to the first horizontal direction. The plurality of heat dissipation pins (163) may radiate heat generated by the first substrate (130) and the second substrate (140) in an upward direction (e.g., in a direction away from the first substrate and the second substrate).

[0115] In addition, the heat dissipation cover (160) may include a protrusion (164) provided in an area vertically overlapping with the unit provided on the second substrate (140) in the entire area of ​​the upper plate (162). The protrusion (164) may serve as a receiving space for receiving the unit arranged on the second substrate (140). To this end, the upper plate (162) may have an open structure in the area vertically overlapping with the protrusion (164), but is not limited thereto.

[0116] As described above, the test device (100) of the present embodiment can be configured as a module by connecting the first substrate (130) and the second substrate (140) to each other via a connector. In this way, the present embodiment can perform conversion and testing of data acquired from an external device in each test device (100).

[0117] In this way, the present embodiment can solve the problem that occurs when testing all data on the host computer.

[0118] In addition, the present embodiment connects the configuration for data conversion and the configuration for executing the test provided on the independent substrate by using a connector. In this way, the present embodiment can execute the test of the data acquired from each frame grabber while using the conventional frame grabber as it is.

[0119] At this time, the first substrate (130) can be an FPGA substrate designed for each industrial group. In addition, the second substrate (140) can be a test substrate that can be used in any industrial group. In this way, the present embodiment can combine the second substrate (140) on the FPGA substrate designed for each industrial group. In this way, the present embodiment can provide a test device that can be used in all groups regardless of the industrial group.

[0120] At the same time, the unit for analyzing and testing the data obtained only from the first substrate (130) can be installed on the second substrate (140). In this way, the problem that all the units in the comparative example are concentrated on the main computer (30) can be solved. For example, the present embodiment can distribute the units centrally arranged in the main computer (30) to the second substrate (140) of each test device (100). Therefore, the present embodiment can simplify the heat dissipation structure of each test device (100). In addition, the present embodiment can improve the heat dissipation characteristics of the test device (100), thereby improving the performance of the test device (100). In addition, the present embodiment can be designed to only consider the minimum separation distance that will not cause performance problems due to the heat generation of each unit assembled in the test device (100). Therefore, the present embodiment can improve the circuit integration or component density of the test device (100), and even design a compact size test device (100).

[0121] Meanwhile, the first substrate (130) of the present embodiment may be designed to be divided into a plurality of substrates.

[0122] For example, depending on the industrial group to which the test equipment is applicable, the FPGA substrate and the power substrate may be designed to be separated into independent substrates.

[0123] In this way, Figure 6 As shown, the testing device includes a first substrate (210) and a second substrate (220).

[0124] The second substrate (220) corresponds to the second substrate (140) in the first embodiment. Therefore, a detailed description of the second substrate (220) is omitted.

[0125] The first substrate (210) may be divided into a plurality of substrates.

[0126] The first substrate (210) includes a first sub-substrate (211) and a second sub-substrate (212).

[0127] The first sub-substrate (211) may correspond to an FPGA substrate. The first sub-substrate (211) may be connected to an external device and may receive data acquired from the external device. In addition, the first sub-substrate (211) may convert the received data into data that may be processed by the second substrate (220). In addition, the first sub-substrate (211) may be connected to the second substrate (220) and transmit the converted data to the second substrate (220).

[0128] The second sub-base (212) may be connected to the first sub-base (211) and the second base (220). The second sub-base (212) may include a power connector. The second sub-base (212) may receive power from the outside. In addition, the second sub-base (212) may convert the received power into driving power required for each component. In addition, the second sub-base (212) may supply the converted driving power to the first sub-base (211) and the second base (220).

[0129] Meanwhile, the second sub-substrate (212) may further include a strobe substrate (213).

[0130] When additional high-performance testing is required in the environment of the test equipment application, a flash substrate (213) may be provided. In this case, the flash substrate (213) is shown in the figure as being disposed on the second sub-substrate (212), but is not limited thereto. For example, the flash substrate (213) may also be disposed on the first sub-substrate (211) or the second substrate (220).

