Multi-laser-head collaborative printing method and system of selective laser melting equipment

Through real-time monitoring and dynamic adjustment of the laser head power and powder thickness, the problem of insufficient weld quality in the overlapping area and high stress area in traditional multi-laser head SLM technology is solved, and the high bonding strength and printing quality of structural parts are achieved.

CN119819947AInactive Publication Date: 2025-04-15JIANG SU GE LAI BO SHU ZI KE JI YOU XIAN GONG SI
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Patent Information

Application Number
CN202510310997.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-03-17
Publication Date
2025-04-15
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

The traditional multi-laser head selective laser melting (SLM) technology is difficult to ensure the welding quality in the overlapping area and the high-stress area, resulting in the limitation of the bonding strength and printing quality of the structural parts.

Method used

Through real-time monitoring and dynamic adjustment, the power output of each laser head in different areas is adjusted using sensor data, and the powder thickness is adjusted according to the welding quality to ensure the welding quality of the overlap area and the high-stress area.

Benefits of technology

Accurate welding control of overlapping zones and high-stress zones is achieved, which improves the bonding strength and printing quality of structural parts, avoids stress concentration problems, and improves printing efficiency and accuracy.

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Abstract

The invention discloses a multi-laser-head collaborative printing method and system of selective laser melting equipment, and relates to the technical field of multi-laser-head collaborative printing, and the multi-laser-head collaborative printing method comprises the steps that according to a three-dimensional model of a target part, each printing layer is divided into a plurality of independent areas, and each laser head is distributed to the corresponding area for printing according to a preset task; lap joint points are arranged in all the areas for lap joint; the power output of each laser head in different areas is adjusted in real time according to sensor data; and the welding quality is monitored in the lap joint area and the high-stress area through a sensor, and the powder laying thickness is adjusted according to the strength requirements of different areas. According to the method, a real-time monitoring and dynamic adjusting mechanism is introduced in the printing process, accurate welding of a lap joint area and a high-stress area is achieved, and the bonding strength of a structural part is improved; the printing efficiency is improved through cooperative work of multiple laser heads, the printing precision is remarkably improved through automatic power adjustment and closed-loop control, and material waste is reduced.
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Description

Technical Field

[0001] The present invention relates to the technical field of multi-laser head collaborative printing, and in particular to a multi-laser head collaborative printing method and system for selective laser melting equipment. Background Art

[0002] Selective laser melting (SLM) technology is an advanced additive manufacturing technology that uses a laser beam to melt metal powder layer by layer and stack them layer by layer to achieve high-precision manufacturing of complex three-dimensional metal structures. It has been widely used in aerospace, automobile manufacturing, medical equipment and other fields. However, traditional SLM equipment usually uses a single laser head to print layer by layer, which is inefficient and time-consuming when processing large or complex structures. In order to improve printing efficiency, multi-laser head SLM equipment has gradually developed, and multiple laser heads work together to shorten printing time. However, the current multi-laser head SLM technology still faces some key difficulties, including the difficulty in ensuring the welding quality of the overlapping area, which is prone to poor bonding or stress concentration problems, affecting the structural strength; secondly, the laser power and powder thickness in the existing technology are mostly fixed settings, which are difficult to adjust in real time according to the needs of different areas, resulting in the difficulty in ensuring the metallurgical bonding quality of local areas; in addition, there is a lack of real-time feedback control mechanism, and it is impossible to monitor and dynamically adjust parameters during the printing process, resulting in limited printing quality and molding accuracy. Summary of the invention

[0003] In view of the above-mentioned problems, the present invention is proposed.

[0004] Therefore, the technical problem solved by the present invention is: how to achieve welding quality control of overlapping areas and high stress areas through real-time monitoring and dynamic adjustment to ensure the bonding strength of structural parts and the overall printing quality.

[0005] In order to solve the above technical problems, the present invention provides the following technical solution: a multi-laser head collaborative printing method of a selective laser melting device, which comprises the following steps: According to the 3D model of the target component, each printing layer is divided into several independent areas, and each laser head is assigned to the corresponding area for printing according to the preset task; Set overlapping points in each area for overlapping; Adjust the power output of each laser head in different areas in real time according to sensor data; Sensors are used to monitor the welding quality in the overlap area and high stress area, and the powder thickness is adjusted according to the strength requirements of different areas.