[0131] The flashlight substrate (213) may include a lighting device, and when a captured image is acquired from an external device, the lighting device irradiates light to the product to be tested or the surrounding of the product to be tested. When a high-performance test is required, the flashlight substrate (213) can be operated to irradiate light to the product to be tested or the surrounding of the product to be tested.

[0132] The following is a detailed description of the internal configuration and operation of the test device according to the present embodiment.

[0133] Figure 7 is a schematic diagram showing a configuration of a test system according to one embodiment.

[0134] See also Figure 7 , the test system may include a data acquisition device (300), a test device (400) and a server (500).

[0135] The data acquisition device (300) can acquire test-related data of a product to be tested by the test device. For example, the data acquisition device (300) can acquire a photographic image of the product to be tested. Therefore, the data acquisition device (300) can be a camera including an image sensor.

[0136] The data acquisition device (300) may include a plurality of image sensors corresponding to the plurality of cameras.

[0137] For example, the data acquisition device (300) may include a first image sensor (310) for acquiring first data, a second image sensor (320) for acquiring second data, and an Nth image sensor (330) for acquiring Nth data.

[0138] The first to Nth image sensors (310, 320, 330) may acquire test images from different products. Alternatively, the first to Nth image sensors (310, 320, 330) may acquire test images from the same product. For example, at least two of the first to Nth image sensors (310, 320, 330) may acquire test images from the same first product, and at least one image sensor may acquire test images from a second product different from the first product. However, the present embodiment is not limited thereto, and the test images acquired from the first to Nth image sensors (310, 320, 330) may be different depending on the industrial group to which the product belongs.

[0139] At the same time, when the testing system of this embodiment is used to test the quality of a product (such as a camera), the first to Nth image sensors (310, 320, 330) can acquire test images for inspecting chip components, printed substrate labels, IC stamps, surface inspection, stamps, foreign matter, scratches and blemishes.

[0140] The test device (400) can receive data acquired by the data acquisition device (300) and perform a test using the received data. The test device (400) includes a plurality of test devices. The test device (400) includes a plurality of test devices, each of which is connected to the first to Nth image sensors (310, 320, 330).

[0141] Each of the plurality of test devices may correspond to the test device (100) described above.

[0142] The test device (400) may include first to Nth test devices (410, 420, 430).

[0143] For example, the test device (400) may include a first test device (410) connected to the first image sensor (310). For example, the test device (400) may include a second test device (420) connected to the second image sensor (320). For example, the test device (400) may include an Nth test device (430) connected to the Nth image sensor (330).

[0144] The first to Nth test devices (410, 420, 430) are connected to the first to Nth image sensors (310, 320, 330), respectively. In addition, the first to Nth test devices (410, 420, 430) can respectively analyze the data provided by the first to Nth image sensors (310, 320, 330) and perform corresponding quality test operations.

[0145] The first to Nth test devices (410, 420, 430) may include corresponding configurations. For example, the first to Nth test devices (410, 420, 430) may include the same components.

[0146] However, in the test system of the present embodiment, one of the first to Nth test devices (410, 420, 430) may be set as a master device, and the other test devices may be set as slave devices. In addition, the test device set as the master device may include a different configuration from the test device set as the slave device. This will be described in detail below.

[0147] Among the first to Nth test devices (410, 420, 430), the test device set as a slave device may transmit information according to a test result to the test device set as a master device.

[0148] In addition, among the first to Nth test devices (410, 420, 430), the test device set as the master device can collect test result information corresponding to the test results performed by the master test device and the test result information provided by the slave test device, and transmit the collected test result information to the server (500).

[0149] At this time, the test result information may include identification information and judgment information. The identification information may indicate which of the test result information is data acquired from one of the first to Nth image sensors (310, 320, 330). In addition, the judgment information may indicate quality judgment information corresponding to the test result. For example, the judgment information may be information indicating whether the corresponding product is qualified or defective.

[0150] Next, we will introduce Figure 7 Test equipment in.

[0151] Figure 8 It shows Figure 7 A schematic diagram of the detailed configuration of each test device in; Fig. 9 It shows Figure 8 A schematic diagram of the detailed configuration of the data conversion module in FIG. Fig.10 It shows Figure 8 Schematic diagram of the detailed configuration of the test module in .

[0152] See also Figure 8 The test device (400) of this embodiment includes a data conversion module (401) and a test module (402).

[0153] Specifically, the first to Nth test devices (410, 420, 430) each include a data conversion module (401) and a test module (402).

[0154] At this time, one of the first to Nth test devices (410, 420, 430) is set as a master device, and the other devices are set as slave devices. In addition, the test device set as the master device and the test device set as the slave device both include Figure 8 However, compared with the test module of the test device set as a slave device, the test module of the test device set as a master device may perform different operations or include different components.

[0155] Meanwhile, each of the first to Nth test devices (410, 420, 430) includes a data conversion module (401) and a test module (402). At this time, the data conversion module (401) may correspond to the first substrate (130) described above. For example, the data conversion module (401) may include a unit disposed in the first substrate (130). In addition, the test module (402) may correspond to the second substrate (140) described above. For example, the test module (402) may include a unit disposed in the second substrate (140).

[0156] See also Fig. 9 , the data conversion module (401) includes a first interface unit (401-1).

[0157] The first interface unit (401-1) may be an interface connected to a specific image sensor among the first to Nth image sensors (310, 320, 330). For example, the first interface unit (401-1) may be MIPI (Mobile Industry Processor Interface), but is not limited thereto.

[0158] The first interface unit (401-1) may be connected to a specific image sensor, and may receive image data acquired from the connected specific image sensor through MIPI.

[0159] The data conversion module (401) may include a data conversion unit (401-2) connected to the first interface unit (401-1).

[0160] The data conversion unit (401-2) can convert the data received from the first interface unit (401-1) into a signal that can be processed by the test module (402). For example, the data conversion unit (401-2) can be an FPGA.

[0161] The data conversion module (401) may include a first storage unit (401-4). The first storage unit (401-4) may store data required for the operation of each component of the data conversion module (401) or data generated during the operation. In terms of hardware, the first storage unit (401-4) may be a ROM, RAM, EPROM, flash drive, hard disk drive, or other storage devices.

[0162] The data conversion module (401) may include a second interface unit (401-3). The second interface unit (401-3) may transmit the data converted by the data conversion unit (401-2) to the test module (402). The second interface unit (401-3) may be implemented as PCIe, but is not limited thereto. The second interface unit (401-3) may correspond to the second connector (132) described above.

[0163] The data conversion module (401) of the present embodiment can directly transmit the data converted by the data conversion unit (401-2) to the test module (402) through the second interface unit (401-3). In this way, the present embodiment can omit the data modulation and demodulation operations performed for transmitting the converted data. In addition, the present embodiment can minimize the data transmission line, thereby minimizing the loss of the transmitted data. In addition, the present embodiment can improve the test accuracy performed by the test module (402) by minimizing the data loss.

[0164] Meanwhile, the data conversion module (401) may include a power supply unit (401-5). The power supply unit (401-5) may receive power from the outside and provide required driving power for each component constituting the data conversion module (401). To this end, the power supply unit (401-5) may include a DC-DC converter, but is not limited thereto.

[0165] Meanwhile, the power supply unit (401-5) may be arranged on one substrate together with the first interface unit (401-1), the second interface unit (401-3), the first storage unit (401-4) and the data conversion unit (401-2), or, alternatively, may be arranged on different substrates, such as Figure 6 shown.

[0166] See also Fig.10 , the test module (402) includes a third interface unit (402-1). The third interface unit (402-1) can be connected to the second interface unit (401-3) of the data conversion module (401). Therefore, the third interface unit (402-1) can be implemented as PCIe.

[0167] The third interface unit (402-1) may receive data transmitted through the second interface unit (401-3). For example, the third interface unit (402-1) may receive data converted by the data conversion unit (401-2).