[0006] As a preferred solution of the multi-laser head collaborative printing method of the selective laser melting equipment of the present invention, wherein: according to the three-dimensional model of the target component, each printing layer is divided into a plurality of independent areas, and each laser head is assigned to the corresponding area for printing according to a preset task, including: The printing device imports the 3D model data of the target component and performs layer-by-layer slicing processing, dividing the entire component into several layers according to the design requirements. After the cross-sectional data of each layer is sliced, the corresponding plane contour data is generated; In each layer plane, according to the number of multiple laser heads and the working range of each laser head, the current layer is divided into several independent printing areas of the same length and without overlap; After dividing the areas, each area is assigned to each laser head in sequence according to the number, and a dedicated printing path is set for each laser head.

[0007] As a preferred solution of the multi-laser head collaborative printing method of the selective laser melting device of the present invention, wherein: the overlapping points are set in each area, including: Finite element method is used to perform fine mesh division and mechanical simulation on the structural parts, and the overlap length is determined by analyzing the shortest overlap length and maximizing the strength of the structural parts; Independent printing areas of the same length and without overlap are overlapped evenly to determine the best overlap length. The number of layers of the structural parts is integrated to form several groups. In each group, the first overlapping point is the left critical point or the right critical point of the overlapping area, and the last overlapping point is the center point of the overlapping area. The overlap points of each layer in the same group are evenly arranged from the critical point to the center point of the overlapping area; The first overlapping point of the second layer in two adjacent groups is in the opposite direction of the first overlapping point of the first layer in the first group, and both are two critical points of the overlapping area.

[0008] As a preferred solution of the multi-laser head collaborative printing method of the selective laser melting equipment described in the present invention, wherein: setting overlapping points in each area for overlapping also includes using a serrated process for overlapping after determining the overlapping range.

[0009] As a preferred solution of the multi-laser head collaborative printing method of the selective laser melting device of the present invention, the real-time adjustment of the power output of each laser head in different areas according to the sensor data includes: During the printing process of the multi-laser head selective laser melting equipment, the temperature and molten pool size of each printing area are collected in real time by temperature sensors and optical sensors, and the stress distribution of each area is indirectly evaluated. The expression is: , in, is heat stress, is the elastic modulus of the material, is the thermal expansion coefficient of the material, is the temperature change; Based on the real-time data collected from each printing area, a power adjustment model is constructed to output the final power value to be achieved. The calculated power value is sent as a command to the laser head to perform real-time power adjustment.

[0010] As a preferred solution of the multi-laser head collaborative printing method of the selective laser melting device described in the present invention, the power adjustment model is expressed as follows: , in, is the final power value to be achieved, is the thermal stress in the current region, is the temperature, is the molten pool depth, are the weight coefficients of different parameters, is the basic power value; , , in, is the temperature, is the material density is the specific heat capacity of the material, is the thermal conductivity of the material, is the power density of the heat source per unit volume, is the melt pool depth, is the energy absorption coefficient, is the laser power, is the laser head moving speed.

[0011] As a preferred solution of the multi-laser head collaborative printing method of the selective laser melting equipment of the present invention, wherein: the welding quality is monitored by sensors in the overlap area and the high stress area, and the powder thickness is adjusted according to the strength requirements of different areas, including: In the overlap area and high stress area, the welding quality is monitored in real time through temperature sensors and thickness monitoring sensors, and the welding strength and bonding quality of the overlap area and high stress area are evaluated based on the data fed back by the sensors; If insufficient welding depth or bonding strength is detected to be lower than the preset value, the powder thickness will be automatically adjusted.

[0012] Another object of the present invention is to provide a multi-laser head collaborative printing system for selective laser melting equipment, which can monitor the printing status in real time through a variety of sensors, dynamically adjust the laser power and powder thickness based on the welding requirements of each area, and solve the problems of insufficient welding strength in the overlap area, stress concentration and inaccurate power control in the prior art.