[0168] The test module (402) includes a test unit (402-2). The test unit (402-2) can receive the converted data and analyze the converted data. In addition, the test unit (402-2) can obtain test result information based on the analysis result of the data. For example, the test module (402) can obtain test result information indicating whether the product to be tested is qualified or defective through the analysis of the data.

[0169] The communication unit (402-3) can transmit the data result information obtained by the test unit (402-2) to the outside. At this time, the test result information can include identification information and test judgment information. The identification information can be its own identification information or the identification information of the image sensor. For example, each test device constituting the test device (400) can be assigned different identification information to distinguish each test device. In addition, the communication unit (402-3) can transmit the test judgment information according to the test result together with the assigned identification information to the outside.

[0170] The communication unit (402-3) may be a wireless Internet communication unit. For example, the communication unit (402-3) may include a module for wireless Internet access. Therefore, the communication unit (402-3) is configured to transmit and receive wireless signals in a communication network according to wireless Internet technology.

[0171] Wireless Internet technology may include WLAN (Wireless LAN), Wi-Fi (Wireless-Fidelity), Wi-Fi (Wireless Fidelity) Direct, DLNA (Digital Living Network Alliance), WiBro (Wireless Broadband), WiMAX (World Interoperability for Microwave Access), HSDPA (High Speed ​​Downlink Packet Access), HSUPA (High Speed ​​Uplink Packet Access), LTE (Long Term Evolution) and LTE-A (Long Term Evolution-Advanced), but the present embodiment is not limited thereto.

[0172] At the same time, the communication unit (402-3) can use the local area network to transmit the test result information. For example, the communication unit (402-3) can support short-distance communication using at least one of the following technologies: Bluetooth TM ), RFID (Radio Frequency Identification), IrDA (Infrared Data Association), UWB (Ultra-Wideband), ZigBee, NFC (Near Field Communication), Wi-Fi (Wireless-Fidelity), Wi-Fi Direct and Wireless USB (Wireless Universal Serial Bus).

[0173] Meanwhile, the test result information transmitted through the communication unit (402-3) may have different destinations depending on whether the test device is a master device or a slave device.

[0174] For example, if the communication unit (402-3) is a communication unit equipped in a slave test device, the communication unit (402-3) can transmit the test result information to the master test device set as the master device.

[0175] In addition, if the communication unit (402-3) is a test device set as a master device, the communication unit (402-3) can receive test result information transmitted from the test device set as a slave device and collect the received test result information. In addition, the communication unit (402-3) can transmit the collected test result information together with the test result information obtained from its own test device to the server (500).

[0176] The second storage unit (402-4) can store data required for the operation of the test module (402) or data generated during the operation.

[0177] For example, the second storage unit (402-4) may store a test program required for executing a test by the test unit (402-2). In addition, the second storage unit (402-4) may store test result information obtained from the test unit (402-2).

[0178] Furthermore, in the case where the second storage unit (402-4) is mounted in a test device set as a master device, the second storage unit (402-4) can store test result information transmitted from the test device set as a slave device.

[0179] Furthermore, in the case where the second storage unit (402-4) is mounted in a test device set as a master device, the second storage unit (402-4) may store a driving program for collecting received test result information and transmitting the collected information to the server (500).

[0180] The control unit (402-5) controls the overall operation of the test module (402). When data is received through the third interface unit (402-1), the control unit (402-5) can be controlled to analyze and test the data received by the above test unit (402-2).

[0181] Furthermore, the control unit (402-5) may store the test result information according to the test progress in the second storage unit (402-4).

[0182] Furthermore, the control unit (402-5) mounted in the test device set as the slave device can transmit the test result information to the communication unit of the test device set as the master device through the communication unit (402-3).

[0183] In addition, the control unit (402-5) installed in the test device set as the master device can receive the test result information transmitted from the test device set as the slave device and collect the received test result information. In addition, the control unit (402-5) installed in the test device set as the master device can transmit the collected test result information together with the test result information obtained from its own test device to the server (500).