[0013] In order to solve the above technical problems, the present invention provides the following technical solutions: a multi-laser head collaborative printing system for a selective laser melting device, comprising: a sensor monitoring module, a data processing and analysis module, a power control module, a status display module and a learning optimization module; The sensor monitoring module collects data of the printing area in real time, including temperature, molten pool size, stress and powder thickness data; The data processing and analysis module performs real-time analysis and processing on the data collected by the sensor, and dynamically calculates the laser power and powder thickness adjustment requirements based on the sensor feedback; The power control module receives the output instruction of the data processing module and dynamically adjusts the power of each laser head; The powder coating thickness control module automatically adjusts the powder coating thickness between printing layers according to the powder coating thickness adjustment instruction of the data processing module.

[0014] A computer device comprises a memory and a processor, wherein the memory stores a computer program, and the processor implements the steps of the multi-laser head collaborative printing method of the selective laser melting device as described above when executing the computer program.

[0015] A computer-readable storage medium stores a computer program, which, when executed by a processor, implements the steps of the multi-laser head collaborative printing method of the selective laser melting device as described above.

[0016] Beneficial effects of the invention: The invention realizes precise welding control of overlapping areas and high stress areas by introducing real-time monitoring and dynamic adjustment mechanisms in the multi-laser head selective laser melting (SLM) printing process, thereby improving the bonding strength and printing quality of structural parts; in overlapping areas, laser power and powder thickness are dynamically adjusted through sensor feedback, effectively enhancing metallurgical bonding and avoiding stress concentration problems; in high stress areas, powder thickness and laser power are intelligently adjusted according to sensor feedback, so that structural parts have higher reliability under high stress conditions. The use of multiple laser heads working together greatly improves printing efficiency, and at the same time, printing accuracy is significantly improved through automated power regulation and closed-loop control, reducing material waste, and meeting the needs of high-precision and high-strength industrial-grade additive manufacturing. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. Among them: Figure 1An overall flow chart of a multi-laser head collaborative printing method for a selective laser melting device provided in the first embodiment of the present invention; Figure 2 A schematic diagram of conventional overlap in a multi-laser head collaborative printing method for a selective laser melting device provided in the first embodiment of the present invention; Figure 3 A schematic diagram of staggered overlapping of a multi-laser head collaborative printing method for a selective laser melting device provided in the first embodiment of the present invention. DETAILED DESCRIPTION

[0018] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the drawings of the specification. Obviously, the described embodiments are part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary persons in the art without creative work should fall within the scope of protection of the present invention.

[0019] Example 1, reference Figure 1 As one embodiment of the present invention, a multi-laser head collaborative printing method of a selective laser melting device is provided, comprising: According to the 3D model of the target component, each printing layer is divided into several independent areas, and each laser head is assigned to the corresponding area for printing according to the preset task; Set overlapping points in each area for overlapping; Adjust the power output of each laser head in different areas in real time according to sensor data; Sensors are used to monitor the welding quality in the overlap area and high stress area, and the powder thickness is adjusted according to the strength requirements of different areas.

[0020] The printing device imports the 3D model data of the target component and performs layer-by-layer slicing processing, dividing the entire component into several layers according to the design requirements. After the cross-sectional data of each layer is sliced, the corresponding plane contour data is generated; In each layer plane, the current layer is divided into a number of non-overlapping independent printing areas of the same length according to the number of multiple laser heads and the working range of each laser head.

[0021] After dividing the areas, each area is assigned to each laser head in sequence according to the number, and a dedicated printing path is set for each laser head.

[0022] It is further explained that: The printing device imports the 3D model data of the target component (usually an STL file or other 3D format) and slices the model layer by layer, dividing the entire component into several layers according to design requirements.

[0023] After the cross-sectional data of each layer is sliced, the corresponding plane contour data is generated to prepare for the next area division. In each plane, the control system divides the current layer into several non-overlapping independent printing areas according to the number of multiple laser heads and the working range of each laser head; the division principle is based on the effective working range of each laser head and the required printing accuracy: If the part has a simple shape and a large area, divide each layer area evenly to ensure that each laser head works within an equal area.