[0184] To this end, the control unit installed in the test device set as the master device and the control unit installed in the test device set as the slave device may have different specifications. For example, the control unit installed in the test device set as the master device and the control unit installed in the test device set as the slave device may have different computing performances. Preferably, the computing performance of the control unit installed in the test device set as the master device may be higher than the computing performance of the control unit installed in the test device set as the slave device.

[0185] Specifically, the control unit equipped in the test device set as the slave controls only the test operation in its own test module and the transmission operation for transmitting the test result information according to the test result to the test device set as the master.

[0186] In contrast, the control unit mounted in the test device set as the master device must perform additional operations to collect the test result information transmitted from the test device set as the slave device. In addition, the control unit mounted in the test device set as the master device must selectively process the received test result information. Therefore, the computing performance of the control unit mounted in the test device set as the master device is made higher than the computing performance of the control unit mounted in the test device set as the slave device.

[0187] The following embodiment will explain the operation method of the test equipment step by step. Fig.11 is a flow chart for describing step by step a method of operating a test device configured as a slave device; Fig.12 is a flowchart for describing step by step an operation method of a test device set as a master device.

[0188] See also Fig.11 A first interface unit (401-1) of a test device configured as a slave device receives data transmitted from a connected image sensor (S101).

[0189] In addition, the data conversion unit (401-2) of the test device set as a slave device converts the received data into a signal (S102) that can be processed by the test module (402). Then, the second interface unit (401-3) of the test device set as a slave device transmits the converted data to the third interface unit (402-1) of the test module (402).

[0190] Furthermore, the test module (402) of the test device set as a slave device can receive the converted data through the third interface unit (402-1) and perform a test operation using the received data (S103).

[0191] Then, the communication unit (402-3) of the test device set as the slave device may transmit the test result information according to the test operation result to the communication unit of the test device set as the master device (S104).

[0192] See also Fig.12 , a first interface unit (401-1) of a test device set as a master device receives data transmitted from a connected image sensor (S201).

[0193] In addition, the data conversion unit (401-2) of the test device set as the master device converts the received data into a signal (S202) that can be processed by the test module (402). Then, the second interface unit (401-3) of the test device set as the master device transmits the converted data to the third interface unit (402-1) of the test module (402).

[0194] Furthermore, the test module (402) of the test device set as the master device can receive the converted data through the third interface unit (402-1) and perform a test operation using the received data (S203).

[0195] At this time, the communication unit (402-3) of the test device set as the master device may receive the test result information transmitted from the test device set as the slave device (S204).

[0196] Then, the control unit (402-5) of the test device set as the master device may collect the test result information acquired from its own test device and the test result information transmitted from the test device as the slave device, and transmit the collected test result information to the server 500 (S205).

[0197] The test system of this embodiment includes a plurality of image sensors and a plurality of test devices respectively connected to the image sensors. Each of the plurality of test devices includes a data conversion module and a test module, the data conversion module is suitable for converting data transmitted from the image sensor, and the test module is suitable for analyzing the data converted by the data conversion module and performing quality testing.

[0198] That is, the test system of the present embodiment integrates the FPGA board that performs the data conversion operation and the test board that performs the test into one module. Therefore, the present embodiment can perform a separate test operation on the data acquired from a specific image sensor in each test device. In this way, the present embodiment can solve the reliability problem that occurs when the host computer in the comparative example performs a test on the data acquired from all image sensors.

[0199] In addition, in the case where the data conversion module and the test module are respectively arranged on independent substrates, the present embodiment uses a connector to connect the data conversion module and the test module. In this way, the present embodiment can perform a test on the data acquired from each frame grabber while using the conventional frame grabber as it is. In addition, the present embodiment can be used by connecting the test module of the present invention to the data conversion module corresponding to the FPGA designed to correspond to each industrial group. In this way, the present embodiment can provide a test device that can be used in all groups regardless of the industrial group.