[0024] If the shape of the component is complex, the size of the area that each laser head is responsible for is adjusted according to the structural complexity of different areas to meet the printing needs of different locations.

[0025] After dividing the areas, the control system assigns each area to each laser head in sequence according to the number, and sets a unique printing path for each laser head; laser head 1 is responsible for area A, laser head 2 is responsible for area B, and they proceed in sequence to ensure that each laser head only works in its designated area to avoid overlap between printing paths.

[0026] Before the printing of a layer begins, the control system first calls the path data of each laser head and uploads its printing path to the laser control unit; each laser head performs laser scanning and material melting according to the set path in its respective printing area, gradually completing the printing task of the current layer; when each laser head performs an operation, the control system monitors its position, speed and printing progress in real time to ensure that the laser head does not cross the boundary or operate across areas.

[0027] Reference Figure 2 , all the overlapping points of the working layers are on a vertical line, then the strength of the structural parts is not high. Therefore, the present invention uses the finite element method to perform refined mesh division and mechanical simulation on the structural parts, and analyzes the overlapping length with the goal of minimizing the overlapping length and maximizing the strength of the structural parts to determine the overlapping length.

[0028] Reference Figure 3 Independent printing areas with the same length and no overlap are overlapped evenly to determine the good overlap length, and the number of layers divided by the structural parts is integrated to form several groups. In each group, the first overlap point is the left critical point or the right critical point of the overlap area, and the last overlap point is the center point of the overlap area.

[0029] The overlap points of each layer in the same group are evenly arranged from the critical point to the center point of the overlapping area.

[0030] The first overlapping point of the second layer in two adjacent groups is in the opposite direction of the first overlapping point of the first layer in the first group, and both are two critical points of the overlapping area.

[0031] During the printing process of the multi-laser head selective laser melting equipment, the temperature and molten pool size of each printing area are collected in real time by temperature sensors and optical sensors, and the stress distribution of each area is indirectly evaluated. The expression is: , in, is heat stress, is the elastic modulus of the material, is the thermal expansion coefficient of the material, It's the temperature change.

[0032] Based on the real-time data collected from each printing area, a power adjustment model is constructed to output the final power value to be achieved. The calculated power value is sent as a command to the laser head to perform real-time power adjustment.

[0033] , in, is the final power value to be achieved, is the thermal stress in the current region, is the temperature, is the molten pool depth, are the weight coefficients of different parameters, is the basic power value; , , in, is the temperature, is the material density is the specific heat capacity of the material, is the thermal conductivity of the material, is the power density of the heat source per unit volume, is the melt pool depth, is the energy absorption coefficient, is the laser power, is the laser head moving speed.

[0034] In the overlap area and high stress area, the welding quality is monitored in real time through temperature sensors and thickness monitoring sensors, and the welding strength and bonding quality of the overlap area and high stress area are evaluated based on the data fed back by the sensors; If insufficient welding depth or bonding strength is detected to be lower than the preset value, the powder thickness will be automatically adjusted.

[0035] It is further explained that: In the overlap area and high stress area, the sensor will continuously collect real-time data of each area, and the system will obtain information such as the current welding depth and powder thickness at a fixed interval (such as 10 milliseconds); Once this data is passed to the control system, the system will compare the current data with the preset threshold standards, such as: Weld depth threshold (for example, the target value is set to 0.2 mm); Bond strength threshold (e.g., target bond strength to reach 200 MPa).

[0036] Automatic judgment logic: The system makes conditional judgments based on sensor data. If it detects that the welding depth in the current area is lower than the preset threshold, or the bonding strength is lower than the target value, the control system will trigger the adjustment logic of the powder thickness.

[0037] The system counts the number of abnormal values. If the number of consecutive detections below the threshold exceeds the set trigger condition (such as below the threshold three times in a row), the system determines that the area needs to be thickened and powdered.

[0038] If the above trigger conditions are met, the system will automatically thicken the powder. The thickening value can be set to 10% or 20% of the base thickness to gradually increase the powder thickness.

[0039] Once the powder adjustment is triggered, the control system will increase the current powder thickness by a set increment (such as 10% of the base thickness) and continue with the next step of printing.

[0040] After the powder thickness is adjusted, the sensor continues to monitor the new welding depth and bonding strength in real time, and the system re-evaluates the new data.

[0041] If the adjusted powder thickness still does not meet the set standard, the system will continue to thicken the powder by 10% to 20% each time until it detects that the welding depth and bonding strength meet the requirements.

[0042] After detecting that the powder thickness and bonding strength reach or exceed the set value, the system will restore the powder thickness to normal thickness and continue the standard printing process.

[0043] If the adjusted powder spreading thickness meets the requirement, the counter will be reset to zero, and the adjustment mode will be automatically exited and the normal powder spreading mode will be entered.

[0044] Embodiment 2 is an embodiment of the present invention, which provides a system for a multi-laser head collaborative printing method of a selective laser melting device, including: a sensor monitoring module, a data processing and analysis module, a power control module, a status display module, and a learning optimization module; The sensor monitoring module collects data of the printing area in real time, including temperature, molten pool size, stress and powder thickness data; The data processing and analysis module performs real-time analysis and processing on the data collected by the sensor, and dynamically calculates the laser power and powder thickness adjustment requirements based on the sensor feedback; The power control module receives the output instruction of the data processing module and dynamically adjusts the power of each laser head; The powder coating thickness control module automatically adjusts the powder coating thickness between printing layers according to the powder coating thickness adjustment instruction of the data processing module.

[0045] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art or the part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium, including several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods described in each embodiment of the present invention. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk, etc., which can store program codes.

[0046] The logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as an ordered list of executable instructions for implementing logical functions, and can be embodied in any computer-readable medium for use by an instruction execution system, device or apparatus (such as a computer-based system, a system including a processor, or other system that can fetch instructions from an instruction execution system, device or apparatus and execute instructions), or in conjunction with such instruction execution systems, devices or apparatuses. For the purposes of this specification, "computer-readable medium" can be any device that can contain, store, communicate, propagate or transmit a program for use by an instruction execution system, device or apparatus, or in conjunction with such instruction execution systems, devices or apparatuses.

[0047] More specific examples of computer-readable media (a non-exhaustive list) include the following: an electrical connection with one or more wires (electronic device), a portable computer disk case (magnetic device), a random access memory (RAM), a read-only memory (ROM), an erasable and programmable read-only memory (EPROM or flash memory), an optical fiber device, and a portable compact disk read-only memory (CDROM). In addition, the computer-readable medium may even be a paper or other suitable medium on which the program is printed, since the program may be obtained electronically, for example, by optically scanning the paper or other medium, followed by editing, deciphering or, if necessary, processing in another suitable manner, and then stored in a computer memory.

[0048] It should be understood that the various parts of the present invention can be implemented by hardware, software, firmware or a combination thereof. In the above-mentioned embodiments, multiple steps or methods can be implemented by software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented by hardware, as in another embodiment, it can be implemented by any one of the following technologies known in the art or their combination: a discrete logic circuit having a logic gate circuit for implementing a logic function for a data signal, a dedicated integrated circuit having a suitable combination of logic gate circuits, a programmable gate array (PGA), a field programmable gate array (FPGA), etc.

[0049] Embodiment 3: In this embodiment, in order to verify the beneficial effects of the present invention, scientific demonstration is carried out through economic benefit calculation and simulation experiments. This embodiment experiments the existing traditional method and the method of this embodiment respectively.

[0050] With the widespread application of selective laser melting (SLM) technology, multi-laser head collaborative printing has become an important means to improve the efficiency of additive manufacturing. However, the traditional multi-laser head SLM printing method has significant shortcomings in terms of insufficient bonding strength in the overlap area, regional stress concentration, and unstable printing accuracy. This experiment aims to verify the effectiveness of the multi-laser head collaborative printing method of the present invention in improving bonding strength, optimizing stress distribution, and improving printing accuracy through simulation analysis, and compare it with the traditional multi-laser head printing method with a single power and constant powder thickness.