[0200] At the same time, the present embodiment can distribute the components centrally configured in the traditional main computer to each test equipment. In this way, the present embodiment can solve the problem that all components are concentrated in the main computer as in the comparative example. For example, the present embodiment can distribute the components concentrated in the main computer to the test modules of each test equipment. Therefore, the present embodiment can simplify the heat dissipation structure of each test equipment. In addition, the present embodiment can improve the heat dissipation characteristics of the test equipment, thereby improving the performance of the test equipment. In addition, the present embodiment can be designed to only consider the minimum separation distance that will not cause performance problems due to the heating of each component assembled in the test equipment. Therefore, the embodiment can improve the circuit integration or component density of the test equipment, and even design a test equipment of compact size.

[0201] The characteristics, structures, effects, etc. described in the above embodiments are included in at least one embodiment of the present invention, but are not limited to only one embodiment. In addition, it will be appreciated by those skilled in the art that the characteristics, structures, and effects shown in each embodiment may be combined or modified for use in other embodiments. Therefore, it should be understood that such combinations and modifications are also included within the scope of the present invention.

[0202] The above mainly describes the embodiments, but these embodiments are only examples and do not limit the present invention. It can be understood by those skilled in the art that various changes and applications not given above can be made without departing from the essential features of the embodiments. For example, each component specifically described in the embodiments can be changed. In addition, it should be considered that the differences related to such changes and applications are also included in the scope of the present invention defined by the following claims.

Claims

1. A testing device comprising: A first substrate is provided with a data conversion module, including a first connector for receiving data acquired from an external device, an FPGA (field programmable gate array) for converting the received data, and a second connector for outputting the converted data; a second substrate provided with a test module, including a third connector connected to the second connector of the first substrate and receiving the converted data, a test unit that performs a test operation using the data received through the third connector, a communication unit that transmits test result information according to the test operation result of the test unit to the outside, and a control unit that controls the test unit and the communication unit; as well as The housing is used to accommodate the first substrate and the second substrate.

2. The test device according to claim 1, wherein the first connector comprises a MIPI (Mobile Industry Processor Interface), and Wherein the second connector and the third connector include PCIe (Peripheral Component Interconnect Express).

3. The testing device according to claim 1, wherein the second substrate is disposed on the first substrate, wherein the second substrate comprises a port of the third connector, the port being arranged in an open area corresponding to the second connector, and The port is connected to the second connector. 4 . The test device according to claim 1 , wherein the communication unit of the second substrate transmits the test result information to a test device provided as a master device.

5. The test device according to any one of claims 1 to 3, wherein the communication unit of the second substrate receives test result information from a test device set as a slave device, and transmits the test result information obtained from the test unit and the test result information received from the test device set as the slave device to a server.

6. The test device according to claim 5, wherein the transmitted test result information includes identification information assigned to each test device and test judgment information according to a result of a test performed on each test device.

7. A testing system comprising: a data acquisition device including a plurality of image sensors; as well as a first test device and a second test device, each test device being connected to the plurality of image sensors of the data acquisition device; The first test equipment comprises: a first data conversion unit, configured to convert data received from one of the plurality of image sensors; a first test unit, configured to perform a test operation using the data converted by the first data conversion unit; A first communication unit, configured to transmit first test result information according to a test operation result of the first test unit to the second test device; and A first control unit, used for controlling the first data conversion unit, the first test unit and the first communication unit; The second test equipment comprises: a second data conversion unit, configured to convert data received from another one of the plurality of image sensors; a second test unit, configured to perform a test operation using the data converted by the second data conversion unit; a second communication unit, configured to receive the first test result information from the first communication unit, and transmit the first test result information and second test result information according to the test operation result of the second test unit to a server; and The second control unit is used to control the second data conversion unit, the second test unit and the second communication unit. 8 . The test system according to claim 7 , wherein the first data conversion unit and the second data conversion unit are frame grabbers including an FPGA (Field Programmable Gate Array).

9. The test system according to claim 7, wherein the computing performance of the second control unit is higher than the computing performance of the first control unit.

10. The test system according to claim 7, wherein the first test result information and the second test result information transmitted to the server include identification information of each of the first test device and the second test device and test judgment information acquired from each of the first test device and the second test device.

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