[0051] Use finite element simulation software (such as ANSYS or Simufact) to simulate and analyze heat transfer, stress distribution and metallurgical bonding.

[0052] Select common 3D printing metal powder materials (such as stainless steel or titanium alloy) and preset their material properties (such as density, elastic modulus, thermal expansion coefficient, melting point) in the simulation environment.

[0053] The laser power is set to 500 W, the scanning speed is set to 1.2 m / s, and the thickness of each powder layer is set to 50 μm (traditional method); in the method of the present invention, dynamically adjusted power and powder thickness are used.

[0054] Two laser head printing paths were set in the overlapping area, and simulations were performed using the traditional method (power and powder thickness remained unchanged) and the method of the present invention (power and powder thickness were dynamically adjusted according to sensor feedback). The metallurgical bonding strength of the overlapping area was tested after printing was completed.

[0055] Select high stress areas in the structural parts and use simulation to analyze the stress distribution under different power control strategies. Dynamically adjust the power and powder thickness according to sensor feedback, and record the stress value and stress distribution uniformity of the method of the present invention and the traditional method in the high stress area.

[0056] The multi-layer printing process of the entire model was set up to simulate the collaborative work of multiple laser heads in each area. The layer thickness deviation, total consumables and printing time after printing were recorded, and the printing accuracy and material utilization rate of the method of the present invention and the traditional method were compared.

[0057] Table 1 Data comparison table , It can be seen from the above experimental data that the present invention is significantly superior to the traditional method in all test indicators. In the test of the bonding strength of the overlap area, the method of the present invention improves the bonding strength by 33% by dynamically adjusting the power and the powder thickness, effectively solving the problem of insufficient bonding strength of the traditional overlap area; in the test of the high stress area, the method of the present invention greatly improves the uniformity of stress distribution, and the stress deviation is reduced to ±10 MPa, showing that the present invention has good control over the high stress area and effectively avoids the stress concentration phenomenon. At the same time, the present invention performs well in printing accuracy, and the layer thickness deviation is reduced by 75%, indicating that high-precision printing is achieved with the help of dynamic power control and powder thickness adjustment. In addition, since the material is saved in non-critical areas, the method of the present invention reduces the amount of printing consumables by 15%, and the printing time is reduced by 25%, which effectively improves the printing efficiency. These data show that the application of the present invention in multi-laser head SLM printing not only improves the strength and printing accuracy of structural parts, but also significantly reduces material waste and printing time.

[0058] Table 2 Data comparison table , According to the data in Table 2, it can be seen that the present invention is significantly superior to traditional methods in many aspects. In terms of temperature control stability, the method of the present invention controls the temperature fluctuations in each area within ±5°C through real-time sensor monitoring and power adjustment, which is significantly reduced by 67% compared with the fluctuation range of ±15°C of the traditional method. This shows that the present invention can control the printing temperature more stably, which is helpful for the welding quality and the uniformity of interlayer bonding. In terms of the fracture rate of the overlap zone, the present invention reduces the fracture rate from 20% of the traditional method to 5% by dynamically adjusting the power and powder thickness of the overlap zone, effectively improving the metallurgical bonding quality and structural strength of the overlap zone. In addition, in the residual strength after fatigue testing, the residual strength of the structural parts under the method of the present invention is 60% higher than that of the traditional method, which further proves the advantages of the present invention in optimizing stress distribution and is conducive to extending the service life of parts.

[0059] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A multi-laser head collaborative printing method for a selective laser melting device, characterized in that: include: According to the 3D model of the target component, each printing layer is divided into several independent areas, and each laser head is assigned to the corresponding area for printing according to the preset task; Set overlapping points in each area for overlapping; Adjust the power output of each laser head in different areas in real time according to sensor data; Sensors are used to monitor welding quality in overlapping areas and high stress areas, and the thickness of powder coating is adjusted according to the strength requirements of different areas. The real-time adjustment of the power output of each laser head in different areas according to the sensor data includes: During the printing process of the multi-laser head selective laser melting equipment, the temperature and molten pool size of each printing area are collected in real time by temperature sensors and optical sensors, and the stress distribution of each area is indirectly evaluated. The expression is: , in, is heat stress, is the elastic modulus of the material, is the thermal expansion coefficient of the material, is the temperature change; According to the real-time data collected from each printing area, a power adjustment model is constructed to output the final power value to be achieved. The calculated power value is sent as a command to the laser head to perform real-time power adjustment. The power adjustment model is expressed as: , in, is the final power value to be achieved, is the thermal stress in the current region, is the temperature, is the molten pool depth, are the weight coefficients of different parameters, is the basic power value; , , in, is the temperature, is the material density is the specific heat capacity of the material, is the thermal conductivity of the material, is the power density of the heat source per unit volume, is the melt pool depth, is the energy absorption coefficient, is the laser power, is the laser head moving speed.

2. The multi-laser head collaborative printing method of the selective laser melting device according to claim 1, characterized in that: According to the three-dimensional model of the target component, each printing layer is divided into several independent areas, and each laser head is assigned to the corresponding area for printing according to the preset task, including: The printing device imports the 3D model data of the target component and performs layer-by-layer slicing processing, dividing the entire component into several layers according to the design requirements. After the cross-sectional data of each layer is sliced, the corresponding plane contour data is generated; In each layer plane, according to the number of multiple laser heads and the working range of each laser head, the current layer is divided into several independent printing areas of the same length and without overlap; After dividing the areas, each area is assigned to each laser head in sequence according to the number, and a dedicated printing path is set for each laser head.

3. The multi-laser head collaborative printing method of the selective laser melting device according to claim 2, characterized in that: The setting of overlapping points in each area includes: Finite element method is used to perform fine mesh division and mechanical simulation on the structural parts, and the overlap length is determined by analyzing the shortest overlap length and maximizing the strength of the structural parts; Independent printing areas of the same length and without overlap are overlapped evenly to determine the best overlap length. The number of layers of the structural parts is integrated to form several groups. In each group, the first overlapping point is the left critical point or the right critical point of the overlapping area, and the last overlapping point is the center point of the overlapping area. The overlap points of each layer in the same group are evenly arranged from the critical point to the center point of the overlapping area; The first overlapping point of the second layer in two adjacent groups is in the opposite direction of the first overlapping point of the first layer in the first group, and both are two critical points of the overlapping area.

4. The multi-laser head collaborative printing method of the selective laser melting device according to claim 3, characterized in that: The overlapping points are set in each area for overlapping and the overlapping is performed by using a zigzag process after the overlapping range is determined.

5. The multi-laser head collaborative printing method of the selective laser melting device according to claim 1, characterized in that: The welding quality is monitored by sensors in the overlap area and high stress area, and the powder thickness is adjusted according to the strength requirements of different areas, including: In the overlap area and high stress area, the welding quality is monitored in real time through temperature sensors and thickness monitoring sensors, and the welding strength and bonding quality of the overlap area and high stress area are evaluated based on the data fed back by the sensors; If insufficient welding depth or bonding strength is detected to be lower than the preset value, the powder thickness will be automatically adjusted.

6. A system for a multi-laser head collaborative printing method using the selective laser melting device according to any one of claims 1 to 5, characterized in that: It includes sensor monitoring module, data processing and analysis module, power control module, status display module and learning optimization module; The sensor monitoring module collects data of the printing area in real time, including temperature, molten pool size, stress and powder thickness data; The data processing and analysis module performs real-time analysis and processing on the data collected by the sensor, and dynamically calculates the laser power and powder thickness adjustment requirements based on the sensor feedback; The power control module receives the output instruction of the data processing module and dynamically adjusts the power of each laser head; The powder coating thickness control module automatically adjusts the powder coating thickness between printing layers according to the powder coating thickness adjustment instruction of the data processing module.

7. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that: When the processor executes the computer program, the steps of the multi-laser head collaborative printing method of the selective laser melting device described in any one of claims 1 to 5 are implemented.

8. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the multi-laser head collaborative printing method of the selective laser melting device described in any one of claims 1 to 5 are implemented.

